A heat dissipation structure for a mobile terminal and a mobile terminal

Abstract

This invention belongs to the field of mobile terminal technology, specifically a heat dissipation structure for a mobile terminal. This heat dissipation structure is disposed within the casing of the mobile terminal, comprising an air intake component on one side of the casing and an exhaust component on the other side, and also includes a control motherboard. An airflow guiding mechanism is also disposed within the casing, facing the control motherboard, and guides the cooling airflow onto the control motherboard for rapid heat dissipation. The airflow guiding mechanism includes a support ring cover that is unidirectionally rotatable within the casing, and a limiting mechanism is also provided within the casing to restrict the rotation direction of the support ring cover. This invention also provides a mobile terminal including the aforementioned heat dissipation structure. The heat dissipation structure provided by this invention allows for flexible use, allowing for the selection of either a high-throughput cooling method or a fixed-point cooling method based on the heat dissipation requirements of the control motherboard.

Description

Technical Field

[0001] This invention relates to the field of mobile terminals, specifically a heat dissipation structure for a mobile terminal and a mobile terminal. Background Technology

[0002] In high-power usage scenarios, mobile terminals generate a lot of heat, resulting in high device temperatures. If the heat generated by the mobile terminal cannot be dissipated in time, the temperature of the mobile terminal will continue to rise, which will seriously affect the operating speed of the mobile terminal. Furthermore, if the mobile terminal is in a high-temperature state for a long time, it will seriously affect the lifespan of the mobile terminal.

[0003] The heat dissipation structure proposed in the prior art mainly consists of heat sinks and exhaust fans. The heat of the mobile terminal is transferred to the heat dissipation system through heat transfer between objects. The exhaust fan on the heat dissipation system accelerates the airflow. Although it can improve the heat dissipation effect to a certain extent, the single-structure exhaust fan heat dissipation method is inflexible. It can only accelerate the airflow inside the terminal device casing as a whole. It cannot provide centralized heat dissipation and cooling for localized overheating areas inside the terminal device, nor can it provide targeted heat dissipation for overheated components. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation structure for a mobile terminal and a mobile terminal, thereby solving the technical problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution.

[0006] In a first aspect, in an embodiment of the present invention, a heat dissipation structure for a mobile terminal is provided. The heat dissipation structure is disposed within the housing of the mobile terminal, and includes an air intake assembly on one side of the housing and an exhaust assembly on the other side of the housing.

[0007] It also includes a control motherboard, which is fixedly installed inside the housing by a mounting grille plate;

[0008] The housing is also equipped with an airflow guiding mechanism, which faces the control motherboard and guides the heat dissipation airflow onto the control motherboard to quickly dissipate heat from the control motherboard.

[0009] The airflow guiding mechanism includes a support ring cover, which is rotatably disposed within the housing. A limiting mechanism for restricting the rotation direction of the support ring cover is also provided within the housing.

[0010] As a further limitation of the present invention, the airflow guiding mechanism further includes a first flow guiding component. The first flow guiding component includes a flow guiding base plate, and a support ring cover is coaxially fixed on the outer peripheral surface of the flow guiding base plate. Multiple fan-shaped grooves are arranged in a circumferential array at equal intervals on the flow guiding base plate. Each fan-shaped groove is machined with a fan-shaped ventilation opening. When the fan-shaped ventilation opening is not blocked, the airflow can directly pass through the fan-shaped ventilation opening to realize a large flow of airflow directly blowing towards the control main board.

[0011] As a further limitation of the present invention, the airflow guiding mechanism further includes a second flow guiding component. The second flow guiding component includes a support, which is coaxially rotatably connected to the flow guiding substrate. Multiple fan-shaped cover plates are arranged in a circumferential array at equal intervals on the support. The multiple fan-shaped cover plates correspond one-to-one with multiple fan-shaped slots. Each fan-shaped cover plate is provided with a fan body, and the distance between each fan body and the central axis of the support is different.

