An automated method and system for grinding a surface coating of a workpiece

Abstract

The application discloses an automatic polishing method and system for a workpiece surface coating, and the method comprises the following steps: obtaining device information of a polishing device and workpiece information of a workpiece, wherein the device information of the polishing device comprises original rotating speed of the polishing device, contact area of the polishing device and diameter of the polishing device, and the workpiece information of the workpiece comprises surface area of a hole, diameter of the hole, surface area after removing the hole and distance from a center point of the hole to a contact point of a grinding wheel; a polishing device rotating speed adjustment model is set, the adjusted rotating speed of the polishing device is calculated according to the device information of the polishing device, a polishing device polishing force adjustment model is set, the adjusted polishing force of the polishing device is calculated according to the workpiece information of the workpiece, the polishing device is adjusted according to the adjusted rotating speed and polishing force of the polishing device; a thickness measuring point of the workpiece surface is obtained, the normal vector of each thickness measuring point is calculated, the polishing path of the polishing device is planned according to the normal vector, and the thickness measuring point is polished according to the adjusted polishing device.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of automatic polishing, and more particularly relates to an automatic polishing method and system for workpiece surface coating. BACKGROUND

[0002] Currently, workpiece polishing can be achieved through various techniques and methods, including manual polishing, mechanical polishing, chemical polishing, etc. Different materials and workpiece types require different polishing methods to ensure the desired surface quality.

[0003] With the development of technology, automated polishing equipment is increasingly widely used. Automation can improve production efficiency, reduce labor costs, and achieve more consistent surface quality.

[0004] However, current automated polishing can only polish the surface of a workpiece, and the polishing effect is not good for workpieces with curved surfaces or holes. SUMMARY

[0005] To solve the above technical features, the present application proposes an automatic polishing method for workpiece surface coating, comprising:

[0006] Obtaining device information of a polishing device and workpiece information of a workpiece, wherein the device information of the polishing device includes the original rotational speed of the polishing device, the contact area of the polishing device, and the diameter of the polishing device, and the workpiece information of the workpiece includes the surface area of the hole, the diameter of the hole, the surface area after removing the hole, and the distance from the center point of the hole to the contact point of the grinding wheel;

[0007] Setting a polishing device rotational speed adjustment model, calculating the adjusted rotational speed of the polishing device according to the device information of the polishing device, setting a polishing device polishing force adjustment model, calculating the adjusted polishing force of the polishing device according to the workpiece information of the workpiece, and adjusting the polishing device according to the adjusted rotational speed and polishing force of the polishing device;

[0008] Obtaining a thickness measuring point on the surface of the workpiece, calculating the normal vector of each thickness measuring point, planning the polishing path of the polishing device according to the normal vector, and polishing the thickness measuring point according to the adjusted polishing device.

[0009] Further, the polishing device rotational speed adjustment model comprises:

[0010]

[0011] wherein ω' is the adjusted rotational speed of the polishing device, ω is the original rotational speed of the polishing device, A i is the surface area of the i-th hole, A' is the contact area of the polishing device, n is the number of holes, d i is the diameter of the i-th hole, dmax is the maximum diameter of the hole, R i is the distance from the center point of the i-th hole to the contact point of the grinding wheel, D is the diameter of the grinding device, A max is the surface area after removing the hole, k1 is the first adjustment factor, k2 is the second adjustment factor.

[0012] Further, the grinding device grinding force adjustment model comprises:

[0013]

[0014] wherein F' is the adjusted grinding force of the grinding device, A i is the surface area of the i-th hole, k3 is the third adjustment factor, k4 is the fourth adjustment factor, k5 is the fifth adjustment factor, A max is the maximum surface area of the hole, F is the original grinding force of the grinding device, A' is the contact area of the grinding device, n is the number of holes, d i is the diameter of the i-th hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the i-th hole to the contact point of the grinding wheel, D is the diameter of the grinding device, A max is the surface area after removing the hole.

[0015] Further, the calculation of the normal vector of each thickness measurement point comprises: calculating the normal vector of each thickness measurement point by the nearest neighbor search method.

[0016] Further, the planning of the grinding path of the grinding device according to the normal vector comprises: calculating the coordinates of all points that the grinding path must pass through by calculating the helical trajectory.

[0017] The present application also provides an automatic grinding system for a workpiece surface coating, comprising:

[0018] an acquisition module, configured to acquire device information of a grinding device and workpiece information of a workpiece, wherein the device information of the grinding device comprises: an original rotating speed of the grinding device, a contact area of the grinding device, and a diameter of the grinding device, and the workpiece information of the workpiece comprises: a surface area of a hole, a diameter of the hole, a surface area after removing the hole, and a distance from a center point of the hole to a contact point of a grinding wheel;

[0019] an adjustment module, configured to set a grinding device rotating speed adjustment model, calculate an adjusted rotating speed of the grinding device according to the device information of the grinding device, set a grinding device grinding force adjustment model, calculate an adjusted grinding force of the grinding device according to the workpiece information of the workpiece, and adjust the grinding device according to the adjusted rotating speed and the adjusted grinding force of the grinding device;

[0020] The polishing module is configured to obtain thickness measurement points on the surface of the workpiece, calculate a normal vector of each thickness measurement point, plan a polishing path of the polishing device according to the normal vector, and polish the thickness measurement points according to the adjusted polishing device.

[0021] Further, the polishing device rotation speed adjustment model comprises:

[0022]

[0023] wherein ω' is the adjusted rotation speed of the polishing device, ω is the original rotation speed of the polishing device, A i is the surface area of the i-th hole, A' is the contact area of the polishing device, n is the number of holes, d i is the diameter of the i-th hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the i-th hole to the contact point of the polishing device, D is the diameter of the polishing device, A max is the surface area after the holes are removed, k1 is the first adjustment factor, and k2 is the second adjustment factor.

[0024] Further, the polishing device polishing force adjustment model comprises:

[0025]

[0026] wherein F' is the adjusted polishing force of the polishing device, A i is the surface area of the i-th hole, k3 is the third adjustment factor, k4 is the fourth adjustment factor, k5 is the fifth adjustment factor, A max is the maximum surface area of the hole, F is the original polishing force of the polishing device, A' is the contact area of the polishing device, n is the number of holes, d i is the diameter of the i-th hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the i-th hole to the contact point of the polishing device, D is the diameter of the polishing device, A max is the surface area after the holes are removed.

