A silicon wafer loading and conveying device

Abstract

The present invention discloses a wafer loading and conveying device. The frame conveying module is used to convey the frame to the slicing module. The slicing module includes a water spraying part and a vertical conveying part. The water spraying part is used to spray water on the wafers in the frame for slicing, and the vertical conveying part is used to convey the sliced wafers one by one upward in a vertical posture. The flipping and conveying module is used to receive the wafers in a vertical posture conveyed by the vertical conveying part and flip the wafers from a vertical posture to a horizontal posture. The horizontal conveying module is used to receive the wafers in a horizontal posture conveyed by the flipping and conveying module and convey the wafers in a horizontal posture to the inserting module. The inserting module is used to insert the wafers conveyed by the horizontal conveying module. The frame conveying module, the slicing module, the flipping and conveying module, the horizontal conveying module, and the inserting module are arranged in sequence along the length direction of the frame. This loading and conveying device realizes the automatic slicing, flipping, and inserting of wafers, improving the reliability and efficiency of wafer slicing and loading.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic technology, and in particular, to a wafer loading and conveying device. Background Art

[0002] In the production process of wafers, first, a silicon rod is cut into wafers by a wire sawing machine. At this time, the wafers are pasted on a crystal carrier by a resin plate. Then, the crystal carrier and the cut wafers are placed in a material box together, and the material box transports the crystal carrier and the wafers to a degumming station together. A degumming machine is used to separate the crystal carrier from the wafers, and then the wafers are sequentially conveyed to subsequent workstations such as wafer insertion, cleaning, and drying.

[0003] In the prior art, the material box clamps and limits the wafers as a whole. When performing piecemeal feeding of the wafers in the material box before wafer insertion, the material box releases the clamping of all the wafers. Then, workers take out the wafers vertically placed in the material box, and then manually turn the wafers 90° and place them horizontally in a small material carrier, and then perform subsequent feeding operations. Since all the wafers are released from the limit during feeding, the wafers that have not been fed are likely to tilt and squeeze in the material box, resulting in fragmentation or hidden cracks of the wafers, seriously damaging the quality of the wafers. Moreover, during the entire wafer transfer process, workers need to perform operations such as piecemeal separation of the wafers and transfer the wafers between different workstations, with low reliability and low efficiency.

[0004] The above information disclosed in this background art is only used to increase the understanding of the background art of the present application. Therefore, it may include prior art that is not known to those of ordinary skill in the art. Summary of the Invention

[0005] In view of the problems pointed out in the background art, the present invention proposes a wafer loading and conveying device to realize the automatic transfer of wafers at the degumming station, piecemeal separation station, flipping station, and wafer insertion station. The loading and conveying device integrates the above functions into an integrated structure, which is novel and compact, realizes automatic piecemeal separation, flipping, and insertion of wafers, greatly improves work efficiency, and improves the quality reliability of wafers during operation.

[0006] To achieve the above invention object, the present invention adopts the following technical solutions:

[0007] The present invention provides a wafer loading and conveying device, including:

[0008] A material box for containing multiple cut wafers. The multiple wafers are divided into multiple wafer groups, and an outlet for discharging the wafers is provided at one end of the material box;

[0009] A material box conveying module for conveying the material box to a piecemeal separation module;

[0010] The slicing module includes a water spraying part and a vertical conveying part. The water spraying part is used to spray water on the wafers in the material frame in units of wafer groups to slice multiple wafers in the wafer group. The vertical conveying part is used to convey the sliced wafers upward one by one in a vertical posture.

[0011] The flipping and conveying module is used to receive the wafers in a vertical posture conveyed by the vertical conveying part and flip the wafers from a vertical posture to a horizontal posture.

[0012] The horizontal conveying module is used to receive the wafers in a horizontal posture conveyed by the flipping and conveying module and convey the wafers to the inserting module in a horizontal posture.

[0013] The inserting module is used to insert the wafers conveyed by the horizontal conveying module.

[0014] The frame forms a water tank with an open top inside. The material frame conveying module, the slicing module, the flipping and conveying module, the horizontal conveying module, and the inserting module are arranged in sequence along the length direction of the frame.

[0015] In some embodiments, the material frame conveying module includes a conveying track, a moving frame, and a driving mechanism. The conveying track is arranged at the bottom of the water tank and extends along the length direction of the water tank. The driving mechanism is used to drive the moving frame to move along the length direction of the water tank. The moving frame is connected to the material frame to drive the material frame to move synchronously.

[0016] In some embodiments, the vertical conveying part includes a first mounting frame. An adsorption part and a vertical conveyor belt are arranged on the first mounting frame. The adsorption part is used to adsorb the sliced wafers onto the vertical conveyor belt, and the vertical conveyor belt drives the wafers to move upward in a vertical posture.

[0017] In some embodiments, the adsorption part includes an adsorption area and an auxiliary conveying area. The auxiliary conveying area is arranged above and below the adsorption area. The adsorption area is used to provide an adsorption force to the wafers to adsorb the wafers onto the vertical conveyor belt. The auxiliary conveying area is in rolling contact with the wafers to assist the wafers to move upward in a vertical posture.

[0018] In some embodiments, the water spraying part is arranged on the first mounting frame, and the water spraying part is located on opposite sides of the vertical conveying part.

[0019] In some embodiments, the flipping and conveying module includes a flipping auxiliary part and a rubber-coated rolling wheel. The flipping auxiliary part includes a second mounting bracket, on which a blowing part is provided. The blowing part is located above the vertical conveying part and is used to blow air onto the vertical silicon wafers conveyed upward by the vertical conveying part, so that the silicon wafers are tilted onto the rubber-coated rolling wheel, and the rubber-coated rolling wheel drives the silicon wafers to move to a horizontal posture.

[0020] In some embodiments, a sub-bracket is further provided on the second mounting bracket, and a pressing wheel is arranged on the sub-bracket. The pressing wheel is located in front of the vertical conveying part and is used to press the silicon wafers against the vertical conveying part.

[0021] In some embodiments, multiple cut silicon wafers are pasted on a crystal carrier, and the crystal carrier and the multiple silicon wafers are placed into the material frame together;

[0022] The material frame includes an upper frame and a lower frame. The upper frame is detachably arranged above the lower frame. The upper frame is provided with a limiting structure for limiting the crystal carrier, and the lower frame is provided with a clamping assembly for limiting the silicon wafers;

[0023] The material frame conveying module is provided with a limiting structure for limiting the lower frame;

[0024] The lower frame is lifted away from the upper frame to separate the crystal carrier from the silicon wafers, and the material frame conveying module conveys the lower frame to the slicing module.

[0025] In some embodiments, the clamping assembly includes a plurality of clamping parts arranged in sequence along the length direction of the material frame. The plurality of clamping parts correspond to a plurality of groups of silicon wafers one by one to clamp the corresponding groups of silicon wafers;

[0026] The silicon wafer loading and conveying device further includes an unlocking device. The material frame conveying module conveys the lower frame horizontally in a direction close to the unlocking device. The plurality of clamping parts sequentially contact the unlocking device with the relative movement between the lower frame and the unlocking device. The unlocking device applies an external force to the clamping parts to make the clamping parts move away from the corresponding groups of silicon wafers.

[0027] In some embodiments, the clamping part includes a second pin shaft that passes through the lower frame. An unlocking block is provided at the first end of the second pin shaft, and a clamping block is provided at the second end of the second pin shaft. A spring is sleeved on the second pin shaft, and the spring is located between the clamping block and the lower frame; each unlocking block moves away from the silicon wafers under the action of the unlocking device, driving the corresponding clamping block to move away from the corresponding group of silicon wafers.

