A laser etching process for a chip on film module track hole

Abstract

The application discloses a kind of laser etching processes for flip chip thin film module track hole, including operation box, the right end surface of the operation box is fixed with control panel for the regulation and control of whole device, the left end surface of the operation box is fixed with motor, the output of the motor is fixed with threaded rod, the threaded rod bearing is connected in operation box, the threaded rod is connected with movable frame by screw thread, the movable frame lower end is equipped with laser etcher.This laser etching process for flip chip thin film module track hole, using clamping limiting mechanism, can realize the fixed tensioning effect of flip chip thin film, both can guarantee the stability of flip chip thin film, also can guarantee the flatness of flip chip thin film, facilitate the processing of flip chip thin film, cooperate with linkage cleaning mechanism and cutting mechanism, can clean the surface debris of processed flip chip thin film, and according to actual width cutting, guarantee the processing quality of flip chip thin film, effectively improve the processing efficiency of flip chip thin film.

Description

Technical Field

[0001] The present invention relates to the technical field of chip-on-film processing, and in particular to a laser etching process for track holes in a chip-on-film module. Background Art

[0002] Chip-on-film (COF), also known as COF, is a die-on-film assembly technology that fixes integrated circuits (ICs) on flexible circuit boards. To facilitate assembly of the IC and COF, track holes must be etched on the COF through a laser etching process (using laser ablation to ablate the COF). However, conventional laser etching devices have some shortcomings when etching COF:

[0003] 1. Since the chip-on-film is relatively soft, and the existing laser etching equipment lacks a positioning device, the chip-on-film is prone to bending, which affects the normal etching process;

[0004] 2. After production, the chip-on-film is generally in the form of long strips that need to be cut into fixed lengths according to actual needs. However, existing laser etching devices lack a cutting mechanism, making it difficult to meet cutting requirements.

[0005] 3. During the laser etching process, it is difficult to avoid some debris splashing and adhering to the surface of the flip chip film. However, the existing laser etching device lacks a cleaning mechanism, which affects the production quality of the flip chip film. Summary of the Invention

[0006] The purpose of the present invention is to provide a laser etching process for the track holes of the chip-on-film module to solve the problems raised in the above background technology that the chip-on-film is prone to bending and affects the normal etching process, there is a lack of cutting mechanism, it is difficult to meet the cutting requirements, and there is a lack of cleaning mechanism to make it difficult to clean the debris on the surface of the chip-on-film.

[0007] To achieve the above-mentioned object, the present invention provides the following technical solution: a laser etching process for track holes in a flip chip thin film module, comprising the following steps:

[0008] S1: Clamping and fixing: The height of the fixed plate and the pressure block is adjusted by the screw. The pressure block cooperates with the movable plate to clamp and fix the chip-on-film body, so that the subsequent processing can proceed normally.

[0009] S2: Cutting device position adjustment: Through the function of the mounting frame, the knife holder, the slider and the locking bolt, the position of the cutting knife can be adjusted and fixed so as to cut the processed chip-on-film body;

[0010] S3: The position of the movable plate can be adjusted by the electric telescopic rod, thereby adjusting the position of the chip-on-film body, so that the chip-on-film body is moved to the bottom of the laser etcher for etching processing;

[0011] S4: Through the action of the motor, threaded rod and movable frame, the position of the laser etcher can be adjusted to ensure the normal progress of the etching process;

[0012] S5: After the processing is completed, the chip-on-film body can be moved outwards by the electric telescopic rod, and the surface of the chip-on-film body can be cleaned with a wiping pad, and the chip-on-film body can be automatically cut with a cutting knife.

[0013] Preferably, it includes an operating box, a control panel is fixed on the right end face of the operating box for regulating the entire device, a motor is fixed on the left end face of the operating box, a threaded rod is fixed on the output end of the motor, the threaded rod bearing is connected in the operating box, the threaded rod is connected to a movable frame through a thread, a laser etcher is installed at the lower end of the movable frame, and the position adjustment of the movable frame and the laser etcher can be achieved through the action of the motor and the threaded rod to ensure the normal etching of the track groove of the chip-on-chip film body.

[0014] Preferably, the movable frame and the cross bar are slidably connected, and the cross bar is fixed in the operating box, and the cross bar and the threaded rod are distributed in parallel. When the movable frame is moved under force, the sliding guiding effect between the movable frame and the cross bar can ensure that the movable frame performs stable linear motion.

