Mask and process for producing the same

By designing a spherical arc-shaped air inlet groove and vapor deposition hole structure, combined with the precise processing of a chemical etching device, the problem of vapor deposition airflow guidance was solved, improving the vapor deposition effect and processing accuracy.

CN117230407BActive Publication Date: 2025-10-21ZHEJIANG ZHONGLING TECH CO LTD
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Patent Information

Application Number
CN202311196173.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-09-15
Publication Date
2025-10-21
Estimated Expiration
2043-09-15

AI Technical Summary

Technical Problem

The evaporation holes of the existing mask are arranged vertically, which results in that the evaporation airflow cannot be effectively guided, resulting in poor evaporation effect.

Method used

The design incorporates spherical arc-shaped air inlets and vapor deposition holes. By coordinating several air inlets with the vapor deposition holes, the vapor deposition airflow is guided, improving the uniformity and regularity of the vapor deposition process. The air inlets and vapor deposition holes are then precisely machined using a chemical etching device.

Benefits of technology

It achieves regular movement of vapor deposition gas, improves the uniformity and regularity of vapor deposition, ensures the precise processing of vapor deposition holes, and adapts to the processing needs of plates of different thicknesses.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application belongs to the technical field of mask, especially relates to a mask and a production process thereof, comprising: a plate body; a plurality of air inlet groove groups arranged at the top of the plate body and spaced along the length direction of the plate body, wherein each air inlet groove group comprises a plurality of air inlet grooves spaced along the width direction of the plate body; and a plurality of evaporation holes respectively arranged at the bottom of the plate body and communicated with the groove bottoms of the air inlet grooves; wherein the air inlet grooves and the evaporation holes are all spherical arcs, the opening of the communicated part of the air inlet groove and the evaporation hole is smaller than the opening of the other end, and the top opening of the air inlet groove is larger than the bottom opening of the evaporation hole; the present application has the advantages of excellent evaporation effect and accurate mask production.
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Description

Technical Field

[0001] The present invention relates to the technical field of mask plates, and in particular to a mask plate and a production process thereof. Background Art

[0002] Among related technologies, OLED (organic light-emitting diode) displays offer numerous advantages, including full solid-state, active luminescence, fast response, high contrast, no viewing angle restrictions, and flexible display. Developed in the mid-twentieth century, they are a new display technology widely used in people's daily production and daily lives. OLED displays are poised to become the next generation's most ideal flat-panel display devices. Their superior performance and enormous market potential have attracted numerous manufacturers and research institutions worldwide to invest in the production and development of OLED displays. Evaporation technology is a commonly used process for preparing organic thin films in existing OLED device fabrication, offering advantages such as fast deposition rates and excellent film uniformity.

[0003] In the prior art, most of the evaporation holes of the mask are arranged vertically, which results in that the evaporation airflow cannot be effectively guided, resulting in poor evaporation effect. Summary of the Invention

[0004] In view of the deficiencies in the prior art, the present invention aims to provide a mask and a production process thereof to solve the above problems.

[0005] In view of this, the present invention provides a mask and a production process thereof, comprising:

[0006] plate body;

[0007] A plurality of air inlet slot groups are provided at the top of the plate body, and the plurality of air inlet slot groups are spaced apart along the length direction of the plate body, wherein the air inlet slot groups include a plurality of air inlet slots spaced apart along the width direction of the plate body;

[0008] and a plurality of vapor deposition holes, each of which is provided at the bottom end of the plate body and is connected to the bottom of the air inlet groove;

[0009] The air inlet groove and the evaporation hole are both spherical arc-shaped, and the opening of the connecting part between the air inlet groove and the evaporation hole is smaller than the other end opening. The top opening of the air inlet groove is larger than the bottom opening of the steam hole.

[0010] By adopting the above technical solution, through the cooperation of several air inlet grooves and several evaporation holes, multiple evaporation can be achieved at one time. Since the air inlet grooves and the evaporation holes are both set in a spherical arc shape, the evaporation airflow can be guided, so that the evaporation gas can move regularly, thereby improving the uniformity and regularity of evaporation.

[0011] In the above technical solution, the following steps are further included:

[0012] S1: First, use a cutting device to cut out the plate;

[0013] S2: Use the exposure system to perform yellow light development on the position of the plate that needs to be processed;

[0014] S3: The chemical etching device clamps the plate body, first etches the air inlet groove group on the outermost side of the plate body, then processes multiple air inlet groove groups, and finally cleans and removes the plate body;

[0015] S4: The reverse side of the plate is mounted on a chemical etching device. First, the outermost side of the plate corresponding to the air inlet slot is processed. Then, several more evaporation holes are processed. Finally, the plate is cleaned and removed.

[0016] In this technical solution, through the setting of S1, a plate of the required size can be obtained; through the setting of S2, the air inlet groove and the distillation hole can be processed more accurately during chemical etching, and different exposure rates can be performed according to the different thicknesses of the plates, so that the air inlet groove and the distillation hole can be processed more accurately; through the setting of S3, the air inlet groove group can be processed; through the setting of S4, the evaporation hole can be processed to complete the overall processing.

