Optical module and optical module plug structure

Abstract

The application discloses an optical module and an optical module plug structure. The optical module comprises a mounting shell, a circuit board structure and a heat conduction assembly. The mounting shell is formed with a mounting cavity. The upper and lower sidewalls of the mounting shell are respectively formed with heat conduction allowing through holes communicating with the mounting cavity. The circuit board structure comprises a power device. The power device is arranged in the mounting cavity. The heat conduction assembly comprises two heat conduction abutting portions. The two heat conduction abutting portions are matched with each other to press the upper and lower end surfaces of the power device, and are respectively exposed in the corresponding heat conduction allowing through holes. The heat conduction abutting portions directly conduct the heat of the power device to the external heat dissipation structure, the existence of the air gap is reduced, the thermal resistance is reduced, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of optical module technology, and in particular to an optical module and an optical module plug-in structure. Background Technology

[0002] With the rapid development of 4G communication and the increasing demand for cloud computing, the market demand for high-speed optical modules is growing daily. To meet the market's demand for high-bandwidth and high-speed data transmission, module design is increasingly moving towards miniaturization and high density. Although highly integrated circuits are striving for miniaturization and low power consumption, the high heat dissipation of modules has become a problem that must be addressed as high-speed and high-bandwidth module technology develops. The current mainstream heat dissipation method involves conducting the heat from the power-consuming devices in the optical module to the module's housing using thermal pads or thermal adhesive, and then dissipating the heat through contact between the housing and the external heat dissipation structure. This method involves a large number of air gaps or thermal adhesive between the power-consuming devices and the final heat dissipation device, increasing thermal resistance and directly resulting in poor heat dissipation. Summary of the Invention

[0003] The main objective of this invention is to propose an optical module and an optical module plug-in structure, which aims to solve the problem of poor heat dissipation effect of existing optical module heat dissipation methods.

[0004] To achieve the above objectives, the optical module proposed in this invention includes:

[0005] The mounting housing has a mounting cavity, and the upper and lower side walls of the mounting housing have heat-conducting clearance holes that communicate with the mounting cavity.

[0006] A circuit board structure, including power devices disposed in the mounting cavity; and...

[0007] The thermally conductive assembly includes two thermally conductive abutting parts, which cooperate with each other to press against the upper and lower end faces of the power device, and are respectively exposed in corresponding thermally conductive clearance through holes.

[0008] Optionally, the mounting cavity extends rearward to form a through-hole, and the circuit board structure further includes:

[0009] A first circuit board and a second circuit board, wherein the first circuit board is disposed at the front end of the mounting cavity for mounting an optical lens, and the second circuit board is disposed at the rear end of the mounting cavity and has a conductive plug portion adapted to extend out of the plug-in through hole; and,

[0010] A conductive flexible strip electrically connects the power device to the first circuit board and the second circuit board.

[0011] Optionally, the power device includes a device body and a rigid conductive substrate, the rigid conductive substrate surrounding the periphery of the device body, and the pins of the device body being soldered to the rigid conductive substrate.

[0012] The conductive flexible conductive substrate is connected to the first circuit board and the second circuit board.

[0013] Optionally, the two thermally conductive clearance holes include upper clearance holes that extend through the upper sidewall of the mounting cavity and extend rearward to the rear end face of the mounting housing.

[0014] The two thermally conductive abutting portions include upper thermally conductive abutting portions corresponding to the upper relief through holes. The upper thermally conductive abutting portions have an upper thermally conductive surface that faces upward and is inclined downward in the direction from front to back.

[0015] Optionally, the two thermally conductive clearance holes include upper clearance holes located on the upper sidewall of the mounting cavity, the upper clearance holes extending rearward to the rear end face of the mounting housing;

[0016] The two thermally conductive abutting portions include upper thermally conductive abutting portions corresponding to the upper relief through holes. The upper thermally conductive abutting portions have an upwardly facing upper thermally conductive surface. The upper thermally conductive surface forms a plurality of thermally conductive slots. The plurality of thermally conductive slots are arranged at intervals from left to right and all extend backward to the rear end face of the upper thermally conductive abutting portion.

