Control parameter adjustment method and storage medium

Abstract

The present invention provides a technology that can appropriately adjust the ejection control parameters according to the environment in which the processing liquid is actually ejected onto the substrate while suppressing the consumption of the substrate. In the first adjustment process (S1), the ejection control parameters are adjusted based on the first pressure waveform when the simulated coating is performed. In the third adjustment process (S3), based on the second pressure waveform when the actual coating is performed according to the ejection control parameters adjusted by the first adjustment process (S1), it is determined whether to readjust the ejection control parameters. In the case of readjustment, the ejection control parameters are readjusted based on the third pressure waveform when the simulated coating is performed. In the fourth adjustment process (S4), based on the fourth pressure waveform when the actual coating is performed according to the ejection control parameters readjusted by the third adjustment process (S3), it is determined whether to readjust the ejection control parameters. In the case of readjustment, the ejection control parameters are readjusted based on the fifth pressure waveform when the actual coating is performed.

Description

Technical Field

[0001] The subject matter disclosed in this specification relates to a control parameter adjustment method and a storage medium. Background Art

[0002] In the manufacturing process of a flat panel display (FPD), a substrate processing device called a coater is sometimes used. The coater sprays a processing liquid such as an anti-etching liquid from a nozzle onto a substrate such as glass, and scans the substrate with the nozzle. The processing liquid is sprayed from the nozzle by applying pressure to the processing liquid such as the anti-etching liquid. In addition, a moving mechanism moves the substrate relative to the nozzle, thereby forming a coating film of the processing liquid on the surface of the substrate.

[0003] In such a substrate processing device, it is sometimes required to make the film thickness of the coating film uniform over the entire substrate. The discharge control parameters are appropriately adjusted to make the film thickness uniform. In this adjustment operation, for example, a technician visually confirms the waveform of the discharge pressure and adjusts multiple discharge control parameters. Therefore, the adjustment operation depends to a large extent on the knowledge or experience of the technician. Therefore, the adjustment of the discharge control parameters requires a lot of time and effort from the technician. In addition, a large amount of processing liquid and substrate may be consumed. Therefore, a technology for efficiently adjusting the control parameters has been proposed so far.

[0004] For example, Patent Document 1 describes a substrate processing method, which includes: a simulated ejection process, in which a processing liquid is ejected outside a substrate; an ejection characteristic measurement process, in which the ejection characteristic of the processing liquid in the simulated ejection process is measured; a state quantity derivation process, in which a state quantity of the deviation of the measured ejection characteristic relative to the target characteristic is derived; and a learning process, in which a learning model is constructed by machine learning of the change in the state quantity accompanying the change in the parameter. In this substrate processing method, during a period when the state quantity exceeds a prescribed allowable range, the simulated ejection process, the ejection characteristic measurement process, the state quantity derivation process, and the learning process are repeatedly performed on the basis of changing the parameter based on the learning model. On the other hand, when the state quantity enters the allowable range, the last changed parameter is set as the parameter when the processing liquid is ejected in the processing liquid supply process.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent document 1: Japanese Patent Application Publication No. 2020-040046.

[0008] In Patent Document 1, since the ejection control parameters are adjusted based on simulated ejection, the consumption of the substrate can be suppressed. However, various conditions such as the environment around the nozzle in simulated ejection are different from those in the actual ejection of the processing liquid onto the substrate. Therefore, when the ejection control parameters adjusted by simulated ejection are used, it is sometimes difficult to reproduce the ideal pressure waveform when the processing liquid is actually applied to the substrate. Summary of the invention

[0009] An object of the present invention is to provide a technology capable of appropriately adjusting discharge control parameters according to the environment in which a processing liquid is actually discharged onto a substrate while suppressing consumption of the substrate.

[0010] Technical means to solve the problem

[0011] In order to solve the above-mentioned problems, the first technical solution is a control parameter adjustment method for adjusting the ejection control parameters for controlling the ejection of a processing liquid from a nozzle, comprising: step a), adjusting the ejection control parameters based on a first pressure waveform representing the pressure change in the nozzle when simulating the application of the processing liquid from the nozzle to a portion other than a substrate; step b), obtaining a second pressure waveform representing the pressure change in the nozzle when actually applying the processing liquid from the nozzle to a substrate according to the ejection control parameters adjusted by step a); step c), determining whether to readjust the ejection control parameters based on the second pressure waveform; and step d), When it is determined that readjustment is performed through the step c), the ejection control parameters are readjusted based on the third pressure waveform indicating the pressure change in the nozzle during the simulated coating; in step e), according to the ejection control parameters readjusted through the step d), a fourth pressure waveform indicating the pressure change in the nozzle during the actual coating is obtained; in step f), based on the fourth pressure waveform, it is determined whether to readjust the ejection control parameters; and in step g), when it is determined that readjustment is performed through the step f), the ejection control parameters are readjusted based on the fifth pressure waveform indicating the pressure change in the nozzle during the actual coating.

[0012] The second technical solution is a control parameter adjustment method like the first technical solution, further comprising: step h), adjusting a movement control parameter for controlling the relative movement of the substrate relative to the nozzle, the actual coating causing the substrate to move relative to the nozzle according to the movement control parameter adjusted by the step h), and spraying a processing liquid from the nozzle toward the substrate.

[0013] A third technical solution is the control parameter adjustment method according to the first technical solution or the second technical solution, wherein the step h) adjusts the movement control parameter based on a velocity waveform indicating a change in a relative velocity of the substrate with respect to the nozzle.

[0014] A fourth technical solution is a storage medium storing a computer-readable program, wherein the program enables the computer to execute the control parameter adjustment method described in any one of the first to third technical solutions.

[0015] Effects of the Invention

[0016] According to the control parameter adjustment method of the first to fourth technical solutions, the consumption of the substrate can be suppressed by adjusting and re-adjusting the ejection control parameter based on the pressure waveform obtained by the simulated coating. In addition, the ejection control parameter adjusted based on the pressure waveform obtained by the simulated coating is re-adjusted based on the fifth pressure waveform obtained by the actual coating, so that the ejection control parameter can be adjusted to match the actual coating.

[0017] According to the control parameter adjustment method of the second aspect, coating on the substrate can be appropriately performed by adjusting the movement control parameter.

[0018] According to the control parameter adjustment method of the third aspect, the movement control parameter can be appropriately adjusted based on the speed waveform. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a diagram schematically showing the overall structure of a coating device according to an embodiment.

[0020] Figure 2 It is a diagram showing the structure of a processing liquid supply mechanism.

[0021] Figure 3 Yes means Figure 2 A graph showing the movement pattern of the working disc of the pump is shown.

