Flooring plank and reinforced splice plate

Abstract

The application discloses a floor board and a reinforced splicing board, and belongs to the technical field of composite boards.The base material layer comprises fiber resin powder with a length of 0.2-1.5 mm, is bonded by an adhesive, and is formed into a plate-shaped structure after hardening; copper particles are mixed in the fiber resin powder, and the particle size of the copper particles is 0.6-1.6 mm.In the application, the fiber resin powder is connected to each other in a staggered mode, so that the strength of the board is improved; the copper particles can reduce the porosity in the base material, improve the density of the base material layer, further enhance the strength of the board, and relieve the problem that the floor is not suitable for a humid environment.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of composite boards, and more particularly to a floor board and a reinforced splicing board. BACKGROUND

[0002] Wooden floors, as materials based on wooden structures, are always prone to swelling, arching, warping, and mold discoloration after being exposed to water or moisture, which may cause the floor to be unusable in severe cases or affect its use and appearance in slight cases. In order to solve the problem that floors are afraid of water and humid environments, which are forbidden areas for floors, it is necessary to develop and research reinforced floors with high waterproof performance.

[0003] Most of the waterproof and moisture-proof reinforced floors on the market are made by laying one or more layers of special paper on the front surface of high-density fiberboard, particle board, and other man-made board substrates, adding a wear-resistant layer to the surface of the special paper, and adding a balancing layer to the back of the substrate. The floor is formed by hot pressing, and then treated with waterproof wax. The paste-like wax or solid granular wax is melted at high temperature and coated on the substrate part around the floor. The waterproof wax has strong penetration ability for fibers and can penetrate into the high-density substrate fibers within a few seconds. After the wax is saturated, its water resistance can be improved, and the waterproof effect is enhanced.

[0004] For example, Chinese patent 201911252270.0 discloses a floor with waterproof function and a wax coating process. The floor with waterproof function is provided with a wax coating layer and adds a freshener inside the wax coating layer, which can not only freshen the indoor air but also wax-seal the surface of the floor for waterproofing, effectively preventing water from entering the floor and increasing the gloss of the floor.

[0005] Alternatively, by improving the ordinary fiberboard substrate, the water absorption thickness expansion rate of the floor can be controlled to a certain extent after the waterproof fiberboard is treated with waterproof wax.

[0006] For example, patent 201310562400.7 discloses a waterproof material, a waterproof fiberboard, and a reinforced wood floor and its production method. The waterproof material for the fiberboard is prepared by melting paraffin with a melting point of 50-58℃ and then adding nanoscale or micrometer scale hydrophobic silica under stirring conditions. The waterproof fiberboard is prepared by adding the waterproof material for the fiberboard to a hot mill during production. When the reinforced wood floor is produced, a 0.15-0.4mm thick waterproof material coating is applied to the fiber on the surface of the floor tongue, and a waterproof reinforced wood floor is obtained.

[0007] However, this reinforced floor still has problems such as swelling, arching, shrinkage, warping, mold, discoloration, and other issues when used in southern, coastal, or relatively humid environments due to the wood wet swelling and dry shrinkage characteristics of the fiberboard itself.

[0008] In patent 201710008279.1, a composite epoxy resin plate and its forming method are disclosed, which includes waste semi-solid sheet powder 5%~100%, waste electronic circuit board powder 0~95%. The plate has better waterproofness than wood floor.

[0009] In patent 201910396221.8, a fireproof and waterproof composite floor and decorative plate are disclosed, which also uses waste and old recycled circuit boards as materials to manufacture waterproof core boards.

[0010] The above two kinds of PCB recycling plate materials as floor materials have certain waterproofness, but due to the use of granular powder, they are easy to crack in long-term humid environment after pressing, and have short service life. SUMMARY

[0011] 1. Problems to be solved

[0012] In view of the problem that the existing technology of reinforced wood floor is greatly affected by environmental temperature and humidity and is easy to crack, the present application provides a floor plate and a reinforced splicing plate, which can be used in humid environment for a long time and improves the service life of the plate.