[0027] Further, calculating the normal vector of each thickness measurement point comprises: calculating the normal vector of each thickness measurement point by a nearest neighbor search method.

[0028] Further, planning the polishing path of the polishing device according to the normal vector comprises: calculating the coordinates of all points that must be passed through by the polishing path by calculating a helix trajectory.

[0029] Compared with the prior art, the above technical scheme of the present application has the following beneficial effects:

[0030] The device information of the polishing device and the workpiece information of the workpiece are acquired, wherein the device information of the polishing device comprises original rotating speed of the polishing device, contact area of the polishing device and diameter of the polishing device, and the workpiece information of the workpiece comprises surface area of a hole, diameter of the hole, surface area after removing the hole and distance from the center point of the hole to the contact point of the grinding wheel; a polishing device rotating speed adjustment model is set, the adjusted rotating speed of the polishing device is calculated according to the device information of the polishing device, a polishing device polishing force adjustment model is set, the adjusted polishing force of the polishing device is calculated according to the workpiece information of the workpiece, and the polishing device is adjusted according to the adjusted rotating speed and polishing force of the polishing device; a thickness measuring point on the surface of the workpiece is acquired, the normal vector of each thickness measuring point is calculated, the polishing path of the polishing device is planned according to the normal vector, and the thickness measuring point is polished according to the adjusted polishing device. The polishing device rotating speed and polishing force are adjusted through the above technical scheme, and the efficiency of the polishing device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a flow chart of embodiment 1 of the present application;

[0032] Figure 2 is a structure diagram of the system of embodiment 2 of the present application;

[0033] Figure 3 is a spiral envelope trajectory diagram of polishing of a workpiece coating layer;

[0034] Figure 4 is a diagram of possible holes in the polishing contact range. DETAILED DESCRIPTION

[0035] In order to better understand the above technical scheme, the above technical scheme will be described in detail below in combination with the drawings in the specification and the specific embodiments.

[0036] The method provided by the present application can be implemented in a terminal environment, which can include one or more of the following components: a processor, a storage medium and a display screen. The storage medium stores at least one instruction, which is loaded and executed by the processor to implement the method described in the following embodiments.

[0037] The processor can include one or more processing cores. The processor connects various parts in the entire terminal through various interfaces and lines, executes various functions of the terminal and processes data by running or executing instructions, programs, code sets or instruction sets stored in the storage medium, and calling data stored in the storage medium.

[0038] The storage medium can include a random access memory (RAM) and can also include a read-only memory (ROM). The storage medium can be used to store instructions, programs, codes, code sets, or instructions.

[0039] The display screen is used to display the user interface of each application program.

[0040] All subscripts in the formula of the present application only distinguish parameters and have no actual meaning.

[0041] In addition, those skilled in the art can understand that the structure of the terminal described above does not constitute a limitation on the terminal, and the terminal can include more or fewer components, or combine certain components, or different component arrangements. For example, the terminal also includes radio frequency circuitry, an input unit, a sensor, audio circuitry, a power supply, and the like, which are not described here.

[0042] Embodiment 1

[0043] As Figure 1 shown, the embodiment of the present application provides an automatic polishing method for a workpiece surface coating, comprising:

[0044] Step 101, obtaining device information of a polishing device and workpiece information of a workpiece, wherein the device information of the polishing device includes original rotation speed of the polishing device, contact area of the polishing device, and diameter of the polishing device, and the workpiece information of the workpiece includes surface area of a hole, diameter of the hole, surface area after removing the hole, and distance from a center point of the hole to a contact point of the grinding wheel;

[0045] Step 102, setting a polishing device rotation speed adjustment model, calculating an adjusted rotation speed of the polishing device according to the device information of the polishing device, setting a polishing device polishing force adjustment model, calculating an adjusted polishing force of the polishing device according to the workpiece information of the workpiece, and adjusting the polishing device according to the adjusted rotation speed and the adjusted polishing force of the polishing device;

[0046] Specifically, the polishing device rotation speed adjustment model includes:

[0047]

[0048] Wherein ω' is the adjusted rotation speed of the polishing device, ω is the original rotation speed of the polishing device, A i is the surface area of the i-th hole, A' is the contact area of the polishing device, n is the number of holes, d i is the diameter of the i-th hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the i-th hole to the contact point of the grinding wheel, D is the diameter of the polishing device, and Amax k1 is a first adjustment factor, and k2 is a second adjustment factor.

[0049] Specifically, the polishing equipment polishing force adjustment model comprises:

[0050]

[0051] F' is the adjusted polishing force of the polishing equipment, A i is the surface area of the ith hole, k3 is a third adjustment factor, k4 is a fourth adjustment factor, k5 is a fifth adjustment factor, A max is the maximum surface area of the hole, F is the original polishing force of the polishing equipment, A' is the contact area of the polishing equipment, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the ith hole to the contact point of the grinding wheel, D is the diameter of the polishing equipment, A max is the surface area after removing the hole.

[0052] Step 103, obtaining the thickness measuring points of the workpiece surface, calculating the normal vector of each thickness measuring point, planning the polishing path of the polishing equipment according to the normal vector, and polishing the thickness measuring points according to the adjusted polishing equipment.

[0053] Specifically, calculating the normal vector of each thickness measuring point comprises: calculating the normal vector of each thickness measuring point by the nearest neighbor search method.

[0054] Specifically, planning the polishing path of the polishing equipment according to the normal vector comprises: calculating the coordinates of all points that must be passed through by the polishing path by calculating the helix trajectory.

[0055] The following is an example of the present embodiment, as follows:

[0056] In the process of polishing and grinding the coating of the workpiece, the planning of the polishing and grinding path is a key step. For the cylindrical workpiece surface coating, a commonly used method for generating polishing and grinding path is to use helix trajectory. In addition to being able to ensure that the surface coating is completely polished and ground, the helix trajectory can also reduce the problems of uneven polishing and grinding efficiency and surface scratches. According to the determined initial point and rotation direction, the coordinates of all points that must be passed through by the entire path are calculated using the helix formula to generate a complete path. The helix formula can be expressed using a parametric equation, where the parameter t usually takes a value between 0 and 2π. The helix formula is as follows:

[0057] x = R cos (ωt)

[0058] y = R sin (ωt)

[0059] z = pt + b

[0060] where R is the radius of the helix, ω is the angular velocity of the helix, p is the step size of the helix, and b is the initial height. The parameter t represents the position of each point on the helix, so in practice, reasonable p and b should be selected to ensure that the path covers the surface coating, as shown in Figure 3 .

