Damping film and method for manufacturing the same

Abstract

The present invention relates to a damping film (10), in particular to a damping film (10) for shielding electronic equipment from electric and / or magnetic fields, in particular to a damping film (10) for shielding electronic equipment with a wireless charging component from electric and / or magnetic fields, the damping film comprising a first carrier layer (20); a first adhesive layer (30), the first adhesive layer being in direct contact with the first carrier layer (20); a damping layer (40), the damping layer being in direct contact with the first adhesive layer (30), wherein the damping layer (40) comprises a damping material composed of a soft magnetic substance; a second adhesive layer (50), the second adhesive layer being in direct contact with the damping layer (40), in particular in direct contact with the damping layer (40) on a side of the damping layer (40) facing away from the first adhesive layer (30); and a second carrier layer (60), the second carrier layer being in direct contact with the second adhesive layer (50).

Description

Technical Field

[0001] The invention relates to a damping film and a method for producing the damping film.

[0002] The invention relates in particular to a damping membrane, an article having a battery, a receiving coil for wirelessly receiving energy and a damping membrane, an article having a transmitting coil for wirelessly transmitting energy to the receiving coil and a damping membrane, a method for manufacturing a damping membrane and a use of a damping membrane. Background Art

[0003] Wireless charging methods are used to charge the batteries of mobile devices without the need for a mechanical connection, such as a cable and / or plug, to connect the mobile device to a power source.

[0004] In wireless charging, energy is transferred from a transmitting coil to a receiving coil using electromagnetic fields. These electromagnetic fields can affect not only the receiving coil but also other electronic devices and other components, which can cause unwanted reactions and damage.

[0005] Damping films can be used to damp the propagation of electromagnetic fields, thereby reducing or preventing the effects of electromagnetic fields on other electronic devices and other components. Summary of the invention

[0006] The purpose of the present invention is to provide an improved solution or an alternative solution for the prior art.

[0007] According to a first aspect of the present invention, the object is achieved by a damping film, in particular a damping film for shielding an electronic device from electric and / or magnetic fields, in particular a damping film for shielding an electronic device having a wireless charging component from electric and / or magnetic fields, the damping film having:

[0008] - a first carrier layer;

[0009] - a first adhesive layer, which is in direct contact with the first carrier layer;

[0010] a damping layer, which is in direct contact with the first adhesive layer, wherein the damping layer comprises a damping material consisting of a soft magnetic substance;

[0011] a second adhesive layer which is in direct contact with the damping layer, in particular on a side of the damping layer facing away from the first adhesive layer; and

[0012] A second carrier layer, which is in direct contact with the second adhesive layer.

[0013] The following are the explanations of the relevant terms:

[0014] First of all, it should be pointed out that within the scope of this patent application, if the corresponding context does not clearly state, or it is obvious to a person skilled in the art, or it is technically mandatory to use the phrase "just one...", "just two...", etc., then indefinite articles such as "one", "two", etc. and numerical data should generally be understood as "at least" data, that is, "at least one...", "at least two...", etc.

[0015] In the context of this patent application, the expression “particularly” always means that optional, preferred features are introduced by this expression. The expression should not be understood as “exactly” or “namely”.

[0016] A "damping film" is understood to be a composite film having several layers connected at least in pairs one above the other, which is adapted to damp the propagation of electric and / or magnetic fields, so that electronic devices arranged behind the damping film can be shielded from the influence of the electric and / or magnetic fields starting from the source of the electric and / or magnetic fields. In this way, the influence of electric and / or magnetic fields on electronic devices and / or components protected by the damping film can be greatly reduced or prevented.

[0017] “Damping” is understood to mean that the power of an electric and / or magnetic field, in particular the electrical power and / or magnetic power, is reduced.

[0018] A "carrier layer" is understood to be a structured layer in the layer composite of the damping film, which is adapted to provide an adjacent relatively soft adhesive layer and / or an indirectly adjacent damping layer with a relatively brittle damping material in the layer composite with a higher tensile strength and / or compressive strength. This allows a relatively elastic and therefore flexible shielding film to be obtained, which can be wound around the electronic device and / or deviating components to be shielded, cut into almost any shape and adapted to the shape of the electronic device and / or other components to be shielded.

[0019] Likewise, the carrier layer can advantageously prevent the shielding film as a material composite from having material properties that are evaluated as brittle overall, even if the damping layer has material properties that are evaluated as brittle individually. In addition, the shear strength of the damping film can also be optimized by means of a correspondingly selected carrier layer.

