Hydrogen energy fuel cell circuit board and method of manufacturing the same

Abstract

The application discloses a kind of hydrogen energy fuel cell circuit board and its manufacturing method, circuit board has by surface layer, first current collecting layer, temperature measuring layer, calibration layer, resistance layer and second current collecting layer sequentially laminated and compressed circuit board body, and circuit board body is set as multiple mutually insulated subareas;Wherein, temperature sensing resistance of temperature measuring layer is used to measure the temperature of current through the first current collecting layer of surface layer first flow channel convergence, to obtain the real-time temperature data of battery internal subarea;Resistance layer is used to measure the voltage of subarea resistance when current through second flow channel on circuit board body flows through subarea resistance, to obtain battery internal subarea current data.The manufacturing procedure of the application is simple and can ensure that normal current is effectively collected to second current collecting layer after subarea resistance, to obtain each subarea current density data.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology for hydrogen fuel cells, and more particularly to a circuit board capable of real-time detection of the internal temperature and current density of a hydrogen fuel cell, and a method for manufacturing the circuit board. Background Technology

[0002] A fuel cell mainly consists of a proton exchange membrane, a catalyst layer, an air diffusion layer, and bipolar plates. As the core component of a fuel cell, the bipolar plates play many important roles, including supporting the membrane electrode structure, separating hydrogen and oxygen, collecting electrons, conducting heat, providing hydrogen and oxygen channels, discharging water produced in the reaction, and providing coolant flow channels.

[0003] In the industry, bipolar plates are obtained by processing the front and back copper layers of a circuit board (multilayer board) that has completed basic processing through flow channel processing. The upper surface of the bipolar plate is closely attached to the fuel cell cell. During the operation of the fuel cell, the heat generated is conducted through the bipolar plate, and excessive heat generation will affect the performance of the battery. In addition, in the existing circuit board manufacturing, single-layer feature processing is used for lamination and stacking, and it is difficult to accurately control the interlayer conductivity or insulation. At the same time, the manufacturing process is complicated. Summary of the Invention

[0004] To overcome the above-mentioned defects, the present invention provides a circuit board that is simple and reliable to manufacture and can detect the temperature and current density of the internal compartments of a hydrogen fuel cell in real time.

[0005] The first technical solution adopted by this invention to solve its technical problem is: providing a circuit board for a hydrogen energy fuel cell, including a circuit board body, defining the upper and lower surfaces of the circuit board body as the front and back surfaces of the circuit board, respectively. The front surface of the circuit board is connected to the fuel cell, and the back surface of the circuit board is connected to the load. The circuit board body includes, from top to bottom, a surface layer, a first current collector layer, a temperature sensing layer, a resistance layer, and a second current collector layer. The circuit board body has several non-conductive partitions, and each partition is provided with:

[0006] A first flow channel, wherein a plurality of the first flow channels longitudinally penetrate the surface layer and the first flow collection layer, for connecting the surface layer and the first flow collection layer;

[0007] The second flow channel extends longitudinally through the surface layer, the first current collector layer, the temperature measuring layer, and the resistance layer, and is used to connect the positive terminal of the partition resistor of the resistance layer to the surface layer and the first current collector layer.

[0008] The third current guiding channel extends longitudinally through the resistor layer and the second current collecting layer, and the third current guiding channel is used to connect the negative terminal of the partition resistor of the resistor layer to the second current collecting layer;

[0009] The upper surface of the surface layer is the front side of the circuit board body, and the lower surface of the second current collector layer is the back side of the circuit board body.

[0010] The current in each partition is received by the surface layer on the front of the circuit board and then guided and collected by several first current guiding channels on that partition to the first current collector layer. The heat generated when the current is collected is detected in real time by the temperature sensing resistor set on the temperature measuring layer below the first current collector layer.

[0011] Synchronously, the current received by each partition flows through the positive and negative terminals of the partition resistor in the resistor layer via the second current channel, and then converges to the back of the circuit board body via the third current channel. The current data of the partition is obtained by detecting the current flowing through the partition resistor.

[0012] As a further improvement of the present invention, a calibration layer is provided between the temperature sensing layer and the resistance layer to change the number of layers in the circuit board body.

