Flexible circuit board, display module and electronic device

Abstract

The present application provides a flexible circuit board, a display module and an electronic device. The flexible circuit board includes a substrate layer, a plurality of first traces and a plurality of first binding terminals arranged on a first surface of the substrate layer, and a plurality of second traces and a plurality of pressure transmission parts arranged on a second surface of the substrate layer. The plurality of first traces include first-type traces and second-type traces electrically isolated from each other. The plurality of first-type binding terminals include first-type binding terminals and second-type binding terminals electrically isolated from each other. Each first-type binding terminal is electrically connected to at least one first-type trace, and each second trace is electrically connected between the second-type trace and the second-type binding terminal. Each pressure transmission part includes at least a part corresponding to at least a part of the first binding terminal, so that the pressure transmission part can transmit pressure to the first binding terminal through the substrate layer, so as to alleviate the problem of lateral pressure tilt generated when the existing flexible circuit board and the printed circuit board are bound.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a flexible circuit board, a display module and an electronic device. Background Art

[0002] At present, medium and large-sized display devices (such as foldable laptops and tablets, etc.) mostly use flexible circuit boards (Flexible Print Circuit, FPC) to input the signals of printed circuit boards (Printed Circuit Board Assembly, PCBA) into the display panel, so as to realize the processing and power supply of the in-plane signals. Among them, the flexible circuit board and the printed circuit board are connected by high-temperature hot pressing. Due to the large number of binding terminals (pins) in the binding area, the binding terminals in the binding area of ​​the flexible circuit board and the printed circuit board are both designed in double rows. For the flexible circuit board, the flexible circuit board includes a bottom copper layer and a top copper layer. The bottom copper layer forms a first routing and a double row of first binding terminals. The top copper layer forms a second routing. The first row of binding terminals in the double row of first binding terminals is directly electrically connected to a part of the first routing, and the second row of binding terminals in the double row of first binding terminals is electrically connected to another part of the first routing through the second routing bridge. However, the misalignment of the second routing and the double row of first binding terminals will cause the lateral pressure tilt phenomenon when the flexible circuit board and the printed circuit board are bound, which will lead to abnormal bonding impedance in the binding area and abnormal reliability testing. Summary of the invention

[0003] The present application provides a flexible circuit board, a display module and an electronic device to alleviate the technical problem of lateral pressure tilting generated when the existing flexible circuit board and the printed circuit board are bound.

[0004] To solve the above problems, the technical solutions provided by this application are as follows:

[0005] The present application provides a flexible circuit board, which includes:

[0006] The substrate layer comprises a first surface and a second surface opposite to each other, wherein the first surface comprises a wiring area and a first binding area located at one side of the wiring area;

[0007] A plurality of first routing lines are arranged on the first surface and located in the routing area, the plurality of first routing lines extend along a first direction and are arranged at intervals along a second direction, and the plurality of first routing lines include first-type routing lines and second-type routing lines that are electrically isolated from each other;

[0008] A plurality of first binding terminals are arranged on the first surface and located in the first binding area, the plurality of first binding terminals extend along the first direction and are arranged at intervals along the second direction, and the plurality of first binding terminals include first-type binding terminals and second-type binding terminals that are electrically isolated from each other, the second-type binding terminals are located on a side of the first-type binding terminals away from the first wiring, each of the first-type binding terminals is electrically connected to at least one of the first-type wirings, and each of the second-type binding terminals is electrically connected to at least one of the second-type wirings;

[0009] a plurality of second wirings, arranged on the second surface and corresponding to the gaps between the first type binding terminals, each of the second wirings being electrically connected between the second type wiring and the second type binding terminal; and

[0010] A plurality of pressure transmission parts are arranged on the second surface, and each of the pressure transmission parts at least includes a portion corresponding to at least a portion of the first binding terminal, so that the pressure transmission part can transmit pressure to the first binding terminal through the substrate layer.

[0011] In the flexible circuit board provided in the embodiment of the present application, the elastic modulus of the pressure transmission portion is greater than or equal to the elastic modulus of the second trace.

[0012] In the flexible circuit board provided in the embodiment of the present application, the material of the pressure transmission part is the same as the material of the second trace.

[0013] In the flexible circuit board provided in the embodiment of the present application, in a direction perpendicular to the substrate layer, the thickness of the pressure transmission portion is greater than or equal to the thickness of the second trace.

[0014] In the flexible circuit board provided in the embodiment of the present application, there is a first gap between two adjacent first-type binding terminals, the width of the second routing line in the second direction is smaller than the distance of the first gap, and the orthographic projection of the second routing line on the substrate layer is within the range of the orthographic projection of the first gap on the substrate layer.

[0015] In the flexible circuit board provided in the embodiment of the present application, the flexible circuit board further includes a covering layer, and the covering layer covers the second trace, the pressure transmission part and the substrate layer.

[0016] In the flexible circuit board provided in the embodiment of the present application, the thickness of the covering layer covering the second trace is smaller than the thickness of the covering layer covering the substrate layer.

[0017] In the flexible circuit board provided in the embodiment of the present application, the pressure transmission portion includes a first pressure transmission sub-portion, the first pressure transmission sub-portion is located between two adjacent second traces, and is arranged corresponding to the first type binding terminal.

[0018] In the flexible circuit board provided in the embodiment of the present application, there is a second gap between two adjacent second traces, the first pressure transmission sub-portion is located in the second gap, and the width of the first pressure transmission sub-portion in the second direction is smaller than the distance of the second gap.

[0019] In the flexible circuit board provided in the embodiment of the present application, the central axis of the first pressure transmission sub-portion in the first direction coincides with the central axis of the first type binding terminal in the first direction.

[0020] In the flexible circuit board provided in the embodiment of the present application, the first type of binding terminals and the second type of binding terminals are arranged opposite to each other, the second wiring is also arranged corresponding to the gap of the second type of binding terminals, and the pressure transmission part also includes a second pressure transmission sub-part, and the second pressure transmission sub-part is arranged corresponding to the second type of binding terminals.

[0021] In the flexible circuit board provided in the embodiment of the present application, the second trace is electrically connected to an end of the second-type binding terminal away from the first-type binding terminal.

