Display module and electronic device

Abstract

The application discloses a display module and electronic equipment, the display module has first plane area, bending area and second plane area which are connected in sequence, comprising: a flexible display panel; a support layer arranged on the side opposite to the light emitting direction of the flexible display panel, used for supporting the flexible display panel; a heat dissipation layer comprising a first heat dissipation layer and a second heat dissipation layer respectively located in the first plane area and the second plane area, the heat dissipation layer is arranged on the side of the support layer away from the flexible display panel; a metal connecting layer arranged on the side of the support layer away from the flexible display panel, and the two ends of the metal connecting layer are connected with the first heat dissipation layer and the second heat dissipation layer respectively; a flexible support layer arranged on the side of the heat dissipation layer and the metal connecting layer away from the support layer. The display module conducts heat between the first heat dissipation layer and the second heat dissipation layer through the metal connecting layer, so as to make the temperature of the display module uniform.

Description

Technical Field

[0001] This invention relates to the field of display technology. More specifically, it relates to a display module and an electronic device having the display module. Background Technology

[0002] With the development of display technology, the application fields of display devices are very wide, and people's requirements for the performance of display screens are also gradually increasing. Flexible displays have the characteristics of being bendable and rollable. By utilizing these characteristics, display devices can be folded, thus bringing convenience to people in carrying and using display devices. For example, foldable organic light-emitting display devices have already been used in foldable mobile phones.

[0003] In foldable phones, the hinge separates the mid-frame, resulting in poor heat dissipation. The heat source is mainly concentrated in one half of the screen. During use, the heat is transferred to the screen in the half where the heat source is located, causing the screen temperature in that half to become too high, which seriously affects the user experience. Summary of the Invention

[0004] The purpose of this invention is to provide a display module and an electronic device, wherein the heat of the display module is evenly distributed in the two halves of a foldable screen.

[0005] According to one aspect of the present invention, a display module is provided having a first planar area, a bent area, and a second planar area connected in sequence, comprising:

[0006] Flexible display panel;

[0007] A support layer is disposed on the side opposite to the light emission direction of the flexible display panel, and is used to support the flexible display panel.

[0008] The heat dissipation layer includes a first heat dissipation layer and a second heat dissipation layer located in the first planar region and the second planar region respectively, and the heat dissipation layer is disposed on the side of the bracket layer away from the flexible display panel;

[0009] A metal connection layer is disposed on the side of the support layer away from the flexible display panel, and the two ends of the metal connection layer are respectively connected to the first heat dissipation layer and the second heat dissipation layer;

[0010] A flexible support layer is disposed on the side of the heat dissipation layer and the metal connection layer away from the support layer.

[0011] Optionally, the first heat dissipation layer and the second heat dissipation layer are provided with a stepped structure at their respective ends that are close to each other, and the two ends of the metal connecting layer are attached to the surface of the stepped structure.

[0012] Optionally, the distance c between the edge of the first heat dissipation layer and the edge of the second heat dissipation layer near the center of the bending area and the center of the bending area is in the range of 0.2L to 0.25L, where L is the length from the edge of the first planar area away from the bending area to the center line of the bending area.

[0013] Optionally, the length value 'a' of the step structure ranges from 0.2C to 0.25C.

[0014] Optionally, the first and second heat dissipation layers are made of a single layer of graphite, and the metal connecting layer is made of a stainless steel sheet.

[0015] Optionally, one side surface of the stepped structure is flush with the surface of the heat dissipation layer, the end of the metal connecting layer is bonded to the top surface of the stepped structure, and the top surface of the metal connecting layer is flush with the other side surface of the heat dissipation layer.

[0016] Optionally, a plurality of first holes are provided on the metal connection layer near the center line of the bending area.

[0017] Optionally, the plurality of first holes are arranged in multiple columns along the center line of the bending area, with the centers of the first holes in adjacent columns staggered. The number of first holes ranges from 16 to 24, the diameter of the first holes ranges from 250 to 400 μm, and the spacing between the holes ranges from 3 to 5 mm.

[0018] Optionally, the first hole is circular, hexagonal, or rhomboid in shape.

[0019] Optionally, the first hole is elongated, and the elongated first holes are staggered.

[0020] Optionally, a plurality of first holes and second holes are respectively provided on the metal connection layer and the support layer near the center line of the bending area, and the first holes and second holes are arranged alternately.