[0017] In the above technical solution, the chemical etching device further includes:

[0018] A carrier is provided on the ground;

[0019] A cleaning table is provided on the side wall of the carrier, and a cleaning tank is provided on the top of the cleaning table;

[0020] A horizontal movable structure is arranged in the carrier;

[0021] A concentration adjustment mechanism is provided on the floor inside the carrier;

[0022] The spray mechanism has a fixed end disposed on the horizontal movable structure, an input end passing through the horizontal movable structure and connected to the output end of the concentration regulating mechanism, and an output end passing through the top of the carrier;

[0023] and a spatial moving mechanism, which is arranged at the top of the carrier and the cleaning table, and a chuck for clamping the plate is provided on the output end of the spatial moving mechanism;

[0024] The top of the carrier is provided with a straight hole for the movement of the spray mechanism, the concentration adjustment mechanism is provided with a chemical liquid for chemical etching, and the cleaning tank is provided with a cleaning liquid for cleaning the chemical liquid.

[0025] In the present technical solution, by setting up a concentration adjustment mechanism, chemical liquids of different concentrations can be placed, so that the chemical liquid sprayed by the spray mechanism can change the chemical liquid of the required output concentration according to the thickness of the plate body, thereby improving the internal stress of the plate body, so that the air intake groove and the evaporation hole processed by the plate body are more accurate. By setting up a horizontal moving structure, the spray mechanism can be moved to the corresponding position of the plate body for chemical etching. By setting up a spatial moving mechanism, the chuck can be moved to the corresponding position. By setting cleaning liquid in the cleaning tank, the plate body can be cleaned after chemical etching is completed.

[0026] In the above technical solution, the horizontal movement structure further includes:

[0027] Two threaded rods are rotatably connected to the inner wall of the carrier at intervals;

[0028] A movable plate, threadedly connected to the two threaded rods;

[0029] and two drive motors, the fixed ends of which are arranged on the side of the carrier away from the cleaning table, and the output ends of which pass through the carrier and are respectively connected to the threaded rods;

[0030] Wherein, the fixed end of the spray mechanism is arranged on the top of the movable plate.

[0031] In this technical solution, the threaded rod can be rotated by setting a driving motor, thereby driving the movable plate to move horizontally.

[0032] In the above technical solution, the concentration adjustment mechanism further includes:

[0033] A first concentration box is disposed on the ground and located within the carrier;

[0034] A flushing tank, arranged on top of the first concentration tank;

[0035] The second concentration tank is arranged on the top of the flushing tank;

[0036] The first tank extraction tube has one end located above the second concentration tank and the other end passing through the top of the second concentration tank into the first concentration tank;

[0037] The second tank extraction pipe is placed outside the first tank extraction pipe, and one end of the second tank extraction pipe is located above the second concentration tank, and the other end passes through the top of the second concentration tank into the flushing tank;

[0038] The third tank extraction pipe is placed outside the second tank extraction pipe, and one end of the third tank extraction pipe is located above the second concentration tank, and the other end passes through the second concentration tank;

[0039] The control extraction structure has an input end provided on the first tank extraction pipe, the second tank extraction pipe and the third tank extraction pipe;

[0040] and a hose, one end of which is connected to the output end of the control extraction structure, and the other end of which passes through the movable plate and is connected to the input end of the spray mechanism;

[0041] The first tank extraction pipe, the second tank extraction pipe and the third tank extraction pipe are arranged with concentric axes, and the control extraction structure is used to control the working conditions of the first tank extraction pipe, the second tank extraction pipe and the third tank extraction pipe.

[0042] In the present technical solution, by setting up the first concentration box and the second concentration box, chemical liquids for chemical etching of different concentrations can be placed, by setting up the flushing box, cleaning liquid can be placed, by setting up the first box extraction tube, the chemical liquid in the first concentration box can be extracted, by setting up the second box extraction tube, cleaning liquid can be extracted, by setting up the third box extraction tube, the chemical liquid in the second concentration box can be extracted, and by controlling the setting of the extraction structure, the extraction conditions of the first box extraction tube, the second box extraction tube and the third box extraction tube can be controlled, so that the hose can obtain chemical liquid input or cleaning of different concentrations.

[0043] In the above technical solution, the control extraction structure further includes:

[0044] A fixed tube, one end of which is connected to the outer wall of the top end of the third tank extraction tube and the other end of which extends away from the third tank extraction tube;

[0045] A first control tube, one end of which is threadedly connected to the inner wall of the fixed tube and the bottom end of which abuts against the top of the third tank extraction tube, and the other end of which extends out of the fixed tube;

[0046] A second control tube, one end of which is threadedly connected to the inner wall of the first control tube and the bottom end of which abuts against the top end of the second tank extraction tube, and the other end of which extends out of the fixed tube;

[0047] A main flow column, one end of which is threadedly connected to the inner wall of the second control tube and the bottom end of which abuts against the top of the first tank extraction tube, and the other end of which extends out of the second control tube;

[0048] Main flow trough, set at the top of the main flow column;

[0049] A first channel, one end of which is opened at the bottom end of the main flow column and contacts the top end of the first tank extraction pipe, and the other end is connected to the main flow trough;

[0050] The second channel has one end opening disposed at the bottom end of the first control tube and not interfering with the top end of the third extraction tube, and the other end sequentially passes through the inner wall of the first control tube, the second control tube, the main flow column, and is connected to the main flow groove;

[0051] The third channel has one end opening disposed at the bottom end of the second control tube and in contact with the top end of the second extraction tube, and the other end communicating with the inner wall of the second control tube.

