Positioning scribe mechanism for semiconductor wafers

Abstract

The application relates to a positioning and scribing mechanism for semiconductor wafers, belonging to the field of semiconductor wafer production, which comprises a base, a gas cylinder mounted at the bottom of the base, a mounting plate connected to the top of the gas cylinder, a positioning clamp I movably connected to one side of the mounting plate, a positioning clamp II movably connected to the other side of the mounting plate, an alignment piece detachably and horizontally connected to the top of the positioning clamp I, a clamping piece detachably connected to the top of the positioning clamp II, and the alignment piece and the clamping piece being used for the alignment and clamping of multilayer semiconductor wafers; a belt assembly is arranged at the top of the base, the semiconductor wafers are placed on the top of the belt assembly; a guide rail is vertically arranged at the feeding and discharging position of the belt assembly, the guide rail is matched with a ball screw assembly to move, a tool bit is arranged at the bottom of the ball screw assembly, a driving device is arranged at one side of the ball screw assembly, the driving device drives the tool bit to move in the horizontal direction through the ball screw assembly; the tool bit is connected with the ball screw assembly through a tool bit gas cylinder, and the tool bit gas cylinder controls the tool bit to move in the vertical direction; the positioning and scribing mechanism for semiconductor wafers can solve the problems that the traditional equipment production line cannot align, press and cut integrally, and the low efficiency caused by the manual driving device.

Description

Technical Field

[0001] This invention relates to a positioning and marking mechanism for semiconductor wafers, belonging to the field of semiconductor wafer manufacturing. Background Technology

[0002] Traditional wafer positioning and marking mechanisms mostly employ mechanical or optical methods. Mechanical methods typically use robotic arms for positioning and marking, but they have low accuracy and are easily affected by environmental factors. Optical methods use laser interferometers for positioning and marking, which have higher accuracy, but the equipment is expensive and difficult to widely apply.

[0003] According to Chinese invention patent CN218903083U, this invention relates to the field of metal rolling positioning technology, specifically a metal rolling positioning mechanism. The adjusting device includes a slide groove, with two sliders slidably connected inside the groove. Extension plates are fixedly mounted on the sides of both sliders, and grooves are formed on the sides of the extension plates. A movable limiting plate is fixedly mounted on the surface of the movable block away from the groove. A sliding plate is slidably connected inside the strip groove. A threaded rod is rotatably connected between the inner walls of both ends of a U-shaped bracket. A handwheel is fixedly mounted on one end of the threaded rod. A vertical groove is formed on the inner wall surface of the U-shaped bracket. A T-shaped plate is threadedly connected to the surface of the threaded rod. Two pull rods are hinged to the bottom surface of the T-shaped plate, with the end of the pull rod away from the T-shaped plate hinged to the slider. This invention solves the problem that existing positioning mechanisms are only suitable for rolling metal workpieces of one specification, resulting in low versatility of the entire device.

[0004] Traditional equipment does not involve clamping and scribing devices, which means that it cannot perform automated integrated operations on semiconductor wafers during use. At the same time, the driving device of traditional equipment is manual, which wastes a lot of manpower and time costs during use. The inefficiency makes the equipment unsuitable for use on the production line. Summary of the Invention

[0005] The technical problem to be solved by this invention is that traditional equipment production lines cannot perform integrated alignment, pressing and cutting, and the low efficiency caused by manual driving devices. This invention provides a positioning and marking mechanism for semiconductor wafers.

[0006] The present invention discloses a positioning and marking mechanism for semiconductor wafers, comprising a base, a cylinder mounted at the bottom of the base, a mounting plate connected to the top of the cylinder, a positioning fixture I movably connected to one side of the mounting plate, a positioning fixture II movably connected to the other side of the mounting plate, an alignment member detachably horizontally connected to the top of the positioning fixture I, and a clamping member detachably connected to the top of the positioning fixture II. The alignment member and the clamping member are used for clamping the alignment of the multilayer semiconductor wafer.

[0007] A belt assembly is located on top of the base, and a semiconductor chip is placed on top of the belt assembly;

[0008] The belt assembly has a vertical guide rail at the inlet and outlet. The guide rail moves in conjunction with the ball screw assembly. The bottom of the ball screw assembly has a cutter head. A drive device is located on one side of the ball screw assembly. The drive device moves the cutter head horizontally through the ball screw assembly.

