Simulation test method and simulation test device for domain controller

Abstract

The present invention relates to the technical field of automobile domain controllers, and provides a simulation test method and a simulation test device for domain controllers. The simulation test method includes: S100, obtaining the material parameters of the domain controller circuit board; S200, simulating the target parameters of the domain controller circuit board according to the material parameters; S300, judging whether the simulation data is qualified, if so, executing S400, if not, at least adjusting the material parameters and returning to S100; S400, testing the target parameters; S500, judging whether the simulation data is consistent with the test results, if so, completing the simulation test of the domain controller circuit board, if not, at least adjusting the material parameters and returning to S100. The present invention is used to simulate and test the target parameters of the domain controller circuit board in the early stage of domain controller design and before production. The test and simulation can be fitted by adjusting the material parameters of the domain controller circuit board, thereby greatly improving the simulation accuracy, thereby accurately evaluating the design performance of the domain controller product and improving design efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of automobile domain controllers, and in particular to a simulation test method and a simulation test device for a domain controller. Background Art

[0002] During the design phase of an automotive domain controller, parameters such as voltage and high-speed, high-frequency signals must be kept within reasonable ranges between various circuit modules to ensure proper operation. Circuit modules are interconnected via copper foil on a printed circuit board (PCB). However, copper foil is an imperfect conductor, resulting in impedance and losses.

[0003] Therefore, before the domain controller is put into production, how to determine in advance whether the parameters between various circuit modules are within a reasonable range, and how to adjust the PCB board if the parameters do not meet the requirements, have become problems that need to be solved.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0005] The present invention provides a simulation test method and simulation test device for a domain controller, which are used to simulate and test the target parameters of a domain controller circuit board in the early stage of domain controller design and before production. The test and simulation can be matched by adjusting the material parameters of the domain controller circuit board, thereby greatly improving the simulation accuracy, thereby accurately evaluating the design performance of the domain controller product and improving the design efficiency of the domain controller product.

[0006] According to one aspect of the present invention, a simulation test method for a domain controller is provided, comprising the following steps: S100, obtaining material parameters of a domain controller circuit board; S200, simulating target parameters of the domain controller circuit board based on the material parameters to obtain simulation data; S300, judging whether the simulation data is qualified, and if so, executing step S400; and if not, at least adjusting the material parameters of the domain controller circuit board and returning to step S100; S400, testing the target parameters of the domain controller circuit board to obtain test results; S500, judging whether the simulation data is consistent with the test results, and if so, completing the simulation test of the domain controller circuit board; and if not, at least adjusting the material parameters of the domain controller circuit board and returning to step S100.

[0007] In some embodiments, the material parameters include the thickness and dielectric constant of the film layer between the source circuit module and the terminal circuit module of the domain controller circuit board; the target parameters include the voltage drop between the source circuit module and the terminal circuit module.

[0008] In some embodiments, in step S300 and step S500, adjusting the material parameters of the domain controller circuit board includes: adjusting the thickness of the film layer between the source end circuit module and the terminal circuit module based on the relationship that the voltage drop between the source end circuit module and the terminal circuit module is proportional to the thickness of the film layer between the source end circuit module and the terminal circuit module.

[0009] In some embodiments, in step S300, determining whether the simulation data is qualified includes: obtaining a first difference between the simulation data and the target value of the target parameter, and determining whether the first difference is within a preset range; in step S500, determining whether the simulation data is consistent with the test result includes: obtaining a second difference between the test result and the target value of the target parameter, and determining whether the difference between the second difference and the first difference is within a predetermined range.

[0010] In some embodiments, the material parameters include the thickness, dielectric constant and dielectric loss factor of the film layer between the main chip and the slave chip of the domain controller circuit board; the main chip and the slave chip are interconnected by differential routing, and the target parameters include the insertion loss and return loss between the main chip and the slave chip.

