Light-emitting module and display device

Abstract

A light-emitting substrate (100) comprises a substrate (110) and a plurality of light-emitting components (120). The plurality of light-emitting components (120) are located on one side of the substrate (110). At least one light-emitting component (120) comprises a light-emitting element (130) and a light-modulating portion (140) surrounding the light-emitting element. The light-modulating portion (140) comprises a plurality of sub-structures (142) which are spaced apart from each other. In any direction away from the light-emitting element (130), the height of any two sub-structures (142) in the light-modulating portion (140) relative to the sub-structure (142) closer to the light-emitting element (130) is less than the height of the sub-structure (142) farther away from the light-emitting element (130).

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a light-emitting module and a display device. Background Technology

[0002] Light-emitting substrates, such as Mini LED (Mini Light-Emitting Diode) substrates, have the characteristics of self-emission, fast response, high contrast, wide color gamut, wide viewing angle, and can be fabricated on flexible substrates, and are widely used. Summary of the Invention

[0003] On one hand, a light-emitting substrate is provided. The light-emitting substrate includes a substrate and a plurality of light-emitting components. The plurality of light-emitting components are located on one side of the substrate. At least one light-emitting component includes a light-emitting element and a dimming section disposed around the light-emitting element. The dimming section includes a plurality of substructures spaced apart from each other. Wherein, along any direction away from the light-emitting element, the height of any two substructures in the dimming section relative to the substructure closer to the light-emitting element is less than the height of the substructure relative to the substructure farther from the light-emitting element.

[0004] In some embodiments, along any direction away from the light-emitting element, the area of ​​the orthographic projection of any two substructures in the dimming section relative to the substructure closer to the light-emitting element on the substrate is smaller than the area of ​​the orthographic projection of the substructure relatively farther from the light-emitting element on the substrate.

[0005] In some embodiments, the light-emitting substrate further includes a driving circuit layer and a reflective film. The driving circuit layer is located on one side of the substrate. The driving circuit layer includes metal traces and conductive pads, with the conductive pads electrically connected to the metal traces. The reflective film is located on the side of the driving circuit layer away from the substrate, exposing the conductive pads. The light-emitting element includes a light-emitting portion and leads. The light-emitting portion is located on the side of the reflective film away from the driving circuit layer. The leads are electrically connected to the conductive pads. Multiple substructures in the dimming portion are located on the surface of the reflective film away from the driving circuit layer.

[0006] In some embodiments, the light-emitting substrate further includes a driving circuit layer and a reflective component. The driving circuit layer is located on one side of the substrate. The driving circuit layer includes metal traces and conductive pads, the conductive pads being electrically connected to the metal traces. The reflective component is located on the side of the driving circuit layer away from the substrate. The reflective component encloses a reflective cavity. The reflective component has a through-hole. The light-emitting element includes a light-emitting portion and pins. The light-emitting portion is located in the reflective cavity. The pins are electrically connected to the conductive pads through the through-hole. Multiple substructures in the dimming portion are located in the reflective cavity.

[0007] In some embodiments, the reflective component includes a bottom wall and side walls. The bottom wall has a connecting hole. A plurality of substructures in the dimming section are located on the bottom wall. One end of the side wall is connected to the bottom wall, and the other end extends along the bottom wall in a direction away from the substrate. The side wall and the bottom wall enclose a reflective cavity.

[0008] In some embodiments, the sidewalls are perpendicular to the bottom wall.

[0009] In some embodiments, the edge of the sidewall away from the bottom wall has a shape that is a series of curves or a series of broken lines when projected onto a reference plane parallel to the sidewall.

[0010] In some embodiments, the multiple substructures in the dimming section are located in a straight line along any direction away from the light-emitting element.

[0011] In some embodiments, at least one substructure is shaped as one of a cone, pyramid, frustum, truncated cone, and hemisphere.

[0012] In some embodiments, the height of the multiple substructures in the dimming unit ranges from 250 μm to 1000 μm.

[0013] In some embodiments, the absolute value of the height difference between any two adjacent substructures in the dimming section ranges from 200 μm to 300 μm in any direction away from the light-emitting element.

[0014] In some embodiments, along any direction away from the light-emitting element, the absolute value of the height difference between any two adjacent substructures in the dimming section is equal to the absolute value of the height difference between any other two adjacent substructures.

[0015] In some embodiments, the light-emitting substrate further includes diffused particles. The diffused particles are located within at least one substructure.

[0016] In some embodiments, the light-emitting substrate has a display area. The brightness of the light-emitting elements near the edge of the display area is greater than the brightness of the light-emitting elements located at other positions in the display area.

[0017] On the other hand, a light-emitting module is provided. The light-emitting module includes a light-emitting substrate as described above and at least one lens. The at least one lens is located on the side of the plurality of light-emitting components away from the substrate.

[0018] In some embodiments, at least one lens is configured to have at least one first groove on a surface near the substrate. At least one substructure in the dimming section is at least partially embedded in the first groove.

[0019] In some embodiments, at least one first groove is an annular groove. The orthographic projection of the annular groove onto the substrate surrounds the orthographic projection of the light-emitting element onto the substrate.

[0020] In some embodiments, there are multiple first grooves. Multiple substructures embedded in the same first groove have the same height. And / or, the areas of the orthographic projections of the multiple substructures embedded in the same first groove onto the substrate are the same.

[0021] In some embodiments, the number of first grooves is multiple. Along any direction away from the light-emitting element, the depth of any two first grooves relative to the depth of the first groove closer to the light-emitting element is less than the depth of the first groove relatively farther from the light-emitting element. And / or, along any direction away from the light-emitting element, the width of any two first grooves relative to the width of the first groove closer to the light-emitting element is less than the width of the first groove relatively farther from the light-emitting element.

[0022] In some embodiments, at least one lens is configured to have a recess on a surface remote from the substrate. The orthogonal projection of the light-emitting element onto the substrate at least partially overlaps with the orthogonal projection of the recess onto the substrate.

[0023] In some embodiments, at least one lens is configured to have a second groove on a surface near the substrate. The light-emitting element includes a light-emitting portion, at least a portion of which is located within the second groove.

[0024] In some embodiments, the light-emitting element is configured to emit white light.

[0025] In some embodiments, the light-emitting element is configured to emit monochromatic light. The light-emitting module also includes a color conversion film. The color conversion film is located on the side of at least one lens away from the light-emitting element.

[0026] In some embodiments, the color conversion film is a quantum dot film. The light-emitting element includes a first light-emitting element. The orthographic projection of the first light-emitting element onto the substrate is located near the edge of the orthographic projection of the quantum dot film onto the substrate. The dimming section includes a first dimming section. The first dimming section surrounds the first light-emitting element. The light-emitting module also includes fluorescent particles. The fluorescent particles are located within at least one substructure in the first dimming section. The fluorescent particles are configured to modulate light incident on them, such that the modulated light mixes with unmodulated light emitted by the light-emitting element to form white light.

[0027] In some embodiments, the light-emitting element is configured to emit blue light, and the fluorescent particles include yellow fluorescent particles. Alternatively, the light-emitting element is configured to emit blue light, and the fluorescent particles include red and green fluorescent particles.

[0028] In some embodiments, the light-emitting module further includes a brightness enhancement film. The brightness enhancement film is located on the side of the color conversion film away from at least one lens.

[0029] In another aspect, a display device is provided. The display device includes a backlight module and a liquid crystal display panel. The liquid crystal display panel is located on the light-emitting side of the backlight module. The backlight module includes a light-emitting substrate as described above. Alternatively, the backlight module includes a light-emitting module as described above.

[0030] In another aspect, a display device is provided. The display device includes a display panel. The display panel includes a light-emitting substrate as described above. Alternatively, the display panel includes a light-emitting module as described above. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0032] FIG. 1A This is a structural diagram of a light-emitting module according to some embodiments;

[0033] FIG. 1B This is a structural diagram of a light-emitting substrate according to some embodiments;

[0034] FIG. 1C This is a structural diagram of a light-emitting module according to some other embodiments;

[0035] FIG. 2A This is a structural diagram of the substructure and light-emitting element according to some embodiments;

[0036] FIG. 2B This is a structural diagram of the substructure and light-emitting element according to some other embodiments;

[0037] FIG. 2C This is a structural diagram of a light-emitting component according to some embodiments;

[0038] FIG. 2D This is a structural diagram of a light-emitting component according to some other embodiments;

[0039] FIG. 2E This is a structural diagram of a light-emitting substrate according to some other embodiments;

[0040] FIG. 2F This is a structural diagram of a light-emitting substrate according to some other embodiments;

[0041] FIG. 2G This is a structural diagram of a light-emitting module according to some other embodiments;

[0042] FIG. 3A This is a first structural diagram corresponding to the steps of forming a substructure according to some embodiments;

[0043] FIG. 3B This is a second structural diagram corresponding to the steps of forming a substructure according to some embodiments;

[0044] FIG. 3C This is a third structural diagram of the steps for forming a substructure according to some embodiments;

[0045] FIG. 3D This is a structural diagram of a substructure according to some embodiments;

[0046] FIG. 4A This is a structural diagram of the driving circuit layer, reflective film, and light-emitting element according to some embodiments;

[0047] FIG. 4B This is a structural diagram of a drive circuit according to some embodiments;

[0048] FIG. 4C This is a structural diagram of the driving circuit layer and the reflective film according to some embodiments;

[0049] FIG. 5A This is a structural diagram of a light-emitting module according to some other embodiments;

[0050] FIG. 5B This is a structural diagram of a reflective component according to some embodiments;

[0051] FIG. 5C This is a structural diagram of a light-emitting module according to some other embodiments;

[0052] FIG. 5D This is a structural diagram of a light-emitting module according to some other embodiments;

[0053] FIG. 5E This is a structural diagram of a light-emitting substrate according to some other embodiments;

[0054] FIG. 5F This is a structural diagram of a substructure according to some other embodiments;

[0055] FIG. 5G This is a structural diagram of a light-emitting module according to some other embodiments;

[0056] FIG. 6A This is a structural diagram of a light-emitting module according to some other embodiments;

[0057] FIG. 6B An exploded view of a dimming film according to some embodiments;

[0058] FIG. 6C This is a structural diagram of a first light-emitting element and a first dimming unit according to some embodiments;

[0059] FIG. 6D This is a structural diagram of the edge region of a quantum dot film according to some embodiments;

[0060] FIG. 6E This is a structural diagram of the edge region of a quantum dot film according to some other embodiments;

[0061] FIG. 6F This is a structural diagram of the edge region of a quantum dot film according to some other embodiments;

[0062] FIG. 6G This is a structural diagram of a light-emitting module according to some other embodiments;

[0063] FIG. 6H This is a structural diagram of a light-emitting module according to some other embodiments;

[0064] FIG. 7A This is a structural diagram of a display device according to some embodiments;

[0065] FIG. 7B This is a structural diagram of a display device according to some other embodiments;

[0066] FIG. 7C This is a structural diagram of a display device according to some other embodiments;

[0067] FIG. 7D This is a structural diagram of a display device according to some other embodiments. Detailed Implementation

[0068] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0069] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0070] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0071] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0072] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0073] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0074] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0075] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0076] FIG. 1A This is a structural diagram of a light-emitting module according to some embodiments. FIG. 1B This is a structural diagram of a light-emitting substrate according to some embodiments. FIG. 1C This is a structural diagram of a light-emitting module according to some other embodiments.

[0077] like FIG. 1A As shown, embodiments of this disclosure provide a light-emitting module 200. It is understood that the light-emitting module 200 is used to implement functions such as backlighting or image display. The light-emitting module 200 includes a light-emitting substrate 100, which will be described with examples below.

[0078] In some examples, such as FIG. 1B As shown, the light-emitting substrate 100 includes a substrate 110 and a plurality of light-emitting components 120.

[0079] In some examples, substrate 110 is a rigid substrate. In other examples, substrate 110 is a flexible substrate. For example, the material of substrate 110 includes any one of plastic, FR-4 grade material, resin, glass, quartz, polyimide, or polymethyl methacrylate (PMMA).

[0080] Multiple light-emitting components 120 are located on one side of the substrate 110, and understandably, the light-emitting components 120 are used for emitting light. In some examples, the multiple light-emitting components 120 are located on one side surface of the substrate 110. In other examples, other film structures are also disposed between the multiple light-emitting components 120 and the substrate 110.

[0081] In some examples, such as FIG. 1B As shown, the substrate 110 is divided into multiple light-emitting regions 102, and a light-emitting component 120 is located within one light-emitting region 102. The multiple light-emitting regions 102 are arranged in an array to form a display area 104. Understandably, the display area 104 can realize functions such as backlighting or image display.

[0082] In some examples, the number of light-emitting regions 102 can be 512, 1000, or 2000, etc. The embodiments of this disclosure do not further limit the number of light-emitting regions 102.

[0083] In some implementations, such as FIG. 1A As shown, each light-emitting component 120 includes a light-emitting element 130. Multiple light-emitting components 120 are arranged in an array, with the light-emitting elements 130 in different light-emitting components 120 spaced apart. For example, the distance D between any two adjacent light-emitting elements 130 can be the same or different.

[0084] Understandably, the light-emitting substrate 100 has a light-emitting side, and the light emitted by the light-emitting element 130 can be emitted through the light-emitting side of the light-emitting substrate 100.

[0085] In some examples, such as FIG. 1A As shown, the user observes the light-emitting substrate 100 in a direction perpendicular to or approximately perpendicular to the substrate 110, that is, the user observes the light-emitting substrate 100 in a direction perpendicular to or approximately perpendicular to the plane where the light-emitting element 130 is located. For example, the light-emitting substrate 100 configured in the above manner can be referred to as a direct-lit light-emitting substrate.

[0086] Understandably, multiple light-emitting elements 130 can emit light independently. That is, in some examples, multiple light-emitting elements 130 can emit light simultaneously. In other examples, some of the multiple light-emitting elements 130 may emit light while others do not. When multiple light-emitting elements 130 emit light simultaneously, the brightness of each light-emitting element 130 may be the same or different.

[0087] In some examples, multiple light-emitting elements 130 are used to emit blue light. In other examples, multiple light-emitting elements 130 are used to emit white light. In still other examples, some of the multiple light-emitting elements 130 are used to emit red light, another portion are used to emit green light, and yet another portion are used to emit blue light.

[0088] In some examples, the light-emitting element 130 is a light-emitting diode (LED). For example, the light-emitting element 130 can be any of a conventional LED, a mini LED, or a micro LED.

