Light plate, preparation method thereof, backlight module and display panel

Abstract

The application provides a lamp panel and a preparation method thereof, a backlight module and a display panel. The lamp panel comprises a circuit board, one side of the circuit board on which a light emitting diode is mounted is provided with a reflection layer, the light emitting diode is wrapped with encapsulation glue, the encapsulation glue is adhered to the surface of the reflection layer, the orthographic projection of the positive copper foil and the negative copper foil on the surface of the reflection layer comprises a flat area, and the area to which the encapsulation glue is adhered comprises the flat area. By arranging the positive copper foil and the negative copper foil inside the circuit board, the surface of the reflection layer corresponding to the positive copper foil and the negative copper foil is flat, the bonding force between the glue and the surface of the reflection layer can be ensured, and the phenomenon that the encapsulation glue falls off due to the insufficient bonding force between the encapsulation glue and the surface of the reflection layer is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a lamp plate, a preparation method thereof, a backlight module and a display panel. BACKGROUND

[0002] The backlight module is one of the key components of the liquid crystal display panel, and its main function is to provide a light source with uniform brightness for the liquid crystal display module to normally display images. The lamp plate is arranged inside the backlight module, and the lamp plate includes a circuit board and a light-emitting diode. A plurality of uniformly distributed light-emitting diodes are arranged on the circuit board to achieve a uniform backlight light source.

[0003] At present, the existing lamp plate needs to form a reflection layer on the surface of the circuit board before the light-emitting diode die bonding to reflect the light emitted by the light-emitting diode towards the lamp plate to improve the light source utilization rate. After the light-emitting diode die bonding, the light-emitting diode needs to be encapsulated by dispensing. The spherical encapsulation glue not only protects the light-emitting diode but also expands the light mixing range. However, due to the large number of copper skin traces around the light-emitting diode die bonding position, the reflection layer on the surface of the circuit board has multiple height differences, which cannot form a flat dispensing surface, affecting the surface bonding force of the glue and the reflection layer, and easily leading to the separation of the encapsulation glue. SUMMARY

[0004] The present application provides a lamp plate, a preparation method thereof, a backlight module and a display panel, aiming to solve the technical problem that the surface bonding force of the encapsulation glue and the reflection layer is insufficient, leading to the separation of the encapsulation glue.

[0005] In a first aspect, the present application provides a lamp plate, comprising:

[0006] A circuit board, the circuit board has a positive copper foil and a negative copper foil arranged at intervals inside the circuit board, and the surface of the circuit board is provided with a positive pad penetrating to the positive copper foil and a negative pad penetrating to the negative copper foil;

[0007] A light-emitting diode, the light-emitting diode is mounted on the circuit board, and the light-emitting diode has a positive conducting part and a negative conducting part, the positive conducting part is connected to the positive pad, and the negative conducting part is connected to the negative pad;

[0008] The surface of the circuit board where the light-emitting diode is mounted is provided with a reflection layer, the light-emitting diode is wrapped with encapsulation glue, the encapsulation glue is adhered to the surface of the reflection layer, the positive copper foil and the negative copper foil have a flat area in the orthographic projection on the surface of the reflection layer, and the area where the encapsulation glue is adhered includes the flat area.

[0009] In some embodiments, the orthographic projection of the positive copper foil and the positive pad on the surface of the reflection layer forms a first shape;

[0010] The orthographic projection of the negative copper foil and the negative pad on the surface of the reflection layer forms a second shape;

[0011] The first shape and the second shape are arc-shaped, and the radii of the arcs of the first shape and the second shape are equal.

[0012] In some embodiments, the central angles corresponding to the arcs of the first shape and the second shape are equal, and the central angles corresponding to the arcs of the first shape and the second shape are less than or equal to 180°.

[0013] In some embodiments, the sum of the central angles corresponding to the arcs of the first shape and the second shape is less than or equal to 360°.

[0014] In some embodiments, a gap region is provided between the positive electrode copper foil and the negative electrode copper foil;

[0015] The positive electrode copper foil, negative electrode copper foil, spacer area, positive electrode pad, and negative electrode pad are arranged in a circular shape by their orthogonal projections onto the reflective layer surface.

[0016] In some embodiments, the orthographic projection of the encapsulating adhesive on the surface of the reflective layer coincides with the orthographic projections of the corresponding positive copper foil, negative copper foil, spacer region, positive pad, and negative pad on the surface of the reflective layer.