[0009] The cutter head is connected to a ball screw assembly via a cutter head cylinder, which controls the vertical movement of the cutter head.

[0010] By setting a base, the base can provide support and protection for the overall installation of other components. By setting a cylinder installed at the bottom of the base, the cylinder can provide a power source for positioning and clamping operations. By setting a mounting plate connected to the top of the cylinder, the mounting plate can provide installation space for the installation of other components. By setting a positioning fixture I movably connected to one side of the mounting plate, the positioning fixture I can be used for the alignment operation of semiconductor wafers. By setting a positioning fixture II movably connected to the other side of the mounting plate, the positioning fixture II can be used for the clamping operation of semiconductor wafers. By setting a horizontally detachable alignment component connected to the top of the positioning fixture I, the alignment component can perform the alignment operation of semiconductor wafers. The detachable component can also prevent wear and tear caused by long-term use, allowing for replacement after wear and preventing damage to semiconductor wafers. By setting a clamping component detachably connected to the top of the positioning fixture II, the clamping component can clamp the semiconductor wafers vertically. By setting up the alignment component and the clamping component, the alignment component and the clamping component are used for the alignment and clamping of multilayer semiconductor wafers.

[0011] By setting a belt assembly on the top of the base, the semiconductor wafer can be transported;

[0012] The belt assembly is equipped with vertical guide rails at the inlet and outlet. These guide rails support and guide the ball screw assembly to move along a specified trajectory. A cutter head is located at the bottom of the ball screw assembly. As an actuator, the cutter head is used to cut semiconductor wafers by moving along a specified trajectory path. A drive device is located on one side of the ball screw assembly. This drive device provides the power source for the overall movement, thereby enabling the drive device to control the horizontal movement of the cutter head through the ball screw assembly.

[0013] The cutter head is connected to the ball screw assembly via a cutter head cylinder. By setting up the cutter head cylinder, the cutter head cylinder can connect the cutter head and the ball screw assembly. At the same time, the cutter head cylinder controls the cutter head to perform vertical trajectory movement.

[0014] Furthermore, the positioning fixture I is L-shaped, and the right-angled side of the positioning fixture I is connected to the base through a pin. The bottom inner edge of the positioning fixture I is detachably equipped with an adjustment device, which is vertically set and one end of the adjustment device contacts the mounting plate for the return movement of the alignment part.

[0015] By setting the positioning fixture I in an L-shape, the positioning fixture I can act as a balance plate, controlling the path of the bottom of the positioning fixture I, and thus controlling the path of the top movement trajectory of the positioning fixture I. By setting the inner edge of the bottom of the positioning fixture I to be detachably equipped with an adjustment device, and by setting the adjustment device to be vertically set, the adjustment device can fine-tune the top running trajectory, so as to suit semiconductor wafers of different widths. By setting one end of the adjustment device to contact the mounting plate, it is used for the return movement of the alignment part.

[0016] Furthermore, a spring is provided on the outside of the adjustment device, which is adapted to the adjustment device. The positioning clamp I is connected to the belt assembly through the spring for the alignment movement of the semiconductor wafer.

[0017] By setting a spring on the outside of the adjustment device to match the adjustment device, the spring can be used to align the semiconductor wafer at the top of the belt. By setting a positioning clamp I connected to the belt assembly through the spring, a reliable support point can be provided for the spring to rebound and compress, and for the alignment movement of the semiconductor wafer.

[0018] Furthermore, the positioning fixture II has a guide groove in the middle, and a pin is provided in the guide groove. The pin works with the guide groove to achieve trajectory control of the top clamping member, which is used for vertical positioning of the semiconductor wafer.

[0019] The positioning fixture II has a guide groove in the middle, which can be used to control the trajectory of the positioning fixture II. The pin shaft cooperates with the guide groove to realize the trajectory control of the top clamping part, which is used for vertical positioning of semiconductor wafers.

[0020] Furthermore, the belt assembly includes a bottom support and a belt, with a baffle on one side of the support, the top of the baffle being higher than the top of the belt.

