A diamond / aluminum composite material surface treatment process
By employing a stepped heating and electroless nickel plating-gold plating process, the problems of poor adhesion and incomplete plating in the surface treatment of diamond/aluminum composite materials were solved, achieving uniform and dense plating deposition to meet the welding requirements of electronic packaging.
CN117165941BActive Publication Date: 2026-06-02HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
- Filing Date
- 2023-09-08
- Publication Date
- 2026-06-02
Smart Images
Figure CN117165941B_ABST
Abstract
The present application belongs to the technical field of surface treatment, and in particular to a surface treatment process for diamond / aluminum composite material. The present application comprises the following steps: degreasing, drying, sand blasting, degreasing, pickling, sensitization, activation, electroless nickel plating, low-temperature annealing, degreasing, pickling, impact nickel plating, electroplating nickel, pre-plating gold, electroplating gold, and low-temperature annealing. The present application reduces the stress between the surface of the composite material and the plating layer through a stepwise heating mode, thereby improving the bonding force and meeting the welding technical requirements of the diamond / aluminum composite material.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Surface gold plating method of diamond and copper composite material
CN104195603A
Diamond aluminum composite material surface plating process
CN111334795A
Chemical nickel plating method for surface of high-volume-fraction aluminum-based silicon carbide composite material
CN114150297A
Local gold plating method for metal packaging shell and packaging shell prepared by using local gold plating method
CN114411212A