3D phase change heat spreader and method of making

Abstract

The application provides a 3D phase change radiator and a manufacturing method thereof. The phase change radiator comprises an evaporation part, a condensation part, a flow guide tooth and a heat transfer working medium. The evaporation part comprises a substrate, a first cover plate and a porous capillary structure on the inner surface of the substrate. The substrate and the first cover plate are oppositely arranged and sealed to form an evaporation cavity. The outer surface of the substrate away from the first cover plate is a heat absorption surface. The condensation part comprises at least a plurality of condensation shells. The condensation shells are arranged in parallel and spaced apart above the first cover plate. The flow guide tooth is located inside the condensation shell and protrudes from one end of the condensation shell and is in contact with the porous capillary structure. The flow guide tooth is arranged obliquely inside the condensation shell and forms a preset angle with the inner surface of the substrate. The heat transfer working medium is located inside the evaporation cavity. The 3D phase change radiator of the application enhances the heat dissipation capacity and reduces the heat dissipation resistance by arranging the porous capillary structure and the flow guide tooth in contact.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a 3D phase change heat sink and its manufacturing method. Background Technology

[0002] With the rapid development of semiconductor technology, the integration of high-power components is becoming increasingly higher, and their power density is also increasing. As a result, they generate more and more heat and have a higher heat flux density during operation. Conventional heat sinks are no longer able to meet the heat dissipation requirements of high heat flux density. If the heat generated by power devices cannot be dissipated in a timely and rapid manner, the temperature of the chips in the power devices will rise, which may result in reduced working efficiency and shortened service life, or even damage and failure of the devices.

[0003] Therefore, there is an urgent need for a 3D phase change heat sink with high heat dissipation efficiency for high-power components. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a 3D phase change heat sink and its manufacturing method, so as to solve the problem of low heat dissipation efficiency of heat sinks for high-power components in the prior art.

[0005] To achieve the above and other related objectives, the present invention provides a 3D phase change heat sink, comprising:

[0006] An evaporation section includes a substrate, a first cover plate, and a porous capillary structure. The substrate and the first cover plate are disposed opposite to each other and sealed together to form an evaporation chamber. The porous capillary structure is located on the inner surface of the substrate, and the outer surface of the substrate away from the first cover plate is a heat absorption surface.

[0007] The condensation section includes at least a plurality of condensation shells, which are arranged in parallel and spaced apart above the first cover plate;

[0008] The guide tooth is located inside the condensation shell, with one end of the guide tooth protruding from the condensation shell and contacting the porous capillary structure. The guide tooth is inclined inside the condensation shell and forms a preset angle with the inner surface of the substrate.

[0009] The heat transfer medium is located inside the evaporation chamber.

[0010] Optionally, the preset angle between the guide teeth and the inner surface of the substrate is in the range of 30 degrees to 90 degrees.

[0011] Optionally, the guide teeth have a corrugated fin structure.

[0012] Optionally, the porous capillary structure includes at least one of the following: a woven wire mesh structure, a metal powder sintered porous structure, and a woven wire knot groove.

[0013] Optionally, the sidewall of the substrate is further provided with an injection port for filling the heat transfer medium.

[0014] Optionally, the guide teeth are spaced at a predetermined distance from the interior of the side wall of the condenser shell.

[0015] Optionally, the end of the condenser shell away from the first cover plate is sealed and welded, the condenser shell and the first cover plate are sealed together to form a condensation cavity, and the condensation cavity is connected to the evaporation cavity.

[0016] Optionally, the condensation section further includes a second cover plate and a third cover plate stacked in sequence. The second cover plate is located above the condensation shell. The second cover plate, the third cover plate, the condensation shell, and the first cover plate are sealed together to form a condensation cavity, and the condensation cavity is connected to the evaporation cavity.

[0017] Optionally, the second cover plate is further provided with a plurality of slots, and the end of the condenser housing away from the first cover plate is inserted into the second cover plate through the slots.

[0018] Optionally, the 3D phase change radiator further includes a plurality of heat dissipation fins, which are located on the outer surface of the condensation shell and between adjacent condensation shells.