[0021] Optionally, the support layer located in the bending area is provided with a plurality of grooves extending along the center line of the bending area, and the grooves are located on the side of the second hole away from the center line of the bending area.

[0022] Optionally, the two ends of the metal connecting layer overlap the surface of the stepped structure, and the middle surface of the metal connecting layer is bonded to the support layer through a foam layer.

[0023] Optionally, the heat dissipation layer near the edge of the stepped structure is configured as a slope or an arc surface.

[0024] According to another aspect of the present invention, an electronic device is provided, comprising the display module described above.

[0025] The beneficial effects of this invention are as follows:

[0026] When the heat generated by the electronic device of the present invention is conducted to the first heat dissipation layer, it is uniformly heated. The heat is conducted in the planar direction, and then conducted to the second heat dissipation layer through the metal connection layer. The second heat dissipation layer is uniformly heated again, so that the heat passes through the metal connection layer across the hinge separation, and the heat is evenly distributed on the display panel. Attached Figure Description

[0027] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0028] Figure 1 A schematic diagram of the structure of the electronic device of the present invention is shown.

[0029] Figure 2 A cross-sectional view of the electronic device of the present invention is shown.

[0030] Figure 3 This is a cross-sectional view of a display module in its unfolded state according to the present invention.

[0031] Figure 4 This is a cross-sectional view showing the folded state of the module according to the present invention.

[0032] Figure 5 A partial structural schematic diagram of the display module of the present invention is shown.

[0033] Figure 6 A schematic diagram of the structure of a metal connection layer according to the present invention is shown.

[0034] Figure 7 A schematic diagram of another metal bonding layer of the present invention is shown.

[0035] Figure 8 This is a cross-sectional view showing another display module in its unfolded state according to the present invention.

[0036] Figure 9 A partial structural schematic diagram of the display module of the present invention is shown. Detailed Implementation

[0037] To more clearly illustrate the present invention, the following description, in conjunction with preferred embodiments and accompanying drawings, further explains the invention. Similar components in the drawings are indicated by the same reference numerals. Those skilled in the art should understand that the specific description below is illustrative rather than restrictive and should not be construed as limiting the scope of protection of the present invention.

[0038] Leveraging the bendable and foldable advantages of flexible displays, foldable display devices have become an innovative application area for flexible displays. This allows users to freely adjust the display area of ​​the flexible display according to their needs, making it not only convenient for portability but also providing a better user experience. This represents an important direction for the development of flexible displays. However, in foldable phones, the hinge breaks the mid-frame, dividing the entire device into two halves. This results in poor heat dissipation, with the heat source concentrated in one half. For example, the CPU and SOC are concentrated in one half, causing the temperature in that half to be too high. Consequently, the display temperature in that half is higher than the temperature in the other half. Measurements show that the temperature difference between the two halves can reach 5°C. This uneven screen temperature severely impacts the user experience.

[0039] This application provides an electronic device, which can be a computer, mobile phone, all-in-one machine, smart wearable device, or other device composed of electronic components such as integrated circuits, transistors, and vacuum tubes, and which uses electronic technology (software) to function. This invention primarily targets electronic devices with touch and display functions, which, exemplarily, can be: laptops, tablets, mobile phones, smartwatches, wristbands, personal digital assistants (PDAs), and digital cameras.

[0040] Figure 1 and Figure 2 Taking a smartphone as an example, the general structure of a common electronic device is illustrated. The electronic device includes a display module 2, which is used in foldable screen phones. The electronic device may also include a heat source 1, a hinge 3, and a mid-frame 4. The hinge 3 divides the mid-frame 4 into left and right parts, allowing the mid-frame 4 to rotate around the hinge 3. The display module 2 is mounted on the mid-frame 4 and can fold as the mid-frame 4 rotates, thus allowing the display module 2 to switch between an unfolded and folded state. When the display module 2 is in the unfolded state, the flexible display panel 21 is exposed on the surface of the electronic device, allowing the user to view the image on the flexible display panel 21. When the electronic device is in the folded state, the housing encloses the flexible display panel 21, with the flexible display panel 21 located inside the housing, meaning it is folded inwards.

[0041] The heat source 1 is a component in the electronic device that generates a large amount of heat. In this embodiment, the heat source 1 is the CPU (Central Processing Unit) on the motherboard. The heat generated by the heat source 1 can be conducted to the middle frame 4, but because the middle frame 4 is separated by the hinge 3, the heat cannot be effectively transferred between the left and right parts of the middle frame 4.

