A processing technology for large quartz plates

Abstract

This application belongs to the technical field of quartz slab processing, and particularly relates to a processing technology for quartz slabs, including the following steps: S1. Blanking, optimizing the blanking of Plate 1 and Plate 2; S2. Surface grinding, grinding Plate 1 and Plate 2 flat; S4. Laser processing, performing laser processing on Plate 1 and Plate 2; S5. After MC of Plate 1, sintering Plate 1 and Plate 2 precisely; S6. Flattening the flatness, flattening the surfaces of Plate 1 and Plate 2 by applying pressure to obtain a new flatness; S7. Preliminary welding, assembling and welding Plate 1 and Plate 2, grinding and flattening the flatness; S8. Re-welding, performing side plate assembly welding on Plate 1 and Plate 2 after welding, and welding the side plates to Plate 1 and Plate 2; S9. Final product precise sintering, performing flame polishing on the quartz surface through a polishing device to make the surface of the quartz product reach a mirror state; S10. Cleaning, ensuring the cleanliness of the product through cleaning to obtain a quartz slab.

Description

Technical Field

[0001] This application belongs to the technical field of quartz slab processing, and particularly relates to a processing technology for quartz slabs. Background Art

[0002] Semiconductor quartz epitaxial large slabs are common quartz consumables that must be used in the epitaxial process in the semiconductor processing industry. With the rapid development of the semiconductor industry, the demand growth rate is very fast. The traditional processing technologies for semiconductor quartz epitaxial large slabs are all composed of multiple steps and assembled cumulatively. The processing steps are numerous, the processing flatness is poor, the cracking rate of products is very high, the first-pass yield and production capacity are low, and it cannot meet the current large demand for semiconductor quartz epitaxial large slabs in the semiconductor processing industry. Summary of the Invention

[0003] The purpose of this application is to provide a processing technology for quartz slabs that can solve the above problems.

[0004] The purpose of this application is to provide a processing technology for quartz slabs, including the following steps:

[0005] S1. Blanking, optimizing the blanking of plate 1 and plate 2;

[0006] S2. Surface grinding, surface grinding plate 1 and plate 2;

[0007] S3. Laser processing, performing laser processing on plate 1 and plate 2;

[0008] S4. After MC for plate 1, firing plate 1 and plate 2 precisely;

[0009] S5. Pressing flatness, pressing the surfaces of plate 1 and plate 2 to obtain a new flatness;

[0010] S6. Preliminary welding, assembling, welding, grinding and pressing flatness for plate 1 and plate 2;

[0011] S7. Re-welding, performing side plate assembly welding on plate 1 and plate 2 after welding, and welding the side plates to plate 1 and plate 2;

[0012] S8. Final product precise firing, performing flame polishing on the quartz surface through a polishing device to make the surface of the quartz product reach a mirror state;

[0013] S9. Cleaning, ensuring the cleanliness of the product through cleaning to obtain a quartz slab.

[0014] Adopting the above processing technology for quartz large plates simplifies the processing steps, improves the first-pass yield and production capacity. At the same time, through the optimization of the segmented assembly and welding process for semiconductor quartz epitaxial large plates; by optimizing the segmented processing control method, the forming qualification rate of workpieces is improved. In addition, compared with the traditional process which is made in multiple steps, this application realizes optimized segmentation and batch production optimization process. Using the flatness control of semiconductor quartz epitaxial large plates and the precision firing process control of extra-large plates, high-quality and efficient batch production is carried out.

[0015] In this application, S1 can optimize cost control and improve quartz utilization rate; S2 can improve the cutting accuracy, finish the first fine grinding in one step, and improve processing efficiency; S2 can improve the dimensional accuracy of processed parts; S6 can ensure the qualification of nesting processing, carry out nesting assembly welding, and control the generation of defects; S8 uses the optimized segmentation control method to improve the qualification rate and processing efficiency of engineering products; S10 can ensure that the products meet the cleanliness requirements of quartz products for semiconductor processing. After washing, they need to pass inspection before being warehoused as finished products. And before the S9 step, they need to be washed once through the engineering process. Before the washing in S10, the flatness needs to be pressed one last time. The optimized process of this application can efficiently improve the processing quality in batches and produce beautiful semiconductor quartz epitaxial large plates.

[0016] Furthermore, the polishing equipment includes:

[0017] A base, on which a slide rail is provided;

[0018] A clamping mechanism for clamping the quartz large plate and capable of moving the quartz large plate along the slide rail;

[0019] A flame spray gun, which is arranged on the base and used for flame polishing the quartz large plate, and a support base capable of moving up and down is arranged at the bottom of the flame spray gun;

[0020] A driving mechanism for driving the clamping mechanism to move on the slide rail;

[0021] A control device, which is connected to the control device, the clamping device, the flame spray gun and the driving mechanism;

[0022] Wherein, during the process of the driving mechanism driving the quartz large plate to move, the flame spray gun sprays flames to polish the quartz large plate.