[0019] Optionally, the first cover plate is further provided with a plurality of slots, and the protruding end of the guide tooth is inserted into the first cover plate through the slots.

[0020] This invention also provides a method for manufacturing a 3D phase change heat sink, comprising the following steps:

[0021] An evaporation section is provided, the evaporation section includes a substrate, a first cover plate and a porous capillary structure, the substrate and the first cover plate are disposed opposite to each other and sealed to form an evaporation chamber, and the porous capillary structure is located on the inner surface of the substrate.

[0022] A condensation section is provided, the condensation section comprising at least a plurality of condensation shells, the condensation shells being arranged in parallel and spaced apart above the first cover plate;

[0023] A flow guide tooth is provided, the flow guide tooth is located inside the condensation shell and one end of the flow guide tooth protrudes from the condensation shell and contacts the porous capillary structure, the flow guide tooth is inclined inside the condensation shell and forms a preset angle with the inner surface of the substrate;

[0024] The evaporation section and the condensation section are fixedly connected by welding. After welding, the non-condensable gas inside the evaporation chamber is discharged through the injection port, and the heat transfer medium is filled in. The injection port is then sealed to obtain a 3D phase change radiator.

[0025] Optionally, the guide teeth are fixedly connected to the condenser shell by welding.

[0026] Optionally, the method for welding the evaporation section and the condensation section includes atmosphere-protected brazing furnace welding and vacuum brazing furnace welding.

[0027] As described above, the 3D phase change heat sink and its manufacturing method of the present invention have the following beneficial effects: By setting the evaporation section and the condensation section in sequence in the phase change heat sink, and the condensation cavity is connected to the evaporation cavity through the guide teeth and the porous capillary structure, a three-dimensional homogeneous phase change heat dissipation structure is formed. The structure is compact, small in size, and light in weight, which improves the heat conduction rate of the phase change heat sink, increases the heat dissipation capacity, and reduces the heat dissipation resistance. It is suitable for heat dissipation of high heat flux and high power electronic devices and has broad application prospects. By setting the porous capillary structure on the inner surface of the substrate, the porous capillary structure has a large capillary pressure, which increases the wetting and reflux of the liquid heat transfer medium during the operation of the phase change heat sink, increases the evaporation surface area and the vaporization nucleus of the liquid heat transfer medium, reduces the phase change superheat, strengthens the evaporation phase change heat transfer, and reduces the evaporation thermal resistance and temperature difference. By setting the guide teeth in the condensation shell, the evaporation section and the condensation cavity are connected to the evaporation cavity. The flow guide teeth, which are inclinedly arranged inside the condensation cavity and form an angle of 30 to 90 degrees with the inner surface of the substrate, increase the surface area for condensation heat exchange of the phase change heat sink, enhance its condensation heat dissipation capacity, and reduce its condensation heat dissipation thermal resistance. Furthermore, the inclined flow guide teeth can utilize gravity during operation to facilitate the flow of the liquid heat transfer medium in the condensation section to the inner surface of the substrate, preventing insufficient return of the liquid heat transfer medium from causing the inner surface of the substrate to dry out and resulting in excessively high local temperatures that could damage the phase change heat sink. This further improves the heat conduction rate of the phase change heat sink, increases its heat dissipation capacity, and reduces its heat dissipation resistance. In addition, the heat dissipation capacity of the 3D phase change heat sink is further enhanced by the heat dissipation fins arranged between adjacent condensation shells. The condensation cavity is formed by sealing one end of the condensation shell with the first cover plate, further expanding the application range of the 3D phase change heat sink. Attached Figure Description

[0028] Figure 1 The diagram shown is a structural schematic of the 3D phase change heat sink of the present invention.

[0029] Figure 2The diagram shown is another structural schematic of the 3D phase change heat sink of the present invention.

[0030] Figure 3 The diagram shown is a partial structural schematic of the 3D phase change heat sink of the present invention.

[0031] Figure 4 The diagram shown is a third structural schematic of the 3D phase change heat sink of the present invention.

[0032] Figure 5 The diagram shown is a fourth structural schematic of the 3D phase change heat sink of the present invention.

