A soldering process method for capacitor processing

Abstract

The application belongs to the technical field of capacitors, and specifically provides a welding process method for capacitor processing, which comprises the following steps: connecting a temperature monitoring device and a power supply device to a copper plate; connecting the temperature monitoring device and the power supply device, and setting a temperature threshold of the temperature monitoring device; spot welding a soldering point to a welding position of the copper plate and a capacitor core, and pressing the capacitor core to the position of the soldering point of the copper plate; using the power supply device to electrify the copper plate, and using the temperature monitoring device to continuously monitor the temperature of the copper plate; when the temperature monitoring device monitors that the temperature of the copper plate reaches the set temperature threshold, sending a power-off signal to the power supply device to make the copper plate stop heating and cool down. By using the temperature monitoring device and setting the temperature threshold, when the power supply device electrifies the copper plate to heat to the set temperature threshold, the soldering point melts to weld the copper plate and the capacitor core, and at the same time, the power supply device is powered off, so that the continuous high temperature does not cause thermal damage to the capacitor core.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of capacitors, and particularly relates to a welding process method for capacitor processing. BACKGROUND

[0002] With the development of technical level, the updating and replacement cycle of electronic, household appliance, communication and other industries is getting shorter and shorter, and thin film capacitors have become indispensable electronic components for promoting the updating and replacement of the above industries due to their good electrical performance and high reliability. In the next few years, with the further development of digitalization, informatization and networking construction and the increase of investment of the state in power grid construction, electrified railway construction, new energy and hybrid electric vehicles and the upgrading of consumer electronic products, the market demand for thin film capacitors will further show a rapid growth trend.

[0003] At present, in part of the process of capacitor manufacturing, the capacitor core is welded to the copper plate, and when welding, high-power high-temperature welding exists the risk of damaging the capacitor core, because the welding temperature is generally set above 180 DEG C, and the heat resistance limit temperature of the capacitor core is about 105 DEG C, if the welding time is too long, the continuous high temperature during welding will damage the thin film, which is easy to cause the thermal damage of the capacitor core, so that the service life of the capacitor core is shortened, and if the welding time is too short, the virtual welding of the welding point is easy to produce, which reduces the product reliability, so the welding difficulty is large, the welding quality is difficult to control, and the reliability of the capacitor is reduced.

[0004] Based on this, the application provides a welding process method for capacitor processing to solve the above problems. SUMMARY

[0005] In order to overcome the shortcomings of the prior art, the application provides a welding process method for capacitor processing to solve the problems that the existing technology causes the thermal damage of the capacitor core due to the too long welding time, the service life of the capacitor core is shortened, the virtual welding of the welding point is easy to produce due to the too short welding time, and the product reliability is reduced.

[0006] One embodiment of the application provides a welding process method for capacitor processing, comprising the following steps:

[0007] The copper plate connecting temperature monitoring device is connected with the power supply device;

[0008] The temperature monitoring device is connected with the power supply device, and the temperature threshold of the temperature monitoring device is set;

[0009] The soldering point is welded to the welding position of the copper plate and the capacitor core, and the capacitor core is pressed tightly at the soldering position of the copper plate;

[0010] The copper plate is powered on by the power supply device, and the temperature of the copper plate is continuously monitored by the temperature monitoring device.

[0011] When the temperature monitoring device monitors that the temperature of the copper plate reaches the set temperature threshold, a power-off signal is sent to the power supply device to stop the copper plate from heating and cooling down.

[0012] By adopting the above scheme, the temperature monitoring device is used and the temperature threshold is set. When the power supply device is powered on to heat the copper plate to the set temperature threshold, the solder is melted to weld the copper plate and the capacitor core. At the same time, the power supply device is powered off to stop the copper plate from heating, which can avoid the continuous high temperature from causing thermal damage to the capacitor core.

[0013] In one embodiment, a pressure detection device is arranged on the opposite side of the copper plate welding position, and the pressure detection device is pre-set with a pressure threshold;

[0014] When the capacitor core is pressed against the copper plate soldering point welding position, the pressure detection device calculates the pressure value between the copper plate and the capacitor core and analyzes whether the pressure value is within the pre-set pressure threshold range.

[0015] By adopting the above scheme, the pressure detection device is used to calculate and analyze the pressure value of the welding position of the copper plate and the capacitor core before welding to determine whether the contact between the two is stable. If the contact is not stable, the copper plate will not be heated to melt the solder, which can avoid the occurrence of virtual welding and unstable welding of the welding point when the contact is not stable, thereby improving the reliability of the capacitor.

[0016] In one embodiment, when the pressure value calculated by the pressure detection device is within the pre-set pressure threshold range, the pressure detection device sends a start signal to the power supply device, and the power supply device starts to power on the copper plate for heating;

[0017] When the pressure value calculated by the pressure detection device is less than the pre-set pressure threshold range, the power supply device does not start.

[0018] By adopting the above scheme, the pressure detection device is used to calculate and analyze the pressure value of the welding position of the copper plate and the capacitor core before welding to determine whether the contact between the two is stable. When the pressure is normal, the power is turned on for heating and welding. When the pressure is not normal, the power is not turned on for heating, which can avoid the occurrence of virtual welding and unstable welding of the welding point.

