Component mounting system

Abstract

In the management device (16) of the component mounting system (100), a management storage section (164) accumulatively stores management data (DM) which is data associating the suction position offset data (D1), the parameter information (D2), and the processing status image (G2) acquired from the mounting machine (12) by the management communication section (161). Also, the management control section (165) causes the suction position offset distribution (AD) indicating the distribution of the data group of the suction position offset data (D1) to be displayed on the management display section (162) in a case where an instruction to select one parameter information from among the parameter information (D2) is input via the management operation section (163). In this state, and in a case where an instruction to select one or a plurality of specific position offset data from among the data group of the suction position offset distribution (AD) is input via the management operation section (163), the management control section (165) causes the processing status image (G2) corresponding to the specific position offset data to be displayed on the management display section (162) simultaneously with the suction position offset distribution (AD).

Description

Technical Field

[0001] The present invention relates to a component mounting system having an mounting machine, the mounting machine obtaining a component mounting substrate on which components are mounted. Background Technology

[0002] Conventionally, component mounting systems are known that include a mounting machine for mounting electronic components (hereinafter referred to as "components") on a substrate such as a printed circuit board to obtain a component mounting substrate. In such a component mounting system, the mounting machine includes: a feeder for supplying components; and a mounting head having a suction nozzle for adsorbing components supplied by the feeder and for mounting the components onto the substrate. The mounting head performs the component mounting process according to the positions of a plurality of target mounting positions pre-set on the substrate.

[0003] During component mounting via a mounting head, a positional shift sometimes occurs between the actual adsorption position (actual adsorption position) and the target adsorption position of the component picked up by the nozzle. This positional shift can cause a shift in the actual mounting position of the component on the substrate relative to the target mounting position. When this shift occurs, it affects the quality of the component mounting substrate obtained using the mounting machine.

[0004] Patent Document 1 discloses a technique for improving the positional accuracy of a component's actual mounting position on a substrate. In the technique disclosed in Patent Document 1, an image is captured of the component while its mounting head (head), held by a suction nozzle (clamp), is positioned at a target mounting position (installation position) on the substrate. This image recognition is used to determine the positional difference between the center position of the component held by the suction nozzle and the target mounting position. Furthermore, this positional difference is used to perform a mounting machine calibration to improve the positional accuracy of the component's actual mounting position on the substrate.

[0005] Furthermore, sometimes due to aging of the suction nozzle, the actual adsorption position of the component may deviate beyond the allowable range. In such cases, even if the mounting machine is calibrated based on the difference between the center position of the component held by the suction nozzle and the target mounting position, as disclosed in Patent Document 1, it may not be possible to eliminate the defective positional deviation of the component's actual mounting position on the substrate. In the technology disclosed in Patent Document 1, since it is difficult to determine the cause of the positional deviation of the suction nozzle's actual adsorption position of the component, it is difficult to take appropriate countermeasures to eliminate the defective positional deviation of the component's actual mounting position on the substrate.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Publication No. 2001-223499 Summary of the Invention

[0009] The present invention was made in view of the above circumstances, and its object is to provide a component mounting system that can confirm the occurrence of positional deviation of the suction nozzle on the component and determine the cause of such positional deviation.

[0010] One aspect of the present invention relates to a component mounting system comprising: a mounting machine including a feeder and a mounting head, the feeder performing a component supply process for supplying components, the mounting head having a nozzle for performing a component adsorption process for adsorbing the components, and obtaining a component mounting substrate by performing a component mounting process for mounting the components adsorbed by the nozzle onto a substrate; and a management device capable of data communication with the mounting machine. The management device includes: a management communication unit that acquires adsorption position offset data, parameter information, and processing status images from the mounting machine; the adsorption position offset data representing the offset of the adsorption position of the element relative to the nozzle during the element adsorption process; the parameter information being used to determine the element, the feeder, the nozzle, and the mounting head used in each of the element supply process, the element adsorption process, and the element mounting process; and the processing status images representing images of the processing status of each process; a management storage unit that accumulates and stores management data associated with the adsorption position offset data, the parameter information, and the processing status images; a management display unit that displays information from the management data; a management operation unit that receives instructions regarding the display mode of the management display unit; and a management control unit that controls the management display unit according to the instructions input to the management operation unit. When an instruction to select one parameter from the parameter information is input via the management operation unit, the management control unit controls the management display unit to display an adsorption position offset distribution representing the distribution of data groups of the adsorption position offset data focusing on the one parameter information. Furthermore, when the adsorption position offset distribution is displayed on the management display unit, and when an instruction to select one or more specific adsorption position offset data from the data group of the adsorption position offset distribution is input via the management operation unit, the management control unit controls the management display unit to simultaneously display the processing status images corresponding to the specific adsorption position offset data and the adsorption position offset distribution.

[0011] The objectives, features, and advantages of this invention will become clearer from the following detailed description and accompanying drawings. Attached Figure Description

[0012] Figure 1 This is a diagram showing the overall configuration of a component mounting system according to an embodiment of the present invention.

[0013] Figure 2 It is a block diagram of the mounting machine that the component mounting system possesses.

[0014] Figure 3 This is a top view showing the structure of the main body of the installation machine.

[0015] Figure 4 This is an enlarged view showing the head unit of the main body of the installation machine.

[0016] Figure 5 This is a block diagram of the inspection device that is included in the component mounting system.

[0017] Figure 6 It is a block diagram of the management device of the component mounting system.

[0018] Figure 7 It is a diagram showing the display screen of the management display unit of the management device, and it is a diagram showing the state of the adsorption position offset distribution.

[0019] Figure 8 It is a diagram showing the display screen of the management display unit, and it is also a diagram showing the state of the mounting position offset distribution.

[0020] Figure 9 It is a diagram showing the display screen of the management display unit, and it is a diagram showing the state of simultaneously displaying the adsorption position offset distribution and the mounting position offset distribution.

[0021] Figure 10 It is a diagram showing the display screen of the management display unit, and it is a diagram showing the state of simultaneously displaying the distribution of adsorption position offset and the distribution of mounting position offset, as well as the adsorption position offset shift diagram and the mounting position offset shift diagram.

[0022] Figure 11 This is a diagram showing another example of a display configuration where the adsorption position offset distribution and the mounting position offset distribution, as well as the adsorption position offset shift diagram and the mounting position offset shift diagram, are displayed simultaneously.

[0023] Figure 12 It is a diagram showing the display screen of the management display unit, and it is a diagram showing the state of the adsorption level shift.

[0024] Figure 13 It is a diagram showing the display screen of the management display unit, and it is a diagram showing the state of the normal adsorption rate table. Detailed Implementation

[0025] Hereinafter, the component mounting system according to embodiments of the present invention will be described with reference to the accompanying drawings.

[0026] like Figure 1 As shown, the component mounting system 100 according to this embodiment includes a pattern forming apparatus 10, a pattern inspection apparatus 11, a mounting machine 12, a mounting inspection apparatus 13, a reflow apparatus 14, a reflow inspection apparatus 15, and a management apparatus 16.

[0027] The pattern forming apparatus 10, pattern inspection apparatus 11, mounting machine 12, mounting inspection apparatus 13, reflow apparatus 14, and reflow inspection apparatus 15 are connected in this order in a straight line to form a component mounting line. The management device 16 is connected to the pattern inspection apparatus 11, mounting machine 12, mounting inspection apparatus 13, and reflow inspection apparatus 15 for data communication.

[0028] The pattern forming apparatus 10 is an apparatus for obtaining a pattern forming substrate PP with a pattern formed of solder paste. The pattern forming substrate PP is fed into a pattern inspection apparatus 11. The pattern inspection apparatus 11 includes an imaging unit for photographing the pattern forming substrate PP. The pattern inspection apparatus 11 inspects the pattern forming substrate PP based on a pattern substrate image G1, which represents an image of the pattern forming substrate PP obtained by the imaging unit. The pattern substrate image G1 is an image containing a region containing pixel groups corresponding to the pattern of solder paste in the pattern forming substrate PP. The pattern substrate image G1 is an image that allows confirmation, for example, of the formation state of the solder paste pattern in the pattern forming substrate PP. The pattern inspection apparatus 11 inspects the formation state of the solder paste pattern in the pattern forming substrate PP by performing specified image processing on the pattern substrate image G1. The pattern forming substrate PP inspected by the pattern inspection apparatus 11 is then fed into a mounting machine 12.

[0029] Mounting machine 12 is an apparatus for producing component mounting substrate PPAs on which electronic components (hereinafter referred to as "components") are mounted on a patterned substrate PP. Regarding this mounting machine 12, besides... Figure 1 Also refer to Figures 2 to 4 Please provide an explanation. Furthermore, in Figure 3 In this context, orthogonal XY coordinates on a horizontal plane are used to represent directional relationships.

[0030] The mounting machine 12 includes a mounting machine main body 2, a mounting control unit 4, a mounting communication unit 40, and a mounting storage unit 40M. The mounting machine main body 2 is a structural part that performs component mounting processing such as mounting components onto a pattern forming substrate PP during the production of a component mounting substrate PPA. The mounting communication unit 40 is an interface for data communication with a management device 16 and has the function of outputting various data and information to the management device 16. The mounting control unit 4 controls the component mounting processing of the mounting machine main body 2 according to the substrate data D25 stored in the mounting storage unit 40M, and also controls the data communication of the mounting communication unit 40.

[0031] The main body 2 of the installation machine includes a main frame 21, a conveyor 23, a component supply unit 24, a head unit 25, and a substrate support unit 28.

[0032] The main frame 21 is a structure housing the various parts constituting the main body 2 of the mounting machine. Viewed from above in a direction orthogonal to both the X and Y axes (vertical direction), it is roughly rectangular in shape. A conveyor 23 extends along the X-axis and is disposed on the main frame 21. The conveyor 23 transports the pattern forming substrate PP along the X-axis. The pattern forming substrate PP transported on the conveyor 23 is positioned at a designated working position (the component mounting position on the pattern forming substrate PP) based on the substrate support unit 28. The substrate support unit 28 positions the pattern forming substrate PP on the conveyor 23 by supporting it from below.

[0033] The component supply unit 24 is disposed at each of the two ends of the main frame 21 in the Y-axis direction, separated by the conveyor 23. The component supply unit 24 is a region in which multiple feeders 24F are assembled on the main frame 21 in an arranged configuration, and the placement of each feeder 24F is divided according to each component held by the holding head 251 of the head unit 25 (described later). The feeders 24F are detachably mounted to the component supply unit 24. The feeders 24F are devices for performing component supply processing. There are no particular limitations on the feeder 24F as long as it can hold multiple components and supply the held components to designated component supply positions set within the feeder; for example, it can be a belt feeder. A belt feeder is a feeder that has a reel wound with a component holding belt at specified intervals wound around it and supplies components by feeding the component holding belt from the reel.

[0034] The head unit 25 is held on the moving beam 27. A fixed guide rail 261 extending along the Y-axis and a ball screw shaft 262 driven by a Y-axis servo motor 263 are provided on the main frame 21. The moving beam 27 is positioned on the fixed guide rail 261, and a nut portion 271 on the moving beam 27 is screwed onto the ball screw shaft 262. Furthermore, a guide member 272 extending along the X-axis and a ball screw shaft 273 driven by an X-axis servo motor 274 are provided on the moving beam 27. The head unit 25 is movably held on the guide member 272, and a nut portion on the head unit 25 is screwed onto the ball screw shaft 273. Moreover, based on the movement of the Y-axis servo motor 263, the moving beam 27 moves in the Y-axis direction, and based on the movement of the X-axis servo motor 274, the head unit 25 moves relative to the moving beam 27 in the X-axis direction. That is, the head unit 25 can move in the Y-axis direction as the moving beam 27 moves, and can also move in the X-axis direction along the moving beam 27. The head unit 25 can move between the component supply unit 24 and the pattern forming substrate PP supported by the substrate support unit 28. The head unit 25 performs a component mounting process of mounting a component onto the pattern forming substrate PP by moving between the component supply unit 24 and the pattern forming substrate PP.