[0033] Figure 6 The diagram shown is a fifth structural schematic of the 3D phase change heat sink of the present invention.

[0034] Figure 7 The diagram shown is a sixth structural schematic of the 3D phase change heat sink of the present invention.

[0035] Component designation explanation

[0036] 1 Evaporation section

[0037] 11 base plate

[0038] 12 First cover plate

[0039] 121 Card Slot

[0040] 13 Porous capillary structure

[0041] 14 Evaporation Chamber

[0042] 2. Condensation section

[0043] 21 Second cover plate

[0044] 211 slot

[0045] 22 Third cover plate

[0046] 23 Side panels

[0047] 24. Condensation shell

[0048] 25. Condensation Chamber

[0049] 3 guide teeth

[0050] 4 Inlet

[0051] 5. Heat dissipation fins

[0052] 6 Power Devices Detailed Implementation

[0053] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0054] Please see Figures 1 to 7 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and to facilitate understanding and reading. They are not intended to limit the scope of the invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of the invention, should still fall within the scope of the technical content disclosed in this invention. Furthermore, the terms such as "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.

[0055] Example 1

[0056] This embodiment provides a 3D phase change heat sink, such as Figures 1-2 The diagrams shown are schematic diagrams of one and another structure of the 3D phase change heat sink, respectively. The 3D phase change heat sink includes: an evaporation section 1, a condensation section 2, guide teeth 3, and a heat transfer medium (not shown). The evaporation section 1 includes a substrate 11, a first cover plate 12, and a porous capillary structure 13. The substrate 11 and the first cover plate 12 are oppositely disposed and sealed together to form an evaporation chamber 14. The porous capillary structure 13 is located on the inner surface of the substrate 11, and the outer surface of the substrate 11 away from the first cover plate 12 is the heat absorption surface. The condensation section 2 includes at least a plurality of condensation shells 24, which are parallel and spaced above the first cover plate 21. The guide teeth 3 are located inside the condensation shells 24, with one end protruding from the condensation shell 24 and contacting the porous capillary structure 13. The guide teeth 3 are inclined inside the condensation shells 24 and form a predetermined angle with the inner surface of the substrate 11. The heat transfer medium is located inside the evaporation chamber 14.

[0057] Specifically, such as Figure 3 The diagram shown is a partial structural schematic of the 3D phase change heat sink. The power device 6 is attached to the outer surface of the substrate 11 of the 3D phase change heat sink, that is, the phase change heat sink is a side-mounted heat sink with the heat source on the side.

[0058] Specifically, the power device 6 can also be located below the phase change heat sink, so that the phase change heat sink is used as a heat source installed horizontally below.

[0059] Specifically, a wind-cooling device (not shown) is also provided on one side wall of the phase change heat sink to enhance the heat dissipation capacity of the 3D phase change heat sink.

[0060] Specifically, by setting different installation positions for the air-cooling device and the power device 6, the application range of the 3D phase change heat sink is expanded.

[0061] Specifically, the power device 6 includes a laser generator, an AIGPU computing chip, a CPU processor chip, silicon carbide, or other high-power semiconductor devices.

[0062] Specifically, the high-density, high-heat-flux power device 6 can release a large amount of heat as a heat source during operation, which can be dissipated by the 3D phase change heat sink.

[0063] Specifically, while meeting the performance requirements of the 3D phase change heat sink, the size and shape of the substrate 11 can be selected according to the actual situation and are not limited here.

[0064] Specifically, the substrate 11 is made of at least one of copper, aluminum, and iron, or other suitable materials.

[0065] Specifically, the substrate 11 is used to absorb the heat generated by the power device 6 during operation.

[0066] As an example, the porous capillary structure 13 includes at least one of the following: a woven wire mesh structure, a metal powder sintered porous structure, a woven wire knot groove, or other suitable structures.

[0067] Specifically, while meeting the performance requirements of the 3D phase change heat sink, the size and material of the first cover plate 12 can be selected according to the actual situation, and are not limited here.

[0068] Specifically, the evaporation chamber 14 is formed by the substrate 11 and the first cover plate 12 being fastened and sealed together.

