Independent Scheduling Method for Process Chambers

Abstract

The present invention discloses a method for independent scheduling of process chambers, including: scanning a wafer box on a map to obtain the number of wafers in the wafer box, the transmission route of each wafer, and the process task; obtaining the process chamber to be entered by each wafer according to the wafer transmission route and the process task, and then sending the wafer ID and the process task to the scheduling of the corresponding process chamber in sequence; forming a task pool through the scheduling of the process chamber; each process chamber prepares corresponding execution conditions in advance according to the process task; comparing the process task carried by the current wafer with the current process task of the process chamber task pool, if they are the same, allowing the current wafer to enter the process chamber; after multiple wafers entering the process chamber have completed the execution of the same process task, the process task is deleted from the task pool, and the process chamber prepares corresponding execution conditions in advance for the next task. In this method, the process chamber prepares the relevant execution conditions of the process in advance, and has a verification function.

Description

Technical Field

[0001] The present invention relates to the field of wafer transmission technology, and in particular to a method for independent scheduling of process chambers. Background Art

[0002] The existing wafer scheduling logic performs a map search and matching operation when the wafer box is opened, which can determine how many wafers are in the wafer box, as well as the transmission route and process of each wafer. Therefore, when the atmospheric robot takes out the wafer from the wafer box, it determines whether to put it into the upper LoadLock or the lower LoadLock according to the wafer transmission route and process. Then when the vacuum robot takes the wafer from the upper LoadLock or the lower LoadLock, it first reads the information carried on the wafer to determine which process chamber to transmit it to. Only when it enters the corresponding process chamber to read the wafer information can it know the specific process. Therefore, the process chamber is delayed in obtaining the information carried by the wafer, and cannot verify whether the current wafer is the wafer to be run in this process, nor can it prepare the relevant execution conditions of the corresponding process in advance, resulting in low work efficiency. Summary of the invention

[0003] The purpose of the present invention is to propose a method for independent scheduling of process chambers, wherein the process chamber can know in advance the process being executed by the current wafer, can prepare the relevant execution conditions of the process in advance, and if the current wafer does not conform to the corresponding execution process, can immediately perform the wafer ejection operation, and has a verification function.

[0004] To achieve the above objectives, the process chamber independent scheduling method proposed in this application includes:

[0005] Scan the wafer box on a map to obtain the number of wafers in the wafer box, the transmission route of each wafer, and the process task;

[0006] According to the wafer transmission route and process tasks, the process chamber that each wafer is to enter is obtained, and then the wafer ID and process tasks are sent to the scheduling of the corresponding process chamber in sequence;

[0007] A task pool is formed through the scheduling of the process chamber, and the process tasks of the process chamber are obtained based on the task pool;

[0008] Each process chamber prepares corresponding execution conditions in advance according to the process task;

[0009] Compare the process task carried by the current wafer with the current process task in the process chamber task pool. If they are the same, the current wafer is allowed to enter the process chamber; if they are different, an alarm is issued;

[0010] After multiple wafers entering the process chamber complete the same process task, the process task is deleted from the task pool, and the process chamber prepares the corresponding execution conditions for the next task in advance.

[0011] Preferably, the process chamber is provided with 4 stations, and the process task is a 2×2station operation mode or a 4×1station operation mode.

[0012] In a preferred manner, the execution conditions are that the lifting structure can be lifted and lowered normally and the lifting and rotating carrier can work normally. If the lifting structure or the lifting and rotating carrier fails, an alarm will be directly issued. If the lifting structure or the lifting and rotating carrier has no faults, the process chamber will be preheated, and when the preheating is about to be completed, it will be ready to receive the wafer entering the process chamber. At this time, the lifting structure is in a dropped state and the chamber pressure is able to transmit the wafer.

[0013] In the preferred mode, the corresponding execution conditions are prepared in advance. At the same time, the atmospheric robot takes the wafer from the wafer box and sends it into the LoadLock. Then the vacuum robot takes the wafer from the LoadLock and prepares to send it to the corresponding process chamber. Before sending it in, the process task carried by the current wafer is compared with the current process task in the process chamber task pool.