[0022] Figure 4 This is a block diagram showing a configuration example of a control unit.

[0023] Figure 5 This is a diagram showing the flow of the control unit adjusting the control parameters.

[0024] Figure 6 Yes means Figure 5 Flowchart showing details of the first adjustment step.

[0025] Figure 7 Yes means Figure 5 Flowchart showing details of the second adjustment step.

[0026] Figure 8 Yes means Figure 5 Flowchart showing details of the third adjustment step.

[0027] Fig. 9 It is a diagram showing a setting example of the second ideal waveform.

[0028] Fig.10 Yes means Figure 5 Flowchart showing details of the fourth adjustment step.

[0029] Description of Reference Numerals

[0030] 1 Coating device

[0031] 5 Mobile mechanism

[0032] 7 Coating mechanism

[0033] 8 Treatment liquid supply mechanism

[0034] 9 Control unit

[0035] 51 Chuck mechanism

[0036] 52 Adsorption travel mechanism

[0037] 71 Nozzle

[0038] 81 Pump

[0039] 83. Processing fluid replenishment unit

[0040] 86 Pressure gauge

[0041] 910 Discharge control unit

[0042] 911 Discharge pressure measurement unit

[0043] 912 Mobile Control Department

[0044] 913 Speed ​​Measurement Unit

[0045] 915 Discharge control parameter adjustment unit

[0046] 917 Motion Control Parameter Adjustment Unit

[0047] 931 Procedure

[0048] M Storage Media

[0049] S substrate DETAILED DESCRIPTION

[0050] The following is an explanation of the embodiments of the present invention with reference to the accompanying drawings. It should be noted that the structural components described in the embodiments are only illustrative, and the scope of the present invention is not limited thereto. In the accompanying drawings, the size or number of each part is exaggerated or simplified as needed for ease of understanding.

[0051] <1. Implementation Method>

[0052] Figure 11 is a diagram schematically showing the overall structure of a coating device 1 according to an embodiment. The coating device 1 is a substrate processing device for coating a processing liquid onto an upper surface Sf of a substrate S. The substrate S is, for example, a glass substrate for a liquid crystal display device. It should be noted that the substrate S may be a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a plasma display, a glass or ceramic substrate for a magnetic disk or an optical disk, a glass substrate for an organic EL, a glass substrate or a silicon substrate for a solar cell, other flexible substrates, and a printed substrate, and other various substrates to be processed for electronic devices. The coating device 1 is, for example, a slit coater.

[0053] exist Figure 1 In order to illustrate the configuration relationship of each element of the coating device 1, an XYZ coordinate system is defined. The moving direction of the substrate S is the "X direction". The direction in which the substrate S moves in the X direction (the direction toward the downstream of the moving direction) is the +X direction, and the opposite direction (the direction toward the upstream of the moving direction) is the -X direction. In addition, the direction orthogonal to the X direction is the Y direction, and the direction orthogonal to the X direction and the Y direction is the Z direction. In the following description, the Z direction is set as the vertical direction, and the X direction and the Y direction are set as the horizontal directions. In the Z direction, the +Z direction is set as the upward direction, and the -Z direction is set as the downward direction.

[0054] The coating device 1 has an input conveyor 100, an input transfer unit 2, a floating platform unit 3, an output transfer unit 4, and an output conveyor 110 in sequence toward the +X direction. The input conveyor 100, the input transfer unit 2, the floating platform unit 3, the output transfer unit 4, and the output conveyor 110 constitute a moving path for the substrate S to pass through. In addition, the coating device 1 also has a moving mechanism 5, a coating mechanism 7, a processing liquid supply mechanism 8, and a control unit 9.

[0055] The substrate S is conveyed from the upstream side to the input conveyor 100. The input conveyor 100 has a roller conveyor 101 and a rotation drive mechanism 102. The rotation drive mechanism 102 rotates the rollers of the roller conveyor 101. The substrate S is conveyed to the downstream (+X direction) in a horizontal posture by the rotation of the rollers of the roller conveyor 101. The "horizontal posture" refers to a state in which the main surface (the surface with the largest area) of the substrate S is parallel to the horizontal plane (XY plane).

[0056] The input transfer unit 2 includes a roller conveyor 21 and a rotary lifting drive mechanism 22. The rotary lifting drive mechanism 22 rotates each roller of the roller conveyor 21 and lifts the roller conveyor 21. The substrate S is conveyed downstream (+X direction) in a horizontal posture by the rotation of the roller conveyor 21. In addition, the position of the substrate S in the Z direction is changed by the lifting of the roller conveyor 21. The substrate S is transferred from the input conveyor 100 to the floating platform 3 through the input transfer unit 2.

[0057] like Figure 1 As shown, the floating platform portion 3 is roughly flat. The floating platform portion 3 is divided into three parts along the X direction. The floating platform portion 3 has an inlet floating platform 31, a coating platform 32 and an outlet floating platform 33 in sequence along the +X direction. The upper surface of the inlet floating platform 31, the upper surface of the coating platform 32 and the upper surface of the outlet floating platform 33 are on the same plane. The floating platform portion 3 also has a lifting pin driving mechanism 34, a floating control mechanism 35 and a lifting driving mechanism 36. A plurality of lifting pins are arranged on the inlet floating platform 31. The lifting pin driving mechanism 34 lifts and lowers the plurality of lifting pins. The floating control mechanism 35 supplies compressed air for floating the substrate S to the inlet floating platform 31, the coating platform 32 and the outlet floating platform 33. The lifting driving mechanism 36 lifts and lowers the outlet floating platform 33.

[0058] A plurality of ejection holes for ejecting compressed air supplied from the float control mechanism 35 are arranged in a matrix on the upper surface of the inlet float platform 31 and the upper surface of the outlet float platform 33. When the compressed air is ejected from each ejection hole, the substrate S floats upward relative to the float platform 3. Then, the lower surface Sb of the substrate S is separated from the upper surface of the float platform 3 and supported in a horizontal posture. The distance (floating amount) between the lower surface Sb of the substrate S and the upper surface of the float platform 3 in the state where the substrate S is floating is preferably 10 μm or more. The distance is preferably 500 μm or less.

[0059] The ejection holes for ejecting the compressed air supplied from the floating control mechanism 35 and the suction holes for sucking the gas are alternately arranged on the upper surface of the coating station 32 in the X direction and the Y direction. The floating control mechanism 35 controls the ejection amount of the compressed air ejected from the ejection holes and the suction amount of the air sucked from the suction holes. Thus, the floating amount of the substrate S relative to the coating station 32 is precisely controlled so that the position in the Z direction of the upper surface Sf of the substrate S passing above the coating station 32 reaches a specified value. It should be noted that the floating amount of the substrate S relative to the coating station 32 is calculated by the control unit 9 based on the detection results of the sensor 61 or the sensor 62 described later. In addition, it is preferred that the floating amount of the substrate S relative to the coating station 32 can be adjusted with high precision by airflow control.