[0019] In one embodiment, the capacitor core is clamped by a clamping device and pushed towards the copper plate to press against the copper plate soldering point welding position;

[0020] When the pressure value calculated by the pressure detection device is less than the pre-set pressure threshold range, the pressure detection device sends a start signal to the clamping device, and the clamping device starts to push out the capacitor core.

[0021] By adopting the above scheme, the clamping device is arranged to clamp the capacitor core and push it to the copper plate direction to be pressed and welded, so that the stability and accuracy during welding can be increased, and the capacitor core can be pressed to the copper plate by the clamping device, and then the pressure detection device is used to detect and calculate and analyze the pressure value between the capacitor core and the copper plate to determine whether welding can be performed; according to the calculation and analysis of the pressure value, the capacitor core is pushed out by the clamping device when welding cannot be performed, so as to facilitate reprocessing of the tin soldering position of the copper plate.

[0022] In one of the embodiments, the pressure detection device is connected with a polishing device;

[0023] The pressure detection device sends a starting signal to the clamping device and also sends a starting signal to the polishing device;

[0024] After the clamping device pushes out the capacitor core, the polishing device starts to polish the tin soldering position.

[0025] By adopting the above scheme, when the pressure calculation and analysis cannot be performed, the polishing device is used to polish the tin soldering position of the copper plate, so that the tin soldering position is flattened and then the capacitor core and the copper plate are welded again, so as to avoid unstable welding of the two and improve the reliability of the capacitor.

[0026] In one of the embodiments, the copper plate uniformly spot welds multiple tin soldering points to form multiple tin soldering areas;

[0027] The pressure detection device presets multiple pressure thresholds, when the clamping device presses the capacitor core to the tin soldering area of the copper plate, the pressure detection device calculates the pressure value between each tin soldering area of the copper plate and the capacitor core, and calculates and analyzes whether the pressure value of each tin soldering area is within the preset pressure threshold range;

[0028] When the pressure detection device calculates and analyzes that the pressure value of each tin soldering area is within the preset pressure threshold range, the pressure detection device sends a starting signal to the power supply device, and the power supply device starts to power on and heat the copper plate;

[0029] When the pressure detection device calculates and analyzes that the pressure value of one or more tin soldering areas is less than the preset pressure threshold range, the pressure detection device sends a starting signal to the clamping device, and the clamping device starts to push out the capacitor core.

[0030] By adopting the above scheme, the pressure detection device sets multiple pressure threshold values to detect the pressure condition of each soldering area and calculates and analyzes the pressure value according to the pressure condition to determine whether the contact surface of the capacitor core and the copper plate is stable, and when the pressure values of all soldering areas are normal, the capacitor is powered and heated to start welding; if the pressure values of one or more soldering areas are abnormal, the capacitor is not powered and heated to avoid the occurrence of virtual welding, unstable welding and other conditions of other areas, thereby causing the capacitor to be unstable.

[0031] In one of the embodiments, the pressure detection device is connected with a polishing device;

[0032] The pressure detection device sends a start signal to the clamping device and sends a start signal to the polishing device at the same time;

[0033] After the clamping device pushes out the capacitor core, the polishing device starts to polish the soldering points in each soldering area of the copper plate at the same time.

[0034] By adopting the above scheme, when welding cannot be performed after pressure calculation and analysis, the polishing device is used to polish the spot welding position of each soldering area of the copper plate, so that the spot welding position of each soldering area is flat, and then the capacitor core and the copper plate are welded again, thereby avoiding unstable welding of the two and improving the reliability of the capacitor

[0035] In one of the embodiments, the copper plate is connected with a water circulation cooling device through the temperature monitoring device, and when the temperature monitoring device monitors that the temperature of the copper plate reaches a set temperature threshold value, the temperature monitoring device sends a power-off signal to the power supply device and sends a start signal to the water circulation cooling device at the same time;

[0036] The water circulation cooling device delivers cooling water to the copper plate to cool the copper plate by using the cooling water.

[0037] By adopting the above scheme, after the copper plate is powered off, in order to avoid that the temperature of the copper plate drops slowly after the copper plate is powered off and the high temperature continues to cause thermal damage to the capacitor core, the water circulation cooling device is arranged to inject cooling water to the copper plate, and the copper plate is cooled by using the cooling water, thereby preventing the copper plate from causing thermal damage to the capacitor core due to the high temperature.

[0038] The welding process method for capacitor processing provided by the above embodiments has the following beneficial effects:

[0039] 1. By adopting the temperature monitoring device and setting a temperature threshold value, when the power supply device is powered to heat the copper plate to the set temperature threshold value, the soldering is melted to weld the copper plate and the capacitor core, and at the same time, the power supply device is powered off to avoid thermal damage to the capacitor core caused by the high temperature.

[0040] 2. The application judges whether the contact of the copper plate and the capacitor core is stable by using the pressure detection device to calculate and analyze the pressure value of the welding position of the copper plate and the capacitor core before welding, and if the contact is not stable, the copper plate is not heated and melted for soldering, so as to avoid the situation that the copper plate and the capacitor core are welded in the unstable contact state to cause the virtual welding and unstable welding of the welding point, thereby improving the reliability of the capacitor. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of the drawings shown.

[0042] Figure 1 The flow chart of the welding process method for capacitor processing provided by the present application.

