An electronic device and a method for manufacturing the electronic device.

Abstract

This application relates to an electronic device and a method for processing the electronic device. The electronic device includes a housing and a screen assembly mounted on the housing. The screen assembly includes a display screen and a protective film disposed on the side of the display screen away from the housing. The housing has a protrusion, and there is a gap between the protrusion and the protective film. A conductive layer is disposed within the gap. By disposing of a conductive layer within the gap, a conductive path can be formed, which can reduce the possibility of local charge accumulation, thereby reducing the possibility of dust and other impurities being attracted by electrostatic discharge.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device dust prevention, and in particular to an electronic device and a processing method of the electronic device. BACKGROUND

[0002] With the development of technology, electronic devices such as mobile phones, tablets, and laptops have become common communication devices for people. The screens of electronic devices are provided with protective films. In general, in order to meet the assembly tolerance or to leave a corresponding extension space for the protective film of the folding screen of the electronic device, a corresponding gap is left between the shell and the protective film, and the gap is easy to adsorb dust and other impurities. SUMMARY

[0003] The present application provides an electronic device and a processing method of the electronic device, which are used to solve the problem that the gap between the shell and the protective film of the electronic device is easy to adsorb dust and other impurities.

[0004] The present application provides an electronic device, which comprises:

[0005] a shell;

[0006] a screen assembly mounted on the shell;

[0007] The screen assembly comprises a display screen and a protective film, the protective film is located on the side of the display screen away from the shell, the shell comprises a protruding portion, the protruding portion protrudes along the side of the shell facing the screen assembly, the protruding portion is arranged along the circumferential direction of the screen assembly, and has a gap with the protective film, and a conductive layer is arranged in the gap.

[0008] The gap between the shell and the protective film can reduce the possibility of misalignment of the protective film when the protective film is attached, so that part of the protective film is located in the shell, thereby reducing the possibility of the occurrence of problems such as edge bonding and rainbow stripes. By arranging a conductive layer in the gap between the shell and the protective film assembly to form a conductive path, the possibility of charge accumulation in a certain area can be reduced, the possibility of static electricity generation can be reduced, thereby the possibility of adsorption of dust and other impurities in the gap due to static electricity can be reduced, which is conducive to improving the display effect of the electronic device, facilitating cleaning of the electronic device, and more in line with actual use requirements.

[0009] In a possible implementation, the screen assembly is a folding screen.

[0010] Generally, the folding screen needs to be protected by a protective film due to the inconvenience of setting a glass cover plate, as shown in the figure. Due to the different curvatures of the electronic device and the protective film, the position of the protective film relative to the display screen is different in the folded and unfolded states, and a certain gap needs to be left for the extension of the protective film. When dust and other impurities are adsorbed in the gap, it is easy to affect the extension of the protective film, and even cause damage to the protective film. Therefore, setting a conductive layer in the gap can better protect the folding screen and the protective film, and reduce the possibility of dust and other impurities being adsorbed in the gap.

[0011] In a possible implementation, when the screen assembly is in an unfolded state, the edge of the protective film is located at a first position, and when the screen assembly is in a folded state, the edge of the protective film is at a second position. The distance difference between the first position and the second position is 0.1 mm to 0.5 mm, and the width of the gap is not less than the distance difference.

[0012] The width of the gap is not less than the distance difference between the edge of the protective film at the first position and the second position. The extension space of the protective film can be reserved for the electronic device with a folding screen, so as to reduce the possibility of interference between the protective film and the shell during use, and better meet the actual use requirements.

[0013] In a possible implementation, an adhesive layer is arranged between the protective film and the display screen, the protective film is adhered to the display screen through the adhesive layer, and the adhesive layer can be deformed.

[0014] Since the position of the protective film is not completely the same in the unfolded and folded states of the electronic device, the protective film will be extended to a certain extent and will be displaced. Therefore, the adhesive layer needs to have a certain deformation ability to enable the adhesive layer to be extended with the protective film when the protective film is extended, thereby reducing the possibility of the protective film falling off from the display screen.

[0015] In a possible implementation, the shell includes a cavity, an inner wall of the cavity is provided with a limiting portion, the display screen is located in the cavity, and part of the adhesive layer is connected to the upper surface of the limiting portion along the thickness direction of the electronic device.

