An electronic device

Abstract

The present application provides an electronic device, which eliminates the setting of the middle plate, and fixes and supports the circuit board and the battery on the supporting rear shell, which is conducive to reducing the thickness of the electronic device and improving the thinness of the electronic device. At the same time, the first temperature equalizing plate is fixed to the side of the back cover of the supporting rear shell facing the screen, and the first temperature equalizing plate is connected to the heating device on the circuit board by thermal conduction. In this way, the heat generated by the heating device can be transferred to the first temperature equalizing plate. Due to the heat equalization characteristics given by the first temperature equalizing plate based on its own working principle, the heat on the first temperature equalizing plate can quickly diffuse to the surroundings on the plane where the first temperature equalizing plate is located, thereby improving the uniformity of the heat transferred from the first temperature equalizing plate to the back cover, which is more conducive to the heat dissipation of the electronic device, and avoiding the damage to the electronic device and the problem of poor heat dissipation caused by the accumulation of heat at the position of the electronic device close to the heating device.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0002] With the rapid advancements in mobile phones, tablets, and other electronic devices, consumers are demanding more and more features from these devices. To meet these demands, more and more electronic components are being integrated into these devices. The increasing integration and assembly density of these components has led to a sharp increase in their operating power consumption and heat generation, necessitating a corresponding increase in the heat dissipation requirements of these electronic devices.

[0003] To improve heat dissipation, existing electronic devices often incorporate heat sinks. However, the presence of these heat sinks increases the overall thickness of the electronic device, which is detrimental to the device's slimming and lightweight design. Consequently, existing electronic devices often struggle to achieve both thinness and heat dissipation performance. Summary of the Invention

[0004] The embodiments of the present application provide an electronic device that can simultaneously achieve both thinness and heat dissipation performance of the electronic device.

[0005] An electronic device according to an embodiment of the present application includes: a screen, a supporting rear shell, a circuit board, a battery, and a first temperature equalizer. The supporting rear shell includes a back cover and a frame that are fixedly connected, the back cover and the screen are stacked and spaced apart, and the frame is arranged around the back cover and the screen; the circuit board and the battery are both located in the supporting rear shell and are fixed and supported on the supporting rear shell, the circuit board is used to integrate a heating device, and the heating device is thermally connected to the first temperature equalizer; the first temperature equalizer is located on the side of the circuit board and the battery away from the screen, and the first temperature equalizer is fixed and supported on the surface of the back cover facing the screen, in a plane parallel to the back cover, the orthographic projection of the circuit board is spaced apart from the orthographic projection of the battery, the orthographic projection of the first temperature equalizer overlaps with the orthographic projection of the circuit board, and the orthographic projection of the first temperature equalizer overlaps with the orthographic projection of the battery.

[0006] In the electronic device of the present application embodiment, the middle plate is eliminated and a supporting rear shell is provided instead. The circuit board and battery are both fixed and supported on the supporting rear shell. This helps reduce the thickness of the electronic device and improves its thinness. At the same time, the first temperature averaging plate is fixed to the side of the back cover of the supporting rear shell facing the screen, and the first temperature averaging plate is thermally connected to the heating device on the circuit board. In this way, the heat generated by the heating device can be transferred to the first temperature averaging plate. Due to the heat-dissipating characteristics given by the first temperature averaging plate based on its own working principle, the heat on the first temperature averaging plate can be quickly diffused to the surrounding area on the plane where the first temperature averaging plate is located, thereby improving the uniformity of the heat transferred from the first temperature averaging plate to the back cover, further facilitating the heat dissipation of the electronic device, and avoiding damage to the electronic device and poor heat dissipation caused by heat accumulation near the heating device of the electronic device. At the same time, because the first temperature averaging plate is fixed to the back cover, more heat can be radiated outwards through the back cover side, reducing the heat radiated from the screen side. This helps prevent overheating and damage to the screen caused by excessive heat radiated outwards from the screen side, and helps to increase the service life of the screen. Furthermore, in a plane parallel to the back cover, the orthographic projection of the circuit board is spaced apart from the orthographic projection of the battery, and the orthographic projection of the first temperature averaging plate overlaps with the circuit board, and the orthographic projection of the first temperature averaging plate overlaps with the battery. This allows the first temperature averaging plate to be positioned close to the main circuit board, thereby shortening the distance between the first temperature averaging plate and the heating device, shortening the heat transfer path from the heating device to the first temperature averaging plate, and also facilitating an increase in the area of ​​the first temperature averaging plate, thereby increasing the overlapping area of ​​the first temperature averaging plate and the back cover. As a result, under the heat-averaging effect of the first temperature averaging plate, more heat is evenly transferred to various locations on the back cover, resulting in better heat uniformity on the back cover, further improving the heat dissipation effect, and improving the reliability of the electronic components on the circuit board. Therefore, the electronic device can achieve both thinness and heat dissipation performance.

[0007] In one possible embodiment of the present application, in a plane parallel to the back cover, a portion of the orthographic projection of the circuit board is located within the orthographic projection of the first vapor chamber. Alternatively, in a plane parallel to the back cover, the orthographic projection of the entire circuit board falls within the orthographic projection of the first vapor chamber.

[0008] In one possible embodiment of the present application, the circuit board includes a main circuit board. In a plane parallel to the back cover, a portion of the orthographic projection of the main circuit board is located within the orthographic projection of the first vapor chamber. Alternatively, in a plane parallel to the back cover, the orthographic projection of the entire main circuit board falls within the orthographic projection of the first vapor chamber.

[0009] In one possible embodiment of the present application, the circuit board includes a secondary circuit board. In a plane parallel to the back cover, a portion of the secondary circuit board's orthographic projection is located within the orthographic projection of the first vapor chamber. Alternatively, in a plane parallel to the back cover, the entire secondary circuit board's orthographic projection falls within the orthographic projection of the first vapor chamber.

[0010] In a possible implementation manner of the present application, the circuit board is a main circuit board, also called a main board.

[0011] In one possible embodiment of the present application, in a plane parallel to the back cover, a portion of the orthographic projection of the battery is located within the orthographic projection of the first vapor chamber. Alternatively, in a plane parallel to the back cover, the orthographic projection of the entire battery falls within the orthographic projection of the first vapor chamber.

[0012] In one possible embodiment of the present application, the orthographic projection of at least one heating element overlaps with the orthographic projection of the first vapor chamber in a plane parallel to the back cover. This further shortens the heat transfer path between the heating element and the first vapor chamber, improving the heat dissipation effect on the heating element.

[0013] In a possible implementation manner of the present application, in a plane parallel to the back cover, an orthographic projection of at least one heating component is located within an outer periphery of an orthographic projection of the first temperature vapor chamber.

[0014] In one possible embodiment of the present application, the heating device includes a system-on-chip (SoC), and in a plane parallel to the back cover, the orthographic projection of the SoC overlaps with the orthographic projection of the first temperature vapor chamber. Furthermore, the heating device includes a power management chip, and in a plane parallel to the back cover, the orthographic projection of the power management chip overlaps with the orthographic projection of the first temperature vapor chamber. Furthermore, the heating device includes a charge management chip, and in a plane parallel to the back cover, the orthographic projection of the charge management chip overlaps with the orthographic projection of the first temperature vapor chamber. Furthermore, the heating device includes a radio frequency chip, and in a plane parallel to the back cover, the orthographic projection of the radio frequency chip overlaps with the orthographic projection of the first temperature vapor chamber. Furthermore, the heating device includes a display chip, and in a plane parallel to the back cover, the orthographic projection of the display chip overlaps with the orthographic projection of the first temperature vapor chamber. Furthermore, the heating device includes a general-purpose memory, and in a plane parallel to the back cover, the orthographic projection of the general-purpose memory overlaps with the orthographic projection of the first temperature vapor chamber. This helps shorten the heat transfer path of most of the heat on the circuit board and improves the heat dissipation effect on the heat-generating components on the circuit board.

[0015] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of the system-on-chip is located within the outer periphery of the orthographic projection of the first vapor chamber.

[0016] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of the power management chip is located within the outer periphery of the orthographic projection of the first temperature vapor chamber.

[0017] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of the charging management chip is located within the outer periphery of the orthographic projection of the first temperature vapor chamber.

[0018] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of the RF chip is located within the outer periphery of the orthographic projection of the first temperature vapor chamber.

[0019] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of the display chip is located within the outer periphery of the orthographic projection of the first temperature vapor chamber.

[0020] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of the universal memory is located within the outer periphery of the orthographic projection of the first vapor chamber.

[0021] In some examples, in a plane parallel to the back cover, the orthographic projections of all the heating devices on the main circuit board overlap with the orthographic projection of the first temperature equalizer. Exemplarily, in a plane parallel to the back cover, the orthographic projections of all the heating devices on the main circuit board are within the outer contour of the orthographic projection of the first temperature equalizer. In this way, it is beneficial to shorten the heat transfer path at the main circuit board and improve the heat dissipation effect on the heating devices on the main circuit board. Another example is that in a plane parallel to the back cover, the orthographic projections of the main circuit board are within the outer contour of the orthographic projection of the first temperature equalizer. In this way, the area size of the first temperature equalizer is larger, which can shorten the heat transfer path of all the heating devices and improve the heat dissipation effect on the heating devices on the main circuit board.

[0022] In a possible embodiment of the present application, a first heating device is integrated on the surface of the circuit board facing the back cover; the electronic device includes a first shielding cover, which is arranged on the side of the circuit board facing the back cover and covers the first heating device, and the first shielding cover is connected to the first temperature equalizing plate by thermal conduction. In this way, by setting the first shielding cover, the first shielding cover can be used to shield electromagnetic interference and improve the reliability of the operation of the first heating device. In addition, the heat generated by the first heating device located in the first shielding cover can be transferred to the first shielding cover, and then transferred to the first temperature equalizing plate through the first shielding cover, which is conducive to shortening the heat transmission path, facilitating the heat transfer to the first temperature equalizing plate as quickly as possible, and then radiated to the outside of the electronic device through the supporting back shell, thereby improving the heat dissipation effect.

[0023] Exemplarily, the first shielding cover includes a first plate body and a first side plate. The first plate body is flat and stacked with the first temperature equalizing plate. The first side plate is disposed around an edge of the first plate body and is fixed to the circuit board.

[0024] In a possible embodiment of the present application, in a plane parallel to the back cover, the orthographic projection of the first shielding cover overlaps with the orthographic projection of the first temperature diffusion plate, which helps shorten the heat transfer path and improve heat dissipation efficiency.

[0025] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of the first shielding cover is located within the outer periphery of the orthographic projection of the first temperature vapor chamber.

[0026] In one possible embodiment of the present application, the first shielding cover and the first vapor chamber are directly connected by thermal conduction. This arrangement not only facilitates the compactness of the electronic device but also eliminates the need for a heat transfer structure between the first shielding cover and the first vapor chamber, thereby reducing costs and simplifying the assembly process.

[0027] In a possible implementation of the present application, a first heat-conducting layer is provided between the first shielding cover and the first temperature-vaporizing plate, which is conducive to rationally optimizing the internal structural layout of the electronic device.

[0028] Exemplarily, the first thermally conductive layer is a thermally conductive gel layer. Thermally conductive gel is an ultra-high viscosity thermally conductive material formed by mixing multiple thermally conductive powders and thermally conductive silicone rubber after they are fully matured. The thermally conductive gel can be dispensed using a fully automatic dispensing machine, eliminating the need for manual operation. Furthermore, the thermally conductive gel has a long service life. By configuring the first thermally conductive layer as a thermally conductive gel layer, the connection reliability between the first temperature vapor chamber and the first shielding cover is improved, thereby enhancing the heat transfer effect between the two. It is understood that in other examples, the first thermally conductive layer can also be a thermally conductive silicone layer or a graphite layer.

[0029] For example, in order to improve the connection strength and heat conduction effect between the first shielding cover and the first temperature equalizing plate, in a plane parallel to the back cover, the orthographic projection of the first plate body falls within the outer contour of the orthographic projection of the first temperature equalizing plate, and the orthographic projection of the first heat conducting layer coincides with the orthographic projection of the first plate body.

[0030] In a possible implementation of the present application, a second heat-conducting layer is provided between the first shielding cover and the first heating element, which is conducive to improving the heat conduction effect between the first shielding cover and the first heating element.

[0031] Exemplarily, the second thermally conductive layer is a thermally conductive gel layer. This configuration improves the connection reliability between the first heating element and the first shielding cover, and enhances the heat transfer between them. It is understood that in other examples, the second thermally conductive layer can also be a thermally conductive silicone layer or a graphite layer.

[0032] Exemplarily, in order to improve the connection strength and heat conduction effect between the first shielding cover and the first heating component, the second heat conducting layer covers the entire surface of the first heating component facing the back cover.

[0033] In one possible embodiment of the present application, the surface of the back cover facing the screen has a fixing groove, and the first vapor chamber is fixed in the fixing groove. In this way, while ensuring the heat dissipation effect of the first vapor chamber, the space occupied by the first vapor chamber can be reduced, further achieving a compact structure of the electronic device.

[0034] In one possible embodiment of the present application, the surface of the first vapor chamber facing the screen is flush with the opening of the fixing slot. This reduces the space occupied by the first vapor chamber while ensuring its heat dissipation and dissipation, further enhancing the compactness of the electronic device.

[0035] In one possible embodiment of the present application, the thickness of the first vapor chamber is in the range of [0.2 mm, 0.4 mm]. This reduces the space occupied by the first vapor chamber while ensuring its heat dissipation and further enhances the compactness of the electronic device.

