Semiconductor device and method of adjusting an axis

Abstract

The application provides a semiconductor device and a shaft adjusting method, which comprises a base for carrying a wafer; a shaft connected with the base; and a detection component arranged at an end of the shaft and used for detecting an external force received by the shaft due to deviation from a center line. The semiconductor device provided by the application is provided with the detection component, which can detect the external force received by the shaft due to deviation from the center line, so that convenience is provided when adjusting the position of the shaft.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a detection component for the shaft of a semiconductor device. Background Technology

[0002] In the semiconductor field, the results of semiconductor processes are closely related to the state of the process gas flow field within the semiconductor equipment's process chamber. Taking epitaxial processing as an example, when a wafer is placed on a substrate within the epitaxial chamber, process gases related to the desired epitaxial layer need to be introduced into the chamber, and the corresponding epitaxial layer is grown on the wafer surface under specific temperature and pressure conditions. To improve wafer quality and utilization, the epitaxial layer grown on the wafer surface must achieve maximum uniformity. A major manifestation of uniformity issues is the irregular eccentricity of the epitaxial layer thickness on the wafer surface. This eccentricity is due to the deviation of the axis connected to the substrate from the center of the chamber. Therefore, during the substrate's rotation, the gap between the preheating ring surrounding the substrate and the substrate itself will randomly change, leading to instability in the process gas flow field and consequently affecting the film formation uniformity.

[0003] Therefore, in the prior art, technicians use adjustment devices to move the axis of the semiconductor device to coincide with the center of the chamber. However, the following problems exist when using adjustment devices in the prior art:

[0004] In the prior art, when technicians use the adjustment device, they can only judge whether the shaft has reached the desired position by observation. This inevitably leads to over-adjustment, which may cause excessive stress on the lower dome of the chamber surrounding the shaft. In more serious cases, the lower dome may even break.

[0005] In summary, semiconductor equipment needs to provide a device that can determine whether the adjustment device is properly adjusted. Summary of the Invention

[0006] The purpose of this invention is to provide a semiconductor device and a method for adjusting a shaft. The semiconductor device is equipped with a detection component that can detect the external force acting on the shaft when it is offset relative to the center line. Therefore, when adjusting the position of the shaft, the method can determine whether the shaft is properly adjusted based on the external force detected by the detection component. At the same time, it can avoid over-adjustment that could lead to excessive stress on the lower dome of the semiconductor device chamber surrounding the shaft.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solution:

[0008] A semiconductor device is provided, comprising:

[0009] A base for supporting a wafer;

[0010] A shaft, which is directly or indirectly connected to the base;

[0011] A detection component, disposed at the end of the shaft, is used to detect the external force exerted on the shaft due to its offset relative to the centerline.

[0012] Furthermore, it also includes:

[0013] A base, the position of which is fixed relative to the cavity of the semiconductor device; a positioning component, the positioning component being disposed on the base, for adjusting the position of the shaft on a horizontal plane; and a detection component being connected to the positioning component.

[0014] The positioning component includes a fixing component, which is used to fix the detection component on the positioning component.

[0015] Furthermore, the fixing component is positioned above the detection component.

[0016] Furthermore, the detection component is annular, and the annulus includes a through hole penetrating the upper and lower surfaces of the annulus.

[0017] Furthermore, the end face of the shaft is disposed within the through hole and is located between the upper and lower surfaces of the detection component.

[0018] Furthermore, the end face of the shaft passes through the through hole and extends beyond the lower surface of the annulus.

[0019] Furthermore, the end face of the shaft is disposed on the fixing component, and the end face of the shaft is located above the upper surface of the detection component.

[0020] Furthermore, the fixing component includes a hole for positioning the shaft.

[0021] Furthermore, the hole is either a through hole or a blind hole.

[0022] Furthermore, the diameter of the shaft is the same as the diameter of the through hole of the detection component, and the diameter of the shaft is the same as the diameter of the hole of the fixing component.

[0023] Furthermore, the fixing component is connected to the positioning component by threads, bolts, or screws.

[0024] Furthermore, the positioning component includes a first-direction positioning part and a second-direction positioning part located on a horizontal plane. The first-direction positioning part and the second-direction positioning part are arranged intersectingly, and the angle between the first direction and the second direction is α.