[0015] Preferably, a vertical plate is also fixed on the operating box, and an electric telescopic rod is symmetrically fixed to the rear end surface of the vertical plate, a movable plate is fixed to the output end of the electric telescopic rod, and a fixed frame is symmetrically fixed to the upper end surface of the movable plate, a screw is connected to the fixed frame, and the lower end bearing of the screw is connected to the fixed plate, and the fixed plate is arranged below the fixed frame, and a chip-covered film body is arranged between the movable plate and the fixed plate, and two groups of rotatable movable rods are also connected to the movable plate, and a torsion spring is also connected between the movable rod and the movable plate. The moving action of the movable plate and the chip-covered film body can be realized by the electric telescopic rod, and the elastic action of the torsion spring can provide a basic force for the automatic resetting of the movable rod.

[0016] Preferably, the movable plate is also provided with grooves symmetrically on the left and right, and baffles are also fixed symmetrically on the movable plate, and the baffles are in contact with the movable rod to achieve a blocking effect. Through the action of the grooves, a basic guarantee can be provided for the tightening of the chip-covered film body. Combined with the action of the baffle, the movable rod can only rotate backward and not forward, ensuring the unidirectional movement of the movable rod and thus ensuring the normal operation of the device.

[0017] Preferably, a pressure block is fixed to the lower end surface of the fixed plate, and the pressure block is a semicircular structure, and the pressure block and the groove can cooperate with each other, and at the same time, the pressure block contacts the chip-on-film body to achieve a positioning effect, and a sliding rod is fixed to the upper end surface of the fixed plate, and the sliding rod passes through the fixed frame and can slide up and down, and the position of the fixed plate and the pressure block can be adjusted by the screw, and the sliding guiding effect of the sliding rod can ensure the stability of the movement of the fixed plate and the pressure block, and the pressure block cooperates with the groove to cause the chip-on-film body between the pressure block and the groove to be deformed, thereby achieving a tightening effect on the chip-on-film body, and then ensuring the flatness of the chip-on-film body, and avoiding the chip-on-film body from bending and affecting the normal processing.

[0018] Preferably, a fixed cylinder is also fixed on the operation box, and the fixed cylinder is arranged on the rear side of the movable plate. A connecting rod is slidably connected to the fixed cylinder, and a mounting bracket is fixed on the upper end of the connecting rod. An arc plate with a semicircular structure is also fixed symmetrically on the lower end face of the mounting bracket, and the arc plate contacts the movable rod and can slide. A knife holder is provided under the mounting bracket, and a cutting knife is connected to a bearing on the knife holder. A fixed rod is also fixed vertically and symmetrically on the rear side of the mounting bracket. The height of the mounting bracket, the knife holder and the cutting knife can be adjusted by sliding between the connecting rod and the fixed cylinder, thereby ensuring the normal operation of the device.

[0019] Preferably, one end of a spring is fixed on the connecting rod, and the other end of the spring is fixed in the fixing tube. The elastic action of the spring can provide basic protection for the automatic reset of the connecting rod, mounting bracket, knife holder and cutting knife.

[0020] Preferably, a slider is fixed to the upper end of the tool holder, and the slider is nested in the mounting frame and can slide left and right. A locking bolt is also connected to the front end of the tool holder, and the tool holder and the mounting frame can be locked by the locking bolt. The sliding action of the slider can conveniently adjust the distance between the two sets of cutting knives, and the locking action of the locking bolt can ensure the stability of the device after adjustment.

[0021] Preferably, a horizontal plate is fixed to the lower end of the fixing rod, and a semicircular wiping pad is fixed to the lower end surface of the horizontal plate by bolts, and the wiping pad is elastic and can slide when in contact with the chip-on-film body. Through the action of the wiping pad, the chip-on-film body after laser etching can be cleaned to avoid the adhesion of debris and impurities on the surface of the chip-on-film body affecting the processing quality of the chip-on-film body.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows: the laser etching process for the track hole of the chip-on-film module adopts a clamping and limiting mechanism to achieve the fixed tensioning effect of the chip-on-film, which can ensure the stability of the chip-on-film and the flatness of the chip-on-film, and facilitate the processing of the chip-on-film. In conjunction with the linked cleaning mechanism and cutting mechanism, the surface debris of the processed chip-on-film can be cleaned and cut according to the actual width, thereby ensuring the processing quality of the chip-on-film and effectively improving the processing efficiency of the chip-on-film. The specific contents are as follows:

[0023] This laser etching process for the track holes of the COF module is provided with a pressure block. The height of the fixing plate and the pressure block can be adjusted by a screw to achieve the compression and fixation of the COF body. The pressure block cooperates with the groove to cause deformation of the two ends of the COF body, thereby achieving the automatic tightening effect of the COF body, ensuring the stability and flatness of the COF body fixation, and preventing the COF body from being affected by bending and deformation and affecting the normal processing.

[0024] The laser etching process for the track holes of the COF module is provided with a wiping pad. When the electric telescopic rod contracts and drives the movable plate and the COF body to move, the wiping pad can clean the surface of the COF body to ensure the cleanliness of the COF body surface.

[0025] The laser etching process for the track holes of the flip chip film module is provided with a cutting knife. Through the function of the mounting frame, the knife holder, the slider and the locking bolt, the distance between two adjacent groups of cutting knives can be adjusted so as to realize the cutting effect of the flip chip film body according to actual needs, without the need for subsequent manual cutting, thereby improving the processing efficiency of the flip chip film body. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the laser etching process operation process of the present invention;

[0027] Figure 2 This is a schematic diagram of the three-dimensional structure of the operating box of the present invention when viewed from above;

[0028] Figure 3 This is a schematic diagram of the vertical plate structure from above;

[0029] Figure 4 This is a schematic diagram of the front cross-sectional structure of the operating box of the present invention;

[0030] Figure 5 This is a schematic diagram of the three-dimensional structure of the movable plate of the present invention from a top view;

[0031] Figure 6 This is a schematic diagram of an enlarged partial cross-section of the movable panel of the present invention;

[0032] Figure 7 This is a schematic diagram of the front three-dimensional structure of the mounting frame of the present invention;

[0033] Figure 8 This is a schematic diagram of the rear perspective structure of the mounting frame of the present invention;

[0034] Figure 9 It is a schematic diagram of the three-dimensional structure of the mounting bracket and the tool holder of the present invention.

[0035] In the figure: 1. operation box; 2. control panel; 3. motor; 4. threaded rod; 5. movable frame; 6. laser etcher; 7. horizontal bar; 8. vertical plate; 9. electric telescopic rod; 10. movable plate; 1001. groove; 1002. baffle; 11. fixed frame; 12. screw rod; 13. fixed plate; 1301. pressure block; 1302. slide bar; 14. chip-on-film body; 15. movable rod; 1501. torsion spring; 16. fixed cylinder; 17. connecting rod; 1701. spring; 18. mounting frame; 1801. curved plate; 19. knife holder; 1901. slide block; 1902. locking bolt; 20. cutting knife; 21. fixed rod; 2101. horizontal plate; 2102. wiping pad. DETAILED DESCRIPTION

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0037] See also Figures 1-9 The present invention provides a technical solution: a laser etching process for track holes in a flip chip film module, comprising the following steps:

[0038] S1: Clamping and fixing: The height of the fixed plate 13 and the pressing block 1301 is adjusted by the screw 12. The pressing block 1301 cooperates with the movable plate 10 to clamp and fix the COF body 14 so that the subsequent processing can proceed normally.

[0039] S2: Cutting device position adjustment: Through the functions of the mounting frame 18, the knife holder 19, the slider 1901 and the locking bolt 1902, the position of the cutting knife 20 can be adjusted and fixed so as to cut the processed chip-on-film body 14;

[0040] S3: The position of the movable plate 10 can be adjusted by the electric telescopic rod 9, thereby adjusting the position of the chip-on-film body 14, so that the chip-on-film body 14 is moved to the bottom of the laser etcher 6 for etching;

[0041] S4: Through the action of the motor 3, the threaded rod 4 and the movable frame 5, the position of the laser etcher 6 can be adjusted to ensure the normal progress of the etching process;

[0042] S5: After the processing is completed, the COF body 14 can be moved outward by the electric telescopic rod 9, and the surface of the COF body 14 can be cleaned with the wiping pad 2102, and the COF body 14 can be automatically cut with the cutting knife 20.

