A wafer test data processing method, device, medium and electronic equipment

Abstract

The application provides a wafer test data processing method and device, medium and electronic equipment. The application first generates reference information of any shape in a test target according to a small amount of detection points meeting the requirements and test traces on the corresponding detection points, and then analyzes all detection points and test traces of the shape in the wafer through the reference information of the shape, and screens out detection point information and test trace information meeting the reference information as preparation data. The generated reference information not only includes a first aspect ratio value range for judging the detection point and a second aspect ratio value range for judging the test trace, but also includes a position relationship range of the detection point and the test trace. The range in various constraint conditions is used as the analysis basis, which can effectively avoid misjudgment and omission, and improve the analysis accuracy. Through the above method, the data processing time is saved, the test efficiency is improved, and the low efficiency of manual processing is solved.

Description

Technical Field

[0001] This application relates to the field of wafer inspection technology, and more specifically, to a data processing method, apparatus, medium, and electronic equipment for wafer testing. Background Technology

[0002] Probe testing is a method of testing by inserting a probe into a test point, and it is an important step in wafer testing. Data preparation is an essential step in wafer testing, which involves recording the test point information and test trace information on the wafer for use in automated test trace detection.

[0003] Currently, data preparation for wafer testing is mainly done manually. This process is time-consuming, tedious, and prone to errors, which can seriously affect product yield.

[0004] Therefore, this application provides a data processing method for wafer testing to solve one of the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a data processing method, apparatus, medium, and electronic device for wafer testing, which can solve at least one of the technical problems mentioned above. The specific solution is as follows:

[0006] According to a specific embodiment of this application, in a first aspect, this application provides a data processing method for wafer testing, including:

[0007] After a test pin is applied to any test target in the wafer, a first image is acquired by an imaging device, wherein the first image matches a first area photographed by the imaging device in a preset planar coordinate system.

[0008] Based on the location of the first region and the first image, determine the first detection information of a plurality of first detection points of any shape and the first test trace information of the first test trace on the corresponding first detection point, wherein the first detection point satisfies a preset first detection condition and the first test trace satisfies a preset second detection condition.

[0009] The reference information of the shape in the preset planar coordinate system is determined based on the first detection information of the plurality of first detection points and the first test trace information of the plurality of first test traces;

[0010] Based on the reference information, the second detection information of all second detection points of the shape in the wafer and the second test trace information of the corresponding second test traces on the second detection points are analyzed;

[0011] When the second detection information of any second detection point and the second test trace information of the corresponding second test trace on the second detection point satisfy the reference information, the second detection information of the second detection point and the second test trace information of the corresponding second test trace on the second detection point are determined as preparation data.

[0012] According to a specific embodiment of this application, in a second aspect, this application provides a data processing apparatus for wafer testing, comprising:

[0013] An image capturing unit is used to acquire a first image through an image device after a test pin is inserted into any test target in the wafer, wherein the first image matches a first area photographed by the image device in a preset planar coordinate system;

[0014] An information determination unit is used to determine, based on the first region location of the first region and the first image, first detection information of a plurality of first detection points of any shape and first test trace information of the first test trace on the corresponding first detection point, wherein the first detection point satisfies a preset first detection condition and the first test trace satisfies a preset second detection condition.

[0015] A standard determination unit is used to determine the reference information of the shape in a preset planar coordinate system based on the first detection information of the plurality of first detection points and the first test trace information of the plurality of first test traces;

[0016] An analysis unit is used to analyze, based on the reference information, the second detection information of all second detection points of the shape in the wafer and the second test trace information of the corresponding second test traces on the second detection points;

[0017] The data determination unit is used to determine the second detection information of the second detection point and the second test trace information of the second test trace corresponding to the second detection point as preparation data when the second detection information of any second detection point and the second test trace information of the second test trace on the corresponding second detection point satisfy the reference information.

[0018] According to a specific embodiment of this application, in a third aspect, this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the data processing method for wafer testing as described in any of the preceding claims.

[0019] According to a specific embodiment of this application, in a fourth aspect, this application provides an electronic device, including: one or more processors; and a storage device for storing one or more programs, which, when executed by the one or more processors, cause the one or more processors to implement the wafer testing data processing method as described in any of the preceding claims.