[0043] Figure 2 The capacitor welded by the first embodiment of the present application;

[0044] Figure 3 The capacitor welded by the second embodiment of the present application;

[0045] Figure 4 The welding schematic diagram of the welding process method for capacitor processing provided by the present application.

[0046] Corresponding reference signs:

[0047] 100, copper plate; 200, capacitor core; 300, clamping device; 400, polishing device; 500, water circulation cooling device; 600, pressure detection device. DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0049] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0050] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, if "and / or" or "and / or" appears throughout the text, it means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the present application.

[0051] Referring to Figure 1 , Figure 2 , Figure 4 In the first embodiment of the present application, a welding process method for capacitor processing is provided, comprising the following steps:

[0052] S100: Connect the temperature monitoring device and the power supply device with the copper plate 100.

[0053] In this embodiment, the temperature monitoring device can use an infrared thermometer or a thermocouple. When using an infrared thermometer, the temperature of the copper plate 100 is monitored in real time by a non-contact method; when the welding process is implemented, the infrared thermometer is aimed at the surface of the copper plate 100 to monitor the change of the temperature of the copper plate 100. The thermocouple is a commonly used contact type temperature sensor, when using the thermocouple, the temperature of the surface of the copper plate 100 can be converted into an electrical signal output. The thermocouple is fixed on the copper plate 100, which can monitor the change of the temperature of the copper plate 100 in real time. The power supply device can use a constant temperature power supply or a transformer. The constant temperature power supply can provide stable current output to ensure the heating effect in the welding process. According to the actual demand, constant temperature power supply with different power and voltage can be selected. The transformer can be used to adjust the voltage to meet the needs of different stages in the welding process. For example, at the beginning of welding, the copper plate 100 can be preheated with lower voltage; during the welding process, the voltage can be adjusted to improve the welding speed and quality.

[0054] The implementation principle is that the infrared temperature measuring instrument or thermocouple is connected with the copper plate 100 first, and the temperature of the copper plate 100 is monitored in real time. At the same time, the constant temperature power supply or transformer is connected with the copper plate 100 to provide stable current and voltage output. During the welding process, the temperature of the copper plate 100 is monitored in real time by the temperature monitoring device according to the preset temperature threshold value. When the temperature of the copper plate 100 reaches the set value, a power-off signal is sent to the power supply device, so that the copper plate 100 stops heating and cools down. In this way, accurate control of the welding process can be realized, and the welding quality and effect can be ensured.

[0055] For the connection of the infrared temperature measuring instrument or thermocouple with the copper plate 100 and the connection of the constant temperature power supply or transformer with the copper plate 100, those skilled in the art can determine how to connect according to the shape of the copper plate 100, which is not limited here.

[0056] S200: Connect the temperature monitoring device with the power supply device, and set the temperature threshold value of the temperature monitoring device.

[0057] In this embodiment, the temperature monitoring device (such as an infrared temperature measuring instrument or a thermocouple) is connected with the power supply device (such as a constant temperature power supply or a transformer). The temperature threshold value of the temperature monitoring device includes a first temperature threshold value, a second temperature threshold value and a third temperature threshold value; the first temperature threshold value is 80℃, the second temperature threshold value is 150℃, and the third temperature threshold value is 180℃. The temperature signal is transmitted to the control system by the temperature monitoring device (infrared temperature measuring instrument or thermocouple), and the control system adjusts the power of the power supply device in real time according to the preset temperature threshold value of the temperature monitoring device, so as to ensure that the temperature control in the welding process is within a safe range.

[0058] S300: Solder the soldering points to the welding position of the copper plate 100 and the capacitor core 200, and press the capacitor core 200 to the position of the soldering points of the copper plate 100.

[0059] In this embodiment, the soldering points are pre-soldered to the copper plate 100 at the welding position of the copper plate 100 and the capacitor core 200, and then the capacitor core 200 is pressed to the position of the soldering points of the copper plate 100.

[0060] Specifically, the capacitor core 200 is clamped by the clamping device 300 and pushed towards the copper plate 100, and is pressed to the position of the soldering points of the copper plate 100; the opposite surface of the copper plate 100 at the welding position is provided with a pressure detection device 600, and the pressure detection device 600 is pre-set with a pressure threshold value. The pressure detection device 600 can use a common resistance type pressure sensor, which is installed on the opposite surface of the copper plate 100 at the welding position, and is used to detect the pressure value after the capacitor core 200 contacts the copper plate 100.

[0061] When the capacitor core 200 is pressed to the soldering position of the copper plate 100, the pressure detection device 600 calculates the pressure value between the copper plate 100 and the capacitor core 200 and calculates whether the pressure value is within the preset pressure threshold range; specifically including the following steps:

[0062] S310: When the pressure value calculated by the pressure detection device 600 is within the preset pressure threshold range, step S400 is entered, the pressure detection device 600 sends a start signal to the power supply device, and the power supply device starts to power the copper plate 100 for heating; if the pressure value calculated by the pressure detection device 600 is less than the preset pressure threshold range, step S320 is entered.

[0063] That is, after the capacitor core 200 and the copper plate 100 are in contact, the pressure detection device 600 calculates and analyzes the pressure value of the contact surface between the two, and when the pressure value of the contact surface between the two is within the preset pressure threshold range, it is proved that the contact area of the two is large and the contact is stable, and then a start signal is sent to the power supply device, so that the power supply device powers the copper plate 100 for heating, thereby avoiding the occurrence of virtual welding and unstable welding of the soldering points when the two are welded in an unstable contact state, and improving the reliability of the capacitor.

