A plate polishing device and a plate polishing method

Abstract

The present application relates to a kind of plate polishing device and plate polishing method, plate polishing device in which, including: conveying assembly, it has the conveying plane for conveying plate;Polishing assembly is set to the upper side of conveying assembly, and polishing assembly includes the abrasive head unit that can swing along first direction and second direction;Detection component is located in the plate material end of conveying assembly, and it is used to detect the outer edge profile size of the circumferential outside of plate;Wherein, on the outer edge profile of plate, multiple abrasive head swing back inflection points are arranged, and abrasive head swing back inflection points are planned to form polishing track, and abrasive head unit swings along polishing track, to polish plate.The swing range of abrasive head unit of plate polishing device of the embodiment can be adapted to irregular plate profile, and according to the profile of plate, adaptive swing can effectively avoid the phenomenon that abrasive head unit idles and does useless work, improve efficiency, reduce energy consumption.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of plate polishing, and in particular to a plate polishing device and a plate polishing method. BACKGROUND

[0002] In the prior art, the surface polishing of plates such as stone, rock plate, ceramic plate, metal plate and glass is an important link in the processing process, which continuously polishes the surface of the plate through a polishing head to make the surface of the plate reach a certain gloss.

[0003] The existing plate polishing device polishes the plate by uniformly swinging a plurality of polishing heads. However, the edge profile of the plate is usually irregular, and the width of each plate is also different during polishing production. In the existing plate polishing equipment, there is a plate edge profile sensor in front of the feeding direction. When the plate edge profile is detected, the polishing head is raised to avoid grinding on the conveying belt. Then, the polishing head continues to swing outward until it turns back to swing after swinging to the outermost position. The polishing head is lowered to continue the polishing work.

[0004] It can be seen that in order to prevent the polishing head from grinding on the conveying belt, the polishing head is raised. However, the raised polishing head still rotates and does not contact the plate, which is in a state of idling and doing useless work, wasting energy. In addition, the polishing head does not rise in time and the impact caused by the rising and falling of the polishing head can cause poor edge polishing effect of the plate, and the edge position of the plate is prone to yellow edge and shadow problems. SUMMARY

[0005] In order to overcome at least one of the above-mentioned defects of the prior art, according to one aspect of the present application, a plate polishing device is provided, which effectively avoids the idling and useless work of the polishing head unit, improves the efficiency and reduces the energy consumption.

[0006] A plate polishing device, comprising: a conveying assembly having a conveying plane for conveying a plate; a polishing assembly arranged on the upper side of the conveying assembly, the polishing assembly comprising a polishing head unit swingable in a first direction and a second direction; wherein, in the conveying plane, the first direction is the conveying direction of the conveying assembly, and the second direction is perpendicular to the conveying direction of the conveying assembly; a detection assembly located at the plate feeding end of the conveying assembly and used for detecting the outer edge profile size of the circumferential outer side of the plate; wherein, a plurality of polishing head swing-back inflection points are arranged on the outer edge profile of the plate, and a polishing track is planned according to the plurality of polishing head swing-back inflection points, and the polishing head unit swings along the polishing track to polish the plate.

[0007] Optionally, the grinding head unit is capable of lifting along a third direction, wherein the third direction is a height direction of the conveying assembly; the detection assembly is further configured to detect an inner edge profile of the hole on the plate; wherein a lifting point and a lowering point of the grinding head are determined on the inner edge profile of the plate, and a lifting track of the hole to be avoided is formed according to the lifting point and the lowering point, the grinding head unit lifts along the lifting track, and the lifting track is formed in the grinding track.

[0008] Optionally, a plurality of grinding head swing-back inflection points are arranged on the outer edge profiles of the plate on opposite sides along the second direction; wherein on one side of the outer edge profile, the plurality of grinding head swing-back inflection points are sequentially marked as the ith, wherein i={1, 2,..., n}, n represents the corresponding number and n is a natural number greater than 1, along the first direction; on the other side of the outer edge profile, the plurality of grinding head swing-back inflection points are sequentially marked as the rth, wherein r={1, 2,..., n}, n represents the corresponding number and n is a natural number greater than 1, along the first direction; the plurality of grinding head swing-back inflection points are arranged to move along the path of the ith=1, the rth=1, the rth=2, the ith=2, the ith=3, the rth=3,..., the ith=n, or the rth=m, so as to form the grinding track.

[0009] Optionally, the ith grinding head swing-back inflection point and the rth grinding head swing-back inflection point are arranged in alignment along the second direction, wherein i=r.

[0010] Optionally, the grinding track between the ith grinding head swing-back inflection point and the rth grinding head swing-back inflection point is a first grinding path, wherein i=r; wherein the first grinding path is arranged to pass through the inner edge profile of the hole on the plate to set the lifting point and the lowering point of the grinding head.

[0011] Optionally, the machine frame is further provided, and the grinding assembly further comprises: a first guide rail connected to the machine frame; a first beam body connected to the first guide rail in a sliding manner; a fixed seat connected to the first beam body in a sliding manner, and the grinding head unit is arranged on the fixed seat; a first direction swing driving unit configured to drive the fixed seat to move relative to the first beam body along the first direction; and a second direction swing driving unit configured to drive the first beam body to move relative to the first guide rail along the second direction.

[0012] Optionally, the first direction swing driving unit is connected with the fixed base, and the second direction swing driving unit is connected with the first beam body; a straight rack is fixed on the first guide rail, the first beam body is slidably arranged on the first guide rail, and a gear engaged with the straight rack is arranged on the driving end of the second direction swing driving unit; the driving end of the first direction swing driving unit is provided with a rotating disc, the rotating disc is eccentric and rotationally connected with a connecting rod, and one end of the connecting rod away from the rotating disc is rotationally connected with the first beam body.