[0020] Compared with the prior art, the above-described solutions of this application have at least the following beneficial effects:

[0021] This application provides a data processing method, apparatus, medium, and electronic device for wafer testing. First, this application generates reference information for any shape within the test target based on a small number of satisfactory detection points and corresponding test traces on those detection points. Then, it analyzes all detection points and test traces of that shape on the wafer using the reference information, filtering out detection point information and test trace information that meet the reference information as preparatory data. The generated reference information includes not only a first aspect ratio range for judging detection points and a second aspect ratio range for judging test traces, but also the range of positional relationships between detection points and test traces. By using ranges from various constraints as the basis for analysis, data redundancy is improved, effectively avoiding misjudgments and omissions, and improving analysis accuracy. This method significantly saves data processing time, improves testing efficiency, and solves the inefficiency problem of manual processing. Attached Figure Description

[0022] Figure 1 A flowchart of a data processing method for wafer testing according to an embodiment of this application is shown;

[0023] Figure 2 A schematic diagram of a first detection point and a first test mark in a preset planar coordinate system according to an embodiment of this application is shown;

[0024] Figure 3 A unit block diagram of a data processing apparatus for wafer testing according to an embodiment of this application is shown;

[0025] Figure 4 A schematic diagram of an electronic device connection structure provided according to an embodiment of this application is shown. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “said,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, and “multiple” generally includes at least two unless the context clearly indicates otherwise.

[0028] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0029] It should be understood that although the terms first, second, third, etc., may be used in the embodiments of this application, these descriptions should not be limited to these terms. These terms are only used to distinguish the descriptions. For example, first may also be referred to as second without departing from the scope of the embodiments of this application, and similarly, second may also be referred to as first.

[0030] Depending on the context, the words “if” or “suppose” as used here can be interpreted as “when” or “in response to determination” or “in response to detection.” Similarly, depending on the context, the phrases “if determination” or “if detection (of the stated condition or event)” can be interpreted as “when determination” or “in response to determination” or “when detection (of the stated condition or event)” or “in response to detection (of the stated condition or event).”

[0031] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or device that includes said element.

[0032] It should be noted that any symbols and / or numbers present in the specification that are not marked in the accompanying drawings are not reference numerals.

[0033] The optional embodiments of this application are described in detail below with reference to the accompanying drawings.

[0034] The embodiments provided in this application are embodiments of a data processing method for wafer testing.

[0035] The following is combined Figure 1 The embodiments of this application will be described in detail.

[0036] Step S101: After puncturing any test target in the wafer, acquire a first image through an imaging device.

[0037] The test probe is a preparatory step before testing the wafer. No testing is performed during this process; simply placing test points on the wafer onto probes on a probe board is sufficient. After the test probe is applied, test marks will be left on some test points. This application embodiment uses images captured by an imaging device, including a camera, to collect information about the test points and test marks after the test probe application.

[0038] The preset planar coordinate system is parallel to the plane on which the wafer lies. It can be a planar coordinate system provided by the customer or a planar coordinate system set in advance before testing. Optionally, the preset planar coordinate system is set on the plane on which the wafer lies.

[0039] To collect information on all inspection points and test traces on the wafer, the wafer needs to be divided into multiple sequentially arranged segments in a preset planar coordinate system. Each segment corresponds to the imaging area of ​​an image device. Specifically, the first image corresponds to the first area captured by the image device in the preset planar coordinate system. This can be understood as the image device generating the first image on the wafer's imaging area, which, when projected onto the preset planar coordinate system, becomes the first area. For example, the first area in the preset planar coordinate system is also located on the wafer, and the first image captured by the image device will cover this first area. This application embodiment will primarily describe the preset planar coordinate system set on the plane where the wafer is located. Those skilled in the art can reasonably deduce and project various relevant information onto other planar coordinate systems to obtain the same conclusions as in this application embodiment.

[0040] If images taken from multiple sequentially arranged segmented regions are stitched together, an image of the entire wafer can be generated.

[0041] Step S102: Based on the first region location of the first region and the first image, determine the first detection information of a plurality of first detection points of any shape and the first test trace information of the first test trace on the corresponding first detection point.

[0042] In this embodiment of the application, the test mark on the corresponding detection point refers to the test mark being stuck on the detection point.

[0043] In this application embodiment, the detection points are classified according to their appearance. For example, the shapes of the detection points include: circular detection points, rectangular detection points, elliptical detection points, and irregularly shaped detection points.

[0044] This application embodiment uses this method to prepare data for detection points of any one of the multiple shapes in a wafer, but does not affect the simultaneous use of this method to prepare data for detection points of at least one other shape.

[0045] Wherein, the first detection point meets the preset first detection condition, and the first test trace meets the preset second detection condition.

[0046] The preset first detection condition refers to the condition under which the detection point can perform subsequent automatic test trace detection; the preset second detection condition refers to the condition under which the test trace can perform subsequent automatic test trace detection.

[0047] In this embodiment, only a few first detection points (i.e., several first detection points) that meet preset first detection conditions are selected from any shape of the test target, and the first test traces on the first detection points meet preset second detection conditions. Reference information is generated using the first detection information of the first detection points and the first test trace information of the first test traces, which is used to analyze the detection points and test traces in the wafer.

