Substrate transport system and method of using the same

Abstract

Disclosed herein are systems and methods related to a transfer chamber for an electronic device processing system. The transfer chamber includes a magnetic levitation platform having a magnetic levitation track disposed along a length of the transfer chamber and configured to generate a magnetic field above the track. The transfer chamber also includes a magnetic levitation track disposed along a width of the transfer chamber such that a plane of the transverse track intersects a plane of the longitudinal track at an interface. The transverse track is configured to generate a magnetic field above or below the track. The platform further includes at least one substrate carrier configured to move along the longitudinal track and the transverse track. The substrate carrier is also configured to rotate at the interface.

Description

Technical Field

[0001] This disclosure generally relates to the field of robotics. In particular, it relates to a substrate transport system for transporting substrates between process chambers within an isolated environment. The substrates can be transported using a magnetic levitation platform within a transport housing. A method for using such a magnetic levitation platform within the transport chamber is also disclosed. Background Technology

[0002] Semiconductor devices are formed on a substrate through numerous process steps within one or more process chambers of a semiconductor manufacturing system. Each process chamber performs one or more distinct steps (e.g., etching, polishing, deposition, etc.) to form the semiconductor device. The process chambers are maintained under a vacuum. A substrate transport system, also maintained under a vacuum, can interconnect the process chambers and move substrates between them without interrupting the vacuum. Some substrate transport systems have linear and rectangular arrangements, such that the process chambers are positioned along each side of the transport chamber.

[0003] A substrate transport system using a linear arrangement typically includes a conveyor belt with a rectangular top surface, and a process chamber located on one or opposite side of the conveyor belt. The conveyor belt may be connected to one or more loading locking mechanisms to maintain a vacuum environment within the transport system. The substrate is placed in and removed from the loading locking mechanism, which only opens to the transport chamber under vacuum conditions. One or more robots may be positioned near the process chamber and the loading locking mechanisms to transport the substrate between the conveyor belt and the process chamber or loading locking mechanism.

[0004] Traditional substrate carriers are typically limited to moving substrates in only one direction. Options for moving substrates between process chambers and moving them to or from a loading and locking mechanism are limited. Furthermore, conventional substrate carriers may have a large footprint and internal volume to accommodate the conveyor belt. Summary of the Invention

[0005] According to one or more embodiments, a transmission chamber for an electronic device processing system is disclosed herein, the transmission chamber comprising: a magnetic levitation platform, the magnetic levitation platform comprising: a first magnetic levitation track disposed along the length of the transmission chamber and configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed along the width of the transmission chamber, wherein the plane of the second magnetic levitation track intersects the plane of the first magnetic levitation track at a first junction, wherein the second magnetic levitation track is configured to generate a second magnetic field above or below the second magnetic levitation track; and at least one substrate carrier configured to move along the first magnetic levitation track and the second magnetic levitation track, wherein the substrate carrier is configured to rotate at the first junction.

[0006] In one or more embodiments, this document further discloses a transmission chamber for an electronic device processing system, the transmission chamber comprising: a magnetic levitation platform, the magnetic levitation platform comprising: a first magnetic levitation track disposed at a first height within the transmission chamber along the length of the transmission chamber and configured to generate a first magnetic field above the first magnetic levitation track; a second magnetic levitation track disposed at a second height within the transmission chamber along the width of the transmission chamber, wherein the second magnetic levitation track is configured to generate a second magnetic field below the second magnetic levitation track; and at least one substrate carrier configured to move along the first magnetic levitation track and the second magnetic levitation track, wherein the substrate carrier is configured to move from the first magnetic levitation track to the second magnetic levitation track at an intersection between the plane of the first magnetic levitation track and the plane of the second magnetic levitation track.

[0007] In a further embodiment, this document discloses a method for moving one or more substrates in a transfer chamber, the method comprising: retrieving a first substrate from a first process chamber via a first substrate carrier, the first substrate carrier engaging with a first magnetic levitation track disposed along the length of the transfer chamber, wherein the first magnetic levitation track is configured to generate a first magnetic field above the first magnetic levitation track; generating the first magnetic field via the first magnetic levitation track to move the first substrate carrier carrying the first substrate along the first magnetic levitation track in a first direction; rotating the first substrate carrier carrying the first substrate at a first interface formed at an intersection of a plane of a second magnetic levitation track and a plane of the first magnetic levitation track, wherein the second magnetic levitation track is disposed along the width of the transfer chamber and configured to generate a second magnetic field above or below the second magnetic levitation track; and by... The second magnetic levitation track generates the second magnetic field to move the first substrate carrier carrying the first substrate along the second magnetic levitation track in a second direction; rotates the first substrate carrier carrying the first substrate at a second interface, the second interface being formed at the intersection of the plane of the third magnetic levitation track and the plane of the second magnetic levitation track, wherein the third magnetic levitation track is arranged along the length of the transmission chamber and spaced apart from the first magnetic levitation track, and is configured to generate a third magnetic field above the third magnetic levitation track; generates the third magnetic field through the third magnetic levitation track to move the first substrate carrier carrying the first substrate along the third magnetic levitation track in a third direction to a second process chamber, the second process chamber being located on the side of the transmission chamber opposite to the first process chamber; and rotates the first substrate carrier carrying the first substrate and places the first substrate in the second process chamber. Attached Figure Description

[0008] The present disclosure is illustrated by way of example rather than limitation in the accompanying drawings, in which similar reference numerals denote similar elements.

[0009] Figure 1A A top view of a substrate transport system according to various embodiments is depicted.

[0010] Figure 1B A longitudinal side view of a substrate transport system according to various embodiments is depicted.

[0011] Figure 1C A lateral side view of a substrate transport system according to various embodiments is depicted.

[0012] Figure 1D Substrate carriers according to various embodiments are depicted.

[0013] Figure 2A A top view of a magnetic levitation platform according to various embodiments is depicted.

[0014] Figure 2B One embodiment of a substrate carrier used with a magnetic levitation platform, according to various implementation methods, is described.

[0015] Figure 3A One embodiment of a substrate carrier used with a magnetic levitation platform, according to various implementation methods, is described.

[0016] Figure 3B One embodiment of a substrate carrier used with a magnetic levitation platform, according to various implementation methods, is described.

[0017] Figure 3C An embodiment of a magnetic bearing suitable for use with a substrate carrier for magnetic levitation tracks is described according to various implementations.

[0018] Figure 4 One embodiment of a substrate carrier used with a magnetic levitation platform, according to various implementation methods, is described. Figure 5A One embodiment of a substrate carrier used with a magnetic levitation platform, according to various implementation methods, is described.

[0019] Figure 5B One embodiment of a substrate carrier used with a magnetic levitation platform, according to various implementation methods, is described.

[0020] Figure 6 A maglev platform with an upper maglev track and a lower maglev track is depicted according to different implementations.

[0021] Figure 7 One embodiment of a substrate carrier used with a magnetic levitation platform, according to various implementation methods, is described.

[0022] Figure 8 One embodiment of a substrate carrier used with a magnetic levitation platform, according to various implementation methods, is described.

[0023] Figure 9A A perspective view of one embodiment of a substrate carrier used with a magnetic levitation platform, according to various embodiments, is depicted.

[0024] Figure 9B The centering force is described as a function of the lateral position of the centering magnet, which serves as a substrate carrier, according to various embodiments.

[0025] Figure 10 Perspective views of magnetic levitation platforms according to various embodiments are depicted.

[0026] Figure 11 Perspective views of a magnetic levitation platform and substrate carrier according to various embodiments are depicted.