[0089] For example, a traditional LED is defined as an LED with a size greater than or equal to 500 μm and a spacing greater than 2 mm between LEDs. A Mini LED is defined as an LED with a size greater than or equal to 80 μm and less than 500 μm. A Micro LED is defined as an LED with a size less than 50 μm.

[0090] It should be noted that the embodiments disclosed herein do not further limit the size of the light-emitting element 130 or the distance D between the plurality of light-emitting elements 130.

[0091] Understandably, by arranging multiple light-emitting elements 130 in an array, the light-emitting substrate 100 can achieve local dimming in a smaller range, thereby improving the backlight and display performance of the light-emitting substrate 100.

[0092] In some examples, such as FIG. 1A As shown, the light-emitting module 200 also includes a color conversion film 222. The color conversion film 222 is located on the side of the light-emitting element 130 away from the substrate 110, and is used to convert the light emitted by the light-emitting element 130 into red, green, and blue light. Understandably, by mixing red, green, and blue light of different intensities, the light-emitting substrate 100 can display color image information.

[0093] In some examples, multiple light-emitting elements 130 are used to emit blue light, and the color conversion film 222 is a quantum dot (QD) film 2221 or a phosphor organic film material.

[0094] For example, quantum dot film 2221 includes red quantum dots and green quantum dots, such as FIG. 1A As indicated by the middle arrow, when blue light emitted by the light-emitting element 130 illuminates the quantum dot film 2221, red quantum dots can convert blue light into red light, and green quantum dots can convert blue light into green light, thereby achieving the color conversion function of the light emitted by the light-emitting element 130. Similarly, the phosphor film includes phosphor particles that can convert blue light into yellow light, thereby achieving the color conversion function of the light emitted by the light-emitting element 130.

[0095] In other examples, multiple light-emitting elements 130 are used to emit white light, and the color conversion film 222 is a color filter. The color filter includes a red filter, a green filter, and a blue filter. FIG. 1A As indicated by the middle arrow, when the white light emitted by the light-emitting element 130 illuminates the color filter, red, green, and blue light can exit the color filter, while other colors of light are filtered out by the color filter and cannot be emitted, thereby realizing the color conversion function of the light emitted by the light-emitting element 130.

[0096] In some examples, such as FIG. 1A As shown, the light-emitting substrate 100 also includes a reflective film 162, which is located on the side of the substrate 110 close to the light-emitting element 130. Understandably, the reflective film 162 is used to reflect light, thereby increasing the intensity of light illuminating the light-emitting substrate 100, increasing the brightness of the light-emitting substrate 100, and reducing the power consumption of the light-emitting substrate 100.

[0097] For example, such as FIG. 1C As shown, the distance between the reflective film 162 and the film material (e.g., color conversion film 222) can be called the optical distance (OD). That is, the light emitted by two adjacent light-emitting elements 130 can be mixed between the reflective film 162 and the film material (e.g., color conversion film 222).

[0098] For example, the mixing distance H ranges from 1mm to 5mm. For instance, the mixing distance H can be 1mm, 2mm, 2.2mm, 2.5mm, 2.8mm, or 3mm, 5mm, etc.

[0099] Understandably, to allow space for thermal expansion and contraction of the membrane material, a gap is usually left between two adjacent light-emitting areas 102. For example... FIG. 1BAs indicated by the middle arrow, when the light-emitting substrate 100 is dimmed in a specific area, that is, when some of the multiple light-emitting elements 130 emit light (e.g., light-emitting element 130a) while other light-emitting elements 130 do not emit light (e.g., light-emitting element 130b), the light emitted by light-emitting element 130a can not only illuminate the light-emitting area 102a, but also illuminate the light-emitting area 102b through the gap between two adjacent light-emitting areas 102, causing the light-emitting area 102b to have a halo, that is, causing the light-emitting substrate 100 to have light leakage, which affects the light-emitting performance of the light-emitting substrate 100.

[0100] Understandably, in the embodiments of this disclosure, light-emitting regions 102a and 102b are only used to distinguish two different light-emitting regions 102, and do not further define the light-emitting regions 102. Light-emitting elements 130a and 130b are only used to distinguish two light-emitting elements 130 located in light-emitting regions 102a and 102b respectively, and do not further define the light-emitting elements 130.

[0101] In some embodiments, the light leakage phenomenon of the light-emitting substrate 100 can be improved by increasing the number of light-emitting areas 102 and placing the light-emitting element 130 inside the reflective cup.

[0102] However, the inventors of this disclosure have discovered that increasing the number of light-emitting areas 102 increases the wiring difficulty of the circuit structure (such as the drive circuit electrically connected to the light-emitting element 130), thereby increasing the cost of the light-emitting substrate 100. Setting up structures such as reflective cups also increases the complexity and consequently leads to an increase in the cost of the light-emitting substrate 100.

[0103] To improve the light leakage phenomenon on the light-emitting substrate 100, such as FIG. 1B As shown, some embodiments of this disclosure provide a light-emitting substrate 100 including a substrate 110 and a plurality of light-emitting components 120. The plurality of light-emitting components 120 are located on one side of the substrate 110. At least one light-emitting component 120 includes a light-emitting element 130 and a dimming section 140 disposed around the light-emitting element 130. The dimming section 140 includes a plurality of substructures 142, which are spaced apart from each other.

[0104] In some examples, such as FIG. 1B As shown, each light-emitting component 120 includes a light-emitting element 130 and a dimming section 140 disposed around the light-emitting element 130.

[0105] It is understood that the above embodiments of this disclosure have already provided examples illustrating the positional relationship between the substrate 110, the light-emitting element 130 and the substrate 110, as well as the types of light-emitting elements 130, and will not be repeated here. The dimming unit 140 will be described with examples below.

[0106] like FIG. 2A As shown, the dimming section 140 surrounds the light-emitting element 130. The dimming section 140 includes a plurality of spaced-apart substructures 142, that is, the plurality of substructures 142 in the dimming section 140 surround the light-emitting element 130. In some examples, the spacing between the plurality of substructures 142 in the dimming section 140 may be the same or different.

[0107] In some examples, the multiple substructures 142 in the dimming section 140 may surround the light-emitting element 130 in the form of a circular ring, an elliptical ring, a rectangular ring, a polygonal ring, or other irregular rings.

[0108] In other examples, the multiple substructures 142 in the dimming section 140 may also surround the light-emitting element 130 in the form of at least two concentric circular rings, at least two concentric elliptical rings, at least two concentric rectangular rings, at least two concentric polygonal rings, or at least two concentric irregular rings.

[0109] FIG. 2B This is a structural diagram of the substructure and light-emitting element according to some embodiments. FIG. 2A This is a structural diagram of the substructure and light-emitting element according to some other embodiments.

[0110] In some examples, such as FIG. 2B and FIG. 2A As shown, a plurality of substructures 142 in the dimming section 140 surround a light-emitting element 130. For example, the plurality of substructures 142 in the dimming section 140 are spaced apart from each other and arranged in a ring or a plurality of concentric rings, surrounding the light-emitting element 130.

[0111] For example, when multiple substructures 142 in the dimming unit 140 surround a light-emitting element 130, they surround different light-emitting elements 130 ( FIG. 2B The light-emitting element 130c and FIG. 2A The number of substructures 142 of the light-emitting element 130d can be the same or different.

[0112] Understandably, light-emitting elements 130c and 130d are used only to distinguish two different light-emitting elements 130, and do not further limit the light-emitting element 130.

[0113] In some examples, such as FIG. 2C As shown, when multiple substructures 142 in the dimming section 140 surround a light-emitting element 130, the light-emitting element 130 is located at the center of a circular ring or concentric ring, which improves the structural regularity of the light-emitting assembly 120.

[0114] FIG. 2D This is a structural diagram of a light-emitting component according to some embodiments. FIG. 2CThis is a structural diagram of a light-emitting component according to some other embodiments.

[0115] In some examples, such as FIG. 2D and FIG. 2C As shown, multiple substructures 142 in the dimming section 140 surround multiple light-emitting elements 130.

[0116] For example, such as FIG. 2D As shown, when the multiple substructures 142 in the dimming section 140 surround the multiple light-emitting elements 130, the multiple light-emitting elements 130 can form a triangle by connecting them sequentially in a clockwise or counterclockwise direction. FIG. 2E As shown, when multiple substructures 142 in the dimming section 140 surround multiple light-emitting elements 130, the multiple light-emitting elements 130 can also form a rectangular, square, rhomboid or other irregular shape arrangement by connecting them sequentially in a clockwise or counterclockwise direction.

[0117] FIG. 2F This is a structural diagram of a light-emitting substrate according to some other embodiments. FIG. 1B This is a structural diagram of a light-emitting substrate according to some other embodiments.

[0118] In some examples, such as FIG. 2E As shown, substructure 142 is conical or pyramidal in shape. In other examples, such as FIG. 2F As shown, substructure 142 is shaped like a frustum or a pyramid. In some other examples, such as... FIG. 2G As shown, the shape of substructure 142 is hemispherical or semi-ellipsoidal, etc.

[0119] Understandably, the shapes of the plurality of substructures 142 in the dimming unit 140 may be the same or different. The embodiments of this disclosure do not further limit the shape of the substructures 142.

[0120] FIG. 2G This is a structural diagram of a light-emitting module according to some other embodiments.

[0121] In some embodiments, such as FIG. 2G As shown, in any direction away from the light-emitting element 130, the height of any two substructures 142 in the dimming section 140 relative to the substructure 142 closer to the light-emitting element 130 is less than the height of the substructure 142 relative to the light-emitting element 130.

[0122] Understandably, such as FIG. 2GAs shown, in any direction away from the light-emitting element 130, the height of any two substructures 142 in the dimming section 140 is less than the height of the substructure 142 that is closer to the light-emitting element 130 than the height of the substructure 142 that is farther away from the light-emitting element 130. That is, in any direction away from the light-emitting element 130, the height of multiple substructures 142 can gradually increase.

[0123] For example, such as FIG. 2G As shown, starting from the geometric center of the light-emitting element 130, the vertices or top surfaces of multiple substructures 142 arranged in any direction away from the light-emitting element 130 can be connected sequentially to obtain a concave curve or concave surface.

[0124] Understandably, the light-emitting element 130 is located at the position with the smallest distance from the substrate 110 among the various concave curves or concave surfaces, and the substructure 142 with the largest height in the dimming section 140 is located at the position with the largest distance from the substrate 110 among the concave curves or concave surfaces, and also at the largest distance from the light-emitting element 130. That is, the concave curve or concave surface is curved towards the direction closer to the substrate 110 (e.g., FIG. 2G (As shown by the dashed line).

[0125] This configuration enables the multiple substructures 142 in the dimming unit 140 to collimate the light, reduce the amount of light diffusion in all directions, and thus reduce the intensity of light illuminating other light-emitting areas 102.

[0126] In this way, when performing local dimming on the light-emitting substrate 100, such as FIG. 3A As shown, if the light-emitting element 130a emits light and the light-emitting element 130b does not emit light, the dimming unit 140 can collimate the light emitted by the light-emitting element 130a, reduce the intensity of the light illuminating the light-emitting area 102b, thereby reducing the crosstalk between the two light-emitting elements 130 (light-emitting element 130a and light-emitting element 130b), weakening the light leakage phenomenon in the light-emitting substrate 100, and improving the light-emitting performance of the light-emitting substrate 100.

[0127] In some examples, the heights of the multiple substructures 142 gradually increase in an arithmetic sequence along any direction away from the light-emitting element 130.

[0128] By providing the dimming unit 140, the light leakage phenomenon of the light-emitting substrate 100 can be improved without increasing the number of light-emitting areas 102, thus avoiding increasing the difficulty of circuit routing. Furthermore, the dimming unit 140 can be used to improve the bright and dark areas and light leakage phenomenon of light-emitting substrates 100 with a large or small number of light-emitting areas 102, thereby improving the applicability of the dimming unit 140.

[0129] In addition, the dimming unit 140 is provided to improve the light leakage phenomenon of the light-emitting substrate 100. There is no need to make structures such as reflective cups, which reduces the cost of the light-emitting substrate 100 and simplifies the process, thereby improving the production efficiency of the light-emitting substrate 100.

[0130] As can be seen from the above, in the embodiments of this disclosure, the height of the plurality of substructures 142 in the dimming section 140 gradually increases along any direction away from the light-emitting element 130. Thus, starting from the geometric center of the light-emitting element 130, the vertices or top surfaces of the plurality of substructures 142 arranged in any direction away from the light-emitting element 130 can be sequentially connected to obtain a concave curve or concave surface.

[0131] This configuration enables the multiple substructures 142 in the dimming section 140 to collimate the light emitted from the light-emitting element 130, reducing the diffusion angle of the light in all directions, thereby reducing the intensity of the light illuminating other light-emitting areas 102.

[0132] In this way, when the light-emitting substrate 100 is dimmed in a specific area, the dimming unit 140 can collimate the light emitted by the light-emitting element 130, reduce the light intensity illuminating other light-emitting areas 102, thereby reducing the crosstalk between the two light-emitting elements 130, weakening the light leakage phenomenon of the light-emitting substrate 100, and improving the light-emitting performance of the light-emitting substrate 100.

[0133] By providing the dimming unit 140, the light leakage phenomenon of the light-emitting substrate 100 can be improved without increasing the number of light-emitting areas 102, thus avoiding increasing the difficulty of circuit routing. Furthermore, the dimming unit 140 can be used to improve the bright and dark areas and light leakage phenomenon of light-emitting substrates 100 with a large or small number of light-emitting areas 102, thereby improving the applicability of the dimming unit 140.

[0134] FIG. 3B This is the first structural diagram corresponding to the steps of forming a substructure according to some embodiments. FIG. 3C This is a second structural diagram corresponding to the steps of forming a substructure according to some embodiments. FIG. 3D This is a third structural diagram of the steps for forming a substructure according to some embodiments. FIG. 3A to FIG. 3D This is a structural diagram of a substructure according to some embodiments.

[0135] As described above, the dimming unit 140 includes multiple substructures 142. See below for further details. FIG. 3A The preparation method of substructure 142 is illustrated with an example.

[0136] In some examples, such as FIG. 3B As shown, a first layer pattern 1421 can be formed on one side of the substrate 110. Understandably, the first layer pattern 1421 surrounds the light-emitting element 130.

[0137] like FIG. 3C As shown, a second layer pattern 1422 is formed on the surface of the first layer pattern 1421 away from the substrate 110. For example, the orthographic projection of the second layer pattern 1422 onto the substrate 110 falls within the range of the orthographic projection of the first layer pattern 1421 onto the substrate 110, so that the first layer pattern 1421 can support the second layer pattern 1422.

