Patch product processing system and patch product processing method

Abstract

The present application relates to a kind of patch product processing system and patch product processing method, including first processing line, second processing line, third processing line and fourth processing line;First to third processing line parallel operation;Fourth processing line is in series relative to first to third processing line;By first processing line, target object original piece is cut, and target object patch with predetermined structure is formed;By second processing line, first-grade anti-sticking paper is cut, and second-grade anti-sticking paper with hollow is formed;By third processing line, first-grade adhesive tape is cut, and second-grade adhesive patch with predetermined structure is formed;Second-grade adhesive patch is engaged with second-grade anti-sticking paper by second processing line, and first-grade back adhesive tape is obtained;Target object patch is engaged with first-grade back adhesive tape by fourth processing line, and target product is obtained after cutting second-grade anti-sticking paper once again.The present application can realize the continuous and large batch automatic production of patch product, improve the stability and processing efficiency of patch product processing.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of patch product processing, and particularly relates to a patch product processing system and a patch product processing method. BACKGROUND

[0002] Most therapeutic drugs enter the human body by using subcutaneous injection, which is a low-cost, fast and direct drug delivery method. However, patients themselves cannot easily use the syringe, and the pain and fear brought by the syringe further limit the patient's compliance. Micro-needles (including needle heads with micron-level size) load drugs and transdermally deliver drugs, which is one of the methods to solve the above problems.

[0003] The depth of the micro-needle into the skin usually does not reach the dermis layer, nor does it form obvious pain. In addition, nanometer micro-needle intradermal drug delivery has the advantages of reducing toxic side effects, improving drug efficacy, and accelerating drug absorption, and is a convenient, minimally painful, safe, and self-administered product at home. In addition, micro-needles can also be used for skin pretreatment and have the ability to enhance skin permeability. Therefore, micro-needles have good clinical application prospects.

[0004] At present, after the production of the micro-needle original piece, it needs to be cut into a micro-needle patch with the required shape and size according to the demand, and the micro-needle patch itself does not have adhesion and needs to be attached to an adhesive material for use. Therefore, the production of the micro-needle patch includes a cutting process, an attaching process, a peeling process, and a packaging process. However, the current production of the micro-needle patch is mainly manual or semi-automatic and semi-manual, and these production methods still have problems such as being unable to continuously produce in large quantities, low processing efficiency, complex structure, and waste materials that cannot be recycled. Of course, in addition to the production of the micro-needle patch, the production of other patch products also has basically the same problems, such as silicone patches, facial masks, and other patch-type medical and cosmetic products. SUMMARY

[0005] The present application aims to provide a patch product processing system and a patch product processing method, which can realize the continuous and large-scale automatic production of medical patch products, improve the processing stability and processing efficiency of medical patch products, and reduce the processing cost.

[0006] To achieve the above-mentioned purpose, the present application provides a patch product processing system, which comprises a first processing line, a second processing line, a third processing line and a fourth processing line; the first processing line, the second processing line and the third processing line run in parallel; the fourth processing line runs in series with respect to the first processing line, the second processing line and the third processing line;

[0007] The first processing line is used to process the target object original piece into a target object patch with a predetermined structure;

[0008] The second processing line is used to process the first anti-adhesive paper to form the second anti-adhesive paper with a hollow;

[0009] The third processing line is used to process the first adhesive tape to form the second adhesive tape with a predetermined structure;

[0010] The second processing line is further used to join the second adhesive tape and the second anti-adhesive paper to obtain the first back adhesive tape;

[0011] The fourth processing line is used to join the target patch and the first back adhesive tape, the target patch is placed in the hollow, and one side of the target patch is bonded to the second adhesive tape.

[0012] In an embodiment, the fourth processing line is first configured to join the target patch and the first back adhesive tape to obtain an intermediate product, and then cut the intermediate product to form a plurality of target products with a predetermined structure;

[0013] The target product is composed of the second adhesive tape, the third anti-adhesive paper, and the target patch; the third anti-adhesive paper is cut from the second anti-adhesive paper, the middle part of the third anti-adhesive paper has the hollow, the edge of the third anti-adhesive paper extends beyond the edge of the second adhesive tape, and the second adhesive tape is arranged along the edge of the hollow.

[0014] In an embodiment, the first processing line includes a first backing tape, a first die-cutting mechanism, a first peeling mechanism, a first waste collecting mechanism, and a second waste collecting mechanism, the first backing tape is capable of moving from an upstream to a downstream direction of the first processing line;

[0015] The first processing line is sequentially provided with a feeding station, a die-cutting station, a first waste collecting station, a peeling station, and a second waste collecting station from upstream to downstream;

[0016] The first backing tape is joined with the target patch at the feeding station;

[0017] The first die-cutting mechanism is provided with a first die-cutting support roller and a first cutter at the die-cutting station, the first die-cutting support roller and the first cutter are respectively located at two opposite sides of the first backing tape, and the first cutter is used to cut the target patch to form the target patch;

[0018] The first waste collecting mechanism recycles the waste formed after the target patch is cut at the first waste collecting station;

[0019] The first stripping mechanism is provided with a first stripping cutter at the stripping station, and the first stripping cutter is arranged on the side of the first supporting material away from the target object patch. The first stripping cutter is arranged to abut against the first supporting material, so that the first supporting material is changed from the initial horizontal extension direction to the downward extension direction at the first stripping cutter, so as to strip the target object patch and the first supporting material.

[0020] The second waste collecting mechanism recycles the first supporting material at the second waste collecting station.

[0021] In an embodiment, the first processing line has at least one of the following characteristics:

[0022] The first waste collecting mechanism is provided with a first waste collecting support roller and a first waste collecting pressure roller at the first waste collecting station, and the first waste collecting support roller and the first waste collecting pressure roller are respectively arranged on the two opposite sides of the first supporting material. The first waste collecting mechanism is further provided with a waste belt, a feeding roller and a discharging roller. The feeding roller, the first waste collecting pressure roller and the discharging roller are sequentially connected through the waste belt. The waste belt is sent out from the feeding roller and adheres to the waste after being pressed by the first waste collecting pressure roller. The waste belt adhering to the waste is recycled by the discharging roller.

[0023] The second waste collecting mechanism is provided with a first waste collecting roller for winding the first supporting material at the second waste collecting station.

[0024] The first processing line further comprises a first pressing mechanism capable of tensioning the first supporting material. The first processing line is further provided with a pressing station, and the pressing station is arranged upstream of the feeding station. The first pressing mechanism is provided with a first pressing support roller and a first pressing pressure roller at the pressing station, and the first pressing support roller and the first pressing pressure roller are respectively arranged on the two opposite sides of the first supporting material.

[0025] The first processing line further comprises a first supporting material roll arranged at the most upstream. The first supporting material roll is provided with a rolled first supporting material.

[0026] In an embodiment, the first processing line further comprises an auxiliary adhering mechanism for adhering the target object patch to the first supporting material. The first processing line is further provided with an auxiliary adhering station, and the auxiliary adhering station is arranged between the feeding station and the die-cutting station. The first supporting material is conveyed from below the feeding platform and passes between the discharge side of the feeding platform and the auxiliary adhering mechanism from bottom to top.

[0027] In an embodiment, the auxiliary adhering mechanism is arranged to have at least one of the following characteristics:

[0028] The auxiliary fitting mechanism comprises a first auxiliary pressing mechanism, which comprises pressing plates and fitting plates arranged on two opposite sides of the first bottom supporting tape; the pressing plates can approach or move away from the fitting plates, and the pressing plates can press against the edges of the target object original piece when approaching the fitting plates, so that the edges of the target object original piece are fitted with the first bottom supporting tape;

[0029] The auxiliary fitting mechanism comprises a first blowing mechanism for blowing air to the target object original piece, so that the target object original piece is fitted with the first bottom supporting tape; and,

[0030] The auxiliary fitting mechanism comprises a second auxiliary pressing mechanism, which comprises a first auxiliary fitting pressing roller and a first auxiliary fitting supporting roller arranged on two opposite sides of the first bottom supporting tape; the first auxiliary fitting pressing roller can approach or move away from the first auxiliary fitting supporting roller, and the first auxiliary fitting pressing roller can press against the edges of the target object original piece when approaching the first auxiliary fitting supporting roller, so that the edges of the target object original piece are fitted with the first bottom supporting tape; the roller surface of the first auxiliary fitting pressing roller is wrapped with a protective material.

[0031] In an embodiment, the first processing line comprises a feeding platform for placing the target object original piece; the feeding platform can adsorb the target object original piece, and / or the feeding platform itself can move and / or rotate to push a part of the target object original piece out of the feeding platform.

[0032] In an embodiment, the feeding platform is provided with a plurality of adsorption holes, and the inside of the feeding platform is formed with a negative pressure cavity in communication with the adsorption holes, wherein the feeding platform has at least one of the following characteristics:

[0033] The plurality of adsorption holes are distributed from dense to sparse or from sparse to dense along the discharging direction of the target object original piece;

[0034] The plurality of adsorption holes are distributed from dense to sparse or from sparse to dense along the direction perpendicular to the discharging direction of the target object original piece;

[0035] The distribution density of the plurality of adsorption holes is sparse in the middle and dense at the edges or dense in the middle and sparse at the edges;

[0036] The hole diameters of the plurality of adsorption holes are distributed from large to small or from small to large along the discharging direction of the target object original piece;

[0037] The hole diameters of the plurality of adsorption holes are distributed from large to small or from small to large along the direction perpendicular to the discharging direction of the target object original piece;

[0038] The plurality of adsorption holes have a larger pore size in the middle portion and a smaller pore size in the edge portion, or a smaller pore size in the middle portion and a larger pore size in the edge portion.

[0039] In an embodiment, the feeding platform forms a plurality of rows of adsorption structures along the discharge direction of the target material sheet, each row of adsorption structures comprising a plurality of adsorption holes arranged in sequence along a direction perpendicular to the discharge direction, and the plurality of rows of adsorption structures form a plurality of rows and columns of a matrix; a portion of the adsorption holes in adjacent rows do not share the same negative pressure cavity, and / or a portion of the adsorption holes in adjacent columns do not share the same negative pressure cavity.

[0040] In an embodiment, the feeding platform is provided with a plurality of independently arranged negative pressure cavities, and the negative pressure cavities are arranged in one of the following manners:

[0041] The plurality of negative pressure cavities are arranged in sequence along the discharge direction of the target material sheet;

[0042] The plurality of negative pressure cavities are arranged in sequence along a direction perpendicular to the discharge direction of the target material sheet;

[0043] Some of the plurality of negative pressure cavities are distributed in the middle of the feeding platform, and others are distributed in the edge of the feeding platform.

[0044] In an embodiment, the feeding platform is a profiled conveyor belt, and the profiled conveyor belt is provided with a plurality of partitions arranged in sequence along a conveying direction, and each adjacent partition forms a conveying section, and each conveying section is used to place one target material sheet.

[0045] In an embodiment, the first processing line further comprises an auxiliary laminating mechanism for laminating the target material sheet with a first backing material belt, and the first backing material belt is used to convey the target material sheet; and the first processing line is further provided with an auxiliary laminating station, and the auxiliary laminating station is arranged between the feeding station and the die-cutting station.

[0046] The first backing material belt is conveyed from below the profiled conveyor belt and passes between the discharge side of the profiled conveyor belt and the auxiliary laminating mechanism from bottom to top; and the height of each partition protruding from the conveying surface of the profiled conveyor belt is less than the gap width between the discharge side of the feeding platform and the auxiliary laminating mechanism.

[0047] In an embodiment, the feeding platform is provided with a limiting baffle, and the limiting baffle is used to prevent the target material sheet from moving in a direction other than the discharge direction.

[0048] In an embodiment, the size of the limiting baffle is adjustable, and / or at least part of the structure of the limiting baffle is movable relative to the feeding platform to push a part of the target original sheet out of the feeding platform.

[0049] In an embodiment, the limiting baffle comprises two side baffles and a pushing plate, the two side baffles are arranged at two opposite sides of the pushing plate, the pushing plate is movably connected with the two side baffles, or the limiting baffle is an integrated curved pushing plate, the curved pushing plate wraps around and is used to push the target original sheet.

[0050] In an embodiment, the second processing line comprises a second bottom supporting material belt, a second pressing mechanism, a second die-cutting mechanism, a third pressing mechanism, and a third waste collecting mechanism, the second bottom supporting material belt is used to move from the upstream to the downstream of the second processing line;

[0051] The second processing line is sequentially provided with a first pressing station, a die-cutting station, a second pressing station, and a waste collecting station from the upstream to the downstream;

[0052] The second pressing mechanism is provided with a second pressing support roller and a second pressing roller at the first pressing station, the second pressing support roller and the second pressing roller are respectively located at two opposite sides of the second bottom supporting material belt, so that the second bottom supporting material belt is engaged with the first anti-adhesive paper;

[0053] The second die-cutting mechanism is provided with a second die-cutting support roller and a second cutter at the die-cutting station, the second die-cutting support roller and the second cutter are respectively located at two opposite sides of the second bottom supporting material belt, the second cutter is used to cut the first anti-adhesive paper to form the second anti-adhesive paper;

[0054] The third pressing mechanism is provided with a third pressing roller at the second pressing station, the third pressing roller is arranged at one side of the second bottom supporting material belt, so that the second anti-adhesive paper and the second adhesive sticker are engaged;

[0055] The third waste collecting mechanism recovers the waste corresponding to the hollows by cutting the first anti-adhesive paper at the waste collecting station through the second bottom supporting material belt, and separates the second bottom supporting material belt from the second anti-adhesive paper at the second pressing station.

