Semiconductor optoelectronic device non-contact testing device and method based on yield sub-items

Abstract

The invention discloses a non-contact testing device and method for semiconductor optoelectronic devices based on yield sub-items, comprising a plurality of test items located in a test area, each test item having a plurality of test items, each test item being sorted from small to large according to the yield, each test item facing a short-circuit device, the short-circuit device comprising a metal plate and a test piece placed above the metal plate, the light-emitting surface of the test piece facing the light-receiving direction of the test item, each short-circuit device also facing an induction coil, the induction coils corresponding to all the short-circuit devices and a pulse power supply being connected in series; the invention has the advantages of: considering the influence of the yield on the test during the test process, greatly reducing the test time, and improving the test efficiency.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit testing, and more specifically to a non-contact testing device and method for semiconductor optoelectronic devices based on yield sub-items. Background Art

[0002] As a new type of laser light source, semiconductor laser (Laser Diode, LD for short) has become an important commodity and has been widely used due to its advantages such as high conversion efficiency, small size, light weight, high reliability, direct modulation, and strong ability to integrate with other semiconductor devices. Its working stability and reliability play a key role in the application system. Semiconductor lasers are precision optoelectronic devices. With the expansion of their application range, higher and higher requirements are also put forward for their performance. From the various stages of wafer-die-component assembly, strict testing of the device is required to ensure the yield and reliability of the device, thus putting forward new requirements for the research of semiconductor laser performance testing technology. Parameter testing of semiconductor lasers is an important process to evaluate their performance, which includes testing of parameters such as power, wavelength, spectrum width, efficiency, etc.

[0003] The contact test method is widely used in the industry for characteristic testing of semiconductor lasers. This method mainly uses a laser driver to contact and energize the semiconductor laser electrode through a probe, thereby performing relevant parameter tests. However, in the field of LEDs, a non-contact test method that energizes the device under test through the inductive effect has been widely used. This method has the characteristics of simple design, safety and high efficiency. For example, Chinese patent publication number CN112858864A discloses a device and method for non-contact photoelectric detection of LED chips, but the test method disclosed in the patent application can only test a single device under test, and cannot test multiple devices under test in parallel for different test items, so the test efficiency is low. Sub-item testing has some applications in semiconductor lasers, such as Chinese patent application number 202310139214.6, named a semiconductor optoelectronic device non-contact characteristic sub-item test device and method. Although the test method involved involves parallel testing of multiple devices under test for different test items, it does not take into account that the yield of the device under test in different test items is not the same, and thus does not consider the impact of the yield on the test during the test, which greatly increases the test time, resulting in low test efficiency. Summary of the invention

[0004] The technical problem to be solved by the present invention is that the prior art non-contact semiconductor optoelectronic device testing equipment does not consider the impact of the yield on the test during the test process, which greatly increases the test time and thus reduces the test efficiency.

[0005] The present invention solves the above-mentioned technical problems through the following technical means: a non-contact testing device for semiconductor optoelectronic devices based on yield sub-items, including a plurality of test items located in a test area, each test item having multiple test items, and each test item is sorted from small to large according to the yield, and each test item is facing a short-circuit device, and the short-circuit device includes a metal plate and a test piece placed above the metal plate, and the light-emitting surface of the test piece is facing the light-receiving direction of the test item, and each short-circuit device is also facing an induction coil, and the induction coils and pulse power supplies corresponding to all the short-circuit devices are connected in series.

[0006] Beneficial effect: The present invention sorts each test item according to the yield from small to large, and removes unqualified parts to be tested during the test process. That is, the parts to be tested first undergo the test item with the lowest yield, and the yields of subsequent test items increase successively. The test items with low yields are tested first, which ensures that unqualified parts to be tested are removed in time to the greatest extent possible, so that they will not appear in subsequent test items, and avoid the originally unqualified parts to be tested from being removed only at the end after being tested in multiple test items, thereby greatly reducing the test time and improving the test efficiency.

[0007] Furthermore, the non-contact testing device for semiconductor optoelectronic devices based on yield sub-items also includes a conveyor belt, the testing area is located in the middle area in the running direction of the conveyor belt, a loading area is set at the front end in the running direction of the conveyor belt, and an unloading area is set at the end in the running direction of the conveyor belt.