[0042] like Figure 3 and Figure 4As shown, the display module 2 has a first flat area 101, a bending area 103, and a second flat area 102 connected in sequence. The first flat area 101, the bending area 103, and the second flat area 102 can be unfolded into a flat state, and the first flat area 101 and the second flat area 103 can also be rotated and folded around the bending area 102, so that the display module 2 can switch between unfolded and folded states.

[0043] In this embodiment, the display module 2 includes a flexible display panel 21, a support layer 22, a heat dissipation layer 23, a metal connection layer 24, and a flexible support layer 25. The support layer 22 is disposed on the side away from the light emission direction of the flexible display panel 21 and is used to support the flexible display panel 21. The heat dissipation layer 23 includes a first heat dissipation layer 231 located in the first planar region 101 and a second heat dissipation layer 232 located in the second planar region 102. The first heat dissipation layer 231 and the second heat dissipation layer 232 are respectively attached to the surface of the support layer 22 on the side away from the flexible display panel 21. The metal connection layer 24 is located on the side of the support layer 22 away from the flexible display panel 21, and the two ends of the metal connection layer 24 are respectively connected to the first heat dissipation layer 231 and the second heat dissipation layer 232. The metal connection layer 24 spans the first planar region 101, the bending region 103, and the second planar region 102, that is, the two ends of the metal connection layer 24 are located in the first planar region 101 and the second planar region 102, and the middle part of the metal connection layer 24 is located in the bending region 103.

[0044] The heat source 1 of the whole machine is located in the half of the first planar area 101. The heat generated by it is conducted to the first heat dissipation layer 231 of the display module 2 located in the first planar area 101, and then conducted to the second heat dissipation layer 232 through the metal connection layer 24. This allows the first heat dissipation layer 231 and the second heat dissipation layer 232 to absorb heat at the same time, and conduct it to the outside through the display panel 21 to reduce the temperature of the electronic device and prevent the temperature of the display module 2 in the half of the whole machine heat source 1 from being higher than the temperature of the display module 2 in the other half of the whole machine heat source 1.

[0045] The rotating shaft 3 divides the electronic device into two halves. When the electronic device rotates around the rotating shaft 3, the two halves can unfold into a planar state, or they can overlap to form a folded state. The two halves can have the same or different shapes; that is, when the electronic device is folded, the two halves can completely overlap or partially overlap. It is understood that the center line of the bending area 103 is parallel to the rotation axis of the rotating shaft 3. When the electronic device rotates around the rotating shaft 3, the display module 2 rotates around the center line O of the bending area 103. The center line O of the bending area 103 is the folding center line of the display module 2, and the display module 2 can be bent and folded along this center line.

[0046] The first heat dissipation layer 231 and the second heat dissipation layer 232 have the same shape and material, and are made of single-layer graphite material. The metal connecting layer 24 is made of stainless steel sheet. When heat is conducted to the first heat dissipation layer 231, it is uniformly heated through the graphite layer. The heat is conducted in the planar direction, and then conducted through the metal connecting layer 24 of stainless steel sheet, thereby conducting the heat to the second heat dissipation layer 232. The graphite layer of the second heat dissipation layer 232 is uniformly heated again, so that the heat passes through the metal connecting layer 24 across the separation of the rotating shaft 3, thereby making the heat evenly distributed on the display panel 21, so that the display panel far away from the heat source 1 of the whole machine can also dissipate heat to the outside.

[0047] In one example, the shape and material of the first heat dissipation layer 231 and the second heat dissipation layer 232 may also be different. For example, when the two halves of the electronic device have different shapes and sizes, the shape and size of the first heat dissipation layer 231 located in the larger half can be set to be larger, and the shape and size of the second heat dissipation layer 232 located in the smaller half can be set to be smaller. Alternatively, the shape and size of the first heat dissipation layer 231 located in the half where the heat source 1 of the whole device is located can be set to be larger, while the shape and size of the second heat dissipation layer 232 located in the half where the heat source 1 of the whole device is located can be set to be smaller. This application does not impose any special limitation on the shape of the first heat dissipation layer 231 and the second heat dissipation layer 232, and they can be selected according to actual needs.

