Ultraviolet light curing method, system, manicure device, and additive printing device

Abstract

The application discloses an ultraviolet curing method, system, manicure device and additive printing device, and the method comprises the following steps: acquiring morphological information of a to-be-irradiated region of an object to be irradiated in an irradiation range of an ultraviolet projection system; calculating distances from each block in the to-be-irradiated region to the ultraviolet projection system based on the morphological information; generating an irradiation pattern matched with the to-be-irradiated region based on the to-be-irradiated region; forming an illumination region matched with the irradiation pattern by the ultraviolet projection system based on the irradiation pattern; and adjusting the light-emitting intensity of the light-emitting points at each position in the ultraviolet projection system based on the morphological information and the distances from each block in the to-be-irradiated region to the ultraviolet projection system. The ultraviolet curing method, system and manicure device provided by the application can realize accurate irradiation of the ultraviolet light irradiation region of the to-be-cured surface by acquiring the morphological information of the object to be irradiated in real time, and generating the irradiation pattern matched with the to-be-irradiated region based on the information.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of light curing technology, in particular to an ultraviolet light curing method, system, nail polishing device and additive printing device. BACKGROUND

[0002] As a curing method widely used in industrial production, ultraviolet light curing technology has received widespread attention and adoption due to its fast curing speed and good curing effect. This technology mainly uses ultraviolet light emitted by ultraviolet lamps to achieve rapid curing of materials and is widely used in nail polishing, printing, coating, plastic molding and other fields.

[0003] In traditional ultraviolet light curing methods, ultraviolet lamps usually directly irradiate materials to achieve curing of the materials. However, this curing method has certain problems. Since the ultraviolet light emitted by the ultraviolet lamp has a certain diffusivity, the ultraviolet light will simultaneously irradiate areas that are not desired to be irradiated, which can cause local over-curing or non-curing of the material, affecting the performance and quality of the product.

[0004] Therefore, in view of the above technical problems, it is necessary to provide a new ultraviolet light curing method, system, nail polishing device and additive printing device. SUMMARY

[0005] The purpose of the present application is to provide an ultraviolet light curing method, system, nail polishing device and additive printing device that can concentrate ultraviolet light on the irradiated area that needs to be light cured.

[0006] To achieve the above-mentioned purpose, the technical solutions provided by the present application are as follows:

[0007] In a first aspect, the present application provides an ultraviolet light curing method, comprising:

[0008] real-time acquisition of morphological information of an irradiated area of an irradiated object within the irradiation range of an ultraviolet micro-pixel light-emitting array projection system;

[0009] based on the morphological information, calculating the distance from each block in the irradiated area to the ultraviolet micro-pixel light-emitting array projection system;

[0010] based on the irradiated area, generating an irradiation pattern matching the irradiated area;

[0011] based on the irradiation pattern, the ultraviolet micro-pixel light-emitting array projection system forms an illumination area matching the irradiation pattern to irradiate the irradiated area;

[0012] adjust the light-emitting intensity of the light-emitting points at each position in the ultraviolet micro-pixel light-emitting array projection system based on the morphological information and the distance of each block in the to-be-illuminated region to the ultraviolet micro-pixel light-emitting array projection system, so that the difference in the illumination intensity received by each block in the to-be-illuminated region is within a preset range.

[0013] In one or more embodiments, the morphological information of the to-be-illuminated region of the to-be-illuminated object within the illumination range of the ultraviolet micro-pixel light-emitting array projection system is acquired in real time, including:

[0014] Based on the image acquisition module and / or the 3D information acquisition module, the contour, posture, depth and / or angle information of the to-be-illuminated region of the to-be-illuminated object within the illumination range of the ultraviolet micro-pixel light-emitting array projection system is acquired in real time.

[0015] In one or more embodiments, based on the morphological information, the distance of each block in the to-be-illuminated region to the ultraviolet micro-pixel light-emitting array projection system is calculated, including:

[0016] Based on the morphological information, the to-be-illuminated region and the ultraviolet micro-pixel light-emitting array projection system are mapped to the same spatial coordinate system.

[0017] Based on the spatial coordinates of each block in the to-be-illuminated region and the ultraviolet micro-pixel light-emitting array projection system, the distance of each block in the to-be-illuminated region to the ultraviolet micro-pixel light-emitting array projection system is calculated.

[0018] In one or more embodiments, based on the morphological information and the distance of each block in the to-be-illuminated region to the ultraviolet micro-pixel light-emitting array projection system, the light-emitting intensity of the light-emitting points at each position in the ultraviolet micro-pixel light-emitting array projection system is adjusted, including:

[0019] When the morphology of a certain block in the to-be-illuminated region or the distance of a certain block to the ultraviolet micro-pixel light-emitting array projection system changes, one or more light-emitting points in the ultraviolet micro-pixel light-emitting array projection system corresponding to the block and the light-emitting intensity thereof are re-matched.

[0020] In one or more embodiments, the method further includes:

[0021] The matching degree of the illumination region and the to-be-illuminated region is calculated.

[0022] If the matching degree is lower than a preset threshold, the illumination pattern is adjusted based on the positional deviation of the illumination region and the to-be-illuminated region.

[0023] updating the lighted area formed by the ultraviolet micro-pixel light-emitting array projection system based on the adjusted illumination pattern, so that the updated lighted area matches the area to be irradiated.

[0024] In one or more embodiments, the matching degree of the lighted area and the area to be irradiated is calculated, comprising:

[0025] acquiring an image containing the lighted area and the area to be irradiated;

[0026] calculating the matching degree of the lighted area and the area to be irradiated based on the coincidence degree of the lighted area and the area to be irradiated in the image.

[0027] In one or more embodiments, the method further comprises:

[0028] predicting the position of the area to be irradiated at the next time based on the moving speed of the area to be irradiated;

[0029] adjusting the light-emitting point of the ultraviolet micro-pixel light-emitting array projection system based on the predicted position, so that the irradiation position of the lighted area corresponds to the predicted position.