[0052] and a fourth channel, one end of which is provided on the outer wall of the main flow column and the other end of which is connected to the main flow groove.

[0053] In which, the top opening of the main flow groove is connected to the hose, when the second control tube rotates and rises, the third channel is connected to the fourth channel, when the first control tube is completely threadedly connected to the fixed tube, the top opening of the third box extraction tube is sealed, when the second control tube is completely threadedly connected to the first control tube, the top opening of the second box extraction tube is sealed, when the main flow column is completely threadedly connected to the second control tube, the top opening of the first box extraction tube is sealed.

[0054] In the present technical solution, when the liquid pump is started in the initial state, only the second channel is in the open state. At this time, the liquid pump extracts the chemical liquid in the second concentration tank through the third tank extraction pipe. When only the second control pipe is rotated to rise to connect the third channel with the fourth channel, the second channel is disconnected. At this time, the liquid pump extracts the flushing liquid in the flushing tank through the second tank extraction pipe to clean the residual chemical liquid in the whole. When only the mainstream column is rotated to rise, the first channel is opened. At this time, the liquid pump extracts the chemical liquid in the first concentration tank through the first tank extraction pipe. When the first control pipe, the second control pipe and the mainstream column rise the same distance, the first channel is opened and the second channel is opened. At this time, the liquid pump extracts the chemical liquid in the first concentration tank and the second concentration tank at the same time, which can neutralize the chemical liquids of different concentrations to achieve an intermediate concentration of chemical liquid. By extracting three chemical liquids of different concentrations, different concentrations of chemical liquids can be used according to the thickness of the plate, thereby reducing the stress of the plate itself and achieving etching accuracy.

[0055] In the above technical solution, the spraying mechanism further includes:

[0056] The liquid pump has a fixed end located at the top of the movable plate and an input end connected to a hose;

[0057] The support tube has one end connected to the output end of the liquid pump and the other end passing through the straight hole and located above the carrier;

[0058] The liquid collecting structure is placed on the outer wall of the support tube and is located above the carrier.

[0059] The shunt pipe has an outer wall at its middle portion connected to the end of the support pipe facing away from the liquid pump, and the shunt pipe and the support pipe are arranged in a T-shape;

[0060] A plurality of outlet pipes, one end of which is spaced apart from the top of the diversion pipe and the other end of which is connected to the diversion pipe away from the diversion pipe;

[0061] and a plurality of diameter-changing structures, each of which is arranged at one end of the outlet pipe away from the diversion pipe;

[0062] The diameter-changing structure is used to change the diameter of the outflow from the outflow pipe, and the liquid collecting structure is used to collect the fallen chemical liquid.

[0063] In this technical solution, through the setting of the liquid extraction pump, the extracted chemical liquid or cleaning liquid can be transported into the support tube, and then transmitted to several outlet pipes through the diversion pipe, and finally sprayed out through the diameter-changing structure, thereby achieving chemical etching. Through the setting of the liquid collection structure, the sprayed liquid can be collected.

[0064] In the above technical solution, the liquid collecting structure further comprises:

[0065] The liquid collecting basin has its bottom end sleeved on the outer wall of the supporting tube and located above the carrier;

[0066] The liquid outlet is provided on the side wall of the bottom end of the liquid collecting basin;

[0067] and a liquid outlet pipe connected to the liquid outlet hole;

[0068] Wherein, the outflow pipe is located in the liquid collecting basin.

[0069] In this technical solution, the waste liquid flowing down from chemical etching can be collected by setting the liquid collection basin, the waste liquid can flow into the liquid outlet pipe by setting the liquid outlet hole, and the waste liquid can be discharged by setting the liquid outlet pipe.

[0070] In the above technical solution, the further said diameter-changing structure includes:

[0071] A rotating motor is arranged on the outer wall of the liquid outlet pipe;

[0072] The rotating plate is connected to the output end of the rotating motor, and the bottom end of the rotating plate is flush with the top end of the liquid outlet pipe;

[0073] and a plurality of diameter-changing blocks, circumferentially arranged on the outer side wall of the rotating plate;

[0074] Wherein, several of the diameter-changing blocks are respectively provided with liquid spray holes of different diameters.