[0016] The limiting portion can limit the position of the display screen to improve the installation precision of the display screen. Part of the adhesive layer is connected to the upper surface of the limiting portion, and the area of the adhesive layer is greater than the area of the display screen. By increasing the area of the adhesive layer, the extended protective film can be well fixed when the protective film is extended, the stability of the protective film is improved, and the actual use requirements are better met.

[0017] In a possible implementation, the gap has a width of 0.1 mm to 1 mm, and the conductive layer covers the bottom wall of the gap.

[0018] The width of the gap can be equal to or greater than the distance difference of the edge of the protective film in the unfolded and folded states, and the conductive layer covering the bottom wall of the entire gap can facilitate reducing the possibility of local accumulation of electric charges, thereby reducing the possibility of electrostatic adsorption of dust and other impurities.

[0019] In a possible implementation, the gap has a depth of 0.5 mm to 3 mm.

[0020] The depth of the gap is 0.5 mm to 3 mm, which can facilitate accommodating the conductive layer.

[0021] In a possible implementation, the conductive layer has a thickness of 1 μm to 10 μm.

[0022] The conductive layer is too thin, which can easily cause damage to the conductive layer, and the conductive layer does not cover the bottom of the entire gap, thereby affecting the conductive effect. The conductive layer is too thick, which can easily hinder the extension of the protective film. The thickness of the conductive layer is less than the depth of the gap, which can reduce the wear of the conductive layer during use, and facilitate prolonging the service life of the conductive layer.

[0023] In a possible implementation, the conductive layer is a hydrophobic conductive layer.

[0024] The electronic device has a waterproof capability by making the conductive layer have a hydrophobic capability, which is more in line with actual use requirements.

[0025] In a possible implementation, at least part of the protruding portion is higher than the protective film along the thickness direction of the electronic device.

[0026] The protruding portion can be used to limit the installation of the protective film, so as to improve the position accuracy of the installation of the protective film. When the electronic device is an inward folding device with a folding screen, the protruding portion is higher than the protective film during folding. Therefore, the protruding portions at different ends of the electronic device can be in contact first, thereby reducing the possibility of mutual collision between the display screens, reducing the possibility of damage to the display screens, and being more in line with actual use requirements.

[0027] In a possible implementation, the conductive layer includes 50% to 80% of a conductive polymer, 19% to 30% of a fluorine-containing polymer, and 1% to 20% of a curing agent.

[0028] The conductive polymer can have an antistatic effect, and the fluorine-containing polymer can have a hydrophobic effect, thereby reducing the adsorption of dust and other impurities and improving the reliability of the entire machine.

[0029] In a possible implementation, the conductive layer comprises 50% to 80% of the fluoropolymer, 19% to 30% of the conductive particles, and 1% to 20% of the curing agent.

[0030] The fluoropolymer can have a hydrophobic effect, reducing the adsorption of impurities such as dust and improving the reliability of the entire machine.

[0031] In a possible implementation, the conductive layer comprises 50% to 80% of the fluoropolymer, 19% to 30% of the ionic liquid, and 1% to 20% of the curing agent.

[0032] The fluoropolymer can have a hydrophobic effect, reducing the adsorption of impurities such as dust and improving the reliability of the entire machine.

[0033] In a possible implementation, the distance between the gap and the display screen along the length or width direction of the electronic device is 0.1 mm to 1 mm.

[0034] Such a design can reduce the interference of the conductive layer on the display screen and reduce the possibility of touch failure of the display screen.

[0035] The application also provides a processing method of an electronic device, which is used to prepare the electronic device described in any one of the above embodiments, and the processing method comprises the following steps:

[0036] The screen assembly with the release film is installed in the shell.

[0037] The conductive layer is coated on the electronic device.

[0038] The release film is removed.

[0039] In a possible implementation, when the conductive layer is coated on the electronic device, the processing method comprises the following steps:

[0040] The electronic device coated with the conductive layer is placed in a UV light source until the conductive layer is cured.

[0041] In a possible implementation, when the conductive layer is coated on the electronic device, the processing method comprises the following steps:

[0042] The solution of the conductive layer is added to a carrier, baked to obtain a solid pill, and evaporated on the screen assembly by electron beam evaporation.

