A cleaning device for a silicon wafer boat

By designing a cleaning device for silicon wafer frames, an automated detection and positioning mechanism combined with a residual material cleaning mechanism solves the problem of low efficiency in manual cleaning, achieving efficient and low-cost frame cleaning, and improving the utilization efficiency of the circulating frames and worker safety.

CN117483374BActive Publication Date: 2026-05-01TIANJIN NEW MART TECH DEV CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TIANJIN NEW MART TECH DEV CO LTD
Filing Date
2023-10-07
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

In existing technologies, the cleaning of silicon wafer frames mainly relies on manual operation, which leads to low efficiency, increases time and manufacturing costs, and affects the continued utilization efficiency of the recycled frames.

Method used

A silicon wafer frame cleaning device is designed, including a main frame, a detection device, a first positioning mechanism, a second positioning mechanism, a residual material conveying mechanism, and a residual material cleaning mechanism. The detection device detects the status of the frame, the positioning mechanism positions and opens the clamping device, and the residual material cleaning mechanism uses a cleaning brush to clean the residual wafers in the frame and conveys them to the residual material box.

Benefits of technology

The automated material box cleaning process improves work efficiency, reduces time and costs, helps improve the utilization efficiency of circulating material boxes, and ensures worker safety.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The application discloses a kind of cleaning device of silicon wafer frame, including main frame;Two pairs of first positioning mechanism and detection device are arranged on the top of main frame;Second positioning mechanism is arranged on the top right end of main frame;Detection device is between two pairs of first positioning mechanism;Residual material conveying mechanism is arranged on the lower part of main frame;Residual cleaning opening slot is arranged on the upper part of main frame;The middle part of residual cleaning opening slot is provided with residual material cleaning mechanism distributed horizontally;Second positioning mechanism is used for the transverse positioning of circulating material frame;First positioning mechanism is arranged corresponding to the original limit hole in circulating material frame;Residual material cleaning mechanism is used for the cleaning of the inner cavity of circulating material frame, so that the residual photovoltaic silicon wafer residual piece in the inner cavity of circulating material frame falls into the residual material box of residual material conveying mechanism.The application can conveniently and reliably clean the residual photovoltaic silicon wafer residual piece in circulating material frame, improve work efficiency, reduce time cost and manufacturing cost rate.
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Description

Technical Field

[0001] This invention relates to the field of photovoltaic silicon wafer production technology, and in particular to a cleaning device for silicon wafer frames. Background Technology

[0002] As my country's photovoltaic new energy industry grows larger, the production cycle of photovoltaic silicon wafers is required to be shorter and shorter.

[0003] Currently, in silicon wafer production workshops, due to production needs, it is necessary to clean the residual photovoltaic silicon wafers inside the recycling bins after the previous processes are completed. Then, a robotic arm (such as a five-axis robotic arm) grabs the empty bins and puts them into the production line for use in subsequent production processes.

[0004] To clean up residual photovoltaic silicon wafers in the recycling bins, the current common practice is for workers to clean them manually. This method is inefficient, increases time and manufacturing costs, and also affects the continued utilization efficiency of the recycling bins. Summary of the Invention

[0005] The purpose of this invention is to address the technical deficiencies of existing technologies by providing a cleaning device for silicon wafer frames.

[0006] Therefore, the present invention provides a cleaning device for silicon wafer frames, including a main frame;

[0007] At the top of the main frame, there are two pairs of first positioning mechanisms and detection devices symmetrically distributed front and back;

[0008] At the top right end of the main frame, there is a second positioning mechanism distributed horizontally;

[0009] The detection device is located between the two pairs of first positioning mechanisms;

[0010] The detection device includes three sets of through-beam switches symmetrically distributed front and rear.

[0011] The detection device is used to detect whether there is a circulating material box that needs to be cleaned placed on the top of the main frame. When a circulating material box is detected on the top of the main frame, a trigger working signal is sent to the second positioning mechanism, and the loading status of the circulating material box is detected. When the circulating material box is full, a trigger grabbing signal is sent to the robot located outside, so that the robot will grab the circulating material box as full. When the circulating material box is empty, a trigger working signal is sent to the residual material cleaning mechanism.