[0075] In this technical solution, by setting the rotating motor, the rotating plate can be rotated, so that different diameter-changing blocks can be moved to the top of the liquid outlet pipe, so that chemical liquid can be discharged from spray holes of different diameters, so that chemical liquid of different diameters can be sprayed when the plate thickness is different, so that the air inlet groove and the evaporation hole can be accurately processed to prevent excessive internal stress and inaccurate processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0077] Figure 1 This is a schematic diagram of the mask structure in a specific embodiment of the present invention;

[0078] Figure 2 A cross-sectional view of a mask according to a specific embodiment of the present invention;

[0079] Figure 3 A cross-sectional view of a chemical etching device according to a specific embodiment of the present invention;

[0080] Figure 4 Specific implementation of the present invention Figure 3 Enlarged view of point A in the middle;

[0081] Figure 5 Specific implementation of the present invention Figure 3 Enlarged view of point B in the middle.

[0082] 1. Plate body; 2. Air inlet groove; 3. Evaporation hole; 4. Carrier; 5. Cleaning table; 6. Cleaning groove; 7. Chuck; 8. Straight hole; 9. Threaded rod; 10. Moving plate; 11. Driving motor; 12. First concentration box; 13. Flushing box; 14. Second concentration box; 15. First box extraction pipe; 16. Second box extraction pipe; 17. Third box extraction pipe; 18. Hose; 19. Fixed pipe; 20. First control pipe; 21. Second control pipe; 22. Main flow column; 23. Main flow groove; 24. First channel; 25. Second channel; 26. Third channel; 27. Fourth channel; 28. Liquid pump; 29. ​​Support pipe; 30. Diverter pipe; 31. Outlet pipe; 32. Liquid collecting basin; 33. Liquid outlet hole; 34. Liquid outlet pipe; 35. Rotating motor; 36. Rotating plate; 37. Diameter-changing block; 38. Liquid spray hole. DETAILED DESCRIPTION

[0083] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0084] In the description of this application, it should be noted that the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn according to the actual proportional relationship. Technologies, methods and equipment known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0085] It should be noted that the terms "first," "second," and so on, in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein. Furthermore, the objects distinguished by "first," "second," and so on generally refer to a category, and do not limit the number of objects. For example, the first object can be one or more. Furthermore, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the preceding and following objects, namely, a mask and its production process.

[0086] It should be noted that, in the description of this application, the directions or positional relationships indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise specified, these directional terms do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of this application; the directional terms "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0087] It should be noted that, in the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0088] Example 1:

[0089] This embodiment provides a mask and a production process thereof, including:

[0090] Plate 1;

[0091] A plurality of air inlet slot groups are provided at the top end of the plate body 1, and the plurality of air inlet slot groups are spaced apart along the length direction of the plate body 1, and the air inlet slot groups include a plurality of air inlet slots 2 spaced apart along the width direction of the plate body 1;

[0092] and a plurality of vapor deposition holes 3, each of which is provided at the bottom end of the plate body 1 and is connected to the bottom of the air inlet groove 2;

[0093] The air inlet groove 2 and the evaporation hole 3 are both spherical arc-shaped, and the opening of the connecting portion of the air inlet groove 2 and the evaporation hole 3 is smaller than the opening at the other end, and the top opening of the air inlet groove 2 is larger than the bottom opening of the steam hole;

[0094] By cooperating with a plurality of air inlet slots 2 and a plurality of evaporation holes 3, multiple evaporations can be achieved at one time. Since the air inlet slots 2 and the evaporation holes 3 are both arranged in a spherical arc shape, the evaporation airflow can be guided so that the evaporation gas can move regularly, thereby improving the uniformity and regularity of the evaporation.

[0095] Example 2:

[0096] In addition to the structural features of the aforementioned embodiments, this embodiment further includes the following steps:

[0097] S1: First, use a cutting device to cut out the plate body 1;

[0098] S2: Use the exposure system to perform yellow light development on the position of the plate 1 that needs to be processed;

[0099] S3: The chemical etching device clamps the plate body 1, first etches the air inlet groove group on the outermost side of the plate body 1, then processes multiple air inlet groove groups, and finally cleans and removes the plate body 1;

[0100] S4: The back side of the plate body 1 is mounted on a chemical etching device. First, the outermost side of the plate body 1 and the evaporation holes 3 corresponding to the air inlet groove 2 are processed. Then, a plurality of evaporation holes 3 are processed. Finally, the plate body 1 is cleaned and removed.

[0101] Through the setting of S1, the plate body 1 of the required size can be obtained. Through the setting of S2, the air inlet groove 2 and the distillation hole can be processed more accurately during chemical etching, and different exposure rates can be performed according to the different thicknesses of the plate body 1, so that the air inlet groove 2 and the distillation hole can be processed more accurately. Through the setting of S3, the air inlet groove group can be processed. Through the setting of S4, the evaporation hole 3 can be processed to complete the overall processing.