[0023] The polishing equipment here is a device for radial flame polishing. Quartz is polished by flame to make its surface reach a mirror state. During polishing, through corresponding transportation equipment such as grippers and conveyor belts, the large quartz plate is transported to the base, and the large quartz plate is clamped by the clamping mechanism. After clamping, the driving mechanism drives the clamping mechanism to move along the slide rail. During the movement, the flame spray gun is turned on and flame polishing is performed on the large quartz plate. Here, there are two groups of flame spray guns, which are arranged on both sides of the clamping mechanism and can polish one side or both sides of the large quartz plate. At the same time, in order to enable the entire surface of the quartz to be processed, a support base is set at the bottom of the flame spray gun, and the support base can move up and down, thus expanding the polishing range.

[0024] Further: The clamping mechanism includes:

[0025] A sliding seat, which is arranged on the slide rail and cooperates with the slide rail, and a groove is arranged on the sliding seat;

[0026] A placing seat, which is arranged on the groove and is used for placing the large quartz plate;

[0027] Clamping plates, which are arranged in the groove and on both sides of the groove;

[0028] A driver, which is arranged on the sliding seat and is used to drive the clamping plates to move;

[0029] Among them, when the sliding seat drives the large quartz plate to move, the flame spray gun performs flame polishing on both sides of the large quartz plate through the groove.

[0030] The clamping mechanism is mainly used to clamp the large quartz plate for processing to prevent it from shaking or falling. When fixing, the large quartz plate is placed into the groove, and then the driver is turned on. The driver drives the clamping plates to move and clamp the large quartz plate. Among them, by setting a placing seat on the groove, the large quartz plate contacts the placing seat when being fixed.

[0031] Further, an adjusting device is arranged on the placing seat, and the adjusting device includes:

[0032] A connecting rod, which is arranged on the sliding seat and is connected to the driving mechanism;

[0033] An adjusting groove, which is arranged in the sliding seat and below the placing seat;

[0034] A slider, which is arranged in the adjusting groove and can slide up and down in the adjusting groove, and a plurality of sliding rods penetrating through the adjusting groove are arranged at the top of the slider, and the other ends of the sliding rods are connected to the placing seat;

[0035] A chamber, which is arranged inside the slider, and an inner plate body is arranged in the chamber, and inner springs are arranged on both sides of the inner plate body;

[0036] An outer plate body is arranged in the adjustment groove and below the slider. Multiple long rods are arranged on the top of the outer plate body, and one end of the long rod far from the outer plate body is connected to the inner plate body;

[0037] A contact assembly includes a first contact block arranged at the bottom of the outer plate body and a second contact block arranged at the bottom of the adjustment groove;

[0038] Among them, the first contact block and the second contact block are connected to the control device.

[0039] Since each large quartz plate has a weight, and different large quartz plates have different weights, different weights require different forces to push. If the thrust is too small, it will cause the large plate not to be pushed properly, and if the thrust is too large, it will cause the misalignment of the position of the large quartz plate, affecting the subsequent polishing work. In this application, by setting an adjustment device, the thrust of the driver can be adjusted so that it can cooperate in real time with the change in the weight of the quartz stone plate. After the quartz stone plate is placed on the placement seat, the placement seat is pressed and sinks, and drives the slider to move downward in the adjustment groove through the sliding rod. The sliding rod and the adjustment groove are connected through a linear bearing, thereby reducing the friction. The movement of the slider will drive the inner plate body to move together, and the inner plate body will drive the outer plate body to move downward through the long rod body until the first contact block at the bottom of the outer plate body contacts the second contact block. At this time, the adjustment function of the control device for the driver will be turned on. In this application, no matter how heavy the quartz stone plate placed on the placement seat is, the first contact block and the second contact block will contact.

[0040] At the same time, by arranging inner springs on both sides of the inner plate body, the slider can continue to move after the first contact block and the second contact block contact, and will not be affected by the inner plate body and the outer plate body.

[0041] Further, the adjustment device further includes:

[0042] An outer spring is arranged in the adjustment groove, and both ends of the outer spring are in contact with the slider and the bottom of the adjustment groove respectively;

[0043] A connecting block is arranged on the side wall of the slider. A contact groove for the connecting block to slide is arranged on the inner wall of the adjustment groove, and a contact head is arranged on the connecting block;

[0044] A storage groove is arranged on the inner wall of the adjustment groove and communicated with the contact groove. A column is arranged in the storage groove, and a resistance wire is wound around the column;

[0045] Among them, the resistance wire is in contact with the contact head.

[0046] The setting of the outer spring has multiple functions. That is, it can cooperate with the inner spring to support and buffer the movement of the slider, prevent the slider from moving down too quickly under pressure, and can also improve the support effect of the slider. At the same time, it is also used for the reset of the slider. When the quartz stone plate leaves the placement seat, the outer spring will assist the slider to reset and wait for the next operation.

