A vapor chamber and electronic device

Abstract

The application discloses a vapor chamber and an electronic device. The vapor chamber comprises a first cover plate and a second cover plate. The second cover plate is buckled on the first cover plate to form a sealed cavity. At least one composite capillary structure is arranged in the sealed cavity in a spaced manner, and a vapor channel is formed on both sides of each composite capillary structure. The composite capillary structure comprises a porous capillary structure and a channel capillary structure, which are filled with a cooling medium. The vapor channel and the composite capillary structure are left-right parallel structures. The overall height of the vapor chamber can be reduced in the form of reducing the height of the composite capillary structure, so that the vapor chamber is thinned. Meanwhile, the composite design of the porous capillary structure and the channel capillary structure is adopted. The high capillary force of the porous capillary structure is utilized, and the high permeability of the channel capillary structure is utilized. The composite capillary structure can reduce the flow resistance of the working medium transmission, promote the rapid transportation of the working medium, realize the thinning of the overall thickness of the vapor chamber without performance attenuation, and further meet the light and thin demand of the electronic device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of terminal equipment, in particular to a vapor chamber and an electronic device. BACKGROUND

[0002] A vapor chamber (VC for short) is a heat dissipation device, which can be applied in electronic devices including mobile phones, tablets, notebook computers and the like. The inner wall of the vapor chamber has a capillary structure, and a cooling medium is filled in the capillary structure. The vapor chamber can quickly and evenly dissipate the heat of a mobile phone system chip by using the cooling medium, and then returns the cooling medium to the heat source end by using the capillary action of the capillary structure, so as to reduce the temperature of the mobile phone and ensure that the mobile phone will not affect the use of the user due to the temperature being too high.

[0003] Due to the light and thin trend of electronic devices, the heat dissipation device used in the corresponding electronic devices must be thinned synchronously to meet the demand of light and thin development of electronic devices. However, the thickness of the current vapor chamber is generally ≥0.30 mm, and the over-thick vapor chamber cannot meet the demand of light and thin development of electronic devices. SUMMARY

[0004] The present application provides a vapor chamber and an electronic device to solve the problem that the over-thick vapor chamber cannot guarantee the light and thin development of electronic devices.

[0005] In a first aspect, the present application provides a vapor chamber, comprising: a first cover plate; a second cover plate, the second cover plate is buckled on the first cover plate to form a sealed cavity, the inside of the sealed cavity is a negative pressure environment; a composite capillary structure, at least one composite capillary structure is arranged in the sealed cavity at intervals, each composite capillary structure abuts between the first cover plate and the second cover plate; at least one composite capillary structure separates the sealed cavity into at least one sub-cavity, the sub-cavity is used to form a vapor channel; the composite capillary structure comprises a porous capillary structure and a channel capillary structure, the porous capillary structure and the channel capillary structure are connected, the porous capillary structure and the channel capillary structure are both filled with a cooling medium, and the cooling medium circulates between the channel capillary structure, the porous capillary structure and the vapor channel. Here, the composite capillary structure and the vapor channel in the vapor chamber are parallel structures, the overall height of the vapor chamber can be reduced by reducing the height of the composite capillary structure, and light and thin development is realized. At the same time, the composite design of the porous capillary structure and the channel capillary structure is adopted, the high capillary force of the porous capillary structure is utilized, and the high permeability of the channel capillary structure is utilized, so that the composite capillary structure can reduce the flow resistance of the working medium transmission, promote the rapid transportation of the working medium, realize the reduction of the overall thickness of the vapor chamber without performance attenuation, and further meet the demand of light and thin development of electronic devices.

[0006] In the embodiment of the present application, the porous capillary structure is located above the channel capillary structure; the porous capillary structure is abutted between the first cover plate and the channel capillary structure, the channel capillary structure is abutted between the porous capillary structure and the second cover plate, and the porous capillary structure and the channel capillary structure are communicated through the cooling medium. Here, the porous capillary structure is responsible for transmitting the steam generated by the cooling medium in the porous capillary structure and the channel capillary structure to the steam channel when heated, and the porous capillary structure absorbs the liquid condensed by the steam when cooled and transmits it to the channel capillary structure, realizing the gas-liquid circulation of the cooling medium.

[0007] In the embodiment of the present application, the channel capillary structure includes at least one column and at least one channel, each of the columns is arranged at intervals, one end of each of the columns is connected with the porous capillary structure, and the other end of each of the columns is connected with the second cover plate; the channel is formed between the adjacent two columns, and the channel is filled with the cooling medium. Here, the channel capillary structure includes a plurality of channels, each of which is filled with the cooling medium, and when the steam is generated by heating, a large amount of heat generated by the electronic device can be dissipated at the same time, improving the heat dissipation efficiency.

[0008] In the embodiment of the present application, the vapor chamber includes a low-temperature region and a high-temperature region; in the high-temperature region, the cooling medium in the channel absorbs heat to generate first steam, and the cooling medium in the porous capillary structure absorbs heat to generate second steam, the first steam passes through the porous capillary structure, and the second steam is combined and transmitted to the steam channel, the steam channel transmits the first steam and the second steam to the low-temperature region, realizing heat dissipation; in the low-temperature region, the first steam and the second steam in the steam channel are condensed into cooling medium, and the cooling medium flows back to the high-temperature region through the porous capillary structure and the channel capillary structure, realizing gas-liquid circulation. Here, through the gas-liquid two-phase change of the cooling medium, the gas-liquid circulation is realized, so that the heat in the high-temperature region of the vapor chamber is conducted to the low-temperature region and dissipated.

[0009] In the embodiment of the present application, the porous capillary structure is located on one side of the channel capillary structure, the porous capillary structure is abutted between the first cover plate and the second cover plate, one end of the channel capillary structure is connected with the second cover plate, and the other end of the channel capillary structure is spaced apart from the first cover plate. Here, the composite capillary structure adopts a left-right structure, a plurality of channels of the channel capillary structure are directly communicated with different steam channels, and the steam generated by the cooling medium in the channel can be transmitted to the steam channels on both sides at the same time, which is more efficient.

[0010] In the embodiment of the present application, the channel capillary structure includes at least one column and at least one channel, each of the columns is arranged at opposite sides of the porous capillary structure, the channel is formed between the column and the porous capillary structure, and the channel is filled with the cooling medium; in the high-temperature area of the heat plate, the cooling medium in the channel generates first steam after absorbing heat and is transferred into the steam channel, and the cooling medium in the porous capillary structure generates second steam after absorbing heat and is transferred into the steam channel, the steam channel transfers the first steam and the second steam to the low-temperature area to realize heat dissipation; in the low-temperature area of the heat plate, the first steam and the second steam in the steam channel condense into the cooling medium, the cooling medium returns to the high-temperature area through the porous capillary structure and the channel capillary structure to realize gas-liquid circulation. Here, the gas-liquid circulation is realized through the gas-liquid two-phase change of the cooling medium, so that the heat in the high-temperature area of the heat plate is conducted to the low-temperature area and dissipated.

[0011] In the embodiment of the present application, the channel capillary structure includes a plurality of columns and at least one channel, each of the columns is arranged at the same side of the porous capillary structure, the channel is formed between adjacent two columns, the channel is formed between the column and the porous capillary structure, and each of the channels is filled with the cooling medium; in the high-temperature area of the heat plate, the cooling medium in the channel generates first steam after absorbing heat and is transferred into the steam channel, and the cooling medium in the porous capillary structure generates second steam after absorbing heat and is transferred into the steam channel, the steam channel transfers the first steam and the second steam to the low-temperature area to realize heat dissipation; in the low-temperature area of the heat plate, the first steam and the second steam in the steam channel condense into the cooling medium, the cooling medium returns to the high-temperature area through the porous capillary structure and the channel capillary structure to realize gas-liquid circulation. The gas-liquid circulation is realized through the gas-liquid two-phase change of the cooling medium, so that the heat in the high-temperature area of the heat plate is conducted to the low-temperature area and dissipated.