[0048] It should be noted that although the support layer 22 also spans the first plane region 101, the bending region 103 and the second plane region 102, the support layer 22 located in the bending region 103 has an opening area. This opening area has a large number of through holes to improve the bending performance of the support layer 22, thereby reducing the lateral heat conduction capacity of the support layer 22. That is, the heat generated by the heat source 1 of the whole machine is difficult to transfer in large quantities through the support layer 22 to the part of the half-region away from the heat source 1 of the whole machine.

[0049] To improve the thermal conductivity of the bracket layer 22, the bracket layer 22 can be made of high thermal conductivity aluminum alloy, which has a thermal conductivity of 120–260 W / (m·K). This design improves the thermal conductivity of the bracket layer 22, allowing some of the heat generated by the heat source 1 of the entire device to be conducted from the first planar region 101 to the second planar region 102 through the bracket layer 22, further ensuring a more uniform heat distribution on the display panel 21.

[0050] A flexible support layer 25 is disposed on the surface of the first heat dissipation layer 231, the metal connection layer 24, and the second heat dissipation layer 232 away from the support layer 22. The material of the flexible support layer 25 may include polyimide (CPI), polyethylene terephthalate (PET), polypropylene (PP), polyethylene naphthalate (PEN), thermoplastic polyurethane (TPU), polymethyl methacrylate (PMMA), cyclic olefin polymer (COP), polycarbonate (PC), triacetate cellulose (TAC), or transparent polyaramid. The flexible support layer 25 covers the first heat dissipation layer 231, the metal connection layer 24, and the second heat dissipation layer 232, providing protection and support for these layers.

[0051] In one example, the first heat dissipation layer 231 and the second heat dissipation layer 232 are bonded between the support layer 22 and the flexible support layer 25 via a pressure-sensitive adhesive layer (PSA). The metal connection layer 24 is bonded to the surface of the flexible support layer 25 near the support layer 22 via a PSA layer. The thickness of the PSA layer ranges from 5 to 10 μm, and optionally, the thickness is 5 μm, 7 μm, or 10 μm. Using an ultra-thin PSA layer can reduce longitudinal thermal resistance, improve the thermal conductivity between the flexible support layer 25 and the first heat dissipation layer 231 and the second heat dissipation layer 232, and improve the thermal conductivity between the first heat dissipation layer 231, the second heat dissipation layer 232, and the support layer 22.

[0052] In one example, the flexible display panel 21 is a touch display panel, comprising a stacked display panel and a touch layer. The display panel is primarily used for displaying images on electronic devices, and it can be a self-emissive display or a microLED display. When the display is self-emissive, it can be an Organic Light Emitting Diode (OLED) or a Quantum Dot Light Emitting Diode (QLED).

[0053] The touch layer in the flexible display panel 21 is used to input touch signals from the outside, such as a user's finger tap signal or a user's fingerprint image. The touch layer is stacked with the display panel, and the touch layer can be disposed on one side of the display panel. For example, when the display panel is a self-emissive display, the touch layer can be disposed on the side of the light-emitting surface of the display panel.

[0054] In one example, when the flexible display panel 21 is a self-emissive display panel, the flexible display panel may include a substrate, a driving backplane, an emissive layer, and an encapsulation layer. The substrate provides the foundation for other structures in the display screen; the driving backplane, emissive layer, and encapsulation layer can all be fabricated on the substrate. The substrate material can be glass; for flexible displays, the substrate material is typically a flexible material such as PI (polyimide) or PET (saturated polyester). The driving backplane is configured to drive the emissive layer to emit light. The driving backplane may include multiple pixel circuits (also called pixel driving circuits), and the emissive layer may include multiple light-emitting devices. One pixel circuit in the driving backplane is coupled to one light-emitting device in the emissive layer to control the intensity of the light emitted by that light-emitting device. The encapsulation layer covers the light-emitting device, protecting it. The encapsulation layer may be an encapsulation substrate or an encapsulation film. In some embodiments, the encapsulation layer includes at least one organic encapsulation layer and one inorganic encapsulation layer. The inorganic encapsulation layer mainly serves to block water and oxygen intrusion, while the organic encapsulation layer assists in encapsulation and planarization. The organic encapsulation layer can be made of organic materials such as acrylic polymers or silicone polymers.

