Bonding apparatus capable of improving alignment accuracy

Abstract

The present application is a bonding device capable of improving alignment accuracy, mainly comprising a pressing unit, a stage and a plurality of movable adsorption modules. The pressing unit faces the stage and is used to bond a substrate placed on the stage. The movable adsorption module comprises a frame, an adsorption unit, a rolling module and an adsorption unit driver, wherein the adsorption unit driver is connected to the frame and drives the adsorption unit to rise and fall through the frame. The rolling module is located between the frame and the adsorption unit, so that the adsorption unit can displace relative to the frame. In the process of aligning the substrate, the movable adsorption module can continuously adsorb and flatten the substrate, so as to improve the accuracy of aligning the substrate.

Description

Technical Field

[0001] This invention relates to a bonding apparatus that can improve alignment accuracy. During the alignment of substrates, a movable adsorption module can continuously adsorb and flatten the substrate to improve the accuracy of substrate alignment. Background Technology

[0002] Integrated circuit technology has matured, and electronic products are currently trending towards thinner, smaller, higher-performance, more reliable, and smarter designs. Chips within electronic products significantly impact their performance, with some of these performance characteristics related to chip thickness. For example, thinner wafers can improve heat dissipation efficiency, enhance mechanical properties, improve electrical performance, and reduce package size and weight.

[0003] In semiconductor manufacturing, thinning, via etching, and back-side metallization processes are typically performed on the back side (lower surface) of the wafer. Generally, a bonding process is performed before wafer thinning, where an adhesive layer is placed between the wafer and a substrate (e.g., sapphire glass). The wafer and substrate are then bonded together using lamination units and a stage. After wafer thinning, a debonding process is performed to separate the wafer from the substrate.

[0004] However, the coefficients of thermal expansion of the different material layers of a wafer are different, so wafer warpage often occurs after high-temperature processing. In addition, each wafer may have different warpage shapes, such as saddle-shaped or hill-shaped, which is not conducive to the alignment of the stacked wafers in the subsequent bonding process and is prone to inaccurate alignment. Summary of the Invention

[0005] To address the problems of prior art, this invention proposes a novel bonding apparatus that improves alignment accuracy. It utilizes multiple movable adsorption modules to adsorb and flatten warped substrates placed on the support surface of a stage. During substrate alignment, the movable adsorption modules continuously adsorb the substrate, and as the substrate displaces relative to the support surface of the stage, the alignment unit can align a flat substrate, thus improving the accuracy of substrate alignment.

[0006] One objective of this invention is to provide a bonding device that can improve alignment accuracy, mainly comprising a first cavity, a second cavity, a pressing unit, a stage, and a plurality of movable adsorption modules, wherein the first cavity is used to connect to the second cavity and form a sealed space between the two.

[0007] A movable adsorption module is mounted on a platform and includes a frame, an adsorption unit, a rolling module, and an adsorption unit driver. The adsorption unit driver is connected to the frame and drives the adsorption unit to rise and fall relative to the bearing surface of the platform. Specifically, the adsorption unit driver can lift the adsorption unit and adsorb the warped substrate. Then, the adsorption unit driver will lower the adsorption unit to flatten the warped portion of the substrate.

[0008] The rolling module is located between the frame and the adsorption unit, allowing the adsorption unit to move relative to the frame along the bearing surface of the parallel stage. During the alignment process, the adsorption unit continuously adsorbs the substrate, and the alignment unit moves relative to the bearing surface of the stage via the substrate. Therefore, during alignment, the substrate does not return to its original warped state, which helps improve the accuracy of substrate alignment.

[0009] One objective of this invention is to provide a bonding device that improves alignment accuracy. This is achieved by incorporating a rolling module or a deforming unit between the adsorption unit and the frame, facilitating displacement of the adsorption unit relative to the frame. Furthermore, the rolling module or deforming unit reduces friction between the adsorption unit and the frame, thus preventing the generation of contaminating particles during relative displacement.

