Backlight module and display device

Abstract

The embodiment of the present disclosure provides a backlight module and a display device. The backlight module comprises a back plate, a buffer connecting layer, a circuit board and a support layer which are sequentially stacked, wherein the buffer connecting layer comprises a plurality of buffer connecting members, the support layer comprises a plurality of first support structures, each first support structure corresponds to one buffer connecting member, and the orthographic projection of the first support structure on the circuit board at least partially overlaps with the orthographic projection of the corresponding buffer connecting member on the circuit board.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, specifically to a backlight module and a display device. Background Technology

[0002] As people's requirements for display effects of display products have increased, Mini LED backlight technology has emerged. Mini LED backlight technology uses tens of thousands of ultra-small LEDs to make the dimming zones more detailed, with higher contrast, while shortening the light mixing distance (OD) and reducing the overall thickness of the device.

[0003] Mini LED backlighting technology uses a glass substrate to form the light-emitting substrate. Compared with the PCB substrate that provides driving signals, the advantages of glass-based light-emitting substrates are becoming increasingly apparent. For example, they can eliminate high-frequency flicker in the screen by using active driving; reduce the number of panels in large-size display environments and reduce the gaps and color differences between panels; and the glass-based light board has high flatness, making it easy to bond the chips and reducing the risk of chip detachment.

[0004] At the same time, the defects of glass-based light-emitting substrates also become apparent. Because glass is relatively more fragile, when the light-emitting substrate is subjected to external stress, the impact force on the supporting structure exceeds the strength limit of the glass itself after being transmitted to the light-emitting substrate, ultimately causing the light-emitting substrate to crack. Summary of the Invention

[0005] This disclosure provides a backlight module and a display device.

[0006] In a first aspect, embodiments of this disclosure provide a backlight module, comprising: a backplate, a buffer connection layer, a circuit board, and a support layer stacked sequentially, wherein the buffer connection layer includes a plurality of buffer connectors, and the support layer includes a plurality of first support structures.

[0007] Each of the first support structures corresponds to one of the buffer connectors, and the orthographic projection of the first support structure on the circuit board at least partially overlaps with the orthographic projection of its corresponding buffer connector on the circuit board.

[0008] In some embodiments, the orthographic projection of the first support structure on the circuit board is located within the area of ​​the orthographic projection of the corresponding buffer connector on the circuit board.

[0009] In some embodiments, the first support structure is conical.

[0010] On the first cross section of the backlight module, the distance between the edge of the first support structure and the edge of the corresponding buffer connector on the same side in the first direction is at least 1.5 mm. The first cross section is a cross section passing through the axis of the first support structure and parallel to the thickness direction of the circuit board. The first direction is a direction on the first cross section that is perpendicular to the thickness direction of the circuit board.

[0011] In some embodiments, the backplate has at least one protruding structure that protrudes away from the circuit board, and the buffer connector covers the opening of the groove formed by the protruding structure.

[0012] The backlight module further includes a filling structure located on the side of the protruding structure facing the buffer connector, and having a gap between it and the buffer connector.

[0013] In some embodiments, the filling structure has a first surface facing the circuit board, the back plate has a second surface facing the circuit board, and the second surface is an extension of the opening of the groove formed by the protrusion structure.

[0014] The distance between the first surface and the second surface in the thickness direction of the circuit board is 0.2 mm to 0.3 mm.

[0015] In some embodiments, the Shore hardness of the filling structure is 120A to 150A.

[0016] In some embodiments, the backplane has at least one protruding structure that protrudes in a direction away from the circuit board.

[0017] The backlight module further includes a second support structure, the orthographic projection of the second support structure on the circuit board being located within the area of ​​the orthographic projection of the protrusion structure on the circuit board, and the Shore hardness of the second support structure being less than the Shore hardness of the first support structure.

[0018] In some embodiments, the Shore hardness of the second support structure is 90A to 110A.

[0019] In some embodiments, the material of the second support structure is selected from silicone or thermoplastic rubber.

[0020] In some embodiments, the material of the cushioning connector includes easy-pull adhesive.

[0021] In some embodiments, the thickness of the buffer connector is 0.5 mm to 0.7 mm.