[0025] Furthermore, the semiconductor device also includes:

[0026] An adjustment assembly, which is connected to both the base and the positioning component;

[0027] The adjustment assembly includes a first direction adjustment part and a second direction adjustment part located on a horizontal plane. The first direction adjustment part is used to adjust the position of the first direction positioning part relative to the base, and the second direction adjustment part is used to adjust the position of the second direction positioning part relative to the base.

[0028] Furthermore, the adjustment assembly also includes a connecting part, which is disposed on the base and is used to fix the adjustment assembly on the base. Both the first direction adjustment part and the second direction adjustment part are micrometer screws. The micrometer screw is fixed on the connecting part and one end is connected to the first direction positioning part and the second direction positioning part.

[0029] Furthermore, the positioning component also includes a locking element for fixing the positioning component relative to the base in the adjusted position.

[0030] Furthermore, the base includes a central hole, and the locking component includes a plate and a bolt. The plate is disposed below the base, and the plate is provided with a threaded hole that mates with the bolt. After the positioning component is adjusted, the bolt is passed through the positioning component and the central hole of the base and connected to the threaded hole on the plate.

[0031] Furthermore, both the first directional positioning part and the second directional positioning part are shaped like "[". The second directional positioning part has a protruding ring in the middle facing the base, and the first directional positioning part has a receiving groove in the middle that cooperates with the protruding ring. The protruding ring is inserted into the receiving groove, and the first directional positioning part and the second directional positioning part can rotate relative to each other with the center of the protruding ring as the center.

[0032] Furthermore, the inner diameter of the convex ring is greater than or equal to the diameter of the through hole of the detection component.

[0033] Furthermore, when the end face of the shaft passes through the through hole and exceeds the lower surface of the annulus, the diameter of the inner hole of the convex ring is larger than the diameter of the through hole of the detection component.

[0034] Furthermore, the detection component is a shear force sensor.

[0035] Furthermore, the included angle α is greater than 0° and less than 180°.

[0036] The present invention also provides a method for adjusting the axis of the above-mentioned semiconductor device, comprising:

[0037] S1. Adjust the position of the shaft relative to the center line;

[0038] S2. Determine whether the force detected by the detection component exceeds the preset threshold; if it does, return to step S1; if it does not exceed the threshold, proceed to the next step S3.

[0039] S3. Lock the position of the axis.

[0040] Compared with the prior art, the present invention has the following advantages:

[0041] 1. The semiconductor device provided by the present invention is provided with a detection component. The detection component detects the external force on the shaft due to its offset relative to the center line. Therefore, when adjusting the position of the shaft, the detection component can determine whether the shaft has been adjusted to the desired position based on the external force detected by the detection component, thereby improving repeatability and convenience.

[0042] 2. At the same time, avoid the problem of excessive stress caused by over-adjustment of the shaft, which could lead to the lower dome cracking.

[0043] 3. In addition, the detection component is located at the end of the shaft, and the connection between the fixed component and the shaft provides more sensitive force detection. Attached Figure Description

[0044] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the drawings described below are one embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort:

[0045] Figure 1 A schematic diagram of the structure of a semiconductor device provided by the present invention;

[0046] Figure 2 A top view of the shaft adjustment device provided by the present invention;

[0047] Figure 3 A cross-sectional view of the shaft adjustment device provided by the present invention in a second direction;

[0048] Figure 4 A schematic diagram of the shaft, positioning component, and detection component provided by the present invention;

[0049] Figure 5 This is yet another structural schematic diagram of the shaft, positioning component, and detection component provided by the present invention;

[0050] Figure 6 This is another structural schematic diagram of the shaft, positioning component, and detection component provided by the present invention. Detailed Implementation

[0051] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, further illustrates the solution proposed by the present invention. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, used only to facilitate and clearly illustrate the embodiments of the present invention. Please refer to the drawings to make the objectives, features, and advantages of the present invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of the present invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the present invention, should still fall within the scope of the technical content disclosed in the present invention.

[0052] Figure 1 A schematic diagram of the structure of a semiconductor device provided by the present invention is shown. Figure 1 As shown, the present invention provides a semiconductor device. Optionally, the semiconductor device is at least one of an epitaxial device and a rapid thermal processing device. Taking an epitaxial device as an example, the epitaxial device is used to deposit an epitaxial layer on the surface of a wafer, and the epitaxial layer may be a silicon epitaxial layer, a silicon-germanium epitaxial layer, or a doped silicon-germanium epitaxial layer.