[0008] Furthermore, a waiting area is provided corresponding to the location of each test item, and the waiting area is used to bin the test pieces and remove unqualified test pieces.

[0009] Furthermore, the non-contact testing device for semiconductor optoelectronic devices based on yield classification also includes a robotic arm, which is used to transfer the test pieces to the corresponding waiting area after each test item completes the test of the test pieces, or to transfer the test pieces to the next test item after the test pieces are binned in the waiting area.

[0010] Furthermore, the device to be tested is one of a semiconductor laser, an LED chip, a light guide, a photocell, a photodiode, and a phototransistor.

[0011] The present invention also provides a non-contact testing method for semiconductor optoelectronic devices based on yield sub-items, the method comprising:

[0012] The short-circuit device is placed on the conveyor belt and runs from the loading area to the testing area. The short-circuit device includes a metal plate and a piece to be tested placed on the metal plate. A variety of test items are located in the testing area. There are multiple test items for each test item. Each test item is sorted from small to large according to the yield. When there is a piece to be tested corresponding to the position of the test item with the smallest yield, the conveyor belt stops running and the piece to be tested is optically tested. After the test is completed, the piece to be tested is transferred to the waiting area corresponding to the test item by a robotic arm for binning. After the binning is completed, the piece to be tested is transferred to the next test item by a robotic arm for continued testing and binning. The test is performed level by level and binned. After the piece to be tested passes all types of test items, it is transferred to the unloading area.

[0013] Furthermore, the method further comprises:

[0014] During the testing process, after all types of test items of the current batch of parts to be tested are tested, the conveyor belt continues to run, and the next batch of parts to be tested runs from the loading area to the testing area. When there is a part to be tested corresponding to the position of the test item with the lowest yield or when the number of parts to be tested to be binned in the waiting area corresponding to the test item with the lowest yield exceeds the preset upper limit, the conveyor belt stops running.

[0015] Furthermore, the number of each test item is set as follows:

[0016] Sort each test item by yield from low to high. Mark the test time, assuming is the yield of the i-th test item, is the number of the i-th test item, and the last test item is The number of test items is set to 1, and the number of other test items is obtained according to the test time and yield in the following way:

[0017] like ,but , and when hour, ;

[0018] like ,but , and when hour, .

[0019] Furthermore, the yield rate is determined by:

[0020] First, randomly sample a part of the parts to be tested;

[0021] Without considering the number of test items, the test is performed to obtain the test data of the sampled parts to be tested;

[0022] Perform data cleaning, delete the data corresponding to the test items with too large data deviation among the same type of test items, and check whether there is a problem with the test item. If there is a problem, remove the test item; the method of checking whether there is a problem with the test item is: for the test items with too large data deviation among the same type of test items, use normal test pieces to test, if the measured data still has problems, replace the test item equipment. At the same time, use normal test pieces to test the replaced test item equipment to ensure that the replaced test item equipment is normal.

[0023] The yield rate of each test item is obtained based on the number of tested pieces that pass the test in each test item / the total number of tested pieces.

[0024] Furthermore, the process of performing optical testing on the DUT for each test item is as follows:

[0025] The device under test placed on the metal plate forms a short circuit, and the pulse power supply excites the short circuit at the corresponding position of the induction coil to generate an induced current, so that the device under test is powered on and illuminated. The light emitted by the device under test is detected by the test item at its corresponding position, thereby performing an optical test on the device under test.

[0026] The present invention also provides a non-contact testing method for semiconductor optoelectronic devices based on yield sub-items, the method comprising:

[0027] The short-circuit device is placed on the conveyor belt and runs from the loading area to the testing area. The short-circuit device includes a metal plate and a piece to be tested placed on the metal plate. An insulating layer is arranged on the edges of the metal plate. A variety of test items are located in the testing area. There are multiple test items of each kind. Each test item is sorted in ascending order of yield. A baffle that can block the piece to be tested from moving forward is arranged at the position of the last test item of each test item. The conveyor belt continues to run. After the baffle corresponding to the first test item blocks the short-circuit device, multiple short-circuit devices are contacted in series, and the piece to be tested on each short-circuit device is facing a test item and an induction coil. Each test item of the current type performs optical testing on the piece to be tested. After the test is completed, the piece to be tested that has completed the current test is transferred to the waiting area corresponding to the test item by a robotic arm for binning. After the binning is completed, the piece to be tested is transferred to the next test item by a robotic arm for continued testing and binning. The test is conducted level by level and binned. After the piece to be tested passes all types of test items, it is transferred to the unloading area.