[0013] Optionally, the polishing assembly further comprises a third direction lifting driving unit connected with the fixed base, a main shaft is arranged on the lifting end of the third direction lifting driving unit, and the main shaft is connected with the grinding head unit; a grinding head rotation driving unit is connected with the fixed base, a rotating shaft sleeve is connected with the driving end of the grinding head rotation driving unit through a transmission belt, the rotating shaft sleeve is arranged on the main shaft, and one of the main shaft and the rotating shaft sleeve is provided with a guide key and the other is provided with a guide slot.

[0014] According to another aspect of the present application, a plate polishing method is provided, which is applied to the plate polishing device described above, and comprises the following steps:

[0015] Obtaining the outer edge contour position data of the plate, and calculating the outer edge contour size data of the plate by using the outer edge contour position data of the plate;

[0016] Determining the swing turning point of the grinding head in the backward direction according to the outer edge contour size data of the plate and the conveying speed data;

[0017] Planning the polishing track according to the swing turning point of the grinding head in the backward direction;

[0018] Driving the grinding head unit to swing along the polishing track to perform self-adaptive edge contour polishing.

[0019] Optionally, the plate polishing method further comprises the following steps:

[0020] Obtaining the inner edge contour position data of the plate, and calculating the inner edge contour size data of the plate by using the inner edge contour position data of the plate;

[0021] Determining the lifting point and the lowering point of the grinding head according to the inner edge contour size data of the plate and the conveying speed data;

[0022] Planning the lifting track according to the lifting point and the lowering point of the grinding head;

[0023] Driving the grinding head unit to lift and lower along the lifting track.

[0024] In summary, the plate polishing device and the plate polishing method provided by the present application have the following technical effects:

[0025] In view of the existing plate polishing device exists grinding head idle do useless work and cause the edge polishing effect of plate is not good problem, therefore the plate polishing device of the embodiment improves the polishing structure, the detection component in which detects the respective corresponding outer edge contour size of different shapes of plate in real time, and determines a plurality of grinding head swing inflection points on the respective corresponding outer edge contour, and forms the respective corresponding polishing track through the preset algorithm planning, so that the polishing swing of the grinding head unit is adaptive to the outer edge contour of the plate, and the adaptive polishing is carried out according to different shapes of plate, so that the idle work of the grinding head unit is avoided, the efficiency is improved, and the energy consumption is reduced. At the same time, the adaptive polishing of different shapes of plate can improve the polishing quality of the plate surface, especially the edge polishing effect, and prevent the edge position of the plate from appearing yellow edge and shadow. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The plate polishing track schematic diagram of the existing polishing plate equipment;

[0027] Figure 2 The structure schematic diagram of the plate polishing device of the embodiment of the application;

[0028] Figure 3 The structure schematic diagram of the plate conveying assembly of the plate polishing device of the embodiment of the application;

[0029] Figure 4 The structure schematic diagram of the polishing track path of the plate with holes in the plate polishing device of the embodiment of the application;

[0030] Figure 5 The structure schematic diagram of the polishing track path of the plate without holes in the plate polishing device of the embodiment of the application;

[0031] Figure 6 Another structure schematic diagram of the plate polishing device of the embodiment of the application;

[0032] Figure 7 A Figure 6 The local enlarged view of A in the figure;

[0033] Figure 8 The structure schematic diagram of the polishing assembly in the plate polishing device of the embodiment of the application;

[0034] Figure 9 Another structure schematic diagram of the polishing assembly in the plate polishing device of the embodiment of the application;

[0035] Figure 10 Another structure schematic diagram of the polishing assembly in the plate polishing device of the embodiment of the application;

[0036] Figure 11 Fig. 6 is a schematic view of another structure of the polishing assembly in the plate polishing device according to an embodiment of the present application;

[0037] Fig. 1 is a schematic view of a plate polishing device according to an embodiment of the present application, Fig. 2 is a schematic view of a polishing assembly in the plate polishing device according to an embodiment of the present application, Fig. 3 is a schematic view of another structure of the polishing assembly in the plate polishing device according to an embodiment of the present application, Fig. 4 is a schematic view of another structure of the polishing assembly in the plate polishing device according to an embodiment of the present application, Fig. 5 is a schematic view of another structure of the polishing assembly in the plate polishing device according to an embodiment of the present application, and Fig. 6 is a schematic view of another structure of the polishing assembly in the plate polishing device according to an embodiment of the present application. DETAILED DESCRIPTION

[0038] In order to better understand and implement, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the accompanying drawings in the embodiments of the present application.

[0039] In the description of the present application, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments and are not intended to limit the present application.

[0041] In the prior art, the surface polishing of plates such as stone, rock plate, ceramic plate, metal plate and glass is an important link in the processing process, which continuously polishes the surface of the plate through the polishing head to make the surface of the plate reach a certain gloss.

[0042] The existing plate polishing device is polished by multiple polishing grinding heads swinging uniformly. However, the edge profile of the plate is usually irregular, and the width of each plate is also different during polishing production. In the existing polishing plate equipment, there is a plate edge profile sensor in front of the feeding direction. When the edge profile of the plate is detected, the grinding head will be lifted to avoid the grinding head grinding on the conveying belt (see Figure 1 , Figure 1 Specifically, the plate polishing and grinding trajectory diagram of the existing polishing plate equipment) ; then, the grinding head continues to swing outward (i.e. in the direction of arrow B), and turns back to swing until the grinding head swings to the outermost position (i.e. swings back to B1 line), and returns to the edge profile position of the plate, and the grinding head is lowered to continue the polishing work.

