A corner degree imprint alignment method, device and product

Abstract

The present application relates to chip processing technical field, especially a kind of corner degree imprinting alignment method, equipment and product.The corner degree imprinting alignment method includes the following steps: providing the imprinting film with first calibration group, second calibration group on imprinting surface, first calibration group and second calibration group are arranged at preset angle θ on imprinting surface;Providing wafer with opposite first surface and second surface;First surface is imprinted by imprinting film, so that first surface is formed with first mark group corresponding to first calibration group and second mark group corresponding to second calibration group;First calibration group on imprinting film is aligned with second mark group of wafer and / or second calibration group on the imprinting film is aligned with first mark group of the wafer, then second surface is imprinted by imprinting film.Through the above setting, mechanical error caused by wafer and stage rotation can be eliminated, the rotation accuracy of corner degree double-side imprinting operation is greatly improved, and then the imprinting effect of wafer is improved.

Description

Technical Field

[0001] This invention relates to the field of chip processing technology, and in particular to a method, equipment and product for angle-shifting imprinting alignment. Background Technology

[0002] Nanoimprint lithography is a technique that uses photoresist to transfer micro- and nano-structures from a template onto a material to be processed. This technique achieves ultra-high resolution through mechanical transfer and is expected to replace traditional photolithography in the future, becoming an important processing method in the fields of microelectronics and materials science.

[0003] Currently, the alignment method for precise angle-shifting imprinting on both sides generally uses image recognition technology. That is, after aligning the markers on the flexible film with the markers on the wafer, the stage used to support the wafer is mechanically rotated to the required angle to complete the subsequent imprinting process. However, this method suffers from large alignment errors, leading to poor imprinting accuracy and effect. Therefore, how to solve the problem of large alignment errors remains a major challenge that urgently needs to be addressed by those skilled in the art. Summary of the Invention

[0004] In view of at least one deficiency of the prior art, the purpose of the present invention is to provide a method, apparatus and product for angular imprinting alignment, so as to effectively improve the rotational accuracy of angular double-sided imprinting operations and thereby improve wafer performance.

[0005] Firstly, this embodiment provides a method for aligning embossed designs at a rotating angle, including:

[0006] Preparation steps: Provide an imprinting film, wherein the imprinting surface of the imprinting film has a first calibration group and a second calibration group, the first calibration group and the second calibration group being arranged at a preset angle θ on the imprinting surface; Provide a wafer, wherein the wafer has a first surface and a second surface opposite to each other;

[0007] First side imprinting step: The first side and the imprinting surface face each other, and the first side is imprinted by the imprinting film so that the first side of the wafer has a first mark group corresponding to the first calibration group and a second mark group corresponding to the second calibration group;

[0008] The second imprinting step involves aligning the second surface with the imprinting surface, aligning the first calibration group on the imprinting film with the second mark group on the wafer, and / or aligning the second calibration group on the imprinting film with the first mark group on the wafer, and then imprinting the second surface with the imprinting film to form an imprinted pattern on the first and second surfaces at a preset angle θ.

[0009] Optionally, the first calibration group and the second calibration group are formed by rotating the preset angle θ around the center of the embossed pattern on the embossed surface.

[0010] Optionally, the imprinting film is a hard film template or a soft film template.

[0011] Optionally, the imprinting surface of the imprinting film has a pattern area for forming the imprinted pattern, and the first calibration group and / or the second calibration group are located outside the pattern area.

[0012] Optionally, the first group of marks and / or the second group of marks are part of the embossed pattern on the embossed surface.

[0013] Optionally, the first calibration group includes at least calibration point A1 and calibration point A2, and the second calibration group includes at least calibration point B1 and calibration point B2; the straight line passing through calibration point A1 and calibration point A2 intersects the straight line passing through calibration point B1 and calibration point B2 at a preset angle θ.