[0013] 2. Technical solutions

[0014] In order to solve the above problems, the technical solutions adopted by the present application are as follows:

[0015] The floor plate of the present application comprises a decorative layer, a base material layer and a balancing layer, wherein,

[0016] The decorative layer is connected to the upper side of the base material layer and comprises melamine impregnated paper with a thickness of 0.05~0.30mm;

[0017] The base material layer contains fiber resin powder with a length of 0.2~1.5mm, which is hardened into a plate shape by adhesive, and the fiber resin powder uniformly mixed with copper particles; wherein the particle size of at least part of the copper particles is 0.2~1.6mm;

[0018] The balancing layer is connected to the lower side of the base material layer.

[0019] Further, the melamine impregnated paper contains aluminum oxide, and the thickness of the decorative layer is 0.08~0.15mm;

[0020] Or:

[0021] The decorative layer further comprises aluminum oxide wear-resistant paper, which is arranged on the upper side of the melamine impregnated paper.

[0022] Further, the fiber resin powder is a powder formed by crushing materials including at least glass fibers and epoxy resin, and the powder has a fiber shape with a certain length.

[0023] Further, the melamine impregnated paper is adhered to the substrate layer by hot pressing, and the glue content of the melamine impregnated paper can make the glue solution on the surface of the melamine impregnated paper penetrate into the substrate layer, and the penetration depth is 0.08-0.3mm.

[0024] Further, the substrate layer further includes a fiber filament, and the fiber filament includes fine short fibers dispersed in the fiber resin powder.

[0025] Further, the length of the short fibers in the fiber filament is 3-20mm.

[0026] Further, the material of the fiber filament includes glass fibers.

[0027] Further, the substrate layer includes, according to the mass ratio, 20%-60% of glass fibers, 20%-75% of epoxy resin, 0.2-3% of copper particles, and 3%-35% of adhesive.

[0028] Further, the fiber resin powder is a powder formed by crushing the PCB circuit board through a process including crushing and metal separation.

[0029] Further, the adhesive is one or more of isocyanate adhesive, melamine resin adhesive, acrylate adhesive, and polyurethane adhesive.

[0030] Further, the decorative layer is attached to the upper side of the substrate layer by hot pressing.

[0031] Further, the balancing layer includes melamine impregnated paper, and is attached to the lower side of the substrate layer by hot pressing.

[0032] The reinforced splicing plate includes a decorative layer, a substrate layer, and a balancing layer.

[0033] The decorative layer is connected to the upper side of the substrate layer and includes melamine impregnated paper.

[0034] The substrate layer includes 0.15-1.4mm of fiber resin powder and 3-15mm of fiber filament, and the fiber resin powder and the fiber filament are adhered by adhesive.

[0035] The balancing layer is connected to the lower side of the substrate layer.

[0036] Further, the main components of the fiber resin powder and the fiber filament are glass fibers and epoxy resin.

[0037] Further, the fiber resin powder is mixed with copper particles, and at least part of the copper particles have a particle size of 0.5-1.4 mm.

[0038] Further, the melamine impregnated paper is hot-pressed and bonded with the substrate layer, so that the glue solution on the surface of the melamine impregnated paper penetrates into the substrate layer, and the penetration depth is 0.11-0.25 mm.

[0039] Further, the penetration depth is 0.12-0.18 mm.

[0040] The reinforced splicing plate of the present application has a clamping groove formed on the side surface of the splicing plate for connecting adjacent splicing plates, and the splicing plate comprises a decorative layer, a substrate layer and a balancing layer.

[0041] The decorative layer is connected to the upper side of the substrate layer and comprises melamine impregnated paper.

[0042] The substrate layer comprises 0.15-1.4 mm fiber resin powder and 3.2-18 mm fiber filament, and the fiber resin powder and the fiber filament are bonded by an adhesive; the fiber resin powder is formed by a powder obtained by crushing and separating metal from a PCB circuit board.

[0043] The balancing layer comprises melamine impregnated paper and is connected to the substrate layer by hot pressing.

[0044] Further, a certain amount of copper metal is reserved during the process of separating metal from the PCB circuit board, so that copper particles with a particle size of 0.6-1.6 mm are formed in the fiber resin powder.

[0045] 3. Beneficial effects

[0046] Compared with the prior art, the beneficial effects of the present application are:

[0047] (1) The substrate layer of the floor board of the present application is formed by bonding 0.2-1.5 mm fiber resin powder, and the powder with this particle size is connected to each other in a staggered manner, thereby improving the strength of the board and having better crack resistance; in addition, the copper particles contained therein can reduce the porosity in the substrate and improve the density of the substrate layer, thereby further enhancing the strength of the board.

