Colored paper, lpm impregnated paper, inorganic material eco-friendly processed board containing the same, and manufacturing method

Abstract

Disclosed are an inorganic processed board and a method of manufacturing the same, and a gummed paper and an LPM impregnated paper. The inorganic processed board includes an inorganic board, a first gummed paper disposed on one surface of the inorganic board, a first LPM impregnated paper disposed on the first gummed paper, and a second LPM impregnated paper disposed on the other surface of the inorganic board facing the one surface of the inorganic board.

Description

[0001] Cross-reference to related applications

[0002] This application is based on and claims the priority of Korean Patent Application No. 10-2022-0083699, filed on July 7, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to adhesive paper, low-pressure melamine (LPM) impregnated paper, inorganic environmentally friendly processed boards including the adhesive paper, and methods for manufacturing the same. Background Technology

[0004] The increasing fire risk due to urban development and skyscrapers, coupled with heightened public awareness of fire safety, has led to a growing demand for non-combustible and quasi-noncombustible building materials. Consequently, inorganic boards, such as magnesium oxide boards, calcium silicate boards, cellulose reinforced cement boards (hereinafter referred to as "CRC boards"), and vermiculite boards, are increasingly being used in the field of interior building materials. However, the promotion of inorganic board materials in the development of non-combustible and quasi-noncombustible environmentally friendly processed boards faces several challenges. These limitations stem from several constraints, such as the higher price compared to existing organic interior materials (such as wood), and the limited availability of surface processing materials and methods, which restricts design options. Therefore, there is a need to develop economical and well-designed non-combustible and quasi-combustible environmentally friendly processed boards to protect lives from fire.

[0005] Currently, magnesium oxide boards and calcium silicate boards are mainly used as non-combustible and near-combustible indoor and outdoor materials. In particular, relatively economical and lightweight magnesium oxide, with its superior water resistance and processability, is primarily used as an indoor material for non-structural applications. Magnesium oxide boards are produced by mixing magnesium compound powder, perlite as filler, glass fibers (such as vermiculite and meteorite), wood chips, and water, then pressing and subsequently plastically processing the mixture. During the molding process, magnesium oxide boards are manufactured by laying a release agent, glass fiber pad, and non-woven fabric (felt) on the base and surface of the molding die, adding a mixture containing magnesium powder, then pressurizing and dehydrating the mixture using a press, followed by hydraulic curing. This results in an uneven, highly porous, and rough surface, with residual siloxane release agent adhering to the back.

[0006] Compared to magnesium oxide boards, calcium silicate boards are more expensive and, due to their high density, high strength, and excellent insulation and heat resistance, are primarily used in commercial, industrial, indoor, and outdoor materials. Calcium silicate boards are manufactured by mixing water with diatomaceous earth, siliceous materials, lime, cellulose pulp, and various fillers, followed by pressure dewatering to form a wet slurry. This wet slurry is then placed in a high-pressure autoclave at 10 kg / cm³.2 Up to 15kg / cm 2 The calcium silicate board undergoes a hydrothermal reaction under high temperature and high pressure saturated steam pressure of 160℃ to 230℃, followed by final drying, resulting in a product with highly porous and rough surfaces and backs.

[0007] In addition to magnesium oxide boards and calcium silicate boards, vermiculite boards and CRC boards are also widely used as quasi-combustible and non-combustible indoor and outdoor materials.

[0008] Vermiculite boards are lightweight (density 0.3 g / cm³) produced by heating vermiculite and perlite at 800°C to 1100°C to expand them, then mixing them with an inorganic binder (sodium silicate or calcium silicate) and molding them, followed by curing at a high temperature (160°C to 180°C) for at least 24 hours. 3 Porous boards and vermiculite boards exhibit excellent non-combustibility, insulation, sound insulation, and deodorization properties, but they have many pours on the surface and back.

[0009] CRC board is a product obtained by mixing water with cellulose fibers (such as natural pulp), Portland cement, and quartz, pressing the mixture with 10,000 tons of pressure, and then curing it with high-temperature, high-pressure steam in an autoclave. CRC board has a high density (1.4 g / cm³). 3 Due to its excellent non-flammability, water resistance, and durability, CRC board is widely used as an interior and exterior building material, but it has a rough surface and back and is highly alkaline.

[0010] To enhance the surface design and performance of magnesium oxide boards, calcium silicate boards, vermiculite boards, and CRC boards (hereinafter referred to as "inorganic boards") manufactured as described above, various types of surface treatments are required. However, post-processing is complex due to the limitations of the surface condition of inorganic boards before processing, with coatings, high-pressure melamine (HPM), veneers, and plastic sheets (such as polyvinyl chloride (PVC)) primarily used in post-processing. Although inorganic boards are non-combustible materials with several excellent properties, they require complex steps and become costly structures in post-processing, such as the use of separate adhesives. Therefore, inorganic boards are difficult to widely apply in the market and cause environmental pollution problems due to the adhesive components.

[0011] Therefore, it is necessary to address the issues in the post-processing stage in order to develop an economical, well-designed, non-combustible, inorganic, and environmentally friendly processed board as a building interior material. Summary of the Invention

[0012] To address the problems of existing technologies and to improve the economic design of inorganic boards while maintaining their non-flammability and excellent performance, it is necessary to achieve, through a one-step process, the lamination of low-pressure melamine (LPM) or LPM and phenolic resin impregnated adhesive paper on one surface of the inorganic board, and the lamination of LPM or LPM and phenolic resin impregnated adhesive paper on the other surface of the inorganic board.

[0013] However, when LPM and phenol-impregnated adhesive paper are laminated onto inorganic boards, rough portions on one surface of the inorganic board and rough surfaces or siloxane release agent portions on the other surface can cause various defects, such as adhesion defects, cracks, and surface whitening.

[0014] In particular, for LPM to be used as a building material after being laminated onto inorganic boards, it needs to be free of warping, and for LPM, which is mainly used as a furniture surface agent, to be used as an interior building material, LPM needs to have enhanced properties such as water resistance, crack resistance, impact resistance and scratch resistance, and needs to prevent the release of harmful chemical formaldehyde as much as possible.

[0015] However, existing LPMs cannot meet the quality requirements for use as building interior materials, so it is necessary to improve the quality of LPMs to a level that allows them to be used as building interior materials.

[0016] Furthermore, when phenol-impregnated paper is laminated onto the rough side of one surface of an inorganic board, the rough side of another surface of an inorganic board, or the siloxane release agent portion, it easily leads to adhesion defects, smoothness defects, surface contamination, etc. However, existing technologies produce phenol-impregnated kraft paper (base paper weight of 150 to 200 g / m²). 2 The product needs to have improved quality because the aforementioned problems are difficult to resolve to a satisfactory level, and the formaldehyde release is high.

[0017] According to one aspect of the present invention, an inorganic processing plate may include: an inorganic plate; a first adhesive paper disposed on one surface of the inorganic plate; a first low-pressure melamine (LPM) impregnated paper disposed on the first adhesive paper; and a second LPM impregnated paper disposed on another surface of the inorganic plate facing one surface of the inorganic plate.

[0018] According to another aspect of the present invention, the inorganic processing plate may include: an inorganic plate; a first adhesive paper disposed on one surface of the inorganic plate; and a first LPM impregnated paper disposed on the first adhesive paper.