[0020] Conceivable carrier layers are preferably, among others, plastic films and / or textile layers.

[0021] An “adhesive layer” is understood to be a layer composed of an adhesive material, in particular a layer composed of an adhesive, which is suitable for connecting two layers adjoining the adhesive layer to one another.

[0022] A “damping layer” is understood to be a layer comprising a damping material within the damping film.

[0023] “Damping material” is preferably understood to be a soft magnetic substance having a magnetic permeability greater than or equal to 500 H / m.

[0024] Preferably, the damping material has low eddy current loss, so that the shielding effect brought by the damping material can be advantageously improved. In particular, in the case of high-frequency electric and / or magnetic fields, the low eddy current loss of the damping material brings about a favorable damping effect.

[0025] Among other things, the low eddy current losses of the damping material advantageously enable the damping film to not heat up too much or to maintain its temperature or to increase it only slightly.

[0026] Furthermore, the relatively high magnetic permeability of soft magnetic substances results in that an electric field acting on the soft magnetic material can be converted particularly efficiently into a magnetic field and vice versa. In this way, the electric field and the magnetic field can exchange their energy particularly efficiently, thus particularly contributing to the damping effect.

[0027] “Soft magnetic material” is understood to be a material that can be easily magnetized in a magnetic field. Preferably, the soft magnetic material has a coercive field strength of less than or equal to 1,000 A / m.

[0028] "Coercive field strength" is understood to be the magnetic field strength required to completely demagnetize a damping material that was previously charged to the saturation flux density.

[0029] Preferably, the soft magnetic substance, in particular the amorphous soft magnetic substance, is an alloy with iron, nickel and / or cobalt.

[0030] A damping film is proposed which has a composite of several material layers, a damping layer which has a damping effect on electric and / or magnetic fields and in this case has a soft magnetic substance as the damping material.

[0031] By combining several different material layers into a damping film and / or selecting materials for the corresponding material layers, the properties of the damping film can be advantageously optimized. Thus, a damping film can be realized which is elastic and cuttable at the same time and which can also damp electric and / or magnetic fields particularly effectively.

[0032] For the first carrier layer and the first adhesive layer, among others, a glue strip is conceivable, which already provides a composite consisting of the first carrier layer and the first adhesive layer. This idea can also be applied by analogy to the second carrier layer and the second adhesive layer.

[0033] In particular, the combination of a damping film consisting of a first carrier layer connected to the damping layer and a second carrier layer connected to the damping layer advantageously makes it possible for the damping film proposed here to have particularly good cuttability, so that the damping film can be geometrically adapted exactly to the intended conditions of use. Tests have surprisingly shown that the composite consisting of the first carrier layer, the damping layer and the second carrier layer has significantly improved cuttability, in particular, even in complex cutting processes, thereby advantageously enabling significantly smoother cut edges to be achieved.

[0034] The damping material of the damping layer expediently has a cross-sectional area projected in the normal direction of the first carrier layer which is greater than or equal to 80%, preferably greater than or equal to 87.5% and particularly preferably greater than or equal to 92.5% of the cross-sectional area of ​​the first carrier layer.

[0035] Further expediently, the damping material of the damping layer has a cross-sectional area projected in the normal direction of the first carrier layer which is greater than or equal to 95%, preferably greater than or equal to 97.5% and particularly preferably greater than or equal to 99% of the cross-sectional area of ​​the first carrier layer.

[0036] It is provided that the damping layer does not have the damping material over the entire surface, but rather, when viewed in a plan view of the damping film, the damping layer has the damping material only over a portion of the surface.

[0037] It is conceivable here, inter alia, that the damping material is provided in strips which are oriented parallel to one another and are each spaced apart from one another.

[0038] Furthermore, it is conceivable in particular that the damping material is designed in the form of particles and that the particles are arranged dispersed with respect to one another in the damping layer.

[0039] It should be explicitly pointed out that the damping layer can have strips and / or particles of the damping material, wherein the particles and / or strips are arranged in another manner relative to one another without departing from the present aspect.

[0040] Preferably, the damping layer has a layer consisting of several strips of damping material.

[0041] The following are the explanations of the relevant terms:

[0042] A "layer" is understood to be an arrangement of strips with damping material, which are arranged in an ordered manner relative to one another, preferably parallel to one another, wherein the strips either do not overlap at all or overlap only slightly. In other words, in a layer, the strips are arranged only in one plane, wherein the strips may still overlap slightly at their abutting edges.

[0043] A “strip” of damping material is understood to be a film or a thin strip having a maximum thickness of 50 μm.