[0028] The advantages of the present invention are:

[0029] (1) The present invention sorts each test item according to the yield from small to large, and removes unqualified DUTs during the test process. That is, the DUT first undergoes the test item with the lowest yield, and the yields of subsequent test items increase successively. The test items with low yields are tested first, which ensures that unqualified DUTs are removed in time to the greatest extent possible, so that they will not appear in subsequent test items, and avoid the originally unqualified DUTs being removed only at the end after being tested in multiple test items, thereby greatly reducing the test time and improving the test efficiency.

[0030] (2) In the present invention, when there is a piece of test material corresponding to each position of the test item with the lowest yield or when the number of pieces of test material to be binned in the waiting area corresponding to the test item with the lowest yield exceeds a preset upper limit, the conveyor belt stops running to prevent the waiting area from accumulating pieces of test material exceeding the preset upper limit and thus being unable to normally receive the next batch of pieces of test material.

[0031] (3) In the present invention, the positions of the induction coil, the test item and the device to be tested are aligned, and the pulse power supply excites the short-circuit loop at the corresponding position of the induction coil to generate an induced current, thereby energizing the device to be tested and lighting up the device to be tested. The light emitted by the device to be tested is detected by the test item at its corresponding position, thereby performing an optical test on the device to be tested, realizing non-contact testing, and multiple test items are set for each test item to realize parallel testing of each test content, greatly improving the test efficiency.

[0032] (4) If the number of the next test items is the same as the number of the previous test items, there will be a part of the test items that have no corresponding DUTs, resulting in a futile wait. Therefore, the present invention reasonably sets the number of each test item according to the yield of different types of test items, test time, etc., so that each test item has a corresponding DUT, avoiding the futile wait. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of a non-contact testing device for semiconductor optoelectronic devices based on yield sub-items disclosed in Embodiment 1 of the present invention;

[0034] Figure 2 It is a schematic diagram of a short-circuit device in a non-contact test device for semiconductor optoelectronic devices based on yield sub-items disclosed in Embodiment 1 of the present invention;

[0035] Figure 3 A design flow chart of the number of test items in the non-contact test method for semiconductor optoelectronic devices based on yield sub-items disclosed in Embodiment 2 of the present invention;

[0036] Figure 4 This is a relationship diagram between the yield and test time of each test item in the non-contact test method for semiconductor optoelectronic devices based on yield sub-items disclosed in Example 2 of the present invention. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in combination with the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Example 1

[0039] like Figure 1 As shown, the present invention provides a non-contact test device for semiconductor optoelectronic devices based on yield classification, including multiple test items 1 located in a test area 7, each test item 1 performs a type of test, and each test item 1 has multiple items, which is convenient for testing multiple DUTs 2 in parallel under each test type, thereby improving the test efficiency. Each test item 1 is sorted from small to large according to the yield, and each test item 1 is facing a short-circuit device, such as Figure 2 As shown, the short-circuit device includes a metal plate 3 and a DUT 2 placed on the metal plate 3, the positive and negative electrodes of the DUT 2 are in contact with the metal plate 3, thereby forming a closed loop, i.e., a short-circuit loop, and the light-emitting surface of the DUT 2 faces the light-receiving direction of the test item 1. Each short-circuit device also faces an induction coil 4, and the induction coils 4 and pulse power supplies 5 corresponding to all the short-circuit devices are connected in series to form another closed loop, i.e., a test control loop.