[0043] The device comprises an operating box 1, a control panel 2 being fixed to the right end face of the operating box 1 for regulating the entire device, a motor 3 being fixed to the left end face of the operating box 1, a threaded rod 4 being fixed to the output end of the motor 3, the threaded rod 4 being connected to the operating box 1 by a bearing, the threaded rod 4 being connected to a movable frame 5 by a thread, the lower end of the movable frame 5 being mounted with a laser etcher 6; the movable frame 5 is slidably connected to a crossbar 7, the crossbar 7 being fixed to the operating box 1, and the crossbar 7 being parallel to the threaded rod 4;

[0044] After the COF body 14 moves to the position directly below the laser etcher 6, as shown in FIG. Figure 2 and Figure 4 As shown, the laser etcher 6 and the motor 3 are started by controlling the control panel 2, and the threaded rod 4 is driven to rotate by the motor 3. The threaded connection between the threaded rod 4 and the movable frame 5 can make the movable frame 5 move under force, thereby driving the laser etcher 6 to move, thereby achieving the laser etching effect of the chip-on-film body 14. When the movable frame 5 moves, the sliding guide effect between the movable frame 5 and the cross bar 7 can ensure the stability of the movement of the movable frame 5 and the laser etcher 6, thereby ensuring the normal progress of the laser etching.

[0045] The operating box 1 is also fixed with a vertical plate 8, and the rear end surface of the vertical plate 8 is also symmetrically fixed with an electric telescopic rod 9, and the output end of the electric telescopic rod 9 is fixed with a movable plate 10. The upper end surface of the movable plate 10 is also symmetrically fixed with a fixing frame 11, and the fixing frame 11 is connected with a screw 12. The lower end bearing of the screw 12 is connected to the fixing plate 13, and the fixing plate 13 is arranged below the fixing frame 11. A cover film body 14 is provided between the movable plate 10 and the fixed plate 13. Two sets of rotatable movable rods 15 are also connected to the movable plate 10, and a torsion spring 15 is also connected between the movable rod 15 and the movable plate 10. 01; The movable plate 10 is further provided with grooves 1001 symmetrically on the left and right, and a baffle 1002 is further fixed on the movable plate 10, and the baffle 1002 contacts the movable rod 15 to achieve a blocking effect; a pressing block 1301 is further fixed to the lower end surface of the fixed plate 13, and the pressing block 1301 is a semicircular structure, and the pressing block 1301 and the groove 1001 can cooperate with each other, and at the same time, the pressing block 1301 contacts the chip-on-film body 14 to achieve a positioning effect, and a sliding rod 1302 is further fixed to the upper end surface of the fixed plate 13, and the sliding rod 1302 passes through the fixed frame 11 and can slide up and down;

[0046] When the COF body 14 is laser etched, Figure 2-Figure 6 As shown, first fix the COF body 14 and place the COF body 14 on the movable plate 10, with the COF body 14 located between the pressing block 1301 and the movable plate 10. Then, by rotating the screw 12, the height of the fixed plate 13 and the pressing block 1301 is adjusted until the pressing block 1301 cooperates with the groove 1001 to achieve the clamping effect of one end of the COF body 14. Then, straighten the COF body 14 and place the other end of the COF body 14 on the other side so that the pressing block 1301 and the groove 1001 can be matched. Between the movable plates 10, according to the above principle, the other end of the COF body 14 can be fixed, ensuring the stability of the COF body 14. When the COF body 14 is fixed, the semicircular structure of the pressing block 1301 cooperates with the groove 1001 to deform the end of the COF body 14, thereby providing a certain pulling force to the COF body 14 between the left and right sets of pressing blocks 1301, thereby ensuring the flatness of the COF body 14 and facilitating the processing of the COF body 14.