[0061] According to the generated helix path, it is smoothed using interpolation algorithms and the like, and the motion planning of the polishing tool is calculated. Generally, when planning the polishing path of the tool, the motion trajectory of the tool holder should be perpendicular to the normal vector of the surface.

[0062] When using the helix path to plan the polishing path of the workpiece surface coating, optimization is needed according to the actual situation. This section will introduce common optimization methods in helix path planning, and specifically explain that the speed and polishing force need to be planned according to the Preston equation and the calculation of the coating thickness described in the previous section, and the new speed and polishing force need to be calculated according to the holes existing in the contact range of the polishing machine.

[0063] When using the helix path to plan the polishing path of the workpiece surface coating, some key path parameters need to be selected, such as the radius of the helix, the angular velocity and the step size, etc. When selecting these parameters, the shape and requirements of the surface coating, as well as the size and material of the polishing tool, etc. factors should be fully considered. First, the appropriate helix radius needs to be selected. Too small radius will result in too dense path and low polishing efficiency; too large radius will result in too loose path and cannot completely cover the surface. Generally, the appropriate radius can be selected according to the curvature of the surface. Second, the appropriate angular velocity and step size need to be selected. The angular velocity determines the cross-sectional shape of the path, while the step size determines the axial distribution of the path. Generally, the appropriate angular velocity and step size need to be selected according to the roughness of the surface and the size of the polishing tool, etc. factors. Finally, the appropriate initial height needs to be selected to ensure that the path completely covers the surface. The initial height can be determined according to the radius of the polishing tool and the thickness of the surface coating.

[0064] In order to achieve the optimization effect of the polishing process of the workpiece surface coating, the speed and polishing force need to be planned according to the Preston equation described in the previous section. The thickness of the coating to be removed in the polishing process is obtained by calculating the average thickness measured by the thickness measuring points planned in the contact range of the polishing machine. The Preston equation can describe the relationship between the speed and polishing force and the concentration of abrasive particles, surface speed, etc. factors in the polishing process, and the selection of speed and polishing force can be optimized according to the specific polishing process and the situation of the surface coating. Specifically, the Preston equation is:

[0065]

[0066] Wherein, Ah represents the thickness of the coating removed per unit time, At represents the unit time, k'1 and k'2 are constants, F represents the polishing force, and m represents the concentration of abrasive particles.

[0067] In practical applications, the selection of the rotation speed and the polishing force can be further determined by combining the Preston equation with parameters such as the Poisson distribution of the surface coating. The Poisson distribution of the surface coating can be used to describe the distribution of the coating on the surface, thereby predicting the removal of the coating thickness during the polishing process. At the same time, factors such as the diameter and contact area of the polishing tool need to be considered to further adjust the rotation speed and the polishing force.

[0068] In addition, in practical applications, there are often some holes or depressions on the surface of the workpiece, which will affect the polishing process. For example, when a hole appears in the polishing contact range, the pressure at other positions will increase due to the decrease in contact area, thereby causing an increase in removal. Therefore, according to the size and distribution of the holes in the polishing machine contact range, the polishing force and the rotation speed need to be further adjusted to achieve local detail control.

[0069] Specifically, as shown in Figure 4 there are holes of different sizes in the polishing machine contact range, and the polishing equipment rotation speed adjustment model is set to include:

[0070]

[0071] Wherein, ω' is the adjusted rotation speed of the polishing equipment, Fω is the original rotation speed of the polishing equipment, A i is the surface area of the i-th hole, A' is the contact area of the polishing equipment, n is the number of holes, d i is the diameter of the i-th hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the i-th hole to the contact point of the polishing wheel, D is the diameter of the polishing equipment, A max is the surface area after removing the hole, k1 is the first adjustment factor, and k2 is the second adjustment factor.

[0072] Specifically, the polishing force adjustment model of the polishing equipment is set to include:

[0073]

[0074] Wherein, F' is the adjusted polishing force of the polishing equipment, A i is the surface area of the i-th hole, k3 is the third adjustment factor, k4 is the fourth adjustment factor, k5 is the fifth adjustment factor, A maxis the maximum surface area of the holes, F is the original polishing force of the polishing device, A' is the contact area of the polishing device, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the holes, R i is the distance from the center point of the ith hole to the contact point of the grinding wheel, D is the diameter of the polishing device, A max is the surface area after removing the holes.

[0075] In summary, the optimization of the spiral line path planning needs to consider many factors, including the selection of path parameters, path interpolation and smoothing, tool path optimization, etc. In addition, the relationship between coating removal thickness and polishing force described by the surface coating Preston equation and the adjustment of polishing force and speed when there are holes also need to be planned and controlled in practical application.

[0076] Embodiment 2

[0077] As Figure 2 shown, the embodiment of the application also provides an automatic polishing system for a workpiece surface coating, comprising:

[0078] an acquisition data module, configured to acquire device information of a polishing device and workpiece information of a workpiece, wherein the device information of the polishing device comprises an original speed of the polishing device, a contact area of the polishing device and a diameter of the polishing device, and the workpiece information of the workpiece comprises a surface area of holes, a diameter of the holes, a surface area after removing the holes and a distance from a center point of the holes to a contact point of a grinding wheel;

[0079] an adjustment module, configured to set a polishing device speed adjustment model, calculate an adjusted speed of the polishing device according to the device information of the polishing device, set a polishing device polishing force adjustment model, calculate an adjusted polishing force of the polishing device according to the workpiece information of the workpiece, and adjust the polishing device according to the adjusted speed and the adjusted polishing force of the polishing device;

[0080] Specifically, the polishing device speed adjustment model comprises:

[0081]

[0082] wherein ω' is the adjusted speed of the polishing device, ω is the original speed of the polishing device, A i is the surface area of the ith hole, A' is the contact area of the polishing device, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the holes, R i is the distance from the center point of the ith hole to the contact point of the grinding wheel, D is the diameter of the polishing device, A maxk1 is a first adjustment factor, and k2 is a second adjustment factor.