[0044] Preferably, the strip has a thickness of less than or equal to 40 μm, preferably less than or equal to 30 μm and particularly preferably less than or equal to 25 μm. Further preferably, the strip has a thickness of less than or equal to 20 μm, preferably less than or equal to 15 μm and particularly preferably less than or equal to 12 μm.

[0045] Preferably, the strip has a width of less than or equal to 30 mm, preferably less than or equal to 25 mm and particularly preferably less than or equal to 20 mm. Further preferably, the strip has a width of less than or equal to 15 mm, preferably less than or equal to 12.5 mm and particularly preferably less than or equal to 10 mm.

[0046] In this case, a damping membrane having a damping layer is proposed, wherein the damping layer has a layer composed of several strips of damping material, in particular has exactly one layer composed of several strips of damping material.

[0047] The damping quality can advantageously be further improved by the arrangement of several strips in one layer instead of a continuous film of soft magnetic substance.

[0048] It should be clearly pointed out that the above values ​​for the thickness and / or width of the strips should not be understood as strict limitations. Specifically, these values ​​can be exceeded or lowered on an engineering scale without departing from the aspects of the present invention. In short, these values ​​are used to provide a basis for the size of the thickness and / or width of the strips proposed herein.

[0049] According to an expedient embodiment, two strips of damping material have a distance from one another of less than or equal to 0.2 mm, preferably less than or equal to 0.1 mm and particularly preferably less than or equal to 0.05 mm.

[0050] The separated strips can spatially confine eddy currents in the damping layer and achieve domain refinement. In addition, due to the distinguishable hysteresis loops, the soft magnetic properties are isotropic, so that magnetic fields from different directions can be shielded.

[0051] It is further preferred that two strips of damping material directly adjoin one another, in particular that two adjacent strips of damping material directly adjoin one another over their entire longitudinal extension.

[0052] It should be clearly pointed out that the above values ​​for distance should not be understood as strict limitations. Specifically, these values ​​may be exceeded or lowered on an engineering scale without departing from the aspects described in the present invention. In short, these values ​​are used to provide a basis for the size of the distances proposed here.

[0053] According to an alternative embodiment, the two strips of damping material overlap by greater than or equal to 0.2 mm, preferably by 0.2 mm and particularly preferably by less than or equal to 0.1 mm, in particular over their entire longitudinal extension.

[0054] The arrangement of overlapping strips of damping film may advantageously enable improved conduction of magnetic flux from strip to strip and thus improved shielding.

[0055] It should be clearly pointed out that the above values ​​for overlap should not be understood as strict limitations. Specifically, these values ​​may be exceeded or lowered on an engineering scale without departing from the aspects described in the present invention. In short, these values ​​are used to provide a basis for the size of overlap proposed herein.

[0056] According to a particularly preferred embodiment, the damping layer comprises particles of a damping material.

[0057] The following are the explanations of the relevant terms:

[0058] “Particles” are understood to be objects that are small compared to the damping film. Particles are preferably understood to be objects that have an extension in the range of 3 μm to 200 μm in each spatial direction.

[0059] A damping layer having particles of a soft-magnetic substance is conceivable here.

[0060] Preferably, the particles in the damping layer are arranged dispersed with respect to one another.

[0061] Further preferably, the damping layer composed of soft magnetic material particles has a thickness greater than or equal to 10 μm and less than or equal to 40 μm.

[0062] In particular, it is also conceivable that the particles are bonded in the damping layer by means of a matrix material.

[0063] A “matrix material” is understood to be a material in which the particles of the soft magnetic substance are soluble.

[0064] “Dissolving the particles of the soft magnetic substance in the matrix material” is understood to mean that the particles are converted into a substantially homogeneous mixture in the technical sense, while retaining its material composition, which mixture, in addition to the particles, contains at least a solvent for the particles, in particular at least a matrix material. It should be taken into account that the solvent surrounds the particles and that the particles are bound to the solvent by adhesive interactions.

[0065] Preferably, the solvent has fillers in addition to the matrix material.

[0066] Liquid substances, in particular liquid substances with a dilatant or Newtonian or pseudoplastic or Bingham plastic or Casson plastic flow behavior, are preferably considered as matrix materials.

[0067] According to an alternative embodiment, the matrix material is hardened after the particles have dissolved, in particular by a reaction between the matrix material and a hardener. It is also conceivable, among other things, that the damping film is fixed in shape after the attachment using UV light, in particular that the matrix material of the damping layer is hardened by UV light.

