electronic devices

By setting a through hole connecting to the second cavity on the shell of the speaker assembly and sealing it with the inner wall of the support, the problem of increasing the volume of the rear sound cavity of the speaker is solved, and the audio effect and connection strength are improved without changing the size and layout of the equipment.

CN117412228BActive Publication Date: 2025-09-09HONOR DEVICE CO LTD
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Patent Information

Application Number
CN202311222272.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-09-20
Publication Date
2025-09-09
Estimated Expiration
2043-09-20

AI Technical Summary

Technical Problem

In the prior art, in order to increase the volume of the rear sound cavity of a speaker, it is usually necessary to increase the overall size of the housing of the speaker assembly and the electronic device or change the layout within the device, resulting in a larger device size or difficulty in adjusting the layout.

Method used

By setting a first through hole connected to the second cavity on the shell of the speaker assembly, and using the inner wall of the support to cooperate with the shell to close the through hole, the total volume of the first through hole, the front cavity and the rear cavity is increased, and the volume of the rear sound cavity of the speaker is increased. Glass or ceramic materials are used to close the through hole to reduce vibration problems.

Benefits of technology

Without increasing the size of the device or changing the internal layout, the audio effect of the speaker component is improved, the audio experience is enhanced, the volume of the speaker's rear sound cavity is increased, and the connection strength and anti-deformation ability are enhanced.

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Abstract

The present application provides an electronic device, which includes a support member and a speaker assembly. The support member is provided with a first cavity. The speaker assembly includes a shell and a speaker body. The shell is arranged in the first cavity and is provided with a second cavity. The speaker body is arranged in the shell and divides the second cavity into a front cavity and a rear cavity. The shell is provided with a first through hole connected to the second cavity, and the inner wall of the first cavity cooperates with the shell to cover the side of the first through hole facing away from the second cavity. In the above electronic device, the second cavity is connected through the first through hole, and the inner wall of the first cavity in the support member cooperates with the shell to cover the side of the first through hole facing away from the second cavity, so that the total volume of the first through hole, the front cavity and the rear cavity is increased, which is beneficial to increase the volume of the rear sound cavity in the speaker assembly as the speaker body, so as to improve the audio effect of the speaker assembly, thereby enabling the electronic device to bring a better audio experience.
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Description

Technical Field

[0001] The embodiments of the present application relate to the field of terminal technology, and in particular to an electronic device. Background Art

[0002] Electronic devices with external speaker functionality typically require an independent, enclosed space as the speaker's rear acoustic cavity to achieve optimal sound quality. Conventional rear acoustic cavities are either sealed chambers formed within the speaker assembly's housing, or formed by assembling a separate speaker or a semi-sealed speaker assembly with the electronic device's housing. Existing solutions typically increase the volume of the rear acoustic cavity by increasing the size of both the speaker assembly's housing and the electronic device's housing, thereby increasing the volume of the sealed cavity. This results in an increase in the overall size of the electronic device or requires changes to the electronic device's internal layout to accommodate the larger speaker assembly's housing. Summary of the Invention

[0003] In view of this, the present application provides an electronic device that can increase the rear cavity of a speaker without increasing the size of the electronic device or changing the layout within the electronic device.

[0004] The present application provides an electronic device, comprising a support member and a speaker assembly. The support member is provided with a first cavity. The speaker assembly comprises a housing and a speaker body. The housing is disposed within the first cavity and is provided with a second cavity. The speaker body is disposed within the housing and divides the second cavity into a front cavity and a rear cavity. The housing defines a first through hole communicating with the second cavity, and an inner wall of the first cavity cooperates with the housing to seal a side of the first through hole facing away from the second cavity.

[0005] In the above-mentioned electronic device, the second cavity is connected through the first through hole, and the inner wall of the first cavity in the support member and the shell cooperate to cover the side of the first through hole facing away from the second cavity, so that the total volume of the first through hole, the front cavity and the rear cavity is increased, which is beneficial to increase the volume of the rear sound cavity in the speaker assembly as the speaker body, so as to improve the audio effect of the speaker assembly, thereby enabling the electronic device to bring a better audio experience.