[0048] Optionally, the first detection information of each first detection point includes the detection point region position of the detection point region 3 occupied by the first detection point in the preset planar coordinate system and the first aspect ratio of the detection point region 3 of the first detection point; the first test trace information of each first test trace includes the trace region position of the trace region 1 occupied by the first test trace in the preset planar coordinate system and the second aspect ratio of the trace region 1 of the first test trace.

[0049] The aspect ratio (e.g., first aspect ratio, second aspect ratio) mentioned in the embodiments of this application refers to the ratio of the length of the target area (e.g., detection point area 3, trace area 1) on the first coordinate axis (e.g., the X-axis) to the length of the target area on the second coordinate axis (e.g., the Y-axis) in a preset planar coordinate system; or, the ratio of the length of the target area on the second coordinate axis (e.g., the Y-axis) to the length of the target area on the first coordinate axis (e.g., the X-axis).

[0050] In some specific embodiments, such as Figure 2 As shown, the first detection information of a plurality of first detection points of any shape and the first test trace information of the corresponding first test traces on the first detection points, based on the location of the first region and the first image, includes the following steps:

[0051] Step S102-1: Based on the first image, determine a first detection image of a plurality of first detection points of any shape and a first test trace image of the first test trace on the corresponding first detection point.

[0052] In other words, the first image contains detection point images of multiple detection points of any shape, as well as test trace images of test traces present on some of the detection point images. This means that during the trial needle insertion, not all detection points will have test traces, and not all detection points with test traces contain the information needed for data processing. This step selects several first detection points from the multiple detection points of any shape that meet the preset first detection conditions.

[0053] Step S102-2a: Obtain the first detection information corresponding to the first detection point based on the location of the first region and the first detection image of each first detection point in the first image.

[0054] In some specific embodiments, obtaining the first detection information corresponding to the first detection point based on the location of the first region and the first detection image of each first detection point in the first image includes the following steps:

[0055] Step S102-2a-1: Determine the first image region in the first image for any first detection image.

[0056] The first image region is the smallest rectangular region containing the first detected image 4, and any side of the first image region is parallel to any side of the first image.

[0057] The smallest rectangular region of the first detection image 4 refers to the first image region being a rectangular region, and each side of the first image region having a unique intersection point with the first detection image 4. This intersection point is the tangent point between the edge of the first image region and the first detection image 4.

[0058] An image coordinate system exists within the image, with its coordinate axes parallel to each edge of the image. In this coordinate system, the coordinates of each vertex of the first image region are represented by pixel position coordinates. Placing any edge of the first image region parallel to any edge of the first image facilitates coordinate calculations, reduces computational complexity, and decreases the amount of data processing.

[0059] Step S102-2a-2: Determine the detection point region of the first detection image in the preset planar coordinate system based on the location of the first region and the first image region.

[0060] Since the first image region exists only in the image coordinate system of the first detection image 4, and the position of the first region is the information of the first image in the preset plane coordinate system, the first image region in the image coordinate system of the first detection image 4 is converted into the detection point region 3 in the preset plane coordinate system through the position of the first region, so that the data prepared in the preset plane coordinate system can be automatically processed in subsequent tests.

[0061] In this application, the prepared data refers to data detected in advance during the data preparation process to enable subsequent automatic test trace detection. The prepared data includes detection point information and test trace information.

[0062] In this case, any side of the detection point region 3 is parallel to a coordinate axis of the preset planar coordinate system, which is beneficial for coordinate calculation, reduces the complexity of calculation, and reduces the amount of data processing.

[0063] Step S102-2a-3: Determine the position of the preset azimuth angle of the detection point area as the location of the detection point area.

[0064] The preset azimuth angle refers to the rectangular angle of any specific direction within the rectangular area. For example, if the upper left corner of the rectangular area represents the preset azimuth angle, then the preset azimuth angle of detection point area 3 is the upper left corner of detection point area 3.

[0065] Step S102-2a-4: Obtain the first aspect ratio value based on the detection point region.

[0066] The first aspect ratio refers to the ratio of the length of the detection point region 3 on the first coordinate axis (e.g., the X-axis) to the length of the detection point region 3 on the second coordinate axis (e.g., the Y-axis) in the preset planar coordinate system; or, the ratio of the length of the detection point region 3 on the second coordinate axis (e.g., the Y-axis) to the length of the detection point region 3 on the first coordinate axis (e.g., the X-axis).

[0067] The aspect ratio of detection area 3 for all detection points is calculated in the same way so that it can be compared during analysis.

[0068] Step S102-2b: Based on the location of the first region and the first test trace image of each first test trace in the first image, obtain the first test trace information corresponding to the first test trace.

