High-performance ferrite tile wheel profile polishing device and polishing method thereof

Abstract

The application discloses a high-performance ferrite tile wheel profile polishing device and a polishing method thereof, and belongs to the technical field of tile production. The device comprises a cleaning and drying unit, a spiral vibration unit and a grinding material feeding unit. The grinding material feeding unit comprises a base, a feeding straight vibrator and a stock bin arranged on the base. The feeding straight vibrator is arranged above the base, and the stock bin is arranged above the feeding straight vibrator. The stock bin is provided with an inclined guide chute, the guide chute is inclined and extends above the spiral vibration unit, and the stock bin stores the grinding material. The grinding material is intermittently conveyed into the spiral vibration unit by the feeding straight vibrator. The grinding material is inorganic material with Mohs hardness not more than 5, and is selected from BaSO4, CaSiO4, CaSiO3 and gamma-AlOOH. The particle size of the above-mentioned materials is 0.5-1.0 mm.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of magnetic tile production, and more particularly relates to a high-performance ferrite magnetic tile profile grinding device and a grinding method thereof. BACKGROUND

[0002] Ferrite is a kind of magnetic component with iron oxide as the main raw material, which is widely used in automobiles, household appliances and power tools. In recent years, with the change of household appliance motors from alternating current to direct current, the demand for ferrite components has increased significantly. Currently, ferrite magnetic tiles are mainly used in permanent magnet DC motors. Unlike electromagnetic motors that generate magnetic potential source through excitation coils, permanent magnet motors generate constant magnetic potential source with permanent magnet materials. Permanent magnet magnetic tiles have many advantages, such as simple motor structure, easy maintenance and light weight.

[0003] At present, after the ferrite magnetic tile completes the pressing forming and sintering process, it enters the grinding process. The ferrite magnetic tile grinding process steps include: 1) grinding the two end faces of the shaft length with a double-end face grinder; 2) grinding the chord width and bottom plane of the magnetic tile with a single-station grinder; 3) grinding the inner and outer circular arc chamfers of the two end faces of the shaft length with a four-station automatic chamfer grinder; 4) coarsely grinding the inner and outer arcs of the magnetic tile with a double-station through-type tile-shaped magnet grinder; 5) precisely grinding the inner arc of the magnetic tile with a single-station through-type tile-shaped magnet grinder; 6) precisely grinding the outer arc of the magnetic tile with a single-station through-type tile-shaped magnet grinder; and 7) turning a 4R angle on the magnetic tile product. However, the magnetic tile after precision grinding has a relatively rough surface, and some products with high requirements for the magnetic tile profile need to be polished and ground again.

[0004] After searching, patent document 1: Chinese patent CN212170033U discloses a spiral vibration polishing device for ferrite magnetic tile processing, which comprises a polishing device, a stable plate is fixedly welded outside the polishing device, a connecting buckle ring is fixedly connected to the outer surface of the stable plate, a limiting rod is fixedly connected to the outside of the connecting buckle ring, an oscillating spring rod is fixedly connected to the bottom of the polishing device, and a bottom support table is fixedly installed at the bottom of the oscillating spring rod. According to the structure disclosed in the patent, the polishing and grinding are realized by the mutual collision between the vertical arc-shaped abrasive, the inclined abrasive and the magnetic tile. However, it is found that the roughness of the magnetic tile profile is still high, which cannot meet the requirements of products with high requirements for the magnetic tile profile.

[0005] Patent document 2: Chinese patent CN114310537A discloses a magnetic material manufacturing method, which comprises the following steps:

[0006] Step one, the raw material is pressed into a tile-shaped piece by a pressing device; step two, the tile-shaped piece side is polished using a polishing device; step three, the edge-polished tile-shaped piece is magnetized to obtain a tile-shaped magnetic material; the polishing device comprises a table frame, a connecting seat, a polishing head, a polishing frame and a mounting frame, the connecting seat is connected to the polishing frame, the polishing head rotates on the connecting seat, the mounting frame for mounting the tile-shaped piece is longitudinally connected to the middle part of the table frame, and the polishing frame for adjusting the position of the polishing head is transversely connected to the table frame.