[0030] In one or more embodiments, the method further comprises:

[0031] adjusting the ultraviolet micro-pixel light-emitting array projection system in a dithering manner, so that the difference of the cumulative dose of irradiation between any two points in each block of the area to be irradiated is less than a preset value.

[0032] In one or more embodiments, the method further comprises:

[0033] statistically calculating the irradiation dose received by each block in the area to be irradiated in real time;

[0034] when the cumulative dose of irradiation received by a block in the area to be irradiated reaches a preset dose, the light-emitting point corresponding to the block is turned off.

[0035] In one or more embodiments, the method further comprises:

[0036] based on the irradiation dose received by each block;

[0037] different numerical values or display colors are given to the blocks that have reached the preset dose and the blocks that have not reached the preset dose.

[0038] In a second aspect, the present application provides an ultraviolet light curing system, comprising:

[0039] An acquisition module is configured to acquire morphological information of a to-be-irradiated region of an object to be irradiated within an irradiation range of an ultraviolet micro-pixel light-emitting array projection system in real time.

[0040] A calculation module is configured to identify the to-be-irradiated region and calculate distances from the ultraviolet micro-pixel light-emitting array projection system of each block in the to-be-irradiated region based on the morphological information.

[0041] A generation module is configured to generate an irradiation pattern matching the to-be-irradiated region based on the to-be-irradiated region.

[0042] An irradiation module is configured to cause the ultraviolet micro-pixel light-emitting array projection system to form an irradiation region matching the irradiation pattern based on the irradiation pattern, so as to irradiate the to-be-irradiated region.

[0043] An adjustment module is configured to adjust light-emitting intensities of each light-emitting point in the ultraviolet micro-pixel light-emitting array projection system based on the morphological information and the distances from the ultraviolet micro-pixel light-emitting array projection system of each block in the to-be-irradiated region, so as to cause a difference in irradiation intensities received by each block in the to-be-irradiated region to be within a preset range.

[0044] In one or more embodiments, the ultraviolet micro-pixel light-emitting array projection system includes an ultraviolet micro-pixel light-emitting array and an optical projection system, the ultraviolet micro-pixel light-emitting array includes a driving chip and an ultraviolet micro-pixel light-emitting device disposed on the driving chip, and the ultraviolet micro-pixel light-emitting device is electrically connected to the driving chip.

[0045] In one or more embodiments, the optical projection system includes a lens assembly for focusing ultraviolet light emitted by the ultraviolet micro-pixel light-emitting array and a dithering adjustment assembly, the dithering adjustment assembly is configured to drive the lens assembly to deflect an optical axis of the lens assembly.

[0046] In one or more embodiments, the ultraviolet micro-pixel light-emitting array includes a dithering adjustment assembly, a substrate, and a plurality of ultraviolet micro-pixel light-emitting devices disposed on the substrate, the dithering adjustment assembly is configured to drive the ultraviolet micro-pixel light-emitting array to dither in a direction parallel to the substrate.

[0047] In a third aspect, the present application provides a manicure device including the ultraviolet light curing system as described above, and the manicure device can be used to implement the ultraviolet light curing method as described above.

[0048] In a fourth aspect, the present application provides an additive printing device including the ultraviolet light curing system as described above, and the additive printing device can be used to implement the ultraviolet light curing method as described above.

[0049] Compared with the prior art, the ultraviolet light curing method, system, manicure device and additive printing device provided by the present application can realize accurate irradiation of the ultraviolet light irradiation area of the surface to be cured by acquiring the shape information of the object to be irradiated in real time, generating an irradiation pattern matched with the irradiation area based on the information, and then realizing accurate irradiation of the ultraviolet light irradiation area of the surface to be cured; and by adjusting the light-emitting intensity of the light-emitting points at each position in the ultraviolet micro-pixel light-emitting array projection system, the difference between the light intensities received by each block in the irradiation area is ensured to be within a preset range, uniform irradiation is realized, and the problems of local over-curing or uncuring are avoided. BRIEF DESCRIPTION OF DRAWINGS

[0050] Figure 1 is a flowchart of the ultraviolet light curing method in an embodiment of the present application;

[0051] Figure 2 is a structural block diagram of the ultraviolet light curing system in an embodiment of the present application. DETAILED DESCRIPTION

[0052] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, but it should be understood that the protection scope of the present application is not limited by the specific embodiments.

[0053] Unless otherwise explicitly stated, throughout the specification and claims, the term "comprise" or its variants such as "comprises" or "comprising" will be understood to encompass the stated element or components, without excluding other elements or components.

[0054] In the existing ultraviolet light curing technology, since ultraviolet light has a certain diffusivity, direct irradiation of the ultraviolet light will cause the light to irradiate the area that is not expected to be irradiated at the same time, which may cause local over-curing or uncuring of the material, thereby affecting the performance and quality of the final product.

[0055] To solve the foregoing problems, the core implementation idea of the present application is to realize accurate control of the ultraviolet light irradiation area by acquiring the shape information of the object to be irradiated in real time, generating an irradiation pattern matched with the irradiation area based on the information, and then realizing accurate control of the ultraviolet light irradiation area. By adjusting the light-emitting intensity of the light-emitting points at each position in the ultraviolet micro-pixel light-emitting array projection system, the difference between the light intensities received by each block in the irradiation area is ensured to be within a preset range, uniform irradiation is realized, and the problems of local over-curing or uncuring are avoided. In addition, the method can be adjusted and optimized in real time to adapt to the changes in the shape of the object to be irradiated, and ensure the stability and reliability of the curing effect.

[0056] Please refer to Figure 1 Fig. 1 is a flowchart of the ultraviolet light curing method in an embodiment of the present application. The ultraviolet light curing method specifically includes the following steps:

[0057] S101: Real-time acquisition of the morphological information of the to-be-irradiated region of the to-be-irradiated object within the irradiation range of the ultraviolet micro-pixel light-emitting array projection system.