[0069] In some specific embodiments, obtaining the first test trace information corresponding to the first test trace based on the location of the first region and the first test trace image of each first test trace in the first image includes the following steps:

[0070] Step S102-2b-1: Determine the second image region in the first image for any first test trace image.

[0071] The second image region is the smallest rectangular region containing the first test trace image 2, and any side of the second image region is parallel to any side of the first image.

[0072] The smallest rectangular region of the first test trace image 2 refers to the second image region being a rectangular region, where each side of the second image region intersects the first test trace image 2 at a unique point. This intersection point is the tangent point between the edge of the second image region and the first test trace image 2. Placing any side of the second image region parallel to any side of the first image region facilitates coordinate calculation, reduces computational complexity, and decreases the amount of data processing.

[0073] Step S102-2b-2: Determine the trace region of the first test trace image in the preset planar coordinate system based on the location of the first region and the second image region.

[0074] Since the second image region exists only in the image coordinate system of the first test trace image 2, and the first region position is the information of the first image in the preset plane coordinate system, the second image region in the image coordinate system of the first test trace image 2 is converted into the trace region 1 in the preset plane coordinate system through the first region position, so that the data prepared in the preset plane coordinate system can be automatically processed in subsequent tests.

[0075] In this case, any side of the trace region 1 is parallel to a coordinate axis of a preset planar coordinate system, which is beneficial for coordinate calculation, reduces the complexity of calculation, and reduces the amount of data processing.

[0076] Step S102-2b-3: Determine the position of the preset azimuth angle of the trace area as the location of the trace area.

[0077] The preset azimuth angle of the trace area 1 and the preset azimuth angle of the detection point area 3 are both located in the same direction within their respective rectangular areas.

[0078] For example, if the upper left corner of the rectangular area represents the preset azimuth angle, then the preset azimuth angle of the detection point area 3 refers to the upper left corner of the detection point area 3; the preset azimuth angle of the trace area 1 is the upper left corner of the detection point area 3.

[0079] Step S102-2b-4: Obtain the second aspect ratio value based on the trace region.

[0080] The second aspect ratio refers to the ratio of the length of the trace region 1 on the first coordinate axis (e.g., the X-axis) to the length of the trace region 1 on the second coordinate axis (e.g., the Y-axis) in the preset planar coordinate system; or, the ratio of the length of the trace region 1 on the second coordinate axis (e.g., the Y-axis) to the length of the trace region 1 on the first coordinate axis (e.g., the X-axis).

[0081] The calculation method for the second aspect ratio can differ from that for the first aspect ratio. However, the aspect ratio of all test traces in trace region 1 is calculated in the same way for comparison during analysis.

[0082] It should be noted that there is no specific order between steps S102-2a and S102-2b. They can be processed simultaneously, or steps S102-2a can be processed first and steps S102-2b can be processed later, or steps S102-2b can be processed first and steps S102-2a can be processed later.

[0083] Step S103: Determine the reference information of the shape in the preset planar coordinate system based on the first detection information of the plurality of first detection points and the first test trace information of the plurality of first test traces.

[0084] The purpose of determining the reference information of the shape in the preset planar coordinate system is to: use the reference information to analyze the detection point information and test trace information of all detection points of the same shape in the wafer, and realize the automatic preparation of test data.

[0085] In some specific embodiments, determining the reference information of the shape in a preset planar coordinate system based on the first detection information of the plurality of first detection points and the first test trace information of the plurality of first test traces includes the following steps:

[0086] Step S103-1: Obtain the positional relationship range in the reference information based on the detection point area position of the plurality of first detection points and the trace area position of the plurality of first test traces.

[0087] The positional relationship range is used to constrain the positional relationship between the detection point and the test trace. For example, during analysis, the detection point information and the test trace information on the detection point being analyzed both meet the requirements of the analysis standard information. However, the analysis standard information requires that the test trace image in the preset planar coordinate system be located near the geometric center of the detection point image, while the test trace image on the detection point image being analyzed is located in the lower left of the detection point image. Such detection point information and test trace information are not the preparation data used for testing.

[0088] In some specific embodiments, obtaining the positional relationship range in the reference information based on the detection point region positions of the plurality of first detection points and the trace region positions of the plurality of first test traces includes the following steps:

[0089] Step S103-1-1: Based on the location of the detection point area of ​​any first detection point and the location of the trace area of ​​any first test trace, obtain the first distance value and the first angle value between the first straight line and the preset coordinate axis in the preset plane coordinate system.

[0090] Wherein, the first straight line passes through the detection point area of ​​the first detection point and the trace area of ​​the first test trace.