[0012] A waste material conveying mechanism is installed at the lower part of the main frame;

[0013] The upper part of the main frame has horizontally distributed residual cleaning opening slots in the middle of the longitudinal direction;

[0014] At the top left end of the main frame, directly to the left of the residual cleaning opening slot, there is a positioning block;

[0015] A horizontally distributed residue cleaning mechanism is provided in the middle of the residue cleaning opening slot;

[0016] There are reserved gaps on the front and back sides of the residual material cleaning mechanism and on the front and back sides of the residual cleaning opening;

[0017] The second positioning mechanism is used to push the upper right side of the circulating material frame to the left laterally according to the trigger signal sent by the detection device when a circulating material frame that needs to be cleaned is placed on the top of the main frame, until the lower left side of the circulating material frame contacts the positioning block, thereby positioning the circulating material frame laterally.

[0018] The first positioning mechanism is set in correspondence with the original limiting hole in the circulating material frame. It is used to longitudinally position the circulating material frame and to drive the original clamping device by pushing the original limiting hole in the circulating material frame, thereby opening the clamping device so that the clamping device no longer maintains the clamping positioning state.

[0019] The residual material cleaning mechanism has cleaning brushes that extend into the inner cavity of the circulating material frame. When the original cotton clamping device in the circulating material frame is opened by the first positioning mechanism, the rodless cylinder on it drives the cleaning brushes to clean the inner cavity of the circulating material frame from right to left according to the trigger working signal sent by the detection device, so that the residual photovoltaic silicon wafers in the inner cavity of the circulating material frame fall into the residual material box of the residual material conveying mechanism.

[0020] The waste material box of the waste material conveying mechanism has an opening at the top and, when located directly below the waste material cleaning mechanism, is used to store photovoltaic silicon wafers cleaned out of the circulating material box in real time.

[0021] As can be seen from the technical solution provided by the present invention above, compared with the prior art, the present invention provides a cleaning device for silicon wafer frames. Its structure is scientifically designed and can conveniently and reliably clean the residual photovoltaic silicon wafers in the recycling frames, improve work efficiency, reduce time and manufacturing costs, and help improve the reuse efficiency of the recycling frames. Attached Figure Description

[0022] Figure 1 An isometric view (i.e., a three-dimensional structural schematic diagram) of a silicon wafer frame cleaning device provided by the present invention;

[0023] Figure 2 A front view of a silicon wafer spool cleaning device provided by the present invention;

[0024] Figure 3A left view of a cleaning device for a silicon wafer frame provided by the present invention;

[0025] Figure 4 A top view of a silicon wafer spool cleaning device provided by the present invention;

[0026] Figure 5 for Figure 3 Schematic diagram of the cross-sectional structure along the AA direction;

[0027] Figure 6 A schematic diagram of the three-dimensional structure of a circulating material frame. Figure 1 At this point, the material is fully loaded.

[0028] Figure 7 A schematic diagram of the three-dimensional structure of a circulating material frame. Figure 1 At this time, the material is empty.

[0029] Figure 8 A schematic diagram of the structure of a silicon wafer material frame cleaning device provided by the present invention, wherein a full-load circulating material frame is placed on it;

[0030] In the diagram, 1. Main framework;

[0031] 2. First positioning mechanism; 204. First positioning cylinder; 203. Screw;

[0032] 3. Waste material conveying mechanism; 301. First platform; 302. First platform; 303. Waste material box;

[0033] 4. Detection device; 4011. First through-beam switch; 4012. Second through-beam switch;

[0034] 5. Residue cleaning mechanism; 501. Rodless cylinder; 502. Cleaning brush;

[0035] 6. Second positioning mechanism, 201. Second positioning cylinder, 202. Stop block;

[0036] 7. Positioning blocking block. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0039] In the description of this patent, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection or setting, a detachable connection or setting, or an integral connection or setting. Those skilled in the art can understand the specific meaning of the above terms in this patent according to the specific circumstances.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0041] See Figures 1 to 8 The present invention provides a cleaning device for a silicon wafer frame, used to clean the photovoltaic silicon wafers remaining in the circulating frame, comprising: a main frame 1;

[0042] At the top of the main frame 1, there are two pairs of first positioning mechanisms 2 and a detection device 4 symmetrically distributed front and back;

[0043] At the top right end of the main frame 1, a second positioning mechanism 6 is provided in a horizontal distribution.

