Boss self-adaptive uniform temperature plate system for reinforcing computer

Abstract

The application relates to the heat transfer technology field of reinforced computer vapor chamber, and discloses a boss self-adaptive vapor chamber system for a reinforced computer, which comprises a vapor chamber unit, a heat-conducting boss unit and a computer mainboard unit; the vapor chamber unit comprises a vapor chamber; the heat-conducting boss unit comprises a heat-conducting boss which is connected with the vapor chamber through an elastic assembly; the computer mainboard unit comprises a computer mainboard and a heating device, the computer mainboard is connected with the heating device, the heating device is attached to the surface of the heat-conducting boss, and the computer mainboard is connected with the vapor chamber unit; the elastic assembly is used for making the heat-conducting boss face or be away from the heating device, and the compression amount of the elastic assembly can be adjusted. According to the disclosure, the heat-conducting boss has telescopic performance within a certain range through the adoption of the elastic assembly, the cooperation gap between the heating device and the heat-conducting boss can be compensated, the heating device and the boss unit can be closely attached, and reliable heat dissipation is achieved.

Description

Technical Field

[0001] This application relates to the field of heat transfer technology for rugged computer vapor chambers, and for example to a boss-adaptive vapor chamber system for rugged computers. Background Technology

[0002] Existing rugged computer motherboards rely primarily on heat dissipation plates for high-power heat-generating components. The bosses on existing rugged computer heat spreaders are generally machined as a single piece or inlaid with copper parts. However, once the heat spreader is machined, the height of the bosses cannot be changed.

[0003] The heat spreader bosses, which are machined as a single piece or inlaid with copper parts, inevitably have machining tolerances, resulting in variations in the height of the bosses within a certain range. At the same time, the height of the heat-generating components on the computer motherboard also has dimensional tolerances and welding height tolerances within a certain range.

[0004] Therefore, after the computer motherboard and heat spreader are assembled, problems such as chip overvoltage or poor bonding can easily occur. This can cause heat-generating components in the computer motherboard to be damaged due to overvoltage, or the bosses may not fit well with the chips, resulting in large gaps. The thermal interface material layer cannot effectively fill the gaps, causing a sharp increase in thermal resistance and preventing the chip's heat from being effectively conducted.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0006] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0007] This disclosure provides a boss-adaptive vapor chamber system for ruggedizing computers, which solves the problem that chip overvoltage or poor bonding can easily occur after the computer motherboard and vapor chamber are assembled.

[0008] In some embodiments, the adaptive heat spreader system for ruggedizing a computer includes a heat spreader unit, a heat-conducting boss unit, and a computer motherboard unit: the heat spreader unit includes a heat spreader; the heat-conducting boss unit includes a heat-conducting boss connected to the heat spreader unit via an elastic component; the computer motherboard unit includes a computer motherboard and a heating element, the computer motherboard is connected to the heating element, the heating element is in contact with the surface of the heat-conducting boss, and the computer motherboard is connected to the heat spreader unit; the elastic component is used to orient the heat-conducting boss toward or away from the heating element, and the compression of the elastic component is adjustable.

[0009] Optionally, the heat exchange plate unit further includes a heat transfer bushing. The heat exchange plate has a through hole in the middle for cooperating with the heat-conducting boss, and a plurality of first mounting holes are provided around the through hole. The first mounting holes are used to install elastic components. The heat transfer bushing is embedded in the through hole.

[0010] Optionally, the heat-conducting boss includes a platform portion and a boss portion. The platform portion is provided with a plurality of second mounting holes that mate with the positions of the first mounting holes for mounting the elastic component. The boss portion is connected to the middle of the platform portion and mates with the heat transfer bushing in terms of position and structure. The side surface of the boss portion is provided with an oil-containing groove, and the oil-containing groove is filled with heat-conducting oil.

[0011] Optionally, a limiting groove is provided on the side of the platform near the heat exchange plate, and the limiting groove is used to limit the elastic component.

[0012] Optionally, the elastic component includes a guide sleeve, a guide shaft, an elastic device, and a locking shaft. Multiple guide sleeves are provided, each capable of being lifted and lowered within a corresponding first mounting hole. Multiple guide shafts are provided, with their first ends embedded in corresponding second mounting holes. The second ends of the guide shafts pass through the guide sleeves and have grooves with internal threads on their walls. The elastic device is fitted over the guide shafts, with its first end abutting against the guide sleeve and its second end abutting against the bottom of the limiting groove. The locking shaft is threadedly connected to the guide shafts.