[0017] In some embodiments, the positive and negative copper foils are arranged symmetrically with respect to the spacer region.

[0018] In some embodiments, the positive electrode pad and the negative electrode pad are adjacent to the spacer region.

[0019] In some embodiments, the orthographic projections of the positive and negative copper foils onto the plane of the circuit board are located within the orthographic projection of the reflective layer onto the plane of the circuit board.

[0020] In some embodiments, the circuit board has a positive electrode trace that connects to the positive copper foil and a negative electrode trace that connects to the negative copper foil.

[0021] The positive electrode trace is connected to the side of the positive copper foil that is away from the negative copper foil, and the negative electrode trace is connected to the side of the negative copper foil that is away from the positive copper foil.

[0022] In some embodiments, the circuit board surface is provided with a positive test pad extending to the positive electrode trace and a negative test pad extending to the negative electrode trace.

[0023] Secondly, this application provides a method for preparing a lamp panel, comprising:

[0024] A circuit board is provided, wherein the circuit board has positive copper foil and negative copper foil arranged at intervals inside the circuit board, and the surface of the circuit board has a positive pad extending to the positive copper foil and a negative pad extending to the negative copper foil;

[0025] A reflective layer is formed on the side of the circuit board where the light-emitting diodes are mounted;

[0026] An LED is mounted on a circuit board. The LED has a positive conductive part and a negative conductive part. The positive conductive part is connected to the positive pad, and the negative conductive part is connected to the negative pad.

[0027] An encapsulating adhesive is formed by dispensing adhesive onto a light-emitting diode (LED). The encapsulating adhesive adheres to the surface of a reflective layer. The orthogonal projections of the positive and negative copper foils onto the reflective layer surface include flat areas, and the areas adhered by the encapsulating adhesive also include flat areas.

[0028] Thirdly, this application provides a backlight module, including the lamp panel as described in the first aspect.

[0029] Fourthly, this application provides a display panel including a backlight module as described in the third aspect.

[0030] This application sets positive and negative copper foils inside the circuit board, making the reflective layer surfaces corresponding to the positive and negative copper foils flat. The encapsulating adhesive can be at least partially bonded to the flat area of ​​the reflective layer surface, which helps to improve the bonding force between the adhesive and the reflective layer surface, thereby avoiding the phenomenon of encapsulating adhesive falling off due to insufficient bonding force between the encapsulating adhesive and the reflective layer surface. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of a lamp panel provided in an embodiment of this application;

[0033] Figure 2 This is a schematic diagram of the orthogonal projection of the positive and negative copper foils provided in the embodiments of this application onto the surface of the reflective layer;

[0034] Figure 3 This is a schematic diagram of a circuit board structure provided in an embodiment of this application;

[0035] Figure 4 This is a schematic diagram of another structure of the circuit board provided in the embodiments of this application;

[0036] Figure 5 This is a schematic diagram of another structure of the circuit board provided in the embodiments of this application;

[0037] Figure 6 This is a schematic diagram of another structure of the circuit board provided in the embodiments of this application;

[0038] Figure 7 This is a schematic flowchart of a lamp board preparation method provided in the embodiments of this application.

[0039] Among them, 10 is the circuit board, 100 is the flat area, 11 is the positive copper foil, 12 is the negative copper foil, 13 is the spacer area, 14 is the positive pad, 15 is the negative pad, 16 is the positive trace, 17 is the negative trace, 18 is the positive test pad, 19 is the negative test pad, 20 is the light-emitting diode, 21 is the positive conductive part, 22 is the negative conductive part, 30 is the reflective layer, and 40 is the encapsulating adhesive. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0042] In this application, the term "exemplary" is used to mean "serving as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use the invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the invention can be made without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the invention with unnecessary detail. Therefore, the invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0043] This application provides a lamp board and its manufacturing method, a backlight module, and a display panel, which will be described in detail below.

[0044] First, refer to Figure 1 , Figure 2 as well as Figure 3 , Figure 1 This paper shows a schematic diagram of a lamp board structure in an embodiment of this application. Figure 2 This diagram illustrates a schematic representation of the orthographic projection of the positive and negative copper foils onto the surface of the reflective layer in an embodiment of this application. Figure 3 This paper shows a schematic diagram of a circuit board 10 in an embodiment of this application, wherein the lamp board includes:

[0045] The circuit board 10 has a positive copper foil 11 and a negative copper foil 12 spaced apart inside. The surface of the circuit board 10 has a positive pad 14 that extends through the positive copper foil 11 and a negative pad 15 that extends through the negative copper foil 12.

