A thermal control structure and a thermal control method thereof

Abstract

The application discloses a thermal control structure, which comprises a low-precision heater in direct contact with a heating object, a heater substrate fixed to the other side of the low-precision heater, a high-precision heater fixed to the other side of the heater substrate, a temperature control boundary body fixed to the other side of the high-precision heater, and a plurality of temperature testing components fixed to the other side of the temperature control boundary body. The thermal control structure can make the temperature measuring boundary have higher temperature consistency, reduce the requirement for a temperature control algorithm, reduce the difficulty in realizing the constant-temperature boundary, and reduce the number of temperature sensors and the manufacturing cost. The application also discloses a thermal control method, which has the same advantages.

Description

Technical Field

[0001] This invention belongs to the technical field of deep ultraviolet projection lithography equipment, and in particular relates to a thermal control structure and its thermal control method. Background Technology

[0002] Projection lithography equipment is one of the core pieces of equipment in large-scale integrated circuit manufacturing production lines. With the increasing demands for finer linewidths in integrated circuits, the resolution of projection optics equipment has also gradually improved. ArF excimer laser projection lithography equipment with a wavelength of 193.368nm has become the mainstream equipment for 90nm, 65nm, and 45nm node integrated circuit manufacturing. In particular, the structural design, pre-assembly, and assembly processes of projection lithography objectives require high repeatability of optical component inspection. The objective must operate in a constant-temperature environment to ensure that the overall deformation of the objective is within a very small range. Simultaneously, the typical lens assembly inside the objective also needs to maintain a constant-temperature boundary around its perimeter.

[0003] In existing technologies, using a single-layer heater for constant temperature control requires a large number of heaters and temperature sensors, and places high demands on the temperature control algorithm, which results in excessively high costs. Summary of the Invention

[0004] To address the aforementioned issues, this invention provides a thermal control structure and method that enables higher temperature consistency at the temperature measurement boundary, reduces the requirements for temperature control algorithms, lowers the difficulty of achieving constant temperature boundaries, and reduces the number of temperature sensors required, thereby reducing manufacturing costs.

[0005] The present invention provides a thermal control structure, including a low-precision heater that is in direct contact with the object being heated, a heater substrate fixed to the other side of the low-precision heater, a high-precision heater fixed to the other side of the heater substrate, a temperature control boundary body fixed to the other side of the high-precision heater, and multiple temperature testing components fixed to the other side of the temperature control boundary body.

[0006] Preferably, in the above thermal control structure, the low-precision heater is a low-precision electric heating element or a low-precision electric heating plate.

[0007] Preferably, in the above thermal control structure, the heater substrate is a polyimide substrate.

[0008] Preferably, in the above thermal control structure, the high-precision heater is a high-precision electric heating element or a high-precision electric heating plate.

[0009] Preferably, in the above-mentioned thermal control structure, the temperature control boundary body is an aluminum alloy boundary body or a stainless steel boundary body.

[0010] Preferably, in the above thermal control structure, the temperature testing component is a temperature sensor.

[0011] Preferably, in the above thermal control structure, the low-precision heater and the object being heated are bonded together using thermally conductive double-sided adhesive or thermally conductive silicone.

[0012] Preferably, in the above thermal control structure, the high-precision heater and the heater substrate are bonded together using thermally conductive double-sided adhesive or thermally conductive silicone.

[0013] Preferably, in the above-mentioned thermal control structure, the distance between adjacent temperature testing components ranges from 1 cm to 3 cm.

[0014] The present invention provides a thermal control method, utilizing a thermal control structure as described in any of the above claims, comprising:

[0015] Low-precision temperature consistency is achieved using the aforementioned low-precision heater.

[0016] Based on the temperature measured by the temperature testing component, the high-precision heater, in conjunction with the temperature control strategy, achieves high-precision temperature consistency across all parts of the temperature control boundary body.

[0017] As described above, the thermal control structure provided by this invention includes a low-precision heater in direct contact with the object being heated. A heater substrate is fixed to one side of the low-precision heater, a high-precision heater is fixed to the other side of the heater substrate, a temperature control boundary body is fixed to the other side of the high-precision heater, and multiple temperature testing components are fixed to the other side of the temperature control boundary body. Therefore, it achieves higher temperature consistency at the temperature measurement boundary, reduces the requirements for the temperature control algorithm, lowers the difficulty of implementing a constant temperature boundary, and reduces the number of temperature sensors required, thus lowering manufacturing costs. The thermal control method provided by this invention has the same advantages. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0019] Figure 1 A schematic diagram of an embodiment of a thermal control structure provided by the present invention;

[0020] Figure 2 This is a schematic diagram of an embodiment of a thermal control method provided by the present invention. Detailed Implementation

[0021] The core of this invention is to provide a thermal control structure and its thermal control method, which can achieve higher temperature consistency at the temperature measurement boundary, reduce the requirements for temperature control algorithms, reduce the difficulty of achieving constant temperature boundaries, and reduce the number of temperature sensors and manufacturing costs.

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] An embodiment of the thermal control structure provided by the present invention is as follows: Figure 1 As shown, Figure 1 This is a schematic diagram of an embodiment of a thermal control structure provided by the present invention. The thermal control structure may include a low-precision heater 2 that is in direct contact with the object being heated 1. A heater substrate 3 is fixed to the other side of the low-precision heater 2. A high-precision heater 4 is fixed to the other side of the heater substrate 3. A temperature control boundary body 5 is fixed to the other side of the high-precision heater 4. A plurality of temperature testing components 6 are fixed to the other side of the temperature control boundary body 5. The temperature testing components 6 may be, but are not limited to, temperature sensors, and the distance between adjacent temperature testing components 6 may preferably be from 1 cm to 3 cm.