[0055] In one example, such as Figure 5 As shown in the figure, a partial structure of the display module 2 is illustrated, including a schematic diagram of the structure of the display module 2 in the half-area where the heat source 1 of the whole machine is located. The length of the half-area display module 2 is L, including a first planar area 101 and half of a bent area 103, that is, the length from the edge of the first planar area 101 away from the bent area 103 to the center line O of the bent area 103. The edge of the first heat dissipation layer 231 is flush with the edge of the first planar area 101 away from the bent area 103. In this embodiment, the length from the edge of the first planar area 101 away from the bent area 103 to the center line O of the bent area 103 is equal to the length from the edge of the second planar area 102 away from the bent area 103 to the center line of the bent area 103. The first heat dissipation layer 231 and the second heat dissipation layer 232 are symmetrically arranged in the first planar area 101 and the second planar area 102 along the center line O of the bent area 103. The center line O of the bending area 103 is the folding center line of the display module 2, and the display module 2 can be bent and folded along the folding center line.

[0056] The first heat dissipation layer 231 and the second heat dissipation layer 232 have stepped structures 233 at their adjacent ends. The two ends of the metal connecting layer 24 are respectively bonded to the surfaces of the stepped structures 233 of the first heat dissipation layer 231 and the second heat dissipation layer 232. By connecting the metal connecting layer 24 to the surface of the stepped structures 233, the metal connecting layer 24 is prevented from protruding from the surface of the heat dissipation layer, which helps to reduce the thickness of the display module 2.

[0057] The distance C between the edge of the stepped structure 233 of the first heat dissipation layer 231 and the second heat dissipation layer 232 near the center of the bending area 103 and the center line O of the bending area ranges from 0.2L to 0.25L, where L is the length from the edge of the first planar area 101 away from the bending area 103 to the center line O of the bending area 103. Optionally, the distance C between the edge of the stepped structure 233 of the first heat dissipation layer 231 and the center line O of the bending area is 0.2L, 0.21L, 0.22L, 0.23L, 0.24L, or 0.25L. It should be noted that the distance C between the edge of the stepped structure 233 of the first heat dissipation layer 231 and the edge of the stepped structure 233 of the second heat dissipation layer 232 can be the same or different, as long as their values ​​are within the above range. The connection between the metal connecting layer 24 and the stepped structure 233 in this structure is located in the first plane area 101 and the second plane area 102, and outside the bending arc area of ​​the support layer 22. This reduces the stress on the connection points between the metal connecting layer 24 and the first heat dissipation layer 231 and the second heat dissipation layer 232 during the folding process of the display module 2, preventing breakage at the connection. Simultaneously, it also prevents the stepped structure 233 from being too far from the bending area 103, which would result in an excessively large distance between the stepped structures 233 of the first heat dissipation layer 231 and the second heat dissipation layer 232, leading to a longer metal connecting layer 24 and thus affecting heat conduction from the first heat dissipation layer 231 to the second heat dissipation layer 232.

[0058] In one example, the length value 'a' of the step structure 233 ranges from 0.2°C to 0.25°C. Optionally, the length value 'a' of the step structure 233 can be 0.2°C, 0.21°C, 0.22°C, 0.23°C, 0.24°C, or 0.25°C. The end of the metal connecting layer 24 extends through the step structure 233, meaning that the end of the metal connecting layer 24 completely covers the top surface of the step structure 233. The end faces on both sides of the metal connecting layer 24 are connected to the end faces of the first heat dissipation layer 231 and the second heat dissipation layer 232, respectively. The width value 'a' at the bonding point between the metal connecting layer 24 and the first heat dissipation layer 231 and the second heat dissipation layer 232 ensures the reliability of the connection between the metal connecting layer 24 and the heat dissipation layer. Furthermore, the fact that the end of the metal connecting layer 24 completely covers the top surface of the step structure 233 increases the contact area between the metal connecting layer 24 and the step structure 233, thereby increasing the thermal conductivity between them.

