Flexible heat conduction system for a scientific camera

Abstract

The present application relates to the technical field of scientific camera, and especially relates to a flexible heat conduction system of a scientific camera. An elastic component is additionally arranged between a heat conduction block and a TEC device, the elastic component can control the extrusion force between the heat conduction components according to the elastic deformation amount, and in the installation process, good contact is ensured and the fragile components are not damaged. In addition, the elastic component can absorb the deformation caused by temperature change, the temperature cycle in the use process of the scientific camera will not cause the internal stress to damage the components, and meanwhile, the position of the image sensor can be ensured not to change with the temperature change and affect the PV value.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of scientific camera, in particular to a flexible heat conduction system of scientific camera. BACKGROUND

[0002] Scientific camera often needs to use thermoelectric refrigeration technology to refrigerate image sensor to extremely low temperature to improve long exposure imaging quality, and a traditional mounting mode is a rigid connection mode of layer-by-layer stacking of thermoelectric cooling piece (TEC), heat conduction block, image sensor and control circuit board and other components to guide heat of the image sensor to the cold end of the TEC, and refrigeration is performed by using the TEC.

[0003] However, the disadvantages of this mode are as follows:

[0004] 1: In the stacking mounting process, in order to ensure good heat transfer performance, a large downward pressure is often needed to ensure that each stacked component has a small contact thermal resistance. However, due to the rigid connection, the downward pressure cannot be controlled, and the device, especially the TEC and the image sensor which are relatively fragile in structure, is often damaged.

[0005] 2: In the camera use process, due to the need to undergo repeated refrigeration and temperature recovery cycles, the materials of each component have large differences in expansion coefficient, and the rigidly connected system is prone to thermal stress, resulting in device damage and unstable connection.

[0006] 3: The stacked system of the image sensor will change position due to thermal expansion and contraction during temperature alternation, affect the surface PV value, and affect the performance of the camera. SUMMARY

[0007] The technical problem to be solved by the present application is to provide a flexible heat conduction system of scientific camera.

[0008] In order to solve the above technical problems, the technical scheme adopted by the present application is:

[0009] A flexible heat conduction system of scientific camera, the scientific camera comprising a control board and an image sensor arranged on the control board, the flexible heat conduction system comprising a heat conduction block, an elastic assembly and a TEC device; the control board is provided with a through hole corresponding to the position of the image sensor, one end of the heat conduction block is in contact with the image sensor through the through hole, and the other end of the heat conduction block is connected with the TEC device through the elastic assembly.

[0010] The present application has the following beneficial effects:

[0011] The application provides a flexible heat conduction system of a scientific camera, which adds an elastic component between a heat conduction block and a TEC device, the elastic component can control the extrusion force between the heat conduction components according to the elastic deformation amount, and in the installation process, the elastic component can ensure good contact and will not damage the fragile components. In addition, the elastic component can absorb the deformation caused by temperature change, and the temperature cycle in the use process of the scientific camera will not cause internal stress damage to the components, and at the same time, the position of the image sensor can be ensured not to change with the temperature change to affect the PV value. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the flexible heat conduction system of the scientific camera of the application.

[0013] Figure 2 It is a schematic diagram of the structure of the flexible heat conduction system of the scientific camera of the application.

[0014] Figure 3 It is a schematic diagram of the structure of the elastic component of the flexible heat conduction system of the scientific camera of the application.

[0015] Figure 4 It is a schematic diagram of the structure of the bottom plate of the flexible heat conduction system of the scientific camera of the application.

[0016] REFERENCE SIGNS:

[0017] 1, image sensor; 2, control board; 3, wire harness; 4, stud; 5, wall plug; 6, bottom plate; 7, heat conduction block; 8, first sliding block; 9, second sliding block; 10, first spring; 11, second spring; 12, guide pin; 13, TEC device;

[0018] 601, first spring fixing baffle; 602, second spring fixing baffle;

[0019] 801, guide structure; 802, first spring guide column; 901, guide structure; 902, second spring guide column. DETAILED DESCRIPTION

[0020] In order to explain the technical content, the purposes and effects of the application in detail, the following will be described in combination with the embodiments and the accompanying drawings.

[0021] Please refer to Figures 1 to 4 The application provides a flexible heat conduction system of a scientific camera, which includes a control board and an image sensor arranged on the control board, and the flexible heat conduction system includes a heat conduction block, an elastic component and a TEC device; the control board is provided with a through hole corresponding to the position of the image sensor, one end of the heat conduction block is in contact with the image sensor through the through hole, and the other end of the heat conduction block is connected with the TEC device through the elastic component.