[0047] In order to accurately adjust the thrust, the present application also provides a connecting block. The connecting block is installed on the slider. When the slider moves, it will drive the connecting block to move together. As the slider gradually moves down, the contact head located on the connecting block will contact the resistance wire on the column. The heavier the weight of the quartz large plate, the greater the pressure on the placement seat, the greater the distance the slider moves down, and the contact head will also gradually move down with the slider. While the lighter the weight of the quartz stone plate, the slider will drive the contact head to move up. As the position of the contact head changes, the resistance of the resistance wire will also change. After the first contact block contacts the second contact block, the resistance wire is energized. When the contact head moves up, the resistance increases and the current decreases, and the control device controls the thrust adjustment of the driver to become smaller. When the contact head moves down, the resistance decreases and the current increases, and the control device controls the thrust adjustment of the driver to become larger according to the change, so that the thrust of the driver can be matched with the weight change of the quartz stone in real time, which not only saves energy but also makes the pushing of the quartz large plate more stable.

[0048] Furthermore, a sliding stability device is provided between the sliding seat and the slide rail. The sliding stability device includes:

[0049] Lateral guide rails, which are arranged on the sliding seat;

[0050] Lateral guide blocks, which are arranged on the slide rail and cooperate with the lateral guide rails;

[0051] Linkage chutes, which are arranged on both sides of the lateral guide rail, and combination blocks are arranged in the linkage chutes;

[0052] Dampers, which are arranged in the lateral guide rail and connected to the lateral guide blocks;

[0053] Among them, the combination blocks are connected to the lateral guide blocks, and the combination blocks are arranged on both sides of the lateral guide blocks.

[0054] Since the flame spray gun can only move in the up and down direction and cannot move horizontally, in order to achieve full polishing, the clamping mechanism drives the entire clamping mechanism to move through a connecting rod, and then drives the large quartz plate to move, so that it can be fully polished. Due to the heavy weight of the large quartz plate and to make the large quartz plate more stable during polishing, the present application is provided with a sliding stability device for assistance. Affected by the driving mechanism, the entire sliding seat moves and drives the lateral guide rail to move. The lateral guide block is installed on the slide rail and thus its position remains unchanged. By setting a damper, the sliding seat will be buffered by the damper when moving, buffering the current movement, thereby reducing the vibration received by the quartz stone plate during movement and ensuring the stability of the polishing work. At the same time, due to the setting of a linkage chute, a combined block is arranged in the linkage chute and is connected to the lateral guide block, and the combined block will move together with the movement of the clamping mechanism.

[0055] Further, the sliding stability device further includes:

[0056] The combined block includes a support guide block and a guiding guide block that are hinged to each other, and the support guide block is connected to the lateral guide block;

[0057] An arc-shaped guide rail, which is arranged on the lateral guide rail and communicates with the linkage chute;

[0058] A limit guiding column, which is arranged in the lateral guide rail and is located at the bending part of the arc-shaped guide rail;

[0059] A damping spring, one end of which is connected to the guiding guide block, and the other end is installed on one side of the damper through a positioning block;

[0060] Wherein, when the support guide block moves to the limit position of the linkage chute, the guiding guide block enters the arc-shaped guide rail and cooperates with the limit guiding column.

[0061] The movement of the sliding seat has certain limitations. The sliding seat can move in two directions, and the moving distance is related to the length of the large quartz plate, and its length is determined by the distance between the clamping plates. In order to further improve the stability of the movement of the sliding seat and the large quartz plate and ensure the stability of the polishing work, the present application also provides an arc-shaped guide rail, a support guide block and a guiding guide block. The support guide block is connected to the lateral guide block, and the lateral guide block does not move. As the driving mechanism moves, the support guide block drives the guiding guide block to move on the linkage chute. A linkage chute is arranged on both sides of the lateral guide block, so combined blocks are arranged on both sides of each lateral guide block. When the support guide block moves to the limit position of the linkage chute, the guiding guide block enters the arc-shaped guide rail and cooperates with the limit guiding column, and the damping spring is connected to the guiding guide block. Therefore, during the cooperation process, the force in the horizontal direction can be dispersed towards the bending direction of the arc-shaped guide rail, thereby further playing a damping and buffering role and ensuring the stability of the large quartz plate moving in two directions and the stability of the polishing work.

[0062] Furthermore, it also includes the following processing steps:

[0063] S1. Fix the large quartz plate through the clamping mechanism;

[0064] S2. The control device controls the flame spray gun to turn on;

[0065] S3. The control device controls the driving mechanism to drive the large quartz plate to move, and at the same time controls the support base to drive the flame spray gun to move up and down to perform flame polishing on the large quartz plate.