[0007] Patent document 3: Chinese patent CN116330079A discloses a burr removing device, which comprises a mounting plate, a support frame and a gas cylinder, etc. The support frame is fixedly connected to the bottom of the mounting plate, and the gas cylinder is fixedly connected to the top of the mounting plate through a shelf. The magnetic material is moved to contact the clamping belt from the right side, and then the first motor is started to rotate in the forward direction to drive the magnetic material to move to the left, and the magnetic material is clamped and fixed. When the magnetic material moves to the left to the appropriate position, the burr removing process is started by rotating the adjustable polishing plate to remove the burr of the magnetic material. SUMMARY

[0008] 1. Problem to be solved

[0009] In view of the problem that the profile polishing roughness of the above-mentioned magnetic tile cannot meet the use requirements, the present application provides a high-performance ferrite magnetic tile profile polishing device to improve the profile smoothness of the ferrite magnetic tile and ensure that the use requirements are met.

[0010] Another object of the present application is to provide a polishing method of the high-performance ferrite magnetic tile profile polishing device.

[0011] 2. Technical solution

[0012] In order to solve the above-mentioned problems, the technical solution adopted by the present application is as follows:

[0013] The present application provides a high-performance ferrite magnetic tile profile polishing device, which comprises:

[0014] A cleaning and drying unit is used to clean the ferrite magnetic tile after grinding and to remove the surface moisture of the ferrite magnetic tile;

[0015] A spiral vibration unit is used to receive the ferrite magnetic tile obtained by the cleaning and drying unit, and to provide vibration for the ferrite magnetic tile and to drive the output of the ferrite magnetic tile in a spiral manner;

[0016] The abrasive feeding unit comprises a base, a feeding vibrator arranged above the base, and a hopper arranged above the feeding vibrator, the hopper is provided with an inclined guide chute, the guide chute is inclinedly extended above the spiral vibration unit, the hopper stores the abrasive, the abrasive is inorganic material with Mohs hardness not more than 5, and is selected from BaSO4, CaSiO4, CaSiO3 or γ-AlOOH, and the particle size of the above-mentioned material is 0.5-1.0 mm.

[0017] According to any one of the embodiments of the first aspect of the present application, the center line of the guide chute is coincident with the center line of the spiral vibration unit.

[0018] According to any one of the embodiments of the first aspect of the present application, the spiral vibration unit comprises a spiral vibration mechanism, the spiral vibration mechanism comprises a frame, a vibration disc, a spiral track, a track outlet, and a slide rail, the vibration disc is arranged on the frame, the spiral track is arranged on the inner side of the vibration disc, the track outlet is arranged at the end of the spiral track, and the slide rail is arranged on the top surface of the vibration disc.

[0019] According to any one of the embodiments of the first aspect of the present application, the outlet of the guide chute is arranged at the edge of the vibration disc, and the distance between the outlet and the vibration disc is 5-10 mm.

[0020] According to any one of the embodiments of the first aspect of the present application, the abrasive feeding unit further comprises a protection unit, the protection unit comprises a protection cover, the protection cover can cover the spiral vibration unit and the abrasive feeding unit, and can effectively inhibit dust generated by vibration.

[0021] According to any one of the embodiments of the first aspect of the present application, the cleaning and drying unit comprises an ultrasonic cleaning part and a hot air drying part, the ultrasonic cleaning part comprises a water tank, an ultrasonic generator, and a chain plate, the ultrasonic generator is arranged on both sides of the water tank, and the chain plate is arranged in the water tank; the hot air drying part comprises a hot air pipe and a drying chamber, the hot air pipe is arranged around the upper part of the drying chamber, and the chain plate passes through the drying chamber. Through low-temperature drying (100-150 DEG C) of the cleaning and drying machine, the residual moisture on the surface of the ferrite magnetic tile can be effectively removed, and the adsorbed water on the surface of the magnetic tile can also be removed.

[0022] According to any one of the embodiments of the first aspect of the present application, the particle size of the abrasive is 0.8 mm.

[0023] According to any one of the embodiments of the first aspect of the present application, the inclination angle of the guide chute is 10-15 DEG (the included angle with the horizontal plane), and preferably 12 DEG.

[0024] The second aspect of the present application provides a polishing method of a high-performance ferrite tile profile polishing device, comprising the steps of:

[0025] S1, cleaning and drying the ground ferrite tile to remove the surface residual moisture;

[0026] S2, opening the grinding material feeding unit to add grinding material to the spiral vibration unit, the grinding material is an inorganic material with a Mohs hardness of not more than 5, and the ferrite tile obtained from S1 is added to the spiral vibration unit,

[0027] S3, setting the vibration frequency of the spiral vibration unit to 150-220HZ, and the vibration frequency of the grinding material feeding unit is 10min / time.

[0028] According to any embodiment of the second aspect of the present application, the grinding material is selected from BaSO4, CaSiO4, CaSiO3 or γ-AlOOH, and the particle size is 0.5-1.0mm.