[0040] In order to facilitate industrial application in practical application, the testing device of the present invention further includes a conveyor belt 6, wherein the testing area 7 is located in the middle area of ​​the conveyor belt 6 in the running direction, a loading area 8 is set at the front end of the conveyor belt 6 in the running direction, and a unloading area 9 is set at the end of the conveyor belt 6 in the running direction. The form of the conveyor belt 6 is not too restricted, and it can be linear or circular. The linear conveyor belt 6 only needs to set the loading area 8 at the head end in the running direction, the unloading area 9 at the end in the running direction, and the testing area 7 in the middle area in the running direction. The circular conveyor belt 6 is similar to the linear conveyor belt 6. If the circular conveyor belt 6 runs in a clockwise direction, any area of ​​the conveyor belt 6 is set as the testing area 7, and then the area of ​​the conveyor belt 6 located at the front end of the testing area 7 according to the running direction is considered to be set with the loading area 8, and the area of ​​the conveyor belt 6 located at the rear end of the testing area 7 according to the running direction is considered to be set with the unloading area 9. It should be noted that the loading area 8, the unloading area 9 and the testing area are not directly arranged on the conveyor belt 6, but are near the corresponding positions of the conveyor belt 6. Only the test pieces 2 loaded from the loading area 8 are located on the conveyor belt 6, and are transmitted through the conveyor belt 6 to the testing area for testing. After the test, they are transmitted to the unloading area 9 through the conveyor belt 6.

[0041] In practical applications, a waiting area 10 is set corresponding to the location of each test item 1, and the waiting area 10 is used to bin the test pieces 2 and remove unqualified test pieces 2. Figure 1 , Figure 1 1a represents the first test item 1, 1b represents the second test item 1, 1c represents the third test item 1, and a waiting area 10 is set at the location of each test item 1. In this embodiment, the waiting area 10 and each test area are spatially located in the upper space of the conveyor belt 6 to avoid mutual interference between the waiting area 10 and the test area during the operation of the conveyor belt 6.

[0042] From the foregoing content, it can be known that the piece to be tested 2 needs to arrive at the waiting area 10 for binning after completing the relevant tests of each test item 1, because the testing device provided by the present invention also includes a robotic arm 11, and the robotic arm 11 is used to transfer the piece to be tested 2 to the corresponding waiting area 10 after each test item 1 completes the test of the piece to be tested 2, or to transfer the piece to be tested 2 to the next test item 1 after the waiting area 10 completes the binning of the piece to be tested 2.

[0043] As a further improvement of the present invention, the device under test 2 is one of a semiconductor laser, an LED chip, a light pipe, a photocell, a photodiode, and a phototransistor. As long as the positive and negative electrodes of the above devices are attached to the metal plate 3 to achieve short circuit, a device under test 2 can be formed, and it is necessary to ensure that the light-emitting surface of the above device is facing the light-receiving surface of the corresponding test item 1, so as to ensure that the test item 1 can collect the optical signal of the device under test 2, so as to perform relevant tests on it.

[0044] The working process of the present invention is as follows: the piece to be tested 2 is placed on the conveyor belt 6 and runs from the loading area 8 to the testing area 7. When there is a piece to be tested 2 corresponding to the position of the test item 1 with the lowest yield, the conveyor belt 6 stops running, and the piece to be tested 2 placed on the metal plate 3 forms a short circuit. The pulse power supply 5 excites the short circuit at the corresponding position of the induction coil 4 to generate an induced current, so that the piece to be tested 2 is energized and the piece to be tested 2 is lit. The light emitted by the piece to be tested 2 is detected by the test item 1 at its corresponding position, so that the piece to be tested 2 is optically tested. After the test is completed, the piece to be tested 2 is transferred to the waiting area 10 corresponding to the test item 1 by the robot arm 11 for binning. After the binning is completed, the piece to be tested 2 is transferred to the next test item 1 by the robot arm 11 to continue testing and binning. The test is carried out level by level and binned. After the piece to be tested passes all types of test items 1, it is transferred to the unloading area 9. Binning is done after the test equipment has tested the device 2 and then classified according to the voltage value, band value, and power value. Binning can be done manually. Binning belongs to the conventional technology in the industry and is not an improvement point of the present invention, so it will not be elaborated on here.