[0010] To achieve the above objectives, the present invention proposes a bonding device that improves alignment accuracy, comprising: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect to the second cavity and forms a sealed space between the first cavity and the second cavity; a pressing unit connected to the first cavity and located in the sealed space; a stage connected to the second cavity and located in the sealed space, the stage including a bearing surface facing the pressing unit, the bearing surface being used to support a first substrate and place a second substrate on the first substrate, wherein a plurality of setting grooves are provided on the bearing surface of the stage; and a plurality of movable adsorption modules, comprising: a frame disposed in the setting groove of the bearing surface; an adsorption unit connected to the frame, wherein the adsorption unit is used to adsorb the first substrate placed on the bearing surface of the stage; a rolling module located between the frame and the adsorption unit, causing the adsorption unit to move relative to the frame; and an adsorption unit driver connected to the frame and driving the adsorption unit to rise and fall relative to the bearing surface of the stage via the frame, so that the adsorption unit flattens the adsorbed first substrate.

[0011] This invention provides another bonding device that can improve alignment accuracy, comprising: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect to the second cavity and form a sealed space between the first cavity and the second cavity; a pressing unit connected to the first cavity and located in the sealed space; a stage connected to the second cavity and located in the sealed space, the stage including a bearing surface facing the pressing unit, the bearing surface being used to support a first substrate and place a second substrate on the first substrate, wherein a plurality of setting grooves are provided on the bearing surface of the stage; and a plurality of movable adsorption modules, comprising: a frame disposed in the setting groove of the bearing surface; an adsorption unit connected to the frame, wherein the adsorption unit is used to adsorb the first substrate placed on the bearing surface of the stage; a deformation unit located between the frame and the adsorption unit, causing the adsorption unit to displace relative to the frame; and an adsorption unit driver connected to the frame and driving the adsorption unit to rise and fall relative to the bearing surface of the stage via the frame, causing the adsorption unit to flatten the adsorbed first substrate.

[0012] In at least one embodiment of the present invention, a plurality of distance measuring units are disposed on the pressing unit and used to measure the distance between the plurality of distance measuring units and the first substrate placed on the bearing surface of the stage.

[0013] In at least one embodiment of the present invention, the adsorption unit driver adjusts the rising height of the adsorption unit according to the measurement result of the distance measurement unit, so that the adsorption unit adsorbs the first substrate.

[0014] In at least one embodiment of the present invention, the adsorption unit includes an adsorption port and an exhaust line, the exhaust line being fluidly connected to the adsorption port and used to form a negative pressure on the adsorption port, so that the adsorption port adsorbs the first substrate placed on the support surface.

[0015] In at least one embodiment of the present invention, the frame includes a receiving space for receiving the adsorption unit, the cross-sectional area of ​​the receiving space being larger than the cross-sectional area of ​​the adsorption unit, such that the adsorption unit is displaced relative to the bearing surface of the stage within the receiving space.

[0016] In at least one embodiment of the present invention, the accommodating space of the frame includes at least one connecting bottom surface and at least one through hole is provided on the connecting bottom surface, the rolling module is located on the connecting bottom surface, and a fastener passes through the through hole of the connecting bottom surface to connect the adsorption unit, wherein the cross-sectional area of ​​the through hole is larger than the cross-sectional area of ​​a rod portion of the fastener.

[0017] In at least one embodiment of the present invention, the rolling module includes a base, a plurality of balls and a base, the base being connected to the frame and the base being connected to the adsorption unit, and the plurality of balls being located between the bases.

[0018] In at least one embodiment of the present invention, a plurality of elastic units are included, located between the frame and the adsorption unit.

[0019] In at least one embodiment of the present invention, a plurality of alignment units are located on the bearing surface of the stage and are used to align the first substrate and the second substrate. During the alignment process of the alignment unit aligning the first substrate, the adsorption unit is moved relative to the bearing surface of the stage within the accommodating space of the frame via the first substrate.

[0020] The beneficial effects of the present invention are: it provides a novel bonding machine with a movable adsorption module. During the alignment process of the alignment unit, the movable adsorption module continuously adsorbs the substrate and moves with the substrate relative to the bearing surface of the stage, so that the alignment unit can align the flat substrate and improve the accuracy of substrate alignment. Attached Figure Description

[0021] Figure 1 This is a perspective schematic diagram of an embodiment of the bonding apparatus of the present invention that can improve alignment accuracy.