[0064] Specifically, the pressure threshold range can be set by the person skilled in the art according to the actual size of the capacitor core 200 and the copper plate 100, which is clear to the person skilled in the art and will not be described here.

[0065] S320: When the pressure value calculated by the pressure detection device 600 is less than the preset pressure threshold range, S400 is not entered, and the power supply device is not started.

[0066] That is, after the capacitor core 200 and the copper plate 100 are in contact, the pressure detection device 600 calculates and analyzes the pressure value of the contact surface between the two, and when the pressure value of the contact surface between the two is less than the preset pressure threshold range, it is proved that the contact area of the two is small, and the possible reason is that the soldering position of the copper plate 100 and the capacitor core 200 is missed when spot welding and soldering, the soldering point is small or uneven, and the start signal is not sent to the power supply device, avoiding the occurrence of virtual welding and unstable welding of the soldering points when the two are welded in an unstable contact state.

[0067] According to the need, when the pressure value calculated by the pressure detection device 600 is less than the preset pressure threshold range, the following steps are further included:

[0068] S321: The pressure detection device 600 sends a start signal to the clamping device 300, and the clamping device 300 starts to push out the capacitor core 200.

[0069] That is, when the contact surface pressure value between the capacitor core 200 and the copper plate 100 is less than the preset pressure threshold range, no start signal is sent to the power supply device, the capacitor core 200 is pushed out by the clamping device 300 in the opposite direction of the copper plate 100, and the soldering position on the copper plate 100 is reprocessed. The reprocessing is determined by manual judgment. If there is a missing soldering, return to step S300, re-solder the soldering position of the copper plate 100 and the capacitor core 200, and then re-press the capacitor core 200 to the soldering position of the copper plate 100 to calculate the pressure threshold. If the soldering is small or uneven, go to step S322 for reprocessing.

[0070] The clamping device 300 of the embodiment can use a conventional mechanical arm to clamp the capacitor core 200, instead of manually holding the capacitor core 200 by the staff, which may cause the capacitor core 200 to be not pressed tightly, resulting in a problem of not firm welding between the two, and the staff may be easily scalded when manually holding the capacitor core 200 for work due to high-temperature operation of the copper plate 100.

[0071] According to the need, when the soldering is small or uneven, the pressure detection device 600 is connected with the polishing device 400; the pressure detection device 600 sends a start signal to the clamping device 300, and further includes the following steps:

[0072] S322: Send a start signal to the polishing device 400; after the clamping device 300 pushes out the capacitor core 200, the polishing device 400 is started to polish the soldering position.

[0073] That is, after the clamping device 300 pushes out the capacitor core 200 in the opposite direction of the copper plate 100, the polishing device 400 is started to extend to the soldering position of the copper plate 100 to polish the soldering at the position, so that the soldering is flat or the original soldering is polished off; after the soldering is polished flat, re-enter step S300, and re-press the capacitor core 200 to the soldering position of the copper plate 100 to calculate the pressure threshold. After the original soldering is polished off, re-enter step S300, re-solder the soldering position of the copper plate 100 and the capacitor core 200, and then re-press the capacitor core 200 to the soldering position of the copper plate 100 to calculate the pressure threshold. Repeat until the contact surface pressure value between the capacitor core 200 and the copper plate 100 after contacting is within the preset pressure threshold range, then enter step S400, the pressure detection device 600 sends a start signal to the power supply device, and the power supply device starts to power the copper plate 100.

[0074] The polishing device 400 can adopt a conventional mechanical arm connected to a polishing head to polish the soldering spot welding position.

[0075] S400: The copper plate 100 is powered by the power supply device, and the temperature of the copper plate 100 is continuously monitored by the temperature monitoring device.

[0076] In this embodiment, the copper plate 100 is powered by the power supply device (constant temperature power supply or transformer), and when the current passes through the copper plate 100, the copper plate 100 will generate heat due to internal resistance. The temperature monitoring device continuously monitors the temperature of the copper plate 100 according to the set temperature threshold, and the temperature signal is transmitted to the control system by the temperature monitoring device (infrared thermometer or thermocouple). The control system adjusts the power of the power supply device in real time according to the temperature threshold preset by the temperature monitoring device to ensure that the temperature control during welding is within a safe range.

[0077] Specifically, the power supply device powers and heats the copper plate 100, including a preheating stage, a welding stage, and a holding stage in sequence; the preheating stage corresponds to a first temperature threshold (80°C), the welding stage corresponds to a third temperature threshold (180°C), and the holding stage corresponds to a second temperature threshold (150°C). When the pressure value calculated by the pressure detection device 600 is within the preset pressure threshold range, the power supply device is started in step S400 to run in the preheating stage (the power supply device is set to a fixed operating power) to slowly heat the copper plate 100 to 80°C, reducing the thermal shock on the capacitor core 200 when the copper plate 100 is directly powered and heated at high power during welding; when the temperature of the copper plate 100 slowly rises to 80°C, the temperature signal is transmitted to the control system by the temperature monitoring device, and the control system adjusts the power of the power supply device in real time according to the temperature threshold preset by the temperature monitoring device to run in the welding stage (the power supply device is set to a fixed operating power) to quickly heat the copper plate 100 to 180°C, to ensure that the solder on the welding position of the copper plate 100 that contacts the capacitor core 200 melts, and the capacitor core 200 is connected and fixed to the copper plate 100 through the melted solder; when the temperature of the copper plate 100 quickly rises to 180°C, the temperature signal is transmitted to the control system by the temperature monitoring device, and the control system adjusts the power of the power supply device in real time according to the temperature threshold preset by the temperature monitoring device to prevent the copper plate 100 from continuously heating the capacitor core 200 to cause thermal damage, and enters the holding stage (the power supply device is set to a fixed operating power) to run to reduce the temperature of the copper plate 100 to 150°C, and maintain for a period of time to ensure that the welding area is fully solidified to improve the welding quality, and then enter step S500.

