Die cutting process

Abstract

The present application relates to the field of die cutting production process, and more particularly to a die cutting process and a die cutting product production line, comprising the following steps: forming a first semi-finished product, the first semi-finished product comprising a release film, a double-sided adhesive and a face paper which are sequentially compounded, wherein the release film is formed with mark point avoidance holes, the double-sided adhesive is formed with through holes, and the mark point avoidance holes are arranged within the range of the through holes; forming a second semi-finished product, the second semi-finished product comprising a PET film, a protective film and a low-adhesion film which are sequentially compounded; forming a third semi-finished product, the third semi-finished product comprising the double-sided adhesive and the second semi-finished product which are sequentially compounded, the double-sided adhesive is compounded with the PET film, and the through holes of the double-sided adhesive are formed with mark points; wherein forming the third semi-finished product comprises the following steps: sequentially compounding the second semi-finished product, the first semi-finished product and a mark point material layer, the mark point material layer is compounded with the release film; and cutting the mark point material layer within the mark point avoidance holes through a flat knife set cutting die, so as to form mark points with a specified appearance on the PET film.

Description

Technical Field

[0001] This invention relates to the field of die-cutting production processes, and specifically to a die-cutting process. Background Technology

[0002] Die-cut products typically require mark points for subsequent inspection and identification. Currently, mark points are mainly bonded to the original film using ejector pins before molding to achieve the desired dotted appearance. In rotary die-cutting, the inner and outer frames of the die-cut film are formed using a rotary die. To reduce film loss, the mark points are bonded to the original film using ejector pins before die-cutting. However, this ejector pin method can cause severe deformation of the mark points, making them difficult for customer equipment to identify. Furthermore, rotary die-cutting has poor precision, making it difficult to accurately control the cutting dimensions of the mark points. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a die-cutting process that can improve the dimensional accuracy and flatness of the mark points.

[0004] This application also proposes a die-cutting product production line capable of implementing the above-mentioned die-cutting process.

[0005] The die-cutting process according to the first aspect of this application includes the following steps:

[0006] The first semi-finished product is formed, which includes a release film, double-sided adhesive and face paper that are laminated in sequence. The release film has mark point clearance holes, and the double-sided adhesive has through holes. The mark point clearance holes are located within the range of the through holes.

[0007] A second semi-finished product is formed, which includes a PET film, a protective film, and a low-adhesion film that are sequentially laminated.

[0008] A third semi-finished product is formed, which includes double-sided adhesive and a second semi-finished product that are laminated sequentially. The double-sided adhesive is laminated with a PET film, and mark points are formed in the through-holes of the double-sided adhesive.

[0009] The process of forming the third semi-finished product includes the following steps: sequentially laminating the second semi-finished product, the first semi-finished product, and the mark point material layer; laminating the mark point material layer with the release film; and cutting the mark point material layer inside the mark point clearance hole using a flat-blade cutting die to form mark points with a specified appearance on the PET film.

[0010] The die-cutting process according to embodiments of the present invention has at least the following beneficial effects:

[0011] This embodiment of the application sequentially laminates a mark point material layer, a release film, double-sided adhesive, and a PET film. The mark point clearance holes and through holes can both be considered clearance structures for the mark points. Therefore, during the lamination process, the mark point material layer can be bonded to the PET film via these two clearance structures. Compared to using ejector pins, this embodiment uses a planar lamination method to attach part of the mark point material to the PET film, avoiding the risk of the mark points being pushed and deformed, significantly improving the flatness of the mark point material, and also preventing sheet loss. Furthermore, this embodiment uses a flat die-cutting method to cut the mark point clearance holes, through holes, and mark points into shape. The flat die-cutting mold can correct deviations in real time using positioning holes, improving the dimensional accuracy of the relevant holes and mark points. Therefore, the die-cutting process of this embodiment can improve the appearance accuracy of the mark points in terms of both surface flatness and cutting dimensions, which is beneficial to significantly improving the appearance yield of die-cut products.