[0014] In a preferred manner, if the process task carried by the current wafer is the same as the current process task of the process chamber task pool, the vacuum robot arm enters through a door or a double door structure of the process chamber. At this time, the lifting structure rises to support the wafer, and then the vacuum robot arm exits the lifting structure and falls, so that the wafer is located on the heater and the door is closed.

[0015] In the preferred manner, if the process task is a 2×2station operation mode, the specific implementation method is as follows: wafer No. 1 and wafer No. 2 are directly deposited for the first time after being placed on the heater. After the first deposition is completed, the lifting and rotating carrier rises, lifts up the wafers, rotates them 180° clockwise, and then descends. Wafer No. 1 and wafer No. 2 are placed on the new heater; the vacuum robot arm sends wafer No. 3 and wafer No. 4 into the process chamber and places them on the original heater. At this time, wafer No. 1 and wafer No. 2 are deposited for the second time, and wafer No. 3 and wafer No. 4 are deposited for the first time. After deposition, the lifting and rotating carrier rises, lifts up the wafers, rotates them 180° clockwise, and then descends. Then the vacuum robot arm takes out wafer No. 1 and wafer No. 2, and puts in wafer No. 5 and wafer No. 6 for deposition, and the cycle continues.

[0016] In the preferred mode, if the process task is a 4×1station operation mode, the specific implementation method is as follows: wafer No. 1 and wafer No. 2 are placed on the heater, the lifting and rotating carrier rises, holds up the wafers and rotates them 180° clockwise and then descends, and wafer No. 1 and wafer No. 2 are placed on the new heater; the vacuum robot arm sends wafer No. 3 and wafer No. 4 into the process chamber and places them on the original heater. At this time, all four wafers undergo the first deposition. After the first deposition is completed, the vacuum robot arm takes out wafer No. 3 and wafer No. 4, and puts in wafer No. 5 and wafer No. 6. The lifting and rotating carrier rises, holds up the wafers and rotates them 180° clockwise and then descends, and the vacuum robot arm takes out wafer No. 1 and wafer No. 2 and puts in wafer No. 7 and wafer No. 8, and the cycle continues.

[0017] In a preferred embodiment, the lifting structure includes: a pin component and a driving component; the pin component is located in the reaction chamber, and the driving component can drive the pin component to rise and fall; the driving component includes: a mounting shell, a servo motor, a coupling, a nut, a lead screw and a push rod assembly; the mounting shell is a vertical hollow cavity with openings at both ends, and the mounting shell is vertically fixed below the reaction chamber; the servo motor is vertically fixed at the lower end of the mounting shell, and the coupling, the lead screw and the nut are all arranged in the mounting shell, and the servo motor drives the lead screw to rotate synchronously through the coupling, the lead screw is vertically arranged at the axial position of the mounting shell, and the lead screw and the nut are spirally transmitted; the nut is connected to the push rod assembly, and the push rod assembly penetrates into the reaction chamber from the bottom and is connected to the pin component, the nut drives the push rod assembly to move vertically, and the push rod assembly drives the pin component to move vertically.

[0018] In a preferred embodiment, the push rod assembly includes: a push rod seat and a push rod; the push rod seat is a hollow cavity with an opening at the lower end, the lower end of the push rod seat is fixedly connected to the nut, the lead screw extends into the cavity of the push rod seat, and the push rod seat moves vertically with the nut; the push rod and the lead screw are coaxially arranged, one end of the push rod is fixedly connected to the upper end of the push rod seat, and the other end is fixedly connected to the ejector pin component after passing through the reaction chamber.

[0019] In a preferred embodiment, the driving component further includes a guide assembly; the guide assembly is disposed between the push rod seat and the inner wall of the mounting shell, and the guide assembly performs vertical guidance and radial limitation on the push rod assembly.

[0020] In a preferred embodiment, the guide assembly includes: a guide rail and a slider; the guide rail is fixed on the inner wall of the mounting shell, and the length direction of the guide rail is vertically arranged; the slider is arranged on the guide rail and slides along the guide rail, and the slider is fixedly connected to the push rod seat.

