Multilayer resonator line structure and multilayer filter line structure

Abstract

A multilayer resonator line structure and a multilayer filter line structure are provided. The multilayer resonator line structure includes a multilayer substrate, a plurality of resonators, and a plurality of conductive members. The multilayer substrate has an upper surface, a lower surface, and a ground layer. The upper surface and the lower surface face away from each other, and the ground layer is between the upper surface and the lower surface. Part of the resonators are disposed on the upper surface, and another part of the resonators are disposed on the lower surface. The conductive members are in the multilayer substrate and electrically connect the resonators to the ground layer, respectively.

Description

Technical Field

[0001] This invention relates to a resonator circuit structure and a filter circuit structure, and more particularly to a multilayer resonator circuit structure and a multilayer filter circuit structure. Background Technology

[0002] Generally, a band-pass filter is used to filter out signals in a frequency band between two specific frequencies. Because resonators have the characteristic of producing a frequency response only at a specific frequency, they are often used to implement band-pass filters. When a band-pass filter implemented with multiple resonators needs to be set on a circuit board, these resonators are usually placed on the same mounting surface of the circuit board.

[0003] However, because these resonators are all mounted on the same mounting surface of the circuit board, they occupy a large area on the mounting surface, compressing the space occupied by other electronic components. This reduces the space utilization of the circuit board and makes miniaturization difficult. Summary of the Invention

[0004] The present invention provides a multilayer resonator circuit structure and a multilayer filter circuit structure to improve the space utilization of the circuit board and make the miniaturization of the circuit board easier.

[0005] An embodiment of the present invention discloses a multilayer resonator circuit structure comprising a multilayer substrate, a plurality of resonators, and a plurality of conductive components. The multilayer substrate has an upper surface, a lower surface, and a ground layer. The upper and lower surfaces are back-to-back with each other, and the ground layer is located between the upper and lower surfaces. A portion of the resonators is disposed on the upper surface, and another portion of the resonators is disposed on the lower surface. The conductive components are located in the multilayer substrate and electrically connect the resonators to the ground layer.

[0006] In one embodiment of the invention, each resonator includes a contact portion and a plurality of resonant transmission lines. The resonant transmission lines are connected to the contact portion and consist of a ground line and at least one open line. These conductive components electrically connect these ground lines to a ground plane.

[0007] In one embodiment of the present invention, the number of at least one open line is multiple.

[0008] In one embodiment of the invention, each resonant transmission line includes an inner extension section and an outer extension section. The inner extension section is connected to the contact portion. The outer extension section is connected to the inner extension section. The outer extension section is not parallel to the inner extension section.

[0009] In one embodiment of the invention, the inner and outer extensions of any resonant transmission line, together with the inner extensions of adjacent resonant transmission lines, surround a layout area. Each resonator also includes a plurality of extensions. These extensions are located in these layout areas and connected to the contact portions.

[0010] In one embodiment of the invention, there are two resonators located on the upper surface and two on the lower surface, and the two resonators on the upper and lower surfaces are coupled together by parallel resonant transmission lines. The ground layer has two slots that are separate from each other. The two slots correspond to the two resonant transmission lines coupled on the upper surface. The other slot corresponds to the two resonant transmission lines coupled on the lower surface.

[0011] In one embodiment of the present invention, the projection of each slot on the upper or lower surface is located between the two contact portions and perpendicular to the two outer extensions of the coupled two resonant transmission lines.

[0012] In one embodiment of the invention, each slot includes a main slot segment and two secondary slot segments. The projection of the main slot segment on the upper or lower surface is located between the two contact portions and is perpendicular to the two outer extensions of the coupled two resonant transmission lines. The two secondary slot segments are respectively connected to opposite ends of the main slot segment and are perpendicular to the main slot segment.

[0013] In one embodiment of the invention, each slot further includes multiple secondary slot segments. These secondary slot segments are respectively connected to the opposite ends of the two secondary slot segments and are parallel to the main slot segment.

[0014] Another embodiment of the present invention discloses a multilayer filter circuit structure comprising a multilayer substrate, a plurality of filters, and a plurality of conductive components. The multilayer substrate has an upper surface, a lower surface, and a ground layer. The upper and lower surfaces are back-to-back with each other, and the ground layer is located between the upper and lower surfaces. A portion of the filters is disposed on the upper surface, and another portion of the filters is disposed on the lower surface. The conductive components are located in the multilayer substrate and electrically connect the filters to the ground layer.