[0006] In one possible embodiment, the support member includes a support body and a cover body, the cover body and the support body are connected and enclosed to form a first cavity. The first through hole is provided on a side of the housing facing the cover body, and the cover body covers a side of the first through hole facing away from the second cavity.

[0007] In the above embodiment, the first through hole is provided on the side of the shell facing the cover, so that the shell and the cover are connected and matched, and the cover closes the side of the first through hole facing away from the second cavity.

[0008] In a possible implementation manner, the cover is made of glass or ceramic.

[0009] In the above embodiment, the cover is made of glass or ceramic, which has a greater hardness than metal and plastic, so as to solve the problem that the first through hole and the second through hole allow the support member exposed outside the electronic device to directly cover the side connected to the second cavity, resulting in obvious vibration of the cover when the speaker body is working.

[0010] In one possible embodiment, the support member includes a support body and a cover. The support body is disposed within the first cavity. The cover is connected to the support body and surrounds the first cavity together with the support body. The first through hole is disposed on a side of the housing facing away from the cover. The support body seals the side of the first through hole facing away from the second cavity.

[0011] In the above embodiment, the first through hole is provided on the side of the shell away from the cover, so that the support body and the cover are connected and matched, and the support body closes the side of the first through hole away from the second cavity.

[0012] In a possible implementation, the first through hole is connected to the front cavity, and the position of the speaker body is adjusted so that the total volume of the front cavity and the first through hole reaches a set value.

[0013] In the above embodiment, the first through hole is connected to the front cavity, which can increase the total volume of the first through hole, the front cavity and the rear cavity. By adjusting the position of the speaker body, the volume of the front cavity is reduced until the total volume of the first through hole and the front cavity reaches a set value. Under the premise of ensuring the sound effect, the volume of the rear sound cavity in the speaker assembly as the speaker body is increased to improve the audio effect of the speaker assembly, thereby providing the electronic device with a better audio experience.

[0014] In a possible implementation, the first through hole is connected to the rear cavity.

[0015] In the above embodiment, the space formed by the connection between the first through hole and the rear cavity serves as the rear sound cavity of the speaker body. The volume of the rear sound cavity is larger than that of the rear cavity, which improves the audio effect of the speaker assembly and thus brings a better audio experience to the electronic device.

[0016] In a possible implementation, the electronic device further includes a first sealing member disposed between the support member and the housing, wherein the first sealing member is provided with a second through hole, the second through hole being in communication with the first through hole.

[0017] In the above embodiment, the second through hole is connected to the first through hole, so that the second through hole also serves as a part of the rear sound cavity of the speaker body, further increasing the volume of the rear sound cavity and further improving the audio effect of the speaker assembly.

[0018] In a possible implementation, an orthographic projection of the first through hole on the support member coincides with an orthographic projection of the second through hole on the support member.

[0019] In the above embodiment, the shell connection area between the shell and the support member, and the first through hole and the second through hole are adapted to the volume of the rear sound cavity of the speaker body, so as to achieve the effect of ensuring the connection strength between the shell and the support member while increasing the volume of the rear sound cavity of the speaker body.

[0020] In a possible implementation, there are multiple first through holes, and the housing forms a connecting arm between every two first through holes, and the connecting arm is connected to the support member.

[0021] In the above embodiment, the connecting arm between each two first through holes increases the area where the shell is connected to the support member between the multiple first through holes, and increases the distribution density of the connection part between the shell and the support member, thereby improving the ability of the support member to resist deformation due to external force.

[0022] In a possible embodiment, the inner wall of the second cavity is provided with a plurality of protruding positioning portions, and the plurality of positioning portions are configured to respectively abut the speaker body to position the speaker body along at least one direction among the thickness direction, the width direction and the length direction.

[0023] In the above embodiment, the positioning portion is reliably positioned against the speaker body, which helps to maintain the volume of the front cavity and the rear cavity stable, thereby improving the sound reliability of the electronic device.