[0060] The substrate S carried into the floating stage 3 is given a driving force in the +X direction from the roller conveyor 21 and is conveyed onto the entrance floating stage 31. The entrance floating stage 31, the coating stage 32, and the exit floating stage 33 support the substrate S in a floating state. As the floating stage 3, for example, the structure described in Japanese Patent No. 5346643 can be adopted.

[0061] The moving mechanism 5 is arranged below the floating stage 3. The moving mechanism 5 has a chuck mechanism 51 and an adsorption travel mechanism 52. The chuck mechanism 51 has an adsorption disk (not shown) provided on the adsorption member. The chuck mechanism 51 supports the substrate S from the bottom side in a state where the adsorption disk is in contact with the peripheral edge of the lower surface Sb of the substrate S. The adsorption travel mechanism 52 adsorbs the substrate S on the adsorption disk by applying negative pressure to the adsorption disk. In addition, the adsorption travel mechanism 52 causes the chuck mechanism 51 to reciprocate in the X direction.

[0062] The chuck mechanism 51 holds the substrate S with the lower surface Sb of the substrate S located higher than the upper surface of the floatation table 3 . With the periphery of the substrate S held by the chuck mechanism 51 , the substrate S is maintained in a horizontal position by the buoyancy provided by the floatation table 3 .

[0063] like Figure 1 As shown in FIG. 1 , the coating device 1 has a sensor 61 for measuring the plate thickness. The sensor 61 is arranged near the roller conveyor 21. The sensor 61 detects the position in the Z direction of the upper surface Sf of the substrate S held by the chuck mechanism 51. In addition, by positioning the chuck (not shown) in a state where the substrate S is not held directly below the sensor 61, the sensor 61 can detect the position in the vertical direction Z of the adsorption surface of the upper surface of the adsorption member.

[0064] The chuck mechanism 51 moves in the +X direction while holding the substrate S carried into the floating stage 3. Thus, the substrate S is transported from above the entrance floating stage 31 to above the coating stage 32 to above the exit floating stage 33. Then, the substrate S moves from the exit floating stage 33 to the output transfer unit 4.

[0065] The output transfer unit 4 moves the substrate S from a position above the exit floating platform 33 to the output conveyor 110. The output transfer unit 4 includes a roller conveyor 41 and a rotary lifting drive mechanism 42. The rotary lifting drive mechanism 42 drives the roller conveyor 41 to rotate and lift the roller conveyor 41 in the Z direction. The substrate S is moved in the +X direction by the rotation of each roller of the roller conveyor 41. In addition, the substrate S is displaced in the Z direction by the lifting of the roller conveyor 41.

[0066] The output conveyor 110 includes a roller conveyor 111 and a rotation drive mechanism 112. The output conveyor 110 conveys the substrate S in the +X direction by the rotation of each roller of the roller conveyor 111, and discharges the substrate S to the outside of the coating device 1. It should be noted that the input conveyor 100 and the output conveyor 110 are part of the coating device 1. However, the input conveyor 100 and the output conveyor 110 may be assembled in another device different from the coating device 1.

[0067] The coating mechanism 7 coats the processing liquid onto the upper surface Sf of the substrate S. The coating mechanism 7 is arranged above the moving path of the substrate S. The coating mechanism 7 has a nozzle 71. The nozzle 71 is a slit nozzle having a slit-shaped ejection outlet on the lower surface. The nozzle 71 is connected to a positioning mechanism (not shown). The positioning mechanism positions the nozzle 71 at a coating position ( Figure 1 The processing liquid supply mechanism 8 is connected to the nozzle 71. The processing liquid supply mechanism 8 supplies the processing liquid to the nozzle 71, so that the processing liquid is ejected from the ejection port arranged on the lower surface of the nozzle 71.

[0068] In the coating device 1, the substrate S is moved relative to the nozzle 71 that ejects the processing liquid by the moving mechanism 5, and the processing liquid is applied to the substrate S. However, the moving mechanism 5 may be configured to move the nozzle 71 relative to the substrate S arranged at a predetermined position. In addition, the moving mechanism 5 may also be configured to move both the nozzle 71 and the substrate S. In this case, the moving direction of the substrate S may also be opposite to the moving direction of the nozzle 71. In addition, the moving direction of the substrate S may also be opposite to the moving direction of the nozzle 71. In this case, the moving mechanism 5 may transport the nozzle 71 and the substrate S in such a manner that the nozzle 71 catches up with the substrate S at a speed faster than the speed of the transported substrate S.

[0069] Figure 2 8 is a diagram showing the structure of the treatment liquid supply mechanism 8. The treatment liquid supply mechanism 8 includes a pump 81, a pipe 82, a treatment liquid replenishing unit 83, a pipe 84, an on-off valve 85, a pressure gauge 86, and a drive unit 87. The pump 81 is a delivery source for delivering the treatment liquid to the nozzle 71, and delivers the treatment liquid according to the volume change. The pump 81 may be, for example, a bellows pump described in Japanese Patent Publication No. 10-61558. Figure 2 As shown, the pump 81 has a flexible tube 811 that can expand and contract elastically in the radial direction. One end of the flexible tube 811 is connected to the processing liquid replenishing unit 83 via a pipe 82. The other end of the flexible tube 811 is connected to the nozzle 71 via a pipe 84.

[0070] The pump 81 has a bellows 812 that is free to elastically deform in the axial direction. The bellows 812 has a small bellows portion 813, a large bellows portion 814, a pump chamber 815, and a working disc portion 816. The pump chamber 815 is located between the flexible tube 811 and the bellows 812. A non-compressible medium is sealed in the pump chamber 815. The working disc portion 816 is connected to the drive portion 87.

[0071] The processing liquid replenishing unit 83 has a storage tank 831 for storing the processing liquid. The storage tank 831 is connected to the pump 81 through the pipe 82. An on-off valve 833 is installed in the pipe 82. The on-off valve 833 is opened and closed according to the command from the control unit 9. When the on-off valve 833 is opened, the processing liquid can be replenished from the storage tank 831 to the flexible pipe 811 of the pump 81. In addition, when the on-off valve 833 is closed, the replenishment of the processing liquid from the storage tank 831 to the flexible pipe 811 of the pump 81 is restricted.