[0029] 3. Beneficial effects

[0030] Compared with the prior art, the beneficial effects of the present application are:

[0031] (1) The high-performance ferrite tile profile polishing device of the present application uses grinding material with a Mohs hardness of not more than 5, which can effectively remove the tiny burrs generated on the edge of the ferrite tile due to grinding, meeting the use requirements of the ferrite tile; the hardness of the small particle grinding material does not exceed the hardness of the ferrite tile itself (the hardness is higher after sintering, generally around 8 or even higher), and the grinding material is subjected to vibration in a microscopic state, constantly extruding and rubbing the ferrite tile to polish the tiny burrs (observed under a microscope, the tiny burrs are part of the protrusions);

[0032] (2) The high-performance ferrite tile profile polishing device of the present application, the falling point of the grinding material from the guide chute is located on the center line of the spiral vibration unit, and then spreads to both sides, maximizing the grinding material without accumulation. BRIEF DESCRIPTION OF DRAWINGS

[0033] The technical solutions of the present application will be further described in detail below in combination with the drawings and examples, but it should be known that these drawings are designed only for explanatory purposes, and therefore do not limit the scope of the present application. In addition, unless specifically indicated, these drawings are only intended to conceptually illustrate the structural configuration described herein, and do not necessarily be drawn to scale.

[0034] Figure 1 The structure of the high-performance ferrite tile profile polishing device of the present application is shown in the figure;

[0035] Figure 2 The cleaning and drying unit structure diagram of the high-performance ferrite magnetic tile profile polishing device of the present application;

[0036] Figure 3 The spiral vibration unit structure diagram of the high-performance ferrite magnetic tile profile polishing device of the present application;

[0037] Figure 4 The abrasive feeding unit structure diagram of the high-performance ferrite magnetic tile profile polishing device of the present application;

[0038] Explanation of reference signs:

[0039] 10, cleaning and drying unit; 11, ultrasonic cleaning part; 12, hot air drying part; 13, water tank; 14, ultrasonic transmitter; 15, chain plate; 16, hot air pipe; 17, drying chamber; 18, conveying belt;

[0040] 20, spiral vibration unit; 21, rack; 22, vibration disc; 23, spiral track; 24, track outlet; 25, sliding rail;

[0041] 30, abrasive feeding unit; 31, base; 32, feeding straight vibrator; 33, material bin; 331, material guide groove;

[0042] 40, protection unit, 41, protective cover. DETAILED DESCRIPTION

[0043] The exemplary embodiments of the present application are described in detail below. Although these exemplary embodiments are described in sufficient detail to enable those skilled in the art to practice the application, it should be understood that other embodiments can be realized and that various changes can be made to the embodiments described herein without departing from the spirit and scope of the present application. The detailed description of the embodiments of the present application in the following is not intended to limit the scope of the claimed application, but merely to provide examples for illustration and description of the features and characteristics of the present application, to propose the best way to carry out the present application, and to enable those skilled in the art to carry out the present application. Therefore, the scope of the present application is only limited by the appended claims.

[0044] The raw materials used in the present application are purchased from the market as special instructions.

[0045] As Figures 1 to 4As shown, the high-performance ferrite tile profile polishing device of the embodiment comprises a cleaning and drying unit 10 for cleaning and removing surface moisture of the ferrite tile for grinding; a spiral vibration unit 20 for receiving the ferrite tile from the cleaning and drying unit 10, providing vibration and spiral driving output for the ferrite tile, the ferrite tile from the cleaning and drying unit 10 can be manually carried to the spiral vibration unit 20, or conveyed by a conveying belt 18, as shown. Figure 1 As shown.

[0046] and a grinding material feeding unit 30, as shown. Figure 4 The grinding material feeding unit 30 comprises a base 31, a feeding vibrator 32 arranged above the base 31, and a bin 33 arranged above the feeding vibrator 32, the bin 33 is provided with an inclined guide groove 331, the inclination angle of the guide groove 331 is 10-15° (the included angle with the horizontal plane), and the specific angles are 10°, 11°, 12°, 13°, 14° and 15°; the guide groove 331 extends obliquely above the spiral vibration unit 20, the bin 33 stores grinding material, and the grinding material is intermittently conveyed into the spiral vibration unit 20 by the feeding vibrator 32.

[0047] In the embodiment, the grinding material is an inorganic material with Mohs hardness not more than 5, and BaSO4, CaSiO4, CaSiO3 or γ-AlOOH is selected, the particle size of the above-mentioned materials is 0.5-1.0 mm, and the specific particle sizes are 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm and 1.0 mm.