[0091] Since several first detection points have been selected, there must be several first test traces corresponding to each first detection point. Each first detection point has a detection point area location, and each first test trace has a trace area location.

[0092] The first distance value is the distance from the location of the detection point region of any first detection point to the location of the trace region of any first test trace. By connecting several detection point regions with several trace regions, multiple first straight lines can be generated. For example, if the detection point locations of two first detection points are selected: A1 and A2, and the trace locations of two first test traces are selected: B1 and B2, then multiple first distance values ​​can be obtained: d11, d12, d21 and d22, as well as multiple first straight lines: L11, L12, L21 and L22, and multiple first included angle values ​​can be generated: g11, g12, g21 and g22; where d11 is the distance from A1 to B1, d12 is the distance from A1 to B2, d21 is the distance from A2 to B1, and d22 is the distance from A2 to B2; L11 is the straight line from A1 to B1, L12 is the straight line from A1 to B2, L21 is the straight line from A2 to B1, and L22 is the straight line from A2 to B2.

[0093] Step S103-1-2: Determine the first distance range in the positional relationship range based on all first distance values, and determine the first included angle range in the positional relationship range based on all first included angle values.

[0094] The first distance range refers to the range that is greater than or equal to the minimum first distance value and less than or equal to the maximum first distance value.

[0095] The first included angle range refers to the range that is greater than or equal to the minimum first included angle value and less than or equal to the maximum first included angle value.

[0096] In this embodiment, the first distance range and the first included angle range between the detection point and the test trace are used to constrain the positional relationship between the detection point and the test trace, so that detection points and test traces with the same positional relationship can be quickly screened out in the analysis.

[0097] Step S103-2: Obtain the range of the first aspect ratio value in the reference information based on the first aspect ratio value of the plurality of first detection points.

[0098] The first aspect ratio range refers to the range that is greater than or equal to the minimum first aspect ratio and less than or equal to the maximum first aspect ratio.

[0099] Because the first aspect ratio of detection points of different shapes varies greatly, the embodiments of this application determine the shape of the detection point by the range of the first aspect ratio.

[0100] Step S103-3: Obtain the range of the second aspect ratio value in the reference information based on the second aspect ratio value of the plurality of first test traces.

[0101] The second aspect ratio range refers to the range that is greater than or equal to the minimum second aspect ratio and less than or equal to the maximum second aspect ratio.

[0102] Because the second aspect ratio of test marks with different shapes is very different, the embodiments of this application determine the shape of the test mark by the range of the second aspect ratio.

[0103] In this specific embodiment, the generated reference information includes not only the first aspect ratio range for determining the detection point and the second aspect ratio range for determining the test trace, but also the range of the positional relationship between the detection point and the test trace. By using the ranges in various constraints as the basis for analysis, data redundancy is improved, which can effectively avoid misjudgment and omission, and improve the accuracy of analysis.

[0104] Step S104: Based on the reference information, analyze the second detection information of all second detection points of the shape in the wafer and the second test trace information of the corresponding second test traces on the second detection points.

[0105] This application embodiment utilizes the reference information of the shape to analyze the second detection information of the second detection point of each shape in the wafer and the second test trace information of the second test trace on the corresponding second detection point.

[0106] Step S105: When the second detection information of any second detection point and the second test trace information of the corresponding second test trace on the second detection point satisfy the reference information, the second detection information of the second detection point and the second test trace information of the corresponding second test trace on the second detection point are determined as preparation data.

[0107] This application only analyzes the detection points and test traces of any shape in the wafer to select the preparation data for testing. However, it does not affect the fact that the same method can achieve the same effect for detection points and test traces of other shapes.

[0108] This application first generates reference information for any shape in the test target based on a small number of qualified detection points and corresponding test marks on those points. Then, it analyzes all detection points and test marks of that shape on the wafer using this reference information, selecting those that meet the reference information as preparatory data. The generated reference information includes not only a first aspect ratio range for determining detection points and a second aspect ratio range for determining test marks, but also the range of positional relationships between detection points and test marks. Using these ranges from various constraints as the basis for analysis improves data redundancy, effectively avoids misjudgments and omissions, and enhances analysis accuracy. This method significantly saves data processing time, improves testing efficiency, and solves the inefficiency of manual processing.

[0109] This application also provides apparatus embodiments that follow the above embodiments, for implementing the method steps described in the above embodiments. The interpretation of the same names is the same as that in the above embodiments, and they have the same technical effects as those in the above embodiments, so they will not be repeated here.

[0110] like Figure 3 As shown, this application provides a data processing apparatus 300 for wafer testing, comprising:

[0111] The image capturing unit 301 is used to acquire a first image through an image device after a test pin is inserted into any test target in the wafer, wherein the first image is matched with a first area photographed by the image device in a preset planar coordinate system.