[0019] According to another aspect of the present invention, the inorganic processing plate may include: an inorganic plate; a third LPM impregnation paper disposed on one surface of the inorganic plate and comprising at least two of urea resin, melamine resin, melamine copolymer resin and thermosetting resin; and a fourth LPM impregnation paper disposed on another surface of the inorganic plate facing one surface of the inorganic plate and comprising at least two of urea resin, melamine resin, melamine copolymer resin and thermosetting resin.

[0020] In one embodiment, the inorganic board may be a magnesium oxide board, a calcium silicate board, a cellulose reinforced cement board (CRC board), a vermiculite board, or a combination thereof.

[0021] In one embodiment, the first adhesive paper can be prepared by impregnating a base paper with a first composition containing a thermosetting adhesive resin, the base paper having a g / m² content of 20 to 60 g / m². 2 The weight of the original paper.

[0022] In one embodiment, the weight ratio of the thermosetting adhesive resin to the base paper can be from 55% to 72.7%.

[0023] In one embodiment, the moisture content of the first adhesive paper may be 5% to 7%.

[0024] In one embodiment, the thermosetting adhesive resin may be a phenol-formaldehyde resin in which the molar ratio of formaldehyde to phenol is 1.2 to 1.9, or a copolymer thereof.

[0025] In one embodiment, the first composition may further include a curing accelerator selected from carbonates / esters, ester compounds, amine compounds, or any mixture of these materials.

[0026] In one embodiment, the first LPM-impregnated paper and the second LPM-impregnated paper can be prepared by impregnating base paper with a second composition comprising urea-formaldehyde resin or its copolymer resin and a third composition comprising melamine-formaldehyde resin or its copolymer resin, respectively.

[0027] In one embodiment, in the urea-formaldehyde resin or its copolymer resin, the molar ratio of formaldehyde to urea may be 1.4 to 2.0, and in the melamine-formaldehyde resin or its copolymer resin, the molar ratio of formaldehyde to melamine may be 1.4 to 2.0.

[0028] In one embodiment, the second composition may further comprise a property modifier, said property modifier being a urea compound.

[0029] In one embodiment, the third composition may further comprise a property modifier, wherein the property modifier is a polyhydric aldehyde compound.

[0030] In one embodiment, the third composition may further comprise a crosslinking agent selected from cyanoguanidine, triethyl phosphate, polyethylene glycol, or any mixture thereof.

[0031] In one embodiment, the first LPM impregnated paper and the second LPM impregnated paper may be the same as or different from each other.

[0032] In one embodiment, the inorganic processing plate may further include a second adhesive paper disposed between the inorganic plate and the second LPM impregnated paper.

[0033] In one embodiment, the second adhesive tape may be the same as or different from the first adhesive tape.

[0034] In one embodiment, the third LPM impregnated paper and the fourth LPM impregnated paper may be the same as or different from each other.

[0035] According to one aspect of the present invention, a method of manufacturing an inorganic processing board may include: laminating a first adhesive paper onto one surface of the inorganic board; laminating a first LPM impregnated paper onto the first adhesive paper; laminating a second LPM impregnated paper onto another surface of the inorganic board facing one surface of the inorganic board to form a laminate; and hot-pressing the laminate.

[0036] According to another aspect of the present invention, a method for manufacturing an inorganic processing board may include: laminating a first adhesive paper onto one surface of the inorganic board; laminating a first LPM-impregnated paper onto the first adhesive paper; laminating a second adhesive paper onto another surface of the inorganic board facing one surface of the inorganic board; laminating a second LPM-impregnated paper onto the second adhesive paper to form a laminate; and hot-pressing the laminate.

[0037] According to another aspect of the present invention, a method for manufacturing an inorganic processing board may include: laminating a first adhesive paper onto one surface of the inorganic board; laminating a first LPM impregnated paper onto the first adhesive paper to form a laminate; and hot-pressing the laminate.

[0038] According to another aspect of the invention, a method of manufacturing an inorganic processing board may include: laminating paper prepared by impregnating base paper with a fourth composition on at least one surface of the inorganic board to form a laminate, said fourth composition comprising melamine resin and at least two of phenol resin, formaldehyde resin and urea resin; and hot-pressing said laminate.

[0039] In one embodiment, the hot-pressing temperature in the laminate can be from 140°C to 160°C.

[0040] In one embodiment, the hot-pressing time in the laminate can be from 50 seconds to 120 seconds.

[0041] In one embodiment, the hot-pressing specific pressure in the laminate can be 30 bar / cm². 2 Up to 60 bar / cm 2 .

[0042] According to another aspect of the present invention, the inorganic processing plate can be manufactured by any of the foregoing methods.

[0043] According to one aspect of the invention, the adhesive paper can be prepared by impregnating a base paper with a first composition, said base paper having a g / m² content of 20 to 60 g / m². 2 The first composition comprises, by weight of the base paper, a thermosetting adhesive resin and a curing accelerator selected from carbonates / esters, ester compounds, amine compounds, or any mixture of these materials.

[0044] In one embodiment, the thermosetting adhesive resin may be a phenol-formaldehyde resin or its copolymer resin.

[0045] In one embodiment, the weight ratio of the thermosetting adhesive resin to the base paper can be from 55% to 72.7%.

[0046] In one embodiment, the moisture content may be 5% to 7%.

[0047] According to one aspect of the present invention, low-pressure melamine (LPM) impregnated paper can be prepared by impregnating base paper with a second composition comprising urea-formaldehyde resin or a copolymer thereof and a third composition comprising melamine-formaldehyde resin or a copolymer thereof.

[0048] In one embodiment, the second composition may further comprise a property modifier, said property modifier being a urea compound.

[0049] In one embodiment, the third composition may further comprise a property modifier, wherein the property modifier is a polyhydroxy aldehyde compound.

[0050] In one embodiment, the third composition may further comprise a crosslinking agent selected from cyanoguanidine, triethyl phosphate, polyethylene glycol, or any mixture of these materials.

[0051] In one embodiment, the LPM-impregnated paper, measured by KSM 3357, may have a crosslinking density of 70% or lower. Attached Figure Description

[0052] The accompanying drawings, which are included in and form part of this specification, illustrate embodiments of the invention.

[0053] Figure 1 This is an image of adhesive tape according to one embodiment of the present invention.

[0054] Figure 2A and Figure 2B These are images of LPM-impregnated paper according to one embodiment of the present invention.

[0055] Figures 3 to 6 These are schematic diagrams of inorganic processing plates according to embodiments of the present invention.

[0056] Figure 7A This is a picture showing a portion of a magnesium plate; Figure 7B This is an image showing a portion of an inorganically processed plate according to an embodiment of the present invention, made from magnesium aluminate; and Figure 7C The image shows a portion of a non-machined plate, in which LPM-impregnated paper is placed on both surfaces of a magnesium plate, but without adhesive tape.

[0057] Figure 8A This is a picture showing a portion of a calcium silicate board; Figure 8B These are pictures showing a portion of an inorganically processed plate according to an embodiment of the present invention, manufactured using calcium silicate board; and Figure 8C The image shows a portion of an inorganically processed board, in which LPM impregnated paper is placed on both surfaces of a calcium silicate board, but without adhesive paper.

[0058] Figure 9A This is an image showing a portion of the CRC board; Figure 9B These are images showing a portion of an inorganically processed board manufactured using a CRC board according to an embodiment of the present invention; and Figure 9C The image shows a portion of a non-machined board, in which LPM-impregnated paper is applied to both surfaces of a CRC board, but no adhesive tape is used.