[0013] Optionally, the locking shaft includes a fixing cap and a connecting rod, the diameter of the fixing cap being larger than the diameter of the guide sleeve, and the connecting rod being provided with threads; the temperature equalization plate is provided with a recessed groove for limiting the fixing cap.

[0014] Optionally, the guide bushing is threadedly connected to the heat exchange plate through the first mounting hole; the guide bushing can be raised and lowered on the heat exchange plate to adjust the compression of the elastic device.

[0015] Optionally, the computer motherboard has through holes for fixing screws, and the heat spreader unit is provided with fixing posts, through which screws pass and are fixedly connected to the fixing posts.

[0016] Optionally, in the initial state, the heat-conducting boss is at the top dead center position, at which time the end face of the locking shaft is in contact with the stepped surface of the threaded hole, and the elastic device is in the minimum load state; in the extreme position state, the heat-conducting boss reaches the bottom dead center position after being squeezed and slid by the heating device, at which time the lower surface of the heat-conducting boss is in close contact with the heat spreader, the end face of the locking shaft is separated from the stepped surface of the threaded hole, and the elastic device is in the maximum load state.

[0017] Optionally, the adaptive heat spreader system also includes a pressure sensor, which is embedded in the central hole of the heat-conducting boss to detect the pressure value applied by the heat-conducting boss to the heating device, so as to adjust the compression of the elastic component.

[0018] The boss-adaptive heat dissipation plate system for ruggedizing computers provided in this disclosure can achieve the following technical effects:

[0019] The adaptive heat spreader system disclosed herein employs an elastic component, enabling the heat-conducting boss to have a certain range of expandability. This compensates for the clearance between the heat-generating device and the heat-conducting boss caused by machining tolerances, assembly tolerances, welding tolerances, etc., ensuring a tight fit between the heat-generating device and the boss unit for reliable heat dissipation. Furthermore, the compression of the elastic component can be adjusted to generate excessive pressure on the heat-conducting boss against the heat-generating device (chip).

[0020] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0021] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0022] Figure 1 This is a schematic diagram of the control logic of the boss adaptive temperature distribution plate system disclosed herein.

[0023] Figure 2 This is an exploded view of the overall structure of this disclosure;

[0024] Figure 3 This is a schematic cross-sectional view of the overall structure at the top dead center of this disclosure;

[0025] Figure 4 This is a schematic cross-sectional view of the overall structure at the lower stop point of this disclosure;

[0026] Figure 5 This is an exploded view of the vapor chamber unit structure disclosed herein;

[0027] Figure 6 This is a schematic diagram of the thermally conductive boss unit structure disclosed herein;

[0028] Figure 7 This is a schematic diagram of the assembly structure of the heat-conducting boss unit and the heat spreader unit disclosed herein.

[0029] Figure 8 This is a schematic diagram of the assembly structure of the computer motherboard unit and the vapor chamber unit disclosed herein.

[0030] In the diagram: 1. Heat spreader unit; 1.1. Heat spreader; 1.2. Guide bushing; 1.3. Heat transfer bushing; 1.1.1. First mounting hole; 1.1.2. Fixing post; 1.1.3. Threaded hole stepped surface; 2. Heat-conducting boss unit; 2.1. Heat-conducting boss; 2.2. Guide shaft; 2.1.1. Oil-containing groove; 2.1.2. Heat transfer oil; 2.1.3. Upper surface of heat-conducting boss; 2.1.4. Lower surface of heat-conducting boss; 3. Elastic device; 4. Locking shaft; 4.1. Locking shaft end face; 5. Computer motherboard unit; 5.1. Computer motherboard; 5.2. Heating device; 5.1.1. Fixing screw through hole; 6. Pressure sensor; 7. Heat-conducting interface material layer; 8. Screw. Detailed Implementation

[0031] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0032] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0033] In this disclosure, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for better describing the embodiments of this disclosure and their implementations, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to require them to be constructed and operated in a specific orientation. Furthermore, some of the aforementioned terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this disclosure according to the specific circumstances.

[0034] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0035] Unless otherwise stated, the term "multiple" means two or more.

[0036] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0037] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in the present disclosure can be combined with each other.

[0039] Combination Figure 1-8 As shown, this disclosure provides a boss adaptive heat spreader system for ruggedizing a computer, including a heat spreader unit 1, a heat-conducting boss unit 2, and a computer motherboard unit 5.