[0028] Compared with the prior art, the advantages and positive effects of the present invention are as follows:

[0029] In the silicon wafer loading and conveying device of the present application, the material frame conveying module, the slicing module, the flipping conveying module, the horizontal conveying module, and the inserting module are arranged in a straight line, facilitating the automatic transfer of silicon wafers between the modules. This loading and conveying device integrates the above functions into an integrated structure, which is novel and compact, realizing the automatic slicing, flipping, and inserting of silicon wafers, greatly improving the working efficiency and the quality reliability of silicon wafers during operation.

[0030] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become clearer. Brief Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0032] Figure 1 Structural layout diagram of the silicon wafer loading device according to the embodiment;

[0033] Figure 2 Structural schematic diagram of the frame and the material frame conveying module according to the embodiment;

[0034] Figure 3 Structural schematic diagram of the material frame conveying module according to the embodiment;

[0035] Figure 4 Structural schematic diagram of the slicing module according to the embodiment;

[0036] Figure 5 Structural schematic diagram of the flipping auxiliary part according to the embodiment;

[0037] Figure 6 Structural schematic diagram of the slicing module and the flipping auxiliary part according to the embodiment;

[0038] Figure 7 Structural schematic diagram of the slicing module, the flipping conveying module, and the horizontal conveying module according to the embodiment;

[0039] Figure 8 Structural schematic diagram of the cleaning part according to the embodiment;

[0040] Figure 9 Schematic diagram of the relative position of the cleaning part and the rubber coating rolling wheel according to the embodiment;

[0041] Figure 10 Schematic structural diagram of a silicon wafer detection module according to an embodiment;

[0042] Figure 11 One of the schematic structural diagrams of a material frame and a transfer trolley according to an embodiment;

[0043] Figure 12 Another schematic structural diagram of a material frame and a transfer trolley according to an embodiment;

[0044] Figure 13 Is Figure 12 Enlarged view of part A in

[0045] Figure 14 Schematic structural diagram of a material frame and a silicon wafer unit according to an embodiment;

[0046] Figure 15 Schematic structural diagram of an upper frame according to an embodiment;

[0047] Figure 16 Schematic structural diagram of a lower frame according to an embodiment;

[0048] Figure 17 Schematic structural diagram of a clamping assembly and a lower frame according to an embodiment;

[0049] Figure 18 Schematic structural diagram of a clamping assembly according to an embodiment;

[0050] Figure 19 Is Figure 14 Cross-sectional view taken along the A-A direction in

[0051] Figure 20 Is Figure 14 Cross-sectional view taken along the B-B direction in

[0052] Figure 21 Schematic structural diagram of a clamping part according to an embodiment;

[0053] Figure 22 Is Figure 14 Enlarged view of part B in

[0054] Figure 23 Schematic structural diagram of an unlocking device according to an embodiment;

[0055] Figure 24 Schematic structural diagram of an anti-tipping assembly according to an embodiment;

[0056] Figure 25 Schematic structural diagram of a transfer trolley according to an embodiment;

[0057] Figure 26 Cross-sectional view of a transfer trolley according to an embodiment;

[0058] Figure 27 Schematic diagram of the structure of a silicon wafer unit according to an embodiment. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0060] The present embodiment discloses a silicon wafer feeding and conveying device 1, which is used to automatically feed the cut silicon wafers to a wafer inserting mechanism.

[0061] The silicon wafer unit 100 is as follows Figure 27 As shown, it includes a wafer tray 110 and a plurality of silicon wafers 120 to be separated and adhered to the wafer tray 110 . The plurality of silicon wafers 120 are divided into a plurality of silicon wafer groups 121 . Figure 27 In the figure, two adjacent silicon wafer groups 121 are separated by a dotted line.

[0062] During the production and processing of silicon wafers, the silicon rod is first cut into silicon wafers 120 by a slicing device (such as a wire cutting machine). At this time, the silicon wafer 120 is adhered to the crystal tray 110 through a resin plate. After the cutting is completed, the crystal tray 110 and the silicon wafer 120 are loaded into a transfer device. The transfer device transfers the silicon wafer unit 100 to the degumming station, separates the crystal tray 110 from the silicon wafer 120, and the separated silicon wafer 120 undergoes subsequent slicing, loading and other processes. The silicon wafer 120 is loaded to the inserting station for inserting, and then the silicon wafer 120 is cleaned, dried and other operations are performed after insertion.

[0063] Reference Figures 1 to 7 The silicon wafer loading and conveying device 1 in this embodiment is an integrated structure, including a frame 10, a material frame conveying module 20, a slicing module 30, a flip conveying module 40, a horizontal conveying module 50, an inserting module 60 and the like.

[0064] The rack 10 constitutes the framework of the entire loading and conveying device and serves as a mounting carrier for other functional modules. The material frame conveying module 20, the slicer module 30, the flip conveying module 40, the horizontal conveying module 50, and the inserting module 60 are arranged in sequence along the length direction of the rack 10. The straight-line arrangement of the functional modules facilitates the transfer of silicon wafers between the modules.

[0065] A water tank with an open top is formed in the rack 10. The rack 10 also serves as a water container. On the one hand, it receives liquid dripping from the silicon wafer, and on the other hand, it provides a water source for functional modules that need water, such as the flipping and conveying module 40.

[0066] The wafer cassette 200 is used to hold the cut silicon wafers. The structure of the wafer cassette 200 is as shown in Figure 17 . Multiple silicon wafers in the wafer cassette 200 are divided into multiple wafer groups 121. An outlet 214 for discharging the silicon wafers 120 is provided at one end of the wafer cassette 200.

[0067] The structure of the wafer cassette conveying module 20 is as shown in Figure 2 and Figure 3 . The wafer cassette conveying module 20 is used to convey the wafer cassette 200 to the slicing module 30. After the silicon rod is cut on the slicing equipment, as shown in Figure 27 , the silicon wafers 120 and the crystal carrier 110 are put into the wafer cassette 200 together. The wafer cassette 200 is transferred from the slicing station to the debonding station by a transfer device (such as a transfer cart). At the debonding station, the crystal carrier is separated from the silicon wafers, and the silicon wafers remain in the wafer cassette. The wafer cassette 200 is then transported into the wafer cassette conveying module 20 by an auxiliary device such as a manipulator. The wafer cassette conveying module 20 automatically conveys the wafer cassette 200 to the downstream slicing module 30 to slice the silicon wafers in the wafer cassette 200, so as to facilitate the subsequent wafer loading operation.

[0068] The structure of the slicing module 30 is as shown in Figure 4 . The slicing module 30 includes a water spraying part 31 and a vertical conveying part 32. The water spraying part 31 is used to spray water on the silicon wafers 120 in the wafer cassette 200 in units of the wafer groups 121 to slice the multiple silicon wafers in the wafer group 121. The vertical conveying part 32 is used to convey the sliced silicon wafers upward one by one in a vertical posture.

[0069] The structure of the flipping and conveying module 40 is as shown in Figures 5 to 7 . The flipping and conveying module 40 is used to receive the silicon wafers in a vertical posture conveyed by the vertical conveying part 32 and flip the silicon wafers from a vertical posture to a horizontal posture.

[0070] Referring to Figure 7 , the horizontal conveying module 50 is used to receive the silicon wafers in a horizontal posture conveyed by the flipping and conveying module 40 and convey the silicon wafers in a horizontal posture to the wafer inserting module 60.