[0022] In the flexible circuit board provided in the embodiment of the present application, there is a third gap between the two adjacent second-type binding terminals, the width of the second trace in the second direction is smaller than the distance of the third gap, and the orthographic projection of the second trace on the substrate layer is within the range of the orthographic projection of the third gap on the substrate layer.

[0023] In the flexible circuit board provided in the embodiment of the present application, there is a fourth gap between the two adjacent second traces, the second pressure transmission sub-portion is located in the fourth gap, and the width of the second pressure transmission sub-portion in the second direction is smaller than the distance of the fourth gap.

[0024] In the flexible circuit board provided in the embodiment of the present application, the central axis of the second pressure transmission sub-portion in the first direction coincides with the central axis of the second type binding terminal in the first direction.

[0025] In the flexible circuit board provided in the embodiment of the present application, the first type of binding terminals and the second type of binding terminals are arranged alternately, and the second wiring is electrically connected to an end of the second type of binding terminals close to the first type of binding terminals; the pressure transmission part also includes a third pressure transmission sub-part, and the third pressure transmission sub-part is arranged corresponding to the second type of binding terminals.

[0026] In the flexible circuit board provided in the embodiment of the present application, the central axis of the third pressure transmission sub-portion in the first direction coincides with the central axis of the second type binding terminal in the first direction.

[0027] In the flexible circuit board provided in the embodiment of the present application, the first type of binding terminals and the second type of binding terminals are arranged alternately, the second wiring is electrically connected to one end of the second type of binding terminals away from the first type of binding terminals, and the central axis of the second wiring in the first direction coincides with the central axis of the second type of binding terminals in the first direction.

[0028] An embodiment of the present application also provides a display module, which includes a display panel, a printed circuit board, and a flexible circuit board electrically connected between the display panel and the printed circuit board, wherein the flexible circuit board includes the flexible circuit board of one of the aforementioned embodiments; wherein the printed circuit board includes a second binding area opposite to the first binding area of ​​the flexible circuit board, and the printed circuit board is provided with a plurality of second binding terminals in the second binding area, and the second binding terminals are bound to the corresponding first binding terminals on the flexible circuit board.

[0029] In the display module provided in the embodiment of the present application, the orthographic projection of the first binding terminal on the printed circuit board is located within the orthographic projection range of the corresponding second binding terminal on the printed circuit board.

[0030] In the display module provided in the embodiment of the present application, the orthographic projection of the pressure transmission portion corresponding to the first binding terminal on the printed circuit board is located within the orthographic projection range of the corresponding second binding terminal on the printed circuit board.

[0031] In the display module provided in the embodiment of the present application, the central axis of the first binding terminal coincides with the central axis of the corresponding second binding terminal.

[0032] In the display module provided in the embodiment of the present application, the second binding terminals include a third type of binding terminals and a fourth type of binding terminals that are electrically isolated from each other, the third type of binding terminals are bound to the first type of binding terminals on the flexible circuit board, and the fourth type of binding terminals are bound to the second type of binding terminals on the flexible circuit board.

[0033] An embodiment of the present application further provides an electronic device, which includes the display module of one of the aforementioned embodiments.

[0034] The beneficial effects of the present application are as follows: in the flexible circuit board, display module and electronic device provided by the present application, the flexible circuit board includes a substrate layer, a plurality of first wirings and a plurality of first binding terminals arranged on a first surface of the substrate layer, and a plurality of second wirings and a plurality of pressure transmission parts arranged on a second surface of the substrate layer, the first surface includes a wiring area and a first binding area located on one side of the wiring area, a plurality of first wirings are located in the wiring area, a plurality of first wirings extend along a first direction and are spaced apart along a second direction, and a plurality of first wirings include first-type wirings and second-type wirings electrically isolated from each other, a plurality of first binding terminals are located in the first binding area, a plurality of first binding terminals extend along the first direction and are spaced apart along the second direction, and a plurality of first binding terminals include first-type binding terminals and second-type binding terminals electrically isolated from each other, and the The second type of binding terminal is located on a side of the first type of binding terminal away from the first type of wiring, each of the first type of binding terminals is electrically connected to at least one of the first type of wiring, each of the second type of binding terminals is electrically connected to at least one of the second type of wiring, a plurality of second wirings are arranged corresponding to the gaps of the first type of binding terminals, each of the second wirings is electrically connected between the second type of wiring and the second type of binding terminal, and each pressure transmission part includes at least a part corresponding to at least part of the first binding terminal, so that the pressure transmission part can transmit pressure to the first binding terminal through the substrate layer. In this way, when the flexible circuit board is bound to the printed circuit board, the pressure transmission part can apply positive pressure to the binding terminal through the substrate layer to avoid lateral pressure tilt of the binding terminal, thereby alleviating the technical problem of lateral pressure tilt generated when the existing flexible circuit board and the printed circuit board are bound. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 The figure is a schematic diagram of binding a flexible circuit board and a printed circuit board in the prior art.

[0037] Figure 2 A schematic diagram of a cross-sectional structure of a flexible circuit board provided in an embodiment of the present application.

[0038] Figure 3 for Figure 2 Detailed schematic diagram of the first surface of the substrate layer.

[0039] Figure 4 for Figure 2Detailed schematic diagram of the second surface of the substrate layer.

[0040] Figure 5 for Figure 4 Detailed schematic diagram of the second wiring and pressure transmission part.

[0041] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure along the M-M' direction.

[0042] Figure 7 for Figure 5 Schematic diagram of the cross-sectional structure along the N-N' direction.

[0043] Figure 8 for Figure 2 Schematic diagram of the flexible circuit board and printed circuit board after being bound.

[0044] Fig. 9 A schematic diagram of a top view of the pressure transmission portion provided in an embodiment of the present application.

[0045] Fig.10 for Fig. 9 Schematic diagram of the cross-sectional structure along Q-Q'.

[0046] Fig.11 Another schematic diagram of the top view structure of the pressure transmission part provided in an embodiment of the present application.

[0047] Fig.12 for Fig.11 Schematic diagram of the cross-sectional structure along the R-R' line.

[0048] Fig.13 A schematic diagram of the arrangement of the first type binding terminals and the second type binding terminals provided in an embodiment of the present application.

[0049] Fig.14 for Fig.13 Schematic diagram of the connection between the second type of binding terminals and the second trace.

