A process for the preparation of a combination solder holder capacitor

Abstract

The application discloses a preparation process of a combined solder support capacitor, and the combined solder support capacitor comprises two supports arranged in a central symmetry and a capacitor body arranged between the two supports, wherein the capacitor body comprises a plurality of capacitor chips stacked in an up-down mode and buffer gaskets arranged between adjacent two capacitor chips; the preparation process comprises the following steps: step one, a plurality of capacitor chips and buffer gaskets are sequentially stacked according to the capacitor body structure by using a stacking jig, and adhesive is coated between the capacitor chips and the buffer gaskets; step two, the stacking jig with the plurality of stacked capacitor chips is sent into an oven for curing to obtain the capacitor body; step three, the capacitor body is fixed between the two supports through glue, and then a reflow soldering process is performed to obtain the combined solder support capacitor; the stacking jig and the matching stacking method are designed according to the technical characteristics of the support capacitor, so that the requirements of reliability, stability and batch production of the support capacitor can be met.

Description

Technical Field

[0001] The invention belongs to the field of capacitor preparation, and in particular relates to a preparation process of a combined solder bracket capacitor. Background Art

[0002] With the rapid and continuous development of science and technology, the demand for small-size, large-capacity, and high-power capacitors in fields such as power supplies, industry, automobiles, military industry, and aerospace is increasing, while traditional chip ceramic capacitors are difficult to meet the large-capacity demand.

[0003] In the prior art, to increase the capacitance and energy storage capacity of capacitors, multiple capacitor chips are typically connected in parallel as an energy storage unit. During fabrication, the multiple capacitor chips are stacked between two opposing frames, and buffer spacers are required between adjacent capacitor chips. However, due to the elasticity of the buffer spacers, the capacitor chips are prone to deformation and excessive gaps during stacking. This results in uneven chip size after stacking, which in turn affects the soldering quality of the product, and requires further improvement. Summary of the Invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a preparation process for a combined solder bracket capacitor.

[0005] The present invention adopts the following technical solutions:

[0006] A process for preparing a combined solder bracket capacitor, the combined solder bracket capacitor comprising two brackets arranged in a centrally symmetrical manner and a capacitor body arranged between the two brackets, the capacitor body comprising a plurality of capacitor chips stacked one above the other and a buffer spacer arranged between two adjacent capacitor chips;

[0007] The preparation process comprises the following steps:

[0008] Step 1: Use a stacking jig to stack multiple capacitor chips and buffer gaskets in sequence according to the capacitor body structure, and apply adhesive between the capacitor chips and the buffer gaskets;

[0009] Step 2: Place the stacking jig with the plurality of capacitor chips stacked thereon into an oven for curing to obtain the capacitor body;

[0010] Step 3, fixing the capacitor body between the two brackets with glue, and then performing a reflow process to obtain the combined solder bracket capacitor;

[0011] The stacking jig comprises a base, a mounting seat, a plurality of stacking seats and a position adjusting mechanism, the mounting seat is arranged on the base, a plurality of mounting grooves for mounting the plurality of stacking seats are formed on the mounting seat; the plurality of stacking seats are arranged in the plurality of mounting grooves in sequence and used for stacking a plurality of capacitor chips, a stacking groove for stacking the capacitor chips is formed on the stacking seat; the position adjusting mechanism is arranged on the base and used for adjusting the positions of the plurality of stacking seats in the mounting grooves, and the position adjusting mechanism comprises a moving seat capable of moving back and forth relative to the mounting seat, a plurality of elastic positioning columns arranged on the moving seat and corresponding to the plurality of stacking seats in sequence and a adjusting member arranged on the base and connected to and driving the moving seat to move.

[0012] When the capacitor chips are stacked, the stacking seat is arranged in the mounting groove, then a plurality of capacitor chips and buffer gaskets are sequentially arranged in the stacking groove according to the structure of the capacitor body, then the moving seat is driven by the adjusting member to move close to the mounting seat so that the front ends of the elastic positioning columns abut against the stacking seat, the plurality of stacked capacitor chips and buffer gaskets are fixed between the stacking groove and the mounting groove, and the stacking of the plurality of capacitor chips is completed.

[0013] Further, the bracket comprises a bracket body connected to the end of the capacitor body in the vertical direction and a connecting plate arranged on the bracket body and extending in the direction close to the other bracket, the capacitor body and the bracket body are connected by conductive glue, and the capacitor body and the connecting plate are bonded by red glue.