[0014] Optionally, after the first imprinting step, the first side of the wafer is formed with the first mark group and the second mark group. The first mark group includes mark point A1 and mark point A2, which correspond to the calibration point A1 and calibration point A2, respectively. The second mark group includes mark point B1 and mark point B2, which correspond to the calibration point B1 and calibration point B2, respectively. In the second imprinting step, the calibration point A1 on the imprinting film is aligned with the mark point B1 on the first side of the wafer, and the calibration point A2 on the imprinting film is aligned with the mark point B2 on the first side of the wafer. Alternatively, the calibration point B1 on the imprinting film is aligned with the mark point A1 on the first side of the wafer, and the calibration point B2 on the imprinting film is aligned with the mark point A2 on the first side of the wafer. After alignment, imprinting is performed.

[0015] Optionally, the method further includes an imprint film preparation step; providing a master plate on which a preset imprint pattern and a first identification group and a second identification group are formed; transferring the imprint pattern and the first identification group and the second identification group on the master plate onto the imprint film, so that the imprint surface of the imprint film has an imprint pattern and a first calibration group corresponding to the first identification group and a second calibration group corresponding to the second identification group.

[0016] Secondly, embodiments of the present invention provide a rotating angle imprinting alignment device, which employs the rotating angle imprinting alignment method described in any of the solutions in the first aspect above.

[0017] Thirdly, embodiments of the present invention provide a product for angle-shifting embossing, employing the angle-shifting embossing alignment method described in any of the solutions in the first aspect above.

[0018] Based on the above, compared with the prior art, the angle-shifting imprinting alignment method, equipment and product provided by the present invention have at least the following beneficial effects: by utilizing the design of two sets of calibration groups on the imprinting film, the imprinting of the first and second sides of the wafer can be achieved solely by the rotation of the imprinting film, which can eliminate mechanical errors caused by the rotation of the stage below the wafer, greatly improve the rotational accuracy of the angle-shifting double-sided imprinting operation, and thus improve the imprinting effect of the wafer.

[0019] Other features and beneficial effects of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other beneficial effects of the invention can be realized and obtained by means of the structures particularly pointed out in the description, claims and drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Unless otherwise specified, the positional relationships shown in the drawings in the following description are based on the direction in which the components are drawn in the figure.

[0021] Figure 1 A flowchart of a rotation angle alignment method provided in an embodiment of the present invention;

[0022] Figure 2 This is a process diagram of a rotation angle alignment method provided in an embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of the calibration group on the imprint film in one embodiment;

[0024] Figure 4 This is a three-dimensional schematic diagram of the first surface imprinting step in one embodiment;

[0025] Figure 5 This is a schematic diagram of a group of markers on a wafer in one embodiment;

[0026] Figure 6 This is a top view schematic diagram of the second side imprinting step in one embodiment;

[0027] Figure 7 A flowchart of a rotation angle alignment method provided in another embodiment of the present invention.

[0028] Figure label:

[0029] 10-Imprint film; S3-Imprint surface; 11-Patterned area; 20-Wafer; S1-First surface; S2-Second surface. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. The technical features designed in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0031] In the description of this invention, it should be noted that all terms used in this invention (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and should not be construed as limiting the invention; it should be further understood that the terms used in this invention should be understood to have the same meaning as those in the context of this specification and in the relevant field, and should not be understood in an idealized or overly formal sense, except as expressly defined in this invention.

[0032] Current nanoimprint lithography technology is still in the development stage regarding alignment issues, especially for products with angular alignment on both sides, where the processing accuracy falls far short of requirements. For example, some high-end TOF (Time of Flight) products require optical lenses with precisely deflected patterns on both sides. For these products, existing imprint alignment methods generally use image recognition technology to align markers on the flexible film with markers on the wafer, then mechanically rotate the stage to the required angle. This method has the following problems: First, the alignment deviation is large, and the final rotation angle is affected by the accuracy of the marker alignment (image recognition) and the mechanical rotation accuracy of the stage, making it difficult to achieve high rotational accuracy and affecting the imprinting effect; second, there is no effective monitoring method for the mechanical rotation of the stage, making it susceptible to deviations in the rotation angle due to hardware fluctuations, aging, and other issues, thus affecting imprinting accuracy.