[0102] Example 3:

[0103] In this embodiment, in addition to the structural features of the aforementioned embodiment, the chemical etching device further includes:

[0104] A carrier 4 is provided on the ground;

[0105] A cleaning platform 5 is provided on the side wall of the carrier 4, and a cleaning tank 6 is provided on the top of the cleaning platform 5;

[0106] A horizontal movable structure is provided in the carrier 4;

[0107] The concentration adjustment mechanism is arranged on the ground inside the carrier 4;

[0108] The spray mechanism has a fixed end disposed on the horizontal movable structure, an input end passing through the horizontal movable structure and connected to the output end of the concentration adjustment mechanism, and an output end passing through the top of the carrier 4;

[0109] and a spatial moving mechanism, which is arranged at the top of the carrier 4 and the cleaning table 5, and a chuck 7 for clamping the plate 1 is provided on the output end of the spatial moving mechanism;

[0110] The top of the carrier 4 is provided with a straight hole 8 for the movement of the spray mechanism, the concentration adjustment mechanism is provided with a chemical liquid for chemical etching, and the cleaning tank 6 is provided with a cleaning liquid for cleaning the chemical liquid;

[0111] By setting up the concentration adjustment mechanism, chemical liquids of different concentrations can be placed, so that the chemical liquid sprayed by the spray mechanism can change the chemical liquid of the required output concentration according to the thickness of the plate body 1, thereby improving the internal stress of the plate body 1, so that the air intake groove 2 and the evaporation hole 3 processed by the plate body 1 are more accurate. By setting up the horizontal moving structure, the spray mechanism can be moved to the corresponding position of the plate body 1 for chemical etching. By setting up the spatial moving mechanism, the chuck 7 can be moved to the corresponding position. By setting the cleaning liquid in the cleaning tank 6, the plate body can be cleaned after the chemical etching is completed.

[0112] Example 4:

[0113] In this embodiment, in addition to the structural features of the aforementioned embodiment, the horizontal movement structure further includes:

[0114] Two threaded rods 9 are rotatably connected to the inner wall of the carrier 4 at intervals;

[0115] The movable plate 10 is threadedly connected to the two threaded rods 9;

[0116] and two drive motors 11, the fixed ends of which are arranged on the side of the carrier 4 away from the cleaning table 5, and the output ends of which pass through the carrier 4 and are respectively connected to the threaded rods 9;

[0117] Wherein, the fixed end of the spray mechanism is arranged at the top of the movable plate 10;

[0118] By setting the driving motor 11, the threaded rod 9 can be rotated, thereby driving the movable plate 10 to move horizontally.

[0119] Example 5:

[0120] In this embodiment, in addition to the structural features of the aforementioned embodiment, the concentration adjustment mechanism further includes:

[0121] The first concentration box 12 is set on the ground and located inside the carrier 4;

[0122] The flushing tank 13 is provided on the top of the first concentration tank 12;

[0123] The second concentration tank 14 is provided on the top of the flushing tank 13;

[0124] The first tank extraction pipe 15 has one end located above the second concentration tank 14 and the other end passing through the top of the second concentration tank 14 into the first concentration tank 12;

[0125] The second tank extraction pipe 16 is placed outside the first tank extraction pipe 15, and one end of the second tank extraction pipe 16 is located above the second concentration tank 14, and the other end passes through the top of the second concentration tank 14 into the flushing tank 13;

[0126] The third tank extraction pipe 17 is placed outside the second tank extraction pipe 16, and one end of the third tank extraction pipe 17 is located above the second concentration tank 14, and the other end passes through the second concentration tank 14;

[0127] The control extraction structure has an input end provided on the first tank extraction pipe 15, the second tank extraction pipe 16 and the third tank extraction pipe 17;

[0128] and a hose 18, one end of which is connected to the output end of the control extraction structure, and the other end of which passes through the movable plate 10 and is connected to the input end of the spray mechanism;

[0129] The first tank extraction pipe 15, the second tank extraction pipe 16 and the third tank extraction pipe 17 are arranged as concentric axes, and the control extraction structure is used to control the working conditions of the first tank extraction pipe 15, the second tank extraction pipe 16 and the third tank extraction pipe 17;

[0130] By setting the first concentration box 12 and the second concentration box 14, chemical liquids for chemical etching of different concentrations can be placed, by setting the flushing box 13, cleaning liquid can be placed, by setting the first box extraction pipe 15, the chemical liquid in the first concentration box 12 can be extracted, by setting the second box extraction pipe 16, cleaning liquid can be extracted, by setting the third box extraction pipe 17, the chemical liquid in the second concentration box 14 can be extracted, and by controlling the setting of the extraction structure, the extraction conditions of the first box extraction pipe 15, the second box extraction pipe 16 and the third box extraction pipe 17 can be controlled, so that the hose 18 can obtain chemical liquid input or cleaning of different concentrations.