[0050] Fig.15 Another schematic diagram of the connection between the second type of binding terminal and the second trace provided in an embodiment of the present application.

[0051] Fig.16 Another schematic diagram of the connection between the second type binding terminal and the second trace provided in an embodiment of the present application.

[0052] Fig.17 A schematic diagram of a top view of the structure of a display module provided in an embodiment of the present application.

[0053] Fig.18 for Fig.17 Schematic diagram of the arrangement of the second binding terminals on the printed circuit board. DETAILED DESCRIPTION

[0054] The following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present application can be implemented in. The directional terms mentioned in the present application, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present application, rather than to limit the present application. In the figures, units with similar structures are represented by the same reference numerals. In the accompanying drawings, the thickness of some layers and regions is exaggerated for clear understanding and ease of description. That is, the size and thickness of each component shown in the drawings are arbitrarily shown, but the present application is not limited to this.

[0055] In view of the problem of lateral pressure tilting when the flexible circuit board and the printed circuit board are bound in the prior art, the inventor of the present application found in research that it is mainly caused by the misalignment of the second wiring and the double-row first binding terminal. Figure 1 , Figure 1 The figure is a schematic diagram of the binding of a flexible circuit board and a printed circuit board in the prior art. Figure 1 In the embodiment, the printed circuit board 500 and the flexible circuit board 600 are bound together by applying pressure by the pressure mechanism 700. The flexible circuit board 600 is provided with a first binding terminal 601, and the printed circuit board 500 is provided with a second binding terminal 501. The second trace 602 on the flexible circuit board 600 is set corresponding to the gap between the adjacent first binding terminals 601, so that the second trace 602 is misaligned with the corresponding first binding terminal 601. In this way, during the binding process of the printed circuit board 500 and the flexible circuit board 600, due to the misalignment of the first binding terminal 601 and the second trace 602 on the flexible circuit board 600, when pressure is applied to the flexible circuit board 600 under high temperature conditions, the first binding terminal 601 will be tilted relative to the second binding terminal 501, thereby causing a gap 502 between the first binding terminal 601 and the second binding terminal 501, resulting in poor contact between the first binding terminal 601 on the flexible circuit board 600 and the second binding terminal 501 on the printed circuit board 500, thereby causing abnormal bonding impedance in the binding area and abnormal reliability test.

[0056] To this end, the present application provides a flexible circuit board, a display module and an electronic device to solve the above problems.

[0057] Please refer to Figures 2 to 8 , Figure 2 A schematic diagram of a cross-sectional structure of a flexible circuit board provided in an embodiment of the present application, Figure 3 for Figure 2 A detailed schematic diagram of the first surface of the substrate layer, Figure 4 for Figure 2 Detailed schematic diagram of the second surface of the substrate layer, Figure 5 for Figure 4 Detailed schematic diagram of the second wiring and pressure transmission part. Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure along the M-M' direction, Figure 7 for Figure 5 Schematic diagram of the cross-sectional structure along the N-N' direction, Figure 8 for Figure 2 Schematic diagram of the flexible circuit board and printed circuit board after binding. Figure 2 and Figure 3 The flexible circuit board 100 includes a substrate layer 10, and the substrate layer 10 includes a first surface 11 and a second surface 12 opposite to each other. The flexible circuit board 100 also includes a plurality of first traces 20 and a plurality of first binding terminals 30 disposed on the first surface 11, and a plurality of second traces 40 and a plurality of pressure transmission parts 50 disposed on the second surface 12.

[0058] The flexible circuit board 100 further includes a covering layer 60 covering the second trace 40 , the pressure transmission part 50 and the substrate layer 10 . The material of the covering layer 60 may be the same as that of the substrate layer 10 , such as flexible films such as polyimide (PI).

[0059] Specifically, refer to Figure 3 , the first surface 11 includes a routing area 111 and a first binding area 112 located on one side of the routing area 111. A plurality of first routing lines 20 are arranged on the first surface 11 and located in the routing area 111, the plurality of first routing lines 20 extend along the first direction X, and are arranged at intervals along the second direction Y, and the plurality of first routing lines 20 include first-type routing lines 21 and second-type routing lines 22 that are electrically isolated from each other. The first-type routing lines 21 and the second-type routing lines 22 are arranged alternately to reasonably utilize the space of the routing area 111. The first direction X and the second direction Y are different, for example, the first direction X is a column direction, the second direction Y is a row direction, and the first direction X is perpendicular to the second direction Y.

[0060] A plurality of first binding terminals 30 are arranged on the first surface 11 and located in the first binding area 112. The plurality of first binding terminals 30 extend along the first direction X and are arranged at intervals along the second direction Y. The plurality of first binding terminals 30 include first-type binding terminals 31 and second-type binding terminals 32 that are electrically isolated from each other. The second-type binding terminals 32 are located on the side of the first-type binding terminals 31 away from the first wiring 20. Each of the first-type binding terminals 31 is electrically connected to at least one of the first-type wiring 21, and each of the second-type binding terminals 32 is electrically connected to at least one of the second-type wiring 22.

[0061] Optionally, the first wiring 20 and the first binding terminal 30 are made of the same material, such as copper. In this case, the first wiring 20 and the first binding terminal 30 are formed under the same process conditions, and the first type of wiring 21 and the first type of binding terminal 31 can be integrally formed.

[0062] Reference Figure 4 , a plurality of second traces 40 are arranged on the second surface 12 and are arranged corresponding to the gaps of the first type binding terminals 31, and each second trace 40 is electrically connected between the second type trace 22 and the second type binding terminal 32, so that the second type binding terminal 32 is electrically connected to the second type trace 22 through the bridge of the second trace 40. Specifically, the end of the second trace 40 close to the first trace 20 is electrically connected to the second type trace 22 through the first via 401, and the end of the second trace 40 away from the first trace 20 is electrically connected to the second type binding terminal 32 through the second via 402. The first via 401 and the second via 402 are both formed by punching the substrate layer 10.

[0063] The pressure transmission part 50 is arranged on the second surface 12, and each pressure transmission part 50 includes at least a part corresponding to at least part of the first binding terminal 30, so that the pressure transmission part 50 can transmit pressure to the first binding terminal 30 through the substrate layer 10. In this way, when the flexible circuit board 100 is bound to the printed circuit board, the pressure transmission part 50 can apply positive pressure to the binding terminal through the substrate layer 10 to avoid lateral pressure tilt of the binding terminal, thereby alleviating the technical problem of lateral pressure tilt generated when the existing flexible circuit board and the printed circuit board are bound.