[0012] In the embodiment of the present application, the number of the channels is 1-3, the widths of the channels are different, or the widths of the channels are the same. Here, the plurality of channels can reduce the liquid phase resistance and improve the return efficiency of the liquid phase medium.

[0013] In the embodiment of the present application, the channel capillary structure and the second cover plate are integrally formed through an etching process, which can ensure the stability of the channel capillary structure.

[0014] In the embodiment of the present application, the width of the steam channel is 0.5-2 times the width of the composite capillary structure, which can ensure the transfer rate of the steam and further improve the heat dissipation efficiency.

[0015] In the embodiments of the present application, the sealing cavity is further provided with a support column abutting between the first cover plate and the second cover plate, and the support column is used to maintain the shape of the sealing cavity. Here, the support column can be used to resist the deformation of the vapor chamber caused by the difference between the internal and external atmospheric pressures and other external forces, so as to prevent the vapor channel and the composite capillary structure from being flattened to cause the failure of the vapor chamber.

[0016] In a second aspect, the present application provides an electronic device comprising a body, a shell and the vapor chamber of the first aspect. Here, the composite capillary structure and the vapor channel in the vapor chamber are in a parallel structure, and the overall height of the vapor chamber can be reduced by reducing the height of the composite capillary structure to achieve thinning. At the same time, the composite design of the porous capillary structure and the channel capillary structure is adopted, the high capillary force of the porous capillary structure is utilized, and the high permeability of the channel capillary structure is utilized, so that the composite capillary structure can reduce the flow resistance of the working medium transmission and promote the rapid transportation of the working medium, so as to realize the thinning of the overall thickness of the vapor chamber without performance attenuation, thereby meeting the demand for thinning of the electronic device.

[0017] The vapor chamber and the electronic device provided by the embodiments of the present application, the vapor chamber comprises a first cover plate and a second cover plate, the second cover plate is buckled on the first cover plate to form a sealing cavity, at least one composite capillary structure is arranged in the sealing cavity, and a vapor channel is formed on both sides of each composite capillary structure. The composite capillary structure comprises a porous capillary structure and a channel capillary structure connected to each other. The porous capillary structure and the channel capillary structure are filled with a cooling medium, and the vapor generated by the cooling medium when heated can be transmitted to the vapor channels on both sides of the composite capillary structure at the same time, that is, the same vapor channel can receive the vapor generated by the cooling medium when heated in the adjacent two sides of the composite capillary structure, the transmission rate is higher, and the heat dissipation efficiency is higher; and the vapor channel and the composite capillary structure are in a left-right parallel structure, and the overall height of the vapor chamber can be reduced by reducing the height of the composite capillary structure to achieve thinning. At the same time, the composite design of the porous capillary structure and the channel capillary structure is adopted, the high capillary force of the porous capillary structure is utilized, and the high permeability of the channel capillary structure is utilized, so that the composite capillary structure can reduce the flow resistance of the working medium transmission and promote the rapid transportation of the working medium, so as to realize the thinning of the overall thickness of the vapor chamber without performance attenuation, thereby meeting the demand for thinning of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, other drawings can also be obtained by those skilled in the art without any creative labor on the basis of these drawings.

[0019] Figure 1FIG. 1 is a structural schematic diagram of an electronic device provided by an embodiment of the present application.

[0020] Figure 2 FIG. 2 is a structural schematic diagram of a first type of vapor chamber provided by an embodiment of the present application.

[0021] Figure 3 FIG. 3 is a structural schematic diagram of a first type of composite capillary structure provided by an embodiment of the present application.

[0022] Figure 4 FIG. 4 is a size marking schematic diagram of the first type of composite capillary structure provided by an embodiment of the present application.

[0023] Figure 5A FIG. 5 is a heat dissipation path schematic diagram of a working medium evaporation stage of the first type of vapor chamber provided by an embodiment of the present application.

[0024] Figure 5B FIG. 6 is a heat dissipation path schematic diagram of a working medium condensation stage of the first type of vapor chamber provided by an embodiment of the present application.

[0025] Figure 6 FIG. 7 is a structural schematic diagram of a second type of vapor chamber provided by an embodiment of the present application.

[0026] Figure 7 FIG. 8 is a structural schematic diagram of a second type of composite capillary structure provided by an embodiment of the present application.

[0027] Figure 8A FIG. 9 is a heat dissipation path schematic diagram of a working medium evaporation stage of the second type of vapor chamber provided by an embodiment of the present application.

[0028] Figure 8B FIG. 10 is a heat dissipation path schematic diagram of a working medium condensation stage of the second type of vapor chamber provided by an embodiment of the present application.

[0029] Figure 9 FIG. 11 is a structural schematic diagram of a third type of vapor chamber provided by an embodiment of the present application.

[0030] Figure 10 FIG. 12 is a structural schematic diagram of a third type of composite capillary structure provided by an embodiment of the present application.

[0031] Figure 11A FIG. 13 is a heat dissipation path schematic diagram of a working medium evaporation stage of the third type of vapor chamber provided by an embodiment of the present application.

[0032] Figure 11B FIG. 14 is a heat dissipation path schematic diagram of a working medium condensation stage of the third type of vapor chamber provided by an embodiment of the present application.

[0033] Figure 12 FIG. 15 is a structural schematic diagram of a fourth type of vapor chamber provided by an embodiment of the present application.

[0034] Figure 13is a structural schematic diagram of a fourth composite capillary structure provided by an embodiment of the present application.

[0035] Figure 14 is a structural schematic diagram of a fifth vapor chamber provided by an embodiment of the present application. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments of the present application, other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0037] Hereinafter, the terms "first", "second", and the like are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0038] In addition, in the present application, the orientation terms such as "upper", "lower", "top end", "bottom end", and the like are defined with respect to the orientation of the components shown in the drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0039] The electronic device described in the embodiments of the present application includes but is not limited to a mobile phone, a notebook computer, a tablet computer, a laptop computer, a personal digital assistant, or a wearable device, etc. The electronic device is described below as a mobile phone.

[0040] Figure 1 is a structural schematic diagram of an electronic device provided by an embodiment of the present application.

[0041] As shown in Figure 1 , the electronic device 100 includes a body 101 and a shell 102, the shell 102 is mounted on the body 101, and the shell 102 and the body 101 can be mounted in a welding manner, for example. The shell 102 can be a battery cover of the electronic device 100, and the battery cover is close to the battery of the display device. The body 101 can include system chips, batteries and other components, which generate heat when running. To achieve heat dissipation, a vapor chamber 200 can be provided on the shell 102 or the body 101, and the heat generated by the electronic device 100 is dissipated through the vapor chamber 200.

[0042] A vapor chamber heat exchanger, also commonly called a steam vaporizer, superconducting heat exchanger, or heat-conducting plate, utilizes the boiling phase transformation of the working fluid (cooling medium) within a sealed cavity into a gas phase (absorbing heat) and condensing back into a liquid phase (releasing heat). Capillary force is used as the transport force for the liquid working fluid, completing the phase change cycle of the gas and liquid phases within the hot and cold regions (high and low temperature regions) of the heat exchanger. This achieves efficient heat exchange through latent heat of phase change, heat conduction, and convection.