[0131] Example 6:

[0132] In this embodiment, in addition to the structural features of the aforementioned embodiment, the control extraction structure further includes:

[0133] The fixed pipe 19 has one end inner wall connected to the top outer wall of the third tank extraction pipe 17 and the other end extending away from the third extraction pipe;

[0134] A first control tube 20 , one end of which is threadedly connected to the inner wall of the fixed tube 19 and the bottom end of which abuts against the top of the third tank extraction tube 17 , and the other end of which extends out of the fixed tube 19 ;

[0135] A second control tube 21 , one end of which is threadedly connected to the inner wall of the first control tube 20 and the bottom end of which abuts against the top of the second tank extraction tube 16 , and the other end of which extends out of the fixed tube 19 ;

[0136] The main flow column 22 has one end threadedly connected to the inner wall of the second control tube 21 and the bottom end abuts against the top of the first tank extraction tube 15, and the other end extends out of the second control tube 21;

[0137] The main flow channel 23 is provided at the top of the main flow column 22;

[0138] The first channel 24 has one end opening disposed at the bottom end of the main flow column 22 and abutting against the top end of the first tank extraction pipe 15 , and the other end connected to the main flow groove 23 ;

[0139] The second channel 25 has one end opening at the bottom of the first control tube 20 and does not interfere with the top of the third extraction tube. The other end passes through the inner wall of the first control tube 20, the second control tube 21, the main flow column 22, and is connected to the main flow groove 23.

[0140] The third channel 26 has one end opening disposed at the bottom end of the second control tube 21 and in contact with the top end of the second extraction tube, and the other end communicating with the inner wall of the second control tube 21.

[0141] and a fourth channel 27, one end of which is provided on the outer wall of the main flow column 22 and the other end of which is connected to the main flow groove 23.

[0142] The top opening of the main flow groove 23 is connected to the hose 18. When the second control pipe 21 rotates and rises, the third channel 26 is connected to the fourth channel 27. When the first control pipe 20 is fully threadedly connected to the fixed pipe 19, the top opening of the third tank extraction pipe 17 is sealed. When the second control pipe 21 is fully threadedly connected to the first control pipe 20, the top opening of the second tank extraction pipe 16 is sealed. When the main flow column 22 is fully threadedly connected to the second control pipe 21, the top opening of the first tank extraction pipe 15 is sealed.

[0143] In the initial state, when the liquid pump 28 is started, only the second channel 25 is in the open state. At this time, the liquid pump 28 extracts the chemical liquid in the second concentration box 14 through the third box extraction pipe 17. When only the second control pipe 21 is rotated to rise so that the third channel 26 is connected to the fourth channel 27, the second channel 25 is disconnected. At this time, the liquid pump 28 extracts the flushing liquid in the flushing box 13 through the second box extraction pipe 16 to clean the residual chemical liquid in the whole. When only the main column 22 is rotated to rise, the first channel 24 is opened. At this time, the liquid pump 28 extracts the chemical liquid in the flushing box 13 through the first box extraction pipe 16 to clean the residual chemical liquid in the whole. The tube 15 extracts the chemical liquid in the first concentration box 12. When the first control tube 20, the second control tube 21 and the main column 22 rise the same distance, the first channel 24 opens and the second channel 25 opens. At this time, the liquid pump 28 simultaneously extracts the chemical liquid in the first concentration box 12 and the second concentration box 14, which can neutralize the chemical liquids of different concentrations to achieve a chemical liquid of intermediate concentration. By extracting three chemical liquids of different concentrations, different concentrations of chemical liquids can be used according to the thickness of the plate 1, thereby reducing the stress of the plate 1 itself and achieving etching accuracy.

[0144] Example 7:

[0145] In this embodiment, in addition to the structural features of the aforementioned embodiment, the spray mechanism further includes:

[0146] A liquid pump 28, the fixed end of which is disposed on the top of the movable plate 10, and the input end of which is connected to the hose 18;

[0147] The support tube 29 has one end connected to the output end of the liquid pump 28 and the other end passing through the straight hole 8 and located above the carrier 4;

[0148] The liquid collecting structure is placed on the outer wall of the support tube 29 and is located above the carrier 4.

[0149] The outer wall of the middle portion of the shunt pipe 30 is connected to the end of the support pipe 29 facing away from the liquid pump 28, and the shunt pipe 30 and the support pipe 29 are arranged in a T-shape;

[0150] A plurality of outlet pipes 31, one end of which is spaced apart from the top of the diversion pipe 30 and the other end of which is connected to the diversion pipe 30;

[0151] and a plurality of diameter-changing structures, each disposed at one end of the outlet pipe 31 away from the diversion pipe 30;

[0152] The diameter-changing structure is used to change the diameter of the outflow pipe 31, and the liquid collecting structure is used to collect the fallen chemical liquid;

[0153] By setting the liquid pump 28, the extraction rate of the liquid pump 28 can be adjusted to control the rate of chemical liquid discharge to change the erosion stress. The extracted chemical liquid or cleaning liquid can also be transported to the support tube 29, and then transmitted to several outlet pipes 31 through the diversion pipe 30, and finally redirected and sprayed through the diameter-redirecting structure, thereby achieving chemical etching. By setting the liquid collection structure, the sprayed liquid can be collected.