[0022] Figure 2 This is a cross-sectional schematic diagram of an embodiment of the bonding apparatus of the present invention that can improve alignment accuracy.

[0023] Figure 3 This is a perspective view of an embodiment of the bonding unit and stage of the bonding apparatus of the present invention, which can improve alignment accuracy.

[0024] Figure 4 This is a three-dimensional cross-sectional schematic diagram of an embodiment of the movable adsorption module of the bonding device of the present invention, which can improve alignment accuracy.

[0025] Figure 5 This is an exploded perspective view of an embodiment of the adsorption unit and frame of the bonding device of the present invention, which can improve alignment accuracy.

[0026] Figure 6 This is a perspective view of an embodiment of the adsorption unit and frame of the bonding device of the present invention, which can improve alignment accuracy.

[0027] Figure 7 This is a cross-sectional schematic diagram of an embodiment of the adsorption unit, frame, and rolling module of the bonding device of the present invention, which can improve alignment accuracy.

[0028] Figure 8 This is a perspective view of an embodiment of the rolling module of a bonding device according to the present invention, which can improve alignment accuracy.

[0029] Figure 9 This is a cross-sectional schematic diagram of an embodiment of the bonding device of the present invention that can improve alignment accuracy by rising and adsorbing the substrate.

[0030] Figure 10This is a cross-sectional schematic diagram of an embodiment of the bonding device of the present invention that can improve alignment accuracy by adsorbing and flattening a substrate.

[0031] Explanation of reference numerals in the attached drawings: 10 - Bonding device that improves alignment accuracy; 111 - First cavity; 112 - Sealed space; 113 - Second cavity; 121 - First substrate; 123 - Second substrate; 13 - Pressing unit; 14 - Alignment unit; 15 - Stage; 151 - Bearing surface; 153 - Groove; 155 - Air extraction port; 16 - Air extraction motor; 17 - Movable adsorption module; 171 - Adsorption unit driver; 172 - Accommodation space; 1721 - First opening; 1723 - Second opening; 1725 - Connecting bottom surface; 173-Adsorption unit; 1731-Adsorption port; 1732-Fixing hole; 1733-Elastic unit; 1735-Evacuation line; 174-Gap space; 175-Fastener; 1751-Head; 1753-Rod; 177-Frame; 1771-Perforation; 179-Rolling module; 1791-Base; 1792-Groove; 1793-Base; 1794-Connecting hole; 1795-Ball; 18-Distance measuring unit; 191-Cavity driver; 193-Pressure unit driver. Detailed Implementation

[0032] Please see Figure 1 and Figure 2 Figures show a perspective view and a cross-sectional view of an embodiment of the bonding device for improving alignment accuracy according to the present invention. As shown in the figures, the bonding device 10 for improving alignment accuracy includes a first cavity 111, a second cavity 113, a pressing unit 13, a stage 15, and a plurality of movable adsorption modules 17, wherein the first cavity 111 faces the second cavity 113, and the first cavity 111 is movable relative to the second cavity 113.

[0033] like Figure 2 As shown, the pressing unit 13 is located within and connected to the first cavity 111. The stage 15 is located within and connected to the second cavity 113. The bearing surface 151 of the stage 15 faces the pressing unit 13. After the first cavity 111 is connected to the second cavity 113, a sealed space 112 is formed between them, and the pressing unit 13 and the stage 15 are located within the sealed space 112. The bearing surface 151 of the stage 15 is used to support a first substrate 121, and a second substrate 123 can be placed on the first substrate 121.

[0034] like Figure 1As shown, in one embodiment of the present invention, the first cavity 111 may be connected to a cavity actuator 191, wherein the cavity actuator 191 is located outside the sealed space 112 and connected to the first cavity 111. The cavity actuator 191 is used to drive the first cavity 111 to move relative to the second cavity 113. For example, the cavity actuator 191 may be a linear actuator.