[0036] In one possible embodiment of the present application, the first vapor chamber is fixed to the back cover via a thermally conductive adhesive layer. This allows the thermally conductive adhesive layer to bond the first vapor chamber to the back cover, securing the two relative to each other. Furthermore, the thermal conductivity of the thermally conductive adhesive layer facilitates heat transfer from the first vapor chamber to the back cover, thereby facilitating heat dissipation in the electronic device.

[0037] Exemplarily, the thermally conductive adhesive layer includes but is not limited to a double-sided adhesive layer and a liquid adhesive layer.

[0038] In one possible embodiment of the present application, the first vapor chamber and the load-bearing rear housing are integrally formed. This arrangement not only improves the connection strength and stability between the first vapor chamber and the load-bearing rear housing, but also eliminates the need for mounting the first vapor chamber and the load-bearing rear housing, simplifying the processing and reducing production costs.

[0039] In a possible implementation manner of the present application, a support beam is provided on the surface of the back cover facing the screen. The support beam protrudes from the back cover toward the screen, and is used to separate the battery and the circuit board.

[0040] In order to improve the connection strength between the support beam and the load-bearing rear shell, the support beam and the load-bearing rear shell can be integrally formed.

[0041] In one possible embodiment of the present application, the support beam has an escape opening that extends through the support beam in the direction of the battery and circuit board arrangement. The first vapor chamber has a through-hole located within the escape opening. This allows the side of the first vapor chamber where the main circuit board is located to extend between the battery and the back cover, ensuring the integrity of the first vapor chamber.

[0042] In one possible embodiment of the present application, a relief opening extends through the support beam in the direction in which the back cover and screen are stacked, thereby dividing the support beam into two spaced-apart sub-beams. The first thermal vapor chamber has relief notches on both sidewalls in the direction in which the two sub-beams are arranged. The penetration portion is positioned between the relief notches on the sidewalls of the first thermal vapor chamber, and the sub-beams are positioned within the corresponding relief notches. This arrangement facilitates positioning of the first thermal vapor chamber and the load-bearing rear housing, utilizing the coordination between the relief notches and the sub-beams, and the relief opening and the penetration portion, thereby improving installation efficiency.

[0043] In a possible implementation manner of the present application, the electronic device further includes a circuit board bracket, which is disposed on a side of the circuit board facing the screen and is fixed to the support beam.

[0044] In a possible embodiment of the present application, the circuit board includes a main circuit board, and the circuit board bracket includes a main circuit board bracket. The main circuit board bracket is arranged on a side of the main circuit board facing the screen, and the main circuit board bracket is fixed to the support beam.

[0045] In a possible embodiment of the present application, the circuit board includes a sub-circuit board, and the circuit board bracket includes a sub-circuit board bracket. The sub-circuit board bracket is arranged on a side of the sub-circuit board facing the screen, and the sub-circuit board bracket is fixed to the support beam.

[0046] In one possible embodiment of the present application, a second heating element is integrated into the surface of the circuit board facing the screen; the electronic device includes a second shielding cover, which is disposed on the side of the circuit board facing the screen and covers the second heating element. Thus, the second shielding cover can be used to shield electromagnetic interference, thereby improving the reliability of the second heating element.

[0047] Exemplarily, the second shielding cover includes a second plate body and a second side plate. The second plate body is flat and stacked with the screen. The second side plate is disposed around an edge of the second plate body and is fixed to the circuit board.

[0048] In a possible embodiment of the present application, a third heat-conducting layer is provided between the second shielding cover and the second heating element, which is conducive to improving the heat conduction effect between the second shielding cover and the second heating element.

[0049] Exemplarily, the third heat-conducting layer is a thermally conductive gel layer. This configuration improves the connection reliability between the second heating element and the second shielding cover, and enhances the heat transfer between them. It is understood that in other examples, the third heat-conducting layer can also be a thermally conductive silicone layer or a graphite layer.

[0050] Exemplarily, in order to improve the connection strength and heat conduction effect between the second shielding cover and the second heating element, the third heat conduction layer covers the entire surface of the second heating element facing the screen.

[0051] In a possible embodiment of the present application, the electronic device further includes a circuit board bracket, the circuit board bracket is arranged on the side of the circuit board facing the screen, and the second shielding cover is located between the circuit board and the circuit board bracket, the circuit board bracket is fixedly connected to the supporting rear shell, and the circuit board bracket is thermally connected to the second shielding cover. In this way, the circuit board bracket can be used to protect the electronic components on the circuit board, and to separate the electronic components integrated on the side of the circuit board facing the screen from the screen, thereby preventing the electronic device from puncturing the screen due to the shaking of the circuit board during the falling process. At the same time, since the circuit board bracket is fixed to the supporting rear shell, the heat generated by the heating device on the circuit board is facilitated to be transferred to the circuit bracket by enabling thermal conduction between the circuit board bracket and the second shielding cover, and then further transferred to the supporting rear shell through the circuit bracket, thereby improving the heat dissipation effect.

[0052] In one possible embodiment of the present application, the second shielding cover is directly connected to the circuit board support via thermal conduction. This arrangement not only facilitates the compactness of the electronic device but also eliminates the need for a heat transfer structure between the second shielding cover and the circuit board support, thereby reducing costs and simplifying the assembly process.

[0053] In a possible embodiment of the present application, a fourth heat-conducting layer is provided between the second shielding cover and the circuit board support, which is conducive to improving the heat conduction effect between the second shielding cover and the circuit board support.

[0054] Specifically, the fourth thermally conductive layer is a thermally conductive gel layer. This configuration improves the connection reliability between the circuit bracket and the second shielding cover, and enhances heat transfer between them. It is understood that in other examples, the fourth thermally conductive layer can also be a thermally conductive silicone layer or a graphite layer.

[0055] Exemplarily, in order to improve the connection strength and heat conduction effect between the circuit bracket and the second shielding cover, the fourth heat conducting layer covers the entire surface of the second shielding cover facing the screen.

[0056] In a possible embodiment of the present application, the screen includes a translucent cover plate and a display screen. The translucent cover plate includes a fixing portion and a bearing portion. The fixing portion is arranged around the edge of the bearing portion, the fixing portion is fixed to and supported by the frame, the display screen is laminated and fixed to the surface of the bearing portion facing the back cover, and the side of the display screen away from the bearing portion is suspended in the air. In this way, the display screen can be isolated from the battery, the circuit board, etc., to prevent the electronic device from being punctured by electronic components due to the shaking of the circuit board during the falling process. At the same time, an air isolation layer can be formed between the display screen and the circuit bracket, and between the display screen and the battery, to reduce the heat transferred from the heating device to the screen, which is conducive to more heat being transferred to the direction of the first temperature plate, thereby improving the heat dissipation effect.

[0057] In one possible embodiment of the present application, a stepped portion is provided on the end of the inner peripheral wall of the frame facing away from the back cover. The stepped portion extends to the end surface of the frame facing away from the back cover. The fixing portion supports and secures the stepped portion. This arrangement allows the stepped portion to serve as a positioning mechanism, improving the reliability of the assembly between the light-transmitting cover plate and the frame.

[0058] In one possible embodiment of the present application, a heat-dissipating material layer is provided on the surface of the screen facing the back cover, thereby ensuring uniformity of heat transferred from the heating device to the screen and preventing damage to the screen due to local overheating.

[0059] In some examples, the thermally-sustaining material layer is a graphite layer or a graphene layer.

[0060] In a possible implementation manner of the present application, a flexible protective layer is provided on the surface of the screen facing the back cover, so that the flexible protective layer can be used to protect the screen.

[0061] Exemplarily, the flexible protective layer is disposed between the surface of the display screen facing the back cover and the heat-spreading material layer, or the flexible protective layer is disposed on a side of the heat-spreading material layer away from the display screen.

[0062] Exemplarily, the flexible protective layer includes but is not limited to foam, rubber or silicone.

[0063] In one possible embodiment of the present application, the thermal conductivity of the flexible protective layer is greater than that of air. The flexible protective layer has through-holes, and the orthographic projection of the through-holes overlaps with the orthographic projection of the heat-generating device in a plane parallel to the back cover. This ensures uniformity in the heat transferred from the heat-diffusion material layer to the screen, further improving the uniformity of screen heating. This allows more heat to radiate outward from one side of the first vapor chamber, reducing heat dissipation pressure on the screen.

[0064] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of the through hole is located within the outer periphery of the orthographic projection of one of the heating components.

[0065] In a possible implementation manner of the present application, in a plane parallel to the back cover, an orthographic projection of one of the heating components is located within an outer peripheral contour of the orthographic projection of the through hole.

[0066] In a possible implementation manner of the present application, in a plane parallel to the back cover, an orthographic projection of one of the heating components completely overlaps with an orthographic projection of the through hole.

[0067] In order to further reduce the heat transfer at the through hole, the through hole can be filled with a heat insulating material, for example, the heat insulating material includes but is not limited to foam, glass fiber and asbestos.

[0068] In one possible embodiment of the present application, the screen includes a display screen, which includes multiple functional layers, which are stacked in the thickness direction of the screen, and two adjacent functional layers are bonded together by an adhesive layer; wherein at least one adhesive layer has a through hole, and in a plane parallel to the back cover, the orthographic projection of the through hole overlaps with the orthographic projection of the heating device; and / or, at least one functional layer has a heat insulation hole, and in a plane parallel to the back cover, the orthographic projection of the heat insulation hole overlaps with the orthographic projection of the heating device. In this way, the heat dissipation from the screen to the side toward which the outer surface of the light-transmitting cover plate faces is reduced, which is more conducive to heat transfer in the direction of the screen, thereby more conducive to achieving uniform heating of the screen and improving the heat dissipation effect.

[0069] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of the heat insulation hole is located within the outer periphery of the orthographic projection of one of the heat-generating components.

[0070] In a possible implementation of the present application, in a plane parallel to the back cover, the orthographic projection of one of the heating components is located within the outer periphery of the orthographic projection of the thermal insulation hole.

[0071] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of one of the heating components completely overlaps with the orthographic projection of the thermal insulation hole.

[0072] In a possible implementation manner of the present application, in a plane parallel to the back cover, the orthographic projection of the through hole is located within the outer periphery of the orthographic projection of one of the heat-generating components.

[0073] In a possible implementation of the present application, in a plane parallel to the back cover, an orthographic projection of one of the heating components is located within an outer periphery of an orthographic projection of the through hole.

[0074] In a possible implementation manner of the present application, in a plane parallel to the back cover, an orthographic projection of one of the heating components completely coincides with an orthographic projection of the through hole.

[0075] Exemplarily, among the multiple functional layers, the functional layer farthest from the light-transmitting cover plate is provided with a heat-insulating hole, while the other functional layers are not provided with a heat-insulating hole. Furthermore, exemplary, among the multiple functional layers, the functional layer second farthest from the light-transmitting cover plate is provided with a heat-insulating hole, while the other functional layers are not provided with a heat-insulating hole.

[0076] In one possible embodiment of the present application, the orthographic projection of the heat-insulating hole overlaps with the orthographic projection of the through hole in a plane parallel to the back cover. This reduces heat dissipation from the screen toward the side of the outer surface of the light-transmitting cover plate, facilitates heat transfer in the direction of the screen, and thus facilitates more uniform heating of the screen and improves heat dissipation.

[0077] In a possible embodiment of the present application, in a plane parallel to the back cover, the orthographic projection of the thermal insulation hole completely coincides with the orthographic projection of the through hole, or, in a plane parallel to the back cover, the orthographic projection of the thermal insulation hole is located within the outer contour of the orthographic projection of the through hole, or, in a plane parallel to the back cover, the orthographic projection of the through hole is located within the outer contour of the orthographic projection of the thermal insulation hole.

[0078] In one possible embodiment of the present application, the electronic device further includes a second temperature evaporating plate, which is disposed on the outer edge of the first temperature evaporating plate and fixed to the inner circumference of the frame. This increases the overall heat dissipation area of ​​the first and second temperature evaporating plates, further facilitating heat dissipation from the heat-generating components and improving heat dissipation efficiency.

[0079] Exemplarily, the second temperature evaporating plate can be connected to the first temperature evaporating plate by gluing, welding, clamping, or screwing. In another exemplary embodiment, the second temperature evaporating plate and the first temperature evaporating plate are integrally formed, and the vacuum cavity of the second temperature evaporating plate can be connected to the vacuum cavity of the first temperature evaporating plate or not.

[0080] Furthermore, a clearance opening is provided at a position of the second temperature homogenizing plate corresponding to the clearance notch, and the clearance opening is used to avoid the first support beam.

