Liquid cooling heat dissipation method and device based on liquid cooling heat dissipation equipment

Abstract

The embodiment of the application provides a liquid cooling heat dissipation method and device based on a liquid cooling heat dissipation equipment, the liquid cooling heat dissipation equipment comprises a heat distribution plate (15), a heat dissipation cold plate (12) and a drag reduction cold plate (5), the method comprises the following steps: monitoring the temperature of the chip (13); when the temperature of the chip (13) exceeds a first threshold value, reducing the liquid flow entering the drag reduction cold plate (5) and increasing the liquid flow entering the heat dissipation cold plate (12); when the temperature of the chip (13) is less than a second threshold value, increasing the liquid flow entering the drag reduction cold plate (5) and reducing the liquid flow entering the heat dissipation cold plate (12); the compatibility problem of the cold plate in the system with different heat dissipation and flow resistance requirements is optimized, the heat dissipation effect of the liquid cooling heat dissipation equipment is improved, the heat dissipation effect of the liquid cooling heat dissipation equipment is improved, and the resource waste during system operation is reduced.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling heat dissipation, and in particular to a liquid cooling heat dissipation method and apparatus based on liquid cooling heat dissipation equipment. Background Technology

[0002] With the advent of the big data era, the demand for computing power is growing rapidly, leading to a continuous increase in chip power density. This means that traditional air cooling is no longer sufficient to meet the heat dissipation needs of chips in high heat flux density scenarios. Simultaneously, as national requirements for low energy consumption in data centers increase, traditional air-cooled data centers are increasingly unable to meet these demands. Therefore, liquid cooling has become a major trend in data center chip heat dissipation, and the development of liquid cooling technology has attracted increasing attention from industry professionals. Currently, the mainstream liquid cooling methods include cold plate liquid cooling and immersion liquid cooling. Immersion liquid cooling's coolant cost and compatibility issues have limited its large-scale application to some extent, while cold plate liquid cooling, due to its controllable cost and relatively mature technology, has become the solution choice for many liquid cooling manufacturers and has achieved large-scale commercial application.

[0003] However, the heat dissipation requirements of different chips and the pressure drop requirements of liquid cooling systems on cold plates vary significantly. In traditional liquid cooling solutions, a single cold plate can only meet the heat dissipation and flow resistance requirements of a specific chip, resulting in poor versatility. When the system flow resistance requirements change or the chip power changes significantly, the cold plate needs to be redesigned. Furthermore, during server operation, when the chip power load decreases while the system flow rate remains constant, traditional cold plates cannot adjust accordingly and will still operate with higher flow resistance and higher heat dissipation capacity, leading to resource waste. Summary of the Invention

[0004] In view of the above problems, a liquid cooling heat dissipation method based on a liquid cooling heat dissipation device is proposed to overcome or at least partially solve the above problems, including:

[0005] A liquid cooling method based on a liquid cooling heat dissipation device, the liquid cooling heat dissipation device including a heat distribution plate (15), a heat dissipation plate (12), and a drag-reducing plate (5); one side of the heat distribution plate (15) is connected to the heat dissipation plate (12) and connected to the drag-reducing plate (5) through a heat pipe (14), and the other side of the heat distribution plate (15) is connected to a chip (13); wherein, the heat distribution plate (15) is used to transfer the heat generated by the chip (13) to the heat dissipation plate (12) and the drag-reducing plate (5) respectively; the method includes:

[0006] Monitor the temperature of the chip (13);

[0007] When the temperature of the chip (13) exceeds the first threshold, the liquid flow rate into the drag-reducing cold plate (5) is reduced and the liquid flow rate into the heat dissipation cold plate (12) is increased;

[0008] When the temperature of the chip (13) is less than the second threshold, the liquid flow rate into the drag-reducing cold plate (5) is increased and the liquid flow rate into the heat dissipation cold plate (12) is decreased.

[0009] Optionally, the liquid cooling device further includes a heat dissipation plate inlet electric valve (9) and a drag-reducing plate inlet electric valve (2); the step of reducing the liquid flow rate into the drag-reducing plate (5) and increasing the liquid flow rate into the heat dissipation plate (12) when the temperature of the chip (13) exceeds the first threshold includes:

[0010] When the temperature of the chip (13) exceeds the first threshold, the liquid flow rate into the drag-reducing cold plate (5) is reduced by adjusting the valve opening of the drag-reducing cold plate inlet electric valve (2) and the liquid flow rate into the heat dissipation cold plate (12) is increased by adjusting the valve opening of the heat dissipation cold plate inlet electric valve (9).

[0011] The step of increasing the liquid flow rate into the drag-reducing cold plate (5) and decreasing the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) is less than the second threshold includes:

[0012] When the temperature of the chip (13) is less than the second threshold, the liquid flow rate into the drag-reducing cold plate (5) is increased by adjusting the valve opening of the drag-reducing cold plate inlet electric valve (2), and the liquid flow rate into the heat dissipation cold plate (12) is reduced by adjusting the valve opening of the heat dissipation cold plate inlet electric valve (9).

[0013] Optionally, the liquid cooling heat dissipation device further includes a heat dissipation plate outflow electric valve (8) and a drag-reducing plate outflow electric valve (6), wherein the heat dissipation plate outflow electric valve (8) is used to control the outflow of liquid in the heat dissipation plate (12), and the drag-reducing plate outflow electric valve (6) is used to control the outflow of liquid in the drag-reducing plate (5).

[0014] Optionally, the liquid cooling heat dissipation device further includes a heat dissipation plate flow monitoring point (11), a drag-reducing plate flow monitoring point (3), a heat dissipation plate drain electric valve (10), and a drag-reducing plate drain electric valve (4); wherein, the heat dissipation plate flow monitoring point (11) and the drag-reducing plate flow monitoring point (3) are used to monitor the liquid flow of the heat dissipation plate (12) and the drag-reducing plate (5); the method further includes:

[0015] When the liquid flow rate in the heat dissipation plate (12) or the drag reduction plate (5) is less than the preset value, the valve opening of the heat dissipation plate inlet electric valve (9) or the drag reduction plate inlet electric valve (2) corresponding to the heat dissipation plate (12) or the drag reduction plate (5) is adjusted to the maximum.