[0011] In some embodiments, the master chip and the slave chip each include two ports. In step S200, simulating target parameters of the domain controller circuit board includes:

[0012] Calculate the S-parameter matrix Where Sij represents the energy injected into port j and measured at port i. The insertion loss SDD21 and return loss SDD11 are calculated using the formulas SDD21 = 0.5 × (S21 + S43 - S41 - S23) and SDD11 = 0.5 × (S11 - S13 - S31 + S33).

[0013] In some embodiments, in step S300, adjusting the material parameters of the domain controller circuit board includes: adjusting the thickness of the film layer between the main chip and the slave chip based on the relationship that the insertion loss and return loss between the main chip and the slave chip are proportional to the thickness of the film layer between the main chip and the slave chip.

[0014] In some embodiments, in step S300, determining whether the simulation data is qualified includes: using the IBIS-AMI model to perform transient simulation on the simulation data to obtain a first eye diagram, and determining whether the first eye diagram is consistent with the standard eye diagram of the target parameter; in step S500, determining whether the simulation data is consistent with the test result includes: using the IBIS-AMI model to perform transient simulation on the test result to obtain a second eye diagram, and determining whether the second eye diagram is consistent with the first eye diagram.

[0015] In some embodiments, in step S300, if the simulation data is determined to be unqualified, the model parameters of the IBIS-AMI model are further adjusted; in step S500, if the simulation data is determined to be inconsistent with the test result, the model parameters of the IBIS-AMI model are further adjusted.

[0016] According to another aspect of the present invention, a simulation test device for a domain controller is provided, which is used to implement the simulation test method for a domain controller as described in any of the above embodiments.

[0017] The beneficial effects of the present invention compared with the prior art include at least:

[0018] The domain controller simulation test method and simulation test device provided by the present invention are used to simulate the target parameters of the domain controller circuit board in the early stage of domain controller design and before production, so as to determine in advance whether the target parameters of the domain controller circuit board are within a reasonable range. If not, the target parameters of the domain controller circuit board can be adjusted by adjusting the material parameters of the domain controller circuit board to meet the requirements; then, the target parameters of the domain controller circuit board are tested. If the test results are inconsistent with the simulation data, the material parameters of the domain controller circuit board can be further adjusted to make the test and simulation fit until the simulation data are consistent with the test results. In this way, the simulation accuracy can be greatly improved, thereby accurately evaluating the design performance of the domain controller product and improving the design efficiency of the domain controller product.

[0019] The domain controller simulation testing method and device provided by this invention are particularly suitable for simulating and testing high-speed, high-frequency signals such as voltage drop, insertion loss, and return loss on a domain controller circuit board. The simulation data obtained through simulation testing and fitting can be used to ensure the performance of the domain controller during production.

[0020] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are incorporated into and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and it is clear that those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0022] Figure 1 A schematic diagram showing the steps of a simulation test method for a domain controller according to an embodiment of the present invention is shown;

[0023] Figure 2 A schematic diagram showing the topological structure of the source circuit module and the terminal circuit module of the domain controller circuit board in an embodiment of the present invention is shown;

[0024] Figure 3 A schematic diagram showing the steps of performing a simulation test on the voltage drop between the source circuit module and the terminal circuit module of the domain controller circuit board according to an embodiment of the present invention is shown;

[0025] Figure 4 A schematic diagram showing the topological structure of the main chip and the slave chip of the domain controller circuit board in an embodiment of the present invention is shown;

[0026] Figure 5 A schematic diagram illustrating steps for simulating the insertion loss and return loss between the main chip and the slave chip of a domain controller circuit board in an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0027] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make this disclosure thorough and complete and to fully convey the concepts of the example embodiments to those skilled in the art.