[0048] and a protection unit 40, the protection unit 40 comprises a protection cover 41, the protection cover 41 can cover the spiral vibration mechanism and the grinding material feeding unit 30, effectively inhibiting the dust generated by vibration, the material of the protection cover 41 is PVC material, the transparent structure facilitates the operator to observe the internal situation, and the protection cover 41 has high toughness and can block the splashed grinding material.

[0049] In the embodiment, as shown, Figure 1 the center line of the guide groove 331 coincides with the center line of the spiral vibration unit 20, the landing point of the grinding material from the guide groove 331 is located on the center line of the spiral vibration unit 20, and then spreads to both sides, so that the accumulation of the grinding material is minimized.

[0050] In the embodiment, as shown, Figure 3As shown, the spiral vibration unit 20 includes a spiral vibration mechanism, which includes a rack 21, a vibration disc 22, a spiral track 23, a track outlet 24, and a sliding track 25. The vibration disc 22 is installed on the rack 21, the spiral track 23 is installed on the inside of the vibration disc 22, the track outlet 24 is located at the end of the spiral track 23, and is placed on the top surface of the vibration disc 22 and connected to the sliding track 25.

[0051] In combination Figure 1 As shown, the outlet of the material guide groove 331 is located inside the edge of the vibration disc 22, and the distance from the height of the vibration disc 22 is 5-10 mm, specifically 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, and 10 mm, which can well send the grinding material to the inside of the vibration disc 22.

[0052] Further, as Figure 2 As shown, the cleaning and drying unit 10 includes an ultrasonic cleaning part 11 and a hot air drying part 12. The ultrasonic cleaning part 11 includes a water tank 13, an ultrasonic generator 14, and a chain plate 15. The ultrasonic generator is placed on both sides of the water tank 13, and the chain plate 15 is placed in the water tank 13. The water tank stores clean water, such as tap water. The hot air drying part 12 includes a hot air pipe 16 and a drying chamber 17. The hot air pipe 16 is placed around the upper part of the drying chamber 17, and the chain plate 15 passes through the drying chamber 17.

[0053] Through the low-temperature drying (100-150℃, such as 100℃, 110℃, 120℃, 130℃, 140℃, and 150℃) of the cleaning and drying machine, the water remaining on the surface of the ferrite magnet tile can be effectively removed, and the adsorbed water on the shallow surface of the magnet tile can also be removed.

[0054] In addition, the cleaning and drying unit 10 can also use steam drying (100-150℃, such as 100℃, 110℃, 120℃, 130℃, 140℃, and 150℃) and other methods.

[0055] The addition amount of the grinding material is 0.5kg / 10kg-0.8kg / 10kg of magnet tile. Using inorganic materials with Mohs hardness not exceeding 5, the tiny burrs generated on the edge of the magnet tile during grinding can be effectively removed, meeting the use requirements of the magnet tile. However, the inventors surprisingly found that during the subsequent performance test of the ferrite magnet tile, the performance of the ferrite magnet tile treated by the grinding material was improved (compared with other grinding material treatments, such as the magnet tile obtained in the patent document 1), especially when multiple magnet tiles were used as components of a permanent magnet motor, under the premise that the volume did not change and no other treatment was performed, the eddy current loss of the permanent magnet motor at high frequency was reduced by about 0.05-0.08%.

[0056] The inventor thinks that the possible reason is that the hardness of the small-particle abrasive is not higher than the hardness of the magnetic tile itself (the hardness after sintering is higher, generally about 8 or even higher), the abrasive is subjected to vibration, is constantly pressed and rubbed against the magnetic tile, and polishes the small burrs (the small burrs are part of protrusions observed under a microscope); meanwhile, the abrasive is pressed and polished to generate small particles, the particles have good insulation performance, are adhered to the surface of the ferrite magnetic tile, or even partially enter the holes on the surface, and form an effective insulation layer between the ferrite magnetic tiles, thereby improving the resistance of the magnetic tile and effectively reducing the eddy current loss at high frequency.

[0057] Furthermore, the abrasive has a small particle size and can be partially adhered to the surface of the ferrite magnetic tile, so that the ferrite magnetic tile is not directly exposed to the air environment and is not easily corroded by moisture, thereby having a certain rust-proof effect on the magnetic tile and prolonging the service life of the magnetic tile.