[0056] In an embodiment, the second processing line has at least one of the following characteristics:

[0057] The third waste collecting mechanism is provided with a second waste collecting winding drum at the waste collecting station to wind the second bottom supporting material belt;

[0058] The second processing line further comprises a second bottoming material tape roll and a first anti-adhesive paper roll arranged at the most upstream, the second bottoming material tape roll is provided with a second bottoming material tape roll, and the first anti-adhesive paper roll is provided with a first anti-adhesive paper roll, and the second bottoming material tape roll and the first anti-adhesive paper roll are arranged independently.

[0059] In an embodiment, the third processing line comprises a third bottoming material tape, a fourth pressing mechanism, a third die-cutting mechanism, a fourth waste collecting mechanism and a fifth pressing mechanism, the third bottoming material tape is used to move from the upstream to the downstream of the third processing line;

[0060] The third processing line is sequentially provided with a first pressing station, a die-cutting station and a waste collecting station from the upstream to the downstream, and is further provided with a second pressing station, the second pressing station is arranged downstream of the die-cutting station and parallel to the waste collecting station;

[0061] The fourth pressing mechanism is provided with a fourth pressing support roller and a fourth pressing roller at the first pressing station, the fourth pressing support roller and the fourth pressing roller are respectively located at two opposite sides of the third bottoming material tape, so that the third bottoming material tape is combined with the first adhesive tape;

[0062] The third die-cutting mechanism is provided with a third die-cutting support roller and a third cutter at the die-cutting station, the third die-cutting support roller and the third cutter are respectively located at two opposite sides of the third bottoming material tape, and the third cutter is used to cut the first adhesive tape to form the second adhesive tape;

[0063] The fourth waste collecting mechanism recycles the waste generated by cutting the first adhesive tape at the waste collecting station;

[0064] The fifth pressing mechanism is provided with a fifth pressing support roller at the second pressing station, the fifth pressing support roller is arranged at one side of the third bottoming material tape, so that the second anti-adhesive paper and the second adhesive tape are combined.

[0065] In an embodiment, the third pressing mechanism is provided with a third pressing roller at the second pressing station of the second processing line, the third pressing roller is arranged at one side of the second bottoming material tape, the fifth pressing support roller is arranged at the other side of the second bottoming material tape, the positions of the third pressing roller and the fifth pressing support roller correspond to each other; the second bottoming material tape of the second processing line and the third bottoming material tape pass between the third pressing roller and the fifth pressing support roller, and the fourth processing line and the third processing line share the third bottoming material tape, that is, the third bottoming material tape continues to be transported from the second pressing station of the third processing line to the fourth processing line.

[0066] In one embodiment, the third processing line further includes a primary adhesive tape material roll and a third base material roll located at the upstream end. The third base material roll contains a roll of third base material, and the primary adhesive tape material roll contains a roll of primary adhesive tape. The third base material roll and the primary adhesive tape material roll are arranged independently of each other.

[0067] In one embodiment, the fourth processing line includes a third bottom support belt, a peeling support mechanism, a bonding mechanism, a fourth die-cutting mechanism, a fifth waste collection mechanism, a second peeling mechanism, and a sixth waste collection mechanism, wherein the third bottom support belt is used to move from upstream to downstream of the fourth processing line;

[0068] The fourth processing line is provided with a bonding station, a die-cutting station and a first waste collection station in sequence from upstream to downstream; the fourth processing line is also provided with a peeling station, a second waste collection station and a packaging station; the peeling station is located downstream of the die-cutting station and is arranged in parallel with the first waste collection station; the second waste collection station and the packaging station are both located downstream of the peeling station and are arranged in parallel.

[0069] The peeling support mechanism is provided with peeling support rollers on one side of the bonding station and the third bottom material belt;

[0070] The bonding mechanism applies a force to the target patch at the bonding station to bond the target patch with the primary adhesive tape.

[0071] The fourth die-cutting mechanism is provided with a fourth die-cutting support roller and a fourth cutter at the die-cutting station. The fourth die-cutting support roller and the fourth cutter are respectively located on two opposite sides of the third bottom material belt. The fourth cutter is used to cut the secondary release paper to form multiple target products.

[0072] The fifth waste collection mechanism collects the waste material formed after the secondary anti-sticking paper is cut at the first waste collection station;

[0073] The second peeling mechanism is provided with a second peeling blade at the peeling station. The second peeling blade is located on the side of the third support strip away from the target product. The second peeling blade presses against the third support strip with its two adjacent sides, so that the third support strip changes from its initial horizontal extension direction to an oblique upward extension direction at the second peeling blade, thereby peeling the target product and the third support strip.

[0074] The sixth waste collection mechanism recovers the third bottom material belt at the second waste collection station;

[0075] The packaging station is arranged close to the peeling station, and is provided with a packaging box, and the peeled target product automatically falls into the packaging box.

[0076] In an embodiment, the bonding mechanism comprises a peeling bonding compression roller corresponding to the position of the peeling support roller, the peeling bonding compression roller and the peeling support roller are arranged at two opposite sides of the third supporting material belt, the peeling bonding compression roller is used for pressing the edge of the target product patch, so that the target product patch is bonded with the secondary adhesive, and the roller surface of the peeling bonding compression roller is wrapped with a deformable protective structure.

[0077] In an embodiment, the bonding mechanism comprises a second blowing mechanism and a bonding support platform, the second blowing mechanism and the bonding support platform are arranged at two opposite sides of the third supporting material belt respectively; the second blowing mechanism can be close to or away from the bonding support platform; when the second blowing mechanism is close to the bonding support platform, the second blowing mechanism is used for blowing air to the target product patch, so that the target product patch is bonded with the secondary adhesive.

[0078] In an embodiment, the number of target product patches is multiple, the second blowing mechanism comprises a blowing platform, the blowing platform is provided with multiple air outlets, the number and position of the air outlets correspond to the number and position of the target product patches, each target product patch is blown by a corresponding air outlet, the diameter of the air outlet is greater than the diameter of the target product patch, and when the blowing platform is close to the bonding support platform, the air outlet is sleeved with the target product patch to blow air.

[0079] In an embodiment, the fourth processing line further comprises a second visual detection system in communication connection with the control system, and the control system is used for controlling the state of the bonding mechanism according to the visual detection information of the second visual detection system.

[0080] In order to achieve the above-mentioned purpose, the present application also provides a patch product processing method, and the processing method is implemented by any one of the patch product processing systems.

[0081] In the patch product processing system and patch processing method disclosed by the present application, the patch product processing system comprises a first processing line, a second processing line, a third processing line and a fourth processing line; the first processing line, the second processing line and the third processing line run in parallel; the fourth processing line runs in series with respect to the first processing line, the second processing line and the third processing line; the first processing line is used for processing a target original patch into a target patch with a predetermined structure; the second processing line is used for processing a first anti-adhesion paper into a second anti-adhesion paper with hollows; the third processing line is used for processing a first adhesive tape into a second adhesive tape with a predetermined structure; the second processing line is also used for bonding the second adhesive tape with the second anti-adhesion paper to obtain a first back adhesive tape; and the fourth processing line is used for bonding the target patch with the first back adhesive tape, with the target patch placed in the hollows and one side of the target patch bonded with the second adhesive tape. In this way, the present application can realize continuous and large-batch automatic production of patch-type target products, improve the processing efficiency and stability of the target products and reduce the processing cost. The present application can realize parallel die cutting of target original patches, anti-adhesion papers and adhesive tapes, thereby improving the processing efficiency of patch-type target products. In addition, the second adhesive tape, the second anti-adhesion paper and the target patch after die cutting can be automatically gathered and bonded, and peeled off into the corresponding packaging boxes, thereby automatically completing subsequent sealing and packaging without manual intervention, improving the processing efficiency and stability of product processing and ensuring the quality of patch-type target products. BRIEF DESCRIPTION OF DRAWINGS

[0082] Those skilled in the art will understand that the provided drawings are for the purpose of better illustrating the present application and do not constitute any limitation on the scope of the present application. Among them:

[0083] Figure 1 The micro-needle patch product processing flowchart provided for a preferred embodiment of the present application;

[0084] Figure 2 The view of the patch product processing system provided for a preferred embodiment of the present application, in which the arrows indicate the conveying direction of the materials;

[0085] Figure 3a The assembly view of the micro-needle patch product provided for a preferred embodiment of the present application;

[0086] Figure 3b The exploded view of the micro-needle patch product provided for a preferred embodiment of the present application;

[0087] Figure 3c The sectional view of the micro-needle patch product provided for a preferred embodiment of the present application;

[0088] Figure 4 A view of packaging the microneedle patch product according to a preferred embodiment of the present application;

[0089] Figure 5 A view of recovering the microneedle wafer cutting waste by using the waste removal tape according to a preferred embodiment of the present application;

[0090] Figure 6 A view of cutting the intermediate product to form a plurality of target products according to a preferred embodiment of the present application;

[0091] Figure 7 A view of the entire row of target products according to a preferred embodiment of the present application;

[0092] Figure 8 A view of the microneedle wafer placed on the loading platform, with a part of the microneedle wafer protruding from the discharge side of the loading platform to be placed on the first bottom material tape according to a preferred embodiment of the present application;

[0093] Figure 9 A perspective view of the loading platform with adsorption holes according to a preferred embodiment of the present application;

[0094] Figure 10 A Figure 9 Cross-sectional view of the loading platform;

[0095] Figure 11 A view of the loading platform with adsorption holes and the limiting baffle arranged on the loading platform according to a preferred embodiment of the present application;

[0096] Figure 12 A view of the adsorption holes distributed from sparse to dense along the discharge side direction according to a preferred embodiment of the present application;

[0097] Figure 13 A view of the adsorption holes distributed from small to large in diameter along the discharge side direction according to a preferred embodiment of the present application;

[0098] Figure 14 A view of the adsorption structure in each row being separately provided with a negative pressure cavity along the discharge side direction according to a preferred embodiment of the present application;

[0099] Figure 15 A view of the profiled conveyor belt forming the loading platform according to a preferred embodiment of the present application;

[0100] Figure 16 A view of the first auxiliary pressing mechanism and the first blowing mechanism arranged on the discharge side of the loading platform according to a preferred embodiment of the present application;

[0101] Figure 17A view of the feeding roller forming a feeding platform according to an embodiment of the present application;

[0102] Figure 18 A view of the partially movable limiting baffle according to an embodiment of the present application;

[0103] Figure 19 A view of the wholly movable limiting baffle according to an embodiment of the present application;

[0104] Figures 20 to 22 A view of the pressing plate according to an embodiment of the present application, in which the shape of the pressing plate matches the shape of the exposed area of the microneedle wafer;

[0105] Figure 23 and Figure 24 A view of the distribution of the air outlet holes of the first air blowing mechanism according to an embodiment of the present application;

[0106] Figure 25 A view of the second auxiliary pressing mechanism according to an embodiment of the present application, in which the microneedle wafer on the discharge side is pressed, and the first cleaning mechanism is used to remove dust from the microneedle wafer on the discharge side;

[0107] Figure 26 A view of the first supporting material belt according to an embodiment of the present application, in which a plurality of microneedle patches are formed for cutting the microneedle wafer;

[0108] Figure 27 A view of the third supporting material belt according to an embodiment of the present application, in which the first-level adhesive material belt is supported, and the number and position of the second-level adhesive patches correspond to the microneedle patches;

[0109] Figure 28 A view of the third supporting material belt according to an embodiment of the present application, in which a plurality of target products are supported, and the microneedle patches are one-to-one correspondingly bonded to the second-level adhesive patches;

[0110] Figure 29 A view of the bonding mechanism according to an embodiment of the present application;

[0111] Figure 30 A view of the air blowing platform of the second air blowing mechanism according to an embodiment of the present application;

[0112] Figure 31 A view of the second auxiliary pressing mechanism according to an embodiment of the present application, in which the microneedle wafer on the discharge side is pressed, and the first cleaning mechanism is used to remove dust from the microneedle wafer on the discharge side.