[0022] In some embodiments, the material of the first support structure includes polycarbonate.

[0023] Secondly, embodiments of this disclosure provide a display device including the backlight module described in the first aspect.

[0024] In this embodiment, the backplane and the light-emitting substrate / circuit board are connected by multiple buffer connectors. Multiple first support structures are distributed on the circuit board at locations corresponding to the buffer connectors, reducing the impact force on the circuit board. Specifically, the orthographic projection of the first support structure on the drive plane at least partially overlaps with the orthographic projection of its corresponding buffer connector on the circuit board. This scheme, combining the distribution of the first support structures with the buffer connectors, can reduce stress damage and reinforce the circuit board when the backlight module is subjected to external stress, thanks to the buffering performance of the buffer connectors. This effectively improves the situation where the first support structure transmits the decomposed external force to the circuit board beyond its own strength limit, reducing the risk of the circuit board breaking due to instantaneous impact and improving product yield and reliability. Attached Figure Description

[0025] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0026] Figure 1 This is a schematic diagram of the structure of a liquid crystal display device provided in related technologies.

[0027] Figure 2 This is a partial structural diagram of a backlight module provided in related technologies.

[0028] Figure 3 This is a schematic diagram of the structure of a backlight module provided in an embodiment of the present disclosure.

[0029] Figure 4 This is a schematic diagram illustrating the relationship between the distance between the easy-open adhesive and the supporting structure and the maximum stress on the circuit board, as provided in related technologies.

[0030] Figure 5a This is a simulation diagram of the stress on a circuit board provided in related technologies.

[0031] Figure 5b This is a simulation diagram illustrating another type of stress experienced on a circuit board, as provided in related technologies.

[0032] Figure 5c This is a simulation diagram illustrating the stress experienced on another type of circuit board, as provided in related technologies.

[0033] Figure 6 This is a schematic diagram of another backlight module provided in an embodiment of the present disclosure.

[0034] Figure 7 This is a schematic diagram of another backlight module provided in an embodiment of the present disclosure.

[0035] Explanation of reference numerals in the attached figures:

[0036] Backlight module 100: back plate 10, buffer connection layer 20, circuit board 30, support layer S0; light-emitting substrate E, light-emitting element e, optical film group 40;

[0037] Back panel 10: raised structure 101, filling structure 102, bottom wall 11, side wall 12;

[0038] Buffer connection layer 20: Buffer connector 2;

[0039] Support layer S0: First support structure S1, second support structure S2;

[0040] Display panel 200, and supporting structure S' in related technologies. Detailed Implementation

[0041] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0043] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0044] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0045] Figure 1 This is a schematic diagram of the structure of a liquid crystal display device provided in related technologies, such as... Figure 1 As shown, the liquid crystal display device includes a display panel 200 and a backlight module 100. The backlight module 100 provides a light source for the liquid crystal display panel 200. Figure 1 As shown, the backlight module 100 includes a backplate 10, a light-emitting substrate E, and an optical film assembly 40. The backplate 10 includes a bottom wall 11 and a side wall 12 connected to the bottom wall 11, the bottom wall 11 and the side wall 12 defining an accommodating space Sp.

[0046] The light-emitting substrate E and the optical film assembly 40 are disposed in the receiving space Sp. The light-emitting substrate E is disposed on the bottom wall 11 of the back plate 10 and includes: a circuit board 30, a light-emitting element e disposed on the circuit board 30, and a support structure S'. The circuit board 30 can be made of materials such as glass, quartz, plastic, polyimide, or FR4. The light-emitting element e can be an inorganic light-emitting diode with a size on the order of hundreds of micrometers. The support structure S' supports the optical film assembly 40, thereby achieving a certain light mixing distance (OD) and reducing the lamp shadow caused by the spacing of adjacent light-emitting elements e.

[0047] like Figure 1 As shown, in order to improve the mechanical strength of the backplate 10, the bottom wall 11 of the backplate 10 is provided with multiple protrusions 101. The protrusions 101 protrude in a direction away from the receiving space. Therefore, at the position corresponding to the protrusions 101, a gap is formed between the circuit board 30 and the bottom wall 11 of the backplate 10.