[0046] Light-emitting diode 20 is mounted on circuit board 10. Light-emitting diode 20 has a positive electrode conducting part 21 and a negative electrode conducting part 22. The positive electrode conducting part 21 is connected to the positive electrode pad 14, and the negative electrode conducting part 22 is connected to the negative electrode pad 15.

[0047] The circuit board 10 has a reflective layer 30 on the side where the light-emitting diode 20 is mounted. The light-emitting diode 20 is wrapped with encapsulating adhesive 40, which is adhered to the surface of the reflective layer 30. The orthogonal projection of the positive copper foil 11 and the negative copper foil 12 on the surface of the reflective layer 30 includes a flat area 100, and the area adhered by the encapsulating adhesive 40 includes the flat area 100.

[0048] Specifically, the circuit board 10 provides a mounting base for the light-emitting diode 20 and a driving circuit for it to emit light. The positive copper foil 11 and the negative copper foil 12 are components of the driving circuit inside the circuit board 10. The positive copper foil 11 and the negative copper foil 12 are formed after etching the copper foil of the circuit board 10. The surface of the circuit board 10 is provided with a positive pad 14 that extends to the positive copper foil 11 and a negative pad 15 that extends to the negative copper foil 12, ensuring that the light-emitting diode 20 can be electrically connected to the positive copper foil 11 and the negative copper foil 12 through the positive pad 14 and the negative pad 15, respectively.

[0049] The light-emitting diode 20 is powered by the driving circuit of the circuit board 10 and emits light. Generally, multiple light-emitting diodes 20 are arranged in an array on the lamp board to improve the uniformity of light emission. Specifically, the light-emitting diode 20 has a positive electrode conducting portion 21 and a negative electrode conducting portion 22. The positive electrode conducting portion 21 and the negative electrode conducting portion 22 are the pads of the light-emitting diode 20. The positive electrode conducting portion 21 is connected to the positive electrode pad 14 and the negative electrode conducting portion 22 is connected to the negative electrode pad 15 by soldering. For example, the light-emitting diode 20 can be a Mini-LED or a Micro-LED.

[0050] In this embodiment, a reflective layer 30 is provided on the side of the circuit board 10 where the light-emitting diodes 20 are mounted. The reflective layer 30 can reflect the light emitted by the light-emitting diodes 20 onto the lamp board to improve the utilization rate of the light source. For example, the reflective layer 30 can be a reflective sheet attached to the surface of the circuit board 10, or the reflective layer 30 can be formed by curing white oil applied to the surface of the circuit board 10. At the same time, each light-emitting diode 20 is wrapped with a spherical encapsulating adhesive 40, which is bonded to the surface of the reflective layer 30 to protect the light-emitting diode 20 and expand the light mixing range of a single light-emitting diode 20, making the light output of the entire lamp board more uniform.

[0051] It should be noted that by setting positive copper foil 11 and negative copper foil 12 inside the circuit board 10, the surface of the reflective layer 30 corresponding to the positive copper foil 11 and negative copper foil 12 is flat. Since the orthogonal projection of the positive copper foil 11 and negative copper foil 12 on the surface of the reflective layer 30 includes the flat area 100, and the area where the encapsulating adhesive 40 is bonded includes the flat area 100, it is beneficial to improve the bonding force between the adhesive and the surface of the reflective layer 30, thereby avoiding the phenomenon of the encapsulating adhesive 40 falling off due to insufficient bonding force between the encapsulating adhesive 40 and the surface of the reflective layer.

[0052] In some embodiments of this application, such as an embodiment where the encapsulating adhesive 40 is spherical, see [reference]. Figure 2 as well as Figure 3In this circuit, a gap 13 is provided between the positive copper foil 11 and the negative copper foil 12. The gap 13 is filled with the insulating material of the circuit board 10 to ensure the insulation of the positive copper foil 11 and the negative copper foil 12. The positive copper foil 11, the negative copper foil 12, the gap 13, the positive pad 14 and the negative pad 15 are projected onto the surface of the reflective layer 30 to form a circle. A pattern corresponding to this circle is set on the surface of the circuit board 10. After the light-emitting diode 20 is glued to form a spherical encapsulating glue 40, the diameter of the glue can be quickly identified through the circular area. Since many light-emitting diodes 20 are soldered on the lamp board, especially for Mini-LEDs, this can significantly improve the speed of product quality inspection.