[0043] It can be seen that in order to prevent the grinding head from grinding on the conveying belt, the grinding head will be lifted, however, the grinding head after being lifted is still rotating, but will not contact with the plate, and is in the state of idling and doing useless work (i.e. the area between B1 and B2 in the figure, the grinding head does useless work), which wastes energy. In addition, the lifting of the grinding head is not timely and the impact generated by the lifting will cause poor edge polishing effect of the plate, and the edge position of the plate is prone to yellow edge and shadow problems.

[0044] Referring to Figures 2-11 The present application discloses a plate polishing and grinding device and a plate polishing and grinding method for irregular plates 7 using the same.

[0045] Embodiment 1 Structure of a plate polishing and grinding device

[0046] Referring to Figures 2-11 The present embodiment discloses a plate polishing and grinding device, which can be specifically applied to irregular profile plates 7 and can be adaptively connected for polishing, wherein the polishing objects include but are not limited to stone, rock plate, ceramic plate, metal plate, glass and other plates 7, and the specific structure is as follows:

[0047] The plate polishing and grinding device comprises a conveying assembly 2, a polishing and grinding assembly 3 and a detection assembly 4.

[0048] The conveying assembly 2 has a conveying plane for conveying the plate 7; the polishing and grinding assembly 3 is arranged on the upper side of the conveying assembly 2, and the polishing and grinding assembly 3 comprises a grinding head unit 31 which can swing in a first direction and a second direction; wherein in the conveying plane, the first direction is the conveying direction of the conveying assembly 2, and the second direction is the direction perpendicular to the conveying direction of the conveying assembly 2; the detection assembly 4 is located at the plate feeding end of the conveying assembly 2, and is used for detecting the outer profile size of the plate 7.

[0049] The plurality of grinding head swing-back inflection points 5 are arranged on the outer edge profile of the plate 7, and the polishing trajectory 73 is planned according to the plurality of grinding head swing-back inflection points 5, and the grinding head unit 31 swings along the polishing trajectory 73 to polish the plate 7.

[0050] It should be noted that the first direction is the X direction in the above description, Figure 2 and the second direction is the Y direction in the above description. Figure 2

[0051] In view of the problem that the existing plate polishing device has idle grinding head and poor edge polishing effect of the plate 7, the plate polishing device of the embodiment improves the polishing structure, the detection assembly 4 detects the respective corresponding outer edge profile size of the plate 7 in real time, determines a plurality of grinding head swing-back inflection points 5 on the respective corresponding outer edge profile, and plans a respective corresponding polishing trajectory 73 through a preset algorithm, so that the polishing swing range of the grinding head unit 31 is self-adaptive to the outer edge profile of the plate 7, and the plate 7 of different shapes is polished self-adaptively, avoiding the idle grinding head unit 31 and improving the efficiency and reducing the energy consumption.

[0052] At the same time, the self-adaptive polishing of the plate 7 of different shapes can improve the polishing quality of the plate 7, especially the edge polishing effect, and prevent the edge of the plate from having yellow edges and dark shadows.

[0053] Preferably, how to determine the grinding head swing-back inflection points 5 on the outer edge profile of the plate 7 can be that the detection assembly 4 detects the outer edge profile size of the plate 7, a speed sensor detects the conveying speed of the plate 7, and a computer preset algorithm software automatically calculates the grinding head swing-back inflection points 5 according to the outer edge profile size and the conveying speed, and then connects the plurality of grinding head swing-back inflection points 5 in sequence to form the polishing trajectory 73, which can be referred to in Figure 4 and Figure 5 .

[0054] Referring to Figures 9-11 Optionally, the grinding head unit 31 can ascend and descend along a third direction, wherein the third direction is the height direction of the conveying assembly 2; the detection assembly 4 is further configured to detect the inner edge profile size of the hole on the plate 7; wherein the grinding head ascending point 61 and the grinding head descending point 62 are determined on the inner edge profile of the plate 7, the ascending and descending trajectory 74 of the hole is formed according to the grinding head ascending point 61 and the grinding head descending point 62, the grinding head unit 31 ascends and descends along the ascending and descending trajectory 74, and the ascending and descending trajectory 74 is formed in the polishing trajectory 73. In the illustrated embodiment, the third direction is the Z direction.

[0055] ​In view of the fact that some of the existing plates 7 have holes, in order to prevent the contact between the grinding head unit 31 and the conveying belt 21 of the conveying assembly 2 through the holes of the plate 7, the grinding head unit 31 needs to be raised at the edge of the hole and then lowered after passing through the hole to continue the grinding, so that the grinding head unit 31 can be lifted in the third direction to avoid the hole, so as to more adaptively grind the plate 7.

[0056] At the same time, the lifting track 74 is planned in the grinding track 73, which can combine the lifting track 74 of the lifting point of the grinding head unit 31 into the grinding track 73 of the grinding head unit 31, effectively plan the grinding track 73 with the highest grinding efficiency, and improve the grinding efficiency; at the same time, it can also avoid the hole and prevent the contact between the grinding head unit 31 and the conveying belt 21.

[0057] It should be noted that, in view of the fact that the existing plate 7 has two types of plates 7, one of which is a plate 7 without holes, and at this moment the profile size of the plate 7 detected by the detection assembly 4 is the outer edge profile size; the other is a plate 7 with holes, and at this moment the profile size of the plate 7 detected by the detection assembly 4 is the outer edge profile size and the inner edge profile size. Therefore, the plate grinding device can be applied to at least two different types of irregular plates 7.

[0058] Specifically, when the plate 7 without holes needs to be ground, referring to Figure 6 , the plate grinding device can calculate the grinding track 73 according to the outer edge profile size of the plate 7 detected by the detection assembly 4 and the conveying speed, and preset the algorithm software of the computer to calculate the swing inflection point 5 of the grinding head, and drive the grinding head unit 31 to swing along the grinding track 73.