[0053] like Figure 1As shown, the semiconductor device 100 provided by the present invention mainly includes a chamber and an adjustment device 200. The chamber is composed of an upper dome 104, a lower dome 107, and a side wall 106 sealed together. The chamber 100 is symmetrically arranged along the center line 130 of the chamber, and the base generally rotates around the center line 130. The upper dome 104 is a roughly convex circle, including a circular light-transmitting part and a flange arranged around the light-transmitting part. The lower dome 107 is roughly umbrella-shaped. Both the upper dome 104 and the lower dome 107 are made of quartz. The upper dome 104 is fixed to the side wall 106 by an upper flange 103. An upper heating lamp group 102 is arranged above the chamber, and a lower heating lamp group 108 is arranged below the chamber. An air inlet 116 is arranged at one end of the chamber, and an exhaust port 105 is arranged at the other end opposite to the air inlet 116. When the required process is performed within the chamber, the process gas flows into the interior of the chamber through the inlet 116 and reaches the surface of the wafer 118. The upper heating lamp group 102 and the lower heating lamp group 108 heat the wafer 118 to the required temperature so that the process gas can react. The process gas, after the reaction is complete, is then discharged from the chamber through the exhaust port 105. On the horizontal plane, perpendicular to the line connecting the inlet and exhaust ports, the chamber is also provided with a wafer transfer port for transferring the wafer 118 into and out of the chamber. To facilitate monitoring of the process temperature of the wafer 118 within the chamber, the chamber is also equipped with an upper temperature sensor 101 and a lower temperature sensor 112, which measure the process temperature of the wafer 118 in real time through the upper dome 104 and lower dome 107, respectively, for temperature control.

[0054] like Figure 1 As shown, the semiconductor device also includes a base 117 for supporting a wafer 118, a rotating support shaft 114, a support pin 115, a support frame 113, a shaft 120, and a rotating mechanism 109. The base 117 is connected to the rotating support shaft 114. The base 117 is rotated and moved up and down by the rotating support shaft 114, thereby driving the base 117 and the wafer 118 to rotate around a centerline 130 or driving the base 117 to move up and down. The wafer support pin 115 is movably disposed in the pin hole of the base. When the rotating support shaft 114 drives the support pin 115 to move downward, the support frame 113 lifts the support pin 115, thereby separating the wafer from the base 117. The rotating mechanism 109 is connected to the rotating support shaft 114 and is used to drive the rotating support shaft 114 to rotate during the process.

[0055] The shaft 120 is directly or indirectly connected to the base. Optionally, the shaft 120 is connected to the base 117 through the rotating mechanism 109 and the rotating support shaft 114.

[0056] The adjustment device 200 includes a detection component 301, such as... Figure 1 As shown, the detection component is disposed at the end of the shaft 120 and is used to detect the external force on the shaft 120 due to its offset relative to the center line 130.

[0057] The present invention provides a detection component that can detect the external force on the shaft 120 when it is offset relative to the center line 130. Therefore, when the shaft 120 is adjusted using the adjustment device 200, the external force detected by the detection component can be used to determine whether the shaft 120 has been adjusted to the desired position, thus avoiding the instability and time waste caused by relying on experience to adjust the position of the shaft.

[0058] Figure 2 A top view of the adjustment device 200 provided by the present invention is shown. Figure 3 A cross-sectional view of the adjustment device 200 provided by the present invention in a second direction is shown. Figure 2 and Figure 3 As shown, the adjustment device 200 also includes a base 205 and a positioning component. The position of the base is fixed relative to the position of the semiconductor device's chamber. Optionally, the base 205 is fixedly connected to the semiconductor device's chamber, or the base 205 is fixedly connected to other components fixed in other positions. The positioning component is disposed on the base 205 and is used to adjust and position the shaft 120 on a horizontal plane. The detection component is connected to the positioning component. Optionally, the positioning component is disposed above the base 205, and the detection component 301 is disposed on the positioning component. Optionally, the detection component 301 is disposed on the upper surface of the positioning component, and the shaft 120 is disposed above or above the positioning component. The positioning component includes a fixing component 240 for fixing the detection component 301 onto the positioning component; optionally, the fixing component 240 is disposed above the detection component 301, and the fixing component 240 is detachably connected to the positioning component; optionally, the fixing component 240 is also used to position the shaft 120; further optionally, the fixing component 240 may be used to withstand the force generated by the shaft 120 due to its offset relative to the center line 130.