[0064] The elastic modulus of the pressure transmission part 50 is greater than or equal to the elastic modulus of the second wiring 40, so that the hardness of the pressure transmission part 50 is at least not less than the hardness of the second wiring 40, and further, when the pressure transmission part 50 and the second wiring 40 are subjected to the same pressure, the deformation of the pressure transmission part 50 is less than or equal to the deformation of the second wiring 40, so as to ensure that the binding pressure can directly act on the first binding terminal 30 located below the pressure transmission part 50, and avoid the first binding terminal 30 from being tilted by lateral pressure. Optionally, the material of the pressure transmission part 50 is the same as that of the second wiring 40, such as copper, to reduce the difficulty of the process. The pressure transmission part 50 is in a floating state, that is, the pressure transmission part 50 is not connected to the electrical signal.

[0065] Further, in a direction perpendicular to the substrate layer 10, the thickness of the pressure transmission part 50 is greater than or equal to the thickness of the second wiring 40. When the thickness of the pressure transmission part 50 is equal to the thickness of the second wiring 40, the pressure transmission part 50 and the second wiring 40 can withstand the same pressure, and the pressure applied to the pressure transmission part 50 can pass through the substrate layer 10 to act on the first binding terminal 30 located below the pressure transmission part 50, thereby preventing the first binding terminal 30 from being tilted due to lateral pressure. When the thickness of the pressure transmission part 50 is greater than the thickness of the second wiring 40, the pressure transmission part 50 can withstand more pressure than the second wiring 40, so that most of the binding pressure is applied to the pressure transmission part 50. In this way, the pressure on the pressure transmission part 50 can act on the first binding terminal 30 located below the pressure transmission part 50 through the substrate layer 10, avoiding the first binding terminal 30 from being tilted due to lateral pressure. At the same time, it can also protect the second wiring 40 and avoid the binding pressure from acting on the second wiring 40 and causing defects such as cracks in the second wiring 40.

[0066] The relative position relationship among the first binding terminal 30 , the second wiring 40 and the pressure transmission part 50 will be described in detail below.

[0067] Reference Figure 4 and Figure 5, there is a first gap 311 between two adjacent first-type binding terminals 31, and the width D1 of the second wiring 40 in the second direction Y is smaller than the distance L1 of the first gap 311. The orthographic projection of the second wiring 40 on the substrate layer 10 is located within the range of the orthographic projection of the first gap 311 on the substrate layer 10. In other words, there is no overlapping part between the orthographic projection of the second wiring 40 on the substrate layer 10 and the orthographic projection of the first-type binding terminal 31 on the substrate layer 10, so as to avoid the generation of coupling capacitance between the second wiring 40 and the first-type binding terminal 31, thereby avoiding the influence on the transmission signal of the first-type wiring 21.

[0068] Optionally, the width D2 of the first type binding terminal 31 in the second direction Y ranges from 125 microns to 225 microns, such as 125 microns, 135 microns, 150 microns, 175 microns, 190 microns, 210 microns, 225 microns, etc. The distance L1 of the first gap 311 ranges from 125 microns to 225 microns, such as 125 microns, 135 microns, 150 microns, 175 microns, 190 microns, 210 microns, 225 microns, etc. The width D2 of the first type binding terminal 31 in the second direction Y may be equal to the distance L1 of the first gap 311, such as 175 microns. However, the present application is not limited thereto, and the width D2 of the first type binding terminal 31 of the present application may also be greater than the distance L1 of the first gap 311.

[0069] Optionally, the pressure transmission part 50 includes a first pressure transmission sub-part 51 and a second pressure transmission sub-part 52, and the first pressure transmission sub-part 51 and the second pressure transmission sub-part 52 are both located between two adjacent second wirings 40, and the first pressure transmission sub-part 51 is set corresponding to the first type of binding terminal 31, and the second pressure transmission sub-part 52 is set corresponding to the second type of binding terminal 32.

[0070] There is a second gap 403 between two adjacent second wirings 40, the first pressure transmission sub-portion 51 is located in the second gap 403, and the width D3 of the first pressure transmission sub-portion 51 in the second direction Y is smaller than the distance L2 of the second gap 403, so as to avoid short circuit between adjacent second wirings 40. Further, the first type binding terminal 31 is arranged corresponding to the second gap 403, and the width D2 of the first type binding terminal 31 in the second direction Y is smaller than the distance L2 of the second gap 403. The orthographic projection of the first type binding terminal 31 on the substrate layer 10 falls within the range of the orthographic projection of the second gap 403 on the substrate layer 10, so as to avoid overlapping between the first type binding terminal 31 and the second wiring 40.

[0071] Optionally, the width D3 of the first pressure transmission sub-section 51 in the second direction Y is also smaller than the width D2 of the first type of binding terminal 31 in the second direction Y. In the second direction Y, the orthographic projection of the first pressure transmission sub-section 51 on the substrate layer 10 falls within the range of the orthographic projection of the first type of binding terminal 31 on the substrate layer 10. Furthermore, the central axis P1 of the first pressure transmission sub-section 51 in the first direction X coincides with the central axis of the first type of binding terminal 31 in the first direction X, so that the binding pressure applied to the first pressure transmission sub-section 51 can pass through the substrate layer 10 to act on the middle area of ​​the first type of binding terminal 31, thereby avoiding uneven force on the first type of binding terminal 31 and causing lateral pressure tilt. It should be noted that since the central axis P1 of the first pressure transmission sub-section 51 in the first direction X coincides with the central axis of the first type of binding terminal 31 in the first direction X, Figure 5 The central axis of the first-type binding terminal 31 in the first direction X is not shown.

[0072] Reference Figure 3 and Figure 5 , the first type binding terminal 31 is arranged opposite to the second type binding terminal 32, and the vertical projection of the second type binding terminal 32 in the first direction X overlaps with the vertical projection of the first type binding terminal 31 in the first direction X. The second wiring 40 is also arranged corresponding to the gap of the second type binding terminal 32. The pressure transmission part 50 also includes a second pressure transmission sub-part 52, and the second pressure transmission sub-part 52 is arranged corresponding to the second type binding terminal 32. Optionally, the second pressure transmission sub-part 52 is integrally formed with the first pressure transmission sub-part 51, that is, the first pressure transmission sub-part 51 extends along the first direction X to form the second pressure transmission sub-part 52.