[0012] As a further limitation of the present invention, the flow guiding substrate is also provided with a plurality of torsion springs, each torsion spring having a first torsion bar and a second torsion bar. The flow guiding substrate is also fixedly provided with a plurality of positioning posts, each positioning post corresponding to a plurality of torsion springs. The first torsion bar abuts against the positioning post, and the second torsion bar abuts against the corresponding fan-shaped cover plate. Under the elastic support of the torsion springs, the fan-shaped cover plate covers the fan-shaped ventilation opening.

[0013] As a further limitation of the present invention, the rotation of the support ring is driven by a forward and reverse motor, which is installed inside the housing, and the drive shaft of the forward and reverse motor is coaxially and fixedly connected to the support.

[0014] As a further limitation of the present invention, the limiting mechanism includes a limiting seat fixedly disposed in the housing, a limiting block slidably disposed on the limiting seat by a supporting spring, a limiting inclined surface on one side of the limiting block, and a plurality of limiting grooves evenly spaced on the outer ring of the supporting ring cover. Under the elastic support of the supporting spring, the limiting block abuts against the limiting groove. Since the limiting block has a limiting inclined surface machined on one side, under the limiting action of the limiting groove, the supporting ring cover can only rotate in one direction and cannot rotate in the opposite direction.

[0015] Secondly, in an embodiment of the present invention, a mobile terminal is provided, which includes the mobile terminal heat dissipation structure provided in the first aspect above.

[0016] As a further limitation of the present invention, the air intake assembly includes an air intake fan, which is mounted on the housing, and the air intake assembly also includes an air intake grille plate mounted on the housing, which corresponds to the air intake fan and is used to protect the air intake fan.

[0017] As a further limitation of the present invention, the exhaust assembly includes an exhaust fan, which is mounted on the housing, and the exhaust assembly also includes an exhaust grille plate mounted on the housing, which corresponds to the exhaust fan and is used to protect the exhaust fan.

[0018] Compared with the prior art, the beneficial effects of the heat dissipation mechanism and mobile terminal provided by the present invention are:

[0019] First, the heat dissipation structure provided by this invention allows for flexible use by selecting either a high-throughput heat dissipation method or a fixed-point heat dissipation method based on the heat dissipation requirements of the control motherboard.

[0020] Second, in the high-throughput heat dissipation method, the support is rotated counterclockwise. Since the support ring cannot rotate counterclockwise, the support ring is in a fixed state, which can drive the fan-shaped cover to rotate counterclockwise, so that the fan-shaped cover moves away from the fan-shaped vent. At this time, the heat dissipation airflow blows directly from the fan-shaped vent to the control motherboard.

[0021] Secondly, in the fixed-point heat dissipation method, when the forward and reverse motor drives the support to rotate clockwise, and with the elastic support of the second torsion bar on the fan-shaped cover plate, the fan-shaped cover plate can always cover the fan-shaped ventilation opening when the support rotates. When the fan body is aligned with the designated position of the control board, the forward and reverse motor stops. Because the second torsion bar supports the fan-shaped cover plate, the fan-shaped cover plate can still be in the state of covering the fan-shaped ventilation opening. At this time, starting the current fan body can achieve fixed-point heat dissipation. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention.

[0023] Figure 1 This is a schematic diagram of the mobile terminal heat dissipation structure and the mobile terminal of the present invention;

[0024] Figure 2 This is a schematic diagram of the airflow guiding mechanism of the present invention in a high-flux state;

[0025] Figure 3 This is a schematic diagram of the airflow guiding mechanism of the present invention in a directional flow guiding state;

[0026] Figure 4 This is a schematic diagram of the first airflow guiding component in the airflow guiding mechanism of the present invention;

[0027] Figure 5 This is a schematic diagram of the second airflow guiding component in the airflow guiding mechanism of the present invention;

[0028] Figure 6This is a schematic diagram of the motion path of the fan body in the second airflow guiding component of the present invention;

[0029] Figure 7 for Figure 1 A magnified view of a portion of point A in the middle.