[0028] The accompanying drawings are merely schematic illustrations of the present invention and are not necessarily drawn to scale. Identical reference numerals in the figures denote identical or similar parts, and thus repetitive descriptions thereof will be omitted. Some of the blocks shown in the accompanying drawings are functional entities that do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0029] In addition, the processes shown in the accompanying drawings are only exemplary and do not necessarily include all steps. For example, some steps can be decomposed, some steps can be combined or partially combined, and the order of actual execution may change according to actual circumstances. The words "first", "second" and similar terms used in the specific description do not indicate any order, quantity or importance, but are only used to distinguish different components. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] It should be noted that, in the absence of conflict, the embodiments of the present invention and features in different embodiments may be combined with each other.

[0031] Figure 1 The main steps of the simulation test method of the domain controller in the embodiment of the present invention are shown; Figure 1 As shown, the simulation test method of the domain controller provided by the embodiment of the present invention includes the following steps:

[0032] S100, obtaining material parameters of a domain controller circuit board.

[0033] A domain controller circuit board primarily refers to a PCB stacked with Prepreg and Core dielectrics. Material parameters can be determined through measurement and the properties of the dielectric itself.

[0034] S200 , simulating target parameters of the domain controller circuit board according to the material parameters to obtain simulation data.

[0035] The target parameters can be obtained through simulation calculation based on the material parameters.

[0036] S300, determine whether the simulation data is qualified, if so, execute step S400, if not, at least adjust the material parameters of the domain controller circuit board and return to step S100.

[0037] As mentioned above, the domain controller circuit board is built by interconnecting the copper foil carrier on the PCB (Printed Circuit Board). The longer the distance between the copper foil carriers that achieve interconnection, the greater the corresponding impedance and loss. Based on this principle, if the simulation data is unqualified, the simulation data can be adjusted by adjusting the material parameters of the domain controller circuit board, such as reducing the distance between the copper foil carriers that achieve interconnection between circuit modules.

[0038] S400: Test target parameters of the domain controller circuit board to obtain test results.

[0039] Test results are data on target parameters obtained under real test scenarios.

[0040] S500, determine whether the simulation data is consistent with the test result, if so, complete the simulation test of the domain controller circuit board, if not, at least adjust the material parameters of the domain controller circuit board and return to step S100.

[0041] By adjusting the material parameters of the domain controller circuit board, the simulation data and test results are adjusted, and the simulation data and test results are continuously fitted to make them consistent.

[0042] The above-mentioned domain controller simulation test method is used to simulate the target parameters of the domain controller circuit board in the early stages of domain controller design and before production, so as to determine in advance whether the target parameters of the domain controller circuit board are within a reasonable range. If not, the target parameters of the domain controller circuit board can be adjusted to meet the requirements by adjusting the material parameters of the domain controller circuit board. The target parameters of the domain controller circuit board are then tested. If the test results are inconsistent with the simulation data, the material parameters of the domain controller circuit board can be further adjusted to make the test and simulation fit until the simulation data is consistent with the test results. In this way, the simulation accuracy can be greatly improved, thereby accurately evaluating the design performance of the domain controller product and improving the design efficiency of the domain controller product.

[0043] Figure 2 The topology of the source circuit module and the terminal circuit module of the domain controller circuit board is shown. Figure 3 The steps of simulating the voltage drop between the source circuit module and the terminal circuit module of the domain controller circuit board are shown; Figures 1 to 3 As shown, in some embodiments, a simulation test method for a domain controller is used to simulate a voltage drop between a source circuit module and a terminal circuit module of a domain controller circuit board, including the following steps. The domain controller circuit board includes a source circuit module and multiple terminal circuit modules. Simulating the voltage drop between the source circuit module and the terminal circuit module of the domain controller circuit board refers to separately simulating the voltage drop between the source circuit module and each terminal circuit module of the domain controller circuit board; Figure 3 The simulation test steps shown refer to performing a simulation test on the voltage drop between the source circuit module and a terminal circuit module of the domain controller circuit board.

[0044] S100a, obtaining the thickness and dielectric constant of the film layer between the source circuit module and the terminal circuit module of the domain controller circuit board.