[0015] In one embodiment of the invention, each filter includes at least one resonator, an input interface, and an output interface. The input interface and the output interface are respectively located on opposite sides of the at least one resonator. These conductive components electrically connect the resonators to a ground plane.

[0016] In one embodiment of the present invention, there are multiple resonators located on the upper surface and the lower surface, and the resonators located on the upper surface and the resonators located on the lower surface are arranged in multiple rows of straight lines.

[0017] In one embodiment of the invention, the number of these resonators in each row on the upper and lower surfaces is the same.

[0018] In one embodiment of the invention, at least two rows of resonators on the upper surface have different numbers of resonators. Similarly, at least two rows of resonators on the lower surface have different numbers of resonators.

[0019] According to the multilayer resonator circuit structure and multilayer filter circuit structure disclosed in the above embodiments, the resonators are respectively disposed on the upper and lower surfaces of the multilayer substrate facing away from each other, or the filters are respectively disposed on the upper and lower surfaces of the multilayer substrate facing away from each other. That is, some resonators or some filters can be reconfigured on the lower surface where electronic components are not located, without occupying any space on the upper surface of the multilayer substrate where other electronic components are located. In this way, the change in the placement of the resonators and filters will allow more space on the upper surface where electronic components are located to be placed, thereby improving the space utilization of the circuit board and contributing to the miniaturization of the circuit board. Attached Figure Description

[0020] Figure 1 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the first embodiment of the present invention.

[0021] Figure 2 for Figure 1 A three-dimensional cross-sectional schematic diagram of the multi-layer resonator circuit structure.

[0022] Figure 3 for Figure 1 Top view of the multilayer resonator circuit structure.

[0023] Figure 4 for Figure 1 The bottom view of the multilayer resonator circuit structure.

[0024] Figure 5 This is a three-dimensional schematic diagram of a multilayer resonator circuit structure according to a second embodiment of the present invention.

[0025] Figure 6 for Figure 5 Top view of the multilayer resonator circuit structure.

[0026] Figure 7 This is a three-dimensional schematic diagram of a multilayer resonator circuit structure according to a third embodiment of the present invention.

[0027] Figure 8 for Figure 7 Top view of the multilayer resonator circuit structure.

[0028] Figure 9 This is a three-dimensional schematic diagram of a multilayer resonator circuit structure according to a fourth embodiment of the present invention.

[0029] Figure 10 This is a three-dimensional schematic diagram of a multilayer resonator circuit structure according to a fifth embodiment of the present invention.

[0030] Figure 11 for Figure 10 Top view of the multilayer resonator circuit structure.

[0031] Figure 12 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the sixth embodiment of the present invention.

[0032] Figure 13 for Figure 12 Top view of the multilayer resonator circuit structure.

[0033] Figure 14 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the seventh embodiment of the present invention.

[0034] Figure 15 for Figure 14 Top view of the multilayer resonator circuit structure.

[0035] Figure 16 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the eighth embodiment of the present invention.

[0036] Figure 17 for Figure 16 Top view of the multilayer resonator circuit structure.

[0037] Figure 18 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the ninth embodiment of the present invention.

[0038] Figure 19 for Figure 18 Top view of the multilayer resonator circuit structure.

[0039] Figure 20 This is a three-dimensional schematic diagram of a multilayer resonator circuit structure according to the tenth embodiment of the present invention.

[0040] Figure 21 for Figure 20 Top view of the multilayer resonator circuit structure.

[0041] Figure 22 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the eleventh embodiment of the present invention.

[0042] Figure 23 for Figure 22 Top view of the multilayer resonator circuit structure.

[0043] Figure 24 This is a three-dimensional schematic diagram of the multilayer filter circuit structure according to the twelfth embodiment of the present invention.

[0044] Figure 25 for Figure 24 The top view of the multilayer filter circuit structure.

[0045] Figure 26 This is a three-dimensional schematic diagram of a multilayer filter circuit structure according to the thirteenth embodiment of the present invention.

[0046] Figure 27 for Figure 26 The top view of the multilayer filter circuit structure.

[0047] Figure 28 This is a three-dimensional schematic diagram of a multilayer filter circuit structure according to the fourteenth embodiment of the present invention.

[0048] Figure 29 for Figure 28 The top view of the multilayer filter circuit structure. Detailed Implementation

[0049] The following detailed description of the embodiments of the present invention outlines its features and advantages, sufficient to enable any person skilled in the art to understand the technical content of the embodiments and implement them accordingly. Furthermore, based on the disclosure, claims, and drawings in this specification, any person skilled in the art can easily understand the related objectives and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but are not intended to limit the scope of the invention in any way.