[0043] The heat spreader 200 provided in this application embodiment is applied to electronic devices and related modules, structural components, functional components, etc. that have heat dissipation functions.

[0044] As electronic devices 100 become increasingly thinner and lighter, the heat dissipation devices (such as heat sinks 200) used in these devices must also be thinner. However, the thickness of commonly used heat sinks 200 is generally ≥0.30mm, which is too thick and cannot meet the needs of the development of thinner and lighter electronic devices 100.

[0045] To reduce the thickness of the heat spreader 100, this application provides a heat spreader 200 employing a composite capillary structure. The composite capillary structure includes a porous capillary structure and a channel capillary structure. The porous capillary structure provides high capillary force, while the channel capillary structure has high permeability. By using a composite capillary structure with high capillary force and high permeability, the flow resistance of the working fluid can be reduced, promoting rapid delivery of the working fluid. This allows for a reduction in the overall thickness of the heat spreader 200 without performance degradation, thereby meeting the requirement for a thinner and lighter electronic device 100. In this application embodiment, the thickness of the heat spreader 200 is less than 0.3 mm. For example, the thickness of the heat spreader 200 can be 0.2 mm, 0.25 mm, etc.

[0046] Figure 2 This is a schematic diagram of the structure of the first heat spreader provided in the embodiments of this application.

[0047] like Figure 2 As shown, this application embodiment provides a heat spreader 200, including: a first cover plate 10, a second cover plate 20, a composite capillary structure 30, and a cooling medium, etc. The second cover plate 20 is fastened to the first cover plate 10 to form a sealed cavity, and the connection between the second cover plate 20 and the first cover plate 10 can be achieved by welding.

[0048] The first cover plate 10 and the second cover plate 20 are made of the same material, which can be copper or copper alloy material, or other material with good heat conduction performance and no chemical reaction with the cooling medium. In other embodiments, the first cover plate 10 and the second cover plate 20 can also be made of carbon fiber, graphene, graphite sheet, etc. If it is necessary to increase the deformation resistance of the vapor chamber 200, the first cover plate 10 and the second cover plate 20 can also be made of stainless steel, titanium metal, titanium alloy, tungsten alloy, etc.

[0049] The inside of the sealed cavity is a negative pressure environment, and the sealed cavity is used to prevent the loss of the cooling medium, maintain a vacuum negative pressure state, and play a certain anti-deformation role. The cooling medium can be water, deionized water, methanol, acetone, etc. The following describes the cooling medium as water.

[0050] At least one composite capillary structure 30 is arranged in the sealed cavity, and each composite capillary structure 30 abuts between the first cover plate 10 and the second cover 20, that is, one end of each composite capillary structure 30 is connected with the first cover plate 10, and the other end of each composite capillary structure 30 is connected with the second cover plate 20. The at least one composite capillary structure 30 can be arranged in any direction, and the sealed cavity is divided into at least one sub-cavity, and the sub-cavity is used to form a vapor channel 40. For example, if five composite capillary structures 30 are arranged in the sealed cavity, the five composite capillary structures 30 can divide the sealed cavity into six sub-cavities, and six vapor channels 40 are obtained.

[0051] The plurality of composite capillary structures 30 arranged in the sealed cavity can be arranged at equal intervals or at unequal intervals. The following describes an example of arranging the plurality of composite capillary structures 30 at equal intervals. The composite capillary structure 30 is used to transport the cooling medium by capillary force, complete the entire power cycle and then complete the thermodynamic cycle, and is the key to maintaining two-phase heat exchange. In addition, the composite capillary structure 30 is also used to maintain the shape of the sealed cavity to avoid deformation of the vapor chamber 200 caused by external force.

[0052] The vapor channel 40 is used to realize the transmission of vapor, that is, to realize the transmission of vapor generated by the high-temperature area of the vapor chamber 200 to the low-temperature area, so as to realize the emission of heat. In order to ensure the transmission rate and thus improve the heat dissipation efficiency, in combination with the content, the width W40 of the vapor channel 40 is 0.5 times to 2 times the width W30 of the composite capillary structure 30. For example, the width W40 of the vapor channel 40 is preferably 1 times to 1.5 times the width W30 of the composite capillary structure 30. Figure 4

[0053] ​In order to improve or maintain the heat dissipation performance of the vapor chamber 200 while reducing the thickness of the vapor chamber 200, in the embodiments of the present application, the composite capillary structure 30 can be composed of the porous capillary structure 50 and the channel capillary structure 60 connected to each other. The porous capillary structure 50 provides high capillary force, and the channel capillary structure 60 provides high permeability, so that the flow resistance of the working medium (cooling medium) can be reduced through the composite capillary structure 30, the rapid transportation of the working medium is promoted, and the overall thickness of the vapor chamber 200 is reduced without performance attenuation.

[0054] The porous capillary structure 50 and the channel capillary structure 60 are filled with cooling medium. The vapor chamber 200 includes a low-temperature region and a high-temperature region, which are determined according to specific working scenarios and can be the entire first cover plate 10 or the entire second cover plate 20, or a part of the first cover plate 10 or the second cover plate 20. When the heat generated by a certain component (heat source) in the electronic device 100 is conducted to the vapor chamber 200, the part of the vapor chamber 200 that receives the heat is the high-temperature region, and the other end is the low-temperature region. The heat source is located on the side of the second cover plate 20, i.e., on the side of the channel capillary structure 60. For example, the left side of the second cover plate 20 of the vapor chamber 200 first receives the heat generated by a certain component in the electronic device 100, so the left side of the second cover plate 20 is the high-temperature region, and the right side of the second cover plate 20 is the low-temperature region.

[0055] When the heat is conducted to the high-temperature region of the vapor chamber 200, the cooling medium (such as water) in each composite capillary structure 30 arranged in the sealed cavity begins to produce vaporization phenomenon after being heated in a low-vacuum environment, i.e., the cooling medium absorbs heat and expands rapidly to produce a gas phase (such as steam). The gaseous cooling medium (such as steam) is transmitted to the steam channel 40 in the sealed cavity that communicates with the composite capillary structure 30 and rapidly spreads along the steam channel 40 to the low-temperature region. When the gaseous cooling medium enters the low-temperature region, it produces condensation phenomenon due to cold and is condensed into a liquid state. The heat accumulated during evaporation is released by condensation, so that the heat in the high-temperature region of the vapor chamber 200 is conducted to the low-temperature region and dissipated. The part of the vapor chamber 200 where the low-temperature region realizes heat dissipation can be the first cover plate 10 and / or the second cover plate 20. The condensed cooling medium (such as water) returns to the high-temperature region of the vapor chamber 200 by the capillary action of the composite capillary structure 30. The above process will be repeated in the sealed cavity, the gas-liquid circulation of the cooling medium between the channel capillary structure 60, the porous capillary structure 50 and the steam channel 40 is realized, the heat transfer and export are realized, and the heat dissipation of the electronic device 100 is realized.

[0056] The heat dissipation function of the heat plate 200 is mainly realized through the gas-liquid phase change of the cooling medium. The heat dissipation process of the heat plate 200 includes four main steps of conduction, evaporation, convection and condensation. The gasification inside the heat plate 200 continues to proceed, and the internal pressure will maintain balance with the change of temperature. The heat plate 200 has a large size coverage range and flexible layout, and can be designed according to the actual size and distribution of the heat source to cover the heat source flexibly and realize heat dissipation for multiple heat sources at the same time.