[0048] Figure 2 This is a partial structural diagram of a backlight module provided in related technologies, such as... Figure 2 As shown, the backplate 10 and the circuit board 30 are typically bonded together using multiple adhesive strips 20. To prevent the adhesive strips from breaking when removed, their thickness is generally above 0.5mm. Correspondingly, in areas where no adhesive strips are used... Figure 2In area A, a gap will be formed between the circuit board 30 and the bottom wall of the backplate 10.

[0049] In both of the above scenarios, due to the numerous support structures S' on the circuit board 30, some of these structures inevitably end up directly opposite the gaps. Some products use support structures S' made of harder materials; for example, if the support structures S' are made of PC (polycarbonate, Shore hardness around 100D), when the display device is subjected to impact during drop testing or transportation, the instantaneous impact force will act on the support structures S' through the optical film assembly 40 and then be transmitted to the circuit board 30, easily causing damage to the circuit board 30. The risk of damage is even greater when the circuit board 30 is made of glass.

[0050] To solve at least one of the above-mentioned technical problems, this disclosure provides a backlight module in which the buffer connector and the first support structure are disposed on opposite sides of the circuit board, so that when subjected to external impact, the buffer connector absorbs stress, reduces the force acting on the circuit board, and avoids the circuit board from breaking.

[0051] Figure 3 This is a schematic diagram of the structure of a backlight module provided in an embodiment of the present disclosure, as shown below. Figure 3 As shown, the backlight module includes: a backplate 10 and a light-emitting substrate E located on one side of the backplate 10, wherein the light-emitting substrate E includes a circuit board 30 and a support layer S0 stacked sequentially along a direction away from the backplate 10; it also includes: a buffer connection layer 20 located between the backplate 10 and the light-emitting substrate E, the buffer connection layer 20 including a plurality of buffer connectors 2, and the support layer S0 including a plurality of first support structures S1. Each first support structure S1 corresponds to one buffer connector 2, and the orthographic projection of the first support structure S1 on the circuit board 30 at least partially overlaps with the orthographic projection of its corresponding buffer connector 2 on the circuit board 30.

[0052] In this embodiment, the backplate 10 and the light-emitting substrate E / circuit board 30 are connected by multiple buffer connectors 2. Multiple first support structures S1 are distributed on the circuit board 30 at positions corresponding to the buffer connectors 2, which reduces the impact force on the circuit board 30. Specifically, the orthographic projection of the first support structure S1 on the drive surface and the orthographic projection of its corresponding buffer connector 2 on the circuit board 30 at least partially overlap. This scheme, combining the distribution of the first support structures S1 with the buffer connectors 2, can reduce stress damage and reinforce the circuit board 30 when the backlight module is subjected to external stress, thanks to the buffering performance of the buffer connectors 2. This effectively improves the phenomenon where the first support structure S1 transmits the decomposed external force to the circuit board 30 beyond its own strength limit, reducing the risk of the circuit board 30 breaking due to instantaneous impact, and improving product yield and product reliability.

[0053] In some embodiments, the material of the buffer connector 2 includes easy-pull adhesive, which has a certain degree of stickiness and can firmly connect the back plate 10 and the circuit board 30. At the same time, in order to facilitate separation and easy tearing, the easy-pull adhesive should not be too thin, and its thickness is set to 0.5mm to 0.7mm.

[0054] In some embodiments, the buffer connector 2 may be cylindrical or cuboid. The shape of its surface in contact with the circuit board 30 is not limited in this embodiment.