[0081] In one possible embodiment of the present application, the load-bearing rear housing includes an outer housing and an inner housing, wherein the inner housing is disposed on the inner surface of the outer housing; wherein the inner housing is metal and the outer housing is plastic or leather; alternatively, the inner housing is plastic and the outer housing is metal. This arrangement not only helps ensure the structural strength of the load-bearing rear housing, but also reduces the weight of the load-bearing rear housing, thereby contributing to the lightweighting of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0082] Figure 1 A perspective diagram of an electronic device in the related art;

[0083] Figure 2 Based on Figure 1 The cross-sectional structure diagram of the electronic device in the related art is shown at line AA;

[0084] Figure 3 A perspective view of an electronic device according to some embodiments of the present application;

[0085] Figure 4 Based on Figure 3 an exploded schematic diagram of the electronic device shown;

[0086] Figure 5a Based on Figure 3 A schematic cross-sectional view of the electronic device shown in the BB direction;

[0087] Figure 5b Based on Figure 4 Schematic diagram of the projection of the heating device, main circuit board, battery, first temperature vapor chamber and load-bearing rear shell in the electronic device shown in the figure on a plane parallel to the back cover;

[0088] Figure 6 Based on Figure 4 A schematic diagram of the cooperation between the supporting rear housing and the first temperature vapor chamber in the electronic device shown;

[0089] Figure 7 Based on Figure 4 A schematic projection diagram of the first temperature vapor chamber, the main circuit board, and the heating element in the electronic device shown in the figure is shown in a plane parallel to the back cover;

[0090] Figure 8 Schematic diagrams of cross-sectional structures of electronic devices according to other embodiments of the present application;

[0091] Figure 9 Based on Figure 8 A schematic diagram of a load-bearing rear housing in the electronic device shown;

[0092] Figure 10 Based on Figure 8A schematic diagram of the cooperation between the load-bearing rear housing and the first temperature vapor chamber in the electronic device shown;

[0093] Figure 11 Based on Figure 8 A schematic diagram of the flexible protective layer shown;

[0094] Figure 12 Based on Figure 8 Schematic diagram of the projection of the temperature homogenizing plate, main circuit board and flexible protective layer in a plane parallel to the back cover;

[0095] Figure 13 Based on Figure 5a and Figure 8 A schematic diagram of the cross-sectional structure of the display screen shown in ;

[0096] Figure 14 This is a three-dimensional diagram of the first temperature vapor chamber and the second temperature vapor chamber after being matched according to some embodiments of the present application;

[0097] Figure 15 Schematic diagram of the cooperation between the load-bearing rear housing and the first temperature vapor chamber according to other embodiments of the present application;

[0098] Figure 16 is a schematic diagram of a tablet computer according to some embodiments of the present application;

[0099] Figure 17 To cancel Figure 8 A schematic diagram of an electronic device obtained by using the first vapor chamber in FIG.

[0100] Figure 18 This is a graph showing the temperature test results of various locations on the load-bearing rear shell of the first experimental object;

[0101] Figure 19 This is a graph showing the temperature test results at various locations on the load-bearing rear shell of the second experimental object. DETAILED DESCRIPTION

[0102] In the embodiments of the present application, the terms "exemplary," "also exemplary," "for example," or "another example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in the embodiments of the present application as "exemplary," "also exemplary," "for example," or "another example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary," "also exemplary," "for example," or "another example" is intended to present related concepts in a concrete manner.

[0103] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of the features.

[0104] In the description of the embodiments of this application, the term "and / or" refers to and encompasses any and all possible combinations of one or more of the associated listed items. The term "and / or" describes an association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this application generally indicates that the associated objects are in an "or" relationship.

[0105] In the description of the embodiments of the present application, unless otherwise expressly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, "connected" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of the present application, such as "inside" and "outside", etc., are only referenced to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0106] In the description of the embodiments of the present application, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element limited by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In the absence of further restrictions, an element limited by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0107] See also Figure 1 and Figure 2 , Figure 1 is a perspective view of an electronic device 100a in the related art; Figure 2 Based on Figure 1The cross-sectional structure diagram of the electronic device 100a at line AA in the related art shown. Specifically, the electronic device 100a includes a screen 1a, a middle frame 5a, a circuit board 2a, a battery 3a and a back cover 4a. The middle frame 5a includes a middle plate 5a1 and a frame 5a2. The screen 1a, the middle plate 5a1 and the back cover 4a are stacked in sequence and arranged at intervals in the thickness direction of the electronic device 100. The middle plate 5a1 is located between the screen 1a and the back cover 4a. The frame 5a2 is arranged around the middle plate 5a1, the back cover 4a and the screen 1a. The screen 1a, the middle frame 5a and the back cover 4a are fixedly connected after being separately processed. The circuit board 2a and the battery 3a are fixed to the side of the middle plate 5a1 facing the back cover 4a.

[0108] Because circuit board 2a integrates various electronic components, such as control chips, these components generate heat during operation. Heat-generating electronic components are considered heat-generating devices. Therefore, electronic devices require heat dissipation. Furthermore, the more electronic components integrated into an electronic device, the greater the need for heat dissipation.

[0109] To improve the heat dissipation effect of electronic equipment, please continue to refer to Figure 2 Electronic device 100a also includes a heat sink 6a, such as a temperature vapor chamber. Heat sink 6a is located on the side of middle plate 5a1 facing screen 1a and is thermally connected to screen 1a. This allows some heat from electronic device 100a to radiate outward from screen 1a, improving heat dissipation.

[0110] However, the inventors discovered through actual research that while the heat sink 6a in the related art provides a certain heat dissipation effect for the electronic device 100a, it occupies the volume of the space between the screen 1a and the back cover 4a, hindering the thinness of the electronic device 100a. Furthermore, during the research on the thinning design of the electronic device 100a, the inventors unexpectedly discovered that the "middle plate 5a1" serves as the structural framework within the electronic device 100a. While it can provide support for the battery 3a, circuit board 2a, and other components, the middle plate 5a1, located between the screen 1a and the back cover 4a, actually occupies the volume of the space between the screen 1a and the back cover 4a, which is also detrimental to the thinness of the electronic device 100a. Furthermore, the placement of the heat sink 6a on the side of the middle plate 5a1 facing the screen 1a causes more heat in the electronic device 100a to pass through the screen 1a and radiate outward from that side, which can easily cause overheating and damage to the screen 1a.

[0111] Based on this, in order to solve the technical problems in the above-mentioned related technologies, the inventors of this application, from the perspective of taking into account the thinness of electronic devices and the heat dissipation performance of electronic devices, have made improvements to the above-mentioned related technologies after long-term efforts in research and development, changed the design ideas, and improved the above-mentioned related technologies. In the electronic device of the embodiment of the present application, the setting of the middle plate is cancelled, and a load-bearing rear shell is set instead, and the circuit board and the battery are fixed and supported on the load-bearing rear shell, which is conducive to reducing the thickness of the electronic device and improving the thinness of the electronic device. At the same time, the first temperature averaging plate is fixed to the side of the back cover of the load-bearing rear shell facing the screen, and the first temperature averaging plate is connected to the heating device on the circuit board by thermal conduction. In this way, the heat generated by the heating device can be transferred to the first temperature averaging plate. Due to the heat-dissipating characteristics given by the first temperature averaging plate based on its own working principle, the heat on the first temperature averaging plate can be quickly diffused to the surrounding areas on the plane where the first temperature averaging plate is located, thereby improving the uniformity of the heat transferred from the first temperature averaging plate to the back cover, which is more conducive to the heat dissipation of the electronic device and avoiding the damage to the electronic device and the problem of poor heat dissipation caused by the accumulation of heat near the heating device of the electronic device. At the same time, because the first heat spreader is fixed to the back cover, more heat can be radiated outward through the back cover, reducing the amount of heat radiated from the screen. This helps prevent overheating and damage to the screen caused by excessive heat radiating outward from the screen, thereby improving the screen's service life. Furthermore, in a plane parallel to the back cover, the orthographic projection of the circuit board and the orthographic projection of the battery are separated, and the orthographic projections of the first heat spreader overlap with the circuit board and the battery. This allows the first heat spreader to be positioned close to the main circuit board, shortening the distance between the first heat spreader and the heat-generating device, and shortening the heat transfer path from the heat-generating device to the first heat spreader. This also helps increase the area of ​​the first heat spreader, thereby increasing the area of ​​overlap between the first heat spreader and the back cover. As a result, the heat spreader's heat distribution helps ensure more heat is evenly transferred to all locations on the back cover, resulting in better heat uniformity on the back cover, further improving heat dissipation and enhancing the reliability of electronic components on the circuit board. Therefore, this electronic device achieves both thinness and heat dissipation performance.

[0112] Before describing the specific solutions of the present application, the working principle of the temperature homogenizing plate is first explained.

[0113] The temperature spreader, also known as the vapor chamber (VC), has a vacuum cavity. A capillary structure is provided in the vacuum cavity. At the same time, the vacuum cavity is filled with a working fluid. Currently, the commonly used material for the temperature spreader is copper, and the working fluid is pure water or liquid ammonia. The working principle of the temperature spreader includes four processes: conduction, evaporation, convection, and solidification. The heat generated by the heat source enters the vacuum cavity through heat conduction. The working fluid near the heat source absorbs heat and vaporizes, taking away a large amount of heat at the same time; the steam in the vacuum cavity of the temperature spreader diffuses from the high temperature zone to the low temperature zone, and when the steam contacts the inner wall of the low temperature zone, the steam will condense into liquid and release heat energy; the working fluid condensed into liquid returns to the heat source through the capillary force of the capillary structure, thereby completing a heat conduction cycle and forming a circulation system in which gas and liquid coexist.

[0114] The specific scheme of the electronic device of the present application is described in detail below with reference to the accompanying drawings.

[0115] The present application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other suitable electronic device. For example, the electronic device may be a mobile phone, a tablet personal computer, a smart screen, a speaker, a display, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device (such as a watch or a bracelet), augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet, a medical device, and the like.

[0116] See also Figure 3 and Figure 4 , Figure 3 is a perspective view of an electronic device 100 provided according to some embodiments of the present application. Figure 4 Based on Figure 3 FIG. 1 is an exploded schematic diagram of the electronic device 100 . Figure 3 and Figure 4 The electronic device 100 is described using a mobile phone as an example. In this embodiment, the electronic device 100 may include a screen 1 , a carrying rear housing 4 , a circuit board, a battery 3 , and a first temperature-vaporizing plate 61 .

[0117] It is understandable that Figure 3 and Figure 4 The following figures and the related drawings only schematically illustrate some components of the electronic device 100, and the actual shapes, sizes, positions and structures of these components are not affected by the present invention. Figure 3 and Figure 4and the limitations of the following figures.

[0118] exist Figure 3 and Figure 4 In the illustrated embodiment, the electronic device 100 is in the shape of a rectangular flat plate. To facilitate the description of the various embodiments below, an XYZ coordinate system is established. Specifically, the width direction of the electronic device 100 is defined as the X-axis direction, the length direction of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. It is understandable that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs and is not specifically limited here. In some other embodiments, the shape of the electronic device 100 can also be a square flat plate, a diamond flat plate, a circular flat plate, an elliptical flat plate, or a special-shaped flat plate, etc.

[0119] Screen 1 is used to display images, videos, etc. Figure 4 and Figure 5a , Figure 5a Based on Figure 3 The electronic device 100 shown is a schematic cross-sectional view in the BB direction. The screen 1 includes a transparent cover plate 11 and a display screen 12. The transparent cover plate 11 is flat. Specifically, the shape of the transparent cover plate 11 includes but is not limited to a rectangular plate, a square plate, an oblong plate, a circular plate, and an elliptical plate. The material of the transparent cover plate 11 includes but is not limited to glass, plastic, and ceramic. The transparent cover plate 11 and the display screen 12 are stacked and fixedly connected. The connection method between the transparent cover plate 11 and the display screen 12 includes but is not limited to gluing. The transparent cover plate 11 is mainly used to protect the display screen 12 and prevent dust.

[0120] The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD), etc. The display surface of the display screen 12 faces the transparent cover plate 11, so that the images, videos, and other information displayed on the display screen 12 can be viewed by the user through the transparent cover plate 11.

[0121] The bearing rear shell 4 is used to protect and fix the internal electronic components of the electronic device 100. Figure 4 and Figure 5a The load-bearing rear shell 4 includes a back cover 41 and a frame 42. The back cover 41 is flat. The shape of the back cover 41 is adapted to the shape of the screen 1. The material of the back cover 41 includes but is not limited to metal, ceramic, plastic, glass, and any combination of these four materials. The back cover 41 and the screen 1 are stacked and spaced apart in the Z-axis direction (that is, the thickness direction of the electronic device 100). Specifically, the back cover 41 is located on the side of the display screen 12 away from the light-transmitting cover plate 11.

[0122] The frame 42 is fixed to the back cover 41. The frame 42 is arranged around the back cover 41 and the screen 1. The material of the frame 42 includes, but is not limited to, metal, ceramic, plastic, glass, or any combination of these four materials. The material of the frame 42 can be the same as that of the back cover 41, or it can be different. For example, the frame 42 can be fixedly connected to the back cover 41 by gluing, welding, or snapping, that is, the frame 42 and the back cover 41 can be assembled together. This arrangement can help simplify the mold structure of the back cover 41 and the frame 42, facilitating the processing of the back cover 41 and the frame 42. In other examples, the frame 42 and the back cover 41 can be integrally molded, that is, the frame 42 and the back cover 41 form a single, integral structure. This arrangement can help improve the structural strength of the load-bearing back cover 4, simplify the processing of the load-bearing back cover 4, reduce manufacturing costs, and also improve the reliability of the load-bearing back cover 4 in supporting the electronic components within the electronic device 100.

[0123] The transparent cover 11 is fixed to the frame 42. Specifically, the transparent cover 11 can be fixed to the frame 42 by gluing. The transparent cover 11, the back cover 41, and the frame 42 form a housing for the electronic device 100. This housing accommodates the display 12, the circuit board, the battery 3, and the first temperature-vaporizing plate 61.

[0124] For some examples, see Figure 4 and Figure 5a The light-transmitting cover 11 includes a fixing portion 111 and a bearing portion 112. The fixing portion 111 is arranged around the edge of the bearing portion 112. The light-transmitting cover 11 is fixed to the frame 42 with the help of the fixing portion 111. Exemplarily, a step portion 422 is provided at one end of the inner peripheral wall of the frame 42 away from the back cover 41. The step portion 422 extends to the end face of the frame 42 facing away from the back cover 41. The fixing portion 111 is supported and fixed on the step portion 422. In this manner, the step portion 422 can be used for positioning, thereby improving the reliability of assembly between the light-transmitting cover 11 and the frame 42. The display screen 12 can be stacked and fixed on the surface of the bearing portion 112 facing the back cover 41.