[0059] Further specifically, when the plate 7 with holes needs to be ground, referring to Figure 7 , the plate grinding device can calculate the grinding track 73 and the lifting track 74 according to the outer edge profile size, the inner edge profile size and the conveying speed of the plate 7 detected by the detection assembly 4, and preset the algorithm software of the computer to calculate the swing inflection point 5 of the grinding head, the lifting point 61 and the lowering point 62 of the grinding head, and control the driving of the grinding head unit 31 to swing along the grinding track 73 and lift along the lifting track 74.

[0060] It should be noted that, referring to Figure 4 and Figure 5 , the swing inflection point 5 of the grinding head refers to the turning point of the grinding head unit 31 moving on the surface of the plate 7 to the outer profile of the circumferential outer surface of the plate 7, and the turning angle of the turning point can be approximately 90° or other suitable angles, which needs to be determined according to the actual outer profile of the plate 7; the lifting point 61 and the lowering point 62 of the grinding head refer to the lifting or lowering of the grinding head unit 31 moving on the surface of the plate 7 to the inner profile on the hole of the plate 7, and the lifting height can be set according to the actual situation.

[0061] Reference Figure 4 and Figure 5 Optionally, the plurality of grinding head swing-back inflection points 5 are arranged on the opposite two-side outer edge profiles of the plate 7 along the second direction.

[0062] Wherein, on one of the two-side outer edge profiles, the plurality of grinding head swing-back inflection points 5 are sequentially marked as the ith, where i={1, 2, …, n}, n represents the corresponding number and n is a natural number greater than 1, along the first direction; on the other of the two-side outer edge profiles, the plurality of grinding head swing-back inflection points 5 are sequentially marked as the rth, where r={1, 2, …, n}, n represents the corresponding number and n is a natural number greater than 1, along the first direction; the plurality of grinding head swing-back inflection points 5 are arranged to move along the path of the ith=1, the rth=1, the rth=2, the ith=2, the ith=3, the rth=3, …, the ith=n or the rth=m, to form the grinding track 73. In this way, the specific positions of the grinding head swing-back inflection points 5 are located on the opposite two-side outer edge profiles of the plate 7 along the second direction, and the plurality of grinding head swing-back inflection points 5 are connected in a certain logical order to form the grinding track 73, wherein the logical order is: first connected to the grinding head swing-back inflection points 5 on the opposite side, then connected to the grinding head swing-back inflection points 5 on the same side, and then connected to the grinding head swing-back inflection points 5 on the opposite side, that is, first connected on the opposite side, then connected on the same side, to form the grinding track 73, so that a grinding track 73 similar to a wave shape can be formed, which can well cover the surface of the plate 7 to be ground, thereby improving the grinding efficiency.

[0063] Reference Figure 4 and Figure 5 Optionally, the ith grinding head swing-back inflection point 5 and the rth grinding head swing-back inflection point 5 are arranged in alignment along the second direction, where i=r. In this way, the first grinding head swing-back inflection point 5 and the first grinding head swing-back inflection point 5 are arranged in alignment, the second grinding head swing-back inflection point 5 and the second grinding head swing-back inflection point 5 are arranged in alignment, and the third grinding head swing-back inflection point 5 and the third grinding head swing-back inflection point 5 are arranged in alignment, so that the two grinding head swing-back inflection points 5 on the opposite sides are arranged in alignment, which can effectively simplify the determination of the positions of the grinding head swing-back inflection points 5 on the outer edge profile, thereby improving the efficiency of determining the grinding head swing-back inflection points 5.

[0064] Meanwhile, it should be noted that the grinding track 73 of the grinding head unit 31 on the surface of the plate 7 forms a shape similar to a square wave, as shown in Figure 4 and Figure 5 This can further fully polish the surface of the plate 7 and improve the grinding efficiency.

[0065] It should be noted that, in order to facilitate the understanding of the determination of the position of the grinding head swing back inflection point 5 and the grinding trajectory 73, the relative two side edge contours of the plate 7 along the second direction are exemplified as the upper and lower two side edge contours.

[0066] The grinding trajectory 73 specifically includes a first grinding path 731 and a second grinding path 732, a plurality of grinding head swing back inflection points 5 are arranged on the upper and lower two side edge contours of the plate 7 along the second direction, the plurality of grinding head swing back inflection points 5 on the upper and lower two side edge contours are arranged in pairs in alignment and form the first grinding path 731, the two grinding head swing back inflection points 5 on the same side contour form the second grinding path 732, and the second grinding path 732 is arranged in sequence between the adjacent two first grinding paths 731 in one above the other and along the first direction.

[0067] Through the detection assembly 4 to obtain the contour size of the plate 7, the computer preset algorithm software will determine the plurality of grinding head swing back inflection points 5 according to the above-mentioned determination method, the plurality of grinding head swing back inflection points 5 will be connected by two grinding head swing back inflection points 5 arranged in alignment on the upper and lower edge contours to form the first grinding path 731, and the two grinding head swing back inflection points 5 on the same edge contour are connected to form the second grinding path 732, and the second grinding path 732 is arranged in sequence between the adjacent two first grinding paths 731 in one above the other, to form a nearly square wave-shaped grinding path. Of course, in other embodiments, the spacing between the grinding head swing back inflection points 5 on the same edge contour can also be different, and the spacing size can be planned according to the actual size of the plate 7.

[0068] It should be noted that the same spacing between the grinding head swing back inflection points 5 on the same edge contour means that the adjacent two first grinding paths 731 are the same.

[0069] Referring to Figure 4 and Figure 5 Optionally, the grinding trajectory 73 between the i-th grinding head swing back inflection point 5 and the r-th grinding head swing back inflection point 5 is the first grinding path 731, where i=r; wherein the first grinding path 731 sets the grinding head lifting point 61 and the grinding head lowering point 62 at the inner edge contour of the hole on the plate 7. In this way, the lifting and lowering trajectory 74 of the lifting and lowering points of the grinding head unit 31 can be specifically combined into the first grinding path 731 of the grinding trajectory 73, the grinding efficiency of the grinding trajectory 73 can be effectively planned to improve the grinding efficiency; at the same time, the hole can also be avoided to prevent the grinding head unit 31 from contacting the conveying belt 21.