[0045] Specifically, material parameters include the thickness and dielectric constant of the film layer between the source and terminal circuit modules of the domain controller circuit board. The dielectric constant (Dk), also known as the dielectric constant or permittivity, is an essential factor in PCB impedance design. It refers to the energy storage capacity of the vacuum-enhanced material and is an inherent electrical property of the material.

[0046] S200a, simulating the voltage drop between the source circuit module and the terminal circuit module of the domain controller circuit board according to the thickness and dielectric constant of the film layer between the source circuit module and the terminal circuit module to obtain simulation data.

[0047] That is, the target parameter specifically includes the voltage drop between the source circuit module and the terminal circuit module.

[0048] S300a, obtain a first difference between the simulation data and the target value of the voltage drop between the source circuit module and the terminal circuit module, and determine whether the first difference is within a preset range. If so, execute step S400a. If not, adjust the thickness of the film layer between the source circuit module and the terminal circuit module based on the relationship that the voltage drop between the source circuit module and the terminal circuit module is proportional to the thickness of the film layer between the source circuit module and the terminal circuit module, and return to step S100a.

[0049] That is, determining whether the simulation data is qualified includes: obtaining a first difference between the simulation data and a target value of a target parameter, and determining whether the first difference is within a preset range. The target value can be a specific value or a range of values; the first difference can be calculated as a ratio, such as the ratio of the difference between the simulation data and the target value of the target parameter to the target value of the target parameter. Correspondingly, the preset range is a preset ratio, such as a suitable ratio of 3%.

[0050] Furthermore, as mentioned above, the longer the distance between the copper foil carriers that interconnect the circuit modules, the greater the corresponding impedance. Given a fixed current, it can be determined that the voltage drop between circuit modules is proportional to the impedance, and furthermore, that the voltage drop between circuit modules is proportional to the thickness of the film layer.

[0051] S400a: Test the voltage drop between the source circuit module and the terminal circuit module of the domain controller circuit board to obtain a test result.

[0052] S500a, obtain a second difference between the test result and the target value of the target parameter, and determine whether the difference between the second difference and the first difference is within a predetermined range. If so, complete the simulation test of the voltage drop between the source circuit module and the terminal circuit module of the domain controller circuit board. If not, adjust the thickness of the film layer between the source circuit module and the terminal circuit module based on the relationship that the voltage drop between the source circuit module and the terminal circuit module is proportional to the thickness of the film layer between the source circuit module and the terminal circuit module, and return to step S100a.

[0053] That is, determining whether the simulation data is consistent with the test result includes obtaining a second difference between the test result and the target value of the target parameter, and determining whether the difference between the second difference and the first difference is within a predetermined range. The second difference can be calculated as a proportional value, such as the ratio of the difference between the test result and the target value of the target parameter to the target value of the target parameter; correspondingly, the predetermined range is a predetermined proportional value, such as a suitable proportional value such as 5%.

[0054] Through the above-mentioned simulation test method of the domain controller, the voltage drop between the source circuit module and the terminal circuit module of the domain controller circuit board can be simulated and fitted, which can greatly improve the simulation accuracy, so as to accurately evaluate the design performance of the domain controller product and improve the design efficiency of the domain controller product. The simulation data finally obtained can be used for the production of the domain controller to ensure the product performance of the produced domain controller.

[0055] Figure 4 The topology of the main chip and the slave chip of the domain controller circuit board is shown. Figure 5 The steps of simulating the insertion loss and return loss between the main chip and the slave chip of the domain controller circuit board are shown; Figure 1 、 Figure 4 and Figure 5 As shown, in some embodiments, a simulation test method of a domain controller is used to simulate the insertion loss and return loss between the main chip and the slave chip of the domain controller circuit board, including the following steps. The domain controller circuit board includes a main chip and multiple slave chips. The simulation test of the insertion loss and return loss between the main chip and the slave chip of the domain controller circuit board refers to the simulation test of the insertion loss and return loss between the main chip of the domain controller circuit board and each slave chip separately; Figure 5 The simulation test steps shown are to simulate the insertion loss and return loss between the main chip and a slave chip of the domain controller circuit board.