[0125] The circuit board is fixed and supported in the load-bearing rear shell 4. Specifically, the circuit board may include a main circuit board 2 and a sub-circuit board 5.

[0126] The main circuit board 2 is used to integrate electronic components such as the control chip. The main circuit board 2 is fixed in the load-bearing rear shell 4. Specifically, the main circuit board 2 can be fixed in the load-bearing rear shell 4 by screw connection, clamping, gluing, etc.

[0127] Control chips include, but are not limited to, system-on-chip (SOC), charging management chip, power management unit (PMU), radio frequency chip, display chip, application processor (AP), double data rate synchronous dynamic random access memory (DDR), and universal flash storage (UFS). In some embodiments, the main circuit board 2 is electrically connected to the screen 1 and is used to control the screen 1 to display images or videos.

[0128] The main circuit board 2 can be a rigid circuit board, a flexible circuit board, or a combination of rigid and flexible circuit boards. For example, the main circuit board 2 can be an FR-4 dielectric board, a Rogers dielectric board, or a hybrid of FR-4 and Rogers dielectric boards. FR-4 is a designation for a flame-retardant material grade, and Rogers dielectric boards are high-frequency boards.

[0129] The auxiliary circuit board 5 is fixed in the load-bearing rear shell 4. Specifically, the auxiliary circuit board 5 can be fixed to the load-bearing rear shell 4 by screw connection, clamping, gluing or welding. The auxiliary circuit board 5 is spaced apart from the main circuit board 2. For example, please continue to refer to Figure 4 and Figure 5a , the secondary circuit board 5 is arranged along the Y-axis with the main circuit board 2. Thus, in a plane parallel to the back cover 41 (i.e., the direction defined by the X-axis and Y-axis), the orthographic projection of the main circuit board 2 and the orthographic projection of the secondary circuit board 5 are spaced apart. Compared to arranging the main circuit board 2 and the secondary circuit board 5 along the Z-axis, this facilitates a thinner design for the electronic device 100. Of course, it is understood that in other examples, when the electronic device 100 is of another type, the secondary circuit board 5 may not be provided in the electronic device 100.

[0130] The auxiliary circuit board 5 can be a rigid circuit board, a flexible circuit board, or a rigid-flexible circuit board. The auxiliary circuit board 5 can be made of FR-4 dielectric board, Rogers dielectric board, or a mixed dielectric board of FR-4 and Rogers, etc.

[0131] The secondary circuit board 5 is electrically connected to the primary circuit board 2 via a connecting structure 7 to enable data and signal transmission between the secondary circuit board 5 and the primary circuit board 2. The connecting structure 7 may be a flexible printed circuit (FPC). In other embodiments, the connecting structure 7 may also be a conductive wire or enameled wire.

[0132] The secondary circuit board 5 integrates electronic components such as a universal serial bus (USB) device 51. The USB device 51 can be a USB Type-C interface device, a USB Type-A interface device, a USB Micro-B interface device, or a USB Type-B interface device. A socket 421 is provided on the frame 42 at the location corresponding to the USB device 51. Accessories such as chargers, headphones, and data cables can be electrically connected to the USB device 51 through this socket 421 to enable power, signal, and data transmission.

[0133] When the electronic device 100 is working, the electronic components on the main circuit board 2 and / or the auxiliary circuit board 5 will generate heat. The electronic components that generate heat when working (for example, the system-level chip, charging management chip, power management chip, application processor, etc. on the main circuit board 2) are heating devices 8.

[0134] The battery 3 is fixed and supported within the load-bearing rear housing 4 of the electronic device 100. Specifically, the battery 3 can be secured to the surface of the back cover 41 facing the screen 1 by gluing. The battery 3, the main circuit board 2, and the auxiliary circuit board 5 are spaced apart in the directions defined by the X-axis and the Y-axis. This allows the orthographic projections of the main circuit board 2, the battery 3, and the auxiliary circuit board 5 to be spaced apart within a plane parallel to the back cover 41. Compared to arranging the battery 3, the main circuit board 2, and the auxiliary circuit board 5 in the Z-axis direction, this facilitates a thinner design for the electronic device 100.

[0135] For example, see Figure 4 and Figure 5a The battery 3 is located between the main circuit board 2 and the auxiliary circuit board 5. The battery 3 is used to provide power to the main circuit board 2, the auxiliary circuit board 5, the screen 1, and the like. To facilitate securing the battery 3 and the auxiliary circuit board 5 to the load-bearing rear housing 4, when the auxiliary circuit board 5 and the main circuit board 2 are electrically connected via the connecting structure 7, the connecting structure 7 is located on the side of the battery 3 and auxiliary circuit board 5 facing the display screen 12.

[0136] The power management module is electrically connected to the battery 3. It receives charging input from the battery 3 and discharges the battery to power the screen 1, the main circuit board 2, the auxiliary circuit board 5, and the like. The power management module can also monitor parameters such as the battery 3 capacity, the number of cycles, and the battery 3 health status (leakage, impedance).

[0137] The charging management chip is electrically connected to the battery 3. Specifically, the charging management chip is used to receive charging input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charging management chip can receive charging input from the wired charger through the USB interface 51. In some wireless charging embodiments, the charging management chip can receive wireless charging input through the wireless charging coil of the electronic device 100. In some embodiments, the power management chip and the charging management chip can be integrated into one or can be provided separately.

[0138] In order to facilitate the fixing of the battery 3, the main circuit board 2 and the auxiliary circuit board 5 to the rear housing 4. And in order to facilitate the spacing of the battery 3, the main circuit board 2 and the auxiliary circuit board 5 in the direction defined by the XY axis. In some embodiments, the rear housing 4 is provided with a battery compartment b, a main circuit board compartment a and an auxiliary circuit board compartment c. For example, see Figure 4 and Figure 5a A support beam is provided on the surface of the back cover 41 facing the screen 1. The support beam is used to separate the battery 3 from the circuit board. Specifically, the support beam includes a first support beam 411 and a second support beam 412. The first support beam 411 and the second support beam 412 both protrude from the back cover 41 toward the display screen 12. The first support beam 411 and the second support beam 412 both extend in the X-axis direction, and their two ends in the X-axis direction are connected to the opposite inner side surfaces of the frame 42. The first support beam 411 and the second support beam 412 are spaced apart in the Y-axis direction. In this way, the frame 42, the back cover 41, the first support beam 411 and the second support beam 412 can enclose a battery compartment b for installing the battery 3. The portion of the frame 42 located on the side of the first support beam 411 away from the second support beam 412, the back cover 41 and the first support beam 411 can enclose a main circuit board compartment a for installing the main circuit board 2. As a result, the first support beam 411 is located between the battery 3 and the main circuit board 2 , so that the battery 3 and the main circuit board 2 are separated by the first support beam 411 .

[0139] The portion of the frame 42 located on the side of the second support beam 412 away from the first support beam 411, the back cover 41, and the second support beam 412 can enclose a secondary circuit board compartment c for mounting the secondary circuit board 5. Thus, the second support beam 412 is positioned between the secondary circuit board 5 and the battery 3, thereby separating the battery 3 and the secondary circuit board 5.

[0140] In order to improve the connection strength between the support beam and the load-bearing rear shell 4, the support beam and the load-bearing rear shell 4 can be formed as an integral part. Of course, the present application is not limited to this, and the support beam and the load-bearing rear shell 4 can be assembled and connected. Exemplary connection methods of the support beam and the load-bearing rear shell 4 include but are not limited to gluing, welding, screw connection or clamping.

[0141] It is understood that the specific structure of the support beam is limited to Figure 4 and Figure 5a . When the relative positional relationship among the main circuit board 2, the auxiliary circuit board 5 and the battery 3 changes, the relative positional relationship among the main circuit board compartment a, the auxiliary circuit board compartment c and the battery compartment b also changes accordingly, and the shape and extension direction of the support beam will also be adaptively adjusted. Moreover, it can be understood that only one of the first support beam 411 and the second support beam 412 can be provided on the back cover 41. For example, when only the first support beam 411 is provided on the back cover 41, the battery compartment b and the auxiliary circuit board compartment c are the same, and the battery 3 and the auxiliary circuit board 5 are in the same compartment. When only the second support beam 412 is provided on the back cover 41, the main circuit board compartment a and the battery compartment b are the same, and the main circuit board 2 and the battery 3 are in the same compartment. In other examples, when the electronic device 100 does not include the auxiliary circuit board 5, the electronic device 100 may also not include the auxiliary circuit board compartment c, in which case the second support beam 412 may not be required.

[0142] The above-described formation of the main circuit board compartment a, auxiliary circuit board compartment c, and battery compartment b is for illustrative purposes only and does not constitute a specific limitation on this application. In other examples, the main circuit board compartment a, auxiliary circuit board compartment c, and battery compartment b can also be formed by directly slotting the back cover 41. In this case, the portion between two adjacent slots serves as the support beam. Alternatively, in other examples, the main circuit board compartment a, auxiliary circuit board compartment c, and battery compartment b may not be provided within the load-bearing rear housing 4. In this case, no support beam is required on the back cover 41.

[0143] In the electronic device 100 of the present embodiment, the load-bearing rear housing 4 includes a back cover 41 and a frame 42, and the main circuit board 2, auxiliary circuit board 5, and battery 3 are all fixed and supported on the load-bearing rear housing 4, thereby eliminating the middle plate structure in the related art. This arrangement helps reduce the thickness of the electronic device 100 and improves the thinness of the electronic device 100.

[0144] The first temperature plate 61 is used to even out the heat and dissipate the heat for the electronic device 100. Figure 4 and Figure 5a The first temperature averaging plate 61 is in the shape of a flat plate. For example, the first temperature averaging plate 61 can be in the shape of a rectangular flat plate, a circular flat plate, or a special-shaped flat plate. This application does not limit the specific shape of the first temperature averaging plate 61. The shape of the first temperature averaging plate 61 can refer to the layout of the heating components on the circuit board.

[0145] The first temperature averaging plate 61 is fixed on the surface of the back cover 41 facing the screen 1 , and is located on the side of the battery 3 and the circuit board away from the screen 1 .

[0146] In some embodiments, please refer to Figure 5a , the first temperature averaging plate 61 can be fixed to the back cover 41 by a thermally conductive adhesive layer 9. In this way, on the one hand, the thermally conductive adhesive layer 9 can be used to bond the first temperature averaging plate 61 and the back cover 41 together to achieve relative fixation of the two. On the other hand, the thermal conductivity of the thermally conductive adhesive layer 9 can also be used to facilitate the transfer of heat from the first temperature averaging plate 61 to the back cover 41, so as to facilitate heat dissipation of the electronic device 100. Exemplarily, the thermally conductive adhesive layer 9 includes but is not limited to a double-sided adhesive layer and a liquid adhesive layer, as long as the thermally conductive adhesive layer 9 is thermally conductive. Of course, it can be understood that in other examples, the first temperature averaging plate 61 can also be fixed to the back cover 41 by means of clamping, welding or screw connection.

[0147] In other examples, the first temperature equalizing plate 61 and the back cover 41 can also be a structural whole. That is to say, the first temperature equalizing plate 61 and the back cover 41 are an integrally formed part. This arrangement is not only conducive to improving the connection strength between the first temperature equalizing plate 61 and the back cover 41 and improving the stability of the fixation between the two, but also eliminates the installation steps between the first temperature equalizing plate 61 and the back cover 41, simplifies the processing technology, and reduces production costs. Exemplarily, the first temperature equalizing plate 61 and the load-bearing rear shell 4 are a structural whole. That is to say, the first temperature equalizing plate 61 and the load-bearing rear shell 4 are an integrally formed part. This arrangement is not only conducive to improving the connection strength between the first temperature equalizing plate 61 and the load-bearing rear shell 4 and improving the stability of the fixation between the two, but also eliminates the installation steps between the first temperature equalizing plate 61 and the load-bearing rear shell 4, simplifies the processing technology, and reduces production costs.

[0148] The first temperature evaporating plate 61 is thermally connected to the heating element 8. For example, the first temperature evaporating plate 61 is indirectly thermally connected to the heating element 8 via another heat-conducting structure. For another example, the first temperature evaporating plate 61 and the heating element 8 can be directly thermally connected, i.e., there is no other structure between the first temperature evaporating plate 61 and the heating element 8, but they are in direct contact.

[0149] In this way, if Figure 5b As shown by the arrow in Figure 5b Based on Figure 4The schematic diagram of the projection of the heating element 8, main circuit board 2, battery 3, first temperature evaporating plate 61, and supporting back cover 4 of the electronic device 100 shown is shown in a plane M parallel to the back cover. The heat generated by the heating element 8 can be transferred to the first temperature evaporating plate 61. Due to the heat averaging characteristics given by the first temperature evaporating plate 61 based on its own operating principle, the heat on the first temperature evaporating plate 61 can be quickly diffused in all directions along the XY axis, thereby improving the uniformity of the heat transferred from the first temperature evaporating plate 61 to the back cover 41, further facilitating the heat dissipation of the electronic device 100 and avoiding damage to the electronic device 100 and poor heat dissipation caused by heat accumulation near the heating element 8. At the same time, because the first temperature evaporating plate 61 is fixed to the back cover 41, more heat can be radiated outward through the side of the back cover 41, reducing the heat radiated from the side of the screen 1. This helps prevent overheating and damage to the screen 1 caused by excessive heat radiating outward from the side of the screen 1, and helps to increase the service life of the screen 1.