[0066] The beneficial effects of this application are as follows:

[0067] 1. By adopting the above processing technology for large quartz plates, the processing steps are simplified, the first-pass qualification rate and production capacity are improved. Compared with the traditional process, the traditional process is made in multiple steps, while this application realizes optimized segmentation and batch production optimization process. Using the flatness control of semiconductor quartz epitaxial large plates and the precise firing process control of extra-large plates, batch production of high-quality and high-efficiency products is carried out;

[0068] 2. The heavier the weight of the large quartz plate, the greater the pressure on the placement seat, the greater the downward movement distance of the slider, and the contact head will gradually move downward with the slider. While the lighter the weight of the quartz stone plate, the slider will drive the contact head to move upward. After the first contact block contacts the second contact block, the resistance wire is energized. When the contact head moves upward, the resistance increases and the current decreases, and the control device controls the thrust adjustment of the driver to become smaller. When the contact head moves downward, the resistance decreases and the current increases, and the control device controls the thrust adjustment of the driver to become larger according to the change, so that the thrust of the driver can be matched with the weight change of the quartz stone in real time, which not only saves energy, but also makes the pushing of the large quartz plate more stable;

[0069] 3. This application is provided with a sliding stability device for assistance. Affected by the driving mechanism, the entire sliding seat moves and drives the lateral guide rail to move. The lateral guide block is installed on the slide rail and thus its position remains unchanged. By setting the damper, the sliding seat will be buffered by the damper when moving, buffering the current movement, thereby reducing the vibration suffered by the quartz stone plate during movement and ensuring the stability of the polishing work. Description of the Drawings

[0070] Figure 1 is the flow chart of the processing technology of the present invention;

[0071] Figure 2 is the structural schematic diagram of plate 1 and plate 2 in the processing technology of the present invention;

[0072] Figure 3 is the structural schematic diagram of the polishing equipment of the present invention;

[0073] Figure 4 is the structural schematic diagram of the polishing equipment of the present invention for clamping the large quartz plate;

[0074] Figure 5 is Figure 4 An enlarged view of A in

[0075] Figure 6 is a schematic diagram of the cooperation between the slide rail and the sliding seat in the present invention;

[0076] Figure 7 is a schematic structural diagram of the sliding stability device of the present invention;

[0077] Figure 8 is a schematic diagram of the internal structure of the sliding stability device of the present invention. In the figure, the reference numerals are: 100, base; 110, slide rail; 210, sliding seat; 221, groove; 220, placement seat; 230, clamping plate; 240, driver; 300, flame spray gun; 400, driving mechanism; 500, adjusting device; 510, connecting rod; 520, adjusting groove; 530, slider; 531, sliding rod; 540, chamber; 541, inner plate body; 542, inner spring; 550, outer plate body; 560, contact assembly; 561, first contact block; 562, second contact block; 570, outer spring; 580, connecting block; 581, contact head; 590, storage groove; 591, upright column; 592, resistance wire; 600, sliding stability device; 610, lateral guide rail; 620, lateral guide block; 630, linkage chute; 640, combined block; 641, support guide block; 642, guiding guide block; 650, damper; 660, arc guide rail; 670, limit guiding column; 680, damping spring. Specific embodiments

[0078] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0079] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. generally belong to the same category, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally represents an "or" relationship between the associated objects.

[0080] The following will, with reference to the accompanying drawings, describe in detail the processing technology of the quartz large plate provided by the embodiments of the present application through specific embodiments and their application scenarios.

[0081] Embodiment 1:

[0082] As Figure 1 and Figure 2 shown, the embodiments of the present application provide a processing technology for quartz large plates, including the following steps:

[0083] S1. Blanking, optimizing the blanking of Plate 1 and Plate 2;

[0084] S2. Surface grinding, surface grinding Plate 1 and Plate 2;

[0085] S3. Laser processing, performing laser processing on Plate 1 and Plate 2;

[0086] S4. After MC of Plate 1, sinter Plate 1 and Plate 2 precisely;

[0087] S5. Pressing flatness, pressing the surfaces of Plate 1 and Plate 2 flat by applying pressure to obtain a new flatness;

[0088] S6. Preliminary welding, assembling, welding, grinding and pressing flatness of Plate 1 and Plate 2;

[0089] S7. Re-welding, performing side plate assembling and welding on Plate 1 and Plate 2 after welding, and welding the side plates to Plate 1 and Plate 2;

[0090] S8. Final product precise sintering, performing flame polishing on the quartz surface through a polishing device to make the surface of the quartz product reach a mirror state;

[0091] S9. Cleaning, ensuring the cleanliness of the product through cleaning to obtain the quartz large plate.

[0092] In some implementation manners of the embodiments of the present application, as Figure 1 shown, adopting the above-mentioned processing technology for quartz large plates simplifies the processing steps, improves the first-pass yield and production capacity. At the same time, through the optimization of the segmented assembly and welding process of semiconductor quartz epitaxial large plates; by optimizing the segmented processing control method, the forming qualification rate of the workpieces is improved. In addition, compared with the traditional process, the traditional process is made in multiple steps, while the present application realizes optimized segmentation and batch production optimization process. Utilizing the flatness control of semiconductor quartz epitaxial large plates and the precise sintering process control of ultra-large plates, batch production of high-quality and high-efficiency products is carried out.