[0012] According to some embodiments of the present invention, the second semi-finished product, the first semi-finished product, and the mark material layer are sequentially laminated, including the following steps: removing the face paper through a first row of waste tape; laminating the second semi-finished product onto double-sided adhesive; and laminating the mark material layer onto the release film. Under the extrusion action of the lamination process, the mark material layer can sequentially contact and adhere to the PET film through the mark avoidance holes and through holes.

[0013] According to some embodiments of the present invention, forming the third semi-finished product further includes the following steps: winding up the mark material layer; winding up the release film to form the third semi-finished product.

[0014] According to some embodiments of the present invention, forming a first semi-finished product includes the following steps: sequentially laminating a release film, double-sided adhesive, and face paper; using a flat-blade cutting die to punch mark point clearance holes in the release film, double-sided adhesive, and face paper and removing waste; using a flat-blade cutting die to punch through holes in the double-sided adhesive and face paper and removing waste.

[0015] According to some embodiments of the present invention, forming the first semi-finished product further includes the following steps: using a flat-blade cutting die to punch out a covering structure from the release film, double-sided adhesive, and face paper, wherein the area of ​​the covering structure is not less than the area of ​​the mark point; and collecting the covering structure.

[0016] According to some embodiments of the present invention, the die-cutting process further includes forming a fourth semi-finished product, which includes the following steps: cutting out the outline of the double-sided adhesive and the PET film; removing the waste material of the double-sided adhesive and the PET film frame to form the fourth semi-finished product.

[0017] According to some embodiments of the present invention, the die-cutting process further includes forming a fifth semi-finished product, which includes the following steps: cutting out the shape of the protective film; removing the outer frame waste of the protective film to form the fifth semi-finished product.

[0018] According to some embodiments of the present invention, the die-cutting process further includes forming a finished product, which includes the following steps: attaching the cover structure to the mark points; and winding up the low-tack film.

[0019] According to the second aspect of this application, the die-cutting production line is capable of performing the above-described die-cutting process.

[0020] The die-cutting production line according to the second aspect of this application has at least the following beneficial effects: including all the beneficial effects of the die-cutting process of the first aspect embodiment, which will not be repeated here.

[0021] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0023] Figure 1 This is a flowchart illustrating a die-cutting process according to an embodiment of the present invention;

[0024] Figure 2 This is a flowchart illustrating step S100 of an embodiment of the present invention;

[0025] Figure 3 This is a flowchart illustrating step S300 of an embodiment of the present invention;

[0026] Figure 4 This is a flowchart illustrating step S310 of an embodiment of the present invention;

[0027] Figure 5 This is a flowchart illustrating step S400 of an embodiment of the present invention;

[0028] Figure 6 This is a flowchart illustrating step S500 of an embodiment of the present invention;

[0029] Figure 7 This is a flowchart illustrating step S600 of an embodiment of the present invention;

[0030] Figure 8 This is a schematic diagram of the structure of the finished product obtained by the die-cutting process according to an embodiment of the present invention;

[0031] Figure 9 Regarding an embodiment of the present invention Figure 8 An explosion diagram;

[0032] Figure 10 This is a schematic diagram showing the distribution of the composite layer material corresponding to steps S310 and S320 in an embodiment of the present invention.

[0033] Figure 11 This is a schematic diagram of the blade line corresponding to step S100 in an embodiment of the present invention;

[0034] Figure 12 This is a schematic diagram of the cutter line corresponding to step S400 in an embodiment of the present invention;

[0035] Figure 13 This is a schematic diagram of the cutting edge corresponding to step S500 in an embodiment of the present invention.

[0036] Figure label:

[0037] 100 (First semi-finished product); 110 (release film); 120 (double-sided adhesive); 130 (face paper); 140 (mark point clearance hole); 150 (through hole); 160 (covering structure); 200 (Second semi-finished product); 210 (PET film); 220 (protective film); 230 (low-adhesion film); 300 (Third semi-finished product); 310 (mark point material layer); 311 (mark point); 400 (Fourth semi-finished product); 500 (Fifth semi-finished product); 510 (mounting hole); 600 (finished product); 700 (positioning hole). Detailed Implementation

[0038] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0039] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0040] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0041] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0042] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0043] Please see Figure 1 According to the die-cutting process of the first aspect of this application, the process includes the following steps:

[0044] S100, forming a first semi-finished product 100, the first semi-finished product 100 includes a release film 110, double-sided adhesive 120 and face paper 130 sequentially laminated, wherein the release film 110 has a mark point avoidance hole 140 formed on it, and the double-sided adhesive 120 has a through hole 150 formed on it, and the mark point avoidance hole 140 is located within the range of the through hole 150.