[0058] It can be understood that, in order to realize accurate irradiation of the to-be-irradiated region of the to-be-irradiated object, the morphological characteristics of the to-be-irradiated object need to be understood in advance, so as to generate an irradiation pattern matched therewith and adjust the light-emitting intensity. Since the to-be-irradiated object can change during the curing process, such as moving, rotating, deforming, etc., the morphological information thereof needs to be acquired in real time, so as to ensure the curing effect and quality.

[0059] Specifically, the contour, pose, depth and / or angle information of the to-be-irradiated region of the to-be-irradiated object within the irradiation range of the ultraviolet micro-pixel light-emitting array projection system can be acquired in real time based on the image acquisition module and / or the 3D information acquisition module.

[0060] It should be noted that a high-resolution camera or other image sensor can be used to capture a two-dimensional image of the to-be-irradiated object in real time, and the contour and pose information of the object can be extracted through image processing algorithms. For example, edge detection, contour extraction and other techniques can be used to obtain the contour of the object; feature point matching, pose estimation and other techniques can be used to obtain the pose of the object.

[0061] Three-dimensional morphological information of the to-be-irradiated object can also be acquired in real time by using laser scanning, stereo vision, depth camera and other techniques, so as to obtain the depth and angle information of the object. For example, laser scanning can accurately measure the depth of the surface of the object through the difference in round-trip time of laser; or the depth and contour or angle of the surface of the object can be calculated through the parallax of two images at different angles by using stereo vision; or the contour and morphology of the surface of the object can be obtained by identifying and calculating the deformation of the structured light on the surface of the object.

[0062] In step S101, one or more devices capable of capturing the surface features of the to-be-irradiated object, such as a camera, a laser scanner, an infrared sensor, etc., can be used to observe and measure the to-be-irradiated object in real time, so as to acquire the contour (i.e. edge line), pose (i.e. position and direction), depth (i.e. distance) and angle (i.e. inclination) information of the surface of the to-be-irradiated object, so as to facilitate subsequent calculation and control.

[0063] By acquiring the morphological information of the to-be-irradiated object in real time, dynamic tracking and adaptation of the to-be-irradiated object can be realized, so that the ultraviolet light can always accurately irradiate the region that needs to be cured, and the influence on the region that is not expected to be irradiated is reduced. At the same time, by acquiring the morphological information of the to-be-irradiated object, necessary data and basis can be provided for subsequent calculation and control, and the curing efficiency and accuracy can be improved.

[0064] In a specific example of nail art, assume that the object to be irradiated is a finger nail, and the surface of the nail is coated with a layer of nail polish that needs to be cured. In order to achieve the curing of the nail polish layer, it is necessary to use ultraviolet light for irradiation. The profile and posture information of the nail polish layer can be captured by the image acquisition module. And the depth and angle information of each point on the surface of the nail polish layer to the ultraviolet micro-pixel light-emitting array projection system can be measured by the 3D information acquisition module.

[0065] In another specific example of additive printing, assume that the object to be irradiated is a 3D printed model, which is identified according to the layer-by-layer slicing data of the 3D model. In order to achieve the layer-by-layer curing of the 3D printed model, it is necessary to use ultraviolet light for irradiation. The profile, position, and distance of the layer-by-layer printed model can be captured and identified by the image acquisition module according to the progress of the 3D printing. And the depth and angle information of each point on the surface of the layer-by-layer printed model to the ultraviolet micro-pixel light-emitting array projection system can be measured by the 3D information acquisition module, so as to dynamically adjust the lighting area and brightness of the ultraviolet micro-pixel light-emitting array.

[0066] S102: Calculate the distance of each block in the irradiated area to the ultraviolet micro-pixel light-emitting array projection system based on the shape information.

[0067] It can be understood that, in order to achieve uniform irradiation of the irradiated area, it is necessary to adjust the light-emitting intensity of the light-emitting points at the corresponding positions according to the distance of each block in the irradiated area to the ultraviolet micro-pixel light-emitting array projection system, so that the light intensity received by each block is similar. Since the distances of different blocks to the ultraviolet micro-pixel light-emitting array projection system may be different, these distances need to be calculated first in order to facilitate subsequent adjustment.

[0068] According to the shape information of the object to be irradiated obtained in step S101, such as profile, posture, depth, and angle, etc. The irradiated area can be divided into several small blocks, such as pixels or grids, etc. The irradiated area and the ultraviolet micro-pixel light-emitting array projection system are represented in a unified spatial coordinate system, such as Cartesian coordinate system or polar coordinate system, etc. Then the distance of the center point or other representative point of each block to the ultraviolet micro-pixel light-emitting array projection system is calculated in order to facilitate subsequent light intensity control.

[0069] Specifically, based on the shape information, the irradiated area and the ultraviolet micro-pixel light-emitting array projection system can be mapped to the same spatial coordinate system; and based on the spatial coordinates of each block in the irradiated area and the ultraviolet micro-pixel light-emitting array projection system, the distance of each block in the irradiated area to the ultraviolet micro-pixel light-emitting array projection system can be calculated.

[0070] For example, in the aforementioned example of manicure, the area where the nail polish layer is located can be divided into several small blocks, and the area where the nail polish layer is located and the ultraviolet micro-pixel light-emitting array projection system are mapped into the same spatial coordinate system, and the distance from each block to the light-emitting plane of the ultraviolet micro-pixel light-emitting array projection system is calculated. The distance from each block to the ultraviolet micro-pixel light-emitting array projection system can be calculated using the following formula:

[0071]

[0072] wherein, d is the distance from each block to the ultraviolet micro-pixel light-emitting array projection system, x , y , z is the spatial coordinate of the center point or other representative point of each block, x 0 , y 0 , z 0 is the spatial coordinate of the light-emitting point in the ultraviolet micro-pixel light-emitting array projection system corresponding to the center point or other representative point of the block.

[0073] S103: generating an irradiation pattern matched with the to-be-irradiated area based on the to-be-irradiated area.