[0033] To effectively solve at least one of the above problems, embodiments of the present invention provide a method, equipment, and product alignment method for rotating embossing to effectively improve the accuracy of embossing alignment. The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0034] Example 1

[0035] Please see Figure 1 , Figure 2 An embodiment of the present invention provides a method for aligning embossing at a rotating angle, comprising at least the following steps:

[0036] S20, preparation step; provide an imprinting film 10, the imprinting surface S3 of the imprinting film 10 has a first calibration group and a second calibration group, the first calibration group and the second calibration group are arranged at a preset angle θ on the imprinting surface S3; provide a wafer 20, the wafer 20 has a first surface S1 and a second surface S2 opposite to each other.

[0037] S30, First surface S1 imprinting step: The first surface S1 and the imprinting surface S3 are oriented opposite each other, and the first surface S1 is imprinted by the imprinting film 10 so that the first surface S1 of the wafer 20 has a first mark group corresponding to the first calibration group and a second mark group corresponding to the second calibration group.

[0038] S40, the second surface S2 imprinting step: make the second surface S2 face the imprinting surface S3, align the first calibration group on the imprinting film 10 with the second mark group on the wafer 20, and / or align the second calibration group on the imprinting film 10 with the first mark group on the wafer 20, and then imprint the second surface S2 through the imprinting film 10 to form an imprinted pattern with the first surface S1 and the second surface S2 having a preset angle θ.

[0039] In step S20, the imprinting film 10 can be selected from hard or soft film templates with different material hardness according to actual needs, and no limitation is made here. The imprinting film 10 has an imprinting surface S3 for contacting and imprinting with the wafer 20, and the imprinting surface S3 is formed with an imprinting pattern, which is designed according to actual needs.

[0040] The embossing surface S3 also has a first calibration group and a second calibration group. The first and second calibration groups can be multiple or a single specific graphic. For example, a graphic feature set within the embossed pattern can be used as the first or second calibration group; that is, the first and / or second calibration groups are part of the embossed pattern on the embossed surface S3. In an alternative embodiment, such as... Figure 2 As shown, the first marking group and / or the second marking group can also be separately designed calibration patterns on the imprinting surface S3 in areas other than the imprinted pattern. That is, the imprinting surface S3 of the imprinting film 10 has a pattern area 11 for forming the imprinted pattern, and the first marking group and / or the second marking group are located outside the pattern area 11. The calibration pattern can be a cross shape, a grid shape, a circle, a rectangle, or other shapes, etc., and this embodiment is not limited to this.

[0041] In other alternative embodiments, the first calibration group is a part of the embossed pattern, and the second calibration group is a separately designed calibration pattern; or, the first calibration group is a separately designed calibration pattern, and the second calibration group is a part of the embossed pattern; or, some calibration portions of the first calibration group are part of the embossed pattern, and some calibration portions are separately designed calibration patterns; similarly, some calibration portions of the second calibration group are part of the embossed pattern, and some calibration portions are separately designed calibration patterns. Based on the above, the specific calibration group design can be reasonably designed according to actual needs, and is not limited here.

[0042] Furthermore, the arrangement of the first calibration group and the second calibration group at a preset angle θ on the imprinting surface S3 means that the overall image of the first calibration group is consistent with the overall image of the second calibration group, and they are rotated clockwise or counterclockwise around a certain center by a preset angle θ. Preferably, the first calibration group and the second calibration group are formed by rotating the preset angle θ around the center of the imprinted pattern on the imprinting surface S3. The preset angle θ is set according to the requirements of the imprinted pattern in the actual imprinting operation; for example, it can be 22.5°, and is not limited here.

[0043] The wafer 20 has a first surface S1 and a second surface S2 arranged opposite to each other. During the angle imprinting process, the first surface S1 of the wafer 20 forms an imprinted pattern, and the second surface S2 of the wafer 20 forms an imprinted pattern rotated at a predetermined angle θ with the imprinted pattern of the first surface S1. The wafer 20 can be made of a transparent or semi-transparent material, such as a diffraction grating body. Its transparency is sufficient to allow observation or identification of the first or second set of marks on the first surface S1 during imprinting on the second surface S2. For example, the wafer 20 can be a circular structure or a square structure, etc.