[0071] The wafer inserting module 60 is used to insert the silicon wafers conveyed by the horizontal conveying module 50.

[0072] In the silicon wafer loading and conveying device 1 of this embodiment, the wafer cassette conveying module 20, the slicing module 30, the flipping and conveying module 40, the horizontal conveying module 50, and the wafer inserting module 60 are arranged in a straight line, which is convenient for the automatic transfer of silicon wafers between the modules. The loading and conveying device integrates the above functions into an integrated structure, which is novel and compact in structure, realizes the automatic slicing, flipping, and inserting of silicon wafers, greatly improves the working efficiency, and improves the quality reliability of silicon wafers during the operation process.

[0073] Regarding the specific structure of the frame conveying module 20, in some embodiments, refer to Figure 2 and Figure 3 , the frame conveying module 20 includes a conveying track 21, a moving frame 22, and a driving mechanism 23. The conveying track 21 is provided at the bottom of the water tank and extends along the length direction of the water tank. The driving mechanism 23 is used to drive the moving frame 22 to move along the length direction of the water tank. The moving frame 22 is connected to the frame 200 to drive the frame 200 to move synchronously.

[0074] The frame 200 is located on the conveying track 21. When the driving mechanism 23 is started, it drives the moving frame 22 to move along the length direction of the water tank, and the moving frame 22 drives the frame to move synchronously with it.

[0075] Furthermore, there are two conveying tracks 21, and the two conveying tracks 21 are arranged oppositely. The conveying track 21 includes a horizontal bearing part 2101 and a vertical limiting part 2102. The frame 200 is located on the horizontal bearing part 2101, and the frame 200 moves along the horizontal bearing part 2101. The vertical limiting part 2102 is located beside the frame 200 to limit the frame 200 to prevent the frame 200 from falling off the horizontal bearing part 2101.

[0076] Furthermore, rollers 2103 are provided on the horizontal bearing part 2101, and the rollers 2103 are in rolling contact with the bottom of the frame 200 to reduce the moving friction of the frame 200.

[0077] Furthermore, the distance between the two vertical limiting parts 2102 is adjustable to adapt to frames 200 of different width dimensions.

[0078] For the adjustment structure between the two vertical limiting parts 2102, common mechanical structures such as lead screws and bolts can be used to achieve it, and no specific limitation is made in this embodiment.

[0079] Furthermore, the driving mechanism 23 includes a driving motor 2301. The driving motor 2301 drives the transmission shaft 2303 to rotate through a first transmission belt 2302. The transmission shaft 2303 drives a second transmission belt 2304 to rotate. The second transmission belt 2304 extends along the length direction of the water tank, and the moving frame 22 is connected to the second transmission belt 2304.

[0080] When the driving motor 2301 is started, the driving motor 2301 drives the first transmission belt 2302 to rotate. The first transmission belt 2302 drives the transmission shaft 2303 to rotate. The transmission shaft 2303 drives the second transmission belt 2304 to rotate. The second transmission belt 2304 drives the moving frame 22 to move synchronously, and then the moving frame 22 drives the frame 200 to move synchronously.

[0081] Further, there are two second drive belts 2304, and each second drive belt 2304 is arranged at the top of the corresponding side of the frame 10. The moving frame 22 is of a U-shaped frame structure and includes a moving horizontal part 2201 and a moving vertical part 2202. The two ends of the moving horizontal part 2201 are respectively provided with the moving vertical parts 2202, and the top of the moving vertical part 2202 is fixedly connected to the second drive belt 2304 on the corresponding side.

[0082] From Figure 2 It can be seen that the drive motor 2301, the first drive belt 2302, the drive shaft 2303, and the second drive belt 2304 are located outside the frame 10, which will not occupy the internal space of the frame 10 or the placement space of the material box 200. The moving frame 22 is located inside the frame 10, which is convenient for connecting with the material box 200 to drive the material box to move synchronously.

[0083] Further, a limiting structure for limiting the material box 200 is arranged on the moving horizontal part 2201. Through the detachable connection between the limiting structure and the material box 200, on the one hand, it is convenient for the connection between the material box 200 and the limiting structure so that the material box 200 moves synchronously with the moving frame 22, and on the other hand, it is also convenient for the separation between the material box 200 and the limiting structure.

[0084] In a specific embodiment, referring to Figure 3 , the limiting structure is a convex column 2203 arranged on the moving horizontal part 2201. Correspondingly, referring to Figure 14 , a mating hole is arranged on the outer side of one end of the material box. The material box is placed into the frame 10 from top to bottom, and the convex column 2203 is inserted into the mating hole 216 to realize the connection and cooperation between the material box 200 and the moving frame 22.

[0085] For the specific structure of the slicing module 30, referring to Figure 4 , the vertical conveying part 32 includes a first mounting frame 3201. An adsorption part and a vertical conveyor belt 3202 are arranged on the first mounting frame 3201. The adsorption part is used to adsorb the sliced silicon wafers onto the vertical conveyor belt 3202, and the vertical conveyor belt 3202 drives the silicon wafers to move upward in a vertical posture.

[0086] The sliced silicon wafers 120 in the material box 200 are adsorbed out by the adsorption part onto the vertical conveyor belt 3202, and the vertical conveyor belt 3202 drives the silicon wafers 120 to move upward. Through the mutual cooperation of the adsorption part and the vertical conveyor belt 3202, the silicon wafers in the material box 200 are conveyed upward one by one.

[0087] Further, the adsorption part includes an adsorption area 3203 and an auxiliary conveying area 3204. The auxiliary conveying area 3204 is arranged above and below the adsorption area 3203. The adsorption area 3203 is used to provide an adsorption force to the silicon wafer to adsorb the silicon wafer onto the vertical conveyor belt 3202. The auxiliary conveying area 3204 is in rolling contact with the silicon wafer to assist the silicon wafer to move upward in a vertical posture.

[0088] The adsorption area 3203 faces the silicon wafer directly to smoothly adsorb the silicon wafer in the material frame 200 onto the vertical conveyor belt 3202. The auxiliary conveying areas 3204 arranged at intervals above and below are in rolling contact with the upper part and the lower part of the silicon wafer, playing an auxiliary role in the vertical upward movement of the silicon wafer.

[0089] Further, the adsorption area 3203 is a water-absorbing plate 3205. A plurality of water-absorbing holes 3206 are arranged on the water-absorbing plate 3205 at intervals. The water-absorbing plate 3205 is connected to a water-absorbing waterway (not shown). The liquid on the silicon wafer is sucked into the water-absorbing waterway through the water-absorbing holes 3206 under the suction of the water-absorbing waterway, and the silicon wafer is adsorbed onto the surface of the vertical conveyor belt 3202.

[0090] Further, the vertical conveyor belt 3202 is arranged facing the adsorption area 3203, facilitating the silicon wafer to be directly adsorbed onto the surface of the vertical conveyor belt 3202 under the action of the adsorption area 3203.

[0091] Further, the auxiliary conveying area 3204 includes a plurality of follower rollers 3207, and the follower rollers 3207 are in rolling contact with the silicon wafer.

[0092] Further, the vertical conveyor belt 3202 is driven by a driving mechanism 23. The driving mechanism 23 includes a motor 3208, a synchronous belt 3209, and a rotating shaft 3210. The synchronous belt 3209 is connected between the power output end of the motor 3208 and the rotating shaft 3210. The rotating shaft 3210 is connected to the vertical conveyor belt 3202 to drive the vertical conveyor belt 3202 to rotate.

[0093] The motor 3208 and the synchronous belt 3209 are located beside the adsorption area 3203 and the auxiliary conveying area 3204, without interfering with the upward transportation of the silicon wafer.