[0027] Figure 12 A method for moving a wafer through a transfer chamber according to various embodiments is shown. Detailed Implementation

[0028] According to embodiments, this document discloses a transfer chamber with a magnetic levitation platform (also referred to herein as a magnetic levitation system) for use in semiconductor manufacturing systems. According to embodiments herein, the transfer chamber with the magnetic levitation platform can have a smaller footprint than conventional transfer systems, provides flexible substrate flow, can have a smaller vacuum volume than conventional transfer systems, and is relatively easy to maintain.

[0029] In some embodiments, the magnetic levitation platform includes a network of magnetic levitation tracks (also referred to herein as "lanes") that can move a substrate from one location within a cavity to another without interrupting the vacuum. The magnetic levitation platform can provide random access to process chambers and loading locking mechanisms connected to, for example, a transfer chamber in which the magnetic levitation platform is located. In some embodiments, the magnetic levitation platform may include one or more longitudinal magnetic levitation tracks running along the length of the cavity and one or more transverse magnetic levitation tracks running along the width of the cavity. In one or more embodiments, the magnetic levitation platform may include two (2) to five (5) longitudinal tracks spaced apart and two (2) to five (5) transverse tracks also spaced apart. The transverse tracks may run at an angle (e.g., about 90°) relative to the longitudinal tracks, such that the plane of each transverse track intersects the plane of each longitudinal track at one or more interfaces. At least one substrate carrier may be configured to move linearly along either a longitudinal track or a transverse track. At the interfaces, the at least one substrate carrier may be configured to switch from a longitudinal track to a transverse track and vice versa, and change direction. The at least one substrate carrier can be configured to rotate at the interface. For example, the at least one substrate carrier can be configured to rotate from about ±90° to about ±180° at one or more interfaces. Regardless of rotation, for example, ±90°, the substrate and carrier can move from a longitudinal track to a parallel longitudinal track via a transverse track. In some embodiments, the substrate and carrier can rotate ±180° at the interface. After such rotation, the substrate carrier can move along the same longitudinal track, but in the opposite direction.

[0030] In one or more embodiments, the height of the one or more longitudinal tracks may differ from the height of the one or more transverse tracks. In at least one embodiment, the one or more transverse tracks may be configured to align with the inlet of the process chamber, while the longitudinal tracks may be configured to span the length of the transfer chamber; for example, one or more of the longitudinal tracks may be aligned with one or more loading locking mechanisms located at the ends of the transfer chamber. At the interface where the planes of the longitudinal tracks and transverse tracks intersect, the substrate carrier may be configured to move vertically from the longitudinal tracks to the transverse tracks and vice versa. Vertical movement may be performed in addition to or instead of rotation. In at least one embodiment, the one or more longitudinal tracks are oriented upwards on the bottom surface of the chamber, and the one or more transverse tracks are oriented downwards on the top surface of the chamber. In at least one embodiment, the one or more longitudinal tracks are oriented downwards on the top surface of the chamber, and the one or more transverse tracks are oriented upwards on the bottom surface of the chamber. The at least one substrate carrier may include a magnet (e.g., a mover) on the top surface for engaging with the one or more top rails, and another magnet (e.g., a mover) on the bottom surface for engaging with the one or more bottom rails.

[0031] According to one or more embodiments, the width of the substrate carrier may be about 300-320 mm, and the length may be about 300-320 mm. The longitudinal and transverse tracks may be spaced apart by at least one suitable distance such that two substrate carriers carrying substrates moving on adjacent longitudinal or transverse tracks will not collide. In some embodiments, the longitudinal tracks may be spaced apart by about 350 mm to about 450 mm, or any individual value or subrange within this range. In some embodiments, the transverse tracks may be spaced apart by about 900 mm to about 1000 mm, or any individual value or subrange within this range, including about 914 mm.

[0032] In at least one embodiment, the bottom surface of the transfer chamber provides motive force. This force may be generated by at least one stator of at least one linear motor. The substrate carrier for transporting the substrate within the transfer chamber may include magnets (e.g., movers) that enable the substrate carrier to be moved by the at least one linear motor along one or more longitudinal and / or transverse tracks.

[0033] Figures 1A-1C An embodiment of the substrate transfer system is shown. Figure 1A A top view of a substrate transport system according to various embodiments is depicted. Figure 1B A longitudinal side view of a substrate transport system according to various embodiments is depicted. Figure 1CA lateral side view of a substrate transport system according to various embodiments is depicted.

[0034] refer to Figures 1A-1C The transfer chamber 102 for the electronic device processing system 100 may have at least one port 103, configured to allow access to at least one process chamber 104A-104L. In one embodiment, the transfer chamber 102 may have multiple ports 103, each configured to allow access to one of the multiple process chambers 104A-104L. Each port may include a slit valve, sized to receive an end effector holding a substrate (e.g., a wafer). In one embodiment, all ports 103 and / or slit valves are coplanar and share a common height. Alternatively, different ports and / or slit valves may be positioned at different heights and / or planes. Furthermore, in one embodiment, all ports 103 and / or slit valves have a common opening spacing (vertical dimension of the opening). The common aperture spacing can be a single-height spacing, which can receive end effectors and substrates positioned at a specific height. Alternatively, the common aperture spacing can be a multi-height spacing, which can receive end effectors and substrates positioned at multiple different heights (e.g., end effectors and substrates attached to a substrate carrier on a bottom track, and end effectors and substrates attached to a substrate carrier on a top track). Or, different ports 103 can have different aperture spacings.

[0035] According to an embodiment, the transmission chamber may have a length and a width, wherein a first dimension of the length (referred to as the longitudinal direction) is several orders of magnitude larger than a second dimension of the width (referred to as the transverse direction). The plurality of ports 103 may be arranged along the length of the transmission chamber 102. In an embodiment, the ports 103 may be oriented approximately orthogonally to the length of the transmission chamber 102. In an embodiment, the length is approximately 5 feet to approximately 20 feet, or approximately 6 feet, or approximately 8 feet, or approximately 10 feet, or approximately 12 feet, or approximately 14 feet, or approximately 16 feet, or approximately 18 feet, or approximately 20 feet, etc. In an embodiment, the transmission chamber 102 may further include additional ports 106 configured to allow access to the loading locking mechanism 107 (or more additional ports, each configured to allow access to one or more loading locking mechanisms). The additional ports 106 may be arranged along the width of the transmission chamber 102 at a first end of the transmission chamber 102. The loading locking mechanism 107 can be connected to a factory interface 109 containing one or more front-opening wafer transfer cassettes (FOUPs) 111. Furthermore, one or more additional ports (not shown) can be located at the end of the transfer chamber opposite port 106 and can be configured to allow access to one or more loading locking mechanisms and / or process chambers. The factory interface includes a robot (not shown) that removes wafers from the FOUPs 111 and places them into the loading locking mechanism 107 so that substrate carriers 110, 110A-110C can retrieve these wafers from the loading locking mechanism 107.

[0036] In some embodiments, port 106 may be approximately orthogonal to port 103. In one embodiment, the width of the transmission chamber 100 is approximately twice the width of the mounting locking mechanism 107, or twice the width of the substrates 108, 108A-108C. In another embodiment, the width of the transmission chamber 100 is approximately three times the width of the mounting locking mechanism 107, or three times the width of the substrates 108, 108A-108C.

[0037] The transfer chamber system 100 includes at least one substrate carrier 110A-110D, which is configured to transfer a substrate 108 between the at least one process chamber 104A-104L and the transfer chamber 102. According to embodiments, the transfer chamber 102 may contain several substrate carriers 110A-110D, for example, 2, 3, 4, 5, 6, 7, 8, 9, or 10, or about 2 to about 10 substrate carriers.