[0138] like FIG. 3D As shown, a third layer pattern 1423 is formed on the surface of a portion of the second layer pattern 1422 that is away from the first layer pattern 1421.

[0139] For example, the orthographic projection of the third layer pattern 1423 on the substrate 110 falls within the range of the orthographic projection of the second layer pattern 1422 on the substrate 110, so that the second layer pattern 1422 can support the third layer pattern 1423.

[0140] In some examples, a portion of the multiple substructures 142 (two or more) includes a first layer pattern 1421, another portion of the substructures 142 (two or more) includes a first layer pattern 1421 and a second layer pattern 1422, and yet another portion of the substructures 142 (two or more) includes a first layer pattern 1421, a second layer pattern 1422, and a third layer pattern 1423.

[0141] It should be noted that in the embodiments of this disclosure, the first layer pattern 1421, the second layer pattern 1422 and the third layer pattern 1423 are only used to distinguish the substructure 142 or a part of the substructure 142 formed in different steps, and do not further limit the shape of the substructure 142.

[0142] Understandably, the substructures 142 are formed layer by layer in a phased manner, so that the height of the multiple substructures 142 can gradually increase in any direction away from the light-emitting element 130.

[0143] Understandably, when the substructure 142 is formed layer by layer in a phased manner, it can be formed in two, three, or four layers. The embodiments of this disclosure do not further limit the number of layers in forming the substructure 142.

[0144] In some examples, patterned first layer pattern 1421, second layer pattern 1422 and third layer pattern 1423 can be formed using 3D printing or 3D spraying processes.

[0145] In other examples, 3D printing or 3D spraying processes can also be used to form patterned substructures 142 one by one.

[0146] In some examples, the substructure 142 can be cured by methods such as heat curing or ultraviolet curing.

[0147] In other examples, such as FIG. 2A As shown, substructure 142 can also be formed by applying an adhesive.

[0148] For example, the material forming the substructure 142 can be placed inside the adhesive applicator 106. By controlling the dispensing speed and moving speed of the adhesive applicator 106, the height of the multiple substructures 142 can be increased in any direction away from the light-emitting element 130, simplifying the manufacturing steps of the substructure 142 and reducing production costs.

[0149] For example, the materials forming substructure 142 include materials with high thixotropic properties, such as highly thixotropic adhesives. Materials with high thixotropic properties can be rapidly patterned, simplifying the fabrication process of substructure 142.

[0150] In some embodiments, such as FIG. 2B and FIG. 4A As shown, in any direction away from the light-emitting element 130, the area of ​​the orthogonal projection of any two substructures 142 in the dimming section 140 relative to the substructure 142 closer to the light-emitting element 130 on the substrate 110 is smaller than the area of ​​the orthogonal projection of the substructure 142 relative to the substructure 142 farther from the light-emitting element 130 on the substrate 110.

[0151] Understandably, in any direction away from the light-emitting element 130, the area of ​​the orthogonal projection of any two substructures 142 in the dimming section 140 onto the substrate 110 relative to the substructure 142 closer to the light-emitting element 130 is smaller than the area of ​​the orthogonal projection of the substructure 142 farther from the light-emitting element 130 onto the substrate 110. That is, in any direction away from the light-emitting element 130, the area of ​​the orthogonal projection of multiple substructures 142 onto the substrate 110 can gradually increase.

[0152] Understandably, by setting the area of ​​the orthogonal projection of the plurality of substructures 142 on the substrate 110 to gradually increase along any direction away from the light-emitting element 130, the collimation effect of the plurality of substructures 142 in the dimming section 140 on the light is improved, and the light leakage phenomenon of the light-emitting substrate 100 is further improved.

[0153] In some examples, the area of ​​the substructure 142 projected onto the substrate 110 is circular. Along any direction away from the light-emitting element 130, the area of ​​the projected substructure 142 onto the substrate 110 gradually increases, that is, along any direction away from the light-emitting element 130, the diameter of the projected substructure 142 onto the substrate 110 gradually increases.

[0154] FIG. 4B This is a structural diagram of the driving circuit layer, reflective film, and light-emitting element according to some embodiments. FIG. 4C This is a structural diagram of a drive circuit according to some embodiments. FIG. 4A This is a structural diagram of the driving circuit layer and the reflective film according to some embodiments.

[0155] In some embodiments, such as FIG. 4A As shown, the light-emitting substrate 100 also includes a driving circuit layer 150 and a reflective film 162. The driving circuit layer 150 is located on one side of the substrate 110. The reflective film 162 is located on the side of the driving circuit layer 150 away from the substrate 110.

[0156] In some examples, the driving circuit layer 150 is located on one side surface of the substrate 110. In other examples, such as FIG. 4A As shown, other film structures, such as the first adhesive layer 156, are also provided between the driving circuit layer 150 and the substrate 110 to improve the connection reliability between the driving circuit layer 150 and the substrate 110.

[0157] In some examples, such as FIG. 4A As shown, the driving circuit layer 150 includes metal traces 152 and conductive pads 154. The conductive pads 154 are electrically connected to the metal traces 152. For example, the metal traces 152 are located on one side of the substrate 110, and the conductive pads 154 are located on the side of the metal traces 152 away from the substrate 110. Understandably, there are multiple conductive pads 154.

[0158] In some examples, such as FIG. 4B As shown, an additional film structure, such as a second adhesive layer 158, is disposed between the metal trace 152 and the conductive pad 154 to improve the reliability of the electrical connection between the metal trace 152 and the conductive pad 154. In other examples, the conductive pad 154 is bonded to the surface of the metal trace 152 away from the substrate 110.

[0159] In some examples, such as FIG. 4B As shown, the light-emitting substrate 100 also includes a driving circuit Q, which is located between the substrate 110 and the conductive pad 154 and is electrically connected to the conductive pad 154, enabling the driving signal to be transmitted to the conductive pad 154. The conductive pad 154 is electrically connected to the light-emitting element 130, and the driving signal can be transmitted to the light-emitting element 130 through the conductive pad 154, enabling the light-emitting element 130 to emit light under the driving action of the driving circuit Q.

[0160] For example, such as FIG. 4CAs shown, the light-emitting substrate 100 includes multiple gate lines G and multiple data lines D located on the substrate 110. The driving circuit Q is electrically connected to the gate lines G and the data lines D. Under the control of the gate scan signal from the gate line G, the driving circuit Q receives the data signal from the data line D and outputs a driving signal.

[0161] In some examples, the driving circuit Q includes a thin-film transistor (TFT) T. For example... FIG. 4B As shown, the thin-film transistor T includes a driving transistor DT. The driving transistor DT is located between the substrate 110 and the conductive pad 154, and is electrically connected to the conductive pad 154, for outputting a driving signal.

[0162] In some examples, the light-emitting substrate 100 also includes a driver chip (Integrated Circuit, IC). The driver IC is electrically connected to the driver circuit Q and is used to control the driver circuit Q to provide a driving signal to the light-emitting element 130.

[0163] In some examples, such as FIG. 4C As shown, the driving circuit Q includes a thin-film transistor T and a capacitor C.

[0164] The reflective film 162 is located on one side of the driving circuit layer 150, and understandably, the reflective film 162 serves to reflect light. For example, the material of the reflective film 162 includes photosensitive white ink or thermosetting white ink.

[0165] In some examples, the reflective film 162 is located on the side of the driving circuit layer 150 away from the substrate 110. In other examples, other film structures, such as insulating layers or planarization layers, are disposed between the reflective film 162 and the driving circuit layer 150 to provide electrical isolation or planarize the contact surface.

[0166] The reflective film 162 exposes the conductive pad 154. For example, as shown... FIG. 4A As shown, an opening 166 can be formed at a corresponding position on the reflective film 162 using a patterning process, allowing the reflective film 162 to expose the conductive pad 154. In some examples, the area of ​​the opening 166 is larger than the area of ​​the conductive pad 154, allowing the conductive pad 154 to be fully exposed.

[0167] like FIG. 4A As shown, the light-emitting element 130 includes a light-emitting portion 132 and a pin 134, with the pin 134 electrically connected to the conductive pad 154. Understandably, the pin 134 is used to receive a drive signal, enabling the light-emitting portion 132 to emit light under the influence of the drive signal.

[0168] Understandably, since the reflective film 162 can expose the conductive pad 154, the pin 134 can be electrically connected to the conductive pad 154.

[0169] In some examples, there are multiple pins 134. For example, multiple pins 134 can be electrically connected to multiple conductive pads 154. In some examples, the electrical connection between the pins 134 and the conductive pads 154 is achieved by soldering.

[0170] like FIG. 4A As shown, the light-emitting part 132 is located on the side of the reflective film 162 away from the driving circuit layer 150. Understandably, the reflective film 162 serves to reflect light. The light-emitting part 132 is located on the side of the reflective film 162 away from the driving circuit layer 150, so that a portion of the light emitted by the light-emitting part 132 can illuminate the reflective film 162, and under the reflection of the reflective film 162, illuminate the area outside the light-emitting substrate 100 in a direction away from the substrate 110 (e.g., ...). FIG. 4A (As shown by ray a).

[0171] That is, by setting the reflective film 162 and placing the light-emitting part 132 on the side of the reflective film 162 away from the driving circuit layer 150, the intensity of light illuminating the light-emitting substrate 100 can be increased, thereby increasing the brightness of the light-emitting substrate 100, improving the utilization rate of light, and reducing the power consumption of the light-emitting substrate 100.

[0172] like FIG. 4A As shown, multiple substructures 142 in the dimming section 140 are located on the surface of the reflective film 162 away from the driving circuit layer 150. This arrangement allows a portion of the light emitted by the light-emitting element 130 to illuminate the multiple substructures 142.

[0173] For example, such as FIG. 5A As shown by light rays b1, b2 and b3, the multiple substructures 142 in the dimming section 140 can collimate the light rays and improve the light leakage phenomenon that occurs in the light-emitting substrate 100.

[0174] In some examples, multiple substructures 142 in the dimming section 140 are attached to the side surface of the reflective film 162 away from the driving circuit layer 150.

[0175] FIG. 5B This is a structural diagram of a light-emitting module according to some other embodiments. FIG. 5C This is a structural diagram of a reflective component according to some embodiments. FIG. 5D This is a structural diagram of a light-emitting module according to some other embodiments. FIG. 5A This is a structural diagram of a light-emitting module according to some other embodiments.

[0176] As described above, in some embodiments, the light-emitting substrate 100 includes a driving circuit layer 150 and a reflective film 162, with the reflective film 162 located on the side of the driving circuit layer 150 away from the substrate 110. In other embodiments, such as... FIG. 5A to FIG. 5D As shown, the light-emitting substrate 100 includes a driving circuit layer 150 and a reflective component 170.

[0177] The driving circuit layer 150 is located on one side of the substrate 110. The driving circuit layer 150 includes metal traces 152 and conductive pads 154, with the conductive pads 154 electrically connected to the metal traces 152. It is understood that the driving circuit layer 150 has been illustrated in the above embodiments of this disclosure and will not be repeated here.

[0178] The light-emitting element 130 includes a light-emitting portion 132 and pins 134. It is understood that embodiments of the present disclosure have already provided examples of the light-emitting element 130, and will not be repeated here. Referring to the following... FIG. 5A An example of the reflective component 170 will be given.

[0179] like FIG. 5A As shown, the reflective element 170 is located on the side of the driving circuit layer 150 away from the substrate 110. In some examples, the reflective element 170 is attached to the surface of the driving circuit layer 150 away from the substrate 110. In other examples, other film structures are also provided between the reflective element 170 and the driving circuit layer 150.

[0180] like FIG. 5A As shown, the reflective component 170 surrounds and forms a reflective cavity 172. For example, the reflective cavity 172 can be a box-shaped structure with a rectangular, circular, polygonal or other irregular shape on the bottom surface.

[0181] Understandably, the inner wall of the reflective component 170 (the surface on the side away from the substrate 110) encloses and forms a reflective cavity 172. It should be noted that... FIG. 5B , 5C In 5D, the area shown by the dashed line (that is, the reflective cavity 172) is spaced from the inner wall of the reflective component 170. This is only for the purpose of showing the reflective cavity 172 and does not further define the positional relationship between the reflective cavity 172 and the reflective component 170.

[0182] like FIG. 5C As shown, the reflective component 170 has a connecting hole 174. In some examples, the reflective component 170 may have one or more connecting holes 174. For example, the shape of the connecting hole 174 may be square or circular, etc. The shapes of the connecting holes 174 on different reflective components 170 may be the same or different.

[0183] like FIG. 5CAs shown, the light-emitting part 132 is located in the reflective cavity 172, and the pin 134 is electrically connected to the conductive pad 154 through the through hole 174.

[0184] In some examples, the shape of the via 174 is adapted to the shape of the orthographic projection of the light-emitting element 130 onto the substrate 110, so that the pin 134 can be electrically connected to the conductive pad 154 through the via 174.

[0185] Understandably, the reflective component 170 can reflect light. The light-emitting part 132 is located inside the reflective cavity 172, allowing a portion of the light emitted by the light-emitting part 132 to illuminate the inner wall of the reflective cavity 172, and under the reflection of the reflective component 170, to exit the light-emitting substrate 100 in a direction away from the substrate 110 (e.g., ...). FIG. 5C (As shown in the middle light beam c). That is, by providing the reflective component 170, the intensity of light illuminating the light-emitting substrate 100 can be increased, thereby increasing the brightness of the light-emitting substrate 100, improving the utilization rate of light, and reducing the power consumption of the light-emitting substrate 100.

[0186] In some examples, the inner wall of the reflecting cavity 172 is coated with a reflective material, enabling the reflecting component 170 to reflect light. For example, the reflective material may be titanium dioxide or silicon dioxide.

[0187] like FIG. 5B As shown, a plurality of substructures 142 in the dimming unit 140 are disposed in the reflective cavity 172. For example, the plurality of substructures 142 in the dimming unit 140 are located in the reflective cavity 172.

[0188] In some embodiments, such as FIG. 5C As shown, the reflective component 170 includes a bottom wall 176 and a side wall 178. The bottom wall 176 has a connecting hole 174. A plurality of substructures 142 in the dimming section 140 are located on the bottom wall 176. One end of the side wall 178 is connected to the bottom wall 176, and the other end extends along the bottom wall 176 away from the substrate 110. The side wall 178 and the bottom wall 176 enclose a reflective cavity 172.

[0189] Understandably, the bottom wall 176 is primarily a plate-like structure with a flat surface. A connecting hole 174 is formed on the bottom wall 176, allowing the pin 134 of the light-emitting element 130 to be electrically connected to the conductive pad 154 through the connecting hole 174. For example, a side wall 178 surrounds the bottom wall 176, such that the side wall 178 and the bottom wall 176 together form a reflective cavity 172.