[0059] like Figure 2 and Figure 3 As shown, the positioning component includes a first-direction positioning part 211 and a second-direction positioning part 209 located on a horizontal plane. The first-direction positioning part 211 and the second-direction positioning part 209 are intersecting each other, with the first-direction positioning part 211 extending along a first direction and the second-direction positioning part 209 extending along a second direction. The angle between the first and second directions is α. The positioning component can drive the shaft 120 to move in the first or second direction and fix and position the shaft at the desired location.

[0060] Optionally, the adjustment device 200 further includes an adjustment assembly, which is connected to the base 205 and the positioning component respectively. The adjustment assembly includes a first direction adjustment part 203 and a second direction adjustment part 207 located on a horizontal plane. The first direction adjustment part 203 is used to adjust the position of the first direction positioning part 211 relative to the base 205, and the second direction adjustment part 207 is used to adjust the position of the second direction positioning part 209 relative to the base 205.

[0061] Optionally, the adjustment assembly further includes a connecting part, which is disposed on the base and used to fix the adjustment assembly on the base 205. The first direction adjustment part 203 and the second direction adjustment part 207 are both micrometer screws, which are fixed on the connecting part and one end is connected to the first direction positioning part 211 and the second direction positioning part 209. Optionally, the connecting portion includes a first connecting portion 204 and a second connecting portion 206. The first direction adjusting portion 203 is fixed to the first connecting portion 204, and one end of it is connected to the first direction positioning portion 211. The micrometer screw of the first direction adjusting portion 203 can drive the first direction positioning portion 211 to move relative to the first connecting portion in a first direction by screwing, and rotates slightly about the center 202 of the first connecting portion during movement. The second direction adjusting portion 207 is fixed to the second connecting portion 206, and one end of it is connected to the second direction positioning portion 209. The micrometer screw of the second direction adjusting portion 207 can drive the second direction positioning portion 209 to move relative to the second connecting portion in a second direction by screwing, and rotates slightly about the center 208 of the second connecting portion during movement. The first direction positioning portion 211 and the second direction positioning portion 209 are both in the shape of "[".

[0062] Optionally, the positioning component further includes a locking element for fixing the positioning component relative to the base 205 in the adjusted position.

[0063] Optionally, the base 205 includes a central hole 212, and the locking component includes a plate 221 and a bolt 219. The plate 221 is disposed below the base 205, and the plate 221 is provided with a threaded hole that mates with the bolt 219. After the positioning component is adjusted, the bolt 219 is passed through the positioning component and the central hole 212 of the base and connected to the threaded hole on the plate.

[0064] Optionally, the second directional positioning part 209 is provided with a protruding ring 210 facing the base 205 in the middle, and the first directional positioning part 211 is provided with a receiving groove 225 that cooperates with the protruding ring 210 in the middle. The protruding ring is inserted into the receiving groove, and the first directional positioning part 211 and the second directional positioning part 209 can rotate relative to each other with the center of the protruding ring 210 as the center.

[0065] Regarding the connection method between the shaft and the positioning component: Specifically, the upper surface of the positioning component is provided with a mounting groove, and the detection component 301 and the fixing component 240 are disposed within the mounting groove. The shape of the mounting groove matches the outer shape of the detection component 301 and the fixing component 240. The mounting groove is a cylindrical groove with a stepped portion inside. The detection component 301 is annular, and the annular detection component 301 also includes a through hole penetrating the upper and lower surfaces of the annular shape. Optionally, the fixing component 240 is annular or similar, and the lower surface of the fixing component 240 fits against the upper surface of the detection component 301. The fixing component 240 includes a hole, and the shaft 120 is disposed within the hole to position the shaft. The hole is a through hole or a blind hole. The detection component 301 is disposed at the bottom of the cylindrical groove, and the fixing component 240 is disposed on the stepped portion of the cylindrical groove. Preferably, the radius of the fixing component 240 is larger than the radius of the detection component 301, thereby providing a more stable force-bearing contact surface. Alternatively, the radius of the fixing component 240 may be equal to the radius of the detection component 301. Preferably, the upper surface of the fixing component 240 is higher than the upper surface of the positioning portion to facilitate force detection by the detection component 301. Alternatively, the upper surface of the fixing component 240 may be equal to or lower than the upper surface of the positioning portion. The diameter of the shaft 120 is the same as the diameter of the through hole of the detection component to facilitate force detection, and the diameter of the shaft 120 is the same as the diameter of the hole of the fixing component to position the shaft 120. A vertical hole is provided at the bottom of the mounting groove, and the diameter of the vertical hole is greater than or equal to the diameter of the shaft 120. Optionally, the vertical hole is provided in the convex ring, that is, forming the inner hole of the convex ring. Alternatively, the vertical hole is not provided in the convex ring, but is provided in other positions of the positioning component. In this solution, the convex ring is a protrusion. Specifically, as follows:

[0066] Figure 4-6 Schematic diagrams of different embodiments of the shaft, positioning component, and detection component provided by the present invention are shown respectively.

[0067] In one embodiment, such as Figure 4As shown, the end face of the shaft 120 is disposed within the through hole and between the upper and lower surfaces of the annulus. The hole of the fixing component 240 is a through hole. The end face of the shaft 120 first passes through the hole of the fixing component 240 and then extends downward until it reaches the through hole of the detection component 301. In this embodiment, the hole of the fixing component 240 can position the shaft 120 within the hole; the inner surface of the through hole of the detection component 301 contacts the shaft 120, and simultaneously, the inner surface of the hole of the fixing component 240 also contacts the shaft 120. When the shaft 120 is offset relative to the center line 130, the shaft will exert a force on the horizontal plane simultaneously on the inner surface of the hole of the fixing component 240 and the inner surface of the through hole of the detection component 301. The detection component 301 can detect the force on the shaft due to the offset relative to the center line. The greater the offset of the shaft 120 relative to the center line, the greater the detection value detected by the detection component 301.

[0068] In one embodiment, such as Figure 5 As shown, the end face of the shaft 120 passes through the through hole and extends beyond the lower surface of the annulus. The hole in the fixing component 240 is a through hole. The diameter of the vertical hole at the bottom of the mounting groove is larger than the diameter of the through hole of the detection component, meaning the diameter of the inner hole of the convex ring is larger than the diameter of the through hole of the detection component. The end face of the shaft first passes through the hole of the fixing component 240, then extends downwards, passing through the through hole of the detection component 301, until the end face of the shaft 120 is below the lower surface of the detection component 301. In this embodiment, the hole in the fixing component 240 positions the shaft 120 within it. The inner surfaces of the through hole in the detection component 301 and the hole in the fixing component 240 contact the shaft 120. When the shaft 120 is offset relative to the center line 130, it exerts a force on the horizontal plane simultaneously on the inner surfaces of the hole in the fixing component 240 and the through hole in the detection component 301. The detection component 301 can detect the force exerted on the shaft due to its offset relative to the center line. The greater the offset of the shaft 120 relative to the center line, the greater the detection value detected by the detection component 301. In this embodiment, because the shaft extends deeper downwards, the hole in the positioning component provides better positioning for the shaft. Furthermore, because the diameter of the vertical hole (the inner hole of the convex ring) is larger than the diameter of the shaft, the shaft will not touch the inner surface of the vertical hole, allowing the detection component 301 to detect a larger and more sensitive force.

[0069] In another embodiment, such as Figure 6As shown, the end face of the shaft is disposed on the fixing component 240, and the end face of the shaft is located above the upper surface of the detection component. Specifically, the shaft is located within the hole of the fixing component 240, and is situated between the upper and lower surfaces of the fixing component 240. In this embodiment, the hole of the fixing component 240 can be a through hole or a blind hole. The end face of the shaft 120 first passes through the upper surface of the fixing component 240, and then extends downward until it reaches the hole of the fixing component 240. In this embodiment, the hole of the fixing component 240 can position the shaft 120 in the hole; the inner surface of the hole of the fixing component 240 contacts the shaft 120, but the inner surface of the detection component 301 does not contact the shaft 120. When the shaft 120 is offset relative to the center line 130, the shaft will exert a force on the inner surface of the hole of the fixing component 240 on the horizontal plane. Due to the balance of forces and the interaction of forces, the detection component 301 will be subjected to the force of the fixing component 240. Therefore, the detection component 301 can detect the force on the shaft due to the offset relative to the center line. The greater the offset of the shaft 120 relative to the center line, the greater the detection value detected by the detection component 301.