[0050] It should be noted that throughout the instruction manual, the same reference numerals refer to the same or similar components.

[0051] Please see Figures 1 to 4 . Figure 1 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the first embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional cross-sectional schematic diagram of the multi-layer resonator circuit structure. Figure 3 for Figure 1 Top view of the multilayer resonator circuit structure. Figure 4 for Figure 1 The bottom view of the multilayer resonator circuit structure.

[0052] In this embodiment, the multilayer resonator circuit structure 10 includes a multilayer substrate 100, a plurality of resonators 200, and a plurality of conductive components 300. The multilayer substrate 100 has an upper surface 111, a lower surface 121, and a ground layer 130. The upper surface 111 and the lower surface 121 are back-to-back with each other, and the ground layer 130 is located between the upper surface 111 and the lower surface 121. In this embodiment, the multilayer substrate 100 is, for example, a two-layer substrate. More specifically, in this embodiment, the multilayer substrate 100 includes a first dielectric layer 110, a second dielectric layer 120, and a ground layer 130. The first dielectric layer 110 and the second dielectric layer 120 are located on opposite sides of the ground layer 130. The upper surface 111 and the lower surface 121 are located on the first dielectric layer 110 and the second dielectric layer 120, respectively, and are back-to-back with the ground layer 130.

[0053] In this embodiment, the ground layer 130 has two separate slots 131. In this embodiment, the slots 131 are, for example, elongated and filled with dielectric material, but are not limited thereto. In other embodiments, the slots are, for example, empty slots without dielectric material.

[0054] A portion of the resonator 200 is disposed on the upper surface 111. Another portion of the resonator 200 is disposed on the lower surface 121. For example, there are two resonators 200 located on the upper surface 111, and they are coupled to each other. There are two resonators 200 located on the lower surface 121, and they are coupled to each other.

[0055] In this embodiment, the number of resonators 200 located on the upper surface 111 is, for example, the same as the number of resonators 200 located on the lower surface 121, but the invention is not limited thereto. In other embodiments, the number of resonators located on the upper surface may also be different from the number of resonators located on the lower surface.

[0056] Since the structures of all resonators 200 are the same or similar, only one resonator 200 will be described below. The resonator 200 includes a contact portion 210 and multiple resonant transmission lines 220. These resonant transmission lines 220 are connected to the contact portion 210, and these resonant transmission lines 220 are, for example, a ground line 2201 and three open lines 2202. That is, the ground line 2201 and the three open lines 2202 are connected to the contact portion 210.

[0057] Each resonant transmission line 220 is bent and includes an inner extension 221 and an outer extension 222. Alternatively, the ground line 2201 and each open line 2202 are both bent and each includes an inner extension 221 and an outer extension 222. These inner extensions 221 are connected to the contact portion 210. These outer extensions 222 are respectively connected to these inner extensions 221, and these outer extensions 222 are not parallel to these inner extensions 221. In this embodiment, the outer contour of the resonator 200 is generally square, and each inner extension 221 is located, for example, at a diagonal of the square, and each outer extension 222 is located, for example, at a side of the square. Alternatively, each inner extension 221 is arranged radially relative to the contact portion 210, and the angle between any two adjacent inner extensions 221 is, for example, 90 degrees, and the angle between each outer extension 222 and each connected inner extension 221 is, for example, 45 degrees. This causes the inner extension 221 and outer extension 222 of any resonant transmission line 220 to together with the inner extension 221 of the adjacent resonant transmission line 220 to surround the layout region S. The outer contour of the layout region S is approximately an isosceles triangle.

[0058] In this embodiment, the resonator 200 may further include multiple extension sections 230. These extension sections 230 are located in the layout regions S and connected to the contact section 210. The extension sections 230 are separated from the surrounding inner extension sections 221 and outer extension sections 222, and, while being separated from the surrounding inner extension sections 221 and outer extension sections 222, they fill the layout region S as much as possible. In this way, the stopband of the resonator 200 can be widened by increasing the layout area of ​​the extension sections 230. Alternatively, the stopband of the resonator 200 can also be widened by increasing the number of open lines 2202.