[0057] Figure 3 is a structural schematic diagram of a first composite capillary structure provided by an embodiment of the present application. Figure 4 is a size marking schematic diagram of the first composite capillary structure provided by the embodiment of the present application.

[0058] As shown in Figure 3 and Figure 4 , in the embodiment of the present application, the composite capillary structure 30 is an upper and lower structure. For example, the porous capillary structure 50 is located above the channel capillary structure 60. The porous capillary structure 50 is abutted between the first cover plate 10 and the channel capillary structure 60, and the channel capillary structure 60 is abutted between the porous capillary structure 50 and the second cover plate 20. That is, one end of the porous capillary structure 50 is connected with the first cover plate 10, the other end of the porous capillary structure 50 is connected with one end of the channel capillary structure 60, and the other end of the channel capillary structure 60 is connected with the second cover plate 20. The connection mode of the porous capillary structure 50 and the channel capillary structure 60 can adopt a welding mode.

[0059] The material of the porous capillary structure 50 can be metal particles, such as copper powder. The copper powder is made into the porous capillary structure 50 by using a sintering process. The porous capillary structure 50 can be a powder porous capillary structure, which has strong water absorption capacity. A large number of hole structures 51 exist in the porous capillary structure 50, and the cooling medium is filled into the hole structures 51. The capillary force of the porous capillary structure 50 is greater than that of the conventional copper mesh capillary, so that high capillary force can be provided, which provides conditions for long-distance transport of the working medium.

[0060] The channel capillary structure 60 includes at least one column 61 and at least one channel 62. The at least one column 61 is arranged at intervals, so that the channel 62 is formed between the adjacent two columns 61, and the cooling medium is filled in the channel 62. One end of each column 61 is connected with the porous capillary structure 50, and the other end of each column 61 is connected with the second cover plate 20.

[0061] The plurality of columns 61 can be arranged at equal intervals so that the widths of the plurality of channels 62 formed thereby are equal. Alternatively, the plurality of columns 61 can be arranged at unequal intervals so that the widths of the plurality of channels 62 formed thereby are unequal. The width W62 of the channel 62 can be between 0.05 mm and 0.5 mm. For example, the width W62 of the channel 62 is preferably between 0.1 mm and 0.3 mm. The number of channels 62 can be between 1 and 3. For example, the number of channels 62 is preferably between 1 and 2. If two channels 62 are provided, three columns 61 are required to form the two channels 62. The plurality of channels can be provided to reduce the resistance of the liquid phase and improve the efficiency of the return flow of the liquid phase.

[0062] The plurality of columns 61 of the channel capillary structure 60 is perpendicular to the bottom surface of the porous capillary structure 50, so that the channel 62 formed by the plurality of columns 61 is perpendicular to and in contact with the porous capillary structure 50. The porous capillary structure 50 and the channel capillary structure 60 are filled with the cooling medium, and are in communication with each other, so that the cooling medium can be transferred between the porous capillary structure 50 and the channel capillary structure 60. For example, the channel 62 of the channel capillary structure 60 and the hole structure 51 of the porous capillary structure 50 are in communication with each other through the cooling medium.

[0063] The width W50 of the porous capillary structure 50 and the width W60 of the channel capillary structure 60 can be the same, and the width W61 of the column 61 depends on the number of columns 61, the number of channels 62, the width W62 of the channel 62, and the width W50 of the porous capillary structure 50.

[0064] In some embodiments, the channel capillary structure 60 and the second cover plate 20 are integrally formed by an etching process, which can ensure the stability of the channel capillary structure 60. The channel capillary structure 60 and the second cover plate 20 are made of the same material. When the second cover plate 20 is formed, at least one column 61 is etched on the second cover plate 20 according to the above parameters to form the channel capillary structure 60. The porous capillary structure 50 is formed by sintering copper powder, and then the porous capillary structure 50 is fixed on the channel capillary structure 60 by welding to form the composite capillary structure 30.

[0065] The channel capillary structure 60 and the second cover plate 20 are made of the same material. The channel capillary structure 60 has water absorption capacity and can bind water. The water absorption capacity of the channel capillary structure 60 can be lower than that of the porous capillary structure 50, but the channel capillary structure 60 has high permeability.

[0066] In some embodiments, the overall width W30 of the composite capillary structure 30 in the up-down structure can be 0.5mm-1.5mm. For example, the overall width W30 of the composite capillary structure 30 is preferably 0.8mm-1.3mm. The height of the vapor channel, the height H30 of the composite capillary structure 30, and the height of the sealed cavity formed in the vapor chamber 200 are all between 0.12mm-0.19mm. The height H50 of the porous capillary structure 50 is about 6-9 times the height H60 of the channel capillary structure 60. For example, the height H60 of the channel capillary structure 60 can be between 0.01mm-0.04mm, and the height H50 of the porous capillary structure 50 can be between 0.08mm-0.18mm. In other embodiments, the height H50 of the porous capillary structure 50 and the height H60 of the channel capillary structure 60 can be determined based on the preset design thickness of the vapor chamber 200, which meets the thinning requirements of the vapor chamber 200.

[0067] In the embodiments of the present application, the thickness of the vapor chamber 200 is less than 0.3mm, and the height H30 of the composite capillary structure 30 is between 0.12mm-0.19mm, so the thickness of the first cover plate 10 and the second cover plate 20 is less than the target value in the range of 0.055mm-0.09mm. For example, when the height H30 of the composite capillary structure 30 is 0.12mm, the thickness of the first cover plate 10 and the second cover plate 20 is less than 0.09mm (target value), for example, it can be 0.08mm, 0.07mm, 0.06mm, 0.05mm, etc. When the height H30 of the composite capillary structure 30 is 0.19mm, the thickness of the first cover plate 10 and the second cover plate 20 is less than 0.055mm (target value), for example, it can be 0.054mm, 0.053mm, 0.04mm, 0.03mm, 0.02mm, etc. The thickness of the first cover plate 10 and the second cover plate 20 can be the same or different, and is preferably the same. The smaller the thickness of the first cover plate 10 and the second cover plate 20, the smaller the thickness of the vapor chamber 200, and the thinner the electronic device 100.

[0068] Figure 5A is a schematic diagram of the heat dissipation path of the working medium evaporation stage of the first vapor chamber provided in the embodiments of the present application. Figure 5B is a schematic diagram of the heat dissipation path of the working medium condensation stage of the first vapor chamber provided in the embodiments of the present application.

[0069] As Figure 5AAs shown, when the heat generated by the components in the electronic device 100 is dissipated by the first vapor chamber 200, the cooling medium in the channel capillary structure 60 absorbs heat and generates first vapor q1 in the high temperature area of the vapor chamber 200. If the channel capillary structure 60 includes two channels 62, the cooling medium in each channel 62 absorbs heat and generates corresponding first vapor q1 (including: q11, q12) respectively. The cooling medium in the porous capillary structure 50 absorbs heat and generates second vapor q2. The channel 62 and the porous capillary structure 50 are in communication, so the first vapor q1 generated by the channel capillary structure 60 is transmitted upward into the porous capillary structure 50. The porous capillary structure 50 combines the received first vapor q1 and the generated second vapor q2 to be delivered to the vapor channel 40. Since the two sides of the composite capillary structure 30 are connected with the vapor channel 40, the porous capillary structure 50 can deliver the vapor q1, q2 to the left and right vapor channels 40. The vapor channel 40 delivers the first vapor q1 and the second vapor q2 to the low temperature area of the vapor chamber 200 to dissipate heat.