[0017] Optionally, the left and right side walls of the mounting cavity are respectively formed with lateral clearance through holes corresponding to the heat-conducting contact portion. The lateral clearance through holes are used to expose the left and right ends of the heat-conducting contact portion, and the heat-conducting contact portion is formed with a plurality of heat dissipation through holes corresponding to the lateral clearance through holes.

[0018] Optionally, the mounting housing includes an upper housing and a lower housing. Corresponding to each of the heat-conducting clearance through holes, the upper housing has two upper housing side plates arranged opposite to each other, and the lower housing has two lower housing side plates arranged opposite to each other. The upper housing side plates and the corresponding lower housing side plates are overlapped in the left-right direction to form an overlapping connection group. Each of the heat-conducting clearance through holes expands in the left-right direction to the corresponding overlapping connection group to form a bearing end face at the upper and lower ends of the overlapping connection group. Two connecting protrusions extending in the front-back direction are formed on the bearing end face, and the two connecting protrusions are respectively disposed on the upper housing side plate and the lower housing side plate.

[0019] The two heat-conducting contact parts are detachably connected, and the left and right ends of each heat-conducting contact part are respectively provided on the corresponding bearing end face, and a mating groove is formed for each of the two connecting protrusions.

[0020] The optical module plug-in structure provided by this invention includes:

[0021] An optical module, including any one of the optical modules described above;

[0022] A connector cage having a forward-opening connector cavity for accommodating the optical module; the upper and lower side walls of the connector cavity having two heat dissipation clearance holes corresponding to the two heat-conducting clearance holes; and...

[0023] The heat dissipation assembly includes two heat dissipation abutment parts, which are disposed on the insertion cage and extend into the corresponding heat dissipation clearance through holes to abut against the corresponding heat-conducting abutment parts.

[0024] Optionally, the two thermally conductive contact portions include an upper thermally conductive contact portion, the upper thermally conductive contact portion having an upwardly facing upper thermally conductive surface, wherein:

[0025] The upper heat-conducting surface has multiple heat-conducting slots, which are spaced apart from left to right and extend rearward to the rear end face of the heat-conducting abutment. The two heat-dissipating abutments include upper heat-dissipating abutments, which have multiple heat-dissipating protrusions corresponding to the multiple heat-conducting slots; and / or,

[0026] In the direction from front to back, the upper heat-conducting surface is inclined downwards, and the upper sidewall of the insertion cavity is inclined corresponding to the upper heat-conducting surface.

[0027] Optionally, the left and right side walls of the mounting cavity are respectively formed with lateral clearance through holes corresponding to the heat-conducting contact portion. The lateral clearance through holes are used to expose the left and right ends of the heat-conducting contact portion, and the heat-conducting contact portion is formed with a plurality of heat dissipation through holes corresponding to the lateral clearance through holes.

[0028] The left and right side walls of the insertion cavity are provided with ventilation clearance holes corresponding to the multiple heat dissipation holes;

[0029] The heat dissipation assembly also includes a heat dissipation duct that connects to the ventilation clearance hole.

[0030] In the technical solution provided by this invention, the upper and lower end faces of the power device are pressed together by the two thermally conductive contact parts, thereby maximizing the conduction of heat generated by the power device. Moreover, the thermally conductive clearance through-hole allows the corresponding thermally conductive contact parts to extend and directly contact the external heat dissipation structure. The entire process involves only one heat transfer through the thermally conductive contact parts to conduct the heat of the power device to the external heat dissipation structure, thereby minimizing thermal resistance and improving heat dissipation efficiency. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0032] Figure 1 This is a front view schematic diagram of an embodiment of the optical module provided by the present invention;

[0033] Figure 2 for Figure 1 A cross-sectional schematic diagram of the optical module in the diagram;

[0034] Figure 3 for Figure 2 A magnified schematic diagram of part A in the middle;

[0035] Figure 4 for Figure 1 A front view of the upper shell of the structure;

[0036] Figure 5 for Figure 1 A front view of the lower shell of the structure;

[0037] Figure 6 for Figure 1 A top view of the mounting housing;

[0038] Figure 7 for Figure 6 A magnified schematic diagram of part B in the middle;

[0039] Figure 8 for Figure 1 A bottom view of the upper heat-conducting contact part in the middle;

[0040] Figure 9 for Figure 1 A top view of the upper heat-conducting contact part in the middle;

[0041] Figure 10 This is a three-dimensional structural diagram of the insertion cage in the optical module insertion structure provided by the present invention.