[0072] The pipe 84 is connected to the output side of the pump 81. The on-off valve 85 is installed in the pipe 84. The on-off valve 85 is opened and closed according to the command from the control unit 9. By opening and closing the on-off valve 85, switching is performed between supplying the processing liquid to the nozzle 71 and stopping the supply of the processing liquid. The pressure gauge 86 is arranged in the pipe 84. The pressure gauge 86 detects the pressure (discharge pressure) of the processing liquid supplied to the nozzle 71, and outputs a signal indicating the detected pressure value to the control unit 9.

[0073] Figure 3 Yes means Figure 2 Graph of the movement pattern of the working disk portion 816 of the pump 81 is shown. Figure 3 In FIG. 8 , the horizontal axis represents time, and the vertical axis represents the moving speed of the working disk unit 816. The driving unit 87 moves the working disk unit 816 at a speed of Figure 3 The movement pattern shown (a pattern indicating the change in the speed of the working disk portion 816 relative to the passage of time) is displaced in the axial direction. The volume on the inner side of the bellows 812 changes due to the displacement of the working disk portion 816. As a result, the flexible tube 811 expands and contracts in the radial direction to perform a pumping action, and the treatment liquid supplied from the treatment liquid replenishing unit 83 is transported to the nozzle 71. The movement pattern of the working disk portion 816 is closely related to the ejection characteristics of the treatment liquid ejected from the nozzle 71. Therefore, according to the movement pattern, a pressure waveform indicating the time change of the ejection pressure can be obtained. It should be noted that the ejection amount (the amount of the treatment liquid ejected from the nozzle 71) increases or decreases according to the increase or decrease of the ejection pressure.

[0074] In this embodiment, by adjusting various parameters (acceleration time, steady speed, steady speed time, deceleration time, etc.) that define the movement of the work disk portion 816, an optimization process (adjustment process) is appropriately performed to make the pressure waveform of the ejection pressure of the processing liquid ejected from the nozzle 71 consistent with or close to the ideal waveform. This optimization process will be described in detail later.

[0075] like Figure 1 and Figure 2As shown, a sensor 62 is arranged in the nozzle 71 that supplies the processing liquid from the processing liquid supply mechanism 8. The sensor 62 detects the height of the substrate S in the Z direction in a non-contact manner. The sensor 62 is connected to the control unit 9 in a manner that enables data communication. Based on the detection result of the sensor 62, the control unit 9 measures the distance (separation distance) between the floating substrate S and the upper surface of the coating table 32. The control unit 9 adjusts the coating position of the nozzle 71 using the positioning mechanism based on the separation distance measured by the sensor 62. It should be noted that as the sensor 62, an optical sensor or an ultrasonic sensor can be used.

[0076] The coating mechanism 7 has a nozzle cleaning standby unit 72. The nozzle cleaning standby unit 72 performs prescribed maintenance on the nozzle 71 arranged at the maintenance position. The nozzle cleaning standby unit 72 has a roller 721, a cleaning unit 722 and a roller tank (rollerbat) 723. The nozzle cleaning standby unit 72 cleans the nozzle 71 and forms an accumulation of liquid, thereby adjusting the nozzle 71 The ejection port is adjusted to a state suitable for coating processing. In addition, in the coating device 1, the nozzle 71 is configured in a state of a maintenance position (simulated coating position), that is, the ejection port of the nozzle 71 is opposite to the outer peripheral surface of the roller 721, and the treatment liquid is ejected from the nozzle 71 to the outer peripheral surface of the roller 721 to evaluate the ejection pressure applied to the treatment liquid. At this time, by rotating the roller 721, the treatment liquid ejected from the nozzle 71 can be applied to the moving surface. That is, the coating applied to the moving substrate S can be simulated and reproduced.

[0077] Discharging the processing liquid from the nozzle 71 onto the surface of the roller 721 is referred to as “simulated coating”, which is discharging the processing liquid onto a portion other than the substrate S. Also, coating the processing liquid from the nozzle 71 onto the substrate S is referred to as “actual coating”.

[0078] Figure 4 1 is a block diagram showing an example of the configuration of the control unit 9. The control unit 9 controls the operation of each element of the coating device 1. The control unit 9 is a computer having a computing unit 91, a storage unit 93, and a user interface 95. The computing unit 91 is a processor composed of a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The storage unit 93 is composed of a transient storage device such as a RAM (Random Access Memory), a non-transient auxiliary storage device such as a HDD (Hard Disk Drive) and an SSD (Solid State Drive).

[0079] The user interface 95 includes a display that displays information to the user and an input device that accepts input operations of the user. As the control unit 9, for example, a desktop type, a laptop type, or a tablet type computer can be used.

[0080] The storage unit 93 stores a program 931. The program 931 is provided by a storage medium M. That is, the storage medium M stores the program 931 so that the control unit 9 as a computer can read it. The storage medium M is, for example, a USB (Universal Serial Bus) memory, a DVD (Digital Versatile Disc) or other optical disk, a magnetic disk, or the like.

[0081] The calculation unit 91 executes the program 931 to function as a discharge control unit 910 , a discharge pressure measuring unit 911 , a movement control unit 912 , a speed measuring unit 913 , a discharge control parameter adjustment unit 915 , and a movement control parameter adjustment unit 917 .

[0082] The discharge control unit 910 controls the operation (delivery operation) of the pump 81 that delivers the processing liquid to the nozzle 71. The discharge control unit 910 controls the delivery operation of the pump 81 based on a preset discharge control parameter.

[0083] The discharge pressure measuring unit 911 measures a pressure waveform representing a temporal change in the discharge pressure. That is, the discharge pressure measuring unit 911 periodically acquires the discharge pressure measured by the pressure gauge 86 at a predetermined sampling period. Thus, the discharge pressure applied to the processing liquid during the period when the processing liquid is discharged from the nozzle 71 is acquired and stored in the storage unit 93 as data representing a pressure waveform (discharge data). The discharge data is data representing a relationship between a certain time and the discharge pressure measured at that time (that is, temporal change in the discharge pressure).

[0084] The movement control unit 912 controls the operation (movement operation) of the suction travel mechanism 52 that moves the substrate S relative to the nozzle 71 based on a preset movement control parameter.

[0085] The speed measuring unit 913 measures the moving speed of the substrate S by the chuck mechanism 51 and the adsorption travel mechanism 52. The speed measuring unit 913 measures the moving speed of the substrate S based on the output of the adsorption travel mechanism 52 (for example, the output of the rotary encoder, etc.). The speed measuring unit 913 stores the acquired speed as speed data in the storage unit 93. The speed data is data indicating the relationship between a time and the moving speed measured at that time (that is, the change of the moving speed over time).