[0059] Figure 10A This is a picture showing a portion of a vermiculite slab; Figure 10B These are images showing a portion of an inorganically processed plate according to an embodiment of the present invention, manufactured using vermiculite slabs; and Figure 10C The image shows a portion of a non-machined board, in which LPM-impregnated paper is placed on both surfaces of a vermiculite board, but without adhesive tape. Detailed Implementation

[0060] To clearly explain the technical concept of the present invention, various embodiments or examples described herein are provided. The technical concept of the present invention includes various modifications, equivalents, and substitutions to each embodiment or example described herein, as well as embodiments or examples selectively combined in whole or in part with each embodiment or example described herein. Furthermore, the technical concept of the present invention is not limited to the various embodiments or examples described below and their detailed descriptions.

[0061] Unless otherwise stated, all technical or scientific terms used herein have the meanings commonly understood by one of ordinary skill in the art to which this invention pertains. Terms as defined in commonly used dictionaries should be interpreted as having the same meaning as those used in the context of the relevant description and should not be interpreted in an ideal or overly formal sense unless they are explicitly defined herein.

[0062] The terms "comprising," "may include," "provided," "available," and "having" used herein can indicate the presence of principal features (e.g., functions, operations, components, etc.) and do not exclude the presence of other additional features. In other words, such terms should be understood as open-ended terms implying the possibility of including other implementations.

[0063] Unless otherwise stated, the singular expression may include the plural meaning, and this also applies to the singular expressions described in the claims.

[0064] The expressions “A, B and C”, “A, B or C”, “A, B and / or C”, “at least one of A, B and C”, “at least one of A, B or C”, “at least one of A, B and / or C”, “selected from at least one of A, B and C”, “selected from at least one of A, B or C”, “selected from at least one of A, B and / or C”, etc., used in this document may refer to each of the listed items, or may provide any possible combination of the listed items.

[0065] The terms “approximately” or “about” as used herein may refer to the customary range of error for each value, as is well known to those skilled in the art. In the case of numerical values ​​or ranges described herein, the term may refer to ±20%, ±15%, ±10%, ±9%, ±8%, ±7%, ±6%, ±5%, ±4%, ±3%, ±2%, or ±1% of the numerical values ​​or ranges stated or claimed in one embodiment.

[0066] Unless otherwise stated in the context, the descriptions of dimensions, values ​​and their ranges used herein are not limited to the respective dimensions, values ​​and their ranges, and may represent equivalent ranges including these.

[0067] The following describes various aspects and embodiments of the present invention.

[0068] [Adhesive tape]

[0069] One aspect of the present invention relates to adhesive paper.

[0070] Figure 1 This is an image of adhesive tape according to one embodiment of the present invention.

[0071] In one embodiment, the adhesive paper can be prepared by impregnating base paper with the first composition, wherein the base paper has a concentration of 20 to 60 g / m² per unit area. 2 The first composition comprises, by weight of the base paper, a thermosetting adhesive resin and a curing accelerator selected from carbonates / esters, ester compounds, amine compounds, or any mixture of these materials.

[0072] The adhesive tape is prepared by impregnating base paper with a composition comprising a thermosetting adhesive resin and a curing accelerator as described above, wherein the base paper has a weight of 20 to 60 g / m² per unit area. 2 This ensures that the adhesive properties of the adhesive tape are maintained at a predetermined level or higher, and minimizes the harmful environmental impact of the chemicals contained in the adhesive tape.

[0073] In one embodiment, the weight ratio of the thermosetting adhesive resin to the base paper can be from 55% to 72.7%.

[0074] In one embodiment, the moisture content of the adhesive tape may be 5% to 7%.

[0075] In one embodiment, in order to suppress adhesion defects or surface contamination on the surface of the inorganic board or the silicone release agent portion, or to improve flatness, the molar ratio (number of moles of formaldehyde / number of moles of phenol) of the phenol-formaldehyde resin (hereinafter referred to as "phenolic resin") or copolymer resin (phenol-urea-formaldehyde resin (PUF), phenol-melamine-formaldehyde resin (PMF), phenol-melamine-urea-formaldehyde resin (PMUF)) in the adhesive paper can be 1.2 to 1.9.

[0076] In one embodiment, to improve environmental friendliness, the methanol content relative to the thermosetting adhesive resin (e.g., phenolic resin) can be reduced from 7 wt% to 8 wt% to 0 to 5 wt%, and in the preparation of the thermosetting adhesive resin (e.g., phenolic resin), at least one of catechol, resorcinol, and hydroquinone as dihydroxybenzene compounds and 2,3-naphthodiol, 1,2-dihydroxynaphthalene, and 1,8-dihydroxynaphthalene as polyhydroxynaphthalene compounds can be added as a performance modifier in an amount of 2.4 wt% to 4.2 wt% relative to the weight of the thermosetting adhesive resin (e.g., phenolic resin).

[0077] In the impregnation of base paper with thermosetting adhesive resin, as a curing accelerator for the thermosetting adhesive resin (e.g., phenolic resin), to promote the curing of the thermosetting adhesive resin, a mixture of 2.4 wt% to 3.7 wt% relative to the solids of the thermosetting adhesive resin (e.g., phenolic resin) may be added, which consists of 20 to 35 parts by weight of sodium carbonate, ethylene carbonate, or propylene carbonate (these are carbonates), 19 to 28 parts by weight of methyl formate, methyl salicylate, or phenyl acetate (these are ester compounds), and 21 to 40 parts by weight of triethylenetriamine, polyethylene glycol diamine, or tetraethylene glycol diamine (these are amine compounds).

[0078] [LPM Impregnated Paper]

[0079] Another aspect of the present invention relates to low-pressure melamine (LPM) impregnated paper.

[0080] Figure 2A and Figure 2B This is an image of LPM impregnated paper according to one embodiment of the present invention.

[0081] In one embodiment, LPM impregnated paper can be prepared by impregnating base paper with a second composition comprising urea-formaldehyde resin or its copolymer and a third composition comprising melamine-formaldehyde resin or its copolymer.

[0082] For example, urea-formaldehyde resin (hereinafter referred to as "urea resin") or copolymer resin (melamine-urea-formaldehyde, MUF) can be prepared such that the molar ratio of formaldehyde to phenol (moles of formaldehyde / moles of phenol) is in the range of 1.4 to 2.0.

[0083] For example, as a performance modifier in the preparation of urea resin, a urea compound, which is at least one of ethylene urea, thiourea, cyclodiurea, isobutyl diurea and acetylurea, can be added at a weight percentage of 1.4 wt% to 3.8 wt% relative to the weight of the urea resin.

[0084] For example, melamine urea formaldehyde resin (hereinafter referred to as "melamine resin") or its copolymer resin (melamine phenol formaldehyde resin (MPF) or melamine urea phenol formaldehyde resin (MUPF)) can be prepared such that the molar ratio of formaldehyde to melamine (moles of formaldehyde / moles of melamine) is in the range of 1.4 to 2.0.

[0085] For example, as a performance modifier in the preparation of melamine resin, a polyhydroxy aldehyde, which is one or two of glyoxal, glutaraldehyde, malondialdehyde, propionaldehyde, octaldehyde, and sebacaldehyde, can be added at 1.5 wt% to 3.5 wt% (weight percentage) relative to the weight of melamine.