[0021] The height difference between the top of the baffle and the top of the belt is H.

[0022] The belt assembly includes a bottom support and a belt. A baffle is provided on one side of the support. The baffle works with an alignment component to align the semiconductor wafer. By setting the top of the baffle to be larger than the top of the belt, the baffle can block the semiconductor wafer, thus allowing the alignment operation to proceed.

[0023] Among them, the height difference H between the top of the baffle and the top of the belt is preferred, and the range of H can be 10mm-20mm.

[0024] Furthermore, gaps are provided on both sides of the base, which are used for positioning clamp I and positioning clamp II to extend from inside the base, and at the same time provide space for the movement trajectory of positioning clamp I and positioning clamp II.

[0025] By setting gaps on both sides of the base, positioning clamps I and II can extend from inside the base, thus connecting the inside and outside of the base. The gaps on both sides of the base also provide space for the movement trajectories of positioning clamps I and II, avoiding interference between parts during operation and ensuring the safety of operators.

[0026] Furthermore, an auxiliary vision sensor is installed near the cutter head, which transmits signals to the drive device to control the trajectory of the cutter head.

[0027] By setting an auxiliary vision sensor near the cutter head, the boundary contour of the semiconductor wafer is identified by the auxiliary vision sensor, which facilitates the subsequent movement of the cutter head along a specified path. The signal is transmitted to the drive device, which then controls the trajectory of the cutter head.

[0028] Furthermore, the positioning fixture II is connected to the adapter via a pin, and the bottom of the adapter is equipped with an adjustment block, which is used to adapt to the specifications of semiconductor wafer glass of different thicknesses; the positioning fixture II is connected to the mounting plate via the adapter, and the trajectory of the clamping component is controlled by the up and down movement of the mounting plate.

[0029] By setting an adapter on one side of the mounting plate, the adapter can connect the adapter plate and the positioning fixture II, avoiding the increase in cost caused by overall processing. The positioning fixture II is connected to the adapter via a pin, which can be used to control the movement trajectory of the positioning fixture II. An adjustment block is set at the bottom of the connector, which can be used to raise the connector and adjust the degree of clamping force of the positioning fixture II on the semiconductor wafer.

[0030] Furthermore, the guide groove includes guide groove I and guide groove II, with an obtuse angle between them. Guide groove I is used for the rotation of the clamping member around the axis, and guide groove II is used for the vertical movement of the clamping member.

[0031] By setting guide grooves including guide groove I and guide groove II, with an obtuse angle between guide groove I and guide groove II, guide groove I and guide groove II can control the clamping part to move in two strokes. The first stroke is the rotation of the clamping part around the axis by guide groove I, and the second stroke is the vertical movement of the clamping part by guide groove II.

[0032] Compared with the prior art, the beneficial effects of the present invention are:

[0033] This invention discloses a positioning and marking mechanism for semiconductor wafers. A base provides support and protection for the overall installation of other components. A cylinder is installed at the bottom of the base, providing power for positioning and clamping operations. A mounting plate is connected to the top of the cylinder, providing installation space for other components. A positioning clamp I is movably connected to one side of the mounting plate for aligning the semiconductor wafer. A positioning clamp II is movably connected to the other side of the mounting plate for clamping the semiconductor wafer. An alignment component is detachably horizontally connected to the top of positioning clamp I for aligning the semiconductor wafer. This detachable component allows for replacement after wear and tear from prolonged use, preventing damage to the semiconductor wafer and affecting future use. The positioning clamp II... A detachable clamping component is provided at the top, which can vertically clamp the semiconductor wafer. A belt assembly is provided at the top of the base to transport the semiconductor wafer. Alignment and clamping components are provided for aligning and clamping multilayer semiconductor wafers. Vertical guide rails are provided at the inlet and outlet of the belt assembly. The guide rails act as support components to allow the top structure to move along a specified path. The guide rails work in conjunction with a ball screw assembly, which acts as an actuator to move along the specified path. The ball screw is controlled by a drive device, which provides power and controls the trajectory of the cutter head through the ball screw. This solution addresses the problems of traditional production lines that cannot perform integrated alignment, clamping, and cutting, and the low efficiency caused by manual drive devices. It provides a positioning and marking mechanism for semiconductor wafers. Attached Figure Description