[0013] Another technical solution adopted by the present invention to solve its technical problem is: providing a method for manufacturing a circuit board for a hydrogen fuel cell, wherein the circuit board includes a first double-sided copper-clad laminate, an insulating layer, a second double-sided copper-clad laminate, an insulating layer, and a third double-sided copper-clad laminate stacked sequentially from top to bottom, and the method for manufacturing the circuit board is as follows:

[0014] S1: Several dividing grooves are cut on the front and back copper foils of the first layer of double-sided copper clad laminate to form several partitions. Several first flow channels penetrating the first layer of double-sided copper clad laminate are provided on each partition. The front and back copper foils of the first layer of double-sided copper clad laminate form a surface layer and a first current collection layer, respectively, and the surface layer and the first current collection layer are connected through the first flow channels.

[0015] S2: Several temperature sensing resistors connected in series are set on the front copper foil of the second double-sided copper-clad laminate, wherein the front and back copper foils of the second double-sided copper-clad laminate form a temperature measuring layer and a calibration layer, respectively.

[0016] S3: Cut several dividing grooves on the front copper foil of the third double-sided copper-clad laminate to form several partitions, and set partition resistors on each partition. The front and back copper foils of the third double-sided copper-clad laminate form a resistor layer and a second current collector layer, respectively. At the same time, a third current guide channel is set on each partition, which penetrates the third double-sided copper-clad laminate and is connected to the negative terminal of the partition resistor.

[0017] S4: The first layer of double-sided copper clad laminate, the second layer of double-sided copper clad laminate, and the third layer of double-sided copper clad laminate obtained from S1, S2, and S3 are stacked sequentially, and an insulating layer is set between adjacent boards before pressing them together to form a laminated board. A second current-conducting channel is set in each partition of the laminated board, which penetrates the laminated board and is connected to the positive terminal of the partition resistor.

[0018] S5: Copper plating and electroless gold plating are performed on the front and back sides of the S4 laminate to obtain the circuit board body.

[0019] As a further improvement of the present invention, in S1, a plurality of first through holes are arrayed on each partition of the first double-sided copper-clad foil by means of mechanical drilling, and a copper layer is electroplated on the hole wall of the first through hole to form a first flow channel connecting the surface layer and the first current collection layer, and the first flow channel is filled with resin.

[0020] As a further improvement of the present invention, in S3, a second through hole is formed on each partition of the third double-sided copper-clad laminate by mechanical drilling. A copper layer is electroplated on the hole wall of the second through hole to form a third current-conducting channel that connects the negative electrode of the partition resistor of the resistor layer and the second current-collecting layer, and the third current-conducting channel is filled with resin.

[0021] As a further improvement of the present invention, in S4, before forming the second flow channel, a third through hole is formed on each partition of the laminate by mechanical drilling, and a pre-flow hole is formed by electroplating a copper layer on the hole wall of the third through hole to connect the positive electrode of the partition resistor of the surface layer, the first current collector layer, the resistor layer, and the second current collector layer.

[0022] As a further improvement of the present invention, non-flow guiding holes are provided on the laminated plate from its back side to its front side by mechanical drilling. These holes are concentric with the pre-flow guiding holes and have a diameter larger than that of the pre-flow guiding holes, so as to form a second flow guiding channel that is not connected to the second flow collection layer.

[0023] As a further improvement of the present invention, the depth dimension of the non-drainage hole is less than half the thickness dimension of the third layer of double-sided copper clad laminate.

[0024] As a further improvement of the present invention, in S4, before forming the laminate, each partition of the second double-sided copper-clad foil is provided with a clearance ring, the clearance ring being concentrically arranged with the second flow channel and having a diameter larger than the outer diameter of the second flow channel.

[0025] As a further improvement of the present invention, the temperature sensing resistor is made of copper wires arranged in a serpentine pattern.

[0026] The beneficial effects of this invention are:

[0027] 1. By setting multiple mutually insulated partitions on the circuit board body, and collecting the current generated in each partition through the surface layer and the first current guiding channel to the first current collector layer, the heat generated when the current is collected to the first current collector layer is measured by the temperature sensing resistor set on the temperature measuring layer, thereby obtaining the real-time temperature data of each partition inside the battery.

[0028] 2. By setting a second current channel in each partition of the circuit board body, the current on the surface layer and the second current collector layer flows through the positive and negative terminals of the partition resistor in that partition through the second current channel, and then is collected through the third current channel to the back of the second current collector layer and connected to the external load. By detecting the voltage across the partition resistor, the partition current data inside the battery can be obtained.