[0078] For the power supply device to run in the preheating stage, welding stage and holding stage, the specific operating power and the time of each stage are set by the person skilled in the art according to the mass of the copper plate 100, which is clear to the person skilled in the art and will not be repeated here.

[0079] S500: When the temperature monitoring device monitors that the temperature of the copper plate 100 reaches the set temperature threshold, a power-off signal is sent to the power supply device to stop heating and cool down the copper plate 100.

[0080] In this embodiment, when the temperature monitoring device monitors that the temperature of the copper plate 100 reaches the set temperature threshold, i.e. the temperature reaches the set second temperature threshold (holding stage), and maintains for a period of time, the temperature monitoring device sends a power-off signal to the power supply device to stop heating the copper plate 100 and gradually cool the copper plate 100 to room temperature.

[0081] S600: The copper plate 100 is connected with the water circulation cooling device 500, and when the temperature monitoring device monitors that the temperature of the copper plate 100 reaches the set temperature threshold, the temperature monitoring device sends a power-off signal to the power supply device at the same time, and sends a start signal to the water circulation cooling device 500.

[0082] In this embodiment, when the power supply device stops heating the copper plate 100, in order to avoid slow temperature drop of the copper plate 100 and slow solidification of the solder, cooling water is circulated to cool down, so as to improve the cooling speed of the copper plate 100 and make the solder solidify quickly.

[0083] Specifically, the copper plate 100 is connected with the water circulation cooling device 500, and the water circulation cooling device 500 is electrically connected with the temperature monitoring device; when the temperature monitoring device sends a power-off signal to the power supply device to stop heating the copper plate 100, the temperature monitoring device sends a start signal to the water circulation cooling device 500 at the same time, so that the water circulation cooling device 500 starts to operate.

[0084] S700: The water circulation cooling device 500 delivers cooling water to the copper plate 100 to cool down the copper plate 100.

[0085] In this embodiment, when the temperature monitoring device sends a power-off signal to the power supply device to stop heating the copper plate 100, the temperature monitoring device sends a start signal to the water circulation cooling device 500 at the same time, so that the water circulation cooling device 500 starts to operate, the water circulation cooling device 500 delivers cooling water to the inside of the copper plate 100, and the cooling water takes away the temperature of the copper plate 100 to make the copper plate 100 cool down quickly, so as to make the solder solidify quickly and complete the welding of the capacitor core 200 and the copper plate 100.

[0086] Referring to Figure 1 , Figure 3 , Figure 4 In a second embodiment of the present application, a welding process method for capacitor processing is provided, comprising the following steps:

[0087] S100: Connect the temperature monitoring device and the power supply device to the copper plate 100.

[0088] In this embodiment, the temperature monitoring device can use an infrared thermometer or a thermocouple. When using an infrared thermometer, the temperature of the copper plate 100 is monitored in real time by a non-contact method. When the welding process is implemented, the infrared thermometer is aimed at the surface of the copper plate 100 to monitor the temperature change of the copper plate 100. The thermocouple is a commonly used contact temperature sensor, which can convert the temperature on the surface of the copper plate 100 into an electrical signal output. The thermocouple is fixed on the copper plate 100 to monitor the temperature change of the copper plate 100 in real time. The power supply device can use a constant temperature power supply or a transformer. The constant temperature power supply can provide stable current output to ensure the heating effect during the welding process. According to the actual needs, constant temperature power supplies with different power and voltage can be selected. The transformer can be used to adjust the voltage to meet the needs of different stages in the welding process. For example, a lower voltage can be used to preheat the copper plate 100 at the beginning of welding; during the welding process, the voltage can be adjusted to improve the welding speed and quality.

[0089] The implementation principle is to first connect the infrared thermometer or thermocouple to the copper plate 100 to monitor the temperature of the copper plate 100 in real time. At the same time, the constant temperature power supply or transformer is connected to the copper plate 100 to provide stable current and voltage output. During the welding process, the temperature of the copper plate 100 is monitored in real time by the temperature monitoring device according to the preset temperature threshold. When the temperature of the copper plate 100 reaches the set value, a power-off signal is sent to the power supply device to stop heating and cooling the copper plate 100. In this way, precise control of the welding process can be achieved to ensure the welding quality and effect.

[0090] For the connection of the infrared thermometer or thermocouple to the copper plate 100 and the connection of the constant temperature power supply or transformer to the copper plate 100, those skilled in the art can determine how to connect according to the shape of the copper plate 100, which is not limited here.