[0070] Referring to Figures 6-11 Optionally, the plate grinding device further comprises a rack 1.

[0071] The polishing assembly 3 further comprises a first guide rail 11, a first beam body 33, a fixing base 34, a first direction swing driving unit 35 and a second direction swing driving unit 36.

[0072] The first guide rail 11 is connected with the rack 1, the first beam body 33 is slidably connected with the first guide rail 11, the fixing base 34 is slidably connected with the first beam body 33, the polishing head unit 31 is arranged on the fixing base 34, the first direction swing driving unit 35 is used for driving the fixing base 34 to move relative to the first beam body 33 along a first direction, and the second direction swing driving unit 36 is used for driving the first beam body 33 to move relative to the first guide rail 11 along a second direction.

[0073] In view of the fact that the polishing head unit 31 can swing along the first direction and the second direction to polish the plate 7, in the embodiment, the first guide rail 11 is arranged on the rack 1, the first beam body 33 is arranged on the first guide rail 11, the fixing base 34 is arranged on the first beam body 33, and the polishing head unit 31 is arranged on the fixing base 34. The second direction swing driving unit 36 is used for driving the first beam body 33 to move along the second direction. At this moment, the first beam body 33, the fixing base 34 and the polishing head unit 31 all move along the second direction.

[0074] Meanwhile, the first direction swing driving unit 35 is used for driving the fixing base 34 to move along the first direction. At this moment, the fixing base 34 and the polishing head unit 31 both move along the first direction, that is, the polishing head unit 31 can move along the first direction and the second direction, and the plate 7 can be polished according to the polishing track 73.

[0075] In other embodiments, the first direction swing driving unit 35 can be a linear movement module, such as a synchronous belt type linear module, a ball screw type linear module, a linear motor module or a telescopic air cylinder, which is used for driving the polishing head unit 31 to move linearly along the first direction.

[0076] In other embodiments, the second direction swing driving unit 36 can be a linear movement module, such as a synchronous belt type linear module, a ball screw type linear module, a linear motor module or a telescopic air cylinder, which is used for driving the polishing head unit 31 to move linearly along the second direction.

[0077] Referring to Figures 6-11 Optionally, the first direction swing driving unit 35 is connected with the fixing base 34, and the second direction swing driving unit 36 is connected with the first beam body 33. A straight rack 321 is fixed on the first guide rail 11, the first beam body 33 is slidably arranged on the first guide rail 11, and a driving end of the second direction swing driving unit 36 is provided with a gear 322 which is engaged with the straight rack 321. A driving end of the first direction swing driving unit 35 is provided with a rotating disc 37 which is eccentric and rotatably connected with a connecting rod 371. One end of the connecting rod 371 which is away from the rotating disc 37 is rotatably connected with the first beam body 33.

[0078] In view of the fact that the first direction swing driving unit 35 and the second direction swing driving unit 36 can drive the grinding head unit 31 to move along the first direction and the second direction, the specific implementation structure in the embodiment can be that a straight rack 321 is fixed on the first guide rail 11, the second direction swing driving unit 36 is arranged on the first beam body 33, and the driving end of the second direction swing driving unit 36 is provided with a gear 322. The second direction swing driving unit 36 drives the gear 322 to rotate, and the gear 322 and the straight rack 321 are engaged. Since the straight rack 321 is fixed on the first guide rail 11, the straight rack 321 is fixed and thus the gear 322 will move on the straight rack 321 along the second direction, thereby driving the second direction swing driving unit 36, the first beam body 33, the fixed seat 34, the first direction swing driving unit 35 and the grinding head unit 31 to move along the second direction.

[0079] Moreover, the driving end of the first direction swing driving unit 35 is provided with a rotating disc 37, one end of a connecting rod 371 is eccentrically arranged on the rotating disc 37, and the other end of the connecting rod 371 is connected with the first beam body 33. Thus, when the first direction swing driving unit 35 drives the rotating disc 37 to rotate, the relative distance between the first direction swing driving unit 35 and the first beam body 33 in the first direction can be changed through the change of the position of the connecting rod 371 itself, thereby driving the fixed seat 34 and the grinding head unit 31 to move along the first direction. In this way, the grinding head unit 31 can move along the first direction and the second direction, the plate material 7 is polished according to the polishing trajectory 73, and the structure is more compact.

[0080] Optionally, the first direction swing driving unit 35 and the second direction swing driving unit 36 can be servo motors.

[0081] Referring to Figures 6-11 Optionally, the polishing assembly 3 further comprises a third direction lifting driving unit 38 connected with the fixed seat 34, a driving end of the third direction lifting driving unit 38 being provided with a main shaft 381 connected with the grinding head unit 31; and a grinding head rotating driving unit 39 connected with the fixed seat 34, a driving end of the grinding head rotating driving unit 39 being connected with a rotating shaft sleeve 382 through a transmission belt 391, the rotating shaft sleeve 382 being sleeved on the main shaft 381, one of the main shaft 381 and the rotating shaft sleeve 382 being provided with a guide key and the other being provided with a guide slot.

[0082] Specifically, a guide groove is formed in the inner wall of the rotating sleeve 382 in the axial direction, the axial direction of the main shaft 381 is parallel to the axial direction of the rotating sleeve 382, a guide key is arranged on the main shaft 381 and slidably embedded in the guide groove. In the illustrated embodiment, the axial direction of the inner wall of the rotating sleeve 382 is the third direction, i.e., the Z direction. Specifically, a rotating bearing is arranged between the lifting end of the third direction lifting driving unit 38 and the main shaft 381, and a rotating bearing is also arranged between the rotating sleeve 382 and the fixed seat 34.