[0038] Each substrate carrier 110A-110D is configured to move using a magnetic levitation transport system (e.g., one or more linear motors). For example, each substrate carrier 110A-110C can move along at least one magnetic levitation track 150A-150B, 152A-152F. According to an embodiment, the transport chamber 102 may include two (or more) longitudinal magnetic levitation tracks 150A, 150B and multiple transverse magnetic levitation tracks 152A, 152B, 152C, 152D, 152E, 152F. Each magnetic levitation track may include a corresponding stator of a linear motor. In one embodiment, the longitudinal magnetic levitation tracks are positioned on the bottom inner surface 116 of the transport chamber 102, and the transverse magnetic levitation tracks 152A-152F are positioned on the opposite top inner surface 118 of the transport chamber 102. The longitudinal magnetic levitation tracks 150A-150B can be configured to move the substrate carrier 110A-110C in the forward and backward directions (away from and toward the loading locking mechanism), while the transverse magnetic levitation tracks 152A-152F can be configured to move the substrate carrier toward and away from the process chamber connected to the length of the transfer chamber 102 (e.g., perpendicular to the longitudinal axis of the transfer chamber).

[0039] In one embodiment, the longitudinal magnetic levitation tracks 150A-150B are positioned at the top of the transmission chamber, and the transverse magnetic levitation tracks 152A-152F are positioned at the bottom of the transmission chamber. In another embodiment, the longitudinal magnetic levitation tracks 150A-150B can be positioned at the top and / or bottom of the transmission chamber, and the transverse magnetic levitation tracks can also be positioned at the same top and / or bottom. Figure 1B As shown, the maglev tracks can be arranged facing each other (e.g., any maglev track on the bottom of the transmission chamber is oriented upwards, and any maglev track on the top of the transmission chamber is oriented downwards). In an embodiment, the upper and lower tracks can be spaced apart by a distance of about 40 mm to about 300 mm, or about 100 mm to about 250 mm, or about 150 mm to about 200 mm.

[0040] According to an embodiment, longitudinal magnetic levitation tracks 150A-150B can be configured to move one or more of a plurality of substrate carriers 110A-110D along the length of the transmission chamber 102 (e.g., along the longitudinal axis). Transverse magnetic levitation tracks 152A-152F can be configured to move one or more of the plurality of substrate carriers 110A-110D along a transverse axis orthogonal to the longitudinal axis of the transmission chamber 102. In one embodiment, longitudinal magnetic levitation track 150A moves substrate carriers 110A-110D in a first direction (e.g., away from the loading locking mechanism), and longitudinal magnetic levitation track 150B moves substrate carriers 110A-110D in the opposite second direction (e.g., toward the loading locking mechanism). The substrate carriers can be transported between longitudinal magnetic levitation tracks 150A-150B via transverse magnetic levitation tracks 152A-152F.

[0041] In some embodiments, as shown, the width of the transfer chamber 102 is too narrow to allow the substrate carrier positioned near the process chamber to rotate in a manner that guides the held substrate toward the process chamber. In such embodiments, to place the substrate into the process chamber (e.g., process chamber 104D), the substrate carrier (e.g., substrate carrier 110B) is positioned at the intersection of the transverse and longitudinal tracks on the side of the transfer chamber opposite to the process chamber into which the substrate will be placed. The substrate carrier can then be rotated toward the process chamber until it is approximately aligned with the transverse track (and perpendicular to the longitudinal track). The substrate carrier can then be moved toward the process chamber along the transverse track to place the substrate into the process chamber. After the substrate is placed into the process chamber, the substrate carrier can be moved in the opposite direction until it is again located at the intersection of the transverse and longitudinal tracks opposite to the process chamber, and then it can be rotated to face the longitudinal direction.

[0042] Figure 1DAn embodiment of a substrate carrier 110 suitable for use in a transfer chamber system 100 is shown. The substrate carrier 110 may include an end effector 120 for receiving, lifting, and holding a substrate 108 (e.g., a wafer), and / or placing the substrate thereon. Any suitable end effector 120 for a semiconductor processing system may be used, as will be understood by those skilled in the art. According to the embodiment, the one or more substrate carriers 110 may be a robotic arm known to those skilled in the art. The substrate carrier 110 may include an upper magnetic portion 124 and a lower magnetic portion 126. The lower magnetic portion 126 may be a first mover, for example, a first linear motor. The upper magnetic portion 124 may be a second mover, for example, a second linear motor. Alternatively, the upper and lower magnetic portions may be the upper and lower halves of a single mover configured to engage with a first stator below the substrate carrier 110 and a second stator above the substrate carrier 110. The upper magnetic portion 124 may include one or more magnets (e.g., permanent magnets), and the lower magnetic portion 126 may include one or more additional magnets. The upper and lower magnetic portions may be configured such that their magnetic fields do not interfere with each other. The magnetic levitation transport system includes one or more electromagnets (not shown) for controlling the movement of the substrate carrier and linear motors (not shown) for moving the substrate carriers 110, 110A-110D.

[0043] Return to reference Figures 1A-1CAccording to an embodiment, the plurality of ports 103 may be or include a plurality of slit valves. A substrate carrier engaged with a magnetic levitation track disposed on the bottom surface of the transfer chamber can enter and exit a first transfer plane of at least a first subset of the plurality of slit valves. A substrate carrier engaged with a magnetic levitation track disposed on the top surface of the transfer chamber can enter and exit a second transfer plane of a second subset of the plurality of slit valves. To further increase throughput and allow substrates to be exchanged approximately simultaneously in process chambers 104A-104L or loading locking mechanism 107, at least some of the plurality of slit valves have a first wafer transfer plane and a second wafer transfer plane above the first wafer transfer plane. A substrate carrier engaged with a magnetic levitation track on the bottom surface can enter and exit the first wafer transfer plane. A substrate carrier engaged with a magnetic levitation track on the top surface can enter and exit the second wafer transfer plane. In a further embodiment, the plurality of slit valves may have a common transfer plane, and substrate carriers engaged with both the magnetic levitation track on the bottom and top surfaces can enter and exit this common transfer plane. The size of the slit valve openings can be adjusted according to the configuration of the transfer planes. For a single transfer plane, the slit valve opening can be approximately 1 inch to approximately 20 inches, while when there are two transfer planes, it is approximately 2 inches to approximately 20 inches. For example, if there are two wafer transfer planes, the slit valve opening may be larger than when there is only one wafer transfer plane.

[0044] According to one embodiment, the system may include a first loading locking mechanism and a second loading locking mechanism (not shown). A substrate carrier engaged with a magnetic levitation track on the bottom surface can enter and exit the first loading locking mechanism. The second loading locking mechanism may be stacked above the first loading locking mechanism at the end of the transmission chamber 102. A substrate carrier engaged with a magnetic levitation track on the top surface can enter and exit the second loading locking mechanism. In one embodiment, a first height of the transmission chamber 102 near the end of the first loading locking mechanism may be greater than a second height of the remainder of the transmission chamber 102. In a further embodiment, the first and second loading locking mechanisms may be arranged side-by-side at an angle (e.g., 30 or 45 degrees) relative to the length of the transmission chamber.