[0073] There is a third gap 321 between the two adjacent second-type binding terminals 32, the width D1 of the second wiring 40 in the second direction Y is smaller than the distance L3 of the third gap 321, and the orthographic projection of the second wiring 40 on the substrate layer 10 is located within the range of the orthographic projection of the third gap 321 on the substrate layer 10. In other words, there is no overlapping part between the orthographic projection of the second wiring 40 on the substrate layer 10 and the orthographic projection of the second-type binding terminal 32 on the substrate layer 10, so as to avoid the generation of coupling capacitance between the second wiring 40 and the second-type binding terminal 32, thereby avoiding the influence on the transmission signal of the second-type wiring 22.

[0074] Optionally, the width D4 of the second type binding terminal 32 in the second direction Y ranges from 125 microns to 225 microns, such as 125 microns, 135 microns, 150 microns, 175 microns, 190 microns, 210 microns, 225 microns, etc. The distance L3 of the third gap 321 ranges from 125 microns to 225 microns, such as 125 microns, 135 microns, 150 microns, 175 microns, 190 microns, 210 microns, 225 microns, etc. The width D4 of the second type binding terminal 32 in the second direction Y may be equal to the distance L3 of the third gap 321, such as 175 microns. However, the present application is not limited thereto, and the width D4 of the second type binding terminal 32 of the present application may also be greater than the distance L3 of the third gap 321.

[0075] There is also a fourth gap 404 between two adjacent second wirings 40, and the fourth gap 404 is connected to the second gap 403. The second pressure transmission sub-portion 52 is located in the fourth gap 404, and the width D5 of the second pressure transmission sub-portion 52 in the second direction Y is smaller than the distance L4 of the fourth gap 404, so as to avoid short circuit between adjacent second wirings 40. Further, the second type binding terminal 32 is arranged corresponding to the fourth gap 404, and the width D4 of the second type binding terminal 32 in the second direction Y is smaller than the distance L4 of the fourth gap 404. The orthographic projection of the second type binding terminal 32 on the substrate layer 10 falls within the range of the orthographic projection of the fourth gap 404 on the substrate layer 10, so as to avoid overlapping between the second type binding terminal 32 and the second wiring 40.

[0076] Optionally, the width D5 of the second pressure transmission sub-section 52 in the second direction Y is also smaller than the width D4 of the second type binding terminal 32 in the second direction Y. In the second direction Y, the orthographic projection of the second pressure transmission sub-section 52 on the substrate layer 10 falls within the range of the orthographic projection of the second type binding terminal 32 on the substrate layer 10. Furthermore, the central axis P2 of the second pressure transmission sub-section 52 in the first direction X coincides with the central axis of the second type binding terminal 32 in the first direction X, so that the binding pressure applied to the second pressure transmission sub-section 52 can act on the middle area of ​​the second type binding terminal 32 through the substrate layer 10, avoiding the second type binding terminal 32 from being subjected to uneven force and causing lateral pressure tilt. It should be noted that since the central axis P2 of the second pressure transmission sub-section 52 in the first direction X coincides with the central axis of the second type binding terminal 32 in the first direction X, Figure 5 The central axis of the second-type binding terminal 32 in the first direction X is not shown.

[0077] Next, how to electrically connect the second wiring 40 with the second-type binding terminal 32 and the second-type wiring 22 is described in detail.

[0078] Reference Figure 5 The end of the second routing 40 close to the first routing 20 is electrically connected to the second type of routing 22 through the first via 401, the end of the second routing 40 away from the first routing 20 is electrically connected to the second type of binding terminal 32 through the second via 402, and the second routing 40 is electrically connected to the end of the second type of binding terminal 32 away from the first type of binding terminal 31.

[0079] Specifically, refer to Figure 6 The substrate layer 10 includes the first via hole 401 penetrating the substrate layer 10, and the second wiring 40 can be electrically connected to the second wiring 40 through the metal connection portion filled in the first via hole 401, and the metal connection portion in the first via hole 401 can be formed simultaneously with the second wiring 40. The process of forming the first via hole 401 on the substrate layer 10 can be laser drilling or the like.

[0080] Reference Figure 7 The substrate layer 10 includes the second via hole 402 penetrating the substrate layer 10, and the second wiring 40 can be electrically connected to the second type binding terminal 32 through the metal connection portion filled in the second via hole 402, and the metal connection portion in the second via hole 402 can be formed simultaneously with the second wiring 40. The process of forming the second via hole 402 on the substrate layer 10 can be laser drilling or the like.

[0081] In this embodiment, refer to Figure 8 By setting the pressure transmission part 50 at the position corresponding to the first binding terminal 30, when the flexible circuit board 100 is bound to the printed circuit board 200, the pressure transmission part 50 can apply positive pressure to the first binding terminal 30 through the base material layer 10, so that when the first binding terminal 30 of the flexible circuit board 100 is bound with the second binding terminal 201 on the printed circuit board 200, the first binding terminal 30 will not be tilted by lateral pressure, thereby alleviating the problem of lateral pressure tilting when the existing flexible circuit board and the printed circuit board are bound.

[0082] In one embodiment, see Figures 2 to 10 , Fig. 9 A schematic diagram of a top view of the pressure transmission part 50 provided in an embodiment of the present application is shown in FIG. Fig.10 for Fig. 9Schematic diagram of the cross-sectional structure along the middle line Q-Q'. Different from the above embodiment, the first pressure transmission sub-section 51 and the second pressure transmission sub-section 52 are separately arranged, the first pressure transmission sub-section 51 and the second pressure transmission sub-section 52 are arranged opposite to each other, and there is a gap between the first pressure transmission sub-section 51 and the second pressure transmission sub-section 52.