[0042] Explanation of icon numbers:

[0043] label name label name 100 optical module 123 Second circuit board 11 Mounting housing 124 conductive flexible strip 111 Thermally conductive clearance through hole 13 Thermal conductive components 112 upper shell 131 Thermally conductive contact part 1121 Upper shell side plate 131a Upper heat-conducting contact part 113 Lower housing 1311 upper heat-conducting surface 1131 Lower shell side plate 1312 Thermal slot 114 Connecting convex strip 1313 Heat dissipation holes 12 Circuit board structure 1314 Matching groove 121 Power devices 200 Plug-in cage 1211 Device body 21 Plug cavity 1212 Rigid conductive substrate 22 Heat dissipation makes way for through holes 122 First circuit board 23 Ventilation clearance hole

[0044] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0046] It should be noted that if the embodiments of the present invention involve directional indication, the directional indication is only used to explain the relative positional relationship and movement of the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0047] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0048] With the rapid development of 4G communication and the increasing demand for cloud computing, the market demand for high-speed optical modules is growing daily. To meet the market's demand for high-bandwidth and high-speed data transmission, module design is increasingly moving towards miniaturization and high density. Although highly integrated circuits are striving for miniaturization and low power consumption, the high heat dissipation of modules has become a problem that must be addressed as high-speed and high-bandwidth module technology develops. The current mainstream heat dissipation method involves conducting the heat from the power-consuming devices in the optical module to the module's housing using thermal pads or thermal adhesive, and then dissipating the heat through contact between the housing and external heat dissipation devices. This method involves a large number of air gaps or thermal adhesive between the power-consuming devices and the final heat dissipation devices, increasing thermal resistance and directly resulting in poor heat dissipation.

[0049] In view of this, the present invention proposes an optical module and an optical module plug-in structure, aiming to solve the problem of poor heat dissipation effect of existing optical module heat dissipation methods, wherein... Figures 1 to 9 This is a plan view of an embodiment of the optical module provided by the present invention. Figure 10 This is a three-dimensional structural diagram of the insertion cage in the optical module insertion structure provided by the present invention.

[0050] Please see Figures 1 to 3The optical module 100 includes a mounting housing 11, a circuit board structure 12, and a heat-conducting component 13. The mounting housing 11 forms a mounting cavity, and the upper and lower side walls of the mounting housing 11 respectively form heat-conducting clearance through holes 111 communicating with the mounting cavity. The circuit board structure 12 includes a power device 121, which is disposed in the mounting cavity. The heat-conducting component 13 includes two heat-conducting abutment portions 131, which cooperate with each other to press the upper and lower end faces of the power device 121, and are respectively exposed in the corresponding heat-conducting clearance through holes 111.

[0051] In the technical solution provided by the present invention, the upper and lower end faces of the power device 121 are pressed together by the two thermally conductive contact parts 131, thereby maximizing the conduction of heat generated by the power device 121. Moreover, the thermally conductive clearance through hole 111 allows the corresponding thermally conductive contact part 131 to extend and directly contact the external heat dissipation structure. The entire process involves only one heat transfer through the thermally conductive contact part 131 to conduct the heat of the power device 121 to the external heat dissipation structure, thereby minimizing thermal resistance and improving heat dissipation efficiency.