[0024] In a possible embodiment, the support member is provided with a third through hole connecting the first cavity and the outside, and a fourth through hole is provided in a positioning portion of the shell near the third through hole, connecting the third through hole and the front cavity.

[0025] In the above embodiment, the fourth through hole effectively utilizes the space occupied by the positioning portion, which is beneficial to increasing the volume of the front cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of an electronic device provided in an embodiment of the present application.

[0027] Figure 2 for Figure 1 The electronic device shown is a perspective schematic diagram with a cutaway view and the screen omitted.

[0028] Figure 3 for Figure 2 A schematic plan view of a cutaway electronic device is shown.

[0029] Figure 4 for Figure 2 The figure shows a schematic diagram of a speaker assembly in an electronic device without a first through hole.

[0030] Figure 5 for Figure 4 The schematic diagram of the speaker assembly shown is provided with a first through hole.

[0031] Figure 6 for Figure 2 The electronic device shown is a schematic diagram of another embodiment when the first through hole is provided in the supporting body.

[0032] Figure 7 for Figure 1 The illustrated electronic device is a schematic diagram of another embodiment when the projection of the second through hole overlaps with the projection of the first through hole.

[0033] Figure 8 and Figure 9 They are Figure 5 The figure shows schematic diagrams of speaker assemblies in different embodiments when the shape, arrangement, etc. of the first through hole are changed.

[0034] Figure 10 for Figure 1 The electronic device is shown as a perspective schematic diagram in cross section in another embodiment.

[0035] Figure 11 for Figure 10 A schematic plan view of a cutaway electronic device is shown.

[0036] Figure 12 for Figure 11 The figure shows a schematic diagram of a speaker assembly in an electronic device without a first through hole.

[0037] Figure 13 for Figure 12 The schematic diagram of the speaker assembly shown is provided with a first through hole.

[0038] Description of main component symbols

[0039] Electronic devices 100, 100a, 100c

[0040] Support member 10

[0041] First cavity 101

[0042] Support body 11, 11c

[0043] Groove 103

[0044] Third through holes 105, 105c

[0045] Cover 13

[0046] Speaker assembly 20

[0047] Housings 21, 21a, 21b, 21c, 21d

[0048] Second cavity 201

[0049] Front Chamber 2011, 2011c

[0050] Back Cavity 2013, 2013c

[0051] First through holes 203, 203a, 203b, 203c, 203d

[0052] Connecting arms 211, 211a, 211b

[0053] Positioning portion 213

[0054] Fourth through holes 205, 205c

[0055] Speaker body 23, 23c

[0056] First sealing member 30, 30a, 30b

[0057] Second through holes 301, 301a, 301c

[0058] Screen 40

[0059] Protective Net 50

[0060] Second sealing member 60

[0061] Length direction X

[0062] Width direction Y

[0063] Thickness direction Z

[0064] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0065] In order to further illustrate the technical means and effects adopted by this application to achieve the intended application purpose, the following is combined with the drawings and implementation methods. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0066] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0067] Some embodiments of the present application provide an electronic device comprising a support member and a speaker assembly. The support member defines a first cavity. The speaker assembly comprises a housing and a speaker body. The housing is disposed within the first cavity and defines a second cavity. The speaker body is disposed within the housing and divides the second cavity into a front cavity and a rear cavity. The housing defines a first through-hole communicating with the second cavity, and an inner wall of the first cavity cooperates with the housing to seal a side of the first through-hole facing away from the second cavity.

[0068] In the above-mentioned electronic device, the second cavity is connected through the first through hole, and the inner wall of the first cavity in the support member and the shell cooperate to cover the side of the first through hole facing away from the second cavity, so that the total volume of the first through hole, the front cavity and the rear cavity is increased, which is beneficial to increase the volume of the rear sound cavity in the speaker assembly as the speaker body, so as to improve the audio effect of the speaker assembly, thereby enabling the electronic device to bring a better audio experience.