[0068] The particles expediently have an extension in the range of greater than or equal to 3 μm and less than or equal to 200 μm, preferably greater than or equal to 4 μm and less than or equal to 100 μm and particularly preferably greater than or equal to 5 μm and less than or equal to 50 μm.

[0069] Further preferably, the particles have an extension in the range of greater than or equal to 7 μm and less than or equal to 40 μm, preferably greater than or equal to 8 μm and less than or equal to 30 μm and particularly preferably greater than or equal to 10 μm and less than or equal to 20 μm.

[0070] It goes without saying that the above range limits may also be combined in any way without departing from this aspect of the present invention.

[0071] Optionally, the damping film has a third adhesive layer, preferably a third adhesive layer which is in direct contact with the first carrier layer on that side of the first carrier layer which faces away from the first adhesive layer.

[0072] By means of the third adhesive layer, it can advantageously be achieved that the damping film can be fixed like an adhesive strip at its intended use location.

[0073] For the first carrier layer with the first adhesive layer and the third adhesive layer, double-sided adhesive tapes are conceivable, among others.

[0074] According to a suitable embodiment, the first carrier layer and / or the second carrier layer and / or the first adhesive layer and / or the second adhesive layer and / or the third adhesive layer have a temperature resistance greater than or equal to 80°C, preferably greater than or equal to 100°C and particularly preferably greater than or equal to 120°C.

[0075] Further preferably, the first carrier layer and / or the second carrier layer and / or the first adhesive layer and / or the second adhesive layer and / or the third adhesive layer have a temperature resistance greater than or equal to 150°C, preferably greater than or equal to 170°C and particularly preferably greater than or equal to 200°C.

[0076] The damping material can heat up by damping the electric and / or magnetic fields. The generated heat can be transferred to the adhesive layer and / or the carrier layer. If the temperature resistance is too low, this can cause the damping film to slip and / or fall off and / or become damaged. This is counteracted by the temperature resistance proposed here.

[0077] Furthermore, it is conceivable that the damping film proposed here should be able to be used at locations of use where higher temperatures may occur. This can be achieved by the temperature resistance of the damping film proposed here.

[0078] It should be clearly pointed out that the above values ​​for temperature resistance should not be understood as strict limitations. Specifically, these values ​​can be exceeded or lowered on an engineering scale without departing from the aspects described in the present invention. In short, these values ​​are used to provide a basis for the size of the temperature resistance proposed here.

[0079] Preferably, the damping material has a coercive field strength of less than or equal to 10 A / m, preferably a coercive field strength of less than or equal to 5 A / m and particularly preferably a coercive field strength of less than or equal to 3 A / m.

[0080] Preferably, the damping material has a coercive field strength less than or equal to 2 A / m, preferably a coercive field strength less than or equal to 1.5 A / m and particularly preferably a coercive field strength less than or equal to 1 A / m. Further preferably, the damping material has a coercive field strength less than or equal to 0.5 A / m, preferably a coercive field strength less than or equal to 0.1 A / m and particularly preferably a coercive field strength less than or equal to 0.05 A / m.

[0081] The above-mentioned values ​​of the coercive field strength apply in a magnetic field oscillating at 50 Hz.

[0082] Due to the low coercive field strength of the damping material, the dissipation in the damping material can be reduced, in particular in the case of specific applications with magnetic field strengths that change in polarity, whereby the thermal stability can be additionally increased.

[0083] It should be clearly pointed out that the above values ​​for the coercive field strength of the damping material should not be understood as strict limitations. Specifically, these values ​​can be exceeded or lowered on an engineering scale without departing from the aspects described in the present invention. In short, these values ​​are used to provide a basis for the magnitude of the coercive field strength of the damping material proposed herein.

[0084] Further preferably, the damping material has a remanence of less than or equal to 0.1 T, preferably less than or equal to 0.05 T and particularly preferably less than or equal to 0.02 T.

[0085] As a result, in the case of magnetic field strengths of varying polarity, the dissipation occurring in the damping material can additionally be advantageously reduced.

[0086] Preferably, the damping material has a saturation magnetic flux density greater than or equal to 1 T, preferably greater than or equal to 1.1 T and particularly preferably greater than or equal to 1.2 T. Preferably, the damping material has a saturation magnetic flux density greater than or equal to 1.3 T.

[0087] With increasing saturation flux density, it can be advantageously achieved that the damping material can be dimensioned smaller for the reference application without becoming thermally unstable, in particular because high saturation flux density also enables high saturation magnetic field strengths. In other words, a relatively high saturation flux density makes it possible to reduce or prevent heating of the damping material.