[0083] Specifically, the polishing equipment polishing force adjustment model comprises:

[0084]

[0085] wherein F' is the adjusted polishing force of the polishing equipment, A i is the surface area of the ith hole, k3 is a third adjustment factor, k4 is a fourth adjustment factor, k5 is a fifth adjustment factor, A max is the maximum surface area of the hole, F is the original polishing force of the polishing equipment, A' is the contact area of the polishing equipment, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the ith hole to the contact point of the grinding wheel, D is the diameter of the polishing equipment, A max is the surface area after removing the holes.

[0086] The polishing module is configured to obtain the thickness measurement points on the surface of the workpiece, calculate the normal vector of each thickness measurement point, plan a polishing path of the polishing equipment according to the normal vector, and polish the thickness measurement points according to the adjusted polishing equipment.

[0087] Specifically, calculating the normal vector of each thickness measurement point comprises: calculating the normal vector of each thickness measurement point by using the nearest neighbor search method.

[0088] Specifically, planning the polishing path of the polishing equipment according to the normal vector comprises: calculating the coordinates of all points that must be passed through by the polishing path by calculating the helix trajectory.

[0089] The following is an example of the present embodiment, as shown below:

[0090] In the process of polishing and grinding the coating of a workpiece, the planning of the polishing and grinding path is a key step. For the coating of the surface of a cylindrical workpiece, a commonly used method for generating a polishing and grinding path is to use a helix trajectory. In addition to ensuring that the surface coating is completely polished and ground, the helix trajectory can also reduce the problems of uneven polishing and grinding efficiency and surface scratches. According to the determined initial point and rotation direction, the coordinates of all points that must be passed through by the entire path are calculated using the helix formula to generate a complete path. The helix formula can be expressed using a parametric equation, where the parameter t usually takes a value between 0 and 2π. The helix formula is as follows:

[0091] x = R cos (ωt)

[0092] y = R sin (ωt)

[0093] z = pt + b

[0094] where R is the radius of the helix, ω is the angular velocity of the helix, p is the step size of the helix, and b is the initial height. The parameter t represents the position of each point on the helix, so in practice, reasonable p and b should be selected to ensure that the path covers the surface coating, as shown in Figure 3 .

[0095] According to the generated helix path, it is smoothed using interpolation algorithms and other methods, and the motion planning of the polishing tool is calculated. Generally, when planning the polishing path of the tool, the motion trajectory of the tool holder should be perpendicular to the normal vector of the surface.

[0096] When using the helix path to plan the polishing path of the workpiece surface coating, optimization is needed according to the actual situation. This section will introduce common optimization methods in helix path planning, and specifically explain that the speed and polishing force need to be planned according to the Preston equation and the calculation of the coating thickness described in the previous section, and the new speed and polishing force need to be calculated according to the holes in the contact range of the polishing machine.

[0097] When using the helix path to plan the polishing path of the workpiece surface coating, some key path parameters need to be selected, such as the helix radius, angular velocity, and step size. When selecting these parameters, the shape and requirements of the surface coating, as well as the size and material of the polishing tool, etc. should be fully considered. First, the appropriate helix radius needs to be selected. If the radius is too small, the path will be too dense and the polishing efficiency will be low; if the radius is too large, the path will be too loose and the surface cannot be completely covered. Generally, the appropriate radius can be selected according to the curvature of the surface. Second, the appropriate angular velocity and step size need to be selected. The angular velocity determines the cross-sectional shape of the path, while the step size determines the axial distribution of the path. Generally, the appropriate angular velocity and step size need to be selected according to the roughness of the surface and the size of the polishing tool, etc. Finally, the appropriate initial height needs to be selected to ensure that the path completely covers the surface. The initial height can be determined according to the radius of the polishing tool and the thickness of the surface coating.

[0098] In order to achieve the optimization effect of the polishing process of the workpiece surface coating, the speed and polishing force need to be planned according to the Preston equation described in the previous section. The thickness of the coating to be removed in the polishing process is obtained by calculating the average thickness of the measured points in the contact range of the polishing machine. The Preston equation can describe the relationship between the speed and polishing force and the concentration of abrasive particles, surface speed, etc. in the polishing process, and the selection of speed and polishing force can be optimized according to the specific polishing process and the situation of the surface coating. Specifically, the Preston equation is:

[0099]

[0100] Wherein, Ah represents the thickness of the coating removed per unit time, At represents the unit time, k'1 and k'2 are constants, F represents the polishing force, and m represents the concentration of abrasive particles.

[0101] In practical applications, the selection of the rotation speed and the polishing force can be further determined by combining the Preston equation with parameters such as the Poisson distribution of the surface coating. The Poisson distribution of the surface coating can be used to describe the distribution of the coating on the surface, thereby predicting the removal of the coating thickness during the polishing process. At the same time, factors such as the diameter and contact area of the polishing tool need to be considered to further adjust the rotation speed and the polishing force.

[0102] In addition, in practical applications, there are often some holes or depressions on the surface of the workpiece, which will affect the polishing process. For example, when the hole appears in the polishing contact range, the pressure at other positions will increase due to the decrease in the contact area, thereby causing the removal amount to increase. Therefore, according to the size and distribution of the holes in the polishing machine contact range, the polishing force and the rotation speed need to be further adjusted to realize the control of local details.

[0103] Specifically, as shown in Figure 4 the holes of different sizes exist in the polishing machine contact range, the polishing equipment rotation speed adjustment model is set to include:

[0104]

[0105] Wherein, ω' is the adjusted rotation speed of the polishing equipment, ω is the original rotation speed of the polishing equipment, A i is the surface area of the i-th hole, A' is the contact area of the polishing equipment, n is the number of holes, d i is the diameter of the i-th hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the i-th hole to the contact point of the polishing wheel, D is the diameter of the polishing equipment, A max is the surface area after removing the hole, k1 is the first adjustment factor, and k2 is the second adjustment factor.