[0074] In step S103, the image acquisition module and / or the 3D information acquisition module transmit the acquired information to the processor. The processor can calculate the area where the nail polish layer is located according to the information, and generate an irradiation pattern matched with the area. The processor can control whether the light-emitting points at each position in the ultraviolet micro-pixel light-emitting array projection system emit light and the light-emitting intensity according to the irradiation pattern, so that the ultraviolet light only irradiates the area where the nail polish layer is located, and ensures that the light intensity received by each block is similar.

[0075] If the nail polish layer moves or rotates during the curing process, the image acquisition module and the 3D information acquisition module can capture these changes in time and transmit the new morphological information to the controller. The processor can recalculate the area where the nail polish layer is located according to the new morphological information, and update the irradiation pattern.

[0076] Specifically, the irradiation pattern can be generated by digital image processing, computer graphics, and deep learning model, etc.

[0077] For example, the morphological information of the region to be irradiated can be converted into a binary image using digital image processing techniques, where the region that needs to be irradiated is white and the region that does not need to be irradiated is black, and then the edge information of the region to be irradiated is extracted using edge detection algorithms such as Canny, Sobel, etc. to generate the irradiation pattern. Alternatively, a three-dimensional model can be created based on the morphological information of the region to be irradiated using geometric modeling techniques in computer graphics, and the three-dimensional model is converted into a pixel image, i.e. the irradiation pattern, through a rasterization process. Deep learning (e.g. convolutional neural network CNN) can also be used to train the model to learn to generate irradiation based on the input morphological information of the region to be irradiated, and the morphological information of the region to be irradiated is input into the trained model to obtain the irradiation pattern.

[0078] S104: Based on the irradiation pattern, the ultraviolet micro-pixel light-emitting array projection system forms an illumination region matching the irradiation pattern to irradiate the region to be irradiated.

[0079] In step S104, according to the irradiation pattern matching the region to be irradiated generated in step S103, whether the light-emitting point at each position in the ultraviolet micro-pixel light-emitting array projection system emits light is controlled, so that the ultraviolet micro-pixel light-emitting array projection system forms an illumination region matching the irradiation pattern, thereby projecting ultraviolet light onto the region to be irradiated of the object to be irradiated. If the position or posture of the object to be irradiated changes, the system will adjust the light-emitting array in real time to ensure that the illumination region always matches the irradiation pattern.

[0080] S105: Based on the morphological information and the distance from each block in the region to be irradiated to the ultraviolet micro-pixel light-emitting array projection system, the light-emitting intensity of the light-emitting point at each position in the ultraviolet micro-pixel light-emitting array projection system is adjusted to make the difference in illumination intensity received by each block in the region to be irradiated within a preset range.

[0081] It can be understood that in order to achieve uniform irradiation of the region to be irradiated of the object to be irradiated, the light-emitting intensity of the light-emitting point at the corresponding position needs to be adjusted according to the morphology of each block and the distance to the ultraviolet micro-pixel light-emitting array projection system, so that the illumination intensity received by each block is similar or within an acceptable range. Since the morphology of different blocks or the distance to the ultraviolet micro-pixel light-emitting array projection system may be different, the illumination intensity needs to be adjusted according to the morphology of each block and the distance to the ultraviolet micro-pixel light-emitting array projection system.

[0082] For example, a two-dimensional array matching the layout of the light-emitting points of the light-emitting array can be set in the UV micro-pixel light-emitting array projection system. The gray value or color value corresponding to each grid point in the received illumination pattern is stored in the two-dimensional array, representing the light-emitting intensity. Then, each position in the two-dimensional array is traversed, and whether the light-emitting point at the corresponding position emits light and the light-emitting intensity are controlled according to the stored gray value or color value. If the gray value or color value is 0 or black, it means that the position does not need to emit light; if the gray value or color value is 255 or white, it means that the position needs to emit light at the maximum intensity; if the gray value or color value is between 0 and 255, it means that the position needs to emit light at the corresponding intensity.

[0083] Specifically, when the morphology of a certain block in the to-be-illuminated region or the distance from a certain block to the UV micro-pixel light-emitting array projection system changes, the light-emitting intensity of one or more light-emitting points in the UV micro-pixel light-emitting array projection system corresponding to the block is re-matched.

[0084] The morphology and distance of each block in the to-be-illuminated region can be monitored in real time by the image acquisition module and / or the 3D information acquisition module, such as movement, rotation, deformation, etc. If changes occur, the light-emitting intensity of one or more light-emitting points corresponding to the changed block is re-calculated and adjusted, so that the light intensity received by the changed block is still within the preset range. By re-matching one or more light-emitting points in the UV micro-pixel light-emitting array projection system corresponding to the changed block and their light-emitting intensity, dynamic adaptation and uniform illumination of the to-be-illuminated region can be achieved.

[0085] In one example of adjusting the light-emitting intensity based on the distance change, a two-dimensional array matching the layout of the light-emitting points of the light-emitting array can be set in the UV micro-pixel light-emitting array projection system. The distance from each block to the UV micro-pixel light-emitting array projection system and the desired light intensity received by each block are stored in the two-dimensional array. The light intensity can be set according to the curing requirements or other factors of the to-be-illuminated object, such as curing time, curing depth, curing uniformity, etc. Each position in the two-dimensional array is traversed, and the light-emitting intensity of the light-emitting point at the corresponding position is calculated and adjusted according to the stored distance and light intensity. The light-emitting intensity can be calculated and adjusted according to the following formula:

[0086]

[0087] wherein, I is the light-emitting intensity of the light-emitting point, E is the desired light intensity received by the block, dis the distance from the block to the ultraviolet micro-pixel light-emitting array projection system. By re-matching one or more light-emitting points in the ultraviolet micro-pixel light-emitting array projection system corresponding to the moved block and the light-emitting intensity thereof, the light intensity received by the block after the distance changes can still be within the preset range, thereby achieving uniform irradiation.

[0088] In an exemplary embodiment, the ultraviolet curing method in the present embodiment further includes: calculating the matching degree between the light irradiation area and the to-be-irradiated area; if the matching degree is lower than a preset threshold, adjusting the irradiation pattern based on the positional deviation between the light irradiation area and the to-be-irradiated area; and updating the light irradiation area formed by the ultraviolet micro-pixel light-emitting array projection system based on the adjusted irradiation pattern, so that the updated light irradiation area matches the to-be-irradiated area.