[0070] As Figure 5BAs shown, in the low-temperature region of the vapor chamber 200, the first vapor q1 and the second vapor q2 in the vapor channel 40 encounter cold and condense into liquid cooling medium y0 (such as water) and release the heat accumulated during evaporation. The porous capillary structure 50 absorbs water, and the condensed cooling medium y0 flows back to the high-temperature region through the porous capillary structure 50 and fills the porous capillary structure 50 as the cooling medium y2. The channel capillary structure 60 also has the ability to absorb water, and therefore, the condensed water can also flow back to the high-temperature region through the channel capillary structure 60 and fill the channel capillary structure 60 as the cooling medium y11 and y12. Since the porous capillary structure 50 and the channel capillary structure 60 are connected by welding, there may be a gap between them. Then the condensed water can also enter the porous capillary structure 50 (filled as the cooling medium y2) and / or the channel capillary structure 60 (filled as the cooling medium y11 and y12) through the gap, and then flow back to the high-temperature region through the porous capillary structure 50 and / or the channel capillary structure 60. The condensed cooling medium can be transferred between the porous capillary structure 50 and the channel capillary structure 60. For example, the cooling medium y2 in the porous capillary structure 50 is transmitted downward into the channel capillary structure 60, and flows back to the high-temperature region through each channel 62 in the channel capillary structure 60, and the condensed cooling medium y0 fills each channel 62 in the channel capillary structure 60 as the cooling medium y11 and y12. Through the gas-liquid phase change of the cooling medium, the gas-liquid circulation is realized, so that the heat in the high-temperature region of the vapor chamber 200 is conducted to the low-temperature region and dissipated. It should be noted that the process of absorbing condensed water by the porous capillary structure 50 and the process of absorbing condensed water by the channel capillary structure 60 can be performed simultaneously.

[0071] In the embodiment of the present application, the composite capillary structure 30 and the vapor channel 40 in the vapor chamber 200 are in a parallel structure, and the composite capillary structure 30 and the vapor channel 40 are adjacent to each other on the left and right sides. The vapor generated by the cooling medium in the composite capillary structure 30 can be transmitted to the vapor channels 40 on both sides at the same time, that is, the same vapor channel 40 can receive the vapor generated by the cooling medium in the adjacent composite capillary structure 30 on both sides, the transmission rate is higher, and the heat dissipation efficiency is higher; and the overall height of the vapor chamber 200 can be reduced by reducing the height of the composite capillary structure 30, thereby realizing thinning. At the same time, the composite design of the porous capillary structure 50 and the channel capillary structure 60 is adopted, the high capillary force of the porous capillary structure 50 is utilized, and the high permeability of the channel capillary structure 60 is utilized, so that the composite capillary structure 30 can reduce the flow resistance of the working medium transmission and promote the rapid transportation of the working medium, thereby realizing the thinning of the overall thickness of the vapor chamber 200 without performance attenuation, and further meeting the needs of thinning of the electronic device 100.

[0072] Figure 6is a structural schematic diagram of a second kind of wick provided in an embodiment of the present application. Figure 7 is a structural schematic diagram of a second kind of composite capillary structure provided in an embodiment of the present application.

[0073] As shown in Figure 6 , an embodiment of the present application provides a wick 200, which differs from the structure of the wick 200 shown in Figure 2 in the pattern of the composite capillary structure 30, and the rest of the features can refer to the corresponding content of the wick 200 shown in Figure 2 , which will not be described here in detail.

[0074] As shown in Figure 7 , in an embodiment of the present application, the composite capillary structure 30 is a left-right structure. For example, the porous capillary structure 50 is located on one side of the channel capillary structure 60. The porous capillary structure 50 is abutted between the first cover plate 10 and the second cover plate 20, one end of the channel capillary structure 60 is connected to the second cover plate 20, and the other end of the channel capillary structure 60 is suspended, i.e., the other end of the channel capillary structure 60 is not in contact with the first cover plate 10, and has a certain gap.

[0075] When the channel capillary structure 60 includes one channel 62 (not shown in the figure), a column 61 is arranged on one side of the porous capillary structure 50, and a channel 62 is formed between the column 61 and the porous capillary structure 50, and the channel 62 is filled with a cooling medium. When the channel capillary structure 60 includes two channels 62, a feasible way is to arrange the porous capillary structure 50 between the channel capillary structure 60. Two columns 61 are arranged, so that each column 61 is arranged on the opposite side of the porous capillary structure 50, and each column 61 forms a corresponding channel 62 with the porous capillary structure 50, and the two channels 62 are located on the opposite sides of the porous capillary structure.

[0076] Since the columns 61 on the left and right sides of the porous capillary structure 50 are not in contact with the first cover plate 10, the channel 62 formed by the column 61 and the porous capillary structure 50 can be directly communicated with the vapor passage 40.

[0077] In some embodiments, the overall width W30 of the composite capillary structure 30 in the left-right structure can be 0.5mm-1.5mm. For example, the overall width W30 of the composite capillary structure 30 is preferably 0.8mm-1.3mm. Compared with Figure 3 the first kind of composite capillary structure 30 shown in Figure 3The first composite capillary structure 30 shown has the same overall width, so the width of the porous capillary structure 50 can be reduced accordingly. The height H50 of the porous capillary structure 50 is the same as the height of the vapor channel 40 and the height of the sealed cavity of the vapor chamber 200, both of which are between 0.12 mm and 0.19 mm. The height H60 of the channel capillary structure 60 can be between 0.01 mm and 0.04 mm. The height H50 of the porous capillary structure 50 is about 6-9 times the height H60 of the channel capillary structure 60.

[0078] The channel capillary structure 60 is in direct communication with the vapor channel 40, and the channel capillary structure 60 can bind water due to capillary action, and the porous capillary structure 50 can also bind water due to capillary action. Therefore, it can be ensured that the water in the channel 21 will not overflow into the vapor channel 40. In addition, the water filled in the channel 62 is calculated and there is no excess water. The channel capillary structure 60 and the porous capillary structure 50 both have different degrees of water absorption capacity, and in order to ensure that the water condensed in the low-temperature area of the vapor channel 40 can flow back to the high-temperature area of the vapor chamber 200, the height H60 of the channel capillary structure 60 is set to be lower than the height H50 of the porous capillary structure 50. The porous capillary structure 50 is responsible for absorbing the water condensed in the low-temperature area of the wall surface of the vapor channel 40, and the water absorbed by the porous capillary structure 50 is transmitted to the channel capillary structure 60, and the channel capillary structure 60 can also absorb the water condensed in the low-temperature area of the channel and / or the wall surface of the vapor channel 40 at the same time.

[0079] Figure 8A is a schematic diagram of a heat dissipation path in the working fluid evaporation stage of a second vapor chamber provided by an embodiment of the present application. Figure 8B is a schematic diagram of a heat dissipation path in the working fluid condensation stage of a second vapor chamber provided by an embodiment of the present application.

