A preparation method of a gypsum IC card and a gypsum IC card
By adding gypsum slurry with different water contents in batches and using emulsifiers, defoaming agents and other means, the imprint problem in the preparation of gypsum IC cards was solved, environmentally friendly and personalized gypsum IC card preparation was achieved, and user experience was improved.
Patent Information
- Application Number
- CN202311261755.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-26
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2043-09-26
AI Technical Summary
Existing IC cards mainly use non-renewable petrochemical-based materials, resulting in high consumption and inability to meet users' personalized needs. The preparation technology of gypsum IC cards is difficult, and it is difficult to maintain the clarity of the imprint of the functional part of the IC card in the fluid gypsum.
The method of adding gypsum slurries with different water contents twice is adopted. First, the first gypsum slurry with high water content is added and slightly solidified before burying the IC card functional part. Then the second gypsum slurry with low water content is added and solidified. Emulsifiers, defoaming agents and fragrances are used in combination to ensure that the IC card functional part does not sink to the bottom and improve the curing quality.
An environmentally friendly gypsum IC card is prepared with personalized appearance and fragrance, no marks on the surface, good user experience, meeting personalized design needs, and the IC card function is not affected.
Smart Images
Figure CN117325311B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of IC card preparation, in particular to a preparation method of a gypsum IC card and a gypsum IC card. Background Art
[0002] Currently, common IC cards on the market still use non-renewable petrochemical-based materials such as PVC, PC, and PET. Considering the number of cards held per capita in China and the frequency of IC card product iterations, the consumption of petrochemical-based materials in the IC card industry is staggering. Furthermore, as user demands for personalization continue to grow, IC cards with standard patterns no longer meet their needs.
[0003] Gypsum is an environmentally friendly material widely used in various fields. Its surface is graffiti-resistant, meeting public demands for both environmental protection and aesthetics. However, the performance of gypsum differs significantly from that of petrochemical-based materials. Gypsum is fluid before curing, and currently common gypsum pouring methods, primarily used for mold preparation, fail to address the problem of IC card markings appearing on the surface of the gypsum card after curing. Therefore, gypsum IC cards present significant technical challenges, and few such products are currently available on the domestic market. Summary of the Invention
[0004] The first object of the present invention is to provide a method for preparing a gypsum IC card, so as to solve the problem that the gypsum IC card is difficult to prepare.
[0005] The second object of the present invention is to provide a gypsum IC card prepared by the above-mentioned method for preparing a gypsum IC card.
[0006] In order to achieve the above-mentioned first objective, the present invention provides a method for preparing a gypsum IC card, comprising the following steps:
[0007] S1: preparing a first gypsum slurry and a second gypsum slurry, the first gypsum slurry comprising gypsum and water, wherein the mass ratio of gypsum to water is 2:1 to 3:1, and the second gypsum slurry comprising gypsum and water, wherein the mass ratio of gypsum to water is 3:1 to 4:1;
[0008] S2: pouring the first gypsum slurry into the mold, at least completely covering the bottom surface of the mold but not covering the entire mold, and letting it stand for 3 minutes to 10 minutes;
[0009] S3: burying at least a portion of the IC card functional part in the first gypsum slurry and leaving it to stand for 30 to 60 minutes, so that the IC card functional part has the reading and writing functions of the IC card;
[0010] S4: Pour the second gypsum slurry into the mold and let it stand for 3 to 5 hours before taking it out;
[0011] S5: Continue drying the gypsum IC card taken out in step S4 for 24 hours to 48 hours.
[0012] As can be seen from the above scheme, the gypsum slurry is added in two batches, and the water content of the two gypsum slurries is different. After adding the first gypsum slurry in step S2, it is left to stand for a period of time to allow the gypsum to slightly solidify before adding the IC card functional part. This can effectively prevent the IC card functional part from sinking to the bottom, which would affect the appearance of the IC card functional part after the gypsum card is removed from the film. At the same time, the first gypsum slurry has a higher water content, which improves fluidity, allowing the first gypsum slurry to better fill the mold and reduce bubbles. The second gypsum slurry has a lower water content, which reduces the shrinkage of the gypsum solidification, reduces the imprint of the IC card functional part, and increases the curing speed.