[0058] Specifically, the high-performance ferrite magnetic tile contour polishing device has a polishing method including the following steps: cleaning and drying (at a temperature of 100-150 DEG C) the ground ferrite magnetic tile to remove the residual moisture on the surface; and treating the ferrite magnetic tile with a vibrating disc 22 and an abrasive, wherein the abrasive is an inorganic material with a Mohs hardness of not more than 5, and is selected from BaSO4, CaSiO4, CaSiO3 or gamma-AlOOH, and the particle size of the above-mentioned materials is 0.5-1.0 mm.

[0059] The ferrite magnetic tile obtained by the application has a magnetic property Br of 460 mT, Hcb of 340 kA / m, Hcj of 392 kA / m, and (BH)max of 39.4 kJ / m 3 .

[0060] It should be noted that the above specific embodiments are intended to prove the practical application of the application and do not limit the protection scope of the application. Those skilled in the art can make various modifications, replacements or improvements within the spirit and principles of the application. The protection scope of the application is subject to the appended claims.

Claims

1. A grinding method of a high-performance ferrite tile wheel profile grinding device, characterized by, The method comprises the steps of: S1, cleaning and drying the ground ferrite tile to remove surface residual moisture; S2, opening the grinding material feeding unit (30) to add grinding material to the spiral vibration unit (20), the grinding material being an inorganic material with a Mohs hardness of not more than 5, and adding the ferrite tile obtained from S1 to the spiral vibration unit (20), S3, setting the vibration frequency of the spiral vibration unit (20) to 150-220 HZ, and the vibration frequency of the grinding material feeding unit (30) to 10 min / time; The high-performance ferrite tile contour polishing device comprises: a cleaning and drying unit (10) for cleaning and removing surface moisture of the ground ferrite tile; a spiral vibration unit (20) for receiving the ferrite tile obtained from the cleaning and drying unit (10) and providing vibration and spiral driving output for the ferrite tile; characterized in that and a grinding material feeding unit (30) comprising a base (31), a feeding straight vibrator (32), and a material bin (33) disposed on the base (31), the feeding straight vibrator (32) being disposed above the base (31), the material bin (33) being disposed above the feeding straight vibrator (32), the material bin (33) being provided with an inclined guide chute (331) extending obliquely above the spiral vibration unit (20), the material bin (33) storing grinding material, and the grinding material being intermittently conveyed into the spiral vibration unit (20) by the feeding straight vibrator (32); the grinding material being an inorganic material with a Mohs hardness of not more than 5, selected from one of BaSO4, CaSiO4, CaSiO3, or γ-AlOOH, and having a particle size of 0.5-1.0 mm.

2. The polishing method of a high-performance ferrite tile wheel profile polishing device according to claim 1, characterized in that, The center line of the guide chute (331) coincides with the center line of the spiral vibration unit (20).

3. The polishing method of a high-performance ferrite tile wheel profile polishing device according to claim 1 or 2, characterized in that, The spiral vibration unit (20) comprises a spiral vibration mechanism comprising a rack (21), a vibration disc (22), a spiral track (23), a track outlet (24), and a sliding track (25), the vibration disc (22) being installed on the rack (21), the spiral track (23) being installed on the inner side of the vibration disc (22), the track outlet (24) being located at the end of the spiral track (23) and disposed on the top surface of the vibration disc (22) and connected to the sliding track (25).

4. The method of claim 3, wherein the high-performance ferrite tile profile grinding apparatus is characterized by: The outlet of the guide chute is located at the edge of the vibration disc (22) and is 5-10 mm away from the height of the vibration disc (22).

5. The method of claim 4, wherein the high-performance ferrite tile profile grinding apparatus is characterized by: Further comprising a protection unit, the protection unit (40) comprising a protective cover (41) capable of covering the spiral vibration unit (20) and the grinding material feeding unit (30).

6. The polishing method of a high-performance ferrite tile wheel profile polishing device according to claim 1 or 2, characterized in that, The cleaning and drying unit (10) comprises an ultrasonic cleaning part (11) and a hot air drying part (12), the ultrasonic cleaning part (11) comprises a water tank (13), ultrasonic emitters (14) and a chain plate (15), the ultrasonic emitters (14) are arranged on both sides of the water tank (13), and the chain plate (15) is arranged in the water tank (13); the hot air drying part (12) comprises a hot air pipe (16) and a drying chamber (17), the hot air pipe (16) is arranged around the upper portion of the drying chamber (17), and the chain plate (15) passes through the drying chamber (17).

7. The method of claim 6, wherein the high-performance ferrite tile wheel profile grinding apparatus is characterized by: The inclination angle of the material guide groove is 10-15°.

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