[0069] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0070] See also Figure 1 One embodiment of the present application provides an electronic device 100. The electronic device 100 has an audio playback function. In one embodiment, the electronic device 100 is a mobile phone, but is not limited thereto. For example, in other embodiments, the electronic device 100 can be a tablet computer, a wearable device, an in-vehicle device, an augmented reality (AR) / virtual reality (VR) device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), or other devices.

[0071] The electronic device 100 includes a support member 10, a speaker assembly 20, and a screen 40. The speaker assembly 20 is disposed within the support member 10. The screen 40 is disposed on one side of the support member 10. The screen 40 is used to display images. It is understood that if the electronic device 100 does not have a display function, the screen 40 can also be omitted.

[0072] See also Figure 2 and Figure 3 , Figure 2 This is a perspective cross-sectional view of the electronic device 100 according to some embodiments of the present application, in which the screen 40 is omitted. Figure 3 for Figure 2 The figure shows a planar cross-sectional view of an electronic device 100. The support member 10 is provided with a first cavity 101. The speaker assembly 20 is disposed in the first cavity 101. The speaker assembly 20 includes a housing 21 and a speaker body 23. The speaker body 23 is a structure for converting an audio electrical signal into a sound signal.

[0073] The housing 21 defines a second cavity 201. The speaker body 23 is disposed within the second cavity 201, dividing the second cavity 201 into a front cavity 2011 and a rear cavity 2013. The front cavity 2011 is connected to the external environment outside the electronic device 100. When the speaker body 23 is in operation, it can cause the air in the front cavity 2011 to vibrate, producing sound, which is then transmitted outside the electronic device 100.

[0074] The housing 21 is provided with a first through hole 203. The first through hole 203 communicates with the rear cavity 2013 of the second cavity 201. The inner wall of the first cavity 101 in the support member 10 and the housing 21 cooperate to cover the side of the first through hole 203 facing away from the rear cavity 2013, so that the first through hole 203 and the rear cavity 2013 form a closed space. The space formed by the connection between the first through hole 203 and the rear cavity 2013 serves as the rear sound cavity of the speaker body 23. The volume of the rear sound cavity is larger than that of the rear cavity 2013, which improves the audio effect of the speaker assembly 20, such as the low-frequency effect, and thus provides a better audio experience for the electronic device 100.

[0075] In one embodiment, the electronic device 100 is substantially in the shape of a rectangular plate, but is not limited thereto.

[0076] For the convenience of the following description, Figure 1 The electronic device 100 shown establishes a rectangular coordinate system. The thickness direction Z of the electronic device 100 is defined as the stacking direction of the screen 40 and the support member 10. The directions perpendicular to the thickness direction Z are the length direction X and the width direction Y of the electronic device 100, respectively. The length direction X and the width direction Y are perpendicular. It will be appreciated that the coordinate system of the electronic device 100 can be flexibly configured according to actual needs and is not specifically limited here.

[0077] In one embodiment, the front cavity 2011, the speaker body 23, and the rear cavity 2013 are arranged substantially along the thickness direction Z, but the arrangement is not limited thereto. For example, in other embodiments, when the speaker body 23 is thinner along the thickness direction Z, the front cavity 2011, the speaker body 23, and the rear cavity 2013 may also be arranged substantially along the width direction Y or the length direction X.

[0078] The volume of the first cavity 101 in the electronic device 100 does not need to be changed, the layout of the components in the first cavity 101 does not need to be changed, and the size of the shell 21 of the speaker assembly 20 does not need to be changed. The volume of the rear sound cavity of the speaker body 23 can be increased by opening a hole (first through hole 203) on the shell 21 or opening a hole (second through hole 301) on the first sealing member 30.

[0079] See also Figure 4 and Figure 5 , Figure 4 2 is a schematic diagram of the speaker assembly 20 when the housing 21 does not have the first through hole 203. Figure 4 The speaker assembly 20 shown is an integrated speaker structure, and the speaker assembly 20 forms an independent front cavity 2011 and a rear cavity 2013 in the shell 21.