[0044] In step S30, the imprinting of the imprinting film 10 creates an imprinted pattern, a first mark group, and a second mark group on the first surface S1 of the wafer 20. In step S40, the second surface S2 is first aligned with the imprinting surface S3, and then the first mark group on the imprinting film 10 is aligned with the second mark group on the wafer 20, and / or the second mark group on the imprinting film 10 is aligned with the first mark group on the wafer 20. The alignment is achieved by using a CCD image imaging device for identification, analysis, and processing, followed by rotating the imprinting film 10 by a preset angle θ to align the mark group with the first mark group.

[0045] In other optional embodiments, the angle imprinting alignment method further includes:

[0046] S10, Imprint film 10 preparation step: Provide a master plate, on which a preset imprint pattern and a first identification group and a second identification group are made; transfer the imprint pattern and the first identification group and the second identification group on the master plate to the imprint film 10, so that the imprint surface S3 of the imprint film 10 has an imprint pattern and a first calibration group corresponding to the first identification group and a second calibration group corresponding to the second identification group.

[0047] Preferably, the first or second identification group can be formed on the master plate by etching or by laser marking. The design of the structure and position of the first or second identification group can refer to the design of the first or second calibration group described above, and will not be repeated here.

[0048] In steps S30 and S40, the imprinting process for the first surface S1 and the second surface S2 can be, but is not limited to, thermal imprinting, ultraviolet imprinting, micro-contact imprinting, etc., and is not limited here.

[0049] Taking ultraviolet (UV) imprinting technology as an example, firstly, imprinting adhesive is uniformly coated on the first surface S1 of the wafer 20. Then, imprinting is performed by contacting the imprinting surface S3 of the imprinting film 10 with the first surface S1 of the wafer 20. Next, the imprinting adhesive is cured by UV irradiation. Finally, the imprinting film 10 is removed from the first surface S1, thus completing the imprinting process. The imprinting process for the second surface S2 is the same. It should be noted that the specific imprinting steps can be performed using existing equipment and methods, and will not be elaborated further here.

[0050] The above steps eliminate the need to rotate the stage below the wafer to achieve angled imprinting, which can directly eliminate mechanical errors caused by stage rotation and greatly improve the rotational accuracy of angled double-sided imprinting operations.

[0051] Example 2

[0052] Please see Figures 3-6 In this embodiment, the first calibration group includes at least calibration point A1 and calibration point A2, and the second calibration group includes at least calibration point B1 and calibration point B2; the straight line passing through calibration points A1 and A2 intersects the straight line passing through calibration points B1 and B2 at a preset angle θ. Preferably, the intersection point of the straight line passing through calibration points A1 and A2 and the straight line passing through calibration points B1 and B2 coincides with the center point of the embossed pattern.

[0053] like Figure 4 , Figure 5As shown, after the first side S1 is imprinted, marking points A1, A2, B1, and B2, respectively, corresponding to marking points A1, A2, B1, and B2, are formed on the first side S1 of the wafer 20. Next, during the second side S2 imprinting, marking point A1 on the imprint film 10 is aligned with marking point B1 on the first side S1 of the wafer 20, and marking point A2 on the imprint film 10 is aligned with marking point B2 on the first side S1 of the wafer 20. After alignment, the imprinting operation can be performed, thereby obtaining, for example... Figure 6 The imprinted pattern on the first surface S1 (shown as a dashed line in the figure) and the imprinted pattern on the second surface S2 (shown as a solid line in the figure) are arranged at a predetermined angle θ. In other embodiments, the calibration point B1 on the imprinting film 10 can be aligned with the marking point A1 on the first surface S1 of the wafer 20, and the calibration point B2 on the imprinting film 10 can be aligned with the marking point A2 on the first surface S1 of the wafer 20. After alignment, the imprinting operation can be performed. It should be noted that "alignment" means that when the imprinting film 10 is moved along the imprinting direction until it contacts the wafer 20, the calibration point and the marking point coincide.

[0054] Example 3

[0055] This invention also provides a rotation angle imprinting alignment device, employing the rotation angle imprinting alignment method described in any of the above embodiments. Similarly, it can eliminate mechanical errors caused by the rotation of the stage beneath the wafer, greatly improving the rotational accuracy of rotation angle double-sided imprinting operations, thereby enhancing the wafer imprinting effect.

