A high-temperature conductive silver paste for a microcrystalline glass thick-film heating plate, its preparation method and sintering process
By using composite glass powder with a low coefficient of thermal expansion and a rapid sintering process, a high-temperature conductive silver paste suitable for microcrystalline glass thick film heating plates was prepared. This solved the problem of thermal expansion mismatch in the high-temperature preparation and multiple sintering processes of microcrystalline glass thick film heating plates, and achieved high-performance conductivity and resistance to current surges.
Patent Information
- Application Number
- CN202210808740.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-07-11
- Publication Date
- 2026-05-26
- Estimated Expiration
- 2042-07-11
AI Technical Summary
Microcrystalline glass thick film heating plates are prone to appearance defects such as cracking, blistering, and peeling under high-temperature preparation conditions. In addition, they may experience problems such as open circuits, breakage at the overlap between the conductive and resistive layers, and decreased solderability and adhesion during multiple sintering cycles, making them difficult to match with microcrystalline glass substrates.
By using composite glass powder with a low coefficient of thermal expansion and a rapid sintering process, combined with a specific ratio of silver powder and organic carrier, a high-temperature conductive silver paste for a microcrystalline glass thick film heating plate is prepared. A dense conductive layer is formed through solid-phase diffusion reaction, which matches the thermal expansion characteristics of the microcrystalline glass substrate.
It achieves good thermal expansion matching between conductive silver paste and microcrystalline glass substrate, improves high temperature creep resistance and current surge resistance, ensures that the conductive paste does not fail during multiple sintering cycles, has strong adhesion, excellent conductivity, and the maximum operating temperature can reach over 450℃.