[0043] In a possible implementation, when the solution of the conductive layer is added to a carrier, baked to obtain a solid pill, and evaporated on the screen assembly by electron beam evaporation, the processing method comprises the following steps:

[0044] Before evaporation, the screen assembly is subjected to plasma treatment.

[0045] The embodiment of the present application provides an electronic device and a preparation method of the electronic device. The electronic device comprises a shell and a screen assembly mounted on the shell. The screen assembly comprises a display screen and a protective film arranged on a side of the display screen away from the shell. The shell is provided with a protruding portion. A gap is formed between the protruding portion and the protective film. A conductive layer is arranged in the gap. The conductive layer arranged in the gap can form a conductive path, so that the possibility of local accumulation of electric charges can be reduced, thereby reducing the possibility of electrostatic adsorption of dust and other impurities.

[0046] It should be understood that the above general description and the following detailed description are only exemplary and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0047] Figure 1 A structure schematic diagram of the electronic device in an unfolded state is provided in the present application.

[0048] Figure 2 A structure schematic diagram of the electronic device in a folded state is provided in the present application. Figure 1 A partial enlarged view of the position I is provided in the present application.

[0049] Figure 3 A structure schematic diagram of the electronic device in a folded state is provided in the present application.

[0050] Figure 4 A structure schematic diagram of the electronic device in a folded state is provided in the present application.

[0051] Figure 5 A structure schematic diagram of the electronic device in a folded state is provided in the present application. Figure 3 A partial enlarged view of the position II is provided in the present application.

[0052] Figure 6 A partial enlarged view of the position III is provided in the present application. Figure 4 A partial enlarged view of the position III is provided in the present application.

[0053] Figure 7 A processing flow schematic diagram of the electronic device is provided in the present application.

[0054] LIST OF REFERENCES

[0055] 1-shell, 11-protruding portion, 12-limiting portion; 2-screen assembly, 21-display screen, 22-protective film; 3-gap; 4-conductive layer; 5-adhesive layer; 6-release film.

[0056] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0057] In order to better understand the technical solutions of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0058] With the development of technology, electronic devices such as mobile phones, tablets, and laptops have become common communication devices for people. In order to protect the screen of the electronic device, a protective film can be attached to the screen to reduce the possibility of screen cracking, scratching, and the like. Generally, in order to meet the assembly tolerance of the protective film, a certain gap is usually left between the shell and the protective film. When the screen of the electronic device is a folding screen, due to the different curvatures of the whole machine and the protective film in the folded state, the protective film has a certain displacement in the folded state and the non-folded state, which causes the position of the protective film to change. The distance between the same edge of the protective film in the folded state and the non-folded state is the cross flux. In order to meet the demand of the cross flux, a certain gap is also required between the shell and the protective film. However, the gap formed is easy to accumulate charges to form static electricity, and the gap is easy to adsorb dust and other impurities under the action of static electricity, affecting the user's experience, and cleaning is very inconvenient.

[0059] In view of this, the embodiments of the present application provide an electronic device for solving the problem that the gap between the shell and the protective film of the electronic device is easy to adsorb dust and other impurities.

[0060] As shown in Figure 1 and Figure 2 , the embodiments of the present application provide an electronic device, which includes a shell 1 and a screen assembly 2 mounted on the shell 1, wherein the screen assembly 2 includes a display screen 21 and a protective film 22, and the protective film 22 is located on the side of the display screen 21 away from the shell 1. The shell 1 is provided with a protruding portion 11, which protrudes towards the side of the shell 1 close to the screen assembly 2. The protruding portion 11 is arranged along the circumference of the screen assembly 2 and has a gap 3 with the protective film 22, and a conductive layer 4 is arranged in the gap 3. Specifically, the protruding portion 11 can be arranged along the circumference of the screen assembly 2, or the protruding portion 11 can be arranged locally along the circumference of the screen assembly 2.

[0061] The gap 3 between the shell 1 and the protective film 22 can reduce the possibility of misalignment of the protective film 22 when attaching the protective film 22, which can cause part of the protective film 22 to be located on the shell 1, thereby reducing the possibility of problems such as edge lifting and rainbow stripes. By arranging the conductive layer 4 in the gap 3 between the shell 1 and the protective film 22 assembly to form a conductive path, the possibility of charge accumulation in a certain area can be reduced, the possibility of static electricity generation can be reduced, thereby the possibility of dust and other impurities being adsorbed in the gap 3 due to static electricity can be reduced, which is conducive to improving the display effect of the electronic device, and facilitating cleaning of the electronic device, and more in line with the actual use requirements.