[0190] In some examples, the sidewall 178 can be integrally formed with the bottom wall 176, improving the reliability of the connection between the sidewall 178 and the bottom wall 176.

[0191] The reflective component 170 includes a bottom wall 176 and a side wall 178, such that the bottom wall 176 and the side wall 178 can surround and form a reflective cavity 172, so that the light irradiated to the side wall 178 and the bottom wall 176 can be reflected and irradiated outside the light-emitting substrate 100, thereby increasing the brightness of the light-emitting area 102 and reducing the power consumption of the light-emitting substrate 100.

[0192] Multiple substructures 142 in the dimming unit 140 are located on the bottom wall 176, for example, as shown below. FIG. 5A As shown by rays d1, d2, and d3, a portion of the light emitted by the light-emitting element 130 can illuminate multiple substructures 142. The multiple substructures 142 in the dimming section 140 can collimate the light, improving the light leakage phenomenon that occurs in the light-emitting substrate 100.

[0193] In some examples, multiple substructures 142 in the dimming section 140 are attached to the bottom wall of the reflective cavity 172.

[0194] Understandably, by setting the reflective component 170, not only can the brightness of the light-emitting substrate 100 be increased, the light utilization rate be improved, and the power consumption of the light-emitting substrate 100 be reduced, but the light leakage phenomenon of the light-emitting substrate 100 can also be improved, thereby further improving the light-emitting performance of the light-emitting substrate 100.

[0195] In some examples, such as FIG. 5D As shown, there are multiple reflective components 170. One light-emitting component 120 (including light-emitting element 130 and dimming part 140) is located in the reflective cavity 172 formed by one reflective component 170, that is, the sidewall 178 surrounds one light-emitting component 120.

[0196] This configuration allows the sidewall 172 to reflect the light emitted by each light-emitting element 130, reducing the intensity of light illuminating other reflective cavities 172, which in turn reduces the intensity of light illuminating other light-emitting areas 102. This improves the light leakage phenomenon in the light-emitting substrate 100 and further enhances the light-emitting performance of the light-emitting substrate 100.

[0197] In some other examples, the number of reflective components 170 is one. Multiple light-emitting components 120 (including light-emitting elements 130 and dimming units 140) are located within a reflective cavity 172 formed by a reflective component 170, that is, the sidewalls 178 surround the multiple light-emitting components 120, which simplifies the structure of the light-emitting substrate 100 and reduces the cost of the light-emitting substrate 100.

[0198] In some other embodiments, such as FIG. 5B As shown, the light-emitting substrate 100 includes both a reflective film 162 and a reflective component 170, with the reflective film 162 located between the driving circuit layer 150 and the reflective component 170.

[0199] By providing a reflective film 162 between the driving circuit layer 150 and the reflective component 170, the reflection effect of light is further improved, the intensity of light illuminating the light-emitting substrate 100 is increased, thereby increasing the brightness of the light-emitting substrate 100 and reducing the power consumption of the light-emitting substrate 100.

[0200] As described above, the reflective film 162 has an opening 166. In some examples, when the light-emitting module 200 includes a reflective film 162 and a reflective component 170, the area of ​​the opening 166 on the reflective film 162 is the same as or approximately the same as the area of ​​the connecting hole 174 on the reflective component 170, so that the opening 166 and the connecting hole 174 can expose the conductive pad 154, thereby allowing the pin 134 of the light-emitting element 130 to be electrically connected to the conductive pad 154.

[0201] In other examples, the area of ​​the connecting hole 174 may also be slightly larger than the area of ​​the opening 166.

[0202] In other examples, the angle between the sidewall of the connecting hole 174 and the surface of the reflective component 170 near the substrate 110 is between 30° and 90°, which increases the opening area of ​​the connecting hole 174 and improves the ease of connection between the pin 134 of the light-emitting element 130 and the conductive pad 154.

[0203] For example, the angle between the sidewall of the connecting hole 174 and the surface of the reflective component 170 near the substrate 110 can be 45°, 60°, or 75°, etc.

[0204] In some embodiments, such as FIG. 5B As shown, sidewall 176 is perpendicular to bottomwall 178.

[0205] The sidewall 176 is perpendicular to the bottom wall 178, which further improves the reflection effect of the light emitted by the light-emitting part 132 and reduces the intensity of light irradiated into other reflective cavities 172, that is, reduces the intensity of light irradiated into other light-emitting areas 102. This can improve the light leakage phenomenon of the light-emitting substrate 100 and further improve the light-emitting performance of the light-emitting substrate 100.

[0206] In some embodiments, such as FIG. 5B As shown, the edge of the sidewall 178 away from the bottom wall 176 has a shape that is a series of curves or a series of broken lines when projected onto a reference plane parallel to the sidewall 178.

[0207] Understandably, when a light-emitting component 120 (including a light-emitting element 130 and a dimming part 140) is located within a reflective cavity 172 formed by a reflective component 170, a sidewall 178 surrounds a light-emitting component 120.

[0208] The edge of the sidewall 178, away from the bottom wall 176, is projected onto a reference plane parallel to the sidewall 178 in the shape of a series of curves or polygonal lines. In other words, the end face of the sidewall 178 away from the bottom wall 176 is a curved surface or a polygonal surface. Thus, as... FIG. 5B As shown, the sidewall 178 has a notch 168 at the end away from the bottom wall 176.

[0209] Understandably, some of the light emitted by the light-emitting part 132 can be reflected by the sidewall 178 and the bottom wall 176 and shine into the light-emitting substrate 100 in a direction away from the substrate 110, while another part of the light can shine into other light-emitting areas 102 through the notch 168.

[0210] This configuration not only improves the light leakage phenomenon of the light-emitting substrate 100, but also increases the brightness at adjacent positions of the two light-emitting areas 102, improves the brightness between the two adjacent light-emitting elements 130, weakens the light and dark areas that can be perceived by the naked eye on the light-emitting substrate 100, and improves the light emission uniformity of the light-emitting substrate 100.

[0211] In some examples, the edge of the sidewall 178 away from the bottom wall 176 has a shape that is a series of regular curves or a series of regular broken lines, such as wavy or serrated, or a mixed shape of wavy and serrated, when projected onto a reference plane parallel to the sidewall 178.

[0212] In other examples, the edge of the sidewall 178 away from the bottom wall 176 has the shape of a series of irregular curves or a series of irregular broken lines when projected onto a reference plane parallel to the sidewall 178.

[0213] In some examples, the orthographic projection of the sidewall 178 onto a reference plane parallel to the sidewall 178 is a triangle, rectangle, semicircle, or semi-ellipse, etc. Understandably, since the edge of the sidewall 178 away from the bottom wall 176 is a series of curves or broken lines, the orthographic projection of the sidewall 178 onto a reference plane parallel to the sidewall 178 is an approximate triangle, approximate rectangle, approximate semicircle, or approximate semi-ellipse, etc., with curved or broken edges.

[0214] Taking the edge of the sidewall 178 away from the bottom wall 176 as an example, the orthographic projection onto a reference plane parallel to the sidewall 178 is serrated. FIG. 2A As shown, a serrated structure can be considered as a serrated portion 169. Understandably, a serrated portion 169 includes two inclined sides and a bottom side (that is, the line connecting the two inclined sides).

[0215] In some examples, the orthographic projection of the serrated portion 169 onto a reference plane parallel to the sidewall 178 is a left-right symmetrical triangle, that is, the included angles between the two inclined sides of the serrated portion 169 and the base are equal or approximately equal.

[0216] In other examples, the orthographic projection of the serrated portion 169 onto a reference plane parallel to the sidewall 178 is a left-right asymmetrical triangle, that is, the angles between the two inclined sides of the serrated portion 169 and the base are not equal.

[0217] For example, the angle between one inclined edge of the serrated portion 169 and the bottom edge ranges from 30° to 60°, such as 45°, 50°, or 55°. The angle between the other inclined edge of the serrated portion 169 and the bottom edge ranges from 80° to 90°, such as 82°, 85°, or 87°.

[0218] In some examples, the length of the bottom edge of the serrated portion 169 ranges from 2mm to 4mm, and the height of the serrated portion 169 (that is, the distance between the bottom edge of the serrated portion 169 and the vertex of the serrated portion 169) ranges from 1mm to 2mm.

[0219] For example, the bottom edge length of the serrated portion 169 can be 2.5mm, 3mm, or 3.5mm. The height of the serrated portion 169 can be 1.2mm, 1.5mm, or 1.8mm.

[0220] In some embodiments, such as FIG. 2B and FIG. 5E As shown, in any direction away from the light-emitting element 130, the plurality of substructures 142 in the dimming section 140 are located on a straight line.

[0221] Understandably, by setting multiple substructures 142 in the dimming section 140 to be located in a straight line in any direction away from the light-emitting element 130, the structural regularity of the dimming section 140 can be improved, the collimation effect of light can be improved, the light intensity illuminating other light-emitting areas 102 can be reduced during zone dimming, the light leakage phenomenon occurring in the light-emitting substrate 100 can be improved, and the light-emitting performance of the light-emitting substrate 100 can be improved.

[0222] Furthermore, the multiple substructures 142 in the dimming section 140 are located on a straight line, which improves the structural regularity of the dimming section 140 and facilitates the production and processing of the dimming section 140, thereby improving production efficiency.

[0223] In some embodiments, at least one substructure 142 is shaped as one of a cone, pyramid, frustum, truncated cone, and hemisphere.

[0224] Understandably, the shapes of the multiple substructures 142 in the dimming unit 140 can be the same or different. By setting the shape of at least one substructure 142 to be one of a cone, pyramid, frustum, truncated cone, or hemisphere, different usage requirements are met, and the applicability of the dimming unit 140 is improved.

[0225] For example, a hemisphere includes a semisphere, a semi-ellipsoid, and other approximate structures.

[0226] In some embodiments, the height of the plurality of substructures 142 in the dimming unit 140 ranges from 250 μm to 1000 μm.

[0227] The height of the multiple substructures 142 is set within the range of 250μm to 1000μm. This avoids the substructures 142 being too tall (e.g., greater than 1000μm), thus preventing them from occupying too much space and facilitating the thinning of the light-emitting substrate 100. Furthermore, it also avoids the substructures 142 being too short (e.g., less than 250μm), which would affect the collimation effect of the light and further improve the brightness uniformity of the light-emitting substrate 100.

[0228] In some examples, the height of multiple substructures 142 can range from 300μm to 950μm, 350μm to 900μm, 400μm to 800μm, or 500μm to 700μm, etc. For example, the height of substructure 142 can be 300μm, 400μm, 500μm, 600μm, or 750μm, etc.

[0229] In some embodiments, the absolute value of the height difference between any two adjacent substructures 142 in the dimming section 140 in any direction away from the light-emitting element 130 ranges from 200 μm to 300 μm.

[0230] As can be seen from the above, in any direction away from the light-emitting element 130, the height of any two substructures 142 in the dimming section 140 relative to the substructure 142 closer to the light-emitting element 130 is less than the height of the substructure 142 relative to the substructure 142 farther from the light-emitting element 130. That is, in any direction away from the light-emitting element 130, the height of the substructure 142 can gradually increase.

[0231] Therefore, the absolute value of the height difference between any two adjacent substructures 142 in the dimming section 140 is set to be in the range of 200μm to 300μm in any direction away from the light-emitting element 130. This avoids the height difference between any two adjacent substructures 142 in the dimming section 140 being too large or too small, so that the height of multiple substructures 142 can gradually increase in any direction away from the light-emitting element 130. This improves the regularity of the dimming section 140, improves the collimation effect of the dimming section 140 on the light, improves the light leakage phenomenon of the light-emitting substrate 100, and improves the light-emitting performance of the light-emitting substrate 100.

[0232] In some examples, the absolute value of the height difference between any two adjacent substructures 142 in the dimming section 140 can be 220μm, 250μm, 280μm, or 290μm, etc., in any direction away from the light-emitting element 130.

[0233] In some embodiments, along any direction away from the light-emitting element 130, the absolute value of the height difference between any two adjacent substructures 142 in the dimming section 140 is equal to the absolute value of the height difference between any other two adjacent substructures 142.

[0234] Understandably, the absolute value of the height difference between any two adjacent substructures 142 in the dimming section 140 is set to be equal to the absolute value of the height difference between any two other adjacent substructures 142 in any direction away from the light-emitting element 130, so that the height of the plurality of substructures 142 can gradually increase in an arithmetic sequence in any direction away from the light-emitting element 130.

[0235] This configuration further improves the structural regularity of the dimming unit 140, thereby improving the collimation effect of the dimming unit 140 on light, reducing the light leakage phenomenon in the light-emitting substrate 100, and improving the light-emitting performance of the light-emitting substrate 100.

[0236] Understandably, the absolute value of the height difference between any two adjacent substructures 142 in the dimming section 140 along any direction away from the light-emitting element 130 can be equal to or approximately equal to the absolute value of the height difference between any other two adjacent substructures 142.

[0237] In some examples, the light-emitting module 200 typically includes multiple layers of film. In some implementations, multiple layers of film are often composited to make the film thinner and more multifunctional, thereby reducing the light mixing distance H and facilitating the thinning of the light-emitting substrate 100.

[0238] FIG. 5F This is a structural diagram of a light-emitting substrate according to some other embodiments. FIG. 5G This is a structural diagram of a substructure according to some other embodiments. FIG. 1AThis is a structural diagram of a light-emitting module according to some other embodiments.

[0239] For example, such as FIG. 5E As indicated by the middle arrow, the light emitted by the light-emitting element 130 shines outward in a conical or approximately conical shape, causing the brightness between two adjacent light-emitting elements 130 (that is, the brightness at the edge of each light-emitting area 102) to be less than the brightness at the center of each light-emitting area 102. When the light mixing distance H decreases, the brightness difference between the edge and center of each light-emitting area 102 increases, resulting in uneven brightness of the light-emitting substrate 100.

[0240] For example, such as FIG. 5E As shown, when multiple light-emitting areas 102 are arranged in an array, the brightness at the adjacent positions of two light-emitting areas 102 (e.g.) FIG. 5E As shown in region P1), the brightness is less than that at the center of each luminous region 102 (e.g., FIG. 5F As shown in region P2, this causes areas of light and dark to appear on the light-emitting substrate 100 that can be perceived by the naked eye, affecting the brightness uniformity of the light-emitting substrate 100 and thus affecting the performance of the light-emitting module 200.