[0080] Figure 5 This is a schematic diagram of a speaker assembly 20 in which the housing 21 is provided with first through holes 203. There are two first through holes 203. The two first through holes 203 have the same volume and are spaced side by side, with a connecting arm 211 formed between the two first through holes 203. The cross-section of the first through holes 203 is generally rectangular, but not limited to this. The connecting arm 211 of the housing 21 located between the two first through holes 203 is connected to the inner wall of the first cavity 101 of the support member 10. Under the premise of the same volume, compared to a case where there is only one first through hole 203, the spacing of the two first through holes 203 can increase the strength of the housing 21 connecting to the inner wall of the first cavity 101, allowing the inner wall of the first cavity 101 to be supported in the middle of the multiple first through holes 203, thereby improving the ability of the support member 10 to resist deformation when subjected to external forces.

[0081] It is understood that in other embodiments, the number of the first through holes 203 may be one, three, or other numbers. The cross-sectional shape of the first through holes 203 may also be a circle or other shape. The layout of the plurality of first through holes 203 may also adopt other arrangement methods. For example, in another embodiment, Figure 6 As shown, there are four first through holes 203a, the volumes of the four first through holes 203a are different, and the cross-sectional shape of the first through holes 203a is triangular; the four first through holes 203a are arranged along the circumference to form two diagonally connected connecting arms 211a, and the two connecting arms 211a are cross-connected to the support member 10, further increasing the area of ​​the connection between the shell 21 and the support member 10 between the multiple first through holes 203, and increasing the distribution density of the connecting arms 211a, thereby further improving the ability of the support member 10 to resist deformation under external force. In another embodiment, as Figure 7 As shown, there are four first through holes 203b, and the shape of the first through holes 203b is roughly rectangular. The four first through holes 203b are arranged in an array and form two cross-connecting arms 211b, and the two connecting arms 211b are respectively connected to the support member 10.

[0082] See also Figure 2 and Figure 3 In one embodiment, the support member 10 includes a support body 11 and a cover 13. The support body 11 and the cover 13 are connected to form a first cavity 101. The screen 40 is connected to the support body 11 and is located on opposite sides of the support body 11 with respect to the cover 13.

[0083] In one embodiment, the rear cavity 2013 within the second cavity 201 is closer to the cover 13 than the front cavity 2011. The first through hole 203 is disposed on the side of the housing 21 facing the cover 13, so that the housing 21 and the cover 13 can be connected and mated, and the cover 13 can close the side of the first through hole 203 facing away from the rear cavity 2013.

[0084] The electronic device 100 also includes a first seal 30. The first seal 30 is connected between the inner wall of the first cavity 101 and the shell 21. Furthermore, the first seal 30 is connected between the shell 21 and the cover 13. The first seal 30 can be foam or adhesive. The first seal 30 is connected between the cover 13 and the shell 21 by being bonded to the cavity wall of the first cavity 101 and the shell 21 respectively. The first seal 30 is provided with a second through hole 301. The second through hole 301 is connected to the first through hole 203, so that the second through hole 301 also serves as part of the rear sound cavity of the speaker body 23, further increasing the volume of the rear sound cavity and further improving the audio effect of the speaker assembly 20.

[0085] The cover body 13 is a roughly sheet-like structure. The space formed between the support body 11 and the cover body 13 includes a first cavity 101, which is used to arrange components such as batteries and circuit boards. The support body 11 is provided with a groove 103, and the groove wall of the groove 103 and the shell 21 are arranged to form the first cavity 101. The first cavity 101 can be a closed, open or semi-open cavity structure. The first sealing member 30 is sealed between the cover body 13 and the shell 21, and the second through hole 301 is connected to the first through hole 203, so that the first sealing member 30 seals the side of the first through hole 203 away from the rear cavity 2013 of the second cavity 201, and the closedness of the first cavity 101 does not affect the closedness of the rear cavity 2013 in the second cavity 201.