[0013] A further solution is that the first gypsum slurry in step S1 also includes an emulsifier, a flavor, and a defoamer; the second gypsum slurry also includes an emulsifier, a flavor, and a defoamer; the preparation method of the first gypsum slurry in step S1 is: gypsum and water are evenly mixed in a mass ratio of 2:1 to 3:1, and an emulsifier, a flavor, and a defoamer are added to the mixture of gypsum and water and then mixed evenly; the preparation method of the second gypsum slurry in step S1 is: gypsum and water are evenly mixed in a mass ratio of 3:1 to 4:1, and an emulsifier, a flavor, and a defoamer are added to the mixture of gypsum and water and then mixed evenly.
[0014] A further solution is that a mixture of 100g of gypsum and water of the first gypsum slurry contains 0.05ml~0.15ml of emulsifier, 0.25ml~0.5ml of flavor and 0.05ml~0.1ml of defoamer; a mixture of 100g of gypsum and water of the second gypsum slurry contains 0.05ml~0.15ml of emulsifier, 0.25ml~0.5ml of flavor and 0.05ml~0.1ml of defoamer.
[0015] A further solution is that the emulsifier is an acrylic acid cross-linked polymer, the defoaming agent is a polyoxyethylene ether defoaming agent, and the flavor is an oily solvent flavor.
[0016] As can be seen from the above solution, adding fragrance to the gypsum-water mixture imparts a scent to the IC card, providing users with a novel IC card experience. Since fragrance is mostly oily, adding an emulsifier allows the fragrance and water to fully blend, preventing the fragrance from floating on the surface and affecting the gypsum surface and the fragrance's effectiveness.
[0017] A further solution is that in step S2, the mold is a special-shaped mold, and the first gypsum slurry covers the special-shaped part of the special-shaped mold.
[0018] A further solution is that in step S2, the mold is a rectangular mold, and the first gypsum slurry covers the rectangular mold to a depth of 1 mm to 3 mm.
[0019] As can be seen from the above solution, the gypsum IC card can be set to be special-shaped or non-special-shaped to meet the user's personalized needs for the IC card appearance.
[0020] A further solution is that the IC card functional part in step S3 is a small waterproof block made of PET or PVC material that wraps the chip and the coil.
[0021] As can be seen from the above solution, gypsum will not affect the reading and writing functions of the IC card, and the IC card functional part is waterproof and has a wide range of applications.
[0022] A further solution is that the process for preparing the gypsum IC card further includes step S6: spraying varnish on the surface of the gypsum IC card that has been air-dried in step S5.
[0023] It can be seen from the above solution that the gypsum IC card with varnish coated on the surface has better waterproof performance, better hand feel and better user experience.
[0024] In order to achieve the second objective mentioned above, the present invention provides a gypsum IC card prepared by the method for preparing a gypsum IC card of any of the above schemes.
[0025] As can be seen from the above solution, gypsum IC cards are environmentally friendly and reusable. They can also be customized in appearance and fragrance, offering users a novel IC card experience. The gypsum card's surface is free of markings on the IC card's functional components, providing a pleasant user experience. Furthermore, gypsum IC cards are graffiti-friendly, meeting user needs for personalized design. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 It is a structural schematic diagram of a gypsum IC card of the present invention.
[0027] Figure 2 The present invention is a process flow chart of a method for preparing a gypsum IC card.
[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments. DETAILED DESCRIPTION
[0029] See also Figure 1 The gypsum IC card provided in this embodiment includes a gypsum layer and an IC functional part 2. The IC functional part 2 is completely wrapped by the gypsum layer.