[0241] In some embodiments, the brightness uniformity of the light-emitting substrate 100 can be improved by reducing the distance D between two adjacent light-emitting elements 130, increasing the light emission angle α of the light-emitting element 130 (for example, increasing the light emission angle α to more than 175°), increasing the light mixing distance H, and providing a diffuser plate or a light-diffusing film.

[0242] However, the inventors of this disclosure have discovered that reducing the distance D between two adjacent light-emitting elements 130, while keeping the area of ​​the display area 104 unchanged, increases the number of light-emitting elements 130, thereby increasing the cost of the light-emitting substrate 100. Increasing the emission angle α of the light-emitting element 130 increases the complexity and difficulty of manufacturing the light-emitting element 130, increasing the cost of the light-emitting element 130, which in turn increases the cost of the light-emitting substrate 100.

[0243] Increasing the light mixing distance H of the light-emitting substrate 100 will lead to an increase in the thickness of the light-emitting substrate 100. Furthermore, the addition of a diffuser or homogenizing film will increase the haze of the light-emitting substrate 100, reduce its transmittance, and thus decrease the brightness of the light-emitting region 102, resulting in increased power consumption of the light-emitting substrate 100. Moreover, the addition of a diffuser or homogenizing film will also increase the thickness of the light-emitting substrate 100, which is detrimental to thinning the light-emitting substrate 100.

[0244] To improve the brightness uniformity of the light-emitting substrate 100, in some embodiments, such as FIG. 5G As shown, the light-emitting substrate 100 also includes diffuser particles 164. The diffuser particles 164 are located within at least one substructure 142.

[0245] As described above, multiple substructures 142 in the dimming section 140 surround the light-emitting element 130. Therefore, the diffuser particles 164 are positioned within at least one substructure 142, such as... FIG. 5G As indicated by the middle arrow, a portion of the light emitted directly from the light-emitting element 130 can illuminate the substructure 142 and be dispersed by at least one diffuse particle 164 within the substructure 142, meaning that the light can undergo diffuse reflection under the action of the diffuse particle 164.

[0246] The scattered light propagates in multiple different directions, thereby increasing the intensity of light illuminating the edge of the light-emitting area 102 to a certain extent, based on the collimation effect of multiple substructures 142. This increases the brightness at adjacent positions of two light-emitting areas 102, reduces the brightness difference between the edge and center of the light-emitting area 102, improves the brightness uniformity of each light-emitting area 102, thereby improving the brightness uniformity of the light-emitting substrate 100 and weakening the bright and dark areas appearing on the light-emitting substrate 100.

[0247] In some examples, each substructure 142 contains diffused particles 164. Since multiple substructures 142 surround the light-emitting element 130, they can disperse the light emitted by the light-emitting element 130 in all directions, improve the light dispersion effect, increase the brightness at adjacent positions of the multiple light-emitting areas 102 arranged in the array, and further weaken the bright and dark areas appearing on the light-emitting substrate 100.

[0248] By setting diffuser particles 164 to disperse the light emitted by the light-emitting element 130, the brightness between two adjacent light-emitting areas 102 is increased, and the bright and dark areas appearing on the light-emitting substrate 100 are weakened. This allows for a smaller light mixing distance H, and eliminates the need for diffuser plates or light-diffusing films, which facilitates the thinning of the light-emitting substrate 100 and improves its applicability.

[0249] Understandably, such as FIG. 1A As shown, substructure 142 is located between reflective film 162 and color conversion film 222. Diffusing particles 164 are located within at least one substructure 142, such that the diffused particles 164 are also located between reflective film 162 and color conversion film 222, thus eliminating the need for additional space to accommodate the diffused particles 164, further facilitating the thinning of the light-emitting substrate 100.

[0250] Furthermore, by setting multiple substructures 142 to disperse the light, the brightness between two adjacent light-emitting areas 102 is increased, and the bright and dark areas appearing on the light-emitting substrate 100 are weakened. This eliminates the need to increase the number of light-emitting elements 130 or the light emission angle α of the light-emitting elements 130, thereby reducing the cost of the light-emitting substrate 100.

[0251] In addition, the diffused particles 164 make full use of the light irradiated between two adjacent light-emitting areas 102 to weaken the bright and dark areas appearing on the light-emitting substrate 100, which has little impact on the brightness of the light-emitting area 102 and reduces the power consumption of the light-emitting substrate 100.

[0252] For example, substructure 142 is made of a transparent or semi-transparent material, allowing light to reach the diffuse particles 164 located within substructure 142.

[0253] In some examples, the transmittance of substructure 142 ranges from 50% to 100%. For example, the transmittance of the substructure can be 60%, 70%, 80%, or 90%, etc. Understandably, the transmittance of substructure 142 is the ratio of the intensity of light passing through substructure 142 to the intensity of light illuminating substructure 142.

[0254] For example, the material of substructure 142 includes resin or glue. The material of diffused particles 164 includes silicon dioxide or titanium dioxide.

[0255] For example, the mass ratio of the diffused particles 164 in multiple substructures 142 (that is, the ratio of the weight of the diffused particles 164 disposed within a substructure 142 to the weight of the substructure 142) can be the same or different.

[0256] In some examples, the mass ratio of the diffused particles 164 is 15%.

[0257] The light-emitting substrate 100 provided in the embodiments of this disclosure, by providing diffuser particles 164 in at least one substructure 142, enables the diffuser particles 164 to scatter light, thereby achieving a better light mixing effect at a smaller light mixing distance H, improving the brightness uniformity of the light-emitting area 102, and enabling the light-emitting substrate 100 to have higher color contrast and more prominent color display, which is beneficial for the ultra-thin design, high color rendering performance and energy-saving performance of terminal products (such as mobile phones or computers).

[0258] As can be seen from the above, in any direction away from the light-emitting element 130, the height of any two substructures 142 in the dimming section 140 relative to the substructure 142 closer to the light-emitting element 130 is smaller than the height of the substructure 142 farther from the light-emitting element 130. Furthermore, in any direction away from the light-emitting element 130, the area of ​​the orthographic projection of any two substructures 142 in the dimming section 140 relative to the substructure 142 closer to the light-emitting element 130 onto the substrate 110 is smaller than the area of ​​the orthographic projection of the substructure 142 farther from the light-emitting element 130 onto the substrate 110.

[0259] That is, along any direction away from the light-emitting element 130, the height of the plurality of substructures 142 in the dimming section 140 can gradually increase, and the area of ​​the orthographic projection of the plurality of substructures 142 on the substrate 110 can also gradually increase. This allows the volume of the plurality of substructures 142 in the dimming section 140 to gradually increase along any direction away from the light-emitting element 130. Understandably, the larger the volume of the substructure 142, the more diffused particles 164 it can accommodate, and the better the light-scattering effect.

[0260] This configuration further improves the dispersion effect of light irradiated to the edge of the light-emitting area 102, enhances the light mixing effect between two adjacent light-emitting elements 130, increases the brightness at adjacent positions of the two light-emitting areas 102, weakens the bright and dark stripes appearing on the light-emitting substrate 100, and improves the brightness uniformity of the light-emitting substrate 100.

[0261] As can be seen from the above, if FIG. 2G As shown, the light-emitting substrate 100 has a display area 104. In some embodiments, such as FIG. 2G As shown, the brightness of the light-emitting element 130e near the edge of the display area 104 is greater than the brightness of the light-emitting element 130 located at other positions in the display area 104.

[0262] Understandably, such as FIG. 5A As shown, when the light emitted by the light-emitting element 130e shines on the light-emitting area 102e, it is not easy for the light emitted by other light-emitting elements 130 to mix, so that the brightness at the edge of the display area 104 (that is, the light-emitting area 102e) is less than the brightness at other locations.

[0263] Therefore, by setting the brightness of the light-emitting element 130e located near the edge of the display area 104 to be greater than the brightness of the light-emitting elements 130 located at other positions in the display area 104, the intensity of light illuminating the edge of the display area 104 can be increased, thereby increasing the brightness at the edge of the display area 104 (that is, increasing the brightness of the light-emitting area 102e), improving the brightness uniformity of the display area 104, and thus improving the brightness uniformity of the light-emitting substrate 100.

[0264] Understandably, the light-emitting area 102e is used only to describe the light-emitting area 102 near the edge of the display area 104, and the light-emitting element 130e is used only to describe the light-emitting element 130 near the edge of the display area 104, without further defining the light-emitting area 102 and the light-emitting element 130.

[0265] In some examples, the current flowing through the light-emitting element 130e can be increased, thereby increasing the brightness of the light-emitting element 130e.

[0266] As can be seen from the above, the light-emitting module 200 provided in the embodiments of this disclosure includes a light-emitting substrate 100. In some embodiments, such as FIG. 5A As shown, the light-emitting module 200 also includes at least one lens 210. The at least one lens 210 is located on the side of the plurality of light-emitting components 120 away from the substrate 110.

[0267] In some examples, such as FIG. 5A As shown, lens 210 covers light-emitting component 120. In some practical examples, there are multiple lenses 210. One lens 210 covers one light-emitting component 120.

[0268] In other examples, there is one lens 210. One lens 210 covers multiple light-emitting components 120.

[0269] Understandably, at least one lens 210 is positioned on the side of the plurality of light-emitting components 120 away from the substrate 110, so that the light emitted by the light-emitting element 130 can illuminate the lens 210 and be reflected or refracted under the action of the lens 210.

[0270] That is, by setting the lens 210, the propagation direction of the light emitted by the light-emitting element 130 can be changed, the brightness between two adjacent light-emitting elements 130 can be increased, the brightness uniformity of each light-emitting area 102 can be improved, the bright and dark areas appearing on the light-emitting substrate 100 can be weakened, the brightness uniformity of the light-emitting substrate 100 can be improved, and thus the brightness uniformity of the light-emitting module 200 can be improved.

[0271] As can be seen from the above, the light-emitting substrate 100 includes a reflective component 170. The positional relationship between the reflective component 170 and the lens 210 will be illustrated below with an example.

[0272] In some examples, there are multiple reflective elements 170 and multiple lenses 210. For example... FIG. 6A As shown, a light-emitting component 120 (including a light-emitting element 130 and a dimming part 140) is located in a reflective cavity 172 formed by a reflective component 170, and a lens 210 is also located in a reflective cavity 172, that is, the sidewall 178 surrounds a light-emitting component 120 and a lens 210.

[0273] This configuration allows the light reflected by the reflective component 170 to reach the lens 210 and pass through the lens 210 to reach outside the light-emitting module 200, further reducing crosstalk between two adjacent light-emitting areas 102 and improving the brightness of the light-emitting module 200.

[0274] In other examples, there are multiple reflective elements 170 and one lens 210. Multiple light-emitting components 120 (including light-emitting elements 130 and dimming units 140) are located within a reflective cavity 172 formed by a reflective element 170. The surface of the lens 210 near the substrate 110 has multiple third grooves, and the sidewalls 178 of each reflective element 170 are embedded in the third grooves, so that the lens 210 can cover the multiple reflective elements 170 and the multiple light-emitting components 120.

[0275] In some other examples, there is one reflective component 170 and one lens 210. Multiple light-emitting components 120 (including light-emitting elements 130 and dimming units 140) are located within a reflective cavity 172 formed by the reflective component 170. The lens 210 is also located within a reflective cavity 172 formed by the reflective component 170 and covers the multiple light-emitting components 120.

[0276] In some other examples, there is one reflective component 170 and multiple lenses 210. Multiple light-emitting components 120 (including light-emitting elements 130 and dimming units 140) are located within a reflective cavity 172 formed by a reflective component 170. Multiple lenses 210 are also located within a reflective cavity 172 formed by a reflective component 170, and one lens 210 covers one light-emitting component 120.

[0277] In some examples, such as 5B, a limiting hole 146 is formed on the bottom wall 176 of the reflective component 170. The lens 210 has a limiting post that can pass through the limiting hole 146 and connect to the driving circuit layer 150 or the substrate 110, thereby limiting the lens 210 and preventing the lens 210 from shifting relative to the light-emitting component 120, thus improving the reliability of the light-emitting module 200.

[0278] In some examples, there are multiple limiting holes 146, and the number of limiting posts is the same as the number of limiting holes 146. For example, the number of limiting holes 146 can be 2, 3, or 4, etc. In some examples, the bottom wall 176 is square in shape. The distance between the limiting holes 146 and the bottom wall 176 is one-sixth of the side length of the bottom wall 176.

[0279] FIG. 6A This is a structural diagram of a light-emitting module according to some other embodiments.

[0280] In some embodiments, at least one lens 210 is configured to have at least one first groove 212 on a surface near the substrate 110. At least a portion of at least one substructure 142 in the dimming section 140 is embedded in the first groove 212.

[0281] Understandably, the first groove 212 is formed along the direction from the substrate 110 to the lens 210. When there are multiple first grooves 212, the depth L1 of the multiple first grooves 212 can be the same or different. The width L2 of the multiple first grooves 212 can be the same or different.

[0282] For example, the shape of the first groove 212 can be a cuboid, cylinder, cone, or other irregular shape. When there are multiple first grooves 212, the shapes of the multiple first grooves 212 can be the same or different.

[0283] In some examples, at least a portion of a substructure 142 of the dimming unit 140 is embedded in a first groove 212.

[0284] In other examples, at least a portion of a plurality of substructures 142 in the dimming unit 140 (two or more substructures) is embedded in a first groove 212.

[0285] In some examples, such as FIG. 6A As shown, the depth L1 of the first groove 212 is greater than the height of the substructure 142 embedded in the first groove 212, so that the substructure 142 can be completely embedded in the first groove 212.

[0286] In other examples, such as the light-emitting module 200 including the reflective component 170, there may be a gap between the lens 210 and the reflective component 170, so that the substructure 142 can be partially embedded in the first groove 212.

[0287] like FIG. 2A As shown in the middle line g, when a portion of the light emitted by the light-emitting element 130 shines into the first groove 212, it can be dispersed by the substructure 142. The dispersed light propagates in multiple different directions, increasing the brightness between two adjacent light-emitting elements 130, improving the brightness uniformity of each light-emitting area 102, weakening the bright and dark areas appearing on the light-emitting substrate 100, improving the brightness uniformity of the light-emitting substrate 100, and thus improving the brightness uniformity of the light-emitting module 200. Furthermore, it can also collimate the light, improving the light leakage phenomenon of the light-emitting module 200.

[0288] Furthermore, at least a portion of at least one substructure 142 is embedded in the first groove 212. On the one hand, this allows the first groove 212 to accommodate the substructure 142, eliminating the need for additional accommodating space and facilitating the thinning of the light-emitting module 200. On the other hand, this allows the first groove 212 to protect at least a portion of the at least one substructure 142, improving the reliability of the light-emitting module 200.