[0045] According to an embodiment, the system includes at least one vertical motion assembly 128A-128E, which is configured to receive the substrate 108 and raise and / or lower the substrate between transmission planes and / or magnetic levitation tracks. The vertical motion assembly 128A-128E may include one or more lifting pins, for example, a pair or a set of three lifting pins 130A-130E. Alternatively, the vertical motion assembly may use electromagnetic, lifting plates (e.g., rotatable elevators), and / or other lifting mechanisms to move the substrate carrier, some of which will be described in more detail below. In the example of the lifting pin assembly, the lifting pins 130A-130E may be configured to pass through the bottom surface 116 of the transmission chamber 102 and may have an atmospheric-facing side and a vacuum-facing side. The atmospheric-facing side may be outside the bottom surface of the transmission chamber 102. The lifting pins 130A-130E may be enclosed in a bellows to maintain a vacuum environment in the transmission chamber. Lifting pins 130A-130E can be configured to extend into the transfer chamber 102 on the vacuum-facing side. In one embodiment, the at least one vertical motion component 128A-128E can be configured to vertically move the substrate carrier 110 positioned in front of the first loading locking mechanism so that the substrate carrier 110 reaches a transfer plane (discussed above) at a second height above the rest of the transfer chamber 102. During operation, a magnetic field can be activated near the substrate carriers when the lifting pins 130A-130E or other lifting mechanisms raise the substrate carriers 110, 110A-110C to a degree adjacent to the top track 118. The magnetic field near the substrate carriers 110, 110A-110C can be deactivated when the lifting pins 130A-130E or other lifting mechanisms engage with the substrate carriers 110, 110A-110C on the top track 118 to move the substrates down to the lower track 112 via the lifting pins 130A-130E.

[0046] Figure 2A A magnetic levitation platform 200 according to one or more embodiments described herein is depicted. As shown, a first longitudinal magnetic levitation track 202 runs along the bottom surface of a transmission chamber 214. A second longitudinal magnetic levitation track 204 and a third longitudinal magnetic levitation track 206, parallel to the first longitudinal track 202, also run along the bottom surface of the transmission chamber 214. A linear motor (not shown) may be located below the bottom surface of the transmission chamber 214. The linear motor can generate power through a stator. Transverse tracks 208, 210, and 212 are arranged perpendicular to the longitudinal tracks 202, 204, and 206. Figure 2AIn the embodiment depicted, longitudinal tracks 202, 204, and 206 are oriented upwards at a first height. Transverse tracks 208, 210, and 212 may be oriented upwards at the first height or downwards at a second height above the first height. Longitudinal tracks 202, 204, and 206 may be supported by the bottom surface of chamber 214, while transverse tracks 208, 210, and 212 may be supported by the top surface and / or side surface (not shown) of chamber 214.

[0047] One or more substrate carriers 216, 218, 220 are configured to move back and forth on longitudinal tracks 202, 204, 206 and transverse tracks 208, 210, 212. Substrate carriers 216, 220 may be configured to move on the upper transverse tracks 208, 210, while substrate carrier 218 moves on the lower track 204. In one or more embodiments, substrate carriers 216, 218, 220 may be configured to be vertically raised, lowered, and / or rotated at one or more interfaces 222, 224, 226, 228, 230, 232, 234, 236, 238. Figure 2A As shown, interfaces 222, 224, 226, 228, 230, 232, 234, 236, and 238 are formed where the longitudinal tracks 202, 204, and 206 intersect with the transverse tracks 208, 210, and 212. The substrate carriers 216, 218, and 220 can rotate, for example, by 90° at the interfaces 222, 224, 226, 228, 230, 232, 234, 236, and 238 to move from the longitudinal tracks 202, 204, and 206 to the transverse tracks 208, 210, and 212 and correspondingly change direction. In at least one embodiment, the magnetic levitation platform 200 is configured to lift and / or rotate the substrate carriers 216, 218, and 220 at the interfaces.

[0048] In at least one embodiment, the substrate carriers 216, 218, and 220 may include a pair of actuators, one actuator for providing vertical lifting functionality of the substrate carrier, and the other actuator for providing rotation functionality of the substrate carrier or a turntable thereon. Magnetic bearings positioned outside the turntable may be configured to engage with a magnetic levitation track. For example, the substrate carrier may have an external actuator for lifting / lowering and an internal actuator for rotation (e.g., within a central shaft).

[0049] In one or more embodiments described herein, one or more lifting pin assemblies may be used to raise and lower the substrate carrier from the bottom track to the upper track and vice versa. The lifting pin assemblies may be isolated from the atmosphere using bellows. Each lifting pin assembly may have a set of lifting pins that can raise the substrate carrier from the bottom track to the top track and / or lower the substrate carrier from the top track to the bottom track. When the substrate carrier with the substrate attached reaches a certain proximity to the top magnetic levitation track (e.g., sensed by a track sensing system), the top track may activate a magnetic field near the substrate carrier, thereby securing the substrate carrier to the top track.

[0050] In some embodiments, the substrate carrier is configured to move from a lower track to an upper track without a lifting pin assembly. For example, a substrate carrier with magnets on its top and bottom surfaces uses the magnetic attraction between the magnets and the corresponding magnetic levitation tracks to switch tracks. In one embodiment, a substrate carrier operated on a lower longitudinal track such that the magnets on its bottom surface engage with the longitudinal track can switch to an upper transverse track at the engagement point. The magnets on the top surface of the substrate carrier can engage with the transverse track while disengaging from the lower longitudinal track to gently move the substrate carrier upward toward the upper transverse track. The same process can then be performed to lower the substrate carrier from the upper transverse track to the lower longitudinal track.

[0051] In one or more embodiments, the transverse tracks 208, 210, 212 can be aligned with corresponding slit valves (not shown) and corresponding process chambers (not shown), such that tracks 208, 210, 212 can be used for loading and unloading substrates within the process chambers, while the longitudinal tracks 202, 204, 206 are utilized by substrate carriers 216, 218, 220 to move substrates along the length of the transfer chamber 214. For example, loading and unloading of substrates within the process chambers can occur independently of the lower longitudinal track on the upper transverse tracks. In one embodiment, substrate carriers 216, 218, 220 moving on tracks (e.g., 202) can switch to, for example, track 210 at interface 228 and move along track 210 to interface 232 near the slit valves and process chambers. Similarly, the process chamber and / or loading locking mechanism can be positioned at any end of the longitudinal tracks 202, 204, 206, and the substrate carriers 216, 218, 220 can be moved from one end of the transfer chamber 214 to the other end of the transfer chamber to place the substrate in the process chamber at the opposite end. In at least one embodiment, the substrate carriers 216, 218, 220 may include turntables (not shown) positioned thereon, such that these turntables are integrated with the frame body of the transfer chamber or transfer tunnel (e.g., a fixed turntable).

[0052] One advantage of using a maglev platform with at least three (3) longitudinal tracks 202, 204, 206 and / or at least three transverse tracks 208, 210, 212 is to prevent blockage of the longitudinal tracks when the base plate carrier rotates 90°. Figure 2A As shown, the substrate carrier 216 has rotated at the interface 228 and covers both the longitudinal track 202 and the longitudinal track 204. However, the longitudinal track 206 remains unobstructed and can continue to operate during the vertical or lateral movement of the substrate carrier 216.

[0053] Figure 2B An embodiment of a substrate carrier 216 suitable for use with a modular linear maglev track 252 is shown. The modular linear maglev track 252 can be positioned within a linear transport tunnel (not shown). For example, opposite ends of the transport tunnel may include one or more slit valves that can access one or more process chambers, process chamber clusters, loading locking mechanisms, etc. One or more substrate carriers 200 can be configured to move between opposite ends of the linear transport tunnel to pick up and place substrates between process chambers, clusters, loading locking mechanisms, etc.

[0054] The substrate carrier 216 may include a mover 251 on which a rotary disk 254 may be positioned. A pair of fixed coils 256A, 256B are positioned along at least two sides of the mover 251. A fixed coil 258 may be positioned below the mover 251 and between magnetic levitation tracks 252 along the center of the mover 251. The substrate carrier 216 is configured to move linearly along the magnetic levitation tracks 252 and rotate the substrate arm 260, for example, from about ±90° to about ±180°, so that the substrate carrier 216 can change orientation and / or place the substrate into a process chamber (not shown). The fixed coil 258 is useful for providing linear movement of the substrate carrier 216 and the substrate arm 260.