[0030] The attached figures are labeled as follows:

[0031] 100. Housing; 101. Exhaust fan; 1011. Exhaust grille; 102. Intake fan; 1021. Intake grille; 103. Forward and reverse motor; 1031. Drive shaft; 104. Support block;

[0032] 200. Control mainboard; 201. Install grille plate;

[0033] 300. Support ring cover; 301. Limiting groove; 302. Guide plate; 303. Fan-shaped groove; 304. Fan-shaped vent; 305. Torsion spring; 306. Positioning post; 307. First torsion bar; 308. Second torsion bar;

[0034] 400. Limiting seat; 401. Limiting block; 4011. Limiting inclined surface; 402. Supporting spring;

[0035] 500, Support; 501, Sector-shaped cover plate; 502, Fan body. Detailed Implementation

[0036] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0037] Example 1

[0038] like Figure 1 As shown, in this embodiment of the invention, a heat dissipation structure for a mobile terminal is provided. The heat dissipation structure is disposed inside the housing 100 of the mobile terminal. The heat dissipation structure is provided with an air intake component on one side of the housing 100 and an air exhaust component on the other side of the housing 100. Based on the cooperation between the air intake component and the air exhaust component, the rapid exchange of airflow inside and outside the housing 100 is realized to ensure the heat dissipation effect on the components to be cooled inside the housing 100.

[0039] In this embodiment of the invention, the component to be cooled is a control motherboard 200, which is fixedly installed in the housing 100 by a mounting grille plate 201.

[0040] Furthermore, an airflow guiding mechanism is also provided inside the housing 100. The airflow guiding mechanism faces the control motherboard 200 and guides the heat dissipation airflow onto the control motherboard 200 to quickly dissipate heat from the control motherboard 200.

[0041] Please continue reading. Figure 1 , Figure 2 and Figure 7 In this embodiment of the invention, the airflow guiding mechanism includes a support ring cover 300, which is unidirectionally rotatable within the housing 100. The housing 100 is also provided with a limiting mechanism for restricting the rotation direction of the support ring cover 300.

[0042] The airflow guiding mechanism further includes a first flow guiding component, which includes a flow guiding base plate 302. A support ring cover 300 is coaxially fixed on the outer peripheral surface of the flow guiding base plate 302. The flow guiding base plate 302 is provided with a plurality of fan-shaped grooves 303 arranged in a circumferential array at equal intervals. Each fan-shaped groove 303 is machined with a fan-shaped ventilation opening 304. When the fan-shaped ventilation opening 304 is not blocked, the airflow can directly pass through the fan-shaped ventilation opening 304, so that a large flow of airflow can be directly blown to the control main board 200.

[0043] Furthermore, the airflow guiding mechanism also includes a second flow guiding component, which includes a support 500. The support 500 is coaxially rotatably connected to the flow guiding base plate 302. The support 500 is provided with a plurality of fan-shaped cover plates 501 arranged in a circumferential array at equal intervals. The plurality of fan-shaped cover plates 501 correspond one-to-one with a plurality of fan-shaped slots 303. Each fan-shaped cover plate 501 is provided with a fan body 502. The distance between each fan body 502 and the central axis of the support 500 is different.

[0044] For example, there are three sector-shaped slots 303 and three sector-shaped cover plates 501, such as... Figure 5 and Figure 6 As shown, when the support 500 rotates, the movement paths of the three fan bodies 502 are path a, path b and path c, respectively. The radius of path a is R1, the radius of path b is R2 and the radius of path c is R3, where R1 > R2 > R3.

[0045] In this embodiment of the invention, the opening and closing of each fan body 502 are independent of each other, that is, one or more fan bodies 502 can be controlled to open or close independently.