[0086] In one embodiment, the orthographic projection of the first through hole 203 on the cover 13 is within the range of the orthographic projection of the second through hole 301 on the cover 13, but the present invention is not limited thereto. Figure 8 As shown, the first through hole 203 and the second through hole 301a of the sealing member 30a are respectively projected on the cover 13 of the support member 10 to coincide with each other, so that the connection area between the shell 21 and the support member 10, and the first through hole 203 and the second through hole 301a as the volume of the rear sound cavity of the speaker body 23 are adapted to each other, so as to achieve the effect of ensuring the connection strength between the shell 21 and the support member 10 while increasing the volume of the rear sound cavity of the speaker body 23.

[0087] The cover 13 is made of glass or ceramic, which is harder than metal and plastic, so as to solve the problem that the first through hole 203 and the second through hole 301 allow the support member 10 exposed outside the electronic device 100 to directly cover the side connected to the second cavity 201, resulting in obvious vibration of the cover 13 when the speaker body 23 is working.

[0088] In another embodiment, please refer to Figure 9 , Figure 9 The electronic device 100a shown is compared with Figure 2 The difference between the illustrated electronic device 100 and the illustrated electronic device 100 lies in the addition of a first through hole 203d and a first sealing member 30b. The first through hole 203d is located on the side of the housing 21d facing away from the cover 13. The first through hole 203d communicates with the front cavity 2011 of the second cavity 201. The first sealing member 30b communicates between the housing 21d and the support body 11 of the support member 10. The first sealing member 30b and the support body 11 seal the side of the first through hole 203d facing away from the second cavity 201. The first through hole 203d communicates with the front cavity 2011, allowing the space formed by the first through hole 203d and the front cavity 2011 to serve as the front sound cavity of the speaker body 23. The first through hole 203d increases the volume of the front sound cavity. Sound quality can be maintained when the volume of the front sound cavity is at a set value, which can be the volume of the front cavity 2011 when the first through hole 203d is present. Therefore, reducing the volume of the front sound cavity to a set value can increase the volume of the rear cavity 2013.

[0089] The first through hole 203d is connected to the front cavity 2011, which can increase the total volume of the first through hole 203d, the front cavity 2011 and the rear cavity 2013. By adjusting the position of the speaker body 23, the volume of the front cavity 2011 is reduced until the total volume of the first through hole 203d and the front cavity 2011 reaches a set value. Under the premise of ensuring the sound effect, the volume of the rear sound cavity of the speaker body 23 in the speaker assembly 20 is increased to improve the audio effect of the speaker assembly 20, thereby enabling the electronic device 100a to bring a better audio experience.

[0090] The speaker body 23 can move along the thickness direction Z in the second cavity 201. Specifically, the speaker body 23 moves along the thickness direction Z toward the direction away from the cover body 13, so that the volume of the first through hole 203d and the front cavity 2011 reaches the set value, while increasing the volume of the rear cavity 2013.

[0091] It is understandable that in other embodiments, the first sealing member 30 b may also be provided with a second through hole (not shown) to further increase the volume of the rear sound cavity of the speaker body 23 .

[0092] It can be understood that in other embodiments, Figure 9 The electronic device 100 a shown may also omit the first through hole 203 .

[0093] Therefore, the first through hole 203d is connected to the front cavity 2011 or the rear cavity 2013 of the second cavity 201, and the inner wall of the first cavity 101 in the support member 10 and the shell 21c cooperate to cover the side of the first through hole 203d facing away from the second cavity 201, so that the total volume of the first through hole 203d, the front cavity 2011 and the rear cavity 2013 is increased, which is beneficial to increase the volume of the rear sound cavity serving as the speaker body 23 in the speaker assembly 20, so as to improve the audio effect of the speaker assembly 20, thereby providing the electronic device 100 with a better audio experience.

[0094] See also Figure 3 The support body 11 is provided with a third through-hole 105. The third through-hole 105 connects the first cavity 101 and the exterior of the support member 10. The housing 21 is provided with a fourth through-hole 205. The fourth through-hole 205 extends through the housing 21, allowing the front cavity 2011 to connect to the exterior of the housing 21 through the fourth through-hole 205. The third through-hole 105 and the fourth through-hole 205 are connected to form a sound transmission channel, which connects the front cavity 2011 and the exterior of the electronic device 100, thereby enabling sound to be transmitted to the exterior of the electronic device 100.

