An LC filter capacitor

Abstract

The application provides an LC filter capacitor, which comprises a base, a first patch magnetic ring inductor, a second patch magnetic ring inductor, a first molded capacitor, a second molded capacitor and a parallel capacitor chip, the first patch magnetic ring inductor is welded between a power input terminal post and a first pad, the first molded capacitor is welded between the first pad and a ground terminal post, the second patch magnetic ring inductor is welded between the first pad and a power output terminal post, the second molded capacitor is welded between the power output terminal post and the ground terminal post, and the first molded capacitor comprises a frame and a plurality of capacitor chips, the frame is provided with a first chip pad and a second chip pad, two functional port pads are formed by upward extension on the first chip pad and the second chip pad, and the parallel capacitor chip is connected between the two functional port pads to be connected in parallel with the first molded capacitor. The application has the advantages of modular design, space saving, reliable welding, convenient use for users and convenient overall testing.

Description

Technical Field

[0001] This invention relates to an LC filter capacitor. Background Technology

[0002] An LC filter is a device that can selectively pass through or suppress signals within a certain frequency range. It can effectively filter out frequencies at a specific frequency or frequencies outside that range, thereby selecting the desired signal from cluttered signals. LC filters have always been core components of radio frequency communication systems, and with the rapid development of wireless communication technology and the increasing scarcity of frequency resources, their importance has become even more prominent.

[0003] In practical applications, designers typically design the LC filter circuit first, and then solder the required capacitors and inductors onto the circuit board. This method has drawbacks: the soldering quality is not stable enough and may have problems, resulting in low circuit reliability. In order to save space, more effort is needed to design the positions of capacitors, inductors and other components, and often the optimal results cannot be obtained, resulting in the LC filter circuit still occupying too much space. Summary of the Invention

[0004] This invention proposes an LC filter capacitor with a modular design that saves space, ensures reliable soldering, is easy for users to use, and makes overall testing more convenient.

[0005] This invention is achieved through the following technical solution:

[0006] An LC filter capacitor includes a base, a first surface-mount magnetic ring inductor, a second surface-mount magnetic ring inductor, a first molded capacitor, a second molded capacitor, and parallel capacitor chips. The base includes an insulating shell, a power input terminal, a power output terminal, a ground terminal, and a first pad disposed within the insulating shell. The first surface-mount magnetic ring inductor is soldered between the power input terminal and the first pad. The first molded capacitor is soldered between the first pad and the ground terminal. The second surface-mount magnetic ring inductor is soldered between the first pad and the power output terminal. The second molded capacitor is soldered between the power output terminal and the ground terminal. The first and second molded capacitors have the same structure. The first molded capacitor includes a frame and several capacitor chips. The frame has a first chip pad and a second chip pad for soldering the capacitor chips to be connected in parallel. Both the first and second chip pads extend upward to form two functional port pads. The parallel capacitor chips are connected between the two functional port pads to be connected in parallel with the first molded capacitor. This invention arranges the surface-mount magnetized inductors and molded capacitors in the most reasonable positions within the base, achieving modularity of the LC filter capacitor and effectively saving space. Customers only need to reserve the space required for the base on the circuit board; there is no need to solder the inductors and capacitors themselves. The connection between this invention and other circuits on the circuit board is completed through the terminals. This makes it more convenient to use and avoids the defects of reduced circuit reliability caused by soldering problems. Furthermore, as a complete LC filter capacitor, it is easier to test as a whole. Moreover, the functional port pads of each molded capacitor allow for the soldering of appropriate parallel capacitor chips according to actual conditions, thereby easily adjusting the capacitance value of the LC filter capacitor to achieve a more ideal filtering effect.

[0007] Furthermore, it also includes a second pad disposed within an insulating housing, a third and fourth surface-mount magnetic ring inductor corresponding to the first and second surface-mount magnetic ring inductors respectively, and a third and fourth molded capacitor corresponding to the first and second molded capacitors respectively. The power input terminals include a positive power input terminal and a negative power input terminal, and the power output terminals include a positive power output terminal and a negative power output terminal. The first surface-mount magnetic ring inductor is soldered between the positive power input terminal and the first pad, the second surface-mount magnetic ring inductor is soldered between the first pad and the positive power output terminal, the third surface-mount magnetic ring inductor is soldered between the negative power input terminal and the second pad, the fourth surface-mount magnetic ring inductor is soldered between the second pad and the negative power output terminal, the third molded capacitor is soldered between the second pad and the ground terminal, and the fourth molded capacitor is soldered between the negative power output terminal and the ground terminal. The third and fourth molded capacitors have the same structure as the first molded capacitor, which can further improve the filtering effect.