[0094] Further, there are a plurality of vertical conveyor belts 3202, such as two. The plurality of vertical conveyor belts 3202 are arranged at intervals along the width direction of the adsorption part. The plurality of vertical conveyor belts 3202 are driven by the same rotating shaft 3210 to ensure the movement consistency of the plurality of vertical conveyor belts 3202. The interval arrangement of the plurality of vertical conveyor belts 3202 helps to improve the reliability of the upward transportation of the silicon wafer.

[0095] Further, a water spraying part 31 is provided on the first mounting bracket 3201. The water spraying part 31 is located on opposite sides of the vertical conveying part 32, and sprays water on both sides of the silicon wafer simultaneously, improving the reliability of slicing the silicon wafer.

[0096] Further, two water spraying parts 31 arranged at intervals up and down are provided on each side of the vertical conveying part 32, spraying water on both the upper and lower parts of the silicon wafer, further improving the slicing reliability of the silicon wafer.

[0097] Regarding the specific structure of the flipping conveying module 40, in some embodiments, refer to Figures 5 to 7 , the flipping conveying module 40 includes a flipping assisting part 41 and a rubber coating rolling wheel 42.

[0098] The flipping assisting part 41 is as Figure 5 shown, and it includes a second mounting bracket 4101. A blowing part 4102 is provided on the second mounting bracket 4101. Combining with Figure 6 , the blowing part 4102 is located above the vertical conveying part 32. The blowing part 4102 is used to blow air on the vertical silicon wafer conveyed upward by the vertical conveying part 32, so that the silicon wafer is tilted onto the rubber coating rolling wheel 42, and the rubber coating rolling wheel 42 drives the silicon wafer to move to a horizontal posture.

[0099] Through the cooperation of the blowing part 4102 and the rubber coating rolling wheel 42, the vertically upward conveyed silicon wafer is changed to horizontal conveyance. The setting of the blowing part 4102 causes the silicon wafer to be tilted onto the rubber coating rolling wheel 42, and then the rotation of the rubber coating rolling wheel 42 drives the tilted silicon wafer to a horizontal posture.

[0100] The rubber coating rolling wheel 42 can be a structure of a metal wheel coated with rubber, or a structure of a metal rolling wheel and a non-metal rolling wheel nested with a circular rubber sleeve.

[0101] Further, a sub-bracket 4105 is also provided on the second mounting bracket 4101. A pressing wheel 4106 is arranged on the sub-bracket 4105. The pressing wheel 4106 is located in front of the vertical conveying part 32 and is used to press the silicon wafer against the vertical conveying part 32 to prevent the silicon wafer from being tilted reversely, ensuring that the silicon wafer is reliably tilted onto the rubber coating rolling wheel 42.

[0102] Further, the sub-bracket 4105 is rotatably connected to the mounting bracket, and the pressing wheel 4106 is in the form of a floating wheel to avoid damaging the silicon wafer by the pressing wheel 4106.

[0103] Further, there are multiple pressing wheels 4106, and the multiple pressing wheels 4106 are arranged at intervals in the horizontal direction to apply a uniform acting force on the silicon wafer.

[0104] Further, the blowing part 4102 includes a blowing plate 4103. A plurality of blow holes 4104 arranged at intervals are provided on the blowing plate 4103. The blowing plate 4103 is connected to a blowing air path (not shown).

[0105] Further, the flipping and conveying module 40 further includes a cleaning unit 43 for regularly cleaning the rubber - coating rolling wheel 42. Refer to Figure 8 and Figure 9 , along the horizontal conveying direction of the silicon wafer, the cleaning unit 43 is arranged behind the rubber - coating rolling wheel 42 and below the horizontal conveying module 50.

[0106] The cleaning unit 43 includes a cylinder 4303, a cleaning frame 4302, and a sponge block 4301. The cleaning frame 4302 is arranged at the power output end of the cylinder 4303, and the sponge block 4301 is arranged on the cleaning frame 4302. When the rubber - coating rolling wheel 42 needs to be cleaned, the cylinder 4303 is activated to drive the cleaning frame 4302 to move towards the rubber - coating rolling wheel 42 until the sponge block 4301 contacts the rubber - coating rolling wheel 42. As the rubber - coating rolling wheel 42 rotates, the sponge block 4301 realizes the full - circumferential cleaning of the rubber - coating rolling wheel 42. After the cleaning is completed, the sponge block 4301 retreats away from the rubber - coating rolling wheel 42.

[0107] Regarding the specific structure of the horizontal conveying module 50, in some embodiments, refer to Figure 7 , the horizontal conveying module 50 includes a horizontal conveyor belt group 51. The driving mechanism 23 of the horizontal conveyor belt group 51 is not shown. The silicon wafers in a horizontal posture conveyed by the rubber - coating rolling wheel 42 move onto the horizontal conveyor belt group 51, and the horizontal conveyor belt group 51 carries the silicon wafers and continues to convey them in a horizontal posture to the subsequent wafer - inserting station.

[0108] A ring - shaped groove 4201 is provided along the circumferential direction of the rubber - coating rolling wheel 42. A part of the horizontal conveyor belt group 51 extends into the groove 4201 to receive the silicon wafers in a horizontal posture conveyed by the rubber - coating rolling wheel 42, realizing the stable conveyance of the silicon wafers between the rubber - coating rolling wheel 42 and the horizontal conveyor belt group 51.

[0109] Further, continuing to refer to Figure 7 , the horizontal conveying module 50 further includes two oppositely arranged baffles 52. The baffles 52 extend along the horizontal conveying direction of the silicon wafers. One end of the baffle 52 is located beside the rubber - coating rolling wheel 42, playing a role of limiting the left - right position of the horizontal conveyance of the silicon wafers.

[0110] In some embodiments, the silicon - wafer loading and conveying device 1 further includes a silicon - wafer detection module 70. As Figure 10 shown, it includes a lifting frame 71, a flipping frame 72, and a lifting driving part 75. The lifting driving part 75 drives the lifting frame 71 to move up and down. The flipping frame 72 is rotatably connected to the lifting frame 71. A rolling wheel 73 is provided at the bottom of the flipping frame 72, and a sensor 74, such as a photoelectric sensor, etc., is provided on the lifting frame 71.

[0111] The silicon wafer detection module 70 is arranged in front of the slicing module 30. The frame conveying module 20 horizontally conveys the frame 200 in the direction close to the slicing module 30 until the silicon wafers in the frame 200 touch the rolling wheels 73 on the silicon wafer detection module 70. As the frame 200 continues to move forward, the flipping frame 72 flips. At this time, the sensor 74 will detect the flipping action of the flipping frame 72, and the system knows that the silicon wafers are conveyed in place. Then the lifting drive part 75 drives the lifting frame 71 to rise, and the lifting frame 71 drives the flipping frame 72 and the rolling wheels 73 to rise synchronously to above the silicon wafers, so as not to affect the subsequent slicing and loading operations of the silicon wafers. The slicing module 30 is started to spray water on the silicon wafers and convey them vertically.

[0112] For the specific structure of the frame 200, in some embodiments, refer to Figures 14 to 17 , the frame 210 of the frame 200 includes an upper frame 211 and a lower frame 212, and the upper frame 211 and the lower frame 212 are detachably connected. Figure 15 As shown in the upper frame 211, Figure 16 As shown in the lower frame 212, Figure 17 As shown is the structure in which the clamping assembly 220 and the anti-tipping assembly 240 are arranged on the lower frame 212.