[0112] Information determination unit 302 is used to determine first detection information of a plurality of first detection points of any shape and first test trace information of first test traces on the corresponding first detection points based on the first region location of the first region and the first image, wherein the first detection points satisfy a preset first detection condition and the first test traces satisfy a preset second detection condition.

[0113] The standard determination unit 303 is used to determine the reference information of the shape in a preset planar coordinate system based on the first detection information of the plurality of first detection points and the first test trace information of the plurality of first test traces;

[0114] Analysis unit 304 is used to analyze the second detection information of all second detection points of the shape in the wafer and the second test trace information of the second test traces on the corresponding second detection points based on the reference information;

[0115] The data determination unit 305 is used to determine the second detection information of the second detection point and the second test trace information of the second test trace corresponding to the second detection point as preparation data when the second detection information of any second detection point and the second test trace information of the second test trace on the corresponding second detection point satisfy the reference information.

[0116] Optionally, the first detection information of each first detection point includes the location of the detection point area occupied by the corresponding first detection point in the preset planar coordinate system and the first aspect ratio of the detection point area of ​​the corresponding first detection point.

[0117] The first test trace information for each first test trace includes: the location of the trace area corresponding to the first test trace in the preset planar coordinate system and the second aspect ratio of the trace area corresponding to the first test trace.

[0118] Optionally, the standard determination unit 303 includes:

[0119] The first obtaining subunit is used to obtain the positional relationship range in the reference information based on the detection point area position of the plurality of first detection points and the trace area position of the plurality of first test traces;

[0120] The second obtaining subunit is used to obtain the first aspect ratio range in the reference information based on the first aspect ratio values ​​of the plurality of first detection points;

[0121] The third obtaining subunit is used to obtain the range of the second aspect ratio value in the reference information based on the second aspect ratio value of the plurality of first test traces.

[0122] Optionally, the first obtaining subunit includes:

[0123] The fourth obtaining subunit is used to obtain a first distance value and a first angle value between the first straight line and a preset coordinate axis in a preset plane coordinate system based on the detection point area position of any first detection point and the trace area position of any first test trace. The first straight line passes through the detection point area position of the first detection point and the trace area position of the first test trace.

[0124] The first determining subunit is configured to determine a first distance range within the positional relationship range based on all first distance values, and to determine a first included angle range within the positional relationship range based on all first included angle values.

[0125] Optionally, the information determining unit 302 includes:

[0126] The second determining subunit is used to determine, based on the first image, a first detection image of a plurality of first detection points of any shape and a first test trace image of the first test trace on the corresponding first detection point;

[0127] The first acquisition subunit is configured to acquire first detection information corresponding to the first detection point based on the location of the first region and the first detection image of each first detection point in the first image, and,

[0128] The second acquisition subunit is used to acquire the first test trace information corresponding to the first test trace based on the location of the first region and the first test trace image of each first test trace in the first image.

[0129] Optionally, the first acquisition subunit includes:

[0130] The third determining subunit is used to determine a first image region in the first image for any first detection image, wherein the first image region is the smallest rectangular region containing the first detection image, and any side of the first image region is parallel to any side of the first image.

[0131] The fourth determining subunit is used to determine the detection point region of the first detection image in a preset planar coordinate system based on the location of the first region and the first image region, wherein any side of the detection point region is parallel to a coordinate axis of the preset planar coordinate system;

[0132] The fifth determining subunit is used to determine the position of the detection point area by a preset azimuth angle;

[0133] The fifth obtaining subunit is used to obtain the first aspect ratio value based on the detection point region.

[0134] Optionally, the second acquisition subunit includes:

[0135] The sixth determining subunit is used to determine a second image region in the first image for any first test trace image, wherein the second image region is the smallest rectangular region containing the first test trace image, and any side of the second image region is parallel to any side of the first image.

[0136] The seventh determining subunit is used to determine the trace region of the first test trace image in a preset planar coordinate system based on the first region position and the second image region, wherein any side of the trace region is parallel to a coordinate axis of the preset planar coordinate system;

[0137] The eighth determining subunit is used to determine the position of the trace region as the position of the preset azimuth angle;

[0138] The sixth obtaining subunit is used to obtain the second aspect ratio value based on the trace region.

[0139] This application first generates reference information for any shape in the test target based on a small number of qualified detection points and corresponding test marks on those points. Then, it analyzes all detection points and test marks of that shape on the wafer using this reference information, selecting those that meet the reference information as preparatory data. The generated reference information includes not only a first aspect ratio range for determining detection points and a second aspect ratio range for determining test marks, but also the range of positional relationships between detection points and test marks. Using these ranges from various constraints as the basis for analysis improves data redundancy, effectively avoids misjudgments and omissions, and enhances analysis accuracy. This method significantly saves data processing time, improves testing efficiency, and solves the inefficiency of manual processing.