[0059] In this embodiment, the dual-resonance transmission lines 220 of the two resonators 200 are arranged side-by-side, enabling the two resonators 200 to be coupled. For example, as... Figure 3 As shown, taking the two resonators 200 located on the upper surface 111 as an example, the two outer extensions 222 of the two grounding lines 2201 are parallel to each other and side by side, so that the two resonators 200 are coupled together. Or, as Figure 4 As shown, taking the two resonators 200 located on the lower surface 121 as an example, the two outer extensions 222 of the two open lines 2202 are parallel to each other and side by side, so that the two resonators 200 are coupled together. Alternatively, in other embodiments, the outer extension of the ground line and the outer extension of the open line may be parallel to each other and side by side, so that the two resonators are coupled together. Furthermore, the smaller the gap G between the two outer extensions 222 of the two resonant transmission lines 220, the greater the coupling of the coupled two resonators 200.

[0060] The two slots 131 have corresponding upper surface 111 with coupled dual resonant transmission lines 220, and another corresponding lower surface 121 with coupled dual resonant transmission lines 220. Since the structures of the two slots 131 are identical or similar, only one slot 131 will be described below. Figure 3 As shown, taking the dual resonator 200 located on the upper surface 111 as an example, the projection of the slot 131 onto the upper surface 111 is located between the two contact portions 210 of the corresponding dual resonator 200, and is perpendicular to the two outer extensions 222 of the coupled dual resonant transmission line 220. Since the relationship between the other slot 131 and the dual resonator 200 located on the lower surface 121 is the same as or similar to the above description, it will not be described again.

[0061] Furthermore, the design of slot 131 can increase the coupling of the coupled two resonators 200, and the length L of slot 131 is positively correlated with the coupling of the coupled two resonators 200. That is, the longer the length L of slot 131, the greater the coupling of the coupled two resonators 200.

[0062] These conductive components 300 are, for example, conductive blind vias. These conductive components 300 are located in the first dielectric layer 110 and the second dielectric layer 120 of the multilayer substrate 100, respectively, and electrically connect these ground lines 2201 of the resonator 200 to the ground layer 130.

[0063] In this embodiment, the number of resonators 200 located on the upper surface 111 is the same as the number of resonators 200 located on the lower surface 121, but this is not a limitation. In other embodiments, the number of resonators located on the upper surface may also be different from the number of resonators located on the lower surface.

[0064] Please see Figures 5 to 6 , Figure 5 This is a three-dimensional schematic diagram of a multilayer resonator circuit structure according to a second embodiment of the present invention. Figure 6 for Figure 5 The image shows a top view of a multilayer resonator circuit structure. According to a second embodiment of the present invention, the multilayer resonator circuit structure 10a includes a multilayer substrate 100a, a plurality of resonators 200, and a plurality of conductive components 300. The multilayer resonator circuit structure 10a of this embodiment is similar to the multilayer resonator circuit structure 10 of the first embodiment, the only difference being the form of the slot 131a in the ground layer 130a of the multilayer substrate 100a.

[0065] like Figure 6As shown, slot 131a includes a main slot section 1311a and two auxiliary slot sections 1312a. The projection of the main slot section 1311a onto the upper surface 111 is located between the two contact portions 210 of the corresponding dual resonators 200, and is perpendicular to the two outer extensions 222 of the coupled dual resonant transmission lines 220. The two auxiliary slot sections 1312a are respectively connected to the opposite ends of the main slot section 1311a and are perpendicular to the main slot section 1311a. Since the relationship between the other slot 131a and the dual resonator 200 located on the lower surface 121 is the same as or similar to the above description, it will not be described again.

[0066] Please see Figures 7 to 8 , Figure 7 This is a three-dimensional schematic diagram of a multilayer resonator circuit structure according to a third embodiment of the present invention. Figure 8 for Figure 7 The image shows a top view of a multilayer resonator circuit structure. According to a third embodiment of the present invention, the multilayer resonator circuit structure 10b includes a multilayer substrate 100b, a plurality of resonators 200, and a plurality of conductive components 300. The multilayer resonator circuit structure 10b of this embodiment is similar to the multilayer resonator circuit structure 10 of the first embodiment, the only difference being the form of the two slots 131b in the ground layer 130b of the multilayer substrate 100b.