[0035] like Figure 4 As shown, the head unit 25 includes multiple mounting heads 251. Each mounting head 251 has a suction nozzle 2511 mounted at its distal (lower) end. The suction nozzle 2511 is capable of adsorbing and holding components supplied by the feeder 24F. The suction nozzle 2511 performs component adsorption processing. The suction nozzle 2511 can be connected to one of a negative pressure generating device, a positive pressure generating device, and the atmosphere via an electrically operated switching valve. That is, by supplying negative pressure to the suction nozzle 2511, the component can be adsorbed and held by the suction nozzle 2511, and then, by supplying positive pressure, the adsorption and holding of the component is released. Each mounting head 251 performs component mounting processing on the pattern forming substrate PP at each of a plurality of target mounting positions set on the pattern forming substrate PP, mounting the component adsorbed and held by the suction nozzle 2511 onto the pattern forming substrate PP. Each mounting head 251 obtains a component mounting substrate PPA by performing component mounting processing on the pattern forming substrate PP.

[0036] Each mounting head 251 is capable of rising and falling relative to the skeleton of the head unit 25 in the Z-axis direction (vertical direction), and is capable of rotating about a head axis extending along the Z-axis direction. Each mounting head 251 is capable of rising and falling along the Z-axis direction between a holdable position where the element can be held by the suction nozzle 2511 and a retracted position located above the holdable position. That is, when the element is held by the suction nozzle 2511, each mounting head 251 descends from the retracted position to the holdable position, and holds the element at the holdable position. On the other hand, after holding the element, each mounting head 251 rises from the holdable position to the retracted position. Moreover, each mounting head 251 is capable of rising and falling along the Z-axis direction between the holdable position and the retracted position, the holdable position being a position where the element held by the suction nozzle 2511 can be mounted on a predetermined target mounting position on the patterning substrate PP.

[0037] like Figure 2 and Figure 3 As shown, the main body 2 of the mounting unit also includes a camera mounting unit 3. The camera mounting unit 3 performs a shooting action on the subject and acquires a video image. The camera mounting unit 3 includes a first camera unit 31, a second camera unit 32, and a third camera unit 33.

[0038] The first imaging unit 31 is disposed on the main frame 21 between the component supply unit 24 and the transmitter 23, and is a camera equipped with an imaging device such as CMOS (Complementary metal-oxide-semiconductor) or CCD (Charged-coupled device). When the component mounting process is performed by each mounting head 251, the first imaging unit 31 captures images from below of the components held by the suction nozzles 2511 of each mounting head 251 during the movement of the head unit 25 from the component supply unit 24 towards the pattern forming substrate PP supported by the substrate support unit 28, thereby obtaining a suction processing image G24.

[0039] The adsorption processing image G24 is an image containing a region with a pixel group corresponding to the adsorption holding surface of the nozzle 2511 and a region with a pixel group corresponding to the element adsorbed by the nozzle 2511. Furthermore, when the nozzle 2511 does not adsorb or hold an element, the adsorption processing image G24 is an image containing only the region with a pixel group corresponding to the adsorption holding surface of the nozzle 2511, but not the region containing the pixel group corresponding to the element. The adsorption processing image G24 is an image showing the processing state of the element adsorption processing performed by the nozzle 2511, included in the processing state image G2 acquired by the mounting machine 12. The adsorption processing image G24 is an image that can confirm the processing state of the element adsorption processing, such as the posture of the element adsorbed by the nozzle 2511, the offset of the element's adsorption position relative to the nozzle 2511, etc. The adsorption processing image G24 is input to the mounting control unit 4 (described later) and is referenced when the adsorption position offset is calculated by the data calculation unit 46. Furthermore, the adsorption processing image G24 is transmitted to the management device 16 via the mounting communication unit 40.

[0040] The second imaging unit 32 is a camera, such as one equipped with a CMOS or CCD imaging device, disposed on the head unit 25. The second imaging unit 32 captures images of the component supply position of the feeder 24F from an oblique upward position when the head unit 25 is configured such that the suction nozzle 2511 is directly above the component supply position of the feeder 24F. Specifically, the second imaging unit 32 captures images of the component supplied to the component supply position by the feeder 24F from an oblique upward position before the suction nozzle 2511 performs its suction action, thus acquiring a first supply processing image G21. Furthermore, the second imaging unit 32 captures images of the component supply position while the suction nozzle 2511 is performing its suction action on the component supplied to the component supply position by the feeder 24F, thus acquiring a second supply processing image G22. Additionally, the second imaging unit 32 captures images of the component supply position after the suction action by the suction nozzle 2511 has ended, thus acquiring a third supply processing image G23.

[0041] The first supply processing image G21 is an image containing a region with a pixel group corresponding to the component supply position of the feeder 24F and a region with a pixel group corresponding to the component supplied to the component supply position. The second supply processing image G22 is an image containing a region with a pixel group corresponding to the component supply position of the feeder 24F, a region with a pixel group corresponding to the component supplied to the component supply position, and a region with a pixel group corresponding to the nozzle 2511. The third supply processing image G23 is an image containing a region with a pixel group corresponding to the component supply position of the feeder 24F after the suction action performed by the nozzle 2511 has ended. The first supply processing image G21, the second supply processing image G22, and the third supply processing image G23 are images representing the processing state of the component supply process performed by the feeder 24F, and are included in the processing state image G2 acquired by the mounting machine 12. The first supply processing image G21, the second supply processing image G22, and the third supply processing image G23 are images that can confirm the processing status as a component supply process, such as the posture of the component supplied to the component supply position of the feeder 24F, and the adsorption of the component by the nozzle 2511 at the component supply position. The first supply processing image G21, the second supply processing image G22, and the third supply processing image G23 are transmitted to the management device 16 via the installation communication unit 40.

[0042] Furthermore, the second imaging unit 32 captures an image of the target mounting position from an oblique angle when the suction nozzle 2511, configured by the head unit 25 to hold the component, is positioned directly above the target mounting position set on the pattern forming substrate PP. Specifically, the second imaging unit 32 captures an image of the target mounting position on the pattern forming substrate PP from an oblique angle before the mounting head 251 mounts the component held by the suction nozzle 2511 onto the pattern forming substrate PP, thereby acquiring a first mounting processing image G25. Moreover, the second imaging unit 32 captures an image of the target mounting position after the component mounting operation performed by the mounting head 251 has ended, thereby acquiring a second mounting processing image G26.

[0043] The first mounting processing image G25 is an image containing a region with a pixel group corresponding to the target mounting position on the pattern forming substrate PP and a region with a pixel group corresponding to the periphery of the target mounting position. The second mounting processing image G26 is an image containing a region with a pixel group corresponding to the target mounting position after the component mounting operation performed by the mounting head 251 has ended. The first mounting processing image G25 and the second mounting processing image G26 are images showing the processing state of the component mounting process performed by the mounting head 251, including the processing state image G2 acquired by the mounting machine 12. The first mounting processing image G25 and the second mounting processing image G26 are images that can confirm the processing state of the component mounting process, such as the posture of the component mounted on the target mounting position on the pattern forming substrate PP. The first mounting processing image G25 and the second mounting processing image G26 are transmitted to the management device 16 via the mounting communication unit 40.

[0044] The third imaging unit 33 is a camera equipped with an imaging device such as a CMOS or CCD, which is disposed in the head unit 25. During the mounting process of each actuator mounted on the head unit 251, the third imaging unit 33 captures images of various marks attached to the upper side of the pattern forming substrate PP supported by the substrate support unit 28 from above. By recognizing the marks on the pattern forming substrate PP by the third imaging unit 33, the positional offset of the pattern forming substrate PP relative to the origin coordinates is detected.

[0045] The mounting storage unit 40M stores the substrate data D25 referenced by the mounting control unit 4. The substrate data D25 contains multiple parameter information D2, target adsorption position information DAP, and target mounting position information DPP required for control of component mounting processing of the mounting machine body 2 performed by the mounting control unit 4. The parameter information D2 includes component information D21, head information D22, nozzle information D23, and feeder information D24.

[0046] In component information D21, parameters used to determine the category of a component are recorded, including the component name indicating the component type, the component's external dimensions in the X and Y axes, and the component's thickness. Head information D22 records parameters used to determine the category of the mounting head 251. In head information D22, parameters used to determine the category of the mounting head 251 are recorded, including the mounting head 251's number. Nozzle information D23 records parameters used to determine the category of the nozzle 2511. In nozzle information D23, parameters used to determine the category of the nozzle 2511 are recorded, including the nozzle 2511's type and its identifier. Feeder information D24 records parameters used to determine the category of the feeder 24F. In feeder information D24, parameters used to determine the category of the feeder 24F are recorded, including the feeder 24F's type and the location of the component supply unit 24 of the feeder 24F.

[0047] The Target Adsorption Position Information (DAP) is information registered as a parameter regarding the target adsorption position (target adsorption position) of the component when adsorbed by the nozzle 2511. In the Target Adsorption Position Information (DAP), the coordinates of the target adsorption position of the component relative to the nozzle 2511 in the X and Y axes are registered as parameters. The target adsorption position is typically set at the center of the adsorbed surface of the component. The Target Mounting Position Information (DPP) is information registered as a parameter regarding the target mounting position of the component on the patterning substrate PP. In the Target Mounting Position Information (DPP), the coordinates of the target mounting position on the patterning substrate PP in the X and Y axes are registered as parameters.

[0048] The mounting control unit 4 includes a CPU (Central Processing Unit), a ROM (Read Only Memory) storing control programs, and RAM (Random Access Memory) used as the CPU's working area. The mounting control unit 4 controls the operation of various structural elements of the mounting machine body 2 by executing the control programs stored in the ROM via the CPU, controls the data communication operation of the mounting communication unit 40, and performs various arithmetic operations. The mounting control unit 4 controls the operation of various structural elements of the mounting machine body 2 based on the substrate data D25 stored in the mounting storage unit 40M. For example... Figure 2 As shown, the installation control unit 4 includes a communication control unit 41, a substrate transport control unit 42, a component supply control unit 43, a head control unit 44, an imaging control unit 45, and a data calculation unit 46 as its main functional components.

[0049] The communication control unit 41 controls the data communication between the mounting machine 12 and the management device 16 by controlling the mounting communication unit 40. The mounting communication unit 40, controlled by the communication control unit 41, sends the adsorption position offset data D1, adsorption level data D3, and adsorption state data D4 acquired by the data calculation unit 46 (described later), parameter information D2 contained in the substrate data D25 stored in the mounting storage unit 40M, and processing status images G2 acquired by the first imaging unit 31 and the second imaging unit 32 to the management device 16. The parameter information D2 sent to the management device 16 via the mounting communication unit 40 includes component information D21, head information D22, nozzle information D23, and feeder information D24. Furthermore, the processing status images G2 sent to the management device 16 via the mounting communication unit 40 include a first supply processing image G21, a second supply processing image G22, a third supply processing image G23, an adsorption processing image G24, a first mounting processing image G25, and a second mounting processing image G26.

[0050] Details will be described later. The adsorption position offset data D1, adsorption level data D3, and adsorption state data D4 are data obtained by the data calculation unit 46 for each element loading process performed by the mounting head 251. During one element loading process performed by the mounting head 251, one element is used from multiple elements, one mounting head 251 is used from multiple mounting heads 251, one suction nozzle 2511 is used from multiple suction nozzles 2511, and one feeder 24F is used from multiple feeders 24F. In other words, the element, mounting head 251, suction nozzle 2511, and feeder 24F used are uniquely determined for each element loading process performed by the mounting head 251. Furthermore, for each element loading process performed by the mounting head 251, the first imaging unit 31 and the second imaging unit 32 acquire each processing state image G2. Therefore, the adsorption position offset data D1, adsorption level data D3, adsorption state data D4, parameter information D2, and processing state image G2 obtained by the data calculation unit 46 for each component mounting process performed by the mounting head 251 are correlated with each other.