[0024] It should be noted that this thermal control structure has a dual-layer heating structure. The low-precision heater 2 is a passive thermal control layer, and the high-precision heater 4 is an active thermal control layer. Moreover, the temperature control boundary body 5 mentioned above must have good thermal conductivity. When the thermal control structure enters the working state, the low-precision heater 2 achieves relatively low-precision temperature uniformity. On this basis, the high-precision heater 4 and the temperature testing component 6, together with a certain temperature control strategy, can achieve a high-precision heating temperature control strategy, so that the temperature measurement boundary achieves higher temperature uniformity. In this way, low-precision and high-precision heating are combined, so that an overly complex structure is not needed to achieve temperature uniformity.

[0025] As can be seen from the above description, in the embodiments of the thermal control structure provided by the present invention, since it includes a low-precision heater that is in direct contact with the object being heated, a heater substrate is fixed on the other side of the low-precision heater, a high-precision heater is fixed on the other side of the heater substrate, a temperature control boundary body is fixed on the other side of the high-precision heater, and multiple temperature testing components are fixed on the other side of the temperature control boundary body, the temperature measurement boundary can have higher temperature consistency, reduce the requirements for the temperature control algorithm, reduce the difficulty of implementing the constant temperature boundary, and reduce the number of temperature sensors and manufacturing costs.

[0026] In one specific embodiment of the above thermal control structure, the low-precision heater 2 can be a low-precision electric heating element or a low-precision electric heating plate. Electric heating is low-cost and easy to implement. Of course, other methods can also be selected, and there are no restrictions here.

[0027] In another specific embodiment of the above-mentioned thermal control structure, the heater substrate 3 can preferably be a substrate made of polyimide, which has excellent thermal stability, chemical corrosion resistance and mechanical properties. Therefore, it is suitable to use this polyimide to make the heater substrate to improve the uniformity and stability of heating. Of course, other materials can also be selected according to actual needs, and there are no restrictions here.

[0028] In another specific embodiment of the above thermal control structure, the high-precision heater 4 can preferably be a high-precision electric heating element or a high-precision electric heating plate. This type of heater is low in cost and easy to obtain, and can achieve high-precision heating control using current or voltage. Of course, other types of heaters can also be selected according to actual needs, which is not limited here.

[0029] In a preferred embodiment of the above-mentioned thermal control structure, the temperature control boundary body 5 can preferably be an aluminum alloy boundary body or a stainless steel boundary body. Both of these materials can better transfer heat, thereby making it easier to achieve temperature uniformity at various locations. Of course, other materials can also be selected according to actual needs, which is not limited here.

[0030] In another preferred embodiment of the above-described thermal control structure, the low-precision heater 2 and the object being heated 1 can be bonded together using thermally conductive double-sided adhesive or thermally conductive silicone. Similarly, the high-precision heater 4 and the heater substrate 3 can be bonded together using thermally conductive double-sided adhesive or thermally conductive silicone. It should be noted that both the thermally conductive double-sided adhesive and the thermally conductive silicone have sufficiently good thermal conductivity and can firmly connect the components on both sides, resulting in a more compact and rational thermal control structure. Of course, other types of connecting components can also be selected according to actual needs; this is not a limitation.

[0031] An example implementation of the thermal control method provided by this invention Figure 2 As shown, Figure 2 This is a schematic diagram of an embodiment of a thermal control method provided by the present invention. Utilizing the thermal control structure as described in any of the above claims, the method may include the following steps:

[0032] S1: Achieving low-precision temperature consistency using a low-precision heater;

[0033] S2: Based on the temperature measured by the temperature testing component, a high-precision heater is used in conjunction with a temperature control strategy to achieve high-precision temperature consistency in all parts of the temperature control boundary body.

[0034] It is evident that this thermal control method solves the problem that achieving a high-precision constant temperature boundary with a single-layer heater requires a large number of heaters and temperature sensors, as well as high requirements for the temperature control algorithm, effectively reducing the difficulty of achieving a constant temperature boundary.

[0035] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A thermal control structure, characterized in that, It includes a low-precision heater that is in direct contact with the object being heated, a heater base plate fixed to the other side of the low-precision heater, a high-precision heater fixed to the other side of the heater base plate, a temperature control boundary body fixed to the other side of the high-precision heater, and multiple temperature testing components fixed to the other side of the temperature control boundary body.

2. The thermal control structure according to claim 1, characterized in that, The low-precision heater is a low-precision electric heating element or a low-precision electric heating plate.

3. The thermal control structure according to claim 1, characterized in that, The heater substrate is a polyimide substrate.

4. The thermal control structure according to claim 1, characterized in that, The high-precision heater is a high-precision electric heating element or a high-precision electric heating plate.

5. The thermal control structure according to claim 1, characterized in that, The temperature control boundary body is an aluminum alloy boundary body or a stainless steel boundary body.

6. The thermal control structure according to claim 1, characterized in that, The temperature testing component is a temperature sensor.

7. The thermal control structure according to claim 1, characterized in that, The low-precision heater is bonded to the object being heated using thermally conductive double-sided adhesive or thermally conductive silicone.

8. The thermal control structure according to claim 1, characterized in that, The high-precision heater is bonded to the heater substrate using thermally conductive double-sided adhesive or thermally conductive silicone.

9. The thermal control structure according to claim 1, characterized in that, The distance between adjacent temperature testing components ranges from 1 cm to 3 cm.

10. A thermal control method, characterized in that, The thermal control structure according to any one of claims 1-9 includes: Low-precision temperature consistency is achieved using the aforementioned low-precision heater. Based on the temperature measured by the temperature testing component, the high-precision heater, in conjunction with the temperature control strategy, achieves high-precision temperature consistency across all parts of the temperature control boundary body.

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