A method for preparing an ultra-thin liquid crystal touch screen substrate

Abstract

The application belongs to the technical field of ultra-thin liquid crystal touch screen and discloses an ultra-thin liquid crystal touch screen substrate preparation method. A pattern area (2) is formed on a substrate (1), and a blank area (3) is arranged between the pattern area (2) and the edge of the substrate (1). A glue layer (4) is applied to the edge of each substrate (1), and the glue layer (4) passes through the blank area (3). The pattern area (2) of two substrates (1) is encapsulated in a cavity (5) by the glue layer (4). The two substrates (1) adhered together are subjected to acid etching. The two substrates (1) after acid etching are cut, and the substrate parts with the pattern area (2) are separated from the substrate (1). The ultra-thin liquid crystal touch screen substrate preparation method effectively solves the production of the ultra-thin liquid crystal touch screen, the front-end production of the substrate circuit and the pattern area, eliminates the problem that the production machine table has a very high requirement on the subsequent touch screen circuit production, reduces the manufacturing loss rate in the substrate preparation process, and improves the preparation efficiency.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of ultra-thin liquid crystal touch screen, more particularly, to an ultra-thin liquid crystal touch screen substrate preparation method. BACKGROUND

[0002] With the development of the touch screen industry, the increasing demand of consumers for outdoor display, liquid crystal touch screens gradually become the mainstream touch screen of various activity display devices, and ultra-thin substrate products gradually occupy a huge market. The graphic production technology on the ultra-thin substrate becomes the top priority. The significance of substrate thinning: 1. Reducing the weight of the display screen to provide clearer and brighter image quality. 2. Reducing the occupied space and the thickness of the display module to leave more space, such as increasing the battery capacity. 3. Making the glass substrate flexible to produce curved screens and increase the better visual effect. The traditional thinning process is: substrate taking → sealing glue → acid etching → grinding → cutting → subsequent production of circuit patterns; the sealing glue process is further divided into: covering acid-proof film, using UV glue to bond the substrate and the cover plate → wiping glue → UV curing. According to the traditional process sequence, the subsequent touch screen circuit production requires high production equipment, and many companies are limited by the equipment and cannot participate in the production of mainstream products; moreover, the traditional process sequence greatly reduces the production efficiency of products. Defects of the prior art: limited by the ability of UV glue, only single-sided thinning can be performed, and the production efficiency is slow. The production of touch screen glass line according to the traditional process sequence cannot produce very thin glass, and the production of touch screen circuit becomes a problem; double-sided thinning has high requirements for UV glue, and the cost of replacing new UV glue is high; during the process production, the thin substrate will greatly increase the damage.

[0003] In the prior art, a technology named "Preparation method of touch screen and touch screen" with publication number "CN111475061A" is disclosed. The preparation method of the touch screen includes: providing a substrate, the substrate includes a visual area and a non-visual area; the substrate is provided with a first conductive material layer covering the visual area and the non-visual area; a first non-visual area trace is formed on the first conductive material layer located in the non-visual area; the first conductive material layer is patterned to form a touch electrode line located in the visual area and a second non-visual area trace located in the non-visual area; in the direction perpendicular to the substrate, the projection of the first non-visual area trace is located in the projection of the second non-visual area trace. Compared with the prior art, the embodiment of the application reduces the frame of the touch screen.

[0004] However, the technology does not involve the technical problems and technical solutions of the present application. SUMMARY

[0005] The technical problem to be solved by the present application is: in view of the deficiencies of the prior art, a super-thin liquid crystal touch screen substrate preparation method is provided, which can effectively solve the production of super-thin liquid crystal touch screens, pre-produce substrate lines and pattern areas, eliminate the high requirement of production equipment during subsequent touch screen line production, reduce the damage rate during substrate preparation, and improve the preparation efficiency.