[0113] [Legend of reference signs is as follows]:

[0114] 500 - microneedle raw sheet; 600, 600' - target product; 601 - secondary adhesive tape; 602 - tertiary release paper; 603 - microneedle patch; 602' - secondary release paper; 700 - packaging box; 800 - box cover; S1 - first processing line; A1 - feeding station of first processing line; A2 - die cutting station of first processing line; A3 - first waste collecting station of first processing line; A4 - peeling station of first processing line; A5 - second waste collecting station of first processing line; A6 - pressing station of first processing line; A7 - auxiliary laminating station; 101 - first backing tape material roll; 1011 - first backing tape; 102 - first pressing mechanism; 1021 - first pressing roller; 1022 - first pressing support roller; 103 - feeding platform; 103a - profiled conveyor belt; 103b - exposure area; 1031 - suction hole; 1032 - partition plate; 1033 - feeding roller shaft; 1034 - negative pressure cavity; S - discharge side; 104 - first die cutting mechanism; 1041 - first cutter; 1042 - first die cutting support roller; 105 - first waste collecting mechanism; 1051 - first waste collecting roller; 1052 - first waste collecting support roller; 1053 - feeding reel; 1054 - discharge reel; 1055 - waste adhesive tape; 106 - first peeling mechanism; 107 - second waste collecting mechanism; 108 - limiting baffle; 1081 - side baffle, 1082 - push plate, 108a - curved push plate; 109 - first auxiliary pressing mechanism; 1091 - pressing plate; 1092 - laminating plate; 110 - first air blowing mechanism; 1101 - air outlet hole of first air blowing mechanism; 111 - second auxiliary pressing mechanism; 1111 - first auxiliary laminating roller; 1112 - first auxiliary laminating support roller; 112 - first cleaning mechanism; S2 - second processing line; B1 - first pressing station of second processing line; B2 - die cutting station of second processing line; B3 - second pressing station of second processing line; B4 - waste collecting station of second processing line; 201 - second backing tape material roll; 2011 - second backing tape; 202 - primary release paper material roll; 2021 - primary release paper; 203 - second pressing mechanism; 2031 - second pressing roller; 2032 - second pressing support roller; 204 - second die cutting mechanism; 2041 - second die cutting support roller; 2042 - second cutter; 205 - third pressing mechanism; 2051 - third pressing roller; 206 - third waste collecting mechanism; S3 - third processing line; C1 - first pressing station of third processing line; C2 - die cutting station of third processing line; C3 - waste collecting station of third processing line; C4 - second pressing station of third processing line; 301 - primary adhesive tape material roll; 3011 - primary adhesive tape; 302 - third backing tape material roll; 3021 - third backing tape; 303 - fourth pressing mechanism; 3031 - fourth pressing roller; 3032 - fourth pressing support roller; 304 - third die cutting mechanism; 3041 - third cutter;3042 - third die cutting support roller; 305 - fourth waste collecting mechanism; 306 - fifth pressing mechanism; 3061 - fifth pressing support roller; S4 - fourth processing line; D1 - laminating station of the fourth processing line; D2 - die cutting station of the fourth processing line; D3 - first waste collecting station of the fourth processing line; D4 - peeling station of the fourth processing line; D5 - second waste collecting station of the fourth processing line; D6 - packaging station of the fourth processing line; 401 - peeling support mechanism; 402 - laminating mechanism; 4021 - second blowing mechanism; 4021a - blowing platform; 4021b - air outlet hole of the second blowing mechanism; 4022 - laminating support platform; 4023 - driving mechanism; 4024 - limiting rod; 403 - fourth die cutting mechanism; 4031 - fourth cutter; 4032 - fourth die cutting support roller; 404 - fifth waste collecting mechanism; 405 - first turning roller; 406 - second turning roller; 407 - second peeling mechanism; 408 - sixth waste collecting mechanism; 409 - laminating and pressing roller; 410 - second cleaning mechanism; 501 - first visual inspection system; 502 - second visual inspection system. DETAILED DESCRIPTION

[0115] The application will be described in more detail with reference to the enclosed schematic drawings, wherein

[0116] For the sake of brevity, the full structure of an actual implementation will not be described in detail. In the following description, numerous specific details are set forth, in order to provide a thorough understanding of the application. It will be apparent, however, to one skilled in the art that the application can be practiced without some or all of these details. In other instances, well known process steps have not been described in detail in order not to unnecessarily obscure the application. It will be understood that numerous implementation-specific decisions can be made to a specific embodiment of the application and that such decisions will be based upon practical considerations, such as a particular starting material used, a particular final product desired, and the like. Also, it will be understood that such development effort might be complex and time-consuming, but such is a result of a design choice made by a developer. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. It will be apparent, however, to one skilled in the art that the application can be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail in order not to unnecessarily obscure the application. It will be understood that numerous implementation-specific decisions can be made to a specific embodiment of the application and that such decisions will be based upon practical considerations, such as a particular starting material used, a particular final product desired, and the like. Also, it will be understood that such development effort might be complex and time-consuming, but such is a result of a design choice made by a developer. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. It will be apparent, however, to one skilled in the art that the application can be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail in order not to unnecessarily obscure the application. It will be understood that numerous implementation-specific decisions can be made to a specific embodiment of the application and that such decisions will be based upon practical considerations, such as a particular starting material used, a particular final product desired, and the like. Also, it will be understood that such development effort might be complex and time-consuming, but such is a result of a design choice made by a developer. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. It will be apparent, however, to one skilled in the art that the application can be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail in order not to unnecessarily obscure the application. It will be understood that numerous implementation-specific decisions can be made to a specific embodiment of the application and that such decisions will be based upon practical considerations, such as a particular starting material used, a particular final product desired, and the like. Also, it will be understood that such development effort might be complex and time-consuming, but such is a result of a design choice made by a developer.

[0117] Furthermore, the terminology used in this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “the,” and “the” used in this application are also intended to include the plural forms unless the context clearly indicates otherwise. It should be understood that the terms “first,” “second,” “third,” “fourth,” “fifth,” “sixth,” and similar terms used in this application specification do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, “a” or “one,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one; “multiple” indicates two or more. Unless otherwise stated, “front,” “rear,” “lower,” and / or “upper,” and similar terms are for ease of description only and are not limited to a location or spatial orientation. The terms “comprising” or “including,” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. It should also be understood that “several,” as used in this application specification, indicates an indefinite quantity. In this text, "front" is relative to "rear"; "front" refers to the position where the material arrives first, and "rear" is the position where the material is received later than "front." "Front and back" is the horizontal direction along the material's transport direction, and "left and right" is the horizontal direction perpendicular to the material's transport direction. "Forward" refers to the direction in which the material is transported from front to back. Figure 2 In this context, the direction perpendicular to the paper is the left-right direction, and the direction parallel to the paper is the front-back direction. It should be understood that the material mentioned herein can refer to either unprocessed or processed products. Furthermore, the term "upstream" is relative to "downstream"; "upstream" typically refers to the location where material is processed or received first, while "downstream" typically refers to the location where material is processed or received later. Additionally, it should be understood that all backing tapes used in this application are low-viscosity backing films, such as PET silicone film.

[0118] The present application will now be described in detail with reference to the accompanying drawings and preferred embodiments. It should be understood that although the following description uses the processing of microneedle patches as an example, those skilled in the art will understand that the present invention can also be used to process other patch-type target products, such as silicone sheets or facial masks. Furthermore, unless otherwise specified, the following embodiments and features can complement or combine with each other.

[0119] This invention discloses a method for processing patch products, comprising:

[0120] The target material is processed by the first processing line to form a target material patch with a predetermined structure;

[0121] The first-grade anti-adhesive paper is processed by the second processing line to form a second-grade anti-adhesive paper with a hollow;

[0122] The first-grade adhesive tape is processed by the third processing line to form a second-grade adhesive tape with a predetermined structure;

[0123] The second-grade adhesive tape is combined with the second-grade anti-adhesive paper by the second processing line to obtain a first-grade back adhesive tape;

[0124] The target object patch is combined with the first-grade back adhesive tape by the fourth processing line, the target object patch is placed in the hollow, and one side of the target object patch is bonded with the second-grade adhesive tape.

[0125] Taking the processing of a microneedle patch as an example, Figure 1 The processing method of the microneedle patch product disclosed in the preferred embodiment of the present application comprises first to fourth processing procedures.

[0126] Specifically, the first processing procedure is implemented by the first processing line S1 to process the microneedle original piece to form a microneedle patch with a predetermined structure, specifically including:

[0127] Step S11, loading the microneedle original piece (i.e. the target object original piece);

[0128] Step S12, cutting the microneedle original piece to form a microneedle patch (i.e. the target object patch) with a predetermined structure (including a predetermined shape and size); the number of the microneedle patch is generally multiple;

[0129] Step S13, peeling the microneedle patch; specifically, the microneedle patch is peeled from the first bottom supporting tape.

[0130] The second processing procedure is implemented by the second processing line S2 to process the first-grade anti-adhesive paper to form a second-grade anti-adhesive paper with a hollow, and to combine the second-grade adhesive tape with the second-grade anti-adhesive paper to obtain a first-grade back adhesive tape, specifically including:

[0131] Step S21, loading the first-grade anti-adhesive paper;

[0132] Step S22, cutting the first-grade anti-adhesive paper to form a second-grade anti-adhesive paper with a hollow; the number and position of the hollows on the second-grade anti-adhesive paper correspond one-to-one to the number and position of the microneedle patches;

[0133] Step S23, peeling the second-grade anti-adhesive paper; at this time, the waste material with a hollow is formed after the first-grade anti-adhesive paper is cut, therefore, the hollow waste material and the first bottom supporting tape are both peeled from the second-grade anti-adhesive paper, so as to facilitate the combination of the peeled second-grade anti-adhesive paper with the second-grade adhesive tape in step S24;

[0134] Step S24, the secondary anti-adhesive paper is engaged with the secondary adhesive tape; the adhesive tape can use water gel, hydrogel, non-woven fabric adhesive tape and other adhesive materials.

[0135] The above steps S23 and S24 can be performed simultaneously, or step S23 is performed first and step S24 is performed later. It should be noted that the anti-adhesive paper can be selected as release paper or other anti-adhesive paper with similar performance.

[0136] A third processing flow is implemented by the third processing line S3 to process the primary adhesive tape to form a secondary adhesive tape with a predetermined structure, specifically including:

[0137] Step S31, loading the primary adhesive tape;

[0138] Step S32, cutting the primary adhesive tape to form a secondary adhesive tape with a predetermined structure (predetermined shape and size); the number and position of the secondary adhesive tape correspond to the number and position of the microneedle patch one by one;

[0139] After step S32, step S24 is performed.

[0140] In the above step S24, after the secondary anti-adhesive paper is engaged with the secondary adhesive tape, a primary back adhesive tape is obtained. In the primary back adhesive tape, the secondary anti-adhesive paper is engaged with the back adhesive surface of the secondary adhesive tape, and the hollow part exposes the secondary adhesive tape to engage the microneedle patch. In this embodiment, a large piece of secondary anti-adhesive paper has multiple hollows, and each hollow is covered with a secondary adhesive tape, and the area of the secondary adhesive tape is larger than the area of the hollow.

[0141] A fourth processing flow is implemented by the fourth processing line S4, specifically including step S41, engaging the microneedle patch with the primary back adhesive tape to obtain a target product containing the microneedle patch.

[0142] In an embodiment, after the microneedle patch is engaged with the primary back adhesive tape, a whole row of target products is obtained, at this time, the whole row of target products is composed of a whole piece of secondary anti-adhesive paper, multiple secondary adhesive tapes and multiple target patches.

[0143] In another embodiment, after the microneedle patch is engaged with the primary back adhesive tape, an intermediate product is obtained, and the secondary anti-adhesive paper in the intermediate product is further cut by the fourth processing line S4 to obtain multiple target products, at this time, each target product is composed of a secondary adhesive tape, a tertiary anti-adhesive paper and a target patch, the tertiary anti-adhesive paper is formed by cutting the secondary anti-adhesive paper, the middle part of the tertiary anti-adhesive paper has the hollow, the target patch is inserted into the hollow, and one side of the target patch is adhered to the secondary adhesive tape.

[0144] The one side (microneedle side) of the microneedle patch is provided with a plurality of microneedles, and the other side (non-microneedle side) of the microneedle patch is adhered to a secondary adhesive tape. A plurality of microneedle patches are adhered to a plurality of secondary adhesive tapes one by one. The microneedle patch comprises a substrate and a plurality of microneedles formed on the substrate. All microneedles are arranged in the central region of the substrate, and the edge region (i.e. the needle-free area) is formed in the periphery of the central region. In practice, the substrate and the microneedles can be integrally or integrally manufactured, or two separate bodies are manufactured.

[0145] In an optional manner, the fourth processing procedure further comprises:

[0146] In step S42, after the microneedle patch is adhered to the primary adhesive tape, an intermediate product is obtained, and the intermediate product is cut to form a plurality of target products. Specifically, the secondary release paper on the intermediate product is cut to obtain a plurality of target products.

[0147] The fourth processing procedure further comprises:

[0148] In step S43, the target product is peeled off, and the peeled target product can be automatically loaded into a packaging box. Here, the target product and the third supporting tape supporting the target product are peeled off, and the target product automatically falls into the packaging box after being peeled off from the third supporting tape.

[0149] Further, the fourth processing procedure further comprises:

[0150] In step S44, after being loaded into the packaging box, the packaging box is automatically sealed by a sealing machine.

[0151] In a specific embodiment, the packaging box is a plastic suction box, and the plastic suction box is sealed by plastic sealing.