[0052] It should be understood that, since both the upper and lower end faces of the power device 121 can be used to abut against the corresponding heat-conducting abutment portion 131, it is obvious that the power device 121 is connected to the circuit of the circuit board structure 12 through the side pins, and at the same time, the upper and lower end faces of the power device 121 are not obstructed. There are various types of such circuit board structures 12; for details, please refer to [link / reference]. Figure 3 In this embodiment, the mounting cavity has a through-hole extending rearward. The circuit board structure 12 further includes a first circuit board 122, a second circuit board 123, and a conductive flexible strip 124. The first circuit board 122 is located at the front end of the mounting cavity and is used to mount an optical lens. The second circuit board 123 is located at the rear end of the mounting cavity and has a conductive plug-in portion adapted to extend out of the through-hole. The conductive flexible strip 124 electrically connects the power device 121 to the first circuit board 122 and the second circuit board 123. The optical lens mounted on the first circuit board 122 enables light conversion, while the conductive plug-in portion formed by the second circuit board 123 enables electrical conversion. The power device 121 is connected to the first circuit board 122 and the second circuit board 123 via a conductive flexible strip 124, achieving circuit conduction. Thanks to the flexibility of the conductive flexible strip 124, the power device 121 has a certain allowable displacement during the installation of the circuit board structure 12 into the mounting cavity and during the transportation of the optical module 100, making the power device 121 less likely to fall off. It should be noted that the plug-in portion includes the plug-in contact piece of the circuit board.

[0053] In other embodiments, the circuit board structure 12 includes a rigid circuit board disposed within the mounting cavity, and the rigid circuit board has a receiving through hole corresponding to the power device 121. The power device 121 is partially disposed in the receiving through hole, and the pins of the power device 121 are soldered to the rigid circuit board. The upper and lower ends of the power device 121 are exposed to the upper and lower openings of the receiving through hole, respectively, so as to allow the two heat-conducting contact portions 131 to be pressed together.

[0054] Further, please refer to Figure 2 and Figure 3 In this embodiment, the power device 121 includes a device body 1211 and a rigid conductive substrate 1212. The rigid conductive substrate 1212 surrounds the periphery of the device body 1211, and the pins of the device body 1211 are soldered to the rigid conductive substrate 1212. The conductive flexible strip 124 electrically connects the rigid conductive substrate 1212 to the first circuit board 122 and the second circuit board 123. By soldering the pins of the device body 1211 to the rigid conductive substrate 1212, and then connecting the rigid conductive substrate 1212 to the conductive flexible strip 124, desoldering of multiple pins of the device body 1211 due to uneven stress is avoided.

[0055] In this embodiment, the two thermally conductive clearance through holes 111 include upper clearance through holes penetrating the upper sidewall of the mounting cavity, and the upper clearance through holes expand rearward to the rear end face of the mounting housing 11; the two thermally conductive abutment portions 131 include upper thermally conductive abutment portions 131a corresponding to the upper clearance through holes, and the upper thermally conductive abutment portions 131a have an upwardly facing upper thermally conductive surface 1311, which is inclined downward in the front-to-back direction. Due to the inclined arrangement of the upper thermally conductive surface 1311 of the upper thermally conductive abutment portion 131a, when the optical module 100 is inserted into the insertion structure from front to back, it can abut against the corresponding heat dissipation surface in the insertion structure through the upper thermally conductive surface 1311, thereby reducing the air gap between the upper thermally conductive abutment portion 131a and the external heat dissipation structure, and thus improving heat dissipation efficiency.

[0056] Please see Figure 2 and Figure 9In another embodiment, the two thermally conductive clearance holes 111 include upper clearance holes located on the upper sidewall of the mounting cavity, which expand rearward to the rear end face of the mounting housing 11; the two thermally conductive abutment portions 131 include upper thermally conductive abutment portions 131a corresponding to the upper clearance holes, each upper thermally conductive abutment portion 131a having an upwardly facing upper thermally conductive surface 1311, the upper thermally conductive surface 1311 forming a plurality of thermally conductive slots 1312, the plurality of thermally conductive slots 1312 being spaced apart from left to right, and all extending rearward to the rear end face of the upper thermally conductive abutment portion 131a. By having the thermally conductive slots 1312 extend rearward, the thermally conductive area between the upper thermally conductive abutment portion 131a and the external heat dissipation structure can be increased, thereby improving heat dissipation efficiency.

[0057] Specifically, in this embodiment, the heat-conducting slot 1312 is arranged in a V-shape. The V-shaped heat-conducting slot 1312 not only increases the heat-conducting area, but also has a certain guiding effect, so that the upper heat-conducting contact part 131a is completely pressed against the external heat dissipation structure.