[0006] To solve the above technical problems, the technical solution adopted by the present application is:

[0007] The present application is a super-thin liquid crystal touch screen substrate preparation method, wherein the thinning step of the super-thin liquid crystal touch screen substrate preparation method is:

[0008] S1. Form a pattern area on the substrate, the pattern area is close to the edge of the substrate, and a blank area is arranged between the pattern area and the edge of the substrate;

[0009] S2. Apply a glue layer to the edge of the pattern area of each substrate, and the glue layer passes through the blank area between the pattern area and the edge of the substrate;

[0010] S3. Stick the glue layers of the two substrates, and the glue layer encapsulates the pattern areas of the two substrates in the cavity formed by the glue layer and the two substrates;

[0011] S4. Acid etching the two substrates stuck together;

[0012] S5. Cutting the two substrates after acid etching, cutting along the pattern area edge line of the pattern area, separating the two pattern area substrate parts from the substrate, and forming two pieces of super-thin liquid crystal touch screen products.

[0013] The substrate is a square structure, and the pattern area is a square structure.

[0014] The blank area is formed between the pattern area side edge I of the pattern area side and the substrate side edge I of the substrate side, and the blank area is formed between the pattern area side edge II of the pattern area side and the substrate side edge II of the substrate side.

[0015] The substrate includes four substrate side edges, and the pattern area includes four pattern area side edges. A glue layer is applied to the edge of the pattern area of each substrate along the edge of each substrate side edge, and a blank area is formed on each substrate side edge of the substrate provided with the pattern area side. The glue layer is applied to form a glue layer protection part in the form of a square frame.

[0016] The width of the blank area is ≥5mm.

[0017] The glue layer includes an inner glue layer and an edge glue layer.

[0018] The inner rubber layer is formed on the side of each substrate along the edge of the patterned region.

[0019] The edge rubber layer is wrapped around the two substrates from the outer side of the two substrates to the outer side of the two substrates, and the cross section of the edge rubber layer is in a U-shaped structure.

[0020] The cutting is performed by laser cutting, and the laser cutting is performed from the side of one substrate without a patterned region along the edge of the patterned region to separate the substrate from the substrate with the patterned region, and each substrate with the patterned region forms a piece of ultra-thin liquid crystal touch screen product.

[0021] The line preparation is completed before forming the patterned region on the substrate.

[0022] The technical scheme of the present application has the following working principle and beneficial effects:

[0023] The ultra-thin liquid crystal touch screen substrate preparation method of the present application changes the existing process step sequence, and the substrate is first routed and patterned, and then thinned. When the substrate is set, the size of the substrate is set to be larger than the conventional size, which facilitates the formation of a blank area and the formation of a rubber layer on the edge of the substrate. When thinning, the two substrates are adhered at the edge position by the rubber layer. In this way, the patterned region of each substrate is adhered together and encapsulated in the cavity formed by the rubber layer and the two substrates. During the acid etching and thinning process, the rubber layer forms a seal, and the acid solution cannot enter the cavity, so it will not damage the patterned region. The acid solution etches the non-patterned region on the outside of each substrate, thereby completing the thinning of the set size. After thinning, the substrate is cut. The cutting needs to cut the size of the patterned region, so the cutting is performed from the outside of the substrate and along the edge of the patterned region. The cut part is the substrate with the patterned region. In this way, etching and cutting of two substrates are realized at a time, improving the cutting efficiency. After cutting, the two substrate products are peeled off. The production process is completed. The preparation method of the present application can conveniently and reliably complete the thinning of the ultra-thin substrate by a specific process. 1. The thinning effect is good and does not affect the performance of the substrate. 2. Because the two substrates are adhered during thinning, the thickness is improved, which facilitates etching and cutting of the substrate, greatly reducing the high damage caused by the thin substrate during production. 3. The structure of the rubber layer can effectively protect the patterned region of the substrate without the need to replace the high-cost UV glue material, effectively protecting the patterned region of the substrate from damage during etching. 4. Laser cutting accurately controls the size of the product, ensures the flatness of the product edge, and improves the performance. BRIEF DESCRIPTION OF DRAWINGS

[0024] The following is a brief description of the content expressed by each figure in the specification and the labels in the figures:

[0025] Figure 1 Structure diagram of the substrate before cutting according to the present application;

[0026] Figure 2 Structure diagram of the substrate after forming the glue layer before cutting according to the present application;

[0027] Figure 3 Structure diagram of the two pieces of substrate before sticking according to the present application;

[0028] Figure 4 Structure diagram of the two pieces of substrate after sticking according to the present application;

[0029] The labels in the figures are as follows: 1, substrate; 2, graphic area; 3, blank area; 4, glue layer; 5, cavity; 6, graphic area edge line; 7, graphic area side edge I; 8, substrate side edge I; 9, graphic area side edge II; 10, substrate side edge II; 11, inner side glue layer; 12, edge glue layer. DETAILED DESCRIPTION

[0030] The following is a further detailed description of the specific embodiments of the present application, such as the shape, structure, mutual position and connection relationship between the parts, the function and working principle of each component involved, etc., by comparing the figures and describing the embodiments:

[0031] As shown in the accompanying Figure 1 - the accompanying Figure 4 The present application is a method for preparing an ultra-thin liquid crystal touch screen substrate, wherein the thinning step of the method is:

[0032] S1. Forming a pattern area 2 on the substrate 1, the pattern area 2 is close to the edge of the substrate 1, and a blank area 3 is arranged between the pattern area 2 and the edge of the substrate 1; S2. Applying a glue layer 4 on the edge of the substrate 1 on one side of the pattern area 2 of each substrate 1, and the glue layer 4 passes through the blank area 3 between the pattern area 2 and the edge of the substrate 1; S3. Adhering the glue layers 4 of the two substrates 1, and the glue layer 4 encapsulates the pattern areas 2 of the two substrates 1 in the cavity 5 formed by the glue layer 4 and the two substrates 1; S4. Acid etching the two adhered substrates 1; S5. Cutting the two acid-etched substrates 1, and cutting along the pattern area edge line 6 of the pattern area 2 to separate the substrate parts with the pattern area 2 from the substrate 1, and form two pieces of finished super-thin liquid crystal touch screen products. The above structure improves the technical solution for the deficiencies in the prior art. The process steps are completely changed from the existing process step sequence, the substrate is first routed and patterned, and then thinned; when the substrate is set, the size of the substrate is set to be larger than the conventional size, which facilitates the formation of a blank area and the application of glue on the edge of the substrate to form a glue layer. When thinning, the two substrates are adhered at the edge position through the glue layer, so that the pattern areas of each substrate are adhered together and encapsulated in the cavity 5 formed by the glue layer 4 and the two substrates 1. During the acid etching and thinning process, the glue layer 4 forms a seal, and the acid solution cannot enter the cavity 5, so the pattern area 2 is not damaged, the pattern area is effectively protected, and the acid solution etches the non-pattern area of each substrate 1 located on the outside, thereby completing the thinning of the set size. After thinning, the substrate 1 is cut, and the size of the area where the pattern area is set is cut down, so the cutting is performed from the outside of the substrate, and the cutting is performed along the pattern area edge line 6 of the pattern area 2, and the cut part is the substrate part with the pattern area. In this way, etching and cutting of two substrates are realized each time, improving the cutting efficiency. After cutting, the two substrate products are peeled off; the production process is completed. The preparation method of the present application can conveniently and reliably complete the thinning of the super-thin substrate through a specific process, 1. The thinning effect is good, and the substrate performance is not affected; 2. Because the two substrates are adhered during thinning, the thickness is improved, the etching and cutting of the substrate are facilitated, and the high production damage caused by the thin substrate is greatly reduced; 3. The structure of the glue layer can effectively protect the pattern area of the substrate without replacing the high-cost UV glue material, effectively protect the pattern area of the substrate, and avoid damage during etching; 4. Laser cutting can accurately control the product size, ensure the flatness of the product edge, and improve the performance.The preparation method of the ultra-thin liquid crystal touch screen substrate has simple steps, effectively solves the production of the ultra-thin liquid crystal touch screen, and pre-positions the substrate circuit and the pattern area, eliminates the problem that the production machine table has high requirements during subsequent touch screen circuit production, reduces the damage rate during the substrate preparation process, and improves the preparation efficiency.