[0140] like Figure 4 As shown, this embodiment provides an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, which are executed by the at least one processor to enable the at least one processor to perform the method steps described in the above embodiment.

[0141] This application provides a non-volatile computer storage medium storing computer-executable instructions that can perform the steps described in the above embodiments.

[0142] The following is for reference. Figure 4 The diagram illustrates a structural schematic of an electronic device suitable for implementing the embodiments of this application. The terminal devices in the embodiments of this application may include, but are not limited to, mobile terminals such as mobile phones, laptops, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 4 The electronic device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of this application.

[0143] like Figure 4As shown, the electronic device may include a processing unit (e.g., a central processing unit, a graphics processing unit, etc.) 401, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 402 or a program loaded from a storage device 408 into a random access memory (RAM) 403. The RAM 403 also stores various programs and data required for the operation of the electronic device. The processing unit 401, ROM 402, and RAM 403 are interconnected via a bus 404. An input / output (I / O) interface 405 is also connected to the bus 404.

[0144] Typically, the following devices can be connected to I / O interface 405: input devices 406 including, for example, touchscreens, touchpads, keyboards, mice, cameras, microphones, accelerometers, gyroscopes, etc.; output devices 405 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 408 including, for example, magnetic tapes, hard disks, etc.; and communication devices 409. Communication device 409 allows electronic devices to communicate wirelessly or wiredly with other devices to exchange data. Although Figure 4 Electronic devices with various devices are shown, but it should be understood that it is not required to implement or have all of the devices shown. More or fewer devices may be implemented or have alternatively.

[0145] Specifically, according to embodiments of this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device 409, or installed from a storage device 408, or installed from a ROM 402. When the computer program is executed by the processing device 401, it performs the functions defined in the methods of the embodiments of this application.

[0146] It should be noted that the computer-readable medium described above in this application can be a computer-readable signal medium, a computer-readable storage medium, or any combination thereof. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this application, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. In this application, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium can be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wires, optical fibers, RF (radio frequency), etc., or any suitable combination thereof.

[0147] The aforementioned computer-readable medium may be included in the aforementioned electronic device; or it may exist independently and not assembled into the electronic device.

[0148] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0149] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0150] The units described in the embodiments of this application can be implemented in software or hardware. The names of the units are not, in some cases, limiting the scope of the unit itself.

Claims

1. A data processing method for wafer testing, characterized in that, include: After a test pin is applied to any test target in the wafer, a first image is acquired by an imaging device, wherein the first image matches a first area photographed by the imaging device in a preset planar coordinate system. Based on the location of the first region and the first image, determine the first detection information of several first detection points of any shape and the first test trace information of several first test traces on the corresponding first detection points, wherein the first detection points satisfy a preset first detection condition and the first test traces satisfy a preset second detection condition. The reference information of the shape in the preset planar coordinate system is determined based on the first detection information of the plurality of first detection points and the first test trace information of the plurality of first test traces; Based on the reference information, the second detection information of all second detection points of the shape in the wafer and the second test trace information of the corresponding second test traces on the second detection points are analyzed; When the second detection information of any second detection point and the second test trace information of the corresponding second test trace on the second detection point satisfy the reference information, the second detection information of the second detection point and the second test trace information of the corresponding second test trace on the second detection point are determined as preparation data. The first detection information for each first detection point includes the location of the detection point area corresponding to the first detection point in the preset planar coordinate system and the first aspect ratio of the detection point area corresponding to the first detection point. The first test trace information for each first test trace includes: the location of the trace area corresponding to the first test trace in the preset planar coordinate system and the second aspect ratio of the trace area corresponding to the first test trace; The step of determining the reference information of the shape in the preset planar coordinate system based on the first detection information of the plurality of first detection points and the first test trace information of the plurality of first test traces includes: The positional relationship range in the reference information is obtained based on the detection point area position of the plurality of first detection points and the trace area position of the plurality of first test traces; The first aspect ratio range in the reference information is obtained based on the first aspect ratio values ​​of the plurality of first detection points; The range of the second aspect ratio value in the reference information is obtained based on the second aspect ratio value of the plurality of first test traces; The process of obtaining the positional relationship range in the reference information based on the detection point region positions of the plurality of first detection points and the trace region positions of the plurality of first test traces includes: A first distance value and a first angle value between a first straight line and a preset coordinate axis in a preset plane coordinate system are obtained based on the detection point area position of any first detection point and the trace area position of any first test trace. The first straight line passes through the detection point area position of the first detection point and the trace area position of the first test trace. A first distance range is determined within the range of the positional relationships based on all first distance values, and a first included angle range is determined within the range of the positional relationships based on all first included angle values.