[0051] The substrate transport control unit 42 controls the transporter 23 to transport the pattern forming substrate PP. The component supply control unit 43 controls the component supply processing of each of the multiple feeders 24F arranged in the component supply unit 24 according to the component information D21 and feeder information D24 in the substrate data D25. The head control unit 44 controls the mounting head 251 by controlling the head unit 25 according to the component information D21, head information D22, nozzle information D23, target adsorption position information DAP, and target mounting position information DPP in the substrate data D25. Thus, the head control unit 44 causes the mounting head 251 to perform component mounting processing corresponding to each of the multiple target mounting positions set on the pattern forming substrate PP, by mounting the component held by the nozzle 2511 onto the pattern forming substrate PP. The imaging control unit 45 controls the imaging operation performed by the first imaging unit 31, the second imaging unit 32, and the third imaging unit 33 constituting the mounting imaging unit 3.

[0052] The data calculation unit 46 identifies the actual adsorption position of the nozzle 2511 on the component based on the adsorption processing image G24 acquired by the first imaging unit 31, and calculates the positional offset of the identified actual adsorption position relative to the target adsorption position represented by the target adsorption position information DAP. Furthermore, the data calculation unit 46 acquires adsorption position offset data D1, representing the amount of positional offset between the actual adsorption position and the target adsorption position, for each component mounting process performed by the mounting head 251. The adsorption position offset data D1 acquired by the data calculation unit 46 becomes data representing the amount of offset of the component's adsorption position relative to the nozzle 2511 during the component adsorption process.

[0053] Furthermore, the data calculation unit 46 acquires the negative pressure level data of the negative pressure generating device connected to the suction nozzle 2511 as adsorption level data D3, representing the adsorption level of the suction nozzle 2511 on the element during the element adsorption process. At this time, the data calculation unit 46 acquires the adsorption level data D3 for each element mounting process performed by the mounting head 251.

[0054] Furthermore, the data calculation unit 46, based on the negative pressure level data of the negative pressure generating device connected to the suction nozzle 2511, acquires adsorption state data D4 indicating whether the adsorption state of the suction nozzle 2511 on the element during the element adsorption process is normal, for each element mounting process performed by the mounting head 251. During the element adsorption process performed by the suction nozzle 2511, if the negative pressure level of the negative pressure generating device is within the allowable range, the data calculation unit 46 acquires adsorption state data D4 with added information indicating that the adsorption state of the suction nozzle 2511 on the element is normal. On the other hand, if the negative pressure level of the negative pressure generating device is outside the allowable range, the data calculation unit 46 acquires adsorption state data D4 with added information indicating that the adsorption state of the suction nozzle 2511 on the element is abnormal.

[0055] The adsorption position offset data D1, adsorption level data D3, and adsorption state data D4 acquired by the data calculation unit 46 for each element are sent to the management device 16 via the installation communication unit 40 in association with the parameter information D2 and the processing state image G2.

[0056] Return to Figure 1 The component mounting substrate PPA obtained based on the component mounting process of the mounting head 251 is transferred into the mounting inspection apparatus 13. The mounting inspection apparatus 13 is a device that inspects the component mounting substrate PPA based on a mounting substrate image G3 representing an image of the component mounting substrate PPA. Regarding this mounting inspection apparatus 13, besides… Figure 1 In addition, refer to Figure 5 The inspection device 13 includes an inspection communication unit 131, an inspection imaging unit 132, and an inspection control unit 133.

[0057] The inspection communication unit 131 is an interface for data communication with the management device 16, and has the function of outputting various data and information to the management device 16. The inspection communication unit 131 sends the mounting position offset data D5 obtained by the data calculation unit 1333 (described later) and the mounting substrate image G3 obtained by the inspection imaging unit 132 to the management device 16.

[0058] The inspection imaging unit 132 is a camera equipped with an imaging device such as a CMOS or CCD. The inspection imaging unit 132 captures an image of the component mounting substrate PPA being transported from the mounting machine 12 from above to obtain a mounting substrate image G3. The mounting substrate image G3 is an image containing a region with pixel groups corresponding to the components on the component mounting substrate PPA. The mounting substrate image G3 is an image that allows confirmation of, for example, the orientation of the components on the component mounting substrate PPA after it has been removed from the mounting machine 12, the offset of the component mounting position, etc.

[0059] The inspection control unit 133 includes a CPU, a ROM storing control programs, and RAM used as the CPU's working area. The inspection control unit 133 controls the inspection communication unit 131 and the inspection imaging unit 132 by executing the control programs stored in the ROM through the CPU, and performs various arithmetic operations. The inspection control unit 133, as a main functional component, includes a communication control unit 1331, an imaging control unit 1332, and a data calculation unit 1333.

[0060] The communication control unit 1331 controls the data communication between the inspection device 13 and the management device 16 by controlling the inspection communication unit 131. The shooting control unit 1332 controls the shooting action of the inspection shooting unit 132.

[0061] The data calculation unit 1333 identifies the actual mounting positions (actual mounting positions) of multiple components on the component mounting substrate PPA based on the mounting substrate image G3 acquired by the inspection and imaging unit 132, and calculates the position offsets between the identified multiple actual mounting positions and the multiple target mounting positions represented by the target mounting position information DPP. Furthermore, the data calculation unit 1333 acquires mounting position offset data D5, representing the amount of position offset between the actual mounting position and the target mounting position, for each of the multiple target mounting positions set on the pattern forming substrate PP. The mounting position offset data D5 acquired by the data calculation unit 1333 becomes data representing the amount of offset of the mounting position of the component relative to the pattern forming substrate PP during the component mounting process performed by the mounting head 251.

[0062] The mounting position offset data D5 acquired by the data calculation unit 1333 is sent to the management device 16 via the inspection communication unit 131 in a state associated with the mounting substrate image G3 acquired by the inspection imaging unit 132.

[0063] Return to Figure 1 After being inspected by the mounting inspection device 13, the component mounting substrate PPA is transferred into the reflow device 14. The reflow device 14 is a device for obtaining a reflow substrate PPB by performing a reflow process that melts and solidifies the solder on the component mounting substrate PPA.

[0064] The reflow substrate PPB obtained by the reflow apparatus 14 is transferred into the reflow inspection apparatus 15. The reflow inspection apparatus 15 is equipped with an imaging unit for capturing images of the reflow substrate PPB. The reflow inspection apparatus 15 inspects the reflow substrate PPB based on a reflow substrate image G4, which represents an image of the reflow substrate PPB obtained based on the image captured by the imaging unit. The reflow substrate image G4 is an image containing regions with pixel groups corresponding to the components on the reflow substrate PPB. The reflow substrate image G4 is, for example, an image that allows confirmation of the orientation of the components on the reflow substrate PPB after reflow processing. The reflow inspection apparatus 14 inspects the state of the components on the reflow substrate PPB by performing specified image processing on the reflow substrate image G4.

[0065] The management device 16 is connected to the pattern inspection device 11, the mounting machine 12, the mounting inspection device 13, and the reflow inspection device 15 via data communication, and includes, for example, a microcomputer. The management device 16 receives a pattern substrate image G1 from the pattern inspection device 11, and also receives adsorption position offset data D1, parameter information D2, adsorption level data D3, adsorption status data D4, and processing status image G2 from the mounting machine 12. Furthermore, the management device 16 receives mounting position offset data D5 and the mounting substrate image G3 from the mounting inspection device 13, and also receives a reflow substrate image G4 from the reflow inspection device 15. The management device 16 is operated by an operator.

[0066] Reference Figure 6 The following block diagram illustrates the structure of the management device 16. The management device 16 includes a management communication unit 161, a management display unit 162, a management operation unit 163, a management storage unit 164, and a management control unit 165.

[0067] The management communication unit 161 is an interface for data communication with the pattern inspection device 11, the mounting machine 12, the mounting inspection device 13, and the reflow inspection device 15. The management communication unit 161 acquires a pattern substrate image G1 from the pattern inspection device 11, and acquires adsorption position offset data D1, parameter information D2, adsorption level data D3, adsorption status data D4, and a processing status image G2 from the mounting machine 12. Furthermore, the management communication unit 161 acquires mounting position offset data D5 and a mounting substrate image G3 from the mounting inspection device 13, and acquires a reflow substrate image G4 from the reflow inspection device 15.

[0068] The management storage unit 164 accumulates and stores various data, information, and images acquired by the management communication unit 161. The management storage unit 164 accumulates and stores management data DM that associates the adsorption position offset data D1, parameter information D2, adsorption level data D3, adsorption status data D4, mounting position offset data D5, patterned substrate image G1, processing status image G2, mounting substrate image G3, and reflow substrate image G4, respectively.

[0069] The management display unit 162 includes, for example, a liquid crystal display (LCD). The management display unit 162 displays information of management data DM stored in the management storage unit 164. The display operation of the management display unit 162 is controlled by the management control unit 165.

[0070] The management operation unit 163 includes a keyboard, mouse, or touchscreen mounted on the management display unit 162. The management operation unit 163 accepts input operations from operators regarding various commands related to the display mode of the management display unit 162.

[0071] The management control unit 165 controls the management display unit 162 according to the instructions input to the management operation unit 163.

[0072] When a suction offset display command, indicating the positional offset of the element relative to the suction nozzle 2511, is input via the management operation unit 163, the management control unit 165 causes the management display unit 162 to display, as shown in the image. Figure 7 The display screen DS1 is as shown. Specifically, the management control unit 165 displays the adsorption position offset distribution AD, which represents the distribution of data groups containing adsorption position offset data D1 included in each management data DM, on the display screen DS1 of the management display unit 162, based on the management data DM accumulated and stored in the management storage unit 164. The adsorption position offset distribution AD is, for example, represented as an "XY offset distribution" which shows the distribution of the position offset of the element relative to the target adsorption position of the nozzle 2511, as indicated by each adsorption position offset data D1.

[0073] Based on the adsorption position offset distribution AD displayed on the management display unit 162, the operator can visually confirm the occurrence of position offset of the nozzle 2511 on the actual adsorption position of the component.

[0074] At this time, the management control unit 165 can control the management display unit 162 to simultaneously display the adsorption position offset statistics AST, which represents the statistics of data groups containing adsorption position offset data D1, and the adsorption position offset distribution AD. For data groups containing adsorption position offset data D1, the adsorption position offset statistics AST includes information such as the average position offset, the variance and standard deviation (3σ), which are indicators of the magnitude of data dispersion, and the maximum and minimum position offsets. This adsorption position offset statistics AST can also be associated with information such as the upper and lower limits of the allowable range of adsorption position offset and / or information such as CP and CPK, which are process capability indicators.

[0075] Furthermore, the management control unit 165 controls the management display unit 162 in a manner that allows the date selection area B1, the line (component mounting line) selection area B2, the component selection area B3, the head selection area B4, the nozzle selection area B5, and the feeder selection area B6, which are selected via input operations from the management operation unit 163, to be set on the display screen DS1.

[0076] The operator can select the acquisition date or period based on the data calculation unit 46 of the installation control unit 4 by operating the date selection area B1 using the management operation unit 163. For example, when a specified date or period is selected based on the input operation to the date selection area B1, the management control unit 165 causes the management display unit 162 to display the adsorption position offset distribution AD, which shows the distribution of data groups containing the adsorption position offset data D1 acquired by the data calculation unit 46 of the installation control unit 4 on the specified date or period.

[0077] Furthermore, by using the management operation unit 163 to operate the Line selection area B2, the operator can select the installation machine 12 that serves as the output source of each adsorption position offset data D1 constituting the adsorption position offset distribution AD. For example, if a specific installation machine 12 is selected based on the input operation to the Line selection area B2, the management control unit 165 instructs the management display unit 162 to display the adsorption position offset distribution AD, which shows the distribution of data groups containing each adsorption position offset data D1 output from the installation communication unit 40 of the specified installation machine 12.