[0022] From the above description, the beneficial effects of the present application are that:

[0023] The flexible heat conduction system of the scientific camera provided by the present application adds an elastic component between the heat conduction block and the TEC device, which can control the extrusion force between the heat conduction components according to the elastic deformation amount of the elastic component. During installation, good contact is ensured without damaging fragile components. In addition, the elastic component can absorb the deformation caused by temperature changes, so that temperature cycles during the use of the scientific camera will not cause internal stress damage to the components, and at the same time, the position of the image sensor will not change with temperature changes to affect the PV value.

[0024] Further, the heat conduction block is in a convex structure, the upper end surface of the convex structure of the heat conduction block is in contact with the image sensor, and the horizontal two end surfaces of the convex structure of the heat conduction block are first inclined surfaces;

[0025] The elastic component includes a first sliding block, a first spring, a second sliding block, a second spring, and a guide pin; the first sliding block and the second sliding block are respectively arranged at the positions of the horizontal two end surfaces of the convex structure of the heat conduction block, and the opposite sides of the first sliding block and the second sliding block are respectively provided with second inclined surfaces matched with the first inclined surfaces; the first sliding block and the second sliding block are movably connected through the guide pin; one end of the first sliding block away from the guide pin is in abutment with one end of the first spring; and one end of the second sliding block away from the guide pin is in abutment with one end of the second spring.

[0026] The first sliding block and the second sliding block are respectively in contact with the TEC device.

[0027] From the above description, through the above specific structure design, the mutual cooperation relationship between the heat conduction block and the elastic component and between the TEC device and the elastic component is realized, the mutual movement is realized through the cooperation of the first inclined surface and the second inclined surface, the guide pin plays a role in limiting the movement direction and can only move along the extension direction of the guide pin. The first spring and the second spring respectively provide elastic support force for the first sliding block and the second sliding block.

[0028] Further, the first inclined surface and the second inclined surface are respectively coated with a heat-conducting material or a lubricating material.

[0029] From the above description, through the above-mentioned manner, the heat conduction effect or the stability of relative movement can be improved.

[0030] Further, the first sliding block and the second sliding block are respectively in direct contact with the TEC device, and the contact surface is coated with a heat-conducting material or a lubricating material.

[0031] From the above description, through the above-mentioned manner, the heat conduction effect or the stability of relative movement can be improved.

[0032] Further, two opposite limiting convex walls are arranged on the second inclined surface, and grooves matched with the limiting convex walls are arranged on the first inclined surface at positions corresponding to the limiting convex walls.

[0033] From the above description, it can be seen that the first slider and the second slider cooperate with the heat-conducting block more stably and are less likely to be separated, and can further limit and guide.

[0034] Further, the elastic assembly further comprises a first spring fixing baffle and a second spring fixing baffle, the first spring fixing baffle is arranged on a side of the first slider away from the guide pin, the other end of the first spring abuts against the first spring fixing baffle, the second spring fixing baffle is arranged on a side of the second slider away from the guide pin, and the other end of the second spring abuts against the second spring fixing baffle.

[0035] From the above description, it can be seen that the first spring fixing baffle and the second spring fixing baffle are arranged to provide support force for the first spring and the second spring respectively.

[0036] Further, a first spring guide column extending outward is arranged on a side of the first slider away from the guide pin, and one end of the first spring is sleeved on the first spring guide column; a second spring guide column extending outward is arranged on a side of the second slider away from the guide pin, and one end of the second spring is sleeved on the second spring guide column.

[0037] From the above description, it can be seen that the spring guide column is arranged to ensure the structural stability during assembly and use of the spring, avoid separation, limit the compression direction of the spring, ensure force balance, and thus ensure the service life of the spring.

[0038] Further, a bottom plate is further arranged, the bottom plate is provided with a wall plug, the image sensor is connected with the control board through pins or welding, signals and power of the image sensor are led out through welding of the control board, one side of the wire is welded with the control board, and the other side is welded with the wall plug.

[0039] From the above description, it can be seen that the power supply and communication of the image sensor are realized through the above manner.

[0040] Further, a stud is further arranged on the bottom plate, and the control board is fixed on the stud through a screw.

[0041] Further, the stud is made of a material with poor heat conduction performance.

[0042] From the above description, the material with poor heat conduction performance is PEEK material or POM material, etc.