[0044] The detection device 4 is located between the two pairs of first positioning mechanisms 2;

[0045] The detection device 4 includes three sets of through-beam switches symmetrically distributed front and rear.

[0046] The detection device 4 is used to detect whether a circulating material frame 100 that needs to be cleaned is placed on the top of the main frame 1. When a circulating material frame is detected on the top of the main frame 1, a trigger working signal is sent to the second positioning mechanism 6, and the loading status of the circulating material frame is detected (i.e., whether it is a full frame or an empty frame). When the circulating material frame is full, a trigger gripping signal is sent to the robot located outside, so that the robot will grab the circulating material frame that is full. When the circulating material frame is empty, a trigger working signal is sent to the residual material cleaning mechanism 5 (specifically, the rodless cylinder 501).

[0047] The lower part of the main frame 1 is provided with a residual material conveying mechanism 3;

[0048] The main frame 1 has horizontally distributed residual cleaning opening slots at the middle of its upper longitudinal section.

[0049] At the top left end of the main frame 1, directly to the left of the residual cleaning opening slot, there is a positioning blocking block 7;

[0050] A horizontally distributed residue cleaning mechanism 5 is provided in the middle of the residue cleaning opening groove;

[0051] There are reserved gaps on the front and rear sides of the residual cleaning mechanism 5 and the front and rear sides of the residual cleaning opening;

[0052] The second positioning mechanism 6 is used to push the upper right side of the circulating material frame to the left laterally according to the trigger working signal sent by the detection device 4 when a circulating material frame that needs to be cleaned is placed on the top of the main frame 1, until the lower left side of the circulating material frame contacts the positioning block 7, thereby positioning the circulating material frame laterally.

[0053] The first positioning mechanism 2 is configured to correspond to the original limiting hole 101 in the circulating material frame 100. It is used to perform longitudinal positioning of the circulating material frame 100 and to drive the original clamping device 102 by pushing the original limiting hole 101 in the circulating material frame 100, thereby opening the clamping device 102 and causing the clamping device 102 to no longer maintain the clamping positioning state (i.e., no longer clamping and positioning the silicon wafer 200 in the circulating material frame 100).

[0054] The residual material cleaning mechanism 5 has a cleaning brush 502 that extends into the inner cavity of the circulating material frame (through the original horizontally distributed hollow opening at the bottom of the circulating material frame). When the original cotton clamping device 102 in the circulating material frame is opened by the first positioning mechanism 2, the rodless cylinder 501 on it, according to the trigger working signal sent by the detection device 4, drives the cleaning brush 502 to clean the inner cavity of the circulating material frame from right to left (i.e., slides horizontally in the inner cavity of the circulating material frame), so that the photovoltaic silicon wafer residue (i.e. silicon wafer residue) remaining in the inner cavity of the circulating material frame falls into the residual material box 303 of the residual material conveying mechanism 3.

[0055] The waste material box 303 of the waste material conveying mechanism 3 has an opening at the top and is used to store photovoltaic silicon wafers cleaned out from the recycling box in real time when it is located directly below the waste material cleaning mechanism 5.

[0056] In this invention, each pair of first positioning mechanisms 2 includes two first positioning cylinders 204 and two long screws 203.

[0057] The output end of each first positioning cylinder 204 is connected to the long screw 203;

[0058] Two long screws 203 are positioned opposite each other.

[0059] In specific implementation, for each pair of first positioning mechanisms 2, the two long screws 203 are respectively set to correspond to the original limiting holes 101 on the front and rear sides of the circulating material frame 100.

[0060] It should be noted that, in this invention, the long screw 203 of the first positioning cylinder 204 serves to position the circulating material frame and open the original cotton clamping device in the circulating material frame.