[0048] (2) The substrate layer of the floor board of the present application further comprises fiber filament, and the fiber filament comprises short fibers in the form of fine filaments, which are dispersed in the fiber resin powder, and the length of the short fibers is 3-20 mm, which plays a connecting role and strengthens the connection between the powders, thereby significantly improving the use stability of the reinforced board in a humid environment.

[0049] (3) the glass fiber and epoxy resin component in the substrate layer of the application can be derived from materials obtained from recycling waste circuit boards, which can be directly used to replace traditional fiber boards in waterproof floors after hot pressing, turning waste into treasure, and the waterproof reinforced floor obtained has extremely low water absorption expansion rate and strong waterproof performance, expanding the application range. BRIEF DESCRIPTION OF DRAWINGS

[0050] Figure 1 is a schematic diagram of the composition structure of the floor board;

[0051] Figure 2 is a scanning electron microscope (SEM) image of a fiber resin powder;

[0052] Figure 3 is a scanning electron microscope (SEM) image of a local structure in the substrate layer;

[0053] Figure 4 is a scanning electron microscope (SEM) image of a local area in the substrate layer;

[0054] Figure 5 is a scanning electron microscope (SEM) image of a local microstructure in the substrate layer;

[0055] Figure 6 is a schematic diagram of a clamping groove structure of a spliced board. DETAILED DESCRIPTION

[0056] The application will be further described below in conjunction with specific embodiments.

[0057] The structures, proportions, sizes, etc. shown in the drawings of the specification are only used to cooperate with the content disclosed in the specification, to be understood and read by those skilled in the art, and do not define the limiting conditions under which the application can be implemented, so they do not have technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect and purpose that the application can produce, should still fall within the scope of the technical content disclosed by the application. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and the like used in the specification are only for the convenience of clear understanding and description, and are not used to limit the scope of implementation. The change or adjustment of the relative relationship, without substantially changing the technical content, is also considered as the implementation scope of the application.

[0058] The embodiment provides a floor board, as shown in Figure 1 The floor board comprises a decorative layer 100, a substrate layer 200 and a balancing layer 300; wherein the decorative layer is connected to the upper side of the substrate layer and comprises melamine impregnated paper with a thickness of 0.05-0.30 mm.

[0059] Melamine impregnated paper is paper impregnated in melamine solution, through water evaporation and chemical reaction to form a hard polymer surface, which can be glued to the board through hot pressing.

[0060] The substrate layer is formed by the adhesion of fiber resin powder with a particle size of 0.2-1.5 mm, and the copper particles are uniformly mixed in the fiber resin powder, and after pressing, the copper particles are dispersed in the substrate layer. The lower side of the substrate layer is adhered to the balance layer.

[0061] The decorative layer is attached to the upper side of the substrate layer, and is generally attached to the upper surface of the substrate layer by hot pressing. The thickness of the decorative layer is generally controlled to be 0.05-0.2 mm, and the thickness of the floor board can be further controlled to be 0.06-0.14 mm when used as a floor.

[0062] The decorative layer can be composed of multiple layers of materials, such as adding a fire-resistant layer, a wear-resistant layer, etc., and the multiple layers of materials can be combined with the melamine impregnated paper to form a combination. When a multi-layer combination structure is used, the thickness after pressing is 0.15-0.30 mm. In addition, other materials can be combined on the basis of the board, such as adding a wood grain layer, a bamboo skin, a softwood layer, and a decorative plastic layer, etc., which can be combined by adhesive means, and a certain pattern can be formed on the surface of the board to achieve a decorative effect of the board.

[0063] Of course, melamine impregnated paper with a certain pattern can also be used directly, and hot pressed on the upper surface of the substrate layer to form a decorative layer, with a thickness of about 0.6-0.1 mm.

[0064] The paper in the melamine impregnated paper can have a small thickness, and after impregnation, the thickness will increase, and the different impregnation amounts will change the weight per unit area of the melamine impregnated paper.