[0113] A containing space 213 for containing the silicon wafers 120 is formed in the lower frame 212. The top of the containing space 213 is open, and a discharge port 214 communicating with the containing space 213 is arranged at one end of the lower frame 212.

[0114] The upper frame 211 is detachably arranged on the top of the lower frame 212. An opening 2113 vertically aligned and communicating with the containing space 213 is arranged on the upper frame 211. The silicon wafer unit 100 is loaded into the lower containing space 213 through the opening 2113. A limiting structure for limiting the crystal holder 110 is arranged on the upper frame 211 to ensure the stable placement of the silicon wafer unit 100 in the frame 200. A clamping assembly 220 for limiting the silicon wafers 120 is arranged on the lower frame 212.

[0115] The upper frame 211 is moved away from the lower frame 212 to separate the crystal holder 110 from the silicon wafers 120, and the silicon wafers 120 remain in the lower frame 212. The frame conveying module 20 conveys the lower frame 212 to the slicing module 30. Specifically, after the frame 200 reaches the degumming station, the upper frame 211 is moved away from the lower frame 212 through the degumming equipment. Since there is a limiting connection relationship between the upper frame 211 and the crystal holder 110, and the lower silicon wafers 120 are clamped by the clamping assembly 220, when the upper frame 211 is moved away from the lower frame 212, the upper frame 211 drives the crystal holder 110 to separate from the silicon wafers 120 together, realizing the degumming separation of the crystal holder 110 and the silicon wafers 120.

[0116] In this embodiment, through the up-and-down split structure of the material frame 200, combined with the clamping of the silicon wafer 120 by the clamping assembly 220 in the lower frame 212 and the limit fixation of the crystal carrier 110 by the upper frame 211, the separation of the crystal carrier 110 from the silicon wafer 120 can be achieved by separating the upper frame 211 from the lower frame 212.

[0117] Further, referring to Figure 14 、 Figure 15 and Figure 27 , extension parts 111 are respectively provided at the front and rear ends of the crystal carrier 110 unit, and two spaced protrusion parts 2115 are provided on the corresponding side of the upper frame 211. The extension parts 111 are clamped between the two protrusion parts 2115 to realize the limit fixation of the crystal carrier 110.

[0118] Further, the upper frame 211 includes two relatively arranged upper frame first brackets 2111 and two relatively arranged upper frame second brackets 2112. The upper frame first brackets 2111 extend along the length direction L of the material frame 200, and the upper frame second brackets 2112 extend along the width direction W of the material frame 200. Two spaced support frames 2114 are provided between the two upper frame first brackets 2111, and there is a certain distance between the support frames 2114 and the corresponding side upper frame second brackets 2112. The protrusion parts 2115 are provided on the support frames 2114.

[0119] Further, the lower frame 212 includes two relatively arranged lower frame first brackets 2121 and two relatively arranged lower frame second brackets 2122. The lower frame second brackets 2122 include lower frame transverse frames 2123, and lower frame vertical frames 2124 are respectively provided at the opposite ends of the lower frame transverse frames 2123. The lower frame first brackets 2121 extend along the length direction K of the material frame 200, the lower frame transverse frames 2123 extend along the width direction W of the material frame 200, and the lower frame vertical frames 2124 extend along the height direction of the material frame 200.

[0120] The bottom of the upper frame 211 is detachably connected to the top of the lower frame vertical frame 2124 to realize the detachable connection between the upper frame 211 and the lower frame 212.

[0121] Further, referring to Figures 14 to 16 , an upper limit block 2116 is provided at the bottom of the upper frame 211, and a lower limit block 2126 is provided at the top of the lower frame vertical frame 2124. The upper limit block 2116 and the lower limit block 2126 are adapted through a concave-convex structure. For example, a concave shape is provided on the upper limit block 2116, and a convex shape is provided on the lower limit block 2126, and the concave shape and the convex shape are adapted.

[0122] In some other embodiments, the upper frame 211 and the lower frame 212 can be detachably connected by means of bolts, pins, etc.

[0123] Further, referring to Figure 15 , an upper grasping portion 2117 is provided on the outer side of the upper frame 211. The upper grasping portion 2117 is for being grasped by an external force to separate the upper frame 211 from the lower frame 212.

[0124] Referring to Figure 16 , a lower grasping portion 2127 is provided on the outer side of the lower frame 212. The lower grasping portion 2127 is for being grasped by an external force to transfer the material frame 200.

[0125] Further, support rollers 215 are provided at the bottom of the lower frame 212. The support rollers 215 are arranged at intervals along the width direction W of the material frame 200, and the support rollers 215 are in abutting contact with the bottom of the silicon wafer 120.

[0126] The gap between two adjacent support rollers 215 facilitates the water on the silicon wafer 120 to drip downward.

[0127] In some embodiments, referring to Figure 14 , Figure 17 and Figure 18 , the clamping assembly 220 is used to clamp the silicon wafer unit 100. On the one hand, the clamping assembly 220 can clamp the entire silicon wafer unit 100 at the same time; on the other hand, the clamping assembly 220 can independently unlock each silicon wafer group 121.

[0128] There are two clamping assemblies 220, which are located on opposite sides of the receiving space 213 to clamp opposite sides of the silicon wafer unit 100.

[0129] The clamping assembly 220 includes a plurality of clamping portions 222 arranged in sequence along the length direction of the receiving space 213 (i.e., the length direction L of the material frame 200). The plurality of clamping portions 222 correspond to the plurality of silicon wafer groups 121 one by one to clamp the corresponding silicon wafer groups 121. Each clamping portion 222 moves away from the silicon wafer 120 to release the clamping of the corresponding silicon wafer group 121.

[0130] That is to say, each silicon wafer group 121 is clamped by the corresponding clamping portion 222. When all the clamping portions 222 clamp the corresponding silicon wafer groups 121, the entire silicon wafer unit 100 is clamped. When it is necessary to load the silicon wafer unit 100 in pieces with the silicon wafer groups 121 as units, the clamping portions 222 release the clamping of the corresponding silicon wafer groups 121. When the unlocked silicon wafer groups 121 are loaded in pieces, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping portions 222. In this way, the placement stability of the remaining unloaded silicon wafer groups 121 in the material frame 200 can be ensured, the silicon wafers 120 can be prevented from tipping over or being squeezed against each other, the silicon wafers 120 can be prevented from being damaged, and the quality of the silicon wafers 120 can be ensured.

[0131] The unlocking of the clamping part 222 on the silicon wafer group 121 is realized by the interaction between the unlocking device 300 and the clamping part 222. Specifically, the unlocking device 300 is arranged on the inner side wall of the frame 10 and is close to the slicing module 30. When the material frame conveying module 20 conveys the lower frame 212 horizontally towards the direction close to the unlocking device 300, a plurality of clamping parts 222 sequentially contact the unlocking device 300 with the relative movement between the material frame 200 and the unlocking device 300. The unlocking device 300 is used to apply an external force to the clamping part 222, so that the clamping part 222 moves away from the corresponding silicon wafer group 121, that is, the clamping of the silicon wafer group 121 is released.

[0132] In the material frame 200 of this embodiment, a plurality of clamping parts 222 on the clamping assembly 220 simultaneously clamp the corresponding silicon wafer groups 121 to realize the clamping of all silicon wafers. At the same time, the unlocking of each clamping part 222 on the silicon wafer group 121 is independent of each other. The unlocking device 300 sequentially unlocks each clamping part 222, that is, the unlocking of each silicon wafer group 121 is independent of each other. In this way, when it is necessary to slice and load the silicon wafer units 100 in units of the silicon wafer groups 121, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is sliced and loaded, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping parts 222. In this way, the placement stability of the remaining unloaded silicon wafer groups 121 in the material frame 200 can be ensured, preventing the silicon wafers 120 from tipping over or squeezing each other, avoiding damage to the silicon wafers 120, and ensuring the quality of the silicon wafers 120.