[0058] Furthermore, in this embodiment, the two thermally conductive clearance through holes 111 include upper clearance through holes that penetrate the upper sidewall of the mounting cavity, and the upper clearance through holes expand rearward to the rear end face of the mounting housing 11; the two thermally conductive abutment portions 131 include upper thermally conductive abutment portions 131a corresponding to the upper clearance through holes, the upper thermally conductive abutment portions 131a having an upwardly facing upper thermally conductive surface 1311, the upper thermally conductive surface 1311 being inclined downward in the front-to-back direction, the upper thermally conductive surface 1311 forming a plurality of thermally conductive slots 1312, the plurality of thermally conductive slots 1312 being spaced apart from left to right, and all extending rearward to the rear end face of the upper thermally conductive abutment portions 131a. With this configuration, the inclined arrangement of the upper heat-conducting surface 1311 and the provision of heat-conducting slots 1312 on the upper heat-conducting surface 1311 increase the heat-conducting area between the upper heat-conducting contact part 131a and the external heat dissipation structure, while also reducing the air gap between the upper heat-conducting contact part 131a and the external heat dissipation structure, thereby further improving the heat dissipation efficiency.

[0059] Please see Figure 2 and Figure 3In this embodiment, the left and right side walls of the mounting cavity are respectively formed with lateral clearance through holes corresponding to the heat-conducting contact portion 131. The lateral clearance through holes are used to expose the left and right ends of the heat-conducting contact portion 131, and the heat-conducting contact portion 131 is formed with a plurality of through-holes 1313 corresponding to the lateral clearance through holes. By setting the lateral clearance through holes, the left and right ends of the heat-conducting contact portion 131 are exposed, and by setting the heat dissipation through holes 1313, the external heat dissipation structure can perform air cooling on the heat-conducting contact portion 131, making full use of the heat conduction of each part of the heat-conducting contact portion 131, and further improving the heat conduction and heat dissipation efficiency.

[0060] Specifically, in the front-to-back direction, the left and right sides of the mounting housing 11 are arranged close to each other. This arrangement allows the optical module 100 to be pressed against the corresponding abutment surface by the left and right sides of the mounting housing 11 during the insertion of the optical module 100 into the external plug-in structure.

[0061] Please see Figures 4 to 8In this embodiment, the mounting housing 11 includes an upper housing 112 and a lower housing 113. Corresponding to each of the heat-conducting clearance holes 111, the upper housing 112 has two upper housing side plates 1121 arranged opposite each other in the left-right direction, and the lower housing 113 has two lower housing side plates 1131 arranged opposite each other in the left-right direction. The upper housing side plates 1121 and the corresponding lower housing side plates 1131 overlap in the left-right direction to form an overlapping connection group. Each of the heat-conducting clearance holes 111 expands in the left-right direction to the opposite side plate 1131. The overlapping connection group is configured such that a bearing end face is formed at the upper and lower ends of the overlapping connection group, and two connecting protrusions 114 extending in the front-rear direction are formed on the bearing end face, and the two connecting protrusions 114 are respectively disposed on the upper shell side plate 1121 and the lower shell side plate 1131; the two heat-conducting abutment parts 131 are detachably connected, and the left and right ends of each heat-conducting abutment part 131 are respectively disposed on the corresponding bearing end face, and a mating groove 1314 is formed corresponding to the two connecting protrusions 114. The upper housing side plate 1121 and the lower housing side plate 1131 are stacked together in the left-right direction to form an overlapping connection group. Each overlapping connection group has two bearing end faces in the upper and lower directions corresponding to the two heat-conducting clearance through holes 111. The two ends of the heat-conducting abutment part 131 in the left and right directions can be adapted to the bearing end faces respectively. Then, two connecting protrusions 114 extending in the front-back direction are jointly provided in the mating groove 1314, so that the heat-conducting abutment part 131 can limit the connection between the upper housing side plate 1121 and the corresponding lower housing side plate 1131. This reduces the use of threaded connection structure or snap-fit ​​connection structure on the connection between the upper housing 112 and the lower housing 113, making the assembly and disassembly process more convenient and the connection strength higher. Moreover, the mating connection between the connecting protrusions 114 and the mating groove 1314 can also play an effective sealing role, preventing dust or stray light from entering the mounting cavity.