[0040] The heat spreader unit 1 includes a heat spreader 1.1; the heat-conducting boss unit 2 includes a heat-conducting boss 2.1, which is connected to the heat spreader 1.1 through an elastic component.

[0041] The computer motherboard unit 5 includes a computer motherboard 5.1 and a heat-generating device 5.2. The computer motherboard 5.1 is connected to the heat-generating device 5.2, and the heat-generating device 5.2 is attached to the surface of the heat-conducting boss 2.1. The computer motherboard 5.1 is connected to the heat spreader unit 1.

[0042] The elastic component is used to orient the heat-conducting boss 2.1 toward or away from the heat-generating device 5.2, and the compression of the elastic component is adjustable.

[0043] The adaptive heat spreader system for ruggedized computers provided in this disclosure employs an elastic component, allowing the heat-conducting boss 2.1 to have a certain range of expandability. This compensates for the clearance between the heat-generating device 5.2 and the heat-conducting boss 2.1 caused by machining tolerances, assembly tolerances, welding tolerances, etc., ensuring that the heat-generating device 5.2 and the boss unit can fit tightly together and reliably dissipate heat. Furthermore, the compression of the elastic component can be adjusted to allow the heat-conducting boss 2.1 to generate excessive pressure on the heat-generating device 5.2 (chip).

[0044] Optionally, the heat exchange plate unit 1 further includes a heat transfer bushing 1.3. The heat exchange plate 1.1 has a through hole in the middle for cooperating with the heat conduction boss 2.1. A plurality of first mounting holes 1.1.1 are provided around the through hole. The first mounting holes 1.1.1 are used to install elastic components. The heat transfer bushing 1.3 is embedded in the through hole.

[0045] As an example, the heat spreader 1.1 can be manufactured from a high thermal conductivity material such as aluminum alloy; the heat transfer bushing 1.3 can be made of a copper-based graphite composite material, giving it characteristics such as impact resistance, high thermal conductivity, and self-lubrication. The heat transfer bushing 1.3 is inserted into the central through hole of the heat spreader 1.1 by an interference fit.

[0046] Optionally, the heat-conducting boss 2.1 includes a platform portion and a boss portion. The platform portion is provided with a plurality of second mounting holes that mate with the first mounting hole 1.1.1 for mounting the elastic component. The boss portion is connected to the middle of the platform portion and mates with the heat transfer bushing 1.3 in position and structure. The side surface of the boss portion is provided with an oil-containing groove 2.1.1, which is filled with heat-conducting oil 2.1.2.

[0047] As an example, the thermally conductive boss 2.1 is manufactured from a material with high thermal conductivity, such as copper alloy or aluminum alloy.

[0048] Optionally, a limiting groove is provided on the side of the platform near the heat spreader 1.1, and the limiting groove is used to limit the elastic component.

[0049] Understandably, the limiting groove forms a cavity that can be used to accommodate at least a portion of the structure of the elastic component. The limiting groove can mate with the second mounting hole for mounting and limiting the elastic component.

[0050] Optionally, the elastic component includes a guide sleeve 1.2, a guide shaft 2.2, an elastic device 3, and a locking shaft 4. Multiple guide sleeves 1.2 are provided, each capable of being lifted and lowered within a corresponding first mounting hole 1.1.1. Multiple guide shafts 2.2 are provided, with their first ends respectively embedded in corresponding second mounting holes. The second end of each guide shaft 2.2 passes through the guide sleeve 1.2 and has a groove with an internal thread on its wall. The elastic device 3 is fitted over the guide shaft 2.2, with its first end abutting against the guide sleeve 1.2 and its second end abutting against the bottom of the limiting groove. The locking shaft 4 is threadedly connected to the guide shaft 2.2.

[0051] It is understood that the elastic device 3, as the main elastic structure of the elastic component, is used to adjust the gap between the heat spreader 1.1 and the heat-conducting boss 2.1. The compression of the elastic device 3 can be changed by adjusting the depth of the guide sleeve 1.2 on the heat spreader 1.1. Specifically, the second end of the guide shaft 2.2 is inserted into the guide sleeve 1.2, the elastic device 3 is sleeved on the rod part of the guide shaft 2.2, and inserted into the cavity between the limiting groove and the guide sleeve 1.2. The locking shaft 4 is fastened to the guide shaft 2.2 by threads to limit the movement.