[0059] One side surface of the stepped structure 233 is flush with the surface of the heat dissipation layer. The end of the metal connecting layer 24 is bonded to the top surface of the stepped structure 233, and the top surface of the metal connecting layer 24 is flush with the other side surface of the heat dissipation layer 23. That is, the thickness of the heat dissipation layer 23 is equal to the sum of the thicknesses of the metal connecting layer 24 and the stepped structure 233. After the metal connecting layer 24 is bonded to the top surface of the stepped structure 233, the upper and lower surfaces of the heat dissipation layer 23 are flush with the top surface of the metal connecting layer 24 and the bottom surface of the stepped structure 233, respectively. The stepped structure 233 is formed by etching from the top surface of the heat dissipation layer 23 downwards, with an etching depth of 20–35 μm. Optionally, the etching depth is 20 μm, 25 μm, 30 μm, or 35 μm, meaning the distance between the top surface of the stepped structure 233 and the top surface of the heat dissipation layer ranges from 20–35 μm. Optionally, the sum of the thicknesses of the stepped structure 233 and the metal connecting layer 24 is equal to the thickness of the heat dissipation layer. The thickness values ​​of the first heat dissipation layer 231 and the second heat dissipation layer 232 range from 35 to 50 μm. Optionally, the thickness values ​​of the first heat dissipation layer 231 and the second heat dissipation layer 232 are 35 μm, 40 μm, 45 μm, or 50 μm. The thickness b of the metal connecting layer 24 ranges from 20 to 30 μm. Optionally, the thickness b of the metal connecting layer 24 is 20 μm, 25 μm, or 30 μm. In actual products, the sum of the thickness values ​​of the metal connecting layer 24 and the stepped structure 233 is slightly less than the thickness value of the heat dissipation layer, and the difference between the two can be filled by the pressure-sensitive adhesive layer. In this structure, the two ends of the metal connecting layer 24 are bonded to the top surface of the stepped structure 233 of the first heat dissipation layer 231 and the second heat dissipation layer 232, and the central part of the metal connecting layer 24 is suspended above the support layer 22. That is to say, the metal connecting layer 24 located in the bending area 103 is not bonded to the support layer 22, and the two are in a discontinuous adhesive structure to avoid the thickening of the monomer stack during the bending process of the support layer 22, which would affect other film layer structures.

[0060] In one example, such as Figure 6As shown, multiple first holes 241 are formed on the metal connecting layer 24 near the center line O of the bending region to reduce the stress of the metal connecting layer 24 located in the bending region 103 and improve the bending performance of the metal connecting layer 24. To prevent the first holes 241 from affecting the thermal conductivity of the metal connecting layer 24, the multiple first holes 241 are arranged in multiple columns along the center line O of the bending region, with the centers of the first holes 241 in adjacent columns staggered. This application does not limit the number of columns of the first holes 241, and can select them according to actual needs. In this embodiment, multiple first holes 241 are arranged in two rows, with a spacing d of 3–5 mm between the two rows. Optionally, the spacing d of the first holes 241 is 3 mm, 4 mm, or 5 mm, and the centers of the two rows of first holes are staggered. The number of first holes 241 ranges from 16 to 24, and optionally, the number of first holes 241 is 16, 18, 20, 22, or 24. The diameter of the first holes ranges from 250 to 400 μm, and optionally, the diameter of the first holes 241 is 250 μm, 300 μm, 350 μm, or 400 μm. Because the number of first holes 241 is relatively small and the spacing between them is relatively large, the first holes 241 will not have a significant impact on the thermal conductivity of the metal connection layer 24. Optionally, the shape of the first hole 241 can be circular, hexagonal, or rhomboid, wherein the side length of the hexagonal or rhomboid first hole 241 is 40 to 70 μm. Optionally, the side length of the first hole 241 is 40 μm, 50 μm, 60 μm, or 70 μm.

[0061] In one example, such as Figure 7 As shown, the first hole 241 is elongated in shape, and the elongated first holes 241 are staggered. The length of the elongated first hole 241 is... Where d is the hole spacing of the first hole 241. The shape of the elongated first hole 241 can be racetrack-shaped, parallelogram-shaped, or trapezoidal. The structure of the metal connection layer 24 with this structure is relatively simple and easy to process and manufacture.

[0062] In one example, such as Figure 8 As shown, the two ends of the metal connecting layer 24 overlap the surface of the stepped structure 233 of the first heat dissipation layer 231 and the second heat dissipation layer 232, and the middle surface of the metal connecting layer 24 is bonded to the support layer 22 through the foam layer 26. That is, the thickness of the foam layer 26 is equal to the thickness of the stepped structure 233, and the metal connecting layer 24 is bonded to the surfaces of the foam layer 26 and the stepped structure 233. The foam layer 26 can reduce the rebound force of the metal connecting layer 24 during bending.

[0063] In one example, the thickness of the foam layer 26 is slightly greater than the thickness of the step structure 233. When the metal connecting layer 24 is bonded to the foam layer 26, the metal connecting layer 24 can compress the foam layer 26 so that the thickness of the foam layer 26 is equal to the thickness of the step structure 233.