[0083] Specifically, refer to Fig. 9 , the first pressure transmission sub-section 51 is arranged corresponding to the first type binding terminal 31, the central axis P1 of the first pressure transmission sub-section 51 in the first direction X coincides with the central axis of the first type binding terminal 31 in the first direction X, and the width D3 of the first pressure transmission sub-section 51 in the second direction Y is less than the width D2 of the first type binding terminal 31 in the second direction Y. In some other embodiments, the width D3 of the first pressure transmission sub-section 51 in the second direction Y may also be equal to the width D2 of the first type binding terminal 31 in the second direction Y, so as to better improve the problem of lateral pressure tilt of the first type binding terminal 31.

[0084] The central axis P1 of the first pressure transmission sub-portion 51 in the second direction Y coincides with the central axis of the first type binding terminal 31 in the second direction Y, and the end of the first pressure transmission sub-portion 51 in the first direction X is flush with the end of the first type binding terminal 31 in the first direction X. In other words, the orthographic projection of the first pressure transmission sub-portion 51 on the substrate layer 10 coincides with the orthographic projection of the first type binding terminal 31 on the substrate layer 10.

[0085] The second pressure transmission sub-section 52 is provided corresponding to the second type binding terminal 32, and the central axis P2 of the second pressure transmission sub-section 52 in the first direction X coincides with the central axis of the second type binding terminal 32 in the first direction X, and the central axis P2 of the second pressure transmission sub-section 52 in the first direction X coincides with the central axis P1 of the first pressure transmission sub-section 51 in the first direction X. The width D5 of the second pressure transmission sub-section 52 in the second direction Y is less than the width D4 of the second type binding terminal 32 in the second direction Y. In some other embodiments, the width D5 of the second pressure transmission sub-section 52 in the second direction Y may also be equal to the width D4 of the second type binding terminal 32 in the second direction Y, so as to better improve the problem of lateral pressure tilt of the second type binding terminal 32.

[0086] Reference Fig.10, there is a gap between the second pressure transmission sub-section 52 and the first pressure transmission sub-section 51, and there is also a gap between the second pressure transmission sub-section 52 and the portion electrically connected to the second wiring 40 and the second type binding terminal 32, so as to avoid a short circuit between the second pressure transmission sub-section 52 and the second wiring 40. In this way, one end of the second pressure transmission sub-section 52 in the first direction X is flush with one end of the second type binding terminal 32 in the first direction X, and a certain gap is maintained between the other end of the second pressure transmission sub-section 52 in the first direction X and the second wiring 40. For other descriptions, please refer to the above embodiment, which will not be repeated here.

[0087] In one embodiment, see Figures 2 to 12 , Fig.11 Another schematic diagram of the top view of the pressure transmission part 50 provided in the embodiment of the present application is shown in FIG. Fig.12 for Fig.10 The cross-sectional structure diagram along the R-R' line in FIG. Fig.11 , the width D3 of the first pressure transmission sub-portion 51 in the second direction Y is greater than the width D2 of the first type binding terminal 31 in the second direction Y, and the width D5 of the second pressure transmission sub-portion 52 in the second direction Y is greater than the width D4 of the second type binding terminal 32 in the second direction Y. Taking the second pressure transmission sub-portion 52 as an example, refer to Fig.12 , the width D5 of the second pressure transmission sub-portion 52 is greater than the width D4 of the second type binding terminal 32, and the orthographic projection of the second pressure transmission sub-portion 52 on the substrate layer 10 covers the orthographic projection of the second type binding terminal 32 on the substrate layer 10. For other descriptions, please refer to the above embodiment, which will not be repeated here.

[0088] In one embodiment, see Figures 2 to 14 , Fig.13 A schematic diagram of the arrangement of the first type binding terminals 31 and the second type binding terminals 32 provided in an embodiment of the present application, Fig.14 for Fig.13 Schematic diagram of the connection between the second type binding terminal 32 and the second wiring 40. Different from the above embodiment, referring to Fig.13 The first type of binding terminals 31 and the second type of binding terminals 32 are arranged alternately, that is, the first type of binding terminals 31 correspond to the gap setting of the second type of binding terminals 32, and the second type of binding terminals 32 correspond to the gap setting of the first type of binding terminals 31.

[0089] Reference Fig.14, the second wiring 40 is electrically connected to one end of the second type binding terminal 32 close to the first type binding terminal 31. The pressure transmission part 50 also includes a third pressure transmission sub-part 53, and the third pressure transmission sub-part 53 is arranged corresponding to the second type binding terminal 32. The central axis P3 of the third pressure transmission sub-part 53 in the first direction X coincides with the central axis of the second type binding terminal 32 in the first direction X. For other descriptions, please refer to the above embodiment, which will not be repeated here.

[0090] In one embodiment, see Figures 2 to 15 , Fig.15 Another schematic diagram of the connection between the second type binding terminal 32 and the second wiring 40 provided in the embodiment of the present application. Fig.15 , the second wiring 40 is electrically connected to the end of the second type binding terminal 32 away from the first type binding terminal 31, and the central axis of the second wiring 40 in the first direction X coincides with the central axis of the second type binding terminal 32 in the first direction X, so there is no need to additionally set the third pressure transmission sub-unit 53. For other descriptions, please refer to the above embodiment, which will not be repeated here.

[0091] In one embodiment, see Figures 2 to 16 , Fig.16 Another schematic diagram of the connection between the second type binding terminal 32 and the second wiring 40 provided in the embodiment of the present application. Fig.16 , the connection points of the second routing lines 40 and the second type routing lines 22 are arranged in a staggered manner, that is, the connection points of two adjacent second routing lines 40 and the corresponding second type routing lines 22 do not overlap in the second direction Y. In other words, the connection points of two adjacent second routing lines 40 and the corresponding second type routing lines 22 are at different heights in the first direction X. In this way, by staggering the connection points of the second routing lines 40 and the second type routing lines 22, the contact area of ​​the electrical connection between the second routing lines 40 and the second type routing lines 22 can be increased, thereby improving the stability of the electrical connection between the second routing lines 40 and the second type routing lines 22. Among them, the location of the connection point between the second routing lines 40 and the second type routing lines 22 is the location of the first via 401.