[0016] If the liquid flow rate in the heat dissipation plate (12) or the drag reduction plate (5) is still less than the preset value, an alarm will be triggered indicating that the heat dissipation plate (12) or the drag reduction plate (5) is clogged and needs to be replaced.

[0017] When replacing the heat dissipation plate (12) or the drag reduction plate (5), close the heat dissipation plate inlet electric valve (9), the heat dissipation plate outlet electric valve (8), or the drag reduction plate inlet electric valve (2) and the drag reduction plate outlet electric valve (6) corresponding to the heat dissipation plate to be replaced.

[0018] Fully open the heat dissipation cold plate inlet electric valve (9), the heat dissipation cold plate outlet electric valve (8), or the drag reduction cold plate inlet electric valve (2), the drag reduction cold plate outlet electric valve (6) corresponding to the cold plate that does not need to be replaced, and open the heat dissipation cold plate drain electric valve (10) or the drag reduction cold plate drain electric valve (4) corresponding to the cold plate that needs to be replaced to discharge the residual liquid.

[0019] After the remaining liquid is drained, replace the cold plate that needs to be replaced.

[0020] Optionally, after the residual liquid is drained and the cold plate that needs to be replaced is replaced, the method further includes:

[0021] After the replacement of the cold plate is completed, open the heat dissipation cold plate inlet electric valve (9), the heat dissipation cold plate outlet electric valve (8), or the drag reduction cold plate inlet electric valve (2), the drag reduction cold plate outlet electric valve (6) corresponding to the cold plate to be replaced, and deactivate the alarm.

[0022] Optionally, the heat distribution plate (15) is connected to the chip (13) through an interface material (16), the interface material (16) being used to eliminate the contact thermal resistance between the heat distribution plate (15) and the chip (13).

[0023] Optionally, the heat dissipation plate (12) adopts a traditional shovel tooth straight channel design inside.

[0024] Optionally, the drag-reducing cold plate (5) adopts a discontinuous channel low flow resistance design based on Murray's law.

[0025] A liquid cooling heat dissipation device based on a liquid cooling heat dissipation equipment, the liquid cooling heat dissipation equipment including a heat distribution plate (15), a heat dissipation plate (12), and a drag-reducing plate (5); one side of the heat distribution plate (15) is connected to the heat dissipation plate (12) and connected to the drag-reducing plate (5) through a heat pipe (14), and the other side of the heat distribution plate (15) is connected to a chip (13); wherein, the heat distribution plate (15) is used to transfer the heat generated by the chip (13) to the heat dissipation plate (12) and the drag-reducing plate (5) respectively; the device includes:

[0026] A temperature monitoring module is used to monitor the temperature of the chip (13);

[0027] A heat dissipation module is used to reduce the liquid flow rate into the drag-reducing cold plate (5) and increase the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) exceeds a first threshold.

[0028] The drag reduction module is used to increase the liquid flow rate into the drag reduction cold plate (5) and decrease the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) is less than the second threshold.

[0029] An electronic device includes a processor, a memory, and a computer program stored in the memory and capable of running on the processor. When executed by the processor, the computer program implements the liquid cooling method based on the liquid cooling device as described above.

[0030] A computer-readable storage medium storing a computer program that, when executed by a processor, implements the liquid cooling method based on a liquid cooling device as described above.

[0031] The embodiments of the present invention have the following advantages:

[0032] This invention provides a liquid cooling method based on a liquid cooling device, which includes at least a heat distribution plate (15), a heat dissipation plate (12), and a drag-reducing plate (5). One side of the heat distribution plate (15) is connected to the heat dissipation plate (12) and connected to the drag-reducing plate (5) via a heat pipe (14), and the other side of the heat distribution plate (15) is connected to a chip (13). The heat distribution plate (15) is used to transfer the heat generated by the chip (13) to the heat dissipation plate (12) and the drag-reducing plate (5), respectively. The liquid cooling method includes: monitoring the heat generated by the chip (13). Temperature; when the temperature of the chip (13) exceeds the first threshold, the liquid flow rate into the drag-reducing cold plate (5) is reduced and the liquid flow rate into the heat dissipation cold plate (12) is increased; when the temperature of the chip (13) is less than the second threshold, the liquid flow rate into the drag-reducing cold plate (5) is increased and the liquid flow rate into the heat dissipation cold plate (12) is reduced, thus realizing real-time control of the cold plate according to the heat dissipation and flow resistance requirements during the operation of the same system; the compatibility problem of the cold plate in systems with different heat dissipation and flow resistance requirements is optimized, the heat dissipation effect of the liquid cooling heat dissipation equipment is improved, and the resource waste during system operation is reduced. Attached Figure Description

[0033] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a flowchart illustrating the steps of a liquid cooling method based on a liquid cooling device according to an embodiment of the present invention.

[0035] Figure 2 This is a three-dimensional schematic diagram of the cold plate assembly in the liquid cooling heat dissipation device provided by the present invention;

[0036] Figure 3 This is a schematic diagram of the internal structure of the cold plate provided by the present invention;

[0037] Figure 4 This is an overall schematic diagram of the liquid cooling heat dissipation device provided by the present invention;

[0038] Figure 5 This is a flowchart illustrating the steps of another liquid cooling method based on a liquid cooling device provided in an embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of the structure of a liquid cooling heat dissipation device based on a liquid cooling heat dissipation equipment according to an embodiment of the present invention. Detailed Implementation

[0040] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0041] With the advent of the big data era, the demand for computing power is growing rapidly, leading to a continuous increase in chip power density. This means that traditional air cooling is no longer sufficient to meet the heat dissipation needs of chips in high heat flux density scenarios. Simultaneously, as national requirements for low energy consumption in data centers increase, traditional air-cooled data centers are increasingly unable to meet these demands. Therefore, liquid cooling has become a major trend in data center chip heat dissipation, and the development of liquid cooling technology has attracted increasing attention from industry professionals. Currently, the mainstream liquid cooling methods include cold plate liquid cooling and immersion liquid cooling. Immersion liquid cooling's coolant cost and compatibility issues have limited its large-scale application to some extent, while cold plate liquid cooling, due to its controllable cost and relatively mature technology, has become the solution choice for many liquid cooling manufacturers and has achieved large-scale commercial application.