[0089] According to the light irradiation area formed by the ultraviolet micro-pixel light-emitting array projection system, the matching degree between the light irradiation area and the to-be-irradiated area of the object to be irradiated can be calculated. If the matching degree is lower than a preset threshold (a pre-set standard), the light-emitting points at each position in the irradiation pattern can be adjusted according to the positional deviation between the light irradiation area and the to-be-irradiated area, so that the irradiation pattern is more in line with the shape and position of the to-be-irradiated area. Then, the light irradiation area formed by the ultraviolet micro-pixel light-emitting array projection system is updated according to the adjusted irradiation pattern, so that the light irradiation area is more matched with the to-be-irradiated area.

[0090] In a specific example, a grid with the same size and resolution as the ultraviolet micro-pixel light-emitting array projection system can be established on a two-dimensional plane or a two-dimensional curved surface. The contour lines of the two-dimensional light irradiation area and the area where the to-be-irradiated area is located can be marked on the grid, and the coincidence degree between the two can be calculated. The matching degree between the two-dimensional light irradiation area and the to-be-irradiated area can be calculated according to the coincidence degree. The higher the coincidence degree, the more matched the light irradiation area and the to-be-irradiated area are; the lower the coincidence degree, the less matched the light irradiation area and the to-be-irradiated area are.

[0091] If the matching degree is lower than a preset threshold, the irradiation pattern needs to be adjusted based on the positional deviation between the light irradiation area and the to-be-irradiated area. For example, the following method can be used to adjust the irradiation pattern based on the positional deviation between the light irradiation area and the to-be-irradiated area:

[0092] A two-dimensional array with the same size and resolution as the ultraviolet micro-pixel light-emitting array projection system is set in the ultraviolet micro-pixel light-emitting array projection system. Whether the light-emitting point at each position emits light or not is stored in the two-dimensional array to represent the irradiation pattern to form the light irradiation area. Each position in the two-dimensional array is traversed, and the light irradiation area is transformed by translation, rotation, scaling, etc. according to the positional deviation between the light irradiation area and the to-be-irradiated area, so that the light irradiation area is more in line with the shape and position of the to-be-irradiated area.

[0093] The degree of coincidence can be calculated using image processing techniques, such as edge detection, contour extraction, image segmentation, etc. The contour lines of the lighted area and the area to be irradiated are extracted from the image containing both, and the degree of coincidence between them is calculated, such as the coincidence area, the coincidence ratio, the coincidence center, etc. Machine vision techniques can also be used, such as object detection, object tracking, object recognition, etc., to identify the position and shape of the lighted area and the area to be irradiated from the image containing both, and to calculate the degree of coincidence between them, such as the Euclidean distance, the cosine similarity, the Hamming distance, etc. Sensor technologies can also be used, such as infrared sensors, laser sensors, ultrasonic sensors, etc., to collect distance and angle information of the lighted area and the area to be irradiated from the image containing both, and to calculate the degree of coincidence between them, such as the offset, the rotation angle, the deformation degree, etc.

[0094] In an exemplary embodiment, the ultraviolet curing method in the present embodiment further comprises: predicting the position of the area to be irradiated at the next time based on the moving speed of the area to be irradiated; and adjusting the light-emitting point positions of the ultraviolet micro-pixel light-emitting array projection system based on the predicted position, so that the irradiation position of the lighted area corresponds to the predicted position.

[0095] According to the moving speed of the area to be irradiated of the object to be irradiated, such as the translation speed, the rotation speed, etc., the position of the area to be irradiated at the next time can be predicted by applying kinematic formulas; and according to the predicted position, whether each position of the ultraviolet micro-pixel light-emitting array projection system emits light is adjusted, so that the lighted area formed by the ultraviolet micro-pixel light-emitting array projection system can timely follow the movement of the area to be irradiated and correspond to it. The time interval of the next time is the interval time of refreshing each frame of the image.

[0096] In a specific example, sensors or other measuring devices, such as accelerometers, gyroscopes, encoders, etc., can be used to measure the moving speed of the area to be irradiated, such as the translation speed, the rotation speed, etc., in real time, and transmit the measurement results to a controller or other computing device, such as a PLC, an MCU, a PC, etc. The position changes of the object to be irradiated and the area to be irradiated in the structure according to the adjacent multiple image acquisitions can be used to determine the motion speed (rate and direction) of each partition in combination with the frame rate of the image acquisition device, one or more algorithms, such as Kalman filtering, Bayesian inference, neural networks, etc., can be used to predict the position of the area to be irradiated at the next time according to the aforementioned measurement results and the initial position of the object to be irradiated and the area to be irradiated in the last frame, and transmit the prediction results to the ultraviolet micro-pixel light-emitting array projection system. A two-dimensional array matching the light-emitting points can be provided in the ultraviolet micro-pixel light-emitting array projection system, and according to the prediction results, whether each light-emitting point emits light is adjusted, so that the lighted area formed by the ultraviolet micro-pixel light-emitting array projection system can timely follow the movement of the area to be irradiated.

[0097] In an exemplary embodiment, the UV curing method in the present embodiment further comprises: adjusting the UV micro-pixel light array projection system in a jittering manner, so that the difference of the cumulative dose of irradiation between any two points in each block of the irradiation region is less than a preset value.

[0098] It can be understood that, due to the gap between the light emitting points of the UV micro-pixel light array projection system, the light intensity at the position corresponding to the gap in the irradiation region is insufficient, and if the same position in the irradiation region is always irradiated, the cumulative dose of irradiation received at the position may be insufficient, thereby affecting the curing effect, such as producing a grid-like uneven surface or introducing interlayer defects, and further producing internal defects of the printed product.

[0099] Therefore, the UV micro-pixel light array projection system can be adjusted in a jittering manner (small random or regular movement or rotation), so that the irradiation region is slightly offset or rotated in the two-dimensional plane, so that the position corresponding to the gap in the irradiation region will not always irradiate the same position in the irradiation region, but will change within a small range, so that each position of the irradiation object can receive sufficient UV light.