[0154] Example 8:

[0155] In this embodiment, in addition to the structural features of the aforementioned embodiment, the liquid collecting structure further includes:

[0156] The bottom end of the liquid collecting basin 32 is placed on the outer wall of the support tube 29 and is located above the carrier 4;

[0157] The liquid outlet 33 is provided on the bottom side wall of the liquid collecting basin 32;

[0158] and a liquid outlet pipe 34 connected to the liquid outlet hole 33;

[0159] Wherein, the outflow pipe 31 is located in the liquid collection basin 32;

[0160] The liquid collecting basin 32 can collect the waste liquid from chemical etching, and the liquid outlet 33 can allow the waste liquid to flow into the liquid outlet pipe 34 , which can then discharge the waste liquid.

[0161] Example 9:

[0162] In this embodiment, in addition to the structural features of the aforementioned embodiment, the diameter-changing structure further includes:

[0163] The rotating motor 35 is provided on the outer wall of the liquid outlet pipe 34;

[0164] The rotating plate 36 is connected to the output end of the rotating motor 35, and the bottom end of the rotating plate 36 is flush with the top end of the liquid outlet pipe 34;

[0165] and a plurality of diameter-changing blocks 37 circumferentially arranged on the outer side wall of the rotating plate 36;

[0166] Among them, several of the diameter-changing blocks 37 are respectively provided with spray holes 38 of different diameters;

[0167] By setting the rotating motor 35, the rotating plate 36 can be rotated, so that different diameter-changing blocks 37 can be moved to the top of the liquid outlet pipe 34, so that chemical liquid can be discharged from the spray holes 38 of different diameters, so that chemical liquid of different diameters can be sprayed when the thickness of the plate body 1 is different, so that the air inlet groove 2 and the evaporation hole 3 can be accurately processed to prevent excessive internal stress and inaccurate processing.

[0168] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A mask production process, characterized in that: The mask includes: include: plate(1); A plurality of air inlet groove groups are arranged at the top end of the plate body (1), and the plurality of air inlet groove groups are arranged at intervals along the length direction of the plate body (1), and the air inlet groove groups include a plurality of air inlet grooves (2) arranged at intervals along the width direction of the plate body (1); and a plurality of vapor deposition holes (3), which are respectively arranged at the bottom end of the plate body (1) and are connected to the bottom of the air inlet groove (2); The air inlet groove (2) and the vapor deposition hole (3) are both spherical arc-shaped, and the opening of the portion where the air inlet groove (2) communicates with the vapor deposition hole (3) is smaller than the opening at the other end, and the top opening of the air inlet groove (2) is larger than the bottom opening of the steam hole; The production process includes the following steps: S1: First, a cutting device is used to cut out a plate body (1); S2: Using an exposure system to perform yellow light development on the position of the plate (1) that needs to be processed; S3: The chemical etching device clamps the plate body (1), first etches the air inlet groove group on the outermost side of the plate body (1), then processes multiple air inlet groove groups, and finally cleans and removes the plate body (1); S4: The reverse side of the plate body (1) is mounted on a chemical etching device, and the outermost side of the plate body (1) and the vapor deposition hole (3) corresponding to the air inlet groove (2) are first processed, and then a plurality of vapor deposition holes (3) are processed, and finally the plate body (1) is cleaned and removed; The chemical etching device comprises: A carrier (4) is arranged on the ground; A cleaning table (5) is arranged on the side wall of the carrier (4), and a cleaning tank (6) is provided on the top of the cleaning table (5); A horizontal movable structure is arranged in the carrier (4); A concentration adjustment mechanism is arranged on the ground inside the carrier (4); The spray mechanism has a fixed end arranged on the horizontal movable structure, an input end passing through the horizontal movable structure and connected to the output end of the concentration regulating mechanism, and an output end passing through the top of the carrier (4); and a spatial moving mechanism, which is arranged at the top of the carrier (4) and the cleaning table (5), and a chuck (7) for clamping the plate (1) is provided at the output end of the spatial moving mechanism; The top of the carrier (4) is provided with a straight hole (8) for the movement of the spray mechanism, the concentration adjustment mechanism is provided with a chemical liquid for chemical etching, and the cleaning tank (6) is provided with a cleaning liquid for cleaning the chemical liquid; The concentration adjustment mechanism includes: A first concentration box (12) is disposed on the ground and located inside the carrier (4); A flushing tank (13) is provided on the top of the first concentration tank (12); A second concentration box (14) is provided at the top of the flushing box (13); A first tank extraction pipe (15), one end of which is located above the second concentration tank (14), and the other end of which passes through the top of the second concentration tank (14) into the first concentration tank (12); The second tank extraction pipe (16) is placed outside the first tank extraction pipe (15), and one end of the second tank extraction pipe (16) is located above the second concentration tank (14), and the other end passes through the top of the second concentration tank (14) into the flushing tank (13); The third tank extraction pipe (17) is placed outside the second tank extraction pipe (16), and one end of the third tank extraction pipe (17) is located above the second concentration tank (14), and the other end passes through the second concentration tank (14); The control extraction structure has an input end provided on the first tank extraction pipe (15), the second tank extraction pipe (16) and the third tank extraction pipe (17); and a hose (18), one end of which is connected to the output end of the control extraction structure, and the other end of which passes through the movable plate (10) and is connected to the input end of the spray mechanism; The first tank extraction pipe (15), the second tank extraction pipe (16) and the third tank extraction pipe (17) are arranged on a concentric axis, and the control extraction structure is used to control the working conditions of the first tank extraction pipe (15), the second tank extraction pipe (16) and the third tank extraction pipe (17); The control extraction structure includes: A fixed tube (19), one end of which has an inner wall connected to the outer wall of the top end of the third tank extraction tube (17) and the other end of which extends away from the third tank extraction tube; A first control tube (20), one end of which is threadedly connected to the inner wall of the fixed tube (19) and the bottom end of which abuts against the top end of the third tank extraction tube (17), and the other end of which extends out of the fixed tube (19); A second control tube (21), one end of which is threadedly connected to the inner wall of the first control tube (20) and the bottom end of which abuts against the top end of the second tank extraction tube (16), and the other end of which extends out of the fixed tube (19); A main flow column (22), one end of which is threadedly connected to the inner wall of the second control tube (21) and the bottom end of which abuts against the top end of the first tank extraction tube (15), and the other end of which extends out of the second control tube (21); A main flow groove (23) is provided at the top of the main flow column (22); A first channel (24) has one end opening disposed at the bottom end of the main flow column (22) and in contact with the top end of the first tank extraction pipe (15), and the other end connected to the main flow trough (23); A second channel (25) has one end opening disposed at the bottom end of the first control tube (20) and not in conflict with the top end of the third extraction tube, and the other end sequentially passes through the inner wall of the first control tube (20), the second control tube (21), the main flow column (22), and is connected to the main flow groove (23); The third channel (26) has one end opening disposed at the bottom end of the second control tube (21) and in contact with the top end of the second extraction tube, and the other end communicating with the inner wall of the second control tube (21). and a fourth channel (27), one end of which is provided on the outer side wall of the main flow column (22) and the other end of which is connected to the main flow groove (23). The top opening of the main flow groove (23) is connected to the hose (18). When the second control tube (21) rotates and rises, the third channel (26) is connected to the fourth channel (27). When the first control tube (20) is completely threadedly connected to the fixed tube (19), the top opening of the third tank extraction tube (17) is sealed. When the second control tube (21) is completely threadedly connected to the first control tube (20), the top opening of the second tank extraction tube (16) is sealed. When the main flow column (22) is completely threadedly connected to the second control tube (21), the top opening of the first tank extraction tube (15) is sealed.