[0021] Compared with the prior art, the above technical solution adopted by the present invention has the following advantages:

[0022] 1. The process chamber can predict the next process task in advance and prepare the corresponding execution conditions in advance. There is no need to wait until the wafer enters the process chamber to prepare the execution conditions, which greatly improves work efficiency and saves time;

[0023] 2. When the wafer is transferred to the process chamber, the information carried by the wafer can be compared with the task information of the process chamber task pool to play a verification role;

[0024] 3. The lifting structure arranges the coupling, nut and lead screw in the mounting housing, and connects the push rod assembly and the nut in the mounting housing, making full use of the space in the mounting housing, enhancing the compactness of the driving components, reducing the space occupied by the driving components, and reducing the volume of the lifting structure, which can meet the volume requirements of the handling equipment for the control equipment. The lifting structure arranges the servo motor, lead screw and push rod coaxially, so that the force is transmitted along the axial direction, which is conducive to improving the accuracy of the vertical movement of the ejector pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A structural diagram of a process chamber independent scheduling method;

[0027] Figure 2 This is the principle diagram of 2×2station operation mode;

[0028] Figure 3 This is the schematic diagram of the 4×1station operation mode;

[0029] Figure 4 It is a structural schematic diagram of the lifting structure;

[0030] Figure 5 is a cross-sectional view of the lifting structure;

[0031] Figure 6 It is a structural schematic diagram of the ejector component of the lifting structure;

[0032] Figure 7 A top view of the ejector pin component of the lifting structure;

[0033] Figure 8 for Figure 7 AA section view in;

[0034] Fig. 9 for Figure 8A partial enlarged view of middle Ⅱ;

[0035] Fig.10 for Figure 6 A partial enlarged view of part Ⅰ.

[0036] 1. ejector component; 11. ejector assembly; 111. ejector; 112. ejector mounting seat; 1121. horn section; 1122. cylindrical section; 113. connecting seat; 1131. cylindrical section; 1132. circular ring section; 12. mounting ring; 121. rounded rectangular groove; 122. U-shaped pressure ring;

[0037] 2. Driving component; 21. Mounting housing; 22. Servo motor; 23. Coupling; 24. Nut; 241. Positioning stage; 242. Connecting section; 25. Lead screw; 26. Push rod assembly; 261. Push rod seat; 262. Push rod; 27. Guide assembly; 271. Guide rail; 272. Slider. Specific implementation methods

[0038] The principles of the present disclosure will be described below with reference to several example embodiments shown in the accompanying drawings. Although preferred embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that these embodiments are described only to enable those skilled in the art to better understand and implement the present disclosure, and are not intended to limit the scope of the present disclosure in any way.

[0039] As used herein, the term "including" and its variations mean open inclusion, i.e., "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "based at least in part on". The terms "an example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment".

[0040] Example 1

[0041] like Figure 1 As shown, this embodiment provides a method for independent scheduling of process chambers, including:

[0042] S1. Scan the wafer box on a map to obtain the number of wafers in the wafer box, the transmission route of each wafer, and the process task;

[0043] Specifically, a wafer box will be loaded on the outermost loading station, and a map search operation will be performed on the wafer box to obtain the number of wafers, the transmission route and task of each wafer.

[0044] S2. Obtain the process chamber that each wafer is to enter according to the wafer transmission route and process task, and then send the wafer ID and process task to the scheduling of the corresponding process chamber in sequence;

[0045] Specifically, in the entire scheduling, each part is separated out, instead of waiting to read the information carried by the wafer, the process chamber to be entered is obtained by analyzing the wafer transmission route and process tasks, so that the process chamber can know the task information in advance.

[0046] S3. Forming a task pool through the scheduling of the process chamber, and obtaining the process tasks of the process chamber based on the task pool;

[0047] Specifically, the task pool corresponding to each process chamber puts the tasks into a queue, and then the process chamber executes the process according to this queue each time.

[0048] S4. Each process chamber prepares corresponding execution conditions in advance according to the process task;

[0049] In an example embodiment, the execution condition is that the lifting structure can be lifted normally and the lifting and rotating carrier can work normally. If the lifting structure or the lifting and rotating carrier fails, an alarm is directly issued; if the lifting structure or the lifting and rotating carrier is not faulty, the process chamber is preheated, and when the preheating is about to be completed, it is ready to receive the wafer entering the process chamber. At this time, the lifting structure is in a falling state and the chamber pressure is able to transmit the wafer;

[0050] S5. Compare the process task carried by the current wafer with the current process task in the process chamber task pool. If they are the same, allow the current wafer to enter the process chamber; if they are different, issue an alarm;

[0051] In an example embodiment, while the corresponding execution conditions are prepared in advance, the atmospheric robot arm takes the wafer from the wafer box and sends it into the LoadLock, and then the vacuum robot arm takes the wafer from the LoadLock and prepares to send it to the corresponding process chamber; before sending it in, the process task carried by the current wafer is compared with the current process task in the process chamber task pool.