[0008] Furthermore, the insulating shell has a groove, which has a main groove for arranging the first to fourth patch magnetic ring inductors and the first to fourth molded capacitors, and extension grooves respectively arranged at the four corners of the main groove for arranging positive power input terminals, negative power input terminals, positive power output terminals and negative power output terminals. The insulating shell also forms a separation portion extending into the main groove to separate the first patch magnetic ring inductor and the fourth patch magnetic ring inductor. The design is reasonable and ensures that each component of the LC filter capacitor is arranged in the most reasonable position inside the insulating shell, saving space to the maximum extent.

[0009] Furthermore, the base also includes two mounting portions disposed at both ends of the insulating shell, and mounting holes are provided on the mounting portions to facilitate fixing the base to the circuit board.

[0010] Furthermore, the base is made of plastic material.

[0011] Furthermore, the power input terminal, power output terminal, and ground terminal all extend outward through the insulating housing base plate, facilitating wiring between the present invention and other circuits on the circuit board.

[0012] Furthermore, a horizontally extending ground pad is provided in the middle of the insulating housing base plate, and the ground terminal is provided on the ground pad. Input pads and output pads are respectively provided at the ends of the insulating housing base plate, and the power input terminal and power output terminal are respectively provided on the input pad and output pad, which makes it more convenient to solder each surface mount magnetic ring inductor and each molded capacitor.

[0013] Furthermore, the height of the mounting part is lower than the height of the insulating shell, resulting in a more aesthetically pleasing appearance.

[0014] Furthermore, the capacitor chip is a low-frequency capacitor chip, and the parallel capacitor chip is a high-frequency capacitor chip, which effectively improves the filtering effect. Attached Figure Description

[0015] The present invention will now be described in further detail with reference to the accompanying drawings.

[0016] Figure 1 This is a schematic diagram of the structure of the present invention.

[0017] Figure 2 This is another structural schematic diagram of the present invention.

[0018] Figure 3 This is the circuit schematic diagram of the present invention.

[0019] Figure 4 This is a schematic diagram of the structure of the base of the present invention.

[0020] Figure 5 This is a schematic diagram of the structure of the first molded capacitor of the present invention.

[0021] Figure 6 This is another structural schematic diagram of the first molded capacitor of the present invention (with the plastic casing removed).

[0022] Figure 7 This is a schematic diagram of the frame structure of the first molded capacitor of the present invention.

[0023] The components include: 1. Base; 11. Insulating shell; 111. Main body groove; 112. Extension groove; 113. Separator; 12. Mounting part; 121. Mounting hole; 131. Positive power input terminal; 132. Negative power input terminal; 133. Positive power output terminal; 134. Negative power output terminal; 135. Input pad; 136. Output pad; 14. Ground terminal; 141. Ground pad; 151. First pad; 152. Second pad; 21. First surface mount magnetic ring inductor; 22. Second surface mount magnetic ring inductor. 23. Third surface mount magnetic ring inductor; 24. Fourth surface mount magnetic ring inductor; 31. First molded capacitor; 311. Plastic encapsulation shell; 312. First chip pad; 3121. First solder rod; 313. Second chip pad; 3131. Second solder rod; 314. Capacitor pad; 315. Functional port pad; 3151. Vertical bar; 3152. Horizontal bar; 3153. Soldering part; 316. Capacitor chip; 32. Second molded capacitor; 33. Third molded capacitor; 34. Fourth molded capacitor; 4. Parallel capacitor chip. Detailed Implementation