[0093] In this application, S1 can optimize cost control and improve the utilization rate of quartz; S2 can improve the precision of blanking processing, achieve one-time fine grinding in place, and improve processing efficiency; S2 can improve the dimensional accuracy of processed parts; S6 can ensure the qualification of nesting processing, perform nesting assembly welding, and control the generation of defects; S8 uses an optimized segmented control method to improve the qualification rate of engineering products and processing efficiency; S10 can ensure that the products meet the cleanliness requirements and meet the requirements of quartz products for semiconductor processing. The optimized process of this application can improve the processing quality in batches and efficiently, and produce beautiful semiconductor quartz epitaxial large plates.

[0094] Example 2:

[0095] The embodiment of this application provides a processing technology for quartz large plates. In addition to including the above technical features, the processing technology for quartz large plates in the embodiment of this application further includes the following technical features.

[0096] As Figures 3 to 7 shown, the polishing equipment includes:

[0097] A base 100, on which a slide rail 110 is provided;

[0098] A clamping mechanism for clamping the quartz large plate and capable of moving the quartz large plate along the slide rail 110;

[0099] A flame spray gun 300, which is arranged on the base 100 and used for flame polishing the quartz large plate, and a support base capable of moving up and down is arranged at the bottom of the flame spray gun 300;

[0100] A driving mechanism 400, which is used to drive the clamping mechanism to move on the slide rail 110;

[0101] A control device, which is connected to the control device, the clamping device, the flame spray gun 300 and the driving mechanism 400;

[0102] Among them, during the process of the driving mechanism 400 driving the quartz large plate to move, the flame spray gun 300 sprays flames to polish the quartz large plate.

[0103] In the embodiment of the present application, the polishing device herein is a device for radial flame polishing. The quartz is polished by the flame to make its surface reach a mirror state. When polishing, through corresponding transportation devices such as clamping jaws and conveyor belts, the large quartz plate is transported to the base 100, and the large quartz plate is clamped by the clamping mechanism. After clamping is completed, the driving mechanism 400 drives the clamping mechanism to move along the slide rail 110. During the movement, the flame spray gun 300 is turned on and the large quartz plate is flame polished. Here, two groups of flame spray guns 300 are provided, which are arranged on both sides of the clamping mechanism and can polish one side or both sides of the large quartz plate. At the same time, in order to enable the entire surface of the quartz to be processed, a support base is provided at the bottom of the flame spray gun 300, and the support base can move up and down, thus expanding the polishing range.

[0104] Embodiment 3:

[0105] The embodiment of the present application provides a processing technology for large quartz plates. In addition to including the above technical features, the processing technology for large quartz plates in the embodiment of the present application further includes the following technical features.

[0106] As Figure 3 shown, the clamping mechanism includes:

[0107] The sliding seat 210 is arranged on the slide rail 110 and cooperates with the slide rail 110. A groove 221 is provided on the sliding seat 210;

[0108] The placing seat 220 is arranged on the groove 221 and is used for placing the large quartz plate;

[0109] The clamping plates 230 are arranged in the groove 221 and on both sides of the groove 221;

[0110] The driver 240 is arranged on the sliding seat 210 and is used for driving the clamping plates 230 to move;

[0111] Among them, when the sliding seat 210 drives the large quartz plate to move, the flame spray gun 300 performs flame polishing on both sides of the large quartz plate through the groove 221.

[0112] In the embodiment of the present application, the clamping mechanism is mainly used to clamp the large quartz plate for processing to prevent it from shaking or falling. When fixing, the large quartz plate is placed into the groove 221, and then the driver 240 is turned on. The driver 240 drives the clamping plates 230 to move and clamp the large quartz plate. Among them, by providing the placing seat 220 on the groove 221, the large quartz plate contacts the placing seat 220 when being fixed.

[0113] Embodiment 4:

[0114] The embodiment of the present application provides a processing technology for quartz large plates. In addition to including the above technical features, the processing technology for quartz large plates in the embodiment of the present application further includes the following technical features.

[0115] As Figures 4 to 5 shown, an adjusting device 500 is provided on the placing seat 220. The adjusting device 500 includes:

[0116] A connecting rod 510 is arranged on the sliding seat 210 and connected to the driving mechanism 400;

[0117] An adjusting groove 520 is arranged inside the sliding seat 210 and below the placing seat 220;

[0118] A slider 530 is arranged in the adjusting groove 520 and can slide up and down in the adjusting groove 520. A plurality of sliding rods 531 penetrating through the adjusting groove 520 are arranged at the top of the slider 530, and the other ends of the sliding rods 531 are connected to the placing seat 220;

[0119] A chamber 540 is arranged inside the slider 530. An inner plate body 541 is arranged in the chamber 540, and inner springs 542 are arranged on both sides of the inner plate body 541;

[0120] An outer plate body 550 is arranged in the adjusting groove 520 and below the slider 530. A plurality of long rods are arranged at the top of the outer plate body 550, and the ends of the long rods far from the outer plate body 550 are connected to the inner plate body 541;

[0121] A contact assembly 560 includes a first contact block 561 arranged at the bottom of the outer plate body 550 and a second contact block 562 arranged at the bottom of the adjusting groove 520;

[0122] Among them, the first contact block 561 and the second contact block 562 are connected to the control device.