[0080] As Figure 8AAs shown, when the second type of heat spreader 200 is used to dissipate heat generated by various components in the electronic device 100, in the high-temperature region of the heat spreader 200, the cooling medium in the channel capillary structure 60 absorbs heat and generates first steam. If the channel capillary structure 60 includes two channels 62, the cooling medium in each channel 62 absorbs heat and generates corresponding first steam q11 and q12 respectively. Each channel 62 is connected to the steam channel 40, so the first steam q11 and q12 generated by each channel 62 can be directly transferred to the steam channel 40. For example, the channel 62 located on the left side of the porous capillary structure 50 transfers the corresponding first steam q11 to the steam channel 40 located on the left side of the porous capillary structure 50, and the channel 62 located on the right side of the porous capillary structure 50 transfers the corresponding first steam q12 to the steam channel 40 located on the right side of the porous capillary structure 50. The cooling medium within the porous capillary structure 50 absorbs heat and generates a second vapor q2, which is then transferred to the steam channel 40. Similarly, the porous capillary structure 50 transfers its own generated second vapor q2 to the steam channels 40 on the left and right sides respectively. The steam channels 40 transfer the first vapor q11 / q12 and the second vapor q2 to the low-temperature region of the heat spreader 200, thereby dissipating heat.

[0081] like Figure 8B As shown, in the low-temperature region of the heat spreader 200, the first steam q11 / q12 and the second steam q2 in the steam channel 40 condense upon cooling, forming a cooling medium y0 (such as water), and releasing the heat accumulated during evaporation through condensation. The porous capillary structure 50 absorbs water, and the condensed cooling medium flows back to the high-temperature region through the porous capillary structure 50 and the channel capillary structure 60, achieving gas-liquid circulation. Specifically, the condensed cooling medium flows back to the high-temperature region through the porous capillary structure 50, filling the porous capillary structure 50 as cooling medium y2. The cooling medium y2 in the porous capillary structure 50 is transported downwards to the bottom position opposite to the channel capillary structure 60, and from the bottom position it is transferred to the channel capillary structures 60 located on both sides of the porous capillary structure 50. It then flows back to the high-temperature region through the channels 62 located on both sides of the porous capillary structure 50. The condensed cooling medium y0 fills the channels 62 of the channel capillary structure 60 as cooling media y11 and y12. In addition, the channel capillary structure 60 also has water absorption capacity; the condensed cooling medium y0 can be directly adsorbed by the channel capillary structure 60 and fill the channels 62 of the channel capillary structure 60 as cooling media y11' and y12'. For example, the condensed cooling media y11 and y11' fill the same channel 62, and the cooling media y12 and y12' fill the same channel 62. Through the gas-liquid two-phase change of the cooling medium, gas-liquid circulation is achieved, thereby enabling the heat in the high-temperature area of ​​the heat spreader 200 to be transferred to the low-temperature area and dissipated.

[0082] In this embodiment, the composite capillary structure 30 and the steam channel 40 in the heat spreader 200 are parallel structures, and the composite capillary structure 30 and the steam channel 40 are adjacent to each other. The steam generated by the cooling medium in the composite capillary structure 30 when heated can be transferred to the steam channels 40 on both sides of the composite capillary structure 30 at the same time. That is, the same steam channel 40 can receive the steam generated by the cooling medium in the composite capillary structures 30 on both sides when heated, resulting in a higher transmission rate and thus higher heat dissipation efficiency. Furthermore, the overall height of the heat spreader 200 can be reduced by lowering the height of the composite capillary structure 30, thereby achieving a thinner and lighter design. Meanwhile, the composite design of porous capillary structure 50 and channel capillary structure 60 is adopted. By utilizing the high capillary force of porous capillary structure 50 and the high permeability of channel capillary structure 60, the composite capillary structure 30 can reduce the flow resistance of working fluid transmission and promote the rapid delivery of working fluid. At the same time, the multiple channels 62 of channel capillary structure 60 are directly connected to different steam channels 40, which can improve the evaporation efficiency of channel capillary structure 60. This allows for the reduction of the overall thickness of heat spreader 200 without performance degradation, thereby meeting the requirement of thinner and lighter electronic equipment 100.

[0083] Figure 9 This is a schematic diagram of the structure of the third type of heat spreader provided in the embodiments of this application. Figure 10 This is a schematic diagram of the third composite capillary structure provided in the embodiments of this application.

[0084] like Figure 9 As shown, this application embodiment provides a heat spreader 200, the structure of which is similar to... Figure 2 and Figure 6 The structural difference of the heat spreader 200 shown lies in the style of the composite capillary structure 30; other characteristics can be referred to the same. Figure 2 and Figure 6 The corresponding contents of the heat spreader 200 shown are not described here.

[0085] like Figure 10 As shown in the embodiments of this application, with Figure 7 The difference in the composite capillary structure 30 shown is that, when the channel capillary structure 60 includes two channels 62, a feasible approach is to arrange the porous capillary structure 50 and the channel capillary structure 60 side by side. Furthermore, the channel capillary structure 60 includes two pillars 61, each pillar 61 being spaced apart and positioned on the same side of the porous capillary structure 50. For example, a first channel 621 is formed between the two pillars 61, and a second channel 622 is also formed between the pillar 61 closest to the porous capillary structure 50 and the porous capillary structure 50. The two channels (621, 622) are located on the same side of the porous capillary structure 50, and each channel (621, 622) is filled with a cooling medium.

[0086] Since neither of the two pillars 61 located on the same side of the porous capillary structure 50 is in contact with the first cover plate 10, the two channels (621, 622) formed by the two pillars 61 and the porous capillary structure 50 can be directly connected to the steam channel 40. Furthermore, Figure 10 The remaining properties of the composite capillary structure 30 shown can be referred to Figure 7 The characteristics of the composite capillary structure 30 shown (including the relative positions and parameters of the components, etc.) will not be elaborated here.

[0087] In some embodiments, the overall width of the composite capillary structure 30 with a left-right structure can be the same as that of the composite capillary structure 30 with a left-right structure. Figure 7 The composite capillary structure 30 shown also employs a left-right structure and has the same overall width.

[0088] Figure 11A This is a schematic diagram of the heat dissipation path during the working fluid evaporation stage of the third type of heat exchanger provided in this application embodiment. Figure 11B This is a schematic diagram of the heat dissipation path during the working fluid condensation stage of the third type of heat exchanger provided in this application embodiment.

[0089] like Figure 11A As shown, when the heat generated by various components in the electronic device 100 is dissipated using the third type of heat spreader 200, the cooling medium in the channel capillary structure 60 generates first steam after absorbing heat in the high-temperature region of the heat spreader 200. If the channel capillary structure 60 includes two channels 621 and 622, the cooling medium in each channel 621 and 622 generates first steam q11 and q12 after absorbing heat. Both channels 621 and 622 are connected to the steam channel 40, and since both channels 621 and 622 are located on the same side of the porous capillary structure 50, the first steam q11 and q12 generated by the two channels 621 and 622 can be directly transferred to the steam channel 40 located on the left side of the porous capillary structure 50. The cooling medium within the porous capillary structure 50 absorbs heat and generates a second vapor q2. Steam channels 40 connect to both sides of the same porous capillary structure 50, allowing the porous capillary structure 50 to transfer its generated second vapor q2 to the steam channels 40 on both sides. The steam channels 40 then transfer the first vapor (q11 and q12) and the second vapor q2 to the low-temperature region of the heat spreader 200, achieving heat dissipation.