[0100] In a specific example, a jittering parameter, such as jittering amplitude (preferably higher than half the gap width), jittering frequency (preferably higher than 2 times the update frequency of the irradiation pattern), jittering direction, etc. (preferably two intersecting directions in the plane perpendicular to the optical axis direction, with the direction selection should be combined with the arrangement of the UV micro-pixels) can be set in the UV micro-pixel light array projection system, for controlling the movement or rotation of the UV micro-pixel light array projection system. A timer or other triggering device, such as a sensor, a switch, etc. can be set in the UV micro-pixel light array projection system, for controlling the jittering time or condition of the UV micro-pixel light array projection system. When the timer or other triggering device is started, the UV micro-pixel light array projection system is moved or rotated in a small random or regular manner according to the jittering parameter, so that the irradiation region is slightly offset or rotated in the two-dimensional plane, so that the position corresponding to the gap in the irradiation region will not always irradiate the same position in the irradiation region, but will change within a small range.

[0101] In an exemplary embodiment, in order to avoid over-curing or under-curing of each block in the irradiation region, the UV curing method in the present embodiment further comprises: statistically calculating the irradiation dose received by each block in the irradiation region in real time; and when the cumulative dose of irradiation received by a certain block in the irradiation region reaches a preset dose, the light emitting point corresponding to the block is turned off.

[0102] In order to achieve accurate irradiation of the to-be-irradiated region of the to-be-irradiated object, the irradiation dose received by each block can be counted in real time, and the corresponding light-emitting point can be turned off according to the irradiation dose. Since different blocks may require different curing conditions, such as curing time, curing depth, curing uniformity, etc., the curing requirements of each block or other factors, such as material properties, environmental temperature, mechanical stress, etc., need to be set. By counting and turning off the light-emitting point in real time, unnecessary irradiation of blocks that have been cured or do not need to be cured can be avoided, thereby improving the curing effect and quality. At the same time, the utilization rate of ultraviolet light is also improved, the corresponding ultraviolet micro-pixels in the non-target irradiation region do not need to be turned on, the overall power consumption is reduced, and the overall service life of the ultraviolet micro-pixel array is also prolonged.

[0103] The intensity and time of the ultraviolet light received by each block in the to-be-irradiated region of the to-be-irradiated object can be measured and recorded in real time by sensors or other measuring devices, so as to calculate the irradiation dose received by each block, such as energy density, exposure time, etc. When the irradiation dose received by a certain block reaches the preset dose, it indicates that the block has been cured and does not need to receive more ultraviolet light, and therefore the light-emitting point in the ultraviolet micro-pixel light-emitting array projection system corresponding to the block is turned off to stop irradiation of the block.

[0104] In a specific example, a two-dimensional array corresponding to the light-emitting point array can be provided in the ultraviolet micro-pixel light-emitting array projection system, and the irradiation dose received by each block corresponding to each light-emitting point is stored in each position of the two-dimensional array, indicating the irradiation dose distribution. A preset dose, such as energy density, exposure time, etc., is provided in the ultraviolet micro-pixel light-emitting array projection system to control the curing conditions of each block. Each position in the two-dimensional array is traversed, and whether the light-emitting point corresponding to the position needs to be turned off is determined according to the irradiation dose stored in the position and the preset dose. If the irradiation dose of a certain position reaches or exceeds the preset dose, the light-emitting point corresponding to the position is turned off to stop irradiation of the block corresponding to the position; if the irradiation dose of a certain position is lower than the preset dose, the light-emitting point corresponding to the position is kept unchanged to continue irradiation of the block corresponding to the position.

[0105] In an exemplary embodiment, the ultraviolet light curing method in the present embodiment further includes: based on the counting of the irradiation dose received by each block; different values or display colors are given to the blocks that have reached the preset dose and the blocks that have not reached the preset dose. The user can distinguish the blocks that have reached the irradiation dose and the blocks that have not reached the irradiation dose through the values or display colors, so as to facilitate the user to adjust the posture of the to-be-irradiated object according to the irradiation condition, and avoid the situation that some blocks cannot be irradiated.

[0106] Please refer to Figure 2As shown, based on the same inventive concept as the aforementioned ultraviolet light curing method, an embodiment of the present application provides an ultraviolet light curing system 200, which comprises an acquisition module 201, a calculation module 202, a generation module 203, an illumination module 204 and an adjustment module 205.

[0107] The acquisition module 201 is configured to acquire morphological information of a to-be-illuminated region of an object to be illuminated within an illumination range of an ultraviolet micro-pixel light-emitting array projection system in real time. The calculation module 202 is configured to calculate distances from each block in the to-be-illuminated region to the ultraviolet micro-pixel light-emitting array projection system based on the morphological information. The generation module 203 is configured to generate an illumination pattern matching the to-be-illuminated region based on the to-be-illuminated region. The illumination module 204 is configured to cause the ultraviolet micro-pixel light-emitting array projection system to form an illumination region matching the illumination pattern based on the illumination pattern, so as to illuminate the to-be-illuminated region. The adjustment module 205 is configured to adjust light-emitting intensities of each light-emitting point in the ultraviolet micro-pixel light-emitting array projection system based on the morphological information and the distances from each block in the to-be-illuminated region to the ultraviolet micro-pixel light-emitting array projection system, so that a difference in illumination intensities received by each block in the to-be-illuminated region is within a preset range.

[0108] Specifically, the acquisition module 201 can acquire contour, posture, depth and / or angle information of the to-be-illuminated region of the object to be illuminated within the illumination range of the ultraviolet micro-pixel light-emitting array projection system in real time based on an image acquisition module and / or a 3D information acquisition module.

[0109] The calculation module 202 can be configured to identify the to-be-illuminated region and map the to-be-illuminated region and the ultraviolet micro-pixel light-emitting array projection system to the same spatial coordinate system based on the morphological information, and calculate the distances from each block in the to-be-illuminated region to the ultraviolet micro-pixel light-emitting array projection system based on spatial coordinates of each block in the to-be-illuminated region and the ultraviolet micro-pixel light-emitting array projection system.