[0086] The ejection control parameter adjustment unit 915 performs a process of optimizing the ejection control parameters. For example, the ejection control parameter adjustment unit 915 evaluates the pressure waveform obtained by performing simulated coating, and updates the ejection control parameters based on the evaluation result. The ejection control parameter adjustment unit 915 repeatedly performs simulated coating and acquisition of pressure waveform, evaluation of pressure waveform, and updating of ejection control parameters, thereby optimizing the ejection control parameters.

[0087] In the coating device 1, in order to coat the processing liquid ejected from the nozzle 71 on the upper surface Sf of the substrate S with a uniform film thickness, it is important to adjust the ejection speed, that is, the ejection pressure, of the processing liquid when ejected from the nozzle 71. Therefore, the ejection control parameter closely related to the pressure waveform is optimized so that the pressure waveform of the ejection pressure approaches the ideal waveform. Specifically, the ejection control parameter to be optimized is a set value that specifies the movement of the working disk portion 816, which is Figure 3 And the 16 pump control setting values ​​shown below.

[0088] ·Stable speed V1

[0089] Acceleration time T1: The time from a stopped state to a stable speed V1

[0090] Stable speed time T2: the time for maintaining stable speed V1

[0091] ·Stable speed V2

[0092] Deceleration time T3: The time it takes to decelerate from the stable speed V1 to the stable speed V2

[0093] Stable speed time T4: the time for maintaining stable speed V2

[0094] ·Stable speed V3

[0095] Acceleration time T5: The time to accelerate from stable speed V2 to stable speed V3

[0096] Stable speed time T6: the time for maintaining stable speed V3

[0097] ·Stable speed V4

[0098] Deceleration time T7: The time to decelerate from the stable speed V3 to the stable speed V4

[0099] Stable speed time T8: The time for maintaining stable speed V4

[0100] ·Stable speed V5

[0101] Acceleration time T9: The time to accelerate from stable speed V4 to stable speed V5

[0102] Stable speed time T10: the time for maintaining stable speed V5

[0103] Deceleration time T11: The time from the stable speed V5 to the stop state

[0104] The above 16 ejection control parameters are equivalent to the control amount for controlling the action (delivery action) of the pump 81 for delivering the processing liquid to the nozzle 71. It should be noted that there is no particular limitation on the type and number of ejection control parameters, and any control amount can be set as long as it is the control amount for controlling the delivery action of the pump 81.

[0105] The movement control parameter adjustment unit 917 adjusts the movement control parameters. The movement control parameter adjustment unit 917 updates the movement control parameters based on the simulated movement. "Simulated movement" refers to the simulated reproduction of the relative movement of the substrate S relative to the nozzle 71 during actual coating. In the simulated movement, the treatment liquid is not applied to the substrate S. For example, the simulated movement of the present embodiment means that the movement control unit 912 controls the adsorption travel mechanism 52 to move the chuck mechanism 51 according to the movement control parameters. It should be noted that in this simulated movement, the chuck mechanism 51 can actually hold the substrate S, or it can hold simulated components other than the substrate S. In addition, the chuck mechanism 51 may not hold anything.

[0106] The movement control parameter adjustment unit 917 evaluates the speed waveform obtained by the simulated movement, and updates the movement control parameters based on the evaluation result. Then, the simulated movement is performed again based on the updated movement control parameters. In this way, the movement control parameter adjustment unit 917 repeatedly simulates the movement and obtains the speed waveform, evaluates the speed waveform, and updates the movement control parameters, thereby optimizing the movement control parameters.

[0107] <Adjustment of control parameters>

[0108] Figure 5 is a diagram showing the flow of the control unit 9 adjusting the control parameters. Figure 5 As shown, the adjustment of the control parameters includes a first adjustment step S1, a second adjustment step S2, a third adjustment step S3 and a fourth adjustment step S4. It should be noted that the adjustment of the control parameters is performed in the order of the first adjustment step S1, the second adjustment step S2, the third adjustment step S3 and the fourth adjustment step S4. Each step is described below.

[0109] <First adjustment step S1>

[0110] Figure 6 Yes means Figure 5 Flow chart showing details of the first adjustment step S1 shown in FIG. The first adjustment step S1 is a step of adjusting discharge control parameters in advance by simulating coating when actually coating is performed in the coating device 1 .

[0111] like Figure 6 As shown, when the first adjustment process S1 starts, first, the ejection control parameter adjustment unit 915 sets the ejection control parameter to a predetermined initial value (step S11). The initial value may be an arbitrary value or a value set based on a predetermined algorithm. The ejection control parameter adjustment unit 915 stores the set ejection control parameter in the storage unit 93. It should be noted that the ejection control parameter adjustment unit 915 may also accept an input of an initial value from a user and store the received initial value in the storage unit 93.

[0112] After setting the ejection control parameters in step S11, the control unit 9 performs simulated coating and obtains a pressure waveform (step S12). Specifically, the control unit 9 moves the nozzle 71 to a predetermined maintenance position (a position opposite to the roller 721). Furthermore, the control unit 9 controls the pump 81 according to the control parameters set in the first adjustment step S1, and ejects the processing liquid from the nozzle 71 to the roller 721. In addition, during the simulated coating, the ejection pressure measuring unit 911 samples the ejection pressure measured by the pressure gauge 86 and obtains the data of the pressure waveform. The pressure waveform obtained in step S12 is an example of a "first pressure waveform".

[0113] After the pressure waveform of the simulated coating is obtained in step S12, the pressure waveform is evaluated (step S13). As an example of the evaluation method, the ejection control parameter adjustment unit 915 determines whether the pressure waveform obtained in step S12 is consistent with the first ideal waveform Wt1 (refer to FIG. 1 ) as an ideal pressure waveform. Fig. 9 Specifically, whether the deviation of the pressure waveform obtained in step S12 from the first ideal waveform Wt1 exceeds a prescribed allowable range.

[0114] It should be noted that in step S13, the user can also evaluate the pressure waveform. In this case, the ejection control parameter adjustment unit 915 can cause the display to display the pressure waveform and the first ideal waveform Wt1. In addition, the ejection control parameter adjustment unit 915 can also cause the display to display the above-mentioned deviation amount. In this way, by displaying various information on the display, the user can be appropriately supported in evaluation. In addition, the ejection control parameter adjustment unit 915 can accept the input of the evaluation result from the user through the input device, and store the input evaluation result in the storage unit 93.