2. The method according to claim 1, characterized in that, The first detection information of a plurality of first detection points of any shape determined based on the first region location and the first image, and the first test trace information of the first test trace on the corresponding first detection point, include: Based on the first image, a first detection image of several first detection points of any shape and a first test trace image of the first test trace on the corresponding first detection point are determined; Based on the location of the first region and the first detection image of each first detection point in the first image, first detection information corresponding to the first detection point is obtained, and, Based on the location of the first region and the first test trace image of each first test trace in the first image, obtain the first test trace information corresponding to the first test trace.

3. The method according to claim 2, characterized in that, The step of obtaining the first detection information corresponding to the first detection point based on the location of the first region and the first detection image of each first detection point in the first image includes: A first image region is determined in the first image for any first detection image, wherein the first image region is the smallest rectangular region containing the first detection image, and any side of the first image region is parallel to any side of the first image. Based on the location of the first region and the first image region, a detection point region of the first detection image in a preset planar coordinate system is determined, wherein any side of the detection point region is parallel to a coordinate axis of the preset planar coordinate system; The position of the detection point area is determined by a preset azimuth angle. The first aspect ratio value is obtained based on the detection point area.

4. The method according to claim 2, characterized in that, The step of obtaining the first test trace information corresponding to the first test trace based on the location of the first region and the first test trace image of each first test trace in the first image includes: Determine a second image region in the first image for any first test trace image, wherein the second image region is the smallest rectangular region containing the first test trace image, and any side of the second image region is parallel to any side of the first image; Based on the location of the first region and the second image region, the trace region of the first test trace image in the preset planar coordinate system is determined, wherein any side of the trace region is parallel to a coordinate axis of the preset planar coordinate system; The position of the trace area is determined by a preset azimuth angle. The second aspect ratio is obtained based on the trace region.

5. A data processing apparatus for wafer testing, characterized in that, include: An image capturing unit is used to acquire a first image through an image device after a test pin is inserted into any test target in the wafer, wherein the first image matches a first area photographed by the image device in a preset planar coordinate system; An information determination unit is configured to determine, based on the first region location of the first region and the first image, first detection information of a plurality of first detection points of any shape and first test trace information of a plurality of first test traces on the corresponding first detection points, wherein the first detection points satisfy a preset first detection condition and the first test traces satisfy a preset second detection condition; the first detection information of each first detection point includes the detection point region location of the detection point region occupied by the corresponding first detection point in a preset planar coordinate system and the first aspect ratio of the detection point region of the corresponding first detection point; the first test trace information of each first test trace includes the trace region location of the trace region occupied by the corresponding first test trace in a preset planar coordinate system and the second aspect ratio of the trace region of the corresponding first test trace. A standard determination unit is used to determine the reference information of the shape in a preset planar coordinate system based on the first detection information of the plurality of first detection points and the first test trace information of the plurality of first test traces; the step of determining the reference information of the shape in the preset planar coordinate system based on the first detection information of the plurality of first detection points and the first test trace information of the plurality of first test traces includes: obtaining the positional relationship range in the reference information based on the detection point area position of the plurality of first detection points and the trace area position of the plurality of first test traces; obtaining the first aspect ratio range in the reference information based on the first aspect ratio value of the plurality of first detection points; and obtaining the second aspect ratio value based on the plurality of first test traces. The method for obtaining the second aspect ratio value range in the reference information is as follows: The method for obtaining the positional relationship range in the reference information based on the detection point area positions of the plurality of first detection points and the trace area positions of the plurality of first test traces includes: obtaining a first distance value and a first angle value between a first straight line and a preset coordinate axis in a preset plane coordinate system based on the detection point area position of any first detection point and the trace area position of any first test trace, wherein the first straight line passes through the detection point area position of the first detection point and the trace area position of the first test trace; determining a first distance range in the positional relationship range based on all first distance values; and determining a first angle range in the positional relationship range based on all first angle values. An analysis unit is used to analyze, based on the reference information, the second detection information of all second detection points of the shape in the wafer and the second test trace information of the corresponding second test traces on the second detection points; The data determination unit is used to determine the second detection information of the second detection point and the second test trace information of the second test trace corresponding to the second detection point as preparation data when the second detection information of any second detection point and the second test trace information of the second test trace on the corresponding second detection point satisfy the reference information.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by the processor, it implements the method as described in any one of claims 1 to 4.

7. An electronic device, characterized in that, include: One or more processors; Storage device for storing one or more programs. Wherein, when the one or more programs are executed by the one or more processors, the one or more processors implement the method as described in any one of claims 1 to 4.

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