[0067] like Figure 8 As shown, slot 131b includes a main slot segment 1311b, two auxiliary slot segments 1312b, and multiple secondary slot segments 1313b. The projection of the main slot segment 1311b onto the upper surface 111 is located between the two contact portions 210 of the corresponding dual resonators 200, and is perpendicular to the two outer extensions 222 of the coupled dual resonant transmission line 220. The two auxiliary slot segments 1312b are respectively connected to the opposite ends of the main slot segment 1311b and are perpendicular to the main slot segment 1311b. These secondary slot segments 1313b are respectively connected to the opposite ends of the two auxiliary slot segments 1312b and are parallel to the main slot segment 1311b. Since the relationship between the other slot 131b and the dual resonator 200 located on the lower surface 121 is the same as or similar to the above description, it will not be described again.

[0068] Please see Figure 9 , Figure 9 This is a perspective view of a multilayer resonator circuit structure according to a fourth embodiment of the present invention. The multilayer resonator circuit structure 10c according to the fourth embodiment of the present invention includes a multilayer substrate 100c, a plurality of resonators 200, and a plurality of conductive components 300. The multilayer resonator circuit structure 10c of this embodiment is similar to the multilayer resonator circuit structure 10 of the first embodiment, the only difference being that the ground layer 130c of the multilayer substrate 100c does not have... Figure 1 The slot 131, and the number of resonators 200 located on the upper surface 111 and the lower surface 121 are both single. In this embodiment, the ground layer 130c does not have Figure 1 The slot 131 is created because the two resonators 200 on the upper surface 111 and the lower surface 121 are misaligned, but the invention is not limited thereto. In other embodiments, the ground layer may also have a slot if the two resonators on the upper and lower surfaces at least partially overlap each other, and this slot is located between the two resonators. That is, in other embodiments, the slot may also be located between two resonators stacked vertically on a multilayer substrate.

[0069] This invention is not limited to the form of a resonator. Please refer to [link / reference]. Figures 10 to 11 , Figure 10 This is a three-dimensional schematic diagram of a multilayer resonator circuit structure according to a fifth embodiment of the present invention. Figure 11 for Figure 10 The image shows a top view of a multilayer resonator circuit structure. According to a fifth embodiment of the present invention, the multilayer resonator circuit structure 10d includes a multilayer substrate 100c, a plurality of resonators 200d, and a plurality of conductive components 300. The multilayer resonator circuit structure 10d of this embodiment is similar to the multilayer resonator circuit structure 10c of the fourth embodiment, the only difference being the form of the resonators 200d.

[0070] like Figure 11 As shown, the resonator 200d includes only a contact portion 210 and multiple resonant transmission lines 220. These resonant transmission lines 220 are connected to the contact portion 210, and these resonant transmission lines 220 are, for example, a ground line 2201 and three open lines 2202. Each resonant transmission line 220 is bent and includes an inner extension 221 and an outer extension 222. These inner extensions 221 are connected to the contact portion 210. These outer extensions 222 are respectively connected to these inner extensions 221, and these outer extensions 222 are not parallel to these inner extensions 221. That is, the resonator 200d may, for example, not include... Figure 3 The expansion section 230.

[0071] This invention is not limited to the number of open circuits. Please refer to [link / reference]. Figures 12 to 13 , Figure 12 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the sixth embodiment of the present invention. Figure 13 for Figure 12 The image shows a top view of a multilayer resonator circuit structure. According to the sixth embodiment of the present invention, the multilayer resonator circuit structure 10e includes a multilayer substrate 100c, a plurality of resonators 200e, and a plurality of conductive components 300. The multilayer resonator circuit structure 10c of this embodiment is similar to the multilayer resonator circuit structure 10d of the fifth embodiment, the only difference being that the number of open circuits in both resonators 200e is five.

[0072] Please see Figures 14 to 15 , Figure 14This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the seventh embodiment of the present invention. Figure 15 for Figure 14 The image shows a top view of a multilayer resonator circuit structure. According to the seventh embodiment of the present invention, the multilayer resonator circuit structure 10f includes a multilayer substrate 100c, a plurality of resonators 200f, and a plurality of conductive components 300. The multilayer resonator circuit structure 10f of this embodiment is similar to the multilayer resonator circuit structure 10d of the fifth embodiment, the only difference being that the number of open circuits in both resonators 200f is two.

[0073] Please see Figures 16 to 17 , Figure 16 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the eighth embodiment of the present invention. Figure 17 for Figure 16 The image shows a top view of a multilayer resonator circuit structure. According to the eighth embodiment of the present invention, the multilayer resonator circuit structure 10g includes a multilayer substrate 100c, a plurality of resonators 200g, and a plurality of conductive members 300. The multilayer resonator circuit structure 10g of this embodiment is similar to the multilayer resonator circuit structure 10d of the fifth embodiment, the only difference being the form of the resonators 200g. In this embodiment, the resonator 200g includes a contact portion 210g and a plurality of resonant transmission lines 220g. These resonant transmission lines 220g are connected to the contact portion 210g, and these resonant transmission lines 220g are, for example, a ground line 2201g and three open lines 2202g. Each resonant transmission line 220 is in the shape of a straight strip.