[0088] It should be clearly pointed out that the above values ​​for the saturation flux density of the damping material should not be understood as strict limitations. Specifically, these values ​​can be exceeded or lowered on an engineering scale without departing from the aspects described in the present invention. In short, these values ​​are used to provide a basis for the size of the saturation flux density of the damping material proposed herein.

[0089] The soft magnetic substance is particularly preferably metallic glass.

[0090] The following are the explanations of the relevant terms:

[0091] A “metallic glass” is understood to be a metal-based alloy of a substance which does not have a crystalline structure at the atomic level, but rather an amorphous structure, but has metallic conductivity as a property. Preferably, the metallic glass has non-metallic alloy components in addition to the metal alloy component.

[0092] The amorphous atomic arrangement, which is very unusual for metals, advantageously enables special physical material properties. In particular, by using metallic glass, the coercive field strength of the damping material can be advantageously reduced and / or the magnetic permeability can be advantageously increased. In addition, metallic glass can have a high electrical resistance, whereby for certain applications in damping elements, eddy current losses caused by the damping film can be advantageously reduced.

[0093] Particularly preferably, the soft magnetic substance has a nanocrystalline structure.

[0094] The following are the explanations of the relevant terms:

[0095] Materials with a “nanocrystalline structure” are understood to be polycrystalline solids with a nanometer microstructure, wherein microstructure is understood to be the type, crystal structure, number, shape and topological arrangement of point defects, dislocations, stacking faults and grain boundaries in the crystalline material.

[0096] The physical properties of the damping element can be further improved by the nanocrystalline structure, in particular, the magnetic permeability of the soft magnetic material can be increased.

[0097] Preferably, the nanocrystalline material is made of an amorphous material, wherein the crystal growth of the amorphous material is stimulated by thermal and / or magnetic effects.

[0098] Preferably, the damping material consists of a soft magnetic substance with a nanocrystalline structure having a typical grain size in the range of 5 μm to 30 μm, preferably of a nanocrystalline soft magnetic substance having a typical grain size in the range of 7 μm to 20 μm, particularly preferably of a nanocrystalline soft magnetic substance having a typical grain size in the range of 8 μm to 15 μm. This makes it possible to achieve particularly advantageous physical properties of the damping material, in particular with regard to magnetic permeability and / or saturation magnetic field strength.

[0099] According to a preferred embodiment, the soft magnetic material has the following atomic composition:

[0100] [Fe 1-a Ni a ] 100-x-y-z-α-β-γ Cu x Si y B z Nb α M' β M" γ

[0101] Wherein, a≤0.3, 0.6≤x≤1.5, 10≤y≤17, 5≤z≤14, 2≤α≤6, β≤7, γ≤8, wherein M' is at least one of the elements V, Cr, Co, Al and Zn, and M" is at least one of the elements C, Ge, P, Ga, Sb, In and Be.

[0102] Laboratory tests have shown that the above-mentioned specifications of the soft magnetic substance lead to particularly advantageous material properties for the damping material proposed here.

[0103] In this case, the above-mentioned material specifications make it possible in particular to achieve a damping material having a particularly low coercive field strength and / or a particularly high saturation flux density.

[0104] Preferably, the soft magnetic substance contains nickel, in particular a nickel content greater than or equal to 4.5 wt %, preferably a nickel content greater than or equal to 5 wt % and particularly preferably a nickel content greater than or equal to 5.5 wt %.

[0105] Preferably, the soft magnetic material has magnetostriction with a relative length change in magnitude parallel to the magnetic field, which length change is less than or equal to 2 times 10 -6 , preferably less than or equal to 1 times 10 -6 and particularly preferably less than or equal to 0.5 times 10 -6 .

[0106] The following are the explanations of the relevant terms:

[0107] "Magnetostriction" is understood to mean that the damping material deforms due to the action of a magnetic field. In this case, the damping material undergoes an elastic length change while the volume remains constant.

[0108] According to a second aspect of the invention, this object is achieved by an article having a battery, a receiving coil for wirelessly receiving energy and a damping film according to the first aspect of the invention.

[0109] It goes without saying that the aforementioned advantages of the damping film according to the first aspect of the invention directly apply to an article having a battery, a receiving coil for wirelessly receiving energy and a damping film according to the first aspect of the invention.

[0110] Preferably, the damping film is arranged between the battery and the receiving coil.

[0111] The battery can thus advantageously be protected from electric and / or magnetic fields by the damping film.