[0064] In one example, such as Figure 9 As shown, the edge of the heat dissipation layer near the step structure 233 is set as a slope 234 or an arc surface, which facilitates a smooth transition between the metal connection layer 24 and the first heat dissipation layer 231 and the second heat dissipation layer 232. The gap between the two can be filled by the pressure-sensitive adhesive layer.

[0065] like Figure 3 As shown, multiple first holes 241 and second holes 221 are respectively provided on the metal connection layer 24 and the support layer 22 near the center line O of the bending area. The first holes 241 and the second holes 221 are staggered to avoid forming a structure with through holes at the top and bottom, so as to reduce the strength of the display module.

[0066] The support layer 22 located in the bending area 103 is provided with a plurality of grooves 222 extending along the bending center line O. The grooves 222 are located on the side of the second hole 221 away from the bending center line O, so as to enhance the bending performance of the support layer 22.

[0067] In the description of this invention, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0068] It should also be noted that in the description of this invention, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0069] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of the present invention are still within the protection scope of the present invention.

Claims

1. A display module comprising a first planar area, a bent area, and a second planar area connected in sequence, characterized in that, include: Flexible display panel; A support layer is disposed on the side away from the light emission direction of the flexible display panel, and is used to support the flexible display panel; The heat dissipation layer includes a first heat dissipation layer and a second heat dissipation layer located in the first planar region and the second planar region, respectively, and the heat dissipation layer is disposed on the side of the support layer away from the flexible display panel; A metal connecting layer is disposed on the side of the support layer away from the flexible display panel, and both ends of the metal connecting layer are respectively connected to the first heat dissipation layer and the second heat dissipation layer. The ends of the first heat dissipation layer and the second heat dissipation layer that are close to each other are provided with a stepped structure. Both ends of the metal connecting layer are attached to the surface of the stepped structure. One side surface of the stepped structure is flush with the surface of the heat dissipation layer. The end of the metal connecting layer is bonded to the top surface of the stepped structure, and the top surface of the metal connecting layer is flush with the other side surface of the heat dissipation layer. The central part of the metal connecting layer is suspended above the support layer. A flexible support layer is disposed on the side of the heat dissipation layer and the metal connection layer away from the support layer.

2. The display module according to claim 1, characterized in that, The distance from the edges of the first and second heat dissipation layers near the center of the bending area to the centerline of the bending area. The value range is 0.2L to 0.25L; Wherein, L is the length from the edge of the first planar region away from the bending region to the center line of the bending region.

3. The display module according to claim 2, characterized in that, The length value of the stepped structure The value range is 0.2C to 0.25C.

4. The display module according to claim 3, characterized in that, The first heat dissipation layer and the second heat dissipation layer are made of single-layer graphite, and the metal connecting layer is made of stainless steel sheet.

5. The display module according to claim 1, characterized in that, The metal connecting layer has multiple first holes near the center line of the bending area.

6. The display module according to claim 5, characterized in that, The plurality of first holes are arranged in multiple columns along the center line of the bending area, with the centers of the first holes in adjacent columns staggered. The number of first holes ranges from 16 to 24, the diameter of the first holes ranges from 250 to 400 μm, and the spacing between the holes ranges from 3 to 5 mm.

7. The display module according to claim 5, characterized in that, The first hole is circular, hexagonal, or rhomboid in shape or one or more.

8. The display module according to claim 5, characterized in that, The first hole is elongated, and the elongated first holes are staggered.

9. The display module according to claim 1, characterized in that, Multiple first holes and second holes are respectively provided on the metal connecting layer and the support layer near the center line of the bending area, and the first holes and second holes are arranged alternately.

10. The display module according to claim 9, characterized in that, The support layer located in the bending area has a plurality of grooves extending along the center line of the bending area, and the grooves are located on the side of the second hole away from the center line of the bending area.

11. The display module according to claim 1, characterized in that, The two ends of the metal connecting layer overlap the surface of the stepped structure, and the middle surface of the metal connecting layer is bonded to the support layer through a foam layer.

12. The display module according to claim 1, characterized in that, The edge of the heat dissipation layer near the stepped structure is set as a sloped surface or a circular arc surface.

13. An electronic device, characterized in that, Includes the display module as described in any one of claims 1 to 12.

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