[0055] Figure 4 This is a schematic diagram illustrating the relationship between the distance between the easy-open adhesive and the supporting structure and the maximum stress on the circuit board, as provided in related technologies. Figure 5a This is a simulation diagram illustrating the stress experienced by a circuit board, as provided in related technologies. Figure 5b This is a simulation diagram illustrating another type of stress experienced on a circuit board, as provided in related technologies. Figure 5c This is a simulation diagram illustrating the stress experienced on another type of circuit board, as provided in related technologies. It should also be noted that... Figure 4 The maximum stress on the circuit board 30 represented in the figure is the stress on the circuit board 30 corresponding to the location of the supporting structure. Figure 5a The stress distribution diagram shown on the circuit board 30 is obtained from a simulation test when the distance L1 between the easy-pull adhesive 2 and the supporting structure S' is 25mm. Figure 5b The stress distribution diagram shown on the circuit board 30 is obtained from a simulation test when the distance L2 between the easy-pull adhesive 2 and the supporting structure S' is 50mm. Figure 5c The schematic diagram showing the stress distribution on the circuit board 30 is obtained through simulation testing with the easy-pull adhesive 2 and the support structure S' positioned opposite each other on both sides of the circuit board 30, i.e., the support structure S' is located above the easy-pull adhesive 2. Figure 5a , 5b As shown in Figure 5c, different colors correspond to different stress values ​​in different areas of the circuit board 30. The minimum stress is represented by the blue area, which can be ignored, and the maximum stress is represented by the red area. The coordinates in the figure represent the dimensions between the supporting structure S' and the easily removable adhesive 2, which is closest to it.

[0056] In one example, the support structure is conical with a base diameter of 4 mm. An external force of 300 N is applied to the top of the support structure S'. At this time, as... Figure 5a As shown, when the distance L1 between the easy-open adhesive 2 and the supporting structure S' is 25mm, the maximum stress that the circuit board 30 can withstand is measured to be 517.86MPa; Figure 5bAs shown, when the distance L2 between the easy-pull adhesive 2 and the supporting structure S' is 50mm, the maximum stress on the circuit board 30 can be measured to be 172.06Mpa.

[0057] Combination Figure 4 It can be seen that, under the same external force applied to the supporting structure, different distances between the easy-open adhesive 2 and the supporting structure S' result in different stress magnitudes, i.e., stress distribution ranges, transmitted from the supporting structure S' to the circuit board 30. Specifically, when the projections of the easy-open adhesive 2 and the supporting structure S' on the circuit board 30 do not overlap, the greater the distance between them, the smaller the maximum stress borne by the circuit board 30. However, if... Figure 5a , Figure 5b As shown, although the maximum stress value on the circuit board 30 decreases as the distance between the easy-open adhesive 2 and the supporting structure S' increases, the range of stress affecting the circuit board 30 increases. The above measurements were taken when the supporting structure S' of the same shape was subjected to stress in the same direction and of the same magnitude, measuring the stress on the circuit board 30.

[0058] like Figure 5c As shown, when the support structure S' is located above the easy-open adhesive, the maximum stress on the circuit board 30 is 66.915 MPa, and the stress range is very small, with stress only existing in the area where the support structure S' contacts the circuit board 30.

[0059] Based on the above analysis, it can be seen that when the support structure S' is positioned above the easy-open adhesive, the stress borne by the circuit board 30 is relatively small, and the stress range is also small. Therefore, in some embodiments, the orthographic projection of the first support structure S1 onto the circuit board 30 is located within the area of ​​the orthographic projection of its corresponding buffer connector 2 onto the circuit board 30.

[0060] It should be understood that, in this embodiment of the present disclosure, the first support structure S1, and... Figures 4-5c Compared to the support structure S' used in the experimental measurements, the two are identical in shape, size, and material.

[0061] In some embodiments, the first support structure S1 is conical and made of PC material.

[0062] In some embodiments, such as Figure 3 As shown, on the first cross section of the backlight module, the distance d between the edge of the first support structure S1 and the edge of the corresponding buffer connector 2 on the same side in the first direction is at least 1.5 mm. The first cross section is a cross section passing through the axis of the first support structure S1 and parallel to the thickness direction of the circuit board 30. The first direction is the direction on the first cross section that is perpendicular to the thickness direction of the circuit board 30.

[0063] As can be seen from the above analysis, the buffer connector 2 is an easy-pull adhesive with a certain thickness. Those skilled in the art have found that when the support structure receives external stress and transmits the stress to the circuit board 30, there will also be a large stress at the edge of the circuit board 30 corresponding to the easy-pull adhesive. Therefore, the distance between the edge of the first support structure S1 and the edge of its corresponding buffer structure is not less than 1.5mm to prevent the circuit board 30 from cracking due to the large stress caused by the step difference generated at the edge of the buffer connector 2.