[0065] The substrate layer plays a major role in supporting strength, and also has good waterproofness and certain fireproof effect. In this embodiment, the substrate layer is formed by the adhesion of fiber resin powder with a length of 0.2-1.5 mm by adhesive, i.e. mixing the fiber resin powder with the adhesive, and forming a certain thickness of the board by applying pressure.

[0066] The fiber resin powder referred to here does not require a spherical structure, as shown in Figure 2 The powder is crushed to be granular, with a certain length, and the length is in the range of 0.2-1.5 mm. As a further limitation, the particle size of the powder can be in the range of 0.4-1.2 mm. The fiber resin powder can be embedded and adhered to each other during adhesion.

[0067] The fiber resin powder is a powder formed by crushing materials containing at least glass fiber and epoxy resin. In implementation, a base material is first formed by combining glass fiber and epoxy resin, and then the base material is crushed to obtain the fiber resin powder.

[0068] Based on cost and environmental factors, in some embodiments, the fiber resin powder is formed by a powder obtained by crushing and separating metal from a PCB circuit board.

[0069] The PCB circuit board here can be recycled circuit board scraps containing glass fiber and epoxy resin. After crushing the PCB circuit board, the contained metal is separated to form the required material. In some processes, grinding of the crushed powder is also included to meet certain particle size requirements.

[0070] In some existing solutions, there are solutions that use PCB circuit board scraps to recycle and rework as floor materials.

[0071] As disclosed in patent 201910396221.8, a fireproof and waterproof composite floor and decorative board is made of a composite floor and decorative board made of recycled waste electronic circuit board PCB powder, plastic, magnesium sulfate, adhesive, etc.

[0072] Patent 201710008279.1 discloses a composite epoxy resin board, in which 5% to 100% of waste prepreg powder and 0 to 95% of waste electronic circuit board powder are used. This solution uses waste prepreg as the main raw material. Since the content of epoxy resin in the prepreg is very high, and the epoxy resin has excellent bonding strength, it can replace other adhesive binders. Not only does it reduce the use of adhesive binders, but it also eliminates the need for adhesive binders. Moreover, it reduces the mixing time during the forming process and simplifies the forming process.

[0073] Both of the above two existing solutions use PCB circuit boards as part of the material for the base material. However, experiments have shown that such boards have good bonding strength, but are prone to cracking when soaked in water. According to analysis, the main reason is that after recycling the metal from the PCB circuit board, the powder is sold directly. The particle size of such powder is generally 1.8mm. Due to the large particle size of the powder, there are some pores inside the board after pressing, which has good performance as an ordinary board, but when used as a floor, it will crack when wet.

[0074] In addition, the large size of the powder makes the surface of the pressed board rough, and the amount of glue that can penetrate during hot pressing is small, resulting in relatively poor adhesion between the surface decorative layer.

[0075] When the powder with small particle size is used, for example, the particle size is controlled within 0.1 mm, the structure is closer to a spherical structure, although the density is increased and the compaction is better, the overall structural strength is reduced and the product is more likely to be broken.

[0076] When the fiber resin powder with the particle size of 0.2-1.5 mm is used, the powder particles are interlaced and embedded like fibers, the density is increased compared with the powder with large particle size, and the strength is maintained compared with the powder with smaller particle size, so that the fiber resin powder is not easy to be broken.

[0077] Figure 3 、 Figure 4 The electron microscope image of the substrate layer at 100 um is shown; Figure 5 The electron microscope image of the part area at 50 um is shown.

[0078] When the powder with the particle size of 0.2-1.5 mm is used, the fiber resin powder is easy to deform and form pores. The copper particles contained in the powder have rigidity and hardness, which can extrude the fiber resin powder in the glue solution, facilitate the gas to be discharged, reduce the possibility of gas hole retention, improve the compaction, and form a certain skeleton effect to increase the strength. In addition, copper has good thermal conductivity and extremely low water absorption and expansion rate, which can improve the performance of the board.

[0079] The balance layer can prevent the moisture in the cement floor from eroding into the reinforced floor, and can also balance the stress in the substrate layer together with the wear-resistant layer. The melamine impregnated paper can be attached by hot pressing, or other material layers can be overlaid, or the balance board of other materials such as kraft paper can be attached by gluing.