[0042] However, the heat dissipation requirements of different chips and the pressure drop requirements of liquid cooling systems on cold plates vary significantly. In traditional liquid cooling solutions, a single cold plate can only meet the heat dissipation and flow resistance requirements of a specific chip, resulting in poor versatility. When the system flow resistance requirements change or the chip power changes significantly, the cold plate needs to be redesigned. Furthermore, during server operation, when the chip power load decreases while the system flow rate remains constant, traditional cold plates cannot adjust accordingly and will still operate with higher flow resistance and higher heat dissipation capacity, leading to resource waste.

[0043] In related technologies, different cold plate designs are typically used for chips with different power ratings, and selection and matching are performed for specific applications, making it impossible to achieve multi-scenario application compatibility with a single cold plate. In addition, traditional serrated straight-channel cold plates have relatively high flow resistance and cannot achieve flow resistance adjustment, which is insufficient for dealing with different flow resistance requirements.

[0044] To address the aforementioned problems, this invention improves upon related liquid cooling methods based on liquid cooling devices by incorporating a drag-reducing cold plate. The invention will be described in detail below with reference to the accompanying drawings:

[0045] Reference Figure 1This diagram illustrates a step-by-step flowchart of a liquid cooling method based on a liquid cooling device according to an embodiment of the present invention. The liquid cooling device includes a heat distribution plate (15), a heat dissipation plate (12), and a drag-reducing plate (5). One side of the heat distribution plate (15) is connected to the heat dissipation plate (12) and connected to the drag-reducing plate (5) via a heat pipe (14). The other side of the heat distribution plate (15) is connected to a chip (13). The heat distribution plate (15) is used to transfer the heat generated by the chip (13) to the heat dissipation plate (12) and the drag-reducing plate (5), respectively. Specifically, it may include the following steps:

[0046] Step 101: Monitor the temperature of the chip (13);

[0047] In practical applications, such as Figure 2 The diagram shows a three-dimensional schematic of the cold plate assembly in the liquid cooling heat dissipation device provided by the present invention. The heat generated by the chip will be transferred to the heat distribution plate (15), and then transferred to the drag-reducing cold plate (5) with lower flow resistance and the heat dissipation cold plate (12) with stronger heat dissipation capacity through the heat distribution plate (15). The heat distribution plate (15) can transfer heat to the drag-reducing cold plate (5) through the heat pipe (14). Therefore, the temperature of the chip can be monitored in real time so as to determine the corresponding heat dissipation and flow resistance requirements according to the actual temperature of the chip, thereby realizing the real-time control of the cold plate.

[0048] In one embodiment of the present invention, the heat distribution plate (15) is connected to the chip (13) through an interface material (16), the interface material (16) being used to eliminate the contact thermal resistance between the heat distribution plate (15) and the chip (13).

[0049] In a specific implementation, an interface material (16) can be added between the heat distribution plate (15) and the chip (13) to eliminate the contact thermal resistance between the heat distribution plate (15) and the chip (13); thereby improving the heat conduction efficiency from the chip to the heat distribution plate, making the liquid cooling heat dissipation device design more compact, reducing the space occupied, keeping the chip within a suitable operating temperature range, effectively preventing the chip from overheating, reducing the operating temperature of the chip, and thus extending its service life.

[0050] Step 102: When the temperature of the chip (13) exceeds the first threshold, reduce the liquid flow rate into the drag-reducing cold plate (5) and increase the liquid flow rate into the heat dissipation cold plate (12);

[0051] In a specific implementation, the liquid flow rate of the drag-reducing cold plate (5) and the heat dissipation cold plate (12) can be controlled by electric valves respectively. For example, the control can be achieved by adjusting the valve opening, thereby realizing the adjustment of heat exchange capacity and flow resistance. When the chip power increases and the chip temperature exceeds the set temperature, i.e. the first threshold, the corresponding adjustment signal can be transmitted to the electric valve to reduce the liquid flow rate entering the drag-reducing cold plate (5) and increase the liquid flow rate entering the heat dissipation cold plate (12), thereby enhancing the chip heat dissipation capacity and maintaining the chip temperature within the set temperature range. This mode can be defined as the strong heat exchange mode.

[0052] In one embodiment of the present invention, the heat dissipation plate (12) adopts a traditional shovel tooth straight channel design inside.

[0053] In specific implementations, such as Figure 3 The diagram shows the internal structure of the cold plate provided by the present invention. The first cold plate is the heat dissipation cold plate (12), and the second cold plate is the drag reduction cold plate (5). The heat dissipation cold plate (12) can adopt a traditional toothed straight channel design. Since the heat exchange capacity of the traditional toothed straight channel design is strong, the heat dissipation cold plate (12) can be used as the main heat dissipation cold plate. However, the cold plate of the traditional toothed straight channel design generally has a large flow resistance. When the heat dissipation capacity required by the chip (13) is not high, it is easy to waste resources due to the excessive flow resistance.

[0054] Step 103: When the temperature of the chip (13) is less than the second threshold, increase the liquid flow rate into the drag-reducing cold plate (5) and decrease the liquid flow rate into the heat dissipation cold plate (12).