[0030] The gypsum layer 1 is formed by solidifying the first gypsum slurry 11 and the second gypsum slurry 12. In this embodiment, the first gypsum slurry 11 includes gypsum, water, flavor, emulsifier and defoamer. The mass ratio of gypsum to water is 2:1 to 3:1, and each 100g mixture of gypsum and water contains 0.05ml to 0.15ml of emulsifier, 0.25ml to 0.5ml of flavor and 0.05ml to 0.1ml of defoamer, wherein the emulsifier is an acrylic cross-linked polymer, the defoamer is a polyoxyethylene ether defoamer, and the flavor is an oily solvent flavor. In this embodiment, the second gypsum slurry 12 includes gypsum, water, flavor, emulsifier and defoamer. Wherein the mass ratio of gypsum and water is 3:1~4:1, and every 100g mixture of gypsum and water contains 0.05ml~0.15ml emulsifier, 0.25ml~0.5ml flavor and 0.05ml~0.1ml defoamer, wherein the emulsifier is an acrylic acid cross-linked polymer, the defoamer is a polyoxyethylene ether defoamer, and the flavor is an oily solvent flavor. The acrylic acid cross-linked polymer, polyoxyethylene ether defoamer and oily solvent flavor used in this embodiment are all products that can be purchased on the market. Adding flavor to the gypsum water mixture makes the final IC card have fragrance, and the flavor fragrance can be customized according to user needs, giving users a more novel IC card experience. Since most of the flavor is oily, it has poor solubility in the gypsum water mixture. If added alone, it is easy for the flavor to float on the surface, making the surface of the final gypsum IC card have marks, which is not beautiful and also affects the use effect of the flavor. Therefore, adding an emulsifier can make the flavor and water fully merge, which can effectively solve the above problems. Acrylic cross-linked polymer emulsifiers can improve solution stability and have excellent color retention, oxidation resistance, and low-temperature stability. Polyoxyethylene ether defoamers have excellent defoaming effects, which facilitates the production of gypsum IC cards with excellent surface effects.
[0031] In this embodiment, the IC function part is a waterproof block made of PET or PVC material that wraps the chip and coil. The IC card function part has the read and write function of the IC card, and gypsum will not affect the IC card read and write function. The IC card function part is waterproof and has a wide range of applications.
[0032] See also Figure 2 In this embodiment, the method for preparing the above-mentioned gypsum IC card includes the following steps:
[0033] S1: Prepare the first gypsum slurry 11 and the second gypsum slurry 12:
[0034] The specific steps of preparing the first gypsum slurry 11 are as follows: first, gypsum and water are uniformly mixed in a mass ratio of 2:1 to 3:1, and then 0.05 ml to 0.15 ml of an emulsifier, 0.25 ml to 0.5 ml of a flavor, and 0.05 ml to 0.1 ml of a defoamer are added to the gypsum and water mixture and mixed uniformly to obtain the first gypsum slurry 11;
[0035] The specific steps for preparing the second gypsum slurry 12 are as follows: first, gypsum and water are mixed evenly in a mass ratio of 3:1 to 4:1, and then 0.05ml to 0.15ml of emulsifier, 0.25ml to 0.5ml of essence and 0.05ml to 0.1ml of defoamer are added to the mixture of gypsum and water and mixed evenly to obtain the second gypsum slurry 12.
[0036] S2: Pour the first gypsum slurry 11 into the mold, covering at least a portion of the mold, and let it stand for 3 to 10 minutes. In this embodiment, the mold is a special-shaped mold, and the first gypsum slurry 11 is added to the special-shaped mold until the special-shaped part of the special-shaped mold is completely covered.
[0037] S3: at least a portion of the IC card functional part is buried in the first gypsum slurry 11 and left to stand for 30 to 60 minutes. In this embodiment, the IC card functional part is half buried in the first gypsum slurry 12 .
[0038] S4: Pour the second gypsum slurry 12 into the mold, let it stand for 3 hours and then take it out.
[0039] S5: The taken-out gypsum IC card is further dried for 24 hours. In this embodiment, air drying is adopted.
[0040] S6: spraying varnish on the surface of the air-dried gypsum IC card. In this embodiment, the varnish can be any commercially available varnish, thus obtaining the gypsum IC card of this embodiment.
[0041] The preparation method of the gypsum IC card of this embodiment adds gypsum slurry twice, and the water content of the two gypsum slurries is different. After adding the first gypsum slurry 11 in step S2, it is left to stand for a period of time to allow the gypsum to slightly solidify before the IC card functional part is added. This can effectively prevent the IC card functional part from sinking to the bottom, and the IC card functional part is exposed after the gypsum card is formed, affecting the appearance. At the same time, the first gypsum slurry 11 has a higher water content, which improves fluidity, allowing the first gypsum slurry 11 to better fill the mold and reduce bubbles. The second gypsum slurry 12 has a lower water content, which reduces the shrinkage of the gypsum solidification, reduces the imprint of the IC card functional part, and increases the curing speed. In step S6, varnish is applied to make the gypsum IC card with the varnish coated on the surface have better waterproof performance, better feel, and better user experience.