[0115] When it is evaluated by step S13 that the pressure waveform of the simulated coating is the same as the first ideal waveform Wt1 (for example, the deviation is within the allowable range. "Yes" in step S13), the coating device 1 ends the first adjustment process S1. On the other hand, when it is evaluated by step S13 that the pressure waveform of the simulated coating is different from the first ideal waveform Wt1 (for example, the deviation exceeds the allowable range. "No" in step S13). The coating device 1 updates the ejection control parameters (step S14). Specifically, the ejection control parameter adjustment unit 915 updates the ejection control parameters stored in the storage unit 93 based on the evaluation result of step S13, so that the pressure waveform during the simulated coating becomes the first ideal waveform Wt1. As an algorithm for updating the ejection control parameters, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming method, etc. can be arbitrarily selected.

[0116] It should be noted that the discharge control parameter can be updated using a learned model that has learned the relationship between the amount of change in the discharge control parameter and the amount of deviation, as described in Patent Document 1. A neural network can be used as the learning model.

[0117] In addition, in step S14 , the user may be allowed to update the discharge control parameter. In this case, the discharge control parameter adjustment unit 915 may receive input of a new discharge control parameter through an input device and store the received discharge control parameter in the storage unit 93 .

[0118] As described above, in the first adjustment step S1, the discharge control parameters for actual coating are adjusted based on the pressure waveform obtained by the simulated coating in step S12. Therefore, compared with the case where the discharge control parameters are adjusted by actual coating, consumption of the substrate S can be suppressed.

[0119] <Second adjustment step S2>

[0120] Figure 7 Yes means Figure 5 Flow chart showing details of the second adjustment step S2 shown in FIG. The second adjustment step S2 is a step of adjusting the movement control parameters in advance by simulating movement when actually coating is performed in the coating device 1 .

[0121] like Figure 7 As shown, when the second adjustment process S2 starts, first, the mobile control parameter adjustment unit 917 sets the mobile control parameter to a predetermined initial value (step S21). The initial value can be an arbitrary value or a value set based on a predetermined algorithm. The mobile control parameter adjustment unit 917 stores the set mobile control parameter in the storage unit 93. It should be noted that the mobile control parameter adjustment unit 917 can also accept an input of an initial value from a user and store the received initial value in the storage unit 93.

[0122] After the movement control parameters are set in step S21, the control unit 9 performs simulated movement and obtains the speed waveform (step S22). Specifically, the movement control unit 912 controls the adsorption travel mechanism 52 according to the movement control parameters, thereby moving the chuck mechanism 51 holding the substrate S. In addition, during the simulated movement, the speed measuring unit 913 samples the movement speed of the chuck mechanism 51 based on the output of the adsorption travel mechanism 52, and obtains data of the speed waveform.

[0123] After obtaining the speed waveform of the simulated movement in step S22, the speed waveform is evaluated (step S23). As an example of the evaluation method, the movement control parameter adjustment unit 917 evaluates whether the shape of the speed waveform is the same as the shape of the pressure waveform adjusted in step S11. It should be noted that when comparing the shape of the speed waveform and the shape of the pressure waveform, normalization is performed to make the scale of the speed in the speed waveform consistent with the scale of the pressure in the pressure waveform. In addition, it is determined whether the deviation of the speed waveform relative to the pressure waveform exceeds a prescribed allowable range.

[0124] It should be noted that a regression parameter obtained by regressing the velocity waveform and the pressure waveform using a predetermined function may be derived as an evaluation value, and whether the shapes are consistent may be determined based on the evaluation value.

[0125] In addition, in step S23, the user may also evaluate the velocity waveform. In this case, the mobile control parameter adjustment unit 917 may cause the display to display the normalized velocity waveform and pressure waveform. In addition, the mobile control parameter adjustment unit 917 may cause the display to display the above-mentioned deviation amount. In this way, by displaying various information on the display, the user can be appropriately supported in evaluation. In addition, the mobile control parameter adjustment unit 917 may receive input of the evaluation result from the user through the input device, and store the input evaluation result in the storage unit 93.

[0126] When it is evaluated by step S23 that the shape of the speed waveform of the simulated movement is the same as the shape of the pressure waveform (for example, the deviation is within the allowable range. "Yes" in step S23), the coating device 1 ends the second adjustment process S2. On the other hand, when it is evaluated by step S23 that the shape of the speed waveform of the simulated movement is different from the shape of the pressure waveform (for example, the deviation exceeds the allowable range. "No" in step S23), the coating device 1 updates the movement control parameters (step S24). Specifically, the movement control parameter adjustment unit 917 updates the movement control parameters stored in the storage unit 93 so that the shape of the movement waveform during the simulated movement becomes the pressure waveform. As an algorithm for updating the movement control parameters, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming method, etc. can be arbitrarily selected.

[0127] In addition, the movement control parameter may be updated using a learned model that has learned the relationship between the change amount of the movement control parameter and the deviation amount. A neural network may be used as a learning model.

[0128] In addition, in step S24 , the user may be allowed to update the movement control parameters. In this case, the movement control parameter adjustment unit 917 may receive input of new movement control parameters from the user through an input device, and store the received movement control parameters in the storage unit 93 .

[0129] As described above, in the second adjustment step S2, the movement control parameters are adjusted so that the shape of the velocity waveform matches the shape of the pressure waveform. By performing actual coating according to the movement control parameters adjusted as described above, the processing liquid can be coated on the substrate S with a uniform thickness.

[0130] <Third adjustment step S3>

[0131] Figure 8 Yes means Figure 5 The third adjustment step S3 is a step of re-adjusting the discharge control parameters adjusted in the first adjustment step S1 based on the pressure waveform obtained by the simulated coating when the coating device 1 performs actual coating.

[0132] When the third adjustment process S3 starts, the coating device 1 performs actual coating according to the ejection control parameters adjusted by the first adjustment process S1 and the movement control parameters adjusted by the second adjustment process S2, and obtains the pressure waveform (step S31). Specifically, the coating mechanism 7 moves the nozzle 71 to the coating position. In addition, the movement control unit 912 controls the adsorption travel mechanism 52 according to the movement control parameters to move the substrate S, and the ejection control unit 910 controls the pump 81 according to the ejection control parameters to eject the processing liquid from the nozzle 71 to the substrate S. In addition, during the actual coating, the ejection pressure measuring unit 911 samples the ejection pressure measured by the pressure gauge 86 to obtain the pressure waveform. The pressure waveform obtained by step S31 is an example of the "second pressure waveform".