[0078] The component selection area B3, head selection area B4, nozzle selection area B5, and feeder selection area B6 on the display screen DS1 are areas for inputting instructions to select a parameter from the component information D21, head information D22, nozzle information D23, and feeder information D24, which are associated with the parameter information D2 constituting the suction position offset data D1. The operator can input an instruction to select component information D21 from parameter information D2 by operating the component selection area B3 using the management operation unit 163. Similarly, the operator can input an instruction to select head information D22 from parameter information D2 by operating the head selection area B4 using the management operation unit 163. Furthermore, the operator can input an instruction to select nozzle information D23 from parameter information D2 by operating the nozzle selection area B5 using the management operation unit 163. In addition, the operator can use the management operation unit 163 to operate the feeder selection area B6, thereby inputting a command to select feeder information D24 from parameter information D2.

[0079] The management control unit 165 switches the display on the management display unit 162 to reflect the adsorption position offset distribution AD of the selected information from parameter information D2, in response to changes in parameter selection. Specifically, when a command to select component information D21 from parameter information D2 is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to display the adsorption position offset distribution AD of the component determined by component information D21. Similarly, when a command to select head information D22 from parameter information D2 is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to display the adsorption position offset distribution AD of the mounting head 251 determined by head information D22. Furthermore, when a command to select nozzle information D23 from parameter information D2 is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to display the adsorption position offset distribution AD of the nozzle 2511 determined by nozzle information D23. Furthermore, when an instruction to select feeder information D24 from parameter information D2 is input via management operation unit 163, management control unit 165 controls management display unit 162 by displaying the adsorption position offset distribution AD of feeder 24F determined by feeder information D24.

[0080] Here, the components, mounting head 251, nozzle 2511, and feeder 24F, determined by the component information D21, head information D22, nozzle information D23, and feeder information D24 respectively, which are associated with the adsorption position offset data D1 constituting the adsorption position offset distribution AD, may be the cause of the adsorption position offset of the nozzle 2511 on the component. In other words, the posture and shape of the component supplied by the feeder 24F will affect the adsorption retention of the component by the nozzle 2511. Furthermore, the operating characteristics and aging condition of the nozzle 2511 and mounting head 251 will also affect the adsorption retention of the component by the nozzle 2511.

[0081] Therefore, according to the control of the management control unit 165 on the management display unit 162, the adsorption position offset distribution AD, which focuses on the information selected from the parameter information D2 via the management operation unit 163, is displayed on the management display unit 162. Thus, the operator can determine the cause of the adsorption position offset by visually confirming the adsorption position offset of the nozzle 2511 to the component.

[0082] Furthermore, assuming that there exists adsorption position offset data D1 in the adsorption position offset distribution AD that exceeds the adsorption offset tolerance range AAT, where AAT represents the allowable range of offset amount of the adsorption position relative to the element of the nozzle 2511, the management control unit 165 can control the management display unit 162 in a manner that makes the adsorption position offset data D1 exceeding the adsorption offset tolerance range AAT display in a different form than other position offset data. For example, the management control unit 165 can control the management display unit 162 in a manner that makes the display color of the plotted point of adsorption position offset data D1 exceeding the adsorption offset tolerance range AAT different from the display color of other position offset data.

[0083] like Figure 7 As shown, assuming the adsorption position offset distribution AD is displayed on the management display unit 162, an instruction to select one or more specific position offset data D1S from the data group of adsorption position offset data D1 constituting the adsorption position offset distribution AD is input via the management operation unit 163. In this case, the management control unit 165 controls the management display unit 162 to simultaneously display the image group GG containing the first supply processing image G21, the second supply processing image G22, the third supply processing image G23, the adsorption processing image G24, the first mounting processing image G25, and the second mounting processing image G26 constituting the processing state image G2 corresponding to the specific position offset data D1S, along with the adsorption position offset distribution AD. Figure 7The example shown illustrates the selection of two specific position offset data D1S contained within a specified selection region PR from the data set of adsorption position offset data D1 constituting the adsorption position offset distribution AD. In this case, the management control unit 165 controls the management display unit 162 to simultaneously display two image sets GG corresponding to the two specific position offset data D1S and the adsorption position offset distribution AD.

[0084] Each image constituting the processing status image G2 is associated with the adsorption position offset data D1, and represents the processing status of each process: component supply processing of the feeder 24F, component adsorption processing of the nozzle 2511, and component mounting processing of the mounting head 251. By reviewing each image of the processing status image G2, which is simultaneously displayed on the management display unit 162 along with the adsorption position offset distribution AD, corresponding to the selection command via the specific position offset data D1S from the management operation unit 163, the operator can accurately grasp the impact of adsorption position offset on each process of component supply processing, component adsorption processing, and component mounting processing. Therefore, the operator can more accurately determine the cause of adsorption position offset. After determining the cause of adsorption position offset, the operator can take appropriate countermeasures to eliminate the defect of component mounting position offset on the pattern forming substrate PP caused by adsorption position offset.

[0085] If the cause of the adsorption position shift is determined to be a component, the operator will, for example, verify the input values ​​of parameters such as the component's external dimensions in the component information D21 registered in the substrate data D25. Furthermore, if parameters in the component information D21 are mistakenly entered, the operator will perform a data modification operation to change the data in the component information D21 as a countermeasure to address the cause of the adsorption position shift.

[0086] If the cause of the adsorption position deviation is determined to be the mounting head 251, the operator will check, for example, whether the adsorption position set by the nozzle 2511 for the component adsorption, is appropriate. Furthermore, if the adsorption position set on the mounting head 251 is inappropriate, the operator will adjust the adsorption position set on the mounting head 251 as a countermeasure to the cause of the adsorption position deviation. Additionally, if it is determined that the mounting head 251 is worn out, the operator will replace the mounting head 251.

[0087] If the suction nozzle 2511 is determined to be the cause of the adsorption position shift, the operator may perform operations such as cleaning or replacing the suction nozzle 2511 as a countermeasure to address the cause of the adsorption position shift.

[0088] If the cause of the adsorption position deviation is determined to be the feeder 24F, the operator may perform a countermeasure such as changing the feeder 24F.

[0089] Furthermore, in this embodiment, when an instruction to select specific position offset data D1S is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to simultaneously display the image group GG, which includes the mounting substrate image G3, in addition to the images constituting the processing status image G2, and the adsorption position offset distribution AD. By checking the processing status image G2 and the mounting substrate image G3 simultaneously displayed on the management display unit 162 along with the adsorption position offset distribution AD, the operator can confirm whether the position offset of the adsorption position of the nozzle 2511 on the component affects the position offset of the mounting position of the component on the pattern forming substrate PP. In addition, by comparing the images constituting the processing status image G2 with the mounting substrate image G3, the operator can also confirm whether a component position offset has occurred during the transport of the component mounting substrate PPA from the mounting machine 12 to the mounting inspection device 13.

[0090] Furthermore, in this embodiment, when an instruction to select specific position offset data D1S is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to simultaneously display the image group GG, which includes the patterned substrate image G1 and the reflow substrate image G4, along with the adsorption position offset distribution AD, in addition to the processing status image G2 and the mounting substrate image G3. By checking the patterned substrate image G1 displayed simultaneously with the adsorption position offset distribution AD on the management display unit 162, the operator can confirm the influence of the solder paste pattern formation on the adsorption position offset. In addition, by checking the reflow substrate image G4 displayed simultaneously with the adsorption position offset distribution AD on the management display unit 162, the operator can confirm the position offset status of the components in the reflow substrate PPB after reflow processing.

[0091] When a mounting offset display command indicating the positional offset of a component in the display element mounting substrate PPA is input via the management operation unit 163, the management control unit 165 causes the management display unit 162 to display... Figure 8The display screen DS2 is as shown. Specifically, the management control unit 165 displays a mounting position offset distribution PD on the display screen DS2 of the management display unit 162, which represents the distribution of data groups containing mounting position offset data D5 included in each management data DM, based on each management data DM accumulated and stored in the management storage unit 164. The mounting position offset distribution PD is, for example, represented as an "XY offset distribution" which shows the distribution of the position offsets in the X and Y coordinates, relative to the target mounting position, with respect to the position offset of the actual mounting position of the component in the component mounting substrate PPA represented by each mounting position offset data D5.

[0092] The operator can visually confirm the occurrence of positional offset of the components in the component mounting substrate PPS produced by the mounting machine 1 by referring to the mounting position offset distribution PD displayed on the management display unit 162. In addition, by comparing the adsorption position offset distribution AD and the mounting position offset distribution PD displayed on the management display unit 162, the operator can confirm whether the positional offset of the actual adsorption position of the component by the nozzle 2511 affects the positional offset of the actual mounting position of the component on the component mounting substrate PPA.

[0093] At this time, the management control unit 165 can also control the management display unit 162 in a manner that displays the statistical information PST of the mounting position offset, which represents the statistics of the data group containing each mounting position offset data D5, and the mounting position offset distribution PD at the same time.

[0094] Furthermore, the management control unit 165 controls the management display unit 162 so that the date selection area B1, line selection area B2, component selection area B3, head selection area B4, nozzle selection area B5, and feeder selection area B6, which are input operations via the management operation unit 163, can be set on the display screen DS2. The operator can select the acquisition date or acquisition period based on the data calculation unit 1333 of the inspection control unit 133 by operating the date selection area B1 using the management operation unit 163. Furthermore, the operator can select the mounting machine 12 corresponding to each mounting position offset data D5 constituting the mounting position offset distribution PD by operating the line selection area B2 using the management operation unit 163. The component selection area B3, head selection area B4, nozzle selection area B5, and feeder selection area B6 set on the display screen DS2 are, in the same way as the display screen DS1 described above, areas for inputting instructions to select one parameter from the component information D21, head information D22, nozzle information D23, and feeder information D24 of the parameter information D2 associated with the configuration and mounting position offset data D5.

[0095] The management control unit 165 switches the display on the management display unit 162 to reflect the mounting position offset distribution PD of the selected information from parameter information D2, in response to changes in parameter selection. Specifically, when a command to select component information D21 from parameter information D2 is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to display the mounting position offset distribution PD of the component determined by component information D21. Similarly, when a command to select head information D22 from parameter information D2 is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to display the mounting position offset distribution PD of the mounting head 251 determined by head information D22. Furthermore, when a command to select nozzle information D23 from parameter information D2 is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to display the mounting position offset distribution PD of the nozzle 2511 determined by nozzle information D23. Furthermore, when an instruction to select feeder information D24 from parameter information D2 is input via management operation unit 163, management control unit 165 controls management display unit 162 by displaying the mounting position offset distribution PD of feeder 24F determined by feeder information D24.

[0096] Thus, under the control of the management control unit 165 on the management display unit 162, the mounting position offset distribution PD, which focuses on the information selected from the parameter information D2 via the management operation unit 163, is displayed on the management display unit 162. Therefore, the operator can determine the cause of the mounting position offset by visually confirming the occurrence of the component mounting position offset in the component mounting substrate PPA.

[0097] Furthermore, assuming that there is a mounting position offset data D5 in the mounting position offset distribution PD that exceeds the mounting offset tolerance range PAT, where PAT represents the allowable range of offset of the mounting position of the component in the component mounting substrate PPA, the management control unit 165 can control the management display unit 162 to make the mounting position offset data D5 that exceeds the mounting offset tolerance range PAT display in a different form than other position offset data. For example, the management control unit 165 can control the management display unit 162 to make the display color of the plotted point of the mounting position offset data D5 that exceeds the mounting offset tolerance range PAT different from the display color of other position offset data.

[0098] like Figure 8As shown, assuming the mounting position offset distribution PD is displayed on the management display unit 162, an instruction to select one or more specific position offset data D5S from the data group of mounting position offset data D5 constituting the mounting position offset distribution PD is input via the management operation unit 163. In this case, the management control unit 165 controls the management display unit 162 to simultaneously display the image group GG containing the first supply processing image G21, the second supply processing image G22, the third supply processing image G23, the adsorption processing image G24, the first mounting processing image G25, the second mounting processing image G26, and the mounting substrate image G3, which constitute the processing state image G2 corresponding to the specific position offset data D5S, along with the mounting position offset distribution PD. Figure 8 The example shown illustrates how two specific position offset data D5S, which are contained within a designated selection area PR, are selected from the data group comprising the mount position offset data D5 constituting the mount position offset distribution PD. In this case, the management control unit 165 controls the management display unit 162 to simultaneously display the two image groups GG corresponding to the two specific position offset data D5S and the mount position offset distribution PD.