[0056] S100b, obtaining the thickness, dielectric constant, and dielectric loss factor of the film layer between the main chip and the slave chip of the domain controller circuit board.

[0057] That is, material parameters include the thickness, dielectric constant, and dielectric loss factor of the film layer between the main chip and the slave chip of the domain controller circuit board. The dielectric loss factor (Df), also known as the damping factor, internal dissipation, or loss tangent, is the tangent of the phase difference between the strain and stress cycles of a material under an alternating force field. It is also equal to the ratio of the material's loss modulus to the storage modulus (in layman's terms, the ratio of the energy lost in the insulating material to the energy remaining in the signal line).

[0058] S200b, simulating the insertion loss and return loss between the main chip and the slave chip of the domain controller circuit board according to the thickness, dielectric constant and dielectric loss factor of the film layer between the main chip and the slave chip to obtain simulation data.

[0059] The main chip and the slave chip are interconnected through differential routing to transmit differential signals. The target parameters include insertion loss and return loss between the main chip and the slave chip.

[0060] Furthermore, the main chip and the slave chip each include two ports, for example Figure 4 The figure shows that the differential signal is output from the P1 port and the P3 port of the master chip and input to the P2 port and the P4 port of a slave chip. In step S200b, the insertion loss and return loss between the master chip and the slave chip of the domain controller circuit board are simulated, including:

[0061] Calculate the S-parameter matrix Where Sij represents the energy injected from port j and measured at port i; for example, S 11 It is defined as the square root of the ratio of the energy reflected from the P1 port to the input energy, which can also be simplified as the ratio of the equivalent reflected voltage to the equivalent incident voltage;

[0062] Insertion loss SDD21 and return loss SDD11 are calculated using the formulas SDD21 = 0.5 × (S21 + S43 - S41 - S23) and SDD11 = 0.5 × (S11 - S13 - S31 + S33). Return loss SDD11 represents the difference between the reflected energy on the two lines divided by the incident energy, and insertion loss SDD21 represents the difference between the transmitted energy on the two lines divided by the incident energy.

[0063] S300b, use the IBIS-AMI model to perform transient simulation on the simulation data to obtain a first eye diagram, and determine whether the first eye diagram is consistent with the standard eye diagram of the target parameter. If so, execute step S400b; if not, adjust the thickness of the film layer between the main chip and the slave chip based on the relationship that the insertion loss and return loss between the main chip and the slave chip are proportional to the thickness of the film layer between the main chip and the slave chip. You can also adjust the model parameters of the IBIS-AMI model, and return to step S100b.

[0064] That is, judging whether the simulation data is qualified includes: using the IBIS-AMI model to perform transient simulation on the simulation data to obtain a first eye diagram, and judging whether the first eye diagram is consistent with a standard eye diagram of the target parameters; wherein the first eye diagram and the standard eye diagram can be eye diagrams under a bit error rate of 1-e^12.

[0065] Furthermore, as mentioned above, the longer the distance between the copper foil carriers that interconnect the circuit modules, the greater the corresponding loss. Therefore, adjusting the material parameters of the domain controller circuit board includes adjusting the thickness of the film between the main and secondary chips, based on the relationship that the insertion loss and return loss between the two chips are proportional to the thickness of the film between the main and secondary chips. Furthermore, the model parameters of the IBIS-AMI model can be adjusted to obtain a more accurate eye diagram.

[0066] S400b: Test the insertion loss and return loss between the primary chip and the secondary chip of the domain controller circuit board to obtain test results. The ports used for simulation and testing must be consistent.