[0289] In some embodiments, such asFIG. 2B and FIG. 2A As shown, at least one first groove 212 is an annular groove. The orthographic projection of the annular groove on the substrate 110 surrounds the orthographic projection of the light-emitting element 130 on the substrate 110.

[0290] For example, the shape of the first groove 212 can be a circular ring, a rectangular ring, or other irregular rings. The orthographic projection of the annular groove on the substrate 110 surrounds the orthographic projection of the light-emitting element 130 on the substrate 110, so that the light emitted by the light-emitting element 130 in all directions can illuminate the annular groove and be dispersed by the substructure 142 embedded in the annular groove, further improving the brightness uniformity of the light-emitting module 200.

[0291] Furthermore, as described above, the multiple substructures 142 in the dimming section 140 surround the light-emitting element 130. Therefore, the orthographic projection of the annular groove on the substrate 110 surrounds the orthographic projection of the light-emitting element 130 on the substrate 110, so that at least a portion of the multiple substructures 142 surrounding the light-emitting element 130 can be embedded in the annular groove, which is beneficial for the thinning of the light-emitting module 200.

[0292] For example, such as FIG. 2B and FIG. 6A As shown, the orthographic projection of the light-emitting element 130 on the substrate 110 is located at the center of the orthographic projection of the annular groove on the substrate 110.

[0293] In some embodiments, there are multiple first grooves 212. Multiple substructures 142 embedded in the same first groove 212 have the same height. And / or, the areas of the orthographic projections of the multiple substructures 142 embedded in the same first groove 212 onto the substrate 110 are the same.

[0294] Understandably, when there are multiple first grooves 212, a portion (two or more) of the multiple substructures 142 in the dimming unit 140 are embedded in one first groove 212, another portion (two or more) are embedded in another first groove 212, and yet another portion (two or more) are embedded in yet another first groove 212.

[0295] In some examples, two or more substructures 142 are embedded in each of the first grooves 212 to further improve the light dispersion effect, thereby improving the brightness uniformity of the light-emitting module 200.

[0296] Furthermore, by setting the height of multiple substructures 142 embedded in the same first groove 212 to be the same, and / or by setting the area of ​​the orthogonal projection of multiple substructures 142 embedded in the same first groove 212 on the substrate 110 to be the same, the structural regularity of the dimming section 140 can be improved, thereby improving the collimation effect of light and improving the light leakage phenomenon of the light-emitting module 200.

[0297] In some embodiments, such as FIG. 6A As shown, there are multiple first grooves 212. Along any direction away from the light-emitting element 130, the depth L1 of any two first grooves 212 relative to the first groove 212 closer to the light-emitting element 130 is less than the depth L1 of the first groove 212 relatively farther from the light-emitting element 130. And / or, along any direction away from the light-emitting element 130, the width L2 of any two first grooves 212 relative to the first groove 212 closer to the light-emitting element 130 is less than the width L2 of the first groove 212 relatively farther from the light-emitting element 130.

[0298] Understandably, in any direction away from the light-emitting element 130, the depth L1 of any two first grooves 212 relative to the first groove 212 closer to the light-emitting element 130 is less than the depth L1 of the first groove 212 relative to the light-emitting element 130. That is, in any direction away from the light-emitting element 130, the depth L1 of the multiple first grooves 212 gradually increases.

[0299] Along any direction away from the light-emitting element 130, the width L2 of any two first grooves 212 relative to the first groove 212 closer to the light-emitting element 130 is smaller than the width L2 of the first groove 212 relative to the light-emitting element 130. That is, along any direction away from the light-emitting element 130, the width L2 of the plurality of first grooves 212 gradually increases.

[0300] As can be seen from the above, in some examples, along any direction away from the light-emitting element 130, the height of any two substructures 142 in the dimming section 140 relative to the substructure 142 closer to the light-emitting element 130 is smaller than the height of the substructure 142 farther from the light-emitting element 130. Furthermore, along any direction away from the light-emitting element 130, the area of ​​the orthographic projection of any two substructures 142 in the dimming section 140 relative to the substructure 142 closer to the light-emitting element 130 onto the substrate 110 is smaller than the area of ​​the orthographic projection of the substructure 142 farther from the light-emitting element 130 onto the substrate 110.

[0301] That is, along any direction away from the light-emitting element 130, the height of the plurality of substructures 142 in the dimming section 140 can be gradually increased, and the area of ​​the orthogonal projection of the plurality of substructures 142 on the substrate 110 can also be gradually increased.

[0302] Therefore, the depth L1 of the plurality of first grooves 212 gradually increases and / or the width L2 of the plurality of first grooves 212 gradually increases in any direction away from the light-emitting element 130, so that each first groove 212 can accommodate each substructure 142, avoiding the substructure 142 being unable to be embedded in the first groove 212, which is beneficial to the thinning of the light-emitting module 200.

[0303] In some embodiments, such as FIG. 6A As shown, at least one lens 210 is configured to have a recess 216 on a surface away from the substrate 110. The orthogonal projection of the light-emitting element 130 onto the substrate 110 overlaps at least partially with the orthogonal projection of the recess 216 onto the substrate 110.

[0304] Understandably, the orthogonal projection of the light-emitting element 130 onto the substrate 110 at least partially overlaps with the orthogonal projection of the recess 216 onto the substrate 110, such as... FIG. 6A As shown, when the light emitted by the light-emitting element 130 shines on the recess 216, a portion of it can pass through the wall surface 2161 of the recess 216 and shine outside the lens 210 (e.g., FIG. 6A As shown by the light ray e), another portion of the light can be reflected by the wall surface 2161 of the recessed portion 216 and irradiate the first groove 212 (as shown by...). FIG. 6A (As shown by light rays f and g).

[0305] Understandably, a portion of the light illuminating the first groove 212 can pass through the first groove 212 and be dispersed by the substructure 142 embedded within the first groove 212 (e.g., FIG. 6A (As shown in the middle ray g).

[0306] This configuration allows light to be reflected by the recessed portion 216 and irradiate at least one substructure 142, increasing the intensity of light irradiating at least one substructure 142, improving the light-scattering effect of at least one substructure 142, further weakening the bright and dark areas appearing on the light-emitting module 200, and improving the brightness uniformity of the light-emitting module 200.

[0307] Another portion of the light rays that illuminate the first groove 212 can be reflected off the wall of the first groove 212 and out of the lens 210 (e.g., FIG. 6A As shown in the middle light (f), the light intensity irradiated to the adjacent positions of the two light-emitting areas 102 is further increased, thereby improving the brightness uniformity of the light-emitting substrate 100.

[0308] In some examples, the recess 216 is conical in shape. The orthographic projection of the light-emitting element 130 onto the substrate 110 falls within the range of the orthographic projection of the recess 216 onto the substrate 110.

[0309] In some embodiments, the lens 210 further includes a filling portion 218, which fills the recess 216, such that the surface of the lens 210 away from the substrate 110 is a smooth plane. Understandably, the filling portion 218 is made of a transparent material. The refractive index of the filling portion 218 is different from that of the lens 210.

[0310] In some examples, the refractive index of the filling portion 218 is greater than that of the lens 210, making it easier for light rays illuminating the wall surface 2161 of the recess 216 (that is, light rays illuminating the contact surface between the recess 216 and the filling portion 218) to pass through the recess 216 and the filling portion 218 and illuminate outside the lens 210, thereby increasing the brightness of the light-emitting area 102.

[0311] In other examples, the refractive index of the filling portion 218 is less than that of the lens 210, so that the light irradiating the wall surface 2161 of the recess 216 (that is, the light irradiating the contact surface between the recess 216 and the filling portion 218) can undergo total internal reflection at the wall surface 2161 of the recess 216, thereby increasing the intensity of the light irradiating the first groove 212, that is, increasing the intensity of the light irradiating the substructure 142, improving the light-scattering effect of the diffuser particles 164, further improving the brightness between two adjacent light-emitting elements 130, thereby improving the brightness uniformity of the light-emitting module 200.

[0312] In some embodiments, such as FIG. 6A As shown, at least one lens 210 is configured to have a second groove 214 on a surface near the substrate 110. As described above, the light-emitting element 130 includes a light-emitting portion 132. At least a portion of the light-emitting portion 132 is located within the second groove 214.

[0313] Understandably, the substrate 110 is positioned in the direction of the lens 210 to focus the light. At least a portion of the light-emitting part 132 is located within the second groove 214, allowing the light emitted by the light-emitting part 132 to illuminate the inner wall of the second groove 214. The light is refracted and focused on the inner wall of the second groove 214, reducing the intensity of light illuminating other light-emitting areas 102. This reduces crosstalk between two adjacent light-emitting areas 102 and also increases the brightness of the light-emitting area 102, reducing the power consumption of the light-emitting module 200.

[0314] Furthermore, since at least a portion of the light-emitting part 132 is located within the second groove 214, no additional space is needed to accommodate the light-emitting part 132, which facilitates the thinning of the light-emitting module 200 and also protects the light-emitting part 132, thereby improving the reliability of the light-emitting module 200.

[0315] In some examples, such as FIG. 6B As shown, the light-emitting module 200 also includes a dimming film 219. The dimming film 219 is located on the side of the lens 210 away from the substrate 110, and the orthographic projection of the dimming film 219 on the substrate 110 at least partially overlaps with the orthographic projection of the recess 216 on the substrate 110.

[0316] In some examples, the orthographic projection of the dimming film 219 onto the substrate 110 covers the orthographic projection of the recess 216 onto the substrate 110.

[0317] In some examples, the dimming film 219 is attached to the surface of the lens 210 on the side away from the substrate 110.

[0318] In some examples, there are multiple lenses 210 and multiple dimming films 219, with one dimming film 219 located on the side of a lens 210 away from the substrate 110.

[0319] Understandably, different positions of the dimming film 219 have different light transmittance, which can play a role in adjusting the light intensity, improving the brightness uniformity of the recess 216, and thus further improving the brightness uniformity of each light-emitting area 102, that is, improving the brightness uniformity of the light-emitting module 200.

[0320] FIG. 6B An exploded view of a dimming film according to some embodiments.

[0321] In some examples, such as FIG. 6B As shown, the dimming film 219 includes a first dimming film 2191, a second dimming film 2192, a third dimming film 2193, and a fourth dimming film 2194.

[0322] For example, the first dimming film 2191 is a transparent film, and the first dimming film 2191 is attached to the side surface of the lens 210 away from the substrate 110.

[0323] For example, the second dimming film 2192, the third dimming film 2193 and the fourth dimming film 2194 are stacked on the side of the first dimming film 2191 away from the lens 210 by means of printing or vapor deposition.

[0324] For example, the transmittance of the second dimming film 2192, the third dimming film 2193, and the fourth dimming film 2194 may be the same or different.

[0325] The orthographic projection of the second dimming film 2192 onto the substrate 110 falls within the range of the orthographic projection of the first dimming film 2191 onto the substrate 110. The orthographic projection of the third dimming film 2193 onto the substrate 110 falls within the range of the orthographic projection of the second dimming film 2192 onto the substrate 110. The orthographic projection of the fourth dimming film 2194 onto the substrate 110 falls within the range of the orthographic projection of the third dimming film 2193 onto the substrate 110.

[0326] For example, the centers of the first dimming film 2191, the second dimming film 2192, the third dimming film 2193, and the fourth dimming film 2194 coincide with each other.

[0327] For example, such asFIG. 6B As shown, the second dimming film 2192 and the fourth dimming film 2194 have light-transmitting holes 2195. Understandably, since the first dimming film 2191, the second dimming film 2192, the third dimming film 2193, and the fourth dimming film 2194 are stacked, the position and size of the light-transmitting holes 2195 can be adjusted to allow the dimming film 219 to have different light transmittances at different positions, thereby improving the brightness uniformity of the light-emitting area 102.

[0328] In some examples, the light-transmitting aperture 2195 is circular. In other examples, the light-transmitting aperture 2195 may also be a regular polygon, a regular star polygon, or other shapes. The embodiments disclosed herein do not further limit the shape of the light-transmitting aperture 2195.

[0329] In some examples, such as FIG. 6B As shown, the light-transmitting hole 2195 on the fourth dimming film 2194 is located at the center of the fourth dimming film 2194.

[0330] In some examples, such as FIG. 6B As shown, the first dimming film 2191 is rectangular, and the third dimming film 2193 and the fourth dimming film 2194 are both hexagonal stars and similar to each other, but the area of ​​the third dimming film 2193 is smaller than that of the fourth dimming film 2194. The second dimming film 2192 includes an annular structure 21921 composed of two coaxially arranged hexagonal stars, i.e., the light-transmitting hole 2195 of the second dimming film 2192 is a hexagonal star, and a plurality of separately arranged circular patterns 21922 and 21923 surrounding the annular structure 21921. Furthermore, in any direction away from the geometric center of the second dimming film 2192, the area of ​​any two adjacent circular patterns is smaller than the area of ​​the circular pattern 21922 that is closer to the center of the second dimming film 2192 than the area of ​​the circular pattern 21923 that is farther away from the center of the second dimming film 2192.

[0331] That is, along any direction away from the center of the second dimming film 2192, the area of ​​the multiple light-transmitting holes 2195 opened on the second dimming film 2192 increases sequentially.

[0332] In some examples, such as FIG. 6C As shown, the second dimming film 2192 includes a first sub-film and a second sub-film. The first sub-film is circular or nearly circular, and the second sub-film is octagonal. The first sub-film is attached to the surface of the first dimming film 2191 away from the lens 210, and the second sub-film is attached to the surface of the first sub-film away from the first dimming film 2191. A light-transmitting hole 2195 formed on the second dimming film 2192 penetrates the first sub-film, or penetrates both the first and second sub-films.

[0333] In some examples, the third dimming film 2193 may also be provided with a light-transmitting hole 2195, so that the dimming film 219 can meet different light transmittance requirements.

[0334] In other examples, the first dimming film 2191, the second dimming film 2192, the third dimming film 2193, and the fourth dimming film 2194 may also be other regular or irregular shapes.

[0335] In some examples, the thickness of the first dimming film 2191 ranges from 2.0 μm to 10 μm. For example, the thickness of the first dimming film 2191 can be 3 μm, 5 μm, 7 μm, 8 μm, or 9 μm, etc.

[0336] In some examples, the material of the first dimming film 2191 includes polyethylene terephthalate (PET).

[0337] In some examples, the thickness of the second dimming film 2192 ranges from 2.0 μm to 10 μm. For example, the thickness of the second dimming film 2192 can be 3 μm, 5 μm, 7 μm, 8 μm, or 9 μm, etc.