[0061] In this invention, the first positioning cylinder 204 is a telescopic cylinder, which is not only used to accurately position the circulating material frame, but also to open the cotton clamping device inside the circulating material frame, so that the residual material cleaning mechanism can enter the circulating material frame and clean the residual material inside the circulating material frame into the residual material conveying mechanism.

[0062] It should be noted that the long screw 203 connected to the first positioning cylinder 204 extends into the original limiting hole 101 of the circulating material frame 100, which can both limit the movement of the circulating material frame and open the cotton clamping device inside the circulating material frame for further operation.

[0063] Among them, for the circulating material frame used to store photovoltaic silicon wafers, when the original limiting hole 101 of the circulating material frame 100 is pushed, the clamping device 102 on it will be opened and will no longer clamp the silicon wafer.

[0064] It should be noted that the circulating material frame is a mature, ready-made piece of equipment, specifically manufactured by Huanbo Technology Co., Ltd. This circulating material frame is used to secure silicon wafers, facilitating their transportation and transfer. (See [link to relevant documentation]). Figure 6 , Figure 7 As shown, Figure 6 For a full material frame, Figure 7 This is an empty material frame.

[0065] See Figure 6 , Figure 7 As shown, the front and rear side walls of the circulating material frame 100 have horizontally distributed gaps, so that the light emitted by the photoelectric switch of the detection device 4 can pass through; if there is material (i.e. silicon wafer) in the material frame, the light from the photoelectric switch cannot pass through, so the photoelectric switch will detect it.

[0066] See Figure 6 , Figure 7 As shown, the clamping device in the circulating material frame is used to clamp and position the silicon wafers inside the circulating material frame.

[0067] After the circulating material frame is pushed into place, the clamping device extends from the first positioning cylinder 204. The long screw 203 connected to the first positioning cylinder 204 contacts the original limiting holes 101 on both the front and rear sides of the circulating material frame 100. Through the limiting holes 101, the original lever structure inside the circulating material frame can be driven, and thus the clamping device can be opened through the original lever structure inside the circulating material frame. At this time, the silicon wafers inside the circulating material frame can be removed by the robot gripper. After the silicon wafers 200 are placed in the circulating material frame, the clamping device will be squeezed into a clamping state.

[0068] It should be noted that the sides and bottom of the recycling frame are hollowed out. After removing the silicon wafer, you can proceed with the operation by cleaning the 502 brush.

[0069] In this invention, specifically, the second positioning mechanism 6 includes a second positioning cylinder 201 and a stop block 202;

[0070] The output end on the left side of the second positioning cylinder 201 is connected to the vertically distributed stop block 202.

[0071] It should be noted that the stop block 202 is fixedly connected to the output end of the second positioning cylinder 201. The stop block 202 contacts the circulating material frame, thereby accurately positioning it so that when the circulating material frame completes the cleaning operation, the robot arm located outside can accurately grab the empty material frame.

[0072] It should be noted that in this invention, the second positioning cylinder 201 is a double guide rod cylinder, and a stop block 202 is installed on the double guide rod cylinder. After the gripper of the external robot puts the circulating material frame into the top of the main frame 1, the double guide rod cylinder drives the stop block 202 to position the circulating material frame.

[0073] The first positioning cylinder 204 is a single-rod cylinder, and there are 4 of them. The output end (i.e., piston rod) of the single-rod cylinder has a screw hole, into which the long screw 203 can be inserted, and the length of the cylinder can be adjusted to the required length.

[0074] After the double-guide rod cylinder (i.e., the second positioning cylinder 201) positions the circulating material frame, the long screw 203 of the single-rod cylinder (i.e., the first positioning cylinder 204) goes deep into the circulating material frame. At this time, the circulating material frame can be locked to prevent it from moving, and the cotton clamping device inside the circulating material frame can be opened, so that the subsequent silicon wafer residue cleaning process can be carried out.