[0053] It is worth noting that the interval region 13 referred to in this application is the region located between the positive electrode copper foil 11 and the negative electrode copper foil 12, and can be formed by connecting the two adjacent edges of the positive electrode copper foil 11 and the negative electrode copper foil 12 with a straight line or an arc. For example, using... Figure 3 For example, the positive electrode copper foil 11 and the negative electrode copper foil 12 have opposite arc-shaped edges and adjacent straight edges. The interval region 13 is formed by the combination of two arc lines and the two adjacent straight edges of the positive electrode copper foil 11 and the negative electrode copper foil 12. The radius of the arc line is equal to the radius of the arc-shaped edges of the positive electrode copper foil 11 and the negative electrode copper foil 12, so that the four arc-shaped edges of the positive electrode copper foil 11, the negative electrode copper foil 12, and the interval region 13 can be connected to form a circle.

[0054] In some embodiments of this application, for example, in embodiments where the orthogonal projections of the positive electrode copper foil 11, negative electrode copper foil 12, spacer region 13, positive electrode pad 14, and negative electrode pad 15 onto the surface of the reflective layer 30 form a circle, the orthogonal projection of the encapsulant 40 onto the surface of the reflective layer 30 coincides with the orthogonal projections of the corresponding positive electrode copper foil 11, negative electrode copper foil 12, spacer region 13, positive electrode pad 14, and negative electrode pad 15 onto the surface of the reflective layer 30. This projection overlap allows for quick visual inspection to determine whether the encapsulant 40 is the same size as the corresponding circular area. This not only allows for quick determination of whether the diameter of the encapsulant 40 is too large, but also quick determination of whether the diameter of the encapsulant 40 is too small.

[0055] In some embodiments of this application, see Figure 2 as well as Figure 3The positive electrode copper foil 11 and the positive electrode pad 14 are projected onto the surface of the reflective layer 30 to form a first shape, and the negative electrode copper foil 12 and the negative electrode pad 15 are projected onto the surface of the reflective layer 30 to form a second shape. The first shape and the second shape are arc-shaped, and the radii of the arc-shaped arcs of the first shape and the second shape are equal. The arc-shaped arcs of the first shape and the second shape can form a partial edge of a circle with a corresponding radius. The remaining part is formed by the arc-shaped edge of the interval area 13, which makes it easier to make the shape formed by the positive electrode copper foil 11, the negative electrode copper foil 12, the interval area 13, the positive electrode pad 14 and the negative electrode pad 15 on the surface of the reflective layer 30 circular.

[0056] It should be noted that an arc is a sector minus a triangle or a sector plus a triangle, where the two legs of the triangle are the radii of the sector. When the central angle corresponding to the arc of the first and second shapes is less than 180°, then the first and second shapes are minor arcs. When the central angle corresponding to the arc of the first and second shapes is equal to 180°, then the first and second shapes are semicircles. When the central angle corresponding to the arc of the first and second shapes is greater than 180°, then the first and second shapes are major arcs.

[0057] Understandably, the first and second shapes can also be other shapes, for example, see [reference needed]. Figure 4 , Figure 4 The diagram shows another structural schematic of the circuit board 10 in an embodiment of this application. The first shape and the second shape are rectangles, the shape corresponding to the interval 13 is a rectangle, and the shape formed by the orthogonal projection of the positive electrode copper foil 11, the negative electrode copper foil 12, the interval 13, the positive electrode pad 14 and the negative electrode pad 15 on the surface of the reflective layer 30 is a rectangle.

[0058] Furthermore, in some embodiments of this application, the central angles corresponding to the arcs of the first shape and the second shape are equal, and the central angles corresponding to the arcs of the first shape and the second shape are less than or equal to 180°. When the central angle is less than 180°, the first shape and the second shape are approximately semicircles and form a circle with the spacing area 13. When the central angle is equal to 180°, the spacing area 13 is a rectangle, the length of which is twice the radius of the arc of the first shape, and the width is small. In this case, the orthographic projections of the positive electrode copper foil 11, the negative electrode copper foil 12, the spacing area 13, the positive electrode pad 14, and the negative electrode pad 15 on the surface of the reflective layer 30 can form an approximately circular combined image, which can also quickly identify the size of the dispensing diameter.