[0091] S200: Connect the temperature monitoring device and the power supply device, and set the temperature threshold of the temperature monitoring device.

[0092] In the embodiment, the temperature monitoring device (such as an infrared thermometer or a thermocouple) is connected to the power supply device (such as a constant temperature power supply or a transformer). The temperature threshold of the temperature monitoring device includes a first temperature threshold, a second temperature threshold and a third temperature threshold; the first temperature threshold is 80℃, the second temperature threshold is 150℃, and the third temperature threshold is 180℃. The temperature signal is transmitted to the control system by the temperature monitoring device (infrared thermometer or thermocouple), and the control system adjusts the power of the power supply device in real time according to the preset temperature threshold of the temperature monitoring device, so as to ensure that the temperature in the welding process is controlled within a safe range.

[0093] S300: Solder the soldering points to the welding positions of the copper plate 100 and the capacitor core 200, and press the capacitor core 200 to the positions where the copper plate 100 is soldered.

[0094] In the embodiment, the soldering points are pre-soldered to the copper plate 100 at the welding positions of the copper plate 100 and the capacitor core 200, the copper plate 100 is uniformly spot-welded with multiple soldering points to form multiple soldering areas, and then the capacitor core 200 is pressed to the positions corresponding to each soldering point of the copper plate 100.

[0095] Specifically, the capacitor core 200 is clamped by the clamping device 300 and pushed towards the copper plate 100 to press the positions corresponding to each soldering point of the copper plate 100; the opposite surface of the welding position of the copper plate 100 is provided with a pressure detection device 600, and the pressure detection device 600 is pre-set with multiple pressure thresholds, each pre-set pressure threshold is used to correspondingly calculate the pressure value between each soldering area of the copper plate 100 and the capacitor core 200. The pressure detection device 600 can use a commonly used resistance type pressure sensor, which is installed on the opposite surface of the welding position of the copper plate 100 to detect the pressure value after the capacitor core 200 contacts the copper plate 100.

[0096] When the capacitor core 200 is pressed to the soldering position of the copper plate 100, the pressure detection device 600 calculates the pressure value between each soldering area of the copper plate 100 and the capacitor core 200, and analyzes whether the pressure value of each soldering area is within the pre-set pressure threshold range; specifically including the following steps:

[0097] S310: When the pressure detection device 600 calculates and analyzes that the pressure value of each soldering area is within the pre-set pressure threshold range, step S400 is entered, the pressure detection device 600 sends a start signal to the power supply device, and the power supply device starts to power on and heat the copper plate 100; if the pressure detection device 600 calculates and analyzes that the pressure value of one or more soldering areas is less than the pre-set pressure threshold range, step S320 is entered.

[0098] That is, after the capacitor core 200 contacts the copper plate 100, the pressure detection device 600 calculates and analyzes the pressure value of each soldering area of the contact surface between the two, and when the pressure value of each soldering area of the contact surface between the two is within the preset pressure threshold range, it is proved that the contact area of the two is large and the contact is stable, and only then the power supply device is sent to start the signal, so that the power supply device is powered on to heat the copper plate 100, so as to avoid the situation that the two are welded in the case of unstable contact to cause the virtual welding of the welding point and the unstable welding, so as to improve the reliability of the capacitor.

[0099] Among them, the specific pressure threshold range can be set by the person skilled in the art according to the actual size of the capacitor core 200 and the copper plate 100, which is clear to the person skilled in the art, and will not be repeated here.

[0100] S320: When the pressure value of one or more soldering areas calculated by the pressure detection device 600 is less than the preset pressure threshold range, S400 is not entered, and the power supply device is not started.

[0101] That is, after the capacitor core 200 contacts the copper plate 100, the pressure detection device 600 calculates and analyzes the pressure value of each soldering area of the contact surface between the two, and when the pressure value of each soldering area of the contact surface between the two is within the preset pressure threshold range, it is proved that the contact area of the two is large and the contact is stable, and only then the power supply device is sent to start the signal, so that the power supply device is powered on to heat the copper plate 100, so as to avoid the situation that the two are welded in the case of unstable contact to cause the virtual welding of the welding point and the unstable welding, so as to improve the reliability of the capacitor.

[0102] According to the need, when the pressure value of one or more soldering areas calculated and analyzed by the pressure detection device 600 is less than the preset pressure threshold range, the following steps are further included:

[0103] S321: The pressure detection device 600 sends a start signal to the clamping device 300, and the clamping device 300 starts to push out the capacitor core 200.

[0104] That is, when the pressure value of one or more soldering areas of the contact surface between the capacitor core 200 and the copper plate 100 is less than the preset pressure threshold range, no start signal is sent to the power supply device, and by sending a start signal to the clamping device 300, the clamping device 300 pushes the capacitor core 200 away from the copper plate 100 in the opposite direction, facilitating reprocessing of the soldering position on the copper plate 100. Among them, the reprocessing is judged by artificial, if there is a missing welding, return to step S300, re-solder the soldering points to the welding position of the copper plate 100 and the capacitor core 200, and then re-press the capacitor core 200 to the soldering position of the copper plate 100 to calculate the pressure threshold. If the welding point is small or uneven, go to step S322 for reprocessing.