[0150] Please continue reading Figure 5b In the plane M parallel to the back cover, the orthographic projection of the first temperature homogenizing plate 61 overlaps with the orthographic projection of the main circuit board 2 (e.g. Figure 5b In the figure, the area filled with broken lines is the overlapping area of ​​the orthographic projection of the first temperature plate 61 and the orthographic projection of the main circuit board 2). And the orthographic projection of the first temperature plate 61 overlaps with the orthographic projection of the battery 3 (such as Figure 5b , the filled grid area represents the overlapping area of ​​the orthographic projection of the first vapor chamber 61 and the orthographic projection of the battery 3. That is, the first vapor chamber 61 includes a first portion 613 and a second portion 614. The first portion 613 can be located within the main circuit board compartment a, and within a plane M parallel to the back cover, the orthographic projection of the first portion 613 overlaps with the orthographic projection of the main circuit board 2. The second portion 614 can be located within the battery compartment b, and within a plane M parallel to the back cover, the orthographic projection of the second portion 614 overlaps with the orthographic projection of the battery 3.

[0151] As a result, a portion of the first temperature equalizing plate 61 is located between the main circuit board 2 and the back cover 41, so that the first temperature equalizing plate 61 can be set close to the main circuit board 2, so as to shorten the distance between the first temperature equalizing plate 61 and the heating device 8, shorten the transmission path of heat from the heating device 8 to the first temperature equalizing plate 61, and improve the heat dissipation effect of the heating device 8 on the main circuit board 2; a portion of the first temperature equalizing plate 61 is located between the battery 3 and the back cover 41, which is conducive to increasing the area of ​​the first temperature equalizing plate 61, and then increasing the overlapping area of ​​the first temperature equalizing plate 61 and the back cover 41, so that under the heat equalization effect of the first temperature equalizing plate 61, more heat is evenly transferred to various positions of the back cover 41, so that the heat uniformity on the back cover 41 is better, which is conducive to further improving the heat dissipation effect and improving the reliability of the electronic components on the main circuit board 2.

[0152] It can be understood that the overlap of the orthographic projection of the main circuit board 2 and the orthographic projection of the first temperature equalizing plate 61 in the plane M parallel to the back cover is only one embodiment in which the orthographic projection of the circuit board overlaps the orthographic projection of the first temperature equalizing plate 61 in the plane M parallel to the back cover. In other examples, the orthographic projection of the auxiliary circuit board 5 and the orthographic projection of the first temperature equalizing plate 61 may also overlap in the plane M parallel to the back cover to facilitate heat dissipation of the heat-generating components on the auxiliary circuit board 5. Alternatively, the orthographic projection of the main circuit board 2 and the orthographic projection of the auxiliary circuit board 5 both overlap with the orthographic projection of the first temperature equalizing plate 61 in the plane M parallel to the back cover. In the following description, only the example in which the orthographic projection of the main circuit board 2 and the orthographic projection of the first temperature equalizing plate 61 overlap in the plane M parallel to the back cover is used for explanation. After reading this article, those skilled in the art will understand that the specific implementation method of "in the plane M parallel to the back cover, the orthographic projection of the auxiliary circuit board 5 overlaps with the orthographic projection of the first temperature equalizing plate 61" can refer to any specific implementation method of "in the plane M parallel to the back cover, the orthographic projection of the main circuit board 2 overlaps with the first temperature equalizing plate 61" below, which all fall within the scope of protection of this application.

[0153] It can be understood that "in the plane M parallel to the back cover, the orthographic projection of the first temperature equalizing plate 61 overlaps with the orthographic projection of the main circuit board 2" means that in the plane M parallel to the back cover, a part of the orthographic projection of the main circuit board 2 is located in the orthographic projection of the first temperature equalizing plate 61, or, in the plane M parallel to the back cover, the orthographic projection of the entire main circuit board 2 falls within the orthographic projection of the first temperature equalizing plate 61. At this time, at least a part of the edge of the orthographic projection of the main circuit board 2 may or may not overlap with a part of the edge of the orthographic projection of the first temperature equalizing plate 61. Similarly, “in the plane M parallel to the back cover, the orthographic projection of the first temperature equalizing plate 61 overlaps with the orthographic projection of the battery 3” means that in the plane M parallel to the back cover, a portion of the orthographic projection of the battery 3 is located within the orthographic projection of the first temperature equalizing plate 61, or, in the plane M parallel to the back cover, the orthographic projection of the entire battery 3 falls within the orthographic projection of the first temperature equalizing plate 61. At this time, at least a portion of the edge of the orthographic projection of the battery 3 may or may not overlap with a portion of the edge of the orthographic projection of the first temperature equalizing plate 61.

[0154] It is worth noting that, unless otherwise specified, the phrase "in a plane M parallel to the back cover, the orthographic projection of A overlaps with the orthographic projection of the first temperature vapor chamber 61" herein refers to the explanation of the main circuit board 2 and the battery 3 above. This means that, in a plane M parallel to the back cover, a portion of the orthographic projection of A lies within the orthographic projection of the first temperature vapor chamber 61. Alternatively, in a plane M parallel to the back cover, the entire orthographic projection of A falls within the orthographic projection of the first temperature vapor chamber 61. In this case, a portion of the edge of the orthographic projection of A may or may not overlap with a portion of the edge of the orthographic projection of the first temperature vapor chamber 61. This will not be further elaborated herein.

[0155] See also Figure 6 , Figure 6 Based on Figure 4 The diagram of the cooperation between the rear shell 4 and the first temperature equalizing plate 61 in the electronic device 100 shown. Since a part of the first temperature equalizing plate 61 is between the battery 3 and the back cover 41, and a part of the first temperature equalizing plate 61 is between the back cover 41 and the main circuit board 2. In order to facilitate the first temperature equalizing plate 61 to extend from the side where the main circuit board 2 is located to between the battery 3 and the back cover 41, the integrity of the first temperature equalizing plate 61 is ensured. The first support beam 411 has an avoidance opening 4111. The avoidance opening 4111 passes through the first support beam 411 in the arrangement direction of the battery 3 and the main circuit board 2 (i.e., the Y-axis direction), and the first temperature equalizing plate 61 is inserted into the avoidance opening 4111. In other words, the first temperature equalizing plate 61 has a penetration portion 612. Among them, the penetration portion 612 is located on both sides of the first part 613 and the second part 614 in the Y-axis direction. And the penetration portion 612 is located in the avoidance opening 4111.

[0156] For example, please see Figure 6 , the avoidance opening 4111 passes through the first support beam 411 in the Z-axis direction. In this way, the first support beam 411 can be divided into two spaced-apart sub-beams 4112 by the avoidance opening 4111. In other words, the area between the two spaced-apart sub-beams 4112 defines the avoidance opening 4111. The side walls of the first temperature equalizing plate 61 in the arrangement direction of the two sub-beams 4112 (i.e., the X-axis direction) respectively have avoidance gaps 611. The penetration portion 612 is located between the avoidance gaps 611 on the side walls on both sides of the first temperature equalizing plate 61. And the penetration portion 612 is located in the avoidance opening 4111. The two sub-beams 4112 correspond one-to-one to the two avoidance gaps 611. The corresponding sub-beams 4112 are located in the corresponding avoidance gaps 611. With this arrangement, when the first temperature uniform plate 61 is assembled with the load-bearing rear shell 4 , it is advantageous to utilize the cooperation between the avoidance notch 611 and the sub-beam 4112 and the cooperation between the avoidance opening 4111 and the penetration portion 612 for positioning, thereby improving installation efficiency.

[0157] As another example, a portion of the surface of the first support beam 411 facing the back cover 41 is recessed toward the screen 1 to form a groove, which passes through the first support beam 411 in the arrangement direction of the battery 3 and the main circuit board 2, and defines an avoidance opening 4111.

[0158] Of course, it is understood that in other implementations, when the width of the first temperature vaporizing plate 61 in the arrangement direction of the two sub-beams 4112 (i.e., the X-axis direction) is smaller than the dimension of the avoidance opening 4111 in the arrangement direction of the two sub-beams 4112, the avoidance opening 4111 may not be provided on the first temperature vaporizing plate 61. For example, the width of the first temperature vaporizing plate 61 in the X-axis direction remains unchanged. In still other implementations, the avoidance opening 4111 may not be provided on the first support beam 411, and the first support beam 4111 may be configured as part of the first temperature vaporizing plate 61.

[0159] In order to further shorten the heat transfer path between the heating element 8 and the first temperature plate 61 and improve the heat dissipation effect of the heating element 8, please refer to Figure 7 , Figure 7 Based on Figure 4 The diagram shows the projections of the first temperature vapor chamber 61, main circuit board 2, and heating element 8 in the electronic device 100 within a plane M parallel to the back cover. Within the plane M parallel to the back cover, the orthographic projection of at least one heating element 8 overlaps with the orthographic projection of the first temperature vapor chamber 61. In other words, within the plane M parallel to the back cover, the orthographic projection of one heating element 8 may overlap with the orthographic projection of the first temperature vapor chamber 61, or the orthographic projections of two or more heating elements 8 may overlap with the orthographic projection of the first temperature vapor chamber 61.

[0160] In some examples, for the electronic device 100, when the electronic device 100 is working, different heating devices 8 generate different amounts of heat. In order to improve the heat dissipation effect of the electronic device 100, in a plane M parallel to the back cover, the electronic components on the main circuit board 2 that generate relatively high amounts of heat, such as system-level chips, and / or power management chips, and / or charging management chips, and / or radio frequency chips, and / or display chips, and / or general memory, etc., can have their orthographic projections overlapped with the orthographic projections of the first temperature equalizing plate 61. Exemplarily, in the plane M parallel to the back cover, the orthographic projections of the system-level chip overlap with the orthographic projections of the first temperature equalizing plate 61. Another exemplary embodiment, in the plane M parallel to the back cover, the orthographic projections of the power management chip overlap with the orthographic projections of the first temperature equalizing plate 61. Another exemplary embodiment, in the plane M parallel to the back cover, the orthographic projections of the charging management chip overlap with the orthographic projections of the first temperature equalizing plate 61. As another example, in the plane M parallel to the back cover, the orthographic projections of the power management chip and the system-level chip overlap with the orthographic projection of the first temperature vapor chamber 61. As another example, in the plane M parallel to the back cover, the orthographic projections of the charging management chip and the system-level chip overlap with the orthographic projection of the first temperature vapor chamber 61. As another example, in the plane M parallel to the back cover, the orthographic projections of the power management chip and the charging management chip overlap with the orthographic projection of the first temperature vapor chamber 61. As another example, in the plane M parallel to the back cover, the orthographic projections of the system-level chip, the power management chip, and the charging management chip overlap with the orthographic projection of the first temperature vapor chamber 61. As another example, in the plane M parallel to the back cover, the orthographic projections of the system-level chip, the power management chip, the charging management chip, the RF chip, the display chip, and the universal memory overlap with the orthographic projection of the first temperature vapor chamber 61.

[0161] This helps to shorten the transmission path of most of the heat on the main circuit board 2 and improve the heat dissipation effect of the heating components 8 on the main circuit board 2.

[0162] In some examples, in the plane M parallel to the back cover, the orthographic projections of all the heating devices 8 on the main circuit board 2 overlap with the orthographic projections of the first temperature equalizer 61. Exemplarily, in the plane M parallel to the back cover, the orthographic projections of all the heating devices 8 on the main circuit board 2 are within the outer contour of the orthographic projection of the first temperature equalizer 61. In this way, it is beneficial to shorten the heat transfer path at the main circuit board 2 and improve the heat dissipation effect on the heating devices 8 on the main circuit board 2. Another example is that in the plane M parallel to the back cover, the orthographic projections of the main circuit board 2 are within the outer contour of the orthographic projection of the first temperature equalizer 61. In this way, the area size of the first temperature equalizer 61 is larger, which can shorten the heat transfer path of all the heating devices 8 and improve the heat dissipation effect on the heating devices 8 on the main circuit board 2.

[0163] Of course, it is understandable that in other examples, in the plane M parallel to the back cover, the orthographic projections of the heating element 8 on the main circuit board 2 and the first temperature homogenizing plate 61 may also be non-overlapping.

[0164] On the basis of ensuring the heat dissipation effect of the first temperature vapor chamber 61, the space occupied by the first temperature vapor chamber 61 in the accommodation space is reduced to further achieve the compactness of the structure of the electronic device 100. In some embodiments, the thickness dimension of the first temperature vapor chamber 61 (i.e., the dimension in the Z-axis direction) is in the range of [0.2 mm, 0.4 mm]. For example, the thickness dimension of the first temperature vapor chamber 61 is 0.2 mm, 0.21 mm, 0.22 mm, 0.23 mm, 0.24 mm, 0.25 mm, 0.26 mm, 0.27 mm, 0.28 mm, 0.29 mm, 0.3 mm, 0.31 mm, 0.32 mm, 0.33 mm, 0.34 mm, 0.35 mm, 0.36 mm, 0.3 mm, 0.38 mm, 0.39 mm, or 0.4 mm.

