A diamond / aluminum composite material surface treatment process
By employing a stepped heating and electroless nickel plating-gold plating process, the problems of poor adhesion and incomplete plating in the surface treatment of diamond/aluminum composite materials were solved, achieving uniform and dense plating deposition to meet the welding requirements of electronic packaging.
CN117165941BActive Publication Date: 2026-06-02HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
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Patent Information
- Application Number
- CN202311154246.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-08
- Publication Date
- 2026-06-02
- Estimated Expiration
- 2043-09-08
AI Technical Summary
Technical Problem
Diamond/aluminum composite materials suffer from poor coating adhesion, incomplete plating, and corrosion during surface treatment, making it difficult to meet the welding requirements of electronic packaging.
Method used
A stepped heating method is used in combination with electroless nickel plating and electroplating gold plating. Through physical sandblasting and chemical roughening treatment, a uniform and dense coating is formed, and catalytic centers are formed on the diamond surface to improve the adhesion.
Benefits of technology
It achieves uniform deposition and high adhesion of the coating on the surface of diamond/aluminum composite material, meets welding requirements, and is suitable for heat dissipation applications of high-power electronic components.
✦ Generated by Eureka AI based on patent content.
Abstract
The present application belongs to the technical field of surface treatment, and in particular to a surface treatment process for diamond / aluminum composite material. The present application comprises the following steps: degreasing, drying, sand blasting, degreasing, pickling, sensitization, activation, electroless nickel plating, low-temperature annealing, degreasing, pickling, impact nickel plating, electroplating nickel, pre-plating gold, electroplating gold, and low-temperature annealing. The present application reduces the stress between the surface of the composite material and the plating layer through a stepwise heating mode, thereby improving the bonding force and meeting the welding technical requirements of the diamond / aluminum composite material.
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