[0099] By checking the images of the processing status image G2 and the mounting substrate image G3, which are simultaneously displayed on the management display unit 162 along with the mounting position offset distribution PD, corresponding to the selection command of the specific position offset data D5S via the management operation unit 163, the operator can confirm whether the position offset of the suction position of the nozzle 2511 on the component affects the position offset of the mounting position of the component on the component mounting substrate PPA.

[0100] Furthermore, in this embodiment, when an instruction to select specific position offset data D5S is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to simultaneously display the image group GG, which includes the pattern substrate image G1 and the reflow substrate image G4, along with the mounting position offset distribution PD, in addition to the processing status image G2 and the mounting substrate image G3. By checking the pattern substrate image G1 displayed simultaneously with the mounting position offset distribution PD on the management display unit 162, the operator can confirm the influence of the solder paste pattern formation on the mounting position offset. Furthermore, by checking the reflow substrate image G4 displayed simultaneously with the mounting position offset distribution PD on the management display unit 162, the operator can confirm the position offset status of components in the reflow substrate PPB after reflow processing.

[0101] When simultaneously displaying the positional offsets of the adsorption and mounting positions, and simultaneously displaying commands input via the management operation unit 163, the management control unit 165 causes the management display unit 162 to display... Figure 9The display screen DS3 is as shown. Specifically, the management control unit 165, based on the management data DMs accumulated and stored in the management storage unit 164, simultaneously displays the adsorption position offset distribution AD of each adsorption position offset data D1 contained in each management data DM and the mounting position offset distribution PD of each mounting position offset data D5 contained in each management data DM on the display screen DS3 of the management display unit 162. The operator can easily compare the adsorption position offset distribution AD and the mounting position offset distribution PD based on the information displayed on the management display unit 162. Therefore, the operator can easily confirm whether the positional offset of the adsorption position of the nozzle 2511 on the component affects the positional offset of the mounting position of the component on the component mounting substrate PPA.

[0102] At this time, the management control unit 165 can also control the management display unit 162 in a way that the adsorption position offset statistics information AST and the mounting position offset statistics information PST are displayed simultaneously with the adsorption position offset distribution AD and the mounting position offset distribution PD.

[0103] Furthermore, the management control unit 165 controls the management display unit 162 so that the date selection area B1, line selection area B2, component selection area B3, head selection area B4, nozzle selection area B5, and feeder selection area B6, which are selected via input operations from the management operation unit 163, can be set on the display screen DS3. The operator can select the acquisition date or acquisition period for each adsorption position offset data D1 constituting the adsorption position offset distribution AD and each mounting position offset data D5 constituting the mounting position offset distribution PD by operating the date selection area B1 using the management operation unit 163. Furthermore, the operator can select the mounting machine 12 corresponding to each adsorption position offset data D1 constituting the adsorption position offset distribution AD and each mounting position offset data D5 constituting the mounting position offset distribution PD by operating the line selection area B2 using the management operation unit 163. The component selection area B3, head selection area B4, nozzle selection area B5, and feeder selection area B6 set on the display screen DS3 are, in the same way as the display screens DS1 and DS2 described above, areas for inputting instructions to select one parameter from the component information D21, head information D22, nozzle information D23, and feeder information D24 that constitute the parameter information D2 associated with the suction position offset data D1 and the mounting position offset data D5.

[0104] The management control unit 165 enables the simultaneous display of the adsorption position offset distribution AD and the mounting position offset distribution PD, which are based on information selected from parameter information D2, on the management display unit 162 in response to changes in parameter selection. Specifically, when a command to select component information D21 from parameter information D2 is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to simultaneously display the adsorption position offset distribution AD and the mounting position offset distribution PD of the component determined by component information D21. Similarly, when a command to select head information D22 from parameter information D2 is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to simultaneously display the adsorption position offset distribution AD and the mounting position offset distribution PD of the mounting head 251 determined by head information D22. Furthermore, when an instruction to select nozzle information D23 from parameter information D2 is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 in a manner that simultaneously displays the suction position offset distribution AD and the mounting position offset distribution PD of the nozzle 2511 as determined by the nozzle information D23. Similarly, when an instruction to select feeder information D24 from parameter information D2 is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 in a manner that simultaneously displays the suction position offset distribution AD and the mounting position offset distribution PD of the feeder 24F as determined by the feeder information D24.

[0105] Thus, under the control of the management control unit 165 on the management display unit 162, the adsorption position offset distribution AD and the mounting position offset distribution PD, which are selected from the parameter information D2 via the management operation unit 163, are simultaneously displayed on the management display unit 162. This allows the operator to easily compare the adsorption position offset distribution AD and the mounting position offset distribution PD.

[0106] like Figure 9 As shown, assuming that the adsorption position offset distribution AD and the mounting position offset distribution PD are simultaneously displayed on the management display unit 162, an instruction to select one or more specific position offset data from the data group of one of the position offset distributions is input via the management operation unit 163. Figure 9The example shown illustrates the selection of two specific position offset data D1S contained within a designated selection area PR from the data group of adsorption position offset data D1 constituting the adsorption position offset distribution AD. In this case, the management control unit 165 controls the management display unit 162 to simultaneously display the image group GG containing the first supply processing image G21, the second supply processing image G22, the third supply processing image G23, the adsorption processing image G24, the first mounting processing image G25, the second mounting processing image G26, and the mounting substrate image G3, which constitute the processing state image G2 corresponding to the specific position offset data D1S, along with the adsorption position offset distribution AD and the mounting position offset distribution PD.

[0107] By checking the images in the processing status image G2 and the mounting substrate image G3 displayed on the management display unit 162, which correspond to the selection command for specific position offset data D1S via the management operation unit 163, the operator can confirm whether the position offset of the suction nozzle 2511 at the component's adsorption position affects the position offset of the component's mounting position on the component mounting substrate PPA. Furthermore, in this embodiment, when the command to select specific position offset data D1S is input via the management operation unit 163, the management control unit 165 controls the management display unit 162 to simultaneously display the image group GG, which includes the pattern substrate image G1 and the reflow substrate image G4, along with the adsorption position offset distribution AD and the mounting position offset distribution PD, in addition to the processing status image G2 and the mounting substrate image G3. By checking the pattern substrate image G1 displayed on the management display unit 162, the operator can confirm the influence of the solder paste pattern formation on the adsorption position offset and the mounting position offset. Furthermore, by checking the reflow substrate image G4 displayed on the management display unit 162, the operator can confirm the positional offset of the components in the reflow substrate PPB after reflow processing.

[0108] Furthermore, assuming that when both the adsorption position offset distribution AD and the mounting position offset distribution PD are simultaneously displayed on the management display unit 162, an instruction to select one or more specific position offset data from the data set of one of the position offset distributions is input via the management operation unit 163. As described above... Figure 9The example shown illustrates the selection of two specific position offset data D1S contained within a designated selection area PR from the data group of adsorption position offset data D1 constituting the adsorption position offset distribution AD, which is one type of position offset distribution. In this case, the management control unit 165 controls the management display unit 162 in a manner that makes the attention data D5A corresponding to the specific position offset data D1S in the data group of the mounted position offset distribution PD, which is the other type of position offset distribution, display in a different manner than the other data. For example, the management control unit 165 controls the management display unit 162 in a manner that makes the brightness or contrast of the plotted point of the attention data D5A in the data group of mounted position offset data D5 constituting the mounted position offset distribution PD different from the other data.

[0109] Therefore, the correspondence between specific position offset data D1S and data of interest D5A becomes clear in both the adsorption position offset distribution AD and the mounting position offset distribution PD simultaneously displayed on the management display unit 162. Thus, the operator can properly confirm the correspondence between specific position offset data D1S and data of interest D5A selected via the management operation unit 163. As a result, the operator can more easily confirm whether the position offset of the adsorption position of the nozzle 2511 on the component affects the position offset of the component mounting position on the component mounting substrate PPA.

[0110] Furthermore, the management control unit 165 can also be configured to cause the management display unit 162 to display information when an instruction to select information from parameter information D2 is input via the management operation unit 163. Figure 10 The illustrated display screen is DS4. Specifically, the management control unit 165 controls the management display unit 162 to simultaneously display, in addition to the image group GG, at least one of the adsorption position offset shift diagram AG and the mounting position offset shift diagram PG, along with the adsorption position offset distribution AD and the mounting position offset distribution PD. The adsorption position offset shift diagram AG is a graph showing the time progression of the data group of adsorption position offset data D1. The adsorption position offset shift diagram AG includes graphs showing the time progression of the offset in the X direction, the offset in the Y direction, and the offset in the R direction (rotation direction) regarding the amount of offset relative to the element of the nozzle 2511. The mounting position offset shift diagram PG is a graph showing the time progression of the data group of mounting position offset data D5. The mounting position offset shift diagram PG includes a time shift diagram showing the offset of the mounting position of the element on the pattern forming substrate PP that performs element mounting processing relative to the mounting head 251, a time shift diagram showing the offset in the X direction, a time shift diagram showing the offset in the Y direction, and a time shift diagram showing the offset in the R direction (rotation direction).

[0111] Therefore, the management control unit 165 can simultaneously display the time progression of the adsorption position offset data D1 and the mounting position offset data D5 on the management display unit 162 as a visual graph, along with the adsorption position offset distribution AD and the mounting position offset distribution PD. Thus, the operator can visually confirm the occurrence of the position offset based on the adsorption position offset distribution AD and the mounting position offset distribution PD, and can confirm the time progression of the position offset based on the adsorption position offset progression graph AG and the mounting position offset progression graph PG.

[0112] Furthermore, the management control unit 165 may also be configured to control the management display unit 162 in a manner that simultaneously displays at least one of the adsorption position offset distribution AD and the mounting position offset distribution PD, and at least one of the adsorption position offset shift map AG and the mounting position offset shift map PG. In this case, the management control unit 165 processes the adsorption position offset distribution AD and the adsorption position offset shift map AG as one group, and the mounting position offset distribution PD and the mounting position offset shift map PG as another group. That is, the management control unit 165 controls the management display unit 162 in a manner that simultaneously displays the adsorption position offset distribution AD and the adsorption position offset shift map AG, and simultaneously displays the mounting position offset distribution PD and the mounting position offset shift map PG.

[0113] Assuming that the adsorption position offset distribution AD, the mounting position offset distribution PD, the adsorption position offset shift map AG, and the mounting position offset shift map PG are simultaneously displayed on the management display unit 162, an instruction to select one or more specific position offset data from the data group of the position offset distribution of one of the adsorption position offset distributions AD and the mounting position offset distribution PD is input via the management operation unit 163. Figure 10 The example shown illustrates the selection of two specific position offset data D1S contained within a designated selection area PR from the data group of adsorption position offset data D1, which constitutes the adsorption position offset distribution AD as one type of position offset distribution. In this case, the management control unit 165 controls the management display unit 162 to display the data of interest corresponding to the specific position offset data D1S in each data group of the mounting position offset distribution PD, the adsorption position offset shift map AG, and the mounting position offset shift map PG as the other type of position offset distribution in a different display format than the other data.

[0114] Specifically, in the data group constituting the mounting position offset data D5 of the mounting position offset distribution PD, the data of interest D5A corresponding to the specific position offset data D1S is set to a display format different from the rest of the data. Similarly, in the data group constituting the adsorption position offset data D1 of the adsorption position offset map AG, the data of interest D1A corresponding to the specific position offset data D1S is set to a display format different from the rest of the data. Furthermore, in the data group constituting the mounting position offset data D5 of the mounting position offset map PG, the data of interest D5A corresponding to the specific position offset data D1S is set to a display format different from the rest of the data. For example, the management control unit 165 controls the management display unit 162 to make the brightness or contrast of the plotted points of the data of interest D5A in the mounting position offset distribution PD, the data of interest D1A in the adsorption position offset map AG, and the data of interest D5A in the mounting position offset map PG different from the rest of the data.