[0086] In the preparation of LPM-impregnated paper, in order to prevent warping of the LPM-impregnated paper, a crosslinking agent can be added to the melamine resin at 1.7 wt% to 3.1 wt% relative to the solids of the melamine resin to reduce the degree of crosslinking of the melamine resin. The crosslinking agent is a mixture of 5.2 to 9.8 parts by weight of dicyandiamide, 20.4 to 42.7 parts by weight of triethyl phosphate, and 32.1 to 54.3 parts by weight of polyethylene glycol (Hannong Chemical, Kopex PEG 400 or 1000).

[0087] In one embodiment, the LPM-impregnated paper may have a crosslinking density of 70% or lower, as measured by KSM 3357.

[0088] [Inorganic processed plates and their manufacturing methods]

[0089] Figures 3 to 6 These are schematic diagrams of inorganic processing plates according to embodiments of the present invention.

[0090] refer to Figure 3 The inorganic processing plate 100 includes: an inorganic plate 110; a third LPM impregnated paper 130a disposed on one surface of the inorganic plate 110 and comprising at least two of urea resin, melamine resin, melamine copolymer resin, and thermosetting resin; and a fourth LPM impregnated paper 130b disposed on another surface facing one surface of the inorganic plate 110 and comprising at least two of urea resin, melamine resin, melamine copolymer resin, and thermosetting resin. For example, the opposing surfaces of the inorganic plate 110 may have different roughnesses.

[0091] The inorganic processing board 100 can be manufactured by a process for preparing a laminate and a process for hot-pressing a laminate, wherein the laminate is formed by laminating a third LPM impregnated paper 130a and / or a fourth LPM impregnated paper 130b on at least one surface of the inorganic board 110, wherein the fourth LPM impregnated paper 130b is prepared by impregnating the base paper with a fourth composition comprising at least two of melamine resin and phenolic resin, formaldehyde resin and urea resin.

[0092] The third LPM impregnated paper 130a and the fourth LPM impregnated paper 130b can have enhanced adhesion by further including phenolic resins other than LPM in the composition of the impregnated paper, making it easier for the LPM impregnated paper to be laminated onto the inorganic board 110.

[0093] refer to Figure 4The inorganic processing plate 200 includes: an inorganic plate 210; a first adhesive tape 220a disposed on one surface of the inorganic plate 210; a first LPM impregnated paper 230a disposed on the first adhesive tape 220a; and a second LPM impregnated paper 230b disposed on another surface facing one surface of the inorganic plate 210. For example, the one surface and the other surface of the inorganic plate 210 facing each other may have different roughness.

[0094] The inorganic processing board 200 can be manufactured by: a process of laminating a first adhesive paper 220a onto one surface of the inorganic board 210; a process of laminating a first LPM impregnated paper 230a onto the first adhesive paper 220a; a process of laminating a second LPM impregnated paper 230b onto another surface facing one surface of the inorganic board 210 to form a laminate; and a process of hot pressing the laminate.

[0095] For example, the surface roughness of one surface of the inorganic board 210 on which the first adhesive tape 220a is disposed may be less than the surface roughness of the other surface of the inorganic board 210 without adhesive tape. Due to the relatively smaller surface roughness, it is more difficult to laminate the first LPM impregnated paper 230a onto one surface of the inorganic board 210 than to laminate the second LPM impregnated paper 230b onto the other surface of the inorganic board 210, but the first LPM impregnated paper 230a can be easily laminated onto one surface of the inorganic board 210 by being bonded by the first adhesive tape 220a.

[0096] refer to Figure 5 The inorganic processing plate 300 includes: an inorganic plate 310; a first adhesive tape 320a disposed on one surface of the inorganic plate 310; a first LPM impregnated paper 330a disposed on the first adhesive tape 320a; a second LPM impregnated paper 330b disposed on another surface facing one surface of the inorganic plate 310; and a second adhesive tape 320a disposed between the inorganic plate 310 and the second LPM impregnated paper 330a. For example, the opposing surfaces of the inorganic plate 310 may have different roughnesses.

[0097] The inorganic processing board 300 can be manufactured by: a process of laminating a first adhesive paper 320a onto one surface of the inorganic board 310; a process of laminating a first LPM impregnated paper 330a onto the first adhesive paper 320a; a process of laminating a second adhesive paper 320b onto another surface facing one surface of the inorganic board 310; a process of laminating a second LPM impregnated paper 330b onto the second adhesive paper 320b to form a laminate; and a process of hot-pressing the laminate.

[0098] refer to Figure 6The inorganic processing plate 400 includes: an inorganic plate 410; a first adhesive tape 420a disposed on one surface of the inorganic plate 410; and a first LPM impregnated paper 430a disposed on the first adhesive tape 420a. For example, one surface of the inorganic plate 410 facing each other and the other surface may have different roughness.

[0099] The inorganic processing board 400 can be manufactured by: a process of laminating a first adhesive paper 420a onto a surface of the inorganic board 410; a process of laminating a first LPM impregnated paper 430a onto the first adhesive paper 420a to form a laminate; and a process of hot pressing the laminate.

[0100] In the final process of hot-pressing LPM impregnated paper and adhesive paper onto an inorganic board using a hot-pressing laminator, the original adhesive paper weighs 20 to 60 g / m². 2 The moisture content is 4% to 7%, the impregnation weight (resin weight / impregnated paper weight ratio) is 50% to 75%, and the hot-pressing parameters are: hot-pressing temperature 120°C to 200°C, hot-pressing time 30 to 120 seconds, and hot-pressing specific pressure 20 to 60 bar / cm². 2 The design of the pressure cycle during hot pressing may also be important.

[0101] The invention will be clearly understood from the aspects described above and the embodiments described below. The invention will be explained in detail below so that those skilled in the art can readily understand and implement it through exemplary embodiments. However, these exemplary embodiments are for illustrative purposes only, and the scope of the invention is not intended to be limited by these exemplary embodiments.

[0102] [Preparation Example]

[0103] 1) Urea resin composition A for LPM impregnation (molar ratio of formaldehyde to urea = 1.45:1)

[0104] After adding 1090 parts by weight of formalin (40%), the pH was adjusted to 7 using caustic soda (10% NaOH), followed by the addition of 290 parts by weight of urea. After the urea addition was complete, the mixture was heated to 95°C and held for 15 minutes. After adding 35 parts by weight of ethylene urea, the pH was adjusted to 4.2 using formic acid (HCOOH, 10%), and then the polycondensation reaction was carried out. During the reaction, when the water content (25°C) reached 300%, the pH was adjusted to 7.5 using caustic soda, and the mixture was heated to 65°C. After 45 minutes, 310 parts by weight of urea was added, followed by cooling to 25°C. The final pH was adjusted to 8.9 using caustic soda.

[0105] 2) Urea resin composition B for LPM impregnation (molar ratio of formaldehyde to urea = 1.70:1)

[0106] After adding 1090 parts by weight of formalin (40%), the pH was adjusted to 7 with caustic soda (10% NaOH), and then 290 parts by weight of urea were added. After the urea addition was complete, the mixture was heated to 95°C and held for 15 minutes. After adding 30 parts by weight of thiourea, the pH was adjusted to 4.2 with formic acid (HCOOH, 10%), and then the polycondensation reaction was carried out. During the reaction, when the water content (25°C) reached 300%, the pH was adjusted to 7.5 with caustic soda, and then the mixture was heated to 65°C. After 45 minutes, 222 parts by weight of urea were added, followed by cooling to 25°C. The final pH was adjusted to 8.9 with caustic soda.