[0338] In some examples, the thickness of the third dimming film 2193 ranges from 2.0 μm to 10 μm. For example, the thickness of the third dimming film 2193 can be 3 μm, 5 μm, 7 μm, 8 μm, or 9 μm, etc.

[0339] In some examples, the thickness of the fourth dimming film 2194 ranges from 2.0 μm to 10 μm. For example, the thickness of the fourth dimming film 2194 can be 3 μm, 5 μm, 7 μm, 8 μm, or 9 μm, etc.

[0340] Understandably, the thicknesses of the first dimming film 2191, the second dimming film 2192, the third dimming film 2193, and the fourth dimming film 2194 can be the same or different.

[0341] For example, the materials of the second dimming film 2192, the third dimming film 2193, and the fourth dimming film 2194 include resins, such as those obtained by punching polyurethane resin sheets (e.g., Victorian punching); other synthetic resins such as nylon may also be used; and resin materials with specific patterns can be directly formed on the lens 210 by printing, vapor deposition, etc.

[0342] In other examples, the dimming film 219 may not include the first dimming film 2191, but only the second dimming film 2192, the third dimming film 2193, and the fourth dimming film 2194. The second dimming film 2192, the third dimming film 2193, and the fourth dimming film 2194 are stacked on the surface of the lens 210 away from the substrate 110.

[0343] In some embodiments, the light-emitting element 130 is configured to emit white light.

[0344] As described above, the light-emitting element 130 includes a light-emitting portion 132. In some examples, phosphor can be provided on the light-emitting surface of the light-emitting portion 132, and the monochromatic light emitted by the light-emitting portion 132 can be modulated by the phosphor. The modulated light is mixed with the monochromatic light emitted by the light-emitting portion 132, so that the light-emitting element 130 can emit white light.

[0345] For example, when the light-emitting part 132 emits blue light, yellow phosphor can be provided on the light-emitting surface of the light-emitting part 132. The yellow phosphor can emit yellow light under illumination, and the yellow light mixes with the blue light emitted by the light-emitting part 132, so that the light-emitting element 130 can emit white light.

[0346] For example, when the light-emitting part 132 emits blue light, red phosphor and green phosphor can also be provided on the light-emitting surface of the light-emitting part 132. The red phosphor can emit red light under illumination, and the green phosphor can emit green light under illumination. The red light and green light can be mixed to produce yellow light. The yellow light is mixed with the blue light emitted by the light-emitting part 132, so that the light-emitting element 130 can emit white light.

[0347] In other examples, the light-emitting element 130 includes a first sub-light-emitting element, a second sub-light-emitting element, and a third sub-light-emitting element. The first sub-light-emitting element is configured to emit red light, the second sub-light-emitting element is configured to emit green light, and the third sub-light-emitting element is configured to emit blue light. Mixing the red, green, and blue light makes the light-emitting element 130 emit white light.

[0348] For example, the number of the first sub-light-emitting element, the second sub-light-emitting element, and the third sub-light-emitting element can be the same or different.

[0349] Understandably, the light-emitting element 130 is configured to emit white light. By filtering and other processing of the white light, different colors of light can be obtained, which means that the light-emitting module 200 can emit different colors of light, thereby improving the applicability of the light-emitting module 200.

[0350] As described above, in some embodiments, the light-emitting element 130 is configured to emit white light. In other embodiments, the light-emitting element 130 is configured to emit monochromatic light. For example, the monochromatic light may be blue light.

[0351] FIG. 6CThis is a structural diagram of a first light-emitting element and a first dimming unit according to some embodiments.

[0352] As can be seen from the above, if FIG. 5G As shown, the light-emitting module 200 also includes a color conversion film 222. The color conversion film 222 is located on the side of at least one lens 210 away from the light-emitting element 130.

[0353] Understandably, the color conversion film 222 is located on the side of at least one lens 210 away from the light-emitting element 130, so that monochromatic light emitted by the light-emitting element 130 can illuminate the color conversion film 222 and be converted into red, green, and blue light by the color conversion film 222. Understandably, mixing red, green, and blue light of different intensities can produce colored light, thereby enabling the light-emitting module 200 to display color images.

[0354] As described above, the color conversion film 222 is a quantum dot film 2221. In some embodiments, such as FIG. 6D As shown, the light-emitting element 130 includes a first light-emitting element 136. The orthographic projection of the first light-emitting element 136 on the substrate 110 is close to the edge of the orthographic projection of the quantum dot film 2221 on the substrate 110. The dimming unit 140 includes a first dimming unit 144, which surrounds the first light-emitting element 136.

[0355] Understandably, in the embodiments of this disclosure, the first light-emitting element 136 is only used to describe the light-emitting element 130 near the edge of the orthogonal projection of the quantum dot film 2221 onto the substrate 110, and is not further defined as such. The first dimming section 144 is only used to describe the dimming section 140 surrounding the first light-emitting element 136, and is not further defined as such.

[0356] FIG. 6E This is a structural diagram of the edge region of a quantum dot film according to some embodiments. FIG. 6F This is a structural diagram of the edge region of a quantum dot film according to some other embodiments. FIG. 6D This is a structural diagram of the edge region of a quantum dot film according to some other embodiments.

[0357] In some examples, such as FIG. 6C As shown, the orthographic projection of the quantum dot film 2221 onto the substrate 110 has an edge region Q1 and a central region Q2, with the edge region Q1 surrounding the central region Q2. A boundary line m exists between the edge region Q1 and the central region Q2, and the orthographic projection of the quantum dot film 2221 onto the substrate 110 has an edge n.

[0358] Understandably, the orthogonal projection of the first light-emitting element 136 on the substrate 110 is close to the edge of the orthogonal projection of the quantum dot film 2221 on the substrate 110. That is, the orthogonal projection of the first light-emitting element 136 on the substrate 110 falls into the edge region Q1 of the orthogonal projection of the quantum dot film 2221 on the substrate 110.

[0359] Understandably, the edges of the quantum dot film 2221 are prone to failure due to oxidation and other reasons, which prevents the blue light emitted by the light-emitting element 130 from being converted into red and green light at the edges. This makes it easy for blue light leakage to occur at the edges of the light-emitting module 200, affecting the light-emitting performance of the light-emitting module 200.

[0360] To improve the blue light leakage phenomenon at the edges of the light-emitting module 200, such as FIG. 6D As shown, the light-emitting module 200 also includes fluorescent particles 224. The fluorescent particles 224 are located within at least one substructure 142 of the first dimming section 144. The fluorescent particles 224 are configured to modulate the light irradiated onto the fluorescent particles 224, such that the modulated light is mixed with the unmodulated light emitted by the light-emitting element 130 to form white light.

[0361] Understandably, the fluorescent particles 224 are configured to modulate the light irradiated onto them, meaning the fluorescent particles 224 can emit light under illumination. Since the orthographic projection of the first light-emitting element 136 onto the substrate 110 is close to the edge of the orthographic projection of the quantum dot film 2221 onto the substrate 110 (i.e., the orthographic projection of the first light-emitting element 136 onto the substrate 110 falls within the edge region Q1 of the orthographic projection of the quantum dot film 2221 onto the substrate 110), the fluorescent particles 224 are disposed within at least one substructure 142 of the first dimming section 144, enabling the fluorescent particles 224 to modulate the monochromatic light emitted by the light-emitting element 130. The modulated light mixes with the monochromatic light emitted by the light-emitting element 130 to form white light, improving the blue light leakage phenomenon at the edges of the light-emitting module 200 and enhancing the light-emitting performance of the light-emitting module 200.

[0362] In some examples, the distance m between the boundary line m between the edge region Q1 and the central region Q2 and the edge n of the orthographic projection of the quantum dot film 2221 onto the substrate 110 is ( FIG. 6D (As shown in L7) less than or equal to 2mm.

[0363] For example, such as FIG. 6DAs shown, the width of the quantum dot film 2221 is L3, and its length is L4. The width L5 of the central region Q2, the orthographic projection of the quantum dot film 2221 onto the substrate 110, is less than L3, and its length L6 is less than L4. Furthermore, the geometric center of the central region Q2 is almost coaxial with the geometric center of the quantum dot film 2221, such that the distance between the boundary line m and the edge n in the direction perpendicular to the extension of the corresponding edge is ( FIG. 6D The two are basically the same (as shown in L7), for example, both are about 2mm.

[0364] In some examples, fluorescent particles 224 are disposed within multiple substructures 142 of the first dimming section 144.

[0365] For example, the mass ratio of fluorescent particles 224 in multiple substructures 142 (that is, the ratio of the weight of fluorescent particles 224 disposed in a substructure 142 to the weight of the substructure 142) can be the same or different.

[0366] In some examples, the mass ratio of fluorescent particles 224 is 5%.

[0367] As can be seen from the above, in some examples, the transmittance of substructure 142 ranges from 50% to 100%.

[0368] In some examples, when fluorescent particles 224 are provided within the substructure 142, the transmittance of the substructure 142 ranges from 80% to 100%. This configuration increases the intensity of light irradiating the substructure 142, thereby increasing the intensity of light irradiating the fluorescent particles 224, improving the modulation effect of the fluorescent particles 224 on the light emitted by the light-emitting element 130, further improving the blue light leakage phenomenon at the edge of the light-emitting module 200, and enhancing the light-emitting performance of the light-emitting module 200.

[0369] As can be seen from the above, in some examples, along any direction away from the light-emitting element 130, the height of any two substructures 142 in the dimming section 140 relative to the substructure 142 closer to the light-emitting element 130 is smaller than the height of the substructure 142 farther from the light-emitting element 130. Furthermore, along any direction away from the light-emitting element 130, the area of ​​the orthographic projection of any two substructures 142 in the dimming section 140 relative to the substructure 142 closer to the light-emitting element 130 onto the substrate 110 is smaller than the area of ​​the orthographic projection of the substructure 142 farther from the light-emitting element 130 onto the substrate 110.

[0370] That is, along any direction away from the light-emitting element 130, the height of the plurality of substructures 142 in the dimming section 140 can be gradually increased, and the area of ​​the orthogonal projection of the plurality of substructures 142 in the dimming section 140 onto the substrate 110 can also be gradually increased.

[0371] In some examples, the heights of the plurality of substructures 142 in the first dimming section 144 may gradually increase, or may be the same or approximately the same, along any direction away from the light-emitting element 130.

[0372] In some examples, the area of ​​the orthographic projection of the plurality of substructures 142 in the first dimming section 144 onto the substrate 110 can gradually increase, or be the same or approximately the same, along any direction away from the light-emitting element 130.

[0373] In some examples, along any direction away from the first light-emitting element 136, the areas of the orthographic projections of the plurality of substructures 142 in the first dimming section 144 onto the substrate 110 are the same, and the heights of the plurality of substructures 142 in the first dimming section 144 gradually increase. Furthermore, the mass ratio of the fluorescent particles 224 in the plurality of substructures 142 is the same. This configuration eliminates the need to adjust the mass ratio of the fluorescent particles 224 in different substructures 142, simplifying the fabrication process.

[0374] In other examples, along any direction away from the first light-emitting element 136, the area of ​​the orthographic projection of the plurality of substructures 142 in the first dimming section 144 onto the substrate 110 gradually increases, and the height of the plurality of substructures 142 in the first dimming section 144 is the same. Furthermore, the mass ratio of the fluorescent particles 224 in the plurality of substructures 142 is the same. This configuration also eliminates the need to adjust the mass ratio of the fluorescent particles 224 in different substructures 142, simplifying the fabrication process.

[0375] In some other examples, along any direction away from the first light-emitting element 136, the areas of the orthographic projections of the plurality of substructures 142 in the first dimming section 144 onto the substrate 110 are the same, and the heights of the plurality of substructures 142 in the first dimming section 144 gradually increase. Furthermore, the mass ratio of fluorescent particles 224 is different in each substructure 142.

[0376] For example, the mass ratio of fluorescent particles 224 in multiple substructures 142 can be gradually increased in any direction away from the first light-emitting element 136, further improving the blue light leakage phenomenon at the edge of the light-emitting module 200 and improving the light-emitting performance of the light-emitting module 200.

[0377] In some examples, the mass ratio of fluorescent particles 224 ranges from 5% to 12%. For example, the mass ratio of fluorescent particles 224 can range from 6% to 10%, 7% to 9%, or 7.5% to 8.5%, etc. For example, the mass ratio of fluorescent particles 224 can be 5.5%, 6.5%, or 7.5%, etc.

[0378] In some examples, such as FIG. 6E and FIG. 6DAs shown, if multiple light-emitting elements are distributed at intervals smaller than the edge region Q1, then there is at least one light-emitting region 102 whose orthogonal projection on the substrate 110 completely falls within the edge region Q1 of the orthogonal projection of the quantum dot film 2221 on the substrate 110. That is, the orthogonal projections of the light-emitting components 120 (including the first light-emitting element 136 and the first dimming part 144) located in the light-emitting region 102 on the substrate 110 all fall within the edge region Q1 of the orthogonal projection of the quantum dot film 2221 on the substrate 110.

[0379] For example, such as FIG. 6E As shown, the plurality of light-emitting areas 102 whose orthogonal projections on the substrate 110 fall within the edge region Q1 are arranged in a ring shape. For example, the plurality of light-emitting areas 102 whose orthogonal projections on the substrate 110 fall within the edge region Q1 can be arranged in a circular ring, elliptical ring, rectangular ring, polygonal ring or other irregular ring.

[0380] For example, such as FIG. 6F As shown, the plurality of light-emitting areas 102 whose orthogonal projections on the substrate 110 fall within the edge region Q1 are arranged in at least two concentric rings. For example, the plurality of light-emitting areas 102 whose orthogonal projections on the substrate 110 fall within the edge region Q1 may be arranged in at least two concentric circular rings, at least two concentric elliptical rings, at least two concentric rectangular rings, at least two concentric polygonal rings, or at least two other concentric irregular rings.

[0381] In other examples, if multiple light-emitting elements are distributed with a spacing of 20-50 mm, that is, if multiple first light-emitting elements 136 are also distributed with a spacing of 20-50 mm, then only a portion of the orthographic projection of each first light-emitting element 136 on the substrate 110 falls within the edge region Q1. Within the first dimming section 144 surrounding the first light-emitting elements 136, the orthographic projection of a portion of the substructures 142 (two or more) on the substrate 110 falls within the edge region Q1 (referred to as the first substructure), while the orthographic projection of another portion of the substructures 142 (two or more) on the substrate 110 falls within the central region Q2 (referred to as the second substructure). For example... FIG. 6G As shown, this is the orthogonal projection of the light-emitting region 102 onto the substrate 110, with part of it falling into the edge region Q1 and the other part falling into the central region Q2.