[0014] Further, in step three, the reflow soldering process curve of the conductive glue is used to weld the capacitor body and the two brackets to form the combined solder bracket capacitor.

[0015] Further, the forming process of the bracket is as follows: the bracket material is etched to form a plurality of frames arranged at intervals; then one side of the frame is cut according to the width size of the capacitor chip; then the frame is processed according to the shape of the bracket so that the shape of the frame is preliminarily consistent with the shape of the bracket; finally, the bottom of the frame is cut according to the thickness of the capacitor chip to form the bracket.

[0016] Further, the adjusting member comprises a positioning seat arranged on the base and located at the rear end of the moving seat and an adjusting bolt arranged on the positioning seat and capable of moving back and forth, the front end of the adjusting bolt abuts against the moving seat.

[0017] Further, the position adjusting mechanism further comprises a fixing member for fixing the moving seat on the base, the fixing member comprises a strip-shaped fixing hole arranged on the moving seat and extending in the moving direction of the moving seat, a limiting hole arranged on the base and capable of being opposite to the strip-shaped fixing hole, a fixing bolt inserted into the limiting hole through the strip-shaped fixing hole and a fixing nut matched with the fixing bolt.

[0018] Further, the stacking seat comprises a stacking seat body, a top block arranged on the stacking seat body and abutting against the elastic positioning column, and two auxiliary blocks arranged on the stacking seat body and located on both sides of the stacking groove.

[0019] Further, the connecting plate comprises a connecting section connected with the side edge of the capacitor body and a supporting section arranged on the bottom of the connecting section and bent inward to support the capacitor body.

[0020] Further, the width of the connecting section is 1 / 5-1 / 2 of the length of the capacitor body.

[0021] Further, the lower end of the bracket body forms a stress hole, and the stress hole is located below the connecting plate.

[0022] From the above description of the present application, compared with the prior art, the beneficial effects of the present application are:

[0023] The present application specifically defines the structure of the bracket capacitor, and the conductive glue and the red glue are arranged between the bracket and the capacitor body, respectively. The conductive glue plays a conductive role to ensure that the electrical performance of the bracket capacitor meets the requirements, and the red glue ensures the structural strength of the bracket capacitor, realizes high-temperature service, and improves the mechanical strength of the bracket capacitor under various working conditions. And according to the technical characteristics of the bracket capacitor, a corresponding mass production frame structure and production method are designed; at the same time, in order to improve the stacking efficiency and quality of the capacitor body, a stacking jig and a matching stacking method are designed; to meet the requirements of reliability, stability, batch production of the bracket capacitor. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the combined solder bracket capacitor;

[0025] Figure 2 It is a structural schematic diagram of the bracket;

[0026] Figure 3 It is a forming flowchart of the bracket;

[0027] Figure 4 It is a structural schematic diagram of the jig Figure 1 ;

[0028] Figure 5 It is a structural schematic diagram of the jig Figure 2 ;

[0029] Figure 6 It is a structural schematic diagram of the stacking seat;

[0030] In the figure, 1 - support, 2 - capacitor body, 3 - base, 4 - mounting seat, 5 - stacking seat, 6 - positioning adjusting mechanism, 7 - conductive glue, 8 - red glue, 9 - support material, 11 - support body, 111 - pin end, 112 - stress hole, 12 - connecting plate, 121 - connecting section, 122 - supporting section, 21 - capacitor chip, 22 - buffer gasket, 41 - mounting groove, 42 - locking bolt, 51 - stacking groove, 52 - stacking seat body, 53 - top block, 54 - auxiliary block, 61 - moving seat, 611 - mounting hole, 62 - elastic positioning column, 621 - connecting section, 622 - positioning section, 63 - adjusting piece, 631 - positioning seat, 632 - adjusting bolt, 633 - positioning bolt, 64 - fixing piece, 641 - strip-shaped fixing hole, 642 - limiting hole, 643 - fixing bolt, 644 - fixing nut, 91 - frame. DETAILED DESCRIPTION

[0031] The application will be further described below through specific embodiments.

[0032] REFERENCE Figures 1 to 6 As shown in the figure, a combined solder support capacitor comprises two supports 1 arranged in a central symmetry and a capacitor body 2 arranged between the two supports 1.