[0045] S200, forming a second semi-finished product 200, the second semi-finished product 200 including a PET film 210, a protective film 220 (also called cover), and a low-adhesion film 230 sequentially laminated;

[0046] S300, forming a third semi-finished product 300, the third semi-finished product 300 includes a double-sided adhesive 120 and a second semi-finished product 200 that are sequentially laminated, the double-sided adhesive 120 is laminated with a PET film 210, and a mark point 311 is formed in the through hole 150 of the double-sided adhesive 120.

[0047] S400, forming the fourth semi-finished product 400;

[0048] S500, forming the fifth semi-finished product 500;

[0049] S600, forming finished product 600 (e.g.) Figure 8 and Figure 9 (As shown).

[0050] Please see Figure 2 Step S100 includes:

[0051] S110, sequentially laminate release film 110, double-sided adhesive 120, face paper 130;

[0052] S120, using a flat-blade cutting die, punches out mark point clearance holes 140 on release film 110, double-sided tape 120, and face paper 130 and removes waste;

[0053] S130: Use a flat-blade die to punch through holes 150 in the double-sided tape 120 and the face paper 130 and remove waste.

[0054] S140. Using a flat die, cut the release film 110, double-sided adhesive 120, and face paper 130 to create a covering structure 160. The area of ​​the covering structure 160 is not less than the area of ​​the mark point 311.

[0055] S150, collection coverage structure 160.

[0056] Please refer to the tool path corresponding to step S100. Figure 11 Specifically, the release film 110 is used as a backing material. In some embodiments, the release film 110 is placed horizontally and moves forward. First, in step S110, double-sided adhesive 120 and face paper 130 are sequentially laminated on the upper surface of the release film 110. Then, in step S120, the release film 110, double-sided adhesive 120, and face paper 130 are completely cut to obtain mark point avoidance holes 140. The mark point avoidance holes 140 are used to avoid the position where the mark point 311 needs to be adhered. Then, in step S130, the die is half-cut into the release film. On 110, a through hole 150 is formed on the double-sided adhesive 120 and the face paper 130. The size and shape of the through hole 150 are determined according to the actual appearance requirements of the product. Since the position of the mark point avoidance hole 140 is the forming position of the subsequent mark point 311, in order to ensure the normal use of the die-cut product, the mark point avoidance hole 140 should avoid the area of ​​the double-sided adhesive 120. It is recommended that the diameter of the mark point avoidance hole 140 be smaller than the diameter of the through hole 150, and that the mark point avoidance hole 140 be set within the range of the through hole 150.

[0057] In some embodiments, to further improve processing efficiency, step S140 can be performed simultaneously with step S120. In this process, the covering structure 160 should be located outside the through hole 150 to prevent it from damaging the appearance of the die-cut product. The composite layer material is fully cut in two areas to obtain the mark point avoidance hole 140 structure and the covering structure 160, respectively. After cutting and forming, the mark point avoidance holes 140 are removed, and the covering structure 160 is collected. The covering structure 160 is used to adhere to the mark point 311 after it is formed, to protect the surface quality of the mark point 311.

[0058] Please see Figure 3 Step S300 includes:

[0059] S310, the second semi-finished product 200, the first semi-finished product 100, and the mark material layer 310 are sequentially laminated. Among them, the PET film 210 is laminated with the double-sided adhesive 120, and the mark material layer 310 is laminated with the release film 110. During the lamination process, the mark material layer 310 sequentially contacts and adheres to the PET film 210 through the mark clearance hole 140 and the through hole 150.