[0055] The rotating disk 254 may include a fixed active bearing (not shown) and a corresponding drive component (not shown). The substrate carrier 216 can be considered a purely passive carrier. The rotating disk 254 may further include a passive rotary magnetic bearing 256 on its top surface, which can be configured to provide a rotation angle of up to approximately ±180°.

[0056] Figure 3A and Figure 3B Another embodiment of the substrate carrier 300 is shown. According to the various embodiments described herein, the substrate carrier 300 is suitable for, for example... Figures 1A-2AThe magnetic levitation platform is shown. The substrate carrier 300 may include only passive components in its moving parts. The substrate carrier 300 does not include any current or battery. The substrate carrier 300 includes a turntable 304 positioned on the mover 301. The turntable 304 may include a frictionless magnetic bearing 305 formed by a ring of permanent magnets 307 and a torsion spring (not shown). The substrate carrier 300 may further include a plurality of substrate pins 309 configured to support the substrate 311 as the substrate carrier 300 is transferring the substrate 311 from one position to another. Figure 3A and 3B As shown, the base plate pin 309 can be positioned on the bearing 305.

[0057] In some embodiments, substrate 311 may include a notch 313, which can be used with a notch finder 317 to align substrate 311 with a slit valve, process chamber, and / or robotic arm after transport on substrate carrier 300 and before entering a process chamber. Notch finder 317 may employ an optical absolute encoder (not shown) to provide high-precision alignment. Additionally or alternatively, notch finder 317 may include a Hall sensor to provide alignment.

[0058] In one or more embodiments, the transmission chamber or transmission tunnel (not shown) may further include an active drive section 315, which includes one or more coils. Figure 3B As shown, the active drive portion 315 can be attached to a chamber or tunnel. Each end of the chamber or tunnel may include the active drive portion 315. The active drive portion 315 can be attached to a corner at the end of the chamber or tunnel and can have a span of approximately 90 degrees, such as... Figure 3B As shown. The drive portion 315 may be completely covered with a material (e.g., a metal plate) to cover any air gaps formed between the outer edge of the active drive portion 315 and the inner surface of the chamber or tunnel.

[0059] Figure 3CThe diagram illustrates a passive rotary bearing assembly 303 suitable for use with one or more substrate carriers according to an embodiment herein. A torsion spring 306 extends along the inner shaft 320 of the bearing assembly 303. A permanent magnet 322 may be positioned around the shaft 320 to provide axial polarization. An encoder 324 may be used to monitor the speed, distance, and / or direction of rotation of the shaft 320. An actuator 326 is configured to rotate the shaft 320. Bearings with permanent magnets are unstable (i.e., according to Earnshaw's law). At least one degree of freedom (or inertia) is used to actively stabilize such a bearing. The bearing arrangement results in a force pushing the shaft to the right. The bearing uses a torsion spring to bear this thrust and maintain rotational DOF without relative motion / slippage. The torsion spring is configured to return the magnetic bearing 305 to its default position when not in contact with the moving coil. A ring of permanent magnets 307 may be configured to function as a rotary actuator or a reluctance / stepping actuator. The substrate carrier 300 is configured to rotate up to approximately ±180°. A torsion spring can be positioned along the central axis of the passive bearing, around which the permanent magnet is positioned. The bearing configuration results in a force pushing the axis to the right, so the bearing uses a torsion spring to bear this force and maintain the rotational DOF without relative movement / slippage. The bearing returns to its default position without contacting the active coil.

[0060] Figure 4 Another embodiment of the substrate carrier 400 is shown. According to the various embodiments described herein, the substrate carrier 400 is suitable for, for example... Figure 1A-2A The illustrated magnetic levitation platform. In at least one embodiment, the base plate carrier 400 is suitable for use in a magnetic levitation platform having stacked (or two-layer) magnetic levitation tracks. The base plate carrier 400 can be considered as a purely passive carrier comprising only passive components in the moving parts. The base plate carrier 400 includes a turntable 404 positioned on a mover 401. The turntable 404 may include a frictionless magnetic bearing 405 formed by a ring of permanent magnets 407 and a torsion spring (not shown). Figure 4 As shown, the substrate carrier 400 further includes one or more coils 417 positioned on opposite sides of the mover 401 / bearing 405. Positioning of the coils on opposite sides of the mover 401 / bearing 405 can eliminate radial forces and / or double torque forces. A torsion spring is configured to return the magnetic bearing 405 to its default position when not in contact with the movable coil 417.

[0061] The substrate carrier 400 is configured to rotate up to approximately ±180°. The substrate carrier 400 may further include a plurality of substrate pins 409 configured to support the substrate 411 as the substrate carrier 400 is transferring the substrate 411 from one location to another. Figure 4As shown, the base plate pin 409 can be positioned on the bearing 405.

[0062] In some embodiments, substrate 411 may include a notch 413, which may be used in conjunction with a notch finder (not shown) to align substrate 411 with a slit valve, process chamber, and / or robotic arm after transport on substrate carrier 400 and before entering a process chamber. The notch finder may employ an optical absolute encoder (not shown) to provide high-precision alignment. Additionally or alternatively, the notch finder may include a Hall sensor to provide alignment.

[0063] In the illustrated embodiment, a synchronous driver with a permanent magnet 407 is shown on the mover 401. However, in other embodiments, the mover 401 may include a magnetoresistive driver.

[0064] Figures 5A-5B Another embodiment of the substrate carrier 500 is shown. The substrate carrier 500 can be in a stacked configuration having two vertical layers operable to support one or both substrates 511. Frame 524 includes a bottom surface with substrate pins 509 and side and top structures on which the substrates 511 can be supported during transport. The substrate carrier 500 can be a passive mover with magnets 520, 522 on the top and bottom. Magnets 520, 522 can be configured to engage with one or more longitudinal magnetic levitation tracks and / or one or more transverse magnetic levitation tracks.

[0065] Figure 6 An embodiment of the magnetic levitation platform 600 is shown. A plurality of process chambers and / or loading locking mechanisms 626 are arranged around a transmission chamber 614. A longitudinal magnetic levitation track 602 runs along the length of the transmission chamber 614 at a first height within the transmission chamber 614. Process chambers 626 are located at opposite ends of the longitudinal magnetic levitation track 602. A substrate carrier 616 is configured to move linearly between the process chambers 626 at each end along the longitudinal track 602. The substrate carrier 616 can be any suitable carrier described herein. Transverse magnetic levitation tracks 608 and 610 run perpendicular to the longitudinal track 602. Process chambers 626 are located at opposite ends of each of the transverse tracks 608 and 610. The substrate carrier 616 is also configured to move linearly along the transverse tracks 608 and 610. The transverse tracks 608 and 610 can be at a second height within the transmission chamber 614, lower than the first height.

[0066] The planes of each transverse track 608, 610 intersect the plane of the longitudinal track 602 at interfaces 622, 624. The substrate carrier 616 can move between the longitudinal track 602 and the transverse tracks 608, 610 at interfaces 622, 624. The turntable 604 is configured to rotate the substrate carrier 616 up to approximately ±180°. The substrate carrier 616 may include a mover 601 having an end effector 628 attached to the mover and configured to support the substrate 630. In this embodiment, the turntable 604 may be driven by a direct driver 640 coupled to a lower bearing 642 and an upper bearing 644. Therefore, the turntable 604 will be powered to operate the direct driver 640.

[0067] In one embodiment, the turntable 604 is capable of vertical lifting (e.g., vertical movement). In another embodiment, an actuator 660 is provided to vertically move the turntable 604. The turntable may have an axis of rotation, may be magnetically levitated, and can be vertically moved by the actuator 660. Therefore, the mover can switch between an upper track and a lower track. In an example, the mover may be similar to the mover shown in Figure 5, but without a 90° track rotation between the top and bottom sides.