[0133] In some embodiments, referring to Figure 20 , the clamping part 222 includes a second pin shaft 2221. The second pin shaft 2221 passes through the frame 210. The second pin shaft 2221 can move along the direction passing through the frame 210. An unlocking block 2223 is arranged on the first end of the second pin shaft 2221, and a clamping block 2222 is arranged on the second end of the second pin shaft 2221. A spring 2229 is sleeved on the second pin shaft 2221, and the spring 2229 is located between the clamping block 2222 and the frame 210.

[0134] Each unlocking block 2223 moves away from the silicon wafer unit 100 under the action of the unlocking device 300, driving the corresponding clamping block 2222 away from the corresponding silicon wafer group 121 to unlock the corresponding silicon wafer group 121.

[0135] The clamping block 2222 moves towards the silicon wafer unit 100 under the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121.

[0136] In some embodiments, the cooperation structure between the unlocking device 300 and the clamping part 222 is as follows. Refer to Figures 20 to 23 :

[0137] The unlocking block 2223 includes a transverse portion 2225 and a vertical portion 2226 which are of an integral structure. The transverse portion 2225 is used to abut against the movable plate 221, and the vertical portion 2226 is used to act with the unlocking device 300. Specifically, one end of the transverse portion 2225 is connected to the second pin shaft 2221, a stepped portion 2228 is formed between the transverse portion 2225 and the second pin shaft 2221, and the other end of the transverse portion 2225 is connected to the vertical portion 2226.

[0138] There is a certain distance between the vertical portion 2226 and the movable plate 221. An inclined surface 2227 is provided on the side of the vertical portion 2226 facing the frame 210. Along the discharging direction of the silicon wafer 120, the distance between the inclined surface 2227 and the movable plate 221 first decreases and then increases.

[0139] The unlocking device 300 includes a first roller 320. When a relative movement occurs between the material frame 200 and the unlocking device 300, the first roller 320 moves between the inclined surface 2227 and the frame 210 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin shaft 2221 moves in a direction away from the silicon wafer 120.

[0140] Specifically, the unlocking device 300 is fixed on the inner side wall of the frame 10. Two clamping assemblies 220 are provided corresponding to the material frame 200, so two unlocking devices 300 are also provided. Each unlocking device 300 is used to act with the clamping assembly 220 on the corresponding side. When the silicon wafers 120 in the material frame 200 need to be sliced in units of the silicon wafer group 121, the material frame 200 moves horizontally under the action of the material frame conveying module 20, and a relative movement occurs between the material frame 200 and the unlocking device 300. Along the movement direction of the material frame 200, each clamping portion 222 contacts the unlocking device 300 one by one in sequence. The first roller 320 moves between the inclined surface 2227 and the frame 210 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin shaft 2221 moves in a direction away from the silicon wafer 120, driving the clamping block 2222 away from the silicon wafer 120, that is, releasing the clamping of the corresponding silicon wafer group 121, and thus facilitating the slicing operation of the unlocked silicon wafer group 121 by the device at the subsequent station.

[0141] Further, two inclined surfaces 2227 are provided on the vertical portion 2226, one of the inclined surfaces 2227 is located above the horizontal portion 2225, and the other inclined surface 2227 is located below the horizontal portion 2225. The unlocking device 300 further includes a first mounting bracket 310 with a U-shaped structure. First rollers 320 are respectively provided on the upper and lower walls of the first mounting bracket 310, and the first rollers 320 are in contact with the inclined surfaces 2227 on the corresponding sides. In this way, the unlocking effect of the unlocking device 300 on the clamping portion 222 is improved, and the unlocking reliability is improved.

[0142] In some embodiments, the clamping assembly 220 further includes a movable plate 221. The movable plate 221 extends along the length direction of the accommodation space 213, and a plurality of clamping portions 222 are arranged in sequence along the length direction of the movable plate 221.

[0143] When the movable plate 221 moves away from the accommodation space 213 under an external force, the movable plate 221 drives all the clamping portions 222 provided thereon to move away from the accommodation space 213 synchronously, so as to increase the distance between the two opposite clamping assemblies 220, facilitating the silicon wafer to be loaded into the accommodation space 213 from top to bottom.

[0144] Further, the movable plate 221 is located outside the frame 210. Specifically, referring to Figure 16 and Figure 20 , the lower frame 212 includes two relatively arranged horizontal frames 2125. The horizontal frames 2125 extend along the length direction of the accommodation space 213. The movable plate 221 is located outside the horizontal frames 2125, and the second pin shaft 2221 passes through the horizontal frames 2125 and the movable plate 221. When the movable plate 221 moves away from the accommodation space 213 under an external force, the movable plate 221 pushes all the unlocking blocks 2223 to move away from the accommodation space 213 synchronously, so that all the clamping blocks 2222 move away from the accommodation space 213. Specifically, a stepped portion 2228 is formed between the unlocking block 2223 and the second pin shaft 2221. When the movable plate 221 moves away from the accommodation space 213, the movable plate 221 abuts against the stepped portion 2228 to push the unlocking block 2223 to move synchronously. The unlocking block 2223 drives the second pin shaft 2221 and the clamping block 2222 to move away from the accommodation space 213 synchronously, and the spring 2229 is compressed.

[0145] After the external force acting on the movable plate 221 disappears, the clamping block 2222 moves towards the silicon wafer 120 under the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121.

[0146] Further, a second limiting shaft 223 is provided on the transverse frame 2125, and a second long through hole 2224 is provided on the second pin shaft 2221. The second limiting shaft 223 passes through the second long through hole 2224 to prevent the second pin shaft 2221 from rotating.

[0147] In some embodiments, referring to Figure 14 and Figure 24 , the material frame 200 further includes an anti-tipping component 240, which is used to abut and support the silicon wafer 120. The anti-tipping component 240 is provided at one end away from the discharge port 214. When the transfer cart 400 pushes the material frame 200 forward, the silicon wafer 120 has a tendency to tip backward (i.e., the side opposite to the moving direction of the material frame 200). By the abutment of the anti-tipping component 240 and the silicon wafer 120, the silicon wafer 120 is prevented from tipping.

[0148] The anti-tipping component 240 includes a second mounting frame 241 and a second roller 242 provided on the second mounting frame 241. The second mounting frame 241 is provided on the frame 210, and the second roller 242 is used to abut against the silicon wafer 120. A plurality of second rollers 242 are arranged at intervals in the vertical direction, such as two, which have multiple contacts with the silicon wafer 120 in the up and down height directions, improving the anti-tipping reliability.

[0149] Further, the second mounting frame 241 includes a fixed frame 2411 and a movable frame 2412. The fixed frame 2411 is fixedly provided on the frame 210, the movable frame 2412 is rotatably connected to the fixed frame 2411, a torsion spring 2413 is provided between the movable frame 2412 and the fixed frame 2411, and the second roller 242 is provided on the movable frame 2412. By the rotation of the movable frame 2412 relative to the fixed frame 2411, it adapts to the bumps generated during the transportation of the material frame 200, and avoids the second roller 242 from rigidly squeezing the silicon wafer 120.