[0152] Referring to Figures 3a to 3c and Figure 6In one embodiment, a plurality of target products 600 can be processed, each of which is composed of a secondary adhesive patch 601, a tertiary release paper 602, and a microneedle patch 603. The tertiary release paper 602 is cut from the secondary release paper, and the middle part of the tertiary release paper 602 has a hollowed-out portion, the shape of which generally corresponds to that of the microneedle patch 603; the microneedle patch 603 is placed in the hollowed-out portion, and one side of the microneedle patch 603 is bonded to the secondary adhesive patch 601. All target products 600 have the same shape and size. The size of the tertiary release paper 602 can be the same as that of the secondary adhesive patch 601, so that after being bonded, the edges of the tertiary release paper 602 almost coincide with those of the secondary adhesive patch 601. Alternatively, the edges of the tertiary release paper 602 extend beyond those of the secondary adhesive patch 601, so as to form exposed tertiary release paper 602 around the secondary adhesive patch 601 along the edges of the hollowed-out portion. Considering that the tertiary release paper 602 is inconvenient to operate if it is too small, the size of the tertiary release paper 602 is greater than that of the secondary adhesive patch 601, so that the user can directly tear off the tertiary release paper 602 that extends around the secondary adhesive patch 601, thereby quickly and conveniently tearing off the tertiary release paper 602 and making the operation more convenient. Taking release paper and hydrocolloid as an example, the release paper is used to protect the hydrocolloid surface exposed to the microneedle patch 603 from being contaminated or having its adhesive force reduced due to contact with air or foreign objects. When in use, the release paper is torn along the easy-tear line in the middle of the target product 600, and after the release paper is removed, the hydrocolloid can be attached to the skin, and appropriate pressure can be applied. This not only makes the use convenient, but also avoids the problem of reduced adhesive force due to exposure or contamination of the surface.

[0153] Referring to Figure 7 In another embodiment, a plurality of target products 600' can be processed, each of which is composed of a secondary release paper 602', a plurality of secondary adhesive patches 601, and a plurality of microneedle patches 603, the secondary adhesive patches 601 being bonded to the microneedle patches 603 one by one.

[0154] Figure 4 This is a specific example of packaging the target product 600 according to the present application. As shown in FIG. 6, the target product 600 is packaged in a box 700, and the box 700 is provided with a plurality of compartments 701, each of which is used to accommodate one target product 600. The box 700 can be made of paper, plastic, or other materials, and the compartments 701 can be formed by cutting the box 700 or by other methods. The box 700 can be provided with a cover 702, and the cover 702 can be made of paper, plastic, or other materials. The cover 702 can be provided with a plurality of windows 703, each of which corresponds to one compartment 701. The cover 702 can be provided with a plurality of adhesive strips 704, each of which corresponds to one window 703. The cover 702 can be provided with a plurality of release papers 705, each of which corresponds to one adhesive strip 704. The cover 702 can be provided with a plurality of easy-tear lines 706, each of which corresponds to one window 703. The cover 702 can be provided with a plurality of instructions 707, each of which corresponds to one window 703. Figure 4As shown, in an embodiment, the fourth processing line S4 can automatically load the target product 600 after peeling into the packaging box 700, and finally seal the packaging box 700. The packaging box 700 can include a box body and a box cover 800, and the target product 600 is placed in the box body. After the box cover 800 is closed with the box body, the sealing machine is used for plastic sealing. It should be understood that, since the glue-free surface of the target product 600 is exposed, the target product 600 can be directly placed in the packaging box 700 after being peeled off from the third backing tape, avoiding manual sampling by using a sampler, such as using the adhesion of the non-woven adhesive tape to stick the target product, and then sticking the non-woven adhesive tape on the designated sampling of the packaging box, thereby effectively saving processing time and improving processing efficiency. Preferably, the inner cavity shape of the packaging box 700 matches the shape of the target product 600, so as to better fix the target product 600, effectively prevent the target product 600 from shaking, and reduce the risk of damage.

[0155] Referring to Figure 1 and Figure 2 , the embodiment of the present application also provides a patch product processing system for implementing the patch product processing method described above, which comprises a first processing line S1, a second processing line S2, a third processing line S3 and a fourth processing line S4; the first processing line S1, the second processing line S2 and the third processing line S3 run in parallel; the fourth processing line S4 runs in series with respect to the first processing line S1, the second processing line S2 and the third processing line S3; the first processing line S1 is used to process the microneedle wafer 500 into a microneedle patch 603 with a predetermined structure (shape and size); the second processing line S2 is used to process the first anti-adhesion paper into a second anti-adhesion paper 602' with a hollow structure; the third processing line S3 is used to process the first adhesive tape into a second adhesive tape 601 with a predetermined structure (shape and size); the second processing line S2 is also used to bond the second adhesive tape 601 with the second anti-adhesion paper 602', obtaining a first backing tape; and the fourth processing line S4 is used to bond the microneedle patch 603 with the first backing tape, obtaining the target product 600 or 600'.

[0156] When configured in this way, the patch product processing system can realize parallel die cutting of the microneedle wafer, the anti-adhesion paper and the adhesive tape, thereby improving the processing efficiency of the microneedle patch. In addition, the second adhesive tape, the second anti-adhesion paper and the microneedle patch after die cutting are automatically bonded and peeled off into the corresponding packaging box, and the subsequent sealing and packaging are automatically completed without manual intervention, thereby improving the processing efficiency and the stability of product production, and ensuring the quality of the microneedle patch product.

[0157] In an embodiment, the fourth processing line S4 is configured to first join the microneedle patch 603 with the primary adhesive tape to obtain an intermediate product, and then cut the intermediate product to form a plurality of target products 600. However, in other embodiments of the present application, the intermediate product can be omitted, and the secondary release paper does not need to be cut again. In this case, the fourth processing line S4 can directly process to obtain a continuous row of target products 600'.

[0158] Referring to Figure 2 In an embodiment, the first processing line S1 includes a first backing tape 1011, a first die-cutting mechanism 104, a first peeling mechanism 106, a first waste collecting mechanism 105, and a second waste collecting mechanism 107. The first backing tape 1011 is movable from upstream to downstream of the first processing line S1. The first processing line S1 sequentially includes a feeding station A1, a die-cutting station A2, a first waste collecting station A3, a peeling station A4, and a second waste collecting station A5 from upstream to downstream. The first backing tape 1011 is joined with the microneedle wafer 500 at the feeding station A1, and then drags the microneedle wafer 500 to downstream. The first die-cutting mechanism 104 includes a first cutter 1041 and a first die-cutting support roller 1042 at the die-cutting station A2. The first die-cutting support roller 1042 and the first cutter 1041 are respectively located at two opposite sides of the first backing tape 1011. For example, the first die-cutting support roller 1042 is below the first backing tape 1011, and the first cutter 1041 is above the first backing tape 1011. The first cutter 1041 is used to cut the microneedle wafer 500 to form the microneedle patch 603. The first waste collecting mechanism 105 collects the waste generated after the microneedle wafer 500 is cut at the first waste collecting station A3. The first peeling mechanism 106 includes a first peeling knife at the peeling station A4. The first peeling knife is arranged at a side of the first backing tape 1011 away from the microneedle patch 603. The first peeling knife is used to change the extension direction of the first backing tape 1011 from horizontal to downward at the first peeling knife, so as to peel the microneedle patch 603 and the first backing tape 1011. In other words, the first backing tape 1011 is divided into two parts with different extension directions by the first peeling knife. The included angle a between the two parts of the first backing tape 1011 is less than 90°, and preferably less than or equal to 30°. The second waste collecting mechanism 107 collects the first backing tape 1011 at the second waste collecting station A5. In this way, the first processing line S1 can realize automatic die-cutting and peeling of the microneedle wafer 500, automatic waste collection, and automatic feeding of the microneedle wafer. The whole process does not need manual intervention, has high processing efficiency, and has good processing stability.

[0159] In an embodiment, the first waste collecting mechanism 105 is provided with a first waste collecting pressure roller 1051 and a first waste collecting support roller 1052 at the first waste collecting station A3. The first waste collecting support roller 1052 and the first waste collecting pressure roller 1051 are respectively located at two opposite sides of the first bottom supporting material belt 1011. For example, the first waste collecting support roller 1052 is located below the first bottom supporting material belt 1011, and the first waste collecting pressure roller 1051 is located above the first bottom supporting material belt 1011. The first waste collecting mechanism 105 is further provided with a waste belt 1055, a feeding roller 1053 and a discharging roller 1054. The feeding roller 1053, the first waste collecting pressure roller 1051 and the discharging roller 1054 are sequentially connected through the waste belt 1055. The waste belt 1055 is sent out from the feeding roller 1053, and adheres to the waste material cut from the microneedle wafer 500 after being pressed by the first waste collecting pressure roller 1051. The waste belt 1055 adhering to the waste material is recycled by the discharging roller 1054. In an embodiment, the second waste collecting mechanism 107 is provided with a first waste collecting roller winding the first bottom supporting material belt 1011 at the second waste collecting station A5. In this way, the waste material can be quickly and effectively separated, the waste discharging efficiency is high, and the microneedle patch 603 is less likely to be damaged, and the risk is low. It should be understood that, since the feeding of the waste belt 1055 is arranged after the die cutting, the adverse effect of the feeding of the waste belt 1055 on the die cutting is reduced. In particular, the first waste collecting pressure roller 1051 is further arranged to cooperate with the first waste collecting support roller 1052, so as to further reduce the adverse effect of the waste belt 1055 on the die cutting operation, and ensure the die cutting precision.

[0160] Referring to Figure 5 , the first waste collecting pressure roller 1051 is used to press the waste belt 1055 against the edge portion of the microneedle wafer 500, so as to avoid damaging the microneedle structure of the middle portion of the microneedle wafer 500. In order to protect the cut microneedle wafer 500 from being damaged, the first waste collecting pressure roller 1051 is preferably dumbbell-shaped, which can simultaneously press two waste belts 1055 against the edge portion of the microneedle wafer 500, without touching the microneedle area of the cut microneedle wafer 500. The distance between the left and right pressing wheels of the first waste collecting pressure roller 1051 is adjustable or fixed. If the distance is adjustable, it can be adapted to microneedle wafers of different sizes.

[0161] Referring back to Figure 2In one embodiment, the first processing line S1 further includes a first pressing mechanism 102 capable of tensioning the first bottom support strip 1011; the first processing line S1 also has a pressing station A6, which is located upstream of the loading station A1; the first pressing mechanism 102 at the pressing station A6 has a first pressing support roller 1022 and a first pressing pressure roller 1021, which are respectively located on two opposite sides of the first bottom support strip 1011, such that the first pressing support roller 1022 is below the first bottom support strip 1011 and the first pressing pressure roller 1021 is above the first bottom support strip 1011. The first pressing mechanism 102 further straightens and tightens the first bottom support strip 1011, ensuring processing accuracy. The number of first pressing mechanisms 102 can be one or more arranged side by side.

[0162] In one embodiment, the first processing line S1 further includes a first bottom support material roll 101 located at the uppermost end, the first bottom support material roll 101 having a rolled first bottom support material 1011. In addition to providing the first bottom support material 1011, the first bottom support material roll 101 can also pull, transport, and tension the first bottom support material 1011.

[0163] It should be understood that in the first processing line S1, the first bottom material roll 101, the first pressing mechanism 102, the first die-cutting mechanism 104, the first waste collection mechanism 105 and the second waste collection mechanism 107 can be used to achieve the function of traction and transportation of the first bottom material roll 1011. The first peeling mechanism 106 can also realize the turning and transportation of the first bottom material roll 1011.

[0164] In one embodiment, the first processing line S1 further includes a loading platform 103 for placing the microneedle wafer 500, the loading platform 103 being located at the loading station A1.

[0165] like Figures 8 to 19 As shown, when the microneedle sheet 500 is placed on the loading platform 103, a portion of the microneedle sheet 500 extends out of the discharge side S of the loading platform 103 to rest on the first support strip 1011, with the discharge side S close to the die-cutting station A2. Setting up the loading platform 103 better ensures a smooth fit between the microneedle sheet 500 and the first support strip 1011, guaranteeing fitting accuracy. Preferably, the loading platform 103 can adsorb the microneedle sheet 500 to prevent it from lifting when it is attached to the first support strip 1011. Preferably, the loading platform 103 itself is movable and / or rotated, and through the movement and / or rotation of the loading platform 103, a portion of the microneedle sheet 500 is pushed out of the discharge side S of the loading platform 103.

[0166] In one embodiment, the feeding platform 103 uses negative pressure to adsorb (including vacuum adsorption or non-vacuum adsorption) the microneedle sheet 500. In another embodiment, the feeding platform 103 uses electrostatic adsorption to adsorb the microneedle sheet 500.

[0167] In a specific example, such as Figures 9 to 15 As shown, the loading platform 103 is provided with multiple adsorption holes 1031, and a negative pressure cavity 1034 communicating with the adsorption holes 1031 is formed inside the loading platform 103. After the microneedle substrate 500 is placed on the loading platform 103, the loading platform 103 activates negative pressure adsorption to fix the microneedle substrate 500 on the loading platform 103. The function of the adsorption holes 1031 is, on the one hand, to fix the microneedle substrate 500 on the loading platform 103 and prevent the microneedle substrate 500 from shifting due to mechanical vibration, and on the other hand, to maintain the flatness of the microneedle substrate 500 when the first support material belt 1011 drags the microneedle substrate 500. The adsorption holes 1031 can be uniformly distributed or non-uniformly distributed, and the distribution form is not limited to the rectangular array shown in the figure.

[0168] In one embodiment, such as Figure 12 As shown, the plurality of adsorption holes 1031 are distributed from sparse to dense along the discharge direction A of the microneedle sheet 500. Alternatively, the plurality of adsorption holes 1031 are distributed from dense to sparse along the discharge direction A of the microneedle sheet 500. Preferably, the plurality of adsorption holes 1031 are distributed from sparse to dense along the discharge direction A of the microneedle sheet 500, which can better ensure the flatness of the microneedle sheet 500 when the first support material belt 1011 drags the microneedle sheet 500.