[0043] Please refer toFigures 1 to 4 Embodiment one of the present application is:

[0044] The present application provides a flexible heat conduction system of a scientific camera, the scientific camera comprising a control board 2 and an image sensor 1 arranged on the control board, the flexible heat conduction system comprising a heat conduction block 7, an elastic assembly and a TEC device 13; the control board 2 is provided with a through hole corresponding to the position of the image sensor, one end of the heat conduction block 7 is in contact with the image sensor 1 through the through hole, and the other end of the heat conduction block 7 is connected with the TEC device 13 through the elastic assembly.

[0045] The heat conduction block 7 is in direct contact with the bottom packaging shell of the image sensor 1 through the through hole, and the material of the heat conduction block is a metal material with good heat conduction, such as aluminum alloy or red copper. The heat conduction block 7 is in a convex structure, the upper end surface of the convex structure of the heat conduction block 7 is in contact with the image sensor, and the horizontal two end surfaces of the convex structure of the heat conduction block are first inclined surfaces;

[0046] The elastic assembly comprises a first sliding block 8, a first spring 10, a second sliding block 9, a second spring 11, a guide pin 12, a first spring fixing baffle 601 and a second spring fixing baffle 602; the first sliding block and the second sliding block are respectively arranged at the positions of the horizontal two end surfaces of the convex structure of the heat conduction block, and the opposite sides of the first sliding block and the second sliding block are respectively provided with second inclined surfaces matched with the first inclined surfaces, the inclined angles of the inclined surfaces of the heat conduction block 7, the first sliding block 8 and the second sliding block 9 are the same, and the first inclined surfaces and the second inclined surfaces are coated with heat-conducting materials or lubricating materials. The first sliding block and the second sliding block are movably connected through the guide pin, one end of the first sliding block away from the guide pin is in abutment with one end of the first spring, and one end of the second sliding block away from the guide pin is in abutment with one end of the second spring; the first sliding block and the second sliding block are in direct contact with the TEC device, and the contact surfaces are coated with heat-conducting materials or lubricating materials.

[0047] The second inclined surface is provided with two oppositely arranged limiting convex walls, and the first inclined surface is provided with grooves matched with the limiting convex walls at positions corresponding to the limiting convex walls. The first sliding block and the second sliding block can be more stably matched with the heat conduction block, are not easy to be separated, and can further play a limiting and guiding role.

[0048] The first spring fixing baffle 601 is arranged on the side of the first sliding block away from the guide pin, the other end of the first spring is in abutment with the first spring fixing baffle, and the second spring fixing baffle 602 is arranged on the side of the second sliding block away from the guide pin, and the other end of the second spring is in abutment with the second spring fixing baffle.

[0049] The first slider 8 is provided with a first spring guide column extending outward on the side away from the guide pin, and one end of the first spring is sleeved on the first spring guide column; the second slider 9 is provided with a second spring guide column extending outward on the side away from the guide pin, and one end of the second spring is sleeved on the second spring guide column. The spring guide column can ensure the stability of the structure during the assembly and use of the spring, avoid disengagement, limit the compression direction of the spring, ensure the force balance, and thus ensure the service life of the spring.

[0050] The bottom plate 6 is further provided with a wall socket 5 and a stud 4, the image sensor 1 is connected to the control board through pins or welding, the signal and power supply of the image sensor 1 are led out through the welding of the wire harness 3 on the control board, one side of the wire harness 3 is welded to the control board, and the other side is welded to the wall socket 5. The wall socket 5 and the bottom plate 6 are connected in airtightness through laser welding or glue, and the number of wall sockets 5 is determined according to the number of leads required by the image sensor 1.

[0051] The control board 2 is fixed on the stud 4 by screws. The material of the stud 4 is a material with poor heat conduction performance, such as PEEK material or POM material.

[0052] Specifically, the heat conduction block 7 is in a convex shape structure, and the two sides are designed as smooth inclined surfaces, the two inclined surfaces are in direct contact with the first slider 8 and the second slider 9 respectively, the inclined angles of the heat conduction block 7, the first slider 8 and the second slider 9 are all ensured to be the same, a heat conduction material or a lubricating material is applied on the inclined surface contact surface, and the heat conduction block 7 is guided by the guide structure 801 of the first slider 8 and the guide structure 901 of the second slider 9. The guide structure is the matching structure of the limiting convex wall and the groove. The first slider 8 and the second slider 9 are guided by a plurality of guide pins 12, the first slider 8 and the second slider 9 are in direct contact with the TEC 13, a layer of heat conduction material or lubricating material is applied on the contact surface, and horizontal sliding along the surface of the TEC device 13 is generated. In the use process, the TEC device 13 is powered on, the cold quantity is transmitted to the image sensor 1 through the first slider 8, the second slider 9 and the heat conduction block 7 for refrigeration. The side surfaces of the first slider 8 and the second slider 9 are respectively designed with a first spring guide column 802 and a second spring guide column 902, one end of the first spring 10 is connected with the first slider 8, and the other end is connected with the first spring fixing baffle 601 designed on the bottom plate 6. One end of the second spring 11 is connected with the second slider 9, and the other end is connected with the second spring fixing baffle 602 designed on the bottom plate 6. The heat conduction block 7 can move in the vertical direction during installation, and the contact force between the components can be controlled by controlling the compression amount of the compression spring.