[0112] It should be explicitly pointed out that the subject matter of the second aspect may be advantageously combined with the subject matter of the above-mentioned aspects of the invention, either individually or cumulatively in any combination.

[0113] According to a third aspect of the invention, this object is achieved by an article having a transmitting coil for wirelessly transmitting energy to a receiving coil and a damping film according to the first aspect of the invention.

[0114] It goes without saying that the aforementioned advantages of the damping film according to the first aspect of the invention directly apply to an article having a transmitting coil for wirelessly transmitting energy to a receiving coil and a damping film according to the first aspect of the invention.

[0115] Preferably, the damping film is arranged on the transmitting coil.

[0116] It should be noted that the subject matter of the third aspect can be advantageously combined with the subject matter of the foregoing aspects of the present invention individually or cumulatively in any combination.

[0117] According to a fourth aspect of the present invention, this object is achieved by a method for manufacturing a damping film, the method comprising the following steps:

[0118] - providing a first carrier layer and a first adhesive layer;

[0119] - where appropriate, contacting the first carrier layer and the first adhesive layer;

[0120] -Providing a damping material composed of a soft magnetic substance;

[0121] - bringing the damping material into contact with the first adhesive layer to form a damping layer connected to the first carrier layer;

[0122] - providing a second adhesive layer and a second carrier layer;

[0123] - where appropriate, bringing the second carrier layer into contact with the second adhesive layer; and

[0124] - Bringing the second adhesion layer into contact with the damping layer to form a damping film according to the first aspect of the invention.

[0125] It goes without saying that the aforementioned advantages of the damping membrane according to the first aspect of the present invention are directly applicable to the method for producing the damping membrane according to the first aspect of the present invention.

[0126] Preferably, it is conceivable that the damping material is sprayed in granular form onto the adhesive layer, in particular onto the adhesive film.

[0127] It should be noted that the subject matter of the fourth aspect can be advantageously combined with the subject matter of the previous aspects of the present invention individually or cumulatively in any combination.

[0128] According to a fifth aspect of the present invention, this object is achieved by use of the damping film according to the first aspect of the present invention in an article having a wireless charging component.

[0129] It goes without saying that the aforementioned advantages of the damping film according to the first aspect of the present invention are directly applicable to the use of the damping film according to the first aspect of the present invention in an article having a wireless charging component.

[0130] It should be noted that the subject matter of the fifth aspect can be advantageously combined with the subject matter of the previous aspects of the present invention individually or cumulatively in any combination.

[0131] According to a sixth aspect of the present invention, this object is achieved by the use of a damping film according to the first aspect of the present invention in an article having components to be shielded, in particular electronic components, cables and / or sensors.

[0132] It goes without saying that the aforementioned advantages of the damping film according to the first aspect of the invention directly apply to the use of the damping film according to the first aspect of the invention in articles having components to be shielded, in particular electronic components, cables and / or sensors.

[0133] It should be noted that the subject matter of the sixth aspect can be advantageously combined with the subject matter of the previous aspects of the present invention individually or cumulatively in any combination. BRIEF DESCRIPTION OF THE DRAWINGS

[0134] More advantages, details and features of the present invention can be obtained from the embodiments described below. Specifically:

[0135] Figure 1 shows a schematic cross-sectional view of a damping film according to a first embodiment;

[0136] Figure 2shows a schematic cross-sectional view of a damping membrane according to a first embodiment; and

[0137] Figure 3 A detailed schematic cross-sectional view of a damping membrane according to a second embodiment is shown. Specific embodiments

[0138] In the following description, the same reference numerals represent the same components or the same features, so the description of a component with reference to one figure also applies to other figures to avoid repeated description. In addition, the features described in conjunction with one embodiment can also be used separately in other embodiments.

[0139] Figure 1 The damping film 10 in the embodiment mainly consists of a first carrier layer 20 , a first adhesive layer 30 , a damping layer 40 , a second adhesive layer 50 and a second carrier layer 60 .

[0140] The first adhesive layer 30 is in contact with the first carrier layer 20 and the damping layer 40 and connects them to each other.

[0141] The second adhesive layer 50 is in contact with the second carrier layer 60 and the damping layer 40 and connects them to each other.

[0142] The damping layer 40 comprises a layer 44 of a damping material 42 , in particular a damping material 42 comprising a soft magnetic substance.

[0143] The damping material 42 is organized in the form of strips 46 in the layer 44 of the damping layer 40 , wherein the strips 46 are arranged parallel to one another and adjacent strips 46 have a distance 47 from one another.