[0034] Figure 1 This is a three-dimensional embodiment of the present invention. Figure I ;

[0035] Figure 2 This is a three-dimensional embodiment of the present invention. Figure II ;

[0036] Figure 3 This is a cross-sectional view AA of an embodiment of the present invention;

[0037] Figure 4 This is a cross-sectional view BB of an embodiment of the present invention;

[0038] Figure 5 This is a cross-sectional view (CC) of an embodiment of the present invention;

[0039] Figure 6 This is a front view of an embodiment of the present invention;

[0040] Figure 7 This is a left view of an embodiment of the present invention;

[0041] Figure 8 This is a top view of an embodiment of the present invention;

[0042] Figure 9 This is an overall sectional view of an embodiment of the present invention;

[0043] In the diagram: 1. Base; 2. Cylinder; 3. Mounting plate; 4. Positioning fixture I; 5. Positioning fixture II; 6. Alignment component; 7. Clamping component; 8. Belt assembly; 9. Guide rail; 10. Ball screw assembly; 11. Drive device; 12. Cutter head; 13. Pin I; 14. Adjustment device; 15. Spring; 16. Pin II; 17. Pin III; 18. Auxiliary vision sensor; 19. Adapter; 20. Adjusting block; 21. Cutter head cylinder;

[0044] 101. Gap;

[0045] 501. Guide groove;

[0046] 5011, Guide groove I; 5012, Guide groove II;

[0047] 801. Support component; 802. Belt; 803. Baffle. Detailed Implementation

[0048] Example 1

[0049] like Figures 1-6 As shown, the positioning and marking mechanism for semiconductor wafers according to the present invention includes a base 1, a cylinder 2 installed at the bottom of the base 1, a mounting plate 3 connected to the top of the cylinder 2, a positioning fixture I 4 movably connected to one side of the mounting plate 3, a positioning fixture II 5 movably connected to the other side of the mounting plate 3, an alignment member 6 detachably horizontally connected to the top of the positioning fixture I 4, and a clamping member 7 detachably connected to the top of the positioning fixture II 5. The alignment member 6 and the clamping member 7 are used for clamping the alignment of the multilayer semiconductor wafer.

[0050] The base 1 is provided with a belt assembly 8 at the top, and a semiconductor chip is placed on the top of the belt assembly 8;

[0051] The belt assembly 8 is vertically equipped with a guide rail 9 at the inlet and outlet. The guide rail 9 moves in conjunction with the ball screw assembly 10. The bottom of the ball screw assembly 10 is equipped with a cutter head 12. A drive device 11 is provided on one side of the ball screw assembly 10. The drive device 11 moves the cutter head 12 horizontally through the ball screw assembly 10.

[0052] The cutter head 12 is connected to the ball screw assembly 10 via the cutter head cylinder 21, and the cutter head cylinder 21 controls the cutter head 12 to move in the vertical direction.

[0053] By setting up a base 1, the base 1 can provide support and protection for the overall installation of other components. By setting up a cylinder 2 at the bottom of the base 1, the cylinder 2 can provide a power source for positioning and clamping operations. By setting up a mounting plate 3 connected to the top of the cylinder 2, the mounting plate 3 can provide installation space for the installation of other components. By setting up a positioning fixture I 4 movably connected to one side of the mounting plate 3, the positioning fixture I 4 can be used for the alignment of semiconductor wafers. By setting up a positioning fixture II 5 movably connected to the other side of the mounting plate 3, the positioning fixture II 5 can be used for the alignment of semiconductor wafers. The wafer clamping operation is achieved by setting a detachable horizontally connected alignment piece 6 on the top of the positioning fixture I4. The alignment piece 6 can align the semiconductor wafer. At the same time, the detachable connection allows for replacement after wear due to long-term use of the device, avoiding damage to the semiconductor wafer and affecting its later use. A detachable clamping piece 7 is set on the top of the positioning fixture II5. The clamping piece 7 can clamp the semiconductor wafer vertically. The alignment piece 6 and the clamping piece 7 are used for the alignment and clamping of multilayer semiconductor wafers.