[0106] Specifically, the polishing force adjustment model of the polishing equipment is set to include:

[0107]

[0108] Wherein, F' is the adjusted polishing force of the polishing equipment, A i is the surface area of the i-th hole, k3 is the third adjustment factor, k4 is the fourth adjustment factor, k5 is the fifth adjustment factor, A maxis the maximum surface area of the holes, F is the original polishing force of the polishing device, A' is the contact area of the polishing device, n is the number of holes, d i is the diameter of the i-th hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the i-th hole to the contact point of the grinding wheel, D is the diameter of the polishing device, A max is the surface area after removing the holes.

[0109] In summary, the optimization of the spiral line path planning needs to consider many factors, including the selection of path parameters, path interpolation and smoothing, tool path optimization, etc. In addition, the relationship between coating removal thickness and polishing force described by the surface coating Preston equation and the adjustment of polishing force and rotational speed when holes exist also need to be planned and controlled in practical applications.

[0110] Embodiment 3

[0111] The embodiment of the present application also proposes a storage medium storing a plurality of instructions for implementing the automatic polishing method of the workpiece surface coating.

[0112] Optionally, in the present embodiment, the above-mentioned storage medium can be located in any one of the computer terminals in the computer terminal group in the computer network, or in any one of the mobile terminals in the mobile terminal group.

[0113] Optionally, in the present embodiment, the storage medium is configured to store program code for performing the following steps: step 101, obtaining device information of a polishing device and workpiece information of a workpiece, wherein the device information of the polishing device includes the original rotational speed of the polishing device, the contact area of the polishing device, and the diameter of the polishing device, and the workpiece information of the workpiece includes the surface area of the holes, the diameter of the holes, the surface area after removing the holes, and the distance from the center point of the holes to the contact point of the grinding wheel;

[0114] Step 102, setting a polishing device rotational speed adjustment model, calculating the adjusted rotational speed of the polishing device according to the device information of the polishing device, setting a polishing device polishing force adjustment model, calculating the adjusted polishing force of the polishing device according to the workpiece information of the workpiece, and adjusting the polishing device according to the adjusted rotational speed and polishing force of the polishing device;

[0115] Specifically, the polishing device rotational speed adjustment model includes:

[0116]

[0117] wherein ω' is the adjusted rotational speed of the polishing device, ω is the original rotational speed of the polishing device, A iLet A' be the surface area of ​​the i-th hole, A′ be the contact area of ​​the grinding equipment, n be the number of holes, and d be the surface area of ​​the i-th hole. i Let d be the diameter of the i-th hole. max R is the maximum diameter of the hole. i Let A be the distance from the center point of the i-th hole to the contact point of the grinding wheel, D be the diameter of the grinding equipment, and A be the distance from the center point of the i-th hole to the contact point of the grinding wheel. max To determine the surface area after removing the holes, k1 is the first adjustment factor and k2 is the second adjustment factor.

[0118] Specifically, the grinding force adjustment model of the grinding equipment includes:

[0119]

[0120] Where F′ is the grinding force after the grinding equipment is adjusted, and A i Let A be the surface area of ​​the i-th hole, k3 be the third adjustment factor, k4 be the fourth adjustment factor, k5 be the fifth adjustment factor, and A be the fifth adjustment factor. max Let F be the maximum surface area of ​​the hole, F be the original grinding force of the grinding equipment, A′ be the contact area of ​​the grinding equipment, n be the number of holes, and d be the maximum surface area of ​​the hole. i Let d be the diameter of the i-th hole. max R is the maximum diameter of the hole. i Let A be the distance from the center point of the i-th hole to the contact point of the grinding wheel, D be the diameter of the grinding equipment, and A be the distance from the center point of the i-th hole to the contact point of the grinding wheel. max The surface area after removing the holes.

[0121] Step 103: Obtain the thickness measurement points on the workpiece surface, calculate the normal vector of each thickness measurement point, plan the grinding path of the grinding equipment according to the normal vector, and grind the thickness measurement points according to the adjusted grinding equipment.

[0122] Specifically, calculating the normal vector of each thickness measurement point includes: calculating the normal vector of each thickness measurement point using the nearest neighbor search method.

[0123] Specifically, planning the grinding path of the grinding equipment based on the normal vector includes: calculating the coordinates of all points that the grinding path must pass through by calculating the spiral trajectory.

[0124] The following is an example of this embodiment:

[0125] In the process of workpiece coating grinding and polishing, the planning of grinding and polishing path is a key step. For the cylindrical workpiece surface coating, a commonly used method of grinding and polishing path generation is to use helical trajectory. In addition to ensuring that the surface coating is completely ground and polished, helical trajectory can also reduce the problem of uneven grinding efficiency and surface scratches. According to the determined initial point and rotation direction, the coordinates of all points that the entire path must pass through are calculated using the helical formula to generate a complete path. The helical formula can be expressed using a parametric equation, where the parameter t usually takes a value between 0 and 2π. The helical formula is as follows:

[0126] x = R cos(ωt)

[0127] y = R sin(ωt)

[0128] z = pt + b

[0129] where R is the radius of the helix, ω is the angular velocity of the helix, p is the step length of the helix, and b is the initial height. The parameter t represents the position of each point on the helix, so in practice, reasonable p and b should be selected to ensure that the path covers the surface coating, as shown in Figure 3

[0130] According to the generated helical path, use interpolation algorithm and other methods to smooth it, and calculate the motion planning of the grinding and polishing tool path. Usually in the planning of grinding and polishing tool path, the motion trajectory of the tool holder should be perpendicular to the normal vector of the surface.

[0131] When using helical path to plan the grinding and polishing path of workpiece surface coating, optimization is needed according to the actual situation. This section will introduce the common optimization methods in helical path planning, and specifically explain that the speed and polishing force need to be planned according to the calculation of the Preston equation and coating thickness mentioned in the previous section, and the new speed and polishing force need to be calculated according to the holes existing in the contact range of the grinding and polishing machine.

[0132] ​In the use of spiral path planning for workpiece surface coating polishing path, some key path parameters need to be selected, such as spiral radius, angular velocity and step length, etc. When selecting these parameters, the shape and requirements of the surface coating, as well as the size and material of the polishing tool, etc. should be fully considered. First of all, the appropriate spiral radius needs to be selected. Too small radius will result in too dense path and low polishing efficiency; too large radius will result in too loose path and cannot completely cover the surface. Generally, the appropriate radius can be selected according to the curvature of the surface. Secondly, the appropriate angular velocity and step length need to be selected. Angular velocity determines the cross-sectional shape of the path, while step length determines the axial distribution of the path. Generally, the selection needs to be made comprehensively according to the roughness of the surface and the size of the polishing tool, etc. Finally, the appropriate starting height needs to be selected to ensure that the path completely covers the surface. The starting height can be determined according to the radius of the polishing tool and the thickness of the surface coating.