[0069] Specifically, while meeting the performance requirements of the phase change radiator, the size, material, quantity, and shape of the condenser housing 24 can be selected according to the actual situation and are not limited here.

[0070] Specifically, the condenser shell 24 is a hollow structure used to house the guide teeth 3.

[0071] Specifically, while meeting the performance requirements of the phase change radiator, the size, material, shape, and quantity of the condenser housing 24 can be selected according to the actual situation and are not limited here.

[0072] As an example, the condenser 2 also includes a second cover plate 21 and a third cover plate 22 stacked in sequence. The second cover plate 21 is located above the condenser shell 24. The second cover plate 21, the third cover plate 22, the condenser shell 24 and the first cover plate 12 are sealed together to form a condenser cavity 25, and the condenser cavity 25 is connected to the evaporator cavity 14.

[0073] Specifically, while meeting the performance requirements of the phase change heat sink, the size, shape, and material of the second cover plate 21 can be selected according to the actual situation, and are not limited here.

[0074] Specifically, while meeting the performance requirements of the phase change heat sink, the size, material, and shape of the third cover plate 22 can be selected according to the actual situation and are not limited here.

[0075] Specifically, the 3D phase change heat sink also includes a side plate 23, which is located between the second cover plate 21 and the first cover plate 12, and is located outside the outermost condensation shell 24.

[0076] Specifically, while meeting the performance requirements of the 3D phase change heat sink, the size, material, quantity, and shape of the side plate 23 can be selected according to the actual situation and are not limited here.

[0077] Specifically, the side plate 23 is located between the second cover plate 21 and the first cover plate 12, and is located outside the outermost condenser shell 24, serving to protect the condenser shell 24 and support the 3D phase change heat sink.

[0078] As an example, the second cover plate 22 is also provided with a plurality of slots 211, and the end of the condenser shell 24 away from the first cover plate 12 is inserted into the second cover plate 22 through the slots 211.

[0079] Specifically, while meeting the performance requirements of the phase change heat sink, the size and number of the slots 211 can be selected according to the actual situation and are not limited here.

[0080] As an example, the structure of the guide tooth 3 is a corrugated fin structure.

[0081] As an example, the preset angle between the guide tooth 3 and the inner surface of the substrate 11 is in the range of 30 degrees to 90 degrees.

[0082] As an example, the first cover plate 12 is also provided with a plurality of slots 121, and the protruding end of the guide tooth 3 is inserted into the first cover plate 12 through the slots 121.

[0083] Specifically, while meeting the performance requirements of the phase change heat sink, the size and shape of the slot 121 can be selected according to the actual situation and are not limited here.

[0084] As an example, the guide teeth 3 are spaced at a predetermined distance from the interior of the side wall of the condensation shell 24.

[0085] Specifically, while meeting the performance requirements of the phase change radiator, the range of the distance between the guide teeth 3 and the side wall of the condenser housing 24 can be selected according to the actual situation, and is not limited here.

[0086] Specifically, the condensation cavity 25 is in contact with the porous capillary structure 13 on the inner surface of the substrate 11 through the protruding end of the guide tooth 3, and is interconnected with the evaporation cavity 14 to form a three-dimensional homogeneous phase change heat dissipation structure, which improves the heat conduction rate of the phase change heat sink, increases the heat dissipation capacity, reduces the heat dissipation resistance, and is suitable for heat dissipation of high heat flux and high power electronic devices.

[0087] As an example, the sidewall of the substrate is also provided with an injection port 4, which is used to fill the heat transfer medium.

[0088] Specifically, while meeting the performance requirements of the phase change heat sink, the size and shape of the injection port 4 can be selected according to the actual situation and are not limited here.

[0089] Specifically, the heat transfer medium is injected into the evaporation chamber 14 of the phase change heat sink through the injection port 4. The heat transfer medium absorbs heat and evaporates into gas at the substrate 11, and flows along the guide teeth 3 through the porous capillary structure 13 to the condensation section 2 to release heat and condense into liquid. Then, it returns along the guide teeth 3 to the substrate 11 of the evaporation section 1 for the next phase change heat transfer cycle.