[0150] In some embodiments, the material frame 200 further includes an unlocking trigger portion 230. The unlocking trigger portion 230 includes a first pin shaft 231. The first pin shaft 231 passes through the transverse frame 2125. The first end of the first pin shaft 231 is fixedly connected to the movable plate 221, and the second end of the first pin shaft 231 is used to receive an external force, so that the first pin shaft 231 moves along its penetrating direction in the transverse frame 2125, to drive the movable plate 221 to move synchronously in a direction away from the containing space 213. The movable plate 221 then drives all the clamping portions 222 to move synchronously in a direction away from the containing space 213. In this way, the distance between the two relatively arranged clamping assemblies 220 increases, facilitating the silicon wafer unit 100 to be placed into the material frame 200 from top to bottom.

[0151] In some embodiments, the material frame 200 is transferred between the cutting station and the debonding station by a transfer cart 400. Referring to Figure 11 and Figure 12, first place the material frame 200 on the transfer trolley 400, and then place the cut silicon wafer unit 100 into the material frame 200. The transfer trolley 400 transports the material frame 200 to the debonding station.

[0152] The structure of the transfer trolley 400 refers to Figure 25 and Figure 26 , and the transfer trolley 400 has functions such as storing, limiting, and transporting the material frame 200.

[0153] An unlocking part 410 is provided on the transfer trolley 400. The unlocking part 410 is used to interact with the unlocking trigger part 230 on the material frame 200 to provide an external force to the unlocking trigger part 230. Specifically, after the material frame 200 is placed on the transfer trolley 400, the unlocking part 410 contacts the unlocking trigger part 230, and the unlocking part 410 triggers the unlocking trigger part 230 to act. The movable plate 221 moves away from the loading space 213 under the action of the unlocking trigger part 230, and the movable plate 221 drives a plurality of clamping parts 222 provided thereon to move away from the loading space 213 synchronously.

[0154] During application, before placing the silicon wafer unit 100 into the material frame 200, first place the material frame 200 on the transfer trolley 400. At this time, the unlocking part 410 contacts the unlocking trigger part 230, and the effect is that the movable plate 221 moves away from the loading space 213 under the action of the unlocking trigger part 230, and the movable plate 221 drives a plurality of clamping parts 222 provided thereon to move away from the loading space 213 synchronously, that is, the distance between two opposite clamping assemblies 220 increases, so that it is convenient for the silicon wafer unit 100 to be loaded into the loading space 213 from top to bottom.

[0155] The material frame 200 is provided with a limiting structure for limiting the crystal carrier 110. By limiting the crystal carrier 110 through the material frame 200, the placement stability of the silicon wafer unit 100 in the material frame 200 is ensured, and the silicon wafer 120 is prevented from tipping or shifting.

[0156] After the silicon wafer unit 100 is placed into the material frame 200, the transfer trolley 400 transports the material frame 200 to the next operation station, specifically the debonding station. After arriving at the debonding station, the material frame 200 is removed from the transfer trolley 400 by equipment such as a manipulator. At this time, the unlocking part 410 is separated from the unlocking trigger part 230, and the clamping assembly 220 automatically moves towards the direction close to the silicon wafer unit 100 under the restoring force of the restoring part, clamping the silicon wafer unit 100. After the silicon wafer unit 100 is clamped, it is convenient for the silicon wafer unit 100 to be debonded at the debonding station. At this time, the silicon wafer 120 is clamped by the clamping assembly 220, which is convenient for the crystal carrier 110 to be smoothly separated from the silicon wafer 120.

[0157] After the silicon wafer unit 100 is debonded, it is transported to the next working station by the material frame 200. The silicon wafers 120 are sliced in units of silicon wafer groups 121. The sliced silicon wafers 120 are convenient for subsequent wafer insertion operations. When slicing the silicon wafers 120 in units of silicon wafer groups 121, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is fed for slicing, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping parts 222. During this process, through the interaction between the unlocking device 300 and the clamping part 222, the clamping part 222 unlocks the silicon wafer group 121.

[0158] According to the silicon wafer production process, the usage method of the silicon wafer transfer device composed of a material frame and a transfer trolley is as follows:

[0159] When transporting the cut silicon wafer unit 100, first place the material frame 200 on the transfer trolley 400. The unlocking part 410 contacts the unlocking trigger part 230, and the unlocking part 410 triggers the unlocking trigger part 230 to act. All the clamping parts 222 move synchronously away from the accommodation space 213 under the drive of the movable plate 221, facilitating the silicon wafer unit 100 to be loaded into the accommodation space 213 from top to bottom. At this time, the clamping assembly 220 does not clamp the silicon wafers 120.

[0160] The material frame 200 is provided with a limiting structure for limiting the crystal carrier 110 to ensure the stable placement of the silicon wafer unit 100 in the material frame 200.

[0161] After the transfer trolley 400 transports the material frame 200 to the next working station, the material frame 200 is removed from the transfer trolley 400. The unlocking part 410 is separated from the unlocking trigger part 230. All the clamping parts 222 move towards the silicon wafer unit 100 under the action of the resetting part to clamp the silicon wafers 120, facilitating the debonding and separation of the crystal carrier 110 and the silicon wafers 120.

[0162] The material frame 200 transfers the silicon wafers 120 to the next working station. The silicon wafers 120 in the material frame 200 are sliced in units of silicon wafer groups 121. At this time, a relative movement occurs between the material frame 200 and the unlocking device 300. The multiple clamping parts 222 sequentially contact the unlocking device 300 with the relative movement between the material frame 200 and the unlocking device 300. The unlocking device 300 applies an external force to the clamping part 222 to make the clamping part 222 move away from the corresponding silicon wafer group 121 and release the clamping of the silicon wafer group 121.

[0163] In this embodiment, through the cooperation structure between the transfer trolley 400 and the material box 200, the clamping mechanism on the material box 200 is triggered. On the one hand, when the material box 200 cooperates with the transfer trolley 400, the clamping mechanism is in an unlocked state to facilitate the placement of the silicon wafers 120 into the material box 200. On the other hand, when the material box 200 is separated from the transfer trolley 400, the clamping mechanism automatically clamps the entire silicon wafers 120, improving the placement reliability of the silicon wafers 120 during transportation and also facilitating the subsequent debonding separation of the crystal carrier 110 and the silicon wafers 120. When the silicon wafers 120 are piece-fed, through the unlocking device 300, the material box 200 can also independently release the clamping of each silicon wafer group 121, thereby avoiding damage to the silicon wafers 120, reducing manual intervention, and improving the operation efficiency.

[0164] In some embodiments, a roller (denoted as the third roller 232) is provided at the second end of the first pin shaft 231. Referring again to Figure 13 , Figure 25 and Figure 26 , the unlocking portion 410 is a column provided on the transfer trolley 400. A guiding contact surface 411 is provided at the upper end of the column on the side facing the third roller 232. When the material box 200 is placed on the transfer trolley 400 from top to bottom, the third roller 232 moves from top to bottom along the guiding contact surface 411 to drive the first pin shaft 231 to move away from the containing space 213. Since the first pin shaft 231 is fixedly connected to the movable plate 221, it also drives the movable plate 221 to move away from the containing space 213 synchronously.

[0165] Further, referring to Figure 26 , the guiding contact surface 411 includes a contact surface section 4111, a contact surface section 4112, and a contact surface section 4113 from top to bottom. The contact surface section 4112 extends in the vertical direction. The contact surface section 4111 extends obliquely away from the third roller 232 from the top of the contact surface section 4112. The contact surface section 4113 extends obliquely towards the third roller 232 from the bottom of the contact surface section 4112.