[0059] Preferably, the central angles corresponding to the arcs of the first and second shapes are less than or equal to 180° and greater than or equal to 170°. This allows the first and second shapes to have a relatively large area ratio relative to a circle of the same diameter. This not only allows for the setting of a larger pad on the positive copper foil 11, facilitating the installation of the light-emitting diode 20 on the circuit board 10, but also enables the use of the larger positive copper foil 11 and negative copper foil 12 for heat dissipation when the lamp board is manufactured and put into use, thereby improving the overall heat dissipation performance of the lamp board.

[0060] Understandably, the sum of the central angles corresponding to the arcs of the first and second shapes can be less than or equal to 360°, but the central angles corresponding to the arcs of the first and second shapes are not equal, for example, see [reference needed]. Figure 5 , Figure 5 The diagram shows another structural schematic of the circuit board 10 in an embodiment of this application, wherein the central angle corresponding to the arc of the first shape is less than 180°, while the central angle corresponding to the arc of the second shape is greater than 180°. The sum of the central angles is less than 360°, which can also form a circle with the corresponding interval area 13.

[0061] In some embodiments of this application, such as embodiments where the central angles corresponding to the arcs of the first and second shapes described above are equal, please refer to the following: Figure 3 The positive copper foil 11 and the negative copper foil 12 are symmetrically arranged relative to the spacer area 13, so that the spacer area 13 is in a straight line shape between the positive copper foil 11 and the negative copper foil 12, which helps to reduce the difficulty of manufacturing the positive copper foil 11 and the negative copper foil 12 of the circuit board 10.

[0062] For further information, please refer to [link / reference]. Figure 3 The positive electrode pad 14 and the negative electrode pad 15 are arranged adjacent to the spacer area 13. The size of the light-emitting diode 20 only spans the spacer area 13. When the spacer area 13 is narrow, a smaller light-emitting diode 20 (such as a Mini-LED) can be installed, which is beneficial to increasing the number of light-emitting diodes 20 that can be installed on the lamp board.

[0063] In some embodiments of this application, the orthographic projections of the positive copper foil 11 and the negative copper foil 12 onto the plane of the circuit board 10 are located within the orthographic projection of the reflective layer 30 onto the plane of the circuit board 10. That is, the reflective layer 30 covers the area around the pads, so that the orthographic projections of the positive copper foil 11 and the negative copper foil 12 all fall within the orthographic projection of the reflective layer 30. Compared with the prior art, which requires reserving silver paste printing tolerances and reflective layer 30 (white oil) printing tolerances around the pads, the phenomenon of black leakage from the substrate at the edge of the pads can be avoided.

[0064] It should be noted that because this application uses positive copper foil 11 and negative copper foil 12 with sizes comparable to the encapsulating adhesive 40, it is only necessary to increase the window sizes of positive pad 14 and negative pad 15 corresponding to positive copper foil 11 and negative copper foil 12, respectively. This allows the printing tolerances of silver paste and reflective layer 30 (white oil) to be ignored, enabling reflective layer 30 to cover the area around positive pad 14 and negative pad 15 and achieving the purpose of avoiding black leakage of substrate at the edge of the pad.

[0065] Continue reading Figure 3 The circuit board 10 has a positive electrode trace 16 connecting the positive copper foil 11 and a negative electrode trace 17 connecting the negative copper foil 12. The positive electrode trace 16 is connected to the side of the positive copper foil 11 away from the negative copper foil 12, and the negative electrode trace 17 is connected to the side of the negative copper foil 12 away from the positive copper foil 11. The positive electrode trace 16 and the negative electrode trace 17 are shaped on the same copper foil when the positive copper foil 11 and the negative copper foil 12 are manufactured on the circuit board 10, and finally a driving circuit structure including the positive copper foil 11, the negative copper foil 12, the positive electrode trace 16, and the negative electrode trace 17 is formed on the circuit board 10.