[0133] After the pressure waveform of the actual coating is obtained in step S31, the pressure waveform is evaluated (step S32). The pressure waveform evaluation method in step S32 can also be the same as that in step S33. Figure 6 That is, the discharge control parameter adjustment unit 915 may determine whether the deviation amount of the pressure waveform acquired in step S31 from the first ideal waveform Wt1 exceeds a predetermined allowable range.

[0134] It should be noted that, in step S32, the user can also evaluate the pressure waveform actually applied. In this case, the ejection control parameter adjustment unit 915 can also cause the display to display the pressure waveform and the first ideal waveform Wt1. In addition, the ejection control parameter adjustment unit 915 can also cause the display to display the above-mentioned deviation amount. In this way, by displaying various information on the display, the user can be appropriately supported in evaluation. In addition, the ejection control parameter adjustment unit 915 can accept the input of the evaluation result from the user through the input device, and store the input evaluation result in the storage unit 93.

[0135] When it is evaluated by step S32 that the pressure waveform actually applied is the same as the first ideal waveform (for example, the deviation is within the allowable range. "Yes" in step S32), the coating device 1 ends the third adjustment process S3. On the other hand, in step S32, when it is evaluated that the pressure waveform actually applied is different from the first ideal waveform Wt1 (for example, the deviation exceeds the allowable range. "No" in step S32), the control unit 9 determines that the ejection control parameters need to be readjusted, and readjusts the ejection control parameters.

[0136] In the re-adjustment of the ejection control parameters, the ejection control parameter adjustment unit 915 updates the ejection control parameters (step S33). Specifically, the ejection control parameter adjustment unit 915 updates the ejection control parameters stored in the storage unit 93 so that the pressure waveform during the simulated coating becomes the second ideal waveform Wt2 described later (see Figure 6 ). As an algorithm for updating the ejection control parameters, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming method, etc. can be arbitrarily selected.

[0137] It should be noted that the discharge control parameter can be updated using a learned model that has learned the relationship between the amount of change in the discharge control parameter and the amount of deviation, as described in Patent Document 1. A neural network can be used as the learning model.

[0138] In addition, in step S33 , the user may be allowed to update the ejection control parameter. In this case, the ejection control parameter adjustment unit 915 may receive input of a new ejection control parameter from the user through an input device and store the received ejection control parameter in the storage unit 93 .

[0139] Fig. 9: is a diagram showing an example of setting the second ideal waveform Wt2. The second ideal waveform Wt2 is generated, for example, by the ejection control parameter adjustment unit 915 and stored in the storage unit 93. The second ideal waveform Wt2 has a shape different from the first ideal waveform Wt1. Specifically, the second ideal waveform Wt2 has a shape obtained by deforming the first ideal waveform Wt1 based on the difference (deviation) between the actual applied pressure waveform Wr1 obtained by step S31 and the first ideal waveform Wt1. More specifically, the second ideal waveform Wt2 has a shape obtained by subtracting the above difference from the first ideal waveform Wt1. It should be noted that the shape of the second ideal waveform Wt2 is not limited to. Fig. 9 The shapes shown can be set appropriately.

[0140] Return to Figure 8 After the ejection control parameters are updated in step S33, the coating device 1 performs simulated coating according to the updated ejection control parameters (step S34). When the nozzle 71 is in the coating position above the coating station 32, the coating mechanism 7 moves the nozzle 71 to the maintenance position. Moreover, the treatment liquid is ejected from the nozzle 71 to the rotating roller 721. During the simulated coating, the ejection pressure measuring unit 911 samples the ejection pressure measured by the pressure gauge 86 to obtain a pressure waveform. The pressure waveform obtained in step S34 is an example of a "third pressure waveform".

[0141] After obtaining the pressure waveform of the simulated coating in step S34, the pressure waveform is evaluated (step S35). The pressure waveform evaluation method can also be the same as that of Figure 6 The evaluation method of the pressure waveform in step S13 shown is the same. However, in step S35, the second ideal waveform Wt2 is used instead of the first ideal waveform Wt1. Specifically, the ejection control parameter adjustment unit 915 can determine whether the deviation of the pressure waveform obtained in step S34 from the second ideal waveform Wt2 exceeds a prescribed allowable range.

[0142] It should be noted that in step S35, the user can also evaluate the pressure waveform. In this case, the ejection control parameter adjustment unit 915 can also cause the display to display the pressure waveform and the second ideal waveform Wt2. In addition, the ejection control parameter adjustment unit 915 can also cause the display to display the above-mentioned deviation amount. In this way, by displaying various information on the display, the user can be appropriately supported in evaluation. In addition, the ejection control parameter adjustment unit 915 can accept the input of the evaluation result from the user through the input device, and store the input evaluation result in the storage unit 93.

[0143] When it is evaluated through step S35 that the pressure waveform of the simulated coating is different from the second ideal waveform Wt2 (for example, the deviation exceeds the allowable range. "No" in step S35), the coating device 1 performs step S33 (update of the ejection control parameters) again. On the other hand, when it is evaluated through step S35 that the pressure waveform of the simulated coating is the same as the second ideal waveform Wt2 (for example, the deviation is within the allowable range. "Yes" in step S35), the coating device 1 performs step S31 (acquisition of the pressure waveform of the actual coating) again. In this way, the coating device 1 repeatedly performs steps S33 to S35 until it is evaluated that the pressure waveform obtained by the simulated coating is the same as the second ideal waveform Wt2, thereby readjusting the ejection control parameters.

[0144] As described above, in the third adjustment step S3, when it is evaluated in step S32 that the pressure waveform of actual coating is not an ideal waveform, the ejection control parameters are readjusted based on the pressure waveform obtained by the simulated coating in step S34. Thus, the ejection control parameters can be readjusted while suppressing the consumption of the substrate S. By suppressing the consumption of the substrate S, the environmental load can be reduced.

[0145] Since the environmental conditions of the simulated coating and the actual coating are different, the pressure waveform obtained may sometimes change even with the same ejection control parameters. In this embodiment, the second ideal waveform Wt2, which is the reference for evaluating the pressure waveform of the simulated coating, is set to a shape in which the first ideal waveform Wt1 is deformed according to the difference between the pressure waveform Wr1 of the actual coating and the first ideal waveform Wt1. Therefore, the ejection control parameters can be appropriately readjusted so that the pressure waveform of the actual coating becomes the first ideal waveform Wt1.

[0146] <Fourth Adjustment Step S4>

[0147] Fig.10 Yes means Figure 5 The fourth adjustment step S4 is a step of re-adjusting the discharge control parameters adjusted in the third adjustment step S3 based on the pressure waveform obtained by the actual coating while the actual coating is being performed in the coating device 1 .