[0033] The substrate 1 is a square structure, and the pattern area 2 is also a square structure. The steps of the present application can be applied to the thinning of substrates of different sizes and models. According to the method of the present application, the length and width dimensions of the substrate need to be slightly larger than the length and width dimensions of the pattern area, so that a blank area is formed, and a glue layer is formed on the edge of the substrate.

[0034] The blank area 3 is formed between the pattern area side edge I 7 on one side of the pattern area 2 and the substrate side edge I 8 on one side of the substrate 1, and the blank area 3 is formed between the pattern area side edge II 9 on one side of the pattern area 2 and the substrate side edge II 10 on one side of the substrate 1. The above structure has specific requirements for the setting position of the pattern area on the substrate, and the basic point is to have a blank area, so that glue can be applied in the blank area, and the adhesion and sealing of the two substrates can be realized.

[0035] The substrate 1 includes four substrate side edges, and the pattern area 2 includes four pattern area side edges. A glue layer 4 is applied to the edge of each substrate side edge of the substrate on which the pattern area 2 is arranged. The edge of each substrate side edge of the substrate on which the pattern area 2 is arranged forms a blank area, and the glue layer 4 is applied to form a glue layer protection part in the form of a square frame.

[0036] The width dimension of the blank area 3 is greater than or equal to 5 mm. The width dimension of the blank area facilitates the application of a glue layer with a corresponding width, so as to ensure reliable sealing of the two substrates after adhesion.

[0037] The glue layer 4 includes an inner glue layer 11 and an edge glue layer 12. The inner glue layer 11 is applied to the edge of each substrate side edge of the substrate on which the pattern area 2 is arranged. The edge glue layer 12 wraps the two substrates from the outer edges of the two substrates and around the outer edges of the two substrates, and the cross section of the edge glue layer 12 is in the form of a U-shaped structure. The glue layer 4 includes the inner glue layer 11 and the edge glue layer 12. The inner glue layer 11 is located at the edge of the two adhesively connected substrates, and the edge glue layer 12 reliably seals the two substrates. In this way, the structure of the glue layer is improved, and liquid leakage caused by gaps between the two substrates is avoided.

[0038] The cutting adopts laser cutting, and the laser cutting cuts from one side of the substrate 1 without the graphic area 2 along the graphic area edge line 6, separates the substrate part with the graphic area 2 from the substrate 1, and forms a piece of ultra-thin liquid crystal touch screen product.

[0039] The preparation method of the ultra-thin liquid crystal touch screen substrate changes the existing process step sequence, first makes the line and the graphic area of the substrate 1, then adheres the two pieces, and then enters the acid liquid for thinning process sequence; the size of the substrate is set to be larger than the conventional size, which is convenient for forming a blank area and forming a glue layer on the edge of the substrate. When thinning, the two pieces of substrate are adhered at the edge position through the glue layer, so that the graphic area of each piece of substrate is adhered together and encapsulated in the cavity 5 formed by the glue layer 4 and the two pieces of substrate 1. In the acid etching thinning process, the glue layer 4 forms a seal, and the acid liquid cannot enter the cavity 5, so the graphic area 2 is not damaged, and the graphic area is effectively protected. The acid liquid etches the non-graphic area of each piece of substrate 1 located outside, thereby completing the thinning of the set size. After thinning, the substrate 1 is cut, and the area of the graphic area is set during cutting, so the cutting is performed from the outside of the substrate, and the cutting is performed along the graphic area edge line 6 of the graphic area 2. The cut part is the substrate part with the graphic area. In this way, etching and cutting of two pieces of substrate are realized each time, and the cutting efficiency is improved. After cutting, the two pieces of substrate product are peeled off; thus, the production process is completed. The preparation method of the present application can conveniently and reliably complete the thinning of the ultra-thin substrate by a specific process, 1. The thinning effect is good, and the substrate performance is not affected; 2. Because the two pieces of substrate are adhered during thinning, the thickness is improved, the etching and cutting of the substrate are facilitated, and the high damage caused by the thin substrate during production is greatly reduced; 3. The structure of the glue layer can effectively protect the graphic area of the substrate without replacing the high-cost UV glue material, effectively protect the graphic area of the substrate, and avoid damage during etching; 4. Laser cutting can accurately control the product size and ensure the flatness of the product edge, and improve the performance.