[0062] It should be noted that there are multiple ways to detachably connect the two heat-conducting contact parts 131. It can be achieved by a threaded connection structure or by a snap-fit ​​connection structure. As long as the relative position between the two heat-conducting contact parts 131 can be fixed, the embodiment of the present invention will not elaborate on this.

[0063] In one embodiment, the two thermally conductive abutment portions 131 press against the two bearing end faces of the overlapping connection group from the top and bottom directions, respectively. Then, through the relative positioning relationship between the mating groove 1314 and the corresponding connecting protrusion 114, the two thermally conductive abutment portions 131 are pressed and positioned as a whole onto the upper housing 112 and the lower housing 113.

[0064] In another embodiment, one of the heat-conducting contact portions 131 is formed with a connecting lug, which is connected to the top plate of the corresponding upper housing 112 or the bottom plate of the lower housing 113 by a threaded connection structure, thereby realizing the connection between the two heat-conducting contact portions 131 and the mounting housing 11.

[0065] Furthermore, the present invention also provides an optical module insertion structure, which includes the optical module 100 described above. It should be noted that the structure of the optical module 100 in the optical module insertion structure can refer to the embodiments of the optical module 100 described above, and will not be repeated here. Since the optical module 100 described above is used in the optical module insertion structure provided by the present invention, the embodiments of the optical module insertion structure provided by the present invention include all the technical solutions of all embodiments of the optical module 100 described above, and the technical effects achieved are also completely the same, and will not be repeated here.

[0066] Specifically, please refer to Figure 10 In this embodiment, the optical module insertion structure includes an optical module 100, an insertion cage 200, and a heat dissipation assembly. The optical module 100 includes the aforementioned optical module 100. The insertion cage 200 has a forward-opening insertion cavity 21 for accommodating the optical module 100. The upper and lower side walls of the insertion cavity 21 have two heat dissipation clearance through holes 22 formed through the two heat-conducting clearance through holes 111. The heat dissipation assembly includes two heat dissipation abutments. The two heat dissipation abutments are disposed in the insertion cage 200 and extend into the corresponding heat dissipation clearance through holes 22 to abut against the corresponding heat-conducting abutment 131. By providing heat dissipation clearance through holes 22 at corresponding positions on the insertion cage 200 for the heat dissipation abutment to extend into, when the optical module 100 is adapted to be inserted into the insertion cage 200, the exposed heat-conducting abutment 131 on the optical module 100 can directly adapt to and abut against the corresponding heat dissipation abutment, thereby completing direct and efficient heat conduction. It should be noted that the heat dissipation abutment can be a water-cooled heat sink or an air-cooled heat sink, and the embodiments of the present invention do not limit this.

[0067] It should be noted that the optical module 100 needs to be plugged into the plug cage 200 in order to achieve the exchange of electrical signals.

[0068] Furthermore, in this embodiment, the two thermally conductive abutment portions 131 include upper thermally conductive abutment portions 131a, each having an upwardly facing upper thermally conductive surface 1311. The upper thermally conductive surface 1311 forms a plurality of thermally conductive slots 1312, which are spaced apart from left to right and extend rearward to the rear end face of the thermally conductive abutment portion 131. The two heat dissipation abutment portions include upper heat dissipation abutment portions, each forming a plurality of heat dissipation protrusions corresponding to the plurality of thermally conductive slots 1312. By adapting and inserting the thermally conductive slots 1312 on the upper thermally conductive abutment portion 131a with the corresponding heat dissipation protrusions on the upper heat dissipation abutment portion, the thermally conductive contact area between the upper thermally conductive abutment portion 131a and the upper heat dissipation abutment portion is increased, improving heat dissipation efficiency. Simultaneously, sufficient friction is provided to keep the optical module 100 in the insertion position.