[0045] By sorting each test item 1 from small to large according to the yield, unqualified DUT 2 is eliminated during the test process, that is, the DUT 2 first undergoes the test item 1 with the lowest yield, and the yields of subsequent test items 1 increase successively, and the test items 1 with low yield are tested first, so as to ensure that unqualified DUT 2 is eliminated in time to the greatest extent, so that it will not appear in the subsequent test items 1, and avoid the originally unqualified DUT 2 being eliminated only after being tested by multiple test items 1, thereby greatly reducing the test time and improving the test efficiency.

[0046] Example 2

[0047] Based on Example 1, the present invention also provides a non-contact testing method for semiconductor optoelectronic devices based on yield sub-items, the method comprising:

[0048] The piece to be tested 2 is placed on the conveyor belt 6 and runs from the loading area 8 to the testing area 7. When there is a piece to be tested 2 corresponding to the position of the test item 1 with the lowest yield, the conveyor belt 6 stops running, and the piece to be tested 2 placed on the metal plate 3 forms a short circuit. The pulse power supply 5 excites the short circuit at the corresponding position of the induction coil 4 to generate an induced current, so that the piece to be tested 2 is energized and the piece to be tested 2 is lit. The light emitted by the piece to be tested 2 is detected by the test item 1 at its corresponding position, so that the piece to be tested 2 is optically tested. After the test is completed, the piece to be tested 2 is transferred to the waiting area 10 corresponding to the test item 1 by the robot arm 11 for binning. After the binning is completed, the piece to be tested 2 is transferred to the next test item 1 by the robot arm 11 to continue testing and binning. The test is carried out level by level and binned. After the piece to be tested passes all types of test items 1, it is transferred to the unloading area 9.

[0049] During the testing process, after all types of test items 1 of the current batch of parts to be tested 2 are tested, the conveyor belt 6 continues to run, and the next batch of parts to be tested 2 runs from the loading area 8 to the testing area 7. When there is a part to be tested 2 corresponding to the position of the test item 1 with the lowest yield or when the number of parts to be tested 2 to be binned in the waiting area 10 corresponding to the test item 1 with the lowest yield exceeds a preset upper limit, the conveyor belt 6 stops running to prevent the waiting area 10 from accumulating parts to be tested 2 exceeding the preset upper limit and thus failing to normally receive the next batch of parts to be tested 2.

[0050] Considering that the test time of each test item 1 is different, and the yield of the current test item 1 is different from the yield of the next test item, some of the DUTs 2 may be eliminated after the test of the current test item 1 is completed. If the number of the next test item 1 and the current test item 1 is set to the same, after the test of the current test item 1 is completed, there will not be so many DUTs 1 when testing the next test item 1, resulting in some test items 1 being in a vacant state. Therefore, in order to avoid this vacant phenomenon, Figure 3 As shown, the present invention sets the number of each test item 1, and the setting method is:

[0051] Sort each test item 1 by yield from low to high. After sorting, each test item 1 is sorted by Mark the test time, assuming is the yield of the i-th test item 1, is the number of the i-th test item 1. In this embodiment, the last test item 1 is The number of test items is set to 1. In actual applications, the appropriate number is set according to production needs. The number of other test items 1 is obtained according to the test time and yield in the following way:

[0052] like ,but , and when hour, ;

[0053] like ,but , and when hour, .

[0054] Specific reference Figure 4 The following example illustrates how to calculate the number of test items 1. Test items 1 are recorded in order of yield from small to large as: a1, a2, a3, a4, a5, a6, a7, a8, a9, a10. Among them, the number of items a10 is 1, the number of items a9 is ([8 / 4 / 0.97]+1)*1=3, the number of items a8 is [3 / (8 / 6*0.9)]+1=3, the number of items a7 is [3 / (6 / 5*0.8)]+1=4, the number of items a6 is [4 / (5 / 1*0.75)]+1=2, the number of items a5 is ([4 / 1 / 0.7]+1)*2=12, the number of items a4 is ([7 / 4 / 0.66]+1)*12=36, the number of items a3 is ([16 / 7 / 0.6]+1)*36=144, the number of items a2 is [144 / (16 / 11*0.5)]+1=199, and the number of items a1 is [199 / (11 / 8*0.47)]+1=308. By this arrangement, a1=308, a2=199, a3=144, a4=36, a5=12, a6=2, a7=4, a8=3, a9=3, a10=1. The above settings can ensure that each test item 1 will not be idle in the later stage of the test, and according to the yield rate, some unqualified devices can be eliminated in time to reduce the test time.