[0090] Specifically, during the heat transfer process, the boiling of the liquid heat transfer medium (or the condensation of the gaseous heat transfer medium) is suppressed, and on this basis, the consistency of the microstructure of the heat transfer medium is achieved, thereby realizing the phase change suppression (PCI) heat transfer technology for high-efficiency heat transfer.

[0091] Specifically, the porous capillary structure 13 is located on the inner surface of the substrate 11 and has a large capillary pressure. During the operation of the phase change heat sink, it increases the wetting and reflux of the liquid heat transfer medium to the substrate 11, increases the evaporation surface area and the vaporization nuclei of the liquid heat transfer medium, reduces the phase change superheat, enhances the evaporation phase change heat transfer of the liquid heat transfer medium, and reduces the evaporation thermal resistance and temperature difference.

[0092] Specifically, the guide teeth 3 in the condensation section 2 contact the porous capillary structure 13 on the inner surface of the substrate 11, so that the liquid heat transfer medium condensed in the condensation section 2 flows directly back to the inner surface of the substrate 11 along the guide teeth 3. This ensures that the liquid heat transfer medium on the surface of the substrate 11 evaporates and absorbs heat, avoiding the phenomenon of insufficient liquid return of the liquid heat transfer medium causing the substrate 11 surface to dry out and the local temperature to be too high, which would damage the phase change heat sink. This further improves the heat conduction rate of the phase change heat sink, increases the heat dissipation capacity, and reduces the heat dissipation resistance.

[0093] Specifically, by providing the guide teeth 3 in the condensation shell 24, and the angle between the guide teeth 3 and the inner surface of the substrate 11 is in the range of 30 degrees to 90 degrees, the surface area for condensation heat exchange of the phase change heat sink is increased, the condensation heat dissipation capacity of the phase change heat sink is enhanced, and the condensation heat dissipation thermal resistance is reduced. In addition, during operation, the inclined guide teeth 3 facilitate the return of the liquid heat transfer medium in the condensation section 2 to the inner surface of the substrate 11 by gravity along the guide teeth 3. Furthermore, the guide teeth 3 are spaced at a preset distance from the side wall of the condensation shell, which facilitates the flow of liquid and gaseous heat transfer medium, thereby enhancing the heat dissipation capacity of the phase change heat sink.

[0094] In this embodiment, the evaporation section 1 and the condensation section 2 of the 3D phase change heat sink are stacked sequentially, and the condensation cavity 14 is connected to the porous capillary structure 13 through the guide teeth 3, forming a three-dimensional homogeneous phase change heat dissipation structure. This structure is compact, small in size, and lightweight, improving the heat conduction rate of the phase change heat sink, increasing its heat dissipation capacity, and reducing its heat dissipation resistance. It is suitable for heat dissipation of high-heat-flux, high-power electronic devices and has broad application prospects. By setting the porous capillary structure 13 on the inner surface of the substrate 11, the porous capillary structure 13 has a large capillary pressure, which increases the wetting and reflux of the liquid heat transfer medium during the operation of the phase change heat sink. This increases the evaporation surface area and the vaporization nucleus of the liquid heat transfer medium, reducing phase change superheat, enhancing evaporation phase change heat transfer, and reducing evaporation thermal resistance and temperature difference. Furthermore, the condensation shell... The guide teeth 3 are provided in the body 24, and the guide teeth 3 are inclinedly arranged inside the condensation shell 24 with an angle of 30 degrees to 90 degrees with the inner surface of the substrate 11. This increases the surface area for condensation heat exchange of the phase change heat sink, enhances the condensation heat dissipation capacity of the phase change heat sink, and reduces the condensation heat dissipation thermal resistance. In addition, the inclined guide teeth 3 can utilize gravity during operation to facilitate the flow of the liquid heat transfer medium in the condensation section 2 to the inner surface of the substrate 11. This avoids the dryness of the inner surface of the substrate due to insufficient return of the liquid heat transfer medium, which could lead to local overheating and damage to the phase change heat sink. This further improves the heat conduction rate of the phase change heat sink, increases the heat dissipation capacity, and reduces the heat dissipation resistance. The 3D phase change heat sink described in this embodiment uses natural air cooling for heat dissipation, which broadens the application range and fields of the 3D phase change heat sink.