[0069] In another embodiment, the two thermally conductive contact portions 131 include an upper thermally conductive contact portion 131a, which has an upwardly facing upper thermally conductive surface 1311. In the front-to-back direction, the upper thermally conductive surface 1311 is inclined downwards, and the upper sidewall of the insertion cavity 21 is also inclined corresponding to the upper thermally conductive surface 1311. By inclining the upper thermally conductive surface 1311, the upper thermally conductive surface 1311 and the lower thermally conductive surface can come into closer contact during the insertion of the optical module 100 into the insertion cavity 21, thereby minimizing air gaps, reducing thermal resistance, and improving thermal conductivity.

[0070] It should be noted that the two parallel technical solutions mentioned above can be set simultaneously or one of them can be set. Obviously, setting them simultaneously is more effective. By adapting and inserting the heat-conducting slot 1312 on the upper heat-conducting abutment part 131a with the heat-dissipating protrusion on the corresponding upper heat-dissipating abutment part, the heat-conducting contact area between the upper heat-conducting abutment part 131a and the upper heat-dissipating abutment part is increased. At the same time, it can also provide sufficient friction to keep the optical module 100 in the insertion position. By tilting the upper heat-conducting surface 1311, the upper heat-conducting surface 1311 and the lower heat-conducting surface can be pressed closer together during the process of the optical module 100 being inserted into the insertion cavity 21, thereby eliminating air gaps as much as possible, reducing thermal resistance, and improving heat conduction efficiency.

[0071] In another embodiment, the left and right side walls of the mounting cavity are respectively formed with lateral clearance through holes corresponding to the heat-conducting contact portion 131. The lateral clearance through holes are used to expose the left and right ends of the heat-conducting contact portion 131, and the heat-conducting contact portion 131 is formed with a plurality of through-holes 1313 corresponding to the lateral clearance through holes. The left and right side walls of the insertion cavity 21 are formed with ventilation clearance holes 23 corresponding to the plurality of ventilation clearance holes 1313. The heat dissipation assembly also includes a heat dissipation duct, which is connected to the ventilation clearance hole 23.

[0072] The side exposure of the heat-conducting contact portion 131 allows multiple heat dissipation holes 1313 to be connected to the ventilation clearance hole 23, so that the heat dissipation duct can exhaust heat from the multiple heat dissipation holes 1313, thereby cooperating with the heat dissipation contact portion to complete the heat dissipation treatment of the heat-conducting contact portion 131.

[0073] Furthermore, multiple insertion cavities 21 are arranged side by side from left to right, and two adjacent insertion cavities 21 share a side wall. The ventilation clearance hole 23 is formed on this side wall, and the heat dissipation duct is connected to the ventilation clearance hole 23 located at the far end. With this arrangement, only one heat dissipation duct is needed to achieve ventilation and heat dissipation treatment of the heat-conducting contact part 131 in multiple insertion cavities 21.

[0074] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An optical module, characterized in that, include: The mounting housing has a mounting cavity, and the upper and lower side walls of the mounting housing have heat-conducting clearance holes that communicate with the mounting cavity. A circuit board structure, including power devices disposed in the mounting cavity; and... The thermally conductive component includes two thermally conductive abutting parts, which cooperate with each other to press against the upper and lower end faces of the power device, and are respectively exposed in corresponding thermally conductive clearance through holes.

2. The optical module as described in claim 1, characterized in that, The mounting cavity extends rearward to form a through-hole, and the circuit board structure further includes: A first circuit board and a second circuit board, wherein the first circuit board is disposed at the front end of the mounting cavity for mounting an optical lens, and the second circuit board is disposed at the rear end of the mounting cavity and has a conductive plug portion adapted to extend out of the plug-in through hole; and, A conductive flexible strip electrically connects the power device to the first circuit board and the second circuit board.

3. The optical module as described in claim 2, characterized in that, The power device includes a device body and a rigid conductive substrate. The rigid conductive substrate surrounds the periphery of the device body, and the pins of the device body are soldered to the rigid conductive substrate. The conductive flexible conductive substrate is connected to the first circuit board and the second circuit board.