[0040] The above describes the present application in conjunction with the drawings, and it is obvious that the specific implementation of the present application is not limited by the above method. Various improvements or direct application of the concept and technical solution of the present application to other occasions are within the protection scope of the present application.

Claims

1. A method for preparing an ultra-thin liquid crystal touch screen substrate, characterized in that: The thinning step in the method for preparing the ultra-thin liquid crystal touch screen substrate is as follows: S1. A patterned area (2) is formed on a substrate (1), the patterned area (2) is close to the edge of the substrate (1), and a blank area (3) is provided between the patterned area (2) and the edge of the substrate (1). S2. Apply adhesive layer (4) to the edge of the side of the patterned area (2) on each substrate (1), and the adhesive layer (4) passes through the blank area (3) between the patterned area (2) and the edge of the substrate (1). S3. Adhesive layer (4) of two substrates (1) is bonded together, and adhesive layer (4) encapsulates the pattern area (2) of the two substrates (1) in the cavity (5) formed by adhesive layer (4) and the two substrates (1); S4. Acid etching is performed on the two substrates (1) that are bonded together; S5. Cut the two substrates (1) after acid etching, cut along the edge (6) of the graphic area (2), separate the two substrates with graphic area (2) from the substrate (1) to form two ultra-thin LCD touch screen products. A blank area (3) is formed between the side edge I (7) of the graphic area (2) on one side and the side edge I (8) of the substrate (1) on the other side. A blank area (3) is formed between the side edge II (9) of the graphic area (2) on one side and the side edge II (10) of the substrate (1) on the other side. The substrate (1) includes four substrate sides, and the pattern area (2) includes four pattern area sides. On the side of each substrate (1) where the pattern area (2) is set, an adhesive layer (4) is applied along the edge of each substrate side. A blank area (3) is formed on the edge of each substrate (1) where the pattern area (2) is set. An adhesive layer (4) is applied to the four blank areas (3) to form a square structure adhesive layer protection part.

2. The method for preparing an ultra-thin liquid crystal touch screen substrate according to claim 1, characterized in that: The substrate (1) is square and the graphic area (2) is square.

3. The method for preparing an ultra-thin liquid crystal touch screen substrate according to claim 1 or 2, characterized in that: The width of the blank area (3) is ≥5mm.

4. The method for preparing an ultra-thin liquid crystal touch screen substrate according to claim 1 or 2, characterized in that: The adhesive layer (4) includes an inner adhesive layer (11) and an edge adhesive layer (12).

5. The method for preparing an ultra-thin liquid crystal touch screen substrate according to claim 4, characterized in that: The inner adhesive layer (11) is formed by applying the patterned area (2) on one side of each substrate (1) along the edge of each substrate.

6. The method for preparing an ultra-thin liquid crystal touch screen substrate according to claim 5, characterized in that: The edge adhesive layer (12) wraps around the outer edges of the two substrates (1) from the outer edges of the two substrates (1), and the cross-section of the edge adhesive layer (12) is U-shaped.

7. The method for preparing an ultra-thin liquid crystal touch screen substrate according to claim 1 or 2, characterized in that: The cutting is done by laser cutting. During laser cutting, the substrate (1) is cut along the edge (6) of the graphic area from the side without the graphic area (2). The two substrates with graphic areas (2) are separated from the substrate (1). Each substrate with graphic area (2) forms an ultra-thin LCD touch screen product.

8. The method for preparing an ultra-thin liquid crystal touch screen substrate according to claim 1 or 2, characterized in that: The circuit fabrication is completed before the patterned area (2) is formed on the substrate (1).

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