[0062] As shown in Figure 3 and Figure 4As shown in a possible implementation, the screen assembly 2 is a folding screen.

[0063] Generally, the folding screen does not have a glass cover plate, and thus generally needs to be provided with a protective film 22 to protect the display screen 21, as shown in Figure 2 , Figure 5 and Figure 6 Due to the different curvatures of the electronic device and the protective film 22, the position of the protective film 22 relative to the display screen 21 is different in the folded and unfolded states, and a certain gap 3 needs to be left for the extension of the protective film 22. When dust or other impurities are adsorbed in the gap 3, the extension of the protective film 22 is easily affected, and even the protective film 22 is damaged. Therefore, the conductive layer 4 arranged in the gap 3 can better protect the folding screen and the protective film 22, and reduce the possibility of dust or other impurities being adsorbed in the gap 3.

[0064] In a possible implementation, the surface of the display screen 21 is made of colorless polyimide (CPI) or glass. The scheme provided in the embodiments of the present application can be used for screen assemblies 2 and electronic devices made of different materials.

[0065] As shown in Figure 2 , Figure 5 and Figure 6 In a possible implementation, when the screen assembly 2 is in an unfolded state, the edge of the protective film 22 is in a first position, and when the screen assembly 2 is in a second state, the edge of the protective film 22 is in a second position. The distance difference d2 between the first position and the second position is 0.1 mm to 0.5 mm, and the width d1 of the gap 3 is not less than the distance difference d2.

[0066] Generally, the foldable electronic device includes two types of inner folding and outer folding, as shown in Figure 3 and Figure 5 When the electronic device is in a folded state, the screen assembly 2 is located on the outside, and the shell 1 of the electronic device is located on the inside, which is an outer folding state. Due to the different curvatures of the electronic device and the protective film 22, as shown in Figure 5 , compared with the folded state, when the electronic device is in an unfolded state, the protective film 22 will extend to the edge of the electronic device to a certain extent. The position of the protective film in the unfolded state of the outer folding device is shown by the dashed line in the figure, and the distance difference d2 between the first position and the second position is the extension distance. As shown in Figure 4 and Figure 6 When the electronic device is in a folded state, the screen assembly 2 is located on the inside, and the shell 1 of the electronic device is located on the outside, which is an inner folding state. Due to the different curvatures of the electronic device and the protective film 22, as shown in Figure 6As shown, compared with the unfolded state, when the electronic device is in the folded state, the protective film 22 will extend to the edge of the electronic device to a certain extent, and the position of the protective film in the unfolded state of the folded device is shown by the dashed line, and the distance difference d2 between the first position and the second position is the extension distance.

[0067] The width d1 of the gap 3 is not less than the distance difference d2 of the edge of the protective film 22 at the first position and the second position. The extension space of the protective film 22 can be reserved for the electronic device with a folding screen, so that the possibility of interference between the protective film 22 and the shell 1 during use of the electronic device can be reduced, and the actual use demand can be met.

[0068] As shown in Figure 2 , Figure 5 and Figure 6 , in a possible implementation, the protective film 22 and the display screen 21 have an adhesive layer 5 therebetween, the protective film 22 is relatively fixed to the display screen 21 by adhesion, and the adhesive layer 5 can be deformed.

[0069] Since the position of the protective film 22 is not completely the same in the unfolded and folded states of the electronic device, the protective film 22 will extend to a certain extent and displace, therefore, the adhesive layer needs to have a certain deformation ability to enable the adhesive layer to extend with the protective film 22 when the protective film 22 extends, thereby reducing the possibility of the protective film 22 falling off from the display screen 21.

[0070] As shown in Figure 2 , in a possible implementation, the shell 1 includes a cavity, a limiting portion 12 is arranged on the inner wall of the cavity, the limiting portion 12 protrudes towards the inside of the cavity, the display screen 21 is located in the cavity, and the limiting portion 12 is used to limit the position of the display screen 21. The part of the adhesive layer 5 is connected with the upper surface of the limiting portion 12 in the thickness direction of the electronic device.