[0046] For further information, please refer to [link / reference]. Figures 2-6 The flow guiding substrate 302 is also provided with a plurality of torsion springs 305, each torsion spring 305 having a first torsion bar 307 and a second torsion bar 308. The flow guiding substrate 302 is also fixedly provided with a plurality of positioning posts 306, each corresponding to one of the torsion springs 305. The first torsion bar 307 abuts against the positioning post 306, and the second torsion bar 308 abuts against the corresponding fan-shaped cover plate 501. Under the elastic support of the torsion springs 305, the fan-shaped cover plate 501 covers the fan-shaped ventilation opening 304, sealing the fan-shaped ventilation opening 304. The sealing state is as follows: Figure 3As shown, in this state, the cooling airflow cannot pass through the fan-shaped vent 304. The cooling airflow passes through under the guidance of the corresponding fan body 502. In other words, in Figure 3 In the indicated state, the corresponding fan body 502 can be started as needed, and the support ring cover 300 can be rotated clockwise to align the started fan body 502 with the area on the control motherboard 200 that needs to be cooled, thereby achieving the effect of fixed-point cooling.

[0047] As a preferred option, such as Figure 2 and Figure 3 As shown, the rotation of the support ring cover 300 is driven by the forward and reverse motor 103, which is installed inside the housing 100. The drive shaft 1031 of the forward and reverse motor 103 is coaxially and fixedly connected to the support 500. When the forward and reverse motor 103 drives the support 500 to rotate clockwise, and with the elastic support of the second torsion bar 308 on the fan-shaped cover plate 501, the fan-shaped cover plate 501 always covers the fan-shaped ventilation opening 304 when the support 500 rotates. When the fan body 502 is aligned with the designated position of the control motherboard 200, the forward and reverse motor 103 stops. At this time, because the second torsion bar 308 supports the fan-shaped cover plate 501, the fan-shaped cover plate 501 is still in the state of covering the fan-shaped ventilation opening 304. At this time, starting the current fan body 502 can achieve point-to-point heat dissipation.

[0048] In the high-flow heat dissipation method, the support 500 is rotated counterclockwise. Since the support ring cover 300 cannot rotate counterclockwise, the support ring cover 300 is in a fixed state, which can drive the fan-shaped cover 501 to rotate counterclockwise, so that the fan-shaped cover 501 is moved away from the fan-shaped vent 304. At this time, the heat dissipation airflow blows directly from the fan-shaped vent 304 to the control motherboard 200.

[0049] Understandably, since the radii of the movement paths of the multiple fan bodies 502 are different, they can effectively cover the specified positions on the control motherboard 200.

[0050] like Figure 1 , Figure 2 and Figure 7 As shown, the limiting mechanism includes a limiting seat 400 fixedly disposed within the housing 100. A limiting block 401 is slidably disposed on the limiting seat 400 by a supporting spring 402. One side of the limiting block 401 has a limiting inclined surface 4011. The outer ring of the supporting ring cover 300 is provided with multiple limiting grooves 301 at equal intervals. Under the elastic support of the supporting spring 402, the limiting block 401 abuts against the limiting groove 301. Since the limiting block 401 has a limiting inclined surface 4011 processed on one side, under the limiting action of the limiting groove 301, the supporting ring cover 300 can only rotate in one direction and cannot rotate in the opposite direction.

[0051] For further information, please refer to [link / reference]. Figure 7 The housing 100 is also provided with a support block 104 for supporting the support ring cover 300.

[0052] In summary, the heat dissipation structure provided by this invention allows for flexible use by selecting either a high-throughput heat dissipation method or a fixed-point heat dissipation method based on the heat dissipation requirements of the control motherboard 200.

[0053] Example 2

[0054] This invention provides a mobile terminal, which includes the heat dissipation structure of the mobile terminal provided in Embodiment 1 above.

[0055] Furthermore, the air intake assembly in this embodiment of the invention includes an air intake fan 102, which is disposed on the housing 100. The air intake assembly also includes an air intake grille 1021 disposed on the housing 100. The air intake grille 1021 corresponds to the air intake fan 102 and is used to protect the air intake fan 102.

[0056] Furthermore, the exhaust assembly in this embodiment of the invention includes an exhaust fan 101, which is disposed on the housing 100. The exhaust assembly also includes an exhaust grille 1011 disposed on the housing 100, which corresponds to the exhaust fan 101 and is used to protect the exhaust fan 101.