[0052] In another embodiment, if the process task carried by the current wafer is the same as the current process task of the process chamber task pool, the vacuum robot arm enters through a door or a double door structure of the process chamber. At this time, the lifting structure rises to support the wafer, and then the vacuum robot arm exits the lifting structure and falls, so that the wafer is located on the heater and the door is closed.

[0053] S6. After multiple wafers entering the process chamber complete the same process task, the process task is deleted from the task pool, and the process chamber prepares corresponding execution conditions for the next task in advance.

[0054] In an exemplary embodiment, the process task is a 2×2 station operation mode or a 4×1 station operation mode.

[0055] like Figure 2 As shown, the operation mode of the 2×2station is: wafer No. 1 and wafer No. 2 are directly deposited for the first time after being placed on the heater. After the first deposition is completed, the lifting and rotating carrier rises, lifts the wafers, rotates them 180° clockwise, and then descends. Wafer No. 1 and wafer No. 2 are placed on the new heater; the vacuum robot arm sends wafer No. 3 and wafer No. 4 into the process chamber and places them on the original heater. At this time, wafer No. 1 and wafer No. 2 are deposited for the second time, and wafer No. 3 and wafer No. 4 are deposited for the first time. After deposition, the lifting and rotating carrier rises, lifts the wafers, rotates them 180° clockwise, and then descends. Then the vacuum robot arm takes out wafer No. 1 and wafer No. 2, puts in wafer No. 5 and wafer No. 6 for deposition, and the cycle continues.

[0056] like Figure 3 As shown, the operation mode of the 4×1station is: wafer No. 1 and wafer No. 2 are placed on the heater, the lifting and rotating carrier rises, holds up the wafers, rotates them 180° clockwise and then descends, and wafer No. 1 and wafer No. 2 are placed on the new heater; the vacuum robot arm sends wafer No. 3 and wafer No. 4 into the process chamber and places them on the original heater. At this time, the four wafers are all deposited for the first time. After the first deposition is completed, the vacuum robot arm takes out wafer No. 3 and wafer No. 4, and puts in wafer No. 5 and wafer No. 6. The lifting and rotating carrier rises, holds up the wafers, rotates them 180° clockwise and then descends, and the vacuum robot arm takes out wafer No. 1 and wafer No. 2, and puts in wafer No. 7 and wafer No. 8, and the cycle continues.

[0057] Example 2

[0058] This embodiment specifically introduces the lifting structure:

[0059] The lifting structure cooperates with the vacuum manipulator to complete the placement and placement of the wafer in the process chamber. Figure 4 and Figure 5As shown, the lifting structure includes: an ejector component 1 and a driving component 2; the ejector component 1 is located in the reaction chamber, and the driving component 2 can drive the ejector component 1 to rise and fall; the driving component 2 includes: an installation shell 21, a servo motor 22, a coupling 23, a nut 24, a lead screw 25 and a push rod assembly 26; the installation shell 21 is a cylindrical structure with a hollow cavity with vertical openings at both ends, the installation shell 21 is vertically arranged, and the upper end of the installation shell 21 is fixedly arranged on the lower surface of the reaction chamber; the servo motor 22 is vertically fixedly arranged on the lower end surface of the installation shell 21, the coupling 23, the lead screw 25 and the nut 24 are all arranged in the installation shell 21, and the servo motor The rotating shaft of the machine 22 is connected with the lead screw 25 through the coupling 23. The servo motor 22 drives the lead screw 25 to rotate synchronously through the coupling 23. The lead screw 25 is vertically arranged at the axial position of the mounting shell 21. The lead screw 25 and the nut 24 are spirally transmitted. The rotation of the lead screw 25 drives the nut 24 to move vertically. The nut 24 is connected with the push rod assembly 26. The bottom of the reaction chamber is provided with a space for the push rod assembly 26 to penetrate into the reaction chamber from the bottom. The push rod assembly 26 is connected with the ejector component 1 in the reaction chamber. The nut 24 drives the push rod assembly 26 to move vertically, and the push rod assembly 26 drives the ejector component 1 to move vertically, so as to realize the lifting and lowering of the ejector component 1. When the robot transports the wafer to the workstation, the servo motor 22 starts to raise the ejector component 1, and the ejector component 1 lifts the wafer away from the robot. The robot moves away, and the servo motor 22 reverses to lower the ejector component 1. After the ejector component 1 is lower than the workstation table, the wafer is placed on the workstation; when the robot takes away the wafer, the servo motor 22 starts to raise the ejector component 1, and the ejector component 1 lifts the wafer. The robot moves to the bottom of the wafer, and the servo motor 22 reverses to lower the ejector component 1. After the ejector component 1 is lower than the position of the robot, the wafer is placed on the robot, and the robot moves away to take away the wafer.