[0090] like Figure 11BAs shown, in the low-temperature region of the vapor chamber 200, the first vapor (q11 and q12) and the second vapor q2 in the vapor channel 40 encounter cold and condense into cooling medium y0 (such as water) and release the heat accumulated during evaporation. The porous capillary structure 50 absorbs water, and the condensed cooling medium flows back to the high-temperature region through the porous capillary structure 50 and the channel capillary structure 60, realizing gas-liquid circulation. Specifically, the condensed cooling medium flows back to the high-temperature region through the porous capillary structure 50 and fills in the porous capillary structure 50 as cooling medium y2. The cooling medium y2 in the porous capillary structure 50 is transmitted downward to the bottom position opposite to the channel capillary structure 60, and is transmitted from the bottom position to the second channel 622 adjacent to the porous capillary structure 50 and fills in the second channel 622 as cooling medium y12. The cooling medium y12 is further transmitted from the second channel 622 to the adjacent first channel 621, and fills in the first channel 621 as cooling medium y11. In addition, the channel capillary structure 60 also has the ability to absorb water, and the condensed cooling medium y0 can be directly absorbed by the channel capillary structure 60 and fill in each channel 62 of the channel capillary structure 60 as cooling medium y11', y12'. For example, the condensed cooling medium y11 and y11' fills in the first channel 621, and the cooling medium y12 and y12' fills in the second channel 622. Through the gas-liquid two-phase change of the cooling medium, gas-liquid circulation is realized, so that the heat in the high-temperature region of the vapor chamber 200 is conducted to the low-temperature region and dissipated.

[0091] In the embodiment of the present application, the composite capillary structure 30 and the vapor channel 40 in the vapor chamber 200 are in a parallel structure, and the composite capillary structure 30 and the vapor channel 40 are adjacent to each other on the left and right sides. The vapor generated by the cooling medium in the composite capillary structure 30 can be transmitted to the vapor channel 40 on both sides of the composite capillary structure 30 at the same time, that is, the same vapor channel 40 can receive the vapor generated by the cooling medium in the adjacent composite capillary structure 30 on both sides, the transmission rate is higher, and the heat dissipation efficiency is higher. In addition, the height of the composite capillary structure 30 can be reduced to reduce the overall height of the vapor chamber 200, and the thinness of the vapor chamber 200 is realized. At the same time, the composite design of the porous capillary structure 50 and the channel capillary structure 60 is adopted, the high capillary force of the porous capillary structure 50 is utilized, and the high permeability of the channel capillary structure 60 is utilized, so that the composite capillary structure 30 can reduce the flow resistance of the working medium transmission and promote the rapid transportation of the working medium. At the same time, the plurality of channels 62 of the channel capillary structure 60 are directly communicated with the same vapor channel 40, which can improve the evaporation efficiency of the channel capillary structure 60, realize the thinning of the overall thickness of the vapor chamber 200 without performance attenuation, and further meet the demand of thinness of the electronic device 100.

[0092] Figure 12is a structural schematic diagram of a fourth kind of vapor chamber provided in an embodiment of the present application. Figure 13 is a structural schematic diagram of a fourth kind of composite capillary structure provided in an embodiment of the present application.

[0093] As shown in Figure 12 , an embodiment of the present application provides a vapor chamber 200, which is different from the vapor chamber 200 shown in Figure 2 , Figure 6 and Figure 9 in the pattern of the composite capillary structure 30, and the rest of the characteristics can refer to the corresponding contents of the vapor chamber 200 shown in Figure 2 , Figure 6 and Figure 9 , which will not be described here.

[0094] As shown in Figure 13 , an embodiment of the present application is different from the composite capillary structure 30 shown in Figure 10 in that a plurality of columns 61 are arranged on the opposite sides of the porous capillary structure 50, so as to form a plurality of grooves 62 on the opposite sides of the porous capillary structure 50. For example, when two columns 61 are arranged on the opposite sides of the porous capillary structure 50, two grooves 62 are formed on the opposite sides of the porous capillary structure 50. Then, one composite capillary structure 30 has four grooves 62, and the more the number of grooves 62, the higher the evaporation efficiency, and the lower the flow resistance, which further promotes the rapid transport of the working medium.

[0095] Figure 13 The rest of the characteristics of the composite capillary structure 30 shown in Figure 10 can refer to the characteristics (including the relative positions of the components and parameters, etc.) of the composite capillary structure 30 shown in Figure 12 , and the same as Figure 9 , the heat dissipation path of the vapor chamber 200 shown in , which will not be described here.

[0096] Figure 14 is a structural schematic diagram of a fifth kind of vapor chamber provided in an embodiment of the present application.

[0097] As shown in Figure 14 , the sealing cavity of the vapor chamber 200 is further provided with a support column 70, which abuts between the first cover plate 10 and the second cover plate 20, and the support column 70 is used to maintain the shape of the sealing cavity, that is, to maintain the shape of the vapor chamber 200. Although the composite capillary structure 30 in the vapor chamber 200 has a certain supporting effect, which can maintain the shape of the sealing cavity. However, the support column 70 arranged in the vapor chamber 200 can further improve the supporting effect.

[0098] The support column 70 can be applied to the vapor chamber 200 provided in any of the foregoing embodiments. At least one support column 70 can be arranged in the sealed cavity of the vapor chamber 200, and each support column 70 can be arranged between two adjacent composite capillary structures 30 or between the first composite capillary structure 30 and the end of the first cover plate 10. The support column 70 and the adjacent composite capillary structure 30 form a vapor channel 40, or the support column 70 and the end of the first cover plate 10 form a vapor channel 40. The support column 70 can be used to resist the deformation of the vapor chamber 200 caused by the difference between the internal and external atmospheric pressures and other external forces, so as to prevent the vapor channel 40 and the composite capillary structure 30 from being flattened and causing the vapor chamber 200 to fail.

[0099] The support column 70 can be integrally formed with the first cover plate 10 or the second cover plate 20 through an etching process, so as to improve the connection stability of the support column 70 and the first cover plate 10 or the second cover plate 20, avoid the bonding or welding process between the two, and simplify the processing flow. It can be understood that, in the embodiments of the present application, the material of the support column 70 is the same as that of the first cover plate 10 or the second cover plate 20, for example, copper or copper alloy, etc. By matching the support column 70 with the first cover plate 10 and the second cover plate 20 with high strength, the strength of the entire vapor chamber 200 can also be ensured.

[0100] In the embodiments of the present application, the composite capillary structure 30 and the vapor channel 40 in the vapor chamber 200 are in a parallel structure, and the composite design of the porous capillary structure 50 and the channel capillary structure 60 is adopted. The high capillary force of the porous capillary structure 50 is utilized, and the high permeability of the channel capillary structure 60 is utilized, so that the composite capillary structure 30 can reduce the flow resistance of the working medium transmission and promote the rapid transportation of the working medium; at the same time, at least one support column 70 can be arranged in the sealed cavity to ensure the strength of the vapor chamber 200. The above scheme can realize the thinning of the overall thickness of the vapor chamber 200 without performance attenuation, thereby meeting the demand for light and thin electronic equipment 100.

[0101] In some embodiments, in Figure 2 In the vapor chamber 200 shown in FIG. 1, because the composite capillary structure 30 adopts an up-down structure, the cross-sectional shape of the vapor channel 40 formed in the sealed cavity is a regular shape, such as a rectangle. Figure 6 、 Figure 9 and Figure 12 In the vapor chamber 200 shown in FIG. 1, because the composite capillary structure 30 adopts a left-right structure, the cross-sectional shape of the vapor channel 40 formed in the sealed cavity is an irregular shape.

[0102] When the cross-sectional shape of the steam passage 40 is irregular, the steam passage 40 with the irregular shape has a wider top end and a narrower bottom end. Then, when the proportion relationship between the width W40 of the steam passage 40 and the width W30 of the composite capillary structure 30 is set, the top end width of the steam passage 40 with the irregular shape can be used as a reference, or the bottom end width of the steam passage 40 with the irregular shape can be used as a reference.