[0054] By providing a belt assembly 8 on the top of the base 1, the belt assembly 8 can transport semiconductor wafers;

[0055] By setting the belt assembly 8 with a vertical guide rail 9 at the inlet and outlet, the guide rail 9 can support and guide the ball screw assembly 10 to move along a specified trajectory. The ball screw assembly 10 has a cutter head 12 at the bottom, which serves as an actuator to cut semiconductor wafers by moving along a specified trajectory path. A drive device 11 is provided on one side of the ball screw assembly 10. By setting the drive device 11, the drive device 11 can provide the power source for the overall movement, thereby enabling the drive device 11 to control the horizontal movement of the cutter head 12 through the ball screw assembly 10.

[0056] The cutter head 12 is connected to the ball screw assembly 10 via the cutter head cylinder 21. By setting the cutter head cylinder 21, the cutter head cylinder 21 can connect the cutter head 12 and the ball screw assembly 10. At the same time, the cutter head cylinder 21 controls the cutter head 12 to perform vertical trajectory movement.

[0057] like Figure 1 As shown, as an optimization, the positioning fixture I4 is L-shaped. The right-angled side of the positioning fixture I4 is connected to the base 1 through the pin I13. The bottom inner edge of the positioning fixture I4 is detachably provided with an adjustment device 14. The adjustment device 14 is vertically set, and one end of the adjustment device 14 contacts the mounting plate 3 for the return movement of the alignment part 6.

[0058] By setting the positioning clamp I4 to be L-shaped, the positioning clamp I4 can act as a balance plate, controlling the path of the bottom of the positioning clamp I4, and thus controlling the path of the top movement trajectory of the positioning clamp I4. By setting the inner edge of the bottom of the positioning clamp I4 to be detachably equipped with an adjustment device 14, and by setting the adjustment device 14 to be vertically set, the adjustment device 14 can fine-tune the top running trajectory, so as to suit semiconductor wafers of different widths. By setting one end of the adjustment device 14 to contact the mounting plate 3, it is used for the return movement of the alignment piece 6.

[0059] like Figure 1 As shown, as an optimization, the adjustment device 14 is adapted to the adjustment device 14, and a spring 15 is provided on the outside of the adjustment device 14. The positioning clamp I4 is connected to the belt assembly 8 through the spring 15 for the alignment movement of the semiconductor wafer.

[0060] By setting a spring 15 on the outside of the adjustment device 14 to be compatible with the adjustment device 14, the spring 15 can be used to align the semiconductor wafer on the top of the belt 802. By setting a positioning clamp I4 to connect the belt assembly 8 through the spring 15, a reliable support point can be provided for the spring 15 for the springback and compression, and for the alignment movement of the semiconductor wafer.

[0061] like Figure 1 As shown, as an optimization, the positioning fixture II5 is provided with a guide groove 501 in the middle, and a pin II16 is provided in the guide groove 501. The pin II16 cooperates with the guide groove 501 to realize the trajectory control of the top clamping member 7, which is used for vertical positioning of the semiconductor wafer.

[0062] The positioning fixture II5 is provided with a guide groove 501 in the middle. The guide groove 501 can be used to control the trajectory of the positioning fixture II5. The pin II16 cooperates with the guide groove 501 to realize the trajectory control of the top clamping member 7, which is used for vertical positioning of the semiconductor wafer.

[0063] like Figure 1 As shown, as an optimization, the bottom of the positioning fixture II5 is connected to the mounting plate 3 via the pin II16, and the trajectory of the clamping member 7 is controlled by the up and down movement of the mounting plate 3.

[0064] By setting the bottom of the positioning fixture II5 to be connected to the mounting plate 3 via the pin II16, the mounting plate 3 can control the trajectory of the clamping part 7 by moving the mounting plate 3 up and down.

[0065] like Figure 1 As shown, as an optimization, the belt assembly 8 includes a bottom support 801 and a belt 802. A baffle 803 is provided on one side of the support, and the top of the baffle 803 is higher than the top of the belt 802.

[0066] The height difference between the top of the baffle 803 and the top of the belt 802 is H.