2. A mask production process according to claim 1, characterized in that: The horizontal movement structure includes: Two threaded rods (9) are rotatably connected to the inner wall of the carrier (4) at intervals; A movable plate (10) is threadedly connected to the two threaded rods (9); and two driving motors (11), the fixed ends of which are arranged on the side of the carrier (4) facing away from the cleaning table (5), and the output ends of which pass through the carrier (4) and are respectively connected to the threaded rods (9); Wherein, the fixed end of the spray mechanism is arranged at the top end of the movable plate (10).

3. The production process of a mask according to claim 2, characterized in that: The spray mechanism comprises: A liquid pump (28) having a fixed end disposed on the top of the movable plate (10) and an input end connected to the hose (18); A support tube (29), one end of which is connected to the output end of the liquid pump (28), and the other end of which passes through the straight hole (8) and is located above the carrier (4); The liquid collecting structure is placed on the outer wall of the support tube (29) and is located above the carrier (4). The shunt pipe (30) has an outer wall at its middle portion connected to an end of the support pipe (29) facing away from the liquid pump (28), and the shunt pipe (30) and the support pipe (29) are arranged in a T-shape; A plurality of outlet pipes (31), one end of which is spaced apart from the top of the diversion pipe (30) and the other end of which is connected to the diversion pipe (30); and a plurality of diameter-changing structures, each of which is provided at one end of the outlet pipe (31) away from the diversion pipe (30); The diameter-changing structure is used to change the diameter of the outflow pipe (31), and the liquid collecting structure is used to collect the fallen chemical liquid.

4. A mask production process according to claim 3, characterized in that: The liquid collecting structure comprises: A liquid collecting basin (32) with its bottom end sleeved on the outer wall of the support tube (29) and located above the carrier (4); A liquid outlet hole (33) is provided on the side wall of the bottom end of the liquid collecting basin (32); and a liquid outlet pipe (34) connected to the liquid outlet hole (33); Wherein, the outflow pipe (31) is located in the liquid collection basin (32).

5. The production process of a mask according to claim 3, characterized in that: The diameter-changing structure comprises: A rotating motor (35) is provided on the outer side wall of the liquid outlet pipe (34); The rotating plate (36) is connected to the output end of the rotating motor (35), and the bottom end of the rotating plate (36) is flush with the top end of the liquid outlet pipe (34); and a plurality of diameter-changing blocks (37) circumferentially arranged on the outer side wall of the rotating plate (36); Wherein, a plurality of the diameter-changing blocks (37) are respectively provided with liquid spray holes (38) with different diameters.

Citation Information

Patent Citations

  • Precise metal mask for evaporation and multi-process etching manufacturing method thereof

    CN113265617A

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