[0123] In the embodiments of the present application, since each large quartz plate has a weight, and different large quartz plates will have different weights, different weights require different forces to push. If the pushing force is too small, it will cause the large plate not to be pushed properly. If the pushing force is too large, it will cause the misalignment of the position of the large quartz plate, affecting the subsequent polishing work. In the present application, by setting the adjusting device 500, the pushing force of the driver 240 can be adjusted so that it can cooperate in real time with the change in the weight of the quartz stone plate. After the quartz stone plate is placed on the placing seat 220, the placing seat 220 is pressed and sinks, and drives the slider 530 to move downward in the adjusting groove 520 through the sliding rod 531. The sliding rod 531 and the adjusting groove 520 are connected through a linear bearing, thereby reducing the friction force. The movement of the slider 530 will drive the inner plate body 541 to move together, and the inner plate body 541 will drive the outer plate body 550 to move downward through the long rod body until the first contact block 561 at the bottom of the outer plate body 550 contacts the second contact block 562. At this time, the control device will activate the adjustment function of the driver 240. In the present application, regardless of the weight of the quartz stone plate placed on the placing seat 220, the first contact block 561 and the second contact block 562 will contact each other.

[0124] At the same time, by arranging inner springs 542 on both sides of the inner plate body 541, the slider 530 can continue to move after the first contact block 561 contacts the second contact block 562, without being affected by the inner plate body 541 and the outer plate body 550.

[0125] Furthermore, the adjusting device 500 further includes:

[0126] An outer spring 570, arranged in the adjusting groove 520, and both ends of the outer spring 570 are in contact with the slider 530 and the bottom of the adjusting groove 520 respectively;

[0127] A connecting block 580, arranged on the side wall of the slider 530, a contact groove for the connecting block 580 to slide is arranged on the inner wall of the adjusting groove 520, and a contact head 581 is arranged on the connecting block 580;

[0128] A receiving groove 590, arranged on the inner wall of the adjusting groove 520 and communicating with the contact groove, a column 591 is arranged in the receiving groove 590, and a resistance wire 592 is wound around the column 591;

[0129] Wherein, the resistance wire 592 is in contact with the contact head 581.

[0130] In some embodiments of the present application, the outer spring 570 has multiple functions. That is, it can cooperate with the inner spring 542 to support and buffer the movement of the slider 530, prevent the slider 530 from moving downward too quickly under pressure, and can also improve the support effect of the slider 530. At the same time, it is also used for the reset of the slider 530. When the quartz stone slab leaves the placement seat 220, the outer spring 570 will assist the slider 530 to reset and wait for the next operation. And the outer spring 570 can be multiple small springs or a large spring.

[0131] In order to accurately adjust the thrust, the present application also provides a connecting block 580. The connecting block 580 is installed on the slider 530. When the slider 530 moves, it will drive the connecting block 580 to move together. As the slider 530 gradually moves downward, the contact head 581 on the connecting block 580 will contact the resistance wire 592 on the column 591. The heavier the weight of the large quartz slab, the greater the pressure on the placement seat 220, the greater the downward movement distance of the slider 530, and the contact head 581 will also gradually move downward with the slider 530. And the lighter the weight of the quartz stone slab, the slider 530 will drive the contact head 581 to move upward. As the position of the contact head 581 changes, the resistance of the resistance wire 592 will also change. After the first contact block 561 contacts the second contact block 562, the resistance wire 592 is energized. When the contact head 581 moves upward, the resistance increases and the current decreases. The control device controls the thrust adjustment of the driver 240 to become smaller. When the contact head 581 moves downward, the resistance decreases and the current increases. The control device controls the thrust adjustment of the driver 240 to become larger according to the change, so that the thrust of the driver 240 can be matched with the weight change of the quartz stone in real time, which not only saves energy but also makes the pushing of the large quartz slab more stable.

[0132] Embodiment 5:

[0133] The embodiment of the present application provides a processing technology for large quartz slabs. In addition to including the above technical features, the processing technology for large quartz slabs in the embodiment of the present application further includes the following technical features.

[0134] As Figures 6 to 8 shown, a sliding stability device 600 is provided between the sliding seat 210 and the slide rail 110. The sliding stability device 600 includes:

[0135] A lateral guide rail 610, which is arranged on the sliding seat 210;

[0136] A lateral guide block 620, which is arranged on the slide rail 110 and cooperates with the lateral guide rail 610;

[0137] Linkage chutes 630 are arranged on both sides of the lateral guide rail 610, and a combined block 640 is arranged in the linkage chutes 630;

[0138] The damper 650 is disposed within the lateral guide rail 610 and connected to the lateral guide block 620;

[0139] Among them, the combined block 640 is connected to the lateral guide block 620, and the combined block 640 is provided on both sides of the lateral guide block 620.