[0067] The belt assembly 8 includes a support member 801 and a belt 802. A baffle 803 is provided on one side of the support member 801. The baffle 803 works in conjunction with the alignment member 6 to align the semiconductor wafer. By setting the top of the baffle 803 higher than the top of the belt 802, the baffle 803 can block the semiconductor wafer, thus allowing the alignment operation to proceed.

[0068] Among them, the height difference H between the top of the baffle 803 and the top of the belt 802 is preferably 10mm-20mm.

[0069] like Figure 1 As shown, as an optimization, gaps 101 are provided on both sides of the base 1. The gaps 101 are used to extend the positioning jig I4 and positioning jig II5 from inside the base 1, and at the same time provide space for the movement trajectory of the positioning jig I4 and positioning jig II5.

[0070] By providing gaps 101 on both sides of the base 1, the gaps 101 allow positioning clamps I4 and II5 to extend from inside the base 1, achieving communication between the inside and outside of the base 1. The gaps 101 on both sides of the base 1 also provide space for the movement trajectories of positioning clamps I4 and II5, preventing interference between components during operation and ensuring operator safety. Figure 1 As shown, as an optimization, an auxiliary vision sensor 18 is provided near the cutter head 12, which transmits signals to the drive device 11, thereby controlling the trajectory of the cutter head 12.

[0071] By setting an auxiliary vision sensor 18 near the cutter head 12, the boundary contour of the semiconductor wafer is identified by the auxiliary vision sensor 18, which facilitates the subsequent movement of the cutter head 12 along a specified path. The transmission signal is then sent to the drive device 11, which controls the trajectory of the cutter head 12.

[0072] like Figure 1 As shown, as an optimization, an adapter 19 is provided on one side of the mounting plate 3. The mounting plate 3 is connected to the positioning fixture II 5 through the adapter 19. The positioning fixture II 5 is connected to the adapter 19 through the pin III 17. An adjustment block 20 is provided at the bottom of the adapter 19. The adjustment block 20 is used to adapt to different thicknesses of semiconductor wafer glass specifications.

[0073] By setting an adapter 19 on one side of the mounting plate 3, the adapter 19 can connect the adapter plate and the positioning fixture II 5, avoiding the increase in cost caused by overall processing. The positioning fixture II 5 is connected to the adapter 19 through a pin III 17, which can be used to control the movement trajectory of the positioning fixture II 5. An adjustment block 20 is set at the bottom of the connector, which can be used to raise the connector and adjust the degree of pressure of the positioning fixture II 5 on the semiconductor wafer.

[0074] like Figure 9 As shown, as an optimization, the guide groove 501 includes guide groove I 5011 and guide groove II 5012. The guide groove I 5011 and guide groove II 5012 are at an obtuse angle. Guide groove I 5011 is used for the rotation of the clamping member 7 around the axis, and guide groove II 5012 is used for the vertical movement of the clamping member 7.

[0075] By setting guide groove 501, including guide groove I 5011 and guide groove II 5012, the angle between guide groove I 5011 and guide groove II 5012 is obtuse. Guide groove I 5011 and guide groove II 5012 can control the clamping member 7 to move in two strokes. The first stroke is the rotation of the clamping member 7 around the axis by guide groove I 5011, and the second stroke is the vertical movement of the clamping member 7 by guide groove II 5012.

[0076] Working process or working principle:

[0077] Original state: Mounting plate 3 is in the top position, alignment piece 6 and clamping piece 7 are in the released state, spring 15 is in the compressed state, and pin II 16 is in the guide groove I 5011 at this time;

[0078] Clamping motion: The semiconductor wafer is transported to the bottom of the lead screw assembly via belt 802. Cylinder 2 moves downward and spring 15 rebounds. The spring rebound force controls the top alignment member 6 to move through positioning fixture I 4. Alignment member 6, together with baffle 803, performs alignment operation on the semiconductor wafer. At the same time, cylinder 2 controls positioning fixture II 5 to move clamping member 7. Clamping member 7 rotates through guide groove I 5011 and clamps through guide groove II 5012.

[0079] Cutting motion: The drive device 11 controls the movement of the cutter head 12 through the ball screw assembly 10, and the basic outline boundary of the semiconductor wafer is identified by the auxiliary vision sensor 18 to ensure that the cutter head 12 does not exceed the outline boundary of the semiconductor wafer. The cutter head 12 cuts the semiconductor wafer into the specified shape through the cooperation between the guide rail 9 and the ball screw assembly 10. The cutter head cylinder 21 controls the cutter head 12 to cut different semiconductor wafers.