[0075] In this invention, specifically, the residue cleaning mechanism 5 includes: a rodless cylinder 501 and a cleaning brush 502;

[0076] A cleaning brush 502 is provided on the top of the slider of the horizontally distributed rodless cylinder 501.

[0077] It should be noted that, in this invention, the cleaning brush 502 sweeps the residual pieces in the circulating material frame after the cotton clamping device is opened into the residual material box.

[0078] It should be noted that, for the present invention, the length of the rodless cylinder 501 can be selected according to the length of the circulating material frame. Under the same function, the rodless cylinder is smaller in size and has a larger stroke than the cylinder with a guide rod. After the rodless cylinder 501 is equipped with the cleaning brush 502, it can clean the silicon wafer residue within the stroke into the residue box 303.

[0079] In this invention, specifically, the detection device 4 includes three pairs of through-beam switch mounting brackets 400;

[0080] On each opposite side of the mounting bracket 400 for each pair of photoelectric switches, there is a transmitter and a receiver included in a set of photoelectric switches.

[0081] It should be noted that a through-beam switch, also known as a through-beam photoelectric switch, works by transmitting light directly to the receiver. When the object being detected (e.g., a recycle bin) passes between the transmitter and receiver and blocks the light, the photoelectric switch generates a switching signal.

[0082] In specific implementation, the detection device 4 is used to detect the loading status of the circulating material frame (i.e., whether it is a full frame or an empty frame).

[0083] It should be noted that the detection device 4 uses a through-beam switch, which can be placed far away from the circulating material frame to maintain a safe position. Through the through-beam switch, it can detect whether the circulating material frame is placed on the top of the main frame 1, and detect the loading status inside the circulating material frame (i.e., whether it is full or empty). When it is full, the circulating material frame is then grabbed back by the gripper of the robot located outside, and other processes are carried out.

[0084] It should be noted that, for the present invention, the detection device 4 includes a first pair of photoelectric switches 4011 and two sets of second pair of photoelectric switches 4012, for a total of three sets of photoelectric switches 401 (each set of photoelectric switches includes a transmitter and a receiver symmetrically distributed at the front and back of the top of the main frame 1).

[0085] The first through-beam switch 4011 is located at the top center of the main frame 1;

[0086] The first photoelectric switch 4011 is installed at a height between the vertical height of the upper edge and the vertical height of the lower edge of the original front and rear lower frame 103 of the circulating material frame (the shape of the lower frame 103 on the front and rear sides of the circulating material frame 100 is a rectangle that is horizontally and vertically distributed). It is used to detect whether the circulating material frame exists (that is, whether there is a circulating material frame between this set of photoelectric switches that can block the detection light). If the circulating material frame exists, the operation can be carried out, that is, a trigger working signal is sent to the second positioning mechanism 6 (specifically the second positioning cylinder 201).

[0087] Among them, the two sets of second photoelectric switches 4012 are located on the top left and right sides of the main frame 1;

[0088] For the two sets of second photoelectric switches 4012 located on the left and right sides, the installation height of these two sets of second photoelectric switches is between the vertical height of the upper edge and the vertical height of the lower edge of the hollow opening in the middle of the front and rear sides of the original circulating material frame 100 (the shape of the hollow opening in the middle of the front and rear sides is a horizontally distributed rectangle, and the opening is directly connected to the cavity where the silicon wafer is placed in the longitudinal direction); the installation height of the two sets of second photoelectric switches 4012 is the same, and is higher than the installation height of the first photoelectric switch 4011.

[0089] Two sets of second photoelectric switches 4012 are used to detect the loading status of the circulating material frame. If the detection light of the two sets of second photoelectric switches is not blocked (i.e. the signal can be transmitted), it indicates that the circulating material frame is in an empty frame state (empty material frame). The two sets of second photoelectric switches 4012 send a trigger working signal to the residual material cleaning mechanism 5 (specifically, the rodless cylinder 501).

[0090] If both sets of second photoelectric switches are blocked (i.e. the signal cannot be transmitted), it means that the state of this circulating material frame is full (full material frame), and the two sets of second photoelectric switches 4012 send a trigger gripping signal to the robot.