[0060] S320: The mark material layer 310 within the mark relief hole 140 is cut using a flat die, thereby forming a mark 311 with a specified appearance on the PET film 210. The mark relief hole 140 should be at least 0.2 mm larger on one side than the set size of the mark 311 to facilitate the die cutting out a mark 311 that meets the size requirements. For the composite layer material distribution corresponding to steps S310 and S320, please refer to [link / reference needed]. Figure 10 .

[0061] S330, winding mark point material layer 310;

[0062] S340, winding up the release film 110, forming the third semi-finished product 300.

[0063] Please see Figure 4 Step S310 includes:

[0064] S311. Remove the face paper 130 through the first row of waste tape; this operation is to make the surface of the double-sided adhesive 120 away from the release film 110 sticky, so as to facilitate the next lamination operation.

[0065] S312, A second semi-finished product 200 is laminated onto the surface of the double-sided adhesive 120 away from the release film 110; wherein, the PET film 210 is bonded to the double-sided adhesive 120, thereby laminating the PET film 210, the protective film 220, and the low-tack film 230 onto the double-sided adhesive 120.

[0066] S313, A mark material layer 310 is laminated onto the surface of the release film 110 away from the double-sided adhesive 120; under the extrusion action of the lamination action, the mark material layer 310 can sequentially contact and adhere to the PET film 210 through the mark clearance hole 140 and the through hole 150, thereby flatly bonding to the PET film 210, achieving stable adhesion without the need for ejector pins.

[0067] Step S320 involves cutting the mark point relief hole 140 and through hole 150 after punching them out, and then cutting the mark point material layer 310 within the mark point relief hole 140 into shape using a flat die. The mark point relief hole 140, through hole 150, and mark point 311 are all cut and shaped by a flat die. Therefore, it can be understood that the release film 110 travels between the upper and lower dies of the flat die. According to the conventional positioning structure of the flat die, the lower die will have four or more positioning holes 700 around the release film 110. The flat die uses the positioning holes 700 to correct deviation in real time to improve cutting accuracy. Based on this positioning advantage of flat die cutting, the mark point relief hole 140, through hole 150, and mark point 311 can all achieve higher dimensional accuracy than with a circular die, greatly optimizing the flatness and dimensional accuracy of the mark point 311.

[0068] In summary, this embodiment sequentially laminates the mark point material layer 310, release film 110, double-sided adhesive 120, and PET film 210. The mark point clearance hole 140 and through hole 150 can both be considered as pre-cut clearance structures for the mark point 311. Therefore, during the lamination process, the mark point material layer 310 can be bonded to the PET film 210 via the aforementioned two clearance structures. Compared to using ejector pins, this embodiment uses a planar lamination method to attach a portion of the mark point 311 material to the PET film 210, avoiding the risk of the mark point 311 being deformed by being pushed, significantly improving the flatness of the mark point 311 material, and also preventing sheet loss. Furthermore, this embodiment uses a flat die-cutting method to cut the mark point clearance hole 140, through hole 150, and mark point 311 into shape. The flat die-cutting mold can correct deviations in real time using the positioning hole 700, improving the dimensional accuracy of the relevant holes, especially the mark point 311. Therefore, the die-cutting process of this application embodiment can improve the appearance accuracy of mark point 311 in terms of both surface flatness and cutting size, which is beneficial to significantly improve the appearance yield of die-cut products.

[0069] Please see Figure 5 Step S400 includes:

[0070] S410, Cut out the shapes of double-sided tape 120 and PET film 210 to form the desired product shape;

[0071] S420, the outer frame waste of double-sided tape 120 and PET film 210 is removed through the second row of waste tape to form the fourth semi-finished product 400.

[0072] Please refer to the tool path corresponding to step S400. Figure 12 .

[0073] Please see Figure 6 Step S500 includes:

[0074] S510, Cut out the shape of the protective film 220;

[0075] S520, remove the outer frame waste of protective film 220 to form the fifth semi-finished product 500.