[0095] Example 2

[0096] This embodiment provides another type of 3D phase change heat sink, such as Figures 4-6 The diagrams shown are a third, fourth, and fifth structural schematic of the 3D phase change heat sink, respectively. An embodiment of the 3D phase change heat sink described in Example 1 is provided. The 3D phase change heat sink further includes multiple heat dissipation fins 5, which are located on the outer surface of the condensation shell 24 and between adjacent condensation shells 24.

[0097] Specifically, the heat dissipation fins 5 are made of at least one of copper, aluminum, and iron, or other suitable materials.

[0098] Specifically, while meeting the performance requirements of the phase change heat sink, the size and shape of the heat dissipation fins 5 can be selected according to the actual situation, and are not limited here.

[0099] Specifically, by providing the heat dissipation fins 5 between the condensation shells, the heat dissipation area of ​​the phase change radiator is increased, thereby improving the heat dissipation efficiency of the phase change radiator.

[0100] The 3D phase change heat sink of this embodiment increases the heat dissipation area and improves the heat dissipation efficiency of the 3D phase change heat sink by setting the heat dissipation fins 5 between the condensation shells 24 in the 3D phase change heat sink of embodiment one.

[0101] Example 3

[0102] This embodiment provides a third type of 3D phase change heat sink, such as Figure 7 The diagram shown is a sixth structural schematic of the 3D phase change heat sink. The 3D phase change heat sink is an improvement on the 3D phase change heat sink in Embodiment 1. The end of the condensing shell 24 away from the first cover plate 11 is sealed and welded. The condensing shell 24 and the first cover plate 11 are sealed and connected to form a condensing cavity 25, and the condensing cavity 25 is connected to the evaporation cavity 14.

[0103] Specifically, by sealing and welding the end of the condensing shell 24 away from the first cover plate 11, the condensing shell 24 and the first cover plate 11 are sealed together to form a condensing cavity 25. This simplifies the structure of the 3D phase change heat sink and further increases the application range and fields of the 3D phase change heat sink.

[0104] The 3D phase change heat sink of this embodiment is an improvement on the 3D phase change heat sink in Embodiment 1. By sealing and welding the end of the condensing shell 24 away from the first cover plate 11, the condensing shell 24 and the first cover plate 11 are sealed together to form a condensing cavity 25. This simplifies the structure of the 3D phase change heat sink and further increases the application range and fields of the 3D phase change heat sink.

[0105] Example 4

[0106] This embodiment provides a method for manufacturing a 3D phase change heat sink, including the following steps:

[0107] S1: An evaporation section is provided, the evaporation section includes a substrate, a first cover plate and a porous capillary structure, the substrate and the first cover plate are disposed opposite to each other and sealed to form an evaporation cavity, the porous capillary structure is located on the inner surface of the substrate, and the outer surface of the substrate away from the first cover plate is a heat absorption surface.

[0108] S2: A condensation section is provided, the condensation section comprising at least a plurality of condensation shells, the plurality of condensation shells being arranged in parallel and spaced apart above the first cover plate;

[0109] S3: Provide guide teeth, the guide teeth are located inside the condensation shell and one end of the guide teeth protrudes from the condensation shell and contacts the porous capillary structure, the guide teeth are inclined inside the condensation shell and form a preset angle with the inner surface of the substrate;

[0110] S4: The evaporation section and the condensation section are fixedly connected by welding. After welding, the non-condensable gas inside the evaporation chamber is discharged through the injection port, and the heat transfer medium is filled in. The injection port is then sealed to obtain a 3D phase change radiator.

[0111] Specifically, in step S1, an evaporation section 1 is provided. The evaporation section 1 includes a substrate 11, a first cover plate 12, and a porous capillary structure 13. The substrate 11 and the first cover plate 12 are disposed opposite to each other and sealed together to form an evaporation chamber 14. The porous capillary structure 13 is located on the inner surface of the substrate 11, and the outer surface of the substrate 11 away from the first cover plate 12 is a heat absorption surface.