[0169] In other embodiments, the plurality of adsorption pores 1031 are distributed from dense to sparse or from sparse to dense along a direction perpendicular to the discharge direction A.

[0170] In other embodiments, the distribution density of the plurality of adsorption pores 1031 is either sparse in the middle and dense at the edges, or dense in the middle and sparse at the edges; that is, the distribution density of adsorption pores 1031 in the middle part of the feeding platform 103 is small, and the distribution density of adsorption pores 1031 in the edge part is large, or the distribution density of adsorption pores 1031 in the middle part is large, and the distribution density of adsorption pores 1031 in the edge part is small.

[0171] Besides changing the distribution density of the adsorption pores 1031, the pore size distribution of the adsorption pores 1031 can also be adjusted. For example... Figure 13As shown, in an embodiment, the pore diameters of the plurality of adsorption holes 1031 are arranged from small to large along the discharging direction A. In other embodiments, the pore diameters of the plurality of adsorption holes 1031 are arranged from large to small along the discharging direction A. Preferably, the plurality of adsorption holes 1031 are arranged from small to large along the discharging direction A of the microneedle wafer 500, which can better ensure the flatness of the microneedle wafer 500 when the first bottom supporting tape 1011 drags the microneedle wafer 500. In some other embodiments, the pore diameters of the plurality of adsorption holes 1031 are larger in the middle portion of the loading platform 103 and smaller in the edge portion of the loading platform 103, or vice versa. Alternatively, the pore diameters of the plurality of adsorption holes 1031 are arranged from large to small or from small to large along a direction perpendicular to the discharging direction A.

[0172] In the process of gradually separating the microneedle wafer 500 from the loading platform 103 by the first bottom supporting tape 1011, in order to ensure the flatness of the microneedle wafer 500, preferably a plurality of negative pressure cavities 1034 are arranged independently in the interior of the loading platform 103, and at least part of the adsorption holes 1031 do not share the same negative pressure cavity 1034. In this way, the microneedle wafer 500 can be discharged more easily, and the flatness of the microneedle wafer 500 can be effectively ensured during the discharging process. For example, Figure 9 and Figure 10 As shown, the plurality of negative pressure cavities 1034 are arranged along the discharging direction A, so as to arrange a plurality of adsorption areas along the discharging direction A, and the adsorption areas are independent of each other. For example, the plurality of negative pressure cavities 1034 are arranged along a direction perpendicular to the discharging direction A, so as to form a plurality of independent adsorption areas along the direction perpendicular to the discharging direction A. For example, some of the plurality of negative pressure cavities 1034 are arranged in the middle portion of the loading platform 103, and the others are arranged in the edge portion of the loading platform 103, so as to form independent adsorption areas in the middle portion and the edge portion of the loading platform 103. It should be understood that, in the present application, the middle portion of the loading platform 103 should not be understood as an absolute middle position, but should be understood as a region surrounded by the edge portion.

[0173] As shown, in combination with Figure 14 and Figure 9 and Figure 10In an embodiment, the feeding platform 103 forms a plurality of rows of adsorption structures along the discharge direction A, each row of the adsorption structures comprising a plurality of adsorption holes 1031 arranged in sequence along a direction perpendicular to the discharge direction A, and the plurality of rows of adsorption structures form a matrix of rows and columns, such as an n-row and m-column matrix; the adsorption holes 1031 in a part of adjacent rows do not share the same negative pressure cavity 1034, and / or the adsorption holes 1031 in a part of adjacent columns do not share the same negative pressure cavity 1034. For example, in an n-row and m-column matrix, 1~n1 rows share one negative pressure cavity 1034, and n1 is less than n, or 1~m1 columns share one negative pressure cavity 1034, and m1 is less than m. In a preferred embodiment, as shown in the figure, the feeding platform 103 forms a plurality of rows of adsorption structures along the discharge direction A, and each row of the adsorption structures is provided with a separate negative pressure cavity 1034, and all the adsorption structures do not share the same negative pressure cavity 1034. In use, the adsorption holes 1031 can be opened or closed in sequence along the discharge direction A.

[0174] It should be understood that the negative pressure cavity 1034 provides a negative pressure suction force for the adsorption hole 1031, and when the microneedle raw piece 500 is placed on the feeding platform 103, the microneedle raw piece 500 is adsorbed by the negative pressure, which can prevent the microneedle raw piece from being deviated by the vibration of the mechanism, and in addition, the negative pressure adsorption can maintain the flatness of the microneedle raw piece during the dragging of the microneedle raw piece by the first bottom supporting belt 1011. It should be understood that first, all the adsorption holes 1031 are covered by the microneedle raw piece 500 to adsorb the microneedle raw piece 500, and then during the movement of the microneedle raw piece 500 downstream under the dragging of the first bottom supporting belt 1011, the adsorption holes 1031 away from the discharge side S will be gradually exposed outside the microneedle raw piece; at this time, if all the adsorption holes share the same negative pressure cavity, or all the negative pressure cavities are connected with each other, once some adsorption holes are exposed, the negative pressure environment of the whole negative pressure cavity is broken, and the suction force will be greatly reduced, which greatly affects the suction force of the adsorption holes working below the microneedle raw piece; when each negative pressure cavity is independently arranged along the discharge direction A, the exposed adsorption holes will not affect the suction force of other adsorption holes independently arranged with it, so that the adsorption holes working below the microneedle raw piece maintain good suction force, and the flatness of the microneedle raw piece is maintained during the dragging of the microneedle raw piece by the bottom supporting belt.

[0175] The structure of the feeding platform 103 is not limited, and the feeding platform 103 can be a vacuum table with only adsorption function. The feeding platform 103 can also be a profiled conveying belt 103a with adsorption function, such as Figure 15As shown, placing the microneedle substrate 500 on the contour conveyor belt 103a allows for faster loading of the microneedle substrate 500 and higher loading efficiency. The contour conveyor belt 103a may also lack an adsorption function, simply loading and transporting the microneedle substrate 500. When the loading platform 103 is the contour conveyor belt 103a, multiple partitions 1032 are sequentially arranged along the conveying direction. Each adjacent partition 1032 forms a conveying segment, and each conveying segment is used to place one microneedle substrate 500; thus, continuous and rapid loading of the microneedle substrate 500 can be achieved.

[0176] See Figure 16 The first processing line S1 may further include an auxiliary bonding mechanism for joining the microneedle sheet 500 with the first base material strip 1011 (joining includes bonding or adhesion). The first processing line S1 is also provided with an auxiliary bonding station A7, which is located between the loading station A1 and the die-cutting station A2. The first base material strip 1011 is conveyed from below the contour conveyor belt 103a and passes from bottom to top between the discharge side S of the contour conveyor belt 103a and the auxiliary bonding mechanism. The height of each partition 1032 protruding from the conveying surface of the contour conveyor belt 103a is less than the gap width b between the discharge side S and the auxiliary bonding mechanism. A gap is formed between the discharge side S and the auxiliary bonding mechanism. In the gap area, the contour conveyor belt 103a bends and moves downward. The partition 1032 will momentarily change from the vertical direction to the horizontal direction. At this time, in order to avoid the partition 1032 getting stuck, the height of the partition 1032 protruding from the conveyor surface needs to be less than the gap width b.

[0177] However, besides negative pressure adsorption, the feeding platform 103 can also electrostatically adsorb the microneedle substrate 500, such as by setting the feeding platform 103 as an electrostatic chuck. The advantage of an electrostatic chuck is that there is no air leakage during the movement of the microneedle substrate, and the electrostatic adsorption force is stable. In other cases, the feeding platform 103 can also be configured as being composed of multiple feeding rollers 1033 arranged side-by-side, such as... Figure 17 As shown, the microneedle substrate 500 is placed on the feeding roller shaft 1033. The feeding motion of the microneedle substrate 500 can be realized by the rotation of the feeding roller shaft 1033. The feeding roller shaft 1033 may only rotate without adsorption function, or the feeding roller shaft 1033 may have negative pressure adsorption function or electrostatic adsorption function.

[0178] It should be noted that the feeding platform 103 can or can not move by itself. In an embodiment, the feeding platform 103 can move by itself, such as through a profiled conveyor belt 103a or through a feeding roller 1033, or be pushed by an external driving device to move. Through the movement of the feeding platform 103 by itself, a part of the microneedle wafer 500 can be pushed out of the discharge side S of the feeding platform 103.

[0179] In order to more accurately control the feeding position of the microneedle wafer 500, it is preferred to provide a limiting baffle 108 on the feeding platform 103, which is used to prevent the microneedle wafer 500 from moving in a direction other than the discharge direction A, thereby limiting the position around the microneedle wafer 500. The limiting baffle 108 can be adjustable or non-adjustable in size. Preferably, the limiting baffle 108 is adjustable in size to adapt to the feeding of microneedle wafers 500 of different shapes and sizes.

[0180] For example Figure 18 As shown, the limiting baffle 108 includes two side baffles 1081 and a push plate 1082; the two side baffles 1081 are arranged on the two opposite sides of the push plate 1082; the push plate 1082 is movably connected with the two side baffles 1081; the push plate 1082 can not only push the microneedle wafer 500 in the direction of the arrow B, but also change the size of the limiting baffle 108.

[0181] In an embodiment, part of the structure of the limiting baffle 108, such as the push plate 1082, can move relative to the feeding platform 103 to push a part of the microneedle wafer 500 out of the discharge side of the feeding platform 103.

[0182] In an embodiment, the entire structure of the limiting baffle 108 can move relative to the feeding platform 103. For example Figure 19 As shown, the limiting baffle 108 is a one-piece curved push plate 108a, which is an integral or one-piece structure that wraps around and is used to push the microneedle wafer 500, thereby moving the limiting baffle 108 as a whole. The limiting baffle 108 can be driven to move by a driving device. The driving device includes but is not limited to a motor.

[0183] In actual use, at least one of the feeding platform 103 and the limiting baffle 108 can move. Preferably, the microneedle wafer 500 is pushed to the auxiliary lamination station A7 by the feeding platform 103, which can avoid the problem of difficult feeding caused by the microneedle wafer 500 being too thin and the gap between the push plate and the feeding platform 103 being large, at which time the limiting baffle 108 can be used only for limiting.

[0184] The auxiliary lamination mechanism can be realized by various structures, which are limited by the present application. Referring toFigure 16 In an embodiment, the auxiliary lamination mechanism comprises a first auxiliary pressing mechanism 109, which comprises pressing plates 1091 and lamination plates 1092 arranged on opposite sides of the first backing tape 1011. The pressing plates 1091 are arranged above the first backing tape 1011, and the lamination plates 1092 are arranged below the first backing tape 1011. The pressing plates 1091 can move towards or away from the lamination plates 1092. When the pressing plates 1091 move towards the lamination plates 1092, they can press against the edges of the microneedle wafer 500, so that the edges of the microneedle wafer 500 are laminated to the adhesive surface of the edges of the first backing tape 1011. The first auxiliary pressing mechanism 109 can achieve close lamination of the edges of the microneedle wafer and the first backing tape 1011.

[0185] In a specific embodiment, the pressing plates 1091 are connected to the air cylinder through connecting rods. When the microneedle wafer 500 reaches the auxiliary lamination station A7, the first backing tape 1011 stops moving. Preferably, the control system controls the air cylinder to be turned on, and the connecting rods act on the pressing plates 1091, so that the pressing plates 1091 move downward to press the edges of the microneedle wafer 500 and the first backing tape 1011. After pressing, the control system controls the air cylinder to drive the pressing plates 1091 to move upward to restore the initial state. Thereafter, the first backing tape 1011 continues to move to drag the microneedle wafer 500 to the next station. However, the air cylinder is not limited thereto. In other embodiments, linear motors, electromagnetic hydraulic mechanisms, swing rod mechanisms, etc. can be used to drive the pressing plates 1091 to move. The first auxiliary pressing mechanism 109 is not limited to one, but can also be arranged as multiple in sequence and side by side.

[0186] The pressing plates 1091 contact the edges of the microneedle wafer 500 and make the edges of the microneedle wafer 500 laminated to the first backing tape 1011. During this process, the pressing plates 1091 preferably do not contact the first backing tape 1011 to avoid being affected by the adhesive force of the first backing tape 1011. The shape of the pressing plates 1091 is preferably matched to the shape of the microneedle wafer 500 exposed (projected) out of the feeding platform 103. As shown in FIG. 8, the cross-sectional line fills the area of the pressing plates 1091, and the shape of the pressing plates 1091 is matched to the shape of the exposed area 103b formed by the microneedle wafer 500 projected out of the feeding platform 103. Figures 20 to 22 The lamination plates 1092 support the first backing tape 1011 on the discharge side S of the feeding platform 103 at the auxiliary lamination station A7, and form a gap between the lamination plates 1092 and the discharge side S of the feeding platform 103. The first backing tape 1011 passes through the gap between the feeding platform 103 and the lamination plates 1092 from bottom to top, and is further conveyed above the lamination plates 1092. In an embodiment, the gap width b between the lamination plates 1092 and the discharge side S is greater than the height of the partition plate 1032.