[0110] The adjustment module 205 can re-match one or more light-emitting points in the ultraviolet micro-pixel light-emitting array projection system corresponding to a block in the to-be-illuminated region and light-emitting intensities of the one or more light-emitting points when a morphology of the block or the distance from the block to the ultraviolet micro-pixel light-emitting array projection system changes.

[0111] In an exemplary embodiment, the ultraviolet micro-pixel light-emitting array projection system comprises an ultraviolet micro-pixel light-emitting array and an optical projection system. The ultraviolet micro-pixel light-emitting array comprises a driving chip and an ultraviolet micro-pixel light-emitting device disposed on the driving chip, and the ultraviolet micro-pixel light-emitting device is electrically connected to the driving chip.

[0112] It should be noted that the ultraviolet micro-pixel light-emitting array can be a two-dimensional array of many tiny ultraviolet light-emitting devices (which can be self-emitting devices based on organic light-emitting diodes (OLED), inorganic light-emitting diodes (LED), or other materials), each of which can be individually controlled to emit light or not and to control the intensity of the emitted light, thereby forming an illumination image. The optical projection system can be a system composed of lenses, mirrors, polarizers, and other elements, which can magnify and project the image on the ultraviolet micro-pixel light-emitting array onto a receiving screen or other surface.

[0113] Specifically, the optical projection system includes a dithering adjustment component and a lens component for focusing the ultraviolet light emitted by the ultraviolet micro-pixel light-emitting array, and the dithering adjustment component can drive the lens component to deflect the optical axis of the lens component.

[0114] In a specific example, the adjustment component can be a mechanical or electronic device capable of controlling the position and angle of the lens component, for example, a dithering adjustment component based on a piezoelectric ceramic driver, which is composed of a piezoelectric ceramic driver and a bracket. The piezoelectric ceramic driver can produce a small deformation under the action of voltage, thereby driving the lens component fixed on the bracket to produce a small translation or rotation, so that the optical axis of the lens component is deflected. The component can adjust the lens component in a dithering manner according to preset parameters or real-time feedback signals to make the illumination area send dithering.

[0115] In another specific example, the ultraviolet micro-pixel light-emitting array includes a dithering adjustment component, a substrate, and a plurality of ultraviolet micro-pixel light-emitting devices disposed on the substrate. The dithering adjustment component can be used to drive the ultraviolet micro-pixel light-emitting array to dither along a direction parallel to the substrate. A black matrix (BM) can also be provided between the plurality of ultraviolet micro-pixel light-emitting devices to further improve the collimation of the light emitted by the ultraviolet micro-pixel light-emitting devices.

[0116] The lens component can be an optical element capable of focusing ultraviolet light, for example, a lens component based on a liquid crystal lens, which is composed of a liquid crystal lens and a polarizer. The liquid crystal lens is a variable-focus lens that changes the refractive index by changing the arrangement of liquid crystal molecules, and the polarizer is an optical element that can be used to control the polarization direction of light. When the ultraviolet light emitted by the ultraviolet micro-pixel light-emitting array passes through the polarizer and becomes polarized light, the liquid crystal lens changes the polarization direction of the light according to the voltage, thereby changing the degree of focusing of the light. The component can apply different voltages to the liquid crystal lens according to preset parameters or real-time feedback signals to focus the ultraviolet light at the desired position.

[0117] In an example embodiment, the ultraviolet light curing system 200 further comprises an updating module 206, which is configured to calculate a matching degree between the irradiation area and the to-be-irradiated area, adjust the irradiation pattern based on a positional deviation between the irradiation area and the to-be-irradiated area when the matching degree is lower than a preset threshold, and update the irradiation area formed by the ultraviolet micro-pixel light-emitting array projection system based on the adjusted irradiation pattern, so that the updated irradiation area matches the to-be-irradiated area.

[0118] In an example embodiment, the ultraviolet light curing system 200 further comprises a prediction module 207, which is configured to predict a position of the to-be-irradiated area at a next time based on a moving speed of the to-be-irradiated area, and adjust a light-emitting point of the ultraviolet micro-pixel light-emitting array projection system based on the predicted position, so that an irradiation position of the irradiation area corresponds to the predicted position.

[0119] In an example embodiment, the ultraviolet light curing system 200 further comprises a dithering module 208, which is configured to perform dithering adjustment on the ultraviolet micro-pixel light-emitting array projection system, so that a difference between irradiation cumulative doses of any two points in each block of the to-be-irradiated area is less than a preset value.

[0120] In an example embodiment, the ultraviolet light curing system 200 further comprises a statistical module 209, which is configured to statistically calculate irradiation doses received by each block in the to-be-irradiated area in real time, and turn off a light-emitting point corresponding to a block in the to-be-irradiated area when an irradiation cumulative dose received by the block reaches a preset dose.

[0121] In an embodiment of the present application, a manicure device is provided, which is a device capable of curing manicure material by using ultraviolet light, and comprises an ultraviolet light curing system capable of implementing the above-mentioned ultraviolet light curing method. The manicure device can be used to implement the above-mentioned ultraviolet light curing method.

[0122] In an embodiment of the present application, an additive printing device is provided, which is a device capable of curing additive printing material by using ultraviolet light, and comprises an ultraviolet light curing system capable of implementing the above-mentioned ultraviolet light curing method. The manicure device can be used to implement the above-mentioned ultraviolet light curing method.

[0123] The foregoing description of specific exemplary embodiments of the application has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the application to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. It is intended that the scope of the application be limited not with this detailed description, but rather by the claims appended hereto.