[0115] Therefore, the correspondence between the position offset data in the adsorption position offset distribution AD, mounting position offset distribution PD, adsorption position offset progression diagram AG, and mounting position offset progression diagram PG, which are simultaneously displayed on the management display unit 162, becomes clear. Thus, the operator can properly confirm the correspondence between the adsorption position offset data D1 and the mounting position offset data D5, which also includes the time-related factors. As a result, the operator can easily confirm whether the position offset of the adsorption position of the nozzle 2511 on the component, which also includes the time factor, affects the position offset of the component mounting position on the component mounting substrate PPA.

[0116] Assuming that at least one of the position offset distributions of adsorption position offset distribution AD and mounting position offset distribution PD, and at least one of the shift maps of adsorption position offset map AG and mounting position offset map PG are simultaneously displayed on the management display unit 162, an instruction to select one or more specific position offset data from the data groups of position offset distributions displayed on the management display unit 162 is input via the management operation unit 163. In this case, the management control unit 165 controls the management display unit 162 in a manner that, when a position offset distribution different from the position offset distribution of the object of the instruction from the management operation unit 163 is displayed on the management display unit 162, the position offset distribution and the data of interest corresponding to the specific position offset data in each data group of the shift map displayed on the management display unit 162 are displayed in a different format than the other data.

[0117] Furthermore, assuming as Figure 11In the illustrated display DS5, where the adsorption position offset distribution AD, mounting position offset distribution PD, adsorption position offset shift map AG, and mounting position offset shift map PG are simultaneously displayed on the management display unit 162, an instruction to select one or more specific position offset data from the data group of one of the position offset shift maps, the adsorption position offset shift map AG and the mounting position offset shift map PG, is input via the management operation unit 163. Figure 11 The example shown illustrates the selection of two specific position offset data D1S contained within a designated selection area PR from the data group of adsorption position offset data D1 of the adsorption position offset map AG, which constitutes one position offset map. In this case, the management control unit 165 controls the management display unit 162 to display the data of interest corresponding to the specific position offset data D1S in each data group of the mounting position offset map PG, the adsorption position offset distribution AD, and the mounting position offset distribution PD, which constitute the other position offset map, in a different display format than the other data.

[0118] Specifically, in the data group constituting the mounting position offset data D5 of the mounting position offset map PG, the data of interest D5A corresponding to the specific position offset data D1S is set to a display format different from the rest of the data. Similarly, in the data group constituting the adsorption position offset data D1 of the adsorption position offset distribution AD, the data of interest D1A corresponding to the specific position offset data D1S is set to a display format different from the rest of the data. Furthermore, in the data group constituting the mounting position offset data D5 of the mounting position offset data PD, the data of interest D5A corresponding to the specific position offset data D1S is set to a display format different from the rest of the data. For example, the management control unit 165 controls the management display unit 162 to make the brightness or contrast of the plotted points of the data of interest D5A in the mounting position offset map PG, the data of interest D1A in the adsorption position offset distribution AD, and the data of interest D5A in the mounting position offset distribution PD different from the rest of the data.

[0119] Therefore, the correspondence between the position offset data becomes clear in the adsorption position offset distribution AD, mounting position offset distribution PD, adsorption position offset shift diagram AG, and mounting position offset shift diagram PG, which are simultaneously displayed on the management display unit 162. Thus, the operator can properly confirm the correspondence between the adsorption position offset data D1 and the mounting position offset data D5, which also includes the time-varying conditions.

[0120] Assuming that at least one of the position offset distributions of adsorption position offset distribution AD and mounting position offset distribution PD, and at least one of the shift maps of adsorption position offset distribution AG and mounting position offset distribution PG are simultaneously displayed on the management display unit 162, an instruction to select one or more specific position offset data from the data groups of the shift maps displayed on the management display unit 162 is input via the management operation unit 163. In this case, the management control unit 165 controls the management display unit 162 in a manner that, when a shift map different from the shift map of the target of the instruction from the management operation unit 163 is displayed on the management display unit 162, the shift map and the data of interest corresponding to the specific position offset data in each data group of the position offset distribution displayed on the management display unit 162 are displayed in a different format than the other data.

[0121] Furthermore, the management control unit 165 can also be configured to cause the management display unit 162 to display information when an instruction to select information from parameter information D2 is input via the management operation unit 163. Figure 12 The illustrated display screen is DS6. Specifically, the management control unit 165 controls the management display unit 162 to simultaneously display the adsorption level shift graph ALG, in addition to the image group GG, and the position offset distribution of at least one of the adsorption position offset distribution AD and the mounting position offset distribution PD. The adsorption level shift graph ALG is a graph showing the time shift of a data group of adsorption level data D3 included in each management data DM accumulated and stored in the management storage unit 164. Furthermore, the management control unit 165 can also control the management display unit 162 to simultaneously display the adsorption position offset shift graph AG, the mounting position offset shift graph PG, and the adsorption level shift graph ALG with the adsorption position offset distribution AD and the mounting position offset distribution PD.

[0122] Therefore, the management control unit 165 can simultaneously display the adsorption level data D3, which represents the adsorption level of the nozzle 2511 on the element, over time on the management display unit 162 in a visual graph, along with the adsorption position offset distribution AD and the mounting position offset distribution PD. Thus, the operator can visually confirm the occurrence of position offset based on the adsorption position offset distribution AD and the mounting position offset distribution PD, and can confirm the time progression of the adsorption level data D3 based on the adsorption level shift graph ALG.

[0123] At this time, assuming that the adsorption position offset distribution AD, the mounting position offset distribution PD, and the adsorption level shift map ALG are simultaneously displayed on the management display unit 162, an instruction to select one or more specific position offset data from the data group of the position offset distribution of either the adsorption position offset distribution AD or the mounting position offset distribution PD is input via the management operation unit 163. Figure 12 The example shown illustrates the selection of two specific position offset data D1S within a designated selection region PR from a data set of adsorption position offset data D1 constituting the adsorption position offset distribution AD, which is one type of position offset distribution. In this case, the management control unit 165 controls the management display unit 162 to display the data of interest corresponding to the specific position offset data D1S in each data set of the mounted position offset distribution PD and the adsorption level shift map ALG, which is the other type of position offset distribution, in a different display format than the other data.

[0124] Specifically, in the data group constituting the mounting position offset data D5 of the mounting position offset distribution PD, the data of interest D5A corresponding to the specific position offset data D1S is set to a display format different from the other data. Similarly, in the data group constituting the adsorption level data D3 of the adsorption level shift map ALG, the data of interest D3A corresponding to the specific position offset data D1S is set to a display format different from the other data. For example, the management control unit 165 controls the management display unit 162 in a manner that makes the brightness or contrast of the plotted points of the data of interest D5A in the mounting position offset distribution PD and the data of interest D3A in the adsorption level shift map ALG different from the other data.

[0125] Therefore, the correspondence between the position offset distribution AD, the mounting position offset distribution PD, and the adsorption level shift graph ALG, which are simultaneously displayed on the management display unit 162, becomes clear. Thus, the operator can accurately confirm the correspondence between the position offset data D1, D5, and the adsorption level data D3. Consequently, the operator can focus on the adsorption level of the nozzle 2511 on the component to determine whether the position offset of the nozzle 2511 on the component affects the position offset of the component mounting position on the component mounting substrate PPA.

[0126] Assuming that at least one of the position offset distributions (AD and PD) and the adsorption level shift graph (ALG) is simultaneously displayed on the management display unit 162, an instruction to select one or more specific position offset data from the data groups of the position offset distributions displayed on the management display unit 162 is input via the management operation unit 163. In this case, the management control unit 165 controls the management display unit 162 in a manner that, when a position offset distribution different from the position offset distribution targeted by the management operation unit 163 instruction is displayed on the management display unit 162, the data of interest corresponding to the specific position offset data in each data group of the position offset distribution and the adsorption level shift graph (ALG) is displayed in a different format than the other data.

[0127] Furthermore, the management control unit 165 can also be configured to calculate the normal adsorption rate based on the adsorption state data D4 contained in the management data DMs accumulated and stored in the management storage unit 164. Specifically, the management control unit 165 calculates the normal adsorption rate for the component, mounting head 251, nozzle 2511, and feeder 24F, which are represented by the component information D21, head information D22, nozzle information D23, and feeder information D24, respectively. This normal adsorption rate represents the ratio of the total number of times each of the component, mounting head 251, nozzle 2511, and feeder 24F is used in a specified given period to the number of times it is used when the adsorption state represented by the adsorption state data D4 is normal. That is, when observing each type of component, each type of mounting head 251, each type of nozzle 2511, and each type of feeder 24F, as the normal adsorption rate increases, the number of times the nozzle 2511 is used when the adsorption state of the component is normal increases. Therefore, the higher the normal adsorption rate, the less likely it is to be considered a cause of adsorption position deviation and mounting position deviation.

[0128] like Figure 13 As illustrated in the DS7 display screen, the management control unit 165 controls the management display unit 162 by displaying a normal adsorption rate table ART, which represents the normal adsorption rate in tabular form, when at least one of the adsorption position offset distribution AD and the mounting position offset distribution PD is displayed on the management display unit 162. Specifically, assuming that an instruction to select one or more specific position offset data from the data group of the position offset distribution is input via the management operation unit 163 when at least one of the adsorption position offset distribution AD and the mounting position offset distribution PD is displayed on the management display unit 162. Figure 13 The example shown illustrates a scenario where, with both the adsorption position offset distribution AD and the mounting position offset distribution PD simultaneously displayed on the management display unit 162, two specific position offset data D1S containing a designated selection area PR are selected from the data group of adsorption position offset data D1 constituting the adsorption position offset distribution AD. In this case, the management control unit 165 controls the management display unit 162 by displaying a normal adsorption rate table ART containing the normal adsorption rates of the element, mounting head 251, nozzle 2511, and feeder 24F, represented by parameter information D2 corresponding to the specific position offset data D1S. Furthermore, the management control unit 165 can also control the management display unit 162 by simultaneously displaying, in addition to the image group GG, the adsorption position offset shift graph AG, the mounting position offset shift graph PG, and the normal adsorption rate table ART, along with the adsorption position offset distribution AD and the mounting position offset distribution PD.

[0129] By referring to the normal adsorption rate table ART displayed on the management display unit 162, the operator can confirm the normal adsorption rate of each component, mounting head 251, nozzle 2511, and feeder 24F. This allows the operator to easily determine the cause of adsorption position deviation and mounting position deviation.

[0130] The specific embodiments described above mainly include inventions having the following configuration.

[0131] One aspect of the present invention relates to a component mounting system comprising: a mounting machine including a feeder and a mounting head, the feeder performing a component supply process for supplying components, the mounting head having a nozzle for performing a component adsorption process for adsorbing the components, and obtaining a component mounting substrate by performing a component mounting process for mounting the components adsorbed by the nozzle onto a substrate; and a management device capable of data communication with the mounting machine. The management device includes: a management communication unit that acquires adsorption position offset data, parameter information, and processing status images from the mounting machine; the adsorption position offset data representing the offset of the adsorption position of the element relative to the nozzle during the element adsorption process; the parameter information being used to determine the element, the feeder, the nozzle, and the mounting head used in each of the element supply process, the element adsorption process, and the element mounting process; and the processing status images representing images of the processing status of each process; a management storage unit that accumulates and stores management data associated with the adsorption position offset data, the parameter information, and the processing status images; a management display unit that displays information from the management data; a management operation unit that receives instructions regarding the display mode of the management display unit; and a management control unit that controls the management display unit according to the instructions input to the management operation unit. When an instruction to select one parameter from the parameter information is input via the management operation unit, the management control unit controls the management display unit to display an adsorption position offset distribution representing the distribution of data groups of the adsorption position offset data focusing on the one parameter information. Furthermore, when the adsorption position offset distribution is displayed on the management display unit, and when an instruction to select one or more specific adsorption position offset data from the data group of the adsorption position offset distribution is input via the management operation unit, the management control unit controls the management display unit to simultaneously display the processing status images corresponding to the specific adsorption position offset data and the adsorption position offset distribution.