[0080] In some embodiments, the melamine impregnated paper contains aluminum oxide to increase the wear resistance, and the decorative layer can be appropriately increased in thickness, for example, to 0.6-1.8 mm. When used as a floor, it is required to have good wear resistance, and the melamine impregnated paper containing aluminum oxide has enhanced wear resistance.

[0081] In other embodiments, the decorative layer further includes an aluminum oxide wear-resistant paper disposed on the upper side of the melamine impregnated paper. Further, the thickness of the decorative layer can be controlled to be 0.7-1.8 mm.

[0082] Based on the embodiment, the provided floor includes an aluminum oxide wear-resistant paper, a melamine impregnated paper, a substrate layer, and a balance layer, wherein the wear-resistant paper improves the performance of the board, the melamine impregnated paper can obtain the required floor pattern to be displayed, and the balance layer is used to ensure the stability after installation.

[0083] The copper particles in the substrate layer are uniformly distributed, and some copper particles also exist on the surface of the substrate layer. After the decorative layer is laminated, some copper particles will react with carbon dioxide in the humid air to form copper green, which will form dark spots on the surface of the decorative layer. In the above embodiments, the thickness of the decorative layer is controlled to be 0.6-1.8 mm, the surface thickness is increased, and the possibility of copper green formation is reduced, and the visibility of copper green is also reduced. In specific implementation, the thickness can be 0.6 mm, 0.8 mm, 1.2 mm, 1.5 mm, etc.

[0084] In some embodiments, the melamine impregnated paper is hot-pressed and bonded with the substrate layer. The melamine impregnated paper has a certain amount of glue, which can make the glue on the surface of the melamine impregnated paper penetrate into the substrate layer, and the penetration depth is 0.08-0.3 mm. Generally, it can be controlled within 0.10-0.25 mm.

[0085] When the thickness of the surface decorative layer is large, the paper bonding performance will decrease in the subsequent hot-pressing process of the formed laminate flooring, which can easily cause the surface of the board to bubble or burst. If the thickness is small, copper green is easy to grow and appear. Especially for the decorative layer with texture on the surface, after hot-pressing, the thickness of the concave part of the texture is small, and copper green is easy to appear. In view of this situation, the glue content of the melamine impregnated paper can be increased, and more sol can penetrate into the substrate layer after hot-pressing, so that the surface of the substrate layer is further coated, thereby reducing the possibility of copper particles generating copper green, and more easily protecting the appearance of the board.

[0086] In specific implementation, the penetration amount can be controlled by controlling the pressing force and holding time. For ordinary laminate flooring, the penetration depth is generally within 0.06 mm, mainly playing a connecting role. The present application avoids the generation of copper green by increasing the penetration amount, and allows finer powders to be bonded.

[0087] In terms of the composition of the substrate layer, the powders can mainly consist of epoxy resin materials, the epoxy resin accounts for 80% by mass, 10% of glass fibers are added, and 1.5% of copper particles are added, which are bonded by an adhesive and then pressed together for a certain holding time to harden and form a board.

[0088] In some embodiments, the fiber resin powders include, by mass, 10%-50% of glass fibers, 30%-75% of epoxy resin, 0.2%-3% of copper particles, and 3%-35% of adhesive. For example, the glass fibers are 35%, the epoxy resin is 50%, the copper particles are 0.8%, the adhesive is 13%, and the rest is other impurities.

[0089] As some embodiments, the adhesive in the substrate layer is one or more of isocyanate adhesive, melamine resin adhesive, acrylate adhesive, polyurethane adhesive, urea-formaldehyde resin adhesive, phenol-formaldehyde resin adhesive, polyvinyl acetate adhesive, polyvinyl alcohol adhesive.

[0090] As another embodiment, the substrate layer further comprises a fiber strand, which comprises fine filament short fibers dispersed in a fiber resin powder. The material of the fiber strand can be the same as that of the fiber powder, including glass fiber and epoxy resin. In another embodiment, the glass fiber can also be other fiber materials.

[0091] The short fiber referred to herein means that it is in a filamentous form with a cross-sectional length of less than 0.5 mm. The length of the short fiber in the fiber strand is 3-20 mm, or further controlled to be 5-18 mm.

[0092] The fiber resin powder has a certain length, and after the fiber strand is added, a mixture of the powder and the filamentous material is formed. In the pressed substrate layer, the short fiber can play a stronger pulling role to embed the powder, thereby further improving the strength and avoiding cracking or breaking of the substrate layer.