[0068] Figure 7 Another embodiment of the substrate carrier 700 is shown. The substrate carrier 700 may include a rotary actuator with a passive magnetic bearing 710. An active rotating component 704 (e.g., a magnet and a bearing) may be integrated within and / or attached to a transmission chamber body (not shown). A horizontal stroke bearing 748 may also be integrated with or attached to the transmission chamber along with the active component for rotation. The horizontal stroke bearing 748 is configured to control the amount of rotation of the turntable 706, for example, up to about 200 mm or from about 50 mm to about 200 mm. The substrate carrier 700 may be configured to engage with a magnetic levitation actuator, a plurality of which are positioned at the bottom and top in a horizontal direction 750.

[0069] Figure 8 Another embodiment of the substrate carrier 800 is shown. The substrate carrier 800 may include a rotary actuator with a passive magnetic bearing 810. An active rotating component 804 (e.g., a magnet and a bearing) may be integrated within and / or attached to a transmission chamber body (not shown). The substrate carrier 800 may be configured to engage with a plurality of magnetic levitation actuators positioned at the bottom and top in a horizontal direction 850. The substrate carrier 800 further includes a laterally self-centering magnet 854 to provide centering of the turntable 806 during operation.

[0070] Figure 9AAnother embodiment of the substrate carrier 900 is shown. The substrate carrier 900 is completely passive and includes a rotary bearing 904. In some embodiments, the substrate carrier 900 can be operated by a reluctance actuator. A reluctance motor is an electric motor that induces non-permanent magnetic poles on a ferromagnetic rotor. The rotor has no windings and generates torque through magnetic reluctance. Reluctance motors can be synchronous, variable, switching, or variable-stepping.

[0071] In this embodiment, the substrate carrier 900 is actually a magnetoresistive actuator. In other embodiments, other types of actuators besides magnetoresistive actuators may also be used. For example, in this embodiment, a synchronous actuator may be used with a permanent magnet. As shown, the substrate carrier 900 includes a gear with multiple teeth. The substrate carrier 900 may additionally include X and Y actuators. Thus, the substrate carrier 900 includes a magnetoresistive actuator, but it is configured to have two degrees of freedom and levitation force simultaneously.

[0072] Attached to the rotary bearing 904 are one or more self-centering magnets 954. In at least one embodiment, the torque requirement of the rotary bearing 904 includes the centering force of the self-centering magnets 954, the radius of which is greater than the torque of a torsion spring (not shown) within the bearing 904. Figure 9B As shown. The torque requirement can further include a torque of the drive component greater than the torque of the torsion spring plus the maximum centering force. For example, when the lateral position of magnet 954 is 0 mm, the centering force is also 0. The centering force increases when the lateral position of magnet 954 increases to more than 0 mm, and when the lateral position of magnet 954 decreases to less than 0 mm. Another or more self-centering magnets (not shown) can be positioned above those magnets on bearing 904 and attached to top support 915. The attraction force decreases when the vertical gap between the two sets of magnets increases.

[0073] Figure 10Another embodiment of the magnetic levitation platform 1000 is shown. The platform 1000 includes three (3) longitudinal magnetic levitation tracks 1002, 1004, 1006 and one transverse magnetic levitation track 1008. The longitudinal tracks 1002, 1004, 1006 are at a first height, while the transverse track 1008 is at a second height above the first height. As shown, a plurality of substrate carriers 1016, 1017, 1018, 1019 are configured to move along the longitudinal tracks 1002, 1004, 1006 and the transverse track 1008. The longitudinal tracks 1002, 1004, 1006 are oriented upwards (e.g., positioned on the bottom surface of a transmission chamber or transmission tunnel), and the transverse track 1008 is oriented downwards, wherein the transverse track is attached to or integrated within the transmission chamber or transmission tunnel. Each substrate carrier 1016, 1017, 1018 has a corresponding substrate support 1020, 1021, 1022, wherein the support for substrate carrier 1019 is not shown. Each substrate carrier 1016, 1017, 1018, 1019 includes at least one magnet on its top surface and at least one magnet on its bottom surface, such that substrate carriers 1016, 1017, 1018, 1019 are configured to engage with and move along any of the longitudinal tracks 1002, 1004, 1006 and the transverse track 1008. Substrate carriers 1002, 1004, 1006, 1008 may further include bearings and drive assemblies according to various embodiments herein, which are configured to rotate the substrate carrier up to about ±180°.

[0074] Figure 11Another embodiment of the magnetic levitation platform 1100 and corresponding substrate carriers 1116, 1118 is shown. System 1100 includes multiple magnetic levitation tracks 1102, 1104, 1106, along which substrate carriers 1116, 1118 can move linearly. Each substrate carrier 1116, 1118 includes a mover 1103 and rotary bearings 1105, 1106, to which end effectors 1107, 1108 are attached. The mover 1103 can be operated via a standard power coupler (such as a wire) and a moving magnet (not shown). In this embodiment, the transmission chamber or tunnel containing platform 1100 may include passive platforms 1109, 1110 for rotational and linear movement on the top surface of the chamber or tunnel. Platform 1100 may further include a lifting assembly (e.g., a lifting pin assembly) to raise passive platforms 1109, 1110 from within carriers 1116, 1118, the lifting assembly being sealed by a bellows. Although not shown, another set of magnetic levitation tracks may be positioned above the base carriers 1116, 1118, this other set of magnetic levitation tracks may be longitudinal or transverse magnetic levitation tracks. Base carriers 1116, 1118 may move between the upper magnetic levitation track and the lower magnetic levitation track.

[0075] This document further describes a method 1200 for moving one or more substrates (block 1202) within a transmission chamber, such as... Figure 12 As shown. At block 1204, method 1200 includes: retrieving a first substrate from a first process chamber (or a first loading locking mechanism) via a first substrate carrier engaged with a first magnetic levitation track disposed along the length of a transfer chamber. The first magnetic levitation track may be configured to generate a first magnetic field above the first magnetic levitation track.

[0076] At block 1206, method 1200 includes: generating a first magnetic field via a first magnetic levitation track to move a first substrate carrier carrying a first substrate in a first direction along the first magnetic levitation track.

[0077] At block 1208, method 1200 may include: rotating a first substrate carrier with a first substrate at a first interface formed at the intersection of the plane of the second magnetic levitation track and the plane of the first magnetic levitation track. The second magnetic levitation track is disposed along the width of the transmission chamber and configured to generate a second magnetic field above or below the second magnetic levitation track.

[0078] At block 1210, method 1200 includes: generating a second magnetic field via a second magnetic levitation track to move a first substrate carrier carrying a first substrate in a second direction along the second magnetic levitation track.

[0079] Method 1200 further includes: at block 1212, rotating a first substrate carrier with a first substrate at a second interface formed at the intersection of the plane of the third maglev track and the plane of the second maglev track. The third maglev track may be arranged along the length of the transmission chamber and spaced apart from the first maglev track. The third maglev track is configured to generate a third magnetic field above the third maglev track.

[0080] At block 1214, method 1200 includes: generating a third magnetic field via a third magnetic levitation track to move a first substrate carrier carrying the first substrate in a third direction along the third magnetic levitation track to a second process chamber located on the side of the transfer chamber opposite to the first process chamber. For example, the first substrate is moved from one side of the transfer chamber to the other side of the transfer chamber.

[0081] At block 1216, method 1200 may further include: rotating a first substrate carrier carrying the first substrate and placing the first substrate in a second process chamber. Allowing the substrate to move randomly within the process chamber can increase the throughput of the substrate through the processing system, ultimately improving yield.