[0060] like Figure 5As shown, the push rod assembly 26 includes: a push rod seat 261 and a push rod 262; the push rod seat 261 is a hollow cavity with an opening at the lower end, the nut 24 includes a positioning platform stage 241 and a connecting section 242 in sequence, the connecting section 242 is inserted into the cavity of the push rod seat 261, the connecting section 242 cooperates with the cavity of the push rod seat 261, the positioning surface of the positioning platform stage 241 abuts against the lower end surface of the push rod seat 261, the positioning platform stage 241 is provided with a through hole, and the lower end surface of the push rod seat 261 is provided with a threaded hole, the through hole of the positioning platform stage 241 is aligned with the threaded hole on the lower end surface of the push rod seat 261, and the push rod seat 261 is fixedly connected to the nut 24 by setting screws in the threaded hole and the through hole ; The lead screw 25 passes through the nut 24 and then extends into the cavity of the push rod seat 261, preventing the push rod seat 261 and the lead screw 25 from interfering with each other, and making full use of the space between the lead screw 25 and the mounting shell 21, reducing the axial length, and making the push rod seat 261 and the lead screw 25 more compact; the rotation of the lead screw 25 causes the nut 24 to move vertically, and the nut 24 drives the push rod seat 261 to move synchronously; the push rod 262 is coaxially arranged with the lead screw 25, so that the force is transmitted along the axial direction of the push rod 262, which is beneficial to improving the accuracy of vertical movement; the lower end of the push rod 262 is fixedly connected to the upper end of the push rod seat 261 by a pin, and the upper end of the push rod 262 passes through the reaction chamber to make way and is fixedly connected to the ejector component 1.

[0061] Preferably, combined Figure 4 and Figure 5 As shown, the driving component 2 also includes a guide assembly 27, which is arranged between the push rod seat 261 and the inner wall of the mounting housing 21, and includes: a guide rail 271 and a slider 272; the guide rail 271 is fixed on the inner wall of the mounting housing 21 by screws, and the length direction of the guide rail 271 is arranged vertically; the slider 272 is arranged on the guide rail 271 and slides vertically along the guide rail 271, and the slider 272 is fixedly connected to the push rod seat 261 by screws. The guide rail 271 and the slider 272 work together to guide the push rod seat 261 vertically and limit the radial position, so as to prevent the push rod seat 261 from shaking and affecting the accuracy of vertical movement.

[0062] Combination Figure 4 , Figure 5 and Figure 6 As shown, the ejector component 1 includes: an ejector assembly 11 and a mounting ring 12; the ejector assembly 11 is divided into three groups, and the three groups of ejector assemblies 11 are arranged on the mounting ring 12, and the three groups of ejector assemblies 11 are arranged in a triangular shape along the same circumferential direction of the mounting ring 12; the push rod 262 is fixed to the mounting ring 12 by a hexagon socket screw, and the connection position between the push rod 262 and the mounting ring 12 is located between two groups of ejector assemblies 11. The push rod assembly 26 drives the mounting ring 12 to move vertically, and the mounting ring 12 drives the three groups of ejector assemblies 11 to move vertically, so that the three groups of ejector assemblies 11 can lift and put down the wafer.