[0067] S500b, use the IBIS-AMI model to perform transient simulation on the test results to obtain a second eye diagram, and determine whether the second eye diagram is consistent with the first eye diagram. If so, complete the simulation test of the insertion loss and return loss between the main chip and the slave chip of the domain controller circuit board. If not, adjust the thickness of the film layer between the main chip and the slave chip based on the relationship that the insertion loss and return loss between the main chip and the slave chip are proportional to the thickness of the film layer between the main chip and the slave chip. You can also adjust the model parameters of the IBIS-AMI model, and return to step S100b.

[0068] Specifically, determining whether the simulation data is consistent with the test results includes performing a transient simulation of the test results using the IBIS-AMI model to obtain a second eye diagram, and determining whether the second eye diagram is consistent with the first eye diagram. The second eye diagram is also an eye diagram at a bit error rate of 1-e^12. If the second eye diagram is inconsistent with the first eye diagram, the model parameters of the IBIS-AMI model can be adjusted to obtain a more accurate eye diagram.

[0069] Through the above-mentioned simulation test method of the domain controller, the insertion loss and return loss between the main chip and the slave chip of the domain controller circuit board can be simulated and fitted, which can greatly improve the simulation accuracy, so as to accurately evaluate the design performance of the domain controller product and improve the design efficiency of the domain controller product. The simulation data finally obtained can be used for the production of the domain controller to ensure the product performance of the produced domain controller.

[0070] An embodiment of the present invention also provides a simulation test device for a domain controller, which can be used to implement the simulation test method for the domain controller as described in any of the above embodiments, so as to simulate and test high-speed and high-frequency signals such as the voltage drop, insertion loss, and return loss of the domain controller circuit board. The simulation data obtained through simulation testing and fitting can be used for the production of the domain controller to ensure the product performance of the produced domain controller.

[0071] The simulation test device of the domain controller can be expressed in the following forms.

[0072] Expressed in the form of a functional (program) module architecture, it may include modules for respectively implementing the various steps of the above-mentioned domain controller simulation test method, for example, modules for respectively implementing steps S100 to S500.

[0073] It is expressed in the form of a general-purpose computing device and may include a processing unit and a storage unit. The storage unit stores executable instructions. When the executable instructions are executed by the processing unit, the simulation test method of the domain controller described in any of the above embodiments is implemented.

[0074] The storage unit may include a program / utility having one or more program modules, including but not limited to an operating system, one or more application programs, other program modules, and program data. The general-purpose computing device may also include a bus connecting the processing unit and the storage unit, as well as other platform components. The bus may include a local area bus such as a storage unit bus, a peripheral bus, a graphics acceleration port, and a processing unit bus. The general-purpose computing device may also communicate with one or more external devices, other computing devices in the vehicle, and a network (e.g., a local area network (LAN), a wide area network (WAN), and / or a public network such as the Internet).

[0075] It is in the form of a storage medium, in which a program is stored. When the program is executed, the simulation test method of the domain controller described in any of the above embodiments is implemented.

[0076] The storage medium can be any tangible medium that contains or stores the program, and specifically can be any combination of one or more readable media, and the readable medium can be a readable signal medium or a readable storage medium. The program can be used by or in combination with an instruction execution system, apparatus or device. The program can be executed entirely on the user computing device, partially on the user device, as an independent software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server. In the case of a remote computing device, the remote computing device can be connected to the user computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computing device, for example, using an Internet service provider to connect via the Internet.

[0077] In summary, the simulation test method and simulation test device of the domain controller provided by the present invention are used to simulate the target parameters of the domain controller circuit board in the early stage of domain controller design and before production, so as to determine in advance whether the target parameters of the domain controller circuit board are within a reasonable range. If not, the target parameters of the domain controller circuit board can be adjusted by adjusting the material parameters of the domain controller circuit board to meet the requirements; then the target parameters of the domain controller circuit board are tested, and if the test results are inconsistent with the simulation data, the material parameters of the domain controller circuit board can be further adjusted to fit the test and simulation until the simulation data is consistent with the test results. In this way, the simulation accuracy can be greatly improved, thereby accurately evaluating the design performance of the domain controller product and improving the design efficiency of the domain controller product.