[0166] When the material box 200 is placed on the transfer trolley 400 from top to bottom, the third roller 232 first contacts the contact surface section 4111. The inclined contact surface section 4111 plays a preliminary positioning role for the placement of the material box 200. As the material box 200 continues to be lowered, during the movement of the third roller 232 along the inclined contact surface section 4111, the first pin shaft 231 is gradually pushed away from the containing space 213. After the third roller 232 moves onto the contact surface section 4112, the outward movement of the first pin shaft 231 stops. As the material box 200 continues to be lowered, when the third roller 232 moves to the lower end of the contact surface section 4112, the contact surface section 4113 stops the movement of the third roller 232, and the material box 200 is placed in place.

[0167] Further, each movable plate 221 is configured with two unlocking trigger portions 230. The two unlocking trigger portions 230 are provided at opposite ends of the movable plate 221. That is, each material frame 200 is configured with four unlocking trigger portions 230. Correspondingly, four unlocking portions 410 are provided on the transfer trolley 400, as Figure 25 shown. The four unlocking portions 410 are, on the one hand, used to contact the corresponding unlocking trigger portions 230, and on the other hand, play a role in guiding and pre-positioning the placement of the material frame 200.

[0168] Further, a first limiting shaft 233 is provided on the transverse frame 2125. A first long through hole 234 is provided on the first pin shaft 231. The first limiting shaft 233 passes through the first long through hole 234 to prevent the first pin shaft 231 from rotating.

[0169] In some embodiments, referring to Figure 25 and Figure 26 , a limiting portion 420 is provided on the vehicle body of the transfer trolley 400. The limiting portion 420 is a limiting protrusion arranged on the periphery of the material frame 200. The limiting portion 420 is used to limit the material frame 200 to ensure the stability of the placement of the material frame 200 on the transfer trolley 400.

[0170] Further, a liquid collecting tank 430 is provided on the transfer trolley 400. The liquid collecting tank 430 is located below the material frame 200. The liquid collecting tank 430 is used to collect the liquid dripping from the silicon wafer 120. A liquid discharge port 440 and a liquid discharge valve 450 are provided at the low position of the liquid collecting tank 430 for easy liquid discharge.

[0171] Further, a positioning portion 460 is provided at the moving front end of the transfer trolley 400. The positioning portion 460 is used for positioning when the transfer trolley 400 moves to a specified position.

[0172] In the description of the above embodiments, the specific features, structures, materials or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

Claims

1. A silicon wafer loading and conveying device, characterized in that, it includes: a material frame for containing multiple cut silicon wafers, the multiple silicon wafers being divided into multiple silicon wafer groups, and an outlet for discharging the silicon wafers is provided at one end of the material frame; a material frame conveying module for conveying the material frame to a slicing module; a slicing module including a water spraying part and a vertical conveying part, the water spraying part is used to spray water on the silicon wafers in the material frame in units of the silicon wafer groups to slice the multiple silicon wafers in the silicon wafer groups, and the vertical conveying part is used to convey the sliced silicon wafers one by one upward in a vertical posture; a flipping and conveying module for receiving the silicon wafers in a vertical posture conveyed by the vertical conveying part and flipping the silicon wafers from a vertical posture to a horizontal posture; a horizontal conveying module for receiving the silicon wafers in a horizontal posture conveyed by the flipping and conveying module and conveying the silicon wafers in a horizontal posture to an inserting module; an inserting module for inserting the silicon wafers conveyed by the horizontal conveying module; a machine frame with a water tank having an open top inside, and the material frame conveying module, the slicing module, the flipping and conveying module, the horizontal conveying module, and the inserting module are arranged in sequence along the length direction of the machine frame.

2. The silicon wafer loading and conveying device according to claim 1, characterized in that, the material frame conveying module includes a conveying track, a moving frame, and a driving mechanism, the conveying track is arranged at the bottom of the water tank and extends along the length direction of the water tank, the driving mechanism is used to drive the moving frame to move along the length direction of the water tank, and the moving frame is connected to the material frame to drive the material frame to move synchronously.

3. The silicon wafer loading and conveying device according to claim 1, characterized in that, the vertical conveying part includes a first mounting frame, an adsorption part and a vertical conveyor belt are provided on the first mounting frame, the adsorption part is used to adsorb the sliced silicon wafers onto the vertical conveyor belt, and the vertical conveyor belt drives the silicon wafers to move upward in a vertical posture.

4. The silicon wafer loading and conveying device according to claim 3, characterized in that, the adsorption part includes an adsorption area and an auxiliary conveying area, the auxiliary conveying area is arranged above and below the adsorption area, the adsorption area is used to provide an adsorption force to the silicon wafers to adsorb the silicon wafers onto the vertical conveyor belt, and the auxiliary conveying area is in rolling contact with the silicon wafers to assist the silicon wafers to move upward in a vertical posture.

5. The silicon wafer loading and conveying device according to claim 3, characterized in that, the water spraying part is provided on the first mounting frame, and the water spraying part is located on opposite sides of the vertical conveying part.

6. The silicon wafer loading and conveying device according to claim 1, characterized in that, The flipping and conveying module includes a flipping auxiliary part and a rubber - coated rolling wheel. The flipping auxiliary part includes a second mounting frame, on which a blowing part is provided. The blowing part is located above the vertical conveying part and is used to blow air onto the vertical silicon wafers conveyed upward by the vertical conveying part, so that the silicon wafers are tilted onto the rubber - coated rolling wheel, and the rubber - coated rolling wheel drives the silicon wafers to move to a horizontal posture.

7. The silicon wafer loading and conveying device according to claim 6, wherein, a sub - frame is further provided on the second mounting frame, and a pressing wheel is arranged on the sub - frame. The pressing wheel is located in front of the vertical conveying part and is used to press the silicon wafers against the vertical conveying part.

8. The silicon wafer loading and conveying device according to any one of claims 1 to 7, wherein, Multiple cut silicon wafers are pasted on a crystal carrier, and the crystal carrier and the multiple silicon wafers are placed into the material frame together; The material frame includes an upper frame and a lower frame. The upper frame is detachably arranged above the lower frame. A limiting structure for limiting the crystal carrier is provided on the upper frame, and a clamping assembly for limiting the silicon wafers is provided on the lower frame; A limiting structure for limiting the lower frame is provided on the material frame conveying module; The lower frame is lifted away from the upper frame to separate the crystal carrier from the silicon wafers, and the material frame conveying module conveys the lower frame to the slicing module.

9. The silicon wafer loading and conveying device according to claim 8, wherein, The clamping assembly includes a plurality of clamping parts arranged in sequence along the length direction of the material frame. The plurality of clamping parts correspond to a plurality of groups of silicon wafers one by one to clamp the corresponding groups of silicon wafers; The silicon wafer loading and conveying device further includes an unlocking device. The material frame conveying module conveys the lower frame horizontally in a direction close to the unlocking device. The plurality of clamping parts sequentially contact the unlocking device with the relative movement between the lower frame and the unlocking device. The unlocking device applies an external force to the clamping parts to make the clamping parts move away from the corresponding groups of silicon wafers.

10. The silicon wafer loading and conveying device according to claim 9, wherein, The clamping part includes a second pin shaft, which passes through the lower frame. An unlocking block is provided at the first end of the second pin shaft, and a clamping block is provided at the second end of the second pin shaft. A spring is sleeved on the second pin shaft, and the spring is located between the clamping block and the lower frame; Each unlocking block moves away from the silicon wafers under the action of the unlocking device, driving the corresponding clamping block to move away from the corresponding group of silicon wafers.

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