[0132] According to this component mounting system, the mounting machine and the management device can be connected for data communication. In the management device, the management storage unit accumulates and stores management data associated with the adsorption position offset data, parameter information, and processing status images obtained from the mounting machine by the management communication unit. Furthermore, when a command to select a parameter from the parameter information is input via the management operation unit, the adsorption position offset distribution, representing the distribution of data groups focusing on that parameter, is displayed on the management display unit.

[0133] The components, feeder, nozzle, and mounting head, determined by parameter information associated with adsorption position offset data, can be the causes of adsorption position offset by the nozzle. In other words, the posture and shape of the components supplied by the feeder affect the nozzle's ability to hold them. Furthermore, the operating characteristics and aging of the nozzle and mounting head also affect the nozzle's ability to hold components. By displaying the adsorption position offset distribution based on the parameter information selected via the management operation unit on the management display unit, operators can visually confirm the occurrence of adsorption position offset by the nozzle and determine its causes.

[0134] Furthermore, when the adsorption position offset distribution is displayed on the management display unit, and an instruction to select one or more specific position offset data from the adsorption position offset distribution data group is input via the management operation unit, the management control unit simultaneously displays the processing status images corresponding to the specific position offset data and the adsorption position offset distribution on the management display unit.

[0135] Each processing status image is associated with the adsorption position offset data, and represents the processing status of each process: component supply from the feeder, component adsorption from the nozzle, and component mounting from the mounting head. By checking the processing status images displayed simultaneously with the adsorption position offset distribution on the management display unit according to the selection command corresponding to specific position offset data via the management operation unit, the operator can properly grasp the impact of adsorption position offset on each of the component supply, adsorption, and mounting processes. Therefore, the operator can more accurately determine the cause of adsorption position offset. After determining the cause of adsorption position offset, the operator can take appropriate countermeasures to eliminate the defective component mounting position offset on the substrate caused by adsorption position offset.

[0136] The aforementioned component mounting system can be configured such that it further includes a mounting inspection device capable of data communication with the management device, which inspects the component mounting substrate based on a mounting substrate image representing an image of the component mounting substrate. In this configuration, the management communication unit is configured to acquire mounting position offset data, representing the offset of the component's mounting position relative to the substrate during the component mounting process, and the mounting substrate image, from the mounting inspection device. The management storage unit is configured to accumulate and store data that associates the mounting position offset data with the mounting substrate image, serving as management data. Furthermore, when an instruction to select one parameter from the various parameter information is input via the management operation unit, the management control unit controls the management display unit to display a position offset distribution representing the distribution of data groups of the mounting position offset data focusing on the one parameter information, either a mounting position offset distribution or an adsorption position offset distribution. Furthermore, when the management control unit displays the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution on the management display unit, and when an instruction to select one or more specific position offset data from the data group of the position offset distribution is input via the management operation unit, the management display unit controls the management display unit to simultaneously display the processing status image and the mounting substrate image corresponding to the specific position offset data along with the position offset distribution.

[0137] In this configuration, the management control unit can display a mounting position offset distribution, which represents the distribution of mounting position offset data acquired from the mounting inspection device based on the management communication unit, on the management display unit. Based on the mounting position offset distribution displayed on the management display unit, the operator can visually confirm the occurrence of position offsets in the mounting positions of components on the component mounting substrate obtained from the mounting machine.

[0138] Furthermore, when a command to select specific position offset data is input via the management operation unit while at least one of the adsorption position offset distribution and the mounting position offset distribution is displayed on the management display unit, the management control unit simultaneously displays the mounting substrate image and the position offset distribution on the management display unit, in addition to the processing status images. By reviewing the processing status images and the mounting substrate image displayed simultaneously with the position offset distribution on the management display unit, the operator can confirm whether the position offset of the nozzle's adsorption position on the component affects the position offset of the component's mounting position on the substrate.

[0139] The aforementioned component mounting system can be configured such that it further includes: a pattern inspection device, which is connected to the management device for data communication, and inspects the pattern forming substrate, which has a pattern of solder paste used in the component mounting process, based on a pattern forming substrate image representing an image of the pattern forming substrate; and a reflow inspection device, which is connected to the management device for data communication, and inspects the reflow substrate based on a reflow substrate image representing an image of a reflow substrate after reflow processing of the component mounting substrate. In this configuration, the management communication unit is configured to acquire the pattern substrate image from the pattern inspection device and the reflow substrate image from the reflow inspection device, and the management storage unit is configured to accumulate and store data that associates the pattern substrate image and the reflow substrate image as management data. Furthermore, when the management control unit displays the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution on the management display unit, and when an instruction to select one or more specific position offset data from the data group of the position offset distribution is input via the management operation unit, the management display unit controls the management display unit to simultaneously display the processing state image, the mounting substrate image, the pattern substrate image, and the reflow substrate image corresponding to the specific position offset data with the position offset distribution.

[0140] In this configuration, when a command to select specific position offset data is input via the management operation unit while at least one of the position offset distributions—the adsorption position offset distribution and the mounting position offset distribution—is displayed on the management display unit, the management control unit simultaneously displays the pattern substrate image, the reflow substrate image, and the position offset distribution on the management display unit, in addition to the processing status images and the mounting substrate image. By reviewing the pattern substrate image displayed simultaneously with the position offset distribution on the management display unit, the operator can confirm the impact of the solder paste pattern formation on the adsorption and mounting position offsets. Furthermore, by reviewing the reflow substrate image displayed simultaneously with the position offset distribution on the management display unit, the operator can confirm the position offset status of components on the reflow substrate after reflow processing.

[0141] In the aforementioned component mounting system, the following configuration can be adopted: when the management control unit receives an instruction via the management operation unit to select a parameter from the various parameter information, it controls the management display unit to simultaneously display the adsorption position offset distribution and the mounting position offset distribution focusing on the selected parameter information. In this configuration, when the adsorption position offset distribution and the mounting position offset distribution are simultaneously displayed on the management display unit, and when an instruction to select one or more specific position offset data from a data group of one position offset distribution is received via the management operation unit, the management control unit controls the management display unit to display the data of interest corresponding to the specific position offset data in the data group of the other position offset distribution in a different display format than the other data.

[0142] In this configuration, when an instruction to select a parameter from various parameter information is input via the management operation unit, the management control unit simultaneously displays the adsorption position offset distribution and the mounting position offset distribution of that parameter on the management display unit. This allows the operator to easily compare the adsorption position offset distribution and the mounting position offset distribution. Therefore, the operator can easily confirm whether the positional offset of the nozzle's adsorption position on the component affects the positional offset of the component's mounting position on the substrate.

[0143] Furthermore, assuming that an instruction to select one or more specific position offset data from the data set of one position offset distribution is input via the management operation unit when both the adsorption position offset distribution and the mounting position offset distribution are simultaneously displayed on the management display unit, the management control unit controls the management display unit to display the data of interest corresponding to the specific position offset data in the other position offset distribution data set in a different format than the rest of the data. Thus, the correspondence between the adsorption position offset data and the mounting position offset data becomes clear in both the adsorption position offset distribution and the mounting position offset distribution simultaneously displayed on the management display unit. Therefore, the operator can properly confirm the correspondence between the adsorption position offset data and the mounting position offset data. As a result, the operator can more easily confirm whether the position offset of the nozzle at the adsorption position of the component affects the position offset of the component on the substrate.

[0144] In the aforementioned component mounting system, the following configuration can be adopted: when the management control unit receives an instruction to select a parameter from the parameter information via the management operation unit, it controls the management display unit to simultaneously display at least one of the adsorption position offset shift graph representing the time progression of the data group representing the adsorption position offset data and the mounting position offset shift graph representing the time progression of the data group representing the mounting position offset data, along with the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution.

[0145] In this configuration, when an instruction to select a parameter from various parameter information is input via the management operation unit, the management control unit controls the management display unit to simultaneously display the shift map of at least one of the adsorption position offset map and the mounting position offset map, along with the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution. This allows the time progression of the position offset data of at least one of the adsorption position offset data and the mounting position offset data to be visualized as a graph, simultaneously displayed on the management display unit along with the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution. Therefore, the operator can visually confirm the occurrence of the position offset based on the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution, and can confirm the time progression of the position offset based on the shift map of at least one of the adsorption position offset map and the mounting position offset map.

[0146] In the aforementioned component mounting system, the following configuration can be adopted: when the management control unit simultaneously displays the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution, and the shift map of at least one of the adsorption position offset shift map and the mounting position offset shift map on the management display unit, and when an instruction to select one or more specific position offset data from the data groups of the position offset distribution displayed on the management display unit is input via the management operation unit, the management display unit is controlled so that when a position offset distribution different from the position offset distribution of the object of the management operation unit instruction is displayed on the management display unit, the data of interest corresponding to the specific position offset data in each data group of the position offset distribution and the shift map displayed on the management display unit becomes a display form different from the other data.

[0147] In this configuration, it is assumed that when at least one of the position offset distributions of the adsorption position offset distribution and the mounting position offset distribution, and at least one of the trend maps of the adsorption position offset distribution and the mounting position offset distribution are simultaneously displayed on the management display unit, an instruction to select one or more specific position offset data from the data groups of the position offset distribution displayed on the management display unit is input via the management operation unit. In this case, the management control unit controls the management display unit in a manner that, when a position offset distribution different from the position offset distribution of the object of the management operation unit instruction is displayed on the management display unit, the data of interest corresponding to the specific position offset data in each data group of the position offset distribution and the trend map displayed on the management display unit is displayed in a different form than the other data. As a result, the correspondence between each position offset data becomes clear in the adsorption position offset distribution, the mounting position offset distribution, the adsorption position offset trend map, and the mounting position offset trend map simultaneously displayed on the management display unit. Therefore, the operator can properly confirm the correspondence between the adsorption position offset data and the mounting position offset data, which also includes the time-varying situation. As a result, operators can easily confirm whether the positional shift of the nozzle's adsorption position on the component, which also includes a time factor, affects the positional shift of the component's mounting position on the substrate.

[0148] In the aforementioned component mounting system, the following configuration can be adopted: when the management control unit simultaneously displays the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution, and the shift map of at least one of the adsorption position offset shift map and the mounting position offset shift map on the management display unit, and when an instruction to select one or more specific position offset data from the data groups of the shift maps displayed on the management display unit is input via the management operation unit, the management display unit is controlled so that when a shift map different from the shift map of the object of the management operation unit instruction is displayed on the management display unit, the shift map and the data of interest corresponding to the specific position offset data in each data group of the position offset distribution displayed on the management display unit become display forms different from the other data.

[0149] In this configuration, it is assumed that when at least one of the position offset distributions of the adsorption position offset distribution and the mounting position offset distribution, and at least one of the trend maps of the adsorption position offset distribution and the mounting position offset distribution are simultaneously displayed on the management display unit, an instruction to select one or more specific position offset data from the data groups of the trend maps displayed on the management display unit is input via the management operation unit. In this case, the management control unit controls the management display unit in a manner that, when a trend map different from the trend map of the object of the management operation unit instruction is displayed on the management display unit, the trend map and the data of interest corresponding to the specific position offset data in each data group of the position offset distribution displayed on the management display unit are displayed in a different form than the other data. As a result, the correspondence between each position offset data becomes clear in the adsorption position offset distribution, mounting position offset distribution, adsorption position offset trend map, and mounting position offset trend map simultaneously displayed on the management display unit. Therefore, the operator can properly confirm the correspondence between the adsorption position offset data and the mounting position offset data, which also includes the time-varying situation.