[0070] Optionally, the fixing component 240 is connected to the positioning component via threads, bolts, or screws. Specifically, the sidewall of the fixing component 240 is provided with external threads, and the mounting groove of the positioning component is provided with internal threads that mate with the external threads, thereby achieving a detachable connection between the fixing component 240 and the positioning component; or through holes or threaded holes are provided around the fixing component 240 or at other locations, and the fixing component is detachably fixed to the positioning component by bolts or screws engaging with the through holes or threaded holes. The connection methods are merely examples and are not specifically limited here.

[0071] Optionally, the detection component 301 is a shear force sensor.

[0072] Optionally, the angle α between the first direction and the second direction is greater than 0° and less than 180°, and preferably, the angle α is greater than 80° and less than 100°.

[0073] Additionally, the semiconductor device also includes a controller and an interactive terminal. The controller is electrically connected to the detection component and the interactive terminal. The detection component transmits force-related signals to the controller. The controller processes the received signals and transmits the processed signals to the interactive terminal, which displays the processed signals. Technicians can view the processed signals through the interactive terminal. Optionally, the controller shown is a host computer, and the interactive terminal shown is a display.

[0074] The present invention also provides a method for adjusting the axis of the aforementioned semiconductor device:

[0075] S1. Adjust the position of the shaft relative to the center line;

[0076] Specifically, the first direction adjustment part 203 and / or the second direction adjustment part 207 are controlled by turning the micrometer screw to adjust the position of the first direction positioning part 211 and the second direction positioning part 209 relative to the base 205, thereby driving the shaft 120 to move in the first direction and / or the second direction until the shaft coincides with the center line.

[0077] S2. Determine whether the force detected by the detection component exceeds a preset threshold; if it does, return to step S1; if it does not exceed, proceed to the next step S3.

[0078] Specifically, the controller compares the force detected by the detection component on the shaft due to its offset relative to the centerline with a preset threshold. By observing the processing result displayed on the interactive terminal, if the force on the shaft still exceeds the preset force threshold, step S1 is continued, that is, the position of the shaft is adjusted; if the force on the shaft does not exceed the preset force threshold, the adjustment is stopped.

[0079] S3. Lock the position of the axis.

[0080] Specifically, after adjustment, the bolt 219 is passed through the central hole 212 of the positioning component and the base and connected to the threaded hole on the plate to fix the positioning component relative to the base 205, that is, to fix the position of the shaft 120 relative to the position of the base 205.

[0081] The semiconductor device provided by the present invention is equipped with a detection component that detects the force on the shaft due to its offset relative to the center line. Therefore, when adjusting the position of the shaft, the device can determine whether the shaft has been adjusted to the desired position based on the external force detected by the detection component, which increases convenience and avoids the problem of excessive stress on the shaft causing the lower dome to break due to over-adjustment.

[0082] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. Additionally, the term "connection" in this document indicates a direct connection between A and B, or an indirect connection between A and B, such as an indirect connection between A and B via C, or even via C and D, or more components. The connection between A and B can be integral or separate, detachable or fixed. The term "optional" in this document indicates that the technical feature can be combined with or not combined with any feature in the document.

[0083] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A semiconductor device, characterized in that, include: A base for supporting a wafer; A shaft, which is directly or indirectly connected to the base; A detection component, disposed at the end of a shaft, is used to detect the external force exerted on the shaft due to its offset relative to a centerline; the detection component includes a through hole. A base, the position of which is fixed relative to the position of the chamber of the semiconductor device; A positioning component is disposed on the base and is used to adjust the position of the shaft on a horizontal plane; the detection component is connected to the positioning component. The positioning component includes a fixing component for fixing the detection component onto the positioning component; the fixing component includes a hole. Rotating mechanism; A rotating support shaft, which is connected to the rotating mechanism; The base is connected to the rotating support shaft, and the base moves up and down via the rotating support shaft; the shaft is connected to the base via the rotating mechanism and the rotating support shaft. The shaft applies a horizontal force to the inner surface of the through hole of the detection component or the inner surface of the hole of the fixing component, thereby detecting the offset of the shaft relative to the center line through the detection component.