[0083] Since the grinding head unit 31 can rotate to polish and grind the plate 7 and can also be lifted in the third direction, in the specific implementation structure in the embodiment, the grinding head rotating driving unit 39 drives the rotating sleeve 382 to rotate through the transmission belt 391, the rotating sleeve 382 drives the main shaft 381 to rotate through the guide key, and the main shaft 381 drives the grinding head unit 31 to rotate, thereby polishing and grinding the plate 7.

[0084] Meanwhile, when the grinding head unit 31 needs to be lifted to avoid the hole, the third direction lifting driving unit 38 is extended or retracted to drive the main shaft 381 to be extended or retracted, and the main shaft 381 drives the grinding head unit 31 to be lifted. Since the guide key can slide in the axial direction in the guide groove, the grinding head unit 31 can be lifted without affecting the rotation of the grinding head unit 31, thereby realizing the rotation and lifting of the grinding head unit 31. Meanwhile, the structure is compact and occupies a small area.

[0085] Optionally, the third direction lifting driving unit 38 can be a linear motion module, such as a synchronous belt type linear module, a ball screw type linear module, a linear motor module, or a telescopic pneumatic cylinder, to drive the grinding head unit 31 to move linearly in the third direction.

[0086] Optionally, the grinding head rotating driving unit 39 can be a servo motor.

[0087] Optionally, pulleys are arranged on the grinding head rotating driving unit 39 and the third direction lifting driving unit 38 corresponding to the positions where the transmission belt 391 contacts.

[0088] In other embodiments, the grinding head unit 31 can also be driven by the polishing grinding head driving device of patent application No. CN202210736268.6 to realize the rotation and lifting of the grinding head unit 31.

[0089] In other embodiments, the grinding head unit 31 can also be arranged on the rack 1 through an XYZ moving platform. The XYZ moving platform is also called a three-coordinate high-precision moving platform, which is a platform that can move accurately in the X, Y, and Z directions. The XYZ platform mainly includes an X-axis moving part, a Y-axis moving part, and a Z-axis moving part, which are prior art and will not be described in detail.

[0090] ReferenceFigure 6 Optionally, a plurality of polishing components 33 are provided, and the plurality of polishing components 33 are sequentially and spacedly arranged on the upper side of the conveying component 2 along the first direction. In this way, the grinding head unit 31 in each polishing component 33 can swing along the first direction and the second direction and can be lifted along the third direction, each grinding head unit 31 is independently controlled, and the plate 7 is sequentially polished for multiple times, so as to improve the polishing effect of the plate 7; and the two adjacent plates 7 can be conveyed without interval, the continuous polishing of the plate 7 is realized, and the production efficiency is improved.

[0091] Preferably, the detection component 4 can be a detection tool for obtaining the profile size of the irregular plate 7, for example, a detection tool with an image sensor related to image vision, such as a camera based on a CCD (Charge-coupled Device) chip or a camera based on a CMOS (Complementary Metal Oxide Semiconductor); for example, a detection tool for detecting the profile size of the irregular plate 7 by using laser or ultrasonic wave, such as a profile measuring instrument, which can measure the profile of the measured object by using laser detection principle. The above-mentioned detection tool can obtain the edge profile position data of the plate 7, and the edge profile size data of the plate 7 can be obtained through the program calculation built in the detection tool, so as to provide a basis for the subsequent polishing movement.

[0092] In addition, since the profile of the plate 7 detected by the detection component 4 specifically includes an outer profile and an inner profile, the above-mentioned detection tool can specifically obtain the outer edge profile position 71 data and the inner edge profile position 72 data of the plate 7, and the outer edge profile size data and the inner edge profile size data of the plate 7 can be obtained through the program calculation built in the detection tool, so as to provide a basis for the subsequent polishing movement.

[0093] Preferably, the conveying component 2 comprises a conveying belt 21, a driving shaft, a driven shaft and a conveying driving member, the driving shaft and the driven shaft are respectively arranged on the two sides of the rack 1 along the first direction, and the axis lines of the driving shaft and the driven shaft are perpendicular to the first direction of the rack 1, the conveying belt 21 is sleeved on the driving shaft and the driven shaft, and the conveying driving member is arranged on one side of the rack 1, and the output end of the conveying driving member is connected with the driving shaft. In this way, the conveying driving member drives the driving shaft to rotate, the driving shaft, the driven shaft and the conveying belt 21 are matched, the conveying belt 21 is driven to rotate, and the plate 7 is conveyed. Further preferably, the conveying driving member is a servo motor.

[0094] Embodiment 2: A plate polishing method

[0095] The embodiment discloses a plate polishing method, which can be specifically applied to the irregular profile plate 7 for self-adaptive connection polishing. The plate 7 can be polished by using the plate polishing device in the embodiment 1, and the specific steps are as follows:

[0096] S10: Obtain the outer edge contour position 71 data of the plate 7, and calculate the outer edge contour size data of the plate 7 by using the outer edge contour position 71 data of the plate 7;

[0097] S11: Determine the swing-back inflection point 5 of the grinding head based on the outer edge contour size data of the plate 7 and the conveying speed data;

[0098] S12: Plan the grinding trajectory 73 based on the swing-back inflection point 5 of the grinding head;

[0099] S13: Drive the grinding head unit 31 to swing along the grinding trajectory 73 to perform adaptive edge contour grinding.