4. The optical module as described in claim 1, characterized in that, The two thermally conductive clearance holes include upper clearance holes that extend through the upper sidewall of the mounting cavity and extend rearward to the rear end face of the mounting housing. The two thermally conductive abutting portions include upper thermally conductive abutting portions corresponding to the upper relief through holes. The upper thermally conductive abutting portions have an upper thermally conductive surface that faces upward and is inclined downward in the direction from front to back.

5. The optical module as described in claim 1, characterized in that, The two thermally conductive clearance holes include an upper clearance hole located on the upper sidewall of the mounting cavity, the upper clearance hole extending rearward to the rear end face of the mounting housing; The two thermally conductive abutting portions include upper thermally conductive abutting portions corresponding to the upper relief through holes. The upper thermally conductive abutting portions have an upwardly facing upper thermally conductive surface. The upper thermally conductive surface forms a plurality of thermally conductive slots. The plurality of thermally conductive slots are arranged at intervals from left to right and all extend backward to the rear end face of the upper thermally conductive abutting portion.

6. The optical module as described in claim 1, characterized in that, The left and right side walls of the mounting cavity are respectively formed with lateral clearance through holes corresponding to the heat-conducting contact portion. The lateral clearance through holes are used to expose the left and right ends of the heat-conducting contact portion, and the heat-conducting contact portion is formed with multiple heat dissipation through holes corresponding to the lateral clearance through holes.

7. The optical module as described in claim 1, characterized in that, The mounting housing includes an upper housing and a lower housing. Corresponding to each of the heat-conducting clearance through holes, the upper housing has two upper housing side plates arranged opposite to each other, and the lower housing has two lower housing side plates arranged opposite to each other. The upper housing side plates and the corresponding lower housing side plates are overlapped in the left-right direction to form an overlapping connection group. Each of the heat-conducting clearance through holes expands in the left-right direction to the corresponding overlapping connection group to form a bearing end face at the upper and lower ends of the overlapping connection group. Two connecting protrusions extending in the front-back direction are formed on the bearing end face, and the two connecting protrusions are respectively disposed on the upper housing side plate and the lower housing side plate. The two heat-conducting contact parts are detachably connected, and the left and right ends of each heat-conducting contact part are respectively provided on the corresponding bearing end face, and a mating groove is formed for each of the two connecting protrusions.

8. An optical module plug-in structure, characterized in that, include: The optical module includes the optical module as described in any one of claims 1 to 7; A connector cage having a forward-opening connector cavity for accommodating the optical module; the upper and lower side walls of the connector cavity having two heat dissipation clearance holes corresponding to the two heat-conducting clearance holes; and... The heat dissipation assembly includes two heat dissipation abutment parts, which are disposed on the insertion cage and extend into the corresponding heat dissipation clearance through holes to abut against the corresponding heat-conducting abutment parts.

9. The optical module plug-in structure as described in claim 8, characterized in that, The two thermally conductive contact portions include an upper thermally conductive contact portion, wherein the upper thermally conductive contact portion has an upwardly facing upper thermally conductive surface, wherein: The upper heat-conducting surface has multiple heat-conducting slots, which are spaced apart from left to right and extend rearward to the rear end face of the heat-conducting abutment. The two heat-dissipating abutments include upper heat-dissipating abutments, which have multiple heat-dissipating protrusions corresponding to the multiple heat-conducting slots; and / or, In the direction from front to back, the upper heat-conducting surface is inclined downwards, and the upper sidewall of the insertion cavity is inclined corresponding to the upper heat-conducting surface.

10. The optical module plug-in structure as described in claim 8, characterized in that, The left and right side walls of the mounting cavity are respectively formed with lateral clearance through holes corresponding to the heat-conducting contact portion. The lateral clearance through holes are used to expose the left and right ends of the heat-conducting contact portion, and the heat-conducting contact portion is formed with multiple heat dissipation through holes corresponding to the lateral clearance through holes. The left and right side walls of the insertion cavity are provided with ventilation clearance holes corresponding to the multiple heat dissipation holes; The heat dissipation assembly also includes a heat dissipation duct that connects to the ventilation clearance hole.

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