[0092] Moreover, the portion where the second wiring 40 is connected to the second type of wiring 22 and the portion where the second wiring 40 is connected to the second type of binding terminal 32 are both block-shaped, and the surface shape of the block may be elliptical, circular, etc., and the maximum size of the block-shaped connection portion is greater than the width of the second wiring 40, so as to further improve the connection stability between the second wiring 40 and the second type of wiring 22 and the second type of binding terminal 32. The maximum size of the block-shaped connection portion depends on the surface shape of the block. For example, when the surface shape of the block is an ellipse, the maximum size of the block-shaped connection portion is the length of the major axis of the ellipse. In addition, the corners where the second wiring 40 is electrically connected to the second type of binding terminal 32 are rounded to reduce the bending stress of the second wiring 40. Please refer to the above embodiments for other instructions, which will not be repeated here.

[0093] In one embodiment, the present application also provides a display module, please refer to Figures 2 to 18 , Fig.17 A schematic diagram of a top view of the display module provided in an embodiment of the present application is shown in FIG. Fig.18 for Fig.17 Schematic diagram of the arrangement of the second binding terminals on the printed circuit board. Fig.17 The display module 1000 includes a display panel 300, a printed circuit board 200, and a flexible circuit board 100 electrically connected between the display panel 300 and the printed circuit board 200, wherein the flexible circuit board 100 is the flexible circuit board 100 described in one of the aforementioned embodiments. The printed circuit board 200 includes a second binding area 202 opposite to the first binding area 112 of the flexible circuit board 100, and the printed circuit board 200 is provided with a plurality of second binding terminals 201 in the second binding area 202, and the second binding terminals 201 are bound to the corresponding first binding terminals 30 on the flexible circuit board 100.

[0094] Specifically, with reference to Figure 3 and Fig.18 The second binding terminal 201 includes a third type binding terminal 2011 and a fourth type binding terminal 2012 which are electrically isolated from each other, the third type binding terminal 2011 is bound to the first type binding terminal 31 on the flexible circuit board 100, and the fourth type binding terminal 2012 is bound to the second type binding terminal 32 on the flexible circuit board 100.

[0095] Further, refer to Figure 8, the orthographic projection of the first binding terminal 30 on the printed circuit board 200 is located within the orthographic projection range of the corresponding second binding terminal 201 on the printed circuit board 200, so as to ensure that the first binding terminal 30 can have a sufficient effective contact surface with the second binding terminal 201. In addition, the orthographic projection of the pressure transmission part 50 corresponding to the first binding terminal 30 on the substrate layer 10 falls within the orthographic projection range of the corresponding first binding terminal 30 on the substrate layer 10, so that the orthographic projection of the pressure transmission part 50 corresponding to the first binding terminal 30 on the printed circuit board 200 is located within the orthographic projection range of the corresponding second binding terminal 201 on the printed circuit board 200.

[0096] Optionally, the central axis of the first binding terminal 30 coincides with the central axis of the corresponding second binding terminal 201, and at the same time, the central axis of the first binding terminal 30 also coincides with the central axis of the corresponding pressure transmission part 50, so that the binding pressure applied to the pressure transmission part 50 can act on the corresponding middle area of ​​the first binding terminal 30 through the substrate layer 10, and the binding pressure acting on the middle area of ​​the first binding terminal 30 can be transmitted to the middle area of ​​the corresponding second binding terminal 201, so that the first type of binding terminal 31 and the second binding terminal 201 are effectively bound together, thereby further avoiding the lateral pressure tilt of the first type of binding terminal 31 compared to the second binding terminal 201, which leads to abnormal pressing impedance in the binding area and abnormal reliability test.

[0097] Continue to refer to Fig.17 The flexible circuit board 100 further includes a third binding area 113 opposite to the first binding area 112, and the third binding area 113 is correspondingly bound to the fourth binding area 301 on the display panel 300, that is, the third binding terminal of the third binding area 113 of the flexible circuit board 100 is bound to the fourth binding terminal of the fourth binding area 301 of the display panel 300. The fourth binding area 301 of the display panel 300 is also bound with a driver integrated circuit (IC) 400, and the flexible circuit board 100 transmits the signal of the printed circuit board 200 to the driver integrated circuit 400. The display panel 300 includes an organic light emitting diode display panel, a liquid crystal display panel, etc.

[0098] Based on the same inventive concept, the embodiment of the present application further provides an electronic device, which includes the display module 1000 of the above embodiment. The electronic device includes electronic display devices such as laptops, tablets, and televisions.

[0099] According to the above embodiments, it can be seen that:

[0100] The present application provides a flexible circuit board, a display module and an electronic device, wherein the flexible circuit board includes a substrate layer, a plurality of first wirings and a plurality of first binding terminals arranged on a first surface of the substrate layer, and a plurality of second wirings and a plurality of pressure transmission parts arranged on a second surface of the substrate layer, wherein the first surface includes a wiring area and a first binding area located on one side of the wiring area, wherein the plurality of first wirings are located in the wiring area, the plurality of first wirings extend along a first direction and are spaced apart along a second direction, and the plurality of first wirings include first-type wirings and second-type wirings that are electrically isolated from each other, the plurality of first binding terminals are located in the first binding area, the plurality of first binding terminals extend along the first direction and are spaced apart along the second direction, and the plurality of first binding terminals include first-type binding terminals and second-type binding terminals that are electrically isolated from each other, and the second-type binding terminals include first-type binding terminals and second-type binding terminals that are electrically isolated from each other. The terminal is located on a side of the first-class binding terminal away from the first wiring, each of the first-class binding terminals is electrically connected to at least one of the first-class wiring, each of the second-class binding terminals is electrically connected to at least one of the second-class wiring, and a plurality of second wirings are arranged corresponding to the gaps of the first-class binding terminals, and each of the second wirings is electrically connected between the second-class wiring and the second-class binding terminal. Each pressure transmission part includes at least a part corresponding to at least a part of the first binding terminal, so that the pressure transmission part can transmit pressure to the first binding terminal through the substrate layer. In this way, when the flexible circuit board is bound to the printed circuit board, the pressure transmission part can apply positive pressure to the binding terminal through the substrate layer to avoid lateral pressure tilt of the binding terminal, thereby alleviating the technical problem of lateral pressure tilt generated when the existing flexible circuit board and the printed circuit board are bound.