[0074] Please see Figures 18 to 19 , Figure 18 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the ninth embodiment of the present invention. Figure 19 for Figure 18 The image shows a top view of a multilayer resonator circuit structure. According to the ninth embodiment of the present invention, the multilayer resonator circuit structure 10h includes a multilayer substrate 100c, a plurality of resonators 200h, and a plurality of conductive components 300. The multilayer resonator circuit structure 10h of this embodiment is similar to the multilayer resonator circuit structure 10g of the eighth embodiment, the only difference being that the number of open lines 2202g of each resonator 200h is five. That is, the number of straight resonant transmission lines 220g is six.

[0075] Please see Figure 20 and Figure 21 , Figure 20 This is a three-dimensional schematic diagram of a multilayer resonator circuit structure according to the tenth embodiment of the present invention. Figure 21 for Figure 20The image shows a top view of a multilayer resonator circuit structure. According to the tenth embodiment of the present invention, the multilayer resonator circuit structure 10i includes a multilayer substrate 100c, a plurality of resonators 200i, and a plurality of conductive components 300. The multilayer resonator circuit structure 10i of this embodiment is similar to the multilayer resonator circuit structure 10g of the eighth embodiment, except that the number of open lines 2202g of each resonator 200i is two. That is, the number of straight resonant transmission lines 220g is three.

[0076] Please see Figures 22 to 23 , Figure 22 This is a three-dimensional schematic diagram of the multilayer resonator circuit structure according to the eleventh embodiment of the present invention. Figure 23 for Figure 22 The image shows a top view of a multilayer resonator circuit structure. According to the eleventh embodiment of the present invention, the multilayer resonator circuit structure 10j includes a multilayer substrate 100c, a plurality of resonators 200j, and a plurality of conductive components 300. The multilayer resonator circuit structure 10j of this embodiment is similar to the multilayer resonator circuit structure 10g of the eighth embodiment, the only difference being that the number of open lines 2202j in each resonator 200j is single. That is, the resonator 200j includes a contact portion 210j and a dual resonant transmission line 220j. The dual resonant transmission line 220j is connected to the contact portion 210j and is in the form of a straight strip. The resonant transmission line 220j consists of a ground line 2201j and an open line 2202j.

[0077] Please see Figures 24 to 25 , Figure 24 This is a three-dimensional schematic diagram of the multilayer filter circuit structure according to the twelfth embodiment of the present invention. Figure 25 for Figure 24 The top view of the multilayer filter circuit structure is shown. The multilayer filter circuit structure 20k includes a multilayer substrate 100c, multiple filters 500k, and multiple conductive components 300.

[0078] The multilayer substrate 100c has an upper surface 111, a lower surface 121, and a ground layer 130c. The upper surface 111 and the lower surface 121 face away from each other, and the ground layer 130c is located between the upper surface 111 and the lower surface 121. In this embodiment, the multilayer substrate 100c is, for example, a two-layer substrate. Specifically, in this embodiment, the multilayer substrate 100c includes a first dielectric layer 110, a second dielectric layer 120, and a ground layer 130c. The first dielectric layer 110 and the second dielectric layer 120 are located on opposite sides of the ground layer 130c.

[0079] Some of these filters 500k are disposed on the upper surface 111, and another portion of these filters 500k are disposed on the lower surface 121. Since the structures of each filter 500k are the same or similar, only one filter 500k will be described below. Filter 500k includes a resonator 200, an input interface 510k, and an output interface 520k. The resonator 200 includes a contact portion 210 and a plurality of resonant transmission lines 220. These resonant transmission lines 220 are connected to the contact portion 210, and these resonant transmission lines 220 are, for example, a ground line 2201 and three open lines 2202. That is, the ground line 2201 and the three open lines 2202 are connected to the contact portion 210.

[0080] It should be noted that in this embodiment, the number of filters 500k located on the upper surface 111 is, for example, the same as the number of filters 500k located on the lower surface 121, but the present invention is not limited thereto. In other embodiments, the number of filters located on the upper surface may also be different from the number of filters located on the lower surface.