[0064] Figure 6 This is a schematic diagram of another backlight module provided in an embodiment of the present disclosure, as shown below. Figure 6 As shown, to improve the mechanical strength of the backplate 10, the backplate 10 is provided with at least one protruding structure 101, which protrudes in a direction away from the circuit board 30. In this case, when the first support structure S1 is located above the opening, even though a buffer connector 2 is provided between the circuit board 30 and the protruding structure 101 of the backplate 10, a gap still forms between the protruding structure 101 and the circuit board 30. At this time, the risk of the circuit board 30 breaking can be avoided by filling the protruding structure 101 with a rigid structure.

[0065] like Figure 6 As shown, the backlight module also includes a filling structure 102 located on the side of the protruding structure 101 facing the buffer connector 2, and having a gap between it and the buffer connector 2. The filling structure 102 fills the groove formed by the protruding structure 101, but has a certain gap between it and the buffer connector 2 covering the opening of the groove, thereby providing deformation space when the buffer connector 2 absorbs stress.

[0066] Furthermore, such as Figure 6 As shown, the filling structure 102 has a first surface facing the circuit board 30, the back plate 10 has a second surface facing the circuit board 30, and the second surface is an extension surface of the opening of the protrusion structure 101. The distance h between the first surface and the second surface in the thickness direction of the circuit board 30 is 0.2 mm to 0.3 mm.

[0067] In other words, under natural conditions, the spacing h between the filling structure 102 and its corresponding buffer connector 2 in the thickness direction of the circuit board 30 is 0.2mm to 0.3mm. Thus, after the first support structure S1 is subjected to an external force impact and the force is transmitted to the circuit board 30, the buffer connector 2 absorbs the stress, while the filling structure 102 provides support for the buffer connector 2 to prevent damage to the circuit board 30.

[0068] In some embodiments, the Shore hardness of the filling structure 102 is 120A to 150A to provide support to the buffer connector 2 and prevent the circuit board 30 from being damaged by force due to the back plate 10 being suspended.

[0069] It should be understood that Shore hardness refers to the reading obtained using a Shore hardness tester, and its unit is "degrees." It is described using two methods, A and D, each representing a different hardness range. Generally, products that feel relatively elastic or soft are tested using a Shore A hardness tester, while those that feel harder can be tested using a Shore D hardness tester.

[0070] Figure 7 This is a schematic diagram of another backlight module provided in an embodiment of the present disclosure. In the case where at least one protrusion structure 101 is provided on the back plate 10, the present disclosure also provides another embodiment, which avoids the phenomenon that the circuit board 30 will break under stress impact due to the back plate 10 being suspended due to the protrusion.

[0071] In some embodiments, the backlight module further includes a second support structure S2, the orthographic projection of the second support structure S2 on the circuit board 30 being located in the region of the orthographic projection of the protrusion structure 101 on the circuit board 30, and the Shore hardness of the second support structure S2 being less than the Shore hardness of the first support structure S1.

[0072] Because the second support structure S2 has a low Shore hardness and is made of a softer material, it can deform to a certain extent after the backlight module is impacted, thus acting as a buffer and reducing the risk of the circuit board 30 breaking due to instantaneous impact. Furthermore, since the second support structure S2 is made of a soft material, there is no need to install a corresponding buffer connector 2 on the other side of the circuit board 30 corresponding to the position of the second support structure S2; the second support structure S2 itself can effectively buffer external stress.

[0073] In some embodiments, the Shore hardness of the second support structure S2 is 90A to 110A, which enables the second support structure S2 to both provide a certain buffering effect and a good support effect.

[0074] In some embodiments, the material of the second support structure S2 is selected from silicone or thermoplastic rubber.

[0075] It should be understood that, for ease of manufacturing, both the first support structure S1 and the second support structure S2 are integrally injection molded.

[0076] In addition, it should be noted that the heights of the first support structure S1 and the second support structure S2 can be flexibly set according to the target light mixing distance.