[0055] In practical applications, the liquid flow rates of the drag-reducing cold plate (5) and the heat dissipation cold plate (12) can be controlled by electric valves, for example, by adjusting the valve opening, thereby achieving the adjustment of heat exchange capacity and flow resistance. When the chip power decreases and the chip temperature is lower than the set temperature, i.e. the second threshold, the corresponding adjustment signal can be transmitted to the electric valve to increase the liquid flow rate entering the drag-reducing cold plate (5) and reduce the liquid flow rate entering the heat dissipation cold plate (12), so that more fluid flows through the drag-reducing cold plate (5) with lower flow resistance. At this time, flow resistance control is the main focus. On the basis of satisfying the chip heat dissipation, the system flow resistance is reduced. Therefore, this mode can be defined as low flow resistance mode.

[0056] Based on the above, this application enables online switching and adjustment between strong heat exchange mode and low flow resistance mode, greatly improving the compatibility of this application.

[0057] In one embodiment of the present invention, the liquid cooling heat dissipation device further includes a heat dissipation cold plate inlet electric valve (9) and a drag-reducing cold plate inlet electric valve (2); the step of reducing the liquid flow rate into the drag-reducing cold plate (5) and increasing the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) exceeds the first threshold includes:

[0058] When the temperature of the chip (13) exceeds the first threshold, the liquid flow rate into the drag-reducing cold plate (5) is reduced by adjusting the valve opening of the drag-reducing cold plate inlet electric valve (2) and the liquid flow rate into the heat dissipation cold plate (12) is increased by adjusting the valve opening of the heat dissipation cold plate inlet electric valve (9).

[0059] The step of increasing the liquid flow rate into the drag-reducing cold plate (5) and decreasing the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) is less than the second threshold includes:

[0060] When the temperature of the chip (13) is less than the second threshold, the liquid flow rate into the drag-reducing cold plate (5) is increased by adjusting the valve opening of the drag-reducing cold plate inlet electric valve (2), and the liquid flow rate into the heat dissipation cold plate (12) is reduced by adjusting the valve opening of the heat dissipation cold plate inlet electric valve (9).

[0061] In practical applications, a heat dissipation plate inlet electric valve (9) and a drag-reducing plate inlet electric valve (2) can be added to the liquid cooling heat dissipation equipment. When the temperature of the chip (13) exceeds the first threshold, the liquid flow rate entering the drag-reducing plate (5) can be reduced by adjusting the valve opening of the drag-reducing plate inlet electric valve (2), and the liquid flow rate entering the heat dissipation plate (12) can be increased by adjusting the valve opening of the heat dissipation plate inlet electric valve (9). For example, the heat exchange capacity and flow resistance can be adjusted by adjusting the valve opening. When the chip power increases and the chip temperature exceeds the set temperature, i.e. the first threshold, the corresponding adjustment signal can be transmitted to the electric valve to reduce the liquid flow rate entering the drag-reducing plate (5) and increase the liquid flow rate entering the heat dissipation plate (12), thereby enhancing the chip heat dissipation capacity and maintaining the chip temperature within the set temperature range. This mode can be defined as a strong heat exchange mode.

[0062] When the temperature of the chip (13) is less than the second threshold, the liquid flow rate into the drag-reducing cold plate (5) is increased by adjusting the valve opening of the electric valve (2) of the drag-reducing cold plate inlet, and the liquid flow rate into the heat dissipation cold plate (12) is decreased by adjusting the valve opening of the electric valve (9) of the heat dissipation cold plate inlet. For example, the control can be achieved by adjusting the valve opening, thereby realizing the adjustment of heat exchange capacity and flow resistance. When the chip power decreases and the chip temperature is lower than the set temperature, i.e. the second threshold, the corresponding adjustment signal can be transmitted to the electric valve to increase the liquid flow rate into the drag-reducing cold plate (5) and decrease the liquid flow rate into the heat dissipation cold plate (12), so that more fluid flows through the drag-reducing cold plate (5) with lower flow resistance. At this time, flow resistance control is the main focus. On the basis of satisfying the chip heat dissipation, the system flow resistance is reduced. Therefore, this mode can be defined as low flow resistance mode.

[0063] In one embodiment of the present invention, the drag-reducing cold plate (5) adopts a discontinuous channel low flow resistance design based on Murray's law.

[0064] In practical applications, such as Figure 3 As shown, the first cold plate is the heat dissipation cold plate (12), and the second cold plate is the drag reduction cold plate (5); the spacing of the teeth inside the drag reduction cold plate (5) can be designed for low flow resistance using Murray's law: that is, the channel is a discontinuous channel and can be divided into multiple stages according to requirements, and the spacing of the teeth gradually decreases along the fluid flow direction, while the spacing of the teeth between adjacent stages needs to satisfy Murray's law, that is:

[0065] D1 3 =nD2 3

[0066] Where D1 is the tooth spacing of the upper-level channel, D2 is the tooth spacing of the lower-level channel, and n is the ratio of the number of lower-level channels to the number of upper-level channels.

[0067] As the temperature of the fluid inside the cold plate gradually increases along the flow direction, the heat exchange capacity gradually weakens, resulting in poor heat exchange capacity downstream of the cold plate channel. The drag-reducing cold plate (5) can be arranged in a way that gradually reduces the tooth spacing along the flow channel direction, which can not only enhance the heat exchange capacity downstream of the cold plate and achieve precise heat dissipation, but also maximize the effect of reducing flow resistance through the above design.

[0068] In one embodiment of the present invention, the liquid cooling heat dissipation device further includes a heat dissipation cold plate outflow electric valve (8) and a drag reduction cold plate outflow electric valve (6), wherein the heat dissipation cold plate outflow electric valve (8) is used to control the outflow of liquid in the heat dissipation cold plate (12), and the drag reduction cold plate outflow electric valve (6) is used to control the outflow of liquid in the drag reduction cold plate (5).

[0069] In a specific implementation, the liquid cooling heat dissipation device may also include a heat dissipation plate outflow electric valve (8) and a drag reduction plate outflow electric valve (6) so as to control the outflow of liquid from the heat dissipation plate (12) and the drag reduction plate (5) according to actual needs.