[0029] 3. By setting through holes after laminating the circuit board body, and then back-drilling a certain distance from the second current collector layer after electroplating to form a second current guiding channel, the manufacturing process is simple and can ensure that the normal current is collected to the second current collector layer after passing through the partition resistor, thereby obtaining the current density data of each partition. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structural principle of the circuit board provided by the present invention.

[0031] Referring to the accompanying drawings, the following explanations are provided:

[0032] A. First layer of double-sided copper clad laminate; B. Second layer of double-sided copper clad laminate; C. Third layer of double-sided copper clad laminate; 1. Surface layer; 11. Dividing groove; 2. First current collector layer; 3. Temperature sensing layer; 31. Temperature sensing resistor; 4. Calibration layer; 40. Clearance ring; 5. Resistor layer; 51. Zone resistor; 6. Second current collector layer; 61. Non-guided hole; 7. Zone; 8. First guide channel; 9. Second guide channel; 10. Third guide channel. Detailed Implementation

[0033] The preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0034] This invention provides a circuit board for hydrogen fuel cells and a method for manufacturing the same.

[0035] The circuit board for hydrogen fuel cells of the present invention includes a circuit board body, see reference. Figure 1The circuit board body is defined with its upper and lower surfaces as the front and back surfaces, respectively. The front surface connects to the fuel cell, and the back surface connects to the load. The circuit board body includes, from top to bottom, a surface layer 1, a first current collector layer 2, a temperature sensing layer 3, a resistor layer 5, and a second current collector layer 6. The circuit board body has several non-conductive partitions 7. Each partition 7 has a first current guiding channel 8, a second current guiding channel 9, and a third current guiding channel 10. The first current guiding channels 8 penetrate the surface layer 1 longitudinally and are used for interlayer conduction between the surface layer 1 and the first current collector layer 2. The second current guiding channels 9 penetrate the surface layer 1, the first current collector layer 2, the temperature sensing layer 3, and the resistor layer 5 longitudinally and are used to connect the positive terminal of the partition resistor 51 of the resistor layer 5 to the surface layer 1 and the first current collector layer 2. The third current guiding channel 10 penetrates the resistor layer 5 and the second current collector layer 6 longitudinally and is used to connect the negative terminal of the partition resistor 51 of the resistor layer 5 to the second current collector layer 6.

[0036] Among them, the upper surface of surface layer 1 is the front of the circuit board, and the lower surface of the second current collector layer 6 is the back of the circuit board.

[0037] The current on each partition 7 is received by the surface layer 1 on the front of the circuit board and then guided and collected by several first current guiding channels 8 on the partition 7 to the first current collecting layer 2. The heat generated when the current is collected is detected in real time by the temperature sensing resistor 31 set on the temperature measuring layer 3 below the first current collecting layer 2.

[0038] Synchronously, the current received by each partition 7 flows through the positive and negative terminals of the partition resistor 51 of the resistor layer 5 via the second current channel 9, and then is collected to the back of the circuit board via the third current channel 10. The current data of partition 7 is obtained by detecting the current flowing through the partition resistor 51.

[0039] Furthermore, to ensure the circuit board has an even number of layers, a calibration layer 4 is provided between the temperature sensing layer 3 and the resistance layer 5 to change the number of layers in the circuit board itself. The calibration layer 4 is not wired, only copper is laid, and a clearance ring 40 is provided to prevent this layer from communicating with the second current guiding channel 9.

[0040] By providing a first current-guiding channel on the circuit board body to achieve interlayer conductivity between the surface layer 1 and the first current-collecting layer 2, the current received on the front side of the circuit board is collected into the first current-collecting layer 2 through the first current-guiding channel. The operating temperature of each zone is detected in real time by converting the resistance and temperature relationship. By providing a second current-guiding channel 9 connected to the positive terminal of the zone resistor and a third current-guiding channel 10 connected to the negative terminal of the zone resistor, the current of each zone is collected from the front side of the circuit board to the back side. The current flowing through the zone resistor is obtained by detecting the voltage across the two ends of the zone resistor. The circuit board for hydrogen fuel cells provided by this invention can not only monitor the temperature and current inside the hydrogen fuel cell in real time, but also quickly locate the abnormal zone when an anomaly occurs inside the battery through the zone setting.