[0047] The operating box 1 is also fixed with a fixed cylinder 16, which is arranged on the rear side of the movable plate 10. A connecting rod 17 is slidably connected to the fixed cylinder 16. A mounting bracket 18 is fixed to the upper end of the connecting rod 17. The lower end surface of the mounting bracket 18 is also symmetrically fixed with a semicircular arc plate 1801. The arc plate 1801 contacts the movable rod 15 and can slide. A knife holder 19 is provided below the mounting bracket 18. A cutting knife 20 is connected to the bearing on the knife holder 19. A fixed rod 21 is also fixed to the rear side of the mounting bracket 18 vertically and symmetrically. One end of the spring 1701 is also fixed to the connecting rod 17, and the spring The other end of 1701 is fixed in the fixed cylinder 16; a slider 1901 is also fixed to the upper end of the tool holder 19, and the slider 1901 is nested in the mounting frame 18 and can slide left and right. A locking bolt 1902 is also connected to the front end of the tool holder 19, and the tool holder 19 and the mounting frame 18 can be locked by the locking bolt 1902; a horizontal plate 2101 is fixed to the lower end of the fixing rod 21, and a semicircular wiping pad 2102 is fixed to the lower end surface of the horizontal plate 2101 by bolts, and the wiping pad 2102 is elastic and can slide when in contact with the chip-on-film body 14;

[0048] After the Chip-on-Flip Film body 14 is fixed, Figure 2-Figure 9As shown, the position of the cutting knife 20 is adjusted according to the actual cutting size of the subsequent chip-on-film body 14. At this time, the knife holder 19 can be moved by sliding between the slider 1901 and the mounting frame 18, thereby adjusting the position of the cutting knife 20 to control the distance between two adjacent groups of cutting knives 20. After the adjustment is completed, the locking bolt 1902 can be used to lock it to ensure the stability of the device after adjustment. After the adjustment is completed, the electric telescopic rod 9 is controlled to extend through the control panel 2, thereby driving the movable plate 10 and the chip-on-film body 14 The movable plate 10 moves so as to facilitate the conveying of the chip-on-film body 14 to the position just below the laser etcher 6 for processing. When the movable plate 10 moves, the movable rod 15 is driven to move at the same time. When the movable rod 15 contacts the curved plate 1801, the blocking effect of the baffle 1002 can prevent the movable rod 15 from rotating, so that the curved plate 1801, the mounting frame 18 and the connecting rod 17 are forced to move upward, and the spring 1701 is stretched, which drives the knife holder 19 and the cutting knife 20 to move upward, so as to avoid the cutting knife 20 from contacting the curved plate 1801 when the chip-on-film body 14 is fed. The chip-on-film body 14 is cut to ensure the normal operation of the device until the movable rod 15 is separated from the curved plate 1801, so that the curved plate 1801, the mounting frame 18, the connecting rod 17, the knife holder 19 and the cutting knife 20 are restored to their original positions. When the chip-on-film body 14 is processed, the electric telescopic rod 9 is retracted to drive the chip-on-film body 14 to move forward. At this time, when the movable rod 15 contacts the curved plate 1801, the movable rod 15 can rotate normally, so that the knife holder 19 and the cutting knife 20 will not move upward, thereby making the chip-on-film body 1 4 can contact the cutting blade 20. The spring 1701 provides a force for the cutting blade 20 to achieve the cutting effect of the chip-on-film body 14, so as to meet the actual processing requirements. In addition, when the chip-on-film body 14 is moved by the electric telescopic rod 9, when the chip-on-film body 14 contacts the wiping pad 2102, the wiping pad 2102 can clean the surface of the chip-on-film body 14, thereby ensuring the processing quality of the chip-on-film body 14. This is the working principle of the laser etching process for the track hole of the chip-on-film module.