[0070] In one embodiment of the present invention, the liquid cooling heat dissipation device further includes a heat dissipation plate flow monitoring point (11), a drag-reducing plate flow monitoring point (3), a heat dissipation plate drain electric valve (10), and a drag-reducing plate drain electric valve (4); wherein, the heat dissipation plate flow monitoring point (11) and the drag-reducing plate flow monitoring point (3) are used to monitor the liquid flow of the heat dissipation plate (12) and the drag-reducing plate (5); the method further includes:

[0071] When the liquid flow rate in the heat dissipation plate (12) or the drag reduction plate (5) is less than the preset value, the valve opening of the heat dissipation plate inlet electric valve (9) or the drag reduction plate inlet electric valve (2) corresponding to the heat dissipation plate (12) or the drag reduction plate (5) is adjusted to the maximum.

[0072] If the liquid flow rate in the heat dissipation plate (12) or the drag reduction plate (5) is still less than the preset value, an alarm will be triggered indicating that the heat dissipation plate (12) or the drag reduction plate (5) is clogged and needs to be replaced.

[0073] When replacing the heat dissipation plate (12) or the drag reduction plate (5), close the heat dissipation plate inlet electric valve (9), the heat dissipation plate outlet electric valve (8), or the drag reduction plate inlet electric valve (2) and the drag reduction plate outlet electric valve (6) corresponding to the heat dissipation plate to be replaced.

[0074] Fully open the heat dissipation cold plate inlet electric valve (9), the heat dissipation cold plate outlet electric valve (8), or the drag reduction cold plate inlet electric valve (2), the drag reduction cold plate outlet electric valve (6) corresponding to the cold plate that does not need to be replaced, and open the heat dissipation cold plate drain electric valve (10) or the drag reduction cold plate drain electric valve (4) corresponding to the cold plate that needs to be replaced to discharge the residual liquid.

[0075] After the remaining liquid is drained, replace the cold plate that needs to be replaced.

[0076] In related technologies, when using cold plate liquid cooling, cold plate blockage often occurs in practical applications. Currently, for cold plates that have become blocked, due to their relatively precise structure, it is generally difficult to clear the cold plate flow channels manually. Therefore, the above problem is usually solved by replacing the cold plate with a spare part. However, the chip itself will overheat in a short time under the scenario of heat dissipation failure, and even the chip may burn out, making it impossible to achieve long-term stable operation of the cold plate.

[0077] To solve the above problems, in a specific implementation, the liquid cooling heat dissipation equipment may include a heat dissipation cold plate flow monitoring point (11), a drag reduction cold plate flow monitoring point (3), a heat dissipation cold plate drain electric valve (10), and a drag reduction cold plate drain electric valve (4); wherein, the heat dissipation cold plate flow monitoring point (11) and the drag reduction cold plate flow monitoring point (3) can be used to monitor the liquid flow of the heat dissipation cold plate (12) and the drag reduction cold plate (5); furthermore, when the flow of a certain branch liquid cooling cold plate is lower than the minimum set value, that is, less than the preset value, if the electric valve of the branch is fully opened and the phenomenon still cannot be improved, the system can determine that the cold plate of the branch has a dirt blockage phenomenon, and the system can then issue an alarm and prompt that the cold plate needs to be replaced. Taking the heat dissipation cold plate (12) branch as an example, before the operator executes the cold plate replacement command, the heat dissipation cold plate inlet electric valve (9) and heat dissipation cold plate outlet electric valve (8) of the heat dissipation cold plate (12) branch can be closed, and the branch valve of the drag reduction cold plate (5) can be fully opened to ensure normal heat dissipation of the system. At the same time, the system can open the heat dissipation cold plate drain electric valve (10), which can be connected to the drain pipe to discharge the residual fluid in the heat dissipation cold plate (12) branch. After the system issues the cold plate replacement command, the operator can replace the heat dissipation cold plate (12). After the cold plate is replaced, the system can clear the alarm and enter the normal adjustment process. This greatly improves the online maintenance efficiency of the cold plate and avoids the normal operation of the system being affected by the cold plate being dirty and clogged.

[0078] In one embodiment of the present invention, after the residual liquid is drained and the cold plate to be replaced is replaced, the method further includes:

[0079] After the replacement of the cold plate is completed, open the heat dissipation cold plate inlet electric valve (9), the heat dissipation cold plate outlet electric valve (8), or the drag reduction cold plate inlet electric valve (2), the drag reduction cold plate outlet electric valve (6) corresponding to the cold plate to be replaced, and deactivate the alarm.

[0080] In practical applications, after the replacement of the cold plate is completed, the system can open the heat dissipation cold plate inlet electric valve (9), the heat dissipation cold plate outlet electric valve (8), or the drag reduction cold plate inlet electric valve (2), the drag reduction cold plate outlet electric valve (6) corresponding to the cold plate to be replaced, and deactivate the alarm, thereby entering the normal adjustment process; thereby improving the online maintenance efficiency of the cold plate and avoiding the impact of cold plate dirt blockage on the normal operation of the system.

[0081] Based on the above, and for ease of understanding and to provide a more detailed explanation of the technical solution of this invention, please refer to... Figure 4The diagram shows an overall schematic of the liquid cooling heat dissipation device provided by the present invention. Its working principle can be summarized as follows: the liquid used for heat dissipation enters the liquid cooling heat dissipation device through the inlet (1), and then enters the drag-reducing cold plate (5) and the heat dissipation cold plate (12) through the drag-reducing cold plate inlet electric valve (2) and the heat dissipation cold plate inlet electric valve (9), respectively. Between the drag-reducing cold plate inlet electric valve (2) and the drag-reducing cold plate (5), there is a drag-reducing cold plate flow monitoring point (3) for detecting the liquid flow rate and a drag-reducing cold plate drain electric valve (4) for draining. Similarly, between the heat dissipation cold plate inlet electric valve (9) and the heat dissipation cold plate (12), there is a liquid flow monitoring point (3) for detecting the liquid flow rate and a drain electric valve (4) for draining. The flow monitoring point (11) of the heat dissipation plate is connected to the heat dissipation plate drain electric valve (10) for draining; after the liquid flows through the heat dissipation plate outlet electric valve (8) and the drag reduction plate outlet electric valve (6), it will be discharged through the liquid outlet (7); the bottom of the heat dissipation plate (12) can be connected to the heat distribution plate (15), and the heat distribution plate (15) is connected to the chip (13) through the interface material (16) and connected to the drag reduction plate (5) through the heat pipe (14), so that heat can be transferred to the heat dissipation plate (12) and the drag reduction plate (5) respectively to realize the real-time adjustment of the flow resistance and heat dissipation capacity of the liquid cooling heat dissipation equipment.