[0035] Furthermore, the bonding unit driver 193 is located outside the enclosed space 112 and connected to the bonding unit 13. For example, the bonding unit driver 193 can be a linear actuator to drive the bonding unit 13 to move closer to or away from the stage 15. After the first substrate 121 and the second substrate 123 are aligned, the bonding unit driver 193 can drive the bonding unit 13 to move closer to the bearing surface 151 of the stage 15 and press the first substrate 121 and the second substrate 123 carried by the stage 15 to complete the bonding of the first substrate 121 and the second substrate 123.

[0036] like Figure 2 As shown, a vacuum motor 16 may be provided in the first cavity 111 or the second cavity 113. The vacuum motor 16 is fluidly connected to the sealed space 112 and is used to extract the gas in the sealed space 112 to reduce the pressure in the sealed space 112, so that the sealed space 112 is maintained in a vacuum or low-pressure state.

[0037] The carrier surface 151 of the stage 15 is used to support a first substrate 121 and a second substrate 123 stacked together. For example, the first substrate 121 is a carrier substrate, and the second substrate 123 is a wafer. An adhesive layer is provided between the first substrate 121 and the second substrate 123 to bond the first substrate 121 and the second substrate 123 together. In different embodiments, the first substrate 121 and the second substrate 123 may also be wafers that have undergone semiconductor processing.

[0038] like Figure 3 and Figure 4 As shown, the movable adsorption module 17 is located in the second cavity 113 and is disposed on the stage 15. In one embodiment of the present invention, a plurality of mounting grooves 153 may be provided on the bearing surface 151 of the stage 15, and the movable adsorption module 17 is disposed in each mounting groove 153, wherein the movable adsorption module 17 can be raised and lowered relative to the bearing surface 151 of the stage 15, and can be displaced along a direction parallel to the bearing surface 151 of the stage 15.

[0039] like Figure 5 and Figure 6As shown, the movable adsorption module 17 includes an adsorption unit driver 171, an adsorption unit 173, a frame 177, and a rolling module 179. The frame 177 is disposed within the mounting groove 153 of the platform 15 and includes an accommodating space 172 for accommodating the adsorption unit 173, wherein a portion of the adsorption unit 173 protrudes from the frame 177. The adsorption unit driver 171 is connected to the frame 177 and, via the frame 177, drives the adsorption unit 173 to rise and fall relative to the bearing surface 151 of the platform 15. For example, the adsorption unit driver 171 can be a linear actuator.

[0040] The rolling module 179 is located between the frame 177 and the adsorption unit 173 to facilitate the displacement of the adsorption unit 173 relative to the frame 177 within the accommodating space 172. In one embodiment of the invention, the accommodating space 172 of the frame 177 includes at least one connecting bottom surface 1725, and the rolling module 179 is disposed on the connecting bottom surface 1725. The adsorption unit 173 is placed within the accommodating space 172 of the frame 177, such that the connecting bottom surface 1725 of the frame 177 is connected to and supports the adsorption unit 173 via the rolling module 179.

[0041] At least one through hole 1771 can be provided on the connecting bottom surface 1725 of the frame 177. A fastener 175 can pass through the through hole 1771 of the connecting bottom surface 1725 and be connected to the fixing hole 1732 at the bottom of the adsorption unit 173. For example, the fastener 175 can be a screw, and the fixing hole 1732 can be a screw hole.

[0042] Specifically, the lateral cross-sectional area of ​​the adsorption unit 173 can be smaller than the lateral cross-sectional area of ​​the accommodating space 172. When the adsorption unit 173 is placed in the accommodating space 172 of the frame 177, the adsorption unit 173 will not completely fill the accommodating space 172, and there is a gap space 174 between the adsorption unit 173 and the frame 177, so that the adsorption unit 173 can be displaced relative to the frame 177 and / or the bearing surface 151 of the platform 15 within the accommodating space 172, for example, in a direction parallel to the bearing surface 151 of the platform 15.