[0033] The support 1 comprises a support body 11 extending in a vertical direction and connected with an end of the capacitor body 2, and a connecting plate 12 arranged on the support body 11 and extending in a direction close to the other support body 11. The capacitor body 2 is connected with the support body 11 through the conductive glue 7, and the capacitor body 2 is connected with the connecting plate 12 through the red glue 8. The two kinds of glue are connected with the capacitor body 2 through the structure of the support 1, so that when the electrical performance of the support capacitor meets the requirements, the structural strength of the support capacitor can be ensured, high-temperature service can be realized, and the mechanical strength of the capacitor can be improved under various working conditions. Specifically, the red glue 8 is used to ensure the structural strength of the support capacitor, realize high-temperature service, and improve the mechanical strength of the capacitor under various working conditions. The main material is epoxy resin, which is viscous and has poor fluidity. It can be cured at 150℃ and can ensure the structural strength when used at 300℃ for a long time. The conductive glue 7 plays a conductive role to ensure that the electrical performance of the support capacitor meets the requirements. The main material is 6337 solder, and the melting point is 183℃. The red glue will not affect the electrical performance of the capacitor and the welding of the conductive glue because it is cured in advance and the welding position is on the side of the product.

[0034] The support body 11 comprises a pin end 111 formed on the lower end and extending inwardly, and a stress hole 112 formed on the lower end to release impact stress and avoid stress concentration. Specifically, the stress hole 112 is located below the connecting plate 12.

[0035] The connecting plate 12 comprises a connecting section 121 connected with the side of the capacitor body 2 and a supporting section 122 arranged at the bottom of the connecting section 121 and bent inwardly for supporting the capacitor body 2. Specifically, the width of the connecting section 121 is 1 / 5-1 / 2 of the length of the capacitor body 2.

[0036] The capacitor body 2 comprises a plurality of capacitor chips 21 stacked in sequence and a buffer gasket 22 arranged between two adjacent capacitor chips 21. The buffer gasket 22 is arranged to avoid the mutual extrusion of the capacitor chips 21. Specifically, the size of the capacitor chip 21 is 5mm*5mm*2.5mm, and the width of the connecting section 121 is 1-2.5mm, and the length thereof needs to cover at least the end of a single capacitor chip 21.

[0037] The preparation process of the combined solder support capacitor comprises the following steps:

[0038] Step one, using a stacking jig to stack a plurality of capacitor chips 21 and buffer gaskets 22 according to the structure of the capacitor body 2 in sequence, and applying adhesive between the capacitor chips 21 and the buffer gaskets 22;

[0039] Step two, sending the stacking jig stacked with a plurality of capacitor chips 21 into an oven for curing to obtain the capacitor body 2;

[0040] Step three, fixing the capacitor body 2 between the two supports 1 through the conductive glue 7 and the red glue 8, and then welding the capacitor body 2 and the two supports by using the reflow soldering process curve of the conductive glue 7 to obtain the combined solder support capacitor.

[0041] The forming process of the support 1 is as follows: etching the support material 9 to form a plurality of frames 91 arranged at intervals; then cutting off one side of the frame 91 according to the width size of the capacitor chip 21; then processing the frame 91 according to the shape of the support 1 to make the shape of the frame 91 preliminarily consistent with the shape of the support 1; and finally cutting off the excess frame part at the bottom as a whole according to the thickness of the capacitor chip 21 to form the support 1.

[0042] The stacking jig comprises a base 3, a mounting seat 4, a plurality of stacking seats 5 and a positioning adjusting mechanism 6. Specifically, the mounting seat 4 is arranged on the base 3, and a plurality of mounting grooves 41 for mounting the plurality of stacking seats 5 are formed on the mounting seat 4, and the mounting grooves 41 extend inwardly from the side of the mounting seat 4. Further, the mounting seat 4 is fixed on the base 3 by locking bolts 42.

[0043] A plurality of stacking seats 5 are arranged in the plurality of mounting grooves 41 in sequence for stacking the plurality of capacitor chips 21. The stacking seat 5 is formed with a stacking groove 51 for stacking the capacitor chips 21. When the capacitor chips 21 are stacked, one or more groups of capacitor bodies 2 can be stacked in the stacking groove 51 according to the size of the stacking groove 51. Specifically, the stacking seat 5 includes a stacking seat body 52, a top block 53 arranged on the stacking seat body 52 and abutting against the positioning and adjusting mechanism 6, and two auxiliary blocks 54 arranged on the stacking seat body 52 and located on both sides of the stacking groove 51. The stacking groove 51 extends inward from the opposite surface of the stacking seat 5 and the mounting groove 41. By arranging the auxiliary blocks 54 on both sides of the stacking groove 51, the auxiliary blocks 54 can assist in stacking the capacitor chips 21 when the capacitor chips 21 are stacked, and can keep the entire capacitor body 2 balanced when the capacitor body 2 is subjected to compressive stress. Further, the stacking seat 5 is made of polytetrafluoroethylene material to avoid overflow bonding on the stacking seat 5 during solidification of the capacitor body 2.