[0107] 3) Urea resin composition C for LPM impregnation (molar ratio of formaldehyde to urea = 2.00:1)

[0108] After adding 1090 parts by weight of formalin (40%), the pH was adjusted to 7 with caustic soda (10% NaOH), and then 290 parts by weight of urea were added. After the urea addition was complete, the mixture was heated to 95°C and held for 15 minutes. After adding 32 parts by weight of acetourea, the pH was adjusted to 4.2 with formic acid (HCOOH, 10%), and then the polycondensation reaction was carried out. During the reaction, when the water content (25°C) reached 300%, the pH was adjusted to 7.5 with caustic soda, and then the mixture was heated to 65°C. After 45 minutes, 145 parts by weight of urea were added, followed by cooling to 25°C. The final pH was adjusted to 8.9 with caustic soda.

[0109] 4) Urea resin composition D for LPM impregnation (molar ratio of formaldehyde to urea = 1.45:1)

[0110] Only ethylene urea in urea resin composition A (molar ratio of formaldehyde to urea = 1.45:1) used for LPM impregnation is excluded.

[0111] 5) Urea resin composition E for LPM impregnation (molar ratio of formaldehyde to urea = 1.70:1)

[0112] Only thiourea in urea resin composition B (molar ratio of formaldehyde to urea = 1.70:1) used for LPM impregnation is excluded.

[0113] 6) Urea resin composition F for LPM impregnation (molar ratio of formaldehyde to urea = 2.00:1)

[0114] Acetourea was excluded only from the urea resin composition C (molar ratio of formaldehyde to urea = 2.00:1) used for LPM impregnation.

[0115] 7) Urea resin composition G for LPM impregnation (molar ratio of formaldehyde to urea = 1.25:1)

[0116] After adding 1090 parts by weight of formalin (40%), the pH was adjusted to 7 with caustic soda (10% NaOH), and then 290 parts by weight of urea were added. After the urea addition was complete, the mixture was heated to 95°C and held for 15 minutes. Once the urea was completely dissolved, the pH was adjusted to 4.2 with formic acid (HCOOH, 10%), and then the polycondensation reaction was initiated. During the reaction, when the water content (25°C) reached 300%, the pH was adjusted to 7.5 with caustic soda, and then the mixture was heated to 65°C. After 45 minutes, 406 parts by weight of urea were added, followed by cooling to 25°C. The final pH was set to 8.9 with caustic soda.

[0117] 8) Urea resin composition G for LPM impregnation (molar ratio of formaldehyde to urea = 2.25:1)

[0118] After adding 1090 parts by weight of formalin (40%), the pH was adjusted to 7 with caustic soda (10% NaOH), and then 290 parts by weight of urea were added. After the urea addition was complete, the mixture was heated to 95°C and held for 15 minutes. Once the urea was completely dissolved, the pH was adjusted to 4.2 with formic acid (HCOOH, 10%), and then the polycondensation reaction was carried out. During the reaction, when the water content (25°C) reached 300%, the pH was adjusted to 7.5 with caustic soda, and then the mixture was heated to 65°C. After 45 minutes, 97 parts by weight of urea were added, followed by cooling to 25°C. The final pH was adjusted to 8.9 with caustic soda.

[0119] 9) Melamine resin composition A' for LPM impregnation (molar ratio of formaldehyde to melamine = 1.45:1)

[0120] After adding 1180 parts by weight of formalin (40%), the mixture was heated at 40°C, and the pH was adjusted to 9.4 using caustic soda (10% NaOH). Once the pH stabilized, 1367 parts by weight of melamine was slowly added. After the melamine addition was complete, the mixture was heated at 98°C. After confirming that the melamine was completely dissolved, the pH was adjusted to 9.7, and polycondensation was carried out for 135 minutes. The cloud point was determined at 50°C during the reaction, and then 50.9 parts by weight of propionaldehyde was added. The pH was adjusted to 8.7, and the cloud point was determined at 25°C during the reaction. The pH was then adjusted to 9.5 using triethanolamine (TEA), followed by cooling at 25°C. The resin viscosity (Brookfield cap 2000+, 25℃, 300rpm) was 100cP; the solids content (105℃, 3h) was 64.2%; the molecular weight (Mw, gel permeation chromatography, solvent DMF, flow rate 1ml / min) was 783; and the water content was 150%.

[0121] 10) Melamine resin composition B' for LPM impregnation (molar ratio of formaldehyde to melamine = 1.70:1)

[0122] After adding 1180 parts formalin (40%), the mixture was heated at 40°C, and the pH was adjusted to 9.4 with caustic soda (10% NaOH). Once the pH stabilized, 1166 parts by weight of melamine were slowly added. After the melamine addition was complete, the mixture was heated at 98°C. After confirming complete dissolution of the melamine, the pH was adjusted to 9.7 with caustic soda, and polycondensation was carried out for 135 minutes. The cloud point was determined at 50°C during the reaction, and then 49.2 parts by weight of malondialdehyde were added. The pH was adjusted to 8.7, and the cloud point was determined at 25°C after 30 minutes of reaction. The pH was then adjusted to 9.5 using TEA, followed by cooling at 25°C. The resin viscosity (Brookfield cap 2000+, 25℃, 300rpm) was 95 cP; the solids content (105℃, 3h) was 63.9%; the molecular weight (Mw, gel permeation chromatography, solvent DMF, flow rate 1ml / min) was 765; and the water content was 160%.

[0123] 11) Melamine resin composition C' for LPM impregnation (molar ratio of formaldehyde to melamine = 2.00:1)

[0124] After adding 1180 parts formalin (40%), the mixture was heated at 40°C, and the pH was adjusted to 9.4 with caustic soda (10% NaOH). Once the pH stabilized, 989 parts by weight of melamine were slowly added. After the melamine addition was complete, the mixture was heated at 98°C. After confirming complete dissolution of the melamine, the pH was adjusted to 9.7 with caustic soda, and polycondensation was carried out for 135 minutes. The cloud point was determined at 50°C after 30 minutes of reaction, and then 48.5 parts by weight of octanedialdehyde were added. The pH was adjusted to 8.7, and the cloud point was determined at 25°C after 30 minutes of reaction. The pH was then adjusted to 9.5 using TEA, and the mixture was cooled at 25°C. The resin viscosity (Brookfield cap 2000+, 25℃, 300rpm) was 93 cP; the solids content (105℃, 3h) was 63.2%; the molecular weight (Mw, gel permeation chromatography, solvent DMF, flow rate 1ml / min) was 752; and the water content was 155%.

[0125] 12) Melamine resin composition D' for LPM impregnation (molar ratio of formaldehyde to melamine = 1.45:1)

[0126] Only propionaldehyde in the urea resin composition A' (molar ratio of formaldehyde to urea = 1.45:1) used for LPM impregnation is excluded.

[0127] 13) Melamine resin composition E' for LPM impregnation (molar ratio of formaldehyde to melamine = 1.70:1)

[0128] Malondialdehyde was excluded only from the urea resin composition B' (molar ratio of formaldehyde to urea = 1.70:1) used for LPM impregnation.

[0129] 14) Melamine resin composition F' for LPM impregnation (molar ratio of formaldehyde to melamine = 2.00:1)

[0130] Only octanedialdehyde in the melamine resin composition C' (molar ratio of formaldehyde to urea = 2.00:1) used for LPM impregnation is excluded.