[0082] Reference Figure 5 This diagram illustrates a step flow of another liquid cooling method based on a liquid cooling heat dissipation device according to an embodiment of the present invention. The liquid cooling heat dissipation device includes a heat distribution plate (15), a heat dissipation plate (12), and a drag-reducing plate (5). One side of the heat distribution plate (15) is connected to the heat dissipation plate (12) and connected to the drag-reducing plate (5) through a heat pipe (14). The other side of the heat distribution plate (15) is connected to a chip (13). The heat distribution plate (15) is used to transfer the heat generated by the chip (13) to the heat dissipation plate (12) and the drag-reducing plate (5) respectively. Specifically, it may include the following steps:

[0083] Step 501: Monitor the temperature of the chip (13);

[0084] In practical applications, the heat generated by the chip (13) will be transferred to the heat distribution plate (15), and then transferred to the drag-reducing cold plate (5) with lower flow resistance and the heat dissipation cold plate (12) with stronger heat dissipation capacity through the heat distribution plate (15). The heat distribution plate (15) can transfer heat to the drag-reducing cold plate (5) through the heat pipe (14). Therefore, the temperature of the chip (13) can be monitored in real time so as to determine the corresponding heat dissipation and flow resistance requirements according to the actual temperature of the chip (13), thereby realizing the real-time control of the cold plate.

[0085] Step 502: When the temperature of the chip (13) exceeds the first threshold, reduce the liquid flow rate into the drag-reducing cold plate (5) and increase the liquid flow rate into the heat dissipation cold plate (12); wherein the heat dissipation cold plate (12) adopts a traditional shovel tooth straight channel design inside;

[0086] In specific implementation, the liquid flow rate of the drag-reducing cold plate (5) and the heat dissipation cold plate (12) can be controlled by electric valves respectively. For example, the control can be achieved by adjusting the valve opening, thereby realizing the adjustment of heat exchange capacity and flow resistance. When the chip power increases and the chip temperature exceeds the set temperature, i.e. the first threshold, the corresponding adjustment signal can be transmitted to the electric valve to reduce the liquid flow rate entering the drag-reducing cold plate (5) and increase the liquid flow rate entering the heat dissipation cold plate (12), thereby strengthening the chip heat dissipation capacity and maintaining the chip temperature within the set temperature range. This mode can be defined as strong heat exchange mode. The heat dissipation cold plate (12) can adopt a traditional toothed straight channel design. Since the heat exchange capacity of the traditional toothed straight channel design is strong, the heat dissipation cold plate (12) can be used as the main heat dissipation cold plate. However, the cold plate of the traditional toothed straight channel design generally has a large flow resistance. When the heat dissipation capacity required by the chip (13) is not high, it is easy to waste resources due to excessive flow resistance.

[0087] Step 503: When the temperature of the chip (13) is less than the second threshold, increase the liquid flow rate into the drag-reducing cold plate (5) and decrease the liquid flow rate into the heat dissipation cold plate (12); wherein the drag-reducing cold plate (5) adopts a discontinuous channel low flow resistance design based on Murray's law.

[0088] In practical applications, the liquid flow rates of the drag-reducing cold plate (5) and the heat dissipation cold plate (12) can be controlled by electric valves, for example, by adjusting the valve opening, thereby achieving the adjustment of heat exchange capacity and flow resistance. When the chip power decreases and the chip temperature is lower than the set temperature, i.e. the second threshold, the corresponding adjustment signal can be transmitted to the electric valve to increase the liquid flow rate entering the drag-reducing cold plate (5) and decrease the liquid flow rate entering the heat dissipation cold plate (12), so that more fluid flows through the drag-reducing cold plate (5) with lower flow resistance. At this time, flow resistance control is the main focus. On the basis of satisfying the chip heat dissipation, the system flow resistance is reduced. Therefore, this mode can be defined as a low flow resistance mode. Among them, the tooth spacing inside the drag-reducing cold plate (5) can be designed for low flow resistance using Murray's law: that is, the channel is a non-continuous channel and can be divided into multiple levels according to the requirements, and the tooth spacing gradually decreases along the fluid flow direction. The tooth spacing between adjacent levels needs to satisfy Murray's law, i.e.:

[0089] D1 3 =nD2 3

[0090] Where D1 is the tooth spacing of the upper-level channel, D2 is the tooth spacing of the lower-level channel, and n is the ratio of the number of lower-level channels to the number of upper-level channels.

[0091] As the temperature of the fluid inside the cold plate gradually increases along the flow direction, the heat exchange capacity gradually weakens, resulting in poor heat exchange capacity downstream of the cold plate channel. The drag-reducing cold plate (5) can be arranged in a way that gradually reduces the tooth spacing along the flow channel direction, which can not only enhance the heat exchange capacity downstream of the cold plate and achieve precise heat dissipation, but also maximize the effect of reducing flow resistance through the above design.

[0092] Based on the above, this application enables online switching and adjustment between strong heat exchange mode and low flow resistance mode, greatly improving the compatibility of this application.

[0093] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions involved are not necessarily essential to the embodiments of the present invention.