[0144] Figure 2 Shows Figure 1 4 is a sectional view of an embodiment of a damping membrane 10 in FIG. 1 , wherein the section passes through a damping layer (not shown) and thus enables a top view of strips 46 in the damping layer 40 .

[0145] Figure 3 The damping film 10 in FIG. 1 shows a detailed cross-sectional view, wherein the section passes through a damping layer (not shown). The damping layer (not shown) has a damping material 42 in the form of particles 48 .

[0146] The particles 48 do not form a continuous damping layer (not shown) but have irregular gaps (not shown) therebetween, thereby revealing the first adhesion layer 30 passing through the irregular gaps.

[0147] List of Figure Numbers

[0148] 10 Damping film

[0149] 20 First carrier layer

[0150] 30 First Adhesion Layer

[0151] 40 Damping layer

[0152] 42 Damping material

[0153] 44th floor

[0154] 46 strips

[0155] 47 Distance

[0156] 48 granules

[0157] 50 Second adhesive layer

[0158] 60 Second carrier layer

Claims

1. A damping film (10), the damping film (10) being used to shield an electronic device from electric and / or magnetic fields or to shield an electronic device having a wireless charging component from electric and / or magnetic fields, the damping film having: - a first carrier layer (20); - a first adhesive layer (30), the first adhesive layer being in direct contact with the first carrier layer (20); - a damping layer (40) which is in direct contact with the first adhesive layer (30), The damping layer (40) comprises a damping material (42) composed of a soft magnetic substance; - a second adhesive layer (50), the second adhesive layer being in direct contact with the damping layer (40), wherein The second adhesive layer is in direct contact with the damping layer (40) on a side facing away from the first adhesive layer (30); and a second carrier layer (60), which is in direct contact with the second adhesive layer (50), It is characterized in that The damping material (42) has a coercive field strength less than or equal to 2A / m, and the damping material (42) has a saturation magnetic flux density greater than or equal to 1T.

2. The damping film (10) according to claim 1, characterized in that The damping material (42) of the damping layer (40) has a cross-sectional area projected in a normal direction of the first carrier layer (20), the cross-sectional area being greater than or equal to 80% of the cross-sectional area of ​​the first carrier layer (20).

3. The damping film (10) according to claim 1, characterized in that The damping layer (40) has a layer (44) consisting of a plurality of strips (46) of the damping material (42).

4. The damping film (10) according to claim 3, characterized in that The two strips (46) of the damping material (42) have a distance (47) from each other that is less than or equal to 0.2 mm.

5. The damping film (10) according to claim 3, characterized in that The two strips (46) of the damping material (42) overlap by greater than or equal to 0.2 mm.

6. The damping film (10) according to claim 1, characterized in that The damping layer (40) comprises particles (48) of the damping material (42).

7. The damping film (10) according to claim 6, characterized in that The particles (48) have an extension in the range of greater than or equal to 3 μm and less than or equal to 200 μm.

8. The damping film (10) according to claim 1, characterized in that The damping film (10) has a third adhesive layer which is in direct contact with the first carrier layer (20) on a side thereof facing away from the first adhesive layer (30).

9. The damping film (10) according to claim 8, characterized in that The first carrier layer (20) and / or the second carrier layer (60) and / or the first adhesive layer (30) and / or the second adhesive layer (50) and / or the third adhesive layer have a temperature resistance greater than or equal to 80°C.

10. The damping film (10) according to claim 1, characterized in that The damping material (42) has a remanence less than or equal to 0.1T.

11. The damping film (10) according to claim 1, characterized in that The soft magnetic substance is metallic glass.

12. The damping film (10) according to claim 11, characterized in that The soft magnetic material has a nano-crystal structure.

13. The damping film (10) according to claim 1, characterized in that The soft magnetic material has the following atomic composition: [Fe 1-a Ni a ] 100-x-y-z-α-β-γ Cu x Si y B z No α m' β M" γ Wherein, a≤0.3, 0.6≤x≤1.5, 10≤y≤17, 5≤z≤14, 2≤α≤6, β≤7, γ≤8, wherein M' is at least one of the elements V, Cr, Co, Al and Zn, and M" is at least one of the elements C, Ge, P, Ga, Sb, In and Be.

14. The damping film (10) according to claim 1, characterized in that The soft magnetic material has magnetostriction, and the magnetostriction has a relative length change in magnitude parallel to the magnetic field, and the length change is less than or equal to 2 times 10 -6 .

15. The damping film (10) according to claim 1, characterized in that The damping material (42) has a coercive field strength less than or equal to 1.5 A / m.