[0131] 15) Melamine resin composition G' for LPM impregnation (molar ratio of formaldehyde to melamine = 1.25:1)

[0132] After adding 1180 parts by weight of formalin (40%), the mixture was heated at 40°C, and the pH was adjusted to 9.4 using caustic soda (10% NaOH). Once the pH stabilized, 1583 parts by weight of melamine were slowly added. After the melamine addition was complete, the mixture was heated at 98°C. After confirming complete dissolution of the melamine, the pH was adjusted to 9.7, and polycondensation was carried out for 135 minutes. The cloud point was determined at 50°C during the reaction, and the pH was then adjusted to 8.7. The cloud point was determined at 25°C after 30 minutes of reaction, and the pH was adjusted to 9.5 using triethanolamine (TEA), followed by cooling at 25°C. The resin viscosity (Brookfield cap 2000+, 25℃, 300rpm) was 104 cP; the solids content (105℃, 3h) was 65.5%; the molecular weight (Mw, gel permeation chromatography, solvent DMF, flow rate 1ml / min) was 788; and the water content was 140%.

[0133] 16) Melamine resin composition H' for LPM impregnation (molar ratio of formaldehyde to melamine = 2.25:1)

[0134] After adding 1180 parts by weight of formalin (40%), the mixture was heated at 40°C, and the pH was adjusted to 9.4 with caustic soda (10% NaOH). Once the pH stabilized, 879 parts by weight of melamine were slowly added. After the melamine addition was complete, the mixture was heated at 98°C. After confirming complete dissolution of the melamine, the pH was adjusted to 9.7, and polycondensation was carried out for 135 minutes. The cloud point was determined at 50°C during the reaction, and the pH was then adjusted to 8.7. The cloud point was determined at 25°C after 30 minutes of reaction, and the pH was adjusted to 9.5 using triethanolamine (TEA), followed by cooling at 25°C. The resin viscosity (Brookfield cap 2000+, 25°C, 300 rpm) was 91 cP; the solids content (105°C, 3 h) was 62.1%; the molecular weight (Mw, gel permeation chromatography, solvent DMF, flow rate 1 ml / min) was 743; and the water content was 155%.

[0135] 17) Melamine resin crosslinking agent composition I

[0136] Melamine resin crosslinking agent composition I was prepared by mixing 7.7 parts by weight of dicyandiamide, 31.9 parts by weight of triethyl phosphate and 40.2 parts by weight of polyethylene glycol (Hannong Chemical, Kopex PEG 400).

[0137] 18) Melamine resin crosslinking agent composition II

[0138] Melamine resin crosslinking agent composition II was prepared by mixing 5.8 parts by weight of dicyandiamide, 43.4 parts by weight of triethyl phosphate and 30.2 parts by weight of polyethylene glycol (Hannong Chemical, Kopex PEG 1000).

[0139] 19) Melamine resin crosslinking agent composition III

[0140] Melamine resin crosslinking agent composition III was prepared by mixing 6.2 parts by weight of dicyandiamide, 40.7 parts by weight of triethyl phosphate and 34.9 parts by weight of polyethylene glycol (Hannong Chemical, Kopex PEG 1000).

[0141] 20) Phenolic resin composition A for impregnation of adhesive paper (formaldehyde:phenol molar ratio = 1.3:1, 2% methanol, catalyst KOH)

[0142] After adding 455 parts by weight of phenol, 472 parts by weight of formalin (40%), and 90 parts by weight of primary KOH (50%), the mixture was heated to 95°C for 20 minutes. The mixture was then maintained at 95°C until a viscosity of 250 cP (25°C) was achieved. The mixture was then cooled to 75°C, and 18.5 parts by weight of catechol and 18.5 parts by weight of 1,8-dihydroxynaphthalene were added, and the mixture was maintained for 5 minutes. Next, 110 parts by weight of secondary KOH (50%) was added, and the mixture was maintained at 80°C until a viscosity of 250 cP (25°C) was achieved. Then, 120 parts by weight of tertiary KOH (50%) was added, and the mixture was maintained at 60°C for 10 minutes. Finally, 25 parts by weight of methanol were added, followed by rapid cooling to room temperature. The resulting product had a viscosity of 225 cP (25°C), a solids content of 61%, and a water content of 2000%.

[0143] 21) Phenolic resin composition B for impregnation of adhesive paper (formaldehyde:phenol molar ratio = 1.6:1, 1.7% methanol, catalyst KOH)

[0144] After adding 455 parts by weight of phenol, 580 parts by weight of formalin (40%), and 95 parts by weight of the first KOH (50%), the mixture was heated to 95°C for 20 minutes. The mixture was then maintained at 95°C until a viscosity of 250 cP (25°C) was achieved. The mixture was then cooled to 75°C, and 19.2 parts by weight of hydroquinone and 19.2 parts by weight of 2,3-naphthyldiol were added, and the mixture was maintained for 5 minutes. Next, 115 parts by weight of the second KOH (50%) was added, and the mixture was maintained at 80°C until a viscosity of 250 cP (25°C) was achieved. Then, 120 parts by weight of the third KOH (50%) was added, and the mixture was maintained at 60°C for 10 minutes. Finally, 23 parts by weight of methanol were added, followed by rapid cooling to room temperature. The resulting product had a viscosity of 220 cP (25°C), a solids content of 59%, and a water content of 2100%.

[0145] 22) Phenolic resin composition C for impregnation of adhesive paper (formaldehyde:phenol molar ratio = 1.9:1, 1.5% methanol, catalyst KOH)

[0146] After adding 455 parts by weight of phenol, 690 parts by weight of formalin (40%), and 100 parts by weight of the first KOH (50%), the mixture was heated to 95°C for 20 minutes. The mixture was then maintained at 95°C until a viscosity of 250 cP (25°C) was achieved. The mixture was then cooled to 75°C, and 20.1 parts by weight of resorcinol and 20.1 parts by weight of 1,2-dihydroxynaphthalene were added, and the mixture was maintained for 5 minutes. Next, 120 parts by weight of the second KOH (50%) was added, and the mixture was maintained at 80°C until a viscosity of 250 cP (25°C) was achieved. Then, 120 parts by weight of the third KOH (50%) was added, and the mixture was maintained at 60°C for 10 minutes. Finally, 20 parts by weight of methanol were added, followed by rapid cooling to room temperature. The resulting product had a viscosity of 210 cP (25°C), a solids content of 57%, and a water content of 2150%.

[0147] 23) Phenolic resin composition D for impregnation of adhesive paper (formaldehyde:phenol molar ratio = 1.3:1, 2% methanol, catalyst NaOH)

[0148] Only catechol and 1,8-dihydroxynaphthalene were excluded from the phenolic resin composition A (molar ratio of 1.3, 2% methanol, catalyst KOH) used for impregnation of adhesive paper, and NaOH was used as the catalyst.

[0149] 24) Phenolic resin composition E for impregnation of adhesive paper (formaldehyde:phenol molar ratio = 1.6:1, 1.7% methanol, catalyst NaOH)

[0150] Hydroquinone and 2,3-naphthol were excluded only from the phenolic resin composition B (molar ratio of 1.6, 1.7% methanol, catalyst KOH) used for adhesive paper impregnation, and NaOH was used as the catalyst.

[0151] 25) Phenolic resin composition F for impregnation of adhesive paper (formaldehyde:phenol molar ratio = 1.9:1, 1.5% methanol, catalyst NaOH)

[0152] Only resorcinol and 1,2-dihydroxynaphthalene were excluded from the phenolic resin composition C (molar ratio of 1.9, 1.5% methanol, catalyst KOH) used for impregnation of adhesive paper, and NaOH was used as the catalyst.