Claims

1. An ultraviolet light curing method characterized by, The method comprises: acquiring morphological information of a to-be-irradiated region of an object to be irradiated within an irradiation range of an ultraviolet micro-pixel light-emitting array projection system in real time; calculating distances from each block in the to-be-irradiated region to the ultraviolet micro-pixel light-emitting array projection system based on the morphological information; generating an irradiation pattern matching the to-be-irradiated region based on the to-be-irradiated region; forming an irradiation region matching the irradiation pattern by the ultraviolet micro-pixel light-emitting array projection system based on the irradiation pattern, so as to irradiate the to-be-irradiated region; adjusting light-emitting intensities of light-emitting points at each position in the ultraviolet micro-pixel light-emitting array projection system based on the morphological information and the distances from each block in the to-be-irradiated region to the ultraviolet micro-pixel light-emitting array projection system, so that a difference in irradiation intensity received by each block in the to-be-irradiated region is within a preset range; predicting a position of the to-be-irradiated region at a next time based on a moving speed of the to-be-irradiated region; adjusting light-emitting point positions of the ultraviolet micro-pixel light-emitting array projection system based on the predicted position, so that an irradiation position of the irradiation region corresponds to the predicted position.

2. The ultraviolet light curing method according to claim 1, wherein The method comprises: acquiring contour, posture, depth and / or angle information of a to-be-irradiated region of an object to be irradiated within an irradiation range of an ultraviolet micro-pixel light-emitting array projection system in real time based on an image acquisition module and / or a 3D information acquisition module.

3. The ultraviolet light curing method according to claim 1, wherein The method comprises: mapping the to-be-irradiated region and the ultraviolet micro-pixel light-emitting array projection system to a same spatial coordinate system based on the morphological information; calculating distances from each block in the to-be-irradiated region to the ultraviolet micro-pixel light-emitting array projection system based on spatial coordinates of each block in the to-be-irradiated region and the ultraviolet micro-pixel light-emitting array projection system.

4. The ultraviolet light curing method according to claim 1, wherein The method comprises: when a morphology of a certain block in the to-be-irradiated region or a distance from a certain block to the ultraviolet micro-pixel light-emitting array projection system changes, re-matching one or more light-emitting points in the ultraviolet micro-pixel light-emitting array projection system corresponding to the block and light-emitting intensities of the light-emitting points.

5. The ultraviolet light curing method according to claim 1, wherein The method further comprises: calculating a matching degree of the irradiation region and the to-be-irradiated region; if the matching degree is lower than a preset threshold, adjusting the irradiation pattern based on a positional deviation between the irradiation region and the to-be-irradiated region; updating the irradiation region formed by the ultraviolet micro-pixel light-emitting array projection system based on the adjusted irradiation pattern, so that the updated irradiation region matches the to-be-irradiated region.

6. The ultraviolet light curing method according to claim 5, wherein The method comprises: acquiring an image containing the irradiation region and the to-be-irradiated region; Calculate a matching degree of the lighted area and the area to be irradiated based on a coincidence degree of the lighted area and the area to be irradiated in the image.

7. The ultraviolet light curing method according to claim 1, wherein The method further comprises: Adjust the UV micro-pixel light-emitting array projection system in a dithering manner, so that a difference of irradiation cumulative dose between any two points in each block of the area to be irradiated is less than a preset value.

8. The ultraviolet light curing method according to claim 1, wherein The method further comprises: Real-time statistics of irradiation dose received by each block in the area to be irradiated; When the cumulative irradiation dose received by a block in the area to be irradiated reaches a preset dose, turn off the light-emitting point corresponding to the block.

9. The ultraviolet light curing method according to claim 8, wherein The method further comprises: Based on the irradiation dose received by each block; Different values or display colors are given to the blocks that reach the preset dose and the blocks that do not reach the preset dose.

10. An ultraviolet light curing system characterized by, Comprise: An acquisition module is configured to acquire, in real time, morphological information of an area to be irradiated of an object to be irradiated in an irradiation range of a UV micro-pixel light-emitting array projection system; A calculation module is configured to identify the area to be irradiated and calculate distances from each block in the area to be irradiated to the UV micro-pixel light-emitting array projection system based on the morphological information; A generation module is configured to generate an irradiation pattern matched with the area to be irradiated based on the area to be irradiated; An irradiation module is configured to cause the UV micro-pixel light-emitting array projection system to form a lighted area matched with the irradiation pattern based on the irradiation pattern, so as to irradiate the area to be irradiated; An adjustment module is configured to adjust light-emitting intensities of light-emitting points in the UV micro-pixel light-emitting array projection system based on the morphological information and the distances from each block in the area to be irradiated to the UV micro-pixel light-emitting array projection system, so that a difference of irradiation intensities received by each block in the area to be irradiated is within a preset range; A prediction module is configured to predict a position of the area to be irradiated at a next time based on a moving speed of the area to be irradiated, and adjust light-emitting point positions of the UV micro-pixel light-emitting array projection system based on the predicted position, so that an irradiation position of the lighted area corresponds to the predicted position.

11. The ultraviolet light curing system of claim 10, wherein, The UV micro-pixel light-emitting array projection system comprises a UV micro-pixel light-emitting array and an optical projection system, the UV micro-pixel light-emitting array comprises a driving chip and a UV micro-pixel light-emitting device arranged on the driving chip, and the UV micro-pixel light-emitting device is electrically connected with the driving chip.

12. The ultraviolet light curing system of claim 11, wherein, The optical projection system comprises a dithering adjustment assembly and a lens assembly for focusing UV light emitted by the UV micro-pixel light-emitting array, and the dithering adjustment assembly can drive the lens assembly to deflect an optical axis of the lens assembly.

13. The ultraviolet light curing system of claim 11, wherein the ultraviolet light source is a light emitting diode (LED) array. The UV micro-pixel light-emitting array comprises a dithering adjustment assembly, a substrate and a plurality of UV micro-pixel light-emitting devices arranged on the substrate, and the dithering adjustment assembly is used to drive the UV micro-pixel light-emitting array to dither along a direction parallel to the substrate.

14. A manicuring device characterized by, The UV light curing system comprises the UV micro-pixel light-emitting array projection system according to any one of claims 10-13.

15. An additive printing device, characterized by The UV light curing system comprises the UV micro-pixel light-emitting array projection system according to any one of claims 10-13.

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