[0382] In this way, fluorescent particles 224 can be placed in at least one first substructure (that is, substructure 142 whose orthogonal projection on the substrate 110 falls within the edge region Q1), while fluorescent particles 224 are not placed in the second substructure (that is, substructure 142 whose orthogonal projection on the substrate 110 falls within the central region Q2), saving the amount of fluorescent particles 224, simplifying the fabrication process, and reducing the cost of the light-emitting module 200.

[0383] In some embodiments, the light-emitting element 130 is configured to emit blue light, and the fluorescent particles 224 include yellow fluorescent particles. Alternatively, the light-emitting element 130 is configured to emit blue light, and the fluorescent particles 224 include red and green fluorescent particles.

[0384] Understandably, blue light and yellow light can mix to form white light, and red light and green light can mix to form yellow light. Therefore, in some examples, the fluorescent particles 224 are configured to include yellow fluorescent particles, meaning that the fluorescent particles 224 can emit yellow light when illuminated. The yellow light emitted by the fluorescent particles 224 mixes with the blue light emitted by the light-emitting element 130 to form white light.

[0385] In other examples, the fluorescent particles 224 include red and green fluorescent particles, meaning that the fluorescent particles 224 can emit red and green light when illuminated. The red and green light can be mixed to form yellow light, which is then mixed with the blue light emitted by the light-emitting element 130 to form white light.

[0386] FIG. 6H This is a structural diagram of a light-emitting module according to some other embodiments. FIG. 6G This is a structural diagram of a light-emitting module according to some other embodiments.

[0387] In some embodiments, such as FIG. 6G As shown, the light-emitting module 200 also includes a brightness enhancement film 226. The brightness enhancement film 226 is located on the side of the color conversion film 222 away from at least one lens 210.

[0388] Understandably, the brightness enhancement film 226 increases the brightness of the display area 104, thereby reducing the power consumption of the light-emitting module 200. In some examples, the brightness enhancement film 226 includes a prism. When light shines on the prism, it can be reflected or refracted under the action of the prism, thereby increasing the brightness of the light-emitting module 200.

[0389] In other examples, the brightening film 226 includes cast polypropylene film (CPP).

[0390] In some examples, such as FIG. 6H As shown, the light-emitting module 200 also includes an encapsulation panel 228. The encapsulation panel 228 is located on the side of the brightness enhancement film 226 away from the color conversion film 222. Understandably, the encapsulation panel 228 serves a protective and encapsulating function.

[0391] Understandably, the encapsulation panel 228 is made of a transparent material, allowing light to pass through the encapsulation panel 228 and reach outside the light-emitting module 200. For example, the material of the encapsulation panel 228 includes glass.

[0392] In some examples, such as FIG. 6H As shown, the light-emitting module 200 also includes a frame 202, which is used to support the encapsulation panel 228.

[0393] In some examples, the light-emitting module 200 also includes a diffusion film. The diffusion film is located between the brightness enhancement film 226 and the encapsulation panel 228, and plays a role in uniform light distribution, further improving the brightness uniformity of the light-emitting module 200.

[0394] In some examples, such as FIG. 7A As shown, the light-emitting module 200 also includes a light-diffusing film 204, which is located between the lens 210 and the color conversion film 222 and plays the role of light-diffusing, further improving the brightness uniformity of the light-emitting module 200.

[0395] FIG. 7B This is a structural diagram of a display device according to some embodiments. FIG. 7A This is a structural diagram of a display device according to some other embodiments.

[0396] On the other hand, such as FIG. 7B and FIG. 7A As shown, a display device 300 is provided. The display device 300 includes a backlight module 310 and a liquid crystal display panel 320. The liquid crystal display panel 320 is located on the light-emitting side of the backlight module 310. Wherein, as... FIG. 7B As shown, the backlight module 310 includes the light-emitting substrate 100 as described above. Or, as... FIG. 7A As shown, the backlight module 310 includes the light-emitting module 200 as described above.

[0397] The display device 300 provided in the embodiments of this disclosure includes the light-emitting substrate 100 as described above, or includes the light-emitting module 200 as described above, and therefore has all the above-described beneficial effects, which will not be repeated here.

[0398] Understandably, the display device 300 can display dynamic image information, such as video or game footage, or static image information, such as images or photographs.

[0399] In some embodiments, the display device 300 may be a mobile phone, wireless device, personal data assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, watch, clock, calculator, television monitor, flat panel display, computer monitor, automotive display (e.g., odometer display, etc.), navigator, cockpit controller and / or display, display of camera view (e.g., display of a rearview camera in a vehicle), electronic photograph, electronic billboard or sign, projector, packaging and aesthetic structure (e.g., display of an image of a piece of jewelry), etc.

[0400] For example, the liquid crystal display panel 320 is located on the light-emitting side of the backlight module 310, meaning that the light emitted by the backlight module 310 can illuminate the liquid crystal display panel 320. The liquid crystal display panel 320 will be described with an example below.

[0401] For example, such as FIG. 7B and FIG. 7B As shown, the liquid crystal display panel 320 includes an array substrate 326, a liquid crystal layer 324, and an opposing substrate 322. The array substrate 326 is located on the light-emitting side of the backlight module 310, and the liquid crystal layer 324 is located on the side of the array substrate 326 away from the backlight module 310. The opposing substrate 322 is located on the side of the liquid crystal layer 324 away from the array substrate 326.

[0402] Understandably, such as FIG. 7C As shown, taking the backlight module 310, which includes the light-emitting module 200 as described above, as an example, light is emitted from the light-emitting side of the light-emitting module 200 and illuminates the liquid crystal layer 324. By adjusting the arrangement of liquid crystal molecules in the liquid crystal layer 324, the intensity of light transmitted through the liquid crystal layer 324 can be adjusted, thereby adjusting the intensity of light emitted from the liquid crystal display panel 320, enabling the display device 300 to display color images.

[0403] FIG. 7D This is a structural diagram of a display device according to some other embodiments. FIG. 7C This is a structural diagram of a display device according to some other embodiments.

[0404] On the other hand, such as FIG. 7D and FIG. 7C As shown, an embodiment of this disclosure provides a display device 400. The display device 400 includes a display panel 410. The display panel 410 includes a light-emitting substrate 100 as described above. Alternatively, the display panel 410 includes a light-emitting module 200 as described above.

[0405] The display device 400 provided in the embodiments of this disclosure includes the light-emitting substrate 100 as described above or the light-emitting module 200 as described above, and therefore has all the above-described beneficial effects, which will not be repeated here.

[0406] Understandably, the display device 400 can display dynamic image information, such as video or game footage, or static image information, such as images or photographs.

[0407] In some embodiments, the display device 400 may be a mobile phone, wireless device, personal data assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, watch, clock, calculator, television monitor, flat panel display, computer monitor, automotive display (e.g., odometer display, etc.), navigator, cockpit controller and / or display, display of camera view (e.g., display of a rearview camera in a vehicle), electronic photograph, electronic billboard or sign, projector, packaging and aesthetic structure (e.g., display of an image of a piece of jewelry), etc.

[0408] In some examples, such as FIG. 7D and ​ As shown, the display panel 410 also includes a protective cover plate 420. The protective cover plate 420 is located on the side of the light-emitting element 130 away from the substrate 110. Understandably, the protective cover plate 410 serves to protect the light-emitting substrate 100 (or the light-emitting module 200).

[0409] In some embodiments, the substrate 110 may be configured as a flexible substrate, so that the light-emitting substrate 100 or the light-emitting module 200 can be bent, thereby enabling the display device 400 to achieve curved display, for example, the edges of the display device 400 are curved, thereby improving the display effect of the display device 400.

[0410] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A light-emitting module, comprising a light-emitting substrate; The light-emitting substrate includes: Substrate; Multiple light-emitting components are located on one side of the substrate; at least one light-emitting component includes a light-emitting element and a dimming section disposed around the light-emitting element; the dimming section includes multiple substructures spaced apart from each other; Wherein, along any direction away from the light-emitting element, the height of any two substructures in the dimming section relative to the substructure closer to the light-emitting element is less than the height of the substructure relatively away from the light-emitting element; The light-emitting module further includes at least one lens; the lens is located on the side of the plurality of light-emitting components away from the substrate; the at least one lens is configured to have at least one first groove on a surface close to the substrate; at least a portion of at least one substructure of the dimming unit is embedded in the first groove.

2. The light-emitting module according to claim 1, wherein, Along any direction away from the light-emitting element, the area of ​​the orthographic projection of any two substructures in the dimming section relative to the light-emitting element on the substrate is smaller than the area of ​​the orthographic projection of the substructure relative to the light-emitting element on the substrate.

3. The light-emitting module according to claim 1, further comprising: A driving circuit layer is located on one side of the substrate; the driving circuit layer includes metal traces and conductive pads, and the conductive pads are electrically connected to the metal traces. A reflective film is located on the side of the driving circuit layer away from the substrate; and the reflective film exposes the conductive pad. The light-emitting element includes a light-emitting part and pins. The light-emitting part is located on the side of the reflective film away from the driving circuit layer, and the pins are electrically connected to the conductive pad. Multiple substructures in the dimming part are located on the surface of the reflective film away from the driving circuit layer.

4. The light-emitting module according to claim 1, further comprising: A driving circuit layer is located on one side of the substrate; the driving circuit layer includes metal traces and conductive pads, and the conductive pads are electrically connected to the metal traces. A reflective component is located on the side of the driving circuit layer away from the substrate; the reflective component surrounds and forms a reflective cavity, and the reflective component has a connecting hole; The light-emitting element includes a light-emitting part and pins. The light-emitting part is located in the reflective cavity, and the pins are electrically connected to the conductive pad through the connecting hole. Multiple substructures in the dimming part are located in the reflective cavity.

5. The light-emitting module according to claim 4, wherein, The reflective component includes: The bottom wall has the connecting hole; multiple substructures in the dimming unit are located on the bottom wall; A sidewall, one end of which is connected to the bottom wall, and the other end of which extends along the bottom wall away from the substrate; the sidewall and the bottom wall enclose the reflective cavity.

6. The light-emitting module according to claim 5, wherein, The sidewall is perpendicular to the bottom wall.

7. The light-emitting module according to claim 5, wherein, The edge of the sidewall away from the bottom wall, when projected onto a reference plane parallel to the sidewall, has the shape of a series of curves or a series of broken lines.

8. The light-emitting module according to any one of claims 1 to 7, wherein, In any direction away from the light-emitting element, the multiple substructures in the dimming section are located on a straight line.

9. The light-emitting module according to any one of claims 1 to 7, wherein, At least one of the substructures is shaped like a cone, pyramid, frustum, truncated cone, or hemisphere.

10. The light-emitting module according to any one of claims 1 to 7, wherein, The height of the multiple substructures in the dimming unit ranges from 250μm to 1000μm.

11. The light-emitting module according to any one of claims 1 to 7, wherein, Along any direction away from the light-emitting element, the absolute value of the height difference between any two adjacent substructures in the dimming section ranges from 200μm to 300μm.

12. The light-emitting module according to claim 11, wherein, Along any direction away from the light-emitting element, the absolute value of the height difference between any two adjacent substructures in the dimming section is equal to the absolute value of the height difference between any other two adjacent substructures.

13. The light-emitting module according to any one of claims 1 to 7, further comprising: Diffused particles are located within at least one of the substructures.

14. The light-emitting module according to any one of claims 1 to 7, wherein, The light-emitting substrate has a display area; the brightness of the light-emitting element near the edge of the display area is greater than the brightness of the light-emitting element located at other positions in the display area.

15. The light-emitting module according to claim 1, wherein, At least one of the first grooves is an annular groove; the orthographic projection of the annular groove on the substrate surrounds the orthographic projection of the light-emitting element on the substrate.

16. The light-emitting module according to claim 1, wherein, The number of the first grooves is multiple, and the multiple substructures embedded in the same first groove have the same height; and / or, Multiple substructures embedded in the same first groove have the same area of ​​orthographic projection on the substrate.

17. The light-emitting module according to claim 1, wherein, The number of the first grooves is multiple; Along any direction away from the light-emitting element, the depth of any two of the first grooves closer to the light-emitting element is less than the depth of the first groove farther away from the light-emitting element; and / or, Along any direction away from the light-emitting element, the width of any two of the first grooves closer to the light-emitting element is smaller than the width of the first groove farther away from the light-emitting element.

18. The light-emitting module according to any one of claims 1, 15 to 17, wherein, The at least one lens is configured to have a recess on a surface away from the substrate; the orthogonal projection of the light-emitting element on the substrate overlaps at least a portion of the orthogonal projection of the recess on the substrate.

19. The light-emitting module according to any one of claims 1, 15 to 17, wherein, The at least one lens is configured to have a second groove on a surface near the substrate; the light-emitting element includes a light-emitting portion, at least a portion of which is located within the second groove.

20. The light-emitting module according to any one of claims 1, 15 to 17, wherein, The light-emitting element is configured to emit white light.

21. The light-emitting module according to any one of claims 1, 15 to 17, wherein, The light-emitting element is configured to emit monochromatic light; The light-emitting module also includes: A color conversion film is located on the side of the at least one lens away from the light-emitting element.

22. The light-emitting module according to claim 21, wherein, The color conversion film is a quantum dot film; The light-emitting element includes a first light-emitting element, the orthographic projection of the first light-emitting element on the substrate being close to the edge of the orthographic projection of the quantum dot film on the substrate; the dimming part includes a first dimming part surrounding the first light-emitting element; The light-emitting module further includes fluorescent particles, which are located within at least one substructure in the first dimming section; the fluorescent particles are configured to modulate the light irradiated onto the fluorescent particles, so that the modulated light is mixed with the unmodulated light emitted by the light-emitting element to form white light.

23. The light-emitting module according to claim 22, wherein, The light-emitting element is configured to emit blue light, and the fluorescent particles include yellow fluorescent particles; or, The light-emitting element is configured to emit blue light, and the fluorescent particles include red fluorescent particles and green fluorescent particles.

24. The light-emitting module according to claim 21, further comprising: A brightness enhancement film is located on the side of the color conversion film away from the at least one lens.

25. A display device, comprising: Backlight module; and, The liquid crystal display panel is located on the light-emitting side of the backlight module; The backlight module includes the light-emitting module as described in any one of claims 1 to 24.

26. A display device, comprising a display panel; in, The display panel includes a light-emitting module as described in any one of claims 1 to 24.

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