[0052] As an example, the guide shaft 2.2 is inserted into the through hole in the middle of the heat-conducting boss 2.1 by an interference fit. The elastic device 3 can be a compression spring, a disc spring, or an elastic rubber pad. The locking shaft 4 is made of steel, copper, or aluminum alloy and is fixed to the second end of the guide shaft 2.2 by a thread.

[0053] Optionally, the locking shaft 4 includes a fixing cap and a connecting rod. The diameter of the fixing cap is larger than the diameter of the guide sleeve 1.2, and the connecting rod is provided with threads. The temperature equalization plate 1.1 is provided with a recessed groove for limiting the fixing cap.

[0054] Understandably, the sinkhole is used to limit the highest position of the fixing cap to prevent the locking shaft 4 from squeezing the guide sleeve 1.2 and affecting the compression of the elastic device 3.

[0055] Optionally, the guide sleeve 1.2 is threadedly connected to the heat spreader 1.1 through the first mounting hole 1.1.1; the guide sleeve 1.2 is movable on the heat spreader 1.1 to adjust the compression of the elastic device 3. This can change the preload of the elastic device 3, thereby changing the initial pressure value of the heat-conducting boss 2.1.

[0056] Optionally, the computer motherboard 5.1 has a fixing screw through hole 5.1.1, and the heat spreader unit 1 is provided with a fixing post 1.1.2. The screw 8 passes through the fixing screw through hole 5.1.1 and is fixedly connected to the fixing post 1.1.2, so that the heating device 5.2 and the upper surface 2.1.3 of the heat-conducting protrusion are tightly attached through the heat-conducting interface material layer 7.

[0057] It is understandable that the through hole of the computer motherboard unit 5 is fixedly connected to the fixing post 1.1.2 of the heat spreader unit 1 by screws 8, so that the computer motherboard 5.1 is connected to the heat spreader unit 1, and provides support for the expansion and contraction of the elastic component.

[0058] Optionally, in the initial state, the heat-conducting boss 2.1 is at the top dead center position, at which time the end face of the locking shaft 4 is in contact with the threaded hole step surface 1.1.3, and the elastic device 3 is in the minimum load state; in the extreme position state, the heat-conducting boss 2.1 reaches the bottom dead center position after being squeezed and slid by the heating device 5.2, at which time the lower surface 2.1.4 of the heat-conducting boss is in close contact with the heat spreader 1.1, the end face of the locking shaft 4 is separated from the threaded hole step surface 1.1.3, and the elastic device 3 is in the maximum load state.

[0059] Optionally, the adaptive heat spreader system also includes a pressure sensor 6, which is embedded in the central hole of the heat-conducting boss 2.1 to detect the pressure value applied by the heat-conducting boss 2.1 to the heating device 5.2, so as to adjust the compression of the elastic component.

[0060] Understandably, the pressure sensor 6 can collect the pressure value applied by the heat-conducting boss 2.1 to the heat-generating device 5.2 in real time, and adjust the depth of the guide sleeve 1.2 to keep this pressure value within the allowable pressure value, so as to avoid the heat-generating device 5.2 in the computer motherboard 5.1 being damaged due to overpressure, or the boss not fitting well with the chip, causing a sharp increase in thermal resistance and preventing the chip's heat from being effectively conducted.

[0061] The following is combined Figures 1 to 8 The working principle of this disclosure will be explained.

[0062] like Figure 1 Pressure sensor 6 transmits the collected signal to the amplification and filtering circuit module. The filtered and modulated signal is then transmitted to the A / D converter, which converts the analog signal into a digital signal and transmits it to the microcontroller module. The microcontroller module sets a threshold; if the threshold is exceeded, an alarm signal is issued. The microcontroller module is interconnected with the serial communication interface for data transmission, and the host computer can read the data information from the serial communication interface. Simultaneously, the microcontroller transmits the processed data to the display, showing in real-time the pressure value exerted on the heating element 5.2 of the computer motherboard 5.1. This allows the operator to adjust the depth of the guide sleeve 1.2 to bring the pressure value within the allowable range.

[0063] like Figure 2-4 In the initial state, the heat-conducting boss 2.1 is at the top dead center position. At this time, the end face of the locking shaft 4 is in contact with the stepped surface of the threaded hole 1.1.3, and the elastic device 3 is in the minimum load state. In the extreme position state, the heat-conducting boss 2.1 reaches the bottom dead center position after being squeezed and slid by the heating device 5.2. At this time, the lower surface 2.1.4 of the heat-conducting boss is in close contact with the heat spreader 1.1, the end face of the locking shaft 4 is separated from the stepped surface of the threaded hole 1.1.3, and the elastic device 3 is in the maximum load state.