[0133] In order to achieve the optimization effect of the workpiece surface coating polishing process, the speed and polishing force need to be planned according to the Preston equation described in the foregoing. The coating thickness to be removed in the polishing process is obtained by calculating the average thickness of the thickness measurement points planned in the contact range of the polishing machine. The Preston equation can describe the relationship between the speed and polishing force in the polishing process and factors such as abrasive concentration and surface speed, and the selection of speed and polishing force can be optimized according to the specific polishing process and the situation of the surface coating. Specifically, the Preston equation is:

[0134]

[0135] Where Δh represents the coating thickness removed per unit time, Δt represents the unit time, k'1 and k'2 are constants, F represents the polishing force, and m represents the abrasive concentration.

[0136] In practical application, the selection of speed and polishing force can be further determined by combining the Preston equation (Princeton equation) with the Poisson distribution of the surface coating and other parameters. The Poisson distribution of the surface coating can be used to describe the distribution of the coating on the surface, so as to predict the removal of the coating thickness in the polishing process. At the same time, the diameter and contact area of the polishing tool and other factors need to be considered to further adjust the speed and polishing force.

[0137] In addition, in practical application, there are often some holes or depressions on the workpiece surface, which will affect the polishing process. For example, when the hole appears in the contact range of the polishing machine, the pressure at other positions will increase due to the decrease of the contact area, which will further cause the increase of the removal amount. Therefore, according to the size and distribution of the holes existing in the contact range of the polishing machine, the polishing force and speed need to be further adjusted to realize the control of local details.

[0138] Specifically, as shown in Figure 4 holes of different sizes exist in the contact range of the polishing machine, setting the polishing equipment rotation speed adjustment model includes:

[0139]

[0140] where ω' is the adjusted rotation speed of the polishing equipment, ω is the original rotation speed of the polishing equipment, A i is the surface area of the ith hole, A' is the contact area of the polishing equipment, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the ith hole to the contact point of the grinding wheel, D is the diameter of the polishing equipment, A max is the surface area after removing the holes, k1 is the first adjustment factor, and k2 is the second adjustment factor.

[0141] Specifically, setting the polishing equipment polishing force adjustment model includes:

[0142]

[0143] where F' is the adjusted polishing force of the polishing equipment, A i is the surface area of the ith hole, k3 is the third adjustment factor, k4 is the fourth adjustment factor, k5 is the fifth adjustment factor, A max is the maximum surface area of the hole, F is the original polishing force of the polishing equipment, A' is the contact area of the polishing equipment, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the ith hole to the contact point of the grinding wheel, D is the diameter of the polishing equipment, A max is the surface area after removing the holes.

[0144] In summary, the optimization of the spiral line path planning needs to consider many factors, including the selection of path parameters, path interpolation and smoothing, tool path optimization, etc. In addition, the relationship between coating removal thickness and polishing force described by the surface coating Preston equation and the adjustment of polishing force and rotation speed when holes exist also need to be planned and controlled in practical applications.

[0145] Example 4

[0146] The embodiment of the present application further provides an electronic device, comprising a processor and a storage medium connected with the processor, wherein the storage medium stores a plurality of instructions, the instructions can be loaded and executed by the processor, so that the processor can execute the automatic polishing method for workpiece surface coating.

[0147] Specifically, the electronic device of the embodiment can be a computer terminal, which can comprise one or more processors and a storage medium.

[0148] The storage medium can be used to store software programs and modules, such as the automatic polishing method for workpiece surface coating in the embodiment of the present application, corresponding program instructions / modules, and the processor executes various functional applications and data processing by running the software programs and modules stored in the storage medium, that is, the automatic polishing method for workpiece surface coating is realized. The storage medium can comprise a high-speed random storage medium, and can further comprise a non-volatile storage medium, such as one or more magnetic storage systems, flash memories or other non-volatile solid-state storage media. In some examples, the storage medium can further comprise storage media remotely arranged with respect to the processor, and the remote storage media can be connected to the terminal through a network. Examples of the network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network and a combination thereof.

[0149] The processor can call the information and application programs stored in the storage medium through a transmission system to execute the following steps: step 101, obtaining device information of a polishing device and workpiece information of a workpiece, wherein the device information of the polishing device comprises an original rotating speed of the polishing device, a contact area of the polishing device and a diameter of the polishing device, and the workpiece information of the workpiece comprises a surface area of a hole, a diameter of the hole, a surface area after removing the hole and a distance from a center point of the hole to a contact point of a grinding wheel;

[0150] Step 102, setting a polishing device rotating speed adjustment model, calculating an adjusted rotating speed of the polishing device according to the device information of the polishing device, setting a polishing device polishing force adjustment model, calculating an adjusted polishing force of the polishing device according to the workpiece information of the workpiece, and adjusting the polishing device according to the adjusted rotating speed and the adjusted polishing force of the polishing device;

[0151] Specifically, the polishing device rotating speed adjustment model comprises:

[0152]

[0153] Wherein ω' is the adjusted rotating speed of the polishing device, ω is the original rotating speed of the polishing device, A i is the surface area of the i th hole, A' is the contact area of the polishing device, n is the number of holes, d iis the diameter of the i-th hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the i-th hole to the contact point of the grinding wheel, D is the diameter of the grinding device, A max is the surface area after removing the holes, k1 is the first adjustment factor, k2 is the second adjustment factor.

[0154] Specifically, the grinding device grinding force adjustment model comprises:

[0155]

[0156] where F' is the adjusted grinding force of the grinding device, A i is the surface area of the i-th hole, k3 is the third adjustment factor, k4 is the fourth adjustment factor, k5 is the fifth adjustment factor, A max is the maximum surface area of the hole, F is the original grinding force of the grinding device, A' is the contact area of the grinding device, n is the number of holes, d i is the diameter of the i-th hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the i-th hole to the contact point of the grinding wheel, D is the diameter of the grinding device, A max is the surface area after removing the holes.