[0024] like Figures 1 to 7As shown, the LC filter capacitor includes a base 1, a first surface-mount magnetic ring inductor 21, a second surface-mount magnetic ring inductor 22, a third surface-mount magnetic ring inductor 23, a fourth surface-mount magnetic ring inductor 24, a first molded capacitor 31, a second molded capacitor 32, a third molded capacitor 33, a fourth molded capacitor 34, and a parallel capacitor chip 4. The base 1 includes an insulating shell 11, two mounting portions 12 disposed at both ends of the insulating shell 11, a positive power input terminal 131, a negative power input terminal 132, a positive power output terminal 133, a ground pad 141, a ground terminal 14, a first pad 151, a second pad 152, two input pads 135, and two output pads 136 disposed within the insulating shell 11. In this embodiment, the height of the mounting part 12 is lower than the height of the insulating shell 11. The insulating shell 11 is rectangular. The width of the two mounting parts 12 gradually decreases from the inside to the outside. The mounting parts 12 are provided with mounting holes 121 at their ends. The base 1 can be fixed on the circuit board through the mounting holes 121. The two mounting parts 12 and the insulating shell 11 are integrally formed. The insulating shell 11 is made of plastic material and has a groove. The groove has a main groove 111 for arranging the first patch magnetic ring inductor 21, the second patch magnetic ring inductor 22, the third patch magnetic ring inductor 23, the fourth patch magnetic ring inductor 24, the first molded capacitor 31, the second molded capacitor 32, the third molded capacitor 33, and the fourth molded capacitor 34, and four extension grooves 112 respectively arranged at the four corners of the main groove 111 for arranging the positive power input terminal 131, the negative power input terminal 132, the positive power output terminal 133, and the negative power output terminal 134. The insulating shell 11 also forms a separation portion 113 extending into the main groove 111 to separate the first patch magnetic ring inductor 21 and the fourth patch magnetic ring inductor 24. Ground pad 141 is laterally extended in the middle of the bottom plate of insulating housing 11. Ground terminal 14 is disposed on ground pad 141 and extends outward through the bottom plate of insulating housing 11. First pad 151 and second pad 152 are disposed alternately on the bottom plate of insulating housing 11. Ground pad 141 is located between the first pad 151 and the second pad 152. Two input pads 135 and two output pads 136 are respectively disposed in four extension slots 112. Positive power input terminal 131 and negative power input terminal 132 are respectively disposed on the two input pads 135. Positive power output terminal 133 and negative power output terminal 134 are respectively disposed on the two output pads 136. Positive power input terminal 131, negative power input terminal 132, positive power output terminal 133 and negative power output terminal 134 all pass through the bottom plate of insulating housing 11 and extend outward.

[0025] The first surface-mount magnetic ring inductor 21 corresponds to the third surface-mount magnetic ring inductor 23, the second surface-mount magnetic ring inductor 22 corresponds to the fourth surface-mount magnetic ring inductor 24, the first molded capacitor 31 corresponds to the third molded capacitor 33, the second molded capacitor 32 corresponds to the fourth molded capacitor 34, the first surface-mount magnetic ring inductor 21 is soldered between the positive power input terminal 131 and the first pad 151, the second surface-mount magnetic ring inductor is soldered between the first pad 151 and the positive power output terminal 133, and the third surface-mount magnetic ring inductor 23 is soldered... Between the negative power input terminal 132 and the second pad 152, the fourth surface-mount magnetic ring inductor 24 is soldered between the second pad 152 and the negative power output terminal 134. The first molded capacitor 31 is soldered between the first pad 151 and the ground terminal 14. The second molded capacitor 32 is soldered between the power output terminal and the ground terminal 14. The third molded capacitor 33 is soldered between the second pad 152 and the ground terminal 14. The fourth molded capacitor 34 is soldered between the negative power output terminal and the ground terminal 14. The first surface-mount magnetic ring inductor 21, the second surface-mount magnetic ring inductor 22, the third surface-mount magnetic ring inductor 23, and the fourth surface-mount magnetic ring inductor 24 have the same structure, each with an inductor pad at one end, and the end without an inductor pad is not in contact with the ground pad 141.

[0026] The first molded capacitor 31, the second molded capacitor 32, the third molded capacitor 33, and the fourth molded capacitor 34 have the same structure. In this embodiment, the first molded capacitor 31 is used as an example. The first molded capacitor 31 includes a plastic-encapsulated shell 311 made of epoxy molding compound, a frame disposed within the plastic-encapsulated shell 311, and a plurality of capacitor chips 316. The frame includes a first chip pad 312 and a second chip pad 313 arranged at intervals, two capacitor pads 314 extending downward from the first chip pad 312 and the second chip pad 313 respectively, and two functional port pads 315 extending upward from the first chip pad 312 and the second chip pad 313 respectively. Each capacitor chip 316 is soldered between the first chip pad 312 and the second chip pad 313. The two capacitor pads 314 and the two functional port pads 315 extend outward from the plastic-encapsulated shell 311.