[0094] Reference Figure 6 This diagram illustrates a liquid cooling device based on a liquid cooling heat dissipation device according to an embodiment of the present invention. The liquid cooling heat dissipation device includes a heat distribution plate (15), a heat dissipation plate (12), and a drag-reducing plate (5). One side of the heat distribution plate (15) is connected to the heat dissipation plate (12) and connected to the drag-reducing plate (5) through a heat pipe (14). The other side of the heat distribution plate (15) is connected to a chip (13). The heat distribution plate (15) is used to transfer the heat generated by the chip (13) to the heat dissipation plate (12) and the drag-reducing plate (5) respectively. The device may specifically include the following modules:

[0095] Temperature monitoring module 601 is used to monitor the temperature of the chip (13);

[0096] The heat dissipation module 602 is used to reduce the liquid flow rate into the drag-reducing cold plate (5) and increase the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) exceeds a first threshold.

[0097] The drag reduction module 603 is used to increase the liquid flow rate into the drag reduction cold plate (5) and decrease the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) is less than the second threshold.

[0098] In another embodiment of the present invention, the liquid cooling heat dissipation device further includes a heat dissipation cold plate inlet electric valve (9) and a drag-reducing cold plate inlet electric valve (2); the heat dissipation module 602 includes:

[0099] The heat dissipation submodule is used to reduce the liquid flow into the drag-reducing cold plate (5) by adjusting the valve opening of the drag-reducing cold plate inlet electric valve (2) and increase the liquid flow into the heat dissipation cold plate (12) by adjusting the valve opening of the heat dissipation cold plate inlet electric valve (9) when the temperature of the chip (13) exceeds the first threshold.

[0100] The drag reduction module 603 includes:

[0101] The drag reduction submodule is used to increase the liquid flow rate into the drag reduction cold plate (5) by adjusting the valve opening of the drag reduction cold plate inlet electric valve (2) and decrease the liquid flow rate into the heat dissipation cold plate (12) by adjusting the valve opening of the heat dissipation cold plate inlet electric valve (9) when the temperature of the chip (13) is less than the second threshold.

[0102] In another embodiment of the present invention, the liquid cooling heat dissipation device further includes a heat dissipation plate outflow electric valve (8) and a drag-reducing plate outflow electric valve (6), wherein the heat dissipation plate outflow electric valve (8) is used to control the outflow of liquid in the heat dissipation plate (12), and the drag-reducing plate outflow electric valve (6) is used to control the outflow of liquid in the drag-reducing plate (5). The liquid cooling heat dissipation device further includes a heat dissipation plate flow monitoring point (11), a drag-reducing plate flow monitoring point (3), a heat dissipation plate drain electric valve (10), and a drag-reducing plate drain electric valve (4); wherein the heat dissipation plate flow monitoring point (11) and the drag-reducing plate flow monitoring point (3) are used to monitor the liquid flow of the heat dissipation plate (12) and the drag-reducing plate (5); the device further includes:

[0103] The flow adjustment module is used to adjust the valve opening of the heat dissipation plate (12) or the drag reduction plate (5) corresponding to the heat dissipation plate (12) or the drag reduction plate (5) to the maximum when the liquid flow rate in the heat dissipation plate (12) or the drag reduction plate (5) is less than the preset value.

[0104] The dirt blockage warning module is used to alarm if the liquid flow rate in the heat dissipation plate (12) or the drag reduction plate (5) is still less than the preset value, indicating that the heat dissipation plate (12) or the drag reduction plate (5) is dirty and needs to be replaced.

[0105] The cold plate replacement preparation module is used to close the inlet electric valve (9), outlet electric valve (8), inlet electric valve (2), and outlet electric valve (6) of the cold plate corresponding to the cold plate to be replaced when the heat dissipation cold plate (12) or the drag reduction cold plate (5) is being replaced.

[0106] The residual liquid discharge module is used to fully open the heat dissipation cold plate inlet electric valve (9), the heat dissipation cold plate outlet electric valve (8) or the drag-reducing cold plate inlet electric valve (2) or the drag-reducing cold plate outlet electric valve (6) corresponding to the cold plate that does not need to be replaced, and to open the heat dissipation cold plate drain electric valve (10) or the drag-reducing cold plate drain electric valve (4) corresponding to the cold plate that needs to be replaced to discharge the residual liquid;

[0107] The cold plate replacement module is used to replace the cold plate that needs to be replaced after the residual liquid has been drained.

[0108] In another embodiment of the present invention, the cold plate replacement module further includes:

[0109] The alarm deactivation submodule is used to activate the inlet electric valve (9), outlet electric valve (8), or inlet electric valve (2), outlet electric valve (6) of the heat dissipation cold plate corresponding to the cold plate to be replaced after the cold plate to be replaced has been replaced, and deactivate the alarm.

[0110] An embodiment of the present invention also provides an electronic device, which may include a processor, a memory, and a computer program stored in the memory and capable of running on the processor. When the computer program is executed by the processor, it implements the liquid cooling heat dissipation method based on the liquid cooling heat dissipation device as described above.

[0111] An embodiment of the present invention also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the liquid cooling heat dissipation method based on the liquid cooling heat dissipation device described above.

[0112] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0113] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0114] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, apparatus, or computer program products. Therefore, embodiments of the present invention can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of the present invention can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0115] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0116] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0117] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal equipment, causing a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0118] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present invention.

[0119] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes the aforementioned element.

[0120] The above provides a detailed description of a liquid cooling method and apparatus based on a liquid cooling heat dissipation device. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A liquid cooling heat dissipation method based on a liquid cooling heat dissipation device, characterized in that, The liquid cooling heat dissipation device includes a heat distribution plate (15), a heat dissipation plate (12), and a drag-reducing plate (5); one side of the heat distribution plate (15) is connected to the heat dissipation plate (12) and connected to the drag-reducing plate (5) through a heat pipe (14), and the other side of the heat distribution plate (15) is connected to the chip (13); wherein, the heat distribution plate (15) is used to transfer the heat generated by the chip (13) to the heat dissipation plate (12) and the drag-reducing plate (5) respectively; the method includes: Monitor the temperature of the chip (13); When the temperature of the chip (13) exceeds the first threshold, the liquid flow rate into the drag-reducing cold plate (5) is reduced and the liquid flow rate into the heat dissipation cold plate (12) is increased; When the temperature of the chip (13) is less than the second threshold, the liquid flow rate into the drag-reducing cold plate (5) is increased and the liquid flow rate into the heat dissipation cold plate (12) is decreased.