[0064] like Figure 5The heat spreader unit 1 includes a heat spreader 1.1, a guide sleeve 1.2, and a heat transfer sleeve 1.3. The heat spreader 1.1 is made of a high thermal conductivity material such as aluminum alloy. The guide sleeve 1.2 is made of copper alloy and is connected to a threaded hole via an external thread. The compression of the elastic device 3 can be adjusted by changing the depth. The heat transfer sleeve 1.3 is made of copper-based graphite composite material and features impact resistance, high thermal conductivity, and self-lubrication. The heat transfer sleeve 1.3 is inserted into the hole of the heat spreader 1.1 via an interference fit. The heat spreader 1.1 has eight screw posts.

[0065] like Figure 6-7 The heat-conducting boss unit 2 includes a heat-conducting boss 2.1 and a guide shaft 2.2. The guide shaft 2.2 is inserted into the hole of the heat-conducting boss 2.1 by an interference fit. The heat-conducting boss 2.1 is made of a high thermal conductivity material such as copper alloy or aluminum alloy. The side surface of the heat-conducting boss 2.1 has an oil-containing groove 2.1.1, which contains heat-conducting oil 2.1.2. The elastic device 3 is a compression spring, a disc spring, an elastic rubber pad, etc. The locking shaft 4 is made of steel, copper, or aluminum alloy and is fixed to one end of the guide shaft 2.2 by a thread.

[0066] One end of the guide shaft 2.2 is inserted into the guide sleeve 1.2, the elastic device 3 is inserted into the cavity between the guide shaft 2.2 and the guide sleeve 1.2, and the locking shaft 4 is fastened to the guide shaft 2.2 by threads.

[0067] One end of the heat-conducting boss 2.1 is inserted into the heat-transferring bushing 1.3. The side surface of the heat-conducting boss 2.1 has an oil-containing groove 2.1.1, and the oil-containing groove 2.1.1 contains heat-conducting oil 2.1.2. The guide bushing 1.2 can adjust the depth to change the compression amount of the elastic device 3, change the preload of the elastic device 3, and thus change the initial pressure value of the heat-conducting boss 2.1.

[0068] like Figure 8 The computer motherboard unit 5 includes a computer motherboard 5.1 and a heating element 5.2. The computer motherboard 5.1 has a through hole for fixing screws 5.1.1. The through hole of the computer motherboard unit 5 is fixedly connected to the fixing post 1.1.2 of the heat spreader unit 1 by screws 8, so that the heating element 5.2 is tightly attached to the upper surface 2.1.3 of the heat-conducting protrusion through the heat-conducting interface material layer 7.

[0069] This invention discloses a heat-conducting boss adaptive heat spreader system for ruggedizing a computer. The heat-conducting boss unit 2 is an independent component, and it is assembled with the heat spreader unit 1, elastic device 3, locking shaft 4, computer motherboard unit 5, and pressure sensor 6 as a component. The pressure sensor 6 collects the pressure value of the heat-generating device 5.2 on the computer motherboard 5.1 in real time and reads the pressure value information through a display terminal. This allows the initial pressure value of the heat-conducting boss 2.1 to be adaptively and tightly fitted to the heat-generating device 5.2 on the computer motherboard 5.1 within the allowable pressure range, avoiding problems such as overpressure on the chip or insufficient fit.

[0070] The adaptive heat spreader system disclosed herein employs an elastic component to give the heat-conducting boss 2.1 a certain range of expandability. This compensates for the clearance between the heat-generating device 5.2 and the heat-conducting boss 2.1 caused by machining tolerances, assembly tolerances, welding tolerances, etc., ensuring that the heat-generating device 5.2 and the boss unit can fit tightly together and reliably dissipate heat. Furthermore, the compression of the elastic component can be adjusted to allow the heat-conducting boss 2.1 to generate excessive pressure on the heat-generating device 5.2 (chip).