[0042] The gypsum IC card of this embodiment is more environmentally friendly than petrochemical-based IC cards currently available on the market, and the gypsum is reusable. The gypsum IC card of this embodiment can be customized in appearance and fragrance, and the fragrance is long-lasting, providing users with a more novel IC card experience. Furthermore, the gypsum IC card's surface does not show any markings on the IC card's functional components, providing a pleasant user experience. Users can also creatively graffiti the gypsum IC card to meet their personalized design needs.
[0043] The above embodiments are merely preferred examples of the present invention and are not intended to limit the scope of implementation of the present invention. Therefore, any equivalent changes or modifications made based on the structure, features, and principles of the present invention should be included in the scope of application of the present invention.
Claims
1. A method for preparing a gypsum IC card, characterized in that: The following steps are involved: S1: preparing a first gypsum slurry and a second gypsum slurry, wherein the first gypsum slurry includes gypsum and water, wherein the mass ratio of gypsum to water is 2:1-3:1, and the second gypsum slurry includes gypsum and water, wherein the mass ratio of gypsum to water is 3:1-4:1; the first gypsum slurry has a higher water content, which improves fluidity, enables the first gypsum slurry to better fill the mold, and reduces bubbles; the second gypsum slurry has a lower water content, which reduces the shrinkage of gypsum curing, reduces the imprint of the IC card function part, and increases the curing speed; S2: pouring the first gypsum slurry into a mold, completely covering at least the bottom surface of the mold but not the entire mold, and letting it stand for 3 minutes to 10 minutes. In step S2, the mold is a special-shaped mold; S3: embedding at least a portion of the IC card functional part in the first gypsum slurry and allowing it to stand for 30 to 60 minutes, wherein the IC card functional part has the reading and writing functions of the IC card; S4: Pour the second gypsum slurry into the mold, let it stand for 3 to 5 hours, and then take it out; S5: Continue drying the gypsum IC card taken out in step S4 for 24 hours to 48 hours.
2. The method for preparing a gypsum IC card according to claim 1, wherein: In step S1, the first gypsum slurry further includes an emulsifier, a flavor, and a defoamer; the second gypsum slurry further includes an emulsifier, a flavor, and a defoamer; Step S1: The first gypsum slurry is prepared by mixing gypsum and water in a mass ratio of 2:1 to 3:1, adding an emulsifier, a flavor, and a defoaming agent to the gypsum and water mixture and mixing the mixture evenly; Step S1: The preparation method of the second gypsum slurry is: gypsum and water are mixed uniformly in a mass ratio of 3:1 to 4:1, and an emulsifier, a flavor, and a defoaming agent are added to the mixture of gypsum and water and then mixed uniformly.
3. The method for preparing a gypsum IC card according to claim 2, wherein: The mixture of 100g of gypsum and water in the first gypsum slurry contains 0.05ml~0.15ml of emulsifier, 0.25ml~0.5ml of flavor and 0.05ml~0.1ml of defoamer; The mixture of 100 g of gypsum and water in the second gypsum slurry contains 0.05 ml to 0.15 ml of emulsifier, 0.25 ml to 0.5 ml of flavor and 0.05 ml to 0.1 ml of defoamer.
4. The method for preparing a gypsum IC card according to claim 3, wherein: The emulsifier is an acrylic acid cross-linked polymer, the defoamer is a polyoxyethylene ether defoamer, and the flavor is an oily solvent flavor.
5. The method for preparing a gypsum IC card according to any one of claims 1 to 4, characterized in that: The first gypsum slurry covers the special-shaped portion of the special-shaped mold.
6. A method for preparing a gypsum IC card according to any one of claims 1 to 4, characterized in that: The IC card functional part in step S3 is a small waterproof block made of PET or PVC material that wraps the chip and coil.
7. A method for preparing a gypsum IC card according to any one of claims 1 to 4, characterized in that: The manufacturing process of the gypsum IC card further includes step S6: spraying varnish on the surface of the gypsum IC card dried in step S5.
8. A gypsum IC card, characterized by: The gypsum IC card is a gypsum IC card prepared by the method for preparing a gypsum IC card according to any one of claims 1 to 7.
Citation Information
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