[0157] Step 103, obtaining the thickness measurement points of the workpiece surface, calculating the normal vector of each thickness measurement point, planning the grinding path of the grinding device according to the normal vector, and grinding the thickness measurement points according to the adjusted grinding device.

[0158] Specifically, calculating the normal vector of each thickness measurement point comprises: calculating the normal vector of each thickness measurement point by the nearest neighbor search method.

[0159] Specifically, planning the grinding path of the grinding device according to the normal vector comprises: calculating the coordinates of all points that the grinding path must pass through by calculating the helix trajectory.

[0160] The following is an example of the embodiment, as follows:

[0161] In the process of grinding and polishing the coating of the workpiece, the planning of the grinding and polishing path is a key step. For the cylindrical workpiece surface coating, a commonly used method for generating the grinding and polishing path is to use a helix trajectory. In addition to ensuring that the surface coating is completely ground and polished, the helix trajectory can also reduce the problems of uneven grinding and polishing efficiency and surface scratches. According to the determined initial point and rotation direction, the coordinates of all points that the entire path must pass through are calculated using the helix formula to generate a complete path. The helix formula can be represented using a parametric equation, where the parameter t usually takes a value between 0 and 2π. The helix formula is as follows:

[0162] x = R cos(ωt)

[0163] y = R sin(ωt)

[0164] z = pt + b

[0165] where R is the radius of the helix, ω is the angular velocity of the helix, p is the step size of the helix, and b is the starting height. The parameter t represents the position of each point on the helix, so in practice, reasonable p and b should be selected to ensure that the path covers the surface coating, as shown in Figure 3 .

[0166] According to the generated helix path, it is smoothed using interpolation algorithms and the like, and the motion planning of the grinding tool is calculated. Generally, when planning the grinding tool path, the motion trajectory of the tool holder should be perpendicular to the normal vector of the surface.

[0167] When using the helix path to plan the grinding path of the workpiece surface coating, optimization is needed for actual situations. This section will introduce common optimization methods in helix path planning, and specifically explain that the speed and polishing force need to be planned according to the calculation of the Preston equation and the coating thickness described in the previous section, and the new speed and polishing force need to be calculated according to the holes existing in the contact range of the grinding machine.

[0168] When using the helix path to plan the grinding path of the workpiece surface coating, some key path parameters need to be selected, such as helix radius, angular velocity, and step size, etc. When selecting these parameters, the shape and requirements of the surface coating, as well as the size and material of the grinding tool, etc. factors need to be fully considered. First, the appropriate helix radius needs to be selected. Too small radius will result in too dense path and low grinding efficiency; too large radius will result in too loose path and cannot completely cover the surface. Generally, the appropriate radius can be selected according to the curvature of the surface. Second, the appropriate angular velocity and step size need to be selected. Angular velocity determines the cross-sectional shape of the path, while step size determines the axial distribution of the path. Generally, the appropriate angular velocity and step size need to be selected according to the roughness of the surface and the size of the grinding tool, etc. factors. Finally, the appropriate starting height needs to be selected to ensure that the path completely covers the surface. The starting height can be determined according to the radius of the grinding tool and the thickness of the surface coating.

[0169] In order to achieve the optimization effect of the workpiece surface coating polishing process, the speed and polishing force need to be planned according to the Preston equation described above. The coating thickness to be removed in the polishing process is obtained by calculating the average thickness of the planned thickness measurement points in the contact range of the polishing machine. The Preston equation can describe the relationship between the speed and polishing force and the factors such as abrasive concentration and surface speed in the polishing process, and the selection of speed and polishing force can be optimized according to the specific polishing process and surface coating conditions. Specifically, the Preston equation is:

[0170]

[0171] Where Δh represents the coating thickness removed per unit time, Δt represents the unit time, k'1 and k'2 are constants, F represents the polishing force, and m represents the abrasive concentration.

[0172] In practical applications, the selection of speed and polishing force can be further determined by combining the Preston equation (Princeton equation) with the Poisson distribution of the surface coating and other parameters. The Poisson distribution of the surface coating can be used to describe the distribution of the coating on the surface, so as to predict the removal of the coating thickness in the polishing process. At the same time, factors such as the diameter and contact area of the polishing tool need to be considered to further adjust the speed and polishing force.

[0173] In addition, in practical applications, there are often some holes or depressions on the workpiece surface, which will affect the polishing process. For example, when the hole appears in the polishing contact range, the pressure at other positions will increase due to the decrease of the contact area, which will further cause the increase of the removal amount. Therefore, according to the size and distribution of the holes in the contact range of the polishing machine, the polishing force and speed need to be further adjusted to realize the control of local details.

[0174] Specifically, as shown in Figure 4 The polishing equipment speed adjustment model is set, which includes:

[0175]

[0176] Where ω' is the adjusted speed of the polishing equipment, ω is the original speed of the polishing equipment, A i is the surface area of the i th hole, A' is the contact area of the polishing equipment, n is the number of holes, d i is the diameter of the i th hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the i th hole to the contact point of the grinding wheel, D is the diameter of the polishing equipment, A maxk1 is a first adjustment factor, and k2 is a second adjustment factor.

[0177] Specifically, the setting of the polishing equipment polishing force adjustment model comprises:

[0178]

[0179] Wherein, F' is the adjusted polishing force of the polishing equipment, A i is the surface area of the ith hole, k3 is a third adjustment factor, k4 is a fourth adjustment factor, k5 is a fifth adjustment factor, A max is the maximum surface area of the hole, F is the original polishing force of the polishing equipment, A' is the contact area of the polishing equipment, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the ith hole to the contact point of the grinding wheel, D is the diameter of the polishing equipment, A max is the surface area after the hole is removed.

[0180] In summary, the optimization of the spiral line path planning needs to consider many factors, including the selection of path parameters, path interpolation and smoothing, tool path optimization, etc. In addition, the relationship between coating removal thickness and polishing force described by the surface coating Preston equation and the adjustment of polishing force and rotation speed when the hole exists also need to be planned and controlled in practical application.

[0181] The above-mentioned embodiment numbers of the present application are only for description, not representing the advantages and disadvantages of the embodiments.