[0140] In the embodiment of the present application, since the flame spray gun 300 can only move in the up and down direction and cannot move in the horizontal direction, in order to be able to fully polish, the clamping mechanism drives the entire clamping mechanism to move through the connecting rod 510, and then drives the quartz large plate to move, so that it can be polished completely. Since the quartz large plate is heavy, and in order to make the quartz large plate more stable during polishing, the present application provides a sliding stability device 600 for assistance. Affected by the driving mechanism 400, the entire sliding seat 210 moves and drives the lateral guide rail 610 to move. The lateral guide block 620 is installed on the slide rail 110 and thus its position remains unchanged. By setting the damper 650, the sliding seat 210 will be buffered by the damper 650 during movement, buffering the current movement, and then reducing the vibration received by the quartz stone plate during movement, ensuring the stability of the polishing work. At the same time, since the linkage chute 630 is provided, the combined block 640 is arranged in the linkage chute 630 and the combined block is connected to the lateral guide block 620, and the combined block 640 will move together with the movement of the clamping mechanism.

[0141] Further, the sliding stability device 600 further includes:

[0142] The combined block 640 includes a support guide block 641 and a guide guide block 642 that are hinged to each other. The support guide block 641 is connected to the lateral guide block 620;

[0143] The arc guide rail 660 is disposed on the lateral guide rail 610 and communicates with the linkage chute 630;

[0144] The limit guide post 670 is disposed within the lateral guide rail 610 and located at the bent portion of the arc guide rail 660;

[0145] The damping spring 680 has one end connected to the guide guide block 642 and the other end installed on one side of the damper 650 through a positioning block;

[0146] Among them, when the support guide block 641 moves to the limit position of the linkage chute 630, the guide guide block 642 enters the arc guide rail 660 and cooperates with the limit guide post 670.

[0147] In some embodiments of the present application, the movement of the sliding seat 210 is restricted to a certain extent. The sliding seat 210 can move bidirectionally, and the moving distance is related to the length of the large quartz plate, which is determined by the distance between the clamping plates 230. To further improve the stability of the movement of the sliding seat 210 and the large quartz plate and ensure the stability of the polishing work, the present application also provides an arc-shaped guide rail 660, a supporting guide block 641, and a guiding guide block 642. The supporting guide block 641 is connected to the side guiding block 620. The side guiding block 620 remains stationary. As the driving mechanism 400 moves, the supporting guide block 641 drives the guiding guide block 642 to move on the linkage chute 630. A linkage chute 630 is provided on both sides of the side guiding block 620. Therefore, a combination block 640 is provided on both sides of each side guiding block 620. When the supporting guide block 641 moves to the limit position of the linkage chute 630, the guiding guide block 642 enters the arc-shaped guide rail 660 and cooperates with the limit guiding column 670, and the damping spring 680 is connected to the guiding guide block 642. Therefore, during the cooperation process, the force in the horizontal direction can be dispersed towards the bending direction of the arc-shaped guide rail 660, thereby further playing a damping and buffering role and ensuring the stability of the large quartz plate moving in two directions and the stability of the polishing work.

[0148] Embodiment 6:

[0149] The embodiment of the present application provides a processing technology for a large quartz plate. In addition to including the above technical features, the large quartz plate in the embodiment of the present application further includes the following processing steps:

[0150] S1. Fix the large quartz plate through the clamping mechanism;

[0151] S2. The control device controls the flame spray gun 300 to start;

[0152] S3. The control device controls the driving mechanism 400 to drive the large quartz plate to move, and at the same time controls the supporting seat to drive the flame spray gun 300 to move up and down to polish the large quartz plate.

[0153] It should be noted that in this text, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, article or device comprising such element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples. The embodiments of the present application have been described above in conjunction with the accompanying drawings, but the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Those of ordinary skill in the art, under the inspiration of the present application and without departing from the spirit and scope protected by the claims of the present application, can still make many forms, all of which fall within the protection scope of the present application.