[0077] Specifically, both the first support structure S1 and the second support structure S2 serve to support the optical film assembly 40 in the backlight module, thereby forming a certain light mixing distance. The first support structure S1 is made of a relatively hard material, so its height in its natural state can be equal to the light mixing distance. The second support structure S2, however, is made of a soft material. Therefore, to ensure that the second support structure S2 can still provide sufficient light mixing distance under the pressure of the optical film assembly 40, its height in its natural state should be greater than or equal to the target light mixing distance. The light mixing distance is the distance between the optical film assembly 40 and the circuit board 30. When the distance between the optical film assembly 40 and the circuit board 30 is equal to the target light mixing distance, the light beams of adjacent light-emitting elements e can be fully mixed, thereby reducing or preventing the shadows caused by the spacing of adjacent light-emitting elements e.

[0078] In summary, in this embodiment, the circuit board 30 and the backplate 10 are bonded together using a buffer connector 2, i.e., an adhesive strip. Based on the material properties and thickness of the adhesive strip, it provides a certain buffering effect. Furthermore, combining the distribution positions of the first support structure S1 and the adhesive strip allows the adhesive strip's buffering properties to absorb the stress transmitted from the first support structure S1 to the circuit board 30, thereby preventing external impacts from exceeding the circuit board 30's strength and causing it to crack.

[0079] Furthermore, when the backplate 10 has a raised structure 101, by adding a filling structure 102 in the groove formed by the raised structure 101, after the first support structure S1 is impacted by an external force and transmitted to the circuit board 30, the buffer connector 2 absorbs the stress, while the filling structure 102 provides support for the buffer connector 2 to prevent damage to the circuit board 30. Alternatively, a second support structure S2 made of soft material can be used. After the backlight module is impacted, the deformation of the second support structure S2 itself acts as a buffer, thereby reducing the risk of the circuit board 30 breaking due to instantaneous impact.

[0080] Based on the same inventive concept, this disclosure also provides a display device including the aforementioned backlight module.

[0081] The aforementioned display device can be any product or component with display function, such as electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator, and this disclosure does not limit it.

[0082] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A backlight module, characterized in that, include: The backplate, buffer connection layer, circuit board, and support layer are stacked sequentially, wherein the buffer connection layer includes multiple buffer connectors, and the support layer includes multiple first support structures. Each of the first support structures corresponds to one of the buffer connectors, and the orthographic projection of the first support structure on the circuit board and the orthographic projection of its corresponding buffer connector on the circuit board at least partially overlap; the buffer connector includes an easy-pull adhesive. The backplate has at least one protruding structure that protrudes away from the circuit board, and the buffer connector covers the opening of the groove formed by the protruding structure. The backlight module further includes: a filling structure located on the side of the protruding structure facing the buffer connector, and having a gap between it and the buffer connector; the spacing between the filling structure and the corresponding buffer connector in the thickness direction of the circuit board is 0.2mm~0.3mm; the Shore hardness of the filling structure is 120A~150A.

2. The backlight module according to claim 1, characterized in that, The orthographic projection of the first support structure on the circuit board is located within the area of ​​the orthographic projection of the corresponding buffer connector on the circuit board.

3. The backlight module according to claim 1, characterized in that, The first support structure is conical in shape. On the first cross section of the backlight module, the distance between the edge of the first support structure and the edge of the corresponding buffer connector on the same side in the first direction is at least 1.5 mm. The first cross section is a cross section passing through the axis of the first support structure and parallel to the thickness direction of the circuit board. The first direction is a direction on the first cross section that is perpendicular to the thickness direction of the circuit board.

4. The backlight module according to claim 1, characterized in that, The backlight module further includes a second support structure, the orthographic projection of the second support structure on the circuit board being located within the area of ​​the orthographic projection of the protrusion structure on the circuit board, and the Shore hardness of the second support structure being less than the Shore hardness of the first support structure.

5. The backlight module according to claim 4, characterized in that, The Shore hardness of the second support structure is 90A~110A.

6. The backlight module according to claim 4, characterized in that, The material of the second support structure is selected from silicone or thermoplastic rubber.

7. The backlight module according to claim 1, characterized in that, The thickness of the buffer connector is 0.5mm to 0.7mm.

8. The backlight module according to claim 1, characterized in that, The material of the first support structure includes polycarbonate.

9. A display device, characterized in that, Includes the backlight module as described in any one of claims 1-8.

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