[0165] See also Figure 8 、 Figure 9 and Figure 10 , Figure 8 is a schematic cross-sectional structural diagram of an electronic device 100 according to some other embodiments of the present application, Figure 9 Based on Figure 8 The schematic diagram of the supporting rear shell 4 in the electronic device 100 is shown. Figure 10 Based on Figure 8 The figure shows the mating of the load-bearing rear cover 4 and the first temperature vapor chamber 61 in the electronic device 100. This embodiment differs from the previous embodiments in that the surface of the back cover 41 facing the screen 1 has a fixing groove 413. The first temperature vapor chamber 61 is fixed in the fixing groove 413. This ensures that the heat dissipation effect of the first temperature vapor chamber 61 is maintained while reducing the space occupied by the first temperature vapor chamber 61 within the housing, further achieving a more compact structure for the electronic device 100.

[0166] In some examples, to further reduce the space occupied by the first temperature vapor chamber 61 within the housing space and further achieve a compact structure of the electronic device 100, the surface of the first temperature vapor chamber 61 facing the screen 1 is flush with the opening of the fixing groove 413. Of course, it is understood that in other examples, the surface of the first temperature vapor chamber 61 facing the screen 1 may also protrude from the opening of the fixing groove 413, or may be recessed from the opening of the fixing groove 413.

[0167] Please continue reading Figure 9 and Figure 10When the first support beam 411 is provided on the surface of the back cover 41 facing the screen 1, in order to facilitate the formation of the battery compartment b and the main circuit board compartment a, the portions of the two sub-beams 4112 near the avoidance opening 4111 and the avoidance opening 4111 are both located within the fixing groove 413. Of course, it is understood that in other examples, when the avoidance opening 4111 is larger in the X-axis direction, the sub-beams 4112 may not be located within the fixing groove 413.

[0168] Please continue reading Figure 8 , heating devices 8 are integrated on the side surface of the main circuit board 2 facing the screen 1 and on the side surface of the main circuit board 2 facing the back cover 41. By integrating the heating devices 8 on both side surfaces of the main circuit board 2, it is beneficial to reasonably optimize the structural layout and achieve structural compactness. For the convenience of the following description, the heating device 8 integrated on the side surface of the main circuit board 2 facing the back cover 41 is referred to as the first heating device 81. Exemplarily, the first heating device 81 includes a power management chip. The heating device 8 integrated on the side surface of the main circuit board 2 facing the screen 1 is referred to as the second heating device 82. Exemplarily, the second heating device 82 includes a system-level chip and / or a charging management chip. Of course, it can be understood that in other examples, the heating device 8 on the main circuit board 2 can be integrated only on the side surface of the main circuit board 2 facing the back cover 41, or only on the side surface of the main circuit board 2 facing the screen 1.

[0169] Please continue reading Figure 8 The electronic device 100 further includes a first shielding cover 10. The first shielding cover 10 is disposed on the side of the main circuit board 2 facing the back cover 41 and covers the first heating element 81. Thus, by providing the first shielding cover 10, electromagnetic interference can be shielded, thereby improving the reliability of the first heating element 81. Of course, it is understood that in other examples, the electronic device 100 may also not include the first shielding cover 10.

[0170] Specifically, the first shielding cover 10 is made of metal. For example, the material of the first shielding cover 10 includes, but is not limited to, copper and iron. The connection method between the first shielding cover 10 and the main circuit board 2 includes, but is not limited to, welding, clamping, or gluing.

[0171] Please continue reading Figure 8 The first shielding cover 10 includes a first plate 101 and a first side plate 102. The first plate 101 is flat and stacked with the first temperature equalizing plate 61. The first side plate 102 surrounds the edge of the first plate 101 and is fixed to the main circuit board 2.

[0172] Please continue reading Figure 8The first shielding cover 10 is thermally connected to the first temperature vapor chamber 61. This allows heat generated by the first heating element 81 within the first shielding cover 10 to be transferred to the first shielding cover 10, and then to the first temperature vapor chamber 61 via the first shielding cover 10. This shortens the heat transfer path, facilitating faster heat transfer to the first temperature vapor chamber 61, and then radiating heat to the outside of the electronic device 100 through the load-bearing rear housing 4, improving heat dissipation.

[0173] In a plane M parallel to the back cover, the orthographic projection of the first shielding cover 10 overlaps with the orthographic projection of the first temperature homogenizing plate 61. This helps shorten the heat transfer path and improve heat dissipation efficiency.

[0174] For some examples, see Figure 8 A first heat conducting layer 30 is provided between the first shielding cover 10 and the first temperature averaging plate 61. The first shielding cover 10 is thermally connected to the first temperature averaging plate 61 via the first heat conducting layer 30. This helps to reasonably optimize the internal structural layout of the electronic device 100.

[0175] Exemplarily, the first thermally conductive layer 30 is a thermally conductive gel layer. Thermally conductive gel is a thermally conductive material with ultra-high viscosity, which is formed by mixing multiple thermally conductive powders and thermally conductive silicone rubber after they are fully matured. The thermally conductive gel can be dispensed using a fully automatic dispensing machine, eliminating the need for manual operation. Furthermore, the thermally conductive gel has a long service life. By configuring the first thermally conductive layer 30 as a thermally conductive gel layer, the connection reliability between the first temperature averaging plate 61 and the first shielding cover 10 is improved, thereby enhancing the heat transfer effect between the two. It is understood that in other examples, the first thermally conductive layer 30 can also be a thermally conductive silicone rubber layer or a graphite layer.

[0176] For example, in order to improve the connection strength and heat conduction effect between the first shielding cover 10 and the first temperature equalizing plate 61, in the plane M parallel to the back cover, the orthographic projection of the first plate body 101 falls within the outer contour of the orthographic projection of the first temperature equalizing plate 61, and the orthographic projection of the first thermal conductive layer 30 coincides with the orthographic projection of the first plate body 101.

[0177] In other examples, the first shielding cover 10 and the first temperature evaporating plate 61 can be directly connected by heat conduction. This arrangement not only facilitates the compactness of the electronic device 100, but also eliminates the need for a heat transfer structure between the first shielding cover 10 and the first temperature evaporating plate 61, thereby reducing costs and simplifying the assembly process.

[0178] Please continue reading Figure 8A second heat-conducting layer 40 is provided between the first shielding cover 10 and the first heating element 81. The first shielding cover 10 is thermally connected to the first heating element 81 via the second heat-conducting layer 40. This helps to improve the heat conduction effect between the first shielding cover 10 and the first heating element 81.

[0179] Exemplarily, the second thermally conductive layer 40 is a thermally conductive gel layer. This configuration improves the connection reliability between the first heating element 81 and the first shielding cover 10, thereby enhancing heat transfer between the two. It is understood that in other examples, the second thermally conductive layer 40 may also be a thermally conductive silicone layer or a graphite layer.

[0180] Exemplarily, in order to improve the connection strength and heat conduction effect between the first shielding cover 10 and the first heating device 81 , the second heat conducting layer 40 covers the entire surface of the first heating device 81 facing the back cover 41 .

[0181] In other examples, the first shielding cover 10 and the first heating element 81 may not be provided with a heat transfer structure, but may be spaced apart from each other.

[0182] Please continue reading Figure 8 The electronic device 100 further includes a second shielding cover 20. The second shielding cover 20 is disposed on the side of the main circuit board 2 facing the screen 1 and covers the second heating element 82. Thus, by providing the second shielding cover 20, electromagnetic interference can be shielded, thereby improving the reliability of the second heating element 82. Of course, it is understood that in other examples, the electronic device 100 may also not include the second shielding cover 20.

[0183] Specifically, the second shielding cover 20 is made of metal. For example, the material of the second shielding cover 20 includes, but is not limited to, copper and iron. The connection method between the second shielding cover 20 and the main circuit board 2 includes, but is not limited to, welding, clamping, or gluing.

[0184] Please continue reading Figure 8 The second shielding cover 20 includes a second plate 201 and a second side plate 202. The second plate 201 is flat and stacked with the screen 1. The second side plate 202 surrounds the edge of the second plate 201 and is fixed to the main circuit board 2.

[0185] Please continue reading Figure 8 A third heat-conducting layer 50 is provided between the second shielding cover 20 and the second heating element 82. The second shielding cover 20 is thermally connected to the second heating element 82 via the third heat-conducting layer 50. This helps to improve the heat conduction effect between the second shielding cover 20 and the second heating element 82.

[0186] Exemplarily, the third heat-conducting layer 50 is a thermally conductive gel layer. This configuration improves the connection reliability between the second heating element 82 and the second shielding cover 20, thereby enhancing heat transfer between the two. It is understood that in other examples, the third heat-conducting layer 50 can also be a thermally conductive silicone layer or a graphite layer.

[0187] Exemplarily, in order to improve the connection strength and heat conduction effect between the second shielding cover 20 and the second heating element 82 , the third heat conducting layer 50 covers the entire surface of the second heating element 82 facing the screen 1 .

[0188] In other examples, the second shielding cover 20 and the second heating element 82 may not be provided with a heat transfer structure, but may be spaced apart from each other.

[0189] Please continue reading Figure 8 The electronic device 100 further includes a circuit board support. The circuit board support includes a main circuit support 70. The main circuit support 70 is fixed to the side of the main circuit board 2 facing the screen 1. The second shielding cover 20 is located between the main circuit board 2 and the main circuit support 70. In this way, the main circuit support 70 can be used to protect the electronic components on the main circuit board 2 and to separate the electronic components integrated into the side of the main circuit board 2 facing the screen 1 from the screen 1, thereby preventing the electronic components from piercing the screen 1 due to the shaking of the main circuit board 2 during the electronic device 100 falling.

[0190] In some examples, the main circuit bracket 70 can be fixedly connected to the load-bearing rear housing 4 and the main circuit board 2 respectively by means of threaded connection, clamping, gluing, etc. For example, the main circuit bracket 70 is connected to the frame 42, and the main circuit bracket 70 can also be connected to the first support beam 411 by means of threaded connection, clamping, gluing, etc.

[0191] In order to facilitate the heat generated by the heating element 8 on the main circuit board 2 to be transferred to the main circuit bracket 70, and then radiated through the main circuit bracket 70 toward the frame 42, the first support beam 411, the screen 1, etc., the second shielding cover 20 is connected to the main circuit bracket 70 through thermal conduction. Figure 8 The second shielding cover 20 is connected to the main circuit bracket 70 by thermal conduction.

[0192] Specifically, a fourth heat conducting layer 60 is provided between the second shielding cover 20 and the main circuit support 70 , thereby improving the heat conduction effect between the second shielding cover 20 and the main circuit support 70 .

[0193] Specifically, the fourth thermally conductive layer 60 is a thermally conductive gel layer. This configuration improves the connection reliability between the main circuit bracket 70 and the second shielding cover 20, thereby enhancing heat transfer between the two. It is understood that in other examples, the fourth thermally conductive layer 60 may also be a thermally conductive silicone layer or a graphite layer.

[0194] Exemplarily, in order to improve the connection strength and heat conduction effect between the main circuit bracket 70 and the second shielding cover 20 , the fourth heat conducting layer 60 covers the entire surface of the second shielding cover 20 facing the screen 1 .

[0195] In other examples, the main circuit support 70 and the second shielding cover 20 may be directly connected by heat conduction. This arrangement not only facilitates the compactness of the electronic device 100, but also eliminates the need for a heat transfer structure between the second shielding cover 20 and the main circuit support 70, thereby reducing costs and simplifying the assembly process.

[0196] Because some of the heat generated by the heating element 8 in the electronic device 100 will inevitably radiate outward through the screen 1, in order to ensure uniformity of the heat transferred from the heating element 8 to the screen 1 and prevent damage to the screen 1 due to localized overheating, the electronic device 100 further includes a heat-scaling material layer 80. The heat-scaling material layer 80 is disposed on the side of the display screen 12 facing the back cover 41.

[0197] In some examples, the heat-equalizing material layer 80 is a graphite layer or a graphene layer. Graphite is a heat dissipation material, and the transverse thermal conductivity of graphite is much greater than the longitudinal thermal conductivity. In other words, the heat transfer efficiency on the plane where the graphite is located is better than the heat transfer efficiency in the thickness direction of the graphite, so graphite has a good heat-equalizing effect. Graphene also has good thermal conductivity. The transverse thermal conductivity of graphene is much greater than the longitudinal thermal conductivity, and its heat-equalizing performance is good. By using graphite or graphene to process the heat-equalizing material layer, the heat-equalizing effect of the heat-equalizing material layer 80 can be improved, and the heat on the heat-equalizing material layer 80 is more uniform. Therefore, the heat transferred from the heat-equalizing material layer 80 to the screen 1 is also uniform, thereby preventing the screen 1 from being damaged due to excessive local temperature. In addition, since graphite / graphene can be processed to be thinner, it can ensure lightness and thinness while simplifying the processing process and reducing processing costs.

[0198] Of course, it is understandable that in other examples, the heat-dissipating material layer 80 may also be a temperature-dissipating plate or a heat pipe. Alternatively, the heat-dissipating material layer 80 may not be provided in the electronic device 100 .

[0199] Please continue reading Figure 8The side of the display screen 12 away from the support portion 112 is suspended in the air. This isolates the display screen 12 from the battery 3, main circuit board 2, and auxiliary circuit board 5, preventing electronic components from piercing the screen 1 due to the shaking of the main circuit board 2 during a fall of the electronic device 100. Furthermore, an air barrier is formed between the display screen 12 and the main circuit support, as well as between the display screen 12 and the battery 3, reducing the amount of heat transferred from the heating element 8 to the screen 1 and facilitating the transfer of more heat to the first temperature vapor chamber 61, thereby improving heat dissipation.