[0112] Specifically, the method for forming the porous capillary structure 13 includes sintering or other suitable methods.

[0113] Specifically, the porous capillary structure 13 is formed by sintering metal powder.

[0114] Specifically, in steps S2-S3, a condensation section 2 is provided, the condensation section 2 includes at least a condensation shell 24, and a plurality of condensation shells 24 are arranged in parallel and spaced above the first cover plate 12; a guide tooth 3 is provided, the guide tooth 3 is located inside the condensation shell 24 and one end of the guide tooth 3 protrudes from the condensation shell 24 and contacts the porous capillary structure 13, the guide tooth 3 is inclined inside the condensation shell 24 and forms a preset angle with the inner surface of the substrate 11.

[0115] As an example, the guide tooth 3 is fixedly connected to the condenser shell 24 by welding.

[0116] Specifically, the condensing cavity in the condensing section 2 can be formed by pressing and sealing the end of the condensing shell 24 away from the first cover plate 12 with the first cover plate 12, or it can be formed by sealing and welding the second cover plate 21, the third cover plate 22, the condensing shell 24 and the first cover plate 12 together.

[0117] Specifically, in step S4, the evaporation section 1 and the condensation section 2 are fixedly connected by welding. After welding, the non-condensable gas inside the connected evaporation chamber 14 is discharged through the injection port 4, and a heat transfer medium is filled in. The injection port 4 is then sealed to obtain a 3D phase change radiator.

[0118] Specifically, the first cover plate 12 is also provided with a plurality of slots 121, and the protruding end of the guide tooth 3 is inserted into the first cover plate 12 through the slot 121, that is, the evaporation part 1 and the condensation part 2 are fixedly connected by the protruding end of the guide tooth 3 being inserted into the first cover plate 12.

[0119] As an example, the method of welding the evaporation section 1 to the condensation section 2 includes atmosphere-protected brazing furnace welding, vacuum brazing furnace welding, or other suitable welding methods.

[0120] Specifically, the heat transfer medium is injected into the evaporation chamber 14 through the injection port 4 on the side wall of the substrate 11.

[0121] The 3D phase change heat sink manufactured by the method described in this embodiment has a high thermal conductivity, strong heat dissipation capacity, low heat dissipation resistance, and a compact structure, small size, and light weight, thus having broad application prospects.

[0122] In summary, the 3D phase change heat sink and its manufacturing method of the present invention, by sequentially stacking the evaporation section and the condensation section, and connecting the condensation cavity to the evaporation cavity through the guide teeth and the porous capillary structure, constitute a three-dimensional homogeneous phase change heat dissipation structure. This structure is compact, small in size, and lightweight, improving the heat conduction rate of the phase change heat sink, increasing its heat dissipation capacity, and reducing its heat dissipation resistance. It is suitable for heat dissipation of high-heat-flux, high-power electronic devices and has broad application prospects. By setting the porous capillary structure on the inner surface of the substrate, the porous capillary structure has a large capillary pressure, which increases the wetting and reflux of the liquid heat transfer medium during the operation of the phase change heat sink, increases the evaporation surface area and the vaporization nucleus of the liquid heat transfer medium, reduces the phase change superheat, enhances the evaporation phase change heat transfer, and reduces the evaporation thermal resistance and temperature difference. By setting the guide teeth in the condensation shell, the fluid is guided... The condensing chamber is tilted, and the angle between the guide teeth and the inner surface of the substrate ranges from 30 degrees to 90 degrees. This increases the surface area for condensation heat transfer in the phase change radiator, enhances its condensation heat dissipation capacity, and reduces its condensation heat dissipation thermal resistance. Furthermore, the tilted guide teeth utilize gravity during operation to facilitate the flow of liquid heat transfer fluid from the condensing section to the inner surface of the substrate, preventing insufficient return of the liquid heat transfer fluid and subsequent dryness on the inner surface of the substrate, which could lead to localized overheating and damage to the phase change radiator. This further improves the heat conduction rate of the phase change radiator, increases its heat dissipation capacity, and reduces its heat dissipation resistance. In addition, the heat dissipation capacity of the 3D phase change radiator is further enhanced by the placement of heat dissipation fins between adjacent condensing shells. The condensing chamber is formed by sealing one end of the condensing shell with the first cover plate, further expanding the application range of the 3D phase change radiator. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial applicability.