[0081] The input interface 510k and the output interface 520k are located on opposite sides of the resonator 200. Alternatively, the input interface 510k and the output interface 520k are arranged side-by-side on opposite sides of the resonator 200 in a dual-resonant transmission line 220. In this way, the signal can enter from the input interface 510k, pass through the resonator 200, and exit from the output interface 520k, thus achieving a filtering function.

[0082] Please see Figures 26 to 27 , Figure 26 This is a three-dimensional schematic diagram of a multilayer filter circuit structure according to the thirteenth embodiment of the present invention. Figure 27 for Figure 26 The image shows a top view of a multilayer filter circuit structure. According to the thirteenth embodiment of the present invention, the multilayer filter circuit structure 20m includes a multilayer substrate 100c, multiple filters 500m, and multiple conductive components 300. The multilayer filter circuit structure 20m of this embodiment is similar to the multilayer filter circuit structure 20k of the twelfth embodiment, the only difference being that the number of resonators 200 on the upper surface 111 and the number on the lower surface 121 of the filters 500m are both multiple, and the corresponding resonators 200 are arranged in multiple rows in a straight line. For example, the number of resonators 200 located on the upper surface 111 is four, arranged in a 2x2 array. That is, the number of resonators 200 in each row on the upper surface 111 and the lower surface 121 is the same. The input interface 510m and the output interface 520m are located on opposite sides of the resonator 200 array, respectively. Alternatively, the input interface 510m and the output interface 520m are arranged side-by-side on opposite sides of the resonator 200 array as two-resonant transmission lines 220.

[0083] Please see Figures 28 to 29 , Figure 28 This is a three-dimensional schematic diagram of a multilayer filter circuit structure according to the fourteenth embodiment of the present invention. Figure 29 for Figure 28 The image shows a top view of a multilayer filter circuit structure. According to the fourteenth embodiment of the present invention, the multilayer filter circuit structure 20n includes a multilayer substrate 100c, multiple filters 500n, and multiple conductive components 300. The multilayer filter circuit structure 20n of this embodiment is similar to the multilayer filter circuit structure 20k of the twelfth embodiment, the only difference being that the number of resonators 200 on both the upper surface 111 and the lower surface 121 of the filters 500n is multiple, and the corresponding resonators 200 are arranged in multiple rows in a straight line. For example, there are five resonators 200 on the upper surface 111, and these resonators 200 are arranged in two rows in a straight line. For example, two resonators 200 are in the first row and arranged in a straight line, and the other three resonators 200 are in the second row and arranged in a straight line. That is, the number of resonators 200 in each row on the upper surface 111 and the lower surface 121 is different. The input interface 510n and the output interface 520n are located on opposite sides of the resonator 200 assembly. Alternatively, the input interface 510n and the output interface 520n are respectively arranged side by side on the two resonant transmission lines 220 on opposite sides of the resonator 200 assembly.

[0084] According to the multilayer resonator circuit structure and multilayer filter circuit structure disclosed in the above embodiments, the resonators are respectively disposed on the upper and lower surfaces of the multilayer substrate facing away from each other, or the filters are respectively disposed on the upper and lower surfaces of the multilayer substrate facing away from each other. That is, some resonators or some filters can be reconfigured on the lower surface where electronic components are not located, without occupying any space on the upper surface of the multilayer substrate where other electronic components are located. In this way, the change in the placement of the resonators and filters will allow more space on the upper surface where electronic components are located to be placed, thereby improving the space utilization of the circuit board and contributing to the miniaturization of the circuit board.

[0085] [Symbol Explanation]

[0086] 10, 10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i, 10j: Multilayer resonator circuit structure

[0087] 100, 100a, 100b, 100c: Multilayer substrate

[0088] 110: First dielectric layer

[0089] 111: Upper surface

[0090] 120: Second dielectric layer

[0091] 121: Lower surface

[0092] 130, 130a, 130b, 130c: Grounding layer

[0093] 131, 131a, 131b: Grooving

[0094] 1311a, 1311b: Main channel section

[0095] 1312a, 1312b: Secondary tank sections

[0096] 1313b: Secondary trench section

[0097] 200, 200d, 200e, 200f, 200g, 200h, 200i, 200j: Resonators

[0098] 210, 210g, 210j: Contact parts

[0099] 220, 220g, 220j: Resonant transmission circuit

[0100] 2201, 2201g, 2201j: Grounding lines

[0101] 2202, 2202g, 2202j: Open lines

[0102] 221: Inner extension segment

[0103] 222: Outer extension

[0104] 230: Expansion Department

[0105] 300: Conductive component

[0106] 20k, 20m, 20n: Multilayer filter circuit structure

[0107] 500k, 500m, 500n: Filters

[0108] 510k, 510m, 510n: Input Interface

[0109] 520k, 520m, 520n: Output interfaces

[0110] S: Layout area

[0111] G: Gap

[0112] L: Length.