[0105] The clamping device 300 of the embodiment can use a conventional mechanical arm to clamp the capacitor core 200, instead of using a hand-held capacitor core 200 by the staff, which may cause the capacitor core 200 to be not pressed tightly, resulting in the problem of not firm welding between the two. In addition, due to the high-temperature operation of the copper plate 100, if the staff uses a hand-held capacitor core 200 for operation, it is easy to be scalded.

[0106] According to the need, when the welding point is small or uneven, the pressure detection device 600 is connected with the polishing device 400; the pressure detection device 600 sends a start signal to the clamping device 300, and further includes the following steps:

[0107] S322: send a start signal to the polishing device 400; after the clamping device 300 pushes out the capacitor core 200, the polishing device 400 starts to polish the soldering position of the soldering point in each soldering area of the copper plate 100.

[0108] That is, when the clamping device 300 pushes the capacitor core 200 away from the copper plate 100, the soldering position of the soldering tin on the copper plate 100 is started by the polishing device 400. The number of polishing heads of the polishing device 400 in the embodiment is the same as the number of soldering tin areas. The soldering tin in each soldering tin area of the copper plate 100 is polished by the polishing device 400 at the same time, so that the soldering tin is flat or the original soldering tin is polished off. After the soldering tin is polished flat, step S300 is re-entered, and the capacitor core 200 is re-pressed on the soldering position of the copper plate 100 to calculate the pressure threshold value of each soldering tin area. After the original soldering tin is polished off, step S300 is re-entered, and the soldering tin is re-soldered to the welding position of the copper plate 100 and the capacitor core 200, and then the capacitor core 200 is re-pressed on the soldering position of the copper plate 100 to calculate the pressure threshold value of each soldering tin area. The process is repeated until the pressure detection device 600 calculates and analyzes that the pressure value of each soldering tin area of the contact surface between the capacitor core 200 and the copper plate 100 after the capacitor core 200 contacts the copper plate 100 is within the preset pressure threshold value range, then step S400 is entered, and the power supply device sends a start signal to the power supply device. The power supply device starts to power the copper plate 100.

[0109] The polishing device 400 can use a conventional mechanical arm connected to a polishing head to polish the soldering position.

[0110] S400: The copper plate 100 is powered by the power supply device, and the temperature of the copper plate 100 is continuously monitored by the temperature monitoring device.

[0111] In the embodiment, the copper plate 100 is powered by the power supply device (constant temperature power supply or transformer). When the current passes through the copper plate 100, the copper plate 100 will generate resistance and heat. The temperature of the copper plate 100 is continuously monitored by the temperature monitoring device according to the set temperature threshold value. The temperature signal is transmitted to the control system by the temperature monitoring device (infrared temperature detector or thermocouple). The control system adjusts the power of the power supply device in real time according to the temperature threshold value preset by the temperature monitoring device, so as to ensure that the temperature control in the welding process is within a safe range.

[0112] Specifically, the power supply device performs the power-on heating of the copper plate 100, including a preheating stage, a welding stage, and a holding stage in sequence; the preheating stage corresponds to a first temperature threshold (80°C), the welding stage corresponds to a third temperature threshold (180°C), and the holding stage corresponds to a second temperature threshold (150°C). When the pressure value calculated by the pressure detection device 600 is within the preset pressure threshold range, the power supply device is started in the preheating stage (the power supply device is set to a fixed operating power) to slowly heat the copper plate 100 to 80°C, thereby reducing the thermal shock on the capacitor core 200 when the copper plate 100 is directly powered on with high power during welding; when the temperature of the copper plate 100 slowly rises to 80°C, the temperature monitoring device transmits the temperature signal to the control system, and the control system adjusts the power of the power supply device in real time according to the temperature threshold preset by the temperature monitoring device to operate in the welding stage (the power supply device is set to a fixed operating power) to rapidly heat the copper plate 100 to 180°C, so as to ensure that the solder on the welding position of the copper plate 100 in contact with the capacitor core 200 is melted, and the capacitor core 200 is connected and fixed with the copper plate 100 through the melted solder; when the temperature of the copper plate 100 rapidly rises to 180°C, the temperature monitoring device transmits the temperature signal to the control system, and the control system adjusts the power of the power supply device in real time according to the temperature threshold preset by the temperature monitoring device to prevent the copper plate 100 from continuously high temperature to cause thermal damage to the capacitor core 200, and enters the holding stage (the power supply device is set to a fixed operating power) to operate, so that the temperature of the copper plate 100 drops to 150°C, and is kept for a period of time to ensure that the welding area is fully solidified to improve the welding quality, and then enters step S500.

[0113] For the running power of the power supply device in the preheating stage, the welding stage, and the holding stage, the specific running power and the time of each stage are set by the person skilled in the art according to the quality of the copper plate 100 during use, which is clear to the person skilled in the art, and will not be described here.

[0114] S500: When the temperature monitoring device detects that the temperature of the copper plate 100 reaches the set temperature threshold, a power-off signal is sent to the power supply device to stop heating and cooling the copper plate 100.

[0115] In this embodiment, when the temperature monitoring device detects that the temperature of the copper plate 100 reaches the set temperature threshold, i.e., the temperature reaches the set second temperature threshold (holding stage), and keeps for a period of time, the temperature monitoring device sends a power-off signal to the power supply device to stop heating the copper plate 100 and gradually cool the copper plate 100 to room temperature.