[0153] 26) Phenolic resin composition G for impregnation of adhesive paper (formaldehyde:phenol molar ratio = 1.0:1, 2% methanol, catalyst NaOH)

[0154] After adding 591 parts by weight of phenol, 472 parts by weight of formalin (40%), and 90 parts by weight of the first KOH (50%), the mixture was heated to 95°C for 20 minutes. The mixture was then maintained at 95°C until a viscosity of 250 cP (25°C) was achieved. The mixture was then cooled to 75°C, and 110 parts by weight of the second KOH (50%) was added, maintaining the temperature at 80°C until a viscosity of 250 cP (25°C) was achieved. Next, 120 parts by weight of the third KOH (50%) was added, and the mixture was maintained at 60°C for 10 minutes. Then, 27 parts by weight of methanol was added, followed by rapid cooling to room temperature. The resulting product had a viscosity of 260 cP (25°C), a solids content of 60%, and a water content of 1950%.

[0155] 27) Phenolic resin composition H for impregnation of adhesive paper (formaldehyde:phenol molar ratio = 2.1:1, 1.5% methanol, catalyst KOH)

[0156] After adding 282 parts by weight of phenol, 472 parts by weight of formalin (40%), and 90 parts by weight of the first KOH (50%), the mixture was heated to 95°C for 20 minutes. The mixture was then maintained at 95°C until a viscosity of 250 cP (25°C) was achieved. The mixture was then cooled to 75°C, and 110 parts by weight of the second KOH (50%) was added, maintaining the temperature at 80°C until a viscosity of 250 cP (25°C) was achieved. Next, 120 parts by weight of the third KOH (50%) was added, and the mixture was maintained at 60°C for 10 minutes. Then, 16 parts by weight of methanol was added, followed by rapid cooling to room temperature. The resulting product had a viscosity of 260 cP (25°C), a solids content of 62%, and a water content of 1950%.

[0157] 28) Curing accelerator composition I' for adhesive tape impregnation

[0158] A curing accelerator composition I' for adhesive tape impregnation was prepared by mixing 23.4 parts by weight of ethylene carbonate, 21.9 parts by weight of methyl salicylate and 29.6 parts by weight of polyethylene glycolamine.

[0159] 29) Curing accelerator composition II' for adhesive tape impregnation

[0160] A curing accelerator composition II' for adhesive tape impregnation was prepared by mixing 22.8 parts by weight of propylene carbonate, 19.2 parts by weight of phenyl acetate and 32.4 parts by weight of tetraethylenetriamine.

[0161] 30) Curing accelerator composition III' for adhesive tape impregnation

[0162] A curing accelerator composition III' for adhesive tape impregnation was prepared by mixing 23.0 parts by weight of propylene carbonate, 20.3 parts by weight of methyl formate and 31.7 parts by weight of tetraethylenetriamine.

[0163] 31) Curing accelerator composition I for adhesive tape impregnation

[0164] A curing accelerator composition I for adhesive tape impregnation was prepared by mixing 24.2 parts by weight of calcium carbonate, 20.6 parts by weight of cyclohexamethylenetetramine and 30.1 parts by weight of formalin.

[0165] 32) Curing accelerator composition II for adhesive tape impregnation

[0166] A curing accelerator composition II for adhesive tape impregnation was prepared by mixing 20.1 parts by weight of calcium carbonate, 22.8 parts by weight of cyclohexamethylenetetramine and 32.9 parts by weight of formalin (52%).

[0167] 33) Curing accelerator composition III for adhesive tape impregnation

[0168] "A curing accelerator composition III for adhesive tape impregnation was prepared by mixing 21.9 parts by weight of divinylbenzene, 21.4 parts by weight of cyclohexamethylenetetramine and 31.4 parts by weight of formalin (52%)".

[0169] [Example]

[0170] LPM impregnated paper

[0171] Table 1

[0172]

[0173] Adhesive tape

[0174] Table 2

[0175] Example 1 A” I’ 65 Example 2 B” II' 73 Example 3 C” III' 59 Comparative Example 1 D” I” 188 Comparative Example 2 E” II” 150 Comparative Example 3 F” III” 210 Comparative Example 4 G” I” 197 Comparative Example 5 H” III” 223

[0176] Test case

[0177] 1. Test conditions

[0178] Specifications of magnesium oxide board: 6mm thickness, 1000kg / m³ density 3 Meridional strength 15 N / mm 2 Absorption rate 12%

[0179] Base paper type used for LPM impregnation: white paper, weight 65g / m² 2

[0180] Impregnation amount of melamine resin used for LPM impregnation: 51 g / m 2 (Based on the final LPM impregnated paper moisture content of 7.4%)

[0181] Urea impregnation amount for LPM impregnation: 22g / m 2 (Based on the final LPM impregnated paper moisture content of 7.4%)

[0182] The amount of melamine resin crosslinking agent added: 1.3g / m 2

[0183] Base paper type for adhesive tape impregnation: Cover paper 25g / m 2

[0184] Impregnation amount of phenolic resin used for adhesive tape impregnation: 45g / m 2 (Based on the final adhesive tape's moisture content of 5.6%)

[0185] Dosage of phenolic resin curing accelerator: 1.32 g / m³ 2

[0186] Configuration of hot-pressed products: Surface (LPM melamine resin impregnated paper + phenol impregnated paper) + magnesium oxide board + backing (phenol impregnated paper + LPM melamine resin impregnated paper).

[0187] Hot pressing conditions: pressing temperature 158℃, hot pressing time 110 seconds, specific pressure 53 kg / cm² 2

[0188] 2. Test Results

[0189] (1) General property test

[0190] Table 3

[0191]

[0192] Test results showed that Examples 1 to 3 met general property standards, such as abrasion resistance, scratch resistance, and cigarette burn, but Comparative Examples 1 to 5 failed to meet the quality standards. Steam resistance test results showed that Examples 1 to 3 exhibited excellent water resistance, while Comparative Examples 1 to 5 exhibited unfavorable water resistance. In particular, Comparative Examples 1 to 5 showed delamination, cracking, and severe warping.

[0193] (2) Formaldehyde release test

[0194] Table 4

[0195]

[0196] Test results show that Examples 1 to 3 all meet the E0 quality standard of the desiccator method and the environmental department's quality standard for indoor materials of the small chamber method, while Comparative Examples 1 to 5 all show high formaldehyde release exceeding the quality standard.

[0197] (3) Total volatile organic compounds (TVOC), toluene and acetaldehyde release test

[0198] Table 5

[0199]

[0200] Test results show that Examples 1 to 3 all meet the indoor air quality process testing standards.

[0201] (4) Flame retardant test

[0202] Table 6

[0203]

[0204] Test results show that Examples 1 to 3 all meet the quality standards for non-combustible materials.

[0205] (5) Smoke toxicity test

[0206] Table 7

[0207]

[0208] Test results show that Examples 1 to 3 all meet the gas toxicity test standards.

Claims

1. An inorganic processing plate, comprising: Inorganic board; A first adhesive tape is disposed on one surface of the inorganic plate; A first low-pressure melamine (LPM) impregnated paper is disposed on the first adhesive paper; and A second LPM impregnated paper is disposed on one surface of the inorganic board facing the inorganic board. The first LPM-impregnated paper and the second LPM-impregnated paper have an LPM crosslinking density of 70% or less as measured by KSM 3357.