[0103] In some embodiments, the number of the composite capillary structures 30 arranged in the vapor chamber 200 can be determined based on the size of the vapor chamber. The number of the composite capillary structures 30 shown in various drawings according to the embodiments of the present application is only exemplary and does not limit the number of the composite capillary structures 30 arranged.

[0104] The vapor chamber and the electronic device provided by the embodiments of the present application have the following beneficial effects. The vapor chamber includes a first cover plate and a second cover plate. The second cover plate is fastened to the first cover plate to form a sealed cavity. At least one composite capillary structure is arranged in the sealed cavity, and steam passages are formed on both sides of each composite capillary structure. The composite capillary structure includes a porous capillary structure and a channel capillary structure connected to each other. The porous capillary structure and the channel capillary structure are both filled with a cooling medium. The steam generated by the cooling medium when heated can be transmitted to the steam passages on both sides of the composite capillary structure at the same time, that is, the same steam passage 40 can receive the steam generated by the cooling medium when heated from the two adjacent composite capillary structures 30, the transmission rate is higher, and the heat dissipation efficiency is higher. In addition, the steam passage and the composite capillary structure are in a left-right parallel structure, the overall height of the vapor chamber can be reduced by reducing the height of the composite capillary structure, and the thinness of the vapor chamber is realized. At the same time, the composite design of the porous capillary structure and the channel capillary structure is adopted, the high capillary force of the porous capillary structure is utilized, and the high permeability of the channel capillary structure is utilized. The composite capillary structure can reduce the flow resistance of the working medium transmission, promote the rapid transportation of the working medium, realize the thinning of the overall thickness of the vapor chamber without performance attenuation, and meet the demand for thinness of the electronic device.

[0105] It is to be understood that even though numerous characteristics and embodiments of the application have been set forth in the foregoing disclosure, the exact details are not to be construed as limiting, and that the scope of the application can be affected only by the claims. It is intended that the definition of the application in the claims be understood in its broadest reasonable manner, consistent with the usage of the terms found in the written description and the appended claims.

[0106] It is to be understood that the application is not limited to particular details described herein and / or illustrated in the drawings. Rather, the application can be practiced with modifications and changes within the scope and spirit of the appended claims. The drawings should not be interpreted as limiting the scope of the application.

Claims

1. A heat spreader, characterized in that, include: First cover plate (10); The second cover plate (20) is fastened to the first cover plate (10) to form a sealed cavity, the inside of which is a negative pressure environment; A composite capillary structure (30) is provided at least once in the sealed cavity, and each composite capillary structure (30) abuts between the first cover plate (10) and the second cover plate (20); at least one composite capillary structure (30) divides the sealed cavity into at least one sub-cavity, the sub-cavity being used to form a steam passage (40); The composite capillary structure (30) includes a porous capillary structure (50) and a channel capillary structure (60), which are connected to each other. Both the porous capillary structure (50) and the channel capillary structure (60) are filled with a cooling medium, which circulates between the channel capillary structure (60), the porous capillary structure (50), and the steam channel (40).

2. The heat spreader according to claim 1, characterized in that, The porous capillary structure (50) is located above the channel capillary structure (60); the porous capillary structure (50) abuts between the first cover plate (10) and the channel capillary structure (60), the channel capillary structure (60) abuts between the porous capillary structure (50) and the second cover plate (20), and the porous capillary structure (50) and the channel capillary structure (60) are connected by the cooling medium.

3. The heat spreader according to claim 2, characterized in that, The channel capillary structure (60) includes at least one column (61) and at least one channel (62). Each column (61) is spaced apart. One end of each column (61) is connected to the porous capillary structure (50), and the other end of each column (61) is connected to the second cover plate (20). The channel (62) is formed between two adjacent columns (61), and the channel (62) is filled with the cooling medium.

4. The heat spreader according to claim 3, characterized in that, The heat spreader includes a low-temperature zone and a high-temperature zone; In the high-temperature region, the cooling medium in the channel (62) absorbs heat to generate first steam, and the cooling medium in the porous capillary structure (50) absorbs heat to generate second steam. The first steam passes through the porous capillary structure (50) and, together with the second steam, is transferred to the steam channel (40). The steam channel (40) transfers the first steam and the second steam to the low-temperature region to achieve heat dissipation. In the low-temperature region, the first steam and the second steam in the steam channel (40) condense into a cooling medium, which flows back to the high-temperature region through the porous capillary structure (50) and the channel capillary structure (60) to achieve gas-liquid circulation.

5. The heat spreader according to claim 1, characterized in that, The porous capillary structure (50) is located on one side of the channel capillary structure (60). The porous capillary structure (50) abuts between the first cover plate (10) and the second cover plate (20). One end of the channel capillary structure (60) is connected to the second cover plate (20), and the other end of the channel capillary structure (60) is spaced from the first cover plate (10).

6. The heat spreader according to claim 5, characterized in that, The channel capillary structure (60) includes at least one column (61) and at least one channel (62). Each column (61) is spaced apart on opposite sides of the porous capillary structure (50). The channel (62) is formed between the column (61) and the porous capillary structure (50). The channel (62) is filled with the cooling medium. In the high-temperature region of the heat spreader, the cooling medium in the channel (62) generates first steam after absorbing heat and is transferred to the steam channel (40). In addition, the cooling medium in the porous capillary structure (50) generates second steam after absorbing heat and is transferred to the steam channel (40). The steam channel (40) transfers the first steam and the second steam to the low-temperature region to achieve heat dissipation. In the low-temperature region of the heat spreader, the first and second steam in the steam channel (40) condense into a cooling medium, which flows back to the high-temperature region through the porous capillary structure (50) and the channel capillary structure (60) to achieve gas-liquid circulation.

7. The heat spreader according to claim 5, characterized in that, The channel capillary structure (60) includes several pillars (61) and at least one channel (62). Each pillar (61) is spaced apart on the same side of the porous capillary structure (50). The channel (62) is formed between two adjacent pillars (61) and between the pillar (61) and the porous capillary structure (50). Each channel (62) is filled with the cooling medium. In the high-temperature region of the heat spreader, the cooling medium in the channel (62) generates first steam after absorbing heat and is transferred to the steam channel (40). In addition, the cooling medium in the porous capillary structure (50) generates second steam after absorbing heat and is transferred to the steam channel (40). The steam channel (40) transfers the first steam and the second steam to the low-temperature region to achieve heat dissipation. In the low-temperature region of the heat spreader, the first and second steam in the steam channel (40) condense into a cooling medium, which flows back to the high-temperature region through the porous capillary structure (50) and the channel capillary structure (60) to achieve gas-liquid circulation.

8. The heat spreader according to any one of claims 3, 6, and 7, characterized in that, The number of channels (62) is 1 to 3, and the width of each channel (62) is different, or the width of each channel (62) is the same.

9. The heat spreader according to any one of claims 1-7, characterized in that, The channel capillary structure (60) and the second cover plate (20) are integrally formed by etching process.

10. The heat spreader according to any one of claims 1-7, characterized in that, The width of the steam channel (40) is 0.5 to 2 times the width of the composite capillary structure (30).

11. The heat spreader according to any one of claims 1-7, characterized in that, The sealed cavity is also provided with a support column (70), which abuts between the first cover plate (10) and the second cover plate (20), and the support column (70) is used to maintain the shape of the sealed cavity.

12. An electronic device, characterized in that, It includes the body, the shell, and the heat spreader as described in any one of claims 1-11.

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