[0091] The reason for using two sets of second photoelectric switches in this invention is that some silicon materials (i.e., silicon wafers) may be defective, and this prevents detection errors that may occur if only one set of photoelectric switches is used for detection.

[0092] When the circulating material box is full, the robot receives a trigger gripping signal from the two sets of second photoelectric switches 4012 located on the left and right sides. The robot will then directly grab the circulating material box and place it on the external conveyor line for other operations.

[0093] When the circulating material frame is in an empty frame state, the cleaning mechanism 5 (specifically the rodless cylinder 501) receives a trigger signal from the two sets of second photoelectric switches 4012. According to the trigger signal from the detection device 4, the rodless cylinder 501 drives the cleaning brush 502 to clean the inner cavity of the circulating material frame from right to left (i.e., slides laterally in the inner cavity of the circulating material frame), so that the photovoltaic silicon wafers (i.e. the silicon wafer residue) remaining in the inner cavity of the circulating material frame fall into the residue box 303 of the residue conveying mechanism 3.

[0094] In this invention, specifically, the waste material conveying mechanism 3 includes: a first platform 301, a second platform 302, and a waste material box 303;

[0095] The first platform 301 is located directly below the residual material cleaning mechanism 5;

[0096] The second platform 302 is located on the left side of the main frame 1;

[0097] The top of the first platform 301 and the second platform 302 is used to place the waste material box 303;

[0098] On the upper part of the left and right side walls of the waste material box 303, there is a pull notch 3030.

[0099] In practice, the top surfaces of the first platform 301 and the second platform 302 are located on the same horizontal plane.

[0100] In practice, the right side of the second platform 302 is connected to the left side of the main frame 1 by bolts.

[0101] It should be noted that a waste material box 303 is placed on the first platform 301. The waste material cleaning mechanism cleans the residual silicon wafers inside the circulating material frame after the cotton clamping device is opened and moves them into the waste material box by the cleaning brush 502.

[0102] It should be noted that when the waste material box is full of silicon wafer waste, the work area is paused. The staff enters the area and manually drags the waste material box from the first platform 301 to the second platform 302. The waste material box 303 can then be removed, and an empty waste material box 303 is placed on the second platform 302 and pushed back to the first platform 301.

[0103] The waste material box 303 is normally placed on the first platform 301. When it is to be removed, the waste material box 303 can be dragged to the second platform 302 and then taken out.

[0104] In specific implementation, the first platform 301 includes a longitudinally distributed roller group, which includes multiple longitudinally distributed rollers that can rotate clockwise or counterclockwise.

[0105] The top of the second platform 302 is provided with multiple stainless steel balls that are evenly spaced. The stainless steel balls can rotate in any direction (i.e., 360°), which means that the existing mature universal ball bearing platform can be used.

[0106] Therefore, based on the above design of the roller and stainless steel ball bearings, the present invention facilitates manual removal of the waste material box.

[0107] In this invention, specifically, the dimensions of the main frame 1 are determined according to the dimensions of the circulating material frame used on site.

[0108] To better understand the technical solution of the present invention, the overall operation process of the present invention is described below.

[0109] First, the circulating material box is placed on top of the main frame 1 by the robot gripper (i.e., the manipulator) located on the outside;

[0110] Then, the detection device 4 detects that a circulating material frame that needs to be cleaned is placed on the top of the main frame 1, and sends a trigger signal to the second positioning mechanism 6, so that the second positioning mechanism 6 performs lateral positioning of the circulating material frame.

[0111] Then, the first positioning mechanism 2 longitudinally positions the circulating material frame and extends the long screw 203 into the original limiting hole 101 of the circulating material frame 100. At this time, the circulating material frame can be locked and the original cotton clamping device 102 inside the circulating material frame can be opened.

[0112] Then, after the cotton clamping device is opened, the rodless cylinder 501 in the residual material cleaning mechanism 5 drives the cleaning brush 502 to move, thereby cleaning the residual material in the circulating material frame into the residual material box 303.