2. The method according to claim 1, characterized in that, The liquid cooling heat dissipation device further includes a heat dissipation cold plate inlet electric valve (9) and a drag-reducing cold plate inlet electric valve (2); the step of reducing the liquid flow rate into the drag-reducing cold plate (5) and increasing the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) exceeds the first threshold includes: When the temperature of the chip (13) exceeds the first threshold, the liquid flow rate into the drag-reducing cold plate (5) is reduced by adjusting the valve opening of the drag-reducing cold plate inlet electric valve (2) and the liquid flow rate into the heat dissipation cold plate (12) is increased by adjusting the valve opening of the heat dissipation cold plate inlet electric valve (9). The step of increasing the liquid flow rate into the drag-reducing cold plate (5) and decreasing the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) is less than the second threshold includes: When the temperature of the chip (13) is less than the second threshold, the liquid flow rate into the drag-reducing cold plate (5) is increased by adjusting the valve opening of the drag-reducing cold plate inlet electric valve (2), and the liquid flow rate into the heat dissipation cold plate (12) is reduced by adjusting the valve opening of the heat dissipation cold plate inlet electric valve (9).

3. The method according to claim 2, characterized in that, The liquid cooling heat dissipation device also includes a heat dissipation plate outflow electric valve (8) and a drag reduction plate outflow electric valve (6), wherein the heat dissipation plate outflow electric valve (8) is used to control the outflow of liquid in the heat dissipation plate (12), and the drag reduction plate outflow electric valve (6) is used to control the outflow of liquid in the drag reduction plate (5).

4. The method according to claim 3, characterized in that, The liquid cooling heat dissipation device further includes a heat dissipation plate flow monitoring point (11), a drag-reducing plate flow monitoring point (3), a heat dissipation plate drain electric valve (10), and a drag-reducing plate drain electric valve (4); wherein, the heat dissipation plate flow monitoring point (11) and the drag-reducing plate flow monitoring point (3) are used to monitor the liquid flow of the heat dissipation plate (12) and the drag-reducing plate (5); the method further includes: When the liquid flow rate in the heat dissipation plate (12) or the drag reduction plate (5) is less than the preset value, the valve opening of the heat dissipation plate inlet electric valve (9) or the drag reduction plate inlet electric valve (2) corresponding to the heat dissipation plate (12) or the drag reduction plate (5) is adjusted to the maximum. If the liquid flow rate in the heat dissipation plate (12) or the drag reduction plate (5) is still less than the preset value, an alarm will be triggered indicating that the heat dissipation plate (12) or the drag reduction plate (5) is clogged and needs to be replaced. When replacing the heat dissipation plate (12) or the drag reduction plate (5), close the heat dissipation plate inlet electric valve (9), the heat dissipation plate outlet electric valve (8), or the drag reduction plate inlet electric valve (2) and the drag reduction plate outlet electric valve (6) corresponding to the heat dissipation plate to be replaced. Fully open the heat dissipation cold plate inlet electric valve (9), the heat dissipation cold plate outlet electric valve (8), or the drag reduction cold plate inlet electric valve (2), the drag reduction cold plate outlet electric valve (6) corresponding to the cold plate that does not need to be replaced, and open the heat dissipation cold plate drain electric valve (10) or the drag reduction cold plate drain electric valve (4) corresponding to the cold plate that needs to be replaced to discharge the residual liquid. After the remaining liquid is drained, replace the cold plate that needs to be replaced.

5. The method according to claim 4, characterized in that, After the residual liquid is drained and the cold plate that needs to be replaced is replaced, the process further includes: After the replacement of the cold plate is completed, open the heat dissipation cold plate inlet electric valve (9), the heat dissipation cold plate outlet electric valve (8), or the drag reduction cold plate inlet electric valve (2), the drag reduction cold plate outlet electric valve (6) corresponding to the cold plate to be replaced, and deactivate the alarm.

6. The method according to any one of claims 1-5, characterized in that, The heat distribution plate (15) is connected to the chip (13) through an interface material (16), which is used to eliminate the contact thermal resistance between the heat distribution plate (15) and the chip (13).

7. The method according to claim 6, characterized in that, The heat dissipation plate (12) adopts a traditional shovel tooth straight channel design inside.

8. The method according to claim 7, characterized in that, The drag-reducing cold plate (5) adopts a low flow resistance design with discontinuous channels based on Murray's law.

9. A liquid cooling heat dissipation device based on liquid cooling heat dissipation equipment, characterized in that, The liquid cooling heat dissipation device includes a heat distribution plate (15), a heat dissipation plate (12), and a drag-reducing plate (5); one side of the heat distribution plate (15) is connected to the heat dissipation plate (12) and connected to the drag-reducing plate (5) through a heat pipe (14), and the other side of the heat distribution plate (15) is connected to the chip (13); wherein, the heat distribution plate (15) is used to transfer the heat generated by the chip (13) to the heat dissipation plate (12) and the drag-reducing plate (5) respectively; the device includes: A temperature monitoring module is used to monitor the temperature of the chip (13); A heat dissipation module is used to reduce the liquid flow rate into the drag-reducing cold plate (5) and increase the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) exceeds a first threshold. The drag reduction module is used to increase the liquid flow rate into the drag reduction cold plate (5) and decrease the liquid flow rate into the heat dissipation cold plate (12) when the temperature of the chip (13) is less than the second threshold.

10. An electronic device, characterized in that, It includes a processor, a memory, and a computer program stored in the memory and capable of running on the processor, wherein when the computer program is executed by the processor, it implements the liquid cooling method based on the liquid cooling device as described in any one of claims 1 to 8.

11. A computer-readable storage medium, characterized in that, A computer program is stored on the computer-readable storage medium, and when executed by a processor, the computer program implements the liquid cooling heat dissipation method based on the liquid cooling heat dissipation device as described in any one of claims 1 to 8.

Images