[0078] The domain controller simulation testing method and device provided by this invention are particularly suitable for simulating and testing high-speed, high-frequency signals such as voltage drop, insertion loss, and return loss on a domain controller circuit board. The simulation data obtained through simulation testing and fitting can be used to ensure the performance of the domain controller during production.

[0079] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A simulation test method for a domain controller, characterized in that: This is performed during the early stages of domain controller design and before production, and includes the following steps: S100, obtaining material parameters of a domain controller circuit board; S200, simulating target parameters of the domain controller circuit board based on the material parameters to obtain simulation data; wherein the material parameters include the thickness and dielectric constant of a film layer between a source circuit module and a terminal circuit module of the domain controller circuit board, and the target parameters include a voltage drop between the source circuit module and the terminal circuit module; S300, determining whether the simulation data is qualified, including: obtaining a first difference between the simulation data and a target value of the target parameter, and determining whether the first difference is within a preset range; if so, executing step S400; if not, adjusting at least the material parameters of the domain controller circuit board and returning to step S100; S400, testing target parameters of the domain controller circuit board to obtain test results; S500, determining whether the simulation data is consistent with the test result, including: obtaining a second difference between the test result and the target value of the target parameter, and determining whether the difference between the second difference and the first difference is within a predetermined range; if so, completing the simulation test of the domain controller circuit board; if not, at least adjusting the material parameters of the domain controller circuit board and returning to step S100; Among them, adjusting the material parameters of the domain controller circuit board includes: adjusting the thickness of the film layer between the source end circuit module and the terminal circuit module based on the relationship that the voltage drop between the source end circuit module and the terminal circuit module is proportional to the thickness of the film layer between the source end circuit module and the terminal circuit module.

2. The simulation test method according to claim 1, wherein: The material parameters include the thickness, dielectric constant and dielectric loss factor of the film layer between the main chip and the secondary chip of the domain controller circuit board; The main chip and the slave chip are interconnected through differential routing, and the target parameters include insertion loss and return loss between the main chip and the slave chip.

3. The simulation test method according to claim 2, wherein: The main chip and the slave chip each include two ports. In step S200, simulating target parameters of the domain controller circuit board includes: Calculate the S-parameter matrix , where Sij represents the energy injected from port j and measured at port i; Insertion loss SDD21 and return loss SDD11 are calculated using the formulas SDD21 = 0.5 × (S21 + S43 - S41 - S23) and SDD11 = 0.5 × (S11 - S13 - S31 + S33).

4. The simulation test method according to claim 2, wherein: In step S300, adjusting the material parameters of the domain controller circuit board includes: According to the relationship that the insertion loss and return loss between the main chip and the slave chip are proportional to the thickness of the film layer between the main chip and the slave chip, the thickness of the film layer between the main chip and the slave chip is adjusted.

5. The simulation test method according to claim 2, wherein: In step S300, determining whether the simulation data is qualified includes: performing transient simulation on the simulation data using an IBIS-AMI model to obtain a first eye diagram, and determining whether the first eye diagram is consistent with a standard eye diagram of the target parameter; In step S500, determining whether the simulation data is consistent with the test result includes: using an IBIS-AMI model to perform transient simulation on the test result to obtain a second eye diagram, and determining whether the second eye diagram is consistent with the first eye diagram.

6. The simulation test method according to claim 5, wherein: In step S300, if the simulation data is judged to be unqualified, the model parameters of the IBIS-AMI model are further adjusted; In step S500 , if it is determined that the simulation data is inconsistent with the test result, the model parameters of the IBIS-AMI model are further adjusted.

7. A simulation test device for a domain controller, characterized in that: Used to implement the simulation test method of the domain controller as described in any one of claims 1-6.

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