[0043] The fastener 175 does not completely secure the adsorption unit 173 and the frame 177, allowing the adsorption unit 173 to move relative to the frame 177. Specifically, the fastener 175 may include a head 1751 and a rod portion 1753, where the cross-sectional area of ​​the head 1751 is larger than that of the rod portion 1753, for example, the rod portion 1753 may be a screw. The rod portion 1753 of the fastener 175 is used to connect to the fixing hole 1732 of the adsorption unit 173, while there is a small gap between the head 1751 of the fastener 175 and the frame 177. Furthermore, the cross-sectional area of ​​the rod portion 1753 of the fastener 175 may be smaller than the cross-sectional area of ​​the through hole 1771 of the frame 177, allowing the rod portion 1753 of the fastener 175 to move relative to the frame 177 within the through hole 1771.

[0044] In one embodiment of the present invention, a plurality of elastic units 1733, such as springs, may be provided between the adsorption unit 173 and the frame 177, wherein the elastic units 1733 are located within the spacing space 174.

[0045] like Figure 7 and Figure 8 As shown, the rolling module 179 includes a base 1791, a base 1793, and at least one ball 1795. The ball 1795 is located between the base 1791 and the base 1793, creating a gap between the base 1791 and the base 1793 and preventing the base 1793 from directly contacting the base 1791. The base 1793 can be displaced relative to the base 1791, causing the ball 1795 between them to roll.

[0046] The base 1791 of the rolling module 179 is connected to the frame 177, while the base 1793 is connected to the adsorption unit 173. Furthermore, a groove 1792 can be provided on the surface of the base 1791 facing the base 1793, and a ball bearing 1795 is placed in the groove 1792, allowing the ball bearing 1795 to roll within the groove 1792. By providing the rolling module 179, the frictional force during the displacement of the adsorption unit 173 relative to the frame 177 can be reduced, and the generation of particles during displacement can be prevented.

[0047] In another embodiment of the present invention, the aforementioned rolling module 179 can also be replaced by a deformable unit, which is located between the adsorption unit 173 and the frame 177. For example, the deformable unit can be a spring or an elastic pad. Specifically, the deformable unit can be disposed on the connecting bottom surface 1725 of the frame 177, so that the connecting bottom surface 1725 of the frame 177 supports and connects the adsorption unit 173 via the deformable unit. When the adsorption unit 173 is displaced relative to the frame 177, the deformable unit will deform. The arrangement of the deformable unit can also prevent the adsorption unit 173 from directly contacting the frame 177, thus preventing friction generated when the adsorption unit 173 and the frame 177 are displaced relative to each other.

[0048] In one embodiment of the present invention, the base 1791 and the base 1793 may be annular, and a connecting hole 1794 is provided on the base 1791 and the base 1793. The groove 1792 provided on the base 1791 may be an annular groove, and a plurality of balls 1795 may be arranged in the annular groove. The connecting hole 1794 of the rolling module 179 may be aligned with the fixing hole 1732 of the adsorption unit 173 and the through hole 1771 of the frame 177, and the rod portion 1753 of the fastener 175 may pass through the through hole of the frame 177 and the connecting hole 1794 of the rolling module 179, and be fixed on the fixing hole 1732 of the adsorption unit 173, wherein the cross-sectional area of ​​the rod portion 1753 of the fastener 175 is smaller than the cross-sectional area of ​​the connecting hole 1794.

[0049] like Figure 3 As shown, a plurality of alignment units 14 may be provided on the bearing surface 151 of the stage 15. The alignment units 14 are placed around the first substrate 121 and / or the second substrate 123 of the stage 15, and may be close to or away from the center of the first substrate 121, the second substrate 123 and / or the bearing surface 151 to align the first substrate 121 and the second substrate 123. For example, the alignment unit 14 may be rod-shaped and may extend and retract relative to the bearing surface 151 of the stage 15. After the alignment unit 14 protrudes from the bearing surface 151, it may be displaced radially toward the first substrate 121 along the bearing surface 151. During the displacement, the alignment unit 14 will contact and align the first substrate 121 to position the first substrate 121 at a fixed position on the bearing surface 151.

[0050] During the alignment process of the substrate, the alignment unit 14 may push the first substrate 121 to move relative to the bearing surface 151 of the stage 15, and the first substrate 121 may cause the adsorption unit 173 to move relative to the bearing surface 151 of the stage 15 within the accommodating space 172 of the frame 177, thereby compressing and / or stretching the elastic unit 1733 located between the adsorption unit 173 and the frame 177. Specifically, the first substrate 121 and the adsorption unit 173 will move along a direction parallel to the bearing surface 151.