[0187] The lamination plates 1092 support the first backing tape 1011 on the discharge side S of the feeding platform 103 at the auxiliary lamination station A7, and form a gap between the lamination plates 1092 and the discharge side S of the feeding platform 103. The first backing tape 1011 passes through the gap between the feeding platform 103 and the lamination plates 1092 from bottom to top, and is further conveyed above the lamination plates 1092. In an embodiment, the gap width b between the lamination plates 1092 and the discharge side S is greater than the height of the partition plate 1032.

[0188] With reference to the drawings Figure 16 In another embodiment, the auxiliary lamination mechanism comprises a first air blowing mechanism 110 for blowing air to the microneedle wafer 500 to make the microneedle wafer 500 adhere to the first backing material tape 1011. After such arrangement, the effect of non-contact lamination of the microneedle wafer 500 and the first backing material tape 1011 can be achieved. The first air blowing mechanism 110 and the first auxiliary pressing mechanism 109 can be arranged alternatively or simultaneously. The first air blowing mechanism 110 uses non-contact air blowing, which can better protect the microneedle structure and prevent product contamination. In order to ensure uniform lamination and reduce air bubbles, the air blown by the first air blowing mechanism 110 needs to be processed through the air outlet hole 1101 to form a uniform air flow beam. As shown in Figure 23 and Figure 24 The first air blowing mechanism 110 has a plurality of air outlet holes 1101, and the distribution mode of the air outlet holes 1101 includes but is not limited to a matrix form, and the shape of the air outlet holes 1101 can be various. The first air blowing mechanism 110 directly blows air to the microneedle wafer 500. In a preferred embodiment, the auxiliary lamination mechanism comprises both the first auxiliary pressing mechanism 109 and the first air blowing mechanism 110, and the first air blowing mechanism 110 is arranged upstream or downstream of the first auxiliary pressing mechanism 109. The number of the first air blowing mechanism 110 can be one or a plurality arranged side by side.

[0189] With reference to the drawings Figure 16 In an embodiment, the patch product processing system further comprises a first visual detection system 501 in communication connection with the control system, and the control system is used for controlling the ejection and feeding of the microneedle wafer 500 according to the visual detection information of the first visual detection system 501. In this paper, the ejection of the microneedle wafer 500 refers to the microneedle wafer 500 being separated from the feeding platform 103; the feeding of the microneedle wafer 500 refers to the microneedle wafer 500 being placed on the feeding platform 103.

[0190] In a specific embodiment, when the first visual inspection system 501 detects that the loading platform 103 is in a state of receiving the microneedle wafer 500, the control system first controls the loading platform 103 to start the adsorption function to fix the microneedle wafer 500 on the loading platform 103, at this time, part of the microneedle wafer 500 extends out of the discharge side of the loading platform 103, then the control system controls the first auxiliary pressing mechanism 109 to start, and the pressing plate 1091 moves downward to adhere the part of the microneedle wafer 500 extending out of the loading platform 103 to the first bottom material belt 1011, and then the pressing plate 1091 moves upward to reset. Subsequently, the first bottom material belt 1011 drags the microneedle wafer 500 to separate from the loading platform 103, in this process, the control system controls the first blowing mechanism 110 to blow, so that the microneedle wafer 500 is completely adhered to the first bottom material belt 1011. When the first visual inspection system 501 detects that the loading platform 103 is in a state of unloading the microneedle wafer 500, that is, the microneedle wafer 500 is completely dragged away from the loading platform 103 by the first bottom material belt 1011, the first visual inspection system 501 informs the control system to place the microneedle wafer 500 on the loading platform 103 again. Further, when the microneedle wafer 500 is placed on the loading platform 103, the limiting baffle 108 can realize the accurate positioning of the microneedle wafer 500. Here, it should be understood that the adsorption and fixation of the microneedle wafer 500 by the loading platform 103, combined with the control of the first visual inspection system 501, can realize the accurate and continuous loading of the microneedle wafer 500, and the processing precision is higher.

[0191] Referring to Figure 16In a specific embodiment, the auxiliary laminating station A7 includes an auxiliary pressing station and an auxiliary laminating station. The auxiliary pressing station is arranged upstream of the auxiliary laminating station. The first auxiliary pressing mechanism 109 preliminarily laminates the edges of the microneedle wafer 500 on the first backing material tape 1011 before the auxiliary pressing station. Then, the first backing material tape 1011 moves to drag the microneedle wafer 500 to the auxiliary laminating station. The first blowing mechanism 110 completely laminates the entire microneedle wafer 500 on the first backing material tape 1011 at the auxiliary laminating station. After the first visual inspection system 501 detects that the microneedle wafer 500 reaches the auxiliary pressing station, the first backing material tape 1011 remains stationary. Then, the control system controls the first auxiliary pressing mechanism 109 to be turned on to preliminarily laminate the edges of the microneedle wafer on the first backing material tape 1011. Then, the first backing material tape 1011 moves to drag the microneedle wafer 500 to the auxiliary laminating station. After the first visual inspection system 501 detects that the microneedle wafer 500 reaches the auxiliary laminating station, the first backing material tape 1011 stops moving. Then, the control system controls the first blowing mechanism 110 to be turned on to completely laminate the entire microneedle wafer 500 on the first backing material tape 1011. After that, the first backing material tape 1011 continues to move to drag the microneedle wafer 500 to the next station.

[0192] In an embodiment, the patch product processing system can further comprise a control system in communication with each processing line to control the automated operation of each processing line. However, it should be understood that each processing line can be provided with a control system independently, or all processing lines can share one control system. The control system is mainly in communication with the electrical components in the processing line, thereby controlling the automated operation of the moving components in these processing lines to realize the automated production of microneedle patches and improve the processing efficiency. The type of the control system is not particularly limited in the present embodiment, which can be a hardware that performs logical operation, such as a single-chip microcomputer, a microprocessor, a programmable logic controller (PLC) or a field-programmable gate array (FPGA), or a software program, a functional module, a function, an object library or a dynamic-link library that realizes the above functions on the basis of hardware. Or, it is a combination of the above two. Those skilled in the art should know how to specifically realize the communication between the control system and other devices on the basis of the disclosure of the present application. In addition, the use of a control system is the preferred mode of the present embodiment.

[0193] The type of the first visual inspection system 501 is not limited, which can be an AI vision system or other commonly used visual inspection equipment.

[0194] Referring to Figure 25 The auxiliary lamination mechanism can include a second auxiliary lamination mechanism 111, which includes a first auxiliary lamination roller 1111 and a first auxiliary lamination support roller 1112 arranged on opposite sides of the first bottom supporting tape 1011. The first auxiliary lamination roller 1111 can be close to or away from the first auxiliary lamination support roller 1112. When the first auxiliary lamination roller 1111 is close to the first auxiliary lamination support roller 1112, it can press against the edge of the microneedle wafer 500, so that the edge of the microneedle wafer 500 is laminated to the first bottom supporting tape 1011. Preferably, the roller surface of the first auxiliary lamination roller 1111 is provided with a deformable protective structure, such as a protective structure made of dust-free foam or other soft materials, which can protect the microneedles and reduce the risk of damage to the microneedle structure. The roller surface of the first auxiliary lamination roller 1111 is covered with a protective structure to achieve comprehensive protection. The second auxiliary lamination mechanism 111 can be separately arranged or combined with other auxiliary lamination mechanisms. The second auxiliary lamination mechanism 111 can be one or multiple arranged side by side. In the present embodiment, the second auxiliary lamination mechanism 111 can also tension, pull and transport the first bottom supporting tape 1011.

[0195] In a specific embodiment, referring to Figure 25 After the microneedle wafer 500 is placed on the loading platform 103 by machine or manually, the first vision detection system 501 detects that the microneedle wafer 500 is placed on the loading platform 103, and notifies the control system. The control system controls the driving device to drive the limiting baffle 108 to push the microneedle wafer 500 to the first auxiliary lamination roller 1111, so that the first auxiliary lamination roller 1111 laminates the edge of the microneedle wafer to the first bottom supporting tape 1011. When the first vision detection system 501 detects that the microneedle wafer 500 has been completely separated from the loading platform 103 by the first bottom supporting tape 1011, the control system is notified again to load the microneedle wafer 500 on the loading platform 103.

[0196] In an embodiment, the first processing line S1 further includes a first cleaning mechanism 112 for removing foreign matter (such as dust or other impurities) on the microneedle wafer 500 in a non-contact manner downstream of the loading station A1 and upstream of the die-cutting station A2. The first cleaning mechanism 112 can remove foreign matter attached to the microneedle wafer 500 due to static electricity or other reasons, ensuring the cleanliness of the product. For example, the first cleaning mechanism 112 generates ion wind to remove dust. The number of first cleaning mechanisms 112 is not limited, such as one or more first cleaning mechanisms 112.

[0197] Referring back to Figure 1 and Figure 2In an embodiment, the second processing line S2 comprises a second backing material belt 2011, a second laminating mechanism 203, a second die cutting mechanism 204, a third laminating mechanism 205, and a third waste collecting mechanism 206, wherein the second backing material belt 2011 is configured to move from upstream to downstream of the second processing line S2; the second processing line S2 comprises, from upstream to downstream, a first laminating station B1, a die cutting station B2, a second laminating station B3, and a waste collecting station B4; the second laminating mechanism 203 comprises a second laminating support roller 2032 and a second laminating pressure roller 2031 at the first laminating station B1; the second laminating support roller 2032 and the second laminating pressure roller 2031 are respectively located at two opposite sides of the second backing material belt 2011, for example, the second laminating pressure roller 2031 is located above the second backing material belt 2011, and the second laminating support roller 2032 is located below the second backing material belt 2011, so as to laminate the second backing material belt 2011 and the first release paper 2021, and to make the second backing material belt 2011 and the first release paper 2021 be combined; the second die cutting mechanism 204 comprises a second die cutting support roller 2041 and a second cutter 2042 at the die cutting station B2 of the second processing line S2; the second die cutting support roller 2041 and the second cutter 2042 are respectively located at two opposite sides of the second backing material belt 2011, for example, the second die cutting support roller 2041 is located above the second backing material belt 2011, and the second cutter 2042 is located below the second backing material belt 2011, so as to cut the first release paper 2021 to form the second release paper 602’; the third laminating mechanism 205 comprises a third laminating pressure roller 2051 at the second laminating station B3, wherein the third laminating pressure roller 2051 is located at one side of the second backing material belt 2011 (the side away from the release paper), so as to laminate the second release paper 602’ and the second adhesive sticker 601 (processed by the third processing line S3), and to make the second release paper 602’ and the second adhesive sticker 601 be combined; the third waste collecting mechanism 206 collects the waste corresponding to the hollows after the first release paper 2021 is cut at the waste collecting station B4 through the second backing material belt 2011, and separates the second backing material belt 2011 from the second release paper 602’ at the second laminating station B3.

[0198] In an embodiment, the third waste collecting mechanism 206 comprises a second waste collecting roller at the waste collecting station B4, which is configured to wind the second backing material belt 2011.

[0199] In an embodiment, the second processing line S2 further comprises a second bottoming material tape roll 201 and a first anti-adhesion paper roll 202 arranged at the most upstream, the second bottoming material tape roll 201 is provided with a second bottoming material tape roll 2011, the first anti-adhesion paper roll 202 is provided with a first anti-adhesion paper roll 2021, and the second bottoming material tape roll 201 and the first anti-adhesion paper roll 202 are arranged independently of each other. The second bottoming material tape 2011 and the first anti-adhesion paper 2021 are closely attached by the second pressing mechanism 203, and then cut by the second die-cutting mechanism 204 to cut out the hollows, and the third pressing mechanism 205 is used to attach the second adhesive 601 and the second anti-adhesion paper 602', before attachment, the third waste collecting mechanism 206 is needed to collect the second bottoming material tape 2011 and the hollow waste cut from the first anti-adhesion paper 2021. It is understood that the second pressing mechanism 203 and the third pressing mechanism 205 can also make the second bottoming material tape 2011 in a tight state, and the arrangement of the second bottoming material tape 2011 can reduce the stress of the anti-adhesion paper and reduce its deformation, finally guarantee the position accuracy of the anti-adhesion paper die-cutting and attachment. It is also understood that in the second processing line, the second bottoming material tape roll 201, the second pressing mechanism 203, the second die-cutting mechanism 204, the third pressing mechanism 205, and the third waste collecting mechanism 206 can also be used to pull and convey the second bottoming material tape 2011.