[0095] In one embodiment, the electronic device 100 further includes a protective net 50. The protective net 50 is disposed between the third through hole 105 and the fourth through hole 205. The protective net 50 prevents dust, particles and other impurities from entering the speaker assembly 20.

[0096] In one embodiment, the electronic device 100 further includes a second sealing member 60. The second sealing member 60 is generally annular. The second sealing member 60 is connected between the support body 11 and the housing 21 and surrounds the third through hole 105 and the fourth through hole 205, thereby preventing impurities such as dust and particles from entering the first cavity 101 through the fourth through hole 205.

[0097] See also Figures 10 to 13 , Figure 10 and Figure 13 An electronic device 100c provided according to another embodiment of the present application is shown. Figure 10 The electronic device 100c shown is Figure 2The differences between the illustrated electronic device 100c and the speaker assembly 20 are: the speaker assembly 20 is a semi-sealed structure; and the structure of the support body 11c is modified relative to the speaker's adaptability. Specifically, the cover 13 is disposed on the support body 11c and forms a first cavity 101. The front cavity 2011c of the speaker assembly 20 is closer to the cover 13 than the rear cavity 2013c. The rear cavity 2013c is an open cavity, that is, it communicates with the exterior of the speaker assembly 20. The housing 21c has a first through hole 203c on the side facing the cover 13. There is one first through hole 203c. The first through hole 203c is connected to the front cavity 2011c, which can increase the total volume of the first through hole 203c, the front cavity 2011c and the rear cavity 2013c. By adjusting the position of the speaker body 23, the volume of the front cavity 2011c is reduced until the total volume of the first through hole 203c and the front cavity 2011c reaches a set value. Under the premise of ensuring the sound effect, the volume of the rear sound cavity of the speaker body 23 in the speaker assembly 20 is increased to improve the audio effect of the speaker assembly 20, thereby enabling the electronic device 100c to bring a better audio experience.

[0098] The speaker body 23 can move along the thickness direction Z in the second cavity 201. Specifically, the speaker body 23 moves along the thickness direction Z toward the cover body 13, so that the volume of the first through hole 203c and the front cavity 2011c reaches the set value, while increasing the volume of the rear cavity 2013c.

[0099] The electronic device 100c also includes a first sealing member 30. The first sealing member 30 is provided with a second through hole 301c. There is one second through hole 301c. The second through hole 301c is connected to the first through hole 203c to further increase the total volume of the first through hole 203c, the front cavity 2011c, and the rear cavity 2013c. The volume of the rear cavity 2013c is increased by moving the speaker body 23 toward the cover body 13 along the thickness direction Z. This increases the volume of the rear sound cavity of the speaker body 23 in the speaker assembly 20, thereby improving the audio quality of the speaker assembly 20 and providing a better audio experience for the electronic device 100c.

[0100] It is understandable that in other embodiments, the number of first through holes 203c and the number of second through holes 301c may not be equal. For example, there are two first through holes 203c and one second through hole 301c, and one second through hole 301c is connected to both first through holes 203c.

[0101] The housing 21c can be divided into at least two parts, thereby facilitating the installation of the speaker body 23 into the second cavity 201 of the housing 21c. In one embodiment, the inner wall of the second cavity 201 is provided with a plurality of protruding positioning portions 213, which are configured to respectively abut against the speaker body 23, so that the speaker body 23 is positioned in at least one direction of the thickness direction Z, the width direction Y, and the length direction X. For example, Figure 10 As shown, the positioning portion 213 is located on one side of the speaker body 23 along the width direction Y. The positioning portion 213 extends into the first cavity 101. The positioning portion 213 and the inner wall of the first cavity 101 respectively abut against opposite sides of the speaker body 23 along the width direction Y, thereby positioning the speaker body 23 within the first cavity 101 along the width direction Y. It is understood that in other embodiments, the positioning portion 213 can also be provided at other locations within the first cavity 101 and abut against the speaker body 23 along the thickness direction Z or the length direction X, thereby positioning the speaker body 23 along the thickness direction Z or the length direction X.