[0082] In some embodiments, method 1200 may include: rotating a first substrate carrier at a second interface formed where a third maglev track intersects with the second maglev track and is adjacent to the bottom surface of a transfer chamber, wherein the third maglev track has an upward orientation configured to generate a third magnetic field above the third maglev track; and generating the third magnetic field via the third maglev track to move the first substrate carrier carrying the first substrate upward along the third maglev track in a third direction. For example, the substrate may move along a longitudinal track, then be transferred to a transverse track at the interface, and then again transferred to a different longitudinal track by changing direction, for example, changing by 90° at each interface. Thus, the substrate can be rapidly moved from one process chamber to another using an open maglev lane.

[0083] In some embodiments, method 1200 includes: using a first lifting pin assembly to lift a first substrate carrier to a third magnetic levitation track positioned near the top surface of a transmission chamber. The third magnetic levitation track may have a downward orientation and may be configured to generate a third magnetic field below the third magnetic levitation track. The magnetic levitation platform system may be configured to detect the first substrate carrier's proximity to the third magnetic levitation track. The third magnetic field may be generated to suspend the first substrate carrier below the third magnetic levitation track and to move the first substrate carrier carrying the first substrate upward along the third magnetic levitation track in a third direction.

[0084] In at least one embodiment of method 1200, the at least one substrate carrier is configured to move along a first magnetic levitation track and a second magnetic levitation track. According to the embodiments described herein, the substrate carrier can be any suitable carrier. In one embodiment, the at least one substrate carrier may include a passive rotary magnetic bearing configured to rotate the substrate carrier. Additionally or alternatively, the substrate carrier may include a mirror drive portion configured to rotate the substrate carrier. In some embodiments, the substrate carrier may include a fixed active bearing and drive assembly configured to rotate a turntable on the top surface of the substrate carrier. In a further embodiment, the substrate carrier may include a rotary actuator configured to rotate the passive magnetic bearing. In at least one embodiment, the substrate carrier may include a first magnet on the bottom surface of the substrate carrier and a second magnet on the top surface of the substrate carrier, wherein the first magnet is configured to interact with the first and second magnetic levitation tracks, and the second magnet is configured to interact with a third and fourth magnetic levitation track positioned on the top surface of the transmission chamber.

[0085] Throughout this specification, references such as "one embodiment," "some embodiments," "one or more embodiments," or "an embodiment" mean that a particular feature, structure, material, or characteristic described in conjunction with that embodiment is included in at least one embodiment of the invention. Therefore, the appearance of phrases such as "in one or more embodiments," "in some embodiments," "in one embodiment," or "in one embodiment" in various places throughout this specification does not necessarily refer to the same embodiment of the invention. Furthermore, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments.

[0086] As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” include plural referents. Thus, for example, the reference to “orbit” includes a single orbit as well as more than one orbit.

[0087] As used herein, the term "about" in relation to a measured quantity means the normal variation in that measured quantity that would be expected by a person skilled in the art when performing the measurement and exercising a level of care commensurate with the accuracy of the measured object and the measuring equipment. In some embodiments, the term "about" includes ±10% of the stated number, such that "about 10" would include numbers from 9 to 11.

[0088] The term "at least about" in relation to a measured quantity refers to the normal variation in the measured quantity, as expected by a person skilled in the art when performing the measurement and exercising a level of care commensurate with the accuracy of the measured object and measuring equipment, as well as any quantity higher than the measured quantity. In some embodiments, the term "at least about" includes the stated number minus 10% and any higher quantity, such that "at least about 10" would include 9 and any quantity greater than 9. This term may also be expressed as "about 10 or more". Similarly, the term "less than about" generally includes the stated number plus 10% and any lower quantity, such that "less than about 10" would include 11 and any quantity less than 11. This term may also be expressed as "about 10 or less".

[0089] Unless otherwise stated, all portions and percentages are by weight. Weight percentages (wt.%), unless otherwise stated, are based on the whole composition excluding any volatiles, i.e., based on dry solids content.

[0090] The foregoing description sets forth numerous specific details, such as examples of particular systems, components, methods, etc., to provide a good understanding of several embodiments of the invention. However, those skilled in the art will understand that at least some embodiments of the invention can be practiced without these specific details. In other instances, well-known components or methods are not described in detail, or are presented in a simple block diagram format, to avoid unnecessarily obscuring the invention. Therefore, the specific details set forth are merely exemplary. Specific embodiments may differ from these exemplary details and are still considered to be within the scope of the invention.

[0091] Although the operations of the methods described herein are shown and described in a specific order, the order of operations for each method can be changed so that certain operations can be performed in reverse order, or that an operation can be performed at least partially in parallel with other operations. In another embodiment, instructions or sub-operations of dissimilar operations can be performed intermittently and / or alternately.

[0092] It should be understood that the above description is intended to be illustrative and not restrictive. Upon reading and understanding the above description, those skilled in the art will discover many other embodiments. Therefore, the scope of the invention will be determined with reference to the appended claims and the full scope of the equivalents conferred by such claims.

Claims

1. A transmission chamber for an electronic device processing system, the transmission chamber comprising: Maglev platform, including: A first magnetic levitation track is arranged along the horizontal length of the transmission chamber and configured to generate a first magnetic field above the first magnetic levitation track; A second magnetic levitation track is arranged along the horizontal width of the transmission chamber, wherein the plane of the second magnetic levitation track intersects the plane of the first magnetic levitation track at a first interface, wherein the first and second magnetic levitation tracks are fixed at the first interface, and wherein the second magnetic levitation track is configured to generate a second magnetic field above or below the first magnetic levitation track; and At least one substrate carrier is configured to move along the first maglev track and the second maglev track, wherein a first horizontal plane of the first maglev track is at a different height than a second horizontal plane of the second maglev track, the first maglev track and the second maglev track are arranged face to face, and the substrate carrier is configured to rotate and move vertically at the first interface.

2. The transmission chamber of claim 1, further comprising at least one of the following: (i) A third maglev track, arranged along the horizontal length of the transmission chamber and spaced apart from the first maglev track, wherein the second maglev track is arranged across the third maglev track at the second interface; or (ii) A fourth maglev track, disposed along the horizontal width of the transmission chamber and spaced apart from the second maglev track, wherein the fourth maglev track is disposed across the first maglev track at a third interface.

3. The transmission chamber of claim 2, further comprising at least one of the following: (iii) A fifth maglev track, arranged along the horizontal length of the transmission chamber and spaced apart from the first and third maglev tracks, wherein the second and fourth maglev tracks are arranged across the fifth maglev track; or (iv) A sixth maglev track, arranged along the horizontal width of the transmission chamber and spaced apart from the second and fourth maglev tracks, wherein the sixth maglev track is arranged across the first, third and fifth maglev tracks.

4. The transmission chamber as claimed in claim 3, wherein the first magnetic levitation track and the third magnetic levitation track, and the third magnetic levitation track and the fifth magnetic levitation track, are spaced apart by a distance of 350 mm to 450 mm.

5. The transmission chamber of claim 1, wherein the at least one substrate carrier is configured to move along the first magnetic levitation track and the second magnetic levitation track, wherein the at least one substrate carrier comprises at least one of the following: A passive rotary magnetic bearing is configured to rotate the substrate carrier; or The mirror drive section is configured to rotate the substrate carrier; or A fixed drive bearing and drive assembly are configured to rotate a turntable on the top surface of the substrate carrier; or A rotary actuator is configured to rotate a passive magnetic bearing.

6. The transfer chamber of claim 1, wherein the at least one substrate carrier includes an end effector for holding the substrate, wherein at least one of the first magnetic levitation track or the second magnetic levitation track is configured to rotate the substrate carrier to place the substrate into a process chamber connected to the transfer chamber.