[0200] Continuing to refer to Figure 1 and Figure 2, the third processing line S3 includes a third bottoming material belt 3021, a fourth pressing mechanism 303, a third die cutting mechanism 304, a fourth waste collecting mechanism 305 and a fifth pressing mechanism 306, the third bottoming material belt 3021 is used to move from upstream to downstream direction of the third processing line S3; the third processing line S3 is sequentially provided with a first pressing station C1, a die cutting station C2 and a waste collecting station C3 from upstream to downstream, the third processing line S3 is also provided with a second pressing station C4, the first pressing station C1 of the third processing line S3 is arranged downstream of the die cutting station C2 of the third processing line S3, and is arranged in parallel with the waste collecting station C3 of the third processing line S3; the fourth pressing mechanism 303 is provided with a fourth pressing support roller 3032 and a fourth pressing roller 3031 at the first pressing station C1 of the third processing line S3, the fourth pressing support roller 3032 and the fourth pressing roller 3031 are respectively located at two opposite sides of the third bottoming material belt 3021, such as the fourth pressing support roller 3032 is arranged below the third bottoming material belt 3021, and the fourth pressing roller 3031 is arranged above the third bottoming material belt 3021, to press the third bottoming material belt 3021 and the first level adhesive tape 3011, so as to make the third bottoming material belt 3021 and the first level adhesive tape 3011 jointed; the third die cutting mechanism 304 is provided with a third cutter 3041 and a third die cutting support roller 3042 at the die cutting station C2 of the third processing line S3, the third die cutting support roller 3042 and the third cutter 3041 are respectively located at two opposite sides of the third bottoming material belt 3021, such as the third die cutting support roller 3042 is arranged below the third bottoming material belt 3021, and the third cutter 3041 is arranged above the third bottoming material belt 3021, the third cutter 3041 is used to cut the first level adhesive tape 3011 to form the second level adhesive tape 601; the fourth waste collecting mechanism 305 recycles the waste formed by cutting the first level adhesive tape 3011 at the waste collecting station C3 of the third processing line S3; the fifth pressing mechanism 306 is provided with a fifth pressing support roller 3061 at the second pressing station C4 of the third processing line S3, the fifth pressing support roller 3061 is arranged at one side of the third bottoming material belt 3021 (the side away from the adhesive tape), for pressing the second level release paper 602' and the second level adhesive tape 601.

[0201] The third laminating pressure roller 2051 and the fifth laminating support roller 3061 are in corresponding positions, the second backing material tape 2011 and the third backing material tape 3021 pass between the third laminating pressure roller 2051 and the fifth laminating support roller 3061, and the third backing material tape 3021 is continuously conveyed from the second laminating station C4 of the third processing line S3 to the fourth processing line S4, i.e. the fourth processing line S4 continues to use the third backing material tape 3021 provided by the third processing line S3.

[0202] The third processing line S3 further comprises a first adhesive tape material roll 301 arranged at the most upstream position and a third backing material tape material roll 302, the third backing material tape material roll 302 being provided with a third backing material tape 3021 in roll, and the first adhesive tape material roll 301 being provided with a first adhesive tape 3011 in roll, the third backing material tape material roll 302 and the first adhesive tape material roll 301 being arranged independently of each other. The first adhesive tape 3011 and the third backing material tape 3021 are laminated to each other by the fourth laminating mechanism 303, and then cut into the second adhesive tape 601 by the third die-cutting mechanism 304.

[0203] It should be further understood that in the third processing line, the third backing material tape material roll 302, the fourth laminating mechanism 303, the third die-cutting mechanism 304, the fifth laminating mechanism 306, and the fourth waste collecting mechanism 305 can also be used to pull and convey the third backing material tape 3021.

[0204] Continuing to refer to Figure 1 and Figure 2, the fourth processing line S4 comprises a third bottom supporting material belt 3021, and a peeling supporting mechanism 401, a laminating mechanism 402, a fourth die cutting mechanism 403, a fifth waste collecting mechanism 404, a second peeling mechanism 407 and a sixth waste collecting mechanism 408, the third bottom supporting material belt 3021 of the fourth processing line S4 is used to move from upstream to downstream direction of the fourth processing line S4; the fourth processing line S4 is sequentially provided with a laminating station D1, a die cutting station D2 and a first waste collecting station D3 from upstream to downstream; the fourth processing line S4 is further provided with a peeling station D4, a second waste collecting station D5 and a packaging station D6; the peeling station D4 of the fourth processing line S4 is arranged downstream of the die cutting station D2 of the fourth processing line S4, and is arranged in parallel with the first waste collecting station D3 of the fourth processing line S4; the second waste collecting station D5 and the packaging station D6 of the fourth processing line S4 are both arranged downstream of the peeling station D4 of the fourth processing line S4, and are arranged in parallel; the peeling supporting mechanism 401 is provided with a peeling supporting roller at the laminating station D1, which is located on one side (as below) of the third bottom supporting material belt 3021; the laminating mechanism 402 applies a force to the microneedle patch 603 at the laminating station D1, so that the microneedle patch 603 is completely laminated with the first back adhesive material belt; the fourth die cutting mechanism 403 is provided with a fourth cutter 4031 and a fourth die cutting supporting roller 4032 at the die cutting station D2 of the fourth processing line S4, the fourth die cutting supporting roller 4032 and the fourth cutter 4031 are respectively located on two opposite sides of the third bottom supporting material belt 3021, for example, the fourth die cutting supporting roller 4032 is arranged below the third bottom supporting material belt 3021, and the fourth cutter 4031 is arranged above the third bottom supporting material belt 3021, the fourth cutter 4031 is used to cut the second anti-adhesion paper 602' to form a plurality of target products 600; the fifth waste collecting mechanism 404 recycles the waste formed after the second anti-adhesion paper 602' is cut at the first waste collecting station D3 of the fourth processing line S4; the second peeling mechanism 407 is provided with a second peeling cutter at the peeling station D4 of the fourth processing line S4, the second peeling cutter is arranged on the side of the third bottom supporting material belt 3021 away from the microneedle patch 603, and the two adjacent edges of the second peeling cutter abut against the third bottom supporting material belt 3021, so that the third bottom supporting material belt 3021 changes from horizontal extension direction to upward extension direction at the second peeling cutter, so as to peel the target product 600 and the third bottom supporting material belt 3021, that is, the third bottom supporting material belt 3021 is formed into two parts with different extension directions by the second peeling cutter, the included angle α between the two parts of the third bottom supporting material belt 3021 is less than 90°, preferably less than or equal to 30°; the sixth waste collecting mechanism 408 recycles the third bottom supporting material belt 3021 at the second waste collecting station D5 of the fourth processing line S4;The packaging station D6 is close to the peeling station D4 of the fourth processing line S4, and the packaging station D6 is provided with a packaging box 700, and the target product 600 after peeling falls into the packaging box 700. It should be understood that the glue-free surface of the target product 600 is exposed, and after peeling, it can be directly placed in the packaging box 700, saving the process of manual sampling and boxing.

[0205] As shown in Figure 26 , in an application scenario, the microneedle original piece 500 is cut to form a plurality of microneedle patches 603, and the microneedle patches 603 are arranged on the first bottom supporting material belt 1011 in a certain manner. As shown in Figure 27 , in an application scenario, the third bottom supporting material belt 3021 carries a secondary anti-adhesion paper 602', and the secondary anti-adhesion paper 602' is attached with a secondary adhesive patch 601 consistent with the number of microneedle patches 603. At the attaching station D1 of the fourth processing line S4, all microneedle patches 603 after being peeled off from the first bottom supporting material belt 1011 need to be attached with the secondary adhesive patch 601 on the secondary anti-adhesion paper 602' one by one. In an embodiment, after the microneedle patch 603 is attached with the secondary adhesive patch 601, it is as shown in Figure 26 . It should be understood that Figure 7 and Figure 28 , the dashed line means that the secondary adhesive patch 601 is invisible at the current viewing angle and is represented by a dashed line.

[0206] In an embodiment, as shown in Figure 2 , the attaching mechanism 402 includes a second air blowing mechanism 4021 and an attaching support platform 4022, which are respectively arranged on both sides (above and below) of the third bottom supporting material belt 3021. The air flow beam formed by the second air blowing mechanism 4021 towards the third bottom supporting material belt 3021 realizes the attachment of the microneedle patch 603 and the secondary adhesive patch 601. Preferably, the second air blowing mechanism 4021 can be close to or away from the attaching support platform 4022, so as to adjust the position of the second air blowing mechanism 4021 to adjust the appropriate air flow beam. In an example, as shown in Figure 29 , the attaching mechanism 402 further includes a driving mechanism 4023 and a limiting rod 4024; the driving mechanism 4023 is connected with the second air blowing mechanism 4021 to drive the second air blowing mechanism 4021 to be close to or away from the attaching support platform 4022; the limiting rod 4024 is connected with the second air blowing mechanism 4021 and the attaching support platform 4022 respectively; the second air blowing mechanism 4021 is used to move along the direction of the limiting rod 4024. The number of the limiting rod 4024 can be one or multiple symmetrically arranged, and the limiting rod 4024 can accurately limit the horizontal position of the second air blowing mechanism 4021 to prevent the position from deviating during the descending process. The structure of the driving mechanism 4023 is not limited, such as a linear motor, an air cylinder, etc.

[0207] The fourth processing line S4 preferably further comprises a second visual inspection system 502, which detects that the third bottom supporting material belt 3021 reaches a designated position (such as a laminating station D1), the movement of the third bottom supporting material belt 3021 stops, and the driving mechanism 4023 drives the second blowing mechanism 4021 to descend close to the laminating support platform 4022. In a preferred embodiment, as shown in Figure 30 The second blowing mechanism 4021 comprises a blowing platform 4021a provided with a plurality of air outlet holes 4021b, the number of the air outlet holes 4021b is consistent with the number of microneedle patches 603, each of the microneedle patches 603 is blown by a corresponding one of the air outlet holes 4021b, so that the entire microneedle patch 603 is laminated with the secondary adhesive 601, that is, each air outlet hole 4021b is aligned with the microneedle patch 603. The diameter of the air outlet hole 4021b is greater than or equal to the diameter of the microneedle patch 603, preferably, the diameter of the air outlet hole 4021b is greater than the diameter of the microneedle patch 603, so that the blowing platform 4021a forms a sunken structure, which not only prevents the microneedles from being crushed, but also sets the microneedle patch, increases the utilization rate of airflow, avoids the influence of airflow interference, and has better blowing effect.

[0208] All air outlet holes 4021b can share one air channel or be independently provided with an air channel. For example, an electromagnetic valve for controlling the opening and closing of the air channel can be arranged on the blowing platform 4021a. When the electromagnetic valve is opened, the blowing platform 4021a starts blowing, stops blowing after a period of time (such as 2-15 s), the blowing platform 4021a rises and returns to the original position, and the lamination of the microneedle patch 603 is completed. Thereafter, the third bottom supporting material belt 3021 moves to the next die-cutting station D2. The second visual inspection system 502 can realize accurate lamination of the microneedle patch 603. The type of the second visual inspection system 502 is not limited, such as an AI vision system or other commonly used visual inspection equipment.

[0209] In another embodiment, as shown in Figure 31 The laminating mechanism 402 can comprise a peeling and laminating compression roller 409 corresponding to the position of the peeling support mechanism 401, the peeling and laminating compression roller 409 and the peeling support mechanism 401 are arranged on both sides (upper side and lower side) of the third bottom supporting material belt 3021, and the peeling and laminating compression roller 409 is used to press against the edge of the microneedle patch 603. Preferably, the roller surface of the peeling and laminating compression roller 409 is provided with a protective material, such as dust-free foam.

[0210] In a preferred embodiment, the fourth processing line S4 further comprises a second cleaning mechanism 410 arranged downstream of the laminating station D1 for removing foreign matter on the microneedle patch 603 in a non-contact manner. The second cleaning mechanism 410 can remove foreign matter adhered to the microneedle patch 603 due to static electricity or other reasons, ensuring the cleanliness of the product. For example, the second cleaning mechanism 410 generates ion wind to remove dust. The number of the second cleaning mechanism 410 is not limited, such as one or more.

[0211] Referring back to Figure 2 In an embodiment, after the secondary release paper 602' is die-cut, the third supporting material tape 3021 is turned by 180° by a plurality of turning rollers, and then the target product 600 is peeled off and can be automatically peeled into the packaging box 700. The number of the turning rollers is not limited in the present application. In the present embodiment, the number of the turning rollers is two, i.e., a first turning roller 405 and a second turning roller 406. The first turning roller 405 turns the third supporting material tape 3021 from a horizontal direction to a vertical direction, and the second turning roller 406 turns the third supporting material tape 3021 from the vertical direction to the horizontal direction.

[0212] In summary, according to the technical scheme provided by the embodiments of the present application, the present application can realize the continuous and large-batch automatic production of microneedle patch products, improve the processing efficiency and stability of the microneedle patch products, and reduce the processing cost. Specifically, the present application can realize the parallel die-cutting of the microneedle patch, the release paper, and the adhesive tape, thereby improving the processing efficiency of the microneedle patch product. In addition, the second adhesive tape, the secondary release paper, and the microneedle patch self-assembled after die-cutting are laminated and peeled into the corresponding packaging box, and the subsequent sealing and packaging are automatically completed without manual intervention. In this way, the processing efficiency is improved, the stability of the product processing is improved, and the quality of the patch target product is ensured.

[0213] Although the present application has been disclosed as above, it is not limited thereto. Those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present application and equivalent technology thereof, the present application is intended to include these modifications and variations.