[0066] Furthermore, in some embodiments of this application, see [reference]. Figure 3 The surface of the circuit board 10 is provided with a positive test pad 18 that extends to the positive electrode trace 16 and a negative test pad 19 that extends to the negative electrode trace 17. Since the positive test pad 18 and the negative test pad 19 are set separately, the difficulty of short-circuit testing of the circuit board 10 can be reduced after the circuit board 10 is manufactured. At the same time, in the subsequent lamp board preparation process, it can also serve as the basis for positioning and identification of the tin spraying and dispensing processes, avoiding the phenomenon of inaccurate positioning of the tin spraying and dispensing processes during the overall board positioning and identification due to the expansion and contraction of the board material and the tolerance of the PCB manufacturing process equipment.

[0067] It is worth noting that the above description of the light board is intended to clearly illustrate the implementation and verification process of this application. Under the guidance of this application, those skilled in the art can also make equivalent design modifications. For example, the shape formed by the orthographic projections of the positive electrode copper foil 11, negative electrode copper foil 12, spacer area 13, positive electrode pad 14, and negative electrode pad 15 onto the surface of the reflective layer 30 is a regular hexagon; or, for example, see [reference missing]. Figure 6 , Figure 6 The diagram shows another structural schematic of the lamp board in the embodiment of this application, wherein the circuit board 10 has two positive pads 14 and two negative pads 15 for the same positive copper foil 11 and negative copper foil 12, which can simultaneously dispense glue to two light-emitting diodes 20 to form encapsulating glue 40.

[0068] Furthermore, to better implement the lamp panel of this application, based on the lamp panel, this application also provides a method for preparing the lamp panel, see below.Figure 7 , Figure 7 This invention illustrates a flowchart of a lamp panel fabrication method according to an embodiment of the present application, wherein the lamp panel fabrication method includes:

[0069] Step S601: A circuit board 10 is provided. The circuit board 10 has a positive copper foil 11 and a negative copper foil 12 spaced apart inside. The surface of the circuit board 10 is provided with a positive pad 14 that penetrates to the positive copper foil 11 and a negative pad 15 that penetrates to the negative copper foil 12.

[0070] Step S602: A reflective layer 30 is formed on the side of the circuit board 10 where the light-emitting diode 20 is mounted;

[0071] Step S603: Install the light-emitting diode 20 on the circuit board 10. The light-emitting diode 20 has a positive electrode conducting part 21 and a negative electrode conducting part 22. The positive electrode conducting part 21 is connected to the positive electrode pad 14, and the negative electrode conducting part 22 is connected to the negative electrode pad 15.

[0072] In step S603, adhesive is applied to the light-emitting diode 20 to form an encapsulating adhesive 40 that encapsulates the light-emitting diode 20. The encapsulating adhesive 40 is bonded to the surface of the reflective layer 30. The orthogonal projections of the positive copper foil 11 and the negative copper foil 12 on the surface of the reflective layer 30 include a flat area 100. The area bonded by the encapsulating adhesive 40 includes the flat area 100.

[0073] This application provides a positive copper foil 11 and a negative copper foil 12 inside the circuit board 10, making the surface of the reflective layer 30 corresponding to the positive copper foil 11 and the negative copper foil 12 flat. Since the orthogonal projection of the positive copper foil 11 and the negative copper foil 12 on the surface of the reflective layer 30 includes the flat area 100, and the area where the encapsulating adhesive 40 is bonded also includes the flat area 100, it is beneficial to improve the bonding force between the adhesive and the surface of the reflective layer 30, thereby avoiding the phenomenon of the encapsulating adhesive 40 falling off due to insufficient bonding force between the encapsulating adhesive 40 and the surface of the reflective layer.

[0074] Furthermore, to better implement the lamp board in this application, based on the lamp board, this application also provides a backlight module, which includes the lamp board of any of the above embodiments. Since the backlight module includes the lamp board of any of the above embodiments, it has the beneficial effects related to the lamp board, which will not be elaborated here.

[0075] Furthermore, to better implement the lamp panel in this application, based on the lamp panel, this application also provides a display panel, which includes the backlight module of the above embodiments. Since the display panel includes the lamp panel of any of the above embodiments, it has the beneficial effects related to the lamp panel, which will not be elaborated here.

[0076] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the detailed descriptions of other embodiments above, which will not be repeated here.