[0063] Combination Figure 7 , Figure 8 and Fig. 9 As shown, each set of ejector pin assemblies 11 includes an ejector pin 111 , an ejector pin mounting seat 112 and a connecting seat 113 .

[0064] Combination Figure 7 , Fig. 9 and Fig.10 As shown, the connecting seat 113 is composed of a coaxial cylindrical section 1131 and an annular section 1132. The lower end opening of the cylindrical section 1131 is consistent with the opening diameter of the annular section 1132, and the outer diameter of the annular section 1132 is larger than the outer diameter of the cylindrical section 1131; a rounded rectangular groove 121 and a U-shaped pressing ring 122 are provided on the mounting ring 12, and the U-shaped pressing ring 122 is fixed along the side wall of the rounded rectangular groove 121, and the U-shaped pressing ring 122 is parallel to and spaced from the bottom surface of the rounded rectangular groove 121; the opening of the rounded rectangular groove 121 on one side of the mouth of the U-shaped pressing ring 122 is larger than the diameter of the annular section 1132, and the diameter of the annular section 1132 is between the U-shaped The width of the inner and outer sides of the pressure ring 122 and the diameter of the cylindrical section 1131 are smaller than the width of the inner side of the U-shaped pressure ring 122; the circular section 1132 enters the rounded rectangular groove 121 from the mouth of the U-shaped pressure ring 122, and the cylindrical section 1131 is pushed to drive the circular section 1132 to move toward the U-shaped pressure ring 122, and the upper surface of the circular section 1132 abuts against the lower surface of the U-shaped pressure ring 122, thereby fixing the connecting seat 113 on the mounting ring 12; the cylindrical section 1131 is pulled to drive the circular section 1132 away from the U-shaped pressure ring 122, and the circular section 1132 is separated from the U-shaped pressure ring 122, and the connecting seat 113 can be taken out of the rounded rectangular groove 121.

[0065] The ejector mounting seat 112 includes a horn section 1121 and a cylindrical section 1122 from top to bottom. The horn section 1121 and the cylindrical section 1122 are coaxial, and a through hole penetrating the horn section 1121 and the cylindrical section 1122 is opened along the axis.

[0066] The horn section 1121 has a cross-shaped opening at the upper end and a groove extending downward to the middle of the length direction of the horn section 1121, so that the upper end of the horn section 1121 has four petals, and the upper half of the horn section 1121 has elasticity; the ejector pin 111 is in the shape of a slender rod, and the outer peripheral surface of the ejector pin 111 has an annular groove, and the inner wall of the horn section 1121 has a protrusion. The ejector pin 111 is vertically inserted into the through hole, and the protrusion of the horn section 1121 is stuck in the groove of the ejector pin 111, thereby realizing a detachable connection between the ejector pin 111 and the horn section 1121.

[0067] The upper opening of the cylindrical section 1131 is smaller than the lower opening, the diameter of the cylindrical section 1122 is between the diameters of the upper and lower openings of the cylindrical section 1131, and the height of the cylindrical section 1122 is smaller than the height of the cylindrical section 1131; the ejector mounting seat 112 is inserted from the lower opening of the annular section 1132, the cylindrical section 1122 is located in the connecting seat 113, and one end of the horn section 1121 vertically passes through the upper opening of the connecting seat 113, so that the cylindrical section 1122 is restricted in the cavity of the connecting seat 113, and the cylindrical section 1122 can move in the radial and axial directions of the cavity of the connecting seat 113, so that the ejector 111 moves with the cylindrical section 1122; when the ejector 111 is subjected to radial force, the cylindrical section 1122 can move to weaken the effect of the radial force on the ejector 111, thereby avoiding damage to the ejector 111.

[0068] like Figure 5 As shown, a threaded hole is provided on the upper end surface of the push rod 262, and the threaded hole is located between two groups of ejector pin assemblies 11. A through hole is provided on the mounting ring 12, and a screw is provided in the threaded hole. The screw passes through the through hole of the mounting ring 12 and is screwed into the threaded hole to fix the mounting ring 12 and the push rod assembly 26. The push rod assembly 26 drives the mounting ring 12 to move vertically, and the mounting ring 12 drives the three groups of ejector pin assemblies 11 to move vertically, so that the three groups of ejector pin assemblies 11 can lift and put down the wafer.