[0100] In view of the problems of the existing plate polishing device, such as idle running of the grinding head, useless work, and poor edge polishing effect of the plate 7, the plate grinding method of the embodiment obtains the outer edge contour position 71 data of plates 7 of different shapes, calculates the outer edge contour size data of the plates 7 of different shapes, determines a plurality of swing-back inflection points 5 of the grinding head on the respective corresponding outer edge contours, and plans to form respective corresponding grinding trajectories 73, so that the grinding swing range of the grinding head unit 31 is adaptive to the outer edge contour of the plate 7 of different shapes, and the plate 7 of different shapes can be adaptively ground, avoiding the idle running of the grinding head unit 31, improving the efficiency, and reducing the energy consumption. At the same time, the adaptive grinding of the plates 7 of different shapes can improve the surface grinding quality of the plate 7, especially the edge polishing effect, and prevent the edge position of the plate 7 from appearing yellow edge and shadow.

[0101] Embodiment 3: A plate grinding method

[0102] The embodiment discloses a plate grinding method, which can be specifically applied to irregular contour plates 7 for adaptive connection grinding. The plate 7 can be ground by using the plate grinding device in embodiment 1. At the same time, in view of the fact that some existing plates 7 have holes, in order to prevent the grinding head unit 31 from contacting the conveying belt 21 of the conveying assembly 2 when passing through the holes of the plate 7, the grinding head unit 31 needs to be raised when reaching the edge of the hole, and then lowered to continue grinding after passing through the hole. Therefore, the specific steps are as follows:

[0103] S20: Obtain the outer edge contour position 71 data of the plate 7, and calculate the outer edge contour size data of the plate 7 by using the outer edge contour position 71 data of the plate 7;

[0104] S21: Obtain the inner edge contour position 72 data of the plate 7, and calculate the inner edge contour size data of the plate 7 by using the inner edge contour position 72 data of the plate 7;

[0105] S22: Determine the swing-back inflection point 5 of the grinding head based on the outer edge profile size data of the plate 7 and the conveying speed data;

[0106] S23: Plan the grinding trajectory 73 based on the swing-back inflection point 5 of the grinding head;

[0107] S24: Determine the grinding head lifting point 61 and the grinding head lowering point 62 based on the inner edge profile size data of the plate 7 and the conveying speed data;

[0108] S25: Plan the lifting and lowering trajectory 74 based on the grinding head lifting point 61 and the grinding head lowering point 62;

[0109] S26: Drive the grinding head unit 31 to swing along the grinding trajectory 73 and drive the grinding head unit 31 to lift and lower along the lifting and lowering trajectory 74 to perform adaptive edge profile grinding.

[0110] In this way, the grinding head unit 31 can be prevented from contacting the conveying belt 21 of the conveying assembly 2 when passing through the hole of the plate 7, and the grinding head unit 31 needs to be lifted to the edge of the hole and then lowered after passing through the hole to continue grinding, so that the grinding head unit 31 can be lifted and lowered in the third direction to avoid the hole and more adaptively grind the plate 7; at the same time, the lifting and lowering trajectory 74 is planned in the grinding trajectory 73, which can combine the lifting and lowering trajectory 74 of the lifting and lowering points of the grinding head unit 31 into the grinding trajectory 73 of the grinding head unit 31, effectively plan the grinding trajectory 73 with the highest grinding efficiency, and improve the grinding efficiency; at the same time, the hole can be avoided to prevent the grinding head unit 31 from contacting the conveying belt 21.

[0111] Optionally, the specific steps of the plate grinding method can first plan the grinding trajectory 73 in S23, and then determine the grinding head lifting point 61 and the grinding head lowering point 62 based on the inner edge profile size data of the plate 7, the conveying speed data, and the grinding trajectory 73 in step S24.

[0112] Embodiment 4: A plate grinding method

[0113] The embodiment discloses a plate grinding method, which can be specifically applied to irregular profile plates 7 for adaptive connection grinding. The plate 7 can be ground by using the plate grinding device in embodiment 1. At the same time, in order to realize the movement of the grinding head unit 31 in the first direction, the second direction, and the third direction, and realize the adaptive grinding of plates 7 with different shapes, the specific implementation steps are as follows:

[0114] S30: Use the detection assembly 4 to obtain the outer edge profile position 71 data of the plate 7, and use the outer edge profile position 71 data of the plate 7 to calculate the outer edge profile size data of the plate 7 by using the program built in the detection assembly 4;

[0115] S31: Obtain the inner edge contour position 72 data of the plate 7 using the detection assembly 4, and calculate the inner edge contour size data of the plate 7 using the program built in the detection assembly 4 based on the inner edge contour position 72 data of the plate 7;

[0116] S32: Determine the swing-back inflection point 5 of the grinding head based on the outer edge contour size data of the plate 7 and the conveying speed data;

[0117] S33: Plan the swing-back trajectory 73 using a preset algorithm based on the swing-back inflection point 5 of the grinding head;

[0118] S34: Determine the grinding head lifting point 61 and the grinding head lowering point 62 based on the inner edge contour size data of the plate 7 and the conveying speed data;

[0119] S35: Plan the lifting and lowering trajectory 74 using a preset algorithm based on the grinding head lifting point 61 and the grinding head lowering point 62;

[0120] S36: Drive the grinding head unit 31 to swing along the swing-back trajectory 73 using the first-direction swing drive unit 35 and the second-direction swing drive unit 36, and drive the grinding head unit 31 to lift and lower along the lifting and lowering trajectory 74 using the third-direction lifting and lowering drive unit 38, to perform adaptive edge contour grinding.

[0121] The technical means disclosed in the present application is not limited to the technical means disclosed in the above embodiments, and also includes technical solutions composed of any combination of the above technical features. It should be noted that, for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which are also considered within the scope of protection of the present application.