[0055] The above process requires sorting the yield of each test item 1, so it is necessary to determine the yield of each test item 1. The yield determination method is:

[0056] First, randomly sample a part of the test piece 2;

[0057] Without considering the number of test items 1, the test is performed to obtain the test data of the sampled part of the test piece 2;

[0058] Perform data cleaning, delete the data corresponding to the test item 1 with too large data deviation among the same type of test items 1, and check whether the test item 1 has problems. If there are problems, remove the test item 1. The method for checking whether the test item 1 has problems is: test the test item 1 with too large data deviation among the same type of test items 1 with a normal test piece 2. If the measured data still has problems, replace the test item 1 equipment. At the same time, test the replaced test item 1 equipment with a normal test piece 2 to ensure that the replaced test item 1 equipment is normal.

[0059] The yield rate of each test item 1 is obtained according to the number of the test pieces 2 that have passed the test in each test item 1 / the total number of the test pieces 2.

[0060] Through the above technical scheme, when there is a DUT 2 corresponding to each position of the test item 1 with the lowest yield or when the number of DUT 2 to be binned in the waiting area 10 corresponding to the test item 1 with the lowest yield exceeds the preset upper limit, the conveyor belt 6 stops running to prevent the waiting area 10 from accumulating DUT 2 exceeding the preset upper limit and thus failing to normally receive the next batch of DUT 2. The positions of the induction coil 4, the test item 1 and the DUT 2 are aligned, and the DUT 2 is optically tested to achieve non-contact testing, and multiple test items 1 are set for each test item to achieve parallel testing of each test content, greatly improving the test efficiency.

[0061] Example 3

[0062] Based on Example 2, in actual applications, during the operation of the conveyor belt 6, the device under test 2 will pass through other test items 1 when it runs to the test item 1 at the corresponding position. For example, it will stop when it runs from the position of the first test item 1 of the first test item 1 to the position of the last test item 1, which will cause a device under test 2 to pass through multiple test items 1 before being tested. When passing through, the induced current will be triggered, turning on the device under test 2, thereby performing a short-term optical test, which will affect the final test result. This problem can be solved by controlling the on and off of the pulse power supply 5, and the pulse power supply 5 will be powered on when the conveyor belt 6 stops running. Alternatively, the test can be started only when the device under test 2 reaches the corresponding position, that is, data collection begins. The data obtained by other induction coils 4 before the device under test 2 reaches the corresponding position is scattered and can be discarded.

[0063] Example 4

[0064] Based on Example 2, the present invention also provides another non-contact testing method for semiconductor optoelectronic devices based on yield sub-items, the method comprising:

[0065] Continue reading Figure 1The short-circuit device is placed on the conveyor belt 6 and runs from the loading area 8 to the test area 7. The short-circuit device includes a metal plate 3 and a test piece 2 placed on the metal plate 3. An insulating layer is set around the edges of the metal plate 3 to prevent adjacent short-circuit devices from affecting each other when in contact. Multiple test items 1 are located in the test area 7. Each test item 1 has multiple items. Each test item 1 is sorted from small to large according to the yield. A baffle 12 that can block the test piece 2 from moving forward is set at the location of the last test item 1 of each test item 1. Figure 1 It is just to mark the position of the baffle 12, not the actual structure of the baffle. In actual application, the baffle 12 only needs to block the test piece 2 and not contact the surface of the conveyor belt 6, so as to avoid the baffle 12 contacting the surface of the conveyor belt 6 and hindering the movement of the conveyor belt 6. The baffle 12 can be set as a rectangular plate, which is fixed on other equipment on the production line. The rectangular plate does not move with the conveyor belt 6 and the bottom does not contact the conveyor belt 6. The gap between the bottom of the rectangular plate and the conveyor belt 6 is smaller than the height of the short-circuit device to prevent the short-circuit device from passing through the gap. Secondly, the height of the rectangular plate is higher than the short-circuit device to ensure a sufficiently large contact surface. During the entire test process, the conveyor belt 6 continues to run. After the baffle 12 corresponding to the first test item 1 blocks the short-circuit device, multiple short-circuit devices are in serial contact. Since an insulating layer is set, they will not affect each other. By setting the width of the short-circuit device and the distance between adjacent test items 1, when adjacent short-circuit devices are in contact, the test piece 2 on each short-circuit device is facing a test item 1 and an induction coil 4. During the continuous transmission process of the conveyor belt 6, when a short-circuit device reaches the position of the last test item 1 of the current test item 1, it is blocked by the baffle 12. When the baffle 12 blocks it, the conveyor belt 6 is still running, so the subsequent pieces to be tested 2, that is, the short-circuit device, cannot be transmitted backwards. As a result, the baffle 12 blocks this batch of pieces to be tested 2, so that each test item 1 of the current type performs optical testing on the pieces to be tested 2. After the test is completed, the robot arm 11 transfers all the pieces to be tested 2 that have completed the current test to the waiting area 10 corresponding to the test item 1 of the current type. The parts to be tested 2 are binned. After the binning is completed, the robot arm 11 transfers the parts to the next test item 1 for further testing and binning. The testing principle of the next test item 1 is the same as that of the first test item 1. The baffle 12 blocks the parts to be tested 2 at the location of the next test item 1. After the next test item 1 is tested, it is transferred to other types of test items 1 for testing through the robot arm 11. The parts to be tested are tested and binned one level at a time. After passing the tests of all types of test items 1, the parts to be tested 2 are transferred to the unloading area 9.

[0066] In order to avoid wear of the short-circuit device, a pulley can be provided below the short-circuit device. Assume that the distance from the loading area 8 to the test area is S, the running speed of the conveyor belt 6 is V, and the acceleration of gravity is g. The friction coefficient of the pulley relative to the conveyor belt 6 can be greater than or equal to V 2 / (2gs).

[0067] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A non-contact testing device for semiconductor optoelectronic devices based on yield sub-items, characterized in that: It includes multiple test items located in the test area, each test item has multiple items, and each test item is sorted from small to large according to the yield rate. Each test item is facing a short-circuit device, and the short-circuit device includes a metal plate and a piece to be tested placed on the metal plate. The light-emitting surface of the piece to be tested faces the light-receiving direction of the test item. Each short-circuit device is also facing an induction coil. The induction coils and pulse power supplies corresponding to all short-circuit devices are connected in series; the short-circuit device is placed on a conveyor belt and runs from the loading area to the test area. The short-circuit device includes a metal plate and a piece to be tested placed on the metal plate. Multiple test items are located in the test area There are multiple test items for each test item. Each test item is sorted from small to large according to the yield. When there is a piece to be tested corresponding to the position of the test item with the lowest yield, the conveyor belt stops running and the piece to be tested is optically tested. After the test is completed, the piece to be tested is transferred to the waiting area corresponding to the test item by the robotic arm for binning. After the binning is completed, the piece to be tested is transferred to the next test item by the robotic arm for further testing and binning. The test is carried out level by level and binned. After the piece to be tested passes all kinds of test items, it is transferred to the unloading area. The method for setting the number of each test item is as follows: Sort each test item by yield from low to high. Mark the test time, assuming is the yield of the i-th test item, is the number of the i-th test item, and the last test item is The number of test items is set to 1, and the number of other test items is obtained according to the test time and yield in the following way: like ,but , and when hour, ; like ,but , and when hour, .

2. The semiconductor optoelectronic device non-contact testing device based on yield itemization according to claim 1 is characterized in that: It also includes a conveyor belt, wherein the test area is located in the middle area of ​​the conveyor belt in the running direction, a loading area is arranged at the front end of the conveyor belt in the running direction, and a unloading area is arranged at the end of the conveyor belt in the running direction.

3. The semiconductor optoelectronic device non-contact testing device based on yield itemization according to claim 2 is characterized in that: A waiting area is set corresponding to the location of each test item, and the waiting area is used to bin the test pieces and remove unqualified test pieces.