Claims

1. A patch product processing system characterized by, The first processing line, the second processing line, the third processing line and the fourth processing line; the first processing line, the second processing line and the third processing line run in parallel; the fourth processing line runs in series relative to the first processing line, the second processing line and the third processing line; The first processing line is used for processing the target object wafer into a target object patch with a predetermined structure; the first processing line comprises a feeding platform for placing the target object wafer; The second processing line is used for processing the first-level anti-adhesion paper into a second-level anti-adhesion paper with a hollow structure; The third processing line is used for processing the first-level adhesive tape into a second-level adhesive patch with a predetermined structure; The second processing line is also used for bonding the second-level adhesive patch and the second-level anti-adhesion paper to obtain a first-level back adhesive tape; The fourth processing line is used for bonding the target object patch and the first-level back adhesive tape to obtain an intermediate product, and then cutting the intermediate product into a plurality of target products with a predetermined structure, the target object patch is placed in the hollow structure, and one side of the target object patch is bonded with the second-level adhesive patch; The target product is composed of the second-level adhesive patch, a third-level anti-adhesion paper and the target object patch; the third-level anti-adhesion paper is cut from the second-level anti-adhesion paper, the third-level anti-adhesion paper has the hollow structure in the middle part, the edges of the third-level anti-adhesion paper extend beyond the edges of the second-level adhesive patch, and the second-level adhesive patch is arranged along the edges of the hollow structure; The fourth processing line comprises a third bottom supporting tape, a peeling supporting mechanism, a bonding mechanism, a fourth die-cutting mechanism, a fifth waste collecting mechanism, a second peeling mechanism and a sixth waste collecting mechanism; The third bottom supporting tape is used for moving from an upstream to a downstream of the fourth processing line; The fourth processing line is sequentially provided with a bonding station, a die-cutting station and a first waste collecting station from the upstream to the downstream; The fourth processing line is also provided with a peeling station, a second waste collecting station and a packaging station; the peeling station is arranged downstream of the die-cutting station and parallel to the first waste collecting station; the second waste collecting station and the packaging station are both arranged downstream of the peeling station and in parallel; The peeling supporting mechanism is provided with a peeling supporting roller at one side of the bonding station and the third bottom supporting tape; The bonding mechanism applies a force to the target object patch at the bonding station to bond the target object patch with the first-level back adhesive tape; The fourth die-cutting mechanism is provided with a fourth die-cutting supporting roller and a fourth cutter at the die-cutting station; the fourth die-cutting supporting roller and the fourth cutter are respectively located at two opposite sides of the third bottom supporting tape; the fourth cutter is used for cutting the second-level anti-adhesion paper to form a plurality of target products; The fifth waste collecting mechanism recycles the waste material formed after the second-level anti-adhesion paper is cut at the first waste collecting station; The second stripping mechanism is provided with a second stripping cutter at the stripping station, which is arranged on the side of the third supporting material belt away from the target product; the second stripping cutter is used to press against the third supporting material belt by its two adjacent edges, so that the third supporting material belt changes from the initial horizontal extension direction to the upward oblique extension direction at the second stripping cutter, thereby stripping the target product and the third supporting material belt; The sixth waste collecting mechanism is used to collect the third supporting material belt at the second waste collecting station; The packaging station is arranged close to the stripping station, and is provided with a packaging box, into which the stripped target product automatically falls.

2. The patch product processing system of claim 1, wherein, The first processing line comprises a first supporting material belt, a first die-cutting mechanism, a first stripping mechanism, a first waste collecting mechanism and a second waste collecting mechanism, and the first supporting material belt is movable from the upstream to the downstream of the first processing line; The first processing line is sequentially provided with a feeding station, a die-cutting station, a first waste collecting station, a stripping station and a second waste collecting station from the upstream to the downstream; The first supporting material belt is engaged with the target product original sheet at the feeding station; The first die-cutting mechanism is provided with a first die-cutting support roller and a first cutter at the die-cutting station, and the first die-cutting support roller and the first cutter are respectively arranged on the two opposite sides of the first supporting material belt; the first cutter is used to cut the target product original sheet to form the target product patch; The first waste collecting mechanism is used to collect the waste material formed after the target product original sheet is cut at the first waste collecting station; The first stripping mechanism is provided with a first stripping cutter at the stripping station, which is arranged on the side of the first supporting material belt away from the target product patch; the first stripping cutter is used to press against the first supporting material belt by its two adjacent edges, so that the first supporting material belt changes from the initial horizontal extension direction to the downward oblique extension direction at the first stripping cutter, thereby stripping the target product patch and the first supporting material belt; The second waste collecting mechanism is used to collect the first supporting material belt at the second waste collecting station.

3. The patch product processing system of claim 2, wherein, The first processing line has at least one of the following features: The first waste collecting mechanism is provided with a first waste collecting support roller and a first waste collecting pressure roller at the first waste collecting station, and the first waste collecting support roller and the first waste collecting pressure roller are respectively arranged on the two opposite sides of the first supporting material belt; the first waste collecting mechanism is further provided with a waste belt, a feeding roller and a discharging roller, and the feeding roller, the first waste collecting pressure roller and the discharging roller are sequentially connected through the waste belt; the waste belt is sent out from the feeding roller, and is adhered to the waste material after being pressed against the first waste collecting pressure roller; and the waste belt adhered to the waste material is collected by the discharging roller; The second waste collecting mechanism is provided with a first waste collecting roller for winding the first supporting material belt at the second waste collecting station. The first processing line further comprises a first pressing mechanism capable of tensioning the first backing material, and is further provided with a pressing station, which is arranged upstream of the feeding station, and the first pressing mechanism is provided with a first pressing support roller and a first pressing pressure roller at the pressing station, and the first pressing support roller and the first pressing pressure roller are respectively arranged at two opposite sides of the first backing material. The first processing line further comprises a first backing material roll arranged at the most upstream, and the first backing material roll is provided with a first backing material roll.

4. The patch product processing system of claim 2, wherein, The first processing line further comprises an auxiliary fitting mechanism for fitting the target object sheet with the first backing material, and is further provided with an auxiliary fitting station, which is arranged between the feeding station and the die-cutting station, and the first backing material is conveyed from below the feeding platform and passes between the discharge side of the feeding platform and the auxiliary fitting mechanism from bottom to top.

5. The patch product processing system of claim 4, wherein, The auxiliary fitting mechanism is arranged to have at least one of the following features: The auxiliary fitting mechanism comprises a first auxiliary pressing mechanism, which comprises a pressing plate and a fitting plate arranged at two opposite sides of the first backing material, the pressing plate is capable of approaching or moving away from the fitting plate, and when the pressing plate approaches the fitting plate, the pressing plate can press against the edge of the target object sheet to fit the edge of the target object sheet with the first backing material; The auxiliary fitting mechanism comprises a first blowing mechanism for blowing air to the target object sheet to fit the target object sheet with the first backing material; and The auxiliary fitting mechanism comprises a second auxiliary pressing mechanism, which comprises a first auxiliary fitting pressure roller and a first auxiliary fitting support roller arranged at two opposite sides of the first backing material, the first auxiliary fitting pressure roller is capable of approaching or moving away from the first auxiliary fitting support roller, and when the first auxiliary fitting pressure roller approaches the first auxiliary fitting support roller, the first auxiliary fitting pressure roller can press against the edge of the target object sheet to fit the edge of the target object sheet with the first backing material, and the roller surface of the first auxiliary fitting pressure roller is wrapped with a protective material.

6. The patch product processing system of any one of claims 1-5, wherein, The feeding platform is capable of adsorbing the target object sheet, and / or the feeding platform itself is capable of moving and / or rotating to push a part of the target object sheet out of the feeding platform.

7. The patch product processing system of claim 6, wherein, The feeding platform is provided with a plurality of adsorption holes, and the inside of the feeding platform is formed with a negative pressure cavity in communication with the adsorption holes, and the feeding platform has at least one of the following features: The plurality of adsorption holes are distributed from dense to sparse or from sparse to dense along the discharge direction of the target object sheet; The plurality of adsorption holes are distributed from dense to sparse or from sparse to dense along the direction perpendicular to the discharge direction of the target object sheet; The distribution density of the plurality of adsorption holes is sparse in the middle and dense at the edge or dense in the middle and sparse at the edge; The pore diameter of the plurality of adsorption holes is distributed from large to small or from small to large along the discharge direction of the target object sheet; The pore diameter of the plurality of adsorption holes is distributed from large to small or from small to large along the direction perpendicular to the discharge direction of the target object sheet; The pore diameters of the plurality of adsorption holes are large in the middle part and small in the edge part, or small in the middle part and large in the edge part.

8. The patch product processing system of claim 7, wherein, The feeding platform is provided with a plurality of negative pressure cavities arranged independently, and the negative pressure cavities are arranged in one of the following manners:

9. The patch product processing system of claim 8, wherein, The plurality of negative pressure cavities are arranged in sequence along the discharging direction of the target original sheet. The plurality of negative pressure cavities are arranged in sequence along the direction perpendicular to the discharging direction of the target original sheet. Some of the plurality of negative pressure cavities are distributed in the middle of the feeding platform, and the others are distributed in the edge of the feeding platform. The feeding platform is a profiled conveying belt, and a plurality of partitions are arranged in sequence along the conveying direction of the profiled conveying belt.

10. The patch product processing system of claim 6, wherein, The first processing line further comprises an auxiliary laminating mechanism for laminating the target original sheet with a first bottom supporting material belt, and the first bottom supporting material belt is used for conveying the target original sheet.

11. The patch product processing system of claim 10, wherein, The first bottom supporting material belt is conveyed from below the profiled conveying belt and passes between the discharging side of the profiled conveying belt and the auxiliary laminating mechanism from bottom to top. The feeding platform is provided with a limiting baffle, and the limiting baffle is used to prevent the target original sheet from moving in a direction other than the discharging direction.

12. The patch product processing system of claim 6, wherein, The size of the limiting baffle is adjustable, and / or at least part of the structure of the limiting baffle can move relative to the feeding platform to push a part of the target original sheet out of the feeding platform.

13. The patch product processing system of claim 12, wherein, The limiting baffle comprises two side baffles and a push plate, and the two side baffles are arranged on the two opposite sides of the push plate.

14. The patch product processing system of claim 13, wherein, The second processing line comprises a second bottom supporting material belt, a second pressing mechanism, a second die-cutting mechanism, a third pressing mechanism and a third waste collecting mechanism.

15. The patch product processing system of claim 1, wherein, The second processing line is provided with a first pressing station, a die-cutting station, a second pressing station and a waste collecting station in sequence from upstream to downstream. The second pressing mechanism is provided with a second pressing support roller and a second pressing roller at the first pressing station, and the second pressing support roller and the second pressing roller are respectively located on the two opposite sides of the second bottom supporting material belt to make the second bottom supporting material belt and the first anti-sticking paper be laminated. ​ The second die-cutting mechanism is provided with a second die-cutting support roller and a second cutting knife at the die-cutting station, the second die-cutting support roller and the second cutting knife are respectively located at two opposite sides of the second backing material belt, and the second cutting knife is used for cutting the first release paper to form the second release paper. The third pressing mechanism is provided with a third pressing roller at the second pressing station, and the third pressing roller is arranged at one side of the second backing material belt to make the second release paper and the second adhesive sticker be bonded. The third waste collecting mechanism recovers the waste corresponding to the hollows by the second backing material belt at the waste collecting station after the first release paper is cut, and makes the second backing material belt be separated from the second release paper at the second pressing station.

16. The patch product processing system of claim 15, wherein, The second processing line has at least one of the following characteristics: The third waste collecting mechanism is provided with a second waste collecting roller for winding the second backing material belt at the waste collecting station; and The second processing line further comprises a second backing material belt material roll and a first release paper material roll arranged at the most upstream, the second backing material belt material roll is provided with a wound second backing material belt, and the first release paper material roll is provided with a wound first release paper, and the second backing material belt material roll and the first release paper material roll are independently arranged.

17. The patch product processing system of claim 16, wherein, The second processing line comprises a third pressing mechanism, and the third pressing mechanism is provided with a third pressing roller at the second pressing station, and the third pressing roller is arranged at one side of the second backing material belt. The third processing line has a third backing material belt and a fifth pressing support roller, and the fifth pressing support roller is arranged at the other side of the second backing material belt. The positions of the third pressing roller and the fifth pressing support roller correspond to each other; the second backing material belt and the third backing material belt pass between the third pressing roller and the fifth pressing support roller, and the fourth processing line and the third processing line share the third backing material belt.

18. The patch product processing system of claim 1, wherein, The bonding mechanism comprises a peeling and bonding pressing roller corresponding to the position of the peeling support roller, the peeling and bonding pressing roller and the peeling support roller are arranged at two opposite sides of the third backing material belt, the peeling and bonding pressing roller is used for pressing the edge of the target patch to make the target patch be bonded with the second adhesive sticker, and the roller surface of the peeling and bonding pressing roller is wrapped with a deformable protective structure.

19. The patch product processing system of claim 18, wherein, The bonding mechanism comprises a second blowing mechanism and a bonding support platform, and the second blowing mechanism and the bonding support platform are respectively arranged at two opposite sides of the third backing material belt; the second blowing mechanism can be close to or away from the bonding support platform; when the second blowing mechanism is close to the bonding support platform, the second blowing mechanism is used for blowing air to the target patch to make the target patch be bonded with the second adhesive sticker.

20. The patch product processing system of claim 19, wherein, The number of the target object patches is multiple, the second blowing mechanism comprises a blowing platform, the blowing platform is provided with multiple air outlets, the number and position of the air outlets correspond to the number and position of the target object patches, each target object patch is blown by a corresponding air outlet, the aperture of the air outlet is larger than the diameter of the target object patch, and the air outlet sleeves the target object patch to blow air when the blowing platform is close to the lamination support platform.

21. The patch product processing system of any one of claims 18-20, wherein, The fourth processing line further comprises a second visual detection system in communication connection with the control system, and the control system is used for controlling the state of the lamination mechanism according to the visual detection information of the second visual detection system.

22. A method of processing a patch product, characterized by The processing method is implemented by the patch product processing system in any one of claims 1-21.

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