[0200] On this basis, in order to further improve the protection effect of the display screen 12, please continue to refer to Figure 8 The electronic device 100 further includes a flexible protective layer 90. The flexible protective layer 90 is disposed between the surface of the display screen 12 facing the back cover 41 and the heat-dissipating material layer 80, or the flexible protective layer 90 is disposed on the side of the heat-dissipating material layer 80 away from the display screen 12. It is sufficient to ensure that the flexible protective layer 90 is disposed on the surface of the display screen 12 facing the back cover 41.

[0201] Exemplarily, the flexible protective layer 90 includes, but is not limited to, foam, rubber, or silicone. Of course, it is understood that in other examples, the flexible protective layer 90 may not be provided on the surface of the display screen 12 facing the back cover 41. Alternatively, the flexible protective layer 90 may be provided on the surface of the circuit bracket and battery 3 facing away from the back cover 41.

[0202] Although the heat-dissipating material layer 80 has a good heat-dissipating effect, the temperature on the heat-dissipating material layer 80 is not absolutely uniform. The temperature on the heat-dissipating material layer 80 near the heat source, that is, the heating element 8, is still higher than the temperature far away from the heating element 8. In addition, in some embodiments, the heat-dissipating material layer 80 may need to be significantly cut to avoid the connection structure 7, which greatly affects heat dissipation and causes a high risk of overheating in the area of ​​the display screen 12 corresponding to the heating element 8. In order to ensure the uniformity of heat transferred from the heat-dissipating material layer 80 to the screen 1 and further improve the uniformity of the heating of the screen 1, more heat is radiated outward from one side of the first heat-dissipating plate 61, reducing the heat dissipation pressure on the screen 1 side. Please refer to Figure 11 and Figure 12 , Figure 11 Based on Figure 8 The schematic diagram of the flexible protective layer 90 is shown, Figure 12 Based on Figure 8Schematic diagram of the projection of the temperature equalizing plate, the main circuit board 2 and the flexible protective layer 90 in the plane M parallel to the back cover. The flexible protective layer 90 has a through hole 901. The through hole 901 penetrates the flexible protective layer 90 in the Z-axis direction. The shape of the through hole 901 includes but is not limited to a rectangle, a circle, an ellipse or an irregular shape. In the plane M parallel to the back cover, the orthographic projection of the through hole 901 overlaps with the orthographic projection of the heating device 8. For example, in the plane M parallel to the back cover, the orthographic projection of the through hole 901 can completely coincide with the orthographic projection of one of the heating devices 8; or, in the plane M parallel to the back cover, the orthographic projection of the through hole 901 coincides with a part of the orthographic projection of several heating devices 8 respectively; or, in the plane M parallel to the back cover, the orthographic projection of the through hole 901 is located within the outline of the orthographic projection of one of the heating devices 8; or, in the plane M parallel to the back cover, the orthographic projection of one of the heating devices 8 is located within the outline of the orthographic projection of the through hole 901.

[0203] In some specific examples, within a plane M parallel to the back cover, a portion of the orthographic projection of the through hole 901 overlaps with the orthographic projection of the system-on-chip, the power management chip, and / or the charging management chip.

[0204] In this way, the characteristic that the thermal conductivity of the flexible protective layer 90 is greater than the thermal conductivity of the air, that is, the thermal conductivity of the air is less than the thermal conductivity of the flexible protective layer 90, can be utilized to reduce the heat transfer of the part of the screen 1 facing the heating device 8, thereby being more conducive to achieving uniform heating of the screen 1, so that more heat can be radiated from the side where the first temperature equalizing plate 61 is located to the supporting rear shell 4, thereby improving the heat dissipation effect.

[0205] Of course, it is understandable that, in other examples, in order to further reduce heat transfer at the through hole 901, the through hole 901 may be filled with a heat insulating material, such as, but not limited to, foam, glass fiber, and asbestos.

[0206] See also Figure 13 , Figure 13 Based on Figure 5a and Figure 8Schematic diagram of the cross-sectional structure of the display screen 12 shown in . The display screen 12 includes a plurality of functional layers 121. The plurality of functional layers 121 are stacked in sequence in the thickness direction of the screen 1 (i.e., the Z-axis direction). Two adjacent functional layers 121 are connected by an adhesive layer 123. At least one adhesive layer 123 may be provided with a through hole 1231. The through hole 1231 penetrates the adhesive layer 123 in the Z-axis direction. In the plane M parallel to the back cover, the orthographic projection of the through hole 1231 overlaps with the orthographic projection of the heating device 8. For example, in a plane M parallel to the back cover, the orthographic projection of the through hole 1231 can completely overlap with the orthographic projection of one of the heating devices 8; or, in a plane M parallel to the back cover, a portion of the orthographic projection of the through hole 1231 can overlap with a portion of the orthographic projection of the heating device 8; or, in a plane M parallel to the back cover, the orthographic projection of the through hole 1231 is located within the outline of the orthographic projection of one of the heating devices 8; or, in a plane M parallel to the back cover, the orthographic projection of one of the heating devices 8 is located within the outline of the orthographic projection of the through hole 1231. In this way, the characteristic that the thermal conductivity of the solid part of the display screen 12 is greater than the thermal conductivity of air, that is, the thermal conductivity of air is less than the thermal conductivity of the solid part of the display screen 12, can be utilized to reduce the heat dissipation from the screen 1 to the side toward which the outer surface of the transparent cover plate 11 faces, thereby further facilitating heat transfer in the direction of the screen 1 (i.e., the XY direction), thereby further facilitating the uniformity of heating the screen 1 and improving the heat dissipation effect.

[0207] Please continue reading Figure 13, at least one functional layer 121 is provided with a thermal insulation hole 1211. That is, thermal insulation holes 1211 may be provided on each functional layer 121, or may be provided on a portion of the functional layers 121 among multiple functional layers 121. The thermal insulation hole 1211 penetrates the functional layer 121 where the thermal insulation hole 1211 is located. In a plane M parallel to the back cover, the orthographic projection of the thermal insulation hole 1211 overlaps with the orthographic projection of the heating element 8. For example, in a plane M parallel to the back cover, the orthographic projection of the heat insulation hole 1211 can completely overlap with the orthographic projection of the heating device 8; or, in a plane M parallel to the back cover, a portion of the orthographic projection of the heat insulation hole 1211 can overlap with a portion of the orthographic projection of different heating devices 8 respectively; or, in a plane M parallel to the back cover, the orthographic projection of the heat insulation hole 1211 is located within the outline of the orthographic projection of one of the heating devices 8; or, in a plane M parallel to the back cover, the orthographic projection of one of the heating devices 8 is located within the outline of the orthographic projection of the heat insulation hole 1211. In this way, the characteristic that the thermal conductivity of the solid part of the display screen 12 is greater than the thermal conductivity of air, that is, the thermal conductivity of air is less than the thermal conductivity of the solid part of the display screen 12, can be utilized to reduce the heat dissipation from the screen 1 to the side facing the outer surface of the transparent cover plate 11, thereby more facilitating heat transfer in the direction of the screen 1 (i.e., the XY direction), thereby more facilitating achieving uniform heating of the screen 1 and improving the heat dissipation effect.

[0208] Illustratively, among the multiple functional layers 121, the functional layer 121 farthest from the light-transmitting cover plate 11 is provided with thermal insulation holes 1211, while the other functional layers 121 are not provided with thermal insulation holes 1211. Furthermore, illustratively, among the multiple functional layers 121, the functional layer 121 second farthest from the light-transmitting cover plate 11 is provided with thermal insulation holes 1211, while the other functional layers 121 are not provided with thermal insulation holes 1211.

[0209] Please continue reading Figure 13 In a plane parallel to the back cover, the orthographic projection of the heat-insulating hole 1211 completely overlaps with the orthographic projection of the through hole 1231. This reduces the amount of heat dissipated from the screen 1 toward the side of the outer surface of the transparent cover plate 11, and facilitates heat transfer in the direction of the screen 1 (i.e., the XY direction), thereby achieving more uniform heating of the screen 1 and improving the heat dissipation effect.

[0210] For details, please refer to Figure 13Taking the display screen 12 as an LCD display screen as an example, along the Z-axis direction and in the direction away from the transparent cover plate 11, the multiple functional layers 121 on the display screen 12 are, in order, an optical adhesive layer 121a, a first polarizer layer 121b, a first glass substrate layer 121c, a color filter layer 121d, a sensor layer 121e, a liquid crystal layer 121f, a thin film transistor (TFT) layer 121G, a second glass substrate layer 121h, a second polarizer layer 121i, and a backlight layer 121j.

[0211] In some examples, the heat insulation hole 1211 can be formed on any one of the OCA optical adhesive layer 121A, the first polarizer layer 121b, the first glass substrate layer 121c, the color filter layer 121d, the sensor layer 121e, the liquid crystal layer 121f, the TFT layer 121G, the second glass substrate layer 121h, the second polarizer layer 121i, and the backlight layer 121j. For example, Figure 13 As shown, a heat insulation hole 1211 is provided on the second polarizer layer 121i.

[0212] In other examples, the heat insulation hole 1211 can be formed on any two or three layers of the OCA optical adhesive layer 121A, the first polarizer layer 121b, the first glass substrate layer 121c, the color filter layer 121d, the sensor layer 121e, the liquid crystal layer 121f, the TFT layer 121G, the second glass substrate layer 121h, the second polarizer layer 121i and the backlight layer 121j.

[0213] See also Figure 14 , Figure 14 It is a three-dimensional diagram of the first temperature averaging plate 61 and the second temperature averaging plate 62 after being matched according to some embodiments of the present application. The electronic device 100 also includes a second temperature averaging plate 62. The second temperature averaging plate 62 is arranged on the outer peripheral edge of the first temperature averaging plate 61. Exemplarily, the second temperature averaging plate 62 and the first temperature averaging plate 61 can be connected by gluing, welding, clamping or screw connection. Another example is that the second temperature averaging plate 62 and the first temperature averaging plate 61 are an integrally formed part, and the vacuum inner cavity of the second temperature averaging plate 62 and the vacuum inner cavity of the first temperature averaging plate 61 can be connected or not. In this way, the overall heat dissipation area of ​​the first temperature averaging plate 61 and the second temperature averaging plate 62 is larger, which is more conducive to the heat dissipation of the heating device 8 and improves the heat dissipation effect.

[0214] The second temperature averaging plate 62 is fixed to the inner circumference of the frame 42. The fixing method of the second temperature averaging plate 62 and the frame 42 can refer to the fixing method between the first temperature averaging plate 61 and the back cover 41, which will not be repeated here.

[0215] In some examples, the heat of the heating device 8 is transferred to the first temperature averaging plate 61, and then transferred from the first temperature averaging plate 61 to the second temperature averaging plate 62. In other examples, on the basis that the heat of the heating device 8 is transferred to the first temperature averaging plate 61 and a part of the first temperature averaging plate 61 is transferred to the second temperature averaging plate 62, the second temperature averaging plate 62 can also be directly in contact with the heating device 8 for heat conduction, or be connected to the heating device 8 for heat conduction through other heat-conducting structures other than the first temperature averaging plate 61. Among them, the heat conduction connection method between the second temperature averaging plate 62 and the heating device 8 can refer to the heat conduction connection method between the first temperature averaging plate 61 and the heating device 8. It will not be repeated here.

[0216] Furthermore, a clearance opening 621 is provided at a position of the second temperature uniform plate 62 corresponding to the clearance notch 611 . The clearance opening 621 is used to avoid the first support beam 411 .

[0217] See also Figure 15 , Figure 15 Schematic diagram of the cooperation between the load-bearing rear shell 4 and the first temperature-dispersing plate 61 according to some other embodiments of the present application. The load-bearing rear shell 4 includes an outer shell 43 and an inner shell 44.

[0218] The outer shell 43 includes a first back cover 431 and a first frame 432. The first back cover 431 is flat. The first frame 432 is arranged around the perimeter of the first back cover 431 and is fixed to the first back cover 431. In some examples, the first frame 432 and the first back cover 431 are integrally molded, that is, the first frame 432 and the first back cover 431 form a single, integral structure. This arrangement helps improve the structural strength of the outer shell 43, simplifies the processing of the supporting rear cover 4, reduces manufacturing costs, and also improves the reliability of the supporting rear cover 4 for supporting electronic components within the electronic device 100. Of course, it is understood that in other examples, the first frame 432 can be fixedly connected to the first back cover 431 by gluing, welding, or clipping, that is, the first frame 432 and the first back cover 431 can be assembled together. This arrangement can help simplify the mold structure of the first back cover 431 and the first frame 432, facilitating the processing and manufacturing of the first back cover 431 and the first frame 432. The material of the outer shell 43 includes but is not limited to metal, plastic and / or leather. Among them, leather is a soft material with the texture and appearance of leather, which has the characteristics of being waterproof, durable, soft, etc., does not contain any animal ingredients, and is an artificial leather.

[0219] The inner housing 44 includes a second back cover 441 and a second frame 442. The second back cover 441 is flat and fixed to the side surface of the first back cover 431 facing the screen 1. The first back cover 431 and the second back cover 441 together define the back cover 41.

[0220] The second frame 442 is disposed around the perimeter of the second back cover 441 and is fixed to the second back cover 441. In some examples, the second frame 442 and the second back cover 441 are integrally molded, i.e., the second frame 442 and the second back cover 441 form a single, unitary structure. This arrangement helps improve the structural strength of the inner housing 44, simplifies the processing of the supporting rear cover 4, reduces manufacturing costs, and also improves the reliability of the supporting rear cover 4 in supporting the electronic components within the electronic device 100. Of course, it is understood that in other examples, the second frame 442 can be fixedly connected to the second back cover 441 by gluing, welding, or snapping, that is, the second frame 442 and the second back cover 441 can be assembled together. This arrangement can help simplify the mold structure of the second back cover 441 and the second frame 442, facilitating the processing and manufacturing of the second back cover 441 and the second frame 442. The second frame 442 is fixed to the inner circumference of the first frame 432. The second frame 442 and the first frame 432 together define the frame 42.