[0113] Then, when the waste material box 303 is full of waste material, the work area is paused. The staff enters the area and manually drags the waste material box 303 from the first platform 301 to the second platform 302. The waste material box 303 can then be removed. The empty waste material box 303 is then placed on the second platform 302 and pushed back to the first platform 301 to start the next cycle.

[0114] It should be noted that after cleaning is completed, the long screw 203 of the first positioning mechanism 2 retracts.

[0115] Compared with the prior art, the silicon wafer frame cleaning device provided by the present invention has the following beneficial effects:

[0116] 1. Compared with the prior art, the silicon wafer frame cleaning device of the present invention controls the specific position of the circulating frame to be cleaned through the second positioning mechanism and opens the circulating frame. Then, the rodless cylinder 501 and the cleaning brush 502 in the residual material cleaning mechanism 5 located below the circulating frame are used to clean the residual wafers in the inner cavity of the circulating frame into the residual material box 303. The overall structure is reasonable, easy to install, and has low production cost.

[0117] 2. The waste material box of the present invention is convenient to pick up and put away;

[0118] 3. This invention can conveniently and reliably clean the material frames used for photovoltaic silicon wafers, improve production efficiency, and ensure worker safety.

[0119] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A cleaning device for silicon wafer frames, characterized in that, Including the main framework (1); The top of the main frame (1) is provided with two pairs of first positioning mechanisms (2) and a detection device (4) symmetrically distributed front and back; At the top right end of the main frame (1), there is a second positioning mechanism (6) distributed horizontally; The detection device (4) is located between the two pairs of first positioning mechanisms (2); The detection device (4) includes three sets of through-beam switches symmetrically distributed front and rear; The detection device (4) is used to detect whether a circulating material box (100) that needs to be cleaned is placed on the top of the main frame (1). When a circulating material box is detected on the top of the main frame (1), a trigger working signal is sent to the second positioning mechanism (6), and the loading status of the circulating material box is detected. When the circulating material box is full, a trigger grabbing signal is sent to the robot located outside, so that the robot will grab the circulating material box as full. When the circulating material box is empty, a trigger working signal is sent to the residual material cleaning mechanism (5). The lower part of the main frame (1) is provided with a residual material conveying mechanism (3); The main frame (1) has a horizontally distributed residual cleaning opening slot at the middle of its upper longitudinal position; At the top left end of the main frame (1), a positioning block (7) is provided at the position directly to the left of the residual cleaning opening slot; In the middle of the residual cleaning opening groove, a horizontally distributed residual cleaning mechanism (5) is provided; There are reserved gaps on the front and back sides of the residual cleaning mechanism (5) and the front and back sides of the residual cleaning opening; The second positioning mechanism (6) is used to push the upper right side of the circulating material frame to the left according to the trigger working signal sent by the detection device (4) when a circulating material frame that needs to be cleaned is placed on the top of the main frame (1), until the lower left side of the circulating material frame contacts the positioning block (7), thereby positioning the circulating material frame laterally. The first positioning mechanism (2) is set in correspondence with the original limiting hole (101) in the circulating material frame (100) for longitudinal positioning of the circulating material frame (100) and for driving the original clamping device (102) by pushing the original limiting hole (101) in the circulating material frame (100) to open the clamping device (102) so that the clamping device (102) no longer maintains the clamping positioning state; The residual material cleaning mechanism (5) has a cleaning brush (502) that extends into the inner cavity of the circulating material frame. When the original cotton clamping device (102) in the circulating material frame is opened by the first positioning mechanism (2), the rodless cylinder (501) on it, according to the trigger working signal sent by the detection device (4), drives the cleaning brush (502) to clean the inner cavity of the circulating material frame from right to left, so that the residual photovoltaic silicon wafers in the inner cavity of the circulating material frame fall into the residual material box (303) of the residual material conveying mechanism (3). The waste material box (303) of the waste material conveying mechanism (3) has an opening at the top and is used to store photovoltaic silicon wafers cleaned out from the recycling box in real time when it is located directly below the waste material cleaning mechanism (5).