[0069] The principle of the device in this application:

[0070] When the robot conveys the wafer to the work station, the servo motor 22 starts and drives the lead screw 25 to rotate through the coupling 23. The rotation of the lead screw 25 causes the nut 24 to drive the push rod seat 261 to move upward synchronously. The push rod seat 261 pushes the push rod 262 to move upward. The push rod 262 drives the mounting ring 12 to move upward. The mounting ring 12 causes the three groups of ejector pin assemblies 11 to rise synchronously. The three groups of ejector pin assemblies 11 lift the wafer out of the robot. The robot moves away, and the servo motor 22 reverses. The coupling 23 drives the lead screw 25 to rotate in the opposite direction, and the nut 25 moves downward. The push rod seat 261, the push rod 262, the mounting ring 12 and the three groups of ejector pin assemblies 11 all move downward synchronously. After the ejector pin 111 is lower than the work station table, the wafer is placed on the work station.

[0071] When the robot takes away the wafer, similarly, the servo motor 22 is started to make the three groups of ejector pin assemblies 11 rise, and the three groups of ejector pin assemblies 11 lift the wafer; at this time, the robot moves to the bottom of the wafer, and the servo motor 22 reverses to make the three groups of ejector pin assemblies 11 descend. After the ejector pins 111 are lower than the position of the robot, the wafer is placed on the robot, and the robot moves away to take away the wafer.

[0072] The coupling 23, nut 24 and lead screw 25 are coaxially arranged in the housing 21, and the push rod seat 261 and the nut 24 are connected in the housing 21. The lead screw 25 extends into the cavity of the push rod seat 261, thereby reducing the axial length. The guide rail 271 and the slider 272 are arranged between the inner wall of the housing 21 and the push rod seat 261, thereby making full use of the space between the housing 21 and the lead screw 25, enhancing the compactness of the structure, reducing the space occupied by the structure, and reducing the volume of the lifting structure, thereby meeting the volume requirements of the control equipment for the handling equipment.

[0073] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

[0074] Although the claims in this application have been formulated with respect to particular combinations of features, it should be understood that the scope of the present disclosure also includes any novel feature or any novel combination of features disclosed herein, whether explicitly or implicitly or in any generalization thereof, whether or not it relates to the same scheme in any claim currently claimed.

Claims

1. A process chamber independent scheduling method, characterized in that: include: Scan the wafer box on a map to obtain the number of wafers in the wafer box, the transmission route of each wafer, and the process task; According to the wafer transmission route and process tasks, the process chamber that each wafer is to enter is obtained, and then the wafer ID and process tasks are sent to the scheduling of the corresponding process chamber in sequence; A task pool is formed through the scheduling of the process chamber, and the process tasks of the process chamber are obtained based on the task pool; Each process chamber prepares corresponding execution conditions in advance according to the process task; Compare the process task carried by the current wafer with the current process task in the process chamber task pool. If they are the same, the current wafer is allowed to enter the process chamber; if they are different, an alarm is issued; After multiple wafers entering the process chamber complete the same process task, the process task is deleted from the task pool, and the process chamber prepares the corresponding execution conditions for the next task in advance; The process chamber is provided with 4 stations, and the process task is a 2×2 station operation mode or a 4×1 station operation mode; If the process task is a 2×2 station operation mode, the specific implementation method is as follows: after wafer No. 1 and wafer No. 2 are placed on the heater, they are directly deposited for the first time. After the first deposition is completed, the lifting and rotating carrier rises, lifts the wafers, rotates them 180° clockwise, and then descends. Wafer No. 1 and wafer No. 2 are placed on the new heater; the vacuum robot arm sends wafer No. 3 and wafer No. 4 into the process chamber and places them on the original heater. At this time, wafer No. 1 and wafer No. 2 are deposited for the second time, and wafer No. 3 and wafer No. 4 are deposited for the first time. After deposition, the lifting and rotating carrier rises, lifts the wafers, rotates them 180° clockwise, and then descends. Then the vacuum robot arm takes out wafer No. 1 and wafer No. 2, puts in wafer No. 5 and wafer No. 6 for deposition, and the cycle continues. If the process task is 4×1station operation mode, the specific implementation method is as follows: wafer No. 1 and wafer No. 2 are placed on the heater, the lifting and rotating carrier rises, holds up the wafers and rotates them 180° clockwise and then descends, and wafer No. 1 and wafer No. 2 are placed on the new heater; the vacuum robot arm sends wafer No. 3 and wafer No. 4 into the process chamber and places them on the original heater. At this time, all four wafers undergo the first deposition. After the first deposition is completed, the vacuum robot arm takes out wafer No. 3 and wafer No. 4, and puts in wafer No. 5 and wafer No.