4. A non-contact testing method for semiconductor optoelectronic devices based on yield sub-items, characterized in that: The method comprises: The short-circuit device is placed on the conveyor belt and runs from the loading area to the testing area. The short-circuit device includes a metal plate and a piece to be tested placed on the metal plate. A variety of test items are located in the testing area, and each test item has multiple items. Each test item is sorted from small to large according to the yield. When there is a piece to be tested corresponding to the position of the test item with the smallest yield, the conveyor belt stops running and the piece to be tested is optically tested. After the test is completed, the piece to be tested is transferred to the waiting area corresponding to the test item by a robotic arm for binning. After the binning is completed, the piece to be tested is transferred to the next test item by a robotic arm for continued testing and binning. The test is carried out level by level and binned. After the piece to be tested passes all types of test items, it is transferred to the unloading area; each test item is sorted from low to high according to the yield. After sorting, each test item is sorted by Mark the test time, assuming is the yield of the i-th test item, is the number of the i-th test item, and the last test item is The number of test items is set to 1, and the number of other test items is obtained according to the test time and yield in the following way: like ,but , and when hour, ; like ,but , and when hour, .

5. The non-contact testing method for semiconductor optoelectronic devices based on yield itemization according to claim 4, characterized in that: The method further comprises: During the testing process, after all types of test items of the current batch of parts to be tested are tested, the conveyor belt continues to run, and the next batch of parts to be tested runs from the loading area to the testing area. When there is a part to be tested corresponding to the position of the test item with the lowest yield or when the number of parts to be tested to be binned in the waiting area corresponding to the test item with the lowest yield exceeds the preset upper limit, the conveyor belt stops running.

6. The non-contact testing method for semiconductor optoelectronic devices based on yield itemization according to claim 4, characterized in that: The yield rate is determined as follows: First, randomly sample a part of the parts to be tested; Without considering the number of test items, the test is performed to obtain the test data of the sampled parts to be tested; Perform data cleaning, delete the data corresponding to the test items with too large data deviation among the same type of test items, and check whether there are any problems with the test items. If there are any problems, remove the test items; The yield rate of each test item is obtained based on the number of tested pieces that pass the test in each test item / the total number of tested pieces.

7. The non-contact testing method for semiconductor optoelectronic devices based on yield itemization according to claim 4, characterized in that: The process of optical testing of each test item on the DUT is as follows: The device under test placed on the metal plate forms a short circuit, and the pulse power supply excites the short circuit at the corresponding position of the induction coil to generate an induced current, so that the device under test is powered on and illuminated. The light emitted by the device under test is detected by the test item at its corresponding position, thereby performing an optical test on the device under test.

8. A non-contact testing method for semiconductor optoelectronic devices based on yield sub-items, characterized in that: The method comprises: The short-circuit device is placed on the conveyor belt and runs from the loading area to the testing area. The short-circuit device includes a metal plate and a DUT placed on the metal plate. An insulating layer is set on the edges of the metal plate. Multiple test items are located in the testing area. There are multiple test items of each kind. Each test item is sorted from small to large according to the yield. A baffle that can block the DUT from moving forward is set at the position of the last test item of each test item. The conveyor belt continues to run. After the baffle corresponding to the first test item blocks the short-circuit device, multiple short-circuit devices are contacted in series, and the DUT on each short-circuit device is facing a test item and an induction coil. Each test item of the current type performs optical testing on the DUT. After the test is completed, the DUT that has completed the current test is transferred to the waiting area corresponding to the test item by a robotic arm for binning. After the binning is completed, the DUT is transferred to the next test item by a robotic arm for continued testing and binning. The test is conducted level by level and binned. After the DUT passes all types of test items, it is transferred to the unloading area; each test item is sorted from low to high according to the yield. After sorting, each test item is sorted by Mark the test time, assuming is the yield of the i-th test item, is the number of the i-th test item, and the last test item is The number of test items is set to 1, and the number of other test items is obtained according to the test time and yield in the following way: like ,but , and when hour, ; like ,but , and when hour, .

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