[0053] In summary, the flexible heat conduction system of the scientific camera provided by the application adds an elastic component between the heat conduction block and the TEC device, the elastic component can control the extrusion force between the heat conduction components according to the elastic deformation amount, and in the installation process, good contact is ensured without damaging fragile components. In addition, the elastic component can absorb the deformation caused by temperature change, so that the temperature cycle in the use process of the scientific camera will not cause internal stress damage to the components, and at the same time, the position of the image sensor can be ensured not to change with the temperature change to affect the PV value.

[0054] The above is only an embodiment of the application, and does not limit the patent range of the application, and any equivalent transformation, direct or indirect application in the related technical field by using the content of the specification and drawings of the application is also included in the patent protection range of the application.

Claims

1. A flexible heat conduction system for a scientific camera, the scientific camera comprising a control board and an image sensor disposed on the control board, characterized in that, The flexible heat conduction system comprises a heat conduction block, an elastic assembly and a TEC device; the control board is provided with a through hole corresponding to the position of the image sensor, one end of the heat conduction block is in contact with the image sensor through the through hole, and the other end of the heat conduction block is connected with the TEC device through the elastic assembly; The heat conduction block is in a convex structure, the upper end surface of the convex structure of the heat conduction block is in contact with the image sensor, and the horizontal two end surfaces of the convex structure of the heat conduction block are first inclined surfaces; The elastic assembly comprises a first sliding block, a first spring, a second sliding block, a second spring and a guide pin; the first sliding block and the second sliding block are respectively arranged at the positions of the horizontal two end surfaces of the convex structure of the heat conduction block, and the opposite side surfaces of the first sliding block and the second sliding block are respectively provided with second inclined surfaces matched with the first inclined surfaces; The first sliding block and the second sliding block are movably connected through the guide pin, one end of the first sliding block away from the guide pin is in abutment with one end of the first spring, and one end of the second sliding block away from the guide pin is in abutment with one end of the second spring; the first sliding block and the second sliding block are respectively in contact with the TEC device; The elastic assembly further comprises a first spring fixing baffle and a second spring fixing baffle; the first spring fixing baffle is arranged on the side of the first sliding block away from the guide pin, and the other end of the first spring is in abutment with the first spring fixing baffle; The second spring fixing baffle is arranged on the side of the second sliding block away from the guide pin, and the other end of the second spring is in abutment with the second spring fixing baffle; The first inclined surface and the second inclined surface are respectively coated with a heat conduction material or a lubricating material.

2. The flexible heat conduction system of a scientific camera of claim 1, wherein, The first sliding block and the second sliding block are respectively in direct contact with the TEC device, and the contact surfaces are coated with a heat conduction material or a lubricating material.

3. The flexible heat conduction system of a scientific camera of claim 1, wherein, The second inclined surface is provided with two oppositely arranged limiting convex walls, and the first inclined surface is provided with grooves matched with the limiting convex walls at positions corresponding to the limiting convex walls.

4. The flexible heat conduction system of a scientific camera of claim 1, wherein, The side of the first sliding block away from the guide pin is provided with a first spring guide column extending outward, and one end of the first spring is sleeved on the first spring guide column; the side of the second sliding block away from the guide pin is provided with a second spring guide column extending outward, and one end of the second spring is sleeved on the second spring guide column.

5. The flexible heat conduction system of a scientific camera of claim 1, wherein, A bottom plate is further provided, the bottom plate is provided with a through-wall socket, the image sensor is connected with the control board through pins or welding, and the signal and power supply of the image sensor are led out through the welding of the control board on the wire harness, one side of the wire harness is welded with the control board, and the other side is welded with the through-wall socket.

6. The flexible heat conduction system of a scientific camera of claim 5, wherein, The bottom plate is further provided with a stud, and the control board is fixed on the stud through a screw.

7. The flexible heat conduction system of a scientific camera of claim 6, wherein, The material of the stud is a material with poor heat conduction performance.

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