6. The lifting and rotating carrier rises, holds up the wafers and rotates them 180° clockwise and then descends, and the vacuum robot arm takes out wafer No. 1 and wafer No. 2 and puts in wafer No. 7 and wafer No. 8, and the cycle continues.

2. The independent process chamber scheduling method according to claim 1, characterized in that: The execution conditions are that the lifting structure can be lifted and lowered normally and the lifting and rotating carrier can work normally. If the lifting structure or the lifting and rotating carrier fails, an alarm will be directly issued. If the lifting structure or the lifting and rotating carrier has no faults, the process chamber will be preheated, and when the preheating is about to be completed, it will be ready to receive the wafer entering the process chamber. At this time, the lifting structure is in a dropped state and the chamber pressure is able to transmit the wafer.

3. The independent process chamber scheduling method according to claim 1 or 2, characterized in that: While preparing the corresponding execution conditions in advance, the atmospheric robot takes the wafer from the wafer box and sends it into the LoadLock, and then the vacuum robot takes the wafer from the LoadLock and prepares to send it to the corresponding process chamber; before sending it in, the process task carried by the current wafer is compared with the current process task in the process chamber task pool.

4. The independent process chamber scheduling method according to claim 3, characterized in that: If the process task carried by the current wafer is the same as the current process task of the process chamber task pool, the vacuum robot arm enters through a door or a double door structure of the process chamber. At this time, the lifting structure rises to support the wafer, and then the vacuum robot arm exits the lifting structure and falls, so that the wafer is located on the heater and the door is closed.

5. The process chamber independent scheduling method according to claim 2, characterized in that: The lifting structure comprises: a pin component and a driving component; the pin component is located in the reaction chamber, and the driving component can drive the pin component to rise and fall; the driving component comprises: a mounting shell, a servo motor, a coupling, a nut, a lead screw and a push rod assembly; the mounting shell is a vertical hollow cavity with openings at both ends, and the mounting shell is vertically fixed below the reaction chamber; the servo motor is vertically fixed at the lower end of the mounting shell, and the coupling, the lead screw and the nut are all arranged in the mounting shell, and the servo motor drives the lead screw to rotate synchronously through the coupling, the lead screw is vertically arranged at the axial position of the mounting shell, and the lead screw and the nut are spirally transmitted; the nut is connected to the push rod assembly, and the push rod assembly penetrates into the reaction chamber from the bottom thereof and is connected to the pin component, the nut drives the push rod assembly to move vertically, and the push rod assembly drives the pin component to move vertically.

6. The independent process chamber scheduling method according to claim 5, characterized in that: The push rod assembly includes: a push rod seat and a push rod; the push rod seat is a hollow cavity with an opening at the lower end, the lower end of the push rod seat is fixedly connected to the nut, the lead screw extends into the cavity of the push rod seat, and the push rod seat moves vertically with the nut; the push rod and the lead screw are coaxially arranged, one end of the push rod is fixedly connected to the upper end of the push rod seat, and the other end passes through the reaction chamber and is fixedly connected to the ejector pin component.

7. The process chamber independent scheduling method according to claim 5, characterized in that: The driving component also includes a guide assembly; the guide assembly is arranged between the push rod seat and the inner wall of the mounting shell, and the guide assembly vertically guides and radially limits the push rod assembly; the guide assembly includes: a guide rail and a slider; the guide rail is fixed on the inner wall of the mounting shell, and the length direction of the guide rail is vertically arranged; the slider is arranged on the guide rail and slides along the guide rail, and the slider is fixedly connected to the push rod seat.

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