[0057] The above solutions are merely illustrative examples of preferred embodiments and are not intended to limit the scope of the invention. Appropriate substitutions and / or modifications can be made according to user needs when implementing this invention.

[0058] The number of devices and processing scale described herein are for the purpose of simplifying the description of the invention. Applications, modifications, and variations of the invention will be readily apparent to those skilled in the art.

[0059] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. It can be applied to various fields suitable for the present invention. Other modifications can be readily made by those skilled in the art. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and examples shown and described herein.

Claims

1. A heat dissipation structure for a mobile terminal, wherein the heat dissipation structure is disposed within the housing (100) of the mobile terminal; Its features are: The heat dissipation structure includes an air intake assembly on one side of the housing (100) and an exhaust assembly on the other side of the housing (100). It also includes a control motherboard (200), which is fixedly installed in the housing (100) by means of a mounting grille plate (201); An airflow guiding mechanism is also provided inside the housing (100), and the airflow guiding mechanism faces the control main board (200); the airflow guiding mechanism includes a support ring cover (300), which is unidirectionally rotatable inside the housing (100), and a limiting mechanism for limiting the rotation direction of the support ring cover (300) is also provided inside the housing (100); the airflow guiding mechanism also includes a first flow guiding assembly, which includes a flow guiding base plate (302), and a plurality of torsion springs (305) are provided on the flow guiding base plate (302), and the torsion springs (305) have a first torsion bar (307) and a second torsion bar (308). 02) Multiple positioning posts (306) are also fixedly installed on it. Multiple positioning posts (306) correspond one-to-one with multiple torsion springs (305). The first torsion bar (307) abuts against the positioning post (306), and the second torsion bar (308) abuts against the corresponding fan-shaped cover plate (501). Under the elastic support of the torsion spring (305), the fan-shaped cover plate (501) covers the fan-shaped ventilation opening (304). The rotation of the support ring cover (300) is driven by a forward and reverse motor (103). The forward and reverse motor (103) is installed in the housing (100). The drive shaft (1031) of the forward and reverse motor (103) is coaxially fixedly connected to the support (500). The support ring cover (300) is coaxially fixed on the outer peripheral surface of the flow guide plate (302); The flow guide substrate (302) has multiple fan-shaped slots (303) arranged in a circumferential array at equal intervals, and each fan-shaped slot (303) has a fan-shaped ventilation opening (304) processed in it. The airflow guiding mechanism further includes a second flow guiding component, which includes a support (500). The support (500) and the flow guide plate (302) are coaxially rotatably connected. Multiple fan-shaped cover plates (501) are arranged in a circumferential array at equal intervals on the support (500). The multiple fan-shaped cover plates (501) correspond one-to-one with the multiple fan-shaped grooves (303). Each sector cover (501) is provided with a fan body (502); The distance between the central axis of each fan body (502) and the support (500) is different.

2. The mobile terminal heat dissipation structure according to claim 1, wherein The limiting mechanism includes a limiting seat (400) fixedly disposed in the housing (100), and a limiting block (401) is slidably disposed on the limiting seat (400) by a supporting spring (402). One side of the limiting block (401) has a limiting inclined surface (4011). The outer ring of the support ring cover (300) is provided with multiple limiting grooves (301) at equal intervals. Under the elastic support of the support spring (402), the limiting block (401) abuts against the limiting groove (301).

3. A mobile terminal, characterized by The mobile terminal includes the mobile terminal heat dissipation structure as described in claim 1 or 2.

4. The mobile terminal according to claim 3, characterized in that, The air intake assembly includes an air intake fan (102), which is mounted on the housing (100). The air intake assembly also includes an air intake grille (1021) mounted on the housing (100), which corresponds to the air intake fan (102).

5. The mobile terminal according to claim 4, characterized in that, The exhaust assembly includes an exhaust fan (101) which is mounted on the housing (100), and the exhaust assembly also includes an exhaust grille (1011) mounted on the housing (100), which corresponds to the exhaust fan (101).

Images