[0051] When the adsorption unit 173 does not adsorb the first substrate 121, for example, when the first substrate 121 and the second substrate 123 have been bonded, the elastic unit 1733 will return to its original length, so that the adsorption unit 173 returns to the fixed position in the accommodating space 172.

[0052] like Figure 4 , Figure 5 and Figure 6As shown, the adsorption unit 173 includes at least one adsorption port 1731 and an extraction line 1735, with the extraction line 1735 fluidly connected to the adsorption port 1731. Specifically, at least one fluid channel may be provided inside the adsorption unit 173, and the extraction line 1735 is connected to the adsorption port 1731 via the fluid channel.

[0053] The suction line 1735 is used to connect a suction device, such as a motor. When the suction device is started, it will form a negative pressure on the suction port 1731 of the suction unit 173 through the suction line 1735 and adsorb the first substrate 121 placed on the support surface 151.

[0054] In one embodiment of the present invention, the accommodating space 172 of the frame 177 has a first opening 1721 and a second opening 1723. The first opening 1721 is located at the top of the frame 177, and when the frame 177 is placed in the mounting groove 153 of the platform 15, the first opening 1721 will be located on the bearing surface 151 of the platform 15. The exhaust pipe 1735 can be connected to an exhaust device via the second opening 1723, for example, the second opening 1723 is located at the bottom of the frame 177.

[0055] The extraction line 1735 can be a flexible extraction line. When the adsorption unit 173 is displaced relative to the frame 177, the adsorption unit 173 may bend the extraction line 1735.

[0056] In one embodiment of the present invention, such as Figure 3 As shown, a plurality of distance measurement units 18 may be provided on the pressing unit 13. For example, the distance measurement unit 18 may be a laser rangefinder. The distance measurement unit 18 is used to project the generated measurement beam onto the first substrate 121 to measure the distance between each distance measurement unit 18 and the first substrate 121.

[0057] The degree of warping or height of the first substrate 121 can be determined by the distances measured by each distance measuring unit 18. Then, based on the measurement results, the adsorption unit driver 171 can be controlled to adjust the rising height of the adsorption unit 173 and / or the frame 177, so that the adsorption unit 173 contacts and adsorbs the first substrate 121.

[0058] The distance measuring unit 18 can be disposed above the pressing unit 13, and a plurality of through holes are provided on the pressing unit 13. The measuring beam generated by the distance measuring unit 18 can be projected onto the first substrate 121 through the through holes on the pressing unit 13. In one embodiment of the present invention, the position of each distance measuring unit 18 can correspond to each movable adsorption module 17, for example, adsorption units 173 facing each movable adsorption module 17.

[0059] In one embodiment of the present invention, such as Figure 9As shown, the adsorption unit actuator 171 can drive the adsorption unit 173 to rise, causing the adsorption unit 173 to protrude from the bearing surface 151 of the stage 15 and adsorb the upwardly warped first substrate 121. Figure 10 As shown, the adsorption unit driver 171 drives the adsorption unit 173 to descend, for example, the height of the adsorption unit 173 is approximately the same as the bearing surface 151. When the adsorption unit 173 descends, it pulls the adsorbed first substrate 121 and flattens the upwardly warped first substrate 121.

[0060] A plurality of air extraction ports 155 may be provided on the bearing surface 151 of the stage 15. Each air extraction port 155 is fluidly connected to an air extraction device. When the device extracts air, a negative pressure is created at the air extraction port 155 to adsorb the first substrate 121 placed on the bearing surface 151 of the stage 15. Specifically, the air extraction ports 155 on the bearing surface 151 may be located inside the movable adsorption module 17 and used to adsorb the inner side of the first substrate 121, while the movable adsorption module 17 is used to adsorb the outer side of the first substrate 121 to improve the flatness of the first substrate 121. Furthermore, when the first substrate 121 is aligned by the alignment unit 14, the air extraction ports 155 on the bearing surface 151 will stop generating negative pressure, allowing the alignment unit 14 to push the first substrate 121 and the adsorption unit 173 to move relative to the bearing surface 151 of the stage 15.