Claims

1. A plate polishing apparatus characterized by comprising: The plate polishing device comprises: a conveying assembly (2) having a conveying plane for conveying a plate (7); a polishing assembly (3) disposed on the upper side of the conveying assembly (2), wherein the polishing assembly (3) comprises a polishing head unit (31) swingable in a first direction and a second direction; wherein, in the conveying plane, the first direction is the conveying direction of the conveying assembly (2), and the second direction is the direction perpendicular to the conveying direction of the conveying assembly (2); a detection assembly (4) located at the plate (7) entry end of the conveying assembly (2) and used for detecting the outer edge profile size of the circumferential outer side of the plate (7); wherein a plurality of polishing head swing-back inflection points (5) are arranged on the outer edge profile of the plate (7), and a polishing track (73) is planned according to the plurality of polishing head swing-back inflection points (5), and the polishing head unit (31) swings along the polishing track (73) to polish the plate (7); the polishing head unit (31) is liftable in a third direction, wherein the third direction is the height direction of the conveying assembly (2); and the detection assembly (4) is further used for detecting the inner edge profile size of a hole on the plate (7); wherein a polishing head lifting point (61) and a polishing head lowering point (62) are determined on the inner edge profile of the plate (7), and a lifting and lowering track (74) of the hole is formed according to the polishing head lifting point (61) and the polishing head lowering point (62), the polishing head unit (31) lifts and lowers along the lifting and lowering track (74), and the lifting and lowering track (74) is formed in the polishing track (73).

2. A plate polishing apparatus according to claim 1, wherein a plurality of polishing head swing-back inflection points (5) are spaced and planned on the outer edge profiles of the opposite two sides of the plate (7) in the second direction; wherein, on one side of the outer edge profile, the plurality of polishing head swing-back inflection points (5) are sequentially marked as the ith, wherein i = {1, 2,..., n}, n represents the corresponding number and n is a natural number greater than 1, in the first direction; on the other side of the outer edge profile, the plurality of polishing head swing-back inflection points (5) are sequentially marked as the rth, r = {1, 2,..., n}, n represents the corresponding number and n is a natural number greater than 1, in the first direction; the plurality of polishing head swing-back inflection points (5) are moved in the path of the ith = 1, the rth = 1, the rth = 2, the ith = 2, the ith = 3, the rth = 3,..., the ith = n or the rth = m to form the polishing track (73).

3. The plate polishing device according to claim 2, wherein the ith polishing head swing-back inflection point (5) and the rth polishing head swing-back inflection point (5) are disposed in alignment in the second direction, wherein i = r.

4. The apparatus of claim 2 wherein: the polishing track (73) between the ith polishing head swing-back inflection point (5) and the rth polishing head swing-back inflection point (5) is a first polishing path (731), wherein i = r; wherein the first polishing path (731) passes through the inner edge profile of the hole on the plate (7) to dispose the polishing head lifting point (61) and the polishing head lowering point (62).

5. A plate polishing apparatus according to any one of claims 1 to 4, wherein The plate polishing device further comprises a rack (1), and the polishing assembly (3) further comprises: a first guide rail (32) connected with the rack (1); A first beam body (33) is slidably connected with the first guide rail (32); A fixed seat (34) is slidably connected with the first beam body (33), and the grinding head unit (31) is arranged on the fixed seat (34); A first direction swing driving unit (35) is arranged for driving the fixed seat (34) to move relative to the first beam body (33) along a first direction; A second direction swing driving unit (36) is arranged for driving the first beam body (33) to move relative to the first guide rail (32) along a second direction.

6. A plate polishing apparatus according to claim 5, wherein The first direction swing driving unit (35) is connected with the fixed seat (34), and the second direction swing driving unit (36) is connected with the first beam body (33); A straight rack (321) is fixed on the first guide rail (32), the first beam body (33) is slidably arranged on the first guide rail (32), and a driving end of the second direction swing driving unit (36) is provided with a gear (322) engaged with the straight rack (321); A driving end of the first direction swing driving unit (35) is provided with a rotating disc (37), the rotating disc (37) is eccentric and rotationally connected with a connecting rod (371), and one end of the connecting rod (371) away from the rotating disc (37) is rotationally connected with the first beam body (33).

7. The apparatus of claim 5 wherein: The polishing and grinding assembly (3) further comprises: A third direction lifting driving unit (38) is connected with the fixed seat (34), a lifting end of the third direction lifting driving unit (38) is provided with a main shaft (381), and the main shaft (381) is connected with the grinding head unit (31); A grinding head rotation driving unit (39) is connected with the fixed seat (34), a driving end of the grinding head rotation driving unit (39) is connected with a rotating shaft sleeve (382) through a conveying belt (391), the rotating shaft sleeve (382) is arranged on the main shaft (381), and one of the main shaft (381) and the rotating shaft sleeve (382) is provided with a guide key and the other is provided with a guide slot.

8. A method of plate polishing, characterized by, A plate polishing and grinding device applied to any one of claims 1-7, comprising the following steps: Obtaining outer edge contour position (71) data of the plate (7), and calculating outer edge contour size data of the plate (7) by using the outer edge contour position (71) data of the plate (7); Determining a grinding head swing back inflection point (5) based on the outer edge contour size data of the plate (7) and the conveying speed data; Planning a polishing and grinding track (73) based on the grinding head swing back inflection point (5); Driving the grinding head unit (31) to swing along the polishing and grinding track (73) to perform self-adaptive edge contour polishing and grinding.

9. A method of plate polishing according to claim 8, wherein Further comprising the following steps: Obtaining inner edge contour position (72) data of the plate (7), and calculating inner edge contour size data of the plate (7) by using the inner edge contour position (72) data of the plate (7); Determining a grinding head lifting point (61) and a grinding head lowering point (62) based on the inner edge contour size data of the plate (7) and the conveying speed data; Planning a lifting and lowering track (74) based on the grinding head lifting point (61) and the grinding head lowering point (62); The drive head unit (31) is raised and lowered along a lifting trajectory (74).

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