[0041] Based on the circuit board for hydrogen fuel cells provided above, the present invention provides a method for manufacturing the circuit board to provide a circuit board body having a surface layer 1, a first current collector layer 2, a temperature sensing layer 3, a calibration layer 4, a resistance layer 5, and a second current collector layer 6.

[0042] It is known that each layer of the circuit board uses FR4 type double-sided copper-clad laminate of the same specification as the substrate. To ensure good conductivity, the thickness of the double-sided copper foil is 18μm, and the thickness of the FR4 board is selected according to the layout of each layer. In addition, insulating layers D are respectively provided between the first double-sided copper-clad laminate A and the second double-sided copper-clad laminate B, and between the second and third double-sided copper-clad laminate C to ensure insulation between each layer. (See reference...) Figure 1 In the schematic diagram, the dividing groove 11 of the front copper foil of the first layer double-sided copper foil board A and the third layer double-sided copper foil board C is shown. The dividing groove 11 is set to divide the entire circuit board into different mutually insulated partitions, so as to quickly locate the fault point according to the partition when the battery power supply fails.

[0043] The manufacturing process of the circuit board of the present invention is as follows.

[0044] S1: Several dividing grooves 11 are cut on the front and back copper foils of the first layer double-sided copper clad laminate A to form several partitions 7. Several first flow channels 8 penetrating the first layer double-sided copper clad laminate A are set on each partition 7. The front and back copper foils of the first layer double-sided copper clad laminate A form a surface layer 1 and a first current collection layer 2, respectively, and the surface layer 1 and the first current collection layer 2 are connected through the first flow channels 8.

[0045] Specifically, the processing procedure for the first layer of double-sided copper-clad laminate A in this application is as follows:

[0046] First, material preparation: The double-sided copper-clad laminate is processed into the first layer of double-sided copper-clad laminate A, which conforms to the engineering design dimensions, through cutting and baking.

[0047] Then, several first through holes are drilled in each partition 7 of the first double-sided copper-clad laminate A by mechanical drilling. The diameter of the first through holes is 0.5 mm, and they are arranged in a rectangular array on each partition 7 (partition 7 is made in the last step, and is described here for ease of description).

[0048] Next, copper layers with a thickness of 40μm are formed on the hole wall of the first through hole and on the front and back copper foils of the first double-sided copper-clad laminate A by copper plating and electroplating, so that the first through hole forms a first flow channel 8 that connects the front and back copper foils of the first double-sided copper-clad laminate A. Then the first flow channel 8 is completely filled with resin.

[0049] Finally, a dividing groove 11 is made on the back side of the first double-sided copper clad laminate A by exposure, development and etching, so that multiple mutually insulated partitions 7 are formed on the back side of the first double-sided copper clad laminate A.

[0050] S2: Several temperature sensing resistors 31 connected in series are set on the front copper foil of the second double-sided copper-clad laminate B, wherein the front and back copper foils of the second double-sided copper-clad laminate B form a temperature measuring layer 3 and a calibration layer 4, respectively.

[0051] Specifically, the processing procedure for the second layer of double-sided copper-clad laminate B in this application is as follows:

[0052] First, material preparation: The double-sided copper-clad laminate is processed into a second layer of double-sided copper-clad laminate B that conforms to the engineering design dimensions after being cut and baked.

[0053] Then, after exposure, development and etching, circuit patterns are formed on the front and back sides of the second double-sided copper clad laminate B. The circuit patterns include a serpentine temperature sensing resistor 31 formed on the front copper foil of the second double-sided copper clad laminate B, and a clearance ring 40 formed on the back copper foil of the second double-sided copper clad laminate B.

[0054] Furthermore, temperature sensing resistors 31 are arranged for each partition 7, and multiple temperature sensing resistors 31 are connected in series to form a loop. The two ends of the loop are led out of the circuit board and connected to an external power supply. At the same time, sampling lines are also led out from both ends of each temperature sensing resistor 31 to a standard connector to detect the resistance of each partition in real time. The interface for the external power supply and the standard connectors reserved on the circuit board are the same as the existing circuit board wiring design, and will not be described in detail here.

[0055] Furthermore, the avoidance ring 40 is arranged corresponding to the position of the second flow channel 9 in each partition. The main function of the avoidance ring 40 is to prevent the second flow channel 9 from conducting with the back copper foil of the second double-sided copper-clad laminate B. Alternatively, mechanical drilling can be used to drill through holes with a diameter larger than that of the second flow channel 9 at the corresponding position of the second flow channel 9.