Claims

1. A polishing device for a large quartz plate, characterized in that: The polishing device includes: A base (100) provided with a slide rail (110) thereon; A clamping mechanism for clamping the large quartz plate and capable of moving the large quartz plate along the slide rail (110); A flame spray gun (300) provided on the base (100) and used for flame polishing the large quartz plate, and a support base capable of moving up and down is provided at the bottom of the flame spray gun (300); A driving mechanism (400) for driving the clamping mechanism to move on the slide rail (110); A control device, the control device is connected to the clamping device, the flame spray gun (300), and the driving mechanism (400); Wherein, during the process of the driving mechanism (400) driving the large quartz plate to move, the flame spray gun (300) sprays a flame to polish the large quartz plate; The clamping mechanism includes: A sliding seat (210) provided on the slide rail (110) and cooperating with the slide rail (110), and a groove (221) is provided on the sliding seat (210); A placement seat (220) provided on the groove (221) and used for placing the large quartz plate; Clamping plates (230) provided in the groove (221) and located on both sides of the groove (221); A driver (240) provided on the sliding seat (210) and used for driving the clamping plates (230) to move; Wherein, when the sliding seat (210) drives the large quartz plate to move, the flame spray gun (300) performs flame polishing on both sides of the large quartz plate through the groove (221); An adjusting device (500) is provided on the placement seat (220), and the adjusting device (500) includes: A connecting rod (510) provided on the sliding seat (210) and connected to the driving mechanism (400); An adjusting groove (520) provided in the sliding seat (210) and located below the placement seat (220); A slider (530) provided in the adjusting groove (520) and capable of sliding up and down in the adjusting groove (520), and a plurality of sliding rods (531) penetrating through the adjusting groove (520) are provided at the top of the slider (530), and the other ends of the sliding rods (531) are connected to the placement seat (220); A chamber (540) provided inside the slider (530), an inner plate body (541) is provided in the chamber (540), and inner springs (542) are provided on both sides of the inner plate body (541); An outer plate body (550) provided in the adjusting groove (520) and located below the slider (530), a plurality of long rods are provided at the top of the outer plate body (550), and the ends of the long rods far from the outer plate body (550) are connected to the inner plate body (541); A contact assembly (560) includes a first contact block (561) provided at the bottom of the outer plate body (550) and a second contact block (562) provided at the bottom of the adjusting groove (520); Wherein, the first contact block (561) and the second contact block (562) are connected to the control device; The connecting block (580) is arranged on the side wall of the slider (530). A contact groove for the connecting block (580) to slide is arranged on the inner wall of the adjusting groove (520), and a contact head (581) is arranged on the connecting block (580). The receiving groove (590) is arranged on the inner wall of the adjusting groove (520) and communicates with the contact groove. A column (591) is arranged in the receiving groove (590), and a resistance wire (592) is wound around the column (591). Wherein, the resistance wire (592) contacts with the contact head (581).

2. The polishing equipment for a large quartz plate according to claim 1, wherein: The adjusting device (500) further includes: The outer spring (570) is arranged in the adjusting groove (520), and both ends of the outer spring (570) are in contact with the slider (530) and the bottom of the adjusting groove (520) respectively.

3. The polishing device for a large quartz plate according to claim 2, characterized in that: A sliding stability device (600) is arranged between the sliding seat (210) and the slide rail (110). The sliding stability device (600) includes: The lateral guide rail (610) is arranged on the sliding seat (210). The lateral guide block (620) is arranged on the slide rail (110) and cooperates with the lateral guide rail (610). The linkage sliding grooves (630) are arranged on both sides of the lateral guide rail (610), and a combined block (640) is arranged in the linkage sliding grooves (630). The damper (650) is arranged in the lateral guide rail (610) and is connected with the lateral guide block (620). Wherein, the combined block (640) is connected with the lateral guide block (620), and the combined block (640) is arranged on both sides of the lateral guide block (620).

4. The polishing device for a large quartz plate according to claim 3, characterized in that: The sliding stability device (600) further includes: The combined block (640) includes a support guide block (641) and a guiding guide block (642) which are hinged to each other. The support guide block (641) is connected with the lateral guide block (620). The arc guide rail (660) is arranged on the lateral guide rail (610) and communicates with the linkage sliding grooves (630). The limit guiding column (670) is arranged in the lateral guide rail (610) and is located at the bending part of the arc guide rail (660). One end of the damping spring (680) is connected with the guiding guide block (642), and the other end is installed on one side of the damper (650) through a positioning block. Wherein, when the support guide block (641) moves to the limit position of the linkage sliding grooves (630), the guiding guide block (642) enters the arc guide rail (660) and cooperates with the limit guiding column (670).

5. A processing technology for large quartz plates, characterized in that: It includes the following steps: S1. Blanking, optimizing the blanking of plate 1 and plate 2. S2. Surface grinding, surface grinding plate 1 and plate 2. S3. Laser processing, laser processing plate 1 and plate 2. S4. After MC for plate 1, sinter plate 1 and plate 2 precisely. S5. Pressing flatness, pressing the surfaces of plate 1 and plate 2 flat to obtain a new flatness. S6. Preliminary welding, assembling and welding plate 1 and plate 2, grinding and pressing flatness. S7. Re-welding, performing side plate assembling and welding on plate 1 and plate 2 after welding, and welding the side plates with plate 1 and plate 2. S8. Final product precise sintering, performing flame polishing on the quartz surface through a polishing device to make the surface of the quartz product reach a mirror state. The polishing device adopts the polishing device in claim 1. S9. Wash, and ensure that the product meets the cleanliness requirements through washing to obtain a large quartz plate.

6. The processing technology of a quartz large board according to claim 5, characterized in that: Polishing includes the following steps: S1. Fix the large quartz plate through a clamping mechanism; S2. The control device controls the flame spray gun (300) to turn on; S3. The control device controls the driving mechanism (400) to drive the large quartz plate to move, and at the same time controls the support seat to drive the flame spray gun (300) to move up and down to perform flame polishing on the large quartz plate.

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