[0116] S600: the copper plate 100 is connected with the temperature monitoring device water circulation cooling device 500, when the temperature monitoring device monitors the copper plate 100 temperature reaches the set temperature threshold, the temperature monitoring device sends the power device power off signal at the same time, to the water circulation cooling device 500 sends the start signal.

[0117] In this embodiment, when the power device stops heating the copper plate 100, in order to avoid the slow temperature drop of the copper plate 100, the solder cannot be quickly solidified, the cooling water is circulated to cool down, so as to improve the cooling speed of the copper plate 100, and the solder is quickly solidified.

[0118] Specifically, the copper plate 100 is connected with the water circulation cooling device 500, and the water circulation cooling device 500 is electrically connected with the temperature monitoring device; when the temperature monitoring device sends the power device power off signal to make the power device stop heating the copper plate 100, the temperature monitoring device sends the start signal to the water circulation cooling device 500 to make the water circulation cooling device 500 start running.

[0119] S700: the water circulation cooling device 500 sends cooling water to the copper plate 100, and the cooling water is used to cool the copper plate 100.

[0120] In this embodiment, when the temperature monitoring device sends the power device power off signal to make the power device stop heating the copper plate 100, the temperature monitoring device sends the start signal to the water circulation cooling device 500 to make the water circulation cooling device 500 start running, the water circulation cooling device 500 sends cooling water to the inside of the copper plate 100, and the cooling water is used to take away the temperature of the copper plate 100, so that the copper plate 100 is quickly cooled, and the solder is quickly solidified, and the welding of the capacitor core 200 and the copper plate 100 is completed.

[0121] The above only describes the preferred embodiments of the present application, and does not limit the patent range of the present application, and any equivalent structural transformation, direct / indirect application in other related technical fields under the inventive concept of the present application, and the contents of the present application are included in the patent protection range of the present application.

Claims

1. A soldering process method for capacitor processing, characterized by, The method comprises the following steps: connecting the temperature monitoring device with the power supply device; connecting the temperature monitoring device with the power supply device and setting the temperature threshold of the temperature monitoring device; soldering the soldering points to the soldering position of the copper plate and the capacitor core, and pressing the capacitor core to the soldering position of the copper plate; using the power supply device to power the copper plate, and using the temperature monitoring device to continuously monitor the temperature of the copper plate; when the temperature monitoring device detects that the temperature of the copper plate reaches the set temperature threshold, sending a power-off signal to the power supply device to stop heating and cooling the copper plate; the opposite side of the soldering position of the copper plate is provided with a pressure detection device, and the pressure detection device is pre-set with a pressure threshold; when the capacitor core is pressed to the soldering position of the copper plate, the pressure detection device calculates the pressure value between the copper plate and the capacitor core and analyzes whether the pressure value is within the pre-set pressure threshold range; when the pressure value calculated by the pressure detection device is within the pre-set pressure threshold range, the pressure detection device sends a start signal to the power supply device, and the power supply device starts to power the copper plate for heating; when the pressure value calculated by the pressure detection device is less than the pre-set pressure threshold range, the power supply device does not start.

2. The soldering process method for capacitor processing according to claim 1, wherein: the capacitor core is clamped by a clamping device and pushed towards the copper plate to be pressed to the soldering position of the copper plate; when the pressure value calculated by the pressure detection device is less than the pre-set pressure threshold range, the pressure detection device sends a start signal to the clamping device, and the clamping device pushes out the capacitor core.

3. The soldering process method for capacitor processing according to claim 2, wherein: the pressure detection device is connected with a grinding device; the pressure detection device sends a start signal to the clamping device at the same time, and sends a start signal to the grinding device; after the clamping device pushes out the capacitor core, the grinding device starts to grind the soldering position.

4. The soldering process method for capacitor processing according to claim 2, wherein: the copper plate is uniformly spot-welded with multiple soldering points to form multiple soldering areas; the pressure detection device is pre-set with multiple pressure thresholds, when the clamping device presses the capacitor core to the soldering area of the copper plate, the pressure detection device calculates the pressure value between each soldering area of the copper plate and the capacitor core, and analyzes whether the pressure value of each soldering area is within the pre-set pressure threshold range; when the pressure detection device calculates and analyzes that the pressure value of each soldering area is within the pre-set pressure threshold range, the pressure detection device sends a start signal to the power supply device, and the power supply device starts to power the copper plate for heating; when the pressure detection device calculates and analyzes that the pressure value of one or more soldering areas is less than the pre-set pressure threshold range, the pressure detection device sends a start signal to the clamping device, and the clamping device pushes out the capacitor core.

5. The soldering process method for capacitor processing according to claim 4, wherein: the pressure detection device is connected with a grinding device; The pressure detection device sends a starting signal to the clamping device and a starting signal to the polishing device at the same time; After the clamping device pushes out the capacitor core, the polishing device starts to polish the soldering points in each soldering area at the same time.

6. The soldering process method for capacitor processing according to any one of claims 3 or 5, characterized in that: The copper plate is connected with a water circulation cooling device, and when the temperature monitoring device monitors that the temperature of the copper plate reaches a set temperature threshold, the temperature monitoring device sends a power-off signal to the power supply device and a starting signal to the water circulation cooling device at the same time; The water circulation cooling device delivers cooling water to the copper plate to cool the copper plate.

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