[0071] The foregoing description and accompanying drawings fully illustrate embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included or substituted for parts and features of other embodiments. Embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A boss-type adaptive heat dissipation plate system for ruggedizing computers, characterized in that, include: A heat exchanger unit (1) includes a heat exchanger (1.1); The heat-conducting boss unit (2) includes a heat-conducting boss (2.1), which is connected to the heat-dissipating plate (1.1) through an elastic component; The computer motherboard unit (5) includes a computer motherboard (5.1) and a heat-generating device (5.2). The computer motherboard (5.1) is connected to the heat-generating device (5.2), and the heat-generating device (5.2) is attached to the surface of the heat-conducting boss (2.1). The computer motherboard (5.1) is connected to the heat spreader unit (1). The elastic component is used to orient the heat-conducting boss (2.1) toward or away from the heat-generating device (5.2), and the compression of the elastic component is adjustable; The temperature distribution plate unit (1) includes: The temperature distribution plate (1.1) has a through hole in the middle for cooperating with the heat-conducting boss (2.1), and a plurality of first mounting holes (1.1.1) are provided around the through hole. The first mounting holes (1.1.1) are used to install elastic components; the heat transfer bushing (1.3) is embedded in the through hole; The thermally conductive boss (2.1) includes: The platform section is provided with several second mounting holes that mate with the first mounting hole (1.1.1) for mounting the elastic component; the boss section is connected to the middle of the platform section and mates with the heat transfer bushing (1.3) in position and structure. The side surface of the boss section is provided with an oil-containing groove (2.1.1) and the oil-containing groove (2.1.1) is filled with heat-conducting oil (2.1.2).

2. The boss adaptive temperature distribution plate system according to claim 1, characterized in that, A limiting groove is provided on the side of the platform near the heat exchange plate (1.1), and the limiting groove is used to limit the elastic component.

3. The boss adaptive temperature distribution plate system according to claim 1 or 2, characterized in that, The elastic component includes: Multiple guide bushings (1.2) are provided, each of which can be lifted and installed in the corresponding first mounting hole (1.1.1); A plurality of guide shafts (2.2) are provided. The first ends of the plurality of guide shafts (2.2) are respectively embedded in corresponding second mounting holes. The second ends of the guide shafts (2.2) pass through the guide shaft sleeve (1.2). The second ends are provided with grooves, and the groove walls are provided with internal threads. An elastic device (3) is fitted outside the guide shaft (2.2). The first end of the elastic device (3) abuts against the guide shaft sleeve (1.2), and the second end abuts against the bottom of the limiting groove. The locking shaft (4) is threadedly connected to the guide shaft (2.2).

4. The boss adaptive temperature distribution plate system according to claim 3, characterized in that, The locking shaft (4) includes a fixing cap and a connecting rod. The diameter of the fixing cap is larger than the diameter of the guide sleeve (1.2), and the connecting rod is provided with threads. The temperature distribution plate (1.1) is provided with a recessed groove for limiting the fixing cap.

5. The boss adaptive temperature distribution plate system according to claim 3, characterized in that, The guide bushing (1.2) is threadedly connected to the heat exchange plate (1.1) through the first mounting hole (1.1.1); The guide bushing (1.2) can be raised and lowered on the heat exchange plate (1.1) to adjust the compression of the elastic device (3).

6. The boss adaptive temperature distribution plate system according to claim 3, characterized in that, The computer motherboard (5.1) has a through hole for fixing screws (5.1.1), and the heat spreader unit (1) is provided with a fixing post (1.1.2). The screw (8) passes through the through hole for fixing screws. 5.1.1) is fixedly connected to the fixed post (1.1.2) so that the heating device (5.2) and the upper surface (2.1.3) of the heat-conducting protrusion are tightly bonded through the heat-conducting interface material layer (7).

7. The boss adaptive temperature distribution plate system according to claim 3, characterized in that, In the initial state, the heat-conducting boss (2.1) is at the top dead center position, at which time the end face of the locking shaft (4) is flush with the stepped surface of the threaded hole ( 1.1.3) When the parts are in contact, the elastic device (3) is in a state of minimum load. In its extreme position, the heat-conducting boss (2.1) reaches its lower stop point after being squeezed and slid by the heating device (5.2). At this time, the lower surface (2.1.4) of the heat-conducting boss is in close contact with the heat spreader (1.1), and the end face of the locking shaft (4) is in close contact with the stepped surface of the threaded hole. 1.1.3) Separation, the elastic device (3) is in the maximum load state.

8. The boss adaptive temperature distribution plate system according to claim 1, characterized in that, Also includes: A pressure sensor (6) is embedded in the center hole of the heat-conducting boss (2.1) to detect the pressure value applied by the heat-conducting boss (2.1) to the heating device (5.2) in order to adjust the compression of the elastic component.

Images