[0101] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0102] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A flexible circuit board, characterized in that: include: The substrate layer comprises a first surface and a second surface opposite to each other, wherein the first surface comprises a wiring area and a first binding area located at one side of the wiring area; A plurality of first routing lines are arranged on the first surface and located in the routing area, the plurality of first routing lines extend along a first direction and are arranged at intervals along a second direction, and the plurality of first routing lines include first-type routing lines and second-type routing lines that are electrically isolated from each other; A plurality of first binding terminals are arranged on the first surface and located in the first binding area, the plurality of first binding terminals extend along the first direction and are arranged at intervals along the second direction, and the plurality of first binding terminals include first-type binding terminals and second-type binding terminals that are electrically isolated from each other, the second-type binding terminals are located on a side of the first-type binding terminals away from the first wiring, each of the first-type binding terminals is electrically connected to at least one of the first-type wirings, and each of the second-type binding terminals is electrically connected to at least one of the second-type wirings; A plurality of second wirings are arranged on the second surface and are arranged corresponding to the gaps between the first type binding terminals, and each of the second wirings is electrically connected between the second type wiring and the second type binding terminal; as well as A plurality of pressure transmission parts are arranged on the second surface, each of the pressure transmission parts at least includes a portion corresponding to at least a portion of the first binding terminal, so that the pressure transmission part can transmit pressure to the first binding terminal through the substrate layer; The pressure transmission portion includes a first pressure transmission sub-portion, and the first pressure transmission sub-portion is located between two adjacent second wirings and is arranged corresponding to the first type binding terminal.

2. The flexible circuit board according to claim 1, characterized in that: An elastic modulus of the pressure transmission portion is greater than or equal to an elastic modulus of the second wiring.

3. The flexible circuit board according to claim 2, characterized in that: The material of the pressure transmission portion is the same as that of the second wiring.

4. The flexible circuit board according to claim 2, characterized in that: In a direction perpendicular to the substrate layer, the thickness of the pressure transmission portion is greater than or equal to the thickness of the second wiring.

5. The flexible circuit board according to claim 1, characterized in that: There is a first gap between two adjacent first-type binding terminals, the width of the second trace in the second direction is smaller than the distance of the first gap, and the orthographic projection of the second trace on the substrate layer is within the range of the orthographic projection of the first gap on the substrate layer.

6. The flexible circuit board according to claim 1, characterized in that: The flexible circuit board further includes a covering layer, and the covering layer covers the second trace, the pressure transmission part and the base material layer.

7. The flexible circuit board according to claim 6, characterized in that: The thickness of the covering layer covering the second trace is smaller than the thickness of the covering layer covering the substrate layer.

8. The flexible circuit board according to any one of claims 1 to 7, characterized in that: A second gap is provided between two adjacent second wirings, the first pressure transmission sub-portion is located in the second gap, and a width of the first pressure transmission sub-portion in the second direction is smaller than a distance of the second gap.

9. The flexible circuit board according to claim 8, characterized in that: A central axis of the first pressure transmission sub-portion in the first direction coincides with a central axis of the first type binding terminal in the first direction.

10. The flexible circuit board according to any one of claims 1 to 7, characterized in that: The first type of binding terminals are arranged opposite to the second type of binding terminals, the second wiring is also arranged corresponding to the gap of the second type of binding terminals, and the pressure transmission part also includes a second pressure transmission sub-part, and the second pressure transmission sub-part is arranged corresponding to the second type of binding terminals.

11. The flexible circuit board according to claim 10, characterized in that: The second wiring is electrically connected to an end of the second-type binding terminal away from the first-type binding terminal.

12. The flexible circuit board according to claim 10, characterized in that: There is a third gap between two adjacent second-type binding terminals, the width of the second trace in the second direction is smaller than the distance of the third gap, and the orthographic projection of the second trace on the substrate layer is within the range of the orthographic projection of the third gap on the substrate layer.

13. The flexible circuit board according to claim 12, characterized in that: There is a fourth gap between two adjacent second wirings, the second pressure transmission sub-portion is located in the fourth gap, and the width of the second pressure transmission sub-portion in the second direction is smaller than the distance of the fourth gap.

14. The flexible circuit board according to claim 13, characterized in that: The central axis of the second pressure transmission sub-portion in the first direction coincides with the central axis of the second-type binding terminal in the first direction.

15. The flexible circuit board according to any one of claims 1 to 7, characterized in that: The first type of binding terminals and the second type of binding terminals are arranged alternately, and the second wiring is electrically connected to one end of the second type of binding terminals close to the first type of binding terminals; the pressure transmission part also includes a third pressure transmission sub-part, and the third pressure transmission sub-part is arranged corresponding to the second type of binding terminals.

16. The flexible circuit board according to claim 15, characterized in that: The central axis of the third pressure transmission sub-portion in the first direction coincides with the central axis of the second-type binding terminal in the first direction.

17. The flexible circuit board according to any one of claims 1 to 7, characterized in that: The first type of binding terminals and the second type of binding terminals are arranged alternately, the second wiring is electrically connected to one end of the second type of binding terminals away from the first type of binding terminals, and the central axis of the second wiring in the first direction coincides with the central axis of the second type of binding terminals in the first direction.

18. A display module, characterized in that: It includes a display panel, a printed circuit board and a flexible circuit board electrically connected between the display panel and the printed circuit board, the flexible circuit board includes the flexible circuit board as described in any one of claims 1 to 17; wherein the printed circuit board includes a second binding area opposite to the first binding area of ​​the flexible circuit board, the printed circuit board is provided with a plurality of second binding terminals in the second binding area, and the second binding terminals are bound to the corresponding first binding terminals on the flexible circuit board.

19. The display module according to claim 18, characterized in that: The orthographic projection of the first binding terminal on the printed circuit board is located within the orthographic projection range of the corresponding second binding terminal on the printed circuit board.

20. The display module according to claim 19, characterized in that: The orthographic projection of the pressure transmission portion corresponding to the first binding terminal on the printed circuit board is located within the orthographic projection range of the corresponding second binding terminal on the printed circuit board.

21. The display module according to claim 19, characterized in that: A central axis of the first binding terminal coincides with a central axis of the corresponding second binding terminal.

22. The display module according to claim 19, characterized in that: The second binding terminals include a third type of binding terminals and a fourth type of binding terminals which are electrically isolated from each other. The third type of binding terminals are bound to the first type of binding terminals on the flexible circuit board, and the fourth type of binding terminals are bound to the second type of binding terminals on the flexible circuit board.

23. An electronic device, characterized in that: Comprising the display module as claimed in any one of claims 18 to 22.

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