[0044] The positioning and adjusting mechanism 6 is arranged on the base 3 to adjust the position of the plurality of stacking seats 5 in the mounting groove 41. The positioning and adjusting mechanism 6 includes a moving seat 61 that can move back and forth relative to the mounting seat 4, an elastic positioning column 62 arranged on the front end of the moving seat 61 and abutting against the plurality of stacking seats 5 one by one, an adjusting member 63 arranged on the base 3 and connected to drive the moving seat 61 to move, and a fixing member 64 for fixing the moving seat 61 to the base 3.

[0045] The elastic positioning column 62 includes a connecting section 621 connected to the moving seat 61 and a positioning section 622 arranged on the front end of the moving seat 61 and abutting against the stacking seat 5. Specifically, the moving seat 61 is provided with a mounting hole 611 extending inward from the side surface thereof for mounting the positioning section 622.

[0046] The adjusting member 63 includes a positioning seat 631 arranged on the base 3 and located at the rear end of the moving seat 61, and an adjusting bolt 632 arranged on the positioning seat 631 and movable forward and backward to adjust the position of the moving seat 61. Specifically, the front end of the adjusting bolt 632 abuts against the side surface of the moving seat 61. The adjusting bolt drives the moving seat to move to adjust the position of the stacking seat 5 in the mounting groove 41. Further, the positioning seat 631 is fixed to the base 3 by a positioning bolt 633.

[0047] The fixing member 64 comprises a strip-shaped fixing hole 641 arranged on the moving seat 61 along the moving direction of the moving seat 61, a limiting hole 642 arranged on the base 3 and opposite to the strip-shaped fixing hole 641, a fixing bolt 643 inserted into the limiting hole 642 through the strip-shaped fixing hole 641, and a fixing nut 644 matched with the fixing bolt 643. The strip-shaped fixing hole 641, the limiting hole 642, the fixing bolt 643 and the fixing nut 644 are matched to fix the adjusted moving seat 61 on the base 3, fix the position of the stacking seat 5, and make the elastic positioning column 62 tightly fix the plurality of stacked capacitor chips 21 and have appropriate tight stress, so as to ensure that the size of the stacked capacitor body 2 is uniform and the welding quality of the product is not affected.

[0048] When the capacitor chips 21 are stacked, the stacking seat 5 is arranged in the mounting groove 41, then the plurality of capacitor chips 21 and the buffer gasket 22 are sequentially arranged in the stacking groove 51 according to the structure of the capacitor body 2, and adhesive is coated between the capacitor chips 21 and the buffer gasket 22; then the elastic positioning column 62 is moved to abut against the stacking seat 5 by adjusting the adjusting bolt 632 to drive the moving seat 61 to move close to the mounting seat 4, so as to fix the plurality of stacked capacitor chips 21 and the buffer gasket 22 between the stacking groove 51 and the mounting groove 41; finally, the moving seat 61 is fixed on the base 3 by matching the fixing nut 644 with the fixing bolt 643, and the stacking of the plurality of capacitor chips 21 is completed.

[0049] The application specifically defines the structure of the support capacitor, and the conductive glue 7 and the red glue 8 are arranged between the support 1 and the capacitor body 2, respectively. The conductive glue 7 plays a conductive role to ensure that the electrical performance of the support capacitor meets the requirements, and the red glue 8 ensures the structural strength of the support capacitor, realizes high-temperature service, and improves the mechanical strength of the support capacitor under various working conditions. The corresponding mass production frame structure and production method are designed according to the technical characteristics of the support capacitor. At the same time, in order to improve the stacking efficiency and quality of the capacitor body 2, the stacking jig and the matching stacking method are designed to meet the requirements of reliability, stability and batch production of the support capacitor.

[0050] The above is only a preferred embodiment of the application, and therefore cannot limit the scope of the application. Equivalent changes and modifications made according to the scope and content of the application should still be within the scope of the application.