7. The transfer chamber of claim 1, further comprising a plurality of ports in the sidewall of the transfer chamber, wherein the plurality of ports are a plurality of slit valves through which the at least one substrate carrier can pass, and wherein the second magnetic levitation track is adjacent to a subset of the plurality of ports on the first side of the transfer chamber and is available for transferring a substrate through one of the plurality of ports into a process chamber.

8. The transmission chamber of claim 1, further comprising: Components for transferring the at least one substrate carrier from the first maglev track to the second maglev track, the components comprising: Magnetic bearings, including: A shaft and a torsion spring positioned within the shaft; Multiple permanent magnets are concentric with the shaft; An encoder is configured to monitor at least one of the speed, distance, or direction of rotation of the shaft; and The driver is configured to rotate the shaft.

9. A transmission chamber for an electronic device processing system, the transmission chamber comprising: Maglev platform, including: A first magnetic levitation track is disposed at a first height within the transmission chamber along the horizontal length of the transmission chamber and is configured to generate a first magnetic field above the first magnetic levitation track; A second magnetic levitation track is disposed at a second height within the transmission chamber, along the horizontal width of the transmission chamber, wherein the second magnetic levitation track is configured to generate a second magnetic field below the second magnetic levitation track; and At least one substrate carrier is configured to move along the first maglev track and the second maglev track, wherein the substrate carrier is configured to move vertically from the first maglev track to the second maglev track at the intersection between the plane of the first maglev track and the plane of the second maglev track, the first maglev track and the second maglev track are arranged face to face, and wherein the first maglev track and the second maglev track are fixed at the intersection.

10. The transmission chamber of claim 9, further comprising at least one of the following: (i) A third maglev track, disposed at the first height along the horizontal length of the transmission chamber and spaced apart from the first maglev track, and configured to generate a third magnetic field above the third maglev track, wherein the plane of the second maglev track intersects the plane of the third maglev track; or (ii) A fourth maglev track, disposed at the second height along the horizontal width of the transmission chamber and spaced apart from the second maglev track, and configured to generate a fourth magnetic field below the fourth maglev track, wherein the plane of the first maglev track and the plane of the third maglev track intersect the plane of the fourth maglev track.

11. The transmission chamber of claim 10, wherein the first maglev track and the third maglev track are spaced apart by a distance of 40 mm to 300 mm, and wherein the second maglev track and the fourth maglev track are spaced apart by a distance of 40 mm to 300 mm.

12. The transmission chamber of claim 10, wherein the at least one substrate carrier is configured to move along the first magnetic levitation track, the second magnetic levitation track, the third magnetic levitation track, and the fourth magnetic levitation track, wherein the at least one substrate carrier comprises: The substrate carrier has a first magnet on its bottom surface and a second magnet on its top surface, wherein the first magnet is configured to interact with the first maglev track and the third maglev track, and the second magnet is configured to interact with the second maglev track and the fourth maglev track.

13. The transmission chamber of claim 9, further comprising: At least one lifting pin assembly is configured to move the at least one base plate carrier in a vertical direction between the first magnetic levitation track and the second magnetic levitation track.

14. The transmission chamber of claim 9, further comprising: Multiple process chambers are connected to the transfer chamber via multiple corresponding slit valves.

15. The transmission chamber of claim 9, wherein the transmission chamber is connected to the first loading and locking mechanism, wherein when the at least one substrate carrier is engaged with the first magnetic levitation track, the at least one substrate carrier can enter and exit the first loading and locking mechanism, the transmission chamber further comprising: A second loading and locking mechanism is stacked above the first loading and locking mechanism, wherein the at least one substrate carrier can enter and exit the second loading and locking mechanism when the at least one substrate carrier is engaged with the second magnetic levitation track.

16. The transmission chamber of claim 13, wherein the first magnetic levitation track is configured to move the at least one substrate carrier in a first direction along the horizontal length of the transmission chamber, and wherein the third magnetic levitation track is configured to move the at least one substrate carrier in a second direction along the horizontal length of the transmission chamber, wherein the second direction is opposite to the first direction.

17. A method for moving one or more substrates in a transfer chamber, the method comprising: A first substrate is retrieved from a first process chamber via a first substrate carrier, the first substrate carrier engaging with a first magnetic levitation track disposed along the horizontal length of the transfer chamber, wherein the first magnetic levitation track is configured to generate a first magnetic field above the first magnetic levitation track. The first magnetic field is generated by the first magnetic levitation track to move the first substrate carrier carrying the first substrate along the first magnetic levitation track in a first direction; The first substrate carrier with the first substrate is rotated at a first interface, the first interface being formed at the intersection of the plane of the second magnetic levitation track and the plane of the first magnetic levitation track, and the first substrate carrier with the first substrate is moved vertically from the first magnetic levitation track to the second magnetic levitation track, wherein the first magnetic levitation track and the second magnetic levitation track are fixed at the first interface, wherein the second magnetic levitation track is arranged along the horizontal width of the transmission chamber and is configured to generate a second magnetic field above or below the second magnetic levitation track, and wherein the first magnetic levitation track and the second magnetic levitation track are arranged face to face; The second magnetic field is generated by the second magnetic levitation track to move the first substrate carrier carrying the first substrate along the second magnetic levitation track in the second direction; The first substrate carrier with the first substrate is rotated at the second interface, the second interface being formed at the intersection of the plane of the third magnetic levitation track and the plane of the second magnetic levitation track, and the first substrate carrier with the first substrate is moved vertically from the second magnetic levitation track to the third magnetic levitation track, wherein the third magnetic levitation track is arranged along the horizontal length of the transmission chamber and spaced apart from the first magnetic levitation track, and is configured to generate a third magnetic field above the third magnetic levitation track, and wherein the second magnetic levitation track and the third magnetic levitation track are arranged face to face; The third magnetic field is generated by the third magnetic levitation track to move the first substrate carrier with the first substrate along the third magnetic levitation track in a third direction to the second process chamber, the second process chamber being located on the side of the transfer chamber opposite to the first process chamber. as well as The first substrate carrier with the first substrate is rotated, and the first substrate is placed in the second process chamber.

18. The method of claim 17, further comprising: The first substrate carrier is rotated at the second interface, which is formed at the intersection of the third magnetic levitation track and the second magnetic levitation track and adjacent to the bottom surface of the transmission chamber, wherein the third magnetic levitation track has an upward orientation configured to generate a third magnetic field above the third magnetic levitation track. as well as The third magnetic field is generated by the third magnetic levitation track to move the first substrate carrier carrying the first substrate upward along the third magnetic levitation track in a third direction.

19. The method of claim 17, further comprising: The first substrate carrier is lifted to a third magnetic levitation track positioned near the top surface of the transmission chamber using a first lifting pin assembly, wherein the third magnetic levitation track has a downward orientation and is configured to generate a third magnetic field below the third magnetic levitation track. The first substrate carrier is detected to be adjacent to the third magnetic levitation track; as well as The third magnetic field is generated to suspend the first substrate carrier below the third magnetic levitation track and move the first substrate carrier with the first substrate upward along the third magnetic levitation track.

20. The method of claim 17, wherein at least one substrate carrier is configured to move along the first magnetic levitation track and the second magnetic levitation track, wherein the at least one substrate carrier comprises: A passive rotary magnetic bearing is configured to rotate the substrate carrier; or The mirror drive section is configured to rotate the substrate carrier; or A fixed drive bearing and drive assembly are configured to rotate a turntable on the top surface of the substrate carrier; or A rotary actuator is configured to rotate a passive magnetic bearing; or A first magnet on the bottom surface of the substrate carrier and a second magnet on the top surface of the substrate carrier, wherein the first magnet is configured to interact with the first maglev track and the second maglev track, and the second magnet is configured to interact with the third maglev track and the fourth maglev track positioned on the top surface of the transmission chamber.

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