[0123] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A 3D phase change heat sink, characterized in that, include: An evaporation section includes a substrate, a first cover plate, and a porous capillary structure. The substrate and the first cover plate are disposed opposite to each other and sealed together to form an evaporation chamber. The porous capillary structure is located on the inner surface of the substrate, and the outer surface of the substrate away from the first cover plate is a heat absorption surface. The condensation section includes at least a plurality of condensation shells, which are arranged in parallel and spaced apart above the first cover plate; The guide tooth is located inside the condensation shell, with one end protruding from the condensation shell and contacting the porous capillary structure. The guide tooth is inclined inside the condensation shell and forms a preset angle with the inner surface of the substrate. The first cover plate is also provided with a plurality of slots, and the protruding end of the guide tooth is inserted into the first cover plate through the slots. The heat transfer medium is located inside the evaporation chamber.

2. The 3D phase change heat sink according to claim 1, characterized in that: The preset angle range between the guide teeth and the inner surface of the substrate is 30 degrees to 90 degrees.

3. The 3D phase change heat sink according to claim 1, characterized in that: The guide teeth have a corrugated fin structure.

4. The 3D phase change heat sink according to claim 1, characterized in that: The porous capillary structure includes at least one of the following: a woven wire mesh structure, a metal powder sintered porous structure, and a woven wire knot groove.

5. The 3D phase change heat sink according to claim 1, characterized in that: The substrate sidewall is also provided with an injection port, which is used to fill the heat transfer medium.

6. The 3D phase change heat sink according to claim 1, characterized in that: The guide teeth are spaced at a predetermined distance from the inside of the side wall of the condenser shell.

7. The 3D phase change heat sink according to claim 1, characterized in that: The end of the condenser shell away from the first cover plate is sealed and welded. The condenser shell and the first cover plate are sealed together to form a condenser cavity, and the condenser cavity is connected to the evaporator cavity.

8. The 3D phase change heat sink according to claim 1, characterized in that: The condensation section also includes a second cover plate and a third cover plate stacked in sequence. The second cover plate is located above the condensation shell. The second cover plate, the third cover plate, the condensation shell and the first cover plate are sealed together to form a condensation cavity, and the condensation cavity is connected to the evaporation cavity.

9. The 3D phase change heat sink according to claim 8, characterized in that: The second cover plate is also provided with multiple slots, and the end of the condenser housing away from the first cover plate is inserted into the second cover plate through the slots.

10. The 3D phase change heat sink according to claim 1, characterized in that: The 3D phase change heat sink also includes multiple heat dissipation fins, which are located on the outer surface of the condensation shell and between adjacent condensation shells.

11. A method for manufacturing a 3D phase change heat sink, characterized in that, Includes the following steps: An evaporation section is provided, the evaporation section includes a substrate, a first cover plate and a porous capillary structure, the substrate and the first cover plate are disposed opposite to each other and sealed to form an evaporation cavity, the porous capillary structure is located on the inner surface of the substrate, and the outer surface of the substrate away from the first cover plate is a heat absorption surface. A condensation section is provided, the condensation section comprising at least a plurality of condensation shells, the condensation shells being arranged in parallel and spaced apart above the first cover plate; A flow guide tooth is provided, which is located inside the condensation shell and one end of the flow guide tooth protrudes from the condensation shell and contacts the porous capillary structure. The flow guide tooth is inclined inside the condensation shell and forms a preset angle with the inner surface of the substrate. The flow guide tooth is fixedly connected to the condensation shell by welding. The evaporation section and the condensation section are fixedly connected by welding. After welding, the non-condensable gas inside the evaporation chamber is discharged through the injection port, and the heat transfer medium is filled in. The injection port is then sealed to obtain a 3D phase change radiator.

12. The method for manufacturing a 3D phase change heat sink according to claim 11, characterized in that: Methods for welding the evaporation section and the condensation section include atmosphere-protected brazing furnace welding and vacuum brazing furnace welding.

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