A diamond / aluminum composite material surface treatment process
By employing a stepped heating and electroless nickel plating-gold plating process, the problems of poor adhesion and incomplete plating in the surface treatment of diamond/aluminum composite materials were solved, achieving uniform and dense plating deposition to meet the welding requirements of electronic packaging.
CN117165941BActive Publication Date: 2026-06-02HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
- Filing Date
- 2023-09-08
- Publication Date
- 2026-06-02
Smart Images
Figure CN117165941B_ABST
Abstract
The present application belongs to the technical field of surface treatment, and in particular to a surface treatment process for diamond / aluminum composite material. The present application comprises the following steps: degreasing, drying, sand blasting, degreasing, pickling, sensitization, activation, electroless nickel plating, low-temperature annealing, degreasing, pickling, impact nickel plating, electroplating nickel, pre-plating gold, electroplating gold, and low-temperature annealing. The present application reduces the stress between the surface of the composite material and the plating layer through a stepwise heating mode, thereby improving the bonding force and meeting the welding technical requirements of the diamond / aluminum composite material.
Need to check novelty before this filing date? Find Prior Art