[0080] End of motion: The semiconductor wafer that has finished cutting is transported to the other side of the equipment via belt assembly 8.

[0081] The descriptions of the orientation and relative positional relationships of the structures in this invention, such as front, back, left, right, up, and down, do not constitute a limitation of this invention, but are merely for the convenience of description.

Claims

1. A positioning and marking mechanism for semiconductor wafers, characterized in that, Includes a base (1), a cylinder (2) installed at the bottom of the base (1), a mounting plate (3) connected to the top of the cylinder (2), a positioning fixture I (4) movably connected to one side of the mounting plate (3), a positioning fixture II (5) movably connected to the other side of the mounting plate (3), an alignment component (6) detachably connected to the top of the positioning fixture I (4), and a clamping component (7) detachably connected to the top of the positioning fixture II (5); the alignment component (6) and the clamping component (7) are used for aligning and clamping multilayer semiconductor wafers; The base (1) is provided with a belt assembly (8) on top, and a semiconductor wafer is placed on the top of the belt assembly (8); The belt assembly (8) is vertically equipped with a guide rail (9) at the inlet and outlet. The guide rail (9) moves in conjunction with the ball screw assembly (10). The ball screw assembly (10) is equipped with a cutter head (12) at the bottom. The ball screw assembly (10) is equipped with a drive device (11) on one side. The drive device (11) moves the cutter head (12) horizontally through the ball screw assembly (10). The cutter head (12) is connected to the ball screw assembly (10) via the cutter head cylinder (21), and the cutter head cylinder (21) controls the cutter head (12) to move in the vertical direction; The positioning fixture I (4) is L-shaped. The right-angled side of the positioning fixture I (4) is connected to the base (1) through the pin I (13). The bottom inner edge of the positioning fixture I (4) is detachably equipped with an adjustment device (14). The adjustment device (14) is set vertically. One end of the adjustment device (14) contacts the mounting plate (3) for the return movement of the alignment piece (6). A spring (15) is provided on the outside of the adjustment device (14), and the spring (15) is adapted to the adjustment device (14); the positioning clamp I (4) is connected to the belt assembly (8) through the spring (15) for the alignment movement of the semiconductor wafer; The positioning fixture II (5) has a guide groove (501) in the middle, and a pin II (16) is provided in the guide groove (501). The pin II (16) cooperates with the guide groove (501) to realize the trajectory control of the top clamping member (7) for vertical positioning of the semiconductor wafer. An auxiliary vision sensor (18) is provided near the cutter head (12) to transmit signals to the drive device (11), thereby controlling the trajectory of the cutter head (12) through the drive device (11); Positioning clamp II (5) is connected to adapter (19) via pin III (17). The bottom of adapter (19) is provided with adjustment block (20), which is used to adapt to different thicknesses of semiconductor wafer glass specifications. Positioning clamp II (5) is connected to mounting plate (3) via adapter (19). The trajectory of clamping member (7) is controlled by the up and down movement of mounting plate (3). The guide groove (501) includes guide groove I (5011) and guide groove II (5012). The guide groove I (5011) and guide groove II (5012) are at an obtuse angle. Guide groove I (5011) is used for the rotation of the clamping member (7) around the axis, and guide groove II (5012) is used for the vertical movement of the clamping member (7).

2. The positioning and marking mechanism for semiconductor wafers according to claim 1, characterized in that, The belt assembly (8) includes a support member (801) and a belt (802). A baffle (803) is provided on one side of the support member (801), and the top of the baffle (803) is higher than the top of the belt (802). The height difference between the top of the baffle (803) and the top of the belt (802) is H.

3. The positioning and marking mechanism for semiconductor wafers according to claim 1 or 2, characterized in that, The base (1) has gaps (101) on both sides. The gaps (101) are used to extend the positioning clamp I (4) and positioning clamp II (5) from inside the base (1), while providing space for the movement trajectory of the positioning clamp I (4) and positioning clamp II (5).

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