[0061] In the drawings of this invention, the movable adsorption module 17 is disposed on the outer side of the first substrate 121 and / or the supporting surface 151. In practical applications, the movable adsorption module 17 can also be disposed on the inner side of the first substrate 121 and / or the supporting surface 151, for example... Figure 3 , Figure 9 and Figure 10 Some or all of the air extraction ports 155 may be movable adsorption modules 17.

[0062] Advantages of this invention:

[0063] A novel bonding machine with a movable adsorption module is provided. During the alignment process, the movable adsorption module continuously adsorbs the substrate and moves with the substrate relative to the bearing surface of the stage, enabling the alignment unit to align the flat substrate and improving the accuracy of substrate alignment.

[0064] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A bonding device that improves alignment accuracy, characterized in that, include: First cavity; The second cavity faces the first cavity, wherein the first cavity is used to connect the second cavity and form a sealed space between the first cavity and the second cavity; The pressing unit is connected to the first cavity and is located in the sealed space; A stage is connected to the second cavity and located in the sealed space. The stage includes a bearing surface facing the pressing unit. The bearing surface is used to support the first substrate and place the second substrate on the first substrate. A plurality of mounting grooves are provided on the bearing surface of the stage. and Several movable adsorption modules, including: The frame is positioned within the groove on the bearing surface; An adsorption unit is connected to the frame, wherein the adsorption unit is used to adsorb the first substrate placed on the support surface of the stage; A rolling module is located between the frame and the adsorption unit, which causes the adsorption unit to be displaced relative to the frame. An adsorption unit driver is connected to the frame and drives the adsorption unit to rise and fall relative to the bearing surface of the stage via the frame, so that the adsorption unit flattens the adsorbed first substrate.

2. The bonding apparatus for improving alignment accuracy according to claim 1, characterized in that, The pressing unit includes several distance measuring units disposed on it, which are used to measure the distance between the several distance measuring units and the first substrate placed on the bearing surface of the stage.

3. The bonding apparatus for improving alignment accuracy according to claim 2, characterized in that, The adsorption unit driver adjusts the rising height of the adsorption unit based on the measurement result of the distance measurement unit, so that the adsorption unit adsorbs the first substrate.

4. The bonding apparatus for improving alignment accuracy according to claim 1, characterized in that, The adsorption unit includes an adsorption port and an exhaust line. The exhaust line is fluidly connected to the adsorption port and is used to create a negative pressure at the adsorption port, so that the adsorption port adsorbs the first substrate placed on the support surface.

5. The bonding apparatus for improving alignment accuracy according to claim 1, characterized in that, The frame includes a accommodating space for accommodating the adsorption unit. The cross-sectional area of ​​the accommodating space is larger than the cross-sectional area of ​​the adsorption unit, so that the adsorption unit is displaced relative to the bearing surface of the platform within the accommodating space.

6. The bonding apparatus for improving alignment accuracy according to claim 5, characterized in that, The accommodating space of the frame includes a connecting bottom surface, and a through hole is provided on the connecting bottom surface. The rolling module is located on the connecting bottom surface, and the fastener passes through the through hole of the connecting bottom surface to connect the adsorption unit, wherein the cross-sectional area of ​​the through hole is larger than the cross-sectional area of ​​the rod of the fastener.

7. The bonding apparatus for improving alignment accuracy according to claim 5, characterized in that, The rolling module includes a base, several balls, and a base connected to the frame and the adsorption unit. The balls are located between the bases.

8. The bonding apparatus for improving alignment accuracy according to claim 1, characterized in that, It includes several elastic units located between the frame and the adsorption unit.

9. The bonding apparatus for improving alignment accuracy according to claim 5, characterized in that, The assembly includes several alignment units located on the bearing surface of the stage, which are used to align the first substrate and the second substrate. During the alignment process of the alignment unit aligning with the first substrate, the adsorption unit will be moved relative to the bearing surface of the stage within the accommodating space of the frame via the first substrate.

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