Claims

1. A process for preparing a combined solder bracket capacitor, characterized in that: The combined solder bracket capacitor includes two brackets arranged in a centrally symmetrical manner and a capacitor body arranged between the two brackets. The capacitor body includes a plurality of capacitor chips stacked up and down and a buffer gasket arranged between two adjacent capacitor chips. The preparation process comprises the following steps: Step 1: Use a stacking jig to stack multiple capacitor chips and buffer gaskets in sequence according to the capacitor body structure, and apply adhesive between the capacitor chips and the buffer gaskets; Step 2: Place the stacking jig with the plurality of capacitor chips stacked thereon into an oven for curing to obtain the capacitor body; Step 3, fixing the capacitor body between the two brackets with glue, and then performing a reflow process to obtain the combined solder bracket capacitor; The stacking jig includes a base, a mounting base, a plurality of stacking seats and a positioning adjustment mechanism. The mounting base is arranged on the base and has a plurality of mounting grooves formed thereon for mounting the plurality of stacking seats. Multiple stacking seats are sequentially arranged in multiple mounting slots for stacking multiple capacitor chips, and the stacking seats are formed with stacking slots for stacking capacitor chips; a positioning adjustment mechanism is arranged on the base to adjust the position of the multiple stacking seats in the mounting slots, including a movable seat that can move back and forth relative to the mounting seat, an elastic positioning column arranged at the front end of the movable seat and corresponding to the multiple stacking seats one by one, and an adjustment member arranged on the base and connected to drive the movable seat to move; When stacking capacitor chips, the stacking seat is placed in the relative mounting grooves, and then multiple capacitor chips and buffer gaskets are placed in the stacking grooves in sequence according to the capacitor body structure. Then, the adjusting member drives the movable seat to move closer to the mounting seat so that the front end of the elastic positioning column abuts against the stacking seat, and the stacked multiple capacitor chips and buffer gaskets are fixed between the stacking groove and the mounting groove, completing the stacking of multiple capacitor chips. The bracket includes a bracket body extending in a vertical direction and connected to the end of the capacitor body and a connecting plate arranged on the bracket body and extending in a direction close to another bracket. The capacitor body and the bracket body are connected by conductive glue, and the capacitor body and the connecting plate are bonded by red glue.

2. The process for preparing a combined solder bracket capacitor according to claim 1, characterized in that: In step three, the capacitor body and the two brackets are welded using a reflow soldering process curve of a conductive adhesive to form the combined solder bracket capacitor.

3. The process for preparing a combined solder bracket capacitor according to claim 1, characterized in that: The forming process of the bracket is as follows: the bracket material is etched to form multiple frames arranged at intervals; then one side of the frame is cut off as a whole according to the width of the capacitor chip; then the frame is processed according to the shape of the bracket so that the shape of the frame is initially consistent with the shape of the bracket; finally, the excess frame part at the bottom is cut off as a whole according to the thickness of the capacitor chip to form the bracket.

4. The process for preparing a combined solder bracket capacitor according to claim 1, characterized in that: The adjusting member comprises a positioning seat arranged on the base at the rear end of the moving seat and an adjusting bolt arranged on the positioning seat which can move forward and backward, and the front end of the adjusting bolt abuts against the moving seat.

5. The process for preparing a combined solder bracket capacitor according to claim 1, characterized in that: The positioning and adjustment mechanism also includes a fixing part for fixing the movable seat on the base, and the fixing part includes a strip-shaped fixing hole provided on the movable seat and extending along its moving direction, a limiting hole provided on the base and opposite to the strip-shaped fixing hole, a fixing bolt passing through the strip-shaped fixing hole and embedded in the limiting hole, and a fixing nut cooperating with the fixing bolt.

6. The process for preparing a combined solder bracket capacitor according to claim 1, characterized in that: The stacking seat includes a stacking seat body, a top block arranged on the stacking seat body and abutting against the elastic positioning column, and two auxiliary blocks arranged on the stacking seat body and located on both sides of the stacking slot, and the stacking slot is arranged on the stacking seat body.

7. The process for preparing a combined solder bracket capacitor according to claim 1, characterized in that: The connecting plate includes a connecting section connected to the side of the capacitor body and a supporting section arranged at the bottom of the connecting section and bent inwardly for supporting the capacitor body.

8. The process for preparing a combined solder bracket capacitor according to claim 7, characterized in that: The width of the connecting section is 1 / 5-1 / 2 of the length of the capacitor body.

9. The process for preparing a combined solder bracket capacitor according to claim 1, characterized in that: A stress hole is formed at the lower end of the bracket body, and the stress hole is located below the connecting plate.

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