[0076] Additionally, in some embodiments, it is necessary to punch out a number of mounting holes 510 on the protective film 220 while cutting its shape or after cutting it. These mounting holes 510 correspond to the fixture assembly and positioning mechanism of the customer equipment, so that the die-cut product can be installed on the corresponding equipment fixture in the correct position.

[0077] Please refer to the tool path corresponding to step S500. Figure 13 .

[0078] Please see Figure 7 Step S600 includes:

[0079] S610. The covering structure 160 is attached to the mark point 311 to protect the surface quality of the mark point 311 and reduce the risk of the mark point 311 being scratched and deformed.

[0080] S620, low-adhesion film 230.

[0081] In addition, this application embodiment also provides a die-cutting product production line that can realize the above-mentioned die-cutting process.

[0082] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A die-cutting process, characterized in that, Includes the following steps: A first semi-finished product (100) is formed, comprising a release film (110), double-sided adhesive (120), and face paper (130) sequentially laminated together. The release film (110) has a mark point relief hole (140), and the double-sided adhesive (120) has a through hole (150). The mark point relief hole (140) is located within the range of the through hole (150). A second semi-finished product (200) is formed, which includes a PET film (210), a protective film (220), and a low-adhesion film (230) sequentially laminated together. A third semi-finished product (300) is formed, the third semi-finished product (300) comprising the double-sided adhesive (120) and the second semi-finished product (200) sequentially laminated, the double-sided adhesive (120) being laminated with the PET film (210), and a mark point (311) being formed in the through hole (150) of the double-sided adhesive (120). The formation of the third semi-finished product (300) includes the following steps: sequentially laminating the second semi-finished product (200), the first semi-finished product (100), and the mark material layer (310), wherein the mark material layer (310) is laminated with the release film (110); and cutting the mark material layer (310) within the mark clearance hole (140) using a flat die, thereby forming the mark (311) with a specified appearance on the PET film (210). The step of sequentially compounding the second semi-finished product (200), the first semi-finished product (100), and the mark point material layer (310) includes the following steps: The face paper (130) is removed by the first row of waste tape; The double-sided adhesive (120) is used to bond the second semi-finished product (200). When the release film (110) is laminated with the mark material layer (310), under the extrusion action of the lamination action, the mark material layer (310) can sequentially contact and adhere to the PET film (210) through the mark clearance hole (140) and the through hole (150).

2. The die-cutting process according to claim 1, characterized in that, The process of forming the third semi-finished product (300) also includes the following steps: The mark point material layer (310) is wound up. The release film (110) is wound up to form a third semi-finished product (300).

3. The die-cutting process according to claim 1, characterized in that, The formation of the first semi-finished product (100) includes the following steps: The release film (110), the double-sided adhesive (120), and the face paper (130) are sequentially laminated. The release film (110), the double-sided adhesive (120), and the face paper (130) are punched with a flat die to create the mark hole (140) and remove waste. The through holes (150) are punched out on the double-sided adhesive (120) and the face paper (130) using a flat blade cutting die, and waste is removed.

4. The die-cutting process according to claim 2, characterized in that, The process of forming the first semi-finished product (100) also includes the following steps: A flat-blade die is used to punch out a covering structure (160) from the release film (110), the double-sided adhesive (120), and the face paper (130). The area of ​​the covering structure (160) is not less than the area of ​​the mark point (311). Collect the overlay structure (160).

5. The die-cutting process according to claim 4, characterized in that, It also includes forming a fourth semi-finished product (400), which includes the following steps: Cut out the shapes of the double-sided adhesive (120) and the PET film (210); Remove the waste material from the double-sided adhesive (120) and the outer frame of the PET film (210) to form the fourth semi-finished product (400).

6. The die-cutting process according to claim 5, characterized in that, It also includes forming a fifth semi-finished product (500), which includes the following steps: Cut out the shape of the protective film (220); Remove the outer frame waste of the protective film (220) to form the fifth semi-finished product (500).

7. The die-cutting process according to claim 6, characterized in that, It also includes forming a finished product (600), which includes the following steps: The covering structure (160) is attached to the mark point (311); The low-viscosity film (230) is wound up.

Images