[0093] In some embodiments, the substrate layer comprises 0.3-1.6 mm of fiber resin powder, 4-12 mm of short fiber, 0.6-1.0 mm of copper particles, and is bonded by an adhesive to form a plate. As an extension, it is not excluded that there are some smaller size powders in the substrate layer, as well as dispersed fine copper powder, even nano copper powder for increasing stability.

[0094] In terms of material composition, as one embodiment, the glass fiber is 45%, the epoxy resin is 40%, the copper particles are 1.5%, the adhesive is 12%, and the rest is other additives or impurities. The glass fiber can include the glass fiber in the fiber resin powder and the subsequently added glass fiber short fiber.

[0095] In some embodiments of the mass ratio of the plate, the ratio of the resin fiber powder to the fiber strand is (7-9):(3-1).

[0096] As a specific embodiment, the fiber resin powder is formed by a powder formed after the PCB circuit board is subjected to a process including crushing and metal separation. In the process of making the powder, appropriate antioxidants, cross-linking agents and other substances can be added, and the existing related PCB circuit board waste recycling technology can be referred to. In the process of making the powder, the particle size requirements of the above fiber resin powder embodiments need to be met.

[0097] When the floor plate is used as a product, the embodiment provides a reinforced splicing plate, and a clamping groove is formed on the side surface of the splicing plate,Figure 6 As shown, for the connection between adjacent spliced panels, the spliced panel comprises: a decorative layer, a substrate layer and a balancing layer; wherein,

[0098] The decorative layer is connected to the upper side of the substrate layer and comprises melamine impregnated paper; the melamine impregnated paper is hot-pressed and adhered to the substrate layer, so that the glue solution on the surface of the melamine impregnated paper penetrates into the substrate layer, and the penetration depth is not less than 0.11 mm, for example, 0.12 mm, 0.16 mm, 0.17 mm.

[0099] The substrate layer comprises 0.15-1.4 mm of fiber resin powder and 3.2-18 mm of fiber silk material, and the fiber resin powder and the fiber silk material are adhered by an adhesive;

[0100] The balancing layer is connected to the lower side of the substrate layer.

[0101] The clamping groove opened on the side surface of the spliced panel adopts the existing mortise and tenon structure, so that the two adjacent panels can be spliced with each other. This technology has been applied in existing floor panels, and will not be described again.

[0102] In an embodiment, the fiber resin powder is mixed with copper particles, at least part of the copper particles have a particle size of 0.5-1.4 mm, and the penetration depth is 1.0-1.8 mm.

[0103] In another embodiment, the substrate layer comprises 0.3-1.2 mm of fiber resin powder and 4-12 mm of fiber silk material, and the fiber resin powder and the fiber silk material are adhered by an adhesive. The fiber resin powder is formed by a powder obtained after the PCB circuit board is subjected to a process comprising crushing and metal separation; during the metal separation process, a certain amount of copper metal is reserved in the PCB circuit board, so that the copper particles with a particle size of 0.6-1.6 mm are formed in the fiber resin powder.

[0104] The PCB circuit board contains copper, and generally, as much copper metal as possible is removed during recycling. Since copper particles are required in the present application, a certain amount of copper can be reserved during the removal of copper metal, so as to achieve the purpose of containing copper particles in the fiber resin powder.

[0105] Further, in some embodiments, in order to maintain the copper content and particle size, a part of copper particles can also be additionally added.

[0106] Since the PCB circuit board contains a large amount of metal copper, generally, the PCB circuit board is subjected to recycling and processing, and the metal copper is extracted as much as possible after crushing. However, due to the difficulty in completely removing the copper metal, a part of copper powder with a particle size of less than 0.1 mm still exists in the powder, and this part of copper will produce copper green, but it is difficult to improve the strength of the panel.

[0107] Thus, when using PCB circuit boards as a source of fiber resin powder, the final copper particle size can be controlled by reserving. In the above examples, small particle size copper particles can also be added to meet the requirements.

[0108] The above description of the application and its embodiments is illustrative and not restrictive, and the embodiments shown in the drawings are only one of the embodiments of the application, and the actual structure is not limited thereto. Therefore, if a person skilled in the art is inspired by it, without departing from the purpose of the application, similar structural forms and embodiments can be designed without creativity, which should belong to the protection scope of the application.