2. An inorganic processing plate, comprising: Inorganic board; A first adhesive tape is disposed on one surface of the inorganic plate; and The first LPM impregnated paper is disposed on the first adhesive paper. The first LPM-impregnated paper has an LPM crosslinking density of 70% or less as measured by KSM 3357.

3. An inorganic processing plate, comprising: Inorganic board; The third LPM impregnated paper is disposed on one surface of the inorganic board and comprises at least two of urea resin, melamine resin, melamine copolymer resin and thermosetting resin. and A fourth LPM impregnated paper, wherein the fourth LPM impregnated paper is disposed on another surface of the inorganic board facing one surface of the inorganic board, and comprises at least two of urea resin, melamine resin, melamine copolymer resin, and thermosetting resin. The third and fourth LPM-impregnated papers have an LPM crosslinking density of 70% or less as measured by KSM 3357.

4. The inorganic processing plate according to any one of claims 1 to 3, wherein, The inorganic board is a magnesium oxide board, a calcium silicate board, a cellulose-reinforced cement board (CRC board), a vermiculite board, or a combination thereof.

5. The inorganic processing plate according to claim 1 or 2, wherein, The first adhesive paper is prepared by impregnating a base paper with a first composition, wherein the base paper has a density of 20 to 60 g / m² per unit area. 2 The weight of the base paper, wherein the first composition comprises a thermosetting adhesive resin.

6. The inorganic processing plate according to claim 5, wherein, The weight ratio of the thermosetting adhesive resin to the base paper is 55% to 72.7%.

7. The inorganic processing plate according to claim 5, wherein, The moisture content of the first adhesive tape is 5% to 7%.

8. The inorganic processing plate according to claim 5, wherein, The thermosetting adhesive resin is a phenol-formaldehyde resin in which the molar ratio of formaldehyde to phenol is 1.2 to 1.9, or a copolymer thereof.

9. The inorganic processing plate according to claim 5, wherein, The first composition further comprises a curing accelerator selected from carbonates, ester compounds, amine compounds, or any mixture of these materials.

10. The inorganic processing plate according to claim 1, wherein, The first LPM-impregnated paper and the second LPM-impregnated paper are prepared by impregnating base paper with a second composition and a third composition, wherein the second composition comprises urea-formaldehyde resin or a copolymer thereof, and the third composition comprises melamine-formaldehyde resin or a copolymer thereof.

11. The inorganic processing plate according to claim 10, wherein, In the urea-formaldehyde resin or its copolymer resin, the molar ratio of formaldehyde to urea is 1.4 to 2.0; and in the melamine-formaldehyde resin or its copolymer resin, the molar ratio of formaldehyde to melamine is 1.4 to 2.

0.

12. The inorganic processing plate according to claim 10, wherein, The second composition further comprises a property modifier, wherein the property modifier is a urea compound.

13. The inorganic processing plate according to claim 10, wherein, The third composition further comprises a property modifier, which is a polyhydroxy aldehyde compound.

14. The inorganic processing plate according to claim 10, wherein, The third composition further comprises a crosslinking agent selected from cyanoguanidine, triethyl phosphate, polyethylene glycol, or any mixture of these materials.

15. The inorganic processing plate according to claim 1, wherein, The first LPM impregnated paper and the second LPM impregnated paper may be the same as or different from each other.

16. The inorganic processing plate according to claim 1, wherein the inorganic processing plate further comprises a second adhesive paper disposed between the inorganic plate and the second LPM impregnated paper.

17. The inorganic processing plate according to claim 16, wherein, The second adhesive tape may be the same as or different from the first adhesive tape.

18. The inorganic processing plate according to claim 3, wherein, The third LPM impregnated paper and the fourth LPM impregnated paper may be the same as or different from each other.

19. A method for manufacturing an inorganically processed plate, the method comprising: The first adhesive tape is pressed onto one surface of the inorganic board; The first LPM-impregnated paper is laminated onto the first adhesive paper; A second LPM impregnated paper is laminated on the other surface of the inorganic board, facing one surface of the inorganic board, to form a laminate; as well as The laminate is hot-pressed. The first LPM-impregnated paper and the second LPM-impregnated paper have an LPM crosslinking density of 70% or less as measured by KSM 3357.

20. A method for manufacturing an inorganically processed plate, the method comprising: The first adhesive tape is pressed onto one surface of the inorganic board; The first LPM-impregnated paper is laminated onto the first adhesive paper; The second adhesive tape is pressed onto the other surface of the inorganic board, which faces one surface of the inorganic board. The second LPM impregnated paper is laminated onto the second adhesive paper to form a laminate; as well as The laminate is hot-pressed. The first LPM-impregnated paper and the second LPM-impregnated paper have an LPM crosslinking density of 70% or less as measured by KSM 3357.

21. A method for manufacturing an inorganically processed plate, the method comprising: The first adhesive tape is pressed onto one surface of the inorganic board; The first LPM impregnated paper is laminated onto the first adhesive paper to form a laminate; as well as The laminate is hot-pressed. The first LPM-impregnated paper has an LPM crosslinking density of 70% or less as measured by KSM 3357.

22. A method for manufacturing an inorganically processed plate, the method comprising: A paper laminate prepared by impregnating base paper with a fourth composition is pressed onto at least one surface of an inorganic board to form a laminate, said fourth composition comprising melamine resin and at least two of phenol resin, formaldehyde resin, and urea resin; and The laminate is hot-pressed. The paper described therein has a crosslinking density of 70% or less as measured by KSM 3357.

23. The method according to any one of claims 19 to 22, wherein, In the hot pressing of the laminate, the hot pressing temperature is 140°C to 160°C.

24. The method according to any one of claims 19 to 22, wherein, In the hot pressing of the laminate, the hot pressing time is 50 to 120 seconds.

25. The method according to any one of claims 19 to 22, wherein, In the hot-pressing of the laminate, the hot-pressing specific pressure is 30 bar / cm. 2 Up to 60 bar / cm 2 .

26. An inorganically processed plate manufactured by any one of claims 19 to 22.

27. An adhesive paper prepared by impregnating a base paper with a first composition, the base paper having a g / m² content of 20 to 60 g / m². 2 The weight of the base paper, wherein the first composition comprises: a thermosetting adhesive resin, and a curing accelerator selected from carbonates, ester compounds, and amine compounds.

28. The adhesive tape according to claim 27, wherein, The thermosetting adhesive resin is phenol-formaldehyde resin or its copolymer resin.

29. The adhesive tape according to claim 27, wherein, The weight ratio of the thermosetting adhesive resin to the base paper is 55% to 72.7%.

30. The adhesive tape according to claim 27, wherein, The moisture content is 5% to 7%.

31. A low-pressure melamine (LPM) impregnated paper, said LPM impregnated paper being prepared by impregnating a base paper with a second composition comprising a urea-formaldehyde resin or a copolymer thereof and a third composition comprising a melamine-formaldehyde resin or a copolymer thereof, and said LPM impregnated paper having an LPM crosslinking density of 70% or less as measured by KSM 3357.

32. The LPM impregnated paper according to claim 31, wherein, The second composition further comprises a property modifier, wherein the property modifier is a urea compound.

33. The LPM impregnated paper according to claim 31, wherein, The third composition further comprises a property modifier, which is a polyhydroxy aldehyde compound.

34. The LPM impregnation plate according to claim 31, wherein, The third composition further comprises a crosslinking agent selected from cyanoguanidine, triethyl phosphate, polyethylene glycol, or any mixture of these materials.

Images