[0056] S3: Cut several dividing grooves 11 on the front copper foil of the third double-sided copper clad laminate C to form several partitions 7. Set partition resistors 51 on each partition 7. The front and back copper foils of the third double-sided copper clad laminate C form a resistor layer 5 and a second current collector layer 6, respectively. At the same time, a third current guide channel 10 is set on each partition 7, which penetrates the third double-sided copper clad laminate C and is connected to the negative terminal of the partition resistor 51.

[0057] Specifically, the processing procedure for the third layer double-sided copper-clad laminate C in this application is as follows:

[0058] First, material preparation: The double-sided copper-clad laminate is processed into a third layer double-sided copper-clad laminate C that conforms to the engineering design dimensions after being cut and baked.

[0059] Then, several second through holes are drilled through the third double-sided copper-clad laminate C in each partition 7 by mechanical drilling, wherein the diameter of the second through hole is 2.0 mm;

[0060] Next, through copper plating and electroplating, copper layers with a thickness of 40μm are formed on the hole wall of the second through hole and on the front and back copper foils of the third double-sided copper-clad laminate C, respectively, so that the second through hole forms a third current channel 10 that connects the back of the third double-sided copper-clad laminate C and the negative terminal of the partition resistor 51 (wherein, partition 7 is not made on the third double-sided copper-clad laminate C, which is described here for ease of positioning), and the third current channel 10 is completely filled with resin.

[0061] Finally, a partitioned resistor 51 is formed on the front copper foil of the third double-sided copper-clad laminate C by exposure, development and etching.

[0062] S4: The first double-sided copper clad laminate A, the second double-sided copper clad laminate B, and the third double-sided copper clad laminate C obtained from S1, S2, and S3 are stacked in sequence, and an insulating layer D is set between adjacent boards before pressing to form a laminate. A second current-conducting channel 9 is set in each partition 7 of the laminate, which penetrates the laminate and is connected to the positive terminal of the partition resistor 51.

[0063] Specifically, the processing procedure for the laminated board in this application is as follows:

[0064] First, the third layer of double-sided copper clad laminate C, the insulating layer, the second layer of double-sided copper clad laminate B, the insulating layer, and the first layer of double-sided copper clad laminate A are stacked sequentially on the laminating machine and pressed together, with all three double-sided copper clad laminates facing upwards.

[0065] Then, a third through hole is drilled through the laminate in each partition 7 by mechanical drilling, wherein the diameter of the third through hole is 2.0 mm; by electroplating, a copper layer with a thickness of 40 μm is formed on the hole wall of the third through hole, on the copper foil of the front and back of the laminate, respectively, so that the third through hole forms a pre-conducting hole that connects the positive electrode of the partition resistor 51 of the surface layer 1, the first current collector layer 2, the resistor layer 5, and the interlayer of the second current collector layer 6. (The partition 7 on the front of the laminate is fabricated in S5, which is described here for ease of description.)

[0066] Next, a non-flow-guiding hole 61 is drilled through the second current collector layer 6 from the side facing the resistor layer 5 on the pre-guiding hole, forming a second flow-guiding channel 9 that is not connected to the second current collector layer 6. The diameter of the non-flow-guiding hole 61 is larger than the diameter of the second flow-guiding channel 9, and the plug hole formed by the second flow-guiding channel 9 and the non-flow-guiding hole 61 is completely filled with resin.

[0067] The non-channeling via 61 removes the copper layer formed on the pre-channeling via, thus preventing the second current channel 9 from communicating with the second current collector layer 6. In other words, the non-channeling via 61 is a back-drilled hole with controllable depth, ensuring that the second current channel 9 only communicates with the surface layer 1, the first current collector layer 2, and the resistor layer 5, and not with the second current collector layer 6. This ensures that the partitioned current on the circuit board body flows completely through the partition resistor and converges on the lower copper surface of the second current collector layer 6.

[0068] S5: Copper plating and electroless gold plating are performed on the front and back sides of the S4 laminate to obtain the circuit board body.