[0027] The functional port pad 315 includes a vertical strip 3151, a horizontal strip 3152 extending horizontally from the upper end of the vertical strip 3151, and a welding portion 3153 extending horizontally from the end of the horizontal strip 3152. The lower ends of the vertical strips 3151 of the two functional port pads 315 are respectively disposed on the first chip pad 312 and the second chip pad 313. The first chip pad 312 includes two first solder bars 3121 arranged horizontally at intervals, and the second chip pad 313 includes a second solder bar 3131 located between the two first solder bars 3121.

[0028] The first molded capacitor 31 is soldered between the first pad 151 and the ground terminal 14 via capacitor pad 314. Parallel capacitor chips 4 are soldered between the two functional port pads 315. Capacitor chip 316 is a low-frequency ceramic capacitor chip 316, and parallel capacitor chip 4 is a high-frequency ceramic capacitor chip 316. The capacitance and number of parallel capacitor chips 4 soldered to the first molded capacitor 31, second molded capacitor 32, third molded capacitor 33, and fourth molded capacitor 34 can be adjusted according to the actual needs of the circuit to achieve the desired filtering effect.

[0029] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the specification of the present invention should still fall within the scope of the patent of the present invention.

Claims

1. An LC filter capacitor, characterized in that: The system includes a base, a first surface-mount magnetic ring inductor, a second surface-mount magnetic ring inductor, a first molded capacitor, a second molded capacitor, and parallel capacitor chips. The base includes an insulating housing, a power input terminal, a power output terminal, a ground terminal, and a first pad disposed within the insulating housing. The first surface-mount magnetic ring inductor is soldered between the power input terminal and the first pad. The first molded capacitor is soldered between the first pad and the ground terminal. The second surface-mount magnetic ring inductor is soldered between the first pad and the power output terminal. The second molded capacitor is soldered between the power output terminal and the ground terminal. The first molded capacitor... The first molded capacitor has the same structure as the second molded capacitor. It includes a frame and several capacitor chips. The frame has first and second chip pads for soldering the capacitor chips in parallel. Both the first and second chip pads extend upwards to form two functional port pads. Parallel capacitor chips are connected between the two functional port pads to be connected in parallel with the first molded capacitor. It also includes a second pad disposed within an insulating shell, a third and a fourth surface-mount magnetic ring inductor corresponding to the first and second surface-mount magnetic ring inductors respectively, and a third molded capacitor corresponding to the first and second molded capacitors respectively. The device and the fourth molded capacitor, the power input terminals include a positive power input terminal and a negative power input terminal, the power output terminals include a positive power output terminal and a negative power output terminal, the first surface-mount magnetic ring inductor is soldered between the positive power input terminal and the first pad, the second surface-mount magnetic ring inductor is soldered between the first pad and the positive power output terminal, the third surface-mount magnetic ring inductor is soldered between the negative power input terminal and the second pad, the fourth surface-mount magnetic ring inductor is soldered between the second pad and the negative power output terminal, and the third molded capacitor is soldered between the second pad and the ground connection. Between the posts, the fourth molded capacitor is welded between the negative power output terminal and the ground terminal. The third and fourth molded capacitors have the same structure as the first molded capacitor. The insulating shell has a groove, which has a main groove for setting the first to fourth patch magnetic ring inductors and the first to fourth molded capacitors, and extension grooves respectively set at the four corners of the main groove for setting the positive power input terminal, negative power input terminal, positive power output terminal and negative power output terminal. The insulating shell also forms a separation portion that extends into the main groove to separate the first patch magnetic ring inductor and the fourth patch magnetic ring inductor.

2. The LC filter capacitor according to claim 1, characterized in that: The base also includes two mounting portions disposed at both ends of the insulating shell, and mounting holes are provided on the mounting portions.

3. An LC filter capacitor according to claim 1, characterized in that: The base is made of plastic.

4. An LC filter capacitor according to claim 2, characterized in that: The power input terminal, power output terminal, and ground terminal all extend outward through the bottom plate of the insulating housing.

5. An LC filter capacitor according to claim 1, 2, or 3, characterized in that: The insulating housing base plate has a horizontally extending ground pad in the middle, and the ground terminal is set on the ground pad. The insulating housing base plate has an input pad and an output pad at its ends, and the power input terminal and the power output terminal are set on the input pad and the output pad, respectively.

6. An LC filter capacitor according to claim 4, characterized in that: The height of the mounting section is lower than the height of the insulating outer shell.

7. An LC filter capacitor according to claim 1, 2, or 3, characterized in that: The capacitor chip is a low-frequency capacitor chip, and the parallel capacitor chip is a high-frequency capacitor chip.

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