[0049] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A laser etching process for track holes in a chip-on-film module, characterized in that: The following steps are involved: S1: Clamping and fixing: The height of the fixed plate (13) and the pressing block (1301) is adjusted by the screw (12), and the pressing block (1301) cooperates with the movable plate (10) to achieve the clamping and fixing of the chip-on-film body (14), so that the subsequent processing can proceed normally; S2: Position adjustment of the cutting device: Through the action of the mounting frame (18), the knife holder (19), the slider (1901) and the locking bolt (1902), the position of the cutting knife (20) can be adjusted and fixed so as to cut the processed chip-on-film body (14); S3: The position of the movable plate (10) can be adjusted by the electric telescopic rod (9), thereby adjusting the position of the chip-on-film body (14), so that the chip-on-film body (14) is moved to the bottom of the laser etcher (6) for etching; S4: Through the action of the motor (3), the threaded rod (4) and the movable frame (5), the position of the laser etcher (6) can be adjusted to ensure the normal progress of the etching process; S5: After the processing is completed, the chip-on-film body (14) can be moved outward by the electric telescopic rod (9), and the surface of the chip-on-film body (14) can be cleaned by the wiping pad (2102), and the chip-on-film body (14) can be automatically cut by the cutting knife (20); The invention comprises an operating box (1), wherein a vertical plate (8) is fixed on the operating box (1), an electric telescopic rod (9) is fixed to the rear end face of the vertical plate (8) in a symmetrical manner, a movable plate (10) is fixed to the output end of the electric telescopic rod (9), a fixed frame (11) is fixed to the upper end face of the movable plate (10) in a symmetrical manner, a screw rod (12) is connected to the fixed frame (11), a bearing at the lower end of the screw rod (12) is connected to the fixed plate (13), the fixed plate (13) is arranged below the fixed frame (11), a chip-covered film body (14) is arranged between the movable plate (10) and the fixed plate (13), two groups of rotatable movable rods (15) are connected to the movable plate (10), and a torsion spring (1501) is connected between the movable rod (15) and the movable plate (10); The movable plate (10) is also provided with grooves (1001) symmetrically on the left and right, and baffles (1002) are also fixed on the movable plate (10) symmetrically on the left and right, and the baffles (1002) are in contact with the movable rod (15) to achieve a blocking effect; The operation box (1) is also fixed with a fixed cylinder (16), the fixed cylinder (16) is arranged on the rear side of the movable plate (10), the fixed cylinder (16) is slidably connected with a connecting rod (17), the upper end of the connecting rod (17) is fixed with a mounting frame (18), the lower end surface of the mounting frame (18) is also fixed with a semicircular structure arc plate (1801) symmetrically on the left and right, the arc plate (1801) contacts the movable rod (15) and can slide, a knife holder (19) is provided below the mounting frame (18), a cutting knife (20) is connected to the upper bearing of the knife holder (19), and a fixed rod (21) is also fixed on the rear side of the mounting frame (18) in a vertically symmetrical manner on the left and right.

2. The laser etching process for track holes in a chip-on-film module according to claim 1, characterized in that: A control panel (2) is fixed to the right end face of the operation box (1) for regulating the entire device, a motor (3) is fixed to the left end face of the operation box (1), a threaded rod (4) is fixed to the output end of the motor (3), a bearing of the threaded rod (4) is connected to the inside of the operation box (1), the threaded rod (4) is connected to a movable frame (5) through a threaded connection, and a laser etcher (6) is installed at the lower end of the movable frame (5).

3. The laser etching process for track holes in a chip-on-film module according to claim 2, characterized in that: The movable frame (5) and the cross bar (7) are slidably connected, the cross bar (7) is fixed in the operating box (1), and the cross bar (7) and the threaded rod (4) are parallel.

4. The laser etching process for track holes in a chip-on-film module according to claim 1, characterized in that: A pressure block (1301) is also fixed on the lower end surface of the fixed plate (13), and the pressure block (1301) is a semicircular structure, and the pressure block (1301) and the groove (1001) can cooperate with each other, and at the same time, the pressure block (1301) contacts the chip-on-film body (14) to achieve a positioning effect. A sliding rod (1302) is also fixed on the upper end surface of the fixed plate (13), and the sliding rod (1302) passes through the fixed frame (11) and can slide up and down.

5. The laser etching process for track holes in a chip-on-film module according to claim 1, characterized in that: One end of a spring (1701) is also fixed on the connecting rod (17), and the other end of the spring (1701) is fixed in the fixing cylinder (16).

6. The laser etching process for track holes in a chip-on-film module according to claim 1, characterized in that: The upper end of the tool holder (19) is also fixed with a slider (1901), and the slider (1901) is nested in the mounting frame (18) and can slide left and right. The front end of the tool holder (19) is also connected with a locking bolt (1902), and the tool holder (19) and the mounting frame (18) can achieve a locking effect through the locking bolt (1902).

7. The laser etching process for track holes in a chip-on-film module according to claim 1, characterized in that: A transverse plate (2101) is fixed to the lower end of the fixing rod (21), and a semicircular wiping pad (2102) is fixed to the lower end surface of the transverse plate (2101) by bolts, and the wiping pad (2102) is elastic and can slide when in contact with the chip-on-film body (14).

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