[0069] Specifically, after copper plating and electroplating of the laminate, patterned circuits are created on the front and back copper foils of the laminate through exposure, development and etching. The patterned circuits include partition 7 and patterned circuits connected to the fuel cell cell formed on the front copper foil of the laminate, and patterned circuits connected to the load formed on the back copper foil of the laminate.

[0070] Finally, after solder resist, lettering, and immersion gold plating, the circuit board for hydrogen fuel cells provided by this invention is obtained. Immersion gold plating can prevent corrosion of the front and back of the circuit board from contacting air, thus avoiding affecting the subsequent processing of gas flow channels on the circuit board.

[0071] In summary, the present invention provides a circuit board for a hydrogen fuel cell and its manufacturing method. By setting multiple mutually insulated partitions on the circuit board body, the current generated in each partition is collected through a surface layer via a first current-conducting channel to a first current-collecting layer. The heat generated when the current collects to the first current-collecting layer is measured by a temperature-sensing resistor on a temperature-sensing layer, thereby obtaining real-time temperature data for each partition inside the battery. By setting a second current-conducting channel in each partition of the circuit board body, the current on the surface layer and the second current-collecting layer flows uniformly through the positive and negative terminals of the partition resistor in that partition via the second current-conducting channel, and then collects to the back of the second current-collecting layer via a third current-conducting channel, connecting to an external load. By detecting the voltage across the partition resistor, the current data of each partition inside the battery is obtained. By setting through holes after laminating the circuit board body, and after electroplating, drilling a certain distance upwards from the second current-collecting layer to form a second current-conducting channel, the manufacturing process is simple and ensures that the normal current collects to the second current-collecting layer after passing through the partition resistor, thereby obtaining the current density data of each partition.

[0072] Many specific details have been set forth in the foregoing description to provide a thorough understanding of the present invention. However, the above description is merely a preferred embodiment of the present invention, and the present invention can be implemented in many other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed above. Furthermore, any person skilled in the art can make many possible variations and modifications to the technical solutions of the present invention, or modify them into equivalent embodiments, using the methods and techniques disclosed above, without departing from the scope of the present invention. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention, without departing from the content of the present invention, shall still fall within the protection scope of the present invention.

Claims

1. A circuit board for a hydrogen fuel cell, comprising a circuit board body, wherein the upper and lower surfaces of the circuit board body are defined as the front and back surfaces of the circuit board, respectively, the front surface of the circuit board is connected to a fuel cell, and the back surface of the circuit board is connected to a load, characterized in that: The circuit board body includes, from top to bottom, a surface layer (1), a first current collector layer (2), a temperature sensing layer (3), a resistor layer (5), and a second current collector layer (6). The circuit board body has several non-conductive partitions (7), and each partition (7) is provided with: First flow channel (8), a plurality of first flow channels (8) longitudinally penetrate the surface layer (1) and the first flow collection layer (2) for connecting the surface layer (1) and the first flow collection layer (2); The second flow channel (9) extends longitudinally through the surface layer (1), the first current collection layer (2), the temperature measuring layer (3), and the resistance layer (5), and is used to connect the positive electrode of the partition resistor (51) of the resistance layer (5) to the surface layer (1) and the first current collection layer (2). The third current guiding channel (10) extends longitudinally through the resistor layer (5) and the second current collecting layer (6). The third current guiding channel (10) is used to connect the negative terminal of the partition resistor (51) of the resistor layer (5) to the second current collecting layer (6). The upper surface of the surface layer (1) is the front side of the circuit board, and the lower surface of the second current collector layer (6) is the back side of the circuit board. The current in each partition (7) is received by the surface layer (1) on the front of the circuit board and then guided and collected by several first current channels (8) on the partition (7) to the first current collector layer (2). The heat generated when the current is collected is detected in real time by the temperature sensing resistor (31) set on the temperature measuring layer (3) below the first current collector layer (2). Synchronously, the current received by each partition (7) flows through the positive and negative terminals of the partition resistor (51) of the resistor layer (5) via the second current channel (9), and is then collected on the back of the circuit board via the third current channel (10). The current data of the partition (7) is obtained by detecting the current flowing through the partition resistor (51).

2. The circuit board for hydrogen fuel cells according to claim 1, characterized in that: A calibration layer (4) is provided between the temperature measuring layer (3) and the resistance layer (5) to change the number of layers of the circuit board body.