16. The damping membrane (10) according to claim 1, characterized in that The damping material (42) has a coercive field strength less than or equal to 1 A / m.

17. The damping membrane (10) according to claim 1, characterized in that The damping material (42) of the damping layer (40) has a cross-sectional area projected in a normal direction of the first carrier layer (20), and the cross-sectional area is greater than or equal to 87.5% of the cross-sectional area of ​​the first carrier layer (20).

18. The damping membrane (10) according to claim 1, characterized in that The damping material (42) of the damping layer (40) has a cross-sectional area projected in a normal direction of the first carrier layer (20), and the cross-sectional area is greater than or equal to 92.5% of the cross-sectional area of ​​the first carrier layer (20).

19. The damping film (10) according to claim 3, characterized in that The two strips (46) of the damping material (42) have a distance (47) from each other that is less than or equal to 0.1 mm.

20. The damping membrane (10) according to claim 3, characterized in that The two strips (46) of the damping material (42) have a distance (47) from each other that is less than or equal to 0.05 mm.

21. The damping membrane (10) according to claim 3, characterized in that The two strips (46) of the damping material (42) overlap by less than 0.2 mm.

22. The damping membrane (10) according to claim 3, characterized in that The two strips (46) of the damping material (42) overlap by less than or equal to 0.1 mm.

23. The damping membrane (10) according to claim 6, characterized in that The particles (48) have an extension in the range of greater than or equal to 4 μm and less than or equal to 100 μm.

24. The damping membrane (10) according to claim 6, characterized in that The particles (48) have an extension in the range of greater than or equal to 5 μm and less than or equal to 50 μm.

25. The damping membrane (10) according to claim 8, characterized in that The first carrier layer (20) and / or the second carrier layer (60) and / or the first adhesive layer (30) and / or Or the second adhesive layer (50) and / or the third adhesive layer has a temperature resistance greater than or equal to 100°C.

26. The damping membrane (10) according to claim 8, characterized in that The first carrier layer (20) and / or the second carrier layer (60) and / or the first adhesive layer (30) and / or Or the second adhesive layer (50) and / or the third adhesive layer has a temperature resistance greater than or equal to 120°C.

27. The damping membrane (10) according to claim 1, characterized in that The damping material (42) has a remanence less than or equal to 0.05T.

28. The damping membrane (10) according to claim 1, characterized in that The damping material (42) has a remanence less than or equal to 0.02T.

29. The damping membrane (10) according to claim 1, characterized in that The damping material (42) has a saturation magnetic flux density greater than or equal to 1.1T.

30. The damping membrane (10) according to claim 1, characterized in that The damping material (42) has a saturation magnetic flux density greater than or equal to 1.2T.

31. The damping membrane (10) according to claim 14, characterized in that The length variation is less than or equal to 1 times 10 -6 .

32. The damping membrane (10) according to claim 14, characterized in that The length variation is less than or equal to 0.5 times 10 -6 .

33. An electronic device having a battery, a receiving coil for wirelessly receiving energy and a damping film (10) according to one of claims 1 to 32.

34. The electronic device according to claim 33, wherein the damping film (10) is arranged between the battery and the receiving coil.

35. An electronic device having a transmitting coil for wirelessly transmitting energy to a receiving coil and a damping film (10) according to one of claims 1 to 32.

36. The electronic device according to claim 35, wherein the damping film (10) is arranged on the transmitting coil.

37. A method for manufacturing a damping film (10), the method comprising the following steps: - providing a first carrier layer (20) and a first adhesive layer (30); - bringing the first carrier layer (20) and the first adhesive layer (30) into contact; - providing a damping material (42) consisting of a soft magnetic substance, wherein: The damping material (42) having a coercive field strength less than or equal to 2 A / m and having a coercive field strength greater than or equal to 1T saturation flux density; - bringing the damping material (42) into contact with the first adhesive layer (30) to form a damping layer (40) connected to the first carrier layer (20); - providing a second adhesive layer (50) and a second carrier layer (60); - bringing the second carrier layer (60) and the second adhesive layer (50) into contact; and - bringing the second adhesion layer (50) into contact with the damping layer (40) to form a damping membrane (10) according to one of claims 1 to 32.

38. Method for using a damping membrane (10) according to one of claims 1 to 32, wherein: The damping film (10) is used in an article having a wireless charging component.

39. Method of using a damping film (10) according to one of claims 1 to 32, wherein the damping film (10) is used in an article having electronic components, cables and / or sensors requiring shielding.

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