[0102] It is understandable that in other embodiments, the two positioning portions 213 may respectively abut against opposite sides of the speaker body 23 to position the speaker body 23 .

[0103] The positioning portion 213 is reliably positioned against the speaker body 23 , which helps to keep the volumes of the front cavity 2011 c and the rear cavity 2013 c stable, thereby improving the sound reliability of the electronic device 100 c .

[0104] It is understood that in other embodiments, the positioning portion 213 may also be omitted. The speaker body 23 may be fixed in the first cavity 101 by bonding.

[0105] It is understandable that in other embodiments, the speaker body 23 and the positioning portion 213 may also be bonded and fixed to further improve the connection stability, and the speaker body 23 and the positioning portion 213 can absorb vibrations through the adhesive.

[0106] In one embodiment, the fourth through hole 205c passes through the positioning portion 213 close to the third through hole 105c. The fourth through hole 205c effectively utilizes the space occupied by the positioning portion 213, thereby increasing the volume of the front cavity 2011c.

[0107] In the above-mentioned electronic device 100, the second cavity 201 is connected through the first through hole 203, and the inner wall of the first cavity 101 in the support member 10 and the shell 21 cooperate to cover the side of the first through hole 203 facing away from the second cavity 201, so that the total volume of the first through hole 203, the front cavity 2011 and the rear cavity 2013 is increased, which is beneficial to increase the volume of the rear sound cavity serving as the speaker body 23 in the speaker assembly 20, so as to improve the audio effect of the speaker assembly 20, thereby enabling the electronic device 100 to bring a better audio experience.

[0108] The volume of the first cavity 101 in the electronic device 100 does not need to be changed, the layout of the components in the first cavity 101 does not need to be changed, and the size of the shell 21 of the speaker assembly 20 does not need to be changed. The volume of the rear sound cavity of the speaker body 23 can be increased by opening a hole (first through hole 203) on the shell 21 and / or opening a hole (second through hole 301) on the first sealing member 30.

[0109] In addition, those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present application and are not intended to limit the present application. As long as they are within the spirit of the present application, appropriate changes and modifications to the above embodiments are within the scope of disclosure of the present application.

Claims

1. An electronic device, characterized in that: include: The support member includes a support body and a cover body, wherein the support body and the cover body are connected and enclosed to form a first cavity; Speaker assembly, including: a housing disposed in the first cavity and having a second cavity; and a speaker body, disposed in the housing and dividing the second cavity into a front cavity and a rear cavity, wherein the front cavity and the rear cavity are located on opposite sides of the speaker body; and a first sealing member, disposed between the cover and the housing; The shell is provided with a first through hole connected to the second cavity, and the first through hole is connected to the back cavity. There are multiple first through holes, and the shell forms a connecting arm between every two first through holes, and the connecting arm is connected to the first sealing member and is used to support the cover body; the first through hole is arranged on the side of the shell facing the cover body, and the cover body seals the side of the first through hole away from the second cavity, and the first sealing member is provided with a second through hole, and the second through hole is connected to the first through hole, and the first sealing member seals the side of the first through hole away from the back cavity of the second cavity.

2. The electronic device according to claim 1, wherein: The cover is made of glass or ceramic.

3. The electronic device according to claim 1, wherein: The orthographic projection of the first through hole on the support member coincides with the orthographic projection of the second through hole on the support member.

4. The electronic device according to claim 1, wherein: The inner wall of the second cavity is provided with a plurality of protruding positioning parts, and the plurality of positioning parts are configured to respectively abut against the speaker body to position the speaker body along at least one direction among the thickness direction, the width direction and the length direction.

5. The electronic device according to claim 4, wherein: The support member is provided with a third through hole connecting the first cavity and the outside, and the positioning portion of the shell near the third through hole is provided with a fourth through hole connecting the third through hole and the front cavity.

Citation Information

Patent Citations

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    CN116647797A

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    CN215499087U

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    CN219351905U