2. The silicon wafer frame cleaning device as described in claim 1, characterized in that, Each pair of first positioning mechanisms (2) includes two first positioning cylinders (204) and two long screws (203); The output end of each first positioning cylinder (204) is connected to the long screw (203); Two long screws (203) are arranged opposite each other.

3. The silicon wafer frame cleaning device as described in claim 2, characterized in that, For each pair of first positioning mechanisms (2), the two long screws (203) are respectively set to correspond to the original limiting holes (101) on the front and rear sides of the circulating material frame (100).

4. The cleaning device for silicon wafer frames as described in claim 1, characterized in that, The second positioning mechanism (6) includes a second positioning cylinder (201) and a stop block (202); The output end on the left side of the second positioning cylinder (201) is connected to the vertically distributed stop block (202).

5. The silicon wafer frame cleaning device as described in claim 1, characterized in that, The residue cleaning mechanism (5) includes: a rodless cylinder (501) and a cleaning brush (502); A cleaning brush (502) is provided on the top of the slider of the horizontally distributed rodless cylinder (501).

6. The silicon wafer frame cleaning device as described in claim 1, characterized in that, The waste material conveying mechanism (3) includes: a first platform (301), a second platform (302), and a waste material box (303); The first platform (301) is located directly below the residual material cleaning mechanism (5); The second platform (302) is located to the left of the main frame (1); The top of the first platform (301) and the second platform (302) is used to place the waste material box (303); The upper part of the left and right side walls of the waste material box (303) is provided with a pull notch (3030).

7. The silicon wafer frame cleaning device as described in claim 6, characterized in that, The top surfaces of the first platform (301) and the second platform (302) are located on the same horizontal plane; The right side of the second platform (302) is connected to the left side of the main frame (1) by bolts.

8. The silicon wafer frame cleaning device as described in claim 1, characterized in that, The first platform (301) includes a longitudinally distributed roller assembly, which includes a plurality of longitudinally distributed rollers; The top of the second platform (302) is provided with multiple stainless steel balls that are evenly spaced.

9. The cleaning device for silicon wafer frames as described in claim 1, characterized in that, The detection device (4) includes three pairs of through-beam switch mounting brackets (400); On each opposite side of each pair of through-beam switch mounting brackets (400), there is a transmitter and receiver included in a set of through-beam switches.

10. The silicon wafer frame cleaning device as described in claim 9, characterized in that, The detection device (4) includes a first pair of photoelectric switches (4011) and two sets of second pair of photoelectric switches (4012); Among them, the first photoelectric switch (4011) is located at the top middle position of the main frame (1); The first photoelectric switch (4011) is installed at a height between the vertical height of the upper edge and the vertical height of the lower edge of the original front and rear lower frame (103) of the circulating material frame. It is used to detect whether the circulating material frame exists. If the circulating material frame exists, it sends a trigger working signal to the second positioning mechanism (6). Among them, two sets of second photoelectric switches (4012) are located on the top left and right sides of the main frame (1); For the two sets of second photoelectric switches (4012) located on the left and right sides, the installation height of these two sets of second photoelectric switches is between the vertical height of the upper edge and the vertical height of the lower edge of the original hollow opening in the middle of the front and rear sides of the circulating material frame (100). Two sets of second photoelectric switches (4012) are used to detect the loading status of the circulating material frame. If the detection light of the two sets of second photoelectric switches is not blocked, it indicates that the circulating material frame is empty. The two sets of second photoelectric switches (4012) send a trigger working signal to the rodless cylinder (501) in the residual material cleaning mechanism (5). If both sets of second photoelectric switches are blocked, it means that the state of this circulating material frame is full, and the two sets of second photoelectric switches (4012) send a trigger gripping signal to the robot. When the circulating material box is full, the robot receives a trigger gripping signal from the two sets of second photoelectric switches (4012) located on the left and right sides, and the robot will directly grab the circulating material box. When the circulating material frame is empty, the cleaning mechanism (5) receives a trigger signal from the two sets of second photoelectric switches (4012). The rodless cylinder (501) cleans the inner cavity of the circulating material frame from right to left by driving the cleaning brush (502) according to the trigger signal sent by the detection device (4).

Citation Information

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