[0221] The material of the inner shell 44 includes but is not limited to metal (such as aluminum alloy, copper alloy, magnesium-aluminum alloy), plastic and / or plain leather.

[0222] In some implementations, the material of the outer shell 43 and the material of the inner shell 44 can be the same, so as to facilitate the processing and manufacturing of the bearing rear shell 4.

[0223] In other examples, the materials of the outer shell 43 and the inner shell 44 can also be different. To improve the structural strength of the load-bearing rear shell 4, the inner shell 44 is exemplarily made of metal and the outer shell 43 is made of plastic or leather. In another example, the outer shell 43 is made of metal and the inner shell 44 is made of plastic. This arrangement not only helps ensure the structural strength of the load-bearing rear shell 4, but also reduces the weight of the load-bearing rear shell 4, contributing to the lightweighting of the electronic device 100.

[0224] On this basis, the outer shell 43 and the inner shell 44 can be integrally formed. For example, the outer shell 43 and the inner shell 44 can be fixed together through a two-shot injection molding process. For example, during the processing of the load-bearing rear shell 4, the metal inner shell 44 can be first processed, then the metal inner shell 44 is placed in a mold, and then the plastic outer shell 43 is processed.

[0225] See also Figure 16 , Figure 16It is a schematic diagram of an electronic device 100 according to some other embodiments of the present application. The electronic device 100 is a tablet computer. The structure of the tablet computer is different from that of the above-mentioned mobile phone in that the main circuit board compartment a, the battery compartment b and the auxiliary circuit board compartment c are respectively formed by three depressions on the surface of the side of the back cover 41 facing the screen 1. The main circuit board compartment a and the battery compartment b are arranged in the X-axis direction. The auxiliary circuit board compartment c is on one side of the main circuit board compartment a and the auxiliary circuit board compartment along the Y-axis direction. The first support beam 411 is between the main circuit board compartment a and the battery compartment b. The second support beam 412 is between the main circuit board compartment a and the auxiliary circuit board compartment c and between the battery compartment b and the auxiliary circuit board compartment c.

[0226] The following takes the electronic device 100 as an example, a mobile phone. Figure 17 The mobile phone shown in the figure is used as the first experimental object. Figures 8-12 The mobile phone shown in FIG is used as the second experimental object to verify the improvement of the heat dissipation of the mobile phone by the first heat plate 61. Figure 17 To cancel Figure 8 The schematic diagram of the electronic device 100 obtained after the first temperature plate 61 is formed is shown in FIG. Figure 17 The mobile phone shown is Figure 8 Compared with the illustrated mobile phone, the first temperature equalizing plate 61 is removed. Under the same operating conditions, the temperature of different parts of the bearing rear shell 4 of the two experimental objects is tested, and the test results shown in Table (1) are obtained.

[0227] Table (1) Temperature of the bearing rear shell 4 of the two experimental objects

[0228]

[0229] It can be seen from Table (1) that the temperature of the back shell 4 in the second experimental object is significantly lower than that in the first experimental object.

[0230] In the first experimental object mentioned above, the temperature test results of various locations of the bearing rear housing 4 are as follows: Figure 18 As shown, Figure 18 The temperature test results of the bearing rear shell 4 of the first experimental object are shown in FIG. Figure 18 (a) is the temperature test result of the outer surface of the back cover 41 (i.e., the surface facing away from the screen 1). Figure 18(b) in the figure is the temperature test result of the inner surface of the back cover 41 (that is, the surface facing the screen 1). The temperature of the area close to the heating device 8, or the area directly opposite to the heating device 8 on the Z axis is the highest, and the temperature of the area farther away from the heating device 8 is lower. In addition, the temperature difference between the highest temperature and the lowest temperature on the outer surface of the bearing rear shell 4 is about 1.6°C. The temperature difference between the highest temperature and the lowest temperature on the inner surface of the bearing rear shell 4 is about 5.2°. This indicates that the temperature uniformity on the bearing rear shell 4 is very poor at this time.

[0231] In the second experimental object mentioned above, the temperature test results of various locations of the bearing rear housing 4 are as follows: Figure 19 As shown, Figure 19 This is a graph showing the temperature test results of various locations of the bearing rear housing 4 of the second experimental object. Figure 19 (a) is the temperature test result of the outer surface of the back cover 41 (i.e., the surface facing away from the screen 1). Figure 19 (b) in the figure is the temperature test result of the inner surface of the back cover 41 (that is, the surface facing the screen 1). The temperature of the area close to the heating device 8, or the area directly opposite to the heating device 8 on the Z axis is the highest, and the temperature of the area farther away from the heating device 8 is lower. In addition, the temperature difference between the highest temperature and the lowest temperature on the outer surface of the bearing rear shell 4 is about 1°C. The temperature difference between the highest temperature and the lowest temperature on the inner surface of the bearing rear shell 4 is about 2.1°. It can be seen that in the second experimental object, the temperature difference between the highest temperature and the lowest temperature on the outer surface of the bearing rear shell 4 is lower than the temperature difference between the highest temperature and the lowest temperature on the outer surface of the bearing rear shell 4 in the first experimental object. In the second experimental object, the temperature difference between the highest temperature and the lowest temperature on the inner surface of the bearing rear shell 4 is lower than the temperature difference between the highest temperature and the lowest temperature on the inner surface of the bearing rear shell 4 in the first experimental object. This shows that the first temperature equalizing plate 61 has an obvious heat equalization effect and an excellent heat dissipation effect for the mobile phone as the second experimental object.

[0232] In addition, Figure 19 (b) and Figure 18 Comparing with (b) in the figure, it can be seen that the locations of the collection points of the highest temperatures of the two are roughly in the same area (i.e., the area close to the heating device 8). The collection points of the lowest temperatures are different. The distance between the collection point of the lowest area in the second experimental object and the heating device 8 is significantly greater than the distance between the collection point of the lowest temperature in the first experimental object and the heating device 8. In this case, in the second experimental object, the temperature difference between the highest temperature and the lowest temperature on the inner surface of the bearing rear shell 4 is lower than that in the first experimental object. This further verifies that the first temperature equalizing plate 61 helps to equalize the temperature and dissipate heat for the mobile phone.

[0233] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0234] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: Screen, load-bearing back shell, circuit board, battery and first temperature vapor chamber; The load-bearing rear shell includes a back cover and a frame that are fixedly connected. The back cover and the screen are stacked and spaced apart. The frame is arranged around the back cover and the screen. A flexible protective layer is provided on the side of the screen facing the back cover. The thermal conductivity of the flexible protective layer is greater than that of air, and the flexible protective layer has through holes. The circuit board and the battery are both located within the load-bearing rear housing and fixed to and supported by the load-bearing rear housing. The circuit board is used to integrate a heating device, and the heating device is thermally connected to the first vapor chamber. In a plane parallel to the back cover, the orthographic projection of the through hole overlaps with the orthographic projection of the heating device. The first temperature vapor chamber is located on a side of the circuit board and the battery away from the screen, and is fixed and supported on the surface of the back cover facing the screen. In a plane parallel to the back cover, the orthographic projection of the circuit board is spaced apart from the orthographic projection of the battery, and the orthographic projection of the first temperature vapor chamber overlaps with the orthographic projection of the circuit board, and the orthographic projection of the first temperature vapor chamber overlaps with the orthographic projection of the battery.

2. The electronic device according to claim 1, wherein In a plane parallel to the back cover, an orthographic projection of at least one of the heating components overlaps with an orthographic projection of the first temperature vapor chamber.

3. The electronic device according to claim 2, wherein: The heating device includes a system-on-chip, and in a plane parallel to the back cover, the orthographic projection of the system-on-chip overlaps with the orthographic projection of the first vapor chamber; and / or, The heating device includes a power management chip, and in a plane parallel to the back cover, the orthographic projection of the power management chip overlaps with the orthographic projection of the first vapor chamber; and / or, The heating device includes a charging management chip, and in a plane parallel to the back cover, the orthographic projection of the charging management chip overlaps with the orthographic projection of the first vapor chamber; and / or, The heating device includes a radio frequency chip, and in a plane parallel to the back cover, the orthographic projection of the radio frequency chip overlaps with the orthographic projection of the first vapor chamber; and / or, The heating device includes a display chip, and in a plane parallel to the back cover, the orthographic projection of the display chip overlaps with the orthographic projection of the first vapor chamber; and / or, The heating device includes a universal memory, and in a plane parallel to the back cover, an orthographic projection of the universal memory overlaps with an orthographic projection of the first vapor chamber.

4. The electronic device according to any one of claims 1 to 3, characterized in that: A first heating device is integrated on the surface of the circuit board facing the back cover; The electronic device includes a first shielding cover, which is arranged on a side of the circuit board facing the back cover and covers the first heating element. The first shielding cover is thermally connected to the first temperature equalizing plate.

5. The electronic device according to claim 4, characterized in that In a plane parallel to the back cover, the orthographic projection of the first shielding cover overlaps with the orthographic projection of the first temperature vapor chamber.

6. The electronic device according to claim 4 or 5, characterized in that: The first shielding cover and the first temperature vapor chamber are directly in contact with each other and are connected by heat conduction; or a first heat conducting layer is provided between the first shielding cover and the first temperature vapor chamber.

7. The electronic device according to any one of claims 4 to 6, characterized in that: A second heat-conducting layer is provided between the first shielding cover and the first heating element.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The surface of the back cover facing the screen has a fixing groove, and the first temperature uniform plate is fixed in the fixing groove.

9. The electronic device according to claim 8, wherein: The surface of the first temperature homogenizing plate facing the screen is flush with the opening of the fixing groove.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The thickness of the first temperature equalizing plate ranges from 0.2 mm to 0.4 mm.

11. The electronic device according to any one of claims 1 to 10, characterized in that: The first temperature equalizer is fixed to the back cover via a thermally conductive adhesive layer; or the first temperature equalizer and the load-bearing rear shell are integrally formed.

12. The electronic device according to any one of claims 1 to 11, characterized in that: A support beam is provided on the surface of the back cover facing the screen. The support beam protrudes from the back cover toward the screen and is used to separate the battery and the circuit board.

13. The electronic device according to claim 12, wherein: The support beam has an avoidance opening, and the avoidance opening passes through the support beam in the arrangement direction of the battery and the circuit board. The first temperature uniform plate has a penetration portion, and the penetration portion is located in the avoidance opening.

14. The electronic device according to claim 13, wherein: The avoidance opening penetrates the support beam in the stacking direction of the back cover and the screen to divide the support beam into two spaced-apart sub-beams; The first temperature equalizing plate has avoidance gaps on both side walls in the arrangement direction of the two sub-beams, the penetration portion is located between the avoidance gaps on the two side walls of the first temperature equalizing plate, and the sub-beams are located in the corresponding avoidance gaps.

15. The electronic device according to any one of claims 1 to 14, characterized in that: A second heating device is integrated on the surface of the circuit board facing the screen; The electronic device includes a second shielding cover, which is arranged on a side of the circuit board facing the screen and covers the second heating device.

16. The electronic device according to claim 15, characterized in that A third heat conducting layer is provided between the second shielding cover and the second heating element.

17. The electronic device according to claim 15, characterized in that The electronic device also includes a circuit board bracket, which is arranged on the side of the circuit board facing the screen, and the second shielding cover is located between the circuit board and the circuit board bracket. The circuit board bracket is fixedly connected to the load-bearing rear shell, and the circuit board bracket is thermally conductively connected to the second shielding cover.

18. The electronic device according to claim 17, wherein: The second shielding cover is directly connected to the circuit board bracket by heat conduction; or a fourth heat conducting layer is provided between the second shielding cover and the circuit board bracket.

19. The electronic device according to any one of claims 1 to 18, characterized in that: The screen includes a translucent cover and a display screen. The translucent cover includes a fixing portion and a supporting portion. The fixing portion is arranged around the edge of the supporting portion. The fixing portion is fixed to and supported by the frame. The display screen is stacked and fixed on the surface of the supporting portion facing the back cover, and the side of the display screen away from the supporting portion is suspended in the air.

20. The electronic device according to any one of claims 1 to 19, characterized in that: A heat-dissipating material layer is provided on the surface of the screen facing the back cover.

21. The electronic device according to any one of claims 1 to 20, characterized in that: The screen includes a display screen, and the display screen includes multiple functional layers, the multiple functional layers are stacked in the thickness direction of the screen, and two adjacent functional layers are bonded together by an adhesive layer; Wherein, at least one of the adhesive layers has a through hole, and in a plane parallel to the back cover, the orthographic projection of the through hole overlaps with the orthographic projection of the heating element; and / or, At least one of the functional layers has a heat-insulating hole, and in a plane parallel to the back cover, an orthographic projection of the heat-insulating hole overlaps with an orthographic projection of the heating element.

22. The electronic device according to any one of claims 1 to 21, characterized in that: It also includes a second temperature averaging plate, which is arranged on the outer peripheral edge of the first temperature averaging plate and fixed to the inner peripheral surface of the frame.

23. The electronic device according to any one of claims 1 to 22, characterized in that: The load-bearing rear shell includes: an outer shell and an inner shell, wherein the inner shell is arranged on the inner surface of the outer shell; Wherein, the inner shell is a metal part, and the outer shell is a plastic part or a plain leather part; or, the inner shell is a plastic part, and the outer shell is a metal part.

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