[0056] Example 4

[0057] This invention also provides a rotating embossing product, employing the rotating embossing alignment method described in any of the above embodiments. The rotating embossing product can include, but is not limited to, products requiring both front and back side patterns and precise deflection angles, such as FOT lenses. Similarly, it eliminates mechanical errors caused by the rotation of the stage beneath the wafer, greatly improving the rotational accuracy of rotating double-sided embossing operations, thereby enhancing the wafer embossing effect.

[0058] Furthermore, those skilled in the art should understand that although many problems exist in the prior art, each embodiment or technical solution of the present invention can be improved in only one or a few aspects, without necessarily solving all the technical problems listed in the prior art or the background art simultaneously. Those skilled in the art should understand that any content not mentioned in a claim should not be construed as a limitation on that claim.

[0059] Although this document frequently uses terms such as imprint film, first calibration group, second calibration group, wafer, first marking group, second marking group, master, first identification group, and second identification group, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of the invention; interpreting them as any additional limitation would contradict the spirit of the invention. The terms "first," "second," etc. (if present) in the specification, claims, and accompanying drawings of the embodiments of the invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for aligning and stamping at a rotating angle, characterized in that, include: Preparation steps; An imprinting film is provided, wherein the imprinting surface of the imprinting film has a first calibration group and a second calibration group, the first calibration group and the second calibration group being arranged at a preset angle θ on the imprinting surface; a wafer is provided, wherein the wafer has a first surface and a second surface opposite to each other; First side imprinting step: The first side and the imprinting surface face each other, and the first side is imprinted by the imprinting film so that the first side of the wafer has a first mark group corresponding to the first calibration group and a second mark group corresponding to the second calibration group; The second imprinting step involves aligning the second surface with the imprinting surface, aligning the first calibration group on the imprinting film with the second mark group on the wafer, and / or aligning the second calibration group on the imprinting film with the first mark group on the wafer, and then imprinting the second surface with the imprinting film to form an imprinted pattern on the first and second surfaces at a preset angle θ.

2. The angle-shifting imprinting alignment method according to claim 1, characterized in that: The first calibration group and the second calibration group are formed by rotating the preset angle θ around the center of the embossed pattern on the embossed surface.

3. The angle-shifting imprinting alignment method according to claim 1, characterized in that: The embossing film is a hard film template or a soft film template.

4. The angle-shifting imprinting alignment method according to claim 1, characterized in that: The embossing surface of the embossing film has a pattern area for forming the embossed pattern, and the first calibration group and / or the second calibration group are located outside the pattern area.

5. The angle-shifting imprinting alignment method according to claim 1, characterized in that: The first group of marks and / or the second group of marks are part of the embossed pattern on the embossed surface.

6. The angle-shifting imprinting alignment method according to claim 1, characterized in that: The first calibration group includes at least calibration point A1 and calibration point A2, and the second calibration group includes at least calibration point B1 and calibration point B2; the straight line passing through calibration point A1 and calibration point A2 intersects the straight line passing through calibration point B1 and calibration point B2 at a preset angle θ.

7. The angle-shifting imprinting alignment method according to claim 6, characterized in that: After the first imprinting step, the first side of the wafer is formed with the first mark group and the second mark group. The first mark group includes mark point A1 and mark point A2, which correspond to the calibration point A1 and calibration point A2, respectively. The second mark group includes mark point B1 and mark point B2, which correspond to the calibration point B1 and calibration point B2, respectively. In the second imprinting step, the calibration point A1 on the imprinting film is aligned with the mark point B1 on the first surface of the wafer, and the calibration point A2 on the imprinting film is aligned with the mark point B2 on the first surface of the wafer. Alternatively, the calibration point B1 on the imprinting film is aligned with the mark point A1 on the first surface of the wafer, and the calibration point B2 on the imprinting film is aligned with the mark point A2 on the first surface of the wafer. After the alignment is completed, the imprinting is performed.

8. The angle-shifting imprinting alignment method according to any one of claims 1-7, characterized in that: It also includes an imprint film preparation step; providing a master plate on which a preset imprint pattern and a first identification group and a second identification group are made; transferring the imprint pattern and the first identification group and the second identification group on the master plate onto the imprint film, so that the imprint surface of the imprint film has an imprint pattern and a first calibration group corresponding to the first identification group and a second calibration group corresponding to the second identification group.

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