Claims

1. A flooring material, characterized in that, include: The layers consist of a decorative layer, a substrate layer, and a balancing layer; among which... A decorative layer, attached to the upper side of the substrate layer, includes melamine-impregnated paper with a thickness of 0.05 to 0.30 mm; The substrate layer comprises fiber resin powder with a length of 0.2 to 1.5 mm. The fiber resin powder is formed by crushing a material containing at least glass fiber and epoxy resin and bonding it with an adhesive to form a plate-like structure. Copper particles are uniformly mixed in the fiber resin powder. At least some of the copper particles have a particle size of 0.2 to 1.6 mm. The substrate layer further includes fiber filaments, which consist of short, fine fibers dispersed in fiber resin powder. The length of the short fibers is 3 to 20 mm. The substrate layer comprises, by weight percentage: 20% to 60% glass fiber, 20% to 75% epoxy resin, 0.2% to 3% copper particles, and 3% to 35% adhesive. A balancing layer is attached to the underside of the substrate layer; The melamine-impregnated paper is hot-pressed to the substrate layer, and the adhesive content of the melamine-impregnated paper is such that the adhesive on the surface of the melamine-impregnated paper can penetrate into the substrate layer, with a penetration depth of 0.08 to 0.3 mm.

2. The flooring material according to claim 1, characterized in that: The melamine-impregnated paper contains aluminum oxide, and the decorative layer has a thickness of 0.08–0.15 mm. or: The decorative layer also includes alumina abrasion-resistant paper, which is disposed on the upper side of the melamine-impregnated paper.

3. The flooring material according to claim 1, characterized in that: The material of the fiber filaments includes glass fiber.

4. The flooring material according to claim 1, characterized in that: The fiber resin powder is formed from PCB circuit boards through processes including crushing and metal separation.

5. A flooring material according to claim 1, characterized in that: The adhesive is one or more of the following: isocyanate adhesive, melamine resin adhesive, acrylate adhesive, and polyurethane adhesive.

6. A flooring material according to claim 1, characterized in that: The decorative layer is bonded to the upper side of the substrate layer by hot pressing.

7. A flooring material according to claim 1, characterized in that: The balancing layer comprises melamine-impregnated paper, which is bonded to the underside of the substrate layer by hot pressing.

8. A reinforced splicing panel, wherein a slot is provided on the side of the splicing panel for connecting adjacent splicing panels, characterized in that, The splicing panel includes: a decorative layer, a substrate layer, and a balancing layer; among which, A decorative layer, attached to the upper side of the substrate layer, includes melamine-impregnated paper; The substrate layer includes 0.15-1.4 mm fiber resin powder and 3-15 mm fiber filaments, which are bonded together by an adhesive. The main components of the fiber resin powder and fiber filaments are glass fiber and epoxy resin, and the fiber resin powder is mixed with copper particles, at least some of which have a particle size of 0.5-1.4 mm. A balancing layer is attached to the underside of the substrate layer; The melamine-impregnated paper is hot-pressed to the substrate layer, so that the adhesive on the surface of the melamine-impregnated paper penetrates into the substrate layer, with a penetration depth of 0.11 to 0.25 mm.

9. A reinforced splicing panel according to claim 8, characterized in that: The adhesive penetration depth is 0.12–0.18 mm.

10. A reinforced splicing panel, wherein a slot is provided on the side of the splicing panel for connecting adjacent splicing panels, characterized in that, The splicing panel includes: a decorative layer, a substrate layer, and a balancing layer; among which, A decorative layer, attached to the upper side of the substrate layer, includes melamine-impregnated paper; The substrate layer includes 0.15-1.4 mm fiber resin powder and 3.2-18 mm fiber filaments, which are bonded together by an adhesive. The fiber resin powder is formed from a PCB circuit board through a process that includes crushing and metal separation. During the metal separation process, a certain amount of copper metal is reserved in the PCB circuit board to form the required copper particles in the fiber resin powder. The particle size of the copper particles is 0.6-1.6 mm. The balancing layer contains melamine-impregnated paper, which is bonded to the substrate layer by hot pressing.

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