[0148] When the fourth adjustment process S4 starts, the coating device 1 performs actual coating according to the ejection control parameters adjusted by the third adjustment process S3 and the movement control parameters adjusted by the second adjustment process S2, and obtains a pressure waveform (step S41). The pressure waveform obtained by the actual coating using the ejection control parameters adjusted by the third adjustment process S3 is an example of the "fourth pressure waveform".

[0149] After the pressure waveform of the actual coating is obtained in step S41, the pressure waveform is evaluated (step S42). As an example of the evaluation method, the ejection control parameter adjustment unit 915 determines whether the pressure waveform of the actual coating obtained in step S41 is the same as the first ideal waveform Wt1. More specifically, it is determined whether the deviation of the pressure waveform of the actual coating relative to the first ideal waveform Wt1 exceeds the allowable range.

[0150] It should be noted that in step S42, the user can also evaluate the pressure waveform. In this case, the ejection control parameter adjustment unit 915 can also cause the display to display the pressure waveform and the first ideal waveform Wt1. In addition, the ejection control parameter adjustment unit 915 can also cause the display to display the above-mentioned deviation amount. In this way, by displaying various information on the display, the user can be appropriately supported in evaluation. In addition, the ejection control parameter adjustment unit 915 can accept the input of the evaluation result from the user through the input device, and store the input evaluation result in the storage unit 93.

[0151] When it is evaluated in step S42 that the pressure waveform actually applied is different from the first ideal waveform Wt1 (for example, when the deviation exceeds the allowable range. "No" in step S42), the ejection control parameter adjustment unit 915 updates the ejection control parameters (step S43). Specifically, the ejection control parameter adjustment unit 915 updates the ejection control parameters stored in the storage unit 93 based on the evaluation result of step S42 so that the pressure waveform actually applied becomes the first ideal waveform Wt1. As an algorithm for updating the ejection control parameters, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming method, etc. can be arbitrarily selected.

[0152] Furthermore, for example, the discharge control parameter can be updated using a learned model that has learned the relationship between the amount of change in the discharge control parameter and the amount of deviation, as described in Patent Document 1. A neural network can be used as the learning model.

[0153] When the discharge control parameters are updated in step S43, the coating device 1 executes step S41 again (acquisition of the pressure waveform based on actual coating). The pressure waveform of actual coating acquired using the updated discharge control parameters is an example of the “fifth pressure waveform”.

[0154] When it is evaluated by step S42 that the pressure waveform of the actual coating is the same as the first ideal waveform Wt1 (for example, the deviation is within the allowable range. "Yes" in step S42), the coating device 1 determines whether to end the actual coating (step S43). When it is determined by step S43 that the actual coating is ended (for example, there is no substrate S that should be coated. "Yes" in step S43), the coating device 1 ends the fourth adjustment process S4. When it is determined by step S43 that the actual coating is continued (for example, there is a substrate S that should be coated. "No" in step S43), the coating device 1 performs step S41 again.

[0155] As described above, in the first adjustment step S1 and the third adjustment step S3, since the ejection control parameters are updated based on the pressure waveform obtained by the simulated coating, it may happen that the ejection control parameters cannot be fully adjusted to match the actual coating. In view of this, in the fourth adjustment step S4, the ejection control parameters are updated based on the pressure waveform obtained by the actual coating. Therefore, the ejection control parameters can be adjusted to match the actual coating. Therefore, in the actual coating, the ideal pressure waveform can be reproduced.

[0156] In addition, when it is desired to adjust the ejection control parameters only through the fourth adjustment step S4 without performing the first adjustment step S1 and the third adjustment step S3, a large amount of substrates are consumed, which may increase the environmental load. In this embodiment, first, after the ejection control parameters are adjusted to a certain extent through the first adjustment step S1 and the third adjustment step S3, the fourth adjustment step S4 is performed, so that the consumption of the substrate S can be suppressed. As a result, the environmental load can be reduced.

[0157] <2. Modifications>

[0158] Although the embodiments have been described above, the present invention is not limited to the above contents and various modifications are possible.

[0159] For example, in the above embodiment, the simulated coating is performed by spraying the coating liquid onto the roller 721. However, the coating liquid may be sprayed onto a portion other than the roller 721. For example, the coating liquid may be sprayed onto a container such as the roller groove 723 that can receive the coating liquid sprayed from the nozzle 71.

[0160] The present invention has been described in detail, and the above description is illustrative in all aspects, and the present invention is not limited thereto. It should be understood that many unillustrated variations can be thought of without departing from the scope of the present invention. As long as there is no contradiction, the various structures described in the above-mentioned embodiments and various variations can be appropriately combined or omitted.

Claims

1. A control parameter adjustment method, which adjusts a spray control parameter, wherein the spray control parameter is used to control the spraying of a treatment liquid from a nozzle, wherein: include: Step a), adjusting the ejection control parameter based on a first pressure waveform indicating a pressure change in the nozzle during simulated coating, wherein the simulated coating refers to ejecting a processing liquid from the nozzle to a portion other than the substrate; Step b), acquiring a second pressure waveform indicating a pressure change in the nozzle when actually applying the processing liquid from the nozzle to the substrate according to the discharge control parameter adjusted in step a); Step c), determining whether to readjust the ejection control parameter based on the second pressure waveform; Step d), when it is determined in step c) that readjustment is necessary, readjusting the ejection control parameter based on a third pressure waveform indicating a pressure change in the nozzle when the simulated coating is performed again; Step e), acquiring a fourth pressure waveform indicating a pressure change in the nozzle during the actual coating according to the ejection control parameter readjusted in step d); Step f), determining whether to readjust the ejection control parameter based on the fourth pressure waveform; and g) when it is determined in the step f) that readjustment is necessary, readjusting the discharge control parameter based on a fifth pressure waveform indicating a pressure change in the nozzle during the actual coating.

2. The control parameter adjustment method according to claim 1, wherein: The method further comprises: step h), adjusting a movement control parameter, wherein the movement control parameter is used to control the relative movement of the substrate relative to the nozzle. The actual coating comprises moving the substrate relative to the nozzle according to the movement control parameter adjusted in the step h), and ejecting the processing liquid from the nozzle toward the substrate.

3. The control parameter adjustment method according to claim 2, wherein: The step h) adjusts the movement control parameter based on a speed waveform indicating a change in a relative movement speed of the substrate with respect to the nozzle.

4. A computer program product comprising a computer executable program, wherein: The program causes the computer to execute the control parameter adjustment method according to claim 1 or 2.

5. A computer-readable storage medium having a computer program stored thereon, wherein: The computer program causes the computer to execute the control parameter adjustment method according to claim 1 or 2.

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