2. The semiconductor device as claimed in claim 1, characterized in that, The fixing component is positioned above the detection component.

3. The semiconductor device as described in claim 2, characterized in that, The detection component is ring-shaped, and the ring includes a through hole that penetrates the upper and lower surfaces of the ring.

4. The semiconductor device as claimed in claim 3, characterized in that, The end face of the shaft is disposed within the through hole and is located between the upper and lower surfaces of the detection component.

5. The semiconductor device as claimed in claim 3, characterized in that, The end face of the shaft passes through the through hole and extends beyond the lower surface of the annulus.

6. The semiconductor device as claimed in claim 3, characterized in that, The end face of the shaft is disposed on the fixing component, and the end face of the shaft is located above the upper surface of the detection component.

7. The semiconductor device as claimed in claim 6, characterized in that, The hole is used to position the shaft.

8. The semiconductor device as claimed in claim 7, characterized in that, The hole can be a through hole or a blind hole.

9. The semiconductor device as claimed in claim 8, characterized in that, The diameter of the shaft is the same as the diameter of the through hole of the detection component, and the diameter of the shaft is the same as the diameter of the hole of the fixing component.

10. The semiconductor device according to any one of claims 1-9, characterized in that, The fixing component is connected to the positioning component by threads, bolts or screws.

11. The semiconductor device according to any one of claims 1-9, characterized in that, The positioning component includes a first-direction positioning part and a second-direction positioning part located on a horizontal plane. The first-direction positioning part and the second-direction positioning part are arranged intersectingly, and the angle between the first direction and the second direction is α.

12. The semiconductor device as claimed in claim 11, characterized in that, The semiconductor device also includes: An adjustment assembly, which is connected to both the base and the positioning component; The adjustment assembly includes a first direction adjustment part and a second direction adjustment part located on a horizontal plane. The first direction adjustment part is used to adjust the position of the first direction positioning part relative to the base, and the second direction adjustment part is used to adjust the position of the second direction positioning part relative to the base.

13. The semiconductor device as claimed in claim 12, characterized in that, The adjustment assembly further includes a connecting part, which is disposed on the base and is used to fix the adjustment assembly on the base. Both the first direction adjustment part and the second direction adjustment part are micrometer screws, which are fixed on the connecting part and have one end connected to the first direction positioning part and the second direction positioning part.

14. The semiconductor device as claimed in claim 13, characterized in that, The positioning component also includes a locking element for fixing the positioning component relative to the base in the adjusted position.

15. The semiconductor device as claimed in claim 14, characterized in that, The base includes a central hole, and the locking component includes a plate and a bolt. The plate is located below the base, and the plate has a threaded hole that mates with the bolt. After the positioning component is adjusted, the bolt is passed through the positioning component and the central hole of the base and connected to the threaded hole on the plate.

16. The semiconductor device as claimed in claim 11, characterized in that, Both the first directional positioning part and the second directional positioning part are shaped like a "[". The second directional positioning part has a convex ring in the middle facing the base, and the first directional positioning part has a receiving groove in the middle that cooperates with the convex ring. The convex ring is inserted into the receiving groove, and the first directional positioning part and the second directional positioning part can rotate relative to each other with the center of the convex ring as the center.

17. The semiconductor device as claimed in claim 16, characterized in that, The diameter of the inner hole of the convex ring is greater than or equal to the diameter of the through hole of the detection component.

18. The semiconductor device as claimed in claim 17, characterized in that, The detection component is annular. When the end face of the shaft passes through the through hole and exceeds the lower surface of the annular ring, the inner diameter of the convex ring is larger than the diameter of the through hole of the detection component.

19. The semiconductor device according to any one of claims 1-9, characterized in that, The detection component is a shear force sensor.

20. The semiconductor device as claimed in claim 11, characterized in that, The included angle α is greater than 0° and less than 180°.

21. A method for adjusting the axis of a semiconductor device as described in any one of claims 1-20, characterized in that, include: S1. Adjust the position of the shaft relative to the center line; S2. Determine whether the force detected by the detection component exceeds the preset threshold. If it exceeds the limit, return to step S1; If it does not exceed the limit, proceed to the next step S3; S3. Lock the position of the axis.

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