[0150] In the aforementioned component mounting system, the management communication unit may be configured to acquire adsorption level data from the mounting machine, representing the adsorption level of the nozzle on the component during the component adsorption process. The management storage unit may be configured to accumulate and store data associated with the adsorption level data as management data. In this configuration, when a command to select a parameter from the various parameter information is input via the management operation unit, the management control unit controls the management display unit to simultaneously display an adsorption level shift graph representing the time-varying adsorption level data set as indicated by the adsorption level data, and a position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution.

[0151] In this configuration, when an instruction to select one parameter from various parameter information is input via the management operation unit, the management control unit controls the management display unit to simultaneously display the adsorption level shift graph and the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution. This allows the time-varying adsorption level data, representing the adsorption level of the nozzle on the element, to be displayed graphically on the management display unit simultaneously with the adsorption position offset distribution and the mounting position offset distribution. Therefore, the operator can visually confirm the occurrence of position offset based on the adsorption position offset distribution and the mounting position offset distribution, and can confirm the time-varying adsorption level data based on the adsorption level shift graph.

[0152] In the aforementioned component mounting system, the following configuration can be adopted: when the management control unit simultaneously displays the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution, and the adsorption level shift diagram on the management display unit, and when an instruction to select one or more specific position offset data from the data groups of the position offset distribution displayed on the management display unit is input via the management operation unit, the management display unit controls the management display unit so that when a position offset distribution different from the position offset distribution of the object of the management operation unit instruction is displayed on the management display unit, the data of interest corresponding to the specific position offset data in each data group of the position offset distribution and the adsorption level shift diagram becomes a different display form from the other data.

[0153] In this configuration, it is assumed that when at least one of the position offset distributions (adsorption position offset distribution and mounting position offset distribution) and the adsorption level shift graph are simultaneously displayed on the management display unit, an instruction to select one or more specific position offset data from the data groups of the position offset distribution displayed on the management display unit is input via the management operation unit. In this case, the management control unit controls the management display unit in a manner that, when a position offset distribution different from the position offset distribution of the object of the management operation unit instruction is displayed on the management display unit, the data of interest corresponding to the specific position offset data in each data group of the position offset distribution and the adsorption level shift graph is displayed in a different format than the other data. Therefore, the correspondence between each position offset data and the adsorption level data becomes clear in the adsorption position offset distribution, mounting position offset distribution, and adsorption level shift graph simultaneously displayed on the management display unit. Thus, the operator can properly confirm the correspondence between each position offset data and the adsorption level data. As a result, the operator can focus on the adsorption level of the nozzle on the component to confirm whether the position offset of the nozzle's adsorption position on the component affects the position offset of the component's mounting position on the substrate.

[0154] In the aforementioned component mounting system, the management communication unit may be configured to acquire adsorption state data from the mounting machine indicating whether the adsorption state of the nozzle on the component during the component adsorption process is normal, and the management storage unit may be configured to accumulate and store data associated with the adsorption state data as management data. In this configuration, the management control unit calculates a normal adsorption rate, representing the ratio of the number of times the adsorption state is normal in a given period to the total number of times it is used, for each of the component, the feeder, the nozzle, and the mounting head represented by the parameter information, based on the adsorption state data. Furthermore, when the management control unit displays the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution on the management display unit, and when an instruction to select one or more specific position offset data from the data set of the position offset distribution is input via the management operation unit, the management display unit controls the management display unit to display the normal adsorption rate of each of the component, the feeder, the nozzle, and the mounting head represented by the parameter information corresponding to the specific position offset data.

[0155] In this configuration, it is assumed that when at least one of the position offset distributions—the adsorption position offset distribution and the mounting position offset distribution—is displayed on the management display unit, an instruction to select one or more specific position offset data from the data set of the position offset distribution is input via the management operation unit. In this case, the management control unit controls the management display unit by displaying the normal adsorption rates of each component, feeder, nozzle, and mounting head, represented by parameter information corresponding to the specific position offset data. By confirming the normal adsorption rates of each component, feeder, nozzle, and mounting head displayed on the management display unit, the operator can easily determine the cause of the adsorption position offset and the mounting position offset.

[0156] As described above, according to the present invention, a component mounting system can be provided that is able to confirm the occurrence of positional offset of the suction nozzle on the component and to determine the cause of such positional offset.

Claims

1. A component mounting system, characterized in that... include: An assembly machine includes a feeder and a mounting head. The feeder performs a component supply process, and the mounting head has a nozzle for adsorbing the components. A component mounting substrate is obtained by mounting the components adsorbed by the nozzle onto a substrate. The management device is connected to the installation machine for data communication; wherein, The management device includes: The management communication unit acquires adsorption position offset data, parameter information, and processing status images from the installation machine. The adsorption position offset data represents the offset of the adsorption position of the element relative to the nozzle during the element adsorption process. The parameter information is used to determine the element, the feeder, the nozzle, and the mounting head used in each of the processes: the element supply process, the element adsorption process, and the element mounting process. The processing status images represent images of the processing status of each process. The management storage unit accumulates and stores management data that associates the adsorption position offset data, the parameter information, and the processing status images. The management display unit displays information about the management data; The management operation unit receives instructions regarding the display mode of the management display unit; and, The management control unit controls the management display unit according to the instructions input to the management operation unit; wherein, When the management control unit receives an instruction to select one parameter from the various parameter information via the management operation unit, it controls the management display unit to display an adsorption position offset distribution representing the distribution of the data group of adsorption position offset data focusing on the one parameter information. When the adsorption position offset distribution is displayed on the management display unit, and when an instruction to select one or more specific adsorption position offset data from the data group of the adsorption position offset distribution is input via the management operation unit, the management control unit controls the management display unit to simultaneously display the processing status images corresponding to the specific adsorption position offset data and the adsorption position offset distribution.

2. The component mounting system according to claim 1, characterized in that... Also includes: Equipped with an inspection device and connected to the management device for data communication, the component mounting substrate is inspected based on an image of the mounting substrate representing an image of the component mounting substrate; wherein... The management communication unit is configured to acquire from the mounting inspection device mounting position offset data, which represents the offset of the mounting position of the element relative to the substrate during the element mounting process, and an image of the mounting substrate. The management storage unit is configured to accumulate and store data that, as management data, also associates the mounting position offset data with the mounting substrate image. When an instruction to select one parameter from the various parameter information is input via the management operation unit, the management control unit controls the management display unit to display a position offset distribution representing at least one of the mounting position offset distribution and the adsorption position offset distribution, which indicates the distribution of the data group of mounting position offset data focusing on the one parameter information. When the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution is displayed on the management display unit, and when an instruction to select one or more specific position offset data from the data group of the position offset distribution is input via the management operation unit, the management control unit controls the management display unit to simultaneously display the processing status image and the mounting substrate image corresponding to the specific position offset data with the position offset distribution.

3. The component mounting system according to claim 2, characterized in that... Also includes: A pattern inspection apparatus, connected to the management device for data communication, inspects a pattern forming substrate, which has a pattern of solder paste used in the component mounting process, based on a pattern forming substrate image representing an image of the pattern forming substrate; and... A reflow inspection device, capable of data communication with the management device, inspects the reflow substrate based on an image of the reflow substrate showing an image of the reflow substrate after reflow processing has been performed on the component mounting substrate; wherein... The management communication unit is configured to acquire the pattern substrate image from the pattern inspection device and the reflow substrate image from the reflow inspection device. The management storage unit is configured to accumulate and store data that, as management data, also associates the patterned substrate image with the reflow substrate image. When the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution is displayed on the management display unit, and when an instruction to select one or more specific position offset data from the data group of the position offset distribution is input via the management operation unit, the management control unit controls the management display unit to simultaneously display the processing state image, the mounting substrate image, the pattern substrate image, and the reflow substrate image corresponding to the specific position offset data with the position offset distribution.

4. The component mounting system according to claim 2 or 3, characterized in that, When the management control unit receives an instruction to select one parameter from the various parameter information via the management operation unit, it controls the management display unit to simultaneously display the adsorption position offset distribution and the mounting position offset distribution focusing on the selected parameter information. When the adsorption position offset distribution and the mounting position offset distribution are simultaneously displayed on the management display unit, and when an instruction to select one or more specific position offset data from the data group of one position offset distribution is input via the management operation unit, the management control unit controls the management display unit to make the data of interest corresponding to the specific position offset data in the data group of the other position offset distribution display in a different display form than the rest of the data.

5. The component mounting system according to any one of claims 2 to 4, characterized in that, When the management control unit receives an instruction to select one parameter from the parameter information via the management operation unit, it controls the management display unit to simultaneously display at least one of the adsorption position offset shift graph representing the time shift of the data group representing the adsorption position offset data and the mounting position offset shift graph representing the time shift of the data group representing the mounting position offset data, along with the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution.

6. The component mounting system according to claim 5, characterized in that, When the management control unit displays the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution, and the shift map of at least one of the adsorption position offset shift map and the mounting position offset shift map simultaneously on the management display unit, and when an instruction to select one or more specific position offset data from the data groups of the position offset distribution displayed on the management display unit is input via the management operation unit, the management control unit controls the management display unit to make the data of interest corresponding to the specific position offset data in each data group of the position offset distribution and the shift map displayed on the management display unit display in a different display form than the other data when a position offset distribution different from the position offset distribution of the object of the management operation unit instruction is displayed on the management display unit.

7. The component mounting system according to claim 5 or 6, characterized in that, When the management control unit displays the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution, and the shift map of at least one of the adsorption position offset shift map and the mounting position offset shift map simultaneously on the management display unit, and when an instruction to select one or more specific position offset data from the data groups of the shift maps displayed on the management display unit is input via the management operation unit, the management control unit controls the management display unit to make the shift map and the data of interest corresponding to the specific position offset data in each data group of the position offset distribution displayed on the management display unit display in a different display form than the rest of the data when a shift map different from the shift map of the object of the instruction from the management operation unit is displayed on the management display unit.

8. The component mounting system according to any one of claims 2 to 7, characterized in that, The management communication unit is configured to acquire adsorption level data from the installation machine, representing the adsorption level of the nozzle on the element during the element adsorption process. The management storage unit is configured to accumulate and store data that is associated with the adsorption level data, as well as the management data. When the management control unit receives an instruction to select one parameter from the parameter information via the management operation unit, it controls the management display unit to simultaneously display an adsorption level shift graph representing the time shift of the adsorption level data group represented by the adsorption level data, and a position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution.

9. The component mounting system according to claim 8, characterized in that, When the management control unit displays the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution and the adsorption level shift map on the management display unit, and when an instruction to select one or more specific position offset data from the data groups of the position offset distribution displayed on the management display unit is input via the management operation unit, the management display unit controls the management display unit so that when a position offset distribution different from the position offset distribution of the object of the management operation unit instruction is displayed on the management display unit, the data of interest corresponding to the specific position offset data in each data group of the position offset distribution and the adsorption level shift map is displayed in a different form than the other data.

10. The component mounting system according to any one of claims 2 to 9, characterized in that, The management communication unit is configured to acquire adsorption state data from the installation machine indicating whether the adsorption state of the nozzle on the element during the element adsorption process is normal. The management storage unit is configured to accumulate and store data that is associated with the adsorption state data, as well as the management data. Based on the adsorption state data, the management and control unit calculates a normal adsorption rate for each of the components, the feeder, the nozzle, and the mounting head, as represented by the parameter information, representing the ratio of the number of times the adsorption state is normal to the total number of times it is used within a given period. When the management control unit displays the position offset distribution of at least one of the adsorption position offset distribution and the mounting position offset distribution on the management display unit, and when an instruction to select one or more specific position offset data from the data group of the position offset distribution is input via the management operation unit, the management display unit controls the management display unit to display the normal adsorption rate of each of the elements, the feeder, the nozzle, and the mounting head, represented by the parameter information corresponding to the specific position offset data.

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