[0182] In the above-mentioned embodiments of the present application, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0183] In the several embodiments provided by the present application, it should be understood that the disclosed technology can be implemented in other ways. Of course, the system embodiments described above are only schematic, and the division of units is only a logical function division, and there can be another division way in actual implementation, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection between units can be indirect coupling or communication connection through some interface, unit or module, and can be electrical or other forms.

[0184] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, i.e., may be located in one place, or may be distributed on multiple network units. Part or all of the units may be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0185] In addition, each functional unit in each embodiment of the application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0186] The integrated unit, if realized in the form of a software functional unit and sold or used as an independent product, can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the application, essentially or the part of the prior art that contributes to the technical solutions, or all or part of the technical solutions can be embodied in the form of a software product, which is stored in a storage medium and includes a number of instructions for making a computer device (which can be a personal computer, a server or a network device, etc.) execute all or part of the steps of the method described in each embodiment of the application. The foregoing storage medium includes a U disk, a read-only storage medium (ROM, Read-Only Memory), a random access storage medium (RAM, Random Access Memory), a mobile hard disk, a magnetic disk or an optical disk, and various program code storage media.

[0187] Obviously, the above embodiments are only examples for clear illustration, and not a limitation on the implementation. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the implementations do not need to be exhausted, and the obvious changes or variations derived therefrom are still within the protection scope of the application.

Claims

1. A method of automated grinding of a surface coating of a workpiece, characterized in that, The method comprises the following steps: obtaining equipment information of a polishing device and workpiece information of a workpiece, wherein the equipment information of the polishing device comprises original rotating speed of the polishing device, contact area of the polishing device and diameter of the polishing device, and the workpiece information of the workpiece comprises surface area of a hole, diameter of the hole, surface area after removing the hole and distance from a center point of the hole to a contact point of a grinding wheel; setting a polishing device rotating speed adjustment model to calculate adjusted rotating speed of the polishing device according to the equipment information of the polishing device, setting a polishing device polishing force adjustment model to calculate adjusted polishing force of the polishing device according to the workpiece information of the workpiece, and adjusting the polishing device according to the adjusted rotating speed and the adjusted polishing force of the polishing device; the polishing device rotating speed adjustment model comprises: wherein ω' is the adjusted rotational speed of the polishing apparatus, ω is the original rotational speed of the polishing apparatus, A i is the surface area of the ith hole, A' is the contact area of the polishing apparatus, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the ith hole to the contact point of the polishing apparatus, D is the diameter of the polishing apparatus, A max is the surface area after removing the holes, k1 is the first adjustment factor, k2 is the second adjustment factor; the polishing device polishing force adjustment model comprises: where F' is the adjusted polishing force of the polishing apparatus, A i is the surface area of the ith hole, k3 is a third adjustment factor, k4 is a fourth adjustment factor, k5 is a fifth adjustment factor, A max is the maximum surface area of the holes, F is the original polishing force of the polishing apparatus, A' is the contact area of the polishing apparatus, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the holes, R i is the distance from the center point of the ith hole to the contact point of the polishing wheel, D is the diameter of the polishing apparatus, A max is the surface area after the holes are removed; obtaining thickness measurement points on a surface of the workpiece, calculating normal vectors of each thickness measurement point, planning a polishing path of the polishing device according to the normal vectors, and polishing the thickness measurement points according to the adjusted polishing device.

2. The method of claim 1, wherein the workpiece surface coating is polished by the robot. calculating the normal vectors of each thickness measurement point comprises calculating the normal vectors of each thickness measurement point by a nearest neighbor search method.

3. The method of claim 1, wherein the workpiece surface coating is polished by the robot.

3. The method of claim 1, wherein the workpiece surface coating is polished by the robot. planning the polishing path of the polishing device according to the normal vectors comprises calculating coordinates of all points on the polishing path by calculating a helix trajectory.

4. An automated polishing system for a workpiece surface coating, characterized by, The method comprises the following steps: a data acquisition module is configured to obtain equipment information of a polishing device and workpiece information of a workpiece, wherein the equipment information of the polishing device comprises original rotating speed of the polishing device, contact area of the polishing device and diameter of the polishing device, and the workpiece information of the workpiece comprises surface area of a hole, diameter of the hole, surface area after removing the hole and distance from a center point of the hole to a contact point of a grinding wheel; an adjustment module is configured to set a polishing device rotating speed adjustment model to calculate adjusted rotating speed of the polishing device according to the equipment information of the polishing device, set a polishing device polishing force adjustment model to calculate adjusted polishing force of the polishing device according to the workpiece information of the workpiece, and adjust the polishing device according to the adjusted rotating speed and the adjusted polishing force of the polishing device; the polishing device rotating speed adjustment model comprises: wherein ω' is the adjusted rotational speed of the polishing apparatus, ω is the original rotational speed of the polishing apparatus, A i is the surface area of the ith hole, A' is the contact area of the polishing apparatus, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the hole, R i is the distance from the center point of the ith hole to the contact point of the polishing apparatus, D is the diameter of the polishing apparatus, A max is the surface area after removing the holes, k1 is the first adjustment factor, k2 is the second adjustment factor; the polishing device polishing force adjustment model comprises: where F' is the adjusted polishing force of the polishing apparatus, A i is the surface area of the ith hole, k3 is a third adjustment factor, k4 is a fourth adjustment factor, k5 is a fifth adjustment factor, A max is the maximum surface area of the holes, F is the original polishing force of the polishing apparatus, A' is the contact area of the polishing apparatus, n is the number of holes, d i is the diameter of the ith hole, d max is the maximum diameter of the holes, R i is the distance from the center point of the ith hole to the contact point of the polishing wheel, D is the diameter of the polishing apparatus, A max is the surface area after the holes are removed; a polishing module is configured to obtain thickness measurement points on a surface of the workpiece, calculate normal vectors of each thickness measurement point, plan a polishing path of the polishing device according to the normal vectors, and polish the thickness measurement points according to the adjusted polishing device.

5. An automated polishing system for workpiece surface coatings as defined in claim 4, wherein, calculating the normal vectors of each thickness measurement point comprises calculating the normal vectors of each thickness measurement point by a nearest neighbor search method.

6. An automated polishing system for workpiece surface coatings as described in claim 4, wherein, planning the polishing path of the polishing device according to the normal vectors comprises calculating coordinates of all points on the polishing path by calculating a helix trajectory.

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