[0071] By arranging the limiting portion 12, the position of the display screen 21 can be limited, and the installation precision of the display screen 21 is improved. The part of the adhesive layer 5 is connected with the upper surface of the limiting portion 12, that is, the area of the adhesive layer 5 can be greater than the area of the display screen 21, and the area of the adhesive layer 5 can be greater than or equal to the area of the protective film 22. By increasing the area of the adhesive layer 5, the protective film 22 can play a good fixing role when the protective film 22 extends, the stability of the protective film 22 is improved, and the actual use demand can be met.

[0072] As shown in Figure 2 , in a possible implementation, the width d1 of the gap 3 is 0.1 mm to 1 mm, and the conductive layer 4 covers the bottom wall of the gap 3.

[0073] The width d1 of the gap 3 can be equal to or greater than the distance difference d2 of the edge of the protective film 22 in the unfolded and folded states. Covering the bottom wall of the entire gap 3 by the conductive layer 4 can facilitate reducing the possibility of local accumulation of electric charges, thereby reducing the possibility of electrostatic adsorption of dust and other impurities.

[0074] As shown in the possible implementation, the depth d3 of the gap 3 is 0.5 mm to 3 mm. Figure 5

[0075] The depth of the gap 3 is 0.5 mm to 3 mm, which can facilitate accommodating the conductive layer 4.

[0076] In a possible implementation, the thickness of the conductive layer 4 is 1 μm to 10 μm.

[0077] The conductive layer 4 is too thin, which can easily cause damage to the conductive layer 4, and the conductive layer 4 does not cover the bottom of the gap 3, thereby affecting the conductive effect. The conductive layer 4 is too thick, which can easily hinder the extension of the protective film 22. The thickness of the conductive layer 4 is less than the depth of the gap 3, which can reduce the wear of the conductive layer 4 during use, thereby facilitating prolonging the service life of the conductive layer 4.

[0078] In a possible implementation, the conductive layer 4 is a hydrophobic conductive layer.

[0079] The conductive layer 4 has hydrophobic ability, which can further improve the waterproof capability of the electronic device, and is more in line with the actual use demand.

[0080] In a possible implementation, the conductive layer 4 is a transparent structure.

[0081] The conductive layer 4 can be a colorless transparent structure, which can reduce the influence on the display of the display screen 21 and the overall appearance of the electronic device, and is more in line with the actual use demand.

[0082] As shown in the possible implementation, along the thickness direction of the electronic device, at least part of the protruding part 11 is higher than the display screen 21. Figure 2 The protruding part 11 can be used to limit the installation of the protective film 22, so as to improve the position accuracy of the installation of the protective film 22. When the electronic device is a foldable device with a foldable screen, the protruding parts 11 at the two ends of the electronic device can be first contacted when folding, thereby reducing the possibility of mutual collision of the display screens 21, reducing the possibility of damage to the display screens 21, and being more in line with the actual use demand.

[0083]

[0084] ​​The conductive layer 4 can be coated by spraying, evaporation, inkjet printing, slot coating, dispensing, etc. During processing, the display screen 21 can be first installed on the shell 1, and then the protective film 22 is attached. After attachment, the release film 6 is not torn off, and the spraying operation is performed with the release film 6. After spraying the conductive layer 4, the release film 6 is torn off.

[0085] Such a design can reduce the possibility of the conductive layer 4 being sprayed on the protective film 22. When the conductive layer 4 is sprayed on the protective film 22, it will affect the touch performance of the screen assembly 2, easily leading to touch failure, and affecting the normal use of the electronic device.

[0086] As shown in Figure 7 During processing, the solution of the hydrophobic conductive coating can be first configured, and then sprayed, and then placed. The hydrophobic conductive coating is easily heat-cured, UV-cured, moisture-cured, etc. to form a hydrophobic conductive layer. After curing, the release film 6 on the surface of the protective film 22 is torn off.

[0087] The solution of the hydrophobic conductive layer can be designed with a fluorine-containing conductive polymer. The fluorine-containing conductive polymer solution can include 50% to 80% conductive polymer, 19% to 30% fluorine-containing polymer, and 1% to 20% curing agent. The conductive polymer can include one or more of PEDOT polythiophene conductive polymer, polypyrrole conductive polymer, polyaniline conductive polymer, acrylate conductive polymer, etc. The fluorine-containing polymer includes one or more of perfluoropolyether, polytetrafluoroethylene, etc. The curing agent includes one or more of aliphatic amine curing agent, isocyanate curing agent, aromatic amine curing agent, amido amine curing agent, aromatic ketone curing agent, benzoin ether curing agent, etc.

[0088] The conductive polymer solution and the fluorine-containing polymer solution are mixed uniformly, the curing agent is added, and the mixed solution is obtained after uniform stirring. The mixed solution is coated on the screen assembly 2 in the form of spraying, and then the screen assembly 2 is placed under a UV light source for a period of time, which can be 20 minutes. The fluorine-containing conductive polymer is fully polymerized and cured into a film. Then the release film 6 on the surface of the protective film 22 is torn off.

[0089] By setting the hydrophobic conductive layer, the problem that the gap 3 between the shell 1 and the screen assembly 2 easily adsorbs dust and other impurities and is not easy to clean can be reduced, which is beneficial to improve the user experience.

[0090] In use, the conductive polymer solution can also be mixed with the fluoropolymer solution, and a curing agent is added. After stirring, a mixed solution is obtained and used. The mixed solution is added to the carrier, and the mixed solution is baked to complete thermal curing and remove the solvent, obtaining a solid pill. The solid pill is used as a target material, and the screen assembly 2 is coated by electron beam evaporation. The screen assembly 2 faces the target material, and the release film 6 is not removed from the screen assembly 2. Before evaporation, the screen assembly 2 is subjected to plasma treatment to enhance the adhesion of the coating to the screen assembly 2. After evaporation, the release film 6 is removed.

[0091] The hydrophobic conductive layer is deposited by physical vapor deposition (PVD), and the uniformity of the coating is good and the consistency is higher.

[0092] The hydrophobic conductive layer can also be designed with fluoropolymer mixed conductive particles. The composition of the fluoropolymer mixed conductive particles can include 50% to 80% fluoropolymer, 19% to 30% conductive particles, and 1% to 20% curing agent. The fluoropolymer includes one or more of perfluoropolyether, polytetrafluoroethylene, etc. The conductive particles include one or more of metal particles, carbon black, graphite sheet, graphene, carbon nanotube, etc. The curing agent includes one or more of aliphatic amine curing agent, isocyanate curing agent, aromatic amine curing agent, amido amine curing agent, aromatic ketone curing agent, benzoin ether curing agent, etc.

[0093] The fluoropolymer solution is mixed with the conductive particles, and a curing agent is added. The mixed solution is coated on the screen assembly 2 by spraying, and then the screen assembly 2 is placed under a UV light source for a period of time, which can be 20 minutes. The fluorine-containing conductive polymer is fully polymerized and cured into a film, and then the release film 6 on the surface of the protective film 22 is removed.

[0094] The conductive particles can reduce the impedance of the fluoropolymer and have an antistatic effect.

[0095] The hydrophobic conductive layer can also be designed using a mixture of fluorinated polymers and ionic liquids. The composition of the fluorinated conductive ionic liquid mixture includes: 50% to 80% fluorinated polymer, 19% to 30% ionic liquid, and 1% to 20% curing agent. The fluorinated polymer includes one or more of perfluoropolyethers and polytetrafluoroethylene. The ionic liquid includes one or more cationic ionic liquids, such as alkyl quaternary ammonium salts and alkyl phosphate salts, and one or more anionic ionic liquids, such as alkali metal salts of alkyl sulfonates, alkali metal salts of alkyl phosphates, and alkali metal salts of alkyl dithiocarbamates. The curing agent includes one or more of aliphatic amine curing agents, isocyanate curing agents, aromatic amine curing agents, amide amine curing agents, aromatic ketone curing agents, and benzoin ether curing agents.

[0096] The fluoropolymer solution and ionic liquid are mixed evenly, and a curing agent is added. The well-stirred mixture is then sprayed onto the screen assembly 2. The screen assembly 2 is then placed under a UV light source for a period of time, such as 20 minutes, to allow the fluoroconductive polymer to fully polymerize and cure into a film. Finally, the release film 6 on the surface of the protective film 22 is removed.

[0097] Fluoropolymers can achieve hydrophobic effects, improving the reliability of electronic devices, while ionic liquids can reduce the impedance of polymers, thereby achieving antistatic effects and reducing the possibility of dust and other impurities adsorbed.

[0098] Specifically, the solution design methods for the hydrophobic conductive layer include, but are not limited to, the solutions mentioned above. Other designs that have hydrophobic and conductive effects and can be cured to form a coating can also be applied to the solutions in this application.

[0099] In one possible implementation, the conductive layer 4 can be an antistatic tape.

[0100] Antistatic tape can prevent static electricity, which helps reduce the possibility of dust and other impurities accumulating in gap 3.

[0101] In one possible implementation, the protective film 22 can be a PET protective film 22, the thickness of which can be 10 micrometers to 100 micrometers, and the adhesive layer 5 can be OCA adhesive, the thickness of which can be 10 micrometers to 50 micrometers.

[0102] like Figure 2 As shown, in one possible implementation, the distance d4 between the conductive layer 4 and the display screen 21 is 0.1 mm to 1 mm along the length or width direction of the electronic device.

[0103] By having a preset distance between the conductive layer 4 and the display screen 21, the influence of the conductive layer 4 on the touch performance of the screen assembly 2 can be reduced. When the conductive layer 4 is in contact with the display screen 21, for example, coated above the display screen 21, the impedance of the surface of the display screen 21 changes, which easily causes the touch in this area to fail, affecting the normal use of the screen assembly 2 and the electronic device.

[0104] As shown in Figure 2 In a possible implementation, the display screen 21 is located in the cavity, and the conductive layer 4 can be arranged on the upper surface of the limiting portion 12 in the thickness direction of the electronic device. The display screen 21 is located inside the limiting portion 12 and does not exceed the height of the limiting portion 12. Specifically, the upper surface of the display screen 21 can be at the same height as the upper surface of the limiting portion 12. The partial protective film 22 and the partial adhesive layer 5 are arranged on the upper surface of the limiting portion 12. Since the sizes of the protective film 22 and the adhesive layer 5 can be greater than those of the display screen 21, the conductive layer 4 can be kept at a certain distance from the display screen 21 in the length or width direction of the electronic device, reducing the possibility of contact between the two.

[0105] The scheme provided by the embodiments of the present application can be applied to electronic devices such as mobile phones, tablet computers, and notebook computers. The mobile phone can include a folding screen mobile phone, which can include an inner folding machine and an outer folding machine. In addition to the above-mentioned application scenarios, the embodiments of the present application can also be applied to other scenarios where there is a gap 3 between the protective film 22 and the positive shell.

[0106] The embodiments of the present application also provide a processing method of an electronic device, which is used to process the electronic device involved in the above embodiments. The processing method comprises the following steps:

[0107] S1, installing the screen assembly 2 with the release film 6 on the shell 1.

[0108] S2, coating the conductive layer on the electronic device.

[0109] S3, removing the release film 6.

[0110] The conductive layer 4 can be prepared by using the composition and weight ratio mentioned in the foregoing.

[0111] When step S2 is performed, the processing method can further comprise the following steps:

[0112] S21, placing the electronic device coated with the conductive layer 4 under a UV light source until the conductive layer 4 is cured.

[0113] When step S2 is performed, the processing method can further comprise the following steps:

[0114] S22, adding the solution of the conductive layer 4 to a carrier, performing baking treatment to obtain a solid pill, and evaporating the conductive layer 4 on the screen assembly 2 in the form of electron beam evaporation.

[0115] When step S22 is performed, the processing method can further include:

[0116] S221, before evaporation, the screen assembly 2 is subjected to plasma treatment.

[0117] The embodiment of the present application provides an electronic device and a processing method of the electronic device. The electronic device comprises a shell 1 and a screen assembly 2 installed on the shell 1. The screen assembly 2 comprises a display screen 21 and a protective film 22 arranged on the side of the display screen 21 away from the shell 1. The shell 1 is provided with a protruding part 11. There is a gap 3 between the protruding part 11 and the protective film 22. A conductive layer 4 is arranged in the gap 3. By arranging the conductive layer 4 in the gap 3, a conductive path can be formed, and the possibility of local accumulation of electric charges can be reduced, thereby reducing the possibility of electrostatic adsorption of dust and other impurities.

[0118] It should be noted that a part of the patent application file contains content protected by copyright. The copyright owner reserves all rights except that making copies of the patent document content of the patent file or record of the patent office is permitted.

Claims

1. An electronic device, comprising: The electronic device comprises: a housing (1); a screen assembly (2) mounted on the housing (1); wherein the screen assembly (2) comprises a display screen (21) and a protective film (22), the protective film (22) is located on the side of the display screen (21) away from the housing (1), the housing (1) comprises a protruding portion (11), the protruding portion (11) protrudes along the side of the housing (1) towards the screen assembly (2), the protruding portion (11) is arranged along the circumference of the screen assembly (2), and a gap (3) is formed between the protruding portion (11) and the protective film (22), and a conductive layer (4) is arranged in the gap (3).

2. The electronic device of claim 1, wherein, The screen assembly (2) is a folding screen.

3. The electronic device of claim 2, wherein, When the screen assembly (2) is in an unfolded state, the edge of the protective film (22) is located at a first position, and when the screen assembly (2) is in a folded state, the edge of the protective film (22) is located at a second position, the distance difference between the first position and the second position is 0.1-0.5 mm, and the width of the gap (3) is not less than the distance difference.

4. The electronic device of claim 2, wherein, An adhesive layer (5) is arranged between the protective film (22) and the display screen (21), the protective film (22) is adhered to the display screen (21) through the adhesive layer (5), and the adhesive layer (5) can be deformed.

5. The electronic device of claim 4, wherein, The housing (1) comprises a cavity, the inner wall of the cavity is provided with a limiting portion (12), the display screen (21) is located in the cavity, and part of the adhesive layer (5) is connected to the upper surface of the limiting portion (12) in the thickness direction of the electronic device.

6. The electronic device of any of claims 1-5, wherein, The width of the gap (3) is 0.1-1 mm, and the conductive layer (4) covers the bottom wall of the gap (3).

7. The electronic device of any of claims 1-5, wherein, The depth of the gap (3) is 0.5-3 mm.

8. The electronic device of any of claims 1-5, wherein, The thickness of the conductive layer (4) is 1-10 microns.

9. The electronic device of any of claims 1-5, wherein, The conductive layer (4) is a hydrophobic conductive layer.

10. The electronic device of any of claims 1-5, wherein, At least part of the protruding portion (11) is higher than the protective film (22) in the thickness direction of the electronic device.

11. The electronic device of any of claims 1-5, wherein, The conductive layer comprises 50-80% conductive polymer, 19-30% fluorine-containing polymer, and 1-20% curing agent.

12. The electronic device of any of claims 1-5, wherein, The conductive layer comprises 50-80% fluorine-containing polymer, 19-30% conductive particles, and 1-20% curing agent.

13. The electronic device of any of claims 1-5, wherein, The conductive layer comprises 50-80% fluorine-containing polymer, 19-30% ionic liquid, and 1-20% curing agent.

14. The electronic device of any of claims 1-5, wherein, The distance between the gap (3) and the display screen (21) is 0.1-1 mm in the length or width direction of the electronic device.

15. A processing method of an electronic device, the processing method of an electronic device being used for manufacturing the electronic device according to any one of claims 1 to 14, characterized by, The processing method comprises: mounting the screen assembly (2) with a release film (6) on the housing (1); coating the conductive layer (4) on the electronic device; removing the release film (6).

16. The method of processing an electronic device according to claim 15, wherein When coating the conductive layer (4) on the electronic device, the processing method comprises: placing the electronic device coated with the conductive layer (4) under a UV light source until the conductive layer (4) is cured.

17. The method of processing an electronic device according to claim 15, wherein When coating the conductive layer (4) on the electronic device, the processing method comprises: The solution of the conductive layer (4) is added to the carrier, baked to obtain a solid pill, and evaporated on the screen assembly (2) by electron beam evaporation.

18. The method of processing an electronic device according to claim 17, wherein, The processing method includes, when the solution of the conductive layer (4) is added to the carrier, baked to obtain a solid pill, and evaporated on the screen assembly (2) by electron beam evaporation: The screen assembly (2) is subjected to plasma treatment before evaporation.

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