Claims

1. A multilayer resonator circuit structure, characterized in that, Include: A multilayer substrate has an upper surface, a lower surface, and a ground layer, wherein the upper surface and the lower surface are back to back and the ground layer is located between the upper surface and the lower surface; A plurality of resonators, portions of which are disposed on the upper surface, and other portions of which are disposed on the lower surface; and Multiple conductive components are located in the multilayer substrate and electrically connect the resonators to the ground layer respectively; Each of the resonators includes a contact portion and a plurality of resonant transmission lines connected to the contact portion, and the resonant transmission lines are ground lines and at least one open line, and the conductive components electrically connect the ground lines to the grounding layer respectively. The number of at least one open line is multiple; These open lines protrude from the contact point in multiple different directions.

2. The multilayer resonator circuit structure according to claim 1, wherein each of the resonant transmission lines includes an inner extension section and an outer extension section, the inner extension section being connected to the contact portion, the outer extension section being connected to the inner extension section, and the outer extension section being non-parallel to the inner extension section.

3. The multilayer resonator circuit structure according to claim 2, wherein the inner extension and outer extension of any resonant transmission line together with the inner extension of the adjacent resonant transmission line surround a layout area, and each resonator further includes a plurality of expansion portions, which are respectively located in the layout areas and connected to the contact portion.

4. The multilayer resonator circuit structure according to claim 3, wherein the number of resonators on the upper surface and the lower surface is two, and the two resonators on the upper surface and the lower surface are coupled to each other through two parallel resonant transmission lines, the grounding layer has two slots that are separated from each other, one of the two slots corresponds to the two resonant transmission lines coupled to each other on the upper surface, and the other of the two slots corresponds to the two resonant transmission lines coupled to each other on the lower surface.

5. The multilayer resonator circuit structure according to claim 4, wherein the projection of each slot on the upper surface or the lower surface is located between the two contact portions and perpendicular to the two outer extensions of the coupled two resonant transmission lines.

6. The multilayer resonator circuit structure according to claim 4, wherein each slot includes a main slot segment and two auxiliary slot segments, the projection of the main slot segment located on the upper surface or on the lower surface is located between the two contact portions and is perpendicular to the two outer extensions of the coupled two resonant transmission lines, and the two auxiliary slot segments are respectively connected to the opposite ends of the main slot segment and are perpendicular to the main slot segment.

7. The multilayer resonator circuit structure according to claim 6, wherein each slot further comprises a plurality of secondary slot segments, respectively connected to the opposite ends of the two secondary slot segments and parallel to the main slot segment.

8. A multilayer filter circuit structure, characterized in that, Include: A multilayer substrate has an upper surface, a lower surface, and a ground layer, wherein the upper surface and the lower surface are back to back and the ground layer is located between the upper surface and the lower surface; Multiple filters, portions of which are disposed on the upper surface, and other portions of which are disposed on the lower surface; and Multiple conductive components are located in the multilayer substrate and electrically connect the filters to the ground layer respectively; Each of the filters includes at least one resonator, an input interface, and an output interface, the input interface and the output interface being located separately on opposite sides of the at least one resonator, and the conductive components electrically connecting the resonators to the ground plane respectively. The at least one resonator is located between the input interface and the output interface; The resonator includes a contact portion and multiple resonant transmission lines. These resonant transmission lines are connected to the contact portion and are ground lines and at least one open line. The conductive components electrically connect these ground lines to the grounding layer. The number of at least one open line is multiple; These open lines protrude from the contact point in multiple different directions.

9. The multilayer filter circuit structure according to claim 8, wherein the number of at least one resonator located on the upper surface and the lower surface is multiple, and the resonators located on the upper surface and the resonators located on the lower surface are arranged in multiple rows of straight lines.

10. The multilayer filter circuit structure according to claim 9, wherein the number of each row of resonators located on the upper surface and the lower surface is the same.

11. The multilayer filter circuit structure according to claim 9, wherein at least two rows of the resonators on the upper surface have different numbers of resonators, and at least two rows of the resonators on the lower surface have different numbers of resonators.

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