3. A method for manufacturing a circuit board for a hydrogen fuel cell, characterized in that, The circuit board comprises, in descending order of top to bottom, a first double-sided copper-clad laminate (A), an insulating layer (D), a second double-sided copper-clad laminate (B), an insulating layer (D), and a third double-sided copper-clad laminate (C). The manufacturing method of the circuit board is as follows: S1: Several dividing grooves (11) are cut on the front and back copper foils of the first layer double-sided copper foil board (A) to form several partitions (7). Several first flow channels (8) penetrating the first layer double-sided copper foil board (A) are set on each partition (7). The front and back copper foils of the first layer double-sided copper foil board (A) form a surface layer (1) and a first current collection layer (2) respectively, and the surface layer (1) and the first current collection layer (2) are connected through the first flow channels (8). S2: Several temperature sensing resistors (31) connected in series are set on the front copper foil of the second double-sided copper foil board (B), wherein the front and back copper foils of the second double-sided copper foil board (B) form a temperature measuring layer (3) and a calibration layer (4), respectively. S3: Cut several dividing grooves (11) on the front copper foil of the third double-sided copper foil board (C) to form several partitions (7), and set partition resistors (51) on each partition (7). The front and back copper foils of the third double-sided copper foil board (C) form a resistor layer (5) and a second current collector layer (6) respectively. At the same time, a third current guide channel (10) is set on each partition (7) to penetrate the third double-sided copper foil board (C) and to be connected to the negative terminal of the partition resistor (51). S4: The first double-sided copper clad laminate (A), the second double-sided copper clad laminate (B) and the third double-sided copper clad laminate (C) obtained from S1, S2 and S3 are stacked in sequence, and an insulating layer (D) is set between adjacent boards before pressing to form a laminate. A second current-conducting channel (9) is set in each partition (7) of the laminate, which penetrates the laminate and is connected to the positive terminal of the partition resistor (51). S5: Copper plating and electroless gold plating are performed on the front and back sides of the S4 laminate to obtain the circuit board body.

4. The method for manufacturing a circuit board for a hydrogen fuel cell according to claim 3, characterized in that: In S1, several first through holes are arrayed on each partition (7) of the first double-sided copper-clad laminate (A) by mechanical drilling. A copper layer is electroplated on the hole wall of the first through hole to form a first flow channel (8) connecting the surface layer (1) and the first current collection layer (2), and the first flow channel (8) is filled with resin.

5. The method for manufacturing a circuit board for a hydrogen fuel cell according to claim 4, characterized in that: In S3, a second through hole is formed on each partition (7) of the third double-sided copper clad laminate (C) by mechanical drilling. A copper layer is electroplated on the hole wall of the second through hole to form a third current channel (10) that connects the negative electrode of the partition resistor (51) of the resistor layer (5) and the second current collector layer (6). The third current channel (10) is filled with resin.

6. The method for manufacturing a circuit board for a hydrogen fuel cell according to claim 5, characterized in that: In S4, before forming the second flow channel (9), a third through hole is formed on each partition (7) of the laminate by mechanical drilling, and a pre-flow hole is formed by electroplating a copper layer on the hole wall of the third through hole to connect the positive electrode of the partition resistor (51) of the surface layer (1), the first current collector layer (2), the resistor layer (5), and the second current collector layer (6).

7. The method for manufacturing a circuit board for a hydrogen fuel cell according to claim 6, characterized in that: Non-flow guiding holes (61) are formed on the laminated plate by mechanical drilling from its back side to its front side. These holes are concentric with the pre-flow guiding holes and have a larger diameter than the pre-flow guiding holes, so as to form a second flow guiding channel (9) that is not connected to the second flow collection layer (6).

8. The method for manufacturing a circuit board for a hydrogen fuel cell according to claim 7, characterized in that: The depth dimension of the non-channel hole (61) is less than half the thickness dimension of the third double-sided copper clad laminate (C).

9. The method for manufacturing a circuit board for a hydrogen fuel cell according to claim 7, characterized in that: In S4, before the laminate is formed, each partition (7) on the second double-sided copper clad laminate (B) is provided with a clearance ring (40), which is concentrically arranged with the second flow channel (9) and has a diameter larger than the outer diameter of the second flow channel (9).

10. The method for manufacturing a circuit board for a hydrogen fuel cell according to claim 3, characterized in that: The temperature sensing resistor (31) is made of copper wire arranged in a serpentine pattern.

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