[0077] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0078] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0079] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0080] The above provides a detailed description of a lamp board and its preparation method, backlight module, and display panel provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A light panel, characterized in that, include: A circuit board, wherein the circuit board has a positive copper foil and a negative copper foil arranged at intervals inside the circuit board, and the surface of the circuit board is provided with a positive pad extending to the positive copper foil and a negative pad extending to the negative copper foil; A light-emitting diode (LED) is mounted on the circuit board. The LED has a positive conductive portion and a negative conductive portion. The positive conductive portion is connected to the positive pad, and the negative conductive portion is connected to the negative pad. The LED includes a mini LED. The circuit board has a reflective layer on the side where the light-emitting diode is mounted. The light-emitting diode is wrapped with encapsulating adhesive, which is bonded to the surface of the reflective layer. The orthogonal projections of the positive and negative copper foils onto the reflective layer surface include a flat area. By setting the positive and negative copper foils inside the circuit board, the reflective layer surfaces corresponding to the positive and negative copper foils are made flat, and the area bonded by the encapsulating adhesive includes the flat area.

2. The lamp panel as described in claim 1, characterized in that, The positive electrode copper foil and the positive electrode pad are projected onto the surface of the reflective layer to form a first shape; The negative electrode copper foil and the negative electrode pad are projected onto the surface of the reflective layer to form a second shape; Wherein, the first shape and the second shape are arc-shaped, and the radii corresponding to the arcs of the first shape and the second shape are equal.

3. The lamp panel as described in claim 2, characterized in that, The central angles corresponding to the arcs of the first shape and the second shape are equal, and the central angles corresponding to the arcs of the first shape and the second shape are less than or equal to 180°.

4. The lamp panel as described in claim 2, characterized in that, The sum of the central angles corresponding to the arcs of the first shape and the second shape is less than or equal to 360°.

5. The lamp panel as described in claim 1, characterized in that, There is a gap between the positive electrode copper foil and the negative electrode copper foil; The positive electrode copper foil, the negative electrode copper foil, the spacer area, the positive electrode pad, and the negative electrode pad are arranged in a circular shape on the surface of the reflective layer. The circuit board surface is provided with a pattern corresponding to this circle so as to quickly identify whether the glue dispensing diameter exceeds the standard through the area of ​​the circle.

6. The lamp panel as described in claim 5, characterized in that, The orthographic projection of the encapsulating adhesive onto the surface of the reflective layer coincides with the orthographic projections of the corresponding positive copper foil, negative copper foil, spacer area, positive pad, and negative pad onto the surface of the reflective layer.

7. The lamp panel as described in claim 5, characterized in that, The positive and negative copper foils are arranged symmetrically with respect to the interval region.

8. The lamp panel as described in claim 7, characterized in that, The positive electrode pad and the negative electrode pad are adjacent to the spacer area.

9. The lamp panel as described in claim 1, characterized in that, The orthographic projections of the positive and negative copper foils onto the plane of the circuit board are located within the orthographic projection of the reflective layer onto the plane of the circuit board.

10. The lamp panel as described in claim 1, characterized in that, The circuit board has positive electrode traces that connect to the positive copper foil and negative electrode traces that connect to the negative copper foil. The positive electrode trace is connected to the side of the positive electrode copper foil away from the negative electrode copper foil, and the negative electrode trace is connected to the side of the negative electrode copper foil away from the positive electrode copper foil.

11. The lamp panel as described in claim 10, characterized in that, The circuit board surface is provided with a positive test pad extending to the positive electrode trace and a negative test pad extending to the negative electrode trace.

12. A method for preparing a lamp panel, characterized in that, include: A circuit board is provided, wherein the circuit board has a positive copper foil and a negative copper foil arranged at intervals inside, and the surface of the circuit board is provided with a positive pad extending to the positive copper foil and a negative pad extending to the negative copper foil; A reflective layer is formed on the side of the circuit board where the light-emitting diodes are mounted; A light-emitting diode is mounted on the circuit board. The light-emitting diode has a positive conductive part and a negative conductive part. The positive conductive part is connected to the positive pad, and the negative conductive part is connected to the negative pad. The light-emitting diode is coated with adhesive to form an encapsulating adhesive that encapsulates the light-emitting diode. The encapsulating adhesive is bonded to the surface of the reflective layer to obtain a lamp board as described in any one of claims 1 to 11. The orthogonal projections of the positive and negative copper foils on the surface of the reflective layer include a flat area, and the area bonded by the encapsulating adhesive includes the flat area.

13. A backlight module, characterized in that, Includes the lamp